JP6750182B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus that performs various types of processing (for example, reactive ion etching using plasma) on various types of substrates including semiconductor substrates and the like.

Many substrate processing apparatuses that perform various types of processing on a substrate have a configuration in which a mounting plate for mounting the substrate is arranged in the processing chamber. In the substrate processing apparatus having such a configuration, a mechanism for moving the mounting plate up and down in the processing chamber may be provided. For example, in a device for performing reactive ion etching using inductively coupled plasma (ICP) (so-called inductively coupled reactive ion etching device (ICP-RIE)), it is provided above the processing chamber. Electric power is applied to the coil from a high frequency power source to turn the gas supplied into the processing chamber into plasma, and the plasma gas is used to process the substrate on the mounting plate. At this time, the concentration of plasma formed in the processing chamber becomes lower as the distance from the coil becomes larger (that is, as the position in the processing chamber becomes lower). Therefore, the mounting plate is moved up and down in the processing chamber to adjust the distance between the substrate and the coil, thereby adjusting the concentration of plasma to which the substrate is exposed.

FIG. 10 schematically shows an example of a mechanism for moving the mounting plate up and down in the processing chamber. Here, in the processing chamber 81, the mounting plate 82 on which the substrate 9 is mounted is arranged on the outside of the processing chamber 81 (generally, below the processing chamber 81) and the connecting plate 84. Are connected via. Connecting post 84 is covered with a bellows 85 provided between the mounting plate 82 process chamber 81 of the lower surface, thereby airtightness of the processing chamber 81 is maintained. In this configuration, when the elevating plate 83 is moved up and down, the mounting plate 82 moves up and down following the elevating plate 83.
In such a configuration, the mechanism for raising and lowering the elevating plate 83 includes, for example, a ball screw 86 inserted through a through hole formed in the elevating plate 83, and a ball screw provided between the through hole and the ball screw 86. A nut 87 that is screwed with 86, a rotation driving unit 88 that rotates the ball screw 86, and one guide rail 89 that is provided through the through hole formed in the elevating plate 83. It

In a substrate processing apparatus, it is important to provide such a lifting mechanism so that the substrate can be placed at an appropriate height, but the substrate placed at that height (that is, the mounting plate) is Maintaining a horizontal position is also important. This is because if the mounting plate is tilted, the processing on the substrate mounted on the mounting plate may become uneven.
For example, in the inductively coupled reactive ion etching apparatus, as described above, the concentration of the plasma formed in the processing chamber becomes lower as the position in the processing chamber becomes lower, so that the mounting plate is tilted, There may be a difference in plasma concentration at each position within the surface of the substrate, and the plasma processing may become non-uniform within the surface of the substrate.
Further, for example, a plate-shaped sputter source (target) is provided facing the mounting plate on which the substrate is mounted, a voltage is applied between the mounting plate and the target, and a film is formed on the substrate on the mounting plate by sputtering. When the mounting plate is tilted, the separation distance from the target is different at each position in the plane of the substrate. As a result, the thickness of the film formed on the substrate may become uneven.

JP 05-299381 A

For example, in the configuration shown in FIG. 10, the ball screw 86 and the guide rail 89 are provided on both sides of the connecting column 84 with the connecting column 84 interposed therebetween. According to this configuration, there is no restriction member on the side (side 831 or side 832) on the side where neither the ball screw 86 nor the guide rail 89 is provided, and the horizontal position on those sides is sufficient. Cannot be regulated. Therefore, for example, when the inside of the vacuum chamber 81 is brought into a vacuum state for performing the plasma processing, a vacuum force pulling the mounting plate 82 upward is applied to the mounting plate 82 due to a pressure difference between the atmospheric pressure and the vacuum pressure, and thus the mounting plate 82 is moved up and down. The plate 83 easily tilts. Further, for example, even when a load for inclining the lifting plate 83 is applied due to friction between the ball screw 86 and the nut 87, friction between the guide rail 89 and the lifting plate 83, etc. The plate 83 easily tilts.
Further, for example, in the configuration shown in FIG. 11, two ball screws 86 are provided on both sides of the connecting column 84, and a guide rail 89 is provided at a position 90° from the connecting column 84. Also in this configuration, there is no regulating member on the side 833 of the elevating plate 83 on the side opposite to the guide rail 89 with the connecting column 84 interposed therebetween, and the horizontal position on that side cannot be regulated sufficiently. Therefore, for example, when a load for inclining the mounting plate 82 is applied to the mounting plate 82 due to a vacuum force that pulls the mounting plate 82 upward due to a pressure difference between the atmospheric pressure and the vacuum pressure, the lifting plate 83 is also moved. 83 may tilt.

