JP6718230B2 - Grooving machine - Google Patents
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- JP6718230B2 JP6718230B2 JP2015257774A JP2015257774A JP6718230B2 JP 6718230 B2 JP6718230 B2 JP 6718230B2 JP 2015257774 A JP2015257774 A JP 2015257774A JP 2015257774 A JP2015257774 A JP 2015257774A JP 6718230 B2 JP6718230 B2 JP 6718230B2
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Description
本発明は、半導体デバイスウェーハや石英ボード等のセラミック製のワークピースの表面に等間隔幅の溝を多数加工する方法に関する。本発明の回転カッター（スライサー刃）を備える双頭スライサー装置（両頭スライサー）を用いる溝切り加工方法は、従来の溝切り加工方法と比較して加工時間を半分に縮小できる。 The present invention relates to a method of processing a large number of grooves equidistant width semiconductor Debaisuu E Doha, quartz board or the like ceramic surface of the workpiece. Grooving method of using a rotary cutter double headed slicer apparatus comprising (slicer blade) (double-ended slicer) of the present invention can reduce the processing time in half compared with the conventional groove cutting process.
ウェーハ保管用に、図３で示される２．５〜１２．５ｍｍの等間隔幅の溝を多数（５０〜１３２本の複数）有する石英ウェーハボードが使用されている（非特許文献１）。また、その製造方法も特開昭６０−２４３２７２号公報（特許文献１）および特開平７−１０６２７１号公報（特許文献２）に開示されるように、石英ガラス棒を用いて船型構造の枠組を形成し、該枠組内側に長手方向に所定間隔存して多数のウェーハ支持溝をスライサーで削成し、該ウェーハ支持溝上に多数枚の半導体をほぼ直立させて列設配置する。 The U E Doha for storage, has been used quartz c E Habodo having many grooves equidistant width of 2.5~12.5mm shown in Figure 3 (50-132 present s) (non-patent literature 1). The manufacturing method thereof is also disclosed in Japanese Patent Laid-Open No. 60-243272 (Patent Document 1) and Japanese Patent Laid-Open No. 7-106271 (Patent Document 2), in which a framework of a ship-shaped structure is formed using a quartz glass rod. formed, cutting forms a plurality of U E Doha support groove slicer with predetermined intervals exist longitudinally the frame assembly inside the column set arranged to be substantially upright a large number of semiconductor該U E Doha supported on the groove To do.
また、特開２００６−２７８４７４号公報（特許文献３）は、半導体ウェーハを熱処理する際に使用される半導体ウェーハ支持ボートであって、該ウェーハ支持ボートは、ＳｉＣで形成された枠体と、半導体ウェーハと同質の材料で形成されたウェーハ支持ロッドとから構成され、前記ウェーハ支持ロッドは、前記枠体に着脱自在であることを特徴とする半導体ウェーハ支持ボートを提案する。 Further, Japanese Patent Laid-Open No. 2006-278474 (Patent Document 3) is a semiconductor wafer support boat used when heat-treating a semiconductor wafer, and the wafer support boat includes a frame body made of SiC and a semiconductor. A semiconductor wafer support boat is proposed which is composed of a wafer and a wafer support rod formed of the same material as the wafer, and the wafer support rod is detachable from the frame body.
また、特開２０１４−１８８６２８号公報（特許文献４）は、円盤状の回転カッターによりワークに対して溝加工を施す溝加工方法において、前記回転カッターをその軸方向に往復移動させながらワークに対して切り込みさせる溝加工方法を提案する。 Further, Japanese Patent Application Laid-Open No. 2014-188628 (Patent Document 4) is a groove machining method in which a disk-shaped rotary cutter is used to perform groove machining on a work, while reciprocating the rotary cutter in the axial direction of the work. We propose a grooving method that cuts by cutting.
一方、本願特許出願人による特許第５５４７９２５号公報（特許文献５）は、１テーブル、２頭砥石軸の平面研削装置を用いてワークピースを複合平面加工する方法を提案する。 On the other hand, DuPont Japanese Patent No. 5547925 by (Patent Document 5), 1 table, we propose a method for combined surface machining workpieces using a surface grinding apparatus 2 head wheel spindle.
デバイスウェーハの基板も従来のシリコン基板やガラス板の外にサファイア基板、炭化珪素基板、窒化ガリウム基板、窒化炭素基板等、種類も増え、石英ボードの外に、これら新しいセラミック製ボードを加工することが最近、試みられている。 Debaisuu Eha the board also sapphire board outside the conventional silicon substrate or a glass plate, a silicon carbide board, gallium nitride board, a carbon board nitride, kinds increases, out of the quartz board, these new ceramics Processing of manufactured boards has recently been attempted.
