JP6735604B2 - COMPOSITE MOLDED MEMBER, METHOD OF MANUFACTURING COMPOSITE MOLDED MEMBER, ELECTRONIC/ELECTRIC PARTS, ELECTRONIC/ELECTRIC PARTS MANUFACTURING METHOD, ELECTRONIC/ELECTRIC DEVICE, AND ELECTRONIC/ELECTRIC DEVICE MANUFACTURING METHOD - Google Patents

Description

The present invention relates to a composite molded member, a method for manufacturing the composite molded member, an electronic/electrical component including the composite molded member, a method for manufacturing an electronic/electrical component including the composite molded member, and an electronic/electrical component. The present invention relates to a device and a method for manufacturing an electronic/electrical device including the above electronic/electrical component.

Patent Document 1 discloses a method of manufacturing a resin composite molded body in which a metal terminal is inserted, and a part of the metal terminal protrudes from a resin casing to form an electrical connection part At least one groove shape for producing a compressive stress of resin is provided at the end portion on the plate width side, and at least one acute-angled shape whose angle formed by the groove shape at the intersection with the end surface on the plate width side of the metal terminal is smaller than 90°. In order to improve the airtightness by partially adhering the metal terminal and the resin inside the groove shape by utilizing the phenomenon of volume change when the molten resin is solidified, the metal terminal is inserted. A method for producing the resin composite molded article is disclosed.

JP 2012-101394A

As described in Patent Document 1, it is not easy to ensure the adhesion between the metal part and the resin molding part, and the composite molding member including the metal part and the molding resin part may have a complicated structure. You may be asked. In particular, when the metal part is made of a material such as stainless steel that is difficult to bond to the molded resin part (hereinafter, such a material is also referred to as a “hard bonding material”), the metal part and the molded resin part are suitable. It was particularly difficult to form a composite molded member that was in close contact with the.

The present invention is to solve the above conventional problems, and to provide a composite molded member in which the metal part and the molding resin part are appropriately adhered to each other even when the metal part is made of a difficult-to-bond material. To aim. The present invention provides a method for manufacturing such a composite molded member, an electronic/electrical component including the above composite molded member, a method for manufacturing an electronic/electrical component including the above composite molded member, and the above electronic/electrical component. It is also an object to provide an electronic/electrical device provided and a method of manufacturing an electronic/electrical device configured to include the above electronic/electrical component.

The present invention provided to solve the above-mentioned problems is, in one aspect, a composite molding member including a metal part and a molding resin part, wherein a joining part at which the metal part and the molding resin part are bonded to each other is provided. A silane coupling agent containing a silver-containing material and a thiol group having a shortest axial length of 1 μm or less between a portion of the metal portion located at the joint portion and a portion of the resin-molded resin portion located at the joint portion. The composite molded member is characterized by the presence of an agent. By providing such a configuration, it is possible to increase the bonding strength of the bonding portion. The silver-containing material having the shortest axial length of 1 μm or less existing in the joint portion may function as a carrier for the thiol group-containing silane coupling agent.

In the above-mentioned composite molded member, the surface of the metal portion located at the joining portion may include a portion made of one or more selected from the group consisting of stainless steel, nickel plating, and chrome plating. Even with such a difficult-to-bond material, the bonding strength of the bonded portion can be increased. The above-mentioned difficult-to-bond material and the silver-containing material appropriately interact, and the thiol group-containing silane coupling agent supported on the silver-containing material interacts with the molding resin part, whereby the bonding strength of the bonding part is increased. There is a possibility that

In the above-mentioned composite molded member, the surface of the metal portion located at the joining portion may be a surface that has been subjected to a sulfidation prevention treatment. Even in such a case, the joint strength of the joint portion can be increased. The substance disposed on the surface of the metal part by the sulfurization preventing treatment and the silver-containing material appropriately interact, and the thiol group-containing silane coupling agent supported on the silver-containing material interacts with the molding resin part, It is possible that the joint strength of the joint portion is increased.

When the molding material contains polyamide, it is easy to obtain a composite molded member having excellent heat resistance.

The present invention, in another aspect, is a method for manufacturing a composite molded member including a metal part and a molded resin part. Such a manufacturing method is a pretreatment for forming a pretreatment layer by supplying a silver-containing material having a shortest axial length of 1 μm or less and a thiol group-containing silane coupling agent to the surface of the portion of the metal portion to be the bonding portion. A step of arranging the metal part that has undergone the pretreatment step in a mold and supplying/molding a molding material into the mold to obtain the composite molded member having the joint portion. ..