As described above, in the conventional lifting mechanism, the lifting plate 83 may tilt relatively easily. Since the mounting plate 82 is fixed to the elevating plate 83 by the long connecting pillars 84, even if the elevating plate 83 is slightly inclined, the mounting plate 82 (and by extension, the substrate mounted thereon) is largely inclined. .. As a result, the processing on the substrate may become uneven as described above.

The problem to be solved by the present invention is to provide a technique capable of sufficiently suppressing the mounting plate provided in the processing chamber from tilting.

The substrate processing apparatus according to the present invention made to solve the above problems,
A processing chamber,
A mounting plate disposed in the processing chamber, on which a substrate is mounted,
An elevating plate disposed outside the processing chamber,
One end is fixed to the mounting plate, the other end is fixed to the elevating plate, and a connecting column,
A drive device for elevating and lowering the elevating plate and guide shafts for elevating and lowering the elevating plate, which are provided at respective apexes of a polygon in which the connecting columns are located at the center of gravity of the elevating plate;
Equipped with.

In this structure, the drive device or the guide shaft is provided at each vertex of the polygon in which the connecting column is located at the center of gravity of the lift plate.
According to this structure, even when a local load is applied to the lift plate when it is lifted or stopped, the lift plate does not easily tilt, and the lift plate can continue to maintain the same posture. For example, because a vacuum force pulling the mounting plate upward is applied to the mounting plate due to the pressure difference between the atmospheric pressure and the vacuum pressure, a load that tilts the mounting plate is applied to the mounting plate. Even if a load is applied to the elevating plate to incline it due to friction between the plates, the elevating plate does not easily incline, and the elevating plate can be moved up and down in the same posture. Therefore, it is possible to sufficiently prevent the mounting plate (that is, the mounting plate that is connected to the elevating plate through the connecting column) from tilting.
However, in the above configuration, the "position where the drive device is provided" refers to the point of action at which the drive device acts on the lift plate. That is, here, the points of action of the drive device with respect to the elevating plate are at the respective vertices of the polygon whose center of gravity is the connecting column. Further, the “position where the guide shaft is provided” refers to the penetration position of the guide shaft that is provided so as to penetrate the lift plate. That is, here, the position where the guide shaft penetrates the lifting plate is at the apex of the polygon whose center of gravity is the connecting column.
Specifically, the drive device rotates, for example, a ball screw penetrating the lifting plate, a screwing part (for example, a nut) that is screwed with the ball screw and fixed to the lifting plate, and the ball screw. And a drive unit (for example, a motor). In this case, the position where the ball screw penetrates the lifting plate is the point of action of the drive device.
Alternatively, the driving device is, for example, a rod connected to the lower surface of the lifting plate at the tip, and an element for moving the rod in the axial direction (specifically, for example, various cylinders such as a pneumatic cylinder or a hydraulic cylinder, or An electric actuator including a ball screw and a drive unit that rotates the ball screw, and the like) may be included. In this case, the position where the tip of the rod is connected to the lift plate is the point of action of the drive device.

Preferably, in the substrate processing apparatus,
Comprising a plurality of the guide shafts,
The plurality of guide shafts,
Among the respective vertexes of the polygon whose center of gravity is the connecting column, they are provided at the apexes on the circumference centered on the connecting column.

According to this structure, since the plurality of guide shafts are provided at positions where the distances from the connecting columns are equal to each other, the moments of forces such as friction applied from the guide shafts to the lift plate are substantially equal. As a result, the posture of the lift plate (and thus the posture of the mounting plate) can be maintained particularly stable.

Preferably, the substrate processing apparatus is
Two of the driving devices and four of the guide shafts, which are provided at each vertex of a hexagon whose center of gravity is the connecting column,
Equipped with
The two driving devices are provided at a pair of vertices on the same diagonal among the vertices of the hexagon.

