JP6711706B2 - Lid body, package for storing image pickup element, and image pickup apparatus - Google Patents

Description

The present invention relates to a lid for sealing an image pickup device, an image pickup device housing package including the lid, an image pickup apparatus, and a method for manufacturing the lid.

An image pickup device such as a CCD (Charge Coupled Device) or a C-MOS (Complementary Metal Oxide Semiconductor) is mounted on a wiring board for mounting the image pickup device and then sealed with a translucent lid body to be used in a digital camera or the like. It is mounted on an imaging device.

The lid is a flat plate made of a translucent material such as glass. The outer peripheral portion of the lower surface of the lid body is aligned and joined to the portion of the upper surface of the base body forming the wiring board, which surrounds the portion where the image pickup device is mounted. The alignment is performed by, for example, recognizing an image of the outer peripheral position of the lid.

JP2008-187170

However, in the above-mentioned conventional technique, since the lid body is made of glass or the like, it is difficult to recognize the position of the outer circumference of the lid body, and it is difficult to align the lid body and the base body. In particular, in response to further downsizing of electronic devices in recent years, downsizing of the lid and high accuracy of alignment with respect to the substrate are required, and it becomes difficult to meet these requirements. ing.

A lid according to one aspect of the present invention is a translucent material having a first main surface that is an external light incident surface and a second main surface that is the light emitting surface opposite to the first main surface. A substrate having an inclined surface that is inclined outward from the outer periphery of the first main surface toward the second main surface, and the inclined surface is provided on the outer peripheral portion of the first main surface. includes a frame-like diffuse reflection area in contact with the surface, the first major surface, Ru plane der consecutive toward the diffuse reflection area of the outer peripheral portion than the diffuse reflection area from the inner region.

An image pickup element housing package according to one aspect of the present invention includes a base having an upper surface including an opening and having an image pickup element mounting portion in the opening, and a lid having the above-described configuration that closes the opening. ..

An image pickup apparatus according to one aspect of the present invention includes an image pickup element housing package having the above configuration, and an image pickup element mounted on the mounting portion, and the lid body is joined to an upper surface of the base body to form the opening. The part is blocked.

According to the lid body of one aspect of the present invention, the substrate forming the lid body has an inclined surface inclined outward from the outer periphery of the first main surface toward the second main surface, Since the outer peripheral portion of the first main surface includes the frame-shaped irregular reflection region that is in contact with the inclined surface, it is easy to recognize the outer peripheral position and the like of the lid body. That is, when the lid body is viewed from above (from the first main surface side), the first main surface and the inclined surface that are substantially perpendicular to the viewing direction have different light reflection forms. Further, in the irregular reflection region, light is easily transmitted (scattered light is suppressed), and the reflection form of the light is different from the other regions of the first main surface and the inclined surface. Therefore, the lid can be easily recognized in the irregular reflection area, and the outer peripheral position of the lid can be easily recognized on the inclined surface.

With such a lid, it is possible to improve the accuracy and ease of positioning with respect to the base body. The form of light reflection is recognized, for example, as a difference in brightness or the presence or absence of scattered light.

According to the image pickup element housing package of one aspect of the present invention, since the lid body having the above-described configuration is included, it is easy to perform the alignment at the time of joining the lid body and the base body, and also to improve the position accuracy. It is possible to provide an effective package for housing an image sensor.

According to the imaging device of one aspect of the present invention, since the lid having the above-described configuration is included, the positional accuracy of the joining between the lid and the base is high, the mutual alignment during manufacturing is easy, and the productivity is improved. It is possible to provide an image pickup apparatus which is advantageous also in respect of.

According to the method of manufacturing the lid body of the one aspect of the present invention, since the above-described steps are included, the irregular reflection region and the inclined surface can be easily formed, and the lid body having the above-described configuration can be easily manufactured.

