JP6717079B2 - Light emitting device, manufacturing method thereof, and manufacturing method of package - Google Patents

Description

The present disclosure relates to a light emitting device, a method for manufacturing the same, and a method for manufacturing a package.

In recent years, high-luminance, high-output light emitting elements and small-sized light emitting devices have been developed and used in various fields. For example, a light source used for a backlight of a liquid crystal display device is required to be thin in order to reduce the size and weight of a device using the light source. Therefore, as a light emitting device used as a light source, for example, various light emitting devices of a type called a side view type have been developed. A side-view type light emitting device is generally configured such that a light emitting element is mounted on a package in which an opening for light emission is formed on the front surface of the package, and two lead electrodes are drawn out from the lower surface of the package as external terminals. ing. The two extracted lead electrodes are bent toward the front side of the package or the back side which is the opposite side, and the lower surface side of the bent lead electrodes is used as the mounting surface (see, for example, Patent Document 1). ).

JP, 2008-258233, A

When manufacturing the semiconductor light emitting device as described above, it is necessary to bend the two lead electrodes pulled out from the lower surface of the package at a predetermined angle, but the bending position may be displaced or the bending angle may vary. However, the mounting accuracy of the semiconductor light emitting device may be reduced.

Therefore, it is an object of one embodiment of the present invention to provide a light emitting device, a method for manufacturing a light emitting device, or a method for manufacturing a package, which is excellent in mounting accuracy.

A method for manufacturing a light-emitting device according to an embodiment of the present invention includes a first lead and a second lead having a first surface and a second surface opposite to the first surface, an opening portion on a front surface, and A package having a resin molded body in which a part of one lead and a second lead is embedded, and a light emitting element mounted in the opening, wherein the first lead and the second lead are the resin, respectively. An outer lead portion extending from the lower surface of the molded body, and an inner lead portion embedded in the resin molded body and having a part of the first surface exposed in the opening, and the lower surface side of the resin molded body A method of manufacturing a light emitting device as a mounting surface, comprising: preparing the package; and the outer lead portion such that second surfaces of the two outer lead portions face a lower surface of the resin molded body. And a step of bending the outer lead portion, wherein each of the outer lead portions has a recess formed in the second surface before the step of bending the outer lead portion, and in the step of bending the outer lead portion, Each of the parts is bent at the recess, and the first surface serves as a mounting surface.

Further, a method of manufacturing a package according to an embodiment of the present invention includes a first lead and a second lead having a first surface and a second surface opposite to the first surface; A resin molded body in which a part of the first lead and the second lead is embedded, and the first lead and the second lead each include an outer lead portion extending from a lower surface of the resin molded body, A method of manufacturing a package having an inner lead portion embedded in the resin molded body, a part of the first surface of which is exposed in the opening, wherein the lower surface side of the resin molded body is a mounting surface. A step of preparing the first lead and the second lead, a step of arranging the first lead and the second lead between an upper mold and a lower mold, and sandwiching between the upper mold and the lower mold. A step of injecting a resin material into the formed space and curing or solidifying the resin material to form a resin molded body, and a second surface of each of the outer lead portions faces a lower surface of the resin molded body. And a step of bending the outer lead portion, wherein each of the outer lead portions has a recess formed in the second surface before the step of bending the outer lead portion, and the outer lead portion is bent. In the step, each of the outer lead portions is bent at the recess, and the first surface serves as a mounting surface.

Further, a light emitting device according to an embodiment of the present invention has a first lead and a second lead having a first surface and a second surface opposite to the first surface, an opening portion on the front surface, and A package having a resin molded body in which a part of the lead and the second lead is embedded, and a light emitting element mounted in the opening, wherein the first lead and the second lead are respectively molded of the resin. An outer lead portion that extends from the lower surface of the body and is bent in a direction that extends along the lower surface of the resin molded body, and an inner lead that is embedded in the resin molded body and has a portion of the first surface exposed in the opening. A light emitting device having a mounting surface on a lower surface side of the resin molded body, wherein the lower surface of the resin molded body has a lead arrangement portion in which the outer lead portion is arranged, Also has a convex portion located below, and each of the outer lead portions has a concave portion formed on the second surface side in the bent portion, and the concave portion is in the convex portion of the resin molded body. It is formed in a region between the extension line of the lower surface and the lower surface of the lead placement portion.

