JP6701966B2 - Load port device and EFEM - Google Patents

Description

  The present invention relates to a load port device and an EFEM, and more particularly to a load port device capable of introducing a cleaning gas into a container and an EFEM having the load port device.

  In a semiconductor manufacturing process, a wafer called a FOUP is used to transfer a wafer between processing apparatuses. When performing processing on a wafer, the container is placed on a mounting table of a load port device provided in each processing device, and the load port device connects the space inside the transfer container and the space inside the processing chamber. This makes it possible to take out the wafer from the transfer container by the robot arm or the like and transfer the wafer to the processing chamber.

  Here, in order to protect the surface of the wafer from oxidation and contamination, it is preferable that the environment inside the container in which the wafer is housed is kept in an inactive state and cleanliness above a predetermined state. As a method of improving the inert state and cleanliness of the gas in the transfer container, a load port for introducing the cleaning gas into the transfer container through the bottom hole formed in the bottom surface of the transfer container or the main opening of the transfer container. A device has been proposed (see Patent Document 1).

  On the other hand, there has been proposed an EFEM in which a down flow is formed by using a fan filter unit (FFU) or the like inside a wafer transfer chamber to which a load port device is attached to prevent contamination of a wafer or the like during transfer. In such an EFEM, there is a problem that the air flow associated with the down-flow of the wafer transfer chamber disturbs the air flow in the container or in the vicinity of the opening of the container to prevent the cleaning gas from being introduced into the container. As a technique corresponding to the above, for example, a technique of providing an upper eave that stops downflow has been proposed (see Patent Document 2).

JP, 2007-5607, A JP-A-2005-204344

  Although the conventional technique of providing the upper eaves has the effect of stopping the downflow itself, it may cause a new problem that turbulent flow is formed in the vicinity of the upper eaves. In other words, the conventional technique of providing the upper eaves has a new method from the viewpoint of smooth introduction of the cleaning gas into the container because such turbulent flow may hinder the introduction of the cleaning gas into the container. Have challenges.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a load port device capable of realizing smooth introduction of a cleaning gas into a container and an EFEM having such a load port device.

In order to achieve the above object, a load port device according to the present invention,
A mounting table on which a container having a main opening for loading and unloading a wafer formed on a side surface is mounted,
A device opening that communicates with the main opening is formed, and a wall portion having an outer surface facing the container and an inner surface facing the opposite direction to the outer surface,
An opening and closing unit for opening and closing the main opening,
A gas introduction unit for introducing a cleaning gas into the container,
Above the upper side of the device opening in the inner side surface, provided along the upper side, and having an eaves portion protruding substantially perpendicular to the inner side surface,
A slit or a through hole penetrating the eaves portion in the vertical direction is formed in the eaves portion in a direction along the upper side.

  In the eaves portion of the load port device according to the present invention, a slit or a through hole that vertically penetrates the eaves portion is formed in the direction along the upper side, so that the eaves portion is below the eaves portion, that is, in the vicinity of the device opening. The problem of turbulent flow formation can be prevented. Therefore, the load port device according to the present invention can realize smooth introduction of the cleaning gas into the container. This is because an air pressure difference occurs between the air flow passing through the slit or the through hole and the air flow passing through the outside of the eaves portion, and the air flow passing through the slit or the through hole becomes an air flow passing through the outside of the eaves portion. It is considered that this is because the air pressure becomes higher than that of the air conditioner, so that the airflow below the eaves portion is pulled in a direction away from the device opening.

  Further, for example, in the load port device according to the present invention, a lip base end that is a base end is connected to an eaves tip that is a tip end of the eaves portion, and a lip tip that is a tip end is the wall portion from the lip base end. It may have a lip portion that extends obliquely upward and closer to, and that is provided in a direction along the upper side.

  By providing such a lip portion, the pressure difference between the airflow passing through the eaves portion and the airflow passing outside the eaves portion is increased, and the airflow below the eaves portion is strongly separated from the device opening. Since it is pulled, it is possible to effectively prevent the problem that turbulent flow is formed around the device opening.

  In addition, for example, in the load port device according to the present invention, a base portion of a folded portion that is a base end is connected to the tip of the eaves, and a tip of the folded portion that is a tip extends downward from the eaves tip portion. May have.