It is sectional drawing which shows the cover body of the 1st Embodiment of this invention. It is sectional drawing which expands and shows the A section of FIG. It is sectional drawing which shows the 1st modification of the cover body shown in FIG. It is sectional drawing which expands and shows the A section of FIG. It is sectional drawing which shows the 2nd modification of the lid body shown in FIG. It is sectional drawing which expands and shows the A section of FIG. It is sectional drawing which shows the cover body of the 2nd Embodiment of this invention. It is sectional drawing which expands and shows the A section of FIG. It is sectional drawing which shows the modification of the cover body shown in FIG. It is sectional drawing which expands and shows the A section of FIG. (A)-(d) is sectional drawing which shows the manufacturing method of the lid body in embodiment of this invention in order of process. FIG. 3 is a cross-sectional view showing an image pickup element housing package and an electronic device according to an embodiment of the present invention.

(The lid of the first embodiment)
A lid, an image pickup element housing package, an imaging device, and a lid manufacturing method according to an embodiment of the present invention will be described with reference to the accompanying drawings. It should be noted that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the lid body and the package for storing the image sensor are used, and the upper and lower sides in the process of manufacturing the lid body.

Examples of the lid body of the first embodiment are shown in FIGS. 1 to 6, and examples of the lid body of the second embodiment are shown in FIGS. 7 to 10. FIG. 11 shows an example of a method for manufacturing the lid body, and FIG. 12 shows an example of an image pickup device housing package including the lid body and an image pickup apparatus. In each of these drawings, the substrate 1 and the dielectric film 2 that is added as necessary are shown as the portions that form the lid body 3, and other portions are also denoted by the same reference numerals. Shows.

FIG. 1 is a cross-sectional view showing an example of the lid body of the embodiment, and FIG. 2 is a cross-sectional view showing an enlarged portion A of FIG.

The lid 3 is basically formed by a flat plate-shaped substrate 1 made of translucent glass. The substrate 1 has a rectangular first main surface (upper surface in FIG. 1 and the following drawings) and a second main surface (lower surface in FIG. 1 and the following drawings), respectively.

The lid 3 is used as a sealing member in the image pickup device housing package 10 and the image pickup device 20, as in the example shown in FIG. 12, for example. The translucent lid 3 hermetically seals an image pickup device (described later) in a state where light can be received from the outside.

The first main surface of the substrate 1 is a surface on the upper side (external environment side) in the package 10 for housing the image pickup device and the image pickup device 20, and is a surface exposed to the outside. Further, the second main surface is a surface on the lower side (on the side of the image pickup element), and is a surface located inside the container in which the image pickup element is sealed. In other words, the first main surface is an external light incident surface, and the second main surface is an outgoing surface of the light.

The substrate 1 has an inclined surface 1b that is inclined outward from the outer periphery of the first main surface toward the second main surface. There is a side surface 1c on the lower side of the inclined surface 1b, and the substrate 1 has an upper side surface (unsigned as the upper side surface) inclined outward from the top to the bottom, and a vertical lower side surface (unsigned as the lower side surface). ) And can also be considered as having.

Further, the outer peripheral portion of the first main surface of the substrate 1 includes a frame-shaped irregular reflection area 1a in contact with the inclined surface 1b. In other words, when the lid 3 is viewed from above (from the first main surface side), the frame-shaped inclined surface 1b can be seen at the outermost periphery of the substrate 1, and the frame-shaped inclined surface 1b is formed inside the frame-shaped inclined surface 1b. The irregular reflection area 1a is visible.

According to such a lid body 3, the substrate 1 forming the lid body 3 has the inclined surface 1b having the above-described configuration, and the irregular reflection area 1a having the above-described configuration is included in the outer peripheral portion of the first main surface. Therefore, it is easy to recognize the outer peripheral position of the lid body 3 and the like. That is, when the lid 3 is viewed from above, the first main surface and the inclined surface 1b, which are substantially perpendicular to the viewing direction, have different light reflection forms. Further, the irregular reflection region 1a is different in the form of light reflection from the other region of the first main surface where light is easily transmitted (scattered light is suppressed) and the inclined surface 1b.

Therefore, the lid 3 can be easily recognized in the irregular reflection area 1a, and the outer peripheral position of the lid 3 (substrate 1) can be easily recognized in the inclined surface 1b. That is, it is possible to provide the lid body 3 and the lid body 3 whose outer peripheral position is easily recognized.

