JP6766466B2 - Parts packaging method and parts packaging system - Google Patents

Description

The present invention relates to a component packaging method for accommodating and packaging components in a carrier tape.

In the manufacturing line of electronic parts, the manufactured electronic parts are aligned using a parts feeder, undergo a predetermined inspection, and then packaged and shipped. Carrier tape may be used for packaging the parts.

The carrier tape is a long and thin strip-shaped member, and a plurality of recesses (part storage chambers) for accommodating electronic components are arranged at equal intervals in the longitudinal direction thereof. The carrier tape is heated in a state where electronic components are sequentially loaded into each recess, and then a cover tape made of a long and thin strip-shaped member is superposed on the opening side surface of the recess, and these are sandwiched between them. And pressurized and sent to a thermocompression bonding sealing device.

As described in Patent Document 1, for example, the sealing device includes a trowel member arranged so as to face the base member, and a drive cylinder for vertically driving the trowel member up and down. The iron member has a built-in heater, is lowered by a drive cylinder, and is pressed against the base member at a predetermined seal pressure by the urging force of the seal pressure spring. The carrier tape on which the cover tapes are overlapped is guided between these base members and iron members, and the iron members are lowered to heat and pressurize them, and thermocompression bonding is performed.

However, in the prior art, since the lowering position of the iron member is defined by the stroke of the drive cylinder, when the seal pressure spring deteriorates over time (spring constant decreases) and the urging force changes (decreases), Alternatively, when the sliding resistance changes due to wear of the sliding portion due to the vertical movement of the iron member, an appropriate sealing pressure may not be applied and thermocompression bonding may be insufficient. Although it may be possible to adjust the urging force of the seal pressure spring by stopping the operation and adjusting the stroke of the drive cylinder, it is necessary to stop the operation, and the work is also complicated.

JP-A-10-101021

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a component packaging method capable of stably performing high-quality packaging.

In order to achieve the above object, the parts packaging method according to the present invention is:
The loading process of loading parts into the recesses of a long carrier tape having a plurality of recesses,
A stacking step of stacking the cover tape on the opening side of the recess of the carrier tape loaded with the components, and
A component packaging method comprising a sealing step of crimping an overlapping portion on which the cover tape is superposed on the carrier tape and sealing the component inside the carrier tape.
A sealing load based on a driving means whose driving force can be adjusted by controlling the supplied current value is applied to the overlapping portion, and the component is sealed inside the carrier tape.

In the component packaging method according to the present invention, the sealing load is controlled by controlling the current value supplied to the drive means. Therefore, even if an event occurs in which the load applied to the overlapping portion changes for some reason, it can be flexibly dealt with and the sealing load is controlled so as to cancel the change. This makes it possible to stably perform high-quality packaging.

The current value supplied to the driving means may be controlled so that the sealing load is detected and the sealing load becomes constant. By doing so, the cover tape can be pressure-bonded and sealed to the carrier tape with a constant sealing load, and high-quality packaging can be stably performed.

FIG. 1 is a plan view showing the appearance of an electronic component inspection / packaging device according to an embodiment of the present invention. FIG. 2 is a front view showing the appearance of the electronic component inspection / packaging apparatus shown in FIG. FIG. 3 is a perspective view showing the appearance of a multilayer ceramic capacitor as a target component of the electronic component inspection / packaging apparatus shown in FIG. FIG. 4 is a cross-sectional view taken along the line IV-IV of FIG. FIG. 5 is a side view showing a packaging unit of the electronic component inspection / packaging device shown in FIG. 1, and is a view showing a case where the iron member is raised. FIG. 6 is a side view showing a packaging unit of the electronic component inspection / packaging device shown in FIG. 1, and is a view showing a case where the iron member is lowered. FIG. 7 is a plan view showing a carrier tape containing electronic components by breaking a part thereof. FIG. 8 is a cross-sectional view taken along the line VIII-VIII of FIG.

