JP6762864B2 - Processing equipment - Google Patents

Description

The present invention relates to a processing apparatus that divides a plate-shaped workpiece into a plurality of chips.

A CSP (chip size package) substrate in which a plurality of devices are arranged in an area partitioned by a planned division line and sealed with a resin is divided into individual chips by a dividing device, and each divided chip is portable. It is used in electrical equipment such as telephones and personal computers.

The dividing device for dividing the CSP substrate into individual chips is generally composed of a cutting means for dividing the CSP substrate into individual chips and an accommodating means for accommodating the divided individual chips in a tray. Can be divided into individual chips with high precision and can be stored in a predetermined tray (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2001-23936

However, in order to improve productivity, the CSP substrate is called FOWLP (Fan Out Wafer Level Package) and becomes large (for example, 600 mm × 700 mm), which cannot be handled by the conventional dividing device.

An object of the present invention made in view of the above facts is to provide a processing apparatus capable of efficiently dividing a large substrate into individual chips.

In order to solve the above problems, the present invention provides the following processing apparatus. That is, it is a processing device that divides a plate-shaped workpiece into a plurality of chips, and is a cassette table on which a cassette accommodating a plurality of plate-shaped workpieces is placed, and a cassette placed on the cassette table. A temporary placing means provided on the surface of the temporary placing table with a fork for pulling out the workpiece from the to the first path, and a workpiece pulled out by the fork of the temporary placing means and temporarily placed on the temporary placing means. A work piece detaching means for holding and ascending to separate the work piece from the temporary placing means, and a first moving means for moving the temporary placing means to the first path and separating the temporary placing means from directly under the work piece removing means. A chuck table that is positioned directly under the work piece release means and receives and holds the work piece by lowering the work piece release means, and moves the chuck table to a second path orthogonal to the first path. A cutting means rotatably provided with a second moving means for causing the work piece to be moved and a cutting blade for dividing the work piece held on the chuck table, which is arranged apart from the work piece release means in the second path. The suction pad, which is arranged on the back surface of the temporary placing means and receives and holds the workpiece divided into individual chips from the chuck table, and the workpiece detaching means are separated from the first path. It is a processing apparatus composed of at least a carry-out mechanism for carrying out a work piece divided into individual chips held by the suction pad to the outside.

Preferably, a top surface cleaning means which is disposed in the second path and removes cutting chips generated by cutting the workpiece held on the chuck table from the upper surface of the workpiece and cleans the workpiece, and the first surface cleaning means. When the suction pad is arranged in one path and the work piece divided into individual chips is received from the chuck table and carried out to the carry-out mechanism, the cutting debris adhering to the lower surface of the work piece is removed and washed. The bottom surface cleaning means is provided. The unloading mechanism receives a receiving table that receives the workpiece divided into individual chips held by the suction pad, and a third movement that moves the receiving table to a third path parallel to the second path. Means, tray transfer means for separating the divided workpieces and transferring the chips separated from the receiving table to the tray, tray unloading means for carrying out the tray, and tray supply for supplying an empty tray. It is preferable to provide means. It is convenient that the tray carrying-out means is selectively connected to a tray laminating means for stacking a plurality of trays containing chips and a belt conveyor means for carrying out the trays to a belt conveyor.

The processing apparatus provided by the present invention includes a cassette table on which a cassette accommodating a plurality of plate-shaped workpieces is placed, and a fork that pulls the workpiece out of the cassette placed on the cassette table into the first path. The temporary storage means provided on the surface of the temporary storage table and the work piece pulled out by the fork of the temporary storage means and temporarily placed on the temporary storage means are held and raised to be separated from the temporary storage means. It is positioned directly under the work piece removing means, the first moving means for moving the temporary placing means to the first path and separating it from directly under the work piece removing means, and the work piece removing means. A chuck table that receives and holds the workpiece by lowering the workpiece detaching means, a second moving means that moves the chuck table to a second path orthogonal to the first path, and the workpiece. A cutting means that is rotatably provided with a cutting blade that is disposed apart from the detaching means in the second path and divides the workpiece held on the chuck table, and is arranged on the back surface of the temporary placement means. , A suction pad that receives and holds the workpiece divided into individual chips from the chuck table, and an individual that is disposed apart from the workpiece detaching means in the first path and held by the suction pad. Since it is composed of at least a carry-out mechanism for carrying out the workpiece divided into chips to the outside, even a large substrate called FOWLP can be efficiently divided into individual chips.

The perspective view of the processing apparatus configured according to this invention. A partial perspective view of the processing apparatus shown in FIG. (A) A perspective view showing the temporary placing means and the first moving means in a state where the fork of the temporary placing means shown in FIG. 1 is in the retracted position, and (b) the fork of the temporary placing means shown in FIG. The perspective view which shows the temporary storage means and the first moving means of a state. (A) A perspective view of the suction pad attached to the back surface of the temporary placement means shown in FIG. 1 as viewed from below, and (b) a partially enlarged view of the suction pad. The perspective view of the workpiece detaching means shown in FIG. The perspective view of the cutting means shown in FIG. The perspective view which shows the transport device. A perspective view showing a state in which a work piece is conveyed by a mainstream conveyor. A perspective view showing a state in which a work piece is conveyed from a tributary conveyor to a mainstream conveyor. The perspective view which shows the tray stacking means. A partial perspective view of a processing apparatus connected to a tray laminating means.

Hereinafter, embodiments of a processing apparatus configured according to the present invention will be described with reference to the drawings.

The processing apparatus 2 shown in FIG. 1 is arranged adjacent to the cassette table 4, the first base 6 arranged adjacent to the cassette table 4, and the first base 6 on the opposite side of the cassette table 4. The second base 7 is provided. On the cassette table 4, a cassette 8 for accommodating a plurality of plate-shaped workpieces at predetermined intervals in the vertical direction is placed. FIG. 2 shows a large rectangular substrate 10 (for example, 600 mm × 700 mm) called FOWLP as a workpiece to be accommodated in the cassette 8. The surface 10a of the substrate 10, which is partially enlarged in FIG. 2, is divided into a plurality of rectangular regions by a grid-like division schedule line 12, and a device 14 is arranged in each of the plurality of rectangular regions and sealed with a resin. It has been stopped.

This will be described with reference to FIGS. 1, 3 and 4. As shown in FIG. 1, on the base 6, a temporary placing means 16 capable of pulling out a work piece from a cassette 8 placed on a cassette table 4 and temporarily placing the pulled-out work piece, and an arrow R1 in FIG. A first moving means 18 for moving the temporary placing means 16 is arranged along the first path R1 shown by. As shown in FIG. 3, the temporary placing means 16 includes a temporary placing table 20 on which the workpiece is temporarily placed, and a pair of forks 22 mounted on the surface of the temporary placing table 20 so as to be movable back and forth. A plurality of suction holes 22a are formed on the upper surface of the fork 22, and each suction hole 22a is connected to a suction means (not shown) by a flow path. The drive mechanism (not shown) for moving the fork 22 forward and backward may be composed of, for example, a roller built in the temporary table 20, an endless belt wound around the roller, and a motor for rotating the roller. By this drive mechanism, the fork 22 is moved back and forth in the direction of the first path R1 between the retracted position shown in FIG. 3A and the forward position shown in FIG. 3B. Then, in the temporary placing means 16, the fork 22 is positioned in the forward position near the cassette 8, and then the suction means generates a suction force on the upper surface of the fork 22, so that the lower surface of the work piece housed in the cassette 8 is generated. Can be attracted to the upper surface of the fork 22, and then the fork 22 is positioned in the retracted position so that the workpiece can be pulled out from the cassette 8 to the first path R1 and temporarily placed on the temporary placement table 20. Further, on the back surface of the temporary storage table 20 of the temporary storage means 16, as shown in FIG. 4, a suction pad 24 for holding the workpiece divided into individual chips is arranged. A plurality of suction holes 24a are formed on the lower surface of the rectangular suction pad 24, and each suction hole 24a is connected to a suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement and quantity of the plurality of suction holes 24a correspond to the arrangement and quantity of the device 14 formed on the substrate 10. Therefore, the suction pad 24 attracts and holds each chip while maintaining the shape of the substrate 10 before the division after the substrate 10 is divided into chips by generating a suction force on the lower surface of the suction pad 24 by the suction means. can do.

