JP6748892B2 - Dicing device, dicing method, and dicing tape - Google Patents

Description

The present invention relates to a dicing apparatus, a dicing method and the like, and more particularly to a dicing apparatus and a dicing method for dividing a work such as a semiconductor device or a wafer on which electronic components are formed into individual chips.

In a dicing device that divides a work such as a semiconductor device or a wafer on which electronic components are formed into individual chips, a blade that is rotated at high speed by a spindle, a work table that adsorbs and holds the work, and a work table and a blade An X, Y, Z, and θ drive unit that changes the relative position is provided. In this dicing device, the dicing process (cutting process) is performed by cutting the work with the blade while moving the blade and the work relatively with each drive unit.

In the dicing machine, it is an important factor to match the blade cut amount with the set value, and in order to match the blade cut amount with the set value, the Z axis, which is the cutting direction of the workpiece, is repeatedly positioned to achieve high accuracy. In addition, it is necessary to detect and correct the wear of the blade.

For example, as described in Patent Document 1, in the conventional positioning of the Z axis, the blade is first brought into contact with the upper surface of the work table to detect electrical conduction, and the central position of the blade at this time is used as a reference position for the Z axis. Control of. The operation of bringing this blade into contact with the upper surface of the work table to detect electrical conduction is called a cutter set. Further, in the blade wear correction, the blade and the work table are brought into contact with each other every time a set number of lines of the work are processed, and the reference position is corrected. However, in this method, the blade is brought into contact with the work table, which may damage the blade.

In order to solve the problem of the contact type cutter set, for example, Patent Document 2 proposes an optical type cutter set device. In this optical cutter setting device, the blade is moved between the light projecting means and the light receiving means in the Z-axis direction orthogonal to the optical axis, and the blade gradually blocks the detection light to reach a preset light receiving amount. The blade is positioned with reference to the center position of the blade at that time.

Japanese Patent Laid-Open No. 2003-211350 JP, 2003-234309, A

By the way, there are three types of blade dicing methods: half-cut, semi-full-cut, and full-cut. In recent years, along with the increase in the diameter of the work, a full-cut method for completely cutting the work has become mainstream. In the full-cut method, the work is attached to the dicing tape, placed on the work table, and the blade and the work table are moved relative to each other, while the blade cuts from the surface side of the work to the dicing tape. Is divided into individual chips.

However, the conventional technique described above has a problem in that it cannot sufficiently deal with dicing for performing full cutting of a work.

That is, in the case of the full cut method, it is necessary to control the cutting depth (cutting amount) of the blade so that the blade sufficiently penetrates the work and does not reach the work table.

For example, as shown in FIG. 22, when the work W is fully cut, the height of the blade 90 (the height from the surface of the work table to the center position of the blade 90) H is determined by the cutting depth D of the work W. Is positioned so as to be larger than the thickness M of the work W. Then, the work table (not shown) is cut and fed in the X direction with respect to the blade 90 that is rotated at a high speed, so that the work W is formed with a cutting groove 92 for one line.

However, when there is a variation in the thickness of the dicing tape T, for example, as shown in FIG. 23, when the dicing tape thickness K1 is thinner than the dicing tape thickness K shown in FIG. 22 has a cutting depth D1 smaller than the cutting depth D shown in FIG. That is, the blade 90 is shallowly cut with respect to the work W. In this case, the blade 90 does not sufficiently cut into the work W, which causes cutting failure.

On the other hand, as shown in FIG. 24, in a portion where the dicing tape thickness K2 is thicker than the dicing tape thickness K shown in FIG. 22, the cutting depth D2 into the work W is the cutting depth D shown in FIG. Will be bigger than. That is, the blade 90 is deeply cut with respect to the work W. In this case, the blade 90 cuts into the dicing tape T more than necessary. Therefore, the blade 90 is likely to be clogged with the adhesive or the like on the surface of the dicing tape, which causes the sharpness of the blade 90 to deteriorate.

In this way, even if the blade is set to a predetermined height, if there is thickness variation in the dicing tape, the cutting depth of the blade varies, resulting in stable processing quality. There may be problems. Not only the thickness variation of the dicing tape, but the same problem occurs due to the waviness of the surface of the work table and the abrasion of the blade.

Particularly in recent years, the blade width of the blade has tended to become thinner as the number of chips per wafer increases. When the blade width becomes thin, the abrasive grains of the blade also decrease accordingly, so that the blade is likely to be clogged with the adhesive or the like on the surface of the dicing tape, and the above-mentioned problem becomes more remarkable.

The present invention has been made in view of the above circumstances, and provides a dicing apparatus, a dicing method, and a dicing tape that can stabilize the processing quality without being affected by variations in the thickness of the dicing tape. The purpose is to

In order to achieve the above object, the following inventions are provided.

A dicing device according to a first aspect of the present invention is a dicing device that performs dicing processing by relatively moving a blade rotating by a spindle and a work table while holding a work on a work table via a dicing tape. Based on the cutting trace detection unit that detects the cutting trace information formed on the surface area of the dicing tape where the work is not attached, and the cutting trace information detected by the cutting trace detection unit, the cutting depth to the dicing tape is And a control unit that controls the height of the blade so as to be constant.

A dicing apparatus according to a second aspect of the present invention is a dicing apparatus that performs dicing processing by relatively moving a blade rotating by a spindle and a work table while holding a work on a work table via a dicing tape. , Cutting mark detection for detecting cutting mark information formed on the surface area of the dicing tape in which the work is not attached and the unevenness is periodically provided along the relative movement direction of the blade and the work table And a control unit that controls the height of the blade so that the cutting depth into the dicing tape becomes constant based on the cutting trace information detected by the cutting trace detection unit.

A dicing apparatus according to a third aspect of the present invention is the plate according to the second aspect, which is disposed between the work table and the dicing tape and in which irregularities are periodically formed along the relative movement direction of the blade and the work table. In addition, a concavo-convex member is further provided, and the dicing tape is adsorbed to the work table via the plate-shaped member so that irregularities are formed in the surface area of the dicing tape.

A dicing device according to a fourth aspect of the present invention is the dicing device according to the second aspect, wherein irregularities are periodically formed on the surface of the work table along the relative movement direction of the blade and the work table, and the dicing tape is used as a work piece. By adsorbing to the table, unevenness is formed in the surface area of the dicing tape.

5th aspect of this invention is a dicing tape used for the dicing apparatus of 2nd aspect, Comprising: The base material of a dicing tape and the unevenness|corrugation provided in at least 1 side of an adhesive agent layer, The surface of a dicing tape by unevenness|corrugation The unevenness of the area is configured.

In the dicing device according to the sixth aspect of the present invention, in any one of the first aspect to the fifth aspect, the cutting trace detection unit calculates a cutting trace formation rate in the surface area of the dicing tape based on the cutting trace information, The control unit controls the height of the blade based on the cutting trace formation rate calculated by the cutting trace detection unit so that the cutting trace formation rate falls within a certain range.

