JP6747799B2 - Optical element mounting package, optical element mounting mother board, and electronic device - Google Patents

Description

INDUSTRIAL APPLICABILITY The present invention is used in an optical communication field, various image display fields such as a projector or a head-up display, and various illumination fields such as a headlight, and an optical element mounting package for mounting various optical elements, and an optical element mounting package. The present invention relates to a mother board and an electronic device.

In recent years, electronic devices equipped with optical elements such as laser diodes as light emitting elements are being developed in various image display fields and various illumination fields in addition to the optical communication field.

As an optical element mounting package for such an electronic device, there is, for example, a package including a base having a mounting portion on which the optical element is mounted. The optical element is mounted on the mounting portion via a submount, and a mirror for emitting light emitted from the optical element upward, for example, is mounted on the mounting portion, and the mounting portion is covered with, for example, a lid.

JP 2001-244543 JP

When the optical element is mounted on the mounting portion via the submount like the optical element mounting package described above and the mirror is mounted on the mounting portion, it is emitted from the mounting portion of the optical element and the optical element in the mirror. The heat transfer path from the part that reflects light to the mounting part is long, and when the electronic device is operated, the heat of the optical element and the heat of the part of the mirror that reflects the light emitted from the optical element are dissipated to the outside. It becomes difficult to do so, the excitation in the optical element is weakened, the light output becomes small, the mirror is easily distorted, and the emission direction of the light emitted from the optical element is deviated by the mirror reflecting the light. There is a possibility that unevenness in the amount of light may occur in the electronic device mounted with, or the amount of light may easily decrease, and the electronic device may not emit the required amount of light.

An optical element mounting package according to one aspect of the present invention emits light in one direction provided on a step portion provided on a bottom portion and on the step portion side of the bottom portion above the step portion. A base having a concave portion having a mounting portion for one optical element which is a laser diode, and the bottom portion below the step portion has a first inclined portion inclined to the mounting portion side; first inclined portion, in the thickness direction of the substrate from between the lower surface and the mounting portion of the base, provided over between the upper surface of the said mounting portion substrate, said stepped portion, said There is a second inclined portion inclined from the mounting portion side to the first inclined portion side, the end portion of the second inclined portion is provided so as to contact the end portion of the first inclined portion, and the recessed portion is provided. has a side surface which rises upward surface of the substrate from the first inclined portion.

An optical element mounting mother board according to one aspect of the present invention has a mother board in which a plurality of optical element mounting packages having the above-described configuration are arranged vertically and horizontally in a plan view.

An electronic device according to an aspect of the present invention includes an optical element mounting package having the above structure, or an optical element mounting mother board having the above structure, and the optical element mounting package or the optical element mounting mother board being mounted. And an optical element mounted on the section, and a lid provided so as to close the recess.

According to the optical element mounting package according to one aspect of the present invention, with the above configuration , the mounting portion of the optical element and the portion that reflects the light emitted from the optical element are included in the bottom surface of the recess, or Since the heat transfer path from the mounting part and the part that reflects the light emitted from the optical element to the bottom surface of the recess is shortened, the heat of the optical element and the light emitted from the optical element are reduced when the electronic device is operated. The heat of the reflected part is easily dissipated to the outside, and the excitation in the optical element is suppressed and the output of the light is suppressed from decreasing, and the part that reflects the light emitted from the optical element is suppressed from being distorted. As a result, the emission direction of the light emitted from the optical element becomes a desired optical path, and the deviation of the emission direction of the light is suppressed, which suppresses the occurrence of unevenness of the light amount in the electronic device equipped with the optical element. Further, the reduction of the light quantity is suppressed, and as a result, the electronic device equipped with the optical element can emit the necessary light quantity.

An optical element mounting mother board according to an aspect of the present invention has an mother board on which a plurality of optical element mounting packages having the above-mentioned configuration are arranged vertically and horizontally in a plan view, thereby providing an electronic device on which an optical element is mounted. It is possible to suppress the occurrence of unevenness in the amount of light in the device and to suppress the decrease in the amount of light, and as a result, it is possible to make an electronic device equipped with an optical element emit a required amount of light.