This will be described with reference to FIGS. 1 and 3. As shown in FIG. 1, the first moving means 18 for moving the temporary placing means 16 along the first path R1 is a gate type arranged across the first base 6 and the second base 7. Includes the support frame 26 of. Explaining with reference to FIG. 3, the support frame 26 is a pair of columns extending upward from the upper surface of the first base 6 and the upper surface of the second base 7 at intervals in the direction of the first path R1. It has a 28 and a beam 30 bridged between the upper ends of the columns 28. The beam 30 is equipped with a movable piece 32 that can move forward and backward in the direction of the first path R1, and a drive mechanism 34 that moves the movable piece 32 forward and backward in the direction of the first path R1. The movable piece 32 includes a rectangular supported portion 36 supported on the upper surface of the beam 30 so as to be movable back and forth in the direction of the first path R1, and a rectangular mounting portion 38 hanging from one end of the supported portion 36. Has. The drive mechanism 34 has a ball screw 40 extending in the direction of the first path R1 on the upper surface of the beam 30, and a motor 42 connected to one end of the ball screw 40. The ball screw 40 of the drive mechanism 34 is connected to the supported portion 36 of the movable piece 32. Then, by driving the motor 42 of the drive mechanism 34, the movable piece 32 moves back and forth in the direction of the first path R1 along the guide rail 30a attached to the upper surface of the beam 30. A pair of guide rails 38a extending in the vertical direction at predetermined intervals are attached to one side surface (front side surface in FIG. 3) of the mounting portion 38 of the movable piece 32, and the guide rail 38a is provided with a temporary placing means 16 The temporary storage table 20 is mounted so as to be able to move up and down. Further, an elevating mechanism 44 for elevating and lowering the temporary table 20 is attached to the attachment portion 38 of the movable piece 32. The elevating mechanism 44 has a ball screw 46 extending in the vertical direction between the guide rails 38a of the mounting portion 38, and a motor 48 connected to the upper end portion of the ball screw 46. The ball screw 46 of the elevating mechanism 44 is connected to the temporary storage table 20. Then, by driving the motor 48 of the elevating mechanism 44, the temporary table 20 is elevated and lowered along the guide rail 38a of the mounting portion 38. Further, since the temporary placing table 20 of the temporary placing means 16 is mounted on the mounting portion 38 of the movable piece 32, the moving piece 32 moves forward and backward in the direction of the first path R1 along the first path R1. The temporary storage means 16 is advanced and retreated.

This will be described with reference to FIGS. 1 and 5. As shown in FIG. 1, above the first base 6, a work piece pulled out by the fork 22 of the temporary placing means 16 and temporarily placed on the temporary placing table 20 of the temporary placing means 16 is held and raised. A work piece removing means 50 for separating the work piece from the temporary place table 20 of the temporary place means 16 is arranged. As shown in FIG. 5, the workpiece releasing means 50 includes a holding portion 52 for holding the workpiece and an air cylinder 54 for raising and lowering the holding portion 52. The holding portion 52 has a rectangular holding plate 56 connected to the lower end of the air cylinder 54, and a plurality of hollow suction pieces 58 attached to the peripheral edge of the lower surface of the holding plate 56 at intervals. Each suction piece 58 having an opening (not shown) at the lower end is connected to a suction means (not shown) by a flow path. Then, in the workpiece removing means 50, the suction means generates a suction force on the suction piece 58, so that the work piece is pulled out by the fork 22 of the temporary placement means 16 and temporarily placed on the temporary placement table 20 of the temporary placement means 16. The work piece can be held by the suction piece 58, and the work piece held by the suction piece 58 can be raised by raising the holding portion 52 by the air cylinder 54 from the temporary placement table 20 of the temporary placement means 16. It can be separated.

This will be described with reference to FIG. The upper surface of the first base 6 is movable along a second path R2 (indicated by an arrow R2 in FIG. 2) orthogonal to the first path R1 and rotates about an axis extending in the vertical direction. A rectangular chuck table 60 is freely arranged. On the upper surface of the chuck table 60 that holds the workpiece when the workpiece is cut, as shown by enlarging a part in FIG. 2, a relief groove 62 that allows the cutting blade 100 of the cutting means 76 to be described later to escape is provided. Are formed in a grid pattern, and suction holes 64 are formed in each of the plurality of rectangular regions defined by the relief grooves 62. Each suction hole 64 is connected to a suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement and quantity of the relief grooves 62 correspond to the arrangement and quantity of the planned division lines 12 of the substrate 10, and the arrangement and quantity of the suction holes 64 correspond to the arrangement and quantity of the device 14 of the substrate 10. It corresponds. Therefore, when the chuck table 60 generates a suction force on the upper surface of the chuck table 60 by the suction means and sucks the substrate 10, cutting is performed along the scheduled division line 12 after the substrate 10 is divided into chips. Also, each chip can be sucked and held while maintaining the shape of the substrate 10.

As shown in FIG. 2, in the second path R2, one side and the other side of the chuck table 60 are covered with a stretchable bellows-shaped cover 66. Inside the bellows-shaped cover 66, a second moving means (not shown) for moving the chuck table 60 along the second path R2 is arranged. The second moving means may include, for example, a ball screw extending along the second path R2 inside the bellows-shaped cover 66 and a motor connected to one end of the ball screw. Then, the ball screw of the second moving means is connected to the lower part of the chuck table 60, and the motor of the second moving means is driven to drive the guide rail (not shown) attached to the inside of the bellows-shaped cover 66. The chuck table 60 can be configured to move forward and backward along the second path R2. Further, the rotating means for rotating the chuck table 60 around the axis extending in the vertical direction can be configured by a motor (not shown) arranged below the chuck table 60.

This will be described with reference to FIGS. 1, 2 and 6. As shown in FIG. 1, the first base 6 is separated from the workpiece releasing means 50 in the direction of the second path R2, and the workpiece held on the chuck table 60 is cut. A cutting mechanism 68 is arranged. As shown in FIG. 2, the cutting mechanism 68 includes a gantry support frame 70 arranged across the second path R2. The support frame 70 has a pair of columns 72 extending upward from the upper surface of the first base 6 at intervals in the direction of the first path R1, and a beam 74 bridged between the upper ends of the columns 72. .. A pair of cutting means 76 are arranged on one side surface of the beam 74 (the back side surface in FIG. 2). As shown in FIG. 6, the cutting means 76 has a rectangular index feed piece 78 supported on one side surface of the beam 74 so as to be movable back and forth in the direction of the first path R1, and the index feed piece 78 as the first path. An indexing feed mechanism 80 that advances and retreats in the direction of R1, a cutting feed piece 82 having an L-shaped cross section that is movably supported by the indexing feed piece 78, a cutting feed mechanism 84 that raises and lowers the cutting feed piece 82, and a cutting feed piece. Includes a spindle unit 86 fixed to the lower end of 82.

Continuing the description with reference to FIG. 6, one side surface of the index feed piece 78 (the front side surface in FIG. 6) is a pair of covers extending in the direction of the first path R1 at intervals in the vertical direction. A guide groove 78a is formed, and the guided groove 78a slides on a pair of guide rails (not shown) extending in the direction of the first path R1 at intervals in the vertical direction on one side surface of the beam 74. It is connected freely. The indexing feed mechanism 80 has a ball screw 88 extending in the direction of the first path R1 on one side surface of the beam 74, and a motor 90 connected to one end of the ball screw 88. The ball screw 88 of the indexing feed mechanism 80 is connected to the indexing feed piece 78. Then, by driving the motor 90 of the indexing feed mechanism 80, the indexing feed piece 78 advances and retreats in the direction of the first path R1 along the guide rail attached to one side surface of the beam 74.

The cut feed piece 82 of the cutting means 76 has a rectangular supported portion 92 supported up and down on the other side surface (back side side surface in FIG. 6) of the index feed piece 78, and a lower end of the supported portion 92. It has a rectangular mounting portion 94 protruding from the second path R2. The notch feed mechanism 84 has a ball screw (not shown) extending in the vertical direction on the other side surface of the index feed piece 78, and a motor 96 connected to one end of the ball screw. The ball screw of the cut feed mechanism 84 is connected to the supported portion 92 of the cut feed piece 82. Then, by driving the motor 96 of the cut feed mechanism 84, the cut feed piece 82 is moved up and down along the guide rail (not shown) attached to the side surface of the index feed piece 78 on the other side.

