JP6714730B2 - Working machine and soldering method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a working machine or the like capable of soldering a lead inserted in a through hole of a circuit board.

Among working machines, there is a working machine for soldering the leads inserted in the through holes of the circuit board. The following patent documents describe an example of such a working machine.

International Publication No. 2016/56045

In the working machine described in the above-mentioned patent document, the lead parts are mounted on the board by the working machine, and the leads of the mounted lead parts are soldered. However, it is desired to be soldered to the leads of lead components mounted in various modes. The present invention has been made in view of such an actual situation, and an object thereof is to perform soldering to leads of lead components mounted in various modes.

In order to solve the above problems, the present specification describes a pressing device that presses a lead component in a state where a lead is inserted into a through hole formed in a substrate toward the substrate, and the insertion device inserted in the through hole. A soldering device for soldering the leads, and a storage device for storing component information relating to an inserted component which is the lead component in which the lead is inserted into the through hole in an upstream working machine disposed upstream. , on the basis of the component information, the Ki挿 Nyusumi parts before being inserted in the upstream working machine in a state of pressed by the pressing device, to perform the soldering by the soldering device, the pressing device Disclosed is a working machine including a control device that controls the operation of the soldering device.

Further, in order to solve the above-mentioned problems, the present specification describes a pressing device that presses a lead component in a state where a lead is inserted into a through hole formed in a board toward the board, and the pressing device is inserted into the through hole. In a working machine equipped with a soldering device for soldering the lead, a method of soldering the lead, wherein the upstream working machine is arranged upstream of the working machine . An inserting step of inserting the lead into the through hole of the board, a carrying-in step of carrying in the board in which the lead is inserted in the inserting step into the working machine, and the inserting step by the upstream side working machine. Based on the component information, the lead is inserted into the through-hole of the board by the upstream working machine, based on the component information, with respect to the board carried in in the carrying-in step And a soldering step of performing soldering by the soldering device in a state where the lead component is pressed by the pressing device.

According to the present disclosure, it is possible to appropriately perform soldering on a lead component mounted on an upstream working machine that is disposed on the upstream side of a working machine that performs soldering while preventing component floating. It will be possible.

It is a top view which shows a board work system. It is a perspective view which shows a soldering apparatus. It is a block diagram which shows a control apparatus. It is the schematic which shows the lead component mounted in the 1st working machine. It is the schematic which shows the lead components soldered in a 2nd working machine.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

(A) Configuration of Working System for Board FIG. 1 shows a working system 10 for a board according to an embodiment of the present invention. The board working system 10 is a system for mounting electronic components on a circuit board. The board-to-board working system 10 is composed of a first working machine 12 and a second working machine 14, and the second working machine 14 is disposed downstream of the first working machine 12. In the following description, the arrangement direction of the first working machine 12 and the second working machine 14 is referred to as the X direction, the horizontal direction perpendicular to the direction is referred to as the Y direction, and the horizontal direction perpendicular to the X direction and the Y direction. The direction is called the Z direction.

The second working machine 14 includes a carrying device 20, a mounting head moving device (hereinafter, may be abbreviated as “moving device”) 22, a mounting head 24, a supply device 26, a parts camera 28, and a mark camera 30. , A nozzle station 32, and a soldering device 34.

The transfer device 20 includes a pair of conveyor belts 40 extending in the X direction and an electromagnetic motor (see FIG. 3) 42 that rotates the conveyor belts 40. The circuit board 44 is supported by the pair of conveyor belts 40, and is conveyed in the X direction by driving the electromagnetic motor 42. Further, the transfer device 20 has a substrate holding device (see FIG. 3) 46. The board holding device 46 fixedly holds the circuit board 44 supported by the conveyor belt 40 at a predetermined position (the position where the circuit board 44 is shown in FIG. 1).

