JP6774902B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device, and more particularly to a component mounting device including an electrical characteristic measuring unit.

Conventionally, a component mounting device including an electrical characteristic measuring unit is known (see, for example, Patent Document 1).

The above-mentioned Patent Document 1 includes a head for mounting a component on a substrate, a component supply unit for supplying the component, a positive electrode probe and a negative electrode probe, and an electronic component inspection for measuring the electrical characteristics of the component supplied from the component supply unit. An electronic component mounting device (component mounting device) including a device (electrical characteristic measuring unit) is disclosed. In the electronic component mounting device of Patent Document 1, the component is brought into contact with the positive electrode probe and the negative electrode probe in a state where the component is attracted by the conductive suction nozzle mounted on the head, and the electrical characteristics of the component are measured. It is configured as follows.

JP 2015-103369A

However, in the electronic component mounting device (component mounting device) of Patent Document 1, the component is brought into contact with the positive electrode probe and the negative electrode probe in a state where the component is adsorbed by the conductive suction nozzle to improve the electrical characteristics of the component. Since the measurement is performed, a measurement current flows through the suction nozzle when measuring the electrical characteristics of the component. Therefore, since the electrical characteristics of the component including the influence of the electrical characteristics of the suction nozzle are measured, there is a problem that it is difficult to accurately measure the electrical characteristics of the component.

The present invention has been made to solve the above problems, and one object of the present invention is to provide a component mounting device capable of accurately measuring the electrical characteristics of a component. ..

The component mounting device according to one aspect of the present invention includes a mounting head for mounting components on a substrate, a component supply unit for supplying components, and a measuring electrode, and measures the electrical characteristics of the components supplied from the component supply unit. With the electrical characteristic measuring unit and the mounting head equipped with the insulating measuring nozzle, the component is attracted and conveyed by the insulating measuring nozzle, and the component is brought into contact with the measuring electrode for electrical characteristics. The control unit is provided with a control unit that controls the measurement of the electrical characteristics, and the control unit is configured to control the disposal of the component whose electrical characteristics have been measured. The control unit is the same when measuring the electrical characteristics of the component. In the measurement electrode of the above, the position where the parts are brought into contact with each other is changed in order .

In the component mounting device according to one aspect of the present invention, as described above, with the insulating measurement nozzle mounted on the mounting head, the component is sucked and conveyed by the insulating measurement nozzle to deliver the component. A control unit is provided to control the measurement of electrical characteristics by contacting the measurement electrode. As a result, it is possible to suppress the flow of current through the measuring nozzle when measuring the electrical characteristics of the component, so that the electrical characteristics of the component can be measured with high accuracy. In addition, by configuring the control unit to control the disposal of the parts whose electrical characteristics have been measured, even if the parts are charged with static electricity during the measurement of the electrical characteristics, the parts whose electrical characteristics have been measured are discarded. Occasionally, it is possible to prevent the static electricity charged on the component from being discharged and damaging the component or the substrate. As a result, the electrical characteristics of the component can be measured with high accuracy, and the reliability of the substrate on which the component as a product is mounted can be ensured.

In the component mounting device according to the above one aspect, preferably, the control unit determines whether or not the component supplied from the component supply unit is the correct type based on the measurement result of measuring the electrical characteristics of the component, and the component. Regardless of the measurement result of the electrical characteristics of the above, it is configured to control the disposal of the parts whose electrical characteristics have been measured. With this configuration, it is possible to easily determine whether or not the correct type of component is set in the component supply unit by measuring the electrical characteristics of the component. For example, when multiple parts of the same type are held on tape and supplied, or when multiple parts of the same type are placed on a tray and supplied, by measuring the electrical characteristics of one part. , It can be easily determined whether or not the tape or tray of the correct type of parts is set in the parts supply unit. In addition, one component whose electrical characteristics have been measured is always discarded, and components whose electrical characteristics are not measured other than the discarded components are mounted, so that the reliability of component mounting can be ensured.

In the component mounting device according to the above one aspect, preferably, the measuring nozzle has an insulating property having a resistance value of 10 ¹⁴ Ω or more at a portion in contact with the component. With this configuration, it is possible to effectively suppress the flow of current through the measuring nozzle when measuring the electrical characteristics of the component, so that the electrical characteristics of the component can be measured more accurately.

In the component mounting device according to the above one aspect , as described above, when measuring the electrical characteristics of the component , the control unit is configured to sequentially change the position where the component is brought into contact with the same measurement electrode. Has been done. As a result , it is possible to prevent the measurement electrode from becoming dirty or scraped as compared with the case where the component is brought into contact with the same position of the measurement electrode, so that the surface condition of the measurement electrode deteriorates. It can be delayed. As a result, it is possible to extend the period during which the electrical characteristics of the component can be accurately measured without maintenance of the measuring electrode.

In the component mounting device according to the above one aspect, preferably, the control unit confirms the state of the measurement electrode, and based on the confirmation result, controls or provides a notification prompting the replacement of the measurement electrode. It is configured to control cleaning. With this configuration, when the condition of the measurement electrode deteriorates, the measurement electrode is replaced by notification or the measurement electrode is cleaned, so that the measurement accuracy of the electrical characteristics of the component is lowered. Can be suppressed.

In this case, preferably, when cleaning the measurement electrode, the control unit attaches a cleaning nozzle for cleaning to the mounting head, and controls the measurement electrode to be cleaned by the cleaning nozzle. It is configured. With this configuration, the measurement electrode can be automatically cleaned by the mounting head equipped with the cleaning nozzle, so that the user's workload is reduced compared to when the user cleans the measurement electrode. can do.