By adopting such a manufacturing method, the composite molded member according to one aspect of the present invention can be efficiently manufactured.

The surface on which the pretreatment layer is formed in the pretreatment step may include a portion made of one or more selected from the group consisting of stainless steel, nickel plating, and chrome plating, and is subjected to sulfuration prevention treatment. It may include a portion that has been.

The shape of the silver-containing material is not limited. It may include a granular body having a ratio of the longest axial length to the shortest axial length of 2 or less, or a linear body having a ratio of the longest axial length to the shortest axial length of 5 or more.

The thiol group-containing silane coupling agent may have a triazine skeleton and may be anionized in at least one thiol group.

When the molding material contains polyamide, it is easy to obtain a composite molded member having excellent heat resistance.

The present invention, in another aspect, is an electronic/electrical component comprising the above-mentioned composite molded member. The present invention, in another aspect, is an electronic/electrical device comprising the electronic/electrical component described above. The present invention, in another aspect, is a method for producing an electronic/electrical component, comprising the composite molded member produced by the method for producing a composite molded member as described above. The present invention, in another aspect, is a method for manufacturing an electronic/electrical device, comprising an electronic/electrical part manufactured by the above-described method for manufacturing an electronic/electrical part.

According to the present invention, there is provided a composite molded member in which the metal part and the molding resin part are appropriately in close contact with each other even when the metal part is made of a difficult-to-bond material. According to the present invention, a method for manufacturing such a composite molded member, an electronic/electrical component including the above composite molded member, a method for manufacturing an electronic/electrical component including the above composite molded member, and the above electronic/electrical There is also provided an electronic/electrical device including a component, and a method for manufacturing an electronic/electrical device including the electronic/electrical component.

It is a fragmentary sectional view showing typically the compound molding member concerning one embodiment of the present invention. It is a flowchart explaining the manufacturing method of the composite molded member which concerns on one Embodiment of this invention. It is a figure for demonstrating the manufacturing method of the composite molded member which concerns on one Embodiment of this invention, Comprising: It is a figure which shows notionally the state of the surface of the metal part after a pretreatment process. FIG. 6 is a diagram for explaining the method for manufacturing the composite molded member according to the embodiment of the present invention, and is a diagram showing a state in the middle of the molding step (before the supply of the molding material). FIG. 6A is a view for explaining the method for manufacturing the composite molded member according to the embodiment of the present invention, and is a diagram showing a state in the middle of the molding step (after supplying the molding material). 5 is a diagram showing an observation result of a surface of a metal part after the pretreatment process of Example 1. FIG. 5 is a diagram showing an observation result of a surface of a metal part after the pretreatment process of Example 1. FIG. 5 is a diagram showing an observation result of a surface of a metal part after the pretreatment process of Example 1. FIG. 5 is a diagram showing an observation result of a surface of a metal part after a pretreatment process of Example 2. FIG. 5 is a diagram showing an observation result of a surface of a metal part after a pretreatment process of Example 2. FIG. 5 is a diagram showing an observation result of a surface of a metal part after a pretreatment process of Example 2. FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same components are designated by the same reference numerals, and detailed description thereof will be appropriately omitted.

FIG. 1 is a partial sectional view schematically showing a composite molded member according to an embodiment of the present invention.

As shown in FIG. 1, a composite molded member 10 according to an embodiment of the present invention includes a metal portion 20 and a molded resin portion 30, and a joint portion BR at which the metal portion 20 and the molded resin portion 30 are bonded to each other. Prepare

The material forming the metal part 20 is not limited, but may be a so-called difficult-to-join material. An example of such a material is stainless steel. Stainless steel has a passivation layer mainly composed of oxides of chromium on its surface, and since this passivation layer is chemically stable, it should be joined by increasing the joining strength with the molding resin part 30. Is difficult. The metal part 20 may have a laminated structure, and in this case, the material located on the outermost surface may be a difficult-to-join material. Specific examples of the difficult-to-join material in this case include nickel plating and chromium plating. The metal portion 20 may be subjected to sulfurization prevention treatment. The sulfidation prevention treatment is one of typical treatments performed to protect the metal-based material located on the surface of the metal portion 20 from chemical alteration (sulfidation). Substances such as thiols and triazines that are used for sulfurization prevention chemically interact with the metal-based material located on the surface of the metal portion 20, so that the metal-based material and other substances (sulfur-containing substances) are present. Suppresses chemical interaction (sulfurization). Therefore, the surface of the metal portion 20 that has been subjected to the sulfurization treatment is usually in a chemically inactive state, and the molding resin portion 30 is difficult to join.