前記特許文献１から特許文献３の単頭回転工具を用いる溝加工方法では、加工時間が長い欠点がある。また、溝加工の半分が過ぎたら作業台を１８０度回転し、未溝切り加工のワーク部分の溝切り加工を再開する必要があるので、複数溝の平行度が乱れる欠点がある。 The groove machining methods using the single-headed rotary tool of Patent Documents 1 to 3 have a drawback that the machining time is long. Further, when half of the grooving has passed, it is necessary to rotate the work table by 180 degrees and restart the grooving of the ungrooved work part, which has a drawback that the parallelism of the plurality of grooves is disturbed.
本願発明者らは、特許文献５の２ヘッド、１テーブル（作業台）の双頭スライサー装置を用いれば、溝切り加工時間が半分に減少できると想定し、本願発明に到った。 The inventors of the present application have reached the present invention on the assumption that the grooving time can be reduced to half by using the two-head, one-table (workbench) double-headed slicer device of Patent Document 5.
本発明の溝切り加工装置は、セラミック製の柱体状のワークピースを長手方向が左右方向となるように載置する左右方向に往復移動可能なワークテーブルと、前記ワークピースの上方に設けられ左右に並設され上下方向に移動可能な一対の主軸と、一方が左側の前記主軸の左側に設けられ他方が右側の前記主軸の右側に設けられて左右方向の軸を中心として回転する一対の回転カッターと、を備え、一対の前記主軸を下降させて前記回転カッターにより前記ワークピースに２本の溝を加工する工程と、前記回転カッターの下降による２本の溝加工を終えたら前記主軸を上昇させて前記回転カッターを前記ワークピースより遠ざける工程と、加工された２本の前記溝のそれぞれの隣に新たな溝が溝切り加工される距離だけ前記ワークピースと前記主軸とを左右方向に相対的に移動させる工程と、をこの順番で複数回繰り返して前記ワークピースに複数の溝を等間隔に形成することを特徴とする。 Grooving apparatus of the present invention, a lateral direction reciprocally movable work table for mounting the pillar-shaped workpieces made of ceramic so that the longitudinal direction is the horizontal direction, provided above the workpiece And a pair of main shafts that are arranged side by side and are movable in the vertical direction, and a pair that is provided on the left side of the main shaft on the left side and the other on the right side of the main shaft on the right side and rotates about the horizontal axis. comprising a rotary cutter, wherein the After completing the step of processing the two grooves on the workpiece by the rotary cutter is lowered a pair of said main shaft, the two grooves by the descent of the pre-Symbol rotary cutter a step away the rotary cutter from the workpiece by raising the spindle, each new groove next to the groove of two which is pressurized Engineering is the said distance only the workpiece to be machined grooved spindle a step of relatively moving in the lateral direction, a repeated several times in the order of this and forming at regular intervals a plurality of grooves in the workpiece.
ワークピースへの溝切り加工が同時に２本行われるので加工時間が１／２と縮小された。また、ワークテーブルの回転がなされないので、溝切り加工された溝間の平行度が損なわれることはない。 Since two grooving processes are performed on a workpiece at the same time, the machining time is reduced to 1/2. Further, since the work table is not rotated, the parallelism between the grooved grooves is not impaired.
図２に示す双頭スライサー装置１において、２はワークテーブル、３は回転カッター３ｇを備える主軸、３ｍは駆動モーター、３ｓは昇降装置、ｗはワークピースである。 In double-headed slicer apparatus 1 shown in FIG. 2, 2 work table, 3 spindle with a rotating cutter 3 g, 3m drive motor, 3s is temperature descending device, w is a work piece.
ワークテーブル２は、左右方向移動可能に設けられている。また、回転カッター３ｇとしては、スライサー刃、ダイサー刃、砥石車が使用可能である。ワークピースｗ素材としては、石英ガラス、炭化珪素（ＳｉＣ）、窒化珪素、サファイア基板等が挙げられる。 The work table 2 is provided so as to be movable in the left and right directions. A slicer blade, a dicer blade, and a grinding wheel can be used as the rotary cutter 3g. The workpiece w material, quartz glass, silicon carbide (SiC), silicon nitride, sapphire board, and the like.
