JP6760765B2 - Manufacturing method of electrostatic electromechanical converter - Google Patents

Description

The present invention relates to a method for manufacturing an electrostatic electromechanical converter.

There are generators and electric motors that use electret materials that hold the charge semi-permanently. A generator using an electret is provided with a charged layer made of an electret material and a counter electrode facing the charged layer, and generates electricity by utilizing electrostatic induction generated by a change in the overlapping area of the two. Such a power generation device has an advantage that it is relatively small and can convert the vibration of the electrodes generated by the movement of the device itself into electrical energy. Therefore, its adoption in portable electric devices that are worn or carried by humans, such as wristwatches, is being considered.

Usually, in the power generation device, in order to improve power generation efficiency, a plurality of charged layers are arranged side by side at intervals from each other, and a plurality of counter electrodes are also arranged side by side so as to face the plurality of charged layers. According to such a configuration, power can be taken out from a plurality of counter electrodes at the same time by moving each counter electrode relative to each charged layer (see, for example, Patent Document 1).

Further, similarly to the above-mentioned generator, in the electric motor using the electret material, a plurality of charged layers are arranged on the movable substrate at intervals from each other, and a plurality of counter electrodes are arranged at positions facing the charged layers. (See, for example, Patent Document 2).

Japanese Unexamined Patent Publication No. 2015-192577 (pages 5-7, FIG. 1) Japanese Unexamined Patent Publication No. 2015-126557 (pages 4-6, FIG. 1)

Ideally, the plurality of charging layers constituting the above-mentioned electrostatic electromechanical converter should have a uniform surface potential of each charging layer on the substrate. Therefore, when forming the charged layer, it is ideally desirable that the charged layer is formed on the substrate with a uniform thickness. However, when applying the electret material on the substrate with the openings, if the liquid resin is simply applied by the dispense method, the thickness differs between the central part and the end part due to the influence of surface tension. It ends up. When the film thickness becomes non-uniform, the electric power that can be taken out from each of the charged layers by the power generation device is reduced or varies. Further, even when an electret material is used as the mover of the electric motor, the driving force received by each of the charged layers is reduced. Further, the electrostatic force in the vertical direction received from the counter electrodes facing the charging layer also varies, so that the operation becomes unstable.
Further, when the electret material on the substrate having the opening is charged by electric discharge, when the electret material is charged to a certain extent, the charge is attracted to the side surface of the opening of the grounded substrate, and the charge is charged. The problem arises that the efficiency of the is reduced.

The present invention has been made in consideration of such a problem, and an object of the present invention is an electrostatic electric machine in which a charging layer is formed with a uniform thickness on a substrate having an opening and the surface potential of the charging layer is high. It is to provide a method of manufacturing a converter.

The method for manufacturing an electrostatic electromechanical converter of the present invention is for an electrostatic electromechanical converter in which a charging layer provided on a movable substrate having an opening and a counter electrode provided on a counter substrate are arranged so as to face each other. In the manufacturing process, after the opening forming step of forming an opening in the movable substrate and the opening forming step, the mask member is made of an insulator so as to protrude from the surface forming the charging layer of the movable substrate in the opening. After the mask member placement step and the mask member placement step, a thin film forming step of applying a liquid material to be a thin film to the area surrounded by the movable substrate and the mask member and curing the liquid material, and a thin film. After the forming step, it is characterized by having a charging treatment step of charging the exposed thin film to form a charging layer with the mask member arranged, and a mask member removing step of removing the mask member after the charging treatment step. It is said.

The thin film forming step is characterized in that the applied liquid material is heated and cured.

In the mask member arranging step, the mask member may be arranged on the upper side of the movable substrate.

In the mask member arranging step, it is preferable that the mask member is arranged so as to fill the opening .

An elastic body can be used as the mask member.

It is desirable that the mask member has higher water repellency than the movable substrate.

