JP6754473B2 - Parts mounting device and parts mounting method - Google Patents

Description

The present invention relates to a component mounting device and a component mounting method.

Conventionally, a component mounting device for mounting a component on a substrate has been known. For example, in Patent Document 1, an electronic component (component) adsorbed on a suction nozzle of a transfer head is brought into contact with a circuit board by a lowering operation of the transfer head, and then a constant pressing force is applied to the component. , A component mounting device for fixing components to a substrate is disclosed. This component mounting device includes a pressing control unit that detects the pressing force applied to the component when the component is brought into contact with the substrate as a torque value, and a position detecting unit that detects the current position of the transfer head. When the detection torque value is detected when is larger than the constant pressing force and the position detection unit detects a predetermined mounting height value as the height of the component from the substrate, it is determined that the component is mounted on the substrate.

Japanese Unexamined Patent Publication No. 2001-196794

However, depending on the parts to be mounted on the board, the pressure applied when mounting the parts may change. In this case, the parts can be mounted simply by detecting the hit detection torque value as in the component mounting device described above. It is difficult to judge accurately.

An object of the present invention is to make it possible to more appropriately determine whether or not a component is mounted on a substrate.

The present invention has taken the following measures to achieve the above-mentioned main object.

The component mounting device of the present invention
It is a component mounting device that mounts the component on the board by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
A holding member that holds the parts and
An elevating means capable of elevating the holding member and
A pressure detecting means for detecting the pressure applied to the holding member, and
A mounting determination means for determining whether or not the component is mounted on the substrate,
With
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
According to the mounting determination means, the component is mounted on the substrate when an increase in the pressing force on the holding member is detected by the pressing force detecting means and a decrease in the pressing force is detected after the increase is detected. The gist is to judge.

In the component mounting device of the present invention, the component is mounted on the substrate by inserting the component insertion portion into the insertion portion of the substrate while applying pressure, and at least one of the component insertion portion and the substrate insertion portion is inserted. , The insertion part is elastically deformed in the process of being inserted into the inserted part, and after the insertion part is inserted into the inserted part by a predetermined amount, the elastic deformation is released so that the pressing force on the holding member increases. Is detected, and when the decrease in the pressing force is detected after the increase is detected, it is determined that the component is mounted on the substrate. In this way, it is determined that the insertion part of the component or the insertion part of the substrate is elastically deformed at the time of pressure insertion by the increase of the pressing force on the holding member, and the elastic deformation of the insertion part or the insertion part is released. Judgment is made by the decrease of the pressing force on the holding member. As a result, it is possible to more appropriately determine whether or not the component is mounted on the substrate.

In such a component mounting device of the present invention, the insertion portion of the component is elastically deformed in the process of being inserted into the inserted portion of the substrate, and when the insertion portion is inserted into the inserted portion by a predetermined amount, the insertion portion is elastically deformed. It is also possible to have an elastic locking claw that is released and locked to the inserted portion.

Further, the component mounting device of the present invention includes an elevating position detecting means for detecting an elevating position of the holding member, and the mounting determining means applies a pressing force after the increase in the pressing force is detected by the pressing force detecting means. When the descent is detected and the elevating position of the holding member detected by the elevating position detecting means is within a predetermined range including the target mounting position, it is determined that the component is mounted on the substrate. You can also do it. In this way, it is possible to more accurately determine whether or not the component is mounted on the substrate.

The component mounting method of the present invention
It is a component mounting method for mounting the component on the substrate by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
By lowering the component with a holding member capable of holding the component, the insertion portion of the component is inserted into the inserted portion of the substrate while being pressed, an increase in the pressing force is detected, and the increase is detected and then applied. The gist is to determine that the component is mounted on the substrate when a drop in pressure is detected.

In the component mounting method of the present invention, the component is mounted on the substrate by inserting the component insertion portion into the insertion portion of the substrate while applying pressure, and at least one of the component insertion portion and the substrate insertion portion is inserted. , The insertion part is elastically deformed in the process of being inserted into the inserted part, and after the insertion part is inserted into the inserted part by a predetermined amount, the elastic deformation is released so that the pressing force on the holding member increases. Is detected, and when the decrease in the pressing force is detected after the increase is detected, it is determined that the component is mounted on the substrate. In this way, it is determined that the insertion part of the component or the insertion part of the substrate is elastically deformed at the time of pressure insertion by the increase of the pressing force on the holding member, and the elastic deformation of the insertion part or the insertion part is released. Judgment is made by the decrease of the pressing force on the holding member. As a result, it is possible to more appropriately determine whether or not the component is mounted on the substrate.

It is a block diagram which shows the outline of the structure of the component mounting apparatus 10 of this embodiment. It is a block diagram which shows the outline of the structure of the mounting head 40. It is a block diagram which shows the outline of the structure of the mechanical chuck 60. It is an external view which shows the appearance of the part 12. It is a block diagram which shows the outline of the structure of the control device 70 of the component mounting device 10. It is a flowchart which shows an example of the component mounting process executed by the CPU 71 of the control device 70. It is explanatory drawing which shows the state of mounting the component 12 on a substrate 14. It is explanatory drawing which shows the state of the change of the pressing force A with respect to the mechanical chuck 60 when the component 12 is mounted on a substrate 14.

A mode for carrying out the present invention will be described.

FIG. 1 is a configuration diagram showing an outline of the configuration of the component mounting device 10 of the present embodiment, FIG. 2 is a configuration diagram showing an outline of the configuration of the mounting head 40, and FIG. 3 is a configuration diagram showing an outline of the configuration of the mechanical chuck 60. FIG. 4 is an external view showing the appearance of the component 12, and FIG. 5 is a configuration diagram showing an outline of the configuration of the control device 70 of the component mounting device 10. The left-right direction in FIG. 1 is the X-axis direction, the front (front) rear (back) direction is the Y-axis direction, and the vertical direction is the Z-axis direction.

As shown in FIG. 1, the component mounting device 10 grips the component supply device 20 that supplies the component 12 to the component supply position, the board transfer device 24 that conveys the substrate 14, and the component 12 supplied to the component supply position. A mounting head 40 to be mounted on the substrate 14, an XY robot 30 for moving the mounting head 40 in the XY direction, and a control device 70 (see FIG. 5) for controlling the entire device are provided. In addition to these, the component mounting device 10 also has a parts camera 26 for capturing the posture of the component 12 gripped by the mounting head 40 and a positioning reference mark attached to the substrate 14 provided on the mounting head 40. It also has a mark camera 28 for reading.

In the present embodiment, the component supply device 20 is configured as a tray feeder that supplies the component 12 by a tray 22 in which a plurality of components 12 are housed in a grid pattern.

As shown in FIG. 1, the XY robot 30 has a pair of left and right Y-axis guide rails 33 and a pair of left and right Y-axis guide rails provided in the upper part of a housing (not shown) along the front-rear direction (Y-axis direction). A Y-axis slider 34 that is bridged over 33 and can move along the Y-axis guide rail 33, and an X-axis guide rail 31 provided on the side surface of the Y-axis slider 34 along the left-right direction (X-axis direction). It includes an X-axis slider 32 that can move along the X-axis guide rail 31. The X-axis slider 32 is movable by driving the X-axis motor 36 (see FIG. 5), and the Y-axis slider 34 is movable by being driven by the Y-axis motor 38 (see FIG. 5). A mounting head 40 is mounted on the X-axis slider 32, and the control device 70 is mounted at an arbitrary position on the XY plane by driving and controlling the XY robot 30 (X-axis motor 36 and Y-axis motor 38). The head 40 can be moved.

The mounting head 40 includes a head body 42 as a shaft-shaped member, a mechanical chuck 60 attached to the head body 42 to grip a component 12, a rotating device 45 for rotating the head body 42, and a first body for raising and lowering the head body 42. An elevating device 50 and a second elevating device 55 for elevating and lowering the mechanical chuck 60 are provided.

As shown in FIG. 3, the mechanical chuck 60 includes a chuck body 61 attached so as to be relatively movable in the Z-axis direction with respect to the head body 42, and a pair of left and right grip portions 62a and 62b formed in an L shape. A slider 64 that is attached to the bottom of the L-shape of each grip portion 62, 62b and can slide a pair of left and right grip portions 62, 62b in the directions of approaching and separating from each other, and a drive motor 66 that drives the slider 64 (FIG. 5) and.

The rotating device 45 includes an R-axis motor 46 having a gear 47 on the rotating shaft. A gear 43 that meshes with the gear 47 is provided at the upper end of the head body 42. Therefore, the control device 70 can adjust the component 12 gripped by the mechanical chuck 60 attached to the head body 42 to an arbitrary rotation angle by rotationally driving the R-axis motor 46.