Hereinafter, as an embodiment of the present invention, an inspection / packaging apparatus for electronic components to which the component packaging method according to the present invention is applied will be described with reference to the drawings. As shown in FIGS. 1 and 2, the electronic component inspection / packaging device 1 is configured to substantially include a supply unit 2, an alignment unit 3, a transfer unit 4, an inspection unit 5, and a packaging unit 6. There is. The component packaging method according to the present invention is applied to the packaging unit 6.

Prior to the description of each unit 2 to 6 of the electronic component inspection / packaging device 1, the electronic component which is the target component of the inspection / packaging will be described with reference to FIGS. 3 and 4. In the present embodiment, the target component is a monolithic ceramic capacitor (chip capacitor) as the electronic component 7. A multilayer ceramic capacitor is configured by burying a plurality of internal electrodes 74 and 75 inside a dielectric substrate (element body) 71 made of ceramic. The dielectric substrate 71 is configured by laminating a plurality of ceramic green sheets as described later.

Terminal electrodes 72 and 73 as external electrodes are provided on the outer surfaces of both ends of the dielectric substrate 71. The internal electrode 74 is conducted to the terminal electrode 72, and the internal electrode 75 is conducted to the terminal electrode 73.

Multilayer ceramic capacitors are manufactured as follows. That is, a ceramic green sheet is formed from the dielectric paste, and the dielectric paste for forming the internal electrodes 74 and 75 is applied thereto. Then, these ceramic green sheets are laminated to form a green sheet laminate, and the green sheet laminate is pressed and cut to obtain a plurality of rectangular parallelepiped green chips from the green sheet laminate. Then, the green chip is subjected to a polishing treatment or a firing treatment to form the terminal electrodes 72 and 73.

The terminal electrodes 72 and 73 have, for example, a three-layer structure in which copper (Cu), nickel (Ni), and tin (Sn) are laminated in this order from the inside, and are formed by a sputtering method, a plating method, or the like. can do. In this way, the monolithic ceramic capacitor as the electronic component 7 shown in FIGS. 3 and 4 is obtained.

The shape and size of the multilayer ceramic capacitor vary depending on the purpose and application, but when the shape is a rectangular parallelepiped shape, it is vertical (0.2 to 5.7 mm) x horizontal (0.1 to 5.0 mm). × Thickness (0.1 to 3.2 mm).

The multilayer ceramic capacitor as described above is an example of the electronic component 7, and the electronic component 7 may be a coil element such as a chip inductor, a sensor such as a chip thermistor, or a piezoelectric element. The configuration and material of the terminal electrodes 72 and 73 are not particularly limited, and for example, gold (Au) may be used as the outermost layer. Further, although the method of the present invention is suitable for packaging electronic parts, the target parts are not limited to electronic parts, and can be applied to packaging mechanical parts other than electronic parts and other workpieces. ..

Next, each unit 2 to 6 of the inspection / packaging device 1 will be described with reference to FIGS. 1 and 2. First, the supply unit 2 is a unit that implements a supply process of supplying the electronic component 7 to the transport path (bottom surface 31a in this embodiment) of the alignment unit 3 that executes the next process, and includes the hopper 21 and the guide member 22. I have.

The hopper 21 can store a large number of electronic components 7. A discharge port 21a for discharging the internal electronic component 7 is formed in a part of the hopper 21, and the electronic component 7 discharged from the discharge port 21a is arranged in the vicinity of the discharge port 21a. A guide member 22 for guiding to a predetermined position (supply position) on the transport path (bottom surface 31a) of 3 is provided. The guide member 22 has guide side surfaces 22b and 22b on the guide bottom surface 22a and both side portions thereof. Further, the guide bottom surface 22a has a tip portion 22c on which the guide side surface 22b is not formed. The guide bottom surface 22a is installed at an angle of 0 to 10 degrees with respect to the horizontal direction so that the tip side is lowered.

The inclination of the hopper 21 can be changed with respect to the horizontal direction, and the inclination of the hopper 21 is adjusted based on the output signal from the sensor 33 of the alignment unit 3, which will be described later, so that an appropriate amount of electrons can be obtained. The component 7 can be supplied from the tip end portion 22c to the transport path (bottom surface 31a) of the alignment unit 3 via the guide member 22.

That is, when the sensor 33 detects that the electronic components 7 do not continuously come on the transport path 34a of the alignment unit 3, the amount of electronic components supplied by the hopper 21 so as to supply the new electronic components 7. To control. Further, when the sensor 33 detects that the electronic components 7 are continuously coming on the transport path 34a of the alignment unit 3, the electronic components are supplied by the hopper 21 so as to stop the supply of the new electronic components 7. Control the amount. In the present embodiment, the guide member 22 is configured so as to supply the electronic component 7 from the hopper 21 to the bottom surface 31a of the alignment unit 3, but a part of the electronic component 7 is also provided in the transport path 34a. The guide member 22 may be configured to supply.

The alignment unit 3 is a unit that carries out a step (alignment / transport process) of aligning the electronic components 7 supplied by the supply unit 2 while vibrating the transport path (bottom surface 31a, transport path 34a). .. In the present embodiment, the alignment unit 3 is a vibrating bowl feeder, and includes a bowl 31, a vibrating device (vibration power source) 32, and a sensor 33.

The bowl 31 has a bottomed cylindrical shape, has an opening at the top, and is composed of a bottom surface 31a formed at the bottom and a cylindrical side plate 31b formed continuously from the bottom surface 31a. The bowl 31 is preferably made of a non-magnetic material, for example, made of aluminum, and at least the surface of the transport path (bottom surface 31a, transport path 34a) is DLC from the viewpoint of wear resistance and contamination prevention. It is preferably coated, diamond coated, or canaked.

A transport path forming member 34 is provided on the inner surface of the bowl 31. The transport path forming member 34 is continuously formed from a part of the surface of the bottom surface 31a, and rises toward the upper opening side with a spiral inclination along the inner peripheral wall of the cylindrical side plate 31b. It is formed. The continuous surface of the transport path forming member 34 facing the upper opening side is a transport path 34a for transporting the electronic component 7. The transport path forming member 34 is preferably integrally formed of the same material as the bowl 31, but may be formed separately and integrated with the bowl 31.

The transport path 34a is continuously formed along the inner peripheral wall of the cylindrical side plate 31b of the bowl 31 from the transport path inlet T1 in contact with the bottom surface 31a to the transport path outlet T2 connected to the transport unit 4 for carrying out the next step. There is. The total length of the transport path 34a (distance from the transport path inlet T1 to the transport path outlet T2) is preferably 2 laps or less in order to reduce damage to the electronic component 7 due to friction with the transport path 34a. In the form, the total length is approximately one lap. The total length L, width W, and number of laps of the transport path 34a are appropriately changed according to the shape / material of the electronic component and the purpose of sorting. The transport path 34a has an ascending slope (gradient) at a predetermined angle θ1 with respect to the horizontal plane.

A sorting unit S is provided in the vicinity of the upstream side of the transport path outlet T2 of the transport path 34a. Although not shown, the sorting unit S has, for example, one or more notches, steps, protrusions, guides, etc., and guides (corrects) the posture of the electronic component 7 in a desired direction. Or, the electronic components 7 that are not in the desired orientation are dropped from the transport path 34a to the bottom surface 31a, and as a result, the electronic components 7 are aligned at regular intervals in the transport path outlet T2 of the transport path 34a. .. The electronic components 7 that have fallen to the bottom surface 31a are aligned by climbing again on the transport path 34a.

The bottom surface 31a of the bowl 31 is shaped so that the central portion is high and the bottom surface 31a is lowered toward the periphery so that the electronic component 7 supplied by the supply unit 2 is guided to the outside. The back surface side of the bottom surface 31a of the bowl 31 is elastically supported and fixed to the vibration exciter 32 via a support leaf spring or the like (not shown).