  Such an eaves folding part can prevent the airflow from being entrained in the lower part of the eaves part and suppress the occurrence of turbulence near the opening of the device.

  Further, for example, a folding slit or a folding through hole that horizontally penetrates the eaves folding portion may be formed in the eaves folding portion in a direction along the upper side.

  By forming the folding slit in the folding portion, the airflow passing through the slit can be effectively kept away from the device opening, and the generation of turbulence near the device opening can be suppressed.

  Further, for example, in the load port device according to the present invention, a second lip base end, which is a base end, is connected to the eaves tip, and a second lip tip, which is a tip end, extends from the second lip base end to the wall portion. It may have a second lip portion that extends obliquely downward and away from, and is provided in a direction along the upper side.

  By providing the second lip portion, the relationship between the airflow that passes through the slit or the through hole and is formed below the eave portion and the airflow that flows on the diagonally upper surface of the first lip portion and the second lip portion is adjusted. However, it is possible to effectively suppress the occurrence of turbulence near the opening of the device.

  Further, for example, the tip of the second lip may be located above the folding slit or the folding through hole in the vertical direction.

  Since the second lip tip is located above the folding slit or the folding through hole, it is possible to strengthen the air flow that passes through the folding slit or the folding through hole and flows away from the device opening. Such a load port device can effectively keep the air flow passing through the slit away from the device opening.

  Further, for example, the slit or the through-hole, an upper surface opening formed in the upper surface of the eaves portion, and a lower surface opening formed in the lower surface of the eaves portion and the distance from the wall portion is farther than the upper surface opening, , May be included.

  In the eaves portion where such slits or through holes are formed, the pressure difference between the airflow passing through the eaves portion and the airflow passing outside the eaves portion becomes large, and the airflow below the eaves portion from the device opening. Since it is strongly pulled in the direction of separating, it is possible to effectively prevent the problem that turbulence is formed around the device opening.

An EFEM according to the present invention includes one of the above load port devices,
And a mini-environment device having a fan filter unit for forming a downflow in the wafer transfer chamber and a wafer transfer chamber provided with an end portion of the load port device.

  In the EFEM according to the present invention, it is possible to prevent the problem that a turbulent flow is formed in the vicinity of the device opening because the eaves portion weakens the downflow by the fan filter unit and the slits or the through holes are formed in the eaves portion. it can. Therefore, the load port device provided in such an EFEM can realize smooth introduction of the cleaning gas into the container.

An EFEM according to a second aspect of the invention is a mounting table on which a container having a main opening for loading and unloading a wafer formed on its side surface is mounted.
A device opening that communicates with the main opening is formed, and a wall portion having an outer surface facing the container and an inner surface facing the opposite direction to the outer surface,
An opening and closing unit for opening and closing the main opening,
A load port device having a gas introducing portion for introducing a cleaning gas into the container,
The load port device has a wafer transfer chamber provided at an end and a mini-environment device having a fan filter unit that forms a downflow in the wafer transfer chamber,
The wafer transfer chamber is provided above the upper side of the device opening, along the upper side, and has an eaves portion that projects substantially perpendicularly to the inner side surface,
A slit or a through hole penetrating the eaves portion in the vertical direction is formed in the eaves portion in a direction along the upper side.

  The eaves portion with the slit formed may be provided on the wall portion of the load port device, is continuous above the wall portion of the load port device, and is provided on the wall surface of the wafer transfer chamber facing the same direction as the wall portion. It may be provided. In addition to the eaves portion, the lip portion, the second lip portion, the eaves folding portion, and the like may be provided on the wall portion of the wafer transfer chamber.