A dicing device according to a seventh aspect of the present invention is a dicing device that performs dicing processing by relatively moving a blade rotating by a spindle and a work table while holding a work on a work table via a dicing tape. Is a cutting trace formation control unit that forms cutting traces in the surface area of the dicing tape where the work is not attached, and moves the blade in the direction away from the dicing tape with the relative movement of the blade and the work table. Based on the cutting trace formation control unit that forms a cutting trace vanishing point, the cutting trace detecting unit that detects the cutting trace information including the information about the position of the cutting trace vanishing point, and the cutting trace information detected by the cutting trace detecting unit, And a control unit that controls the height of the blade so that the cutting depth into the dicing tape is constant.

A dicing apparatus according to an eighth aspect of the present invention is the dicing apparatus according to any one of the first to seventh aspects, including an imaging device arranged at a position facing the work table, and the cutting trace detection unit is imaged by the imaging device. Cutting trace information is detected based on the image data of the surface area of the dicing tape.

A dicing apparatus according to a ninth aspect of the present invention is the dicing apparatus according to the eighth aspect, wherein the imaging device is an alignment camera.

A dicing apparatus according to a tenth aspect of the present invention is the dicing apparatus according to any one of the first to seventh aspects, which is provided with a distance measuring device arranged at a position facing the work table, and the cutting trace detecting unit measures with the distance measuring device. Cutting trace information is detected based on the distance data indicating the distance to the surface area of the dicing tape.

A dicing method according to a twelfth aspect of the present invention is a dicing method for performing dicing processing by relatively moving a blade rotating by a spindle and a work table in a state where a work is held on a work table via a dicing tape. , Based on the detection step that detects the cutting trace information formed in the surface area of the dicing tape where the work is not attached and the cutting trace information detected in the detection step, the cutting depth to the dicing tape becomes constant And a control step for controlling the height of the blade.

A dicing method according to a thirteenth aspect of the present invention is a dicing method for performing dicing processing by relatively moving a blade rotating by a spindle and a work table while holding a work on a work table via a dicing tape. A detection step of detecting cutting trace information formed on the surface area of the dicing tape in which the work is not attached and the unevenness is periodically provided along the relative movement direction of the blade and the work table. A control step of controlling the height of the blade so that the cutting depth into the dicing tape becomes constant based on the cutting trace information detected in the detecting step.

A dicing method according to a fourteenth aspect of the present invention is the dicing method according to the thirteenth aspect, wherein unevenness is formed in a surface region of the dicing tape by providing unevenness on at least one of the base material and the adhesive layer of the dicing tape. Is.

A dicing method according to a fifteenth aspect of the present invention is the dicing method according to the thirteenth aspect, wherein a plate-shaped member having irregularities formed periodically along a relative movement direction of the blade and the work table is provided between the work table and the dicing tape. And the dicing tape is adsorbed to the work table through the plate-shaped member to form irregularities in the surface area of the dicing tape.

A dicing method according to a sixteenth aspect of the present invention is the dicing method according to the thirteenth aspect, wherein irregularities are periodically formed on a surface of the work table along a relative movement direction of the blade and the work table. The surface of the dicing tape is made to have irregularities by being attracted to the table.

A dicing method according to a seventeenth aspect of the present invention is a dicing method of performing dicing processing by relatively moving a blade rotating by a spindle and a work table in a state where a work is held on the work table via a dicing tape. The step of forming cutting marks in the surface area of the dicing tape where the work is not attached, the cutting marks disappear by moving the blade away from the dicing tape as the blade moves relative to the work table. Forming step to form points, detection step to detect cutting trace information including information on the position of the cutting trace vanishing point, calculate blade diameter from cutting trace information, and cut into dicing tape based on blade diameter And a control step of controlling the height of the blade so that the depth becomes constant.

The dicing method according to the eighteenth aspect of the present invention further comprises, in the seventeenth aspect, a step of storing log data relating to the position of the blade at each time point when the cutting trace is formed, and the cutting trace vanishing point in the detecting step. The information about the position of is acquired from the log data.

In the dicing method according to the nineteenth aspect of the present invention, in the forming step of the seventeenth aspect or the eighteenth aspect, cutting marks are formed in the dicing tape region on the cutout side of the work.

A dicing method according to a twentieth aspect of the present invention is the dicing method according to any one of the seventeenth aspect to the nineteenth aspect, wherein the forming step and the detecting step are performed every at least one processing line.

According to the present invention, it is possible to stabilize the processing quality without being affected by variations in the thickness of the dicing tape.

Schematic diagram showing the configuration of the dicing apparatus according to the present embodiment Plan view showing the work Schematic diagram showing how the dicing process is performed on the workpiece Schematic diagram showing how the imaging device images the dicing tape area Schematic showing how the line sensor camera images the dicing tape area Figure showing an example of the correction table The figure which showed the concrete operation example in this embodiment. Diagram showing examples of cutting marks Sectional drawing which shows the 1st example which provided the unevenness|corrugation on the surface of the dicing tape. Sectional drawing which shows the 2nd example which provided the unevenness|corrugation on the surface of the dicing tape. Sectional drawing which shows the 3rd example which provided the unevenness|corrugation on the surface of the dicing tape. Sectional drawing which shows the 4th example which provided the unevenness|corrugation on the surface of the dicing tape. Sectional drawing which shows the 5th example which provided the unevenness|corrugation on the surface of the dicing tape. The figure which shows the example which imaged the cutting mark Flowchart showing the flow of cutting trace detection operation and blade height correction operation of the present embodiment Schematic diagram showing how the dicing process is performed on the workpiece The figure which shows the procedure which forms the cutting trace in the dicing tape area|region of the cut-out side. Plan view showing cutting marks A flowchart showing a dicing method according to an embodiment of the present invention. Schematic showing the configuration of a dicing apparatus according to another embodiment A diagram showing an example of a height graph generated by the cutting mark detection unit Diagram for explaining conventional problems Diagram for explaining conventional problems Diagram for explaining conventional problems

Embodiments of the present invention will be described below with reference to the accompanying drawings.

<First Embodiment>
[Configuration of dicing device 10]
FIG. 1 is a schematic diagram showing the configuration of a dicing device 10 according to the first embodiment.

As shown in FIG. 1, the dicing device 10 includes a work table 12, a θ table 14, an X table 16, a blade 18, a spindle 20, a Y table (not shown), and a Z table (not shown). The image pickup device 22 and the control device 50 are provided.

The work table 12 adsorbs and holds the work W. The work W is attached to the frame F via a dicing tape T having an adhesive on the surface thereof, and is adsorbed and held on the work table 12. The frame F to which the dicing tape T is attached is held by a frame holding means (not shown) arranged on the work table 12.