As described above, even if the surface of the metal part 20 is made of a difficult-to-bond material or is chemically inactive due to the sulfurization prevention treatment, etc. Since the silver-containing material and the thiol group-containing silane coupling agent having the shortest axial length of 1 μm or less are present between the portion 20A to be formed and the portion 30A located in the joint portion BR in the molding resin portion 30, the joint portion BR The bonding strength can be increased.

The specific shape of the silver-containing material is not limited as long as the shortest axial length is 1 μm or less. The silver-containing material may include a granular material having a ratio of the longest axial length to the shortest axial length of 2 or less. When the silver-containing material is a granular material, the primary particle size may be 100 nm or less. The silver-containing material may include a linear body having a ratio of the longest axial length to the shortest axial length (aspect ratio) of 5 or more. When the silver-containing material is a linear body, it may have a rod-like shape with an aspect ratio up to about 10, or may have a wire-like shape with an aspect ratio exceeding 10. The silver-containing material may include a flaky body having a ratio of the longest axial length to the shortest axial length of 5 or more. When the silver-containing material is a piece, the shape of the piece may be a synthetic shape formed during synthesis, or a processed shape obtained by secondary processing such as flattening. Good.

The silver-containing material is composed of a material containing silver. The silver-containing material may contain a metal element other than silver. Examples of such elements include precious metal elements such as gold and copper. The silver-containing material may be surface-treated. The type of surface treatment is not limited. As an example, a treatment for adhering a substance containing an amino group, which is performed for the purpose of improving the dispersibility of a silver-containing material, can be mentioned. From the viewpoint of enhancing the dispersibility of the silver-containing material in the dispersion medium (water is exemplified), a protective agent may be applied to the silver-containing material. Specific examples of such a protective agent include gelatin, polyvinylpyrrolidone, a surfactant, and an aqueous wetting and dispersing agent.

The thiol group-containing silane coupling agent is a substance having a thiol group and an alkoxysilane group. The thiol group can easily interact with a metal material such as silver constituting the silver-containing material. The alkoxysilane group forms a silanol group by being hydrolyzed, and can interact with the material forming the molding resin part 30.

The type of material forming the molding resin portion 30 is not particularly limited. Various resins such as polyamide such as 9T nylon and 66 nylon; polyolefin such as polyethylene and polypropylene; polyester such as polyethylene terephthalate and polyethylene naphthalate; liquid crystal polymer; polycarbonate; polyvinyl chloride; polyimide and the like can be used. Since polyamide or liquid crystal polymer has excellent heat resistance, the heat resistance of the composite molded member 10 can be increased, which is preferable in some cases. The resin contained in the molded resin portion 30 may be composed of one kind or plural kinds. The molding resin portion 30 may contain a filler such as an inorganic filler such as silica filler or alumina filler; an organic filler such as melamine resin beads.

Between the portion 20A of the metal portion 20 located at the joint portion BR and the portion 30A of the molding resin portion 30 located at the joint portion BR, a silver-containing material and a thiol group-containing silane coupling agent having a shortest axial length of 1 μm or less are provided. The reason why the bonding strength of the bonding portion BR can be increased by the existence is not clear. Since the above-mentioned silver-containing material easily causes a chemical interaction with a thiol group and has a shape in which the shortest axial length is 1 μm or less, the above-mentioned silver-containing material has a large surface area. Therefore, the silver-containing material serves as a carrier for the thiol group-containing silane coupling agent, and a large amount of the thiol group-containing silane coupling agent is present in the joint portion, resulting in an increase in joint strength. there is a possibility. Further, since silver contained in the silver-containing material is a metal, it is expected that chemical interaction easily occurs with an oxide formed on the surface of stainless steel, chromium plating, nickel plating, or the like. That is, the silver of the silver-containing material interacts with the portion 20A of the metal portion 20 located at the joint portion BR, and interacts with the portion 20A of the silver portion of the metal portion 20 located at the joint portion BR. A portion where the untreated portion interacts with the thiol group of the thiol group-containing silane coupling agent and the silanol group formed by hydrolysis of the alkoxysilane of the thiol group-containing silane coupling agent is located at the bonding portion BR in the molding resin portion 30. There is a possibility that the bonding strength of the bonding portion BR in the metal portion 20 is increased by interacting with 30A.