The spindle unit 86 of the cutting means 76 is rotatably mounted on the spindle housing 98 mounted on the lower surface of the mounting portion 94 of the cutting feed piece 82 and the axis extending in the direction of the first path R1. A spindle (not shown), a motor that rotates the spindle around an axis extending in the direction of the first path R1 (not shown), and a cutting blade 100 fixed to one end of the spindle. It has cutting water supply nozzles 101 arranged on both sides of the cutting blade 100. The cutting blade 100 for dividing the workpiece is rotatably mounted on the spindle unit 86 together with the spindle. The supply nozzle 101 for supplying cutting water when the work piece is divided (cut) by the cutting blade 100 is connected to the cutting water supply means (not shown) by a flow path. In the illustrated embodiment, as shown in FIG. 6, in the pair of cutting means 76, the cutting blades 100 are arranged so as to face each other.

This will be described with reference to FIG. On the other side surface (front side in FIG. 2) of the beam 74 of the support frame 70 of the cutting mechanism 68, an imaging means 102 for imaging a workpiece held on the chuck table 60 is directed in the direction of the first path R1. It is mounted so as to be able to move forward and backward, and a drive mechanism 104 that moves the imaging means 102 forward and backward in the direction of the first path R1 is mounted. The drive mechanism 104 has a ball screw 106 extending in the direction of the first path R1 on the other side surface of the beam 74, and a motor 108 connected to one end of the ball screw 106. The ball screw 106 of the drive mechanism 104 is connected to the image pickup means 102. Then, by driving the motor 108 of the drive mechanism 104, the image pickup means 102 moves back and forth in the direction of the first path R1 along the guide rail 74a attached to the side surface on the other side of the beam 74.

As shown in FIG. 2, the support frame 70 of the cutting mechanism 68 has a top surface cleaning means 110 that removes cutting chips generated by cutting the workpiece held on the chuck table 60 from the top surface of the workpiece and cleans it. Are arranged. The upper surface cleaning means 110 extends from the vertical intermediate portion of one column 72 to the vertical intermediate portion of the other column 72, and is arranged across the second path R2. In the upper surface cleaning means 110 that can be formed from the hollow member, a plurality of injection holes (not shown) are formed on the lower surface at intervals in the direction of the first path R1, and each injection hole supplies the cleaning liquid by the flow path. It is connected to a means (not shown). Then, in the top surface cleaning means 110, the cleaning liquid supplied from the cleaning liquid supply means is injected from each injection hole, so that the cutting chips generated by cutting the workpiece held on the chuck table 60 are removed from the workpiece. It can be removed from the top surface and washed.

As shown in FIGS. 1 and 2, the suction pad 24 of the temporary placing means 16 holds the upper surface of the workpiece divided into individual chips in the first path R1 on the upper surface of the first base 6. While moving along the first path R1, a bottom surface cleaning means 112 is provided for removing and cleaning the cutting chips adhering to the bottom surface of the workpiece. As shown in FIG. 2, the bottom surface cleaning means 112 has a brush 114, an injection means 116, and a roller 118 which are sequentially arranged along the first path R1. The brushes 114 are aligned along the direction of the second path R2. The injection means 116, which can be formed from a hollow member extending in the direction of the second path R2, has a plurality of injection holes 116a formed on the upper surface at intervals in the direction of the second path R2, and each injection hole 116a is a flow path. Is connected to a cleaning liquid supply means (not shown). Further, the roller 118, which is rotatably configured around an axis extending in the direction of the second path R2, has at least an outer peripheral surface formed of an appropriate synthetic resin material such as urethane. Then, in the bottom surface cleaning means 112, the brush 114 moves while the suction pad 24 of the temporary placing means 16 is moving along the first path R1 while holding the upper surface of the workpiece divided into individual chips. Since it comes into contact with the lower surface of the work piece and the cleaning liquid supplied from the cleaning liquid supply means is ejected from each injection hole 116a of the injection means 116 toward the lower surface of the work piece, cutting chips adhering to the lower surface of the work piece. And can be cleaned, and the roller 118 can come into contact with the lower surface of the workpiece to remove the cleaning liquid from the lower surface of the workpiece. As described above, in the processing apparatus 2, the cutting chips generated by cutting the workpiece can be removed from the upper surface of the workpiece by the top surface cleaning means 110 and cleaned. However, in the case of cutting. Since a suction force is generated on the upper surface of the chuck table 60 to hold the work piece, the cutting chips generated during the cutting process are moved to the lower surface side of the work piece by the suction force generated on the upper surface of the chuck table 60. It may move and cutting chips may adhere to the lower surface of the work piece. However, in the processing apparatus 2, even when cutting chips remain on the lower surface of the workpiece whose upper surface has been cleaned by the upper surface cleaning means 110, the cutting chips remaining on the lower surface of the workpiece can be removed by the lower surface cleaning means 112. ..

The processing device 2 includes a carry-out mechanism 120 that carries out the work piece divided into individual chips to the outside. As shown in FIG. 1, the carrying-out mechanism 120 arranged apart from the work piece releasing means 50 in the direction of the first path R1 receives the work piece divided into individual chips from the suction pad 24. The table 122, the third moving means 124 for moving the receiving table 122 along the third path R3 parallel to the second path R2 (indicated by the arrow R3 in FIG. 1), and the divided workpiece. The tray transfer means 126 for transferring the chips sorted from the receiving table 122 to the tray 146, the tray unloading means 128 for carrying out the tray 146 on which the chips are mounted, and the tray supply means for supplying the empty tray 146. Includes 130 and.

The receiving table 122 is arranged on the upper surface of the second base 7, and is configured to be movable along the third path R3. As shown by enlarging a part in FIG. 2, a plurality of suction holes 122a are formed on the upper surface of the rectangular receiving table 122, and each suction hole 122a is connected to a suction means (not shown) by a flow path. Has been done. In the illustrated embodiment, the arrangement and quantity of the plurality of suction holes 122a correspond to the arrangement and quantity of the device 14 formed on the substrate 10. Therefore, the receiving table 122 attracts and holds each chip while maintaining the shape of the substrate 10 before the division after the substrate 10 is divided into chips by generating an attractive force on the upper surface of the receiving table 122 by the suction means. can do. Further, as shown in FIG. 2, the third moving means 124 for moving the receiving table 122 along the third path R3 is formed on the upper surface of the second base 7 along the third path R3. It is housed in the storage groove 7a. The third moving means 124 has a ball screw 132 extending along the accommodating groove 7a and a motor (not shown) connected to one end of the ball screw 132. The ball screw 132 of the third moving means 124 is connected to the lower part of the receiving table 122. Then, by driving the motor of the third moving means 124, the receiving table 122 is moved back and forth along the third path R3 along the guide rail (not shown) attached to the accommodating groove 7a. ..

As shown in FIG. 2, the tray transfer means 126 includes an L-shaped support frame 134 arranged so as to straddle the second base 7. The support frame 134 is separated from the support column 136 extending upward from one end of the upper surface of the second base 7 (the end on the side of the first base 6) and the first base 6 from the upper end of the support column 136. A beam 138 extending in the direction, a suction member 140 mounted on the lower surface of the beam 138 so as to be movable along the beam 138, and a moving mechanism (not shown) for moving the suction member 140 along the beam 138. Have. The moving mechanism for moving the suction member 140 along the beam 138 includes, for example, a ball screw extending in the direction of the first path R1 on the lower surface of the beam 138 and a motor connected to one end of the ball screw. It's fine. Then, the ball screw of the moving mechanism is connected to the upper part of the suction member 140, and the motor of the moving mechanism is driven to drive the suction member 140 along the guide rail (not shown) attached to the lower surface of the beam 138. Can be configured to move forward and backward. The suction member 140 includes an air cylinder 142 mounted on the lower surface of the beam 138 so as to be movable along the beam 138, and a rectangular suction plate 144 fixed to the lower end of the air cylinder 142. In the illustrated embodiment, the suction plate 144 is formed to be smaller than the size of the substrate 10 and to a size corresponding to the width of the transport tray 146 shown in FIGS. 1 and 2. A plurality of suction holes (not shown) are formed on the lower surface of the suction plate 144, and each suction hole of the suction plate 144 is connected to a suction means (not shown) by a flow path. In the illustrated embodiment, the arrangement of the plurality of suction holes of the suction plate 144 corresponds to the arrangement of the device 14 formed on the substrate 10. Therefore, the suction plate 144 is the quantity corresponding to the width of the tray 146 among the divided workpieces held on the receiving table 122 by generating a suction force on the lower surface of the suction plate 144 by the suction means. Can be adsorbed and held while being separated. Further, the tray transfer means 126 raises the suction plate 144 on which the workpiece is sucked by the air cylinder 142, then moves the suction member 140 by the moving mechanism, and then releases the suction force above the tray 146. The workpiece can be transferred to the tray 146. A sheet having a tack force (weak adhesive force) is attached to the recessed storage portion of the tray 146. As the sheet having tack power, the product name "Sepalace" or "Handeco Tack" manufactured and sold by New Tac Kasei Co., Ltd. can be used. Since a sheet having a tacking force is attached to the accommodating portion of the tray 146, the work piece transferred to the accommodating portion of the tray 146 is prevented from being displaced in the tray 146 by the tacking force.