Although not shown, the vibrating device 32 includes a plurality of (four in this embodiment) vibrating actuators that apply vibration to the bowl 31. Each vibration actuator is provided with a piezoelectric (piezo) element and a leaf spring for vibration. The upper end of each leaf spring is fixed to the back surface side of the bottom surface 31a of the bowl 31 by bolts or the like, and the lower end portion is fixed to the inner bottom surface of the housing of the vibration exciter 32 by bolts or the like. Each piezoelectric element is integrally attached to the intermediate portion of the corresponding leaf spring.

A vibration detection sensor for detecting the vibration of the bowl 31 is attached to the outer surface of the cylindrical side surface 31b of the bowl 31, and is applied to the piezoelectric element of each vibration actuator based on the value detected by the vibration detection sensor. The pulse voltage is controlled.

When the bowl 31 is vibrated by each vibrating actuator, the bottom surface 31a of the bowl 31 and the electronic component 7 on the transport path 34a are guided to the outer periphery of the bottom surface 31a and the transport path 34a as shown in FIG. It is transported toward the transport path inlet T1 of the above, and is transported from the transport path inlet T1 of the transport path 34a toward the transport path outlet T2.

The sensor 33 shown in FIG. 1 is arranged between the sorting start position by the sorting unit S and the supply position of the electronic component 7 by the supply unit 2. The sensor 33 is preferably arranged near the supply position of the electronic component 7. The sensor 33 is composed of, for example, a photoelectric sensor, and detects whether or not the electronic component 7 is present at the detection position on the transport path 34a.

In FIGS. 1 and 2, the transport unit 4 is a unit that linearly transports the electronic components 7 aligned in a predetermined posture by the alignment unit 3 to the inspection unit 5 for carrying out the next step. , A vibrating linear feeder is used. The transport unit 4 includes a transport trough 41 extending linearly from the transport path outlet T2 of the transport path 34a of the alignment unit 3 to the inspection unit 5, and a vibration exciter (vibration power source) 42 that applies vibration to the transport trough 41. There is. The transport trough 41 has a linear transport path 41a and side walls 41b and 41b erected on both sides thereof.

The transport trough 41 is preferably made of a non-magnetic material, for example, aluminum, and at least the surface of the transport path 41a is DLC coated, diamond coated, etc. from the viewpoint of wear resistance and contamination prevention. Alternatively, it is preferable that a canac treatment or the like is performed. This is the same as the case of the bowl 31 of the alignment unit 2 described above.

In the transport trough 41, the back surface side of the transport path 41a is elastically supported and fixed to the vibration exciter 42 via a support leaf spring or the like (not shown).

Although not shown, the vibration exciter 42 includes a plurality of vibration actuators (two in this embodiment) that apply vibration to the transport trough 41. Each vibration actuator is provided with a piezoelectric (piezo) element and a leaf spring for vibration. The upper end of each leaf spring is fixed to the back surface side of the transport path 41a of the transport trough 41 by bolts or the like, and the lower end is fixed to the bottom surface inside the housing of the vibration exciter 42 by bolts or the like. Each piezoelectric element is integrally attached to the intermediate portion of the corresponding leaf spring.

A vibration detection sensor for detecting the vibration of the transport trough 41 is attached to the outer surface of the side wall 41b of the transport trough 41, and is applied to the piezoelectric element of each vibration actuator based on the value detected by the vibration detection sensor. The pulse voltage is controlled.

As shown in FIG. 1, under the vibration of the vibration exciter 42, the electronic component 7 on the transport path 41a of the transport trough 41 moves along the transport path 41a to the transport path outlet T2 of the alignment unit 3 (bowl 31). It is transported in a state of being aligned at regular intervals in the direction from the transport path inlet connected to the above to the transport path outlet on the inspection unit 5 side.

In FIGS. 1 and 2, the inspection unit 5 is a unit for carrying out an inspection process for inspecting the appearance of the electronic component 7 transported by the transport unit 4, and is transported on the transport path 41a of the transport unit 4. It includes an image sensor 51 that captures the appearance of the electronic component 7 and an electronic component exclusion device (not shown). The image captured by the image sensor 51 is subjected to image processing such as filtering, and it is determined whether or not there is a defect (peeling of the tin layer of the outermost layer) on the surfaces of the terminal electrodes 72 and 73.

The presence or absence of defects (peeling of the tin layer of the outermost layer) is determined by image processing or the like to determine whether or not there is a portion appearing as darkening on the surfaces of the terminal electrodes 72 and 73 when the electronic component 7 is imaged. To. In the inspection unit 5, the electronic component 7 determined to be defective (defective) is removed from the transport path 41a by the exclusion device, and the electronic component 7 determined to be defective (non-defective) is directly subjected to the next step. It is sent to the packaging unit 6.

Next, the packaging unit 6, which is a unit for packaging the electronic component 7 determined to be a non-defective product by the inspection unit 5, will be described with reference to FIGS. 5 to 7.

The packaging unit 6 is configured to roughly include a component loading device 63, a carrier tape feeding device 61, a cover tape feeding device 62, a sealing device 64, and a control unit 66. The component loading device 63 carries out a loading step of loading (accommodating) the electronic component 7 into the recess T1a of the long carrier tape T1 having the plurality of recesses (component storage chambers) T1a. The carrier tape feeding device 61 and the cover tape feeding device 62 carry out a stacking step of superimposing a long cover tape (top tape) T2 on the opening side of the recess T1a of the carrier tape T1 loaded with the electronic component 7. The sealing device 64 sandwiches the portion where the cover tape T2 is superposed on the carrier tape T1 by the driving force of the driving device (driving means) 65 whose driving force can be adjusted by changing the supplied current value. Crimping and sealing. The control unit 66 controls the load (sealing load) at the time of pinching by controlling the current value supplied to the drive device 65.

In the carrier tape transport device 61, a predetermined supply reel 61a around which the unsealed carrier tape T1 is wound and a carrier tape T1 unwound from the supply reel 61a pass over the base member 64a of the sealing device 64. It has a plurality of rolls including a roll 61b for guiding the carrier tape T1 so as to be conveyed along a route, and a ratchet mechanism (not shown) for conveying the carrier tape T1 frame by frame at a predetermined pitch. The carrier tape T1 is fed on the base member 64a with the opening side of the recess T1a facing upward.

The carrier tape T1 is a long and thin strip-shaped member, and as shown in FIGS. 7 and 8, the carrier tape T1 has a plurality of recesses (parts accommodating chambers) T1a for accommodating the electronic component 7. They are arranged at equal intervals in the longitudinal direction. The recess T1a has a size sufficient to accommodate the electronic component 7 and a corresponding shape, and since the electronic component 7 has a rectangular parallelepiped shape in the present embodiment, it is configured as a rectangular parallelepiped recess accordingly. A plurality of feed holes T1b with which the ratchet tip of a ratchet mechanism (not shown) is engaged are formed on one side edge of the carrier tape T1 at a predetermined pitch. In the present embodiment, the feed holes T1b are formed so as to correspond to each of the recesses T1a, that is, at the same pitch as the arrangement spacing of the recesses T1a.

In the cover tape feeding device 62, the supply reel 62a around which the cover tape T2 is wound and the cover tape T2 unwound from the supply reel 62a pass over the base member 64a of the sealing device 64 on the upper surface of the carrier tape T1. It has a plurality of rolls including a roll 62b that guides the recess T1a so as to be conveyed along a predetermined path (the surface on the opening side of the recess T1a).

The cover tape T2 is a long and thin strip-shaped member, and as shown in FIGS. 7 and 8, is superposed on the upper surface of the carrier tape T1 and thermocompression-bonded to the carrier tape T1 by the sealing device 64. That is, the cover tape T2 is a member that seals (seals) each recess T1a of the carrier tape T1. The width of the cover tape T2 is set to the same value as or slightly smaller than that of the carrier tape T1. The cover tape T2 is fed frame by frame in synchronization with the feed of the carrier tape T1 by a ratchet mechanism (not shown).