上記双頭スライサー装置１を用いてワークピースｗに複数の溝を機械加工する工程は、次の工程を経て実施される。 The step of machining a plurality of grooves in the workpiece w using the double-headed slicer device 1 is performed through the following steps.
（ｏ）．左右に往復移動可能なワークテーブル２上にセラミック製ワークピースｗを長手方向が左右方向となるように載置し、ついで、回転カッター３ｇを備える２個の主軸３、３を溝切り開始点と溝加工半分点に分けて分離配置する段取り工程。（図１ａ参照）。
（ｉ）．前記回転カッター３ｇを備える２個の主軸３、３を下降させて回転カッター３ｇによるワークピースｗの溝切り加工を開始する工程。
（ｉｉ）．２本の溝加工が終えたら前記主軸３、３を上昇させてワークピースｗより遠ざける工程。（図１ｂ参照）。
（ｉｉｉ）．ワークピースｗと主軸３、３との相対的な移動により、前記加工溝の隣の溝が溝切り加工されるピッチ距離ｄだけ移動させる工程。（図１ｃ参照）。
（ｉｖ）．前記回転カッター３ｇを備える２個の主軸３、３を下降させて回転カッター３ｇによるワークピースｗの溝切り加工を開始する工程。
（ｖ）．２本の溝加工が終えたら前記主軸３、３を上昇させてワークピースｗより遠ざける工程。
（ｖｉ）．ワークピースｗと主軸３、３との相対的な移動により、前記加工溝の隣の溝が溝切り加工されるピッチ距離ｄだけ移動させる工程。
（ｖｉｉ）．前記回転カッター３ｇを備える２個の主軸３、３を下降させて回転カッター３ｇによるワークピースｗの溝切り加工を開始する工程。
（ｖｉｉｉ）．２本の溝加工が終えたら前記主軸３、３を上昇させてワークピースｗより遠ざける工程。
（ｉｘ）．前記（ｖｉ）工程から（ｖｉｉｉ）工程を（ｎ／２−２）回繰り返し、ｎ個の溝をワークピースｗに形成させる工程。（図１ｄ参照）。
(O). A ceramic work piece w is placed on the work table 2 which can reciprocate left and right so that the longitudinal direction is the left and right direction, and then the two spindles 3 and 3 having the rotary cutter 3g are used as the grooving start points. A setup process in which the groove is divided into half points and placed separately. (See Figure 1a).
(I). A step of starting the grooving of the workpiece w by the rotary cutter 3g lowers the two spindle 3,3 with the rotary cutter 3g.
(Ii). After finishing the machining of the two grooves, the process of raising the spindles 3 and 3 to move them away from the workpiece w. (See Figure 1b).
(Iii). A step of moving the work piece w and the spindles 3 and 3 by a relative distance between the work groove and a pitch distance d by which a groove adjacent to the working groove is grooved. (See Figure 1c).
(Iv). A step of starting the grooving of the workpiece w by the rotary cutter 3g lowers the two spindle 3,3 with the rotary cutter 3g.
(V). After finishing the machining of the two grooves, the process of raising the spindles 3 and 3 to move them away from the workpiece w .
(Vi). A step of moving the work piece w and the spindles 3 and 3 by a relative distance between the work groove and a pitch distance d by which a groove adjacent to the working groove is grooved.
(Vii). A step of starting the grooving of the workpiece w by the rotary cutter 3g lowers the two spindle 3,3 with the rotary cutter 3g.
(Viii). After finishing the machining of the two grooves, the process of raising the spindles 3 and 3 to move them away from the workpiece w .
(Ix) . Before Symbol (vi) step a (viii) process repeated (n / 2-2) times, the step of forming the n-number of grooves to the workpiece w. (See Figure 1d).
なお、上記（ｉｉｉ）工程のワークピースｗと主軸３、３との相対的な移動が、ワークテーブル２の左右方向の移動による、または、回転カッター３ｇを備える２個の主軸３、３を搭載するツールテーブルの左右方向への移動による、もしくは、双方の移動によるものであっても良い。 The relative movement between the workpiece w and the spindles 3 and 3 in the step (iii) is performed by the horizontal movement of the work table 2 or by mounting the two spindles 3 and 3 having the rotary cutter 3g. The tool table may be moved in the left-right direction or both of them may be moved.