As shown in FIG. 2, the tray supply means 130 includes a rectangular parallelepiped frame 148 arranged close to the second base 7 and having an open upper surface, and at least a pair rotatably supported on the upper portion of the frame 148. It can be composed of a belt conveyor having a roller 150, a pair of endless belts 152 wound around the pair of rollers 150, and a rotation mechanism (not shown) for rotating the rollers 150. A stopper 154 for stopping the tray 146 mounted on the endless belt 152 at a supply position for supplying the tray unloading means 128 is attached to one end of the frame body 148 in the longitudinal direction. Then, in the tray supply means 130, the endless belt 152 is rotated by the rotation mechanism together with the roller 150, so that the operator moves the empty tray 146 mounted on the endless belt 152 toward the supply position and supplies it by the stopper 154. It can be stopped at the position.

As shown in FIG. 1, the tray unloading means 128 receives the first unloading means 156 for unloading the empty tray 146 from the tray supplying means 130 and the empty tray 146 unloading from the first unloading means 156 and is empty. The second unloading means 158 for unloading the tray 146 and the empty tray 146 unloading from the second unloading means 158 were stopped at the workpiece receiving position for receiving the workpiece and accommodated the workpiece. It has a third carrying-out means 160 for carrying out the tray 146.

As shown in FIG. 2, the first carrying-out means 156 includes a frame body 162 that is arranged close to the supply position of the tray supply means 130 and extends upward, an arm 164 that is vertically supported by the frame body 162, and an arm. An elevating mechanism (not shown) for elevating and lowering the 164 and a plurality of hollow suction pieces 166 attached to the lower surface of the tip of the arm 164 at intervals are provided. Each suction piece 166 having an opening (not shown) at the lower end is connected to a suction means (not shown) by a flow path. Then, in the first carrying-out means 156, the arm 164 is lowered, the suction piece 166 is brought into close contact with the upper surface of the tray 146 positioned at the supply position of the tray supply means 130, and then the suction force is applied to the suction piece 166 by the suction means. The tray 146 is attracted to the suction piece 166, and then the arm 164 that sucks the tray 146 by the suction piece 166 is raised by the elevating mechanism to carry out the empty tray 146 from the tray supply means 130. it can.

The second unloading means 158 is arranged at an interval in the vertical direction of the frame body 162 of the first unloading means 156, and can be opened and closed between a closed position close to each other and an open position separated from each other. The one-side receiving member 168 and the other-side receiving member 170 configured in the above, and an air cylinder 172 for opening and closing the one-side receiving member 168 and the other-side receiving member 170 between the closed position and the open position are provided. The one-side receiving member 168 has an upstream side portion 168a and a downstream side portion 168b arranged at intervals that allow the arm 164 of the first carrying-out means 156 to pass when ascending. The lower end of the upstream side portion 168a and the lower end of the downstream side portion 168b of the one-side receiving member 168 project toward the other side receiving member 170, and the lower end of the other side receiving member 170 protrudes toward the one-side receiving member 168. When the member 168 and the other side receiving member 170 are positioned in the closed position, the tray 146 is received from the arm 164 of the first carrying-out means 156 by the protruding portion of the one side receiving member 168 and the protruding portion of the other side receiving member 170. You can do it. Further, each of the one-side receiving member 168 and the other-side receiving member 170 is equipped with a plurality of unloading rollers 174 rotatably arranged on the inner surface side and a rotating mechanism (not shown) for rotating the unloading roller 174. Has been done. At least the outer peripheral surface of the unloading roller 174 is formed of a material (for example, synthetic rubber) that generates a frictional force equal to or higher than a predetermined value with the outer surface of the tray 146. Then, in the second carrying-out means 158, the tray 146 mounted on the one-side receiving member 168 and the other-side receiving member 170 can be carried out by rotating the carrying-out roller 174 by the rotation mechanism. Further, the air cylinder 172 mounted on both the one-side receiving member 168 and the other-side receiving member 170 brings the one-side receiving member 168 and the other-side receiving member 170 close to each other, and the arm 164 to the tray 146 of the first carrying-out means 156 are brought close to each other. The tray 146 can be passed when the arm 164 of the first carrying-out means 156 that has attracted the tray 146 is lifted by separating the one-side receiving member 168 and the other-side receiving member 170 from each other at the closed position where the tray 146 can be received. The one-side receiving member 168 and the other-side receiving member 170 are opened and closed from the open position.

The third carrying-out means 160 connected to the one-side receiving member 168 and the other-side receiving member 170 of the second carrying-out means 158 is a bottom wall 176 and a pair of side walls 178 protruding upward from both ends of the bottom wall 176. A plurality of unloading rollers 180 rotatably arranged on the inner surface side of the side wall 178, a rotating mechanism (not shown) for rotating the unloading rollers 180, and a bottom wall 176 arranged at intervals in the longitudinal direction. A plurality of tray sensors 182 for detecting the tray 146 are provided. At least the outer peripheral surface of the carry-out roller 180 is formed of a material (for example, synthetic rubber) that generates a frictional force equal to or higher than a predetermined value with the outer surface of the tray 146. Then, in the third carry-out means 160, when the empty tray 146 is carried out from the second carry-out means 158, the tray sensor 182 detects the empty tray 146, thereby stopping the rotation of the carry-out roller 180. The empty tray 146 carried out from the second carrying-out means 158 can be stopped at a plurality of workpiece receiving positions along the carrying-out direction. Further, in the third unloading means 160, the tray 146 containing the workpiece can be unloaded by rotating the unloading roller 180 by the rotating mechanism.

In the illustrated embodiment, as shown in FIG. 1, a transport device 200 for transporting the tray 146 containing the workpiece to the next step is connected to the downstream side of the third unloading means 160 of the tray unloading means 128. There is. Explaining with reference to FIG. 7, the transport device 200 receives and transports the tray 146 carried out from the processing device 2 and the tributary belt conveyor 202, and receives the tray 146 from the tributary belt conveyor 202 and transports the tray 146 to the next process. It is equipped with a mainstream belt conveyor 204. The starting point of the tributary belt conveyor 202 is located on the downstream side of the third carrying-out means 160 of the tray carrying-out means 128. Further, the end point of the tributary belt conveyor 202 is positioned on the side side of the mainstream belt conveyor 204, and the tributary belt conveyor 202 and the mainstream belt conveyor 204 form a T-junction 206.

The tributary belt conveyor 202 is wound around a pair of side walls 208 arranged at intervals corresponding to the width of the tray 146, at least a pair of rollers 210 rotatably supported by the side wall 208, and a pair of rollers 210. It has a pair of endless belts 212 and a rotation mechanism (not shown) for rotating the rollers 210. A pair of rollers 210, a pair of endless belts 212, and a rotating mechanism are used as a set of conveyor units, and by using a plurality of sets of conveyor units and a side wall 208 of an appropriate length, a tributary belt conveyor 202 of an appropriate length is used. Can be. As shown in the AA cross section of FIG. 7, the upper surface of the side wall 208 is located above the upper surface of the endless belt 212, and the side wall 208 prevents the tray 146 from falling off from the tributary belt conveyor 202 during transportation. There is. However, as shown in the BB cross section of FIG. 7, in the vicinity of the T-shaped road 206 (the portion where the inner guide member 242 described later is arranged), the upper surface of the side wall 208 located on the downstream side of the mainstream belt conveyor 204. Is located flush with the upper surface of the endless belt 212 or below the upper surface of the endless belt 212, whereby when the tray 146 is conveyed from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the mainstream belt conveyor 204 The side wall 208 located on the downstream side does not interfere with the transportation of the tray 146.