With this configuration, the two drive devices and the four guide shafts are arranged in a well-balanced manner, so that the attitude of the elevating plate (and thus the attitude of the mounting plate) can be maintained particularly stable.

Preferably, in the substrate processing apparatus,
A plurality of the drive devices,
Each of the plurality of drive devices,
Ball screw,
A rotation drive unit for rotating the ball screw,
Equipped with
The plurality of rotation drive units are synchronously controlled.

According to this structure, one rotation drive unit only has to rotate one ball screw. Therefore, the load applied to each rotary drive unit is small, and as a result, it is possible to employ a small rotary drive unit.

Preferably, in the substrate processing apparatus,
A bearing provided between the guide shaft and a through hole formed in the elevating plate through which the guide shaft penetrates,
Further equipped with,
The guide shaft has a circular cross section,
The bearing is
An outer cylinder having a tubular shape and the guide shaft inserted therein,
A plurality of balls rollably provided between the guide shaft and the outer cylinder;
Equipped with.

According to this configuration, for example, a linear guide (that is, a guide rail having a substantially rectangular cross section and a pair of opposing surfaces having a groove (a V-shaped groove in which a ball of a bearing rolls) is formed, and the guide rail extends over the guide rail The manufacturing cost can be reduced as compared with the case of using a guide mechanism including a bearing that is arranged.

According to the present invention, it is possible to sufficiently prevent the elevating plate from tilting, and as a result, it is possible to sufficiently suppress the mounting plate connected to the elevating plate from the tilting plate.

It is a figure which shows the principal part structure of a substrate processing apparatus. It is a figure which shows the structure of a raising/lowering mechanism typically. It is a figure which shows the structure of a guide shaft and a bearing typically. It is a top view of a lifting plate and is a figure showing an example of a layout of a penetration hole. It is a figure which shows another layout of a penetration position. It is a figure which shows another layout of a penetration position. It is a figure which shows another layout of a penetration position. It is a figure which shows another layout of a penetration position. It is a figure which shows the structure of the drive device which concerns on a modification typically. It is a schematic diagram for demonstrating the raising/lowering mechanism which concerns on the conventional structure. It is a schematic diagram for demonstrating the raising/lowering mechanism which concerns on the conventional structure.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiments are examples embodying the present invention and do not limit the technical scope of the present invention.

<1. Substrate processing apparatus 1>
The overall configuration of the substrate processing apparatus 1 according to the embodiment will be described with reference to FIG. FIG. 1 is a diagram showing a main part configuration of the substrate processing apparatus 1. In the following, the substrate processing apparatus 1 is an apparatus for performing reactive ion etching using inductively coupled plasma (ICP) (so-called inductively coupled reactive ion etching apparatus (ICP-RIE)). The case will be described.

The substrate processing apparatus 1 has a processing chamber 11 in which a processing space (processing space for performing etching processing) V is formed. The processing chamber 11 is erected on the base 102 via the legs 101 (see FIG. 2).
At the bottom of the processing chamber 11, a flat lower electrode (cathode) 12 is horizontally arranged. The substrate 9 (for example, a semiconductor substrate) to be processed is placed on the upper surface of the lower electrode 12. That is, here, the lower electrode 12 constitutes a mounting plate on which the substrate 9 is mounted. The lower electrode 12 is connected to a first high frequency power supply 15 via a blocking capacitor 13 and a first matching box 14. Further, the lower electrode 12 is provided with a cooling gas flow path (not shown) which allows helium gas to flow therethrough. The lower electrode 12 is further provided with an elevating mechanism 3 for elevating the lower electrode 12 (see FIG. 2). The lifting mechanism 3 will be described later.
A gas inlet 16 for introducing an etching gas into the processing space V is provided on the sidewall of the processing chamber 11. A gas exhaust port 17 for exhausting the processing space V using a vacuum pump (not shown) is provided on the side wall of the processing chamber 11. The vacuum pump and the gas exhaust port 17 form an exhaust unit that exhausts the processing space V.
A spiral coil 19 is provided above the processing chamber 11 via a dielectric window 18. One end of the coil 19 is connected to the second high frequency power supply 21 via the second matching unit 20, and the other end is directly connected to the second high frequency power supply 21.