FIG. 1 is a schematic diagram of a load port device and an EFEM including the load port device according to an embodiment of the present invention. FIG. 2 is a schematic perspective view of the load port device shown in FIG. 1 as viewed from the inner side surface of the wall portion. FIG. 3 is an enlarged cross-sectional view showing an enlarged view of an eaves portion and a lip portion in the load port device shown in FIG. FIG. 4 is an enlarged cross-sectional view showing an enlarged eaves portion in the load port device according to the first modified example of the present invention. FIG. 5 is a schematic perspective view of the load port device according to the second modified example of the present invention as viewed from the inner side surface side of the wall portion. FIG. 6 is a schematic perspective view of the load port device according to the third modified example of the present invention as viewed from the inner side surface side of the wall portion. FIG. 7 is a schematic perspective view of the load port device according to the fourth modified example of the present invention as viewed from the inner side surface side of the wall portion. FIG. 8 is a schematic perspective view of the load port device according to the fifth modified example of the present invention as viewed from the inner side surface side of the wall portion. FIG. 9 is a schematic perspective view of the load port device according to the sixth modified example of the present invention as viewed from the inner side surface side of the wall portion. FIG. 10 is an enlarged cross-sectional view showing an enlarged eaves portion in the load port device according to the sixth modification.

Hereinafter, the present invention will be described based on the embodiments shown in the drawings.
FIG. 1 is a schematic diagram of a load port device 10 and an EFEM 50 including the load port device 10 according to an embodiment of the present invention. The EFEM (Equipment, front end module) 50 has a mini-environment device 51 in addition to the load port device 10.

  The mini-environment device 51 has a wafer transfer chamber 52, a wafer transfer device 54, a fan filter unit 56, and the like. The wafer transfer machine 54 has an arm 54a capable of gripping the wafer 1 and an arm drive unit (not shown) for moving the arm 54a, and transfers the wafer 1. The wafer carrier 54 can move the wafer 1 housed in the hoop 2 into a processing chamber (not shown) through the wafer carrier chamber 52 maintained in a clean state. Further, the wafer carrier 54 can move the wafer 1, which has been processed in the processing chamber, from the processing chamber to the inside of the hoop 2.

  The wafer transfer chamber 52 is a space that connects the hoop 2 as a container for transferring the wafer 1 and a processing chamber (not shown). A load port device 10 to be described later is provided at the end of the wafer transfer chamber 52, and the wall portion 11 of the load port device 10 closes the opening formed in the outer wall of the wafer transfer chamber 52. It is incorporated in 52.

  A fan filter unit 56 having a fan 56a as a blowing unit and a filter 56b is provided on the ceiling of the wafer transfer chamber 52, and the fan filter unit 56 forms a downflow in the wafer transfer chamber 52. The fan 56a has, for example, blades inclined with respect to the rotation direction and a motor for rotating the blades. The fan 56a is provided directly above the filter 56b. The filter 56b is not particularly limited, but for example, a combination of a particle removal filter and a chemical filter can be used, and particles and contaminants existing in the gas filling the wafer transfer chamber 52 can be removed. It should be noted that the fan filter unit 56 only needs to have a blowing unit such as the fan 56a and a filter 56b, and the fan filter unit 56 includes a unit in which the blowing unit and the filter are separately arranged.

  The load port device 10 has a mounting table 14 on which a hoop (Front Opening Unified Pod) 2 is mounted. The hoop 2 is transported to the top of the mounting table 14 by, for example, a ceiling transport system.

  The hoop 2 mounted on the mounting table 14 hermetically stores and transfers a plurality of wafers 1 as contained items. A space for accommodating the wafer 1 therein is formed inside the hoop 2. The hoop 2 has a box-like shape, and a main opening 2b through which the wafer 1 stored in the hoop 2 is taken in and out is formed on one of the side surfaces of the hoop 2. The hoop 2 also includes a lid 4 for sealing the main opening 2b.

  The load port device 10 can hermetically connect the main opening 2b of the hoop 2 mounted on the mounting table 14 to the wafer transfer chamber 52. That is, the load port device 10 has a wall portion 11 in which the device opening 13 is formed and an opening/closing portion 18 for opening/closing the main opening 2b of the hoop 2. The load port device 10 connects the main opening 2b of the hoop 2 to the device opening 13 by moving the mounting table 14 as shown in FIG. The main opening 2b of the hoop 2 and the device opening 13 formed in the wall portion 11 are both substantially rectangular.