As shown in FIGS. 1 and 7, a tributary stopper 214 and a tributary sensor 216 for detecting the tray 146 are arranged at positions adjacent to the T-junction 206 of the tributary belt conveyor 202. The tributary stopper 214 has a stop position (position shown in FIG. 7) that prevents the tray 146 being conveyed by the tributary belt conveyor 202 from entering the T-junction 206 and a T-junction of the tray 146 being conveyed by the tributary belt conveyor 202. It has a terminal 218 configured to be movable between an allowable position allowing entry into the 206, and an air cylinder 220 for moving the terminal 218 between the stop position and the allowable position. Then, when the tributary sensor 216 does not detect the tray 146, the air cylinder 220 of the tributary stopper 214 positions the terminal 218 at the stop position. Further, when the tributary sensor 216 detects the tray 146 and guides the tray 146 from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the air cylinder 220 of the tributary stopper 214 positions the terminal 218 in an allowable position.

The mainstream belt conveyor 204 is wound around a pair of side walls 222 arranged at intervals corresponding to the width of the tray 146, at least a pair of rollers 224 rotatably supported by the side wall 222, and a pair of rollers 224. It has a pair of endless belts 226 and a rotating mechanism (not shown) for rotating the roller 224. A pair of rollers 224, a pair of endless belts 226, and a rotation mechanism are used as a set of conveyor units, and by using a plurality of sets of conveyor units and a side wall 222 of an appropriate length, a mainstream belt conveyor 204 of an appropriate length is used. Can be. Similar to the side wall 208 of the tributary belt conveyor 202, the upper surface of the side wall 222 of the mainstream conveyor 204 is also located above the upper surface of the endless belt 226, and the tray 146 being conveyed falls off from the mainstream belt conveyor 204 on the side wall 222. Is prevented by. However, in the vicinity of the T-shaped road 206 (the portion where the inner guide member 242 described later is arranged), the upper surface of the side wall 222 of the mainstream belt conveyor 204 is also the endless belt 226, similarly to the side wall 208 of the tributary belt conveyor 202. It is located flush with the top surface or below the top surface of the endless belt 226 so that when the tray 146 is transported from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the side wall 222 of the mainstream belt conveyor 204 is the tray 146. It is designed so that it does not interfere with the transportation of the belt.

As shown in FIGS. 1 and 7, the mainstream stopper 228 and the mainstream sensor 230 that detect the tray 146 are located adjacent to the T-junction 206 of the mainstream belt conveyor 204 and upstream of the T-junction 206. And are arranged. The mainstream stopper 228 has a stop position (position shown in FIG. 7) that prevents the tray 146 being conveyed by the mainstream belt conveyor 204 from entering the T-junction 206 and a T-junction of the tray 146 being conveyed by the mainstream belt conveyor 204. It has a terminal 232 that is configured to be movable between an allowable position that allows entry into the 206, and an air cylinder 234 that moves the terminal 232 between the stop position and the allowable position. Then, when the mainstream sensor 230 does not detect the tray 146, the air cylinder 234 of the mainstream stopper 228 positions the terminal 232 at the stop position. Further, when the mainstream sensor 230 detects the tray 146 and the tray 146 being conveyed by the mainstream belt conveyor 204 passes through the T-junction 206, the air cylinder 234 of the mainstream stopper 228 allows the terminal 232 to be in an allowable position. Positioned in.

A guide means 236 is provided on the T-junction 206, and the guide means 236 includes a curved outer guide member 238 that guides the tray 146 from the tributary belt conveyor 202 to the mainstream belt conveyor 204. The outer guide member 238 positioned across the mainstream belt conveyor 204 is configured to be able to move up and down, and the guide means 236 further includes a drive unit 240 for raising and lowering the outer guide member 238. The drive unit 240, which may be composed of an appropriate actuator such as an air cylinder, lowers the outer guide member 238 to position the tray 146 being conveyed by the tributary belt conveyor 202 at the guide position when guiding the tray 146 to the mainstream belt conveyor 204. The outer guide member 238 is preferably formed of an appropriate low friction material such as PTFE, whereby the tray 146 being conveyed by the tributary belt conveyor 202 smoothly goes to the mainstream belt conveyor 204 without being caught by the outer guide member 238. Is guided. Further, when the tray 146 being conveyed by the mainstream belt conveyor 204 passes through the T-junction 206, the drive unit 240 raises the outer guide member 238, and the T-junction 206 of the tray 146 being conveyed by the mainstream belt conveyor 204 is raised. Position it in an allowable position to allow entry into. In the illustrated embodiment, the guide means 236 includes a curved inner guide member 242 fixed at a position facing the lowering position of the outer guide member 238. Then, when the tray 146 moves from the tributary belt conveyor 202 to the mainstream belt conveyor 204, the inner guide member 242 prevents the tray 146 from falling.

When processing the substrate 10 as a work piece by the processing apparatus 2, first, the cassette 8 containing the plurality of substrates 10 is placed on the cassette table 4. Next, the temporary storage means 16 is moved along the first path R1 by the drive mechanism 34 of the first moving means 18 together with the movable piece 32 until the temporary storage means 16 is adjacent to the cassette 8. Next, the temporary placing means 16 is moved up and down by the elevating mechanism 44 of the first moving means 18, and the temporary placing means 16 is positioned in the vicinity of the substrate 10 to be carried out from the cassette 8. Next, the fork 22 is advanced to the forward position by the drive mechanism of the temporary placing means 16, and the upper surface of the fork 22 is positioned on the back surface of the substrate 10 to be carried out from the cassette 8. Next, the suction means connected to the suction hole 22a of the fork 22 is operated to generate a suction force on the upper surface of the fork 22, and the back surface of the substrate 10 to be carried out from the cassette 8 is attracted to the upper surface of the fork 22. Next, the fork 22 that has attracted the substrate 10 is retracted to the retracted position by the drive mechanism of the temporary placement means 16, the substrate 10 is pulled out to the first path R1, and the substrate 10 is temporarily placed on the temporary placement table 20 of the temporary placement means 16. To do.

After the substrate 10 is temporarily placed on the temporary placement table 20, the holding portion 52 of the workpiece releasing means 50 is lowered by the air cylinder 54 of the workpiece releasing means 50, and the suction piece 58 of the holding portion 52 is placed on the temporary placing table 20. It is brought into close contact with the surface 10a of the substrate 10 temporarily placed on the surface. Next, the suction means connected to the suction piece 58 of the holding portion 52 is operated to generate a suction force on the suction piece 58, and the surface 10a of the substrate 10 is sucked on the suction piece 58. Next, by raising the holding portion 52 by the air cylinder 54 of the workpiece releasing means 50, the substrate 10 held by the suction piece 58 of the holding portion 52 is raised and separated from the temporary placing table 20 of the temporary placing means 16. .. Next, the temporary placing means 16 is moved along the first path R1 by the driving mechanism 34 of the first moving means 18, so that the temporary placing means 16 is separated from directly under the work piece releasing means 50, and the substrate 10 is separated. The chuck table 60 is exposed below. Next, the chuck table 60 is moved along the second path R2 by a second moving means (not shown), and the chuck table is directly under the substrate 10 held by the suction piece 58 of the workpiece releasing means 50. Position 60. Next, the holding portion 52 is lowered by the air cylinder 54 of the workpiece releasing means 50, and the substrate 10 held by the suction piece 58 is placed on the upper surface of the chuck table 60. When the substrate 10 is placed on the upper surface of the chuck table 60, the suction force of the suction piece 58 of the workpiece release means 50 is released, and the suction means connected to the suction hole 64 of the chuck table 60 is operated. A suction force is generated on the upper surface of the chuck table 60, and the substrate 10 is attracted to the upper surface of the chuck table 60.

