JP6747522B2 - 物品中継装置及びストッカ - Google Patents
物品中継装置及びストッカ Download PDFInfo
- Publication number
- JP6747522B2 JP6747522B2 JP2018562911A JP2018562911A JP6747522B2 JP 6747522 B2 JP6747522 B2 JP 6747522B2 JP 2018562911 A JP2018562911 A JP 2018562911A JP 2018562911 A JP2018562911 A JP 2018562911A JP 6747522 B2 JP6747522 B2 JP 6747522B2
- Authority
- JP
- Japan
- Prior art keywords
- article
- depth direction
- opening
- cover
- mounting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0485—Check-in, check-out devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1916—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3408—Docking arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H10P72/3412—Batch transfer of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Warehouses Or Storage Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Vehicle Step Arrangements And Article Storage (AREA)
Description
K2・・・ストッカ内部(設備内部)
M・・・物品
P1・・・第1位置
P2・・・第2位置
R・・・通路
S・・・仮想平面
10・・・開口部
10a・・・上端
20・・・載置台
30・・・第1カバー
40・・・第2カバー
41・・・傾斜部
50・・・移動機構
60・・・シャッタ機構
61、62・・・シャッタ
63・・・制御装置
70・・・外気供給部
71・・・外気取込口
72・・・ダクト
100・・・物品中継装置
111・・・外壁
120・・・棚部
130・・・搬送装置
200・・・ストッカ(設備)
Claims (6)
- 設備内外を区画する外壁に設けられ、設備内部と作業者との間で物品を中継する物品中継装置であって、
前記外壁の外側における作業者の通路に面して開口する開口部と、
前記開口部よりも奥行方向の奥側に設けられて物品が載置される載置台と、
前記開口部に対して上方かつ前記開口部よりも奥行方向の手前側の位置に設けられて前記外壁の一部となる第1カバーと、
前記第1カバーと前記開口部との間に設けられて前記外壁の一部となりかつ下方に向かうにつれて奥行方向の奥側へ向かう形状の第2カバーと、
前記開口部に対して奥行方向の奥側に設けられ、前記外壁の外側の外気を供給する外気供給部と、を備え、
前記第2カバーの一部に前記外気供給部の外気取込口が設けられる、物品中継装置。 - 前記載置台を、奥行方向の手前側の第1位置と、前記第1位置よりも奥行方向の奥側でありかつ設備内部に備えられた搬送装置に対する物品の受け渡し位置である第2位置との間で移動させる移動機構を備える、請求項1に記載の物品中継装置。
- 前記第1位置は、前記載置台に載置された物品の少なくとも一部が、前記開口部の上端を含みかつ前記第2カバーに接する仮想平面よりも奥行方向の手前側となる位置であり、
前記第2位置は、前記第1位置よりも奥行方向の奥側となる位置である、請求項2に記載の物品中継装置。 - 前記第1位置は、奥行方向において前記第1カバーよりも奥側の位置であり、前記移動機構の奥行方向の手前側限界位置である、請求項2または請求項3に記載の物品中継装置。
- 請求項1から請求項4のいずれか一項に記載の物品中継装置を備える、ストッカ。
- 物品が載置される複数の棚を内部に備え、
前記複数の棚の少なくとも1つは、前記第1カバーに対して奥行方向の奥側かつ前記載置台に対して上方に配置される、請求項5に記載のストッカ。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017009445 | 2017-01-23 | ||
| JP2017009445 | 2017-01-23 | ||
| PCT/JP2017/042612 WO2018135137A1 (ja) | 2017-01-23 | 2017-11-28 | 物品中継装置及びストッカ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2018135137A1 JPWO2018135137A1 (ja) | 2019-11-07 |
| JP6747522B2 true JP6747522B2 (ja) | 2020-08-26 |
Family
ID=62909212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018562911A Expired - Fee Related JP6747522B2 (ja) | 2017-01-23 | 2017-11-28 | 物品中継装置及びストッカ |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20210403235A1 (ja) |
| EP (1) | EP3573093A4 (ja) |
| JP (1) | JP6747522B2 (ja) |
| KR (1) | KR20190098223A (ja) |
| CN (1) | CN110235234A (ja) |
| IL (1) | IL268136B (ja) |
| SG (1) | SG11201906775XA (ja) |
| TW (1) | TW201833007A (ja) |
| WO (1) | WO2018135137A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114715588B (zh) * | 2022-06-02 | 2023-07-25 | 弥费科技(上海)股份有限公司 | 存储库 |
| EP4588824A1 (de) * | 2024-01-19 | 2025-07-23 | Jungheinrich Aktiengesellschaft | Lageranordnung und verfahren zum betreiben einer lageranordnung |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5332930B2 (ja) | 1973-09-08 | 1978-09-11 | ||
| US4986715A (en) * | 1988-07-13 | 1991-01-22 | Tokyo Electron Limited | Stock unit for storing carriers |
| US5332930A (en) | 1993-06-24 | 1994-07-26 | Intel Corporation | Phase locked loop circuitry with variable gain and bandwidth |
| JP2000003955A (ja) * | 1998-06-15 | 2000-01-07 | Mitsubishi Electric Corp | 半導体ウエハ収納装置 |
| JP4048074B2 (ja) * | 2002-04-12 | 2008-02-13 | 東京エレクトロン株式会社 | 処理装置 |
| JP4290204B2 (ja) * | 2007-02-13 | 2009-07-01 | 東京エレクトロン株式会社 | 基板処理装置の設定操作支援装置,設定操作支援方法,プログラムを記憶する記憶媒体 |