The moving device 22 includes an X-direction slide mechanism 50 and a Y-direction slide mechanism 52. The X direction slide mechanism 50 has an X slider 56 provided on the base 54 so as to be movable in the X direction. The X slider 56 is moved to an arbitrary position in the X direction by driving an electromagnetic motor (see FIG. 3) 58. Further, the Y-direction slide mechanism 52 has a Y slider 60 provided on the side surface of the X slider 56 so as to be movable in the Y direction. The Y slider 60 is moved to an arbitrary position in the Y direction by driving an electromagnetic motor (see FIG. 3) 62. The mounting head 24 is attached to the Y slider 60. With such a structure, the mounting head 24 is moved to an arbitrary position on the base 54 by the moving device 22.

The mounting head 24 mounts electronic components on the circuit board. The mounting head 24 has a suction nozzle 70 provided on the lower end surface. The suction nozzle 70 communicates with a positive/negative pressure supply device (see FIG. 3) 76 via negative pressure air and positive pressure air passages. The suction nozzle 70 sucks and holds an electronic component by negative pressure, and separates the held electronic component by positive pressure. Further, the mounting head 24 has a nozzle lifting device (see FIG. 3) 78 for lifting the suction nozzle 70. By the nozzle lifting device 78, the mounting head 24 changes the vertical position of the held electronic component. The suction nozzle 70 is attachable to and detachable from the mounting head 24.

The supply device 26 is a feeder-type supply device and has a plurality of tape feeders 82. The tape feeder 82 accommodates the taped parts in a wound state. The tape component is a taped electronic component. Then, the tape feeder 82 feeds the tape-formed component by the feeding device (see FIG. 3) 86. As a result, the feeder-type supply device 26 supplies the electronic component at the supply position by feeding the tape-formed component.

The parts camera 28 is arranged between the transport device 20 and the supply device 26 so as to face upward. Accordingly, by moving the mounting head 24 above the parts camera 28, the parts camera 28 images the electronic component held by the suction nozzle 70. The mark camera 30 is fixed to the Y slider 60 of the moving device 22 in a state of facing downward, and moves to an arbitrary position by the operation of the moving device 22. As a result, the mark camera 30 images an arbitrary position on the base 54.

The nozzle station 32 is arranged next to the parts camera 28 between the transport device 20 and the supply device 26. The nozzle station 32 has a nozzle tray 90, and the nozzle tray 90 is formed with a plurality of housing portions 92 for housing the suction nozzles 70. In the nozzle station 32, the suction nozzle 70 mounted on the mounting head 24 and the suction nozzle 70 housed in the housing portion 92 of the nozzle tray 90 are exchanged. That is, any suction nozzle 70 of the plurality of suction nozzles 70 can be mounted on the mounting head 24.

The soldering device 34 is disposed below the transport device 20, and has a jet device 100 and a jet device moving device 102, as shown in FIG. The jet device 100 includes a solder bath 106, a jet nozzle 108, and a nozzle cover 110. The solder bath 106 has a generally rectangular parallelepiped shape, and molten solder is stored therein. The jet nozzle 108 is erected on the upper surface of the solder bath 106. Then, the operation of the pump (see FIG. 3) 111 draws the molten solder from the solder bath 106, and the molten solder jets upward from the upper end portion of the jet nozzle 108. The nozzle cover 110 is generally cylindrical and is arranged on the upper surface of the solder bath 106 so as to surround the jet nozzle 108. Then, the molten solder jetted from the upper end portion of the jet nozzle 108 flows between the outer peripheral surface of the jet nozzle 108 and the inner peripheral surface of the nozzle cover 110 and flows back into the solder bath 106.

The jet device moving device 102 includes a slider 112, an X-direction moving device 114, a Y-direction moving device 116, and a Z-direction moving device 118. The slider 112 has a generally plate shape, and the jet device 100 is arranged on the upper surface of the slider 112. Further, the X-direction moving device 114 moves the slider 112 in the carrying direction of the circuit board 44 by the carrying device 20, that is, the X direction, and the Y-direction moving device 116 moves the slider 112 in the Y direction. Further, the Z-direction moving device 118 moves the slider 112 in the Z direction, that is, in the vertical direction. Accordingly, the jet device 100 moves to an arbitrary position below the transport device 20 by the operation of the jet device moving device 102.