In the configuration for confirming the state of the measurement electrode, preferably, the control unit captures the measurement electrode by the imaging unit when the number of times the electrical characteristic measurement unit measures the electrical characteristics of the component reaches a predetermined number of times. The control for confirming the state of the measurement electrode and the control for confirming the state of the measurement electrode by contacting the jig component for checking the state with the measurement electrode and measuring the electrical characteristics. It is configured to do at least one. With this configuration, the state of the measurement electrode of the electrical characteristic measuring unit can be periodically checked based on the number of times the electrical characteristics of the component are measured reaches a predetermined number of times. Further, when the measurement electrode is imaged by the imaging unit to confirm the state of the measurement electrode, the presence or absence of dirt or scraping of the measurement electrode can be easily confirmed by analyzing the captured image. In addition, when checking the state of the measurement electrode by contacting the jig part for checking the state with the measuring electrode and measuring the electrical characteristics, the jig part with known electrical characteristics is energized and measured. By comparing the measurement result with the known electrical characteristics, the accuracy of the measurement can be confirmed, so that the deterioration of the measurement accuracy can be easily detected.

According to the present invention, as described above, it is possible to provide a component mounting device capable of accurately measuring the electrical characteristics of a component.

It is a top view which showed the outline of the component mounting apparatus according to one Embodiment of this invention. It is a block diagram which showed the control structure of the component mounting apparatus by one Embodiment of this invention. It is a top view for demonstrating the measurement electrode of the electric property measuring part of the component mounting apparatus by one Embodiment of this invention. It is a side view for demonstrating the measurement electrode of the electric property measuring part of the component mounting apparatus by one Embodiment of this invention. It is a side view which showed the cleaning nozzle mounted on the mounting head of the component mounting apparatus according to one embodiment of the present invention. It is a side view which showed the jig component for confirming the state of the measurement electrode of the electrical characteristic measuring part of the component mounting apparatus by one Embodiment of this invention. It is a flowchart for demonstrating the electrical characteristic measurement process of a component by the control part of the component mounting apparatus according to one Embodiment of this invention. It is a flowchart for demonstrating the electrode confirmation process for measurement by the control part of the component mounting apparatus by one Embodiment of this invention.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

(Configuration of component mounting device)
The configuration of the component mounting device 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 6.

As shown in FIG. 1, the component mounting device 100 is a component mounting device that conveys the substrate P in the X direction by a pair of conveyors 2 and mounts the component 31 on the substrate P at the mounting work position M. As shown in FIG. 1, the component mounting device 100 includes a base 1, a pair of conveyors 2, a component supply unit 3, a head unit 4, a support unit 5, a pair of rail units 6, and a component recognition camera. 7 and a control unit 8 (see FIG. 2) are provided. Further, the component mounting device 100 includes an electrical characteristic measuring unit 9. Further, a nozzle station 11 and a disposal unit 12 are provided on the base 1.

As shown in FIG. 1, the pair of conveyors 2 are installed on the base 1 and are configured to convey the substrate P in the X direction. Further, the pair of conveyors 2 are configured to hold the substrate P being conveyed in a state of being stopped at the mounting work position M. Further, the pair of conveyors 2 are configured so that the distance in the Y direction can be adjusted according to the dimensions of the substrate P.

The component supply unit 3 is configured to supply the component 31. Specifically, the component supply unit 3 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. Further, a plurality of tape feeders 3a are arranged in the component supply unit 3. That is, the component 31 is supplied to the head unit 4 from the tape feeder 3a arranged in the component supply unit 3.

The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of parts 31 is held at predetermined intervals. The tape feeder 3a is configured to supply the component 31 from the tip of the tape feeder 3a by rotating the reel to send out the tape holding the component 31. Here, the component 31 includes electronic components such as ICs, transistors, capacitors, coils and resistors. Further, the same type of component 31 is held on the same tape. That is, the plurality of parts 31 held on the same tape have substantially the same electrical characteristics. Electrical properties include, for example, resistance, capacitance, inductance, impedance.

The head unit 4 is configured to perform work on the substrate P on which the component 31 is mounted. Specifically, the head unit 4 is arranged above the pair of conveyors 2 and the component supply unit 3, and includes a plurality of mounting heads 42 having nozzles 41 attached to the lower ends, and a substrate recognition camera 43. I'm out. Further, as shown in FIG. 2, the head unit 4 includes an ejector 44, a Z-axis motor 45, an R-axis motor 46, and a rotary-axis motor 47. The substrate recognition camera 43 is an example of the "imaging unit" in the claims.

The mounting head 42 is configured to mount the component 31 on the substrate P. The mounting head 42 is configured to be movable up and down (movable in the Z direction). Further, the mounting head 42 is configured to attract the component 31 supplied from the tape feeder 3a of the component supply unit 3 by the negative pressure generated at the tip of the nozzle 41 by the ejector 44 (see FIG. 2). There is. Further, the mounting head 42 performs work of mounting (mounting) the component 31 at the mounting position on the substrate P by the positive pressure generated at the tip of the nozzle 41 by the positive pressure supplied from the outside of the component mounting device 100. It is configured as follows. The negative pressure is an air pressure lower than the air pressure of the atmosphere (periphery) of the mounting head 42, and is a sufficient air pressure to adsorb the component 31. Further, the positive pressure is an air pressure higher than the air pressure of the atmosphere (periphery) of the mounting head 42.

The plurality of mounting heads 42 are arranged in a circumferential shape. Further, the plurality of mounting heads 42 are configured to be rotated around a rotary axis extending in the vertical direction. That is, the plurality of mounting heads 42 are rotary type. Further, the plurality of mounting heads 42 are configured to be rotated and moved with respect to the suction / mounting position where the component 31 is sucked or mounted.

The mounting head 42 is configured so that the nozzle 41 mounted on the tip thereof can be replaced. Specifically, the mounting head 42 is configured so that the nozzle 41 mounted on the nozzle station 11 can be mounted, and the mounted nozzle 41 can be mounted on the nozzle station 11. .. That is, when the nozzle 41 mounted on the mounting head 42 is replaced, the nozzle 41 mounted on the mounting head 42 is mounted on the nozzle station 11, and then the required nozzle 41 of the nozzle station 11 is mounted on the mounting head 42. Will be done. The nozzle station 11 includes a nozzle 41 for mounting components, a nozzle 41a for measuring insulation for measuring electrical characteristics (see FIG. 4), and measurement electrodes 911 and 912 (see FIGS. 3 and 4) described later. A cleaning nozzle 41b (see FIG. 5) for cleaning is arranged. Further, a plurality of nozzles 41 for mounting parts and nozzles 41a for measurement are provided according to the type and size of the parts 31.

The nozzle 41 for mounting parts is made of ceramic. Parts 31 and abutting portions of the nozzle 41 has, for example, the following resistance 10 ⁹ Omega least 10 ¹² Omega. The measuring nozzle 41a is made of an insulating resin. The resistance value of the portion of the measuring nozzle 41a that comes into contact with the component 31 has, for example, 10 ¹⁴ Ω or more. The resistance value of the portion of the measuring nozzle 41a that comes into contact with the component 31 is 10 ¹⁴ Ω or more and 10 ¹⁶ Ω or less. That is, the electric resistance value of the measuring nozzle 41a is larger than the electric resistance value of the nozzle 41 for mounting parts. In other words, the measuring nozzle 41a has a larger insulating property than the nozzle 41 for mounting parts.

The substrate recognition camera 43 is configured to be able to image the substrate P as a recognition target. Specifically, as shown in FIG. 1, the substrate recognition camera 43 is configured to image the fiction mark F of the substrate P in order to recognize the position of the substrate P. Then, by imaging and recognizing the position of the fiducial mark F, it is possible to accurately acquire the mounting position of the component 31 on the substrate P. Further, lighting (not shown) is provided in the vicinity of the substrate recognition camera 43. The illumination is configured to irradiate the substrate P with light (visible light, infrared light, or the like) at the time of imaging by the substrate recognition camera 43. As a result, the substrate P can be clearly imaged by the substrate recognition camera 43.

Further, the substrate recognition camera 43 is configured to be capable of capturing a position where the component 31 of the component supply unit 3 is supplied. Specifically, the substrate recognition camera 43 is configured to be able to image the component supply position of the tape feeder 3a. As a result, it is possible to acquire the state of the component 31 supplied by the tape feeder 3a. Further, the substrate recognition camera 43 is configured so that the measurement electrodes 911 and 912 can be imaged.

The ejector 44 is configured to supply a negative pressure to the mounting head 42. Specifically, the ejector 44 is configured to supply a negative pressure to the mounting head 42 when the mounting head 42 sucks the component 31. Further, the ejector 44 is configured to supply a negative pressure for holding the component 31 by the mounting head 42 when the component 31 is conveyed by the mounting head 42. Further, the ejector 44 is configured to supply a negative pressure for holding the component 31 by the mounting head 42 when the component 31 is mounted on the substrate P by the mounting head 42. Further, the ejector 44 is provided in the head unit 4. As a result, since the device for supplying the negative pressure can be provided in the head unit 4, it is possible to simplify the piping for supplying the negative pressure as compared with the case where the device is provided outside the head unit 4.

The Z-axis motor 45 is configured to move the mounting head 42 in the vertical direction (Z direction). Specifically, the Z-axis motor 45 is configured to move the mounting head 42 located at the suction mounting position in the head unit 4 in the vertical direction. That is, the mounting head 42 can be moved up and down by being rotationally moved to the suction / mounting position in the head unit 4. Further, since the Z-axis motor 45 moves the mounting head 42 located at the suction mounting position in the vertical direction, it is not necessary to provide each of the plurality of mounting heads 42.

The R-axis motor 46 is configured to rotate the mounting head 42 around an axis extending in the vertical direction. This makes it possible to adjust the horizontal orientation of the component 31 attracted to the mounting head 42. The R-axis motor 46 is configured to rotate a plurality of mounting heads 42 in conjunction with each other. As a result, it is not necessary to provide the R-axis motor 46 for each of the plurality of mounting heads 42, so that it is possible to suppress an increase in the number of parts.

The rotary shaft motor 47 is configured to rotate a plurality of mounting heads 42 around a rotary axis extending in the vertical direction.

The support portion 5 includes an X-axis motor 51 as shown in FIGS. 1 and 2. As shown in FIG. 1, the support portion 5 is configured to move the head unit 4 in the X direction along the support portion 5 by driving the X-axis motor 51. Both ends of the support portion 5 are supported by a pair of rail portions 6.

The pair of rail portions 6 are fixed on the base 1. The rail portion 6 on the X1 side includes a Y-axis motor 61. The rail portion 6 is configured to move the support portion 5 along the pair of rail portions 6 in the Y direction orthogonal to the X direction by driving the Y-axis motor 61. Since the head unit 4 can move in the X direction along the support portion 5 and the support portion 5 can move in the Y direction along the rail portion 6, the head unit 4 can move in the XY direction. ..

The component recognition camera 7 is fixed on the upper surface of the base 1. The component recognition camera 7 is configured to be able to image the component 31. Specifically, the component recognition camera 7 is arranged on the outside (Y1 side and Y2 side) of the pair of conveyors 2. The component recognition camera 7 lowers the component 31 attracted to the nozzle 41 of the mounting head 42 (Z2 side) in order to recognize the suction state (suction posture) of the component 31 prior to mounting the component 31 on the substrate P. ) Is configured to image. As a result, the suction state of the component 31 sucked by the nozzle 41 of the mounting head 42 can be acquired by the control unit 8. Further, lighting (not shown) is provided in the vicinity of the component recognition camera 7. The illumination is configured to irradiate the component 31 attracted to the nozzle 41 with light (visible light, infrared light, etc.) at the time of imaging by the component recognition camera 7. As a result, it is possible to clearly image the component 31 attracted to the nozzle 41 by the component recognition camera 7.

The control unit 8 includes a CPU (central processing unit) and storage units such as a RAM (random access memory), a ROM (read-only memory), and an HDD (hard disk drive). The control unit 8 controls the overall operation of the component mounting device 100, such as the transfer operation of the substrate P by the pair of conveyors 2, the mounting operation by the head unit 4, and the imaging operation by the substrate recognition camera 43 and the component recognition camera 7. It is configured. Further, the control unit 8 is configured to control the mounting operation based on the program that performs the mounting operation. For example, the control unit 8 is configured to drive the X-axis motor 51 and the Y-axis motor 61 to control the movement of the head unit 4 in the horizontal direction. Further, the control unit 8 is configured to drive the Z-axis motor 45 to control the ascending / descending movement of the mounting head 42. Further, the control unit 8 is configured to drive the R-axis motor 46 to rotate the mounting head 42 around the axis in the vertical direction (Z direction). Further, the control unit 8 is configured to drive the rotary shaft motor 47 to rotate a plurality of mounting heads 42 around the rotary shaft line. Further, the control unit 8 is configured to control the air pressure (negative pressure) of the ejector 44.

The electrical characteristic measuring unit 9 is configured to measure the electrical characteristics of the component 31 supplied from the component supply unit 3. As shown in FIG. 3, the electrical characteristic measuring unit 9 includes a substrate 91, a fixing member 92, and wiring 93. The substrate 91 is provided with measurement electrodes 911 and 912. When the component 31 is a resistor, the electrical characteristic measuring unit 9 measures the resistance value as the electrical characteristic. Further, when the component 31 is a capacitor, the electric characteristic measuring unit 9 measures the capacitance as an electric characteristic. Further, when the component 31 is a coil, the electrical characteristic measuring unit 9 measures the inductance as an electrical characteristic. Further, when the component 31 is a diode, the electrical characteristic measuring unit 9 measures the resistance value and the polarity as the electrical characteristics.

The electrical characteristic measuring unit 9 applies an AC voltage or a DC voltage in a state where one of the two electrodes provided on the component 31 is in contact with the measuring electrode 911 and the other is in contact with the measuring electrode 912. Then, it is configured to measure the electrical characteristics of the component 31.

The substrate 91 is arranged on the base 1. Measurement electrodes 911 and 912 are arranged on the upper surface of the substrate 91. The measuring electrodes 911 and 912 are arranged apart in the horizontal direction. Specifically, the measurement electrodes 911 and 912 are arranged so as to be separated by a distance that the electrodes of the minimum component 31 can come into contact with each other. For example, the measuring electrodes 911 and 912 are arranged apart from each other in the range of about 0.1 mm to 1 mm. The measuring electrodes 911 and 912 are made of gold (Au). Further, the measurement electrodes 911 and 912 are connected to the wiring 93 via the connectors 93b and 93a, respectively. The wiring 93 is connected to the electrical characteristic measuring unit 9.

The measuring electrode 911 has a length of W1 in the longitudinal direction. Further, the component 31 has a width of W2 in a direction orthogonal to the direction in which the electrodes are arranged. W1 is larger than W2. W1 preferably has a length of 5 times or more that of W2. It is more preferable that W1 has a length of 10 times or more that of W2. It is more preferable that W1 has a length of 20 times or more that of W2. W1 is, for example, about 10 mm to 50 mm. W2 is, for example, about 0.2 mm to 10 mm.

The substrate 91 is fixed on the base 1 by the fixing member 92. Specifically, the fixing member 92 includes a fastening member such as a screw. Then, the substrate 91 is fastened by the fixing member 92 and fixed on the base 1. One fixing member 92 is provided at each of the four corners of the substrate 91. The substrate 91 is provided with wiring (not shown) for connecting the measurement electrodes 911 and 912 and the connector 93b. Further, the substrate 91 is arranged at a height position substantially equal to that of the substrate P on which the component 31 is mounted. As a result, the measurement electrodes 911 and 912 of the substrate 91 can be easily imaged by the substrate recognition camera 43 that images the upper surface of the substrate P.

The connectors 93a and 93b are detachably configured. The connector 93a is provided at the tip of the wiring 93. The connector 93b is provided on the substrate 91. By connecting the connectors 93a and 93b, the measurement electrodes 911 and 912 and the electrical characteristic measurement unit 9 are connected. Further, the substrate 91 can be removed by disconnecting the connectors 93a and 93b and releasing the fixed state of the substrate 91 by the fixing member 92.

Here, in the present embodiment, the control unit 8 attracts and conveys the component 31 by the insulating measurement nozzle 41a with the insulating measurement nozzle 41a mounted on the mounting head 42, and causes the component 31 to be conveyed. Is configured to be brought into contact with the measuring electrodes 911 and 912 to control the measurement of electrical characteristics. Further, the control unit 8 is configured to control the disposal of the component 31 whose electrical characteristics have been measured.