| JP4309935B2 (ja) * | 2007-07-31 | 2009-08-05 | Tdk株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
| JP5131558B2 (ja) * | 2008-12-02 | 2013-01-30 | 株式会社ダイフク | 物品搬送装置 |
| JP5212165B2 (ja) * | 2009-02-20 | 2013-06-19 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP5429559B2 (ja) * | 2010-02-01 | 2014-02-26 | 株式会社ダイフク | 倉庫設備 |
| JP2014029891A (ja) * | 2010-11-29 | 2014-02-13 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
| JP5729148B2 (ja) * | 2011-06-07 | 2015-06-03 | 東京エレクトロン株式会社 | 基板搬送容器の開閉装置、蓋体の開閉装置及び半導体製造装置 |
| JP2014060338A (ja) * | 2012-09-19 | 2014-04-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JPWO2014115643A1 (ja) * | 2013-01-25 | 2017-01-26 | 株式会社日立国際電気 | 基板処理装置の異常判定方法、異常判定装置、及び基板処理システム並びに記録媒体 |
| WO2014157124A1 (ja) * | 2013-03-27 | 2014-10-02 | 東京エレクトロン株式会社 | 基板処理装置 |
| JP6556518B2 (ja) | 2015-06-23 | 2019-08-07 | 日本放送協会 | アンテナ特性測定方法 |
-
2017
- 2017-11-28 CN CN201780084239.3A patent/CN110235234A/zh not_active Withdrawn
- 2017-11-28 WO PCT/JP2017/042612 patent/WO2018135137A1/ja not_active Ceased
- 2017-11-28 SG SG11201906775XA patent/SG11201906775XA/en unknown
- 2017-11-28 JP JP2018562911A patent/JP6747522B2/ja not_active Expired - Fee Related
- 2017-11-28 US US16/479,617 patent/US20210403235A1/en not_active Abandoned
- 2017-11-28 KR KR1020197021465A patent/KR20190098223A/ko not_active Ceased
- 2017-11-28 EP EP17892532.7A patent/EP3573093A4/en not_active Withdrawn
-
2018
- 2018-01-15 TW TW107101435A patent/TW201833007A/zh unknown
-
2019
- 2019-07-17 IL IL268136A patent/IL268136B/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| IL268136B (en) | 2020-11-30 |
| SG11201906775XA (en) | 2019-08-27 |
| EP3573093A4 (en) | 2020-11-04 |
| CN110235234A (zh) | 2019-09-13 |
| WO2018135137A1 (ja) | 2018-07-26 |
| IL268136A (en) | 2019-10-31 |
| KR20190098223A (ko) | 2019-08-21 |
| US20210403235A1 (en) | 2021-12-30 |
| EP3573093A1 (en) | 2019-11-27 |
| JPWO2018135137A1 (ja) | 2019-11-07 |
| TW201833007A (zh) | 2018-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6314713B2 (ja) | 階間搬送設備 | |
| US10625938B2 (en) | Article transport facility | |
| US5655869A (en) | Device for coupling loading and unloading devices with semiconductor processing machines | |
| JP6747522B2 (ja) | 物品中継装置及びストッカ | |
| TW202116650A (zh) | 用於自動化晶圓載具搬運的系統及方法 | |
| JPWO2006046580A1 (ja) | 搬送システム、基板処理装置、及び搬送方法 | |
| CN108349649A (zh) | 取出装置及保管装置 | |
| US10265864B2 (en) | Workpiece reverse support device and robot cell including the same device | |
| JP5365743B2 (ja) | 移載装置 | |
| JPWO2006035473A1 (ja) | 容器搬送装置 | |
| JP2021127252A (ja) | 取出装置および方法 | |
| KR20190101448A (ko) | 스토커 | |
| JP4532038B2 (ja) | トレイ部品供給装置 | |
| JP6848676B2 (ja) | ピッキングシステム | |
| JP2024071778A (ja) | 物品保管装置 | |
| JP7409133B2 (ja) | ピッキング設備 | |
| JP2010120102A (ja) | 生産装置、及び生産システム | |
| JP2008210881A (ja) | 局所クリーン搬送装置における物品受渡し時の清浄度保持装置 | |
| CN116062349A (zh) | 自动仓库 | |
| JP5277572B2 (ja) | 板状物の保管移送システムおよび板状物の保管移送方法 | |
| KR20190052875A (ko) | 카세트 공급시스템 | |
| JP2017069393A (ja) | 基板処理システム | |
| JP2006108292A (ja) | 表面実装機 | |
| JP2021127199A (ja) | ピッキング設備 | |
| KR102227859B1 (ko) | 스토커 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190718 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190718 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200421 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200605 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200707 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200720 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6747522 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |