JP6760558B2 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JP6760558B2 JP6760558B2 JP2018534308A JP2018534308A JP6760558B2 JP 6760558 B2 JP6760558 B2 JP 6760558B2 JP 2018534308 A JP2018534308 A JP 2018534308A JP 2018534308 A JP2018534308 A JP 2018534308A JP 6760558 B2 JP6760558 B2 JP 6760558B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3404—Storage means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
- H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Engineering & Computer Science (AREA)
- Robotics (AREA)
Description
(2)上記(1)の態様において、前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含んでもよい。
(3)上記(1)又は(2)の態様において、前記搬送部品は、前記取付機構に係合する被係合部を有し、前記被係合部は、所定の方向に変位して前記第1取付部に係合する第1被係合部と、前記所定の方向とは異なる方向に変位して前記第2取付部に係合する第2被係合部とを含んでもよい。
搬送部品30を取付ける取付機構40は、容器本体20の天井面22に一体に形成されている。そのため、取付機構40は、容器本体20と同様の成形材料により成形されている。
搬送部品30を容器本体20の取付機構40に装着するには、容器本体20の天井面22の後方B側に搬送部品30を配置し、取付機構40の複数対の支持レール24間に搬送部品30の被挟持板32をそれぞれ挟持させ、容器本体20の正面F側にスライドさせ、各ストッパ25に搬送部品30の被挟持板32の前部を嵌合係止し、搬送部品30の上方への抜けを防止する(図3参照)。
上記実施形態では、第1取付部40Aは2か所、第2取付部40Bは1か所設けられていたが、これらに限らない。例えば、第1取付部40Aが1か所又は3か所以上設けられていてもよいし、第2取付部40Bが2か所以上設けられていてもよい。このとき、それぞれの第1取付部40A、第2取付部40Bに応じて、第1被係合部36、第2被係合部37を形成する。
10 蓋体
20 容器本体
21 開口部、22 天井面、23 側壁、24 支持レール、25 ストッパ、26 ガイド片、27 干渉係合部、28 二股部
30 搬送部品
31 部品本体、32 被挟持板、33 フランジ、34 縦壁、35 補強リブ、36 第1被係合部、37 第2被係合部
320 側面、321,332,334,340 流通口、322 凹凸部、330 凹部、333 角孔、350 内側辺、360 ロックピン、361 把持片
40 取付機構、40A 第1取付部、40B 第2取付部
F 正面
B 後方
W 基板
Claims (3)
- 蓋体により閉鎖される開口部を有し、複数枚の基板を収納可能な容器本体と、
前記容器本体に設けられた取付機構に、前記容器本体の前記開口部側を正面側とする前後方向にスライドして着脱自在に取付けられる搬送部品と、を備え、
前記取付機構が、前記搬送部品を支持する左右の支持レール間に形成された、前記容器本体の前記正面側の第1取付部と、前記正面側から離れる後方側の第2取付部とを含み、
前記搬送部品は、前記取付機構に係合する被係合部と、前記左右の支持レールに支持される被挟持板と、を有し、
前記被係合部は、前記前後方向とは異なる左右方向に変位して前記第1取付部に係合する第1被係合部と、前記左右方向とは異なる方向に変位して前記第2取付部に係合する第2被係合部とを含む、
ことを特徴とする基板収納容器。 - 前記取付機構は、前記容器本体の周壁に設けられ、前記搬送部品を嵌合係止するストッパを含む、
ことを特徴とする請求項1に記載の基板収納容器。 - 前記第2被係合部は、前記左右方向とは異なる上下方向に変位し、
前記搬送部品は、前記第2被係合部の前記後方側に縦壁を有するとともに、前記第1被係合部及び前記第2被係合部を操作可能な流通口又は孔が穿設されている、
ことを特徴とする請求項1又は2に記載の基板収納容器。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016161086 | 2016-08-19 | ||
| JP2016161086 | 2016-08-19 | ||
| PCT/JP2017/026201 WO2018034101A1 (ja) | 2016-08-19 | 2017-07-20 | 基板収納容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2018034101A1 JPWO2018034101A1 (ja) | 2019-06-13 |
| JP6760558B2 true JP6760558B2 (ja) | 2020-09-23 |
Family
ID=61196755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018534308A Active JP6760558B2 (ja) | 2016-08-19 | 2017-07-20 | 基板収納容器 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10727099B2 (ja) |
