JP6784108B2 - Replica mold manufacturing method and imprinting equipment - Google Patents

Description

The present invention relates to a method for manufacturing a replica mold and an imprinting apparatus.

In recent years, in the manufacturing process of semiconductor devices (for example, semiconductor memory, etc.), a mold member (mold) having an uneven pattern formed on the surface of a substrate is used to form a pattern in which the uneven pattern is transferred to a workpiece such as a substrate at the same magnification. Nanoimprint technology, which is a technology, is used.

The mold having a fine uneven pattern used in such nanoimprint technology can be manufactured by, for example, electron beam (EB) lithography or the like. The mold manufactured in this way has a high-precision shape and dimensions of the fine concavo-convex pattern, but the manufacturing cost is high, and after a predetermined number of transfer steps, the workpiece (in) is processed. The transfer pattern formed on the printing resin, etc.) may be defective, or the fine uneven pattern of the mold may be damaged.

If a defect in the transfer pattern or damage to the fine uneven pattern of the mold occurs in this way and the mold is replaced with a new mold, the cost of the product manufactured through the nanoimprint process will increase. Therefore, when performing a nanoimprint process on an industrial scale, generally, a mold manufactured by electron beam (EB) lithography or the like as described above is used as a master mold, and a replica mold manufactured by nanoimprint lithography using the master mold is generally used. Etc. are used.

In the nanoimprinting process, which is one of the steps of manufacturing a replica mold, the surface (pattern forming surface) on which the fine uneven pattern is formed in the master mold is curved toward the replica mold substrate side, and the fine irregularities in the replica mold substrate are formed. The surface to which the pattern is transferred (the surface to be transferred) is also curved toward the master mold. Then, the most protruding portion of the pattern forming surface of the master mold (the portion closest to the replica molding substrate) and the most protruding portion of the transferred surface of the replica molding substrate via the imprint resin dropped on the transferred surface. Make contact with (the part closest to the master mold). After that, the pattern forming surface of the master mold and the transferred surface of the replica molding substrate are deformed so as to return to the original flat surface (see Patent Documents 1 and 2).

Special Table 2009-518207 Japanese Patent Publication No. 2011-512019

In the above Patent Documents 1 and 2, it is an object of the master mold to prevent the occurrence of pattern defects due to the occurrence of air pools between the pattern forming surface of the master mold and the transfer surface of the replica molding substrate. The pattern-forming surface and / or the transfer-transferred surface of the replica molding substrate are brought into contact with each other in a curved state. That is, the above object is achieved by bending either one or both.

By bending either or both of the master mold and replica mold substrates in this way, it is possible to prevent the occurrence of pattern defects due to air pools. After both the pattern forming surface of the master mold and the transfer surface of the replica molding substrate are brought into contact with each other in a curved state, it is necessary to return both to the original flat surface at the same time. This is because the curvature of the curved pattern forming surface and the surface to be transferred are the same, and by returning both to the original flat surface at the same time, a resist pattern can be formed on the surface to be transferred with excellent position accuracy. .. On the other hand, if the curvature of the curved pattern forming surface and the surface to be transferred are different, even though one of them has returned to the original flat surface, the other remains curved and comes into contact with each other. As a result, the positional accuracy of the resist pattern formed on the surface to be transferred is lowered.

Generally, in order to easily bend the pattern forming surface and the transfer surface, both the master mold and the replica molding substrate have recesses, and the pattern formation surface and the transfer surface are transferred by pressurizing the inside of each recess. Can be curved.

Usually, the master mold and the replica mold substrate are often made of the same material (for example, quartz glass). Therefore, if the same pressure is applied to the respective recesses of the master mold and the replica mold substrate and then the pressure inside each recess is reduced at the same ratio, the pattern forming surface of the master mold and the cover of the replica mold substrate are covered. It is usually considered that the curvature of the transfer surface can be made the same, and the pattern forming surface of the master mold and the transfer surface of the replica molding substrate can be returned to the original flat surface at the same time.

However, even if the same pressure is applied to each recessed portion, there is a problem that the curvatures of the pattern forming surface of the master mold and the surface to be transferred of the replica molding substrate are not the same. For example, depending on the size of the recess (diameter of the recess, thickness of the pattern forming surface / transferred surface (depth of the recess), etc.), even if the same pressure is applied to each recess, the pattern forming surface and The curvature of the surface to be transferred will be different.

Further, even when the master mold and the replica mold substrate are both made of quartz glass, depending on whether or not the quartz glass is doped with a metal element or the like, and whether the quartz glass is doped with a metal element or the like. Even if is doped, the curvature will differ depending on the amount of doping and the like.

In particular, in a replica molding substrate, a hard mask layer made of a chromium-based material or the like is often formed on the surface to be transferred, so that the replica molding substrate when the same pressure is applied to each recessed portion. The curvature of the surface to be transferred and the curvature of the pattern forming surface of the master mold will be different, and the curvature of the surface to be transferred of the replica molding substrate when the same pressure is applied depends on the thickness of the hard mask layer. , It will be different from the curvature of the pattern forming surface of the master mold.