An electronic device according to an aspect of the present invention is mounted on an optical element mounting package having the above configuration or an optical element mounting mother board having the above configuration, and an optical element mounting package or an optical element mounting mother board mounting portion. By having the optical element and the lid provided so as to close the concave portion, it is possible to suppress the occurrence of unevenness of the light amount in the electronic device in which the optical element is mounted, and to generate the necessary light amount. It can be a device.

FIG. 4 is a top view showing an example of an electronic device excluding a lid body in the embodiment of the present invention. FIG. 2 is a vertical cross-sectional view taken along line AA of the electronic device including the lid body in FIG. 1. It is a top view which shows the other example of the electronic device except the lid in the reference example of this invention. FIG. 4 is a vertical cross-sectional view taken along line AA of the electronic device including the lid body in FIG. 3. FIG. 6 is a vertical cross-sectional view showing another example of the electronic device in the embodiment of the present invention. (A) is a longitudinal cross-sectional view showing another example of the electronic device including the lid body in the embodiment of the present invention, and (b) is an enlarged longitudinal cross-sectional view of a main part in a B portion of (a). .. FIG. 6 is a vertical cross-sectional view showing another example of the electronic device in the embodiment of the present invention. FIG. 6 is a top view showing another example of the electronic device excluding the lid body in the embodiment of the present invention. FIG. 9 is a vertical cross-sectional view taken along the line AA of the electronic device including the lid body in FIG. 8. It is a longitudinal section showing another example of an electronic device in a reference example of the present invention. FIG. 6 is a vertical cross-sectional view showing another example of the electronic device in the embodiment of the present invention. FIG. 6 is a vertical cross-sectional view showing another example of the electronic device in the embodiment of the present invention.

Exemplary embodiments of the present invention will be described with reference to the drawings.

An electronic device according to an embodiment of the present invention will be described with reference to FIGS. The electronic device according to the present embodiment includes an optical element mounting package 1, an optical element 2 mounted on the optical element mounting package 1, and a lid 4.

The optical element mounting package 1 of the present embodiment has a base 11 having a recess 13 in which an optical element 2 such as a laser diode is mounted.

In the present embodiment, the base 11 has a recess 13 on the bottom surface on which the optical element 2 is mounted.

The base 11 functions as a mounting member for mounting the optical element 2, and the optical element is provided on the metal layer 14 (which may be included in the wiring conductor 12) provided on the mounting portion 11b in the bottom surface of the recess 13. 2 are joined via a joining material 5 such as solder.

For the base 11, ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used. The base 11 may be formed by laminating a plurality of insulating layers made of such ceramics, or may be formed by pressing a ceramic green sheet using a mold that can be formed into a predetermined shape. May be.

When the base 11 is made of a resin material, for example, a fluorine resin such as an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a polyester resin, or a tetrafluoroethylene resin is used. it can.

If the base 11 is formed by laminating a plurality of insulating layers made of, for example, an aluminum oxide sintered body, first, an organic material suitable for a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide and calcium oxide is used. Binder and solvent are added and mixed to form a slurry. Next, this is formed into a sheet by a doctor blade method, a calendar roll method or the like to obtain a ceramic green sheet. Thereafter, the ceramic green sheet is subjected to appropriate punching processing, and a plurality of this is laminated. Then, it is manufactured by firing it at a high temperature (about 1600°C). Alternatively, the ceramic green sheet may be formed into a predetermined shape by pressing using a die that can be formed into a predetermined shape, and the ceramic green sheet may be similarly fired at a high temperature.

The concave portion 13 has a step portion 11a provided on the bottom surface and a mounting portion 11b for the optical element 2 provided on the step portion 11a side of the upper bottom surface of the step portion 11a. In the example shown in FIGS. 1 to 5, the side wall of the recess 13 has a side surface perpendicular to the bottom surface, and the optical element 2 is mounted on the mounting portion 11b. The angle between the bottom surface of the recess 13 and the side surface of the side wall may be an obtuse angle of 95° to 100°.