FIG. 2 is a plan view showing the work W. As shown in FIG. 2, processing lines (planned dividing lines) S are formed in a grid pattern on the surface of the work W, and devices are respectively formed in a plurality of regions (device forming regions) C partitioned by these processing lines S. Are formed.

Returning to FIG. 1, the X table 16 is provided on the upper surface of an X base (not shown). The X table 16 is configured to be movable in the X direction by an X drive unit (not shown) including a motor and a ball screw. The θ table 14 is placed on the X table 16, and the work table 12 is attached to the θ table 14. The θ table 14 is configured to be rotatable in the θ direction (rotational direction around the Z axis) by a rotation drive unit (not shown) including a motor and the like.

The Y table is provided on the side surface of the Y base (not shown). The Y table is configured to be movable in the Y direction by a Y drive unit (not shown) including a motor and a ball screw. A Z table (not shown) is attached to the Y table. The Z table is configured to be movable in the Z direction by a Z drive unit (not shown) including a motor and a ball screw. A spindle 20 with a built-in high-frequency motor having a blade 18 attached to the tip thereof is fixed to the Z table.

With this configuration, the blade 18 is index-fed in the Y direction and is cut and fed in the Z direction. Further, the work table 12 is rotated in the θ direction and is cut and fed in the X direction.

The spindle 20 is rotated at a high speed, for example, at 30,000 rpm to 60,000 rpm.

The blade 18 is a cutting blade configured in a thin disk shape. As the blade 18, an electrodeposition blade in which diamond abrasive grains or CBN (Cubic Boron Nitride) abrasive grains are electrodeposited with nickel, a resin blade in which resin is bonded, or the like is used. The size of the blade 18 is variously selected depending on the processing content, but when dicing an ordinary semiconductor wafer as the work W, a blade having a diameter of 50 mm and a thickness of about 30 μm is used.

The imaging device 22 is arranged at a position facing the work table 12. The imaging device 22 images the surface of the work W in order to evaluate (kerf check) the alignment and the processing state of the work W. The image pickup device 22 is an example of the image pickup device (alignment camera) of the present invention.

The imaging device 22 includes a microscope, a camera, and the like, and images the surface of the work W at a high magnification (for example, 8.0 times) or a low magnification (for example, 1.0 times) by switching the lens of the microscope. It is possible. An area sensor camera is used as the camera.

The imaging device 22 is fixed to the spindle 20 via a holding member 24, and is movable together with the spindle 20 in the Y direction and the Z direction.

The control device 50 controls the operation of each part of the dicing device 10. The control device 50 is realized by a general-purpose computer such as a personal computer or a microcomputer.

The control device 50 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a hard disk, and the like. In the control device 50, various programs such as a control program stored in the ROM are expanded in the RAM, and the programs expanded in the RAM are executed by the CPU, so that each unit shown in the control device 50 in FIG. The function is realized.

The control device 50 functions as a cutting mark detection unit 52, a storage unit 54, and a control unit 56.

The control unit 56 controls the operation of each unit of the control device 50. Specifically, the control unit 56 controls the cutting feed of the work table 12 in the X direction via the X drive unit and the rotation of the work table 12 in the θ direction via the θ drive unit. Further, the control unit 56 controls the Y-direction index feed of the spindle 20 via the Y drive unit and the Z-direction cutting feed of the spindle 20 via the Z drive unit. Further, the control unit 56 controls the rotation operation of the spindle 20 and the imaging operation of the imaging device 22.

The storage unit 54 stores various data necessary for the operation of the dicing device 10. The storage unit 54 also includes data regarding the work W, data regarding alignment, and the thickness of the dicing tape T. For example, as the data regarding the work W, there are a product type number, a material, an outer dimension, a thickness, a chip size, and the like. In addition, the storage unit 54 also stores a cutting mark formation rate Q, a correction table (see FIG. 6), and the like, which will be described later.

The cutting trace detection unit 52 receives the image data captured by the imaging device 22 during the dicing process and detects the cutting trace information described below by image processing or the like.

[Operation of dicing device 10]
Next, the operation of the dicing device 10 thus configured will be described.

First, the work W attached to the frame F via the dicing tape T is transported by the transport means (not shown) and placed on the work table 12. The image of the work W placed on the work table 12 is picked up by the image pickup device 22, and the alignment operation for relative positioning between the work W and the blade 18 is started.

When the alignment operation is completed, the spindle 20 is activated to rotate the blade 18, and cutting water and cooling water are supplied from various nozzles (not shown) provided in a wheel cover (not shown) that covers the blade 18. In this state, the work table 12 is cut and fed in the X direction and the spindle 20 is cut and fed in the Z direction to dice the work W along the machining line S. The spindle 20 is index-fed in the Y direction every time one line is processed, and when the processing in one direction is completed, the work table 12 is rotated by 90 degrees and the work W is dicing processed in a lattice shape.

In the present embodiment, during the dicing processing of the work W, a cutting trace detecting operation and a blade height correcting operation described later are performed for each processing line S.

In the present embodiment, the cutting trace detecting operation and the blade height correcting operation, which will be described later, are performed for each processing line S, but the present invention is not limited to this. For each processing line number specified by the user (for example, It may be carried out every 5 processing lines). Alternatively, the processing may be performed on the processing line S designated by the user (for example, the processing line S such as the first line, the fifth line, the seventh line).

(Cutting trace detection operation)
Next, the cutting mark detection operation will be described.

FIG. 3 is a schematic diagram showing how the work W is subjected to the dicing process.

In the present embodiment, as shown in FIG. 3, the blade 18 moves relative to the work W from the cutting start position P1 on one side to the cutting end position P4 on the other side across the work W while dicing. Processing is performed. At this time, a cutting groove 26 is formed in the work W, and a surface area R of the dicing tape T (hereinafter, referred to as “dicing tape area R”) to which the work W is not attached is cut by the blade 18. Traces 28 are formed.

For example, when the cutting marks 28 in the dicing tape region R are short and fine as a whole (see FIG. 3) or when there are no cutting marks 28 at all, the blade 18 is cut into shallow pieces. Has become. In this case, the blade 18 does not sufficiently cut into the work W, which causes cutting failure.

On the other hand, when the cutting traces 28 in the dicing tape region R are generally long, the blade 18 is deeply cut. In this case, the blade 18 may be clogged, resulting in poor sharpness.

As a result of repeated studies, the present inventor corrects the height (position in the Z direction) of the blade 18 based on the cutting trace formation rate Q in the dicing tape region R in order to stabilize the processing quality. I found something good. Here, the cutting trace formation rate Q is the ratio of the region (length in the cutting feed direction) in which the cutting trace 28 is formed in the dicing tape region R to the entire length (total length in the cutting feed direction of the dicing tape region R). Say.

The cutting trace detection operation in this embodiment is performed by imaging the dicing tape region R with the imaging device 22.