In view of the above problems, an object of the present invention is to provide a method for manufacturing a replica mold having a fine uneven pattern having excellent position accuracy and an imprinting apparatus.

In order to solve the above problems, the present invention has a base having a first surface and a second surface facing the first surface, and fine irregularities are formed in a pattern region set on the first surface side of the base. A method of manufacturing a replica mold using a master mold in which a pattern is formed and a recess is formed substantially in the center of the plan view on the second surface side of the base portion, wherein the first surface and the first surface are formed. A first step of preparing a replica molding substrate having a base having a second surface facing the base and having a recess formed in a substantially central portion in a plan view on the second surface side of the base, and the master mold. By adjusting the pressure in the recessed portion of the replica molding substrate, the first surface side of the replica molding substrate is convexly curved, and the pressure in the recessed portion of the master mold is adjusted. In a state where at least the pattern region on the first surface side of the master mold is curved in a convex shape, the first surface of the replica molding substrate and the first surface of the master mold are placed between them. In the second step of bringing the material to be transferred into contact with each other, the pressure in the recessed portion of the replica molding substrate and the pressure in the recessed portion of the master mold are adjusted to a predetermined pressure. It has a third step of adjusting and transferring the fine concavo-convex pattern to the material to be transferred, and a fourth step of separating the material to be transferred and the master mold to which the fine concavo-convex pattern has been transferred. In the two steps, the curvature of the first surface of the replica molding substrate curved in a convex shape and the curvature of the pattern region of the first surface of the master mold curved in a convex shape become substantially the same. As described above, the pressures in the recessed portion of the replica molding substrate and in the recessed portion of the master mold are adjusted, and in the third step, the recessed portion of the replica molding substrate and the recessed portion of the master mold are used. Manufacture of a replica mold, characterized in that the respective pressures in the recessed portion of the replica molding substrate and in the recessed portion of the master mold are adjusted so that the respective pressure change ratios in the portions are substantially the same. A method is provided (Invention 1).

According to the above invention (Invention 1), the pressure in the recessed portion of the master mold and the pressure in the recessed portion of the replica molding substrate are adjusted to obtain the first surface of the master mold and the first surface of the replica molding substrate. Since the imprinting process is performed in a state of being curved so as to have substantially the same curvature, it is possible to manufacture a replica mold having a fine uneven pattern having excellent position accuracy.

In the present invention, the "curvature of the pattern region of the first surface of the master mold" means that a fine uneven pattern is formed in the side view of the master mold in a state where the first surface (pattern region) is curved in a convex shape. It means the curvature of the curved line composed of the first surface (pattern region) when it is assumed that the first surface (pattern region) is not provided. Further, the "curvature of the first surface of the replica molding substrate" is composed of the first surface (pattern region) in the side view of the replica molding substrate in a state where the first surface is curved in a convex shape. It means the curvature of the curved line. For these curvatures, for example, a master mold or replica mold substrate is placed on a substrate stage capable of vacuum adsorption (for example, a substrate stage in an imprinting apparatus), and the master mold or replica mold substrate is vacuum attracted. , Laser displacement meter (for example, LK-G5000, manufactured by Keyence), etc., measures the height distribution of the master mold or replica mold substrate vacuum-adsorbed on the substrate stage, and the surface is measured from the height distribution data. It can be measured by acquiring the shape.

In the above invention (Invention 1), in the second step, the correlation between the pressure in the recessed portion of the replica molding substrate and the curvature of the first surface, and the pressure in the recessed portion of the master mold and the first. It is preferable to obtain the correlation with the curvature of one surface in advance and adjust the pressures in the recessed portion of the replica molding substrate and in the recessed portion of the master mold based on the correlation (invention). 2) The replica molding substrate preferably includes a hard mask layer provided on the first surface (Invention 3), and in the third step, the inside of the recessed portion of the master mold and the replica molding. It is preferable to adjust each pressure in the recess until the pressure in the recess of the substrate becomes the pressure before adjustment in the second step (Invention 4), and the first surface of the master mold. The flatness of the pattern region in the above pattern region is obtained in advance, and in the third step, the pressure in the recessed portion of the master mold is adjusted until the flatness falls within a predetermined range, and the replica molding substrate is used. It is preferable to adjust the pressure in the recess of the replica molding substrate until the pressure in the recess becomes the pressure before the adjustment in the second step (Invention 5), and the flatness becomes 100 nm or less. It is preferable to adjust the pressure in the recessed portion of the master mold (Invention 6).