The first working machine 12 has the same structure as the second working machine 14 except that the soldering device 34 is not provided. That is, the first working machine 12 has the carrying device 120, the moving device 122, the mounting head 124, the supplying device 126, the parts camera 128, the mark camera 130, and the nozzle station 132, and carries the carrying device. The device 120, the moving device 122, the mounting head 124, the supplying device 126, the parts camera 128, the mark camera 130, and the nozzle station 132 include the transport device 20, the moving device 22, the mounting head 24, the supplying device 26 of the second working machine 14, It has the same structure as the parts camera 28, the mark camera 30, and the nozzle station 32. Therefore, the description of the transport device 120, the moving device 122, the mounting head 124, the supply device 126, the parts camera 128, the mark camera 130, and the nozzle station 132 is omitted.

Further, the board-to-board working system 10 includes a control device 140, as shown in FIG. The control device 140 includes a controller 142, a plurality of drive circuits 144, and an image processing device 146. The plurality of drive circuits 144 are connected to the electromagnetic motors 42, 58, 62, the substrate holding device 46, the positive/negative pressure supply device 76, the nozzle elevating device 78, the feeding device 86, the jet device moving device 102, and the pump 111 of each working machine. Has been done. The controller 142 includes a CPU, a ROM, a RAM, etc., is mainly a computer, and is connected to a plurality of drive circuits 144. As a result, the operation of the transport device 20, the moving device 22 and the like of each work machine is controlled by the controller 142. The controller 142 is also connected to the image processing device 146. The image processing device 146 is a device for processing the imaging data captured by the parts camera 128 and the mark camera 130 of each work machine. As a result, the controller 142 acquires various information from the imaged data. The controller 142 has a storage area 148, and controls the operation of various devices based on the information stored in the storage area 148.

(B) Operation of Board-to-Board Working System In the board-to-board working system 10, the electronic component mounting work is performed on the circuit board 44 with the above-described configuration. In the work system 10 for a board, various electronic components can be mounted on the circuit board 44, but a component having a lead (hereinafter sometimes abbreviated as “lead component”) is mounted on the circuit board 44. The case of mounting will be described below.

Specifically, the circuit board 44 is carried into the first working machine 12 and is carried to the work position by the carrying device 120 of the first working machine 12. Then, at that position, it is held by the substrate holding device 46 of the transfer device 120. Next, the mark camera 130 moves above the circuit board 44 and images the circuit board 44. As a result, information about the holding position of the circuit board 44 and the like can be obtained. Further, the supply device 126 supplies the lead component at a predetermined supply position. Then, the mounting head 124 moves above the component supply position, and the suction nozzle (see FIG. 4) 150 of the mounting head 124 holds the component. As shown in FIG. 4, the lead component 160 includes a component body 162 and two leads 164 extending from the bottom surface of the component body 162. Then, the lead component 160 is suction-held by the suction nozzle 150 on the surface opposite to the bottom surface of the component body 162.

Subsequently, the mounting head 124 holding the lead component 160 moves above the parts camera 128, and the parts camera 128 takes an image of the lead component 160 held by the suction nozzle 150. As a result, the position coordinates of the tip of the lead 164 of the lead component 160 in the XY directions are calculated. Then, the operation of the moving device 122 is controlled so that the position coordinate in the XY direction of the through hole (see FIG. 4) 168 formed in the circuit board 44 and the position coordinate in the XY direction of the tip of the lead 164. It As a result, the suction nozzle 150 holding the lead component 160 moves above the through hole 168 of the circuit board 44, and the through hole 168 and the tip of the lead 164 are aligned in the vertical direction. The position coordinates of the through hole 168 in the XY directions are stored in the storage area 148 of the controller 142, and the stored position coordinates of the through hole 168 are corrected based on the information about the holding position of the circuit board 44 and the like. To be done. Then, the operation of the moving device 122 is controlled based on the corrected position coordinates of the through hole 168.