By adopting the manufacturing method of the present invention, it becomes possible to form a plurality of charged layers constituting the electrostatic electromechanical converter on the substrate with a uniform thickness, and the power that can be taken out from the charged layers is reduced. , Does not cause variation. Further, the problem that the charging efficiency is lowered is also solved.

It is a perspective view which shows the structure of the electrostatic electromechanical converter in this embodiment. It is sectional drawing which shows the electrostatic electromechanical converter in this embodiment. It is a process drawing which shows the manufacturing method of the electrostatic electric converter in this embodiment. It is sectional drawing which shows the opening formation process in this embodiment. It is sectional drawing which shows the mask member arrangement process in this embodiment. It is sectional drawing which shows the thin film forming process in this embodiment. It is sectional drawing which shows the thin film forming process in this embodiment. It is sectional drawing which shows the thin film forming process in this embodiment. It is sectional drawing which shows the thin film forming process in this embodiment. It is sectional drawing which shows the charge processing process in this embodiment. It is sectional drawing which shows the mask member removal process in this embodiment. It is sectional drawing which shows the conventional charge processing process. It is sectional drawing which shows the mask member arrangement in this embodiment. It is sectional drawing which shows the thin film forming process in this embodiment. It is sectional drawing which shows the charge processing process in this embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a schematic configuration of an electrostatic electromechanical converter 10 according to an embodiment of the present invention. As shown in FIG. 1, the electrostatic electromechanical converter 10 includes a movable substrate 11, a plurality of charging layers 12, an opposing substrate 13 arranged so as to face the movable substrate 11, and a plurality of opposing electrodes 14A and 14B. And the rotation shaft 15 and the like.

The movable substrate 11 is formed of a conductor such as metal or a silicon insulator, and has a substantially disk shape as a whole. The movable substrate 11 is provided with a plurality of openings 17 arranged radially when viewed from the center position thereof. Each of these openings 17 has a substantially trapezoidal shape, and the outer circumference of the movable substrate 11 and the two sides facing the center are formed in an arc shape along the outer circumference of the movable substrate 11. By the opening 17, a plurality of substantially trapezoidal conductors are formed radially arranged at intervals from each other between the center and the outer periphery of the movable substrate 11.

A charging layer 12 is formed on the film on the surface of the substantially trapezoidal conductor formed on the movable substrate 11 on the facing substrate 13 side. The charged layer 12 also has a substantially trapezoidal shape as a whole, and the outer circumference of the movable substrate 11 and the two sides facing the center are formed in an arc shape along the outer circumference of the movable substrate 11. The charged layer 12 is made of an electret material containing a fluorine-based resin such as polytetrafluoroethylene (PTFE), and retains a negative charge. Although it is assumed that the charged layer 12 is negatively charged here, the charged layer 12 may be made of a material that is positively charged. The shape and forming method of the charging layer 12 will be described in detail later. The plurality of charging layers 12 are arranged so as to be adjacent to each other at intervals along the surface of the movable substrate 11 on the opposite substrate 13 side.

The facing substrate 13 is made of a material having high insulating properties, and facing electrodes 14A and 14B made of a metal having high conductivity or the like are formed. Further, the patterns of the facing electrodes 14A and 14B arranged on the facing substrate 13 correspond to the shapes and sizes of the openings 17 of the charging layer 12 and the movable substrate 11, respectively. That is, the counter electrodes 14A and 14B have a substantially trapezoidal shape, and the charging layer 12 and the opening 17 of the movable substrate 11 have substantially the same shape, and the number of the charging layer 12 and the number of openings 17 of the movable substrate 11 The same number of electrodes as the sum of are provided. Similar to the opening 17 of the charging layer 12 and the movable substrate 11, the counter electrodes 14A and 14B are formed so as to be arranged radially from the center of the counter substrate 13 toward the outer circumference. The movable substrate 11 and the opposing substrate 13 are arranged so as to be parallel to each other and opposed to each other, so that the charging layer 12 on the movable substrate 11 faces the opposing electrodes 14A and 14B on the opposing substrate 13. .. The plurality of counter electrodes 14A and 14B are arranged so as to be adjacent to each other at intervals along the surface of the counter substrate 13 on the movable substrate 11 side.