With such a lid body 3, for example, in the image pickup device housing package 10 and the image pickup device 20 of the example shown in FIG. 12, it is possible to improve the accuracy and ease of positioning with respect to a base body (described later). The above-mentioned light reflection form is recognized as, for example, a difference in brightness or the presence or absence of scattered light.

Examples of the material forming the substrate 1 include a glass material such as borosilicate glass, a birefringent material such as lithium niobate, quartz, and sapphire, or a light-transmitting material such as a polymer material such as an acrylic resin.

If the substrate 1 is made of glass, for example, it can be manufactured as follows. First, the molten high-purity glass raw material is cooled in a container made of a metal having a melting point higher than the melting temperature of glass to form a block shape. After that, the block-shaped member is molded into a predetermined size and shape, and the substrate 1 can be manufactured by a process such as polishing the surface. Examples of the polishing include lapping using an abrasive such as alumina, optical polishing using an abrasive such as alumina and cerium oxide. Alternatively, the substrate 1 may be formed by forming a molten high-purity glass material into a plate shape having a predetermined thickness by a downdraw method, cutting it into a large size, and then cutting it into a predetermined size and shape. Details of a method of manufacturing the lid 3 including the substrate 1 having the inclined surface 1b and the irregular reflection region 1a will be described later.

The thickness of the substrate 1 is set to about 0.03 to 0.8 mm, for example. If the thickness of the substrate 1 is 0.03 mm or more, the mechanical strength such as the bending strength of the substrate 1 is relatively high, so that the deformation of the substrate 1 due to the stress in the step of forming the dielectric film 2 described later is effective. Can be suppressed to. Further, when the thickness of the substrate 1 is 0.8 mm or less, it is effective for making the imaging device 20 and the like thinner.

In consideration of the above effect and the workability (productivity) when forming the inclined surface 1b, the width of the inclined surface 1b (the distance between the outer circumference and the inner circumference of the inclined surface 1b in plan view) is, for example, about 0.003-0.02m
It is set to about m.

Further, in consideration of the above effect and the workability (productivity) at the time of forming the irregular reflection region 1a, the width of the irregular reflection region 1a (the distance between the outer periphery and the inner periphery of the irregular reflection region 1a in plan view) is For example, it is set to about 0.05 to 0.2 mm.

The irregular reflection region 1a is, for example, a portion of the first main surface of the substrate 1 having a relatively large surface roughness. A portion of the first main surface of the substrate 1 through which external light received by the image sensor is transmitted (inner side of the irregular reflection area 1a) has a smaller surface roughness than the irregular reflection area 1a, and for example, arithmetic by a laser surface roughness meter. The average roughness (Ra) is about 0.001 to 0.02 μm, which is a mirror surface.

On the other hand, the surface roughness of the first main surface of the substrate 1 in the irregular reflection region 1a is, for example, Ra of about 0.1 to 1 μm.

(Modification)
FIG. 3 is a cross-sectional view showing a first modified example of the lid body 3 shown in FIG. 1, and FIG. 4 is a cross-sectional view showing an enlarged part A of FIG. In this example, the substrate 1 has a step portion 1d on the outer peripheral portion of the first main surface. The bottom surface of the step portion 1d is the irregular reflection area 1a. In the examples shown in FIGS. 3 and 4, the entire bottom surface of the step portion 1d is the irregular reflection area 1a, and the bottom surface is not labeled.

In this case, since the bottom surface of the step portion 1d further away from the first main surface is the irregular reflection area 1a, for example, the contrast between the first main surface and the irregular reflection area 1a becomes larger, and the irregular reflection area 1a can be recognized effectively. Can be easily made.

The step portion 1d can be formed by, for example, mechanically grinding the substrate 1. Details of the method of forming the step portion 1d will be described later.

FIG. 5 is a cross-sectional view showing a second modification of the lid body 3 shown in FIG. 1, and FIG. 6 is a cross-sectional view showing an enlarged part A of FIG. In this example, the substrate 1 has an inclined portion 1e on the outer peripheral portion of the first main surface. The surface of the inclined portion 1e is the irregular reflection area 1a. In the examples shown in FIGS. 5 and 6, the entire surface of the inclined portion 1e is the irregular reflection area 1a, and the surface is not labeled.