Specifically, the control unit 8 is configured to determine whether or not the component 31 supplied from the component supply unit 3 is of the correct type based on the measurement result of measuring the electrical characteristics of the component 31. That is, the control unit 8 determines whether or not the tape feeder 3a in which the correct reel is set is attached to the component supply unit 3. In other words, the control unit 8 detects that the tape feeder 3a holding the wrong type of component 31 is arranged at a predetermined position of the component supply unit 3. The control unit 8 is set, for example, when the tape feeder 3a is arranged in the component supply unit 3, the position of the tape feeder 3a is changed, or when a new reel is set in the tape feeder 3a. It is configured to measure the electrical characteristics of the component 31 when it is necessary to confirm whether or not the type of is correct.

Further, the control unit 8 is configured to control the disposal of the component 31 whose electrical characteristics have been measured, regardless of the measurement result of the electrical characteristics of the component 31. That is, the control unit 8 should discard the component 31 whose electrical characteristics have been measured even if the electrical characteristics of the component 31 whose electrical characteristics have been measured are within a predetermined range and the type of the set component 31 is correct. It is configured. Further, the control unit 8 discards the component 31 whose electrical characteristics have been measured even when the electrical characteristics of the component 31 whose electrical characteristics have been measured are out of the predetermined range and the type of the set component 31 is incorrect. It is configured as follows. The discarded component 31 is conveyed by the mounting head 42 and discarded in the disposal section 12.

Further, the control unit 8 is configured to sequentially change the contact positions of the parts 31 on the measuring electrodes 911 and 912 when measuring the electrical characteristics of the parts 31. Specifically, the control unit 8 is configured to change the contact positions of the measuring electrodes 911 and 912 of the component 31 for measuring the electrical characteristics every predetermined number of measurements. For example, as shown in FIG. 3, the control unit 8 is configured to sequentially change the contact positions of the measurement electrodes 911 and 912 so as not to overlap with the contact positions at the time of the previous measurement in a plan view. Has been done.

Further, the control unit 8 confirms the state of the measurement electrodes 911 and 912, and based on the confirmation result, controls the control to prompt the replacement of the measurement electrodes 911 and 912, or cleans the measurement electrodes 911 and 912. It is configured to control the operation. Specifically, the control unit 8 confirms the state of the measurement electrodes 911 and 912, and when it is determined that the state of the measurement electrodes 911 and 912 deteriorates and needs to be replaced, the notification unit 13 is used for measurement. It is configured to give a notification prompting the replacement of the electrodes 911 and 912. Further, the control unit 8 checks the state of the measurement electrodes 911 and 912, and when it is determined that the state of the measurement electrodes 911 and 912 deteriorates and needs to be cleaned, the measurement electrodes 911 and 912 are cleaned. It is configured to provide control.

Specifically, when cleaning the measurement electrodes 911 and 912, the control unit 8 attaches a cleaning nozzle 41b for cleaning to the mounting head 42, and the cleaning nozzle 41b is used to attach the measurement electrodes 911 and 912 to the mounting head 42. It is configured to control the cleaning of the 912. As shown in FIG. 5, the cleaning nozzle 41b is provided with a member 411b for wiping dirt at the tip thereof. The member 411b for wiping dirt is, for example, cotton or felt. The cleaning nozzle 41b is prepared in the nozzle station 11. The cleaning surface of the cleaning nozzle 41b may be dry, or may be impregnated with alcohol, detergent, or the like. The control unit 8 is configured to clean the measurement electrodes 911 and 912 by sliding the cleaning surface of the cleaning nozzle 41b mounted on the mounting head 42 in contact with the measurement electrodes 911 and 912. Has been done.

Further, when the number of times that the electric characteristic measuring unit 9 measures the electric characteristic of the component 31 reaches a predetermined number, the control unit 8 takes an image of the measuring electrodes 911 and 912 by the substrate recognition camera 43 and measures the measuring electrode. The state of the measurement electrodes 911 and 912 is confirmed by controlling the state of the 911 and 912 and measuring the electrical characteristics by bringing the jig component 31a for checking the state into contact with the measurement electrodes 911 and 912. It is configured to perform at least one of control. Specifically, the control unit 8 is configured to check the states of the measurement electrodes 911 and 912 when the number of times the electrical characteristic measurement unit 9 measures the electrical characteristics of the component 31 reaches a predetermined number of times. ing. For example, the control unit 8 is configured to confirm the state of the measurement electrodes 911 and 912 when the electrical characteristic measurement unit 9 measures the electrical characteristics of the component 31 about 500 to 1000 times.

Further, when the control unit 8 images the measurement electrodes 911 and 912 with the substrate recognition camera 43 and confirms the state of the measurement electrodes 911 and 912, the control unit 8 analyzes the images of the measurement electrodes 911 and 912 by image analysis. Check the status. For example, the control unit 8 confirms the state based on the brightness of the images of the measurement electrodes 911 and 912. If the brightness of the images of the measurement electrodes 911 and 912 is within the predetermined range, the control unit 8 determines that there is no stain, and the brightness of the images of the measurement electrodes 911 and 912 is out of the predetermined range, and the measurement is performed. If there is a color (for example, a black portion) different from that of the electrodes 911 and 912, it is determined that the electrode is dirty. Further, if the dirty area (the area of the black portion) is equal to or more than a predetermined value, the control unit 8 determines that the measurement electrodes 911 and 912 need to be cleaned or replaced.

