JP6736643B2 - Multi-row lead frame, multi-row LED lead frame, manufacturing method thereof, and LED package manufacturing method - Google Patents

Description

The present invention is positioned a first strip-like region having blocks in which the individual lead frame regions are arranged in a matrix are connected to the connecting portion, at least on both the outer side of the long sides of the first strip region, a second band-like region comprising a frame portion connected to the connecting portion provided in the first strip-like region, with a production of the multi-row leadframe, the leadframe and their preparation and LED package multi-row type LED Regarding the method.

2. Description of the Related Art Conventionally, there is a multi-row lead frame of a type manufactured by etching a metal plate to form a predetermined lead frame shape from the metal plate and performing necessary plating.

In the manufacture of this type of multi-row lead frame, for example, dry film resists are attached to both front and back surfaces of a metal plate, exposed using a mask with a predetermined pattern formed, and developed to develop both front and back surfaces of the metal plate. The resist mask for etching is formed on the metal plate, and the metal plate is formed into the desired lead frame shape by the etching process.After that, the resist mask for etching formed on both front and back surfaces of the metal plate is removed, and the plating process is performed. The same plating layer is formed on the entire surface of the metal plate formed in the shape. Further, in the production of the LED lead frame used for the production of the LED package product, the reflector may be subsequently used to form the reflector.

By the way, in a method of manufacturing a multi-row lead frame of a type in which a plating layer is formed on the entire surface of a lead frame, a portion other than a lead portion for wire bonding with a pad portion for mounting a semiconductor element or an electrode of the semiconductor element (for example, a connecting portion for each of the lead frame area located outside the side of at least both of the long sides of the first strip-like region having blocks arranged with the connecting portion in a matrix, included in the first band-like region to become the pad portion and the lead portion as well as the plating layer in the second band-like region) that Do from the frame part to be connected is formed, the reflection characteristics and the conductive properties required for the surface of the pad portion and the lead portion There is a problem that the amount of the noble metal forming the outermost plating layer for increasing the amount used increases and the cost increases. Unlike the pad portion and the lead portion, the second strip-shaped region does not need to have a reflection characteristic or a conductive characteristic. Therefore, since the noble metal forming the outermost plating layer is used in such a second strip-shaped region, useless cost increases.

However, conventionally, as a technique for reducing the amount of the noble metal used as the plating layer when manufacturing a lead frame for a multi-row LED, there is, for example, one described in Patent Document 1 below.

In the manufacturing method of a lead frame for a multi-row LED, the one described in Patent Document 1 forms a resist plate for etching on both front and back surfaces of a metal plate and performs etching to form the metal plate into a predetermined lead frame shape. After that, by forming a noble metal plating layer on the front and back of the metal plate with different currents, it has been proposed to reduce the thickness of the plating layer on the back side compared to the plating layer on the front side having the LED element mounting region. There is.

JP, 2016-181733, A

However, by forming the noble metal plating layer on the front and back sides of the metal plate described in Patent Document 1 by different currents, the thickness of the back surface side plating layer is made thinner than the front surface side plating layer having the LED element mounting region. In the technology, in the plating layer on the front surface side having the LED element mounting area, the amount of precious metal constituting the outermost plating layer for providing the reflection characteristics of portions other than the pad portion and the lead portion is increased, resulting in high cost. We cannot solve the problem of becoming. Further, in the technique described in Patent Document 1, located outside the side of at least both of the long sides of the first strip-like region having a block in which individual lead frame regions are arranged are connected in a matrix form, first reduction room for precious metal plating layer formed on the second strip-like region that Do from the frame part to be connected to the connection portion provided in the strip-like regions of are left.

The second strip-shaped region is located outside the first strip-shaped region having the block of the lead frame region. However, since the electrodeposition plating has a characteristic that the plating thickness near the outer periphery of the structure is likely to be large, the second strip-shaped region is likely to be thick. As a result, in the production of the multi-row lead frame, when the noble metal plating is applied to the outermost layer, the useless cost of using the noble metal forming the outermost plated layer formed in the second strip-shaped region is reduced. Easy to grow.
Further, when the plating thickness of the second strip-shaped region becomes thicker than the plating thickness of the first strip-shaped region having the blocks in which the individual lead frame regions are arranged in a matrix, the LED leads used in the manufacture of the LED package product. In the case of manufacturing a frame, when the resin forming die is clamped on the metal plate in the reflector forming step, the surface of the pad portion and the lead portion on the front surface side of the individual lead frame regions provided in the first strip-shaped region and the die There is a risk of creating a gap between Then, burrs of the reflector resin occur along the gaps where the plating thickness of the pad portion and the lead portion on the front surface side in each lead frame region provided in the first strip-shaped region becomes thinner than the plating thickness of the second strip-shaped region. Cover part of the surface of the pad portion on the front side on which the LED element is mounted and the surface of the lead portion, which functions as a reflection surface in each lead frame area, and adversely affects the LED package incorporating the LED element such as a decrease in brightness. May affect.

The present invention, such has been made in view of the problems, as much as possible to reduce the cost by reducing the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible, and, in the manufacture of the LED package products When manufacturing a lead frame for an LED to be used, it is a multi-row type capable of preventing the occurrence of burrs of the reflector resin and keeping the functions of the pad portion on the front surface on which the LED element is mounted and the reflection surface of the lead portion excellent. An object of the present invention is to provide a lead frame, a multi-row LED lead frame, manufacturing methods thereof, and an LED package manufacturing method.

To achieve the above object, a multi-row lead frame according to the present invention includes a first strip-shaped region having blocks in which individual lead frame regions are connected to a connecting portion and arranged in a matrix, and the first strip-shaped region. At least both located outside the side of the long side, multi-row leadframe odor with a second strip-like region comprising a frame portion connected to said connecting portion provided in the strip-like regions of the first, the strip-like region of A laminated plating layer formed by electrolytic processing on the entire front and back surfaces and side surfaces of the metal plate forming the lead frame base material, with the same metal combination and stacking order, and the outermost plating layer being a noble metal plating layer. In the laminated plating layer on the front surface side on which the semiconductor element is mounted , the thickness of the noble metal plating layer of the outermost layer formed in the entire area of the second strip-shaped area is the entire area of the first strip-shaped area. The laminated plating layer on the back surface side that is thinner than the thickness of the formed noble metal plated layer of the outermost layer and is connected to the outside is the noble metal plated layer of the outermost layer formed over the entire second strip-shaped region. The thickness is smaller than the thickness of the noble metal plating layer of the outermost layer formed on the entire area of the first strip-shaped region, and is formed on the entire area of the second strip-shaped area on each of the front surface side and the back surface side. The thickness of the laminated plating layer formed is smaller than the thickness of the laminated plating layer formed over the entire area of the first strip-shaped region.

Further, the multi-row lead frame according to the present invention includes a first strip-shaped region having blocks in which individual lead frame regions are connected to a connecting portion and arranged in a matrix, and at least both of the first strip-shaped region . located outside the side of the long side, and the second band-like region comprising a frame portion connected to the first of the connecting portions provided in the strip-like regions, Te multi-row leadframe odor with a lead frame base material Formed on both the front and back sides and the entire side surface of the eggplant metal plate, the combination of metals formed by electrolytic processing and the stacking order are the same, and the outermost plating layer has a laminated plating layer consisting of a noble metal plating layer. The plating layers other than the noble metal plating layer of the outermost layer in the layer have the same thickness over the entire surface of the metal plate, and the outermost layer of the outermost layer formed on the entire surface of the first strip-shaped region on the front surface side of the metal plate. The noble metal plating layer and the noble metal plating layer of the outermost layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate have the same thickness, and each of the front surface side and the back surface side, The thickness of the outermost noble metal plating layer formed over the entire second strip-shaped region is smaller than the thickness of the outermost noble metal plating layer formed over the entire first strip-shaped region, and the thickness of the formed whole area of the second strip-like region of the back side outermost layer of the noble metal plating layer, the outermost layer of the precious metal plating layer formed on the entire area of the second strip-like region of said surface side It is characterized by having the same thickness.

Further, in the multi-row lead frame of the present invention, the laminated plating layer is preferably a plating layer formed in the order of Ni/Pd/Au/Ag.

Further, in the multi-row lead frame of the present invention, the laminated plating layer is preferably a plated layer formed in the order of Cu/Ag or a laminated plating layer containing Ni.

Further, in the multi-row lead frame of the present invention, the laminated plating layer containing Ni is a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag or Ni/Pd/Au. Is preferred.

Further, in the multi-row lead frame of the present invention, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate is equal to that on the front surface side of the metal plate. When the thickness of the noble metal plating layer of the outermost layer formed over the entire first strip-shaped region is smaller than the thickness of the laminated plating layer formed over the entire second strip-shaped region on the back surface side, It is preferable that the thickness is smaller than the thickness of the laminated plating layer formed over the entire area of the first strip-shaped region on the front surface side.

Also, in the multi-row lead frame of the present invention, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate and the thickness of the front surface side of the metal plate. When the thickness of the noble metal plating layer of the outermost layer formed over the first strip-shaped region is equal, the noble metal plating layer of the outermost layer formed over the entire second strip-shaped region on the back surface side Is preferably equal to the thickness of the outermost noble metal plating layer formed on the entire surface of the second strip-shaped region on the front surface side.

Further, in the multi-row lead frame of the present invention, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate is equal to that on the front surface side of the metal plate. When the thickness of the noble metal plating layer of the outermost layer formed over the entire first strip-shaped region is smaller than the thickness of the laminated plating layer formed over the entire second strip-shaped region on the front surface side, It is preferable that the thickness is smaller than the thickness of the laminated plating layer formed on the entire region of the first strip-shaped region on the back surface side.

In the multi-row lead frame of the present invention, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate is equal to that on the front surface side of the metal plate. If thinner than the thickness of said first strip-like region the outermost layer of the precious metal plating layer formed on the entire area of, forming a first whole area of the strip-like regions of the surface side to perform the semiconductor element mounting and wire bonding of the metal plate With respect to the thickness of the laminated plating layer formed, the thickness of the laminated plating layer formed over the entire first strip-shaped region on the back surface side to be solder-connected to the external device is 50% to 90%, preferably 70% The thickness of the laminated plating layer formed over the entire second strip-shaped area on the side is 26% to 49%, preferably 30%, and the thickness of the laminated plating layer formed over the entire second strip-shaped area on the back surface side. Is 5% to 25%, preferably 20%.

Furthermore, in the multi-row lead frame of the present invention, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate, and the front surface side of the metal plate. When the thickness of the noble metal plating layer of the outermost layer formed over the entire area of the first strip-shaped area is equal to the entire area of the first strip-shaped area on the front surface side and the back surface side, respectively. With respect to the thickness of the noble metal plating layer of the outermost layer, the thickness of the noble metal plating layer of the outermost layer formed in the entire area of the second strip region on the front surface side and the back surface side is 5%. It is good to be 49%, preferably 30%.

A multi-row LED lead frame according to the present invention includes the multi-row lead frame according to any one of the above-mentioned present inventions and a reflector resin portion integrally formed with the multi-row lead frame. , A plurality of recesses formed by an inner side surface formed of the reflector resin portion and the inner bottom surface of the lead frame region exposed from the reflector resin portion.