In the substrate processing apparatus 1 having such a configuration, for example, when high-frequency power is supplied from the second high-frequency power source 21 to the spiral coil 19 while introducing the etching gas from the gas introduction port 16, plasma is generated and etching is performed. Radicals, ions, electrons, etc. are generated from the gas. When high frequency power is supplied to the lower electrode 12 from the first high frequency power supply 15 in this state, the electrons in the plasma follow the fluctuation of the electric field formed by the high frequency and jump into the lower electrode 12. Since the blocking capacitor 13 is connected to the lower electrode 12, when electrons jump in, a negative bias voltage (self-bias) is applied to the lower electrode 12, and the ions are accelerated toward the lower electrode 12.

<2. Lifting mechanism 3>
<i. Overall configuration>
As described above, the substrate processing apparatus 1 includes the elevating mechanism 3 that elevates and lowers the lower electrode 12 (that is, the lower electrode 12 that constitutes the mounting plate on which the substrate 9 is mounted in the processing chamber 11). The overall configuration of the lifting mechanism 3 will be described with reference to FIG. FIG. 2 is a diagram schematically showing the configuration of the lifting mechanism 3.

The elevating mechanism 3 includes an elevating plate 31 arranged in a horizontal position below the processing chamber 11. Three or more through holes 30 are formed in the lift plate 31. The number of through holes 30 formed is equal to the total number of drive devices 300 and guide shafts 38 described below, and the ball screw 34 or the guide shaft 38 of the drive device 300 is inserted into each through hole 30. .. Therefore, the sizes of the through holes 30 are not all equal, and for example, the through hole 30 into which the ball screw 34 is inserted is larger (or smaller) than the through hole 30 in which the guide shaft 38 is inserted. May be What layout is formed on the surface of the lift plate 31 with three or more through holes 30 (that is, at what position the ball screw 34 and the guide shaft 38 are penetrated on the surface of the lift plate 31). ) Will be described later.

The elevating plate 31 and the lower electrode 12 are connected to each other via a connecting column 32. That is, the connection column 32 is arranged so as to be inserted through the insertion port 111 formed at the bottom of the processing chamber 11 and extend in the vertical direction, and the upper end thereof is the lower surface of the lower electrode 12 (preferably, for example, The lower end is fixed to the upper surface (preferably, the upper geometrical center of gravity) of the elevating plate 31. The connection column 32 is formed of a hollow cylinder, and a wire or the like for supplying electric power to the lower electrode 12 is inserted into the hollow portion.
A bellows 33 is provided between the insertion port 111 and the lower electrode 12 to follow the vertical movement of the lower electrode 12, whereby the lower electrode 12 can be moved up and down while maintaining the airtightness of the processing chamber 11. It is like this.

The elevating mechanism 3 further includes one or more (preferably two or more) driving devices 300 that elevate and lower the elevating plate 31. Each drive device 300 includes a ball screw 34, a screwing portion 35 that is screwed into the ball screw 34, and a rotation drive portion 36 that rotates the ball screw 34.
Each ball screw 34 is arranged so as to extend in the vertical direction, and its upper end is preferably fixed to the lower surface of the processing chamber 11 via a bearing. In addition, each ball screw 34 is inserted into the through hole 30 provided in the elevating plate 31 while extending. Between the ball screw 34 and the through hole 30, a screwing portion 35 formed of, for example, a nut is provided. The screwing portion 35 is screwed with the ball screw 34 on the inner peripheral surface and is fixed to the through hole 30 on the outer peripheral surface.
At the lower end of each ball screw 34, a rotation drive unit 36 that rotates the ball screw 34 is provided. That is, the lifting mechanism 3 includes the same number of rotation driving units 36 as the ball screws 34. Each rotation drive unit 36 is specifically configured by, for example, a motor. Further, each rotation drive unit 36 is electrically connected to a rotation control unit 37, and the rotation speed, rotation start/stop timing, and the like are controlled by the rotation control unit 37.

The lifting mechanism 3 further includes one or more (preferably two or more) guide shafts 38 that guide the lifting of the lifting plate 31. Each guide shaft 38 is arranged so as to extend in the vertical direction, and preferably, the upper end thereof is fixed to the lower surface of the processing chamber 11 and the lower end thereof is fixed to the base 102. In addition, each guide shaft 38 is inserted into the through hole 30 formed in the elevating plate 31 during its extension. A bearing 39 is provided between the guide shaft 38 and the through hole 30. The guide shaft 38 is inserted into the bearing 39 on the inner peripheral side, and is fixed to the through hole 30 on the outer peripheral surface.