Further, when the control unit 8 confirms the state of the measurement electrodes 911 and 912 by bringing the jig component 31a for checking the state into contact with the measurement electrodes 911 and 912 and measuring the electrical characteristics, FIG. As shown in the above, in a state where the jig component 31a is attracted by the insulating measurement nozzle 41a, the jig component 31a is brought into contact with the measurement electrodes 911 and 912 to measure the electrical characteristics. The electrical characteristics of the jig component 31a are known and are stored in the storage unit of the control unit 8. Further, the jig component 31a is mounted on the nozzle station 11, for example. The control unit 8 compares the known electrical characteristics of the jig component 31a with the measured electrical characteristics, and if the deviation is within a predetermined range, determines that the measuring electrodes 911 and 912 are normal, and the deviation is large. If it is larger than the predetermined range, it is determined that the measurement electrodes 911 and 912 are abnormal. When the control unit 8 determines that the measurement electrodes 911 and 912 are abnormal, it determines that the measurement electrodes 911 and 912 need to be cleaned or replaced.

The jig component 31a is preferably a component having a high withstand voltage that can withstand high voltage static electricity. For example, by thickening the wiring in the jig component 31a, the component has higher withstand voltage than the thin wiring. Further, increasing the size of the jig component 31a is advantageous in terms of pressure resistance. Further, since the jig component 31a is for checking the presence or absence of dirt on the measurement electrodes 911 and 912, the type of component may be, for example, only a resistor component.

(Measurement of electrical characteristics of parts)
Next, with reference to FIG. 7, the electrical characteristic measurement process of the component by the control unit 8 of the component mounting device 100 will be described with reference to the flowchart.

In step S1 of FIG. 7, it is determined whether or not the component 31 has been replaced. Specifically, in step S1, the tape feeder 3a is newly arranged in the component supply unit 3, the position of the tape feeder 3a is changed, a new reel is set in the tape feeder 3a, and the like. It is determined whether or not it is necessary to determine whether or not the type of the made component 31 is correct. If there is no component replacement, the electrical characteristic measurement process of the component is completed, and if there is a component replacement, the process proceeds to step S2.

In step S2, the nozzle 41 is replaced with the insulating measurement nozzle 41a. Specifically, the nozzle 41 mounted on the mounting head 42 is replaced with the measurement nozzle 41a arranged in the nozzle station 11. At this time, it is replaced with a measuring nozzle 41a corresponding to the size and shape of the component 31 to be measured. In step S3, the component 31 for measuring the electrical characteristics is attracted to the measuring nozzle 41a.

In step S4, the electrical characteristics of the component 31 are measured. Specifically, the component 31 attracted by the insulating measurement nozzle 41a is conveyed, and the component 31 is brought into contact with the measurement electrodes 911 and 912 to measure the electrical characteristics. In step S5, it is determined whether or not the measured value is within the reference value. Specifically, the electrical characteristics of each type of the component 31 stored in the storage unit are compared with the measured value, and it is determined whether or not the measured value is within a predetermined error with respect to the reference value. .. If it is out of the reference value range, the process proceeds to step S6, and if it is within the reference value, the process proceeds to step S7.

In step S6, the installation error of the component 31 is notified. Specifically, the notification unit 13 notifies that the correct type of component 31 is not set. In this case, the mounting operation of the component 31 on the substrate P is stopped until the correct component 31 is set in the component supply unit 3. If the mounting of the component 31 on the substrate P is not affected, the mounting may be started or restarted without waiting for the correct component 31 to be set in the component supply unit 3.

In step S7, the component 31 whose electrical characteristics have been measured is discarded. Specifically, the component 31 whose electrical characteristics have been measured is transported from the measuring electrodes 911 and 912 to the disposal unit 12 and discarded. In step S8, the nozzle 41 is replaced with a nozzle for production. Specifically, the measurement nozzle 41a mounted on the mounting head 42 is replaced with the nozzle 41 arranged in the nozzle station 11. Then, the electrical characteristic measurement process of the component is completed. When there are a plurality of parts 31 that need to be measured, the electrical characteristics of the plurality of parts 31 are measured in parallel by using the plurality of mounting heads 42.

(Measurement electrode confirmation process)
Next, with reference to FIG. 8, the measurement electrode confirmation process by the control unit 8 of the component mounting device 100 will be described with reference to the flowchart.

In step S11 of FIG. 8, the number of measurements is counted. That is, the number of times the electrical characteristics of the component 31 are measured after the measurement electrodes 911 and 912 are replaced or cleaned is counted. In step S12, it is determined whether or not the number of measurements has reached a predetermined number of times. If the predetermined number of times has not been reached, the measurement electrode confirmation process is completed, and if the predetermined number of times has been reached, the process proceeds to step S13.

In step S13, the state of the measurement substrate 91 is confirmed. Specifically, the state of the measurement electrodes 911 and 912 of the substrate 91 is confirmed by using the substrate recognition camera 43 or the jig component 31a. In step S14, it is determined whether the state of the measurement substrate is OK (no problem) or NG (problem). If it is OK, the measurement electrode confirmation process is completed, and if it is NG, the process proceeds to step S15.

In step S15, the measurement substrate 91 is cleaned. Specifically, the measurement electrodes 911 and 912 of the substrate 91 are cleaned by using the cleaning nozzle 41b. In step S16, the state of the measurement substrate 91 is reconfirmed. Specifically, the state of the measurement electrodes 911 and 912 of the substrate 91 is reconfirmed by using the substrate recognition camera 43 or the jig component 31a. That is, it is confirmed whether the conditions of the measuring electrodes 911 and 912 have been improved by cleaning.

In step S17, it is determined whether the state of the measurement substrate is OK (no problem) or NG (problem). If it is OK, the measurement electrode confirmation process is completed, and if it is NG, the process proceeds to step S18. In step S18, a replacement message for the measurement board 91 is displayed. Specifically, the notification unit 13 notifies a message that the measurement board 91 needs to be replaced. After that, the measurement electrode confirmation process is completed.