Further, as in the example shown in FIG. 1 and FIG. 2, the concave portion 13 has a bottom surface on the lower side of the step portion 11a having a first inclined portion 11c inclined toward the mounting portion 11b side, and the first inclined portion 11c. , in the thickness direction of the base 11, from between the mounting portion 11b and the lower surface of the base 11, it is provided over between the upper surface of the mounting portion 11b and the base 11, the stepped portion 11a, first from the mounting portion 11b side The second inclined portion 11d is inclined toward the first inclined portion 11c, and the end of the second inclined portion 11d is provided so as to contact the end of the first inclined portion 11c. and a side surface which rises upward face of the base body 11 from the inclined portion 11c side. With such a configuration, the mounting portion 11b of the optical element 2 and a portion that reflects the light emitted from the optical element 2 are included in the bottom surface of the recess 13, or the mounting portion 11b of the optical element 2 and the optical element 2 are included. Since the heat transfer path from the part that reflects the light emitted from to the bottom surface of the concave portion 13 becomes short, the heat of the optical element 2 and the light emitted from the optical element 2 are reflected when the electronic device is operated. The heat of the part is easily dissipated to the outside, the excitation in the optical element 2 is prevented from being reduced, and the output of the light is prevented from being lowered, and the part which reflects the light emitted from the optical element 2, for example, the first inclined part is suppressed. 11c is suppressed from being distorted, the emission direction of the light emitted from the optical element 2 becomes a desired optical path, and the deviation of the emission direction of the optical element 2 is suppressed. It is possible to suppress the occurrence of the unevenness and the decrease of the light amount, and as a result, it is possible to make the electronic device equipped with the optical element 2 emit the necessary light amount.

In the longitudinal sectional view, if the angle α formed by the virtual straight line extending the mounting portion 11b and the first inclined portion 11c is set to 134° to 136°, the light emitted from the optical element 2 when the electronic device is operated. The emitted light is reflected by the first inclined portion 11c, the optical path of the light emitted from the optical element 2 is converted by 90°, and the light is emitted upward.

The recessed portion 13 provided with the stepped portion 11a, the mounting portion 11b, the first inclined portion 11c and the second inclined portion 11d described later is formed into a plurality of ceramic green sheets for the base 11 by laser processing or punching with a die. And the like, through holes which become the recesses 13 including the stepped portion 11a, the mounting portion 11b, the first inclined portion 11c, and the second inclined portion 11d are formed, respectively, and these ceramic green sheets are not formed into a ceramic green sheet. It can be formed by stacking on a sheet. Further, when the thickness of the base 11 is thin, the through hole that becomes the recess 13 may be formed by laminating ceramic green sheets and then performing laser processing, punching processing with a mold, or the like. Also in this case, the recess 13 can be processed with high precision, which is preferable. It should be noted that the recess 13 may be formed by so-called pressing using a die that can mold the ceramic green sheet on the base 11 having the recess 13 having a predetermined shape.

A metal layer 14 is provided on the mounting portion 11b in order to satisfactorily bond the optical element 2 via the bonding material 5.

For the metal layer 14, a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu) can be used. When the substrate 11 is made of, for example, an aluminum oxide sintered body, first, a conductive paste for the metal layer 14 is prepared by adding and mixing a suitable organic binder, a solvent and the like to a high melting point metal powder such as W, Mo or Mn. To prepare. Next, the conductor paste is printed and applied in a predetermined pattern on the ceramic green sheet to be the base 11 by a screen printing method. Then, this conductor paste having a predetermined pattern is fired at the same time as the ceramic green sheet that becomes the base 11. As a result, the metal layer 14 is deposited and formed on the base 11 at a predetermined position. It should be noted that, using the above-mentioned mold, the ceramic green sheet on which the pattern of the conductor paste for the metal layer 14 has been formed in advance is pressed to form the base 11 having the concave portion 13, and the base 11 is fired to form a predetermined base 11. You may make it form the metal layer 14 in a position.

Also, as in the example shown in FIGS. 1 to 12, the stepped portion 11a, that has a second inclined portion 11d which is inclined to the first inclined portion 11c side from the mounting portion 11b side. With such a configuration, when the optical element 2 is mounted on the mounting portion 11b, there is a contrast between the light reflected by the mounting portion 11b and the side surface of the step portion 11a, that is, the light reflected by the second inclined portion 11d. Since it becomes easier and the visibility in image recognition and the like increases, the optical element 2 uses the boundary between the mounting portion 11b and the second inclined portion 11d, that is, the corner 15 formed by the mounting portion 11b and the second inclined portion 11d as a reference for positioning. Can be accurately mounted on the mounting portion 11b. Further, when a light reflecting member 18 such as a mirror, which will be described later, is mounted on the first inclined portion 11c, positioning is facilitated by aligning the end portion of the light reflecting member 18 with the second inclined portion 11d, and accuracy is improved. It can be installed well.