FIG. 4 is a schematic diagram showing how the imaging device 22 images the dicing tape region R. As shown in FIG. 4, the imaging device 22 images a plurality of dicing tape regions R at high magnification while shifting the position with respect to the dicing tape region R in the X direction, and divides the dicing tape region R into a plurality of divided images. Image the whole. The image data captured by the image capturing device 22 is output to the control device 50. The imaging device 22 may image a wide range of the dicing tape area R at a low magnification.

In the present embodiment, the area sensor camera is used as the camera forming the image pickup device 22, but the invention is not limited to this, and a line sensor camera may be used, for example.

FIG. 5 is a schematic diagram showing how the line sensor camera 30 images the dicing tape area R. As shown in FIG. 5, the line sensor camera 30 has a plurality of light receiving elements (not shown) arranged in a line in the Y direction, and captures the entire dicing tape region R while scanning in the X direction. Has become.

The cutting trace detection unit 52 detects the length of the cutting trace 28 formed in the dicing tape region R (length in the cutting feed direction) by performing image processing on the image data captured by the imaging device 22 by a known method. To do. Further, the cutting trace detection unit 52 calculates the cutting trace formation rate Q in the dicing tape region R based on the detected length of the cutting trace 28.

Here, a method of calculating the cutting trace formation rate Q in the dicing tape region R will be described.

In FIG. 3, when the blade 18 moves relative to the work W from the cutting start position P1 to the cutting end position P4, the position at which the blade 18 starts cutting into the work W is referred to as the work entry position P2, and the blade 18 The position at which the cutting into W is finished is defined as the work exit position P3.

At this time, the cutting traces 28 are formed in the dicing tape area R1 between the cutting start position P1 and the work entry position P2, and in the dicing tape area R2 between the work exit position P3 and the cutting end position P4.

The total length of the dicing tape regions R1 and R2 in the cutting feed direction (X direction) is L1 and L2, respectively, and the total length of the cutting marks 28 formed in the dicing tape regions R1 and R2 is l1, L2. For example, as shown in FIG. 3, when a plurality of cutting marks 28 are formed in the dicing tape region R1, the total length of the cutting marks 28 is set to l1. The same applies to the dicing tape area R2.

The cutting trace detection unit 52 calculates the cutting trace formation rate Q by the following equation (1). The cutting trace formation rate Q is stored in the storage unit 54 in association with the processing line information (processing line number, etc.) when the cutting trace 28 was formed. The unit of the cutting mark formation rate Q is %.

Q={(l1+l2)/(L1+L2)}×100 (1)
(Blade height correction operation)
Next, the blade height correction operation will be described.

In the blade height correction operation, the control unit 56 acquires the cutting trace forming rate Q of the reference line from the storage unit 54. The reference line is the processing line S on which the dicing process has been performed immediately before the current processing line S, and the cutting trace formation rate Q has already been calculated by the above-described cutting trace detection operation.

The control unit 56 further determines the blade height correction amount G corresponding to the cutting trace formation rate Q of the reference line according to the correction table (see FIG. 6) stored in the storage unit 54. Then, the control unit 56 controls the height of the blade 18 (position in the Z direction) based on the determined blade height correction amount G.

(Correction table)
FIG. 6 is a diagram showing an example of the correction table. As shown in FIG. 6, the correction table shows the correspondence between the cutting trace formation rate Q and the blade height correction amount G. This correction table also includes the target cutting trace formation rate (target formation rate) and its permissible range (target formation rate permissible range). The numerical values in the correction table can be set by the user as appropriate through an operation unit (not shown) connected to the control device 50. Further, when the blade height correction amount G is a positive value, the blade height correction amount G indicates correction in the direction in which the cutting depth into the work W becomes deeper, and when it is a negative value, the setting value is set. The correction in the direction in which the cutting depth from the to W becomes shallower is shown.

(Specific operation example)
FIG. 7 is a diagram showing a specific operation example in this embodiment. In order to simplify the description, a case will be described in which four processing lines S1 to S4 along the cutting feed direction (X direction) are subjected to dicing processing in the order of line numbers.

As shown in FIG. 7, first, dicing processing is performed on the first processing line S1. In this case, since there is no reference line, the control unit 56 sets the blade height correction amount G to 0, and leaves the height of the blade 18 unchanged and remains at the set value. Further, the cutting trace detection unit 52 calculates the cutting trace formation rate (23% in this example) of the first processing line S1 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, the dicing process is performed on the second processing line S2. In this case, the control unit 56 acquires the cutting trace formation rate Q (23%) of the first processing line S1 that is the reference line from the storage unit 54. Then, the control unit 56 determines the blade height correction amount G to be +0.006 mm, and controls the height of the blade 18 according to the blade height correction amount G. Further, the cutting trace detection unit 52 calculates the cutting trace formation rate (78% in this example) of the second processing line S2 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, dicing processing is performed on the third processing line S3. In this case, the control unit 56 acquires the cutting trace formation rate (78%) of the second processing line S2, which is the reference line, from the storage unit 54. At this time, since the cutting mark formation rate (78%) exceeds the allowable range (±5%) of the target rate (70%), the control unit 56 determines the blade height correction amount G to be −0.001 mm. Then, the height of the blade 18 is controlled according to the blade height correction amount G. Further, the cutting trace detection unit 52 calculates the cutting trace formation rate (73% in this example) of the third processing line S3 based on the image data captured by the imaging device 22, and stores it in the storage unit 54.

Next, dicing processing is performed on the fourth processing line S4. In this case, the control unit 56 acquires the cutting trace formation rate (73%) of the third processing line S3, which is the reference line, from the storage unit 54. At this time, since the cutting mark formation rate (73%) is within the allowable range (±5%) of the target rate (70%), the control unit 56 determines the blade height correction amount G to be 0 mm, and determines that blade. The height of the blade 18 is controlled according to the height correction amount G.

Next, a specific example of the cutting mark 28 will be described with reference to FIG. FIG. 8 is a diagram (photograph) showing an example of imaging a cutting mark.

In the example shown in FIG. 8, a plurality of cutting traces 28 are formed along the processing line S, and the cutting trace formation rate Q (Ratio in the figure) is 20%. Therefore, when the cutting marks 28 are formed, the blade 18
It can be seen that the lowest point in the Z direction was on the +Z side with respect to the average value of the thickness variations (irregularities) of the dicing tape T.

The control unit 56 determines the blade height correction amount G to be +0.01 mm based on the cutting trace formation rate Q (20%) of the processing line S and the correction table, and determines the height of the blade 18 according to the blade height correction amount G. To control.

(Variation in dicing tape thickness)
By the way, when the thickness variation (unevenness) of the dicing tape T is large as compared with the case where the thickness variation (unevenness) of the dicing tape T is small, even if the height variation of the blade 18 is small, It is possible to grasp the fluctuation as a change in the cutting mark formation rate Q. Therefore, by increasing the variation in thickness (unevenness) of the dicing tape T, the accuracy of height adjustment of the blade 18 can be improved.