Further, in the present invention, a base portion having a first surface and a second surface facing the first surface, a fine uneven pattern formed in a pattern region set on the first surface side of the base portion, and the said base portion. A transfer substrate having a first surface and a second surface facing the first surface and having a recess formed on the second surface side by using an imprint mold having a recess formed on the second surface side. An imprint device for transferring the fine uneven pattern of the imprint mold to the first surface of the above, a stage holding the transfer substrate, and the fine particles on the first surface of the transfer substrate. By adjusting the pressure in the recessed portion of the imprint mold and the mold holder that holds the imprint mold so that the uneven patterns face each other, the first surface side of the imprint mold can be curved. A pressure adjusting unit, a second pressure adjusting unit that can bend the first surface side of the transferred substrate by adjusting the pressure in the recessed portion of the transferred substrate, the first pressure adjusting unit, and the first pressure adjusting unit. A control unit that controls the adjustment of the pressure by the second pressure adjusting unit is provided, and the control unit is provided before the first surface of the imprint mold and the first surface of the transfer substrate come into contact with each other. The first pressure adjustment is made so that the curvature of the first surface of the imprint mold that is curved in a convex shape and the curvature of the first surface of the substrate to be transferred that is curved in a convex shape are substantially the same. The first surface of the imprint mold that is curved in a convex shape and the first surface of the substrate to be transferred that is curved in a convex shape control the adjustment of the pressure by the unit and the second pressure adjusting unit. After contacting through the material to be transferred located between the above, the pressure change ratio in the recessed portion of the imprint mold and in the recessed portion of the substrate to be transferred is substantially the same. (Invention 7) provides an imprint device characterized by controlling the adjustment of the pressure by the pressure adjusting unit and the second pressure adjusting unit (Invention 7).

In the above invention (Invention 7), the control unit controls pressure adjustment by the first pressure adjusting unit based on the correlation between the pressure in the recessed portion of the imprint mold and the curvature of the first surface. It is preferable to control the pressure adjustment by the second pressure adjusting unit based on the correlation between the pressure in the recessed portion of the transferred substrate and the curvature of the first surface (Invention 8) , and the pressure is curved in a convex shape. After the first surface of the imprint mold and the first surface of the convexly curved substrate to be transferred come into contact with each other via a material to be transferred located between them, the first pressure adjusting unit is used. Is the pressure in the recess of the imprint mold until the pressure in the recess of the imprint mold becomes the pressure in the recess before the first surface of the imprint mold is convexly curved. The second pressure adjusting unit adjusts the pressure until the pressure in the recessed portion of the transferred substrate becomes the pressure in the recessed portion before the first surface of the transferred substrate is convexly curved. It is preferable to adjust the pressure in the recessed portion of the transfer substrate (Invention 9 ), and the first pressure adjusting portion is convexly curved with the first surface of the imprint mold which is curved in a convex shape. After the first surface of the transfer substrate comes into contact with the transfer material located between them, the first pressure adjusting unit flattens the pattern region on the first surface of the imprint mold. is preferably degrees to adjust the pressure in the recess portion of the imprint mold until within a predetermined range (invention 1 0), the pressure in the recess portion of the imprint mold to the flatness becomes 100nm or less It is preferable to adjust (Invention 11 ).

According to the present invention, it is possible to provide a method for manufacturing a replica mold having a fine uneven pattern having excellent position accuracy and an imprinting apparatus.

FIG. 1 is a flowchart showing a method for manufacturing a replica mold according to an embodiment of the present invention. FIG. 2 is a process flow chart (No. 1) showing each process of the replica mold manufacturing method according to the embodiment of the present invention on the cut end face. FIG. 3 is a process flow chart (No. 2) showing each process of the replica mold manufacturing method according to the embodiment of the present invention on the cut end face. FIG. 4A is a cut end view showing a schematic configuration of a master mold according to an embodiment of the present invention, and FIG. 4B is a plan view showing a schematic configuration of the master mold. FIG. 5A is a cut end view showing a schematic configuration of a replica molding substrate according to an embodiment of the present invention, and FIG. 5B is a plan view showing a schematic configuration of the replica molding substrate. .. FIG. 6 is a graph showing the correlation between the curvature of the first surface (thin plate portion) of the master mold and replica mold substrates and the pressure in the recessed portion according to the embodiment of the present invention. FIG. 7 is a schematic configuration diagram showing a configuration of an imprinting apparatus according to an embodiment of the present invention.

Embodiments of the present invention will be described with reference to the drawings.
[Manufacturing method of replica mold]
FIG. 1 is a flowchart showing a replica mold manufacturing method according to the present embodiment, and FIGS. 2 and 3 are process flow diagrams showing each process of the replica mold manufacturing method according to the present embodiment on a cut end face. Yes, FIG. 4 is a cut end view (FIG. 4 (A)) and a plan view (FIG. 4 (B)) showing a schematic configuration of the master mold in the present embodiment, and FIG. 5 is a replica mold in the present embodiment. It is a cut end view (FIG. 5 (A)) and a plan view (FIG. 5 (B)) which show the schematic structure of the substrate.

[Substrate preparation process for master mold / replica mold (S01)]
First, a master mold 10 including a base portion 11 having a first surface 11A and a second surface 11B facing the first surface 11A and a fine uneven pattern 13 formed in a pattern region 12 set on the first surface 11A of the base portion 11. (See FIGS. 4A and 4B), the base portion 21 having the first surface 21A and the second surface 21B facing the first surface 21A, and the base portion 21 formed at a substantially central portion in a plan view on the second surface 21B side. A replica molding substrate 20 (see FIGS. 5A and 5B) including the recessed portion 24 is prepared (S01).