  Further, the opening/closing part 18 of the load port device 10 removes the lid 4 closing the main opening 2b connected to the device opening 13 from the main opening 2b, and through the main opening 2b and the device opening 13, to the inside of the hoop 2. The wafer transfer chamber 52 can be communicated. That is, the opening/closing part 18 has a door 18a for closing the opening of the apparatus and a door driving part 18b. The door driving part 18b carries the wafer 18 with the lid 4 of the hoop 2 engaged with the door 18a. It can be moved into the chamber 52.

  Further, the load port device 10 has a bottom gas introduction part 16 as a gas introduction part for introducing the cleaning gas into the hoop 2, and a front gas introduction part 17. The bottom gas introduction part 16 has gas introduction nozzles which can be connected to the bottom holes 5 and 6 provided on the bottom surface of the hoop 2 so as to project from the mounting table 14 and to be cleaned from the bottom holes 5 and 6. Is introduced into the hoop 2. The bottom gas introducing unit 16 can introduce the cleaning gas into the hoop 2 in a state where the inside of the hoop 2 and the wafer transfer chamber 52 are in communication with each other. Even when the opening 2b is closed by the lid 4, the cleaning gas can be introduced into the hoop 2.

  On the other hand, the front gas introduction part 17 has a gas discharge nozzle provided on the inner side surface 11 a of the wall part 11, and introduces the cleaning gas into the hoop 2 via the main opening 2 b and the device opening 13. Therefore, unlike the bottom gas introduction unit 16, the front gas introduction unit 17 can introduce the cleaning gas into the hoop 2 only when the inside of the hoop 2 and the wafer transfer chamber 52 are in communication with each other.

  A cleaning gas is supplied to the bottom gas introduction unit 16 and the front gas introduction unit 17 via a piping unit (not shown). The cleaning gas introduced into the hoop 2 by the bottom gas introduction unit 16 and the front gas introduction unit 17 is not particularly limited, but nitrogen gas or the like is preferably used.

  FIG. 2 is a schematic perspective view of the load port device 10 shown in FIG. 1 as seen from the inner side surface 11 a side of the wall portion 11. It should be noted that in FIG. 2, for convenience of description, the front gas introducing portion 17, the opening/closing portion 18, and the hoop 2 shown in FIG. 1 are not shown.

  As shown in FIG. 2, the wall portion 11 of the load port device 10 has an outer surface 11b facing the hoop 2 on which the mounting table 14 is mounted, and a wafer transfer chamber 52 side that is opposite to the outer surface 11b. It has a facing inner surface 11a. Above the upper side 13a of the device opening 13 on the inner side surface 11a, a canopy portion 20 is provided which projects substantially perpendicularly to the inner side surface 11a.

  The eaves portion 20 has an outer shape of a substantially rectangular flat plate having a long side substantially parallel to the upper side 13a, and is provided along the upper side 13a of the device opening 13. The eaves portion 20 is formed with a slit 22 penetrating the eaves portion 20 in the vertical direction in a direction along the upper side 13a. The slit 22 may be a through hole that is intermittently formed in the direction along the upper side 13a.

  As shown in FIG. 2, a lip portion 30 is connected to the eaves portion 20. A lip base end 32 which is a base end of the lip portion 30 is connected to an eaves tip 24 which is a tip end of the eaves portion 20, and a lip tip 34 which is a tip end of the lip portion 30 extends from the lip base end 32 to the wall portion 11. It extends diagonally upward to approach. Like the eaves portion 20, the lip portion 30 has a substantially rectangular flat outer shape having long sides substantially parallel to the upper side 13a, and is provided along the upper side 13a of the device opening 13.

  FIG. 3 is an enlarged sectional view in which the periphery of the eaves portion 20 and the lip portion 30 of the load port device 10 shown in FIG. 2 are enlarged and displayed. The slit 22 has an upper surface opening 22a formed on the upper surface 20a of the eaves portion 20 and a lower surface opening 22b formed on the lower surface 20b of the eaves portion 20. Since the slit 22 penetrates the eaves portion 20 in the vertical direction, the upper surface opening 22a and the lower surface opening 22b are located equidistant from the wall portion 11.