(Effect of this embodiment)
In this embodiment, the following effects can be obtained.

In the present embodiment, as described above, in a state where the insulating measurement nozzle 41a is mounted on the mounting head 42, the component 31 is attracted and conveyed by the insulating measurement nozzle 41a, and the component 31 is measured. A control unit 8 is provided which controls the measurement of electrical characteristics by abutting the electrodes 911 and 912. As a result, it is possible to suppress the flow of current through the measuring nozzle 41a when measuring the electrical characteristics of the component 31, so that the electrical characteristics of the component 31 can be measured accurately. Further, by configuring the control unit 8 to control the disposal of the component 31 whose electrical characteristics have been measured, the component 31 whose electrical characteristics have been measured is discarded even when the component 31 is charged with static electricity during the measurement of the electrical characteristics. Therefore, it is possible to prevent the component 31 and the substrate P from being damaged by the discharge of static electricity charged in the component 31 at the time of mounting. As a result, the electrical characteristics of the component 31 can be measured with high accuracy, and the reliability of the substrate P on which the component 31 as a product is mounted can be ensured.

Further, in the present embodiment, as described above, the control unit 8 determines whether or not the component 31 supplied from the component supply unit 3 is of the correct type based on the measurement result of measuring the electrical characteristics of the component 31. At the same time, the component 31 whose electrical characteristics have been measured is controlled to be discarded regardless of the measurement result of the electrical characteristics of the component 31. As a result, it is possible to easily determine whether or not the correct type of component 31 is set in the component supply unit 3 by measuring the electrical characteristics of the component 31. For example, when a plurality of parts 31 of the same type are held on a tape and supplied, or when a plurality of parts 31 of the same type are placed on a tray and supplied, the electrical characteristics of one part 31 are measured. By doing so, it can be easily determined whether or not the tape or tray of the correct type of component 31 is set in the component supply unit 3. Further, one component 31 whose electrical characteristics have been measured is always discarded, and a component 31 whose electrical characteristics are not measured other than the discarded component 31 is mounted, so that the reliability of component mounting can be ensured. ..

Further, in the present embodiment, as described above, the measuring nozzle 41a is configured to have an insulating property having a resistance value of 10 ¹⁴ Ω or more at the portion in contact with the component 31. As a result, it is possible to effectively suppress the flow of current through the measuring nozzle 41a when measuring the electrical characteristics of the component 31, so that the electrical characteristics of the component 31 can be measured more accurately.

Further, in the present embodiment, as described above, the control unit 8 is configured to sequentially change the contact positions of the parts 31 on the measuring electrodes 911 and 912 when measuring the electrical characteristics of the parts 31. .. As a result, it is possible to prevent the measurement electrodes 911 and 912 from becoming dirty or scraped as compared with the case where the component 31 is brought into contact with the same positions of the measurement electrodes 911 and 912. It is possible to delay the deterioration of the surface condition of 912. As a result, it is possible to extend the period during which the electrical characteristics of the component 31 can be accurately measured without performing maintenance on the measurement electrodes 911 and 912.

Further, in the present embodiment, as described above, the control unit 8 confirms the state of the measurement electrodes 911 and 912, and based on the confirmation result, gives a notification prompting the replacement of the measurement electrodes 911 and 912. Alternatively, it is configured to control the cleaning of the measurement electrodes 911 and 912. As a result, when the condition of the measurement electrodes 911 and 912 deteriorates, the measurement electrodes 911 and 912 are replaced by notification, or the measurement electrodes 911 and 912 are cleaned, so that the electrical characteristics of the component 31 are obtained. It is possible to suppress a decrease in the measurement accuracy of.

Further, in the present embodiment, as described above, when the control unit 8 cleans the measurement electrodes 911 and 912, the mounting head 42 is equipped with the cleaning nozzle 41b for cleaning, and the cleaning nozzle 41b is attached. Therefore, the measurement electrodes 911 and 912 are controlled to be cleaned. As a result, the mounting head 42 to which the cleaning nozzle 41b is mounted can automatically clean the measurement electrodes 911 and 912, so that the user can clean the measurement electrodes 911 and 912 as compared with the case where the user cleans the measurement electrodes 911 and 912. The work load can be reduced.

Further, in the present embodiment, as described above, when the number of times the control unit 8 measures the electrical characteristics of the component 31 by the electrical characteristic measurement unit 9 reaches a predetermined number of times, the measurement electrode is used by the substrate recognition camera 43. Control by imaging 911 and 912 to check the state of the measurement electrodes 911 and 912, and measuring the electrical characteristics by bringing the jig component 31a for checking the state into contact with the measurement electrodes 911 and 912. It is configured to perform at least one of the control for confirming the state of the jigs 911 and 912. As a result, the states of the measurement electrodes 911 and 912 of the electrical characteristic measuring unit 9 can be periodically confirmed based on the number of times the electrical characteristics of the component 31 are measured reach a predetermined number of times. Further, when the measurement electrodes 911 and 912 are imaged by the substrate recognition camera 43 to confirm the state of the measurement electrodes 911 and 912, the measured images are analyzed to stain or scrape the measurement electrodes 911 and 912. It is possible to easily confirm the presence or absence of. Further, when the jig component 31a for checking the state is brought into contact with the measuring electrodes 911 and 912 and the electrical characteristics are measured to check the state of the measuring electrodes 911 and 912, the jig component whose electrical characteristics are known. Since the measurement accuracy can be confirmed by energizing 31a for measurement and comparing the measurement result with the known electrical characteristics, deterioration of the measurement accuracy can be easily detected.