The material constituting the base 11 of the master mold 10 is not particularly limited, and is generally used as a base material for imprint molding. For example, the base 11 is a glass such as a substrate generally used in manufacturing an imprint mold (for example, quartz glass, soda glass, fluorite, calcium fluoride substrate, magnesium fluoride substrate, acrylic glass, etc.). Resin substrates such as substrates, polycarbonate substrates, polypropylene substrates, polyethylene substrates, transparent substrates such as laminated substrates made by laminating two or more substrates arbitrarily selected from these; nickel substrates, titanium substrates, aluminum substrates, etc. It may be composed of a metal substrate; a semiconductor substrate such as a silicon substrate or a gallium nitride substrate).

The thickness T ₁₁ of the base 11 of the master mold 10 can be appropriately set in the range of, for example, about 300 μm to 10 mm in consideration of strength, handling suitability, and the like. In the present embodiment, "transparent" means that the transmittance of light having a wavelength of 300 to 450 nm is 85% or more, preferably 90% or more, and particularly preferably 95% or more.

The size of the base 11 of the master mold 10 (the size in a plan view) is not particularly limited, but when the base 11 is made of quartz glass, for example, the size of the base 11 is 152 mm × 152 mm. Degree.

The plan view shape of the base 11 of the master mold 10 is not particularly limited, and examples thereof include a substantially rectangular shape and a substantially circular shape. When the master mold 10 is made of quartz glass, which is generally used for optical imprinting, the base portion 11 usually has a substantially rectangular shape in a plan view.

The shape, dimensions, and the like of the fine concavo-convex pattern 13 formed in the pattern region 12 set on the first surface 11A side of the base 11 of the master mold 10 are the replica mold 1 manufactured in the present embodiment (FIG. 3 (FIG. 3). B) It can be appropriately set according to the shape, dimensions, etc. required in). For example, the shape of the fine concavo-convex pattern 13 includes a line-and-space shape, a pillar shape, a hole shape, a grid shape, and the like. Further, the size of the fine concavo-convex pattern 13 is, for example, about 10 to 200 nm, and particularly preferably about 10 to 40 nm because the effect of the present embodiment is remarkably exhibited.

On the second surface 11B side of the base portion 11 of the master mold 10 in the present embodiment, a recessed portion 14 facing the fine uneven pattern 13 formed on the first surface 11A side is formed, and the recessed portion 14 is formed. The thin plate portion 15 is configured as the base portion 11 in the portion. Since the recessed portion 14 is formed, the first surface 11A (thin plate portion 15) on which the fine uneven pattern 13 is formed can be easily curved.

The shape of the recessed portion 14 in a plan view from the second surface 11B side of the master mold 10 is preferably substantially circular. Since the shape of the recessed portion 14 in a plan view is substantially circular, the first surface 11A (thin plate portion 15) on which the fine uneven pattern 13 is formed can be effectively curved.

The recessed portion 14 of the master mold 10 is located on the second surface 11B side so that the region in which the outer shape of the recessed portion 14 is projected onto the first surface 11A side physically includes the outer shape of the pattern region 12 in a plan view. It is formed.

The depth T ₁₄ of the recessed portion 14 of the master mold 10 is not particularly limited, but the thickness T ₁₅ of the thin plate portion 15 (the pattern region 12 in which the fine uneven pattern 13 is formed) is set to the thin plate portion 15. Is set so that the thickness can be made so that it can be effectively curved. The thickness T ₁₅ of the thin plate portion 15 is not particularly limited as long as the thin plate portion 15 can be curved in a convex shape, and is usually about 300 to 2000 μm.

The material constituting the base 21 of the replica molding substrate 20 is not particularly limited, and is generally used as a base material for imprint molding. For example, the base 21 is a glass such as a substrate generally used in manufacturing an imprint mold (for example, quartz glass, soda glass, fluorite, calcium fluoride substrate, magnesium fluoride substrate, acrylic glass, etc.). Resin substrates such as substrates, polycarbonate substrates, polypropylene substrates, polyethylene substrates, transparent substrates such as laminated substrates made by laminating two or more substrates arbitrarily selected from these; nickel substrates, titanium substrates, aluminum substrates, etc. It may be composed of a metal substrate; a semiconductor substrate such as a silicon substrate or a gallium nitride substrate).

The thickness T ₂₁ of the base 21 of the replica molding substrate 20 can be appropriately set in the range of, for example, about 300 μm to 10 mm in consideration of strength, handling suitability, and the like. The size of the base 21 of the replica molding substrate 20 (the size in a plan view) is not particularly limited, but when the base 21 is made of quartz glass, for example, the size of the base 21 is 152 mm. It is about × 152 mm.

The plan view shape of the base 21 of the replica molding substrate 20 is not particularly limited, and examples thereof include a substantially rectangular shape and a substantially circular shape. When the replica mold 1 (see FIG. 3B) manufactured in the present embodiment is made of quartz glass generally used for optical imprinting, the plan view shape of the base 21 is usually substantially rectangular. Is.