In FIGS. 5 and 6, although not shown, the component loading device 63 is determined to be a non-defective product by the inspection unit 5, and the sent electronic component 7 is placed in the recess T1a of the unsealed carrier tape T1. This is a device for sequentially loading the tape T1 in synchronization with the frame advance of the tape T1.

The sealing device 64 includes a base member 64a, a trowel member 64b, and a driving device 65. The base member 64a is fixed to a device housing (not shown). The iron member 64b is arranged above the base member 64a, and the lower surface of the iron member 64b is separated from the lower surface of the base member 64a by a predetermined distance from the lower surface of the base member 64a by the sliding mechanism 64c. It is supported so that it can slide up and down with the ascending position.

A heater (not shown) is built in the iron member 64b, and the temperature of the heater is controlled by the control unit 66. Further, the lower surface of the iron member 64b can heat and pressurize a predetermined portion (for example, see the thermocompression bonding portion T1c in FIG. 7) outside the recess T1a of the carrier tape T1 in which the cover tape T2 is overlapped. It has a shape.

The drive device 65 includes a rack 65a extending vertically, a pinion 65b that meshes with the rack 65a, and a motor 65c that rotationally drives the pinion 65b. The rack 65a is extended vertically, and a part thereof is fixed to the iron member 64b. As the motor 65c, a servomotor which is a driving means whose rotational driving force can be adjusted by changing the supplied current value can be used. The mechanism for converting the rotary motion of the motor 65c into a linear motion is not limited to the rack and pinion mechanism as in this example, and a cam mechanism, a ball screw mechanism, or the like may be used. Further, the driving device 65 is not limited to a motor that generates a rotational driving force by supplying an electric current and a mechanism that converts the rotational motion into a linear motion, and a linear driving force (thrust) proportional to the supplied current is applied. A linear motor, a voice coil motor, or the like that generates electric current may be used.

At the pressure contact portion of the iron member 64b on the upper surface of the base member 64a, the pressure when the iron member 64b is pressure-welded, that is, the pinching pressure when the upper surface of the carrier tape T1 is sealed (thermocompression bonded) with the cover tape T2 is detected. A pressure sensor 66a is provided, and the detected value of the pressure sensor 66a is supplied to the control unit 66. As the pressure sensor 66a, one using a strain gauge or a piezoresistive effect can be used. The pressure sensor 66a may be provided on the lower surface of the iron member 64b.

The position of the iron member 64b is detected by an encoder (not shown) and supplied to the control unit 66. Based on the position information of the supplied iron member 64b, the control means 66 repeatedly raises and lowers the iron member 64b between the ascending position and the descending position in synchronization with the feeding of the carrier tape T1 by the ratchet mechanism described above. At the same time, the current value supplied to the motor 65c is controlled so that the value detected by the pressure sensor 66a when the iron member 64b is lowered becomes a predetermined target value set in advance.

The carrier tape T1 is fed out from the supply reel 61a by the carrier tape feeding device 61, and is conveyed frame by frame with the opening side of the recess T1a facing upward. The electronic component 7 determined by the inspection unit 5 to be a non-defective product in the recess T1a by the component loading device 63 is sequentially loaded in synchronization with the frame advance of the carrier tape T1. The cover tape T2 is fed out from the supply reel 62a by the cover tape feeding device 62, and is overlapped so as to close the opening side of the recess T1a in which the electronic component 7 of the carrier tape T1 is housed. It is sent in synchronization with the frame advance of.

The carrier tape T1 and the cover tape T2 are guided between the base member 64a and the iron member 64b of the sealing device 54 in a superposed state, and the drive device 65 is driven under the control of the control unit 66 to drive the iron. The member 64b repeats the ascending / descending operation in synchronization with the frame advance of the carrier tape T1. Due to the lowering of the iron member 64b, the carrier tape T1 and the cover tape T2 are sandwiched between the base member 64a and the iron member 64b with the thermocompression bonding portion T1c (see FIG. 7) at the outer portion of the opening of the recess T1a. By heating and pressurizing, they are thermocompression bonded to each other. The carrier tape (carrier tape after sealing) T1 to which the cover tape T2 is thermocompression bonded with the electronic component 7 housed in the recess T1a is wound on the take-up reel 61c, packed as a product, and shipped. Will be done.