Further, a method for manufacturing an LED package according to the present invention comprises a step of preparing the multi-row LED lead frame of the present invention, and a step of mounting an LED element in the recess of the multi-row LED lead frame, And a step of obtaining a plurality of LED packages by dividing the multi-row LED lead frame on which the LED elements are mounted into individual pieces.

Further, in the method for manufacturing a multi-row lead frame according to the present invention, the thickness of the noble metal plating layer of the outermost layer formed in the first strip-shaped region on the back surface side of the metal plate is set to the thickness on the front surface side of the metal plate. A first strip-shaped region having blocks in which individual lead frame regions are arranged in a matrix, which is used when making the thickness of the noble metal plating layer of the outermost layer formed in the first strip-shaped region, A method for manufacturing a multi-row lead frame comprising second strip-shaped regions at least on both sides of a long side of the strip-shaped region, wherein individual leads are provided in the first strip-shaped region on both sides of a metal plate that forms a lead frame base material. A step of forming a resist mask for etching corresponding to a predetermined multi-row lead frame shape having a block in which a frame region is arranged in a matrix, and an etching process is performed to form the multi-row lead frame shape on the metal plate. Forming, a step of removing the resist mask on both sides of the metal plate, a step of forming a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing, one surface side of the metal plate , A first shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is disposed, and an outermost noble metal plating layer is formed by electrolytic processing using the first anode. While completing the laminated plating layer on one surface side, a second shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged on the other surface side of the metal plate, Forming the outermost noble metal plating layer by electrolytic processing using a second anode having a surface area different from that of the first anode to complete the laminated plating layer on the other surface side of the metal plate. It has a feature.

Further, the method for manufacturing a multi-row lead frame according to the present invention, the thickness of the noble metal plating layer of the outermost layer formed in the first strip-shaped region on the back surface side of the metal plate, and the thickness of the front surface side of the metal plate A first strip-shaped region having blocks in which individual lead frame regions are arranged in a matrix, which is used when the thickness of the noble metal plating layer of the outermost layer formed in the first strip-shaped region is made equal; A method for manufacturing a multi-row lead frame having second strip-shaped regions on at least both sides of a long side of the strip-shaped region, the method comprising: A step of forming a resist mask for etching corresponding to a predetermined multi-row lead frame shape having blocks in which lead frame regions are arranged in a matrix, and an etching process for forming the multi-row lead frame on the metal plate. A step of forming a shape, a step of removing the resist masks on both sides of the metal plate, a step of forming a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing, and one surface of the metal plate On the side, a first shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged, and an outermost noble metal plating layer is formed by electrolytic processing using the first anode, Completing the laminated plating layer on one surface side of the plate, and disposing a second shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region on the other surface side of the metal plate, The outermost noble metal plating layer is formed by electrolytic processing using the second anode having the same surface area and the same distance from the metal plate as the first anode to complete the laminated plating layer on the other surface side of the metal plate. And a process.

According to the present invention, the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible reduced as much as possible reduce the cost, and, in the case of manufacturing a lead frame for an LED used in the production of the LED package products, A multi-row lead frame, a multi-row LED lead frame and a multi-row LED lead frame capable of preventing the burr generation of the reflector resin and favorably maintaining the functions of the pad portion and the lead portion on the front surface side on which the LED elements are mounted. A manufacturing method thereof and an LED package manufacturing method can be obtained.

FIG. 2 is an explanatory view schematically showing an example of a multi-row lead frame according to the first embodiment of the present invention, (a) is a plan view, and (b) is a schematic view showing a main part of (a). It is an expanded sectional view. FIG. 2 is an explanatory view schematically showing an example of a pattern of a lead frame region in the multi-row lead frame of FIG. 1, (a) is a partial plan view, and (b) is a schematic view showing a main part of (a). Sectional view B, (c) is a partially enlarged view of (b). FIG. 6 is an explanatory diagram showing an example of a manufacturing process of the multi-row lead frame in FIG. 2. 3A and 3B are explanatory views of forming the outermost noble metal plating layer by electrolytic processing in the manufacturing process of FIG. 3, and FIG. 3A is a view of the arrangement of the anode and the shield plate with respect to the lead frame-shaped metal plate viewed from the short side direction of the metal plate. Sectional drawing, (b) is a plan view showing the arrangement of the shielding plate to the metal plate of (a). It is explanatory drawing which shows schematically an example of the multi-row lead frame which concerns on 2nd Embodiment of this invention, (a) is a top view, (b) is CC which shows the principal part of (a) typically. It is an expanded sectional view. FIG. 6 is an explanatory view schematically showing an example of a pattern of a lead frame area in the multi-row lead frame of FIG. 5, (a) is a partial plan view, and (b) is a schematic view showing a main part of (a). Sectional view D, (c) is a partially enlarged view of (b). It is explanatory drawing which shows an example of the manufacturing process of the multi-row lead frame of FIG. FIG. 7 is an explanatory view of forming the outermost noble metal plating layer by electrolytic processing in the manufacturing process of FIG. 7, and (a) shows the arrangement of the anode and the shielding plate with respect to the lead frame-shaped metal plate as viewed from the short side direction of the metal plate. Sectional drawing, (b) is a plan view showing the arrangement of the shielding plate to the metal plate of (a). FIG. 6 is an explanatory diagram showing an example of a manufacturing process of an LED package using the multi-row lead frame manufactured by the multi-row lead frame manufacturing process according to each embodiment of the present invention. FIG. 6 is an explanatory view schematically showing an example of a multi-row lead frame according to another embodiment of the present invention, (a) is a plan view, (b) is a schematic view showing an example of a main part of (a) -E enlarged sectional view, (c) is an EE enlarged sectional view which shows typically the other example of the principal part of (a). FIG. 3 is an explanatory view schematically showing an example of a multi-row lead frame according to still another embodiment of the present invention, where (a) is a plan view and (b) is an example of a main part of (a). FIG. 6C is an enlarged FF sectional view, and FIG. 6C is an enlarged FF sectional view schematically showing another example of the main part of FIG.

Prior to the description of the embodiments, the effects of the present invention will be described.

In the multi-row lead frame according to the first aspect of the present invention, at least a first strip-shaped region having blocks in which individual lead frame regions are connected to a connecting portion and arranged in a matrix, and at least the first strip-shaped region located outside the side of both long sides, and a second strip-like region comprising a frame portion connected to the connecting portion provided in the first strip-like region, Te multi-row leadframe odor with a lead frame base material Formed by electrolytic processing, the combination of metals and the order of lamination are the same, the outermost plating layer has a laminated plating layer consisting of a noble metal plating layer, and the semiconductor element The thickness of the outermost noble metal plating layer formed in the entire second strip-shaped region is equal to the thickness of the outermost noble metal plating layer formed in the entire first strip-shaped region in the laminated plating layer on the front surface side. In the laminated plating layer on the back surface side which is thinner than that of the above , the thickness of the noble metal plating layer of the outermost layer formed in the entire second strip-shaped region is the maximum thickness formed in the entire first strip-shaped region. thinner than the thickness of the surface layer of the noble metal plating layer, the surface side, the people back side of the husband, the thickness of the laminated plating layer formed on the whole area of the second strip-like region is formed in the entire area of the first strip region The structure is thinner than the thickness of the laminated plating layer.
The first multi-row leadframe in the form of the invention, the thickness of the back side first outermost layer of the noble metal plating layer formed on the whole area of the strip-like regions of the metallic plate, the surface side of the metallic plate it is suitable for thin multi-row leadframe than the thickness of the outermost layer of the precious metal plating layer formed on the whole area of the first strip region.

As in the first multi-row leadframe in the form of the present invention, a laminated plating layer on the surface side for mounting the semiconductor element, the thickness of the outermost layer of the precious metal plating layer formed on the whole area of the second strip-shaped regions The laminated plating layer on the back surface side that is connected to the outside and is thinner than the thickness of the noble metal plating layer of the outermost layer formed over the entire first strip-shaped region is the outermost layer formed over the entire second strip-shaped region. the thickness of the precious metal plating layer is thinner than the thickness of the first strip-like region uppermost layer of the precious metal plating layer formed on the entire surface side, the back side of each, formed on the entire area of the second strip-shaped regions If the thickness of the laminated plating layer formed is thinner than the thickness of the laminated plating layer formed over the entire first strip-shaped region , the reflection characteristics and the conductive characteristics required for the surface of the pad portion and the lead portion are obtained. It is possible to significantly reduce the amount of the noble metal that constitutes the outermost plating layer for providing the above. The thickness of the laminated plating layer formed over the entire first strip-shaped region on the back surface side is smaller than the thickness of the laminated plating layer formed over the entire first strip-shaped region on the front surface side. in, to reduce the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible, so the cost to be reduced as much as possible.

Further, as in the multi-row lead frame of the first embodiment of the present invention, the thickness of the laminated plating layer formed over the entire second strip-shaped region on each of the front surface side and the back surface side is the first strip-shaped area. If the structure is thinner than the thickness of the laminated plating layer formed over the entire area , the resin forming mold is used in the reflector forming step in the case of manufacturing the multi-row LED lead frame used for manufacturing the LED package product. When clamped on a metal plate, there is no possibility that a gap will occur between the surface of the pad portion and the surface of the lead portion in the individual lead frame regions provided in the first strip-shaped region and the resin forming mold, Burrs of the reflector resin do not occur on the pad portion and the lead portion side on the front surface side in the frame region. As a result, there is no possibility that the burr of the reflector resin may cover the pad portion on the front surface side on which the LED element is mounted and part of the surface of the lead portion, and may adversely affect the LED package incorporating the LED element such as a decrease in brightness. It is possible to favorably maintain the functions of the pad portion and the lead portion on the front surface side on which the element is mounted as the reflecting surface.

In the multi-row lead frame according to the first aspect of the present invention, preferably, the laminated plating layer is composed of plating layers formed in the order of Ni/Pd/Au/Ag. Further, preferably, the laminated plating layer is formed of a Cu/Ag plated layer or a Ni-containing laminated plating layer. Further, preferably, the Ni-containing laminated plating layer is composed of a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag or Ni/Pd/Au.
Further, in the multi-row lead frame of the first aspect of the present invention, preferably, the thickness of the laminated plating layer formed over the entire second strip-shaped region on the back surface side is equal to the first strip-shaped region on the front surface side. The thickness is thinner than the thickness of the laminated plating layer formed over the entire area .
In the multi-row lead frame according to the first aspect of the present invention, preferably, the thickness of the laminated plating layer formed over the entire second strip-shaped region on the front surface side is equal to the first strip-shaped region on the back surface side. The thickness is thinner than the thickness of the laminated plating layer formed over the entire area .

In the multi-row lead frame according to the first embodiment of the present invention, blocks in which individual lead frame regions are arranged in a matrix in the first strip-shaped region are formed on both surfaces of the metal plate that forms the lead frame base material. A step of forming a resist mask for etching corresponding to a predetermined multi-row lead frame shape, a step of performing etching processing to form a multi-row lead frame shape on a metal plate, and a resist mask on both sides of the metal plate A step of removing a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing, and a step of shielding only a predetermined portion corresponding to the second strip-shaped region on one surface side of the metal plate. 1 shield plate is arranged, the outermost noble metal plating layer is formed by electrolytic processing using the first anode to complete the laminated plating layer on one surface side of the metal plate, and the other of the metal plate A second shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged on the surface side, and the noble metal of the outermost layer is formed by electrolytic processing using a second anode having a surface area different from that of the first anode. And a step of forming a plating layer to complete the laminated plating layer on the other surface side of the metal plate.