  Here, among the downflows formed in the wafer transfer chamber 52, those that are directed to the eaves portion 20 shown in FIG. 3 are the airflow A passing through the slits 22 of the eaves portion 20 and the eaves portion along the lip portion 30. It is considered that the airflow B passing outside 20 is divided. Since the airflow A passing through the slit 22 has a higher atmospheric pressure than the airflow B passing outside the eaves portion 20, as shown in FIG. Is pulled away from. Therefore, the eaves portion 20 having the slits 22 as shown in FIG. 2 effectively prevents the conventional problem that a turbulent flow is formed below the eaves portion that stops downflow. be able to. Further, as a result, the load port device 10 shown in FIGS. 1 to 3 prevents the problem that the downflow directly flows around the device opening 13 or the turbulence of the air flow occurs, and the load port device 10 can be installed in the container. It is possible to realize smooth introduction of the cleaning gas.

  The position of the lip tip 34 shown in FIG. 3 is not particularly limited, but in consideration of the distance from the wall portion 11 so that the airflow A and the airflow B are appropriately formed, the eaves tip from the center position C of the eaves portion 20. It is preferably arranged on the 24 side. The angle θ formed between the lip portion 30 and the eaves portion 20 is also not particularly limited, but is preferably 30 to 60 degrees from the viewpoint of suitably forming the pressure difference between the air flow A and the air flow B. Further, it is preferable that the slit 22 is formed on the eaves tip 24 side from the center position C of the eaves portion 20 from the viewpoint of suitably forming the air flow A pulled toward the air flow B side.

  As described above, the load port device 10 and the EFEM 50 according to the present invention have been described with reference to the embodiments, but the present invention is not limited to these embodiments and includes various modifications. Needless to say.

  FIG. 4 is an enlarged cross-sectional view in which the periphery of the eaves portion 120 of the load port device 110 according to the first modification is enlarged and displayed. The load port device 110 is the same as the load port device 10 shown in FIGS. 1 to 3 except that the slit 122 in the eaves portion 120 has a different shape and does not have a lip portion. Only differences from the load port device 10 will be described.

  As shown in FIG. 4, the slit 122 formed in the eaves portion 120 has an upper surface opening 122a formed in the upper surface 120a of the eaves portion 20 and a lower surface opening 122b formed in the lower surface 120b of the eaves portion 120. ing. The slit 122 obliquely penetrates the eaves portion 120, and the lower surface opening 122b is farther from the wall portion 11 than the upper surface opening 122a.

  Even in such an eaves portion 120, as shown in FIG. 4, the airflow A passing through the slit 122 has a higher atmospheric pressure than the airflow B passing outside the eaves portion 120, so that the airflow below the eaves portion 120. A phenomenon occurs in which A is pulled in a direction away from the device opening 13. Further, the slit 122 that obliquely penetrates the eaves portion 120 as shown in FIG. 4 has a space between the airflow A and the airflow B compared to the slit 22 that vertically penetrates the eaves portion 20 as shown in FIG. The pressure difference can be increased or the air flow A can be effectively guided in the direction away from the device opening 13. Therefore, the load port device 110 according to the first modified example also has the same effect as the load port device 10 according to the embodiment.

  FIG. 5 is a schematic perspective view of the load port device 210 according to the second modification as viewed from the inner surface 11a side of the wall portion 11. The load port device 210 is the same as the load port device 10 shown in FIGS. 1 to 3 except that it has an eaves-folding portion 225, and therefore only the differences from the load port device 10 will be described.

  The load port device 210 has an eaves folding portion 225 that extends downward from the eaves tip 24 that is the tip of the eaves portion 20. The eaves folding portion 225 has a substantially rectangular flat plate-like outer shape having long sides that are substantially parallel to the upper side 13 a of the device opening 13. The eaves folding portion 225 is formed with a folding slit 226 penetrating the eaves folding portion 225 in the horizontal direction.

  The eaves-folding portion 225 can prevent the airflow from being entrained in the lower portion of the eaves portion 20 and suppress the generation of turbulent flow near the device opening 13. Further, since the folding slit 226 is formed, the phenomenon that the airflow A separates from the device opening 13 as shown in FIG. 3 easily occurs, and the same effect as that of the load port device 10 shown in FIGS.