The first elevating device 50 includes a first linear motor 51 and a first Z-axis slider 52 that can be elevated and lowered in the Z-axis direction by driving the first linear motor 51. The first Z-axis slider 52 is formed with a first engaging portion 52a that can be engaged with the horizontal portion 44 provided on the head body 42. As a result, the head body 42 can be raised and lowered as the first Z-axis slider 52 moves up and down. Since the mechanical chuck 60 is attached to the head body 42, the mechanical chuck 60 can be raised and lowered as the head body 42 moves up and down.

The second elevating device 55 includes a second linear motor 56 attached to the first Z-axis slider 52 of the first elevating device 50, and a second Z-axis slider 57 capable of ascending / descending in the Z-axis direction by driving the second linear motor 56. , Equipped with. The second Z-axis slider 57 is formed with a second engaging portion 57a that can be engaged with the upper surface of the mechanical chuck 60. As a result, the mechanical chuck 60 can be raised and lowered as the second Z-axis slider 57 moves up and down. In the present embodiment, the stroke distance of the second Z-axis slider 57 by the second elevating device 55 is shorter than the stroke distance of the first Z-axis slider 52 by the first elevating device 50. The mounting head 40 can roughly adjust the Z-axis position of the component 12 gripped by the mechanical chuck 60 by the first elevating device 50, and then finely adjust the Z-axis position of the component 12 by the second elevating device 55. it can. Further, the second Z-axis slider 57 is used to detect the pressing force (load) α acting on the mechanical chuck 60 when the component 12 gripped by the mechanical chuck 60 is pressed against the substrate 14 and mounted. A pressure sensor 59 is provided.

In the present embodiment, the component 12 has bifurcated locking claws 12a and 12b that can be inserted into the insertion hole 14a (see FIG. 2) of the substrate 14 and locked, as shown in FIG.

As shown in FIG. 5, the control device 70 includes a CPU 71, a ROM 72, an HDD 73, a RAM 74, and an input / output interface 75. These are electrically connected via a bus 76. The control device 70 is provided with an image signal from the parts camera 26, an image signal from the mark camera 28, a pressing force A from the pressure sensor 59, and an X-axis position sensor 37 that detects the position of the X-axis slider 32 in the X-axis direction. Detection signal, detection signal from the Y-axis position sensor 39 that detects the position of the Y-axis slider 34 in the Y-axis direction, detection from the first Z-axis position sensor 53 that detects the position of the first Z-axis slider 52 in the Z-axis direction. A signal, a detection signal from the second Z-axis position sensor 58 that detects the position of the second Z-axis slider 57 in the Z-axis direction, and the like are input via the input / output interface 75. On the other hand, from the control device 70, a control signal to the component supply device 20, a control signal to the substrate transfer device 24, a drive signal to the XY robot 30 (X-axis motor 36 and the Y-axis motor 38), and a mounting head 40 (R). Drive signals to the shaft motor 46, the first linear motor 51, the second linear motor 56, the drive motor 66, etc.) are output via the output port.

Next, the operation of the component mounting device 10 configured in this way, particularly the operation when the component 12 is mounted on the substrate 14, will be described. FIG. 6 is a flowchart showing an example of a component mounting process executed by the CPU 71 of the control device 70. This process is executed when the mounting instruction of the component 12 is given. The mounting instructions include component information (type and size of component 12), component supply positions (Xs, Ys, Zs), and target mounting positions of component 12 (X *, Y *, Z *). And are included.

When the component mounting process is executed, the CPU 71 of the control device 70 first acquires the component information, the component supply position (Xs, Ys, Zs), and the target mounting position (X *, Y *, Z *). (S100), the component 12 is gripped at the component supply position (S110). In the processing of S110, the XY robot 30 is driven and controlled so that the position of the mechanical chuck 60 in the XY direction coincides with the XY coordinates of the component supply positions (Xs, Ys, Zs), and then the mechanical chuck 60 is lowered. This is performed by driving and controlling the first lifting device 50 and the second lifting device 55, and driving and controlling the mechanical chuck 60 (drive motor 66) so as to grip the component 12 at the component supply position (Xs, Ys, Zs).

When the component 12 is gripped in this way, the CPU 71 moves the gripped component 12 to the XY coordinates of the target mounting position acquired in S100 (S120), and then starts descending the component 12 (S130). Here, the process of S120 is performed by driving and controlling the XY robot 30 so that the position of the gripped component 12 in the XY direction matches the XY coordinates (XY *, Y *) of the target mounting position. Further, the process of S130 is performed by driving and controlling the first elevating device 50 and the second elevating device 55 so as to start the descent of the component 12.