The multi-row lead frame according to the first embodiment of the present invention includes a multi-row lead frame and a reflector resin portion that is formed integrally with the multi-row lead frame, and the inner surface of the reflector resin portion and the lead frame region are provided on the upper surface side. Can be configured as a multi-row LED lead frame having a plurality of recesses formed by the inner bottom surface exposed from the reflector resin portion.

The LED package according to the first aspect of the present invention includes a step of preparing the multi-row LED lead frame according to the first aspect of the present invention, and an LED element in the recess of the multi-row LED lead frame. It can be manufactured by including a step of mounting and a step of dividing the multi-row LED lead frame on which the LED elements are mounted into individual pieces to obtain a plurality of LED packages.

Therefore, according to the first embodiment of the present invention, as much as possible to reduce the cost by reducing the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible, and, LED lead used in the manufacture of the LED package products When manufacturing a frame, a multi-row lead frame capable of preventing the occurrence of burrs of the reflector resin and keeping the functions of the pad portion and the lead portion on the front surface on which the LED element is mounted as the reflecting surface in good condition, A lead frame for a row type LED, a manufacturing method thereof, and a manufacturing method of an LED package are obtained.

In the multi-row lead frame according to the second aspect of the present invention, a first strip-shaped region having blocks in which individual lead frame regions are connected to a connecting portion and arranged in a matrix, and a first strip-shaped region are provided. At least both located outside the side of the long side, Te second band-like region and the multi-row leadframe odor with consisting of frame portions connecting the connecting portion provided in the first strip-like region, a lead frame group On the front and back surfaces and the entire side surface of the metal plate forming the material, the combination of metals formed by electrolytic processing and the order of lamination are the same, and the outermost plating layer has a laminated plating layer consisting of a noble metal plating layer. The plating layers other than the noble metal plating layer on the outermost surface of the plating layer have the same thickness over the entire surface of the metal plate, and are the same as the noble metal plating layer on the outermost surface formed in the entire first strip-shaped region on the front surface side of the metal plate. , The outermost noble metal plating layer formed over the entire area of the first strip-shaped area on the back surface side of the metal plate has the same thickness, and is formed over the entire area of the second strip-shaped area on the front surface side and the back surface side, respectively. has been the thickness of the outermost layer of the noble metal plating layer is thinner than the thickness of the outermost layer of the precious metal plating layer formed on the whole area of the first strip-like region, which is formed on the entire area of the second strip-like region of the back side The thickness of the noble metal plating layer of the outermost layer is equal to the thickness of the noble metal plating layer of the outermost layer formed over the entire second strip-shaped region on the front surface side.
A multi-row lead frame according to a second mode of the present invention is the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region on the back surface side of the metal plate, and the surface of the metal plate. The present invention can be applied to a multi-row lead frame in which the thickness of the outermost noble metal plating layer formed over the entire first strip-shaped region on the side is equal.

As in the multi-row lead frame of the second embodiment of the present invention, the thickness of the noble metal plating layer of the outermost layer formed over the entire second strip-shaped region on each of the front surface side and the back surface side is If the structure is thinner than the thickness of the noble metal plating layer of the outermost layer formed over the entire band area, the plating of the outermost layer is required to give the reflection and conductive characteristics required for the pad and lead surfaces. The amount of precious metal constituting the layer can be significantly reduced.

Further, as in the multi-row lead frame of the second aspect of the present invention, the thickness of the noble metal plating layer of the outermost layer formed on the entire front surface side and the back surface side of the second strip-shaped region is In the case of manufacturing a lead frame for a multi-row LED used for manufacturing an LED package product, a reflector forming step can be performed if the structure is thinner than the thickness of the noble metal plating layer of the outermost layer formed over the entire strip-shaped region of 1. When the resin-forming die is clamped to the metal plate by the above method, a gap may occur between the resin-forming die and the surface of the pad portion and the lead portion on the front surface side in each lead frame region provided in the first strip-shaped region. Therefore, the burr of the reflector resin does not occur on the pad portion on the front surface side and the lead portion side in each lead frame region. As a result, there is no possibility that the burr of the reflector resin may cover the pad portion on the front surface side on which the LED element is mounted and part of the surface of the lead portion, and may adversely affect the LED package incorporating the LED element such as a decrease in brightness. It is possible to favorably maintain the functions of the pad portion and the lead portion on the front surface side on which the element is mounted as the reflecting surface.

In the multi-row lead frame of the second aspect of the present invention, preferably, the laminated plating layer is composed of plating layers formed in the order of Ni/Pd/Au/Ag. Further, preferably, the laminated plating layer is formed of a Cu/Ag plated layer or a Ni-containing laminated plating layer. Further, preferably, the Ni-containing laminated plating layer is composed of a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag or Ni/Pd/Au.

In the multi-row lead frame according to the second embodiment of the present invention, blocks in which the individual lead frame regions are arranged in a matrix in the first strip-shaped region are formed on both surfaces of the metal plate forming the lead frame base material. A step of forming a resist mask for etching corresponding to a predetermined multi-row lead frame shape, a step of performing etching processing to form a multi-row lead frame shape on a metal plate, and a resist mask on both sides of the metal plate A step of removing a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing, and a step of shielding only a predetermined portion corresponding to the second strip-shaped region on one surface side of the metal plate. 1 shield plate is arranged, the outermost noble metal plating layer is formed by electrolytic processing using the first anode to complete the laminated plating layer on one surface side of the metal plate, and the other of the metal plate On the surface side, a second shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged, and electrolytic processing using the second anode having the same surface area and distance from the metal plate as the first anode is used. And a step of forming the outermost noble metal plating layer to complete the laminated plating layer on the other surface side of the metal plate.

Further, a multi-row lead frame according to a second aspect of the present invention includes a multi-row lead frame and a reflector resin portion that is integrally formed with the multi-row lead frame, and an inner surface formed of the reflector resin portion and a lead frame region on the upper surface side. Can be configured as a multi-row LED lead frame having a plurality of recesses formed by the inner bottom surface exposed from the reflector resin portion.

Moreover, the LED package of the second aspect of the present invention comprises a step of preparing the lead frame for a multi-row LED of the first aspect of the present invention, and an LED element in the recess of the lead frame for a multi-row LED. It can be manufactured by including a step of mounting and a step of dividing the multi-row LED lead frame on which the LED elements are mounted into individual pieces to obtain a plurality of LED packages.

Therefore, according to the second embodiment of the present invention, as much as possible to reduce the cost by reducing the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible, and, LED lead used in the manufacture of the LED package products When manufacturing a frame, a multi-row lead frame capable of preventing the occurrence of burrs of the reflector resin and keeping the functions of the pad portion and the lead portion on the front surface on which the LED element is mounted as the reflecting surface in good condition, A lead frame for a row type LED, a manufacturing method thereof, and a manufacturing method of an LED package are obtained.

Embodiments of a multi-row lead frame and a manufacturing method thereof according to the present invention will be described below with reference to the drawings.

First Embodiment FIG. 1 is an explanatory view schematically showing an example of a multi-row lead frame according to a first embodiment of the present invention. (a) is a plan view, (b) is a main part of (a) It is an AA expanded sectional view which shows typically. 2A and 2B are explanatory views schematically showing an example of a pattern of a lead frame region in the multi-row lead frame of FIG. 1, where FIG. 2A is a partial plan view and FIG. 2B is a schematic view of a main part of FIG. The BB sectional drawing shown, (c) is a partially expanded view of (b). FIG. 3 is an explanatory view showing an example of a manufacturing process of the multi-row lead frame of FIG. FIG. 4 is an explanatory view of forming the outermost noble metal plating layer by electrolytic processing in the manufacturing process of FIG. 3, and (a) is an anode for a lead frame-shaped metal plate on which a plating layer other than the outermost layer is formed, FIG. 6 is a cross-sectional view of the arrangement of the shielding plate viewed from the short side direction of the metal plate, and FIG. 6B is a plan view showing the arrangement of the shielding plate with respect to the metal plate of FIG.
In the drawings of each embodiment of the present invention, the thickness of the plating layer is shown to be larger than the thickness of the metal plate that forms the lead frame base material, and the thickness of the metal plate that forms the lead frame base material Is the same in each part and is shown in a plane. The pattern of the lead frame area in the lead frame applied to each embodiment of the present invention is not limited to that shown in the drawing, and may be any pattern. Further, for example, a configuration may be adopted in which a recessed portion for improving the adhesion with the reflector resin is provided on the outer edge portion of the metal plate forming the lead frame base material in the pad portion or the lead portion shown below, or the connecting portion. The thickness of the metal plate forming the lead frame base material may be smaller than the thickness of the metal plate forming the lead frame base material in the pad portion or the lead portion.

The multi-row lead frame 1 of the first embodiment includes a first strip-shaped region 1-A and a second strip-shaped region 1-B, as shown in FIGS. 1(a) and 1(b). There is.
The first strip-shaped region 1-A is, for example, as shown in FIG. 2A, each lead frame region 1n having a pad portion 11 and a lead portion 12 (in FIG. (Corresponding to the package outline line indicated by the rectangle) corresponds to the connecting portion 13 and has blocks arranged in a matrix. In the example of FIG. 2A, a connecting portion 13 including a suspension lead and a dam bar is provided between the individual lead frame regions 1n. Further, a frame portion 2 is provided on the outer periphery of the block of the lead frame area 1n arranged in a matrix.
The second strip-like region 1-B, as shown in FIG. 1 (a), located outside the side of the long sides of both of the first strip-like region 1-A.
Then, in the multi-row lead frame 1 of the example of FIG. 1, the first strip-shaped region 1-A includes the block of the lead frame region 1n and the frame portion 2 positioned in the direction along the short side of the lead frame base material. a second strip-like region 1-B had only a frame portion 2 positioned in the direction along the long sides of the first strip-like region 1-a both long sides outer side of the lead frame substrate of It is composed.
In the example of FIG. 1, the blocks of the lead frame area 1n are arranged in a plurality of columns in the long side direction and one row in the short side direction of the lead frame base material. 1 is not limited to the example of FIG. 1, and for example, the blocks of the lead frame region 1n are arranged in a plurality of columns in the long side direction and a plurality of rows in the short side direction of the lead frame base material. May be.
In the case of a multi-row lead frame in which the blocks of the lead frame region 1n are arranged in a plurality of columns in the long side direction and a plurality of rows in the short side direction of the lead frame base material, the first strip-shaped region 1-A is the lead frame. The block of the region 1n, the frame portion 2 located in the direction along the short side of the lead frame base material, and the block portion of the lead frame region 1n located adjacent to each other in the direction along the long side of the lead frame base material. has a frame portion 2, the second strip-like region 1-B is a frame portion 2 positioned in a direction along the long sides of the outer side of the lead frame base material for both the long sides of the first strip-like region 1-a It has a structure having only.
In addition, the multi-row lead frame 1 of the present embodiment, as shown in FIG. 1(b), FIG. 2(b), and FIG. 2(c), has front and back surfaces and side surfaces of the metal plate 10 that forms the lead frame base material. Over the entire surface, the combination of metals and the stacking order formed by electrolytic processing are the same, and the outermost plating layer has stacked plating layers A1, A2, A3, and A4 that are noble metal plating layers. In the present embodiment, the laminated plating layers A1, A2, A3, A4 are composed of plating layers formed in the order of Ni/Pd/Au/Ag. The laminated plating layers A1, A2, A3, and A4 may be plated layers formed in the order of Cu/Ag or laminated plating layers containing Ni, in addition to the above configuration. The laminated plating layer containing Ni can be, for example, a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag, or Ni/Pd/Au. The same applies to the second embodiment described later.