The thiol group-containing silane coupling agent may have a partial structure that easily interacts with the portion 20A of the metal portion 20 located at the joining portion BR and the portion 30A of the molding resin portion 30 located at the joining portion BR. An example of such a structure is a triazine skeleton. The thiol group-containing silane coupling agent may be structurally adjusted to improve handleability. A specific example thereof is a case where the thiol group-containing silane coupling agent has a plurality of thiol groups and at least one of these thiol groups is anionized. By being anionized in this way, the thiol group-containing silane coupling agent can be made into, for example, an alkali metal salt. Since such a metal salt has high water solubility, it becomes easy to supply the thiol group-containing silane coupling agent to the surface of the metal part 20. Further, since it becomes a thiol anion in water, it is expected that an interaction between a thiol group-containing silane coupling agent and a metal such as silver is likely to occur.
Specific examples of the thiol group-containing silane coupling agent include triethoxysilylpropylamino-1,3,5-triazine-2,4-dithiol (n-TES) represented by the following formula (I).

The manufacturing method of the composite molded member 10 is not limited. The composite molded member 10 can be efficiently obtained by manufacturing by the method described below.

FIG. 2 is a flowchart illustrating a method for manufacturing a composite molded member according to an embodiment of the present invention. FIG. 3 is a diagram for explaining the method for manufacturing the composite molded member according to the embodiment of the present invention, and is a diagram conceptually showing the state of the surface of the metal part after the pretreatment step. FIG. 4 is a diagram for explaining the method for manufacturing the composite molded member according to the embodiment of the present invention, and is a diagram showing a state in the middle of the molding process (before supplying the molding material). FIG. 5 is a diagram for explaining the method for manufacturing the composite molded member according to the embodiment of the present invention, and is a diagram showing a state in the middle of the molding process (after supplying the molding material).

As shown in FIG. 2, the method for manufacturing the composite molded member 10 according to the embodiment of the present invention includes a pretreatment process and a molding process.

In the pretreatment step, a silver-containing material having a shortest axial length of 1 μm or less and a thiol group-containing silane coupling agent are provided on a surface of a portion of the metal portion 20 that is to be the bonding portion BR (hereinafter, also referred to as “metal surface”). It is supplied to form a pretreatment layer. The method of supplying the silver-containing material and the thiol group-containing silane coupling agent to the metal surface is arbitrary. The metal part 20 is dipped in a liquid containing the silver-containing material and the thiol group-containing silane coupling agent (hereinafter, also referred to as “treatment liquid”) to obtain the silver-containing material and the thiol group-containing silane coupling agent. A method of supplying to a metal surface is exemplified.

Here, when preparing the treatment liquid, treatment such as heating (for example, 50 to 90° C.) is performed to allow the above-mentioned silver-containing material and the thiol group-containing silane coupling agent to sufficiently interact with each other. It may be preferable to leave it.

When the metal part 20 is immersed in the treatment liquid, the immersion conditions are not limited. It suffices that the silver-containing material and the thiol group-containing silane coupling agent can be appropriately attached to the metal surface. It may be preferable to heat the treatment liquid (for example, 50 to 90° C.). FIG. 3 is a diagram conceptually showing a state in which the silver-containing material and the thiol group-containing silane coupling agent described above are supplied to the surface (metal surface) of the portion of the metal portion 20 that is to be the bonding portion BR. Although it is not always easy to directly attach the thiol group-containing silane coupling agent to the metal surface, the above-mentioned silver can be prepared by using the treatment liquid in which the thiol group-containing silane coupling agent is sufficiently attached to the above silver-containing material. By supplying the containing material to the metal surface, a relatively large amount of thiol group-containing silane coupling agent can be supplied to the metal surface.

Before the above-mentioned pretreatment step is performed, the metal portion 20 may be subjected to a cleaning treatment, a sulfuration preventing treatment, or the like.