Then, the operation of the nozzle elevating device 78 is controlled and the suction nozzle 150 is lowered, so that the lead 164 of the lead component 160 is inserted into the through hole 168 as shown in FIG. The suction nozzle 150 descends and stops until the top surface of the circuit board 44 contacts the bottom surface of the component body 162 of the lead component 160. As a result, the lead component 160 is mounted on the circuit board 44 with the lead 164 inserted in the through hole 168. Then, when the mounting work of the lead component 160 is completed, the transport device 120 is operated, and the circuit board 44 mounted with the lead component 160 is unloaded from the first working machine 12.

At this time, the circuit board 44 carried out from the first working machine 12 is carried into the second working machine 14 and is carried to the working position by the carrying device 20 of the second working machine 14. Then, at that position, a lead component (hereinafter, referred to as “inserted component”) is held by the substrate holding device 46 of the transfer device 20 and the lead 164 is inserted into the through hole 168 of the circuit board 44 by the first working machine 12. 160) is soldered.

Specifically, the storage area 148 of the controller 142 stores information regarding the soldering work for the inserted component 160 in the second working machine 14 (hereinafter, sometimes referred to as “soldering work information”). .. The soldering work information includes information on the inserted component 160 (hereinafter sometimes referred to as “component information”) and information on the suction nozzle corresponding to the inserted component 160 (hereinafter, “component corresponding nozzle information”). (May be described) and information regarding soldering conditions at the time of soldering the inserted component 160 (hereinafter, may be described as “condition information”).

The component information includes the mounting position of the inserted component 160 mounted by the first working machine 12, the size and shape of the inserted component 160, and the like. The component-corresponding nozzle information is information for identifying the suction nozzle 70 used during the soldering work, and is set according to the size and shape of the inserted component 160. Specifically, for example, the suction nozzle 70 having a large nozzle diameter is set for the inserted component 160 having a large size, and the suction nozzle 70 having a small nozzle diameter is set for the inserted component 160 having a small size. It is set. The condition information includes the soldering time at the time of soldering, the approaching/separating speed of the jet device 100 at the time of soldering, the height of the jet nozzle 108 of 108 at the time of soldering, and the like. The soldering work information can be changed. By changing the soldering work information, the suction nozzle 70 used during the soldering work can be changed, and the soldering conditions can be changed.

In the second working machine 14 into which the circuit board 44 on which the inserted component 160 is mounted is carried in, before the soldering work on the inserted component 160 is performed, the suction nozzle 70 corresponding to the component corresponding nozzle information is the nozzle. It is mounted on the mounting head 24 at the station 32. Then, when the circuit board 44 is held at the working position, the mark camera 30 moves above the circuit board 44 and images the circuit board 44. As a result, information about the holding position of the circuit board 44 and the like can be obtained. Then, the mounting position of the inserted component 160 included in the component information is corrected based on the information regarding the holding position of the circuit board 44, and the suction nozzle 70 is provided above the corrected mounting position of the inserted component 160. Be moved.

When the suction nozzle 70 moves above the inserted component 160, it is lowered by the nozzle lifting device 78. Thereby, as shown in FIG. 5, the tip of the suction nozzle 70 contacts the upper surface of the component body 162 of the inserted component 160. At this time, the operation of the nozzle elevating device 78 is controlled so that the suction nozzle 70 presses the component main body 162 toward the circuit board 44 with a predetermined force.

Since the suction nozzle 70 corresponds to the nozzle information corresponding to the component, if the inserted component 160 having a large size is pressed by the suction nozzle 70 having a large nozzle diameter, the inserted component having a small size is inserted. If it is 160, it is pressed down by the suction nozzle 70 having a small nozzle diameter. That is, for each inserted component 160, a predetermined suction nozzle 70 of the plurality of suction nozzles 70 used in the second working machine 14 is associated according to the size and shape of the inserted component 160, and the association is performed. The inserted nozzle 160 is pressed down by the suction nozzle 70. As a result, the inserted component 160 can be suitably pressed down.