After adsorbing the substrate 10 on the upper surface of the chuck table 60, the chuck table 60 is moved along the second path R2 by the second moving means, and the chuck table 60 is positioned below the imaging means 102. Next, the image pickup means 102 is moved by the drive mechanism 104 along the direction of the first path R1, and the chuck table 60 is moved along the second path R2 by the second moving means. The substrate 10 is imaged. Next, based on the image captured by the imaging means 102, the planned division line 12 which is the region of the substrate 10 to be cut is detected. Next, the chuck table 60 is moved along the second path R2 by the second moving means, and the tip end portion of the scheduled division line 12 in the direction of the second path R2 is positioned below the cutting blade 100 of the cutting means 76. ..

When the planned division line 12 of the substrate 10 is detected, if the planned division line 12 and the relief groove 62 of the chuck table 60 do not match, the planned division line 12 and the relief groove 62 are matched. Correct the misalignment of. In the misalignment correction, first, before the chuck table 60 is positioned below the cutting means 76, the chuck table 60 is moved below the workpiece releasing means 50 by the second moving means. Then, when the planned division line 12 and the relief groove 62 do not match in the direction of the second path R2, or when viewed from above, the relative angle between the planned division line 12 and the relief groove 62 is equal to or greater than the allowable angle and the angle shifts. When the above occurs, the substrate 10 is held and raised by the suction piece 58 of the workpiece removing means 50. Next, the chuck table 60 is moved and rotated by the second moving means and rotating means (not shown) to adjust the position of the relief groove 62. As a result, the relief groove 62 can be matched with the scheduled division line 12, and the positional deviation and the angular deviation in the direction of the second path R2 can be corrected. On the other hand, when the planned division line 12 and the relief groove 62 do not match in the direction of R1 of the first path, the chuck table 60 is moved below the workpiece releasing means 50 by the second moving means. After that, the temporary placement means 16 is moved along the first path R1 by the drive mechanism 34 of the first moving means 18, and the temporary placement means 16 is positioned above the chuck table 60. Next, the temporary placement means 16 is lowered by the elevating mechanism 44 of the first moving means 18, and the lower surface of the suction pad 24 of the temporary placement means 16 is brought into close contact with the surface 10a of the substrate 10. Next, the suction force on the upper surface of the chuck table 60 is released, and the suction means connected to the suction hole 24a of the suction pad 24 is operated to generate a suction force on the lower surface of the suction pad 24, and the suction force is generated on the lower surface of the suction pad 24. The surface 10a of the substrate 10 is adsorbed. Next, the temporary placement means 16 is raised by the elevating mechanism 44 of the first moving means 18, so that the substrate 10 held by the suction pad 24 is raised. Next, the temporary placement means 16 is moved along the first path R1 by the drive mechanism 34 of the first moving means 18 to adjust the position of the planned division line 12 of the substrate 10. As a result, the scheduled division line 12 can be matched with the relief groove 62, and the positional deviation in the direction of the first path R1 can be corrected. After correcting the misalignment, the substrate 10 is attracted to the upper surface of the chuck table 60 again.

After the tip of the scheduled division line 12 in the direction of the second path R2 is positioned below the cutting blade 100 of the cutting means 76, a cutting step of dividing the substrate 10 into individual chips is performed. In the cutting process, first, each indexing feed mechanism 80 of the pair of cutting means 76 is operated, and one cutting blade 100 is placed above the planned division line 12 located at one end of the substrate 10 in the direction of the first path R1. In addition to positioning, the other cutting blade 100 is positioned above the planned division line 12 located in the middle portion of the substrate 10 in the direction of the first path R1. Next, each cutting blade 100 is rotated by the motor of each spindle unit 86. Next, each spindle housing 98 is lowered by each cutting feed mechanism 84 until the outer peripheral edge of each cutting blade 100 reaches the relief groove 62 of the chuck table 60, and the cutting edge of each cutting blade 100 is placed on the planned division line 12 of the substrate 10. Along with making a cut, the chuck table 60 is moved along the second path R2 by the second moving means at a predetermined machining feed rate, and a cutting blade is formed at the end of the scheduled division line 12 in the direction of the second path R2. When 100 is reached, each spindle housing 98 is raised by each cutting feed mechanism 84. During this cutting process, the cutting water supply means connected to the cutting water supply nozzle 101 is operated, and the cutting water supplied from the cutting water supply means is supplied from the cutting water supply nozzle 101, and the upper surface is cleaned. Cutting debris generated by cutting the substrate 10 by operating the cleaning liquid supply means connected to each injection hole of the means 110 and injecting the cleaning liquid supplied from the cleaning liquid supply means from each injection hole of the top surface cleaning means 110. Is removed from the surface 10a (upper surface) of the substrate 10 and cleaned. In the cutting step, the cutting process and the indexing feed for indexing and feeding the cutting blade 100 by the indexing feed mechanism 80 for the interval of the adjacent division scheduled lines 12 are alternately performed. As described above, one cutting blade 100 is positioned above the planned division line 12 located at one end of the substrate 10 in the direction of the first path R1, and at the middle portion of the substrate 10 in the direction of the first path R1. When the other cutting blade 100 is positioned above the position scheduled division line 12, each cutting blade 100 is moved toward the other end of the substrate 10 in the direction of the first path R1 in the indexing feed. At the start of cutting, one cutting blade 100 is positioned above the planned division line 12 located at one end of the substrate 10 in the direction of the first path R1, and in the direction of the first path R1. The other cutting blade 100 is positioned above the planned division line 12 located at the other end of the substrate 10, and each cutting blade 100 is placed toward the intermediate portion of the substrate 10 in the direction of the first path R1 in indexing feed. You may move it. Then, by alternately repeating cutting and indexing feed, after cutting all the scheduled division lines 12 positioned along the second path R2, the chuck table 60 is rotated 90 degrees by the rotating means. After rotating, all the scheduled division lines 12 orthogonal to the scheduled division line 12 that have been cut are also cut by alternately repeating the cutting process and the indexing feed. As a result, the substrate 10 can be divided into individual chips. As described above, since the arrangement and quantity of the suction holes 64 of the chuck table 60 correspond to the arrangement and quantity of the device 14 of the substrate 10, in the chuck table 60, even after the substrate 10 is divided into chips. Each chip can be sucked and held while maintaining the shape of the substrate 10. Further, the chuck table 60 can be appropriately replaced according to the size of the plate-shaped workpiece and the size of the device.

After performing the cutting step of dividing the substrate 10 into individual chips, the chuck table 60 is moved along the second path R2 by the second moving means, and the chuck table 60 is placed below the workpiece releasing means 50. At the same time, the temporary placement means 16 is moved along the first path R1 by the drive mechanism 34 of the first moving means 18, and the temporary placement means 16 is positioned above the chuck table 60. In this case, the positions of the suction holes 24a of the suction pad 24 of the temporary placement means 16 and the positions of the chips are aligned with each other when viewed in the vertical direction. Next, the temporary placement means 16 is lowered by the elevating mechanism 44 of the first moving means 18, and the lower surface of the suction pad 24 is brought into close contact with the upper surface of the chip. Next, the suction force on the upper surface of the chuck table 60 is released, a suction force is generated on the lower surface of the suction pad 24, and each chip is sucked on the lower surface of the suction pad 24. As described above, since the arrangement and quantity of the suction holes 24a of the suction pad 24 correspond to the arrangement and quantity of the device 14 of the substrate 10, the shape of the substrate 10 is also formed in the suction pad 24 as in the chuck table 60. Each chip can be sucked and held while maintaining the above. Further, like the chuck table 60, the suction pad 24 can be appropriately replaced according to the size of the plate-shaped workpiece and the size of the device.

After each tip is attracted to the lower surface of the suction pad 24, the temporary placement means 16 is raised by the elevating mechanism 44 of the first moving means 18, so that the lower surface of each tip is the brush 114 and the roller 118 of the lower surface cleaning means 112. Each tip held by the suction pad 24 is raised to a height at which it comes into contact with. Next, the drive mechanism 34 of the first moving means 18 moves the temporary placing means 16 toward the carrying-out mechanism 120 along the first path R1, and each chip is passed above the lower surface cleaning means 112. When each chip passes above the lower surface cleaning means 112, the brush 114 comes into contact with the lower surface of each chip, and the cleaning liquid supplied from the cleaning liquid supply means is sent from each injection hole 116a of the injection means 116 to the lower surface of each chip. Since the injection is directed toward the chips, the cutting chips adhering to the lower surface of each chip can be removed and cleaned, and the roller 118 can come into contact with the lower surface of each chip to remove the cleaning liquid from the lower surface of each chip.