In the present embodiment, the pressure (pinching pressure or pinching pressure) detected by the pressure sensor 66a is the current value supplied to the motor (servomotor) 65c, which is a driving means whose driving force can be adjusted by changing the supplied current value. The control unit 66 controls so that the sealing load) becomes a preset target value. Therefore, even if an event occurs in which the pinching pressure changes for some reason, the cover tape T2 can be thermocompression-bonded to the carrier tape T1 at a constant pinching pressure, and a high-quality package. Can be performed stably. Further, unlike the conventional technique, it is not necessary to stop the operation and adjust the stroke of the drive cylinder, and the productivity can be improved. An event in which the pinching pressure changes for some reason is, for example, when an urging member such as a coil spring is incorporated in the base portion 64a and / or the iron member 64b, the spring constant deteriorates or This is a change in sliding resistance due to friction of the sliding portion as the iron member 64b moves up and down.

It is preferable that the control unit 66 detects the current value supplied to the motor 65c and monitors (monitors, tracks, etc.) the detected current value. As a result, for example, the peak or rate of change of the detected current value can be compared with a predetermined threshold value to detect the presence or absence of an abnormality in real time, thereby preventing the occurrence of packaging defects. it can. In addition, by storing or recording the detected current value data, if it is found that a packaging defect has occurred in the product after packaging, the cause can be determined by examining the stored or recorded current value. Can be quickly identified. That is, it is also possible to manage the traceability of the load for each package seal.

It should be noted that the embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above-described embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

1 ... Electronic component inspection / packaging device 2 ... Supply unit 21 ... Hopper 22 ... Guide member 3 ... Alignment unit 31 ... Bowl 31a ... Bottom surface 32 ... Vibration device 33 ... Sensor 34a ... Transport path 4 ... Transport unit 41 ... Transport Traf 41a ... Transport path 5 ... Inspection unit 51 ... Imaging element 6 ... Packaging unit 61 ... Carrier tape feeding device 62 ... Cover tape feeding device 63 ... Parts loading device 64 ... Sealing device 64a ... Base member 64b ... Iron member 65 ... Drive Device 65a ... Rack 65b ... Pinion 65c ... Motor 66 ... Control unit 66a ... Pressure sensor 7 ... Electronic component 71 ... Dielectric base 72, 73 ... Terminal electrode T1 ... Carrier tape T1a ... Recessed part T1b ... Feed hole T1c ... Thermal crimping part T2 … Cover tape

Claims (4)

The loading process of loading parts into the recesses of a long carrier tape having a plurality of recesses,
A stacking step of stacking the cover tape on the opening side of the recess of the carrier tape loaded with the components, and
A component packaging method comprising a sealing step of crimping an overlapping portion on which the cover tape is superposed on the carrier tape by a sealing device including a trowel member and a driving device, and sealing the component inside the carrier tape. And
A sealing load based on the driving force adjusted and applied to the iron member by controlling the current value supplied to the driving means of the driving device is applied to the overlapping portion, and the component is sealed inside the carrier tape. A parts packaging method characterized by stopping. The driving means is a motor.
The component packaging method according to claim 1, wherein the current value supplied to the motor is detected and the detected current value is monitored. The component packaging method according to claim 1 or 2, wherein the sealing load is detected and the current value supplied to the driving means is controlled so that the sealing load becomes constant. A component loading device for loading components into the recesses of a long carrier tape having a plurality of recesses,
A cover tape feeding device that superimposes a long cover tape on the opening side of the recess of the carrier tape loaded with parts.
A component packaging system comprising a sealing device for pressing and crimping and sealing an overlapping portion on which the cover tape is superposed on the carrier tape.
The sealing device includes a trowel member and a driving device.
The driving device is a component packaging system having a driving means capable of adjusting a driving force for controlling a sealing load on the overlapping portion by the iron portion according to a supplied current value.

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