The inclination angle of the inclined portion 1e (the inclination angle from the horizontal direction to the downward direction in the cross-sectional view) is different from the inclination angle of the inclined surface 1b. The inclined surface 1b has a larger inclination angle than the inclined portion 1e and is a so-called steeply inclined surface.

The inclination angle of the inclined portion 1e is set to, for example, about 30 to 60 degrees. The inclination angle of the inclined surface 1b at this time is set to about 5 to 15 degrees, for example.

In this case, since the surface of the inclined portion 1e having a different inclination angle from the inclined surface 1b is the irregular reflection area 1a, for example, the contrast between the inclined surface 1b and the irregular reflection area 1a is effectively increased to recognize the inclined surface 1b. The ease of use can be effectively improved.

The inclined portion 1e can be formed by, for example, mechanically grinding the substrate 1. Details of the method for forming the inclined portion 1e will be described later.

(The lid of the second embodiment)
FIG. 7 is a cross-sectional view showing the lid body 3 according to the second embodiment of the present invention. FIG. 8 is a cross-sectional view showing an enlarged part A of FIG. In FIGS. 7 and 8, the same parts as those in FIGS. 1 to 6 are designated by the same reference numerals.

As described above, the lid 3 of the second embodiment further includes the dielectric film 2 arranged on the first main surface of the substrate 1. The second embodiment is different from the lid 3 of the first embodiment in the presence of the dielectric film 2, and is otherwise the same as the first embodiment. Descriptions of these points similar to those of the first embodiment will be omitted. The dielectric film 2 is not provided on the irregular reflection area 1a and the inclined surface 1b, as long as it is in a portion of the lid 3 that allows external light to pass therethrough.

The dielectric film 2 is an optical film added to the substrate 1 forming the lid 3, and is, for example, an infrared cut filter that blocks infrared light. The function as an optical film may be present in a portion of the first main surface of the substrate 1 through which light actually transmits, that is, a portion inside the irregular reflection area 1a. Therefore, the dielectric film 2 is provided only on the inner side (center side) of the irregular reflection region 1a on the first main surface.

When the dielectric film 2 is provided, infrared rays, such as near infrared rays, which are unnecessary for image pickup (image formation by photoelectric conversion of visible light) in the light transmitted through the lid body 3 are cut off. Capable of capturing natural color tones.

The dielectric film 2 as an infrared cut filter has a maximum reflectance of 20% or less in a wavelength range of 400 to 600 nm and a wavelength of 700 to 700 nm in order to shield an incident wave having a wavelength in the near infrared range. It has the function of having a minimum reflectance of 90% or more in the 1000 nm region.

The dielectric film 2 includes, for example, a plurality of high refractive index dielectric layers 2a made of a dielectric material having a refractive index of 1.7 or more and a plurality of low refractive index dielectric layers 2b made of a dielectric material having a refractive index of 1.6 or less. And are alternately stacked. That is, the dielectric film 2 included in the lid body 3 of the present embodiment is a dielectric multilayer film (no reference is made to the dielectric multilayer film). The high-refractive-index dielectric layer 2a and the low-refractive-index dielectric layer 2b are formed by a method such as a vapor deposition method or a sputtering method. The high-refractive-index dielectric layer 2a and the low-refractive-index dielectric layer 2b are five layers in the example shown in FIG. 8, but may be more than this. For example, the high-refractive-index dielectric layers 2a and the low-refractive-index dielectric layers 2b may be laminated alternately in order of 10 layers or more to form the dielectric film 2. Further, the dielectric film 2 for antireflection use does not necessarily need to have a plurality of dielectric layers of the high-refractive-index dielectric layer 2a and the low-refractive-index dielectric layer 2b, and may have only a single low-refractive-index dielectric layer 2b. Absent.

Examples of the dielectric material having a refractive index of 1.7 or more include tantalum pentoxide, titanium oxide, niobium pentoxide, lanthanum oxide and zirconium oxide. Further, examples of the dielectric material having a refractive index of 1.6 or less include silicon oxide, aluminum oxide, lanthanum fluoride, magnesium fluoride and the like. Considering mechanical characteristics such as hardness and stability, and optical characteristics such as a refractive index necessary for functioning as an optical filter, titanium oxide is used as the high refractive index dielectric layer 2a and a low refractive index dielectric is used. Silicon oxide may be used for the body layer 2b.