When the temporary placing means 16 passes above the bottom surface cleaning means 112 and the suction pad 24 reaches above the receiving table 122 of the carrying-out mechanism 120, the drive mechanism 34 of the first moving means 18 is stopped. At this time, the positions of the suction holes 122a of the receiving table 122 and the positions of the chips are aligned with each other when viewed in the vertical direction. Next, the temporary placement means 16 is lowered by the elevating mechanism 44 of the first moving means 18, and the lower surface of each chip is brought into close contact with the upper surface of the receiving table 122. Next, the suction force of the suction pad 24 is released, and the suction means connected to the suction hole 122a of the receiving table 122 is operated to generate a suction force on the upper surface of the receiving table 122, and each chip is generated on the upper surface of the receiving table 122. Adsorb the bottom surface of the table. As described above, since the arrangement and quantity of the suction holes 122a of the receiving table 122 correspond to the arrangement and quantity of the device 14 on the substrate 10, the receiving table 122 also has the same as the chuck table 60 and the suction pad 24. Each chip can be sucked and held while maintaining the shape of the substrate 10. Further, the receiving table 122, like the chuck table 60 and the suction pad 24, can be appropriately replaced according to the size of the plate-shaped workpiece and the size of the device.

Subsequently, the unloading process of unloading the chips to the outside of the processing apparatus 2 by the unloading mechanism 120 of the processing apparatus 2 will be described. After each chip is attracted to the upper surface of the receiving table 122, the receiving table 122 is moved along the third path R3 by the third moving means 124, and the receiving table 122 is positioned below the tray transfer means 126. Next, the suction member 140 is lowered by the air cylinder 142 of the tray transfer means 126, and the lower surface of the suction plate 144 is brought into close contact with the upper surface of the chip. Next, the suction force on the upper surface of the receiving table 122 is released, and the suction means connected to the suction hole of the suction plate 144 is operated to generate a suction force on the lower surface of the suction plate 144, which corresponds to the width of the tray 146. A minute number of chips are sucked onto the lower surface of the suction plate 144. As described above, since the size of the suction plate 144 corresponds to the width of the tray 146 and the arrangement of the suction holes of the suction plate 144 corresponds to the arrangement of the device 14 on the substrate 10, it is held by the receiving table 122. Of the chips, the number of chips corresponding to the width of the tray 146 can be sucked and held while being separated. Further, the suction plate 144 can be replaced as appropriate according to the size of the device. Next, each chip held by the suction plate 144 is raised by raising the suction plate 144 by the air cylinder 142 of the tray transfer means 126. Next, the suction plate 144 is moved in the direction orthogonal to the direction of the third path R3 by the moving mechanism of the tray transfer means 126, and the empty tray 146 placed in the third carry-out means 160 of the tray carry-out means 128 The suction plate 144 is positioned above. Next, the suction plate 144 is lowered by the air cylinder 142 of the tray transfer means 126, the lower surface of each chip is brought into close contact with the upper surface of the recessed accommodating portion of the tray 146, and the suction force of the suction plate 144 is released. As a result, the chips divided into the tray 146 can be transferred from the receiving table 122. Then, while the tray 146 is stopped at each work receiving position in the third unloading means 160 of the tray unloading means 128, the tray transferring means 126 transfers the chips from the receiving table 122 to the tray 146 a predetermined number of times ( After performing (for example, three times), the unloading roller 174 is rotated by the rotating mechanism of the third unloading means 160, whereby the tray 146 can be unloaded to the transport device 200.

Here, in the unloading mechanism 120, an operation of supplying an empty tray 146 from the tray supplying means 130 to the third unloading means 160 of the tray unloading means 128 will be described. First, an operator mounts an empty tray 146 on the endless belt 152 of the tray supply means 130, and operates the endless belt 152 by the rotation mechanism of the tray supply means 130. Then, the empty tray 146 is stopped by the stopper 154 at the supply position for supplying the tray unloading means 128. Further, in the second carrying-out means 158, the one-side receiving member 168 and the other-side receiving member 170 are moved to an open position where the tray 146 can pass by the air cylinder 172. Next, the arm 164 is lowered by the elevating mechanism of the first carry-out means 156, and the lower surface of the suction piece 166 of the first carry-out means 156 is brought into close contact with the upper surface of the empty tray 146 positioned at the supply position of the tray supply means 130. Let me. Next, the suction means connected to the suction piece 166 is operated to generate a suction force on the lower surface of the suction piece 166, and the upper surface of the tray 146 is sucked on the lower surface of the suction piece 166. Next, the arm 164 is raised by the elevating mechanism of the first carrying-out means 156, and the empty tray 146 sucked by the suction piece 166 is positioned above the second carrying-out means 158. Next, the air cylinder 172 of the second carrying-out means 158 moves the one-side receiving member 168 and the other-side receiving member 170 to a closed position where the tray 146 can be received. Next, the arm 164 is lowered by the elevating mechanism of the first carrying-out means 156, an empty tray 146 is placed on the one-side receiving member 168 and the other-side receiving member 170 of the second carrying-out means 158, and the first carrying-out means 156 is placed. The suction force of the suction piece 166 is released. As a result, the second unloading means 158 can receive the empty tray 146 from the first unloading means 156. In the state where the second unloading means 158 receives the empty tray 146, the outer peripheral surface of the unloading roller 174 of the second unloading means 158 and the outer surface of the empty tray 146 are in contact with each other. Next, the unloading roller 174 is rotated by the rotating mechanism of the second unloading means 158, whereby the empty tray 146 is unloaded to the third unloading means 160. Then, in the third carry-out means 160, when the empty tray 146 is carried out from the second carry-out means 158 and the tray sensor 182 detects the empty tray 146, the rotation of the carry-out roller 174 is stopped. As a result, the third carrying-out means 160 can stop the empty tray 146 carried out from the second carrying-out means 158 at the receiving position where the chips are received from the tray transfer means 126. As described above, in the processing apparatus 2, even a large substrate 10 called FOWLP can be efficiently divided into individual chips, and the divided chips can be divided and stored in the transport tray 146.

Next, an operation of transporting the tray 146 carried out from the third carrying-out means 160 of the tray carrying-out means 128 by the conveying device 200 will be described. By rotating the unloading roller 180 by the rotation mechanism of the third unloading means 160, the tray 146 carried out from the third unloading means 160 of the tray unloading means 128 is a tributary belt connected to the third unloading means 160. It is mounted on the belt 212 of the conveyor 202 and conveyed toward the mainstream belt conveyor 204. In the transport device 200, in the T-shaped road 206 between the tributary belt conveyor 202 and the mainstream belt conveyor 204, (1) the tray 146 being conveyed by the mainstream belt conveyor 204 is prioritized over the tray 146 being conveyed by the tributary belt conveyor 202. There are cases where the T-shaped road 206 is passed, and (2) a case where the tray 146 being carried by the tributary belt conveyor 202 is prioritized over the tray 146 being carried by the mainstream belt conveyor 204 and passed through the T-shaped road 206. is there. First, the case of (1) above will be described with reference to FIG. 8. The air cylinder 234 of the mainstream stopper 228 positions the terminal 232 of the mainstream stopper 228 at an allowable position, and the drive unit 240 of the guide means 236 positions the outer guide member. The 238 is positioned at the allowable position, and the terminal 218 of the tributary stopper 214 is positioned at the stop position by the air cylinder 220 of the tributary stopper 214. As a result, the tray 146 being conveyed by the tributary belt conveyor 202 can be stopped at the terminal 218 of the tributary stopper 214, and the tray 146 being conveyed by the mainstream belt conveyor 204 can be stopped rather than the tray 146 being conveyed by the tributary belt conveyor 202. The T-shaped road 206 can be passed with priority. Next, the case (2) will be described with reference to FIG. 9. The air cylinder 220 of the tributary stopper 214 positions the terminal 218 of the tributary stopper 214 at an allowable position, and the drive unit 240 of the guide means 236 guides the outside. The member 238 is positioned at the guide position, and the terminal 232 of the mainstream stopper 228 is positioned at the stop position by the air cylinder 234 of the mainstream stopper 228. As a result, the tray 146 being conveyed by the mainstream belt conveyor 204 can be stopped at the terminal 232 of the mainstream stopper 228, and the tray 146 being conveyed by the tributary belt conveyor 202 is guided by the outer guide member 238 to the mainstream belt conveyor. Since it moves to 204, the tray 146 being conveyed by the tributary belt conveyor 202 can be given priority over the tray 146 being conveyed by the mainstream belt conveyor 204 to pass through the T-shaped road 206.