Next, the CPU 71 inputs the pressing force A detected by the pressure sensor 59 (S140), and waits for the input pressing force A to become the first pressure value A1 or more (S150). When the CPU 71 determines that the pressing force A becomes the first pressure value A1 or more, the CPU 71 determines whether or not a predetermined time has elapsed since the pressing force A became the first pressure value A1 or more (S160), and the predetermined time Is determined that the pressure A detected by the pressure sensor 59 is input (S170), and whether or not the input pressure A is less than the second pressure value A2, which is lower than the first pressure value A1. (S180). In the processing of S140 to S180, it is determined whether or not the pressing force A rises until it becomes the first pressure value A1 or more, and then falls until it becomes less than the second pressure value A2 before a predetermined time elapses. Is.

When the CPU 71 determines in S180 that the pressing force A is less than the second pressure value A2, the component 12 held by the mechanical chuck 60 based on the signals from the first Z-axis position sensor 53 and the second Z-axis position sensor 58. Z-axis position Z is input (S190), and the input Z-axis position Z is a predetermined range including the Z coordinate (Z *) of the target mounting position (lower limit position (Z * -α) and upper limit position (Z * + α)). It is determined whether or not it is within the range determined by (S200). When the CPU 71 determines that the Z-axis position Z is within the predetermined range, it determines that the mounting of the component 12 is completed (S210), and drives and controls the drive motor 66 so that the mechanical chuck 60 is released from gripping the component 12. Then (S220), the component mounting process is completed. On the other hand, in S170, the CPU 71 determines in S170 that a predetermined time has elapsed before the pressing force A becomes less than the second pressure value A2, or the pressing force A is less than the second pressure value A2 before the predetermined time elapses. However, if it is determined in S200 that the Z-axis position Z is not within the predetermined range, it is determined that a mounting error has occurred (S230), and the component mounting process is terminated. In the process of S230, the CPU 71 displays on an operation panel (not shown) that a mounting error has occurred and issues a warning.

FIG. 7 is an explanatory view showing how the component 12 is mounted on the substrate 14. As shown in the figure, in the component 12 having the bifurcated locking claws 12a and 12b, the bifurcated locking claws 12a and 12b are elastically deformed inward in the process of being inserted into the insertion hole 14a of the substrate 14. When it is completely pushed in, the elastic deformation is released, it returns to the upright state, and it is locked in the insertion hole 14a.

FIG. 8 is an explanatory diagram showing a state of change in the pressing force A with respect to the mechanical chuck 60 when the component 12 is mounted on the substrate 14. As shown in the figure, when the component 12 is mounted on the substrate 14, the pressing force acting on the mechanical chuck 60 while the locking claws 12a and 12b are pushed into the insertion hole 14a and elastically deformed at time T1. A gradually increases and eventually exceeds the first pressure value A1. When the locking claws 12a and 12b are completely pushed into the insertion hole 14a at time T2, the elastic deformation is released, so that the pressing force A acting on the mechanical chuck 60 decreases and the second pressure value A2 Below. In this way, the situation where the locking claws 12a and 12b of the component 12 are elastically deformed and the situation where the elastic deformation is released are determined by monitoring the pressing force A detected by the pressure sensor 59, and the component 12 is the substrate. It is determined whether or not the 14 is normally attached.

Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The component mounting device 10 of the present embodiment corresponds to the "component mounting device" of the present invention, the mechanical chuck 60 corresponds to the "holding member", and the first lifting device 50 and the second lifting device 55 serve as the "lifting means". Correspondingly, the pressure sensor 59 corresponds to the "pressurizing detection means", and the CPU 71 that executes the processes of S140 to S210 and S230 of the component mounting process of FIG. 6 corresponds to the "mounting determination means". Further, the first Z-axis position sensor 53 and the second Z-axis position sensor 58 correspond to the "elevating position detecting means".

According to the component mounting device 10 of the present embodiment described above, the component 12 is mounted on the board 14 by inserting the bifurcated locking claws 12a and 12b of the component 12 into the insertion holes 14a of the board 14. When the pressure sensor 59 detects that the pressing force A acting on the mechanical chuck 60 increases and then decreases when the component 12 is gripped by the mechanical chuck 60 and inserted under pressure on the substrate 14, the component It is determined that 12 is mounted on the substrate 14. Thereby, it is possible to appropriately determine the mounting of the component 12 having the locking claws 12a and 12b.

Moreover, since the component mounting device 10 also requires that the component 12 is within a predetermined range including the Z coordinate (Z *) of the target mounting position, it is more accurate to determine whether or not the component 12 is mounted on the substrate 14. Can be determined.

It goes without saying that the present invention is not limited to the above-described embodiments, and can be implemented in various embodiments as long as it belongs to the technical scope of the present invention.