The rotating shaft 15 is arranged so as to be orthogonal to the movable substrate 11 and the opposing substrate 13 and to penetrate the center of the movable substrate 11 and the center of the opposing substrate 13. Further, as shown by the arrow in FIG. 1, the movable substrate 11 is rotatably supported around the rotation shaft 15. On the other hand, the facing substrate 13 is fixed to the housing of the electrostatic electromechanical converter 10.

Further, FIG. 2 shows a sectional view taken along line AA of the electrostatic electromechanical converter 10 in FIG. As shown in FIG. 2, the counter electrode on the counter substrate 13 is composed of a counter electrode 14A connected to every other electrode and a counter electrode 14B adjacent to the counter electrode 14A and connected to every other electrode. To. In this configuration, when a square wave signal having the same amplitude is input to the counter electrode 14A and the counter electrode 14B by shifting by a certain period, the movable substrate 11 follows the change in the polarity of the counter electrode 14A and the counter electrode 14B. The upper charging layer 12 receives a driving force continuously, and the movable substrate 11 can be rotated.

Next, the manufacturing method of the electrostatic electromechanical converter 10 of the present invention will be described with reference to FIGS. 3 to 11. 4 to 11 are cross-sectional views showing a step of forming the charging layer 12, and shows a cross section of the movable substrate 11 and the charging layer 12 cut along the circumferential direction of the movable substrate 11.

FIG. 3 is a process diagram showing an example of a manufacturing method of the electrostatic electromechanical converter 10 of the present invention. The method for manufacturing the electrostatic electromechanical converter of the present invention includes an opening forming step S1 in which an opening is provided in the movable substrate and a mask member arranging step S2 in which the mask member is arranged in the opening of the movable substrate provided with the opening. It has a thin film forming step S3 for forming a thin film on a movable substrate, a charging treatment step S4 for forming a thin film into a charging layer by performing a charging treatment on the thin film, and a mask member removing step S5 for removing the mask member. There is.

The opening forming step S1 in the present embodiment will be described with reference to FIG. In the opening forming step, for example, the movable substrate 11 is subjected to the following etching treatment to provide a substantially trapezoidal opening 17 as shown in FIG. When silicon is used as the material of the movable substrate 11, first, a pattern of the resist 18 is formed on the movable substrate 11 by photolithography. By forming the resist 18 in a specific pattern, the surface of the movable substrate 11 excluding the portion forming the opening 17 is masked. Subsequently, the movable substrate 11 is etched with a fluorine-based gas (mainly sulfur hexafluoride), and a protective film is formed on the side wall using the fluorine-based gas to suppress the etching in the lateral direction. By repeatedly digging the silicon deeply, an opening 17 as shown in FIG. 4 is obtained (Bosch process). After forming the opening 17, the resist 18 is removed. When silicon is used as the movable substrate 11, the opening 17 may be formed, the resist 18 may be removed, and then an oxide film may be formed by heat treatment. Although the opening 17 is provided by etching here, it may be realized by other methods such as press working, electric discharge machining, and cutting machining.

Next, the mask member arranging step S2 in the present embodiment will be described with reference to FIG. A mask member 16 having a shape that fills the opening 17 is arranged on the movable substrate 11 provided with the opening 17. The mask member 16 is made of an elastic material or a material having higher water repellency than the movable substrate 11. Further, it is preferable to have a structure in which the convex portion of the mask member 16 protrudes from the opening 17. The effect of the material of the mask member 16 and the effect of projecting the convex portion of the mask member 16 from the opening 17 will be described in detail later. Although the mask member 16 has a continuous shape having irregularities here, the opening 17 may be filled with a plurality of mask members having a substantially trapezoidal shape corresponding to the opening 17.