<ii. Guide shaft 38 and bearing 39>
Next, the configurations of the guide shaft 38 and the bearing 39 will be specifically described with reference to FIG. FIG. 3 is a diagram schematically showing the configurations of the guide shaft 38 and the bearing 39.

The guide shaft 38 is a rod-shaped member having a circular cross section (so-called linear shaft).
The bearing 39 is a so-called linear bush. That is, the bearing 39 includes a cylindrical outer cylinder 391, and the guide shaft 38 is inserted into the outer cylinder 391. Further, a plurality of elliptical grooves whose lengthwise direction extends along the extending direction of the cylinder are formed on the inner side surface of the outer cylinder 391, and a plurality of balls 392 are rollably accommodated in each groove. There is. Although the elevation plate 31 is not shown in FIG. 3, the outer cylinder 391 is fixed to the inner surface of the through hole 30 formed in the elevation plate 31 on the outer surface thereof.
In this configuration, the balls 392 roll along the outer peripheral surface of the guide shaft 38, so that the outer cylinder 391 (and thus the lift plate 31 fixed thereto) can move smoothly along the guide shaft 38. ing.

<iii. Forming Position of Through Hole 30>
As described above, the elevation plate 31 is provided with three or more through holes 30, and the ball screw 34 or the guide shaft 38 is inserted into each through hole 30. The layout of the through holes 30 (that is, the layout of the through positions of the ball screw 34 and the guide shaft 38) will be described with reference to FIGS. 4 to 6. Each of these drawings is a plan view of the lifting plate 31, and shows an example of the layout of the group of through holes 30.

The group of through holes 30 is a polygon whose center of gravity is the connecting column 32 (that is, the center of gravity (geometric center of gravity) on the surface of the lifting plate 31 is the same as the connecting position of the connecting column 32. Hereinafter, this polygon is also referred to as a “centroid-matching polygon”). The center-of-gravity matching polygon may be a regular polygon or may not be a regular polygon. Further, it does not necessarily have to be a convex polygon.

For example, when two ball screws 34 are provided and four guide shafts 38 are provided, six through holes 30 are formed in the lift plate 31.
In this case, for example, as shown in FIG. 4, six through holes 30 are provided at positions corresponding to the respective vertices of a hexagonal (hexagonal with the center of gravity) K6 having the connecting column 32 as the center of gravity. Here, further, four vertices (remaining four vertices other than a pair of vertices on the same diagonal line) of the positions of the vertices of the center-of-gravity matching hexagon K6 are connected to the connecting column 32. On a circle R centered around. That is, the four vertices have the same separation distance from the connection position.
Each of the four guide shafts 38 and the two ball screws 34 is provided so as to penetrate the elevating plate 31 at each apex of the center of gravity hexagon K6. Specifically, the guide shaft 38 is inserted into each of the four through holes 30 on the circumference R among the six through holes 30 formed at the positions corresponding to the vertices of the center-of-gravity matching hexagon K6. The ball screw 34 is inserted into each of the remaining two through holes 30 (that is, the two through holes formed at a pair of apexes on the same diagonal in the center of gravity hexagon K6).

Further, for example, when two ball screws 34 are provided and three guide shafts 38 are provided, five through holes 30 are formed in the elevating plate 31.
In this case, for example, as shown in FIG. 5, five through-holes 30 are provided at positions corresponding to the respective vertices of a pentagon (centroid matching pentagon) K5 having the connecting column 32 as the center of gravity. Here, further, three vertices (two vertices adjacent to each other and one vertex not adjacent to these two vertices) of the positions of the vertices of the pentagon K5 having the same center of gravity are connected. It is on the circumference R centered on the connection position with the pillar 32.
Three guide shafts 38 and two ball screws 34 are provided so as to penetrate the elevating plate 31 at each apex of the pentagon K5 that coincides with the center of gravity. Specifically, the guide shaft 38 is inserted into each of the three through holes 30 on the circumference R among the five through holes 30 formed at the positions corresponding to the vertices of the pentagon K5 that matches the center of gravity. The ball screw 34 is inserted into each of the remaining two through holes 30.