For example, in the above-described embodiment, after the pressing force A from the pressure sensor 59 becomes the first pressure value A1 or more, it becomes less than the second pressure value A2 within a predetermined time, and the Z coordinate (Z) of the target mounting position. Although it is determined that the component 12 is mounted on the substrate 14 on the condition that the component 12 is within the predetermined range including *), the latter condition may be omitted. In this case, the processing of S190 and S200 of the component mounting process of FIG. 6 may be omitted.

Further, in the above-described embodiment, when the component 12 having the bifurcated locking claws 12a and 12b (legs and insertion portions) is inserted into the insertion hole 14a (insertion portion) of the substrate 14, the component 12 is the substrate 14. It was determined whether or not it was attached to, but it is not limited to this. For example, the part may have any number of legs. Further, in the process of inserting the insertion portion of the component into the inserted portion of the substrate, the insertion portion or the inserted portion is elastically deformed, and when the insertion portion is completely inserted into the inserted portion, the elastic deformation is released. If it is, it can be used for determining the mounting of any component on any substrate.

Further, in the above-described embodiment, two elevating devices (first elevating device 50 and second elevating device 55) are provided as elevating devices for elevating and lowering the parts, but the present invention is not limited to this. It may be provided with only one, or may be provided with three or more.

10 parts mounting device, 12 parts, 12a, 12b locking claws, 14 boards, 14a insertion holes, 20 parts supply device, 22 trays, 24 board transfer devices, 30 XY robots, 31 X-axis guide rails, 32 X-axis sliders, 33 Y-axis guide rail, 34 Y-axis slider, 36 X-axis motor, 37 X-axis position sensor, 38 Y-axis motor, 39 Y-axis position sensor, 40 mounting head, 42 head body, 43 gear, 44 horizontal part, 45 rotations Equipment, 46 R-axis motor, 47 gear, 50 1st lifting device, 51 1st linear motor, 52 1st Z-axis slider, 52a 1st engaging part, 53 1st Z-axis position sensor, 55 2nd lifting device, 56th 2 linear motor, 57 2nd Z-axis slider, 57a 2nd engagement part, 58 2nd Z-axis position sensor, 59 pressure sensor, 60 mechanical chuck, 61 chuck body, 62a, 62b grip part, 64 slider, 66 drive motor, 70 Control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 input / output interface, 76 bus.

Claims (4)

It is a component mounting device that mounts the component on the board by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
A holding member that holds the parts and
An elevating means capable of elevating the holding member and
A pressure detecting means for detecting the pressure applied to the holding member, and
A mounting determination means for determining whether or not the component is mounted on the substrate,
With
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
The mounting determination means determines a situation in which at least one of the insertion portion and the insertion portion is elastically deformed and a situation in which the elastic deformation is released by monitoring the pressing force detected by the pressing force detecting means. , A component mounting device for determining whether or not the component is normally mounted on the substrate . It is a component mounting device that mounts the component on the board by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
A holding member that holds the parts and
An elevating means capable of elevating the holding member and
A pressure detecting means for detecting the pressure applied to the holding member, and
A mounting determination means for determining whether or not the component is mounted on the substrate,
With
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
In the mounting determination means, a mounting error occurs when an increase in the pressing force on the holding member is detected by the pressing force detecting means and a decrease in the pressing force is not detected within a predetermined time after the increase is detected. A component mounting device characterized by determining that. It is a component mounting method for mounting the component on the substrate by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
By lowering the component with a holding member capable of holding the component, the insertion portion of the component is inserted while being pressed against the insertion portion of the substrate, and at least one of the insertion portion and the insertion portion is elastically deformed. A component mounting method for determining a situation and a situation in which elastic deformation is released by monitoring a pressing force at the time of inserting the component, and determining whether or not the component is normally mounted on the substrate . It is a component mounting method for mounting the component on the substrate by inserting the component insertion portion into the inserted portion of the substrate while applying pressure.
At least one of the insertion portion of the component and the insertion portion of the substrate is elastically deformed in the process of the insertion portion being inserted into the insertion portion, and after the insertion portion is inserted into the insertion portion by a predetermined amount. Is the one that the elastic deformation is released,
By lowering the component with a holding member capable of holding the component, the insertion portion of the component is inserted into the inserted portion of the substrate while being pressed, an increase in the pressing force is detected, and after the increase is detected, a predetermined value is obtained. It is determined that a mounting error has occurred if a drop in pressing force is not detected by the time elapses.
How to install parts.

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