As a method for depositing and forming the dielectric film 2 (the high refractive index dielectric layer 2a and the low refractive index dielectric layer 2b) on the substrate 1, for example, an ion beam assisted vapor deposition method can be used. As the cations used in the ion beam assisted vapor deposition method, those generated from plasma obtained by introducing both an inert gas composed of argon and an active gas composed of oxygen gas into the ion source of the apparatus are used.

Immediately before depositing the dielectric film 2 on the substrate 1, the first main surface of the substrate 1 is activated by a method such as chemical polishing with an alkaline treatment liquid and plasma cleaning with plasma irradiation. You may do it. By this activation treatment, it is possible to improve the adhesiveness and optical transparency between the first main surface of the substrate 1 and the dielectric film 2.

Further, the lid 3 of the example shown in FIGS. 7 and 8 is an example in which the substrate 1 has a step portion 1d on the outer peripheral portion of the first main surface, and in this respect, the first embodiment described above is used. This is the same as the first modification in. Also in the example shown in FIGS. 7 and 8, the bottom surface of the step portion 1d is the irregular reflection region 1a. With the configuration including the step portion 1d, it is possible to obtain the same effect as that of the first modification example of the first embodiment described above. That is, it is possible to provide the lid body 3 that is advantageous for fine image capturing by cutting the infrared rays and that can easily recognize the irregular reflection area 1a.

(Modification)
FIG. 9 is a cross-sectional view showing a modified example of the lid body 3 shown in FIG. FIG. 10 is an enlarged sectional view showing a portion A of FIG. 9 and 10, the same parts as those in FIGS. 1 to 10 are designated by the same reference numerals.

In the lid 3 in this modified example, the substrate 1 has the inclined portion 1e on the outer peripheral portion of the first main surface and does not have the step portion 1d. Other than this, it is the same as the lid 3 of the example shown in FIGS. 7 and 8. The lid 3 of this modification is similar to the second modification of the first embodiment described above in that it has the inclined portion 1e as described above. Also in the example shown in FIGS. 9 and 10, the surface of the inclined portion 1e is the irregular reflection area 1a. With the configuration including the inclined portion 1e, it is possible to obtain the same effect as that of the second modified example of the first embodiment described above. That is, it is possible to provide the lid body 3 that is advantageous for fine image capturing by cutting the infrared rays and that can easily recognize the inclined surface 1b.

In each of the above examples, a curved surface R may connect between the first main surface of the substrate 1 and the inclined surface 1b, as in the examples shown in FIGS. 4 and 6, for example. In the example shown in FIG. 2, the bottom surface of the step portion 1d of the first main surface is connected to the inclined surface 1b by a curved surface R. Further, in the example shown in FIG. 4, the surface portion of the inclined portion 1e of the first main surface is connected to the inclined surface 1b by the curved surface R.

In this case, since the first main surface and the inclined surface 1b are connected to each other by a smooth surface, foreign matter such as a chip is effectively generated on the outer periphery of the first main surface located on the outermost side of the substrate 1. Suppressed.

The curved surface R may include a portion located above the first main surface (the bottom surface of the step portion 1d or the upper end of the surface of the inclined portion 1e). Also in this case, the curved surface R can reduce the possibility that foreign matter will be generated from the substrate 1 on the outer periphery of the first main surface.

(Method of manufacturing lid)
Next, a method of manufacturing the lid body according to the embodiment of the present invention will be described with reference to FIG. 11A to 11D are cross-sectional views showing a method of manufacturing the lid body according to the embodiment of the present invention in the order of steps. 11, the same parts as those in FIGS. 1 to 10 are denoted by the same reference numerals. The lid body manufactured in these steps is, for example, the lid body 3 of the above-described embodiment including the modified example.

First, as a first step, as shown in FIG. 11A, a translucent mother substrate 11 having a first main surface and a second main surface opposite to the first main surface is prepared. In the example of FIG. 11A, the dielectric film 2 is deposited on the first main surface of the mother substrate 11.