In addition, for example, when two ball screws 34 are provided and two guide shafts 38 are provided, four through holes 30 are formed in the elevating plate 31.
In this case, for example, as shown in FIG. 6 and FIG. 7, the four through holes 30 are provided at positions corresponding to the vertices of squares (centroid-matching squares) K4 and K4′ whose center of gravity is the connecting column 32. Set up. The centroid-matching quadrangle may be one in which each side is parallel to each side of the lift plate 31 (centroid-matching quadrangle K4) as illustrated in FIG. 6, or as illustrated in FIG. The diagonal line may be parallel to each side of the lift plate 31 (center-of-gravity matching quadrangle K4′). In the former case, it is also preferable that the center-of-gravity matching quadrangle K4 has a shape similar to the planar shape of the lift plate 31. Further, it is also preferable that the four vertices of the center-of-gravity coincident quadrangle K4, K4′ are on a circle R centered on the connection position with the connection column 32.
Two guide shafts 38 and two ball screws 34 are provided so as to penetrate the elevating plate 31 at the respective vertices of the centers of gravity K4, K4′. Specifically, of the four through holes 30 formed at the positions corresponding to the vertices of the center of gravity quadrangle K4, each of the two through holes 30 at the positions corresponding to a pair of vertices on the same diagonal line. The guide shaft 38 is inserted through the ball screw 34, and the ball screw 34 is inserted through each of the remaining two through holes 30.

Further, for example, when one ball screw 34 is provided and two guide shafts 38 are provided, three through holes 30 are formed in the elevating plate 31.
In this case, for example, as shown in FIG. 8, three through holes 30 are provided at positions corresponding to the respective vertices of a triangle (center-of-gravity matching triangle) K3 whose center of gravity is the connecting column 32. In this center-of-gravity triangle K3, it is also preferable that the three vertices are on the circumference R centered on the connecting position with the connecting column 32.
At each apex of the center-of-gravity coincident triangle K3, two guide shafts 38 and one ball screw 34 are provided so as to penetrate the elevating plate 31.

<iv. Operation of the lifting mechanism 3>
Next, the operation of the lifting mechanism 3 will be described.
When each rotation driving unit 36 rotates each ball screw 34 according to the control of the rotation control unit 37, the lift plate 31 screwed with the rotation driving unit 36 is guided by each guide shaft 38 while being guided by each ball screw 34. Go up and down along. However, when a plurality of ball screws 34 (and by extension, rotation drive units 36) are provided, the rotation control unit 37 synchronously controls the plurality of rotation drive units 36. Therefore, the plurality of ball screws 34 start to rotate at the same timing, rotate at the same number of rotations, and stop rotating at the same timing. As a result, the height position of each screwing portion 35 is always kept at the same position, and the lift plate 31 moves up and down while maintaining the horizontal posture.

As described above, here, the guide shaft 38 or the driving device 300 is provided at each vertex of the polygon (the center of gravity coincident polygon) in which the connecting column 32 is located at the center of gravity of the elevating plate 31. Therefore, even when a local load is applied to the lift plate 31 when the lift plate 31 is lifted or stationary, the lift plate 31 does not easily tilt, and the posture of the lift plate 31 can be maintained. For example, even when a load that tilts the ball screw 34 and the elevating plate 31 is applied to the elevating plate 31 at the time of elevating, the elevating plate 31 does not easily incline, and the elevating plate 31 remains the same. It can be raised and lowered while maintaining its posture. Therefore, it is possible to sufficiently prevent the lower electrode 12 (mounting plate) connected to the elevating plate 31 via the connecting column 32 from tilting.
In particular, when the plurality of guide shafts 38 are provided at positions where the distances from the connecting columns 32 are equal to each other, the moments of forces such as friction applied from the respective guide shafts 38 to the elevating plate 31 become substantially equal. Thereby, the posture of the lift plate 31 can be maintained particularly stable.