(Modification example)
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims.

For example, in the above embodiment, an example of a configuration in which a nozzle for measuring insulation is formed of resin is shown, but the present invention is not limited to this. In the present invention, the insulating measurement nozzle may be formed of a material other than resin. For example, the insulating measurement nozzle may be made of rubber, ceramic, wood, or the like.

Further, in the above embodiment, an example of a configuration in which a nozzle for mounting a component is formed of ceramic is shown, but the present invention is not limited to this. In the present invention, the nozzle for mounting parts may be formed of other than ceramic. For example, the nozzle for mounting parts may be formed of metal, resin, or the like.

Further, in the above embodiment, an example of a configuration in which a tape feeder holding a tape is arranged in a component supply unit is shown, but the present invention is not limited to this. In the present invention, a tray on which parts are placed may be arranged in the parts supply unit.

Further, in the above embodiment, an example of a configuration including a so-called rotary head unit in which a plurality of mounting heads are provided in a circumferential shape is shown, but the present invention is not limited to this. In the present invention, a so-called in-line type head unit in which a plurality of mounting heads are linearly provided in one row or a plurality of rows may be provided.

Further, in the above embodiment, an example of a configuration in which one head unit is provided is shown, but the present invention is not limited to this. In the present invention, a plurality of head units may be provided. Further, a plurality of rotary may be provided in one head unit.

Further, in the above embodiment, an example of a configuration in which a pair of conveyors for transporting substrates is provided is shown, but the present invention is not limited to this. In the present invention, a plurality of pairs of conveyors for transporting substrates may be provided. For example, the present invention may be applied to a component mounting device capable of transporting substrates in parallel and mounting components on the substrate in parallel.

Further, in the above embodiment, an example of the configuration in which the measurement electrode is formed of gold (Au) is shown, but the present invention is not limited to this. In the present invention, the measurement electrode may be formed of a material other than gold (Au). For example, the measurement electrode may be formed of platinum (Pt), copper (Cu), or the like. Further, the measurement electrode may be formed of an alloy.

Further, in the above embodiment, an example of a configuration in which a jig component for confirming the state of the measurement electrode is supplied from the nozzle station is shown, but the present invention is not limited to this. In the present invention, the jig parts may be supplied from the parts supply unit. For example, jig parts may be supplied from a tape feeder or a tray of the parts supply unit.

Further, in the above embodiment, an example of a configuration in which the measurement electrode is cleaned by wiping it with a cleaning nozzle is shown, but the present invention is not limited to this. In the present invention, the measurement electrode may be cleaned by injecting air from the nozzle or sucking air. Further, the measurement electrode may be cleaned by attaching a brush as a cleaning nozzle to the mounting head and sweeping with the brush.

Further, in the above embodiment, an example of a configuration in which the contact position of the component on the measuring electrode is changed so as not to overlap with the previous position is shown every time the electrical characteristics of the component are measured. Not limited. In the present invention, each time the electrical characteristics of the component are measured, the contact position of the component on the measuring electrode may be changed so as to partially overlap the previous position.

Further, in the above embodiment, for convenience of explanation, an example in which the control processing of the control unit is described by using a flow-driven flowchart in which the processing is sequentially performed along the processing flow has been shown, but the present invention is limited to this. I can't. In the present invention, the control process of the control unit may be performed by an event-driven type (event-driven type) process in which the process is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

3 Parts supply unit 8 Control unit 9 Electrical characteristic measurement unit 31 Parts 31a Jig parts 41a Measurement nozzle 41b Cleaning nozzle 42 Mounting head 43 Board recognition camera (imaging unit)
100 Component mounting device 911, 912 Measurement electrode P substrate

Claims (6)

A mounting head that mounts components on the board,
The parts supply unit that supplies the parts and
An electrical characteristic measuring unit that includes a measuring electrode and measures the electrical characteristics of the component supplied from the component supply unit.
With the insulating measurement nozzle mounted on the mounting head, the component is attracted and conveyed by the insulating measurement nozzle, and the component is brought into contact with the measurement electrode to measure electrical characteristics. It is equipped with a control unit that controls
The control unit is configured to control the disposal of the component whose electrical characteristics have been measured .
The control unit is a component mounting device that is configured to sequentially change the position at which the component is brought into contact with the same measurement electrode when measuring the electrical characteristics of the component. The control unit determines whether or not the component supplied from the component supply unit is of the correct type based on the measurement result of measuring the electrical characteristics of the component, and is involved in the measurement result of the electrical characteristics of the component. The component mounting device according to claim 1, which is configured to control the disposal of the component whose electrical characteristics have been measured. The component mounting device according to claim 1 or 2, wherein the measuring nozzle has an insulating property having a resistance value of 10 ¹⁴ Ω or more at a portion that comes into contact with the component. The control unit is configured to confirm the state of the measurement electrode and, based on the confirmation result, control to give a notification prompting the replacement of the measurement electrode or control to clean the measurement electrode. The component mounting device according to any one of claims 1 to 3 . When cleaning the measurement electrode, the control unit is configured to mount a cleaning nozzle for cleaning on the mounting head and control the measurement electrode to be cleaned by the cleaning nozzle. The component mounting device according to claim 4 . When the number of times the electrical characteristic measuring unit measures the electrical characteristics of the component reaches a predetermined number, the control unit captures the measuring electrode with the imaging unit and confirms the state of the measuring electrode. It is configured to perform at least one of control and control for confirming the state of the measurement electrode by abutting a jig component for checking the state on the measurement electrode and measuring the electrical characteristics. The component mounting apparatus according to claim 4 or 5 .

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