  FIG. 6 is a schematic perspective view of the load port device 310 according to the third modification as seen from the inner surface 11a side of the wall portion 11. The load port device 310 is similar to the load port device 10 shown in FIGS. 1 to 3 except that the load port device 310 has a pair of side eaves 327, and therefore only the differences from the load port device 10 will be described.

  The load port device 310 is provided adjacent to a pair of side sides 13b (sides in the vertical direction) of the device opening 13 on the inner side surface 11a, and a side eaves portion 327 protruding substantially perpendicular to the inner side surface 11a. have. The side eaves portion 327 has a rectangular flat plate-like outer shape having a long side substantially parallel to the side side 13 b of the device opening 13.

  Since the side eaves 327 can prevent the inflow of downflow from both sides of the device opening 13, it contributes to the smooth introduction of the cleaning gas into the hoop 2 by the load port device 310. Further, the load port device 310 has the same effect as the load port device 10 shown in FIGS.

  FIG. 7 is a schematic perspective view of the load port device 410 according to the fourth modification as seen from the inner surface 11a side of the wall portion 11. The load port device 410 is the same as the load port device 210 shown in FIG. 5 except that it has a pair of side eaves portions 427, and therefore only the differences from the load port device 210 will be described.

  The load port device 410 is provided adjacent to a pair of side sides 13b (sides in the vertical direction) of the device opening 13 on the inner side surface 11a, and a side eaves portion 427 protruding substantially perpendicular to the inner side surface 11a. have. The side eaves portion 427 has a rectangular flat plate-like outer shape having long sides substantially parallel to the side edges 13 b of the device opening 13. The side eaves portion 427 is formed with a side slit 428 that horizontally penetrates the side eaves portion 427.

  The side eaves 427 can prevent the inflow of downflow from both sides of the device opening 13 like the side eaves 327 shown in FIG. Contributes to the smooth introduction of clean gas. Further, the side slits 428 can adjust the air flow from the side to the device opening 13 and can suppress the problem that turbulence or the like is formed. Further, the load port device 410 has the same effect as the load port device 210 shown in FIG.

  FIG. 8 is a schematic perspective view of the load port device 510 according to the fifth modification as seen from the inner surface 11a side of the wall portion 11. The load port device 510 is similar to the load port device 410 shown in FIG. 7 except that it has a pair of side eaves folding portions 529, and therefore only the differences from the load port device 410 will be described.

  The load port device 510 has a side eaves folding back portion 529 that extends horizontally from the tip of the side eaves portion 427 toward the device opening 13 side, and the side eaves folding portion 529 is located on the side of the device opening 13 side. It has a substantially rectangular flat plate-like outer shape having long sides substantially parallel to the side 13b.

  The side eaves folding portion 529 can prevent the inflow of downflow from both sides of the device opening 13 like the side eaves portion 427, so that the cleaning gas inside the hoop 2 by the load port device 510 can be prevented. Contribute to the smooth introduction of. Further, the load port device 510 has the same effect as the load port device 210 shown in FIG. 7. In addition, the side eaves folding|returning part 529 may be formed with the slit or through-hole for adjusting an airflow similarly to the side eaves part 427.

  FIG. 9 is a schematic perspective view of the load port device 610 according to the sixth modified example of the present invention as viewed from the inner surface 11a side of the wall 11. Further, FIG. 10 is an enlarged cross-sectional view in which the periphery of the eaves portion 20 of the load port device 610 is enlarged and displayed. The load port device 610 is the same as the load port device 10 according to the first embodiment except that the load port device 610 has an eaves-folding portion 625 and a second lip portion 635. Therefore, only differences from the load port device 10 will be described.

  As shown in FIGS. 9 and 10, in the load port device 610, the folded-back portion base end 625a that is the base end is connected to the eaves tip 24 (see FIG. 10), and the folded-back portion tip 625b that is the tip end is the eaves tip. The eaves folding|returning part 625 extended below from 24 is provided. The eaves folding portion 625 is a rectangular flat plate shape that is folded back substantially vertically to the eaves portion 20. The eaves folding portion 625 is provided so as to be substantially parallel to the wall portion 11.