Further, below the circuit board 44, the operation of the jet device moving device 102 is controlled so that the jet device 100 moves below the lead 164 inserted into the through hole 168. Even when the jet device 100 is moved, the mounting position of the inserted component 160 included in the component information is corrected based on the information regarding the holding position of the circuit board 44, as in the case of moving the mounting head 24. The operation of the jet device moving device 102 is controlled based on the corrected mounting position of the inserted component 160.

Next, when the jet device 100 moves below the lead 164 of the inserted component 160, the lead 164 of the inserted component 160 held by the suction nozzle 70 is soldered. Specifically, in the soldering device 34, the molten solder is jetted from the jet nozzle 108, and the jet device 100 is raised at the approach speed included in the condition information. As a result, the jet nozzle 108 approaches the lead 164, and the molten solder is jetted toward the lead 164. At this time, the jet device 100 is raised to a distance according to the height of the jet nozzle 108 included in the condition information. Then, the molten solder is jetted toward the lead 164 for the soldering time included in the condition information. That is, a state in which the molten solder is jetted toward the leads 164, that is, a state in which the jet device 100 is raised to a predetermined height is maintained for the soldering time included in the condition information. Subsequently, the jet device 100 is lowered at the separation speed included in the condition information. As a result, the jet nozzle 108 is separated from the lead 164, and the soldering work of the inserted component 160 to the circuit board 44 is completed. Then, when the soldering work is completed, the suction nozzle 70 is raised and the pressing of the inserted component 160 is released.

As described above, in the soldering work in the second working machine 14, the molten solder is jetted toward the leads 164, so that component floating easily occurs, but the inserted nozzle 160 is pressed by the suction nozzle 70. The parts are prevented from floating. As a result, the inserted component 160 mounted by the first working machine 12 can be appropriately soldered to the circuit board 44 by the second working machine 14.

Further, the second working machine 14 may perform not only the soldering work on the inserted component 160 mounted on the first working machine 12 but also the soldering work on the lead component 160 mounted on the second working machine 14. It is possible. That is, not only the soldering work for the inserted component 160 mounted outside the machine but also the soldering work for the lead component 160 mounted inside the machine can be performed.

In the soldering work for the lead component 160 mounted in the machine, the same mounting work as the mounting work in the first working machine 12 is performed in the second working machine 14, and the soldering device 34 performs the soldering. , Will be briefly described below. In the second work machine 14, the supply device 26 supplies the lead component 160 at a predetermined supply position. Then, the lead component 160 is held by the suction nozzle 70 of the mounting head 24, and the lead component 160 is imaged by the parts camera 28. As a result, the position coordinates of the tip of the lead 164 of the lead component 160 in the XY directions are calculated. Then, the operation of the moving device 22 is controlled such that the position coordinates in the XY direction of the through hole 168 formed in the circuit board 44 and the position coordinates in the XY direction of the tip of the lead 164.

Subsequently, the operation of the nozzle elevating device 78 is controlled and the suction nozzle 70 is lowered, so that the lead 164 of the lead component 160 is inserted into the through hole 168 as shown in FIG. The suction nozzle 70 is lowered until the upper surface of the circuit board 44 contacts the bottom surface of the component body 162 of the lead component 160, and the lead component 160 is pressed by the suction nozzle 70 with a predetermined force. At this time, below the circuit board 44, the jet device 100 is moved below the leads 164 inserted into the through holes 168. Then, the molten solder is jetted from the tip of the jet nozzle 108 toward the lead 164. Note that the lead component 160 is held by the suction nozzle 70 even when the molten solder is jetted toward the lead 164. That is, the soldering operation is performed on the lead 164 of the lead component 160 which is held by the suction nozzle 70. As a result, the lead component 160 mounted inside the machine is also subjected to the soldering work in a state in which the component floating is prevented, like the inserted component 160 mounted outside the machine.

Thus, in the second working machine 14, the soldering work for the inserted component 160 mounted outside the machine and the soldering work for the lead component 160 mounted inside the machine are performed. Also, the inserted component 160 or the lead component 160 is pressed by the suction nozzle 70. As a result, it is possible to prevent component floating during solder jetting with respect to all components to be soldered in the second working machine 14, and to ensure proper soldering work.