The laminated plating layer A1 is formed on the entire surface of the first strip-shaped region 1-A on the front surface side on which the semiconductor element is mounted.
The laminated plating layer A2 is formed on the entire surface of the second strip-shaped region 1-B on the front surface side on which the semiconductor element is mounted.
The laminated plating layer A3 is formed on the entire surface of the first strip-shaped area 1-A on the back surface side that is connected to the outside.
The laminated plating layer A4 is formed on the entire surface of the second strip-shaped area 1-B on the back surface side that is connected to the outside.
The thickness of the outermost noble metal plating layer is different between the laminated plating layer A1 and the laminated plating layer A2 on the surface side on which the semiconductor element is mounted.
Further, the laminated plating layer A3 and the laminated plating layer A4 on the back surface side that are connected to the outside are different in the thickness of the noble metal plating layer of the outermost layer.
The thickness of the laminated plating layer A2 is smaller than that of the laminated plating layer A1, and the thickness of the laminated plating layer A4 is smaller than that of the laminated plating layer A3.
That is, the thickness of the noble metal plating layer of the outermost layer formed on the entire surface of the second strip-shaped region 1-B on each of the front surface and the back surface is equal to the entire thickness of the first strip-shaped region 1-A . The thickness is smaller than the thickness of the noble metal plating layer which is the outermost layer formed on the surface.
Then, in the multi-row lead frame 1 of the present embodiment, the thickness of the laminated plating layer A1 formed over the entire first strip-shaped region 1-A on the surface side where the semiconductor element is mounted on the metal plate 10 and wire bonding is performed. On the other hand, the thickness of the laminated plating layer A3 formed over the entire area of the first strip-shaped area 1-A on the back surface side that is connected to the external device by soldering is 50% to 90%, preferably 70%, and The thickness of the laminated plating layer A2 formed on the entire region of the second strip-shaped region 1-B is 26% to 49%, preferably 30%, and the laminate formed on the entire region of the second strip-shaped region 1-B on the back surface side. The thickness of the plating layer A4 is 5% to 25%, preferably 20%. The laminated plating layer A3 may be thicker than the laminated plating layer A1 and the laminated plating layer A4 may be thicker than the laminated plating layer A2.
In the example of FIG. 2, the multi-row lead frame 1 of the present embodiment is configured as a multi-row LED lead frame for use in manufacturing an LED package product, and is shaded in FIG. 2(a). The reflector resin portion 15 is formed in the hatched area.

The multi-row lead frame 1 of the first embodiment thus configured can be manufactured as follows. In addition, here, for convenience, the manufacture of a multi-row lead frame in which the lead frame region is designed in the pattern shown in FIG. 2 will be described.
A metal plate 10 which is a lead frame base material made of a copper alloy or a nickel alloy is prepared (see FIG. 3A). Next, resist layers R1 are formed on both surfaces of the lead frame base material 10 (see FIG. 3B). Next, the pad portion to the first strip-like region, the lead portion, the connecting portion, have a frame part, the pad portion, each of the lead frame area that have a lead portion are arranged with the connecting portion in a matrix The resist layers R1 on both sides are exposed and developed using a glass mask having a pattern corresponding to a predetermined multi-row lead frame shape having blocks, and a resist mask 30 for etching is formed (FIG. 3( See c)). Next, subjected to etching from both sides, the pad portion 11 to the metal plate 10, lead portions 12, connecting portions 13, have a frame part 2, the pad portions 11, each of the lead frame area connected to have a lead portion 12 A predetermined multi-row lead frame shape having blocks connected to the portion 13 and arranged in a matrix is formed (see FIG. 3D), and the resist mask 30 for etching is removed after etching (FIG. 3). (See (e)). The multi-row lead frame shape may be formed by a pressing process other than the etching process.
Next, in the plating tank, a predetermined electrolytic processing is performed on the entire surface of the metal plate 10 formed in a lead frame shape (here, no shielding plate is arranged on both front and back surface sides of the metal plate 10, and the surface area and metal are A predetermined plating layer is formed by electrolytic processing in which anodes having the same distance from the plate 10 are arranged on both sides of the metal plate 10. Here, a Ni plating layer, a Pd plating layer, and an Au plating layer are sequentially formed.
Next, in the plating tank, on one surface side (here, the front surface side) of the metal plate 10, a first shield plate 35 that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B. Are arranged (see FIGS. 4(a) and 4(b)), electrolytic processing is performed using the first anode 37 to form a noble metal plating layer (here, Ag plating layer) of the outermost layer, and The laminated plating layers A1 and A2 on one surface side of the plate 10 are completed. At the same time, a second shield plate 36 that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B is arranged on the other surface side (here, the rear surface side) of the metal plate 10 ( 4(a) and 4(b)), a noble metal plating layer (the outermost layer) formed by electrolytic processing using a second anode 38 having a surface area different from that of the first anode 37 (here, a small surface area). Here, an Ag plating layer) is formed to complete the laminated plating layers A3 and A4 on the other surface side of the metal plate 10.
As a result, in the laminated plating layers A1 and A2 on the front surface side on which the LED elements are mounted , the thickness of the noble metal plating layer of the outermost layer formed over the entire second strip-shaped region 1-B is the same as that of the first strip-shaped region 1-. The laminated plating layers A3, A4 on the back surface side , which are thinner than the thickness of the noble metal plating layer of the outermost layer formed on A and are connected to the outside, are the outermost layers formed on the entire second strip-shaped region 1-B. The thickness of the noble metal plating layer is smaller than the thickness of the noble metal plating layer of the outermost layer formed over the entire first strip-shaped region 1-A , and the second strip-shaped region 1- The thickness of the laminated plating layers A2, A4 formed in the entire area of B is thinner than the thickness of the laminated plating layers A1, A3 formed in the entire area of the first strip-shaped region 1-A. A lead frame is obtained (see FIG. 3(f)). In addition, the laminated plating layers A1 and A2 on the front surface side on which the LED elements are mounted include a frame portion 2 located in the direction along the short side of the multi-row lead frame 1 and a frame portion 2 located in the direction along the long side. Then, the thickness of the noble metal plating layer of the outermost layer is different, and the thickness of the laminated plating layer of the frame portion 2 located in the direction along the short side is greater than the thickness of the laminated plating layer of the frame portion 2 located in the direction along the long side. It's getting thicker. Further, the back surface side laminated plating layers A3 and A4 connected to the outside are composed of a frame portion 2 located in the direction along the short side of the multi-row lead frame 1 and a frame portion 2 located in the direction along the long side. , The thickness of the outermost noble metal plating layer is different, and the thickness of the laminated plating layer of the frame portion 2 located in the direction along the short side is thicker than the thickness of the laminated plating layer of the frame portion 2 located in the direction along the long side. Is becoming
Further, in FIG. 4(b), any cut surface along the short side of the multi-row lead frame and passing through the upper surface of the lead frame region 1n may be the same cut surface.

As described above, the control of the noble metal plating thickness of the outermost layer in the plating process is performed by controlling the first anode 37 on one surface side of the metal plate 10 with respect to the metal plate 10 formed in the lead frame shape serving as the cathode. And the surface area of the second anode 38 on the other surface side of the metal plate 10 are made different according to the desired thickness ratio of the noble metal plating layer of the outermost surface, and one surface side of the metal plate 10 is The second shield plate 36 is disposed on each of the first shield plate 35 and the other surface side of the metal plate 10. The ratio of the thickness of the plating layer is such that the thickness of the laminated plating layer A1 formed over the entire first strip-shaped region 1-A on the front surface side on which the LED elements are mounted on the metal plate 10 and the wire bonding is performed, with respect to the external device. The thickness of the laminated plating layer A3 formed over the entire area of the first strip-shaped region 1-A on the back surface side to be soldered to is 50% to 90%, preferably 70%, and the second strip-shaped region on the front surface side. The thickness of the laminated plating layer A2 formed in the entire area 1-B is 26% to 49%, preferably 30%, and the thickness of the laminated plating layer A4 formed in the entire second strip-shaped area 1-B on the back surface side. The thickness of the outermost noble metal plating layer to be formed may be different so that the thickness becomes 5% to 25%, preferably 20%. The laminated plating layer A3 may be thicker than the laminated plating layer A1 and the laminated plating layer A4 may be thicker than the laminated plating layer A2.

In the control of the noble metal plating thickness of the outermost layer in the plating process shown in FIG. 4, the first and second shield plates 35, 36 are provided for the second strip-shaped region 1-B of the metal plate 10. Are separated by 0.5 mm or more and 20.0 mm or less, and the first and second shielding plates 35 and 36 are seen from the first anode 37 and the second anode 38 at that position. In the state, the width that covers the entire area of the second strip-shaped region 1-B and further extends to the first strip-shaped region 1-A within a range of 0.1 mm or more and 20.0 mm or less than that of the second strip-shaped region 1-B. It is preferable that the arrangement is such that
When the first and second shield plates 35, 36 are brought closer to the second strip-shaped region 1-B of the metal plate 10 by a distance smaller than 0.5 mm, there is a risk that the product may come into contact with and scratch the product. On the other hand, when the first and second shielding plates 35 and 36 are separated by a distance exceeding 20.0 mm, the plating thickness increases and it becomes impossible to obtain an extremely thin state in the second strip-shaped region 1-B.
When the width of the first and second shielding plates 35 and 36 that covers the entire area of the second strip-shaped region 1-B and extends to the first strip-shaped region 1-A is less than 0.1 mm, the second strip The plating thickness of the strip|belt-shaped area|region 1-B will increase. On the other hand, when the widths of the first and second shield plates 35 and 36 that cover the entire second strip-shaped region 1-B and extend to the first strip-shaped region exceed 20.0 mm, the liquid flow in the plating tank is increased. Is easily disturbed, resulting in uneven plating.

Next, a reflector resin is filled between the pad portion 11 and the lead portion 12 and from the vicinity of the outer periphery of the pad portion 11 and the lead portion 12 to the outside to cover the connecting portion 13 and between the pad portion 11 and the lead portion 12. The reflector resin portion 15 which is interposed and surrounds the outer peripheries of the pad portion 11 and the lead portion 12 so as to project above the LED element 20 when mounted on the LED element mounting surface of the pad portion 11 is formed by a molding die. It is formed by using (see FIG. 3(g)). As a result, the lead frame for a multi-row LED including the reflector resin portion is obtained.