In the present embodiment, the hard mask layer 23 is formed on the first surface 21A side of the base portion 21 of the replica molding substrate 20. Examples of the material constituting the hard mask layer 23 include metals such as chromium, titanium, tantalum, silicon and aluminum; chromium-based compounds such as chromium nitride, chromium oxide and chromium oxynitride, tantalum oxide, tantalum oxynitride and tantalum oxide. Tantalum compounds such as tantalum carbonate and tantalum boride oxynitride, titanium nitride, silicon nitride, silicon oxynitride and the like can be used alone or in combination of two or more arbitrarily selected.

The hard mask layer 23 is patterned in a step described later (see FIG. 3A) and is used as a mask when etching the replica molding substrate 20. Therefore, it is preferable to select the constituent material of the hard mask layer 23 in consideration of the etching selection ratio and the like according to the type of the replica molding substrate 20. For example, when the replica molding substrate 20 is a quartz glass substrate, a metal chrome film or the like can be preferably selected as the hard mask layer 23.

The thickness T ₂₃ of the hard mask layer 23 takes into consideration the etching selection ratio according to the type of the replica molding substrate 20, the aspect ratio of the fine uneven pattern 2 in the manufactured replica mold 1 (see FIG. 3B), and the like. And set appropriately. For example, when the replica molding substrate 20 is a quartz glass substrate and the hard mask layer 23 is a metallic chromium film, the thickness T ₂₃ of the hard mask layer ₂₃ is about 3 to 20 nm.

The method for forming the hard mask layer 23 on the first surface 21A of the base 21 of the replica molding substrate 20 is not particularly limited, and examples thereof include known film forming methods such as sputtering, PVD, and CVD. Be done.

On the second surface 21B side of the base 21 of the replica molding substrate 20 in the present embodiment, a region (pattern formed region) in which a fine uneven pattern 2 (see FIG. 3B) is formed on the first surface 21A side. A recessed portion 24 facing the 22 is formed, and a thin plate portion 25 is formed as a base portion 21 in the portion where the recessed portion 24 is formed. Since the recessed portion 24 is formed, the pattern formed region 22 (thin plate portion 25) on which the fine uneven pattern 2 is formed can be easily curved.

The shape of the recessed portion 24 in a plan view from the second surface 21B side of the replica molding substrate 20 is preferably substantially circular. Since the shape of the recessed portion 24 in a plan view is substantially circular, the pattern formed region 22 can be curved substantially uniformly.

The recessed portion 24 of the replica molding substrate 20 has a second portion such that the region obtained by projecting the outer shape of the recessed portion 24 toward the first surface 21A physically includes the outer shape of the pattern formed region 22 in a plan view. It is formed on the surface 21B side.

The depth T ₂₄ of the recessed portion 24 of the replica molding substrate 20 is not particularly limited. The depth T ₂₄ of the recessed portion ₂₄ is set so that the thickness T ₂₅ of the thin plate portion 25 can be made such a thickness that the thin plate portion 25 can be effectively curved. The thickness T ₂₅ of the thin plate portion 25 is not particularly limited as long as the thin plate portion 25 can be curved in a convex shape, and is usually about 300 to 2000 μm.

[Imprint processing steps (S02 to S05)]
Next, the first surface 11A side (thin plate portion 15) of the master mold 10 is curved convexly, and the first surface 21A side (thin plate portion 25) of the replica molding substrate 20 is curved convexly (S02, (See FIG. 2A), in that state, the imprint resin 30 coated on the first surface 21A (hard mask layer 23) of the replica molding substrate 20 is formed on the first surface 11A of the master mold 10. The fine uneven pattern 13 is brought into contact with each other (see S03, FIG. 2B).

In FIG. 2A, the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are substantially the same. , The first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are curved in a convex shape. As a method of convexly bending the first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20, for example, in the recessed portion 14 of the master mold 10 and Examples thereof include a method of pressurizing each of the recesses 24 of the replica molding substrate 20. At this time, by separately adjusting the pressure in the recessed portion 14 of the master mold 10 and the pressure in the recessed portion 24 of the replica molding substrate 20, the first surface 11A (thin plate portion 15) of the master mold 10 is formed. The curvature and the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 can be made substantially the same. In the present embodiment, the ratio of the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 to the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 is 1: 0.87. It is preferably about 1.13, and more preferably about 1: 0.93 to 1.07.

Even if the same pressure is applied to the recessed portion 14 of the master mold 10 and the recessed portion 24 of the replica molding substrate 20, the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the replica molding substrate 20 The curvature with the first surface 21A (thin plate portion 25) may be different from each other. If the constituent materials of the master mold 10 and the replica molding substrate 20 are different, the curvatures of the two will naturally be different, but even if the constituent materials of both are the same, the dimensions of the recesses 14 and 24 of both are different. The curvatures of the two will be different due to the difference between the two.