  In the eaves folding portion 625, a folding slit 626 that penetrates the eaves folding portion 625 in the horizontal direction is formed in a direction along the upper side 13a of the device opening 13. As shown in FIG. 10, a part of the air flow A that has passed through the slit 22 formed in the eaves portion 20 flows downward after passing through the folding slit 626 in a direction away from the device opening 13.

  As shown in FIGS. 9 and 10, in the load port device 610, the second lip base end 636 that is the base end is connected to the eaves tip 24, and the second lip tip 637 that is the tip is the second lip base end. A second lip portion 635 is provided that extends obliquely downwardly from the wall portion 11 and extends in a direction along the upper side 13a. The second lip base end 636 is connected to the eaves tip 24 similarly to the lip base end 32 (see FIG. 3) of the lip portion 30, but the lip tip 34 extends obliquely upward. The second lip tip 637 extends obliquely downward. In the sixth modified example, the lip portion 30 and the second lip portion 635 are made of separate plate materials, and their respective base ends are fixed to the eaves tip 24. However, the lip base end 32 and the second lip base end 636 may be connected to each other, and the lip portion 30 and the second lip portion 635 may be formed as a continuous, integral member.

  As shown in FIG. 10, among the downflows formed in the wafer transfer chamber, those that flow toward the eaves portion 20 are the airflow A passing through the slit 22 of the eaves portion 20, the lip portion 30, and the second lip portion 635. It is considered that the airflow B is divided along the outside of the eaves portion 20. In the sixth modified example shown in FIG. 10 as well, as in the first embodiment, the airflow A passing through the slit 22 has a higher atmospheric pressure than the airflow B passing outside the eaves portion 20, so that the eaves portion 20 The lower airflow A is pulled in a direction away from the device opening 13. Particularly, in the sixth modified example, a part of the airflow A that has passed through the slit 22 formed in the eaves portion 20 passes through the folding slit 626 in a direction away from the device opening 13. Therefore, the load port device 610 can effectively distance the airflow A that has passed through the slit 22 from the device opening 13, and can suppress the occurrence of turbulence near the device opening 13. Further, the load port device 610 having both the lip portion 30 and the second lip portion 635 forms an air flow as shown in FIG. 10 and can effectively suppress the occurrence of turbulence near the device opening 13. it can.

  The angle θ1 formed between the lip portion 30 and the eaves portion 20 and the angle θ2 formed between the second lip portion 635 and the eaves folding portion 625 are not particularly limited, and the downflow causes the device opening 13 to occur. It is adjusted so that turbulence does not occur in the vicinity. For example, it is preferable that the angle θ1 is 60 degrees or less and the angle θ2 is 40 degrees or less from the viewpoint of effectively separating the airflow A passing through the slit 22 from the device opening 13. For the same reason, the angle θ2 is preferably smaller than the angle θ1 and the sum of the angle θ1 and the angle θ2 is preferably smaller than 90 degrees.

  Further, the second lip tip 637 may be located above the folding slit 626 in the vertical direction. Since the second lip tip 637 is located above the folding slit 626, the airflow passing through the folding slit 626 and away from the device opening 13 can be strengthened. Therefore, such a load port device 610 is The airflow A passing through the slit 22 can be effectively kept away from the device opening 13. Further, the load port device 610 according to the sixth modified example also has the same effect as the load port device 10 according to the first embodiment. The folding slit 626 may be a folding through hole formed by a through hole that is intermittently formed in the direction along the upper side 13a.

  The combination of the eaves portions 20 and 120, the lip portion 30 and the like shown in the embodiment and the modified example can be arbitrarily changed. For example, the eaves section 20, the lip section 30, the eaves folding section 625, and the second lip section 635 according to the sixth modified example are the side eaves sections 327 and 427 and the side eaves folding section 529 shown in the other modified examples. It is also possible to use together with it, and it is also possible to use the eaves part 120 shown in a 1st modification instead of the eaves part 20 employ|adopted by 1st Embodiment and 2nd-6th modification.

  The above-described embodiments and modifications are merely examples of the embodiments included in the present invention, and do not limit the present invention in any way. Further, the eaves portion 20 shown in FIG. 3 can be arranged at any place between the upper side of the device opening 13 and the fan filter unit 51. For example, the eaves portion 20 may be provided not on the inner side surface 11a of the wall portion 11 of the load port device 10 but on the wall surface of the wafer transfer chamber 52 continuing above the inner side surface 11a.