The method for manufacturing a light emitting device according to the embodiment of the present invention can provide a light emitting device having excellent mounting accuracy. In addition, the package manufacturing method according to the embodiment of the present invention can provide a package having excellent mounting accuracy. Further, the light emitting device according to the embodiment of the present invention can be mounted on a mounting board or the like with high accuracy.

It is a schematic front view of the light-emitting device which concerns on one embodiment of this invention. It is a schematic bottom view of the light-emitting device which concerns on one embodiment of this invention. It is a schematic sectional drawing in the II-II line of FIG. 1A. It is a schematic sectional drawing in the III-III line of FIG. 1A. It is a schematic front view of the package which concerns on one embodiment of this invention. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing a manufacturing process of the light emitting device according to the embodiment of the present invention. It is a schematic sectional drawing which shows an example of the recessed part before and after bending of an outer lead part. It is a schematic front view of the package which concerns on one embodiment of this invention. It is a schematic front view of the package which concerns on one embodiment of this invention.

(Embodiment 1)
Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the embodiments described below are for embodying the technical idea of the present invention, and the present invention is not limited to the following unless otherwise specified. In addition, the sizes and positional relationships of members shown in the drawings may be exaggerated in order to clarify the explanation.

FIG. 1A is a schematic front view (schematic front view) of light emitting device 100 according to the first embodiment. FIG. 1B is a schematic bottom view of light emitting device 100 according to the first embodiment. FIG. 2 is a schematic sectional view taken along line II-II of FIG. 1A. FIG. 3 is a schematic cross-sectional view taken along the line III-III in FIG. 1A. FIG. 4 is a schematic front view of the package according to the first embodiment.

The light emitting device 100 according to the present embodiment includes a package 10 having a pair of positive and negative first leads 21 and second leads 22, and a resin molded body 30. In the light emitting device 100 of the present embodiment, the surface provided with the light emitting surface is referred to as the front surface 30a, and the surface opposite thereto is referred to as the back surface 30b. The surface on the side where the first lead and the second lead are pulled out from the resin molded body is called the lower surface 30c, and the surface on the opposite side is called the upper surface 30d. The resin molded body 30 has an opening 32 in the front surface 30 a, and the light emitting element 40 is placed in the opening 32. The lower surface 30c side of the resin molded body 30 is the mounting surface of the light emitting device 100.

Each of the first lead 21 and the second lead 22 has a first surface 20a and a second surface 20b that is the opposite surface. The first surface 20a is a surface that is electrically connected to the light emitting element 40. The first surface 20a of the first lead 21 and the first surface 20a of the second lead 22 are arranged on the same surface side.

The first lead 21 and the second lead 22 have inner lead portions 21a and 22a and outer lead portions 21b and 22b, respectively. The inner lead portions 21a and 22a are embedded in the resin molded body 30, and a part of the first surface 20a of the two inner lead portions 21a and 22a is exposed at the bottom surface inside the opening 32 of the resin molded body 30. doing. The light emitting element 40 is mounted on the first surface 20a of the inner lead portion 21a of the first lead 21 via an adhesive member. The pair of positive and negative electrodes of the light emitting element 40 are electrically connected to the first surfaces 20a of the two inner lead portions 21a and 22a via wires.

The outer lead portions 21b and 22b are arranged continuously with the inner lead portions 21a and 22a corresponding to the first lead 21 and the second lead 22, respectively, and extend from the lower surface 30c of the resin molded body 30 to the outside. It is bent so as to extend toward the back surface 30b along the lower surface 30c of the resin molded body 30, and is arranged on the lower surface 30c of the resin molded body 30. Further, a part thereof is bent and provided so as to extend upward along the left and right side surfaces of the resin molded body 30.

In the outer lead portions 21b and 22b, a recess 50 is formed on the second surface 20b side at a bent portion adjacent to the lower surface 30c of the resin molded body 30. In the light emitting device 100 of the present embodiment, the recess 50 is formed in a groove shape along the lower surface 30c of the resin molded body 30. It is preferable that the recess 50 is entirely formed from the end of the outer lead portions 21b and 22b in the direction parallel to the lower surface 30c of the resin molded body 30.