Therefore, in the present embodiment, the correlation between the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the pressure in the recessed portion 14 and the first surface 21A (thin plate portion) of the replica molding substrate 20 The correlation between the curvature of 25) and the pressure in the recess 24 is obtained, and based on these correlations, the pressures in the recesses 14 and 24 are set so that the curvatures of the two are substantially the same. adjust.

The correlation between the curvature r of the first surface 11A (thin plate portion 15) of the master mold 10 and the pressure p in the recess portion 14 is based on the assumption that the thin plate portion 15 of the master mold 10 is a peripheral fixed disk. It can be obtained by the following mathematical formulas (1) and (2) expressing the relationship between the radius R of 14 and the maximum amount of deflection W _MAX .

In the above formulas (1) to (2), p is "pressure in the recess 14 (Pa)", R is "radius of recess 14 (mm)", and t is "thickness (mm) of thin plate 15". , V represents "poison ratio", E represents "Young's modulus (Pa)", and D represents "deflection rigidity".

Then, the maximum amount of deflection W _MAX is calculated by fluctuating the pressure in the recessed portion 14 by the above mathematical formulas (1) and (2), and the pressure p (Pa) in the recessed portion 14 and the curvature r of the thin plate portion 15 are obtained. A graph (see FIG. 6) showing the correlation between the above is created.

Similarly, the correlation between the curvature r of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 and the pressure p in the recessed portion 24 is around the thin plate portion 25 of the replica molding substrate 20. Assuming a fixed disk, it can be obtained by the above mathematical formulas (1) and (2) expressing the relationship between the radius R of the recessed portion 24 and the maximum amount of deflection W _MAX . Then, by varying the pressure in the recess 24, the maximum amount of deflection W _MAX is calculated by the above mathematical formulas (1) and (2), and the pressure p (Pa) in the recess 24 and the curvature r of the thin plate portion 25 are obtained. A graph (see FIG. 6) showing the correlation between the above is created.

The curvature r of the thin plate portions 15 and 25 is similar to the shape of the convexly curved thin plate portions 15 and 25 being an arc shape, and the two points at both ends of the peripheral fixed disc and the maximum deflection amount W _MAX. The radius of the circle passing through the three points with one point in the central portion can be obtained by calculating from the equation of the circle.

The maximum amount of deflection W _MAX calculated as described above is when the recessed portion 14 (24) having a radius R is formed on the second surface 11B (21B) of the master mold 10 (replica molding substrate 20). This is the maximum value of the amount of deflection (deformation amount) of the thin plate portion 15 (25) when a predetermined pressure is applied to the recessed portion 14 (24). Specifically, a predetermined pressure is applied to the recessed portion 14 (24) in a state where the first surface 11A (21A) (thin plate portion 15 (25)) of the master mold 10 (replica molding substrate 20) is a flat surface. When applied, the first surface 11A (21A) (thin plate portion 15 (25)) is curved in a convex shape. Then, the maximum amount of deflection W _MAX is calculated as the maximum amount of change (the maximum amount of change in the thickness direction of the base 11 (21)) from the flat surface before pressurization to the state of being curved in a convex shape.

From the correlation thus obtained (see FIG. 6), the pressure p14 in the recessed portion 14 in which the first surface 11A (thin plate portion 15) of the master mold 10 has a predetermined curvature r is obtained, and the replica molding substrate is obtained. In the recessed portion 24, the curvature r of the first surface 21A (thin plate portion 25) of 20 is substantially the same as the curvature r of the first surface 11A (thin plate portion 15) of the master mold 10 obtained as described above. Obtain the pressure p24. Then, by adjusting (pressurizing) the pressure in each of the recessed portions 14 and 24 to the pressure obtained in this way, the first surfaces of the two surfaces are substantially the same in curvature r. 11A, 21A (thin plate portions 15, 25) can be curved in a convex shape.

The first surfaces 11A and 21A (thin plate portions 15 and 25) curved in a convex shape as described above are brought into contact with each other via the imprint resin 30, and then the curved first surfaces 11A and 21A (thin plate portions 15 and 25) are brought into contact with each other. By gradually returning 15 and 25) to the original flat surface (flat surface before being curved in a convex shape), the first surfaces 11A and 21A (thin plate portions 15 and 25) are substantially parallel to each other. By developing the imprint resin 30 between the surfaces 11A and 21A (thin plates 15 and 25) and curing the imprint resin 30, the fine uneven pattern 13 of the master mold 10 is transferred to the imprint resin 30 (FIG. 2 (C)).

To return the first surface 11A of the master mold 10 and the first surface 21A of the replica molding substrate 20 to the original flat surface, the pressure in the recess 14 of the master mold 10 and in the recess 24 of the replica molding substrate 20 To adjust each. Specifically, the pressure inside the recesses 14 and 24 of both is reduced. At this time, as the ratio of changes in pressure (pressure change ratio) in the recesses 14 and 24 of both, the damping rate (pressure damping rate) per unit time of the pressure is substantially the same. As a result, in the process of returning the first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 to the original flat surface, the curvatures of both are substantially the same. Can be maintained at. As a result, the fine uneven pattern 13 of the master mold 10 can be transferred with excellent position accuracy. The ratio of the pressure damping rate in the recessed portion 14 of the master mold 10 to the pressure damping rate in the recessed portion 24 of the replica molding substrate 20 is preferably in the range of 1: 0.88 to 1.15, more preferably. Reduces the pressure inside the recesses 14 and 24 of both while maintaining the range of 1: 0.93 to 1.08.