Therefore, in the following example, an example will be described in which the variation of the cutting trace formation rate Q according to the variation of the height of the blade 18 is adjusted by providing the surface of the dicing tape T with unevenness. The following can be considered as an example in which the surface of the dicing tape T is provided with irregularities.

FIG. 9 is a cross-sectional view showing a first example in which unevenness is provided on the surface of the dicing tape.

In the example shown in FIG. 9, irregularities are formed on the base material B1 of the dicing tape T1. The irregularities are periodically formed along the relative movement direction (X-axis direction) between the blade 18 and the work table 12, and extend in the Y direction. An adhesive layer A1 having a constant thickness is formed on the surface of the base material B1.

The distance D1 between the peaks of the irregularities of the base material B1 (the difference in height between the peaks of the peaks and the peaks of the valley bottoms) is, for example, 5 μm to 10 μm. In addition, the repeating cycle of the unevenness in the X direction is, for example, 800 μm to 1 mm.

The cross-sectional shape of the unevenness of the base material B1 (shape with respect to the ZX plane) may be, for example, a curve (for example, a quadratic or higher-order curve, a sine wave) or a triangular wave. In addition, when the uneven|corrugated cross-sectional shape (shape with respect to ZX plane) of the base material B1 is made into a triangular wave, there is an advantage that the relationship between the height (cutting depth) of the blade 18 and the cutting trace formation rate Q becomes linear. is there.

According to the example shown in FIG. 9, by providing the surface of the dicing tape T with irregularities, it is possible to prevent the cutting trace formation rate Q from greatly fluctuating in accordance with the fluctuation of the height of the blade 18, so that the blade It is possible to ensure the accuracy of height adjustment of 18.

FIG. 10: is sectional drawing which shows the 2nd example which provided the unevenness|corrugation on the surface of the dicing tape.

In the example shown in FIG. 10, the base material B2 of the dicing tape T2 has a constant thickness. Then, irregularities are periodically formed on the surface of the adhesive layer A2 formed on the surface of the base material B1 along the X-axis direction.

FIG. 11 is a sectional view showing a third example in which the surface of the dicing tape is provided with irregularities.

In the example shown in FIG. 11, irregularities are periodically formed on the base material B3 of the dicing tape T3 in the X-axis direction. Further, the adhesive layer A3 formed on the surface of the base material B3 also has irregularities periodically formed in the X-axis direction.

The distance between the peaks of the irregularities, the repeating cycle in the X direction, and the cross-sectional shape in the second and third examples can be the same as in the first example.

In addition, in the first to third examples, the dicing tapes T1 to T3 do not have to be provided with unevenness on the entire surface. For example, in the dicing tapes T1 to T3, concavities and convexities may be provided so as to surround the work W only in a region where the work W is not attached (at least one of the cut-out side region and the cut-out side region of the blade 18).

FIG. 12 is a cross-sectional view showing a fourth example in which irregularities are provided on the surface of the dicing tape.

In the example shown in FIG. 12, the thickness of the base material and the adhesive layer of the dicing tape T is constant.

In the example shown in FIG. 12, a plate member 70 is provided between the work table 12 and the dicing tape T. Concavities and convexities are formed on the surface of the plate member 70 periodically along the X-axis direction. The distance between the peaks of the irregularities of the plate member 70 (the difference in height between the peaks of the peaks and the peaks of the valley bottoms) is 5 μm to 10 μm in one example, and the repetition cycle of the irregularities in the X direction is 800 μm to 1 mm in one example. .. In addition, the cross-sectional shape of the unevenness may be a curved line or a triangular wave, as in the first to third examples.

The plate member 70 is a porous member having a plurality of through holes (not shown) extending in the Z direction. The work table 12 can adsorb and hold the dicing tape T through the through hole. By thus sucking the dicing tape T via the plate-shaped member 70, it becomes possible to make the surface of the dicing tape T uneven. As a result, it is possible to prevent the cutting trace formation rate Q from largely changing according to the change in the height of the blade 18.

In the example shown in FIG. 12, the plate member 70 may have a planar shape corresponding to the area where the work W is not attached, for example, a shape surrounding the work W.

FIG. 13 is a cross-sectional view showing a fifth example in which unevenness is provided on the surface of the dicing tape.

In the example shown in FIG. 13, the thickness of the base material and the adhesive layer of the dicing tape T is constant.

In the example shown in FIG. 13, irregularities are periodically formed on the surface of the work table 12 along the X-axis direction. The distance between the apexes of the irregularities of the work table 12 (the difference in height between the apex of the peak and the apex of the valley bottom) is 5 μm to 10 μm in one example, and the repetition cycle of the irregularities in the X direction is 800 μm to 1 mm in one example. Further, the cross-sectional shape of the unevenness may be a curved line or a triangular wave, as in the first to fourth examples.

In the example shown in FIG. 13, the dicing tape T is attracted to the surface of the work table 12 provided with the irregularities on the surface, whereby the irregularities can be generated on the surface of the dicing tape T. As a result, it is possible to prevent the cutting trace formation rate Q from largely changing according to the change in the height of the blade 18.

Note that, in the example shown in FIG. 13, the unevenness may be provided only on the surface of the work table 12 where the work W is not attached. Further, in the example shown in FIG. 13, the unevenness is formed on the surface of the work table 12, but, for example, the adsorption porous on the surface of the work table 12 may be used as the recess.

(Specific examples of cutting marks)
Next, a specific example of the cutting mark 28 will be described with reference to FIG. FIG. 14 is a diagram (photograph) showing an example of imaging a cutting mark. In FIG. 14, a solid line showing the cross-sectional shape of the unevenness of the dicing tape T and a broken line showing the locus of the lower end portion of the blade 18 are shown in an overlapping manner.

In the example shown in FIG. 14, a plurality of cutting traces 28 are formed along the processing line S, and the cutting trace formation rate Q is 40%. Therefore, it is understood that the lowest point in the Z direction of the blade 18 at the time of forming the cutting marks 28 was on the +Z side with respect to the average value of the thickness variations (concavities and convexities) of the dicing tape T.

The control unit 56 determines the blade height correction amount G to be +0.006 mm from the cutting mark formation rate Q (40%) of the machining line S and the correction table, and according to the blade height correction amount G, the height of the blade 18 is increased. To control.

In the examples shown in FIGS. 9 to 14, by providing the surface of the dicing tape T with irregularities, it is possible to stabilize the processing quality without being affected by variations in the thickness of the dicing tape.

(flowchart)
FIG. 15 is a flowchart showing the flow of the cutting mark detection operation and the blade height correction operation of this embodiment.

First, when performing the dicing process on the work W, the control unit 56 confirms whether or not the cutting mark formation rate Q of the reference line is stored in the storage unit 54 (step S10).