Further, the controller 142 has an insertion section 180, a carry-in section 182, and a soldering section 184, as shown in FIG. The insertion section 180 is a functional section for inserting the lead 164 of the lead component 160 into the through hole 168 of the circuit board 44 in the first working machine 12. The carry-in section 182 is a functional section for carrying in the circuit board 44, in which the lead 164 is inserted into the through hole 168 in the first working machine 12, into the second working machine 14. The soldering part 184 is a functional part for soldering the inserted component 160 of the circuit board 44 carried in by the carry-in part 182.

The second working machine 14 is an example of a working machine. The mounting head 24 is an example of a pressing device. The soldering device 34 is an example of a soldering device. The suction nozzle 70 is an example of a pressing tool. The control device 140 is an example of a control device. The storage area 148 is an example of a storage device. Further, the process executed by the inserting unit 180 is an example of the inserting process. The process executed by the carry-in unit 182 is an example of a carry-in process. The process performed by the soldering unit 184 is an example of the soldering process. The method executed by the inserting section 180, the carry-in section 182, and the soldering section 184 is an example of the soldering method.

It should be noted that the present invention is not limited to the above embodiments, and can be carried out in various modes with various modifications and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the soldering work is executed in the second work machine 14 with respect to the inserted component 160 mounted in the first work machine 12, but the worker manually After mounting the lead component 160 on the circuit board 44, the circuit board may be carried into the second working machine 14 and the soldering operation may be performed on the lead component 160 mounted by the operator.

Further, in the above embodiment, the inserted component 160 is pressed by the suction nozzle 70, but the inserted component 160 may be pressed by various holders such as a chuck.

Further, in the above embodiment, the second working machine 14 performs the soldering work on the inserted component 160 mounted outside the machine and the soldering work on the lead component 160 mounted inside the machine. Only the soldering operation for the externally mounted inserted component 160 may be performed. That is, the second working machine 14 may be specialized as a working machine that executes the soldering work without executing the mounting work. In such a case, as a pressing tool for pressing the inserted component 160, it is possible to employ a tool specialized for the function of pressing the inserted component 160 without having a function of holding the suction nozzle 70 and other components. is there.

14: Second working machine (working machine) 24: Mounting head (pressing device) 34: Soldering device 70: Suction nozzle (pressing tool) 140: Control device 148: Storage area (storage device)

Claims (3)

A pressing device that presses a lead component in a state where a lead is inserted into a through hole formed in the board toward the board;
A soldering device for soldering the leads inserted into the through holes,
A storage device that stores component information relating to an inserted component that is the lead component in which the lead is inserted into the through-hole in an upstream working machine disposed on the upstream side,
Based on the component information, the pre Ki挿 Nyusumi components that are inserted in the upstream working machine in a state of pressed by the pressing device, to perform the soldering by the soldering apparatus, and the pressing device A work machine comprising: a control device that controls the operation of the soldering device. The pressing device is
Having a plurality of pressing tools for pressing the lead parts,
The control device is
A predetermined pressing tool of the plurality of pressing tools is associated with each of the inserted parts, and the inserted part is pressed by the predetermined pressing tool associated with the inserted part. The working machine according to claim 1, which controls the operation of the pressing device. A pressing device that presses a lead component in a state where a lead is inserted into a through hole formed in a substrate toward the substrate, and a soldering device that solders the lead inserted in the through hole In a working machine, a soldering method for performing a soldering operation on the lead,
In the upstream side working machine disposed on the upstream side of the working machine , an inserting step of inserting the lead into the through hole of the substrate,
A carrying-in step of carrying in the substrate, in which the leads are inserted in the inserting step, into the working machine;
A storage step of storing component information regarding the lead component inserted by the upstream working machine;
Based on the component information, the lead component, in which the lead was inserted by the upstream working machine into the through hole of the substrate , was pressed against the substrate carried in the carrying-in step by the pressing device. And a soldering step of performing soldering with the soldering device in the state.

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