Subsequently, the thin film forming step S3 in the present embodiment will be described with reference to FIG. The liquid electret material 22 is applied to the movable substrate 11 by using the dispenser 19 on the movable substrate 11. The coating method using a normal dispenser simply aims to discharge a certain amount of liquid on a flat surface. Therefore, the shape of the applied liquid is the shape in which the liquid is discharged, that is, the shape in which the thickness differs between the center and the end due to surface tension. However, in the present embodiment, as shown in FIG. 6, the convex portion of the mask member 16 is projected, so that the electret material 22 is applied to the region surrounded by the movable substrate 11 and the mask member 16. As a result, even when the liquid electret material 22 is discharged from the dispenser 19, the liquid level of the electret material 22 is parallel to the movable substrate 11, and the electret material 22 can be applied to the end with a uniform thickness. Further, the electret material 22 is cured by heating the electret material 22. In the present embodiment, a resin is used for the electret material 22, and the resin applied on the movable substrate 11 is cured by heating to form a thin film 24.

In the thin film forming step S3, the shape of the thin film 24 differs as shown in FIG. 7 or 8 depending on whether the mask member 16 is hydrophilic or water repellent when the electret material 22 is applied. FIG. 7 shows the shape of the thin film 24 when the mask member 16 is hydrophilic, and FIG. 8 shows the shape of the thin film 24 when the mask member 16 is water repellent. When the mask member 16 is hydrophilic, the mask member 16 tends to get wet and spread when the electlet material 22 is applied, so that the corners of the thin film 24 have a sharp shape as shown in FIG. 7, but the mask member 16 When is water-repellent, the corners of the thin film 24 are rounded as shown in FIG. 8 because it is difficult for the mask member 16 to get wet and spread when the electlet material 22 is applied. Since the sharp shape generated when the mask member 16 is hydrophilic may come into contact with the facing substrate 13 or the facing electrode 14 and hinder the movement of the movable substrate 11, a material having high water repellency is used as the mask member 16. However, it is preferable that the corners of the thin film 24 do not have a sharp shape.

In the above description, the case where the mask member 16 is arranged so as to protrude from the surface of the movable substrate 11 on which the thin film 24 is formed has been described. However, as shown in FIG. 9, the mask member 16 has higher water repellency than the movable substrate 11. By using the material, it is possible to apply the liquid electret material 22 in a state where the surface of the movable substrate 11 forming the thin film 24 and the upper surface of the mask member 16 are aligned. When the liquid electret material 22 is applied with the surface of the movable substrate 11 forming the thin film 24 and the upper surface of the mask member 16 aligned, the movable substrate 11 and the mask member 16 are wetted with respect to the liquid electret material 22. Because of the difference, the liquid electret material 22 wets and spreads only on the movable substrate 11. Therefore, it is possible to make the thickness of the thin film 24 substantially constant by adjusting only the coating amount of the dispenser 19. Further, after applying the electret material 22 with the dispenser 19, it is also possible to easily form the thin film 24 with a constant film thickness by spin coating in which the movable substrate 11 is rotated to remove the excess liquid electret material 22 by centrifugal force. It becomes.

In the thin film forming step S3 described above, an example in which a resin is used as the thin film 24 has been described, but an oxide film formed by heat treatment on the surface of the movable substrate 11 made of silicon can be used as the thin film 24.

Subsequently, the charging treatment step S4 in the present embodiment will be described with reference to FIG. The charging treatment step S4 is a step of charging the thin film 24 on the movable substrate 11 with an electric charge 21 from the needle electrode 20 by using corona discharge to make the thin film 24 a charging layer 12. As a specific embodiment, the movable substrate 11 and the needle electrode 20 are used as electrodes, and a high voltage is applied between them. Then, plasma is generated at the tip of the needle electrode 20, and positive ions and negative ions are generated. At this time, if the needle electrode 20 is the negative electrode and the movable substrate 11 is the positive electrode, the generated negative ions, that is, the electric charge 21, is driven toward the movable substrate 11, and the thin film 24 on the movable substrate 11 is negatively charged and charged. It becomes layer 12.