In addition, since the corner portion 15 formed by the mounting portion 11b and the second inclined portion 11d serves as a positioning reference when the optical element 2 is mounted on the mounting portion 11b, the C surface or the R surface is not provided. May be. When the C surface or the R surface is provided in the corner portion 15, it is preferably C0.1 mm or less or R0.1 mm or less in a longitudinal sectional view. As a result, when the optical element 2 is mounted on the mounting portion 11b, the boundary between the light reflected by the mounting portion 11b and the light reflected by the second inclined portion 11d is likely to be clear and the visibility is good. Therefore, the corner portion 15 can be easily used as a positioning reference, and the optical element 2 can be mounted on the mounting portion 11b with high accuracy.

Further, when the angle β of the corner portion 15 is 130° to 140°, when the light reflecting member 18 such as a mirror is mounted on the first inclined portion 11c, the light reflecting member 18 is attached to the second inclined portion 11d. Positioning can be performed more easily and more accurately by aligning the ends.

An end of the second inclined portion 11d is that provided so as to contact with an end portion of the first inclined portion 11c. With such a configuration, compared to the case where the end of the first inclined portion 11c and the end of the second inclined portion 11d are separated from each other, the portion of the base body 11 where the thickness becomes smaller becomes a wider region. It is possible to prevent the occurrence of cracks and the like when stress such as an external force is applied to the optical element mounting package 1. If the end of the first sloped portion 11c and the end of the second sloped portion 11d are arcuate in a longitudinal sectional view, stress such as external force is applied to the optical element mounting package 1. In this case, it is possible to effectively suppress the occurrence of cracks and the like.

Further, the first inclined portion 11c has a reflection portion 16 that reflects the light emitted from the optical element 2. With such a configuration, when the electronic device is operated, the light emitted from the optical element 2 is reflected by the reflecting portion 16, and the optical path of the light emitted from the optical element 2 is converted by 90°. The light will be emitted upwards.

Further, as in the example shown in FIG. 5, the first inclined portion 11c has a reflective film 17 that reflects the light emitted from the optical element 2. With such a configuration, when the electronic device is operated, the light emitted from the optical element 2 is well reflected by the reflection film 17, and the optical path of the light emitted from the optical element 2 is converted by 90°. As a result, light is emitted upward.

The reflection film 17 is composed of, for example, a dielectric multilayer film or a dielectric vapor deposition film formed by using a thin film forming technique such as a vapor deposition method or a sputtering method, and a metal multilayer film or a metal vapor deposition film.

Further, as in the example shown in FIG. 6, the first inclined portion 11c has the light reflecting member mounting portion 18 of the light reflecting member 3 that reflects the light emitted from the optical element 2. With such a configuration, when the electronic device is operated, the light emitted from the optical element 2 is better reflected by the light reflecting member 3 mounted on the light reflecting member mounting portion 18, The optical path of the light emitted from the element 2 is changed by 90°, and the light is emitted upward.

The light reflecting member 3 is composed of a mirror in which a dielectric multilayer film, a dielectric vapor deposition film, a metal multilayer film, a metal vapor deposition film and the like are formed on a glass plate.

Note that the light reflecting member mounting portion 18 may be provided with the above-mentioned metal layer 14 in order to satisfactorily bond the light reflecting member 3 via the bonding material 5, as with the mounting portion 11b.

Further, the light reflecting member mounting portion 18 has a cutout portion 19. With such a configuration, when the light reflecting member 3 is joined to the light reflecting member mounting portion 18, the joining material 5 easily accumulates in the cutout portion 19, and the light reflecting member 3 is prevented from tilting at a predetermined inclination. It is suppressed from being displaced and tilted, and the light reflecting member 3 is easily mounted well at a predetermined tilt, that is, at an angle of 45° with respect to the light emitted from the optical element 2, and when the electronic device is operated, The light emitted from the optical element 2 is better reflected by the light reflecting member 3, the optical path of the light emitted from the optical element 2 is changed by 90°, and the light is emitted upward.