In the molding step, first, the metal part 20 that has undergone the above thiol treatment step is placed in the mold 40 (FIG. 4). The cavity 40C is located in the mold 40 even when the metal part 20 is arranged. As shown in FIG. 4, a portion of the cavity 40C is defined by the surface of the metal portion 20. The surface of the metal portion 20 that defines the cavity 40C is the surface of the portion 20A located at the joint portion BR of the metal portion 20 in the composite molded member 10. The molding material 30R in a state where the fluidity is increased is supplied into the cavity 40 of the mold 40 (FIG. 5), and thereafter the fluidity of the molding material 30R is reduced to form the molding material 30R, and the cavity 40 The molding resin portion 30 is formed therein. Usually, the fluidity of the molding material 30R is controlled by changing the temperature of the molding material 30R. In this way, the composite molded member 10 including the joint portion BR between the metal portion 20 and the molded resin portion 30 is obtained (FIG. 1).

An electronic/electric component according to an embodiment of the present invention is configured to include the composite molded member 10 manufactured by the above manufacturing method. As described above, in the composite molded member 10, since the joint portion BR between the metal portion 20 and the molding resin portion 30 has high joint strength, it is possible to use a difficult joint material such as stainless steel for the metal portion 20. Since stainless steel has excellent corrosion resistance and high availability, it can be provided at low cost while improving the quality of electronic and electric parts. An electronic/electrical device according to an embodiment of the present invention includes the electronic/electrical component according to the above-described embodiment of the present invention. As described above, since the electronic/electrical component according to the embodiment of the present invention can be made high quality and inexpensive, the electronic/electrical component according to the embodiment of the present invention configured to include such electronic/electrical component. -Electrical equipment can be equipment with excellent cost performance.

Although the present embodiment and application examples thereof have been described above, the present invention is not limited to these examples. For example, those skilled in the art appropriately add, delete, or change the design of each of the above-described embodiments or the application examples thereof, or appropriately combine the features of the embodiments, the present invention is also applicable. As long as it has the gist, it is included in the scope of the present invention.

Hereinafter, the present invention will be described more specifically with reference to Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

(Example 1)
A metal plate of stainless steel (SUS304) was prepared as a member forming the metal part. The metal plate was subjected to alkali degreasing, acid cleaning and neutralization treatment.

A 1.0×10 ⁻⁴ M aqueous solution of triethoxysilylpropylamino-1,3,5-triazine-2,4-dithiol (n-TES) (first aqueous solution) and gelatin-protected nanosilver (average diameter is about 50 nm). An aqueous solution (second aqueous solution) in which 2% by mass of a silver-containing material composed of (a granular body) was dispersed was prepared. A treatment liquid was prepared by mixing 10 mL of the first aqueous solution and 1 mL of the second aqueous solution.

The metal plate that had been subjected to the above neutralization treatment was immersed in the treatment liquid at 80° C. for 5 minutes. The metal plate after the immersion was washed with water and dried to obtain a metal plate that had been subjected to the pretreatment process.

This metal plate was placed in a mold so that a region of 5 mm×5 mm (25 mm ² ) on one surface of the metal plate that had been subjected to the pretreatment process was exposed in the cavity. A molding step of heating 9T nylon (“Genestar” manufactured by Kuraray Co., Ltd.) to 310 to 325° C., setting the mold temperature to 130° C., and performing injection molding was performed.

After the molding step, the mold was opened to obtain a composite molded member. Through the above work, four composite molded members (test pieces 1-1 to 1-4) were obtained.

(Example 2)
When preparing the treatment liquid, instead of the second aqueous solution, a silver nanowire (a linear body having a minor axis diameter of about 0.05 μm and a major axis diameter of 50 μm or less, and broken fragments and the like from the SEM observation image) It can be confirmed.) 4 composite molded members (test piece 2-1 to test piece) in the same manner as in Example 1 except that an aqueous solution (third aqueous solution) in which a silver-containing material composed of 2% by mass was dispersed was used. 2-4) was obtained.

(Comparative Example 1)
When preparing the treatment liquid, four composite molded members (test piece 3-1 to test piece 3) were prepared in the same manner as in Example 1 except that the second aqueous solution was not used and the first aqueous solution was used. -4) was obtained.

(Test Example 1) Observation of metal plate after pretreatment process The metal plate after the pretreatment process in Examples 1 and 2 was observed using a scanning electron microscope. The results are shown in FIGS. 6 to 11. As shown in these figures, the adhesion of the silver-containing material was confirmed on the metal plate.

(Test Example 2) Tensile Test Regarding the composite molded members (test piece 1-1 to test piece 3-4) manufactured according to Example 1 and Example 2 and the comparative example, a tensile tester ("MODEL-1840M" manufactured by Aiko Engineering Co., Ltd.) was used. )) was used for the tensile test. The maximum value of the tensile force obtained by the test of each test piece was defined as the strength (unit: N) of the test piece. The results are shown below.