Finally, the mask member removing step S5 in the present embodiment will be described with reference to FIG. In the mask member removing step S5, the mask member 16 is removed from the inside of the opening 17 of the movable substrate 11 so that the charged layer 12 is formed on the movable substrate 11. In the mask member removing step S5 shown in FIG. 11, by using an elastic body such as silicon resin as the material of the mask member 16, the convex portion of the mask member 16 contracts by applying an external force and can be easily removed. It is possible. Further, the mask member 16 may be made of a material having higher water repellency than the movable substrate 11. In this case, a fluororesin can be used as the mask member 16, the contact angle with the liquid electret material 22 is large, and the adhesive force between the surface of the mask member 16 and the electret material 22 is very weak. .. Therefore, even after the liquid electret material 22 is cured, the electret material and the mask member 16 can be easily removed with a slight force.

Further, in general, the wettability of a liquid changes depending on the surface condition of the solid in contact, and the rougher the surface, the easier it is for the wet surface to get wet, and the less wet the water-repellent surface becomes. Therefore, when a water-repellent material is used for the mask member 16, the mask member 1
By roughening the side surface of the convex portion of No. 6, that is, the surface that protrudes when forming the thin film 24 of the movable substrate 11 and is in contact with the electret material 22, the water repellency is further enhanced, and the mask member removing step S5 can be easily performed. can do. In this way, when the mask member 16 is arranged so as to protrude from the surface of the movable substrate 11 on which the thin film 24 is formed, the surface state of the side surface of the convex portion of the mask member 16 may be roughened.

Further, by forming the mask member 16 with an insulator such as a silicon resin and performing the charging treatment step S4 before the mask member removing step S5, the charging amount of the charging layer 12 can be improved.
FIG. 12 shows the transfer of electric charge after the electric charge is accumulated in the electric charge layer 12 in the charging process step S4. In the charging treatment step S4, after the electric charge is accumulated and charged in the charging layer 12, the electric charge charged by the corona discharge avoids the charged charging layer 12 and flows into the side surface of the movable substrate 11 facing the opening 17. As described above, when the movable substrate 11 is grounded in the charging process step S4, the surface potential of the movable substrate 11 is higher than that of the charging layer 12, and the electric charge is likely to be collected on the movable substrate 11. Therefore, it is preferable to perform the charging treatment step S4 with the mask member 16 made of an insulator arranged as shown in FIG. That is, if the side surface of the movable substrate 11 is covered, the electric charge does not flow into the ground plane, and the electric charge layer 12 and the mask member 16 itself are charged. Not only the charging layer 12 but also the mask member 16 is charged, but as the charge is accumulated in the mask member 16, the charge is also collected in the charging layer 12 and the potential of the charging layer 12 is increased. As a result, more charges are collected in the charging layer 12 than the charges continue to flow on the ground plane.
In this way, by covering the surface of the movable substrate 11 with the mask member 16 made of an insulator, the inflow of electric charges into the movable substrate 11 is prevented, and the electric charges are collected in the charged layer 12 to increase the potential of the charged layer 12. Can be improved.

Performing the charging treatment step S4 with the mask member 16 made of an insulator arranged as described above is a type of electret when the charging layer 12 is formed on the movable substrate 11 having the opening 17 by corona discharge. It is especially effective regardless. Therefore, not only in the case of forming the charging layer 12 with the resin electret material 22, but also in the charging treatment step S4 when the oxide film formed by heat treatment on the surface of the movable substrate 11 made of silicon is used as the charging layer 12. However, the surface potential can be expected to improve.