The wiring conductor 12 is provided on the front surface (the lower surface, the bottom surface of the recess 13) and the inside of the base 11. One end of the wiring conductor 12 is provided on the bottom surface of the recess 13, for example, and the other end of the wiring conductor 12 is provided on the lower surface of the base 11. Further, these are connected to each other by a wiring conductor (not shown) provided inside the base 11 as a through conductor, an interlayer conductor, or a side conductor having the side surface of the base 11 routed. The wiring conductor 12 is for electrically connecting the optical element 2 mounted on the optical element mounting package 1 and the external circuit board. Further, the wiring conductor 12 may be provided so as to include the metal layer 14.

The same metal material as that of the metal layer 14 can be used for the wiring conductor 12. If the base 11 is made of, for example, an aluminum oxide sintered body, first, a conductive paste for the wiring conductor 12 is prepared by adding and mixing a suitable organic binder, a solvent and the like to a high melting point metal powder such as W, Mo or Mn. To prepare. Next, the conductor paste is printed and applied in a predetermined pattern on the ceramic green sheet to be the base 11 by a screen printing method. Then, this conductor paste having a predetermined pattern is fired at the same time as the ceramic green sheet that becomes the base 11. As a result, the wiring conductor 12 is adhered and formed at a predetermined position on the base 11. When the wiring conductor 12 is a through conductor, a through hole is formed in the green sheet by punching or laser processing using a die or punching, and the through hole is filled with a conductor paste for the wiring conductor 12 by a printing method. It is formed by placing. In the same manner as the metal layer 14, the above-mentioned mold is used to press the ceramic green sheet on which the conductor paste for the wiring conductor 12 having a predetermined pattern is previously formed to form the base 11 and fire it. The wiring conductor 12 may be formed at a predetermined position on the base 11.

The exposed surface of the wiring conductor 12 and the metal layer 14 is preferably coated with a plating layer by electroplating or electroless plating. This plating layer is made of a metal such as nickel, copper, gold, or silver that has excellent corrosion resistance and excellent connectivity with the connecting member 6 such as a bonding wire connected to the electrode of the optical element 2. As the plating layer, for example, a nickel plating layer and a gold plating layer, or a nickel plating layer and a silver plating layer are sequentially deposited.

By depositing a copper plating layer having a thickness of about 10 to 80 μm on the metal layer 14 (or the wiring conductor 12) on which the optical element 2 is mounted, the heat of the optical element 2 can be easily dissipated well. You may. The wiring conductor 12 on the lower surface may be coated with a copper plating layer having a thickness of about 10 to 80 μm to facilitate heat dissipation from the optical element mounting package 1 to the external circuit board.

Further, as the plating layer, for example, a palladium plating layer made of a metal other than the above may be interposed.

When a plurality of electronic devices are mounted on an external circuit board via a brazing material such as solder, the light emitted from the optical element 2 is emitted in a desired direction (for example, upward). Although it is necessary to individually adjust the orientation of the electronic device, as in the example shown in FIGS. 8 to 12, an optical device having a mother substrate on which a plurality of optical element mounting packages 1 are arranged vertically and horizontally in a plan view. By using the element mounting mother board 21, a plurality of optical elements 2 are mounted, and the orientation of the electronic device having the optical element mounting mother board 21 may be adjusted, which is more efficient.

In the optical element mounting mother board 21, a plurality of each component of the optical element mounting package 1 of the mother board is arranged vertically and horizontally on the mother board in a plan view, and side walls of the concave portion 13 are provided on the peripheral edge of the mother board. The optical element mounting package 1 is manufactured in the same manner.

When the mounting portions 11b and the first inclined portions 11c are alternately arranged in a plan view as in the examples shown in FIGS. 8, 9 and 12, the mounting portion of the optical element mounting mother board 21 is changed. The optical element 2 mounted on the optical element 11b is arranged so that the bias is suppressed, and the heat of the optical element 2 which generates a large amount of heat in the optical element mounting mother board 21 when the electronic device is operated is a heat distribution in which the bias is suppressed. Therefore, it is easy to effectively diffuse the light to the outside, and it is possible to prevent the excitation in the optical element 2 from becoming good and suppress the decrease in the light output, and the decrease in the light amount is suppressed. As a result, the optical element 2 The electronic device equipped with can emit the required amount of light.