The mother substrate 11 can also be regarded as a substrate 1 to be the lid body 3 connected, is made of a material such as glass similar to the substrate 1, and can be prepared and prepared in the same manner as the substrate 1. .. The thickness of the mother substrate 11 is the same as that of the substrate 1. When the mother substrate 11 is made of glass such as borosilicate glass, it can be manufactured as follows.

First, as in the case of the substrate 1, the molten glass raw material is molded into a block shape in a container made of metal or the like, cooled, and then cut into a predetermined shape and size. After cutting, polishing processing can be performed to produce the mother substrate 11 including the regions to be the plurality of substrates 1 (lids 3).

The deposition of the dielectric film 2 is an auxiliary process. The dielectric film 2 to be deposited on the mother substrate 11 is also made of the same material as the dielectric film 2 in the lid 3 of the second embodiment described above, and is deposited on the upper surface of the mother substrate 11 by the same method. You can

As an auxiliary step after the first step, the mother substrate 11 may be fixed as shown in FIG. 11B to facilitate subsequent processing or alignment during processing. In the example shown in FIG. 11B, the mother substrate 11 is adhered and fixed to the adhesive sheet 4, and the periphery of the adhesive sheet 4 is fixed and held by the frame 5.

The pressure-sensitive adhesive sheet 4 is a film member having a shape and dimensions larger than that of the mother substrate 11 in a plan view, a rectangular shape, and a rectangular shape having an adhesive applied on one surface. Examples of the resin material forming the film of the pressure-sensitive adhesive sheet 4 include polyethylene resin, polypropylene resin, ethylene-propylene resin, polyester resin such as ethylene-vinyl acetate, polyvinyl chloride, polyurethane, polyamide, polystyrene, polycarbonate, polyimide and fluorine. Resin etc. can be mentioned.

Examples of the adhesive include rubber-based, acrylic-based, silicone-based, urethane-based, and polyester-based polyvinyl ether-based adhesives (pressure-sensitive adhesives, etc.). Further, the adhesive may be made of another material such as an ultraviolet curable adhesive.

Further, the frame body 5 is, for example, a processing jig such as a rectangular frame shape having the same shape and dimensions as the outer peripheral portion of the upper surface of the adhesive sheet 4, and the first groove 11a of the first groove 11a formed by a dicing process in a later step. This is for allowing the second groove 11b to be processed at an accurate position by laser processing on the bottom. The frame body 5 has, for example, a ring shape in which linear portions and grooves for positioning are formed on the outer circumference, and is formed of a pressed or etched metal material, an injection-molded resin material, or the like. The pressure-sensitive adhesive sheet 4 is adhered to the frame body 5 by the pressure-sensitive adhesive layer, and the mother substrate 11 is attached to the center of the pressure-sensitive adhesive layer, so that the dicing process and the laser processing process can be mass-produced and reproduced while preventing the generation of foreign matter. You will be able to proceed with good sexuality.

Next, as a second step, as shown in FIG. 11C, a first groove 11a is formed on the first main surface of the mother substrate 11 by mechanical grinding, and then, as a third step, the first groove 11a is formed. A laser beam (hereinafter referred to as a laser) is applied to the bottom of the first groove 11a so as to scan in the length direction of the first groove 11a to form a second groove 11b.

The bottom of the first groove 11a becomes a rough surface by grinding and becomes the irregular reflection area 1a. In addition, the inner surface of the second groove 11b becomes the inclined surface 1b after the division described later. The second groove 11b is provided on the outer periphery of a region of the mother substrate 11 corresponding to each substrate 1, and serves as a dividing groove when the mother substrate 11 is actually divided (broken) into individual substrates 1. .. The first groove 11a and the second groove 11b partition the regions of the mother substrate 11 that will be the individual substrates 1, and are formed in a grid pattern in plan view.

Mechanical grinding can be performed, for example, by using a grinding blade containing an abrasive to grind the upper surface of the mother substrate 11 to a predetermined depth. The blade is, for example, a rotary type, and a dicing blade or the like is used. The ground portion of the mother substrate 11 becomes a roughened surface according to the roughness of the abrasive contained in the blade. As a result, the surface of the ground portion of the mother substrate 11 can be processed to have the same roughness as the surface roughness (Ra) in the irregular reflection area 1a of the lid 3 described above, for example. That is, the irregular reflection region 1a can be formed on the mother substrate 11.