Further, in the above description, the mask member arranging step S2 is performed before the thin film forming step S3, the thin film forming step S3 and the charging treatment step S4 are continuously performed with the mask member 16 arranged, and then the mask member removing step. S5 was performed. However, after the thin film forming step S3, the mask member 16 is removed by the mask member removing step S5, and the mask member arranging step S2 for newly arranging the mask material 16 suitable for the charging treatment is performed before the charging treatment step S4. The charging treatment step S4 may be performed with the mask member 16 arranged. Then, the mask member removing step S5 may be performed after the charging treatment step S4. That is, even if the charged layer is formed in the order of the opening forming step S1, the mask member arranging step S2, the thin film forming step S3, the mask member removing step S5, the mask member arranging step S2, the charging processing step S4, and the mask member removing step S5. Good.

Further, at this time, if uniform thin film formation is possible without arranging the mask member 16 in the thin film forming step S3, the mask member arranging step S2 and the mask member removing step immediately before and after the thin film forming step S3. S5 can be omitted.

By arranging the mask member 16 that fills the opening 17 and applying the electret material 22 to the movable substrate 11 having the opening 17 in this way to form the thin film 24, the end on the movable substrate 11 is formed. A thin film 24 having a uniform thickness can be formed up to the portion. After the thin film 24 is made into the charging layer 12 by the charging treatment, the charge 21 held by the charging layer 12 is maintained for a long time, so that a protective film having water repellency can be formed on the surface of the charging layer 12 to maintain the surface potential. It is desirable to have a structure.

Further, as a modification of the above embodiment, in the mask member arranging step S2, a substantially disk-shaped mask member 16 having a mask member opening 23 having the same dimensions as the charging layer 12 of the movable substrate 11 can be used. FIG. 13 is a diagram for explaining the mask member arranging step S2 when the substantially disk-shaped mask member 16 is used, and the substantially disk-shaped mask member 16 covers the opening 17 from the upper side of the movable substrate 11. Is shown in the cross-sectional view in which is arranged.
The substantially disk-shaped mask member 16 has a substantially disk shape like the movable substrate 11, and is a substantially disk-shaped mask member having the mask member openings 23 radially, and the mask member openings 23 are movable. The dimensions are the same as the range in which the charging layer 12 on the substrate 11 is formed. Since the mask member opening 23 of the mask member 16 is patterned to have the same dimensions as the portion forming the charging layer 12 on the movable substrate 11, the substantially disk-shaped mask member 16 is brought into contact with the thin film 24 to cover the opening 17. Can be placed on the movable substrate 11. In this way, instead of filling the opening 17 with a convex portion, the movable substrate 11 is formed with a substantially disk-shaped mask member 16 so that the opening 17 is hidden when viewed from above and only the surface of the movable substrate 11 is exposed. It may be placed on top.

As a method for producing such a substantially disk-shaped mask member 16, laser processing is performed using an acrylic plate, a silicon plate, or the like as a material, and a 3D printer can also be used.

Further, FIG. 14 shows a thin film forming step S3 using a substantially disk-shaped mask member 16. Even when the substantially disk-shaped mask member 16 is used, the opening 17 is covered from above by the mask member 16, and only the surface of the movable substrate 11 forming the thin film 24 is exposed. Therefore, similarly to the above embodiment, in the thin film forming step S3, the electret material 22 is applied only to the region surrounded by the movable substrate 11 and the mask member 16. As a result, even when the liquid electret material 22 is discharged from the dispenser 19, the liquid level of the electret material 22 is parallel to the movable substrate 11, and the electret material 22 can be applied to the end with a uniform thickness.

Further, as shown in FIG. 15, the charging treatment step S4 can be performed before the mask member removing step S5 as in the previous embodiment. In this case as well, the substantially disk-shaped mask member 16 is arranged on the movable substrate 11 so as to cover the opening 17, and the surface of the grounded movable substrate 11 having a high potential is covered with an insulator. Therefore, the charge accumulated in the charging layer 12 can be increased.