When the cutting trace formation rate Q of the reference line exists in the storage unit 54 (YES in step S10), the control unit 56 controls the height of the blade 18 based on the cutting trace formation rate Q of the reference line ( Step S12). Specifically, the control unit 56 refers to the correction table stored in the storage unit 54 to determine the blade height correction amount G corresponding to the cutting trace formation rate Q of the reference line. Then, the control unit 56 controls the height of the blade 18 according to the determined blade height correction amount G. Then, it progresses to step S14. Step S12 is an example of the control step of the present invention.

On the other hand, when the cutting mark formation rate Q of the reference line does not exist in the storage unit 54 (NO in step S10), the process proceeds to step S14.

Next, the control unit 56 dices the work W with the blade 18 that rotates at high speed while relatively moving the blade 18 and the work W along the current machining line S (step S14).

Next, the dicing tape area R is imaged by the imaging device 22. Then, the cutting trace detection unit 52 acquires the image data captured by the image capturing device 22 and performs image processing on the image data by a known method to obtain information on the cutting trace 28 formed in the dicing tape area R ( The cutting trace information) is detected (step S16). The cutting trace information includes at least information about the length of the cutting trace 28 (length in the cutting feed direction). Step S16 is an example of the detection step of the present invention.

Next, the cutting trace detection unit 52 calculates the cutting trace formation rate Q in the dicing tape region R based on the detected cutting trace information (step S18). The calculation method of the cutting trace formation rate Q is as described above (see the equation (1)).

Next, the cutting trace detection unit 52 stores the calculated cutting trace formation rate Q in the storage unit 54 in association with the information (line information) regarding the processing line S (step S20).

Next, the control unit 56 determines whether or not the processing of all the processing lines S has been completed (step S22). If all the processing lines S have not been processed, the process moves to the next processing line S (step S24). Then, the processing from step S10 to step S22 is repeated until the processing of all the processing lines S is completed.

[Operation and effect of this embodiment]
Next, the function and effect of this embodiment will be described.

According to this embodiment, based on the cutting trace information in the dicing tape region R (the surface region of the dicing tape T to which the work W is not attached), the blade is adjusted so that the cutting depth into the dicing tape T becomes constant. The height of 18 is controlled. As a result, it is possible to make the cutting depth of the blade 18 into the dicing tape T relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, so that the processing quality is stabilized. be able to.

Further, according to the present embodiment, the cutting trace detecting unit 52 detects the cutting trace information in the dicing tape area R based on the image data captured by the image capturing device 22. The image pickup device 22 is composed of an alignment camera, and is originally provided in the dicing device 10, so that the problem of complication of the device structure and increase in cost does not occur.

In addition, in the present embodiment, the cutting trace information is detected based on the image data captured by the image capturing device 22, but the present invention is not limited to this. For example, a distance measuring device 32 (see FIG. 20) described later may be used. The cutting trace information may be detected by using it. Further, the cutting trace information may be visually detected.

Further, when the number of processing lines (for example, 2067 lines) is large, the amount of blade wear until the dicing processing of all the processing lines S is completed cannot be ignored. Therefore, conventionally, it was necessary to adjust the height of the blade 18 by performing the cutter set many times during the dicing process to measure the current blade wear amount. On the other hand, in the present embodiment, during the dicing processing of the work W, the cutting mark detection operation is performed for each processing line S. Therefore, since the current blade wear amount can be grasped in real time, it is not necessary to frequently perform the conventional blade wear amount measurement operation, and there is an advantage that the time until the dicing process is completed can be reduced. ..

Further, in the present embodiment, when dicing the current machining line S, the immediately preceding machining line S is used as a reference line to determine the blade height correction amount G using the cutting trace forming rate Q thereof. However, the present invention is not limited to this, and the machining line S that is temporally or spatially adjacent to or adjacent to the current machining line S may be used as the reference line. The adjacent processing line S means a processing line that is temporally or spatially adjacent to the current processing line S. Further, the processing lines S that are close to each other mean the processing lines S that are within a range of several lines (for example, 1 to 5 lines) temporally or spatially from the current processing line. Further, the reference line is not limited to one processing line S and may be a plurality of processing lines S. In this case, for example, the blade height correction amount G may be determined based on the average value of the cutting trace formation rates Q corresponding to the plurality of processing lines S, respectively.

Further, in the present embodiment, the cutting quality of the processing line S (first 1 to 3 lines) subjected to the dicing process may deteriorate until the height of the blade 18 becomes stable. This problem can be solved by performing dicing on the dicing tape T several times before actually starting the dicing process and adjusting the height of the blade 18 in advance and then performing the dicing process.

Further, in the present embodiment, in the cutting trace detection operation, the lengths of the cutting traces 28 on both the dicing tape region R1 on the cut side and the dicing tape region R2 on the cutout side are measured. Depending on the situation, the following operation can be considered.

(For workpieces with high cutting load)
Since the blade 18 is more worn during the dicing process, only the length of the cutting mark 28 existing in the dicing tape region R2 on the cutout side is measured. This is because the blade 18 is severely worn during the dicing process, and even if the length of the cutting mark 28 in the dicing tape region R1 on the cut side is measured, it does not serve as a reference for height correction of the blade 18.

(If you want to improve overall throughput)
Only the cutting trace 28 of the dicing tape region R1 on the cut side or the dicing tape region R2 on the cutout side is measured, and the time required for the cutting trace detection operation is shortened as compared with the case of measuring both sides. In this case, since it is not necessary to leave the cutting marks 28 on the dicing tape T on the side where the cutting marks 28 are not measured, it is possible to perform cutting at a position where the work W can be cut to the limit and further reduce the cutting time.

<Second Embodiment>
Next, a second embodiment of the present invention will be described. In the following description, the same components as those in the first embodiment will be designated by the same reference numerals and the description thereof will be omitted.

In the present embodiment, the cutting trace formation, the detection operation, and the blade height correction operation, which will be described later, are performed for each number of processing lines designated by the user (for example, every j processing lines). That is, the cutting trace formation, the detection operation, and the blade height correction operation are performed in the processing line S(i) where i=j×k+1 (j is an integer of 1 or more, k is an integer of 0 or more).

The cutting trace formation, the detection operation, and the blade height correction operation may be performed on the processing line S(i) (for example, i=1, 5, 7,...) Specified by the user. It may be performed for each line S (in this case, j=0).

(Cutting trace formation and detection operation)
Next, the cutting mark forming and detecting operation will be described.

FIG. 16 is a schematic diagram showing how the work W is subjected to the dicing process.

In the present embodiment, as shown in FIG. 16, the blade 18 is positioned relative to the work W from the cutting start position P1(i) on one side to the cutting end position P2(i) on the other side across the work W. Dicing processing is performed while moving physically (i is an integer of 1 or more). At this time, the cutting groove 26(i) is formed in the work W, and the surface region R (hereinafter, referred to as “dicing tape region R”) of the dicing tape T on the cutout side where the work W is not attached is formed. Has a cutting mark 28(i) formed by the blade 18.