Examples of the laser include solid lasers such as YAG (wavelength=1064 nm) and ruby (wavelength=694 nm). Further, the laser may be a gas laser such as an argon ion laser (wavelength=1930 nm). For example, among the lasers appropriately selected from these, the fourth harmonic of the YAG laser has a wavelength of 266 nm, and when the mother substrate 11 is made of borosilicate glass, it has a wavelength range (less than 300 nm) that does not substantially pass through the borosilicate glass. (Or 3000 nm or more), the second groove 11b can be formed using this UV laser. When a UV laser of less than 300 nm is used, the irradiation range can be easily narrowed to a circular shape having a diameter of about 20 μm or less. Therefore, the bottom surface of the first groove 11a having a narrow width can be formed on the bottom surface of the first groove 11a. It is easy to perform laser processing by scanning in the length direction.

In the step of forming the first groove 11a as described above, the step portion 1d may be provided on the outer peripheral portion of the upper surface of the individual substrate 1 by appropriately adjusting the cross section in the direction orthogonal to the length direction. It is also possible to provide the inclined portion 1e. That is, if a blade having a quadrangular cross section at the ground portion is used, a square groove-shaped cut which becomes the step portion 1d can be formed in the mother substrate 11, and if a blade having a V-shaped cross section is used, the inclined portion 1e is formed. A V-shaped notch can be formed in the mother substrate 11.

The diffused reflection area 1a is covered with a resist other than the diffused reflection area 1a to expose the diffused reflection area 1a, and the surface is etched with hydrogen fluoride or the like to become the diffused reflection area 1a in the example shown in FIG. The converted surface may be formed on the first main surface of the mother substrate 11.

When the first groove 11a has a depth of about the depth of the stepped portion 1d or the inclined portion 1e as described above, the following effects can be obtained. In this case, by irradiating the first groove 11a with a laser, the generated debris adheres to the side surface of the first groove 11a. That is, the debris can be retained in the first groove 11a. Therefore, debris scattered to the main surface of the mother substrate 11 can be reduced, and as a result, adhesion of foreign matter such as debris to the first main surface of the substrate 1 (lid 3) can be effectively suppressed. .. Therefore, it is possible to further reduce foreign matter on the light-transmitting surface of the lid body 3 and improve the quality of the lid body 3 as a product.

During the laser processing, the irradiation conditions such as the laser intensity, the focal diameter, the distance between the processing surface and the focal point, and the moving speed are adjusted so that the inner surface of the second groove 11b is shaped into a curved surface. Then, the curved surface R between the first main surface of the substrate 1 and the inclined surface 1b in the lid 3 of the above embodiment can be formed. Further, the debris may be processed so that it adheres to the upper end of the second groove 11b in a curved shape. In this case, the curved surface R is formed by debris.

Next, as a fourth step, as shown in FIG. 11D, the mother substrate 11 is divided along the second grooves 11b. Thereby, a large number of individual lid bodies 3 can be manufactured at the same time. This division can be performed by, for example, mechanically applying pressure to vertically generate stress on the mother substrate 11. Due to this stress, the mother substrate 11 can be divided by breaking the mother substrate 11 in the thickness direction at the position of the second dividing groove 11b having a relatively small mechanical strength in the mother substrate 11.

(Package for storing image pickup element and image pickup device)
As described at the beginning of the present embodiment, the image pickup device housing package 10 and the image pickup apparatus 20 of the embodiment as shown in FIG. 12 are configured by including the lid body 3 of any one of the above examples. The imaging element housing package 10 of the embodiment has a base 7 having an upper surface including the opening S, a mounting portion 7a for the imaging element 6 in the opening S, and a lid 3 that closes the opening S. doing. As the lid body 3, the lid body 3 according to any one of the embodiments including the modified example can be used.