(Example 1)
Test piece 1-1:20N
Test piece 1-2: The metal part and the molded resin part were separated when set in the tester.
Test piece 1-3: 28N
Test piece 1-4:50N

(Example 2)
Test piece 2-1: 63N
Test piece 2-2:27N
In the test piece 2-3:93N, the deformation of the molded resin portion became remarkable.
Test piece 2-4:24N

(Comparative example)
Test piece 3-1: The metal part and the molded resin part were separated when set in the tester.
Test piece 3-2:4N
Test piece 3-3: The metal part and the molded resin part were separated when set in the tester.
Test piece 3-4: 6N

As is clear from the above results, the bonding strength of the bonded portion of the composite molded member can be increased by using the treatment liquid in the pretreatment step that contains n-TES and the silver-containing material.

DESCRIPTION OF SYMBOLS 10 Composite molding member BR joining part 20 Metal part 20A Part located in the joining part in the metal part 20 30 Molding resin part 30A Part located in the joining part in the resin molding part 30R Molding material 40 Mold 40C Cavity

Claims (15)

A composite molded member comprising a metal part and a molded resin part,
A joining portion where the metal portion and the molding resin portion are joined,
A silver-containing material having a shortest axial length of 1 μm or less and a thiol group-containing silane coupling agent are present between a portion of the metal portion located at the joining portion and a portion of the molding resin portion located at the joining portion. Then
The composite molded member, wherein the surface of the metal portion located at the joint portion includes a portion made of one or more selected from the group consisting of stainless steel, nickel plating, and chromium plating . A composite molded member comprising a metal part and a molded resin part,
A joining portion where the metal portion and the molding resin portion are joined,
A silver-containing material having a shortest axial length of 1 μm or less and a thiol group-containing silane coupling agent are present between a portion of the metal portion located at the joining portion and a portion of the molding resin portion located at the joining portion. Then
It faces of the metal parts located in the joint portion is the surface sulfuration prevention processing has been performed
A composite molded member. The composite molded member according to claim 1 or 2 , wherein the material forming the molded resin portion contains polyamide . The method of manufacturing the composite molded member Ru comprising a bonding portion for bonding with the molded resin portion and the metal portion and a a molded resin portion metal part,
By immersing the metal part in a liquid containing a silver-containing material and a thiol group-containing silane coupling agent , the shortest axial length of the silver-containing material is 1 μm or less on the surface of the part of the metal part to be the joint part. And a pretreatment step of supplying a thiol group-containing silane coupling agent to form a pretreatment layer,
A molding step of arranging the metal part that has undergone the pretreatment step in a mold and supplying/molding a molding material into the mold to obtain the composite molding member having the joint portion. Manufacturing method. The composite molded member according to claim 4 , wherein the surface on which the pretreatment layer is formed in the pretreatment step includes a portion made of one or more selected from the group consisting of stainless steel, nickel plating, and chrome plating. Production method. The method for producing a composite molded member according to claim 4 or 5 , wherein the surface on which the pretreatment layer is formed in the pretreatment step includes a portion subjected to a sulfidation prevention treatment. The method for producing a composite molded member according to any one of claims 4 to 6, wherein the silver-containing material includes a granular body having a ratio of the longest axial length to the shortest axial length of 2 or less. The method for producing a composite molded member according to claim 4 , wherein the silver-containing material includes a linear body having a ratio of the longest axial length to the shortest axial length of 5 or more. The method for producing a composite molded member according to any one of claims 4 to 8, wherein the thiol group-containing silane coupling agent has a triazine skeleton. The method for producing a composite molded member according to any one of claims 4 to 9, wherein the thiol group-containing silane coupling agent is anionized in at least one thiol group. The method for producing a composite molded member according to any one of claims 4 to 10, wherein the molding material contains polyamide. An electronic/electrical component comprising the composite molded member according to any one of claims 1 to 3 . An electronic/electrical device comprising the electronic/electrical component according to claim 12 . A method for manufacturing an electronic/electrical component, comprising a composite molded member manufactured by the method for manufacturing a composite molded member according to any one of claims 4 to 11 . A method of manufacturing an electronic/electrical device, comprising the electronic/electrical part manufactured by the method of manufacturing an electronic/electrical part according to claim 14 .