In the present embodiment, in the dicing tape region R on the cut-out side of the work W, the scan control of the blade 18 is performed to form the cutting mark 28. Then, the height of the blade 18 is controlled according to the cutting trace information.

FIG. 17 is a diagram showing a procedure for forming cutting marks in the dicing tape area on the cutout side. 17A is a side view, and FIG. 17B is a plan view (a view taken along the arrow XVIIB in FIG. 17A).

In the present embodiment, when the blade 18 moves to the dicing tape region R on the cutout side, the control unit 56 (cutting trace formation control unit) moves (lowers) the blade 18 in the −Z direction as indicated by an arrow A1. And cut it into the dicing tape T. At this time, the position of the blade 18 in the ZX direction is adjusted so as not to contact the work W.

Here, the adjustment of the cutting depth of the blade 18 at the position of the arrow A1 may be manually performed by visual observation or by observing the surface of the dicing tape T in real time by the imaging device 22. Further, a sensor for measuring the torque applied to the spindle 20 is provided, and the control unit 56 automatically adjusts the depth when the cutting trace 28(i) is formed according to the change in the torque. Good. In this case, data regarding the relationship between the tape type (for example, material and thickness) and torque fluctuation is stored in the storage unit 54, and the control unit 56 determines the cutting depth of the blade 18 based on this data. It may be possible to make a determination.

Next, the control unit 56 continuously moves the blade 18 in the direction away from the dicing tape T (+Z direction) while relatively moving the blade 18 and the work W in the X direction, as indicated by arrow A2. (Rise) At this time, the magnitude of the moving (raising) speed of the blade 18 is set to be smaller than the magnitude of the moving speed of the blade 18 when the blade 18 descends as shown by the arrow A1. The control unit 56 acquires log data regarding the relative position of the blade 18 and the work W in the ZX direction, and stores the log data in the storage unit 54.

When the blade 18 is separated from the surface of the dicing tape T as shown in FIG. 17A, the cutting mark 28 is not formed (interrupted) as shown in FIG. 17B. The imaging device 22 captures an image of the cutting trace 28 including the cutting trace vanishing point P _E where the cutting trace 28 is discontinued (see FIGS. 5 to 7). The control unit 56 detects the cutting trace vanishing point P _E from the image, creates cutting trace information including the coordinates (X _E , Z _E ) of the center of the blade 18 corresponding to the cutting trace vanishing point P _E , and stores the information. It is stored in the unit 54. Then, the control unit 56, the Z coordinate _{Z E} in the cutting marks vanishing point _{P E,} and the Z coordinate _{Z T} of the surface of the dicing tape T, the diameter _r B of the blade _{18 (= | Z E -Z T} |) of calculate.

Next, the control unit 56 calculates the positional relationship between the lowest point of the blade 18 in the Z direction and the dicing tape T, and based on the cutting trace information when moving to the next processing line S(i). The height of the blade 18 is controlled. At this time, the control unit 56 makes the cutting depth into the dicing tape T constant based on the diameter r _{B of the} blade 18, the coordinates and the thickness of the surface of the work W, and the coordinates of the surface of the dicing tape T. The height of the blade 18 is controlled.

FIG. 18 is a plan view (photograph) showing cutting marks formed in the dicing tape region R on the cutout side.

In the example shown in FIG. 18, since the cutting trace forming operation is performed in the processing lines S(j×k+1) and S(j×(k+1)+1), the cutting traces 28 are compared with other processing lines. Is clearly formed. Thereby, the control unit 56 can easily detect the position where the cutting mark 28(i) is interrupted from the image.

[Dicing method]
Next, the dicing method according to this embodiment will be described with reference to FIG. FIG. 19 is a flowchart showing a dicing method according to the second embodiment of the present invention.

First, when the cutting of the first processing line S(1) is started (step S30), the control unit 56 controls the height of the blade 18 (step S32). In step S32, for example, the height of the blade 18 is controlled based on the design value of the diameter of the blade 18 stored in the storage unit 54 or the diameter of the blade 18 calculated in the immediately preceding dicing process.

Next, dicing processing (cutting) is performed on the processing line S(1) (step S34).

When the cutting of the processing line S(1) is completed and the blade 18 moves to the dicing tape region R on the cutout side, the control unit 56 performs a cutting trace forming operation (step S40). In step S40, as shown in FIG. 17, the control unit 56 lowers the blade 18 in the dicing tape region R and then gradually and continuously raises it while scanning in the X direction to form the cutting marks 28. Form. At this time, the control unit 56 creates log data of the coordinates of the blade 18 at each time point and stores the log data in the storage unit 54.

Next, the imaging device 22 images the cutting trace 28 formed on the cut-out side of the processing line S(1). The control unit 56 detects the cutting trace vanishing point P _E from the image of the cutting trace 28, and detects the cutting trace information including the coordinates of the cutting trace vanishing point P _E (step S42). The control unit 56 calculates the diameter r _{B of the} blade 18 based on the cutting trace information (step S44). The diameter r _{B of the} blade 18 is stored in the storage unit 54.

Next, the control unit 56 starts cutting of the next processing line S(2) and moves the blade 18 to the processing line S(2) (step S46). The control unit 56 controls the height of the blade 18 based on the diameter of the blade 18 calculated using the cutting trace information (step S48), and cuts the machining line S(2) (step S34). In step S48, the height of the blade 18 is controlled so that the cutting depth into the dicing tape T is constant.

Hereinafter, steps S34 to S52 are repeated, and the cutting of the processing line after S(3) is performed. The control of the height of the blade 18 based on the cutting trace information is performed every j lines.

That is, when i=j×k+1 (j is an integer of 1 or more, k is an integer of 0 or more) (Yes in step S38), the process proceeds to step S40, and the dicing tape on the cutout side of the processing line S(i) is used. In the region R, the cutting trace forming operation (step S40) and the cutting trace detecting operation (step S42), the calculation of the diameter r _B of the blade 18 based on the cutting trace information (step S44), and the next processing line S(i) The height of the blade 18 during cutting is controlled (steps S46 and S48). In step S44, the diameter r _{B of the} blade 18 stored in the storage unit 54 is updated.

On the other hand, when i≠j×k+1 (No in step S38), the height of the blade 18 is controlled after moving to the next processing line (step S50) (step S52). In step S52, the height of the blade 18 may be controlled based on the latest value of the diameter r _B of the blade 18 stored in the storage unit 54.

When the cutting of all the processing lines S(i) is completed (Yes in step S36), the process of FIG. 19 is completed.

[Operation and effect of this embodiment]
Next, the function and effect of this embodiment will be described.