According to the multi-row lead frame 1 of the first embodiment, the laminated plating layers A1 and A2 on the front surface side on which the semiconductor element is mounted are the noble metal platings of the outermost layer formed over the entire second strip-shaped region 1-B. The thickness of the layer is smaller than the thickness of the noble metal plating layer of the outermost layer formed in the entire region of the first strip-shaped region 1-A , and the back surface side laminated plating layers A3 and A4 connected to the outside are The thickness of the noble metal plating layer of the outermost layer formed over the entire band-shaped region 1-B is smaller than the thickness of the noble metal plating layer of the outermost layer formed over the entire first band-shaped region 1-A. The thickness of the laminated plating layers A2 and A4 formed on the entire area of the second strip-shaped region 1-B on the back surface side is the thickness of the laminated plating layer formed on the entire area of the first strip-shaped region 1-A. Since the structure is thinner than that of A1 and A3, the characteristics of the pad portion 11 and the lead portion 12 on the front side on which the LED element is mounted are kept good while the characteristics of the pad portion 11 and the lead portion 12 are required. It is possible to significantly reduce the amount of precious metal used as a plating layer for imparting the reflective property and the conductive property. The thickness of the laminated plating layer A3 formed over the entire area of the first strip-shaped area 1-A on the back surface side is the thickness of the laminated plating layer A1 formed over the entire area of the first strip-shaped area 1-A on the front surface side. thin structure and doing, can be reduced as much as possible the cost by reducing the electrodeposition of noble metal constituting the plating layer of the outermost layer as much as possible as compared with.

Further, according to the multi-row lead frame 1 of the present embodiment, the thicknesses of the laminated plating layers A2 and A4 formed on the entire surface of the second strip-shaped region 1-B on the front surface side and the back surface side are Since the thickness of the laminated plating layers A1 and A3 formed over the entire strip-shaped region 1-A of 1 is thinner than that of the laminated plating layers A1 and A3, when manufacturing a multi-row LED lead frame used for manufacturing an LED package product, When the resin forming die is clamped to the metal plate in the reflector forming step, the surface of the pad portion 11 and the lead portion 12 on the front surface side of each lead frame region 1n provided in the first strip-shaped region 1-A and the resin forming metal There is no possibility of forming a gap with the mold, and burr of the reflector resin does not occur on the surface side pad portion 11 and lead portion 12 side in each lead frame region 1n. As a result, there is no possibility that the burr of the reflector resin covers a part of the surface of the pad portion 11 and the lead portion 12 on which the LED element is mounted and adversely affects the LED package in which the LED element is incorporated, such as a decrease in brightness. Therefore, the functions of the pad portion 11 and the lead portion 12 on the front surface side on which the LED element is mounted can be favorably maintained.

Further, as shown in FIG. 1B, when plating is applied to the surface of the rectangular metal plate 10 in cross section, the plating may be thickly formed near the corners. In such a case, for example, when inserting the multi-row lead frame or the multi-row LED lead frame into a magazine that stores the multi-row lead frame, the thick plated portions formed at the corners are missing and The chipped plated portion may be arranged on the frame region 1n. However, according to the multi-row lead frame of the first embodiment of the present invention, the plating thickness in the vicinity of the corners of the metal plate 10 can be reduced, so that an unnecessary plating portion is unintentionally formed on the lead frame region 1n. The possibility of being arranged can be reduced.
In addition, a hole portion (not shown) for fixing to a plating transfer device or a molding die is formed in the frame portion 2 located in the direction along the long side of the multi-row lead frame shown in FIG. 2(a). It may be done. In such a case, by reducing the thickness of the laminated plating layer on the front surface side and the back surface side of the frame portion 2 located in the direction along the long side corresponding to the second strip-shaped region 1-B, It is possible to reduce the possibility of plating burr. Accordingly, when the multi-row lead frame is fixed to the plating transfer device or the like, the positioning accuracy can be improved and fixed.

Second Embodiment FIG. 5 is an explanatory view schematically showing an example of a multi-row lead frame according to a second embodiment of the present invention, where (a) is a plan view and (b) is a main part of (a). It is CC enlarged sectional view which shows typically. 6A and 6B are explanatory views schematically showing an example of a pattern of a lead frame area in the multi-row lead frame of FIG. 5, where FIG. 6A is a partial plan view and FIG. 6B is a schematic view of a main part of FIG. 6D is a sectional view taken along line D-D, and FIG. FIG. 7 is an explanatory view showing an example of a manufacturing process of the multi-row lead frame of FIG. FIG. 8 is an explanatory view of forming the outermost noble metal plating layer by electrolytic processing in the manufacturing process of FIG. 7, and (a) shows the arrangement of the anode and the shielding plate with respect to the lead frame-shaped metal plate on the short side of the metal plate. FIG. 6B is a cross-sectional view seen from the direction, and FIG. 6B is a plan view showing the arrangement of the shielding plate with respect to the metal plate of FIG.

In the multi-row lead frame 1 of the second embodiment, the plating layers other than the noble metal plating layer (here, Ag plating layer) of the outermost layer in the laminated plating layers A1, A2, A3, and A4 shown in FIG. The metal plate 10 shown in FIG. 5(a) has the same thickness over the entire surface.
In addition, the outermost noble metal plating layer formed on the entire surface of the first strip-shaped region 1-A on the front surface side of the metal plate 10 and the entire region of the first strip-shaped region 1-A on the back surface side of the metal plate 10. The outermost noble metal plating layer thus formed has the same thickness.
In addition, the thickness of the outermost noble metal plating layer in the laminated plating layer A2 shown in FIG. 5(b) is smaller than the thickness of the outermost noble metal plating layer in the laminated plating layer A1, The thickness of the noble metal plating layer is equal to the thickness of the outermost noble metal plating layer in the laminated plating layer A2.
That is, the thickness of the noble metal plating layer of the outermost layer formed on the entire surface of the second strip-shaped region 1-B on each of the front surface and the back surface is equal to that of the first strip region 1-A . It is thinner than the thickness of the noble metal plating layer of the outermost layer formed on the entire surface.
In the multi-row lead frame 1 of the present embodiment, the thickness of the outermost noble metal plating layer formed over the entire area of the first strip-shaped region 1-A on the front surface side and the back surface side of the metal plate 10, respectively. On the other hand, the thickness of the noble metal plating layer of the outermost layer formed on the entire area of the second strip-shaped region 1-B on the front surface side and the back surface side is 5% to 49%, preferably 30%. There is.
Further, the multi-row lead frame 1 of the present embodiment is configured as a multi-row LED lead frame for use in manufacturing an LED package product, as shown in FIG. 6(a). ), the reflector resin portion 15 is formed in the hatched area.
Other configurations are substantially the same as the multi-row lead frame of the first embodiment.

The multi-row lead frame 1 of the second embodiment thus configured can be manufactured as follows. Note that, here, for the sake of convenience, manufacturing of a multi-row lead frame in which the lead frame region is designed in the pattern shown in FIG. 6 will be described.
In the manufacture of the multi-row lead frame of the present embodiment, the metal plate 10 is prepared (see FIG. 7A), the resist layer R1 is formed (see FIG. 7B), and the resist mask 30 for etching is formed (see FIG. 7B). 3 (see FIG. 7C), formation of a multi-row lead frame shape by etching (see FIG. 7D), and removal of the resist mask 30 for etching (see FIG. 7E) until FIG. a) to substantially the same as the manufacturing process of the multi-row lead frame of the first embodiment described with reference to FIG. 3E, and the noble metal plating layer of the outermost layer in the subsequent plating layer forming process. The forming method is different from that in the manufacturing of the multi-row lead frame of the first embodiment.
In the step of forming the plating layer in the production of the multi-row lead frame of the second embodiment, first, a predetermined electrolytic processing (here, the metal plate is performed on the entire surface of the metal plate 10 formed in the lead frame shape in the plating tank. A predetermined plating layer is formed on both front and back sides of No. 10 by electrolytic processing in which anodes having the same surface area and the same distance from the metal plate 10 are placed on both front and back sides without disposing shield plates. To do. Here, a Ni plating layer, a Pd plating layer, and an Au plating layer are sequentially formed.
Next, in the plating tank, on one surface side (here, the front surface side) of the metal plate 10, a first shield plate 35 that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B. (FIGS. 8(a) and 8(b)), and electrolytic processing using the first anode 37 is performed to form a noble metal plating layer (here, Ag plating layer) of the outermost layer, and The laminated plating layers A1 and A2 on one surface side of the plate 10 are completed. At the same time, on the other surface side (here, the back surface side) of the metal plate 10, a second shielding plate 36 that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B is provided . Of the first anode 37, the surface area, and the metal plate 10 from the shield plate 35 and the metal plate 10 (L1= L2 ) at the same distance (see FIG. 8(a) and FIG. 8(b)). Of the noble metal plating layer (here, Ag plating layer) is formed by electrolytic processing using the second anode 38 having the same distances L3 and L4, and the laminated plating layer A3 on the other surface side of the metal plate 10 is formed. Complete A4.
Thus, the surface side, the people backside husband, the thickness of the outermost layer of the precious metal plating layer formed on the whole area of the second strip-like region 1-B, which is formed on the whole area of the first strip-like region 1-A The thickness of the noble metal plating layer of the outermost layer, which is thinner than the thickness of the noble metal plating layer of the outermost layer and is formed over the entire second strip-shaped region 1-B on the back surface side, is equal to the thickness of the second strip-shaped region 1 of the front surface side. A multi-row lead frame of the present embodiment having the same thickness as the outermost noble metal plating layer formed over the entire area B can be obtained (see FIG. 7(f)).

As described above, the control of the noble metal plating thickness of the outermost layer in the plating process is performed by controlling the first anode 37 on one surface side of the metal plate 10 with respect to the metal plate 10 formed in the lead frame shape serving as the cathode. And the distance L3 from the metal plate 10 are equal to the surface area of the second anode 38 on the other surface side of the metal plate 10 and the distance L4 from the metal plate 10, and the one surface side of the metal plate 10 is By arranging the first shield plate 35 disposed on the other side of the metal plate 10 and the second shield plate 36 disposed on the other surface side of the metal plate 10 at the same distance (L1= L2 ) from the metal plate 10. To do. As the thickness ratio of the plating layer, the thickness of the noble metal plating layer of the outermost layer formed over the entire first strip-shaped region 1-A on the front surface side on which the LED element mounting on the metal plate 10 and wire bonding are performed, the external device With respect to the thickness of the noble metal plating layer of the outermost layer formed on the entire area of the first strip-shaped region 1-A on the back side on the side to be soldered to the second strip-shaped region 1 on each of the front surface side and the back surface side. The thickness of the noble metal plating layer of the outermost layer to be formed may be different so that the thickness of the noble metal plating layer of the outermost layer formed in the entire region of -B is 5% to 49%, preferably 30%.