The master mold 10 is separated from the cured imprint resin 30 (see FIG. 2D). As a result, the resist pattern 31 formed by transferring the fine uneven pattern 13 of the master mold 10 can be formed on the first surface 21A (hard mask layer 23) of the replica molding substrate 20.

[Hard mask pattern forming step (S06)]
Using the resist pattern 31 as a mask, for example, the hard mask layer 23 formed on the first surface 21A of the replica molding substrate 20 is etched by a dry etching process using a chlorine-based (Cl ₂ + O ₂ ) etching gas. Then, the hard mask pattern 26 is formed. After that, the resist pattern 31 is removed by wet etching or the like (see FIG. 3A).

[Etching process of replica molding substrate (S07)]
Finally, the replica molding substrate 20 is subjected to a dry etching process using the hard mask pattern 26 as a mask to form a fine uneven pattern 2 on the first surface 21A side, and the hard mask pattern 26 is removed. As a result, the replica mold 1 is manufactured (see FIG. 3B).

In the replica mold manufacturing method according to the present embodiment, the resist pattern 31 can be formed on the first surface 21A of the replica mold substrate 20 with excellent position accuracy by the imprint process using the master mold 10. Therefore, the hard mask pattern 26 formed by etching using the hard mask pattern 26 as a mask and the fine uneven pattern 2 formed by etching using the hard mask pattern 26 as a mask can also be formed with excellent position accuracy. Therefore, according to the replica mold manufacturing method according to the present embodiment, the replica mold 1 having the fine concavo-convex pattern 2 with excellent position accuracy can be manufactured.

[Imprint device]
Next, an imprint apparatus capable of performing the imprint processing (S02 to S05) in the replica mold manufacturing method described above will be described. FIG. 7 is a schematic configuration diagram showing an imprint device according to the present embodiment.

As shown in FIG. 7, in the imprinting apparatus 100 of the present embodiment, the fine unevenness pattern 13 is opposed to the substrate stage 101 holding the replica molding substrate 20 and the first surface 21A of the replica molding substrate 20. A mold holder 102 that holds the master mold 10 is provided, a light source 103 that irradiates the imprint resin 30 with light via the master mold 10, and a control system 110 that controls the imprint device 100. The control system 110 includes a control unit 111, a first pressure adjusting unit 112, and a second pressure adjusting unit 113, and the first pressure adjusting unit 112 is connected to the mold holder 102 through the first pipe 104 and is connected to the mold holder 102. The 2 pressure adjusting unit 113 is connected to the substrate stage 101 through the second pipe 105.

By holding the master mold 10 in the mold holder 102, the first space 106 is formed by the recessed portion 14 of the master mold 10 and the mold holder 102. The first pipe 104 is provided so as to lead to the first space 106. By holding the replica molding substrate 20 on the substrate stage 101, the replica molding substrate 20 and the substrate stage 101 form a second space 107. The second pipe 105 is provided so as to lead to the second space 107.

The control unit 111 controls the first pressure adjusting unit 112 based on the correlation (see FIG. 6) between the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the pressure in the recessed portion 14. Specifically, in the first pressure adjusting unit 112, the first surface 11A side (thin plate portion 15) of the master mold 10 is curved convexly with a predetermined curvature according to an instruction from the control unit 111 based on the correlation. Compressed air or the like is supplied into the first space 106 to pressurize the space 106. Further, the first pressure adjusting unit 112 decompresses the inside of the first space 106 at a predetermined pressure damping rate so as to return the convexly curved first surface 11A (thin plate portion 15) to the original flat surface. ..

Further, the control unit 111 sets the second pressure adjusting unit 113 based on the correlation (see FIG. 6) between the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 and the pressure in the recessed portion 24. Control. Specifically, in the second pressure adjusting unit 113, the first surface 21A side (thin plate portion 25) of the replica molding substrate 20 is convex with a predetermined curvature according to an instruction from the control unit 111 based on the correlation. Compressed air or the like is supplied into the second space 107 to pressurize the space 107 so as to be curved. Further, the second pressure adjusting unit 113 depressurizes the inside of the second space 107 at a predetermined pressure damping rate so as to return the convexly curved first surface 21A (thin plate portion 25) to the original flat surface. ..

The first pressure adjusting unit 112 and the second pressure adjusting unit 113 provide, for example, a function of supplying compressed air or the like to the first space 106 and the second space 107, and the first space 106 and the second space 107, respectively. It may be composed of a pump having a function of creating a vacuum, a switching valve for switching the function of the pump, and the like.

In the imprint device 100, the control unit 111 adjusts the pressure by the first pressure adjusting unit 112 so that the first surface 11A side (thin plate portion 25) of the master mold 10 is convexly curved with a predetermined curvature. Control. Specifically, the first pressure adjusting unit 112 adjusts the pressure in the first space 106 to a predetermined value by supplying compressed air into the first space 106 (the recessed portion 14 of the master mold 10). ..