When the mainstream sensor 230 does not detect the tray 146, the mainstream stopper 228 is positioned at the stop position, and when the tributary sensor 216 does not detect the tray 146, the tributary stopper 214 is positioned at the stop position. When 146 is detected and the tributary sensor 216 does not detect the tray 146 (that is, the tray 146 being conveyed by the mainstream belt conveyor 204 is approaching the T-shaped road 206, while the tributary belt conveyor 202 conveys the tray 146. If the tray 146 in transit is not approaching the T-shaped road 206), the terminal 232 of the mainstream stopper 228 is moved to the allowable position, and the outer guide member 238 is moved to the allowable position. The terminal 218 of the tributary stopper 214 remains in the stop position and is not moved. Therefore, the tray 146 being conveyed by the mainstream belt conveyor 204 is conveyed at the T-junction 206 without stopping. On the other hand, when the tributary sensor 216 detects the tray 146 and the mainstream sensor 230 does not detect the tray 146 (that is, the tray 146 being conveyed by the tributary belt conveyor 202 is approaching the T-shaped road 206, while the mainstream belt conveyor In 204, when the tray 146 is not conveyed or the tray 146 being conveyed is not approaching the T-shaped road 206), the terminal 218 of the tributary stopper 214 is moved to the allowable position, and the outer guide member 238 guides the tray 146. While moved to the position, the terminal 232 of the mainstream stopper 228 remains in the stop position and is not moved. Therefore, the tray 146 being conveyed by the tributary belt conveyor 202 moves to the mainstream belt conveyor 204 by being guided by the outer guide member 238 without stopping at the T-junction 206. As described above, in the transport device 200, since the tray 146 carried out from the processing device 2 can be transported to the next process, it is not necessary for the operator to transport the tray 146 to the next process, and the productivity is improved. It is planned. In the illustrated embodiment, the single tributary belt conveyor 202 that connects the processing device 2 and the mainstream belt conveyor 204 has been described, but the two or more processing devices 2 correspond to the two or more processing devices 2. A tributary belt conveyor 202 may be arranged in each.

In the above-described embodiment, an example in which the transport device 200 is connected to the downstream side of the third carry-out means 160 of the tray carry-out means 128 has been described, but instead of the transport device 200, tray stacking as shown in FIG. 10 has been described. The means 244 may be arranged in the vicinity of the third carrying-out means 160 of the tray carrying-out means 128. The tray stacking means 244 includes a frame body 246 extending in the vertical direction, an arm 248 supported by the frame body 246 so as to be substantially horizontally expandable and ascending / descending, and an expansion / contraction mechanism (shown) for expanding and contracting the arm 248 substantially horizontally. (Not shown), an elevating mechanism (not shown) that raises and lowers the arm 248, a plurality of hollow suction pieces 250 attached to the lower surface of the tip of the arm 248 at intervals, and adjacent to the frame 246. It is provided with a stacking table 252 arranged in a row. Each suction piece 250 having an opening (not shown) at the lower end is connected to a suction means (not shown) by a flow path.

Then, as shown in FIG. 11, when the tray stacking means 244 is arranged in the vicinity of the third carrying-out means 160 of the processing apparatus 2, a predetermined quantity is placed on the tray 146 placed in the third carrying-out means 160. After the chips are housed, the arm 248 is extended by the telescopic mechanism of the tray stacking means 244, and the tip of the arm 248 is positioned above the tray 146 in which the chips are housed. Next, the arm 248 is lowered by the elevating mechanism of the tray stacking means 244, and the suction piece 250 is brought into close contact with the upper surface of the outer edge of the tray 146 in which the chips are housed. Next, the suction means connected to the suction piece 250 is operated to generate a suction force on the suction piece 250, so that the upper surface of the outer edge of the tray 146 is sucked on the lower surface of the suction piece 250. Next, the arm 248 is raised by the elevating mechanism of the tray stacking means 244, and the tray 146 sucked by the suction piece 250 is raised. Next, the arm 248 is contracted by the expansion / contraction mechanism of the tray stacking means 244, the arm 248 is lowered by the elevating mechanism of the tray stacking means 244, the tray 146 is placed on the stacking table 252, and the suction force of the suction piece 250 is released. By repeating the above operation by the tray laminating means 244, a plurality of trays 146 containing chips can be laminated on the laminating table 252. Then, when a predetermined number of trays 146 are stacked, the operator may convey the stacked trays 146 to the next step.

2: Processing equipment 4: Cassette table 8: Cassette 10: Substrate (workpiece)
16: Temporary placing means 18: First moving means 20: Temporary placing table 22: Fork 24: Suction pad 50: Work piece removing means 60: Chuck table 76: Cutting means 100: Cutting blade 110: Top surface cleaning means 112: Bottom surface cleaning means 120: Carrying out mechanism 122: Receiving table 124: Third moving means 126: Tray moving means 128: Tray carrying out means 130: Tray supplying means 146: Tray 200: Conveying device 202: Tributary belt conveyor 204: Mainstream belt Conveyor 206: T-shaped road 214: Tributary stopper 216: Tributary sensor 218: Tributary stopper terminal 228: Mainstream stopper 230: Mainstream sensor 232: Mainstream stopper terminal 236: Guide means 238: External guide member 240: Drive unit 244: Tray Laminating means R1: First path R2: Second path R3: Third path

Claims (4)

A processing device that divides a plate-shaped workpiece into multiple chips.
A cassette table on which cassettes for accommodating multiple plate-shaped workpieces are placed,
A temporary storage means provided on the surface of the temporary storage table so that a fork for pulling out the work piece from the cassette placed on the cassette table to the first path can be moved forward and backward freely.
A work piece detaching means that is pulled out by the fork of the temporary placing means and holds and ascends the work piece temporarily placed in the temporary placing means to be separated from the temporary placing means.
A first moving means that moves the temporary placing means to the first path and separates the temporary placing means from directly under the work piece releasing means.
A chuck table that is positioned directly under the work piece release means and receives and holds the work piece by lowering the work piece release means.
A second moving means for moving the chuck table to a second path orthogonal to the first path, and
A cutting means that is rotatably provided with a cutting blade that is disposed apart from the work piece releasing means in the second path and divides the work piece held on the chuck table.
A suction pad, which is arranged on the back surface of the temporary placing means and receives and holds a workpiece divided into individual chips from the chuck table.
An unloading mechanism that carries out the workpiece divided into individual chips held by the suction pad and is disposed apart from the workpiece detaching means in the first path.
Processing equipment composed of at least. A top surface cleaning means for removing cutting chips generated by cutting a work piece, which is arranged in the second path and held on the chuck table, from the top surface of the work piece and cleaning the work piece.
When the suction pad is arranged in the first path and the work piece divided into individual chips is received from the chuck table and carried out to the carry-out mechanism, cutting chips adhering to the lower surface of the work piece are removed. Bottom cleaning means for cleaning and
The processing apparatus according to claim 1. The unloading mechanism receives a receiving table that receives the workpiece divided into individual chips held by the suction pad, and a third movement that moves the receiving table to a third path parallel to the second path. Means, tray transfer means for separating the divided workpieces and transferring the separated chips from the receiving table to the tray, tray unloading means for carrying out the tray, and tray supply for supplying an empty tray. Means and
The processing apparatus according to claim 1. The processing apparatus according to claim 3, wherein the tray carrying-out means is selectively connected to a tray laminating means for stacking a plurality of trays containing chips and a belt conveyor means for carrying out the trays to a belt conveyor.