The base body 7 is a container for fixing the image pickup device 6 and hermetically sealing it. The base body 7 has, for example, a rectangular plate shape in a plan view, and has an insulating portion (no reference numeral) formed of an insulating material such as a ceramic material having an opening S and an opening S of the insulating portion extending from the inside to the outside. And a conductive portion (without reference numeral) such as a lead terminal arranged laterally through the insulating portion.

The base 7 has a mounting portion 7a inside the opening S (a portion of the insulating portion located below the opening S), and the image pickup device 6 is mounted on the mounting portion 7a. It is fixed by a joining means (not shown) such as.

The lid 3 is joined to the upper surface of the base body 7 to close the opening S, and the image pickup device 6 is hermetically sealed in a container (no reference numeral) formed of the base body 7 and the lid body 3. The sealed image pickup device 6 can convert light received from the outside through the lid 3 into an electric signal by photoelectric conversion, and can pick up an image of the outside.

The lid 3 is joined to the base body 7 by, for example, bonding with an adhesive 8. Examples of the adhesive 8 include a resin adhesive made of an ultraviolet curable epoxy resin or a thermosetting epoxy resin. For example, when a thermosetting epoxy resin is used as the adhesive 8, the adhesive 8 (uncured) is applied by at least the screen 7 or the dispensing method to the base 7 and the lid 3 so as to face each other. 90-250°C after applying on one side and overlaying each other
It is heated at a temperature of about 60 to 90 minutes under pressure to cure. Through these steps, the lid body 3 and the base body 7 are bonded to each other via the adhesive 8, and the imaging device 20 is manufactured.

In the image pickup device 20, the image pickup element 6 sealed in a translucent container constituted by a base 7 and a lid has a conductive portion such as a lead terminal included in the base 7 and a conductive wire such as a bonding wire 9. It is electrically connected by a connecting material. The image sensor 6 can be electrically connected to an external electric circuit via the conductive portion.

Since the lid body 3 is the lid body 3 of the above-described embodiment, according to the image pickup device housing package 10 of the embodiment, the positioning is easy when the lid body 3 is joined to the base body 7, and the positional accuracy is high. Is also easy to improve.

Further, the package 10 for storing the image pickup device having the above-described configuration and the image pickup device 6 mounted on the mounting portion 7a are provided, and the lid 3 is joined to the upper surface of the base 7 to close the opening S. According to the image pickup apparatus 20 of such an embodiment, since the image pickup device housing package 10 having the above-described configuration is included, it is easy to perform the alignment when the lid 3 is joined to the base body 7, and the positional accuracy is improved. It's easy. That is, it is possible to provide the imaging device 20 that is effective in improving the accuracy of imaging and improving productivity.

1: substrate 1a: irregular reflection area 1b: inclined surface 1c: side surface 1d: step portion 1e: inclined portion
11: Mother board
11a: first groove
11b: Second groove 2: Dielectric film 2a: High refractive index dielectric layer 2b: Low refractive index dielectric layer 3: Lid body 4: Adhesive sheet 5: Frame body 6: Imaging device 7: Substrate 7a: Mounting part 8: Adhesive 9: Bonding wire
10: Package for storing the image sensor
20: Imaging device R: Curved surface S: Opening

Claims (5)

A translucent substrate having a first main surface which is an incident surface of external light and a second main surface which is an emission surface of the light opposite to the first main surface,
The substrate has an inclined surface inclined outward from the outer periphery of the first main surface toward the second main surface and a side surface between the inclined surface and the second main surface ,
The outer peripheral portion of the first main surface includes a frame-shaped irregular reflection region in contact with the inclined surface ,
The lid body, wherein the first main surface is a flat surface that is continuous from a region inside the irregular reflection region to the irregular reflection region on an outer peripheral portion. The lid body according to claim 1, further comprising a dielectric film disposed on the first main surface of the substrate. Closure of claim 1 or claim 2, characterized in that between the first main surface and the inclined surface of the substrate are connected by a curved surface. A base having an upper surface including an opening and having a mounting portion for an image sensor in the opening;
An image pickup device housing package, comprising: the lid according to any one of claims 1 to 3 , which closes the opening. An image pickup device housing package according to claim 4 ,
The image pickup device mounted on the mounting portion,
An imaging apparatus, wherein the lid is joined to the upper surface of the base to close the opening.

Images