Further, when the mounting portions 11b are adjacent to each other and the first inclined portions are adjacent to each other in plan view as in the example shown in FIGS. 10 and 11, the light amount is partially increased. If desired, the light quantity can be easily increased without increasing the light output of the optical element 2.

The electronic device is manufactured by mounting the optical element 2 on the mounting portion 11b of the recess 13 of the optical element mounting package 1 and the optical element mounting mother board 21, and providing the lid 4 so as to close the recess 13. .. The optical element 2 is fixed on the metal layer 14 (which may be included in the wiring conductor 12) by a bonding material 5 such as solder, and then is connected to the electrode of the optical element 2 via a connecting member 6 such as a bonding wire. By being electrically connected to the wiring conductor 12, it is mounted on the optical element mounting package 1 and the optical element mounting mother board 21.

The optical element 2 is a semiconductor optical element such as a laser diode.

The recess 13 is sealed by a lid 4 made of glass, ceramics or metal. When the lid 4 is made of glass, it is sealed with a sealing material made of low melting point glass or the like. When the lid 4 is made of ceramics or metal, it is sealed with a sealing material made of a brazing material or the like. Further, when the lid 4 made of glass or ceramics has a light-transmitting property, the light emitted from the optical element 2 and emitted upward is not blocked by the reflecting portion, and the light is emitted from the electronic device. Emitted well.

When the lid 4 has the lens 4a as in the example shown in FIGS. 7 and 12, the light emitted from the optical element 2 and emitted upward at the reflecting portion has a short optical path through the lens 4a. The light amount can be made incident on the light source and the attenuation of the light quantity can be suppressed. Even if the lid 4 does not have a light-transmitting property, the light is satisfactorily emitted from the electronic device without being blocked. In this case, the lens 4a is arranged so as to overlap with a portion where light is reflected in plan view, that is, any one of the first inclined portion 11c, the reflecting portion 16, the reflecting film 17, and the light reflecting member 3.

Further, when the optical element 2 is mounted on the mounting portion 11b such that the end (that is, the edge or the end face) of the end portion overlaps the corner portion 15, a part of the light emitted from the optical element 2 will be part of the corner portion 15. Since it is hard to be blocked by, the decrease in the amount of light is effectively suppressed, and as a result, the electronic device equipped with the optical element 2 can emit the required amount of light.

Next, a method of manufacturing the optical element mounting package 1 and the optical element mounting mother board 21 of the present embodiment will be described.

The base 11 is made of, for example, an aluminum oxide (Al ₂ O ₃ ) sintered material, and has a recess 13 on the bottom surface of which the mounting portion 11b of the optical element 2 is provided. When the substrate 11 is made of an aluminum oxide sintered body whose main component is aluminum oxide (Al ₂ O ₃ ), Al ₂ O ₃ powder is added to silica (SiO ₂ ) or magnesia (MgO) as a sintering aid. ), calcia (CaO), and the like, and an appropriate binder, solvent, and plasticizer are added, and the mixture is kneaded to form a slurry. Then, a ceramic green sheet for a multi-piece substrate is obtained by a molding method such as a doctor blade method.

Using this ceramic green sheet, the optical element mounting package 1 and the optical element mounting mother board 21 are manufactured by the following steps (1) to (5).

(1) A punching process using a punching die for a portion which becomes the recess 13 having the step portion 11a, the mounting portion 11b, the first inclined portion 11c, the second inclined portion 11d and the cutout portion 19.

The first inclined portion 11c and the second inclined portion 11d may be formed by pressing a jig or the like against the ceramic green sheet.

(2) A wiring conductor 12 including an internal conductor and a through conductor, which is formed in a predetermined pattern on the bottom surface, side surface of the concave portion 13 and inside, upper surface, outer surface, and lower surface of the base 11, and the mounting portion 11b of the concave portion 13. Conductive paste printing and filling steps for forming the respective metal layers 14 formed in the portions to be the target.

(3) A step of producing a ceramic green sheet laminate by laminating ceramic green sheets to be an insulating layer. Alternatively, instead of these steps (1) to (3), (3)' corresponding to each base 11, the stepped portion 11a, the mounting portion 11b, the first inclined portion 11c, the second inclined portion 11d and the notch. A step of pressing a ceramic green sheet on which a conductor paste for the wiring conductor 12 is formed in a predetermined pattern using a mold that can be molded into the shape of the recess 13 having the portion 19 to produce a molded body.