The lower surface 30c of the resin molded body 30 has a lead placement portion 34a on which the outer lead portions 21b and 22b described above are placed, and a convex portion 34b located below the lead placement portion 34a. As shown in FIG. 4 and the like, the recessed portion 50 formed in the outer lead portions 21b and 22b is provided in a region between the extension line of the lower surface 30c of the protruding portion 34b of the resin molded body 30 and the lower surface 30c of the lead placement portion 34a. It is formed. As a result, the lead bending position can be provided in the vicinity of the lower surface 30c of the resin molded body 30, and the light emitting device with excellent mounting accuracy can be obtained. Moreover, the thickness of the entire package can be reduced.

The light emitting device 100 is mounted by causing the lower surface 30c to face the mounting substrate and joining the outer lead portions 21b and 22b to the wiring pattern of the mounting substrate using a conductive adhesive member such as solder.

(Method of manufacturing light emitting device)
The method for manufacturing the light emitting device 100 described above will be described in detail based on the schematic cross-sectional views shown in FIGS. 5(a) to 5(c) and FIGS. 6(a) to 6(b).

(1) Step of Preparing Package 10 First, the first lead 21 and the second lead 22 are prepared. Next, the inner lead portions 21 a, 22 a and the outer lead portions 21 b, 22 b corresponding to the openings of the package 10 are arranged between the upper die 71 and the lower die 72. The top surface 73 of the upper die 71 corresponding to the opening of the package contacts the first surface 20a of the inner lead portions 21a and 22a.

A resin material 78 is injected from a gate 74 provided in the lower mold 72 into a space 75 sandwiched between the upper mold 71 and the lower mold 72. Thereby, a part of the inner lead part 21a of the first lead 21 and a part of the inner lead part 22a of the second lead 22 can be exposed on the bottom surface of the opening of the obtained package 10.

The resin material 78 filled in the mold is cured or solidified to form the resin molded body 30. Then, the upper mold 71 and the lower mold 72 are removed.

The light emitting device 40 is mounted on the obtained package 10. Specifically, the light emitting element 40 is mounted on the first surface 20a of the first lead 21. As a mounting method, a method of bonding the light emitting element 40 to the first surface with an adhesive member is used. After that, the light emitting element 40 is electrically connected to the first lead 21 and the second lead 22 via the wire. Then, the translucent resin 60 is filled in the opening 32 of the resin molded body 30 to seal the light emitting element 40.

In the package 10, the outer lead portion 21b of the first lead 21 and the outer lead portion 22b of the second lead 22 extend vertically from the lower surface 30c of the resin molded body 30. On the second surface 20b of the two outer lead portions 21b and 22b, a groove-shaped recess 50 is formed along the lower surface 30c of the resin molded body 30 at a position adjacent to the lower surface 30c of the resin molded body 30. By forming such a recess 50, it becomes easy to stabilize the bending position and bending angle of the lead in the step of bending the outer lead portions 21b and 22b described later. The recess 50 may be formed in the first lead 21 and the second lead 22 before molding the resin molded body 30. The recess 50 may be formed after molding the resin molded body. The recess 50 can be formed by pressing, cutting, etching, laser light irradiation, or the like. The method using laser light irradiation can accurately form the recess 50 even after the resin molded body 30 is molded.

(2) Step of Bending Outer Lead Part Next, the second surface 20b of each of the outer lead part 21b of the first lead 21 and the outer lead part 22b of the second lead 22 faces the lower surface 30c of the resin molded body 30. Then, the outer lead portions 21b and 22b are bent at the recess 50. As a result, the first surface 20a of the outer lead portions 21b and 22b is used as the mounting surface of the light emitting device 100.

Each of the outer lead portions 21b and 22b has a branched portion at its tip, and at least a part of the branched portion can be bent upward along the left and right side surfaces of the resin molded body 30. At this time, a concave portion may be formed on the side of the second surface 20b of the bent portion of the branched portion, and the branched portion may be bent at the concave portion. In addition, it is preferable that the branching portion is bent at a predetermined angle in advance before the bending of the mounting surface of the outer lead portions 21b and 22b described above.

In the light emitting device 100 formed as described above, by bending the outer lead portions 21b and 22b in the recess 50 along the lower surface 30c of the resin molded body 30, variations in lead bending position and bending angle are reduced. By using the first surface 20a of the outer lead portions 21b and 22b thus bent as the mounting surface of the light emitting device, a light emitting device having excellent mounting accuracy can be obtained. Further, since the light emitting device 100 can suppress springback at the bent portion, it is possible to stabilize the fixing when mounting the light emitting device 100 on a mounting board or the like and suppress variations in mounting angle after mounting. it can.

Hereinafter, each component of the light emitting device according to the present embodiment will be described.

(Package 10)
The package 10 is a container that houses the light emitting element 40 and has terminals (electrodes) for supplying power to the light emitting element 40 from the outside. The package 10 includes at least a resin molded body 30, a first lead 21 and a second lead 22. The package 10 of the present embodiment is for a side surface light emitting device.

(Resin molded body 30)
The resin molded body 30 forms the base of the container in the package 10. The resin molded body 30 constitutes a part of the outer shape of the package 10. From the viewpoint of forward light extraction efficiency, the resin molded body 30 has a light reflectance at the emission peak wavelength of the light emitting element 40 of preferably 70% or more, more preferably 80% or more, and 90%. It is even more preferable that the above is satisfied. Further, the resin molded body 30 is preferably white. The resin molded body 30 is in a fluid state, that is, in a liquid state (including a sol state or a slurry state) before being cured or solidified. The resin molded body 30 can be molded by an injection molding method, a transfer molding method, or the like.

A thermosetting resin or a thermoplastic resin can be used as the base material of the resin molded body 30. The resins shown below also include modified resins (including hybrid resins) thereof. The base material of the resin molded body 30 is preferably a thermoplastic resin from the viewpoint of being easily molded by an injection molding method and being inexpensive as compared with a thermosetting resin. As the thermoplastic resin, any one of aliphatic polyamide resin, polycyclohexane terephthalate, and polycyclohexylene dimethylene terephthalate is preferable. Further, the thermosetting resin is preferable from the viewpoint of being excellent in heat resistance and light resistance, having a long life, and having high reliability, as compared with the thermoplastic resin. The thermosetting resin is preferably any one of epoxy resin, silicone resin and unsaturated polyester resin. In particular, unsaturated polyester resins and modified resins thereof are preferable because they can be molded by an injection molding method while having the excellent heat resistance and light resistance of thermosetting resins. From the viewpoint of light reflectivity, mechanical strength, thermal stretchability, etc., the resin molded body 30 preferably contains the following white pigment and filler in the base material, but is not limited thereto.

White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate,
Examples thereof include barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide and zirconium oxide. As the white pigment, one of these may be used alone, or two or more of these may be used in combination. Among them, titanium oxide is preferable because it has a relatively high refractive index and is excellent in light concealing property.

(First lead 21, second lead 22)
The pair of first leads 21 and the second leads 22 form a pair of positive and negative terminals (electrodes) in the package 10. In the light emitting device 100 according to the present embodiment, at least one pair of leads and one or more leads in one package 10 may be provided. It is preferable that a plurality of or all the leads in one package 10 extend from a lower surface that faces one direction of the package 10. In the present embodiment, since the outer lead portion 21b of the first lead 21 and the outer lead portion 22b of the second lead 22 extend from the lower surface 30c of the resin molded body 30, heat radiation from the light emitting element 40 to the mounting board is performed. The route can be shortened. The first lead 21 and the second lead 22 are made of copper, aluminum, gold, silver, tungsten, iron, nickel, cobalt, molybdenum or a flat plate of an alloy of these, and various types such as press (including punching), etching and rolling The processed product becomes the base. The first lead 21 and the second lead 22 may be formed of a laminated body of these metals or alloys, but a single layer may be simple. In particular, a copper alloy containing copper as a main component (phosphor bronze, iron-containing copper, etc.) is preferable. Further, a light-reflecting film such as silver, aluminum, rhodium or an alloy thereof may be provided on the surface thereof, and among them, silver or a silver alloy having excellent light reflectivity is preferable.

The thicknesses of the first lead 21 and the second lead 22 can be appropriately selected, but include 0.05 mm or more and 1 mm or less, preferably 0.07 mm or more and 0.3 mm or less, and more preferably 0.1 mm or more and 0.2 mm or less. preferable. The first lead 21 and the second lead 22 may be, for example, small pieces of a lead frame.

(Recess 50)
FIG. 7A is a schematic cross-sectional view showing an example of a concave portion before and after bending the outer lead portions 21b and 22b. The outer lead portion 21b of the first lead 21 and the outer lead portion 22b of the second lead 22 form a recess 50 on each second surface 20b before the step of bending the outer lead portions 21b, 22b. In the present embodiment, the recess 50 has a groove shape.