In order to facilitate removal in the mask member removing step S5, it is desirable that the substantially disk-shaped mask substrate 16 is also made of an elastic material as in the above embodiment. Further, the substantially disk-shaped mask member 16 may be made of a material having higher water repellency than the movable substrate 11.

From the above, it is desirable to select a material for the mask member that has high insulation and elasticity or high water repellency. Alternatively, the mask in the thin film forming step S3 and the mask in the charging treatment step S4 may be separate ones composed of different materials. That is, a mask made of an elastic or water-repellent material is placed on the movable substrate 11 before the thin film forming step S3, and the removal thereof is performed after the thin film forming step S3. After that, a mask made of a highly insulating material may be placed on the movable substrate 11 before the charging treatment step S4, and the removal thereof may be performed after the charging treatment step S4. Since at least the charging amount of the charging layer 12 cannot be expected to be improved unless the mask member 16 in the charging processing step S4 is used as an insulator, the charging processing step S4 is performed with the mask member 16 made of an insulating material arranged. It is desirable to do it. The mask member 16 made of a material having excellent water repellency and elasticity may be arranged before the thin film forming step S3 and removed immediately after the thin film is formed.

Further, since the above method for creating the charging layer 12 is effective for a substrate provided with an opening 17, it is used not only for the above-mentioned electrostatic electromechanical converter 10 but also for a generator using an electret material or the like. May be.

The present invention is not limited to that described in the above embodiment. In the present embodiment, an example in which the charging layer 12 and the counter electrode 14 are arranged side by side in an annular shape has been described, but the present invention is not limited to this, and the charging layer 12 and the counter electrode 14 are arranged side by side in a straight line, and the counter electrode The signal input to 14 may reciprocate on the straight line. Further, in the above description, the movable substrate 11 is arranged on the movable substrate 13, but the present invention is not limited to this, and the movable substrate 13 may be arranged on the movable substrate 11.

10 Electrostatic electromechanical converter 11 Movable substrate 12 Charging layer 13 Opposing substrate 14A, 14B Opposing electrode 15 Rotating shaft 16 Mask member 17 Opening 18 Resist 19 Dispenser 20 Needle electrode 21 Charge 22 Electret material 23 Mask member opening 24 Thin film

Claims (6)

In a method for manufacturing an electrostatic electromechanical converter in which a charging layer provided on a movable substrate having an opening and a counter electrode provided on a facing substrate are arranged so as to face each other.
An opening forming step of forming the opening in the movable substrate, and
After the opening forming step, a mask member arranging step of arranging a mask member made of an insulator so as to protrude from the surface of the movable substrate on which the charging layer is formed is formed in the opening.
After the mask member arranging step, a thin film forming step of applying a liquid material to be a thin film to a region surrounded by the movable substrate and the mask member and curing the liquid material .
After the thin film forming step, a charging treatment step of charging the exposed thin film to form the charging layer with the mask member arranged .
A method for manufacturing an electrostatic electromechanical converter, which comprises a mask member removing step of removing the mask member after the charging treatment step . The method for manufacturing an electrostatic electromechanical converter according to claim 1, wherein the thin film forming step heats and cures the applied liquid material . The method for manufacturing an electrostatic electromechanical converter according to claim 1 or 2, wherein the mask member arranging step comprises arranging the mask member on the upper side of the movable substrate. The mask member disposing step, an electrostatic method of manufacturing an electromechanical converter according to claim 1 or claim 2, characterized in that by arranging the mask member to fill the opening. The method for manufacturing an electrostatic electromechanical converter according to any one of claims 1 to 4 , wherein the mask member is an elastic body. The method for manufacturing an electrostatic electromechanical converter according to any one of claims 1 to 5 , wherein the mask member has higher water repellency than the movable substrate.

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