(4) The ceramic green sheet laminate (or molded body) is fired at a temperature of about 1500 to 1800° C. to form a multi-piece substrate in which a plurality of bases 11 having wiring conductors 12 and metal layers 14 are arranged vertically and horizontally. Step of obtaining the optical element mounting mother board 21.

(5) Dividing grooves are formed on the multi-cavity substrate obtained by firing along the outer edge of the optical element mounting package 1, and the individual substrates 11 are broken along the dividing grooves. A step of dividing or cutting the multi-cavity substrate into individual bases 11 along a location serving as an outer edge of the optical element mounting package 1 by a slicing method or the like.

Note that the dividing groove can be formed by cutting a plurality of multi-piece substrates with a slicing device having a thickness smaller than the thickness thereof after firing. Alternatively, it may be formed by pressing a cutter blade against the ceramic green sheet laminate (or molded body) for a multi-piece substrate or by cutting the ceramic green sheet laminate with a slicing device to have a smaller thickness than that. .. When a molded body is produced, the ceramic green sheet may be pressed as a mold that can be molded into a shape having a dividing groove.

Further, in the above-mentioned process, the wiring conductor 12 and the metal layer 14 are printed on the ceramic green sheet for the base 11 with a conductive paste in a predetermined pattern by a screen printing method or the like, and the conductor paste is printed on the ceramic green for the base 11. By firing at the same time as the sheet, each substrate 11 is formed at a predetermined position. In the wiring conductor 12, a through conductor penetrating the ceramic green sheet in the thickness direction may be formed by filling the through holes formed in the ceramic green sheet with a conductor paste by printing. Such a conductor paste is prepared by adding a suitable solvent and a binder to a metal powder such as tungsten, molybdenum, manganese, silver or copper and kneading the mixture to adjust the viscosity to an appropriate level. The conductor paste may contain glass, ceramics or the like in order to enhance the bonding strength with the base 11.

In addition, a nickel plating layer having a thickness of 0.5 to 5 μm and a gold plating layer having a thickness of 0.1 to 3 μm are sequentially deposited on the exposed surfaces of the wiring conductor 12 and the metal layer 14, or the thickness is 1 to 10
It is preferable to sequentially deposit a nickel plating layer having a thickness of 0.1 μm and a silver plating layer having a thickness of 0.1 to 1 μm. As a result, it is possible to effectively suppress the corrosion of the wiring conductor 12 and the metal layer 14, and to join the metal layer 14 and the optical element 2 with the joining material 5, and to connect the wiring conductor 12 and the connecting member 6 such as a bonding wire. The connection and the connection between the wiring conductor 12 and the wiring of the external circuit board can be strengthened.

An electronic device in which the optical element 2 and the optical reflecting member 3 are mounted on the optical element mounting package 1 and the optical element mounting mother board 21 thus formed, and which is sealed by the lid 4, By mounting the brazing material such as solder on the external circuit board, the optical element 2 inside the electronic device is electrically connected to the external circuit board through the wiring conductor 12. At this time, the respective electrodes of the optical element 2 are electrically connected to the optical element mounting package 1 and the wiring conductors 12 of the optical element mounting mother board 21 by connecting terminals such as bonding wires.

According to the optical element mounting package 1 of the present embodiment, light is emitted in one direction provided on the stepped portion 11a provided on the bottom surface and on the stepped portion 11a side of the upper bottom surface of the stepped portion 11a. It includes a base body 11 having a concave portion 13 having a mounting portion 11b for the optical element 2 which is one laser diode, and a bottom surface on the lower side of the step portion 11a has a first inclined portion 11c inclined to the mounting portion 11b side. and, the first inclined portion 11c, in the thickness direction of the base 11, from between the mounting portion 11b and the lower surface of the base 11, is provided over between the upper surface of the mounting portion 11b and the base 11, the step portion 11a Has a second inclined portion 11d inclined from the mounting portion 11b side to the first inclined portion 11c side, and an end portion of the second inclined portion 11d is provided so as to contact an end portion of the first inclined portion 11c. cage, the recess 13, since it has a side surface which rises upward surface of the substrate 11 from the first inclined portion 11c side, and reflects light emitted from the mounting portion 11b and the optical element 2 of the optical element 2 The electronic device is operated because the portion is included in the bottom surface of the concave portion 13 or the heat transfer path from the mounting portion 11b of the optical element 2 and the portion that reflects the light emitted from the optical element 2 to the bottom surface of the concave portion 13 is shortened. When this is done, the heat of the optical element 2 and the heat of the part that reflects the light emitted from the optical element 2 are likely to be dissipated to the outside, and the excitation in the optical element 2 becomes good and the light output is reduced. This suppresses the distortion of the part that reflects the light emitted from the optical element 2, for example, the first inclined portion 11c, and the emission direction of the light emitted from the optical element 2 becomes a desired optical path. The emission direction of the light is prevented from shifting, the unevenness of the light quantity is suppressed from occurring in the electronic device equipped with the optical element 2, and the decrease of the light quantity is also suppressed. The mounted electronic device may emit the required amount of light.