In the control of the noble metal plating thickness of the outermost layer in the plating process shown in FIG. 8, the first and second shielding plates 35, 36 are provided for the second strip-shaped region 1-B of the metal plate 10. Are separated by 0.5 mm or more and 20.0 mm or less, and the first and second shielding plates 35 and 36 are seen from the first anode 37 and the second anode 38 at that position. In the state, the width that covers the entire area of the second strip-shaped region 1-B and further extends to the first strip-shaped region 1-A within a range of 0.1 mm or more and 20.0 mm or less than that of the second strip-shaped region 1-B. It is preferable that the arrangement is such that
When the first and second shield plates 35, 36 are brought closer to the second strip-shaped region 1-B of the metal plate 10 by a distance smaller than 0.5 mm, there is a risk that the product may come into contact with and scratch the product. On the other hand, when the first and second shielding plates 35 and 36 are separated by a distance exceeding 20.0 mm, the plating thickness increases and the ultrathin state cannot be obtained in the entire second strip-shaped region 1-B.
When the width of the first and second shielding plates 35 and 36 that covers the entire area of the second strip-shaped region 1-B and extends to the first strip-shaped region 1-A is less than 0.1 mm, the second strip The plating thickness of the strip|belt-shaped area|region 1-B will increase. On the other hand, when the widths of the first and second shield plates 35 and 36 that cover the entire second strip-shaped region 1-B and extend to the first strip-shaped region exceed 20.0 mm, the liquid flow in the plating tank is increased. Is easily disturbed, resulting in uneven plating.
Next, in the same manner as in the first embodiment, the reflector resin portion 15 is formed (see FIG. 7(g)), whereby the multi-row LED lead frame including the reflector resin portion is obtained.

According to the multi-row lead frame 1 of the second embodiment, the thickness of the outermost noble metal plating layer formed over the entire second strip-shaped region 1-B on the front surface side and the back surface side is the first Since the thickness is smaller than the thickness of the noble metal plating layer of the outermost layer formed in the entire strip-shaped region 1-A , the characteristics as the reflecting surface of the pad portion 11 and the lead portion 12 on the surface side on which the LED element is mounted It is possible to significantly reduce the amount of precious metal used while maintaining good performance.

Further, according to the multi-row lead frame 1 of the present embodiment, the thickness of the outermost noble metal plating layer formed over the entire second strip-shaped region 1-B on each of the front surface side and the back surface side is In the case of manufacturing a multi-row LED lead frame used for manufacturing an LED package product, since the thickness is smaller than the thickness of the noble metal plating layer of the outermost layer formed in the entire band-shaped region 1-A of 1, When the resin forming die is clamped to the metal plate in the reflector forming step, the surface of the pad portion 11 and the lead portion 12 on the front surface side of each lead frame region 1n provided in the first strip-shaped region 1-A and the resin forming metal There is no possibility of forming a gap with the mold, and burr of the reflector resin does not occur on the surface side pad portion 11 and lead portion 12 side in each lead frame region 1n. As a result, there is no possibility that the burr of the reflector resin covers a part of the surface of the pad portion 11 and the lead portion 12 on which the LED element is mounted and adversely affects the LED package in which the LED element is incorporated, such as a decrease in brightness. Therefore, the functions of the pad portion 11 and the lead portion 12 on the front surface side on which the LED element is mounted can be favorably maintained.

Further, as shown in FIG. 5(b), when plating is performed on the surface of the rectangular metal plate 10 in cross section, the plating may be thickly formed near the corners. In such a case, for example, when inserting the multi-row lead frame or the multi-row LED lead frame into a magazine that stores the multi-row lead frame, the thick plated portions formed at the corners are missing and The chipped plated portion may be arranged on the frame region 1n. However, according to the multi-row lead frame of the second embodiment of the present invention, the plating thickness in the vicinity of the corners of the metal plate 10 can be reduced, so that an unnecessary plating portion is unintentionally formed on the lead frame region 1n. The possibility of being arranged can be reduced.
Further, in the frame portion 2 located in the direction along the long side of the multi-row lead frame shown in FIG. 6(a), a hole portion (not shown) for fixing to a plating transport device or a mold die is formed. It may be done. In such a case, by reducing the thickness of the laminated plating layer on the front surface side and the back surface side of the frame portion 2 located in the direction along the long side corresponding to the second strip-shaped region 1-B, It is possible to reduce the possibility of plating burr. Accordingly, when the multi-row lead frame is fixed to the plating transfer device or the like, the positioning accuracy can be improved and fixed.

Next, manufacturing of an LED package using the multi-row lead frame 1 of each embodiment of the present invention will be described with reference to the drawings. Note that, here, for convenience, the multi-row lead frame of the first embodiment is used to describe the manufacturing process of the LED package. FIG. 9 is an explanatory view showing an example of a manufacturing process of an LED package using the multi-row lead frame 1 of the first embodiment manufactured by the manufacturing process of FIG.

First, the multi-row LED lead frame 1 including the reflector resin portion 15 shown in FIG. 3(g) is prepared (see FIG. 9(a)). The multi-row LED lead frame has a plurality of recesses on the upper surface side. The concave portion is formed by an inner side surface formed of the reflector resin portion 15 and an inner bottom surface where the lead frame region 1n is exposed from the reflector resin portion 15. In the multi-row LED lead frame, a part of the reflector resin portion 15 covers the laminated plating layer A2 and/or the laminated plating layer A4 located in the second strip-shaped region 1-B . By making the thickness of the laminated plating layer located in the entire second strip-shaped region 1-B smaller than the thickness of the laminated plating layer located in the entire first strip-shaped region 1-A, the first strip-shaped region 1 is formed. A height difference can be provided at the boundary between -A and the second strip-shaped region 1-B, and when the resin material to be the reflector resin portion 15 is molded on the multi-row lead frame 1, the second strip-shaped region 1 is formed. -The resin material easily flows into B. As a result, the reflector resin portion 15 can cover the second strip-shaped region 1-B in a wide range, and a lead frame for a multi-row LED with high adhesion strength can be obtained. The multi-row LED lead frame may be manufactured and prepared by the above manufacturing process, or may be prepared by purchasing a pre-manufactured multi-row LED lead frame.
Next, the LED element 20 is mounted on the upper surface of the laminated plating layer A1 formed on the pad portion 11 of the multi-row LED lead frame 1, and the laminated plating layer formed on the electrode of the LED element 20 and the pad portion 12 is formed. The upper surface of A1 is connected via the bonding wire 14 (see FIG. 9(b)). LED element 20, such as may be used a light emitting diode element, light emission can nitride semiconductor in the visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) Can be preferably used. Moreover, LED element 20 can also be implemented in one of a pair of electrodes on the surface, on the upper surface of the lead frame area 1n as a pair of electrodes and the upper surface of the lead frame area 1n faces.
Next, the transparent resin is filled in the internal space surrounded by the reflector resin portion 15 of the multi-row LED lead frame 1 and in which the LED elements 20 are mounted, the transparent resin portion 16 is formed, and the reflector resin portion 15 is used. The enclosed internal space is sealed (see FIG. 9(c)).

Next, the portion of the reflector resin portion 15 that surrounds the outer peripheries of the pad portion 11 and the lead portion 12 (the package outline line shown in FIG. 1A) is cut together with the connecting portion 13 and further the frame portion 2 (FIG. 9(d)). As a cutting method, for example, a lead-cut die, a dicing saw, or a laser beam can be used for cutting. As a result, a product-unit LED package using the multi-row LED lead frame 1 of the present embodiment is completed (see FIG. 9E).

Here, in the pad portion 11 and the lead portion 12 of the LED package, when the thickness of the noble metal plating of the outermost surface layer on the front surface side is made thicker than the thickness of the noble metal plating of the outermost surface layer on the back surface side, While the flatness of the noble metal plating of a certain outermost layer is increased and the light emitted from the LED element 20 is effectively reflected upward, the thickness of the noble metal plating of the outermost layer on the back surface side is thin, so that the LED package becomes one. This cost can be reduced. In addition, since the noble metal plating on the outermost layer on the front surface side is thick, it is possible to suppress or delay the progress of sulfidation due to a component such as sulfur that enters from the opening of the recess. As a result, for example, it is possible to reduce the possibility that the bonding wire 14 will be broken at the connection portion between one end of the bonding wire 14 and the lead frame region 1n. Further, when the pad portion 11 and the lead portion 12 of the LED package, the outermost layer of the thickness of the noble metal plating on the back face side, for example, was thick comb than the outermost layer of the thickness of the noble metal plating on the front side, the back side It is possible to reduce the possibility that a component such as copper of the base material is deposited on the surface of the noble metal plating of the outermost layer on the side. As a result, the bonding strength between the LED package and the bonding member can be improved when the LED package is mounted on the mounting substrate via the bonding member such as solder. In the pad portion 11 and the lead portion 12 of the LED package, the thickness of the outermost noble metal plating on the front surface side may be the same as the thickness of the outermost noble metal plating on the back surface side.

Ａｇめっき層の厚さ（平均値） (Example 1)
Next, an example of the multi-row lead frame of the present invention will be described. It should be noted that the pre-treatment and post-treatment including the chemical cleaning and the water cleaning, which are carried out in the respective manufacturing steps of each of the following examples, are well-known processes, and therefore the description thereof will be omitted for convenience.
First, a copper material having a thickness of 0.2 mm is used as the metal plate 10 serving as the base material of the lead frame (see FIG. 3(a)), and the resist layer R1 is formed on both surfaces of the metal plate 10 on which the LED element is mounted. formed (see FIG. 3 (b)), the pad portion to the first strip-like region, the lead portion, the connecting portion, have a frame part, the pad portion, connected to an individual lead frame area that have a lead portion connecting portions Then, exposure and development were performed using a glass mask on which a pattern for forming a predetermined multi-row lead frame shape having blocks arranged in a matrix was drawn, and a resist mask 30 for etching was formed ( See FIG. 3(c).
Next, to a region of the metal plate 10 exposed from the resist mask 30 for etching, etching processing, possess Pas head portion 11, the lead portion 12, connecting portion 13, the frame part 2, the pad part 11, to form a predetermined multi-row leadframe shape having blocks in which the individual lead frame area that have a lead portion 12 are arranged with the connecting portion 13 in a matrix (Fig. 3 (d) see) ..
Next, the resist masks 30 for etching on both sides of the metal plate 10 were removed (see FIG. 3(e)).
Next, in the plating tank, a predetermined electrolytic processing is performed on the entire surface of the metal plate 10 (here, electrolytic processing is performed by using anodes having the same area, with no shielding plate being provided on both front and back sides of the metal plate 10). Thus, Ni plating having a set thickness of 1 μm, Pd plating having a set thickness of 0.02 μm, and Au plating having a set thickness of 0.005 μm were sequentially applied.
Next, in the plating tank, on one surface side (here, the front surface side) of the metal plate 10, a first shield plate 35 that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B. Is arranged, and electrolytic processing is performed using the first anode 37. As the outermost noble metal plating layer, 2.5 μm for the entire area of the first strip-shaped region 1-A, the second strip-shaped region 1- The entire area of B is subjected to Ag plating with a set thickness of 0.8 μm, and at the same time, on the other surface side (here, the back surface side) of the metal plate 10, the second strip-shaped area 1-B is formed. A second shield plate 36 that shields only a predetermined portion corresponding to the entire region is arranged, and the second anode 38 having a surface area different from that of the first anode 37 (here, the surface area is small) is used for electrolytic processing. As the surface noble metal plating layer, an Ag plating layer having a set thickness of 2.0 μm for the entire first strip-shaped region 1-A and 0.5 μm for the entire second strip-shaped region 1-B. Thus, a multi-row lead frame in which a plating layer having a four-layer structure laminated in the order of Ni/Pd/Au/Ag was formed on the entire surface of the metal plate 10 formed in a lead frame shape was obtained (FIG. 3(f)). In the multi-row lead frame of Example 1, the Ag plating layer was formed to the thickness shown in Table 1.