The groove-shaped recess 50 is preferably formed over the entire width of the second surface 20b of the outer lead portions 21b and 22b (width in the direction parallel to the lower surface 30c of the resin molded body 30). The depth of the recess 50 is preferably 1/5 or more and 1/2 or less of the thickness of the outer lead portions 21b and 22b.

The groove-shaped recess 50 is preferably formed so that the width on the second surface 20b side is wider than the width on the bottom side of the recess 50. Such a recess 50 is effective in suppressing springback in the bent portion of the lead. Examples of the shape of the recess 50 include a V-shaped cross section. The opening angle of the V-shape can be 60° to 120°, more preferably 80° to 100°. Alternatively, the bottom of the V-shaped groove may be rounded.

FIG. 7B is a schematic sectional view showing a modified example of the recess 50. The groove-shaped recess 50 has a protrusion 52a on one side surface and a recess 52b on the other side surface, and has a shape in which the protrusion 52a and the recess 52b are joined together when the outer lead portions 21b and 22b are bent. Good. Thereby, the bending angle of the lead can be stabilized.

FIG. 7C is a schematic cross-sectional view showing a modified example of the recess 50. The groove-shaped recess 50 includes a first inclined surface 53a having a width that decreases from the second surface 20b side to the first surface 20a side in order from the second surface 20b side to the first surface 20a side. The shape may have a second inclined surface 53b having a larger inclination angle than the inclined surface 53a or a vertical surface. By thus providing a space inside the bent portion after bending the lead, the stress acting on the bent portion can be relieved, and the bending angle of the lead can be stabilized.

(Embodiment 2)
FIG. 8 is a schematic front view of the package of the light emitting device 200 according to the second embodiment.

In the light emitting device 200 according to the present embodiment, the recess 150 is not formed from the ends of the outer lead parts 121b, 122b. The recess 150 is formed from the vicinity of one end of the outer lead portions 121b, 122b to the vicinity of multiple ends thereof in a direction parallel to the lower surface 130c of the resin molded body 130, and both ends of the recess 150 are not formed with the recess. The second surfaces of the lead portions 121b and 122b are present. Thereby, the strength of the bent portion of the lead can be maintained. The length of the recess 150 in the direction parallel to the lower surface 130c of the resin molded body 130 is preferably 1/2 or more of the width of the outer lead portions 121b and 122b in the direction parallel to the lower surface 130c of the resin molded body 130. ..

(Embodiment 3)
FIG. 9 is a schematic front view of the package of the light emitting device 300 according to the third embodiment.

In the light emitting device 300 according to the present embodiment, the recess 250 is formed of a plurality of holes penetrating from the first surface to the second surface, and the plurality of holes are arranged along the lower surface 230c of the resin molded body 230. Has been done. Such a recess 250 can be formed by, for example, laser light irradiation. The number and intervals of the holes are not particularly limited as long as they can withstand the bending of the outer lead parts 221b, 222b. The diameter of the hole is preferably narrowed from the second surface toward the first surface. As a result, an effect of suppressing springback at the bent portion of the lead can be expected.

A light emitting device according to an embodiment of the present invention includes a backlight device for a liquid crystal display, various lighting devices, a large display, various display devices such as advertisements and destination guidance, a projector device, a digital video camera, a facsimile, and a copy machine. It can be used for an image reading device in a machine, a scanner and the like.

10... Package 20a... 1st surface 20b... 2nd surface 21, 121, 221... 1st lead 21a... 1st lead inner lead part 21b, 121b, 221b... 1st lead outer lead part 22, 122, 222... Second lead 22a... Inner lead portion of second lead 22b, 122b, 222b... Outer lead portion of second lead 30, 130, 230... Resin molded body 32... Opening portion 34a Lead placement portion 34b... Convex portion 40... Light emitting element 50, 150, 250... Recessed portion 60... Translucent resin 71 Upper mold 72 Lower mold 73 Top surface 74 Gate 75 Space 78 Resin material 100... Light emitting device

Claims (16)