1... Wafer 2... Hoop 4... Lids 5, 6... Bottom holes 10, 110, 210, 310, 410, 510... Load port device 11... Wall member 11a... Inner side surface 11b... Outer side surface 13... Device opening 13a... Top side 13b ... Sides 14... Mounting table 16... Bottom gas introducing part 17... Front gas introducing part 18... Opening/closing part 18a... Door 18b... Door driving part 20, 120... Eaves 20a, 120a... Upper surface 20b, 120b... Lower surface 22, 122... Slits 22a, 122a... Upper surface openings 22b, 122b... Lower surface opening 24... Eaves tip 225, 625... Eaves folding part 626a... Eaves folding part base end 626b... Eaves folding part tip 226, 626... Folding slit 327, 427... Side eaves Part 428... Side slit 429... Side eaves folding part 30... Lip part 34... Lip tip 635... Second lip part 636... Second lip base end 637... Second lip tip 50... EFEM
51... Mini-environment device 52... Wafer transfer chamber 54... Wafer transfer machine 54a... Arm 56... Fan filter unit 56a... Fan 56b... Filter

Claims (9)

A mounting table on which a container having a main opening for loading and unloading a wafer formed on a side surface is mounted,
A device opening that communicates with the main opening is formed, and a wall portion having an outer surface facing the container and an inner surface facing the opposite direction to the outer surface,
An opening and closing unit for opening and closing the main opening,
A gas introduction unit for introducing a cleaning gas into the container,
Above the upper side of the device opening in the inner side surface, provided along the upper side, and having an eaves portion protruding substantially perpendicular to the inner side surface,
A load port device, wherein a slit or a through hole penetrating the eaves portion in a vertical direction is formed in the eaves portion in a direction along the upper side.   A lip base end that is a base end is connected to an eaves tip that is a tip end of the eaves portion, and a lip tip that is a tip end extends obliquely upward from the lip base end toward the wall portion, and on the upper side. The load port device according to claim 1, further comprising a lip portion provided in a direction along the load port. And the folded portion proximal a proximal end connected to the eaves tip according to claim 2, characterized in that it comprises a visor folded portion which is folded tip is the tip extending downwardly from the eaves tip Load port equipment.   The load port device according to claim 3, wherein a folding slit or a folding through hole that horizontally penetrates the eaves folding portion is formed in the eaves folding portion in a direction along the upper side.   A second lip base end that is a base end is connected to the eaves tip, and a second lip tip that is a tip extends obliquely downwardly away from the second lip base end with respect to the wall portion. The load port device according to claim 3 or 4, further comprising a second lip portion provided in a direction along the upper side.   The load port device according to claim 5, wherein the tip of the second lip is located above the folding slit or the folding through hole in the vertical direction.   The slit or the through hole has an upper surface opening formed on the upper surface of the eaves portion, and a lower surface opening formed on the lower surface of the eaves portion and farther from the wall portion than the upper surface opening. The load port device according to claim 1 or 2, characterized in that. A load port device according to any one of claims 1 to 7,
A mini-environment device having a wafer transfer chamber provided with the load port device at an end and a fan filter unit forming a downflow in the wafer transfer chamber;
With EFEM. A mounting table on which a container having a main opening for loading and unloading a wafer formed on a side surface is mounted,
A device opening that communicates with the main opening is formed, and a wall portion having an outer surface facing the container and an inner surface facing in a direction opposite to the outer surface,
An opening and closing unit for opening and closing the main opening,
A load port device having a gas introducing portion for introducing a cleaning gas into the container,
The load port device has a wafer transfer chamber provided at the end and a mini-environment device having a fan filter unit that forms a downflow in the wafer transfer chamber,
The wafer transfer chamber is provided above the upper side of the device opening, along the upper side, and has an eave portion that projects substantially perpendicularly to the inner side surface,
The EFEM, wherein a slit or a through hole penetrating the eaves portion in the vertical direction is formed in the eaves portion in a direction along the upper side.

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