Ag plating layer thickness (average value)

Ａｇめっき層の厚さ（平均値） (Example 2)
The same manufacturing method as in Example 1 was used until the formation of the Ni/Pd/Au plated layer before forming the noble metal plated layer of the outermost layer.
A first shield that shields only a predetermined portion corresponding to the entire second strip-shaped region 1-B on one surface side (here, the front surface side) of the metal plate 10 when forming the noble metal plating layer of the outermost layer. The plate 35 is arranged, electrolytic processing is performed using the first anode 37, and as the outermost noble metal plating layer, 2.5 μm for the entire first strip-shaped region 1-A, the second strip-shaped region The whole area of 1-B is plated with Ag having a set thickness of 0.8 μm, and at the same time, the second strip-shaped region 1- is formed on the other surface side (here, the back surface side) of the metal plate 10. A second shielding plate 36 that shields only a predetermined portion corresponding to the entire area of B is arranged, and as the outermost noble metal plating layer by electrolytic processing using a second anode 38 having the same surface area as the first anode 37, The lead frame shape is obtained by applying an Ag plating layer having a set thickness of 2.5 μm to the entire area of the first strip-shaped region 1-A and 0.8 μm to the entire area of the second strip-shaped region 1-B. A multi-row lead frame was obtained in which a plating layer having a four-layered structure in which Ni/Pd/Au/Ag was stacked in this order was formed on the entire surface of the metal plate 10 formed in FIG. 7 (see FIG. 7(f)). In the multi-row lead frame of Example 2, the Ag plating layer was formed to the thickness shown in Table 2.

Ag plating layer thickness (average value)

Ａｇめっき層の厚さ（平均値） (Comparative Example 1)
When forming the noble metal plating layer of the outermost layer, a shielding plate is not placed on both front and back sides of the metal plate 10, and Ag plating with a set thickness of 2.5 μm is applied to the entire surface by electrolytic processing using an anode of the same area. A multi-row lead frame of Comparative Example 1 was manufactured by using the same manufacturing method as that of Example 1 except for performing the above. In the multi-row lead frame of Comparative Example 1, the Ag plating layer was formed to have the thickness shown in Table 3.

Ag plating layer thickness (average value)

Ａｇめっき層の厚さ（平均値） (Comparative example 2)
When the noble metal plating layer of the outermost layer is formed, a shielding plate is not arranged on both front and back sides of the metal plate 10, and electrolytic processing using an anode having a different area is used to perform a surface treatment of Ag having a set thickness of 2.5 μm. A multi-row lead frame of Comparative Example 2 was manufactured by using the same manufacturing method as in Example 1 except that plating was performed and Ag plating having a set thickness of 2.0 μm was performed on the back surface side. In the multi-row lead frame of Comparative Example 2, the Ag plating layer was formed to have the thickness shown in Table 4.

Ag plating layer thickness (average value)

1000 pieces of multi-row lead frame samples were prepared by the respective manufacturing methods of Example 1, Example 2, Comparative Example 1 and Comparative Example 2, and the Ag plating thickness of each of the prepared 1000 samples was measured. Then, the average value was calculated. The average values of the Ag plating thicknesses of the samples of the multi-row lead frames of the prepared Example 1, Comparative Example 1 and Comparative Example 2 are as follows: Example 1 is Table 1, Example 2 is Table 2, and Comparative Example 1 is The values in Table 3 and Comparative Example 2 were as shown in Table 4.

Verification of Ag Electrodeposition Reduction Effect of Ag Plating For each of the multi-row lead frame samples of Example 1, Example 2, Comparative Example 1 and Comparative Example 2, the electrodeposition amount was calculated from the measured Ag plating thickness. The effect of reducing the electrodeposition amount was verified. When the electrodeposition amount of Ag plating in the multi-row lead frame manufactured by performing electrolytic processing by a method without control for making the Ag plating thickness of Comparative Example 1 different is 100%, Ag of Comparative Example 2 The electrodeposition amount of Ag plating in a multi-row lead frame manufactured by performing electrolytic processing by a method in which control for varying the plating thickness is performed only on the front surface and the back surface and not at each location on the same surface is 86. %Met.
On the other hand, a multi-row lead frame manufactured by performing electrolytic processing according to the method of controlling the Ag plating thickness in Example 1 at different positions on the same side and the front and back sides. The amount of electrodeposited Ag plating was 79%, and the amount of electrodeposited Ag plating can be further reduced by about 7% compared to the multi-row lead frame of Comparative Example 2 in which only the front surface side and the back surface side were controlled. Was confirmed.
In addition, in the multi-row lead frame manufactured by performing the electrolytic processing by the method performed on the first strip-shaped region and the second strip-shaped region, the control for varying the Ag plating thickness of Example 2 is performed. The electrodeposition amount of Ag plating is 83%, and the electrodeposition amount of Ag plating can be further reduced by about 3% as compared with the multi-row lead frame of Comparative Example 2 in which only the front surface side and the back surface side are controlled. confirmed.

Comparison of the number of burrs generated on the reflecting surface due to the formation of the reflector resin Using a molding die for each of the 1000-row multi-row lead frame samples of Example 1, Example 2, Comparative Example 1, and Comparative Example 2. The reflector resin portion 15 was formed (see FIG. 3(g)).
Next, 1000 samples of each of the multi-row LED lead frames of Example 1, Example 2, Comparative Example 1 and Comparative Example 2 in which the reflector resin portion 15 was formed were observed with a 50× microscope and reflected. The presence or absence of burrs of the reflector resin on the surface was examined, and in the multi-row LED lead frames of Example 1, Example 2, Comparative Example 1 and Comparative Example 2, the burrs of the reflector resin on the reflecting surface were observed. The numbers of confirmed samples were compared.
As a result, in the multi-row LED lead frame of Example 1 in which the Ag plating layer was formed to the thickness shown in Table 1, the number of samples in which the burr of the reflector resin on the surface on the LED element mounting side occurred was 0. there were.
Further, also in the multi-row LED lead frame of Example 2 in which the Ag plating layer is formed to have the thickness shown in Table 2, the surface on the LED element mounting side is similar to the multi-row LED lead frame of Example 1. The number of samples in which the burr of the reflector resin was generated was 0.
On the other hand, in the multi-row LED lead frame of Comparative Example 1 in which the Ag plating layer was formed to have the thickness shown in Table 3, the resin burrs on the LED element mounting side were arranged in a matrix. The lead frame region 1n was detected in the lead frame region 1n located in the center of the block, and the occurrence was found in 23 of the 1000 samples.
Further, in the multi-row LED lead frame of Comparative Example 2 in which the Ag plating layer was formed to the thickness shown in Table 4, the occurrence of burrs of the reflector resin on the surface on the LED element mounting side was arranged in a matrix. Further, it was detected in the lead frame region 1n located in the center of the block of the lead frame region 1n, and the occurrence was confirmed in 12 out of 1000 samples.

Although the preferred embodiments and examples of the present invention have been described above in detail, the present invention is not limited to the above-described embodiments and examples, and does not depart from the scope of the present invention. Various modifications and substitutions can be made to the embodiment and each example.

For example, in a multi-row lead frame in which blocks of the lead frame area 1n are arranged in a plurality of columns in a plurality of columns in a long side direction and a plurality of rows in a direction of a short side, a first strip-shaped area 1-A is provided for each row. , The lead frame region 1n and the frame portion 2 located in the direction along the short side of the lead frame base material, and the second strip-shaped region 1-B is the first strip-shaped region 1- of each row. with a structure having a frame portion 2 positioned in the direction along the long sides of the outer side of the lead frame base material for both the long sides of a, in the entire area of the first strip-like region 1-a line of each, The laminated plating layer A1 is formed on the surface on the front surface side on which the semiconductor element is mounted, and the laminated plating layer A3 is formed on the surface on the rear surface side that is connected to the outside, and the front surface side in the entire second strip-shaped area 1-B of each row is formed. The laminated plating layer A2 may be formed on the surface and the laminated plating layer A4 on the back surface side.

More specifically, for example, as shown in FIG. 10A, a multi-row lead in which the blocks of the lead frame region 1n are arranged in three rows in the long side direction and two rows in the short side direction of the lead frame base material. In the case of a frame, in the first row, an area having blocks of the lead frame region 1n arranged in three columns in the long side direction of the lead frame base material and a frame portion 2 positioned in the direction along the short side of the lead frame base material. Is defined as the first strip-shaped region 1-A(1) in the first row, and in the second row, the blocks of the lead frame region 1n arranged in three columns in the long side direction of the lead frame substrate and the lead frame substrate The region having the frame portion 2 located in the direction along the short side is referred to as the first strip-shaped region 1-A(2) in the second row.
Then, each first strip-like region 1-A (1) of, 1-A both the frame part 2 located in the direction along the long sides of the outer side of the lead frame substrate of the long sides of (2), the 2 band-shaped region 1-B.
In the example of FIG. 10(a), the position is located on the long side of the first strip-shaped region 1-A(1) on the end side (upper side) of the lead frame base material along the long side of the lead frame base material. The second frame area 1-B(1) in the first row is formed between the first band area 1-A(1) and the first band area 1-A(2). The positioned frame portion 2 becomes the second strip-shaped region 1-B(2) in the second row, and the long side of the first strip-shaped region 1-A(2) is on the side of the edge of the lead frame base material (the side of the lower side). ), the frame portion 2 located in the direction along the long side of the lead frame base material becomes the second strip-shaped region 1-B(3) in the third row.
Then, as shown in FIG. 10(b) (or FIG. 10(c)), by using a method substantially similar to that described using FIG. 3 and FIG. 4 (or FIG. 7 and FIG. 8), In the entire area of the first strip-shaped regions 1-A(1) and 1-A(2) of the row, a laminated plating layer A1 is formed on the surface on the front surface side on which the semiconductor element is mounted, and a laminated plating layer is formed on the surface on the rear surface side connected to the outside. The layer A3 is formed, and the laminated plating layer A2 is formed on the front surface side and the laminated plating layer is formed on the rear surface side in the entire second strip regions 1-B(1) to 1-B(3) of the respective rows. A4 may be formed.

Further, for example, as shown in FIG. 11A, a multi-row lead frame in which the blocks of the lead frame region 1n are arranged in three columns in the long side direction and three rows in the short side direction of the lead frame base material is used. In this case, the block of the lead frame region 1n arranged in three rows in the long side direction of the lead frame base material in the first row and the region having the frame portion 2 located in the direction along the short side of the lead frame base material is 1 The first strip-shaped area 1-A(1) of the row and the block of the lead frame area 1n arranged in three rows in the long side direction of the lead frame base material and the short side of the lead frame base material in the second row. The region having the frame portion 2 located in the direction along the is defined as the first strip-shaped region 1-A(2) in the second row, and the third row is arranged in three columns in the long side direction of the lead frame base material. An area including the block of the formed lead frame area 1n and the frame portion 2 located in the direction along the short side of the lead frame base material is referred to as a first strip area 1-A(3) in the third row. ..
Then, each of the first strip-like region 1-A (1), 1 -A (2), located in the direction along the long side of 1-A (3), both in the long side outer side of the lead frame substrate The frame portion 2 to be formed is the second strip-shaped region 1-B.
In the example of FIG. 7(a), the position is in the direction along the long side of the lead frame base material on the end side (upper side) of the lead frame base material on the long side of the first strip-shaped region 1-A(1). The second frame area 1-B(1) in the first row is formed between the first band area 1-A(1) and the first band area 1-A(2). The frame portion 2 located is the second strip-shaped region 1-B(2) in the second row, and is located between the first strip-shaped region 1-A(2) and the first strip-shaped region 1-A(3). The frame portion 2 located at becomes the second strip-shaped region 1-B(3) in the third row, and the long side of the first strip-shaped region 1-A(3) is closer to the end side (lower side) of the lead frame substrate. The frame portion 2 located on the side) in the direction along the long side of the lead frame base material is the second strip-shaped region 1-B(4) in the fourth row.
Then, as shown in FIG. 11(b) (or FIG. 11(c)), as shown in FIG. 11(b) (or FIG. 11(c)), by using a method substantially similar to that described using FIG. 3 and FIG. 4 (or FIG. 7 and FIG. 8), In the entire area of the first strip-shaped regions 1-A(1), 1-A(2), 1-A(3) of the row, the laminated plating layer A1 is connected to the outside on the surface on which the semiconductor element is mounted. The laminated plating layer A3 is formed on the back surface, and the second strip regions 1-B(1), 1-B(2), 1-B(3), 1-B(4) of the respective rows are formed. The laminated plating layer A2 may be formed on the surface of the front surface and the laminated plating layer A4 may be formed on the surface of the back surface in the entire area .

Further, in each of the embodiments and examples of the present invention, the example of the lead frame for a multi-row LED has been described, but the lead frame for a multi-row LED of the present invention includes another semiconductor element other than the LED element. It can also be applied to a multi-row lead frame for mounting.

The multi-row lead frame, the multi-row LED lead frame and the manufacturing method thereof according to the present invention are formed by electrolytic processing on both the front and back surfaces and the entire side surface of a metal plate formed into a predetermined lead frame shape by etching. The present invention is useful in a field in which it is necessary to manufacture a multi-row lead frame in which the combination of metals and the order of lamination are the same and the outermost plating layer has a laminated plating layer composed of a noble metal plating layer.

1 Multi-row lead frame 1-A, 1-A(1), 1-A(2), 1-A(3) First strip-shaped region 1-B, 1-B(1), 1-B( 2), 1-B(3), 1-B(4) 2nd strip|belt-shaped area 1n Individual lead frame area 2 Frame part 10 Lead frame base material (metal plate)
11 pad part 12 lead part 13 connecting part 13a suspension lead 13b dam bar 14 bonding wire 15 reflector resin part 16 transparent resin part 20 semiconductor element 30 resist mask for etching 35 first shielding plate 36 second shielding plate 37 first anode 38 Second anode A1 Laminated plating layer A2 formed on the surface of the first strip-shaped area 1-A on the front surface side on which the LED element is mounted The second strip-shaped area 1-B on the front surface side on which the LED element is mounted Laminated plating layer A3 formed on the surface of the first side strip-shaped region 1 on the back side connected to the outside Region 1-Layered plating layer A4 formed on the surface of the second side strip on the back side connected to the outside Laminated plating layer R1 formed on the surface of region 1-B Resist layer

Claims (16)

A first band-like region having blocks in which the individual lead frame regions are arranged in a matrix are connected to the connecting portion, located outside the side of at least both longer sides of the first strip region, said first of Te second multi-row leadframe odor having a band-like region, a consisting of a frame part to be connected to the connection portion provided in the strip-like region,
The metal plate forming the lead frame base material has a laminated plating layer formed by electrolytic processing with the same combination of metals and the same stacking order, and the outermost plating layer is a noble metal plating layer on the entire front and back surfaces and side surfaces. Then
In the laminated plating layer on the front surface side on which the semiconductor element is mounted, the thickness of the noble metal plating layer of the outermost layer formed in the entire area of the second strip-shaped area is formed in the entire area of the first strip-shaped area. Thin compared to the thickness of the precious metal plating layer on the outermost layer ,
In the laminated plating layer on the back surface side that is connected to the outside, the thickness of the noble metal plating layer of the outermost layer formed in the entire area of the second strip-shaped region is the same as the thickness of the noble metal plating layer formed in the entire area of the first strip-shaped region. Thin compared to the thickness of the precious metal plating layer on the surface ,
The thickness of the laminated plating layer formed over the entire area of the second strip-shaped region on each of the front surface side and the back surface side is equal to the thickness of the laminated plating layer formed over the entire area of the first strip-shaped region. A multi-row lead frame that is characterized by being thin. The multi-row lead frame according to claim 1, wherein the laminated plating layer is a plating layer formed in the order of Ni/Pd/Au/Ag. The multi-row lead frame according to claim 1, wherein the laminated plating layer is a plated layer formed in the order of Cu/Ag or a laminated plating layer containing Ni. The multi-row according to claim 3, wherein the Ni-containing laminated plating layer is a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag, or Ni/Pd/Au. Mold lead frame. The thickness of the laminated plating layer formed on the entire area of the second strip-shaped area on the back surface side is smaller than the thickness of the laminated plating layer formed on the entire area of the first strip-shaped area on the front surface side. The multi-row lead frame according to any one of claims 1 to 4, wherein The thickness of the laminated plating layer formed on the entire area of the second strip-shaped region on the front surface side is smaller than the thickness of the laminated plating layer formed on the entire area of the first strip-shaped region on the back surface side. The multi-row lead frame according to any one of claims 1 to 5, wherein The multi-row lead frame according to any one of claims 1 to 6, and a reflector resin portion that is integrally formed with the multi-row lead frame, and an inner surface formed of the reflector resin portion on an upper surface side. A multi-row LED lead frame, wherein the lead frame region includes a plurality of recesses formed by an inner bottom surface exposed from the reflector resin portion. Preparing the multi-row LED lead frame according to claim 7;
Placing an LED element in the recess of the multi-row LED lead frame;
And a step of obtaining a plurality of LED packages by dividing the multi-row LED lead frame on which the LED elements are mounted into individual pieces, to obtain a plurality of LED packages. Method for manufacturing a multi-row lead frame including a first strip-shaped region having blocks in which individual lead frame regions are arranged in a matrix and second strip-shaped regions on both sides of at least long sides of the first strip-shaped region And
A resist mask for etching corresponding to a predetermined multi-row lead frame shape having blocks in which the individual lead frame areas are arranged in a matrix in the first strip-shaped area on both surfaces of a metal plate that forms the lead frame base material. A step of forming
A step of performing an etching process to form the multi-row lead frame shape on the metal plate;
Removing the resist mask on both sides of the metal plate,
A step of forming a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing,
A first shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged on one surface side of the metal plate, and an outermost noble metal plating layer is formed by electrolytic processing using the first anode. To form a laminated plating layer on one surface side of the metal plate and to shield only a predetermined portion corresponding to the second strip-shaped region on the other surface side of the metal plate. A shield plate is arranged, and a noble metal plating layer of the outermost layer is formed by electrolytic processing using a second anode having a surface area different from that of the first anode to complete a laminated plating layer on the other surface side of the metal plate. And the process of
A method for manufacturing a multi-row lead frame, comprising: A first band-like region having blocks in which the individual lead frame regions are arranged in a matrix are connected to the connecting portion, located outside the side of at least both longer sides of the first strip region, said first of Te second multi-row leadframe odor having a band-like region, a consisting of a frame part to be connected to the connection portion provided in the strip-like region,
The metal plate forming the lead frame base material has a laminated plating layer formed by electrolytic processing with the same combination of metals and the same stacking order, and the outermost plating layer is a noble metal plating layer on the entire front and back surfaces and side surfaces. Then
Plating layers other than the noble metal plating layer of the outermost layer in the laminated plating layer have an equal thickness over the entire surface of the metal plate,
Said outermost layer of the precious metal plating layer formed on the entire area of the first strip-like region on the surface side of the metal plate, the outermost layer formed on the whole area of the first strip-like region of the back surface side of the metal plate Has the same thickness as the precious metal plating layer of
The thickness of the noble metal plating layer of the outermost layer formed on the entire area of the second strip-shaped region on each of the front surface side and the back surface side is the same as that of the outermost layer formed on the entire area of the first strip-shaped region. Thin compared to the thickness of the precious metal plating layer,
The thickness of the back side of the second of the outermost layer of the precious metal plating layer formed on the whole area of the strip-like regions, the outermost layer of the precious metal plating layer formed on the entire area of the second strip-like region of said surface side Is equal to the thickness of
A multi-row lead frame characterized in that The multi-row lead frame according to claim 10, wherein the laminated plating layer is a plating layer formed in the order of Ni/Pd/Au/Ag. The multi-row lead frame according to claim 10, wherein the laminated plating layer is a plated layer formed in the order of Cu/Ag or a laminated plating layer containing Ni. 13. The multi-row according to claim 12, wherein the laminated plating layer containing Ni is a plating layer formed in the order of Ni/Au, Ni/Ag, Ni/Au/Ag or Ni/Pd/Au. Mold lead frame. The multi-row lead frame according to any one of claims 10 to 13, and a reflector resin portion that is integrally formed with the multi-row lead frame, and an inner side surface formed of the reflector resin portion on an upper surface side. A multi-row LED lead frame, wherein the lead frame region includes a plurality of recesses formed by an inner bottom surface exposed from the reflector resin portion. Preparing a multi-row LED lead frame according to claim 14;
Placing an LED element in the recess of the multi-row LED lead frame;
And a step of obtaining a plurality of LED packages by dividing the multi-row LED lead frame on which the LED elements are mounted into individual pieces, to obtain a plurality of LED packages. Method for manufacturing a multi-row lead frame including a first strip-shaped region having blocks in which individual lead frame regions are arranged in a matrix and second strip-shaped regions on both sides of at least long sides of the first strip-shaped region And
A resist mask for etching corresponding to a predetermined multi-row lead frame shape having blocks in which the individual lead frame areas are arranged in a matrix in the first strip-shaped area on both surfaces of a metal plate that forms the lead frame base material. A step of forming
A step of performing an etching process to form the multi-row lead frame shape on the metal plate;
Removing the resist mask on both sides of the metal plate,
A step of forming a predetermined plating layer on the entire surface of the metal plate by a predetermined electrolytic processing,
A first shielding plate that shields only a predetermined portion corresponding to the second strip-shaped region is arranged on one surface side of the metal plate, and an outermost noble metal plating layer is formed by electrolytic processing using the first anode. To form a laminated plating layer on one surface side of the metal plate and to shield only a predetermined portion corresponding to the second strip-shaped region on the other surface side of the metal plate. A shield plate is arranged, and a noble metal plating layer of the outermost layer is formed by electrolytic processing using a second anode having the same surface area and the same distance from the metal plate as the first anode, and the other surface side of the metal plate is formed. The step of completing the laminated plating layer of
A method for manufacturing a multi-row lead frame, comprising:

Images