<3. Other Embodiments>
In the above-described embodiment, each drive device 300 that raises and lowers the lift plate 31 is configured to include the ball screw 34, the screwing portion 35, and the rotation drive portion 36. The configuration of the device 300 is not limited to this.
FIG. 9 illustrates a drive device 300a according to another embodiment. This drive device 300a includes a rod 34a arranged so as to extend in the vertical direction, and an element for moving the rod 34a in the axial direction (specifically, for example, various cylinders such as a pneumatic cylinder, a hydraulic cylinder, or a ball screw). And an electric actuator configured to include a rotation drive unit for rotating the same, and the like) 36a. In this case, the rod 34a does not need to be provided so as to penetrate the lift plate 31, and for example, the tip of the rod 34a is connected to the lower surface of the lift plate 31. In this case, the connection position becomes the point of action of the drive device 300a. Therefore, in this case, the connecting position is arranged at each apex of a polygon having the connecting column 32 of the elevating plate 31 as the position of the center of gravity (polygon matching the center of gravity). That is, in the above embodiment, the rod 34a is coupled to the position where the through hole 30 (for example, the through hole 30 into which the ball screw 34 is inserted in the above embodiment) is formed.
According to the configuration of this modification, the cylinder (or the electric actuator) 36a included in each drive device 300a moves each rod 34a synchronously along its axial direction under the control of the rod position control unit 37a. As a result, the elevating plate 31 connected to the tip of the elevating plate 31 moves up and down while maintaining a horizontal posture.

The number of the drive devices 300, the number of the guide shafts 38, and the layout of the drive devices 300 and the guide shafts 38 with respect to the lift plate 31 are not limited to those exemplified above. For example, in the above example, the drive device 300 may be provided at the position where the guide shaft 38 is provided, and vice versa. Further, in the above-described embodiment, the driving device 300 or the guide shaft 38 may be further provided outside the center-of-gravity polygon in which the driving device 300 and the guide shaft 38 are provided.

In addition, in the above-described embodiment, when a plurality of ball screws 34 are provided, the rotation driving unit 36 is provided on all of them (that is, all of the plurality of ball screws 34 are lift plates). However, it is not always necessary to provide the rotation driving unit 36 for each of all the ball screws 34. That is, when a plurality of ball screws 34 are provided, at least one of them may be provided with the rotation driving unit 36. In this case, the ball screw 34 not provided with the rotation driving unit 36 may be rotatably arranged.

Further, the substrate processing apparatus 1 may be an apparatus that performs various kinds of processing (for example, heating processing, coating processing, etc.) other than etching on the substrate 9.

1 Substrate Processing Device 11 Processing Chamber 12 Lower Electrode (Mounting Plate)
17 Gas Exhaust Port 3 Elevating Mechanism 300 Driving Device 31 Elevating Plate 30 Through Hole 32 Connecting Column 33 Bellows 34 Ball Screw 35 Screwing Part 36 Rotation Driving Unit 37 Rotation Control Unit 38 Guide Shaft 39 Bearing 391 Outer Cylinder 392 Ball 9 Board

Claims (4)

A processing chamber,
A mounting plate disposed in the processing chamber, on which a substrate is mounted,
An elevating plate disposed outside the processing chamber,
One end is fixed to the mounting plate, the other end is fixed to the elevating plate, and a connecting column,
A plurality of drive devices for moving up and down the lifting plate,
A guide shaft for guiding the lifting of the lifting plate,
Equipped with
In the lifting plate, to each of all vertices of a polygon to the connector stud and the center of gravity position, one of the plurality of drive device and the guide shaft is provided one by one,
Each of the plurality of drive devices includes a ball screw and a rotation drive unit that rotates the ball screw, and the plurality of rotation drive units are synchronously controlled.
Substrate processing equipment. The substrate processing apparatus according to claim 1, wherein
Comprising a plurality of the guide shafts,
The plurality of guide shafts,
Of each vertex of the polygon whose center of gravity is the connecting column, it is provided at the apex on the circumference centered on the connecting column,
Substrate processing equipment. The substrate processing apparatus according to claim 1, wherein
Two of the driving devices and four of the guide shafts, which are provided at each vertex of a hexagon whose center of gravity is the connecting column,
Equipped with
The two driving devices are provided at a pair of vertices on the same diagonal among the vertices of the hexagon.
Substrate processing equipment. The substrate processing apparatus according to any one of claims 1 to 3 ,
A bearing provided between the guide shaft and a through hole formed in the elevating plate through which the guide shaft penetrates,
Further equipped with,
The guide shaft has a circular cross section,
The bearing is
An outer cylinder having a tubular shape and the guide shaft inserted therein,
A plurality of balls rollably provided between the guide shaft and the outer cylinder;
With
Substrate processing equipment.

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