According to this embodiment, the depth of cut into the dicing tape T becomes constant based on the cutting trace information in the dicing tape region R (the surface region of the dicing tape T on the cutout side where the work W is not attached). Thus, the height of the blade 18 is controlled. As a result, it is possible to make the cutting depth of the blade 18 into the dicing tape T relatively shallow and constant without being affected by variations in the thickness of the dicing tape T, so that the processing quality is stabilized. be able to.

Further, when the number of processing lines (for example, 2067 lines) is large, the amount of blade wear until the dicing processing of all the processing lines S is completed cannot be ignored. Therefore, conventionally, it was necessary to adjust the height of the blade 18 by performing the cutter set many times during the dicing process to measure the current blade wear amount. On the other hand, in the present embodiment, since the cutting trace forming and detecting operations are performed during the dicing process of the work W, the current blade wear amount can be grasped in real time. Therefore, it is not necessary to frequently perform the operation of measuring the amount of blade wear as in the related art, and there is an advantage that the time until the dicing process is completed can be reduced.

Further, in the present embodiment, the cutting marks 28 are formed and detected in the dicing tape region R on the cutout side, but the present invention is not limited to this. For example, the cutting trace forming and detecting operation may be performed on both the dicing tape area on the cut side and the dicing tape side, or may be performed only on the dicing tape area on the cut side.

[Other Embodiments]
FIG. 20 is a schematic diagram showing the configuration of a dicing apparatus 10A according to another embodiment. 20, the same components as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 20, a dicing device 10A according to another embodiment includes a distance measuring device 32 in addition to the configuration of the dicing device 10 according to the present embodiment.

The distance measuring device 32 is arranged at a position facing the work table 12. The distance measuring device 32 measures the distance to the surface of the dicing tape region R, which is the measurement target, and is composed of, for example, a laser displacement meter or an interference microscope. The measurement result of the distance measuring device 32 is output to the cutting mark detection unit 52 as distance data.

The distance measuring device 32 is fixed to the side surface of the image pickup device 22, and is movable together with the spindle 20 and the image pickup device 22 in the Y direction and the Z direction.

With this configuration, the distance measuring device 32 detects the dicing tape area R as the cutting trace detection operation (first embodiment) or the cutting trace formation and detection operation (second embodiment) performed during dicing of the work W. The distance to the dicing tape area R is measured while shifting the position in the X direction. The distance data, which is the measurement result of the distance measuring device 32, is output to the cutting mark detection unit 52.

The cutting trace detection unit 52 generates a height graph showing a change in height (unevenness state) in the dicing tape region R based on the distance data acquired from the distance measuring device 32.

FIG. 21 is a diagram showing an example of a height graph generated by the cutting mark detection unit 52. As shown in FIG. 21, in the generated height graph, the cutting trace detection unit 52 determines a region lower than a predetermined threshold height (height indicated by a broken line in FIG. 21) as a cutting trace formation region K (cutting trace). 28 is formed). Then, the cutting trace detection unit 52 calculates the cutting trace formation rate Q based on the detected cutting trace formation region K. The subsequent processing is the same as that of this embodiment.

According to another embodiment, the cutting trace information in the dicing tape region R (the surface region of the dicing tape T to which the work W is not attached) can be detected based on the measurement result of the distance measuring device 32. It is possible to stabilize the processing quality as in the case of the present embodiment described above.

Although one example of the present invention has been described in detail, the present invention is not limited to this, and it goes without saying that various improvements and modifications may be made without departing from the gist of the present invention.

10... Dicing device, 12... Work table, 14... θ table, 16... X table, 18... Blade, 20... Spindle, 22... Imaging device, 24... Holding member, 26... Cutting groove, 28... Cutting mark, 30... Line sensor camera, 32... Distance measuring device, 50... Control device, 52... Cutting trace detection unit, 54... Storage unit, 56... Control unit, 70... Plate member, 90... Blade, 92... Cutting groove, 94... Cutting Traces, W... Work, T... Dicing tape, Q... Cutting trace formation rate, G... Blade height correction amount

Claims (12)

A dicing device for performing a dicing process by relatively moving a blade rotating by a spindle and the work table while holding the work on the work table via a dicing tape,
Detects cutting trace information formed on the surface region of the dicing tape in which the work is not attached and the unevenness is periodically provided along the relative movement direction of the blade and the work table. A cutting mark detection unit,
Based on the cutting trace information detected by the cutting trace detection unit, a control unit for controlling the height of the blade so that the cutting depth to the dicing tape is constant,
A dicing device. The cutting trace detection unit calculates the cutting trace formation rate in the surface area of the dicing tape based on the cutting trace information,
The control unit controls the height of the blade so that the cutting trace formation rate is within a certain range based on the cutting trace formation rate calculated by the cutting trace detection unit.
The dicing device according to claim 1. An image pickup device is provided at a position opposite to the work table,
The cutting trace detection unit detects the cutting trace information based on image data of a surface region of the dicing tape captured by the image capturing device,
The dicing device according to claim 1. The imaging device includes an alignment camera,
The dicing device according to claim 3. A distance measuring device arranged at a position facing the work table,
The cutting trace detection unit detects the cutting trace information based on distance data indicating a distance to the surface area of the dicing tape measured by the distance measuring device,
The dicing device according to claim 1. A plate-shaped member that is disposed between the work table and the dicing tape and that has irregularities formed periodically along the relative movement direction of the blade and the work table is further provided.
By attracting the dicing tape to the work table via the plate-shaped member, unevenness is formed in the surface area of the dicing tape,
The dicing device according to claim 1. On the surface of the work table, irregularities are periodically formed along the relative movement direction of the blade and the work table,
By attracting the dicing tape to the work table, unevenness is formed in the surface area of the dicing tape,
The dicing device according to claim 1. A dicing tape used in the dicing device according to claim 1,
A dicing tape having concavities and convexities provided on at least one of the base material and the adhesive layer of the dicing tape, and the concavities and convexities of the surface region of the dicing tape are formed by the concavities and convexities. A dicing method for performing a dicing process by relatively moving a blade rotating by a spindle and the work table in a state where a work is held on the work table via a dicing tape,
Detects cutting trace information formed on the surface region of the dicing tape in which the work is not attached and the unevenness is periodically provided along the relative movement direction of the blade and the work table. A detection step,
Based on the cutting trace information detected in the detection step, a control step of controlling the height of the blade so that the cutting depth to the dicing tape is constant,
A dicing method comprising: By providing unevenness on at least one of the base material and the adhesive layer of the dicing tape, unevenness is formed in the surface area of the dicing tape,
The dicing method according to claim 9. A plate-like member having irregularities formed periodically along the relative movement direction of the blade and the work table is disposed between the work table and the dicing tape,
By attracting the dicing tape to the work table via the plate-shaped member, unevenness is formed in the surface area of the dicing tape,
The dicing method according to claim 9. On the surface of the work table, irregularities are periodically formed along the relative movement direction of the blade and the work table,
By attracting the dicing tape to the work table, to form irregularities in the surface area of the dicing tape,
The dicing method according to claim 9.