本発明の双頭スライサー装置１を用いるウェーハ支持ボードの溝切り加工方法は、従来技術と比較して１／２の加工時間で実施可能である。また、ワークテーブル２の回転がなされないので、溝切り加工された溝間の平行度が損なわれることはない。 Grooving method c E Doha supporting board using a double-headed slicer apparatus 1 of the present invention can be carried out at half the processing time as compared to the prior art. Further, since the work table 2 is not rotated, the parallelism between the grooved grooves is not impaired.
１ 双頭スライサー装置
ｗ ワークピース（被加工物）
２ ワークテーブル
３ 主軸
３ｇ 回転カッター
３ｓ 昇降装置
1 Double-headed slicer device w Workpiece (workpiece)
2 work table 3 spindle 3g rotary cutters 3s lifting device
Claims (1)
前記ワークピースの上方に設けられ左右に並設され上下方向に移動可能な一対の主軸と、
一方が左側の前記主軸の左側に設けられ他方が右側の前記主軸の右側に設けられて左右方向の軸を中心として回転する一対の回転カッターと、を備え、
一対の前記主軸を下降させて前記回転カッターにより前記ワークピースに２本の溝を加工する工程と、
前記回転カッターの下降による２本の溝加工を終えたら前記主軸を上昇させて前記回転カッターを前記ワークピースより遠ざける工程と、
加工された２本の前記溝のそれぞれの隣に新たな溝が加工される距離だけ前記ワークピースと前記主軸とを左右方向に相対的に移動させる工程と、をこの順番で複数回繰り返して実行し、前記ワークピースに複数の溝を等間隔に形成することを特徴とする溝切り加工装置。 And reciprocally movable work table in the lateral direction of the ceramic-made pillar-shaped workpiece longitudinally placed so that the lateral direction,
A pair of main shafts provided above the work piece, arranged side by side on the left and right, and movable in the vertical direction;
A pair of rotary cutters , one of which is provided on the left side of the left main shaft and the other of which is provided on the right side of the right main shaft, and which rotates about a shaft in the left-right direction ;
A step of lowering a pair of the spindles to machine two grooves in the workpiece by the rotary cutter ;
A step of said rotary cutter is raised the spindle After completing the two grooves by the descent of the pre-Symbol rotary cutter away from the workpiece,
Repeated several times and process each new grooves adjacent relatively moving the said only the workpiece distance is processing spindle in the lateral direction of the pressurized Engineering is two of the groove was, at the order of this run Te, grooving apparatus characterized by forming a plurality of grooves at equal intervals in the work piece.
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| JP2015257774A JP6718230B2 (en) | 2015-12-15 | 2015-12-15 | Grooving machine |
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| JP2015257774A JP6718230B2 (en) | 2015-12-15 | 2015-12-15 | Grooving machine |
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| JP2017109464A5 JP2017109464A5 (en) | 2019-01-17 |
| JP6718230B2 true JP6718230B2 (en) | 2020-07-08 |
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| JPH02190310A (en) * | 1989-01-19 | 1990-07-26 | Disco Abrasive Syst Ltd | Plate-shaped object cutting method and cutting blade |
| JPH05111867A (en) * | 1991-10-23 | 1993-05-07 | Fujitsu Ltd | Workpiece processing method with multi-grinding stone |
| JP2718889B2 (en) * | 1994-03-24 | 1998-02-25 | 日本碍子株式会社 | Cutting positioning method of insulator |
| JPH08108427A (en) * | 1994-10-12 | 1996-04-30 | Nec Corp | Machining device for comb tooth groove |
| JP3493282B2 (en) * | 1997-07-02 | 2004-02-03 | 株式会社ディスコ | Cutting method |
| JP3687324B2 (en) * | 1998-01-26 | 2005-08-24 | いすゞ自動車株式会社 | Cylinder bore high-precision fine groove machining apparatus and machining method |
| JP3646781B2 (en) * | 1999-11-08 | 2005-05-11 | 株式会社東京精密 | Dicing method, kerf check method of dicing apparatus, and kerf check system |
| US20030056628A1 (en) * | 2001-09-27 | 2003-03-27 | Eli Razon | Coaxial spindle cutting saw |
| JP2009126006A (en) * | 2007-11-21 | 2009-06-11 | Tokyo Seimitsu Co Ltd | Cutting method for workpiece |
| CN104647615A (en) * | 2013-11-15 | 2015-05-27 | 台湾暹劲股份有限公司 | Wafer cutting device and cutting method thereof |
| JP2015126205A (en) * | 2013-12-27 | 2015-07-06 | 三星ダイヤモンド工業株式会社 | Grooving tool and scribe device with grooving tool attached thereto |
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