According to the optical element mounting mother board 21 of the present embodiment, the optical element 2 is mounted by having the mother substrate in which a plurality of the optical element mounting packages 1 having the above-described configuration are arranged vertically and horizontally in a plan view. It is possible to suppress the unevenness of the light amount in the electronic device and to suppress the decrease in the light amount, and as a result, the electronic device equipped with the optical element 2 can emit the required light amount.

According to the electronic device of the present embodiment, the optical element mounting package 1 having the above configuration or the optical element mounting mother board 21 having the above configuration, and the mounting portion 11b of the optical element mounting package 1 or the optical element mounting mother board 21 are provided. By having the optical element 2 mounted on the optical element 2 and the lid body 4 provided so as to close the concave portion 13, it is possible to suppress the occurrence of unevenness in the amount of light in the electronic device on which the optical element 2 is mounted. In addition, the electronic device can emit a required amount of light.

1... Package for mounting optical element
11... Base body
11a...Step
11b...Mounting part
11c...first inclined portion
11d: second inclined portion
12...Wiring conductors
13...
14... Metal layer
15...・Corner
16---Reflector
17...Reflective film
18....Mounting part for light reflecting member
19....Notch
21 ··· Optical element mounting mother board 2 ··· Optical element 3 ··· Light reflecting member (mirror)
4... Lid 5... Joining material 6... Connecting member

Claims (10)

A recess having a step portion provided on the bottom surface and an optical element mounting portion which is one laser diode that emits light in one direction and is provided on the step portion side of the bottom surface above the step portion. Including a substrate having
The bottom surface below the step portion has a first inclined portion inclined toward the mounting portion side,
First inclined portion, in the thickness direction of the substrate from between the lower surface and the mounting portion of the base, provided over between the upper surface of the said mounting portion substrate,
The stepped portion has a second inclined portion inclined from the mounting portion side to the first inclined portion side,
The end of the second inclined portion is provided so as to contact the end of the first inclined portion,
The recess, an optical element mounting package, characterized in that the said first inclined portion has a side surface which rises upward surface of the substrate. The optical element mounting package according to claim 1, wherein the first inclined portion has a reflecting portion that reflects light emitted from the optical element. The optical element mounting package according to claim 1, wherein the first inclined portion has a reflective film that reflects light emitted from the optical element. The optical element mounting package according to claim 1, wherein the first inclined portion has a light reflecting member mounting portion of a light reflecting member that reflects light emitted from the optical element. The optical element mounting package according to claim 4, wherein the light reflecting member mounting portion has a concave cutout portion in a longitudinal sectional view. The optical element mounting mother board according to any one of claims 1 to 5, further comprising a mother board on which a plurality of the optical element mounting packages are arranged vertically and horizontally in a plan view. The optical element mounting mother board according to claim 6, wherein the mounting portions and the first inclined portions are arranged alternately in a plan view. The optical element mounting mother board according to claim 6, wherein the mounting portions are adjacent to each other and the first inclined portions are adjacent to each other in a plan view. An optical element mounting package according to any one of claims 1 to 5, or an optical element mounting mother substrate according to any one of claims 6 to 8,
An optical element mounted on the mounting portion of the optical element mounting package or the optical element mounting mother board;
An electronic device, comprising: a lid provided so as to close the recess. The electronic device according to claim 9, wherein the lid includes a lens.

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