JP6741016B2 - 複合多結晶体 - Google Patents
複合多結晶体 Download PDFInfo
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Description
特開2003−292397号公報(特許文献1)および国際公開第2009/099130号(特許文献2)に開示されるダイヤモンド多結晶体は、耐摩耗工具である伸線ダイスに適用すると、局所摩耗により伸線時の引抜抵抗が増大し伸後の線径が小さくなり断線が多くなり、切削工具であるスクライブホイールや掘削用ビットに適用すると、局所摩耗、衝撃による欠けなどにより工具寿命が短くなるという問題点があった。
[本開示の効果]
本開示によれば、耐摩耗工具、切削工具などの材料として好適に用いられる、耐摩耗性の高い、多結晶ダイヤモンドと非ダイヤモンド状炭素とを含む複合多結晶体を提供できる。かかる複合多結晶体は、耐摩耗性が高いことから、摩耗により工具寿命が短くなるのを防ぐため、工具寿命を延ばすことができる。
本発明のある実施形態である複合多結晶体は、ダイヤモンド粒子が互いに直接結合して形成される多結晶ダイヤモンドと、多結晶ダイヤモンド中に分散される非ダイヤモンド状炭素とを含み、含有水素濃度が1000ppmより高く20000ppm以下である。本実施形態の複合多結晶体は、含有水素濃度が1000ppmより高く20000ppm以下であるため、耐摩耗性が高い。
(複合多結晶体)
図1を参照して、本実施形態の複合多結晶体10は、ダイヤモンド粒子が互いに直接結合して形成される多結晶ダイヤモンド11と、多結晶ダイヤモンド11中に分散される非ダイヤモンド状炭素12とを含み、含有水素濃度が1000ppmより高く20000ppm以下である。
本実施形態の複合多結晶体10の製造方法は、特に制限はないが、耐摩耗性の高い複合多結晶体10を効率よくかつ低コストで製造する観点から、原料として非ダイヤモンド状炭素を準備する原料準備工程と、上記原料をダイヤモンド相が形成される温度および圧力の条件で焼結することにより複合多結晶体10を形成する複合多結晶体形成工程と、を含むことが好ましい。
実施例1〜3に関わる複合多結晶体を以下の方法で作製した。まず、出発物質として、粒径1μm〜3μmのグラファイト粉末を遊星ボールミルで粉砕して、平均粒径10nm未満の超微粒グラファイト粉末を作製した。この粉末を、水素加熱炉で、水素ガス気流中600℃で5時間処理した後、型押し成形により、1.8g/cm3のグラファイト成形体を準備した(原料準備工程)。このグラファイト成形体の含有水素濃度は、昇温脱離ガス分析法により測定したところ、1000ppm程度であった。
実施例4〜6に関わる複合多結晶体を以下の方法で作製した。まず、出発物質として、含有水素濃度が3000ppm〜20000ppmのグラッシーカーボン、カーボンブラック、またはC60を準備し、それぞれを型押し成形により、密度1.8g/cm3のグラファイト成形体を準備した(原料準備工程)。
比較例1および2に関わる複合多結晶体を以下の方法で作製した。まず、出発物質として、粒径1μm〜3μmのグラファイト粉末を遊星ボールミルで粉砕して、平均粒径10nm以下の超微粒グラファイト粉末を作製した。この粉末を、水素加熱炉で、水素ガス気流中600℃で5時間処理した後、型押し成形により、密度1.8g/cm3のグラファイト成形体を準備した(原料準備工程)。このグラファイト成形体の含有水素濃度は、1000ppm程度であった。
Claims (9)
- ダイヤモンド粒子が互いに直接結合して形成される多結晶ダイヤモンドと、前記多結晶ダイヤモンド中に分散される非ダイヤモンド状炭素と、を含み、
含有水素濃度が1000ppmより高く20000ppm以下である複合多結晶体。 - 前記多結晶ダイヤモンドの相が三次元的に連続している請求項1に記載の複合多結晶体。
- 前記多結晶ダイヤモンドを形成する前記ダイヤモンド粒子の平均粒径が10nm以上200nm以下である請求項1または請求項2に記載の複合多結晶体。
- 前記非ダイヤモンド状炭素の平均粒径が10nm以上200nm以下である請求項1から請求項3のいずれか1項に記載の複合多結晶体。
- 前記複合多結晶体の全体に対する前記非ダイヤモンド状炭素の占める割合は、前記複合多結晶体の任意に特定される一断面の全面積に対して占める前記非ダイヤモンド状炭素の面積の百分率である非ダイヤモンド状炭素占有率が、0.01%以上5%以下である請求項1から請求項4のいずれか1項に記載の複合多結晶体。
- 前記非ダイヤモンド状炭素がグラファイトである請求項1から請求項5のいずれか1項に記載の複合多結晶体。
- 前記非ダイヤモンド状炭素がアモルファスカーボンである請求項1から請求項5のいずれか1項に記載の複合多結晶体。
- ヌープ硬度が50GPa以上である請求項1から請求項7のいずれか1項に記載の複合多結晶体。
- ダイヤモンド粒子が互いに直接結合して形成される多結晶ダイヤモンドと、前記多結晶ダイヤモンド中に分散される非ダイヤモンド状炭素と、を含む複合多結晶体であって、
含有水素濃度が1000ppmより高く20000ppm以下であり、
前記多結晶ダイヤモンドの相が三次元的に連続しており、
前記多結晶ダイヤモンドを形成する前記ダイヤモンド粒子の平均粒径が10nm以上200nm以下であり、
前記非ダイヤモンド状炭素の平均粒径が10nm以上200nm以下であり、
前記複合多結晶体の全体に対する前記非ダイヤモンド状炭素の占める割合は、前記複合多結晶体の任意に特定される一断面の全面積に対して占める前記非ダイヤモンド状炭素の面積の百分率である非ダイヤモンド状炭素占有率が、0.01%以上5%以下であり、
前記非ダイヤモンド状炭素がグラファイトおよびアモルファスカーボンのいずれかであり、
ヌープ硬度が50GPa以上である複合多結晶体。
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| JP2015214041 | 2015-10-30 | ||
| JP2015214041 | 2015-10-30 | ||
| PCT/JP2016/079917 WO2017073293A1 (ja) | 2015-10-30 | 2016-10-07 | 複合多結晶体 |
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| JP6958563B2 (ja) * | 2016-10-07 | 2021-11-02 | 住友電気工業株式会社 | ダイヤモンド多結晶体の製造方法、ダイヤモンド多結晶体、切削工具、耐摩工具および研削工具 |
| WO2019146353A1 (ja) * | 2018-01-24 | 2019-08-01 | 住友電気工業株式会社 | 複合多結晶ダイヤモンド及びその製造方法 |
| US20240368040A1 (en) * | 2021-06-11 | 2024-11-07 | Sumitomo Electric Hardmetal Corp. | Composite polycrystal and tool with composite polycrystal |
| CN116143518B (zh) * | 2021-11-23 | 2024-09-20 | 燕山大学 | 导电高强金刚石/非晶碳复合材料及其制备方法 |
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| US4381271A (en) * | 1981-02-02 | 1983-04-26 | General Electric Company | Use of fired fibrous graphite in fabricating polycrystalline diamond and/or cubic boron nitride/silicon carbide/silicon composite bodies |
| US4919974A (en) * | 1989-01-12 | 1990-04-24 | Ford Motor Company | Making diamond composite coated cutting tools |
| JPH09142933A (ja) | 1995-11-21 | 1997-06-03 | Sumitomo Electric Ind Ltd | ダイヤモンド焼結体及びその製造方法 |
| JP2002060733A (ja) * | 2000-08-17 | 2002-02-26 | Ishizuka Kenkyusho:Kk | ダイヤモンド研磨材粒子及びその製法 |
| JP4275896B2 (ja) | 2002-04-01 | 2009-06-10 | 株式会社テクノネットワーク四国 | ダイヤモンド多結晶体およびその製造方法 |
| JP4203900B2 (ja) * | 2002-10-11 | 2009-01-07 | 住友電気工業株式会社 | ダイヤモンド多結晶体およびその製造方法 |
| JP3992595B2 (ja) * | 2002-11-15 | 2007-10-17 | 独立行政法人科学技術振興機構 | 高純度高硬度超微粒ダイヤモンド焼結体の製造法 |
| JP4542799B2 (ja) | 2004-02-25 | 2010-09-15 | 住友電工ハードメタル株式会社 | 高強度・高耐摩耗性ダイヤモンド焼結体およびその製造方法 |
| US7749863B1 (en) * | 2005-05-12 | 2010-07-06 | Hrl Laboratories, Llc | Thermal management substrates |
| JP5013156B2 (ja) * | 2005-07-21 | 2012-08-29 | 住友電気工業株式会社 | 高硬度ダイヤモンド多結晶体およびその製造方法 |
| JP5070688B2 (ja) * | 2005-08-22 | 2012-11-14 | 住友電気工業株式会社 | 高硬度ダイヤモンド多結晶体及びその製造方法 |
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| JP2009067610A (ja) * | 2007-09-11 | 2009-04-02 | Sumitomo Electric Ind Ltd | 高硬度ダイヤモンド多結晶体およびその製造方法 |
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| EP3369704B1 (en) | 2020-02-19 |
| US20170333998A1 (en) | 2017-11-23 |
| EP3369704A4 (en) | 2019-07-10 |
| CN107108230B (zh) | 2021-06-25 |
| EP3369704A1 (en) | 2018-09-05 |
| CN107108230A (zh) | 2017-08-29 |
| WO2017073293A1 (ja) | 2017-05-04 |
| JPWO2017073293A1 (ja) | 2018-08-16 |
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