| JP (1) | JP6760558B2 (ja) |
| KR (1) | KR102344236B1 (ja) |
| CN (1) | CN109314072B (ja) |
| DE (1) | DE112017004145T5 (ja) |
| SG (1) | SG11201811785RA (ja) |
| TW (1) | TWI743167B (ja) |
| WO (1) | WO2018034101A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7336923B2 (ja) * | 2019-09-05 | 2023-09-01 | 信越ポリマー株式会社 | 基板収納容器 |
| TWI746045B (zh) * | 2020-07-07 | 2021-11-11 | 家登精密工業股份有限公司 | 基板載具鎖扣結構 |
| TWI890198B (zh) * | 2022-11-16 | 2025-07-11 | 美商恩特葛瑞斯股份有限公司 | 具有可拆卸鎖銷和接合構件的緊固總成、及使用該總成之容器 |
| KR102733146B1 (ko) * | 2023-04-10 | 2024-11-25 | 주식회사 삼에스코리아 | 기판수납용기의 탑 플랜지의 체결구조 |
| TWI873993B (zh) * | 2023-07-10 | 2025-02-21 | 家登精密工業股份有限公司 | 上開式基板容器之固持裝置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4146718B2 (ja) * | 2002-12-27 | 2008-09-10 | ミライアル株式会社 | 薄板支持容器 |
| JP4616319B2 (ja) * | 2007-10-15 | 2011-01-19 | ミライアル株式会社 | 薄板支持容器 |
| CN102017119B (zh) * | 2008-03-13 | 2014-01-01 | 安格斯公司 | 具有管状环境控制部件的晶圆容器 |
| JP5328627B2 (ja) * | 2009-12-17 | 2013-10-30 | 信越ポリマー株式会社 | 基板収納容器 |
| JP5318800B2 (ja) | 2010-03-04 | 2013-10-16 | 信越ポリマー株式会社 | 基板収納容器 |
| JP2011249372A (ja) | 2010-05-24 | 2011-12-08 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
| TWI515160B (zh) * | 2010-10-19 | 2016-01-01 | 安堤格里斯公司 | 具自動凸緣之前開式晶圓容器 |
| WO2014192109A1 (ja) * | 2013-05-29 | 2014-12-04 | ミライアル株式会社 | 基板収納容器 |
-
2017
- 2017-07-20 CN CN201780034631.7A patent/CN109314072B/zh active Active
- 2017-07-20 US US16/324,712 patent/US10727099B2/en active Active
- 2017-07-20 WO PCT/JP2017/026201 patent/WO2018034101A1/ja not_active Ceased
- 2017-07-20 JP JP2018534308A patent/JP6760558B2/ja active Active
- 2017-07-20 KR KR1020197005303A patent/KR102344236B1/ko active Active
- 2017-07-20 SG SG11201811785RA patent/SG11201811785RA/en unknown
- 2017-07-20 DE DE112017004145.7T patent/DE112017004145T5/de not_active Withdrawn
- 2017-08-15 TW TW106127571A patent/TWI743167B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018034101A1 (ja) | 2018-02-22 |
| TWI743167B (zh) | 2021-10-21 |
| US20190189489A1 (en) | 2019-06-20 |
| DE112017004145T5 (de) | 2019-05-09 |
| CN109314072B (zh) | 2023-02-10 |
| JPWO2018034101A1 (ja) | 2019-06-13 |
| CN109314072A (zh) | 2019-02-05 |
| SG11201811785RA (en) | 2019-01-30 |
| US10727099B2 (en) | 2020-07-28 |
| TW201812960A (zh) | 2018-04-01 |
| KR20190039533A (ko) | 2019-04-12 |
| KR102344236B1 (ko) | 2021-12-27 |
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