A first lead and a second lead having a first surface and a second surface opposite to the first surface, and a resin molded body having an opening in the front and burying a part of the first lead and the second lead And a package having
A light emitting element mounted in the opening,
The first lead and the second lead are outer lead portions that extend from the lower surface of the resin molded body, and inner lead portions that are embedded in the resin molded body and a part of the first surface is exposed in the opening. Has and
A method for manufacturing a light emitting device, wherein the lower surface side of the resin molded body is a mounting surface,
Preparing the package,
Bending the outer lead portions such that the second surfaces of the two outer lead portions face the lower surface of the resin molded body, respectively.
Each of the outer lead portions has a recess formed in the second surface before the step of bending the outer lead portion,
In the step of folding the outer lead portion by Rukoto bending each of said outer lead portions in the recess, the surrounded by folded subspace formed inside, and to the mounting surface of the first surface Manufacturing method of light emitting device. The method for manufacturing a light emitting device according to claim 1, wherein the recess is a groove. The method for manufacturing a light emitting device according to claim 1, wherein the depth of the recess is 1/5 or more and 1/2 or less of the thickness of the outer lead portion. 4. The method for manufacturing a light emitting device according to claim 1, wherein the recess is formed so that the width of the second surface side is wider than the width of the recess on the bottom side. The method for manufacturing a light emitting device according to claim 1 , wherein each of the recesses is formed at a position adjacent to the lower surface of the resin molded body and along the lower surface. The method for manufacturing a light emitting device according to claim 1 , wherein the recess is formed after the step of preparing the package. A first lead and a second lead having a first surface and a second surface opposite to the first surface, and a resin molded body having an opening in the front and burying a part of the first lead and the second lead And a package having
The first lead and the second lead are outer lead portions that extend from the lower surface of the resin molded body, and inner lead portions that are embedded in the resin molded body and a part of the first surface is exposed in the opening. Has and
A method for manufacturing a package in which the lower surface side of the resin molded body is a mounting surface,
A step of preparing the first lead and the second lead,
Arranging the first lead and the second lead between an upper mold and a lower mold,
A step of injecting a resin material into a space sandwiched between the upper die and the lower die, and curing or solidifying the resin material to form a resin molded body;
A step of bending the outer lead portion so that each second surface of the outer lead portion faces the lower surface of the resin molded body,
Each of the outer lead portions has a recess formed in the second surface before the step of bending the outer lead portion,
In the step of folding the outer lead portion by Rukoto bending each of said outer lead portions in the recess, the surrounded by folded subspace formed inside, and to the mounting surface of the first surface Package manufacturing method. The method for manufacturing a package according to claim 7, wherein the recess is a groove. The method of manufacturing a package according to claim 7 , wherein the depth of the recess is 1/5 or more and 1/2 or less of the thickness of the outer lead portion. The method of manufacturing a package according to claim 7 , wherein the recess is formed so that a width of the second surface side is wider than a width of the recess on a bottom side. The method for manufacturing a package according to claim 7 , wherein each of the recesses is formed at a position adjacent to the lower surface of the resin molded body and along the lower surface. In the step of preparing said first lead and said second lead, any one of claims 7 to 11, providing a first lead and a second lead each recess to the second surface of the outer lead portions are formed A method of manufacturing a package according to item . The method for manufacturing a package according to claim 7 , wherein the recess is formed after the step of molding the resin molded body. A first lead and a second lead having a first surface and a second surface opposite to the first surface, and a resin molded body having an opening in the front and burying a part of the first lead and the second lead And a package having
A light emitting element mounted in the opening,
The first lead and the second lead respectively extend from a lower surface of the resin molded body and are bent in a direction of extending along the lower surface of the resin molded body, and an outer lead portion embedded in the resin molded body. A part of one surface has an inner lead portion exposed in the opening,
A light emitting device having a mounting surface on the lower surface side of the resin molded body,
The lower surface of the resin molded body has a lead placement portion in which the outer lead portion is placed, and a convex portion located below the lead placement portion,
Each of the outer leads, the second surface side at a portion of the bending has a recess which forms a surrounded by portions of the bent space inside,
The light emitting device, wherein the concave portion is formed in a region between an extension line of a lower surface of the convex portion of the resin molded body and a lower surface of the lead placement portion. The light emitting device according to claim 14, wherein the recess is a groove. The light emitting device according to claim 14 or 15 , wherein each of the recesses is formed at a position adjacent to the lower surface of the resin molded body and along the lower surface.

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