Similarly, the control unit 111 controls the pressure adjustment by the second pressure adjusting unit 113 so that the first surface 21A side (thin plate portion 25) of the replica molding substrate 20 is curved convexly with a predetermined curvature. .. Specifically, the second pressure adjusting unit 113 supplies compressed air into the second space 107 (the recessed portion 24 of the replica molding substrate 20) to bring the pressure in the second space 107 to a predetermined value. adjust.

At this time, according to the instruction from the control unit 111, in the second pressure adjusting unit 113, the curvature of the first surface 21A side (thin plate portion 25) of the replica molding substrate 20 is changed by the first pressure adjusting unit 112 in the first space 106. The amount of compressed air supplied into the second space 107 is set to be the same as the curvature when the inside is adjusted to a predetermined pressure (the curvature of the first surface 11A side (thin plate portion 15) of the master mold 10). Control and adjust the pressure in the second space 107. As a result, the curvatures of the convexly curved first surfaces 11A and 21A (thin plate portions 15 and 25) can be made substantially the same.

After the first surface 11A (thin plate portion 15) of the master mold 10 comes into contact with the imprint resin 30 coated on the first surface 21A (hard mask layer 23) of the replica molding substrate 20, the instruction from the control unit 111 As a result, the first pressure adjusting unit 112 and the second pressure adjusting unit 113 depressurize the inside of the first space 106 and the inside of the second space 107.

In the present embodiment, both are convex so that the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are substantially the same. Since it is curved in a shape, the pressure in the first space 106 and the pressure in the second space 107 when it is curved in a convex shape may be different. Therefore, when the depressurizing speed (decompression value per unit time) is the same and the pressure in the first space 106 and the inside of the second space 107 is reduced, the first surface 11A (thin plate portion 15) of the master mold 10 and the replica molding substrate 20 are used. There is a possibility that the timing of returning to the original flat surface with the first surface 21A (thin plate portion 25) of the above may be different. However, in the imprinting apparatus 100 of the present embodiment, the first surfaces 11A and 21A (thin plates 15 and 25) of the master mold 10 and the replica molding substrate 20 are returned to the original flat surface (flat surface before pressurization). When returning, the damping rate of the pressure in the first space 106 per unit time (pressure damping rate) and the damping rate of the pressure in the second space 107 per unit time (pressure damping rate) are substantially the same. The pressure in the first space 106 and the second space 107 is reduced so as to be. In this way, the pressure attenuation rate in the first space 106 and the pressure attenuation rate in the second space 107 are made substantially the same, and the pressure in the first space 106 and the pressure in the second space 107 are reduced to master. The first surface 11A (thin plate portion 15) of the mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 return to the original flat surface substantially at the same time.

According to the imprinting apparatus 100 in the present embodiment, the first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 during the imprint processing (transfer). The first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are convex so that their respective curvatures are substantially the same. The first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 can be returned to the original flat surface substantially at the same time. Can be done. Therefore, the fine uneven pattern 2 can be formed on the first surface 21A side of the replica molding substrate 20 with excellent position accuracy.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

The master mold 10 and the replica molding substrate 20 in the above embodiment may both have a mesa structure on the first surfaces 11A and 21A, or one of them may have a mesa structure. Good. When the master mold 10 has a mesa structure, a fine uneven pattern 13 is formed on the upper surface of the mesa structure, and when the replica molding substrate 20 has a mesa structure, the upper surface of the mesa structure is the pattern formed region 22. Become.

In the above embodiment, the state in which the master mold 10 and the replica molding substrate 20 are set in the mold holder 102 and the substrate stage 101 is set as the initial state, and the inside of the first space 106 and the second space 107 is pressurized from the initial state. Although the pressure is reduced to the initial state, the present invention is not limited to such an embodiment. For example, by pressurizing or depressurizing the recesses 14, 24 (first space 106 and second space 107) of the master mold 10 and the replica molding substrate 20, the first surface 11A of the master mold 10 and the replica molding The initial state is a state in which the flatness of the first surface 21A of the substrate 20 is within a predetermined range (for example, about 100 nm or less), and the first space 106 and the second space 107 are pressurized from the initial state. The surfaces 11A and 21A (thin plate portions 15 and 25) may be curved in a convex shape. In this case, after the first surfaces 11A and 21A (thin plate portions 15 and 25) of the master mold 10 and the replica molding substrate 20 are brought into contact with each other, the flatness of the initial state (first surfaces 11A and 21A is within a predetermined range. The pressure inside the first space 106 and the second space 107 may be reduced at substantially the same pressure attenuation rate until the pressure is reduced to (for example, about 100 nm or less).

Hereinafter, the present invention will be described in more detail with reference to Examples and the like, but the present invention is not limited to the following Examples and the like.

[Example 1]
A master mold 10 having a base portion 11 made of a quartz glass substrate (152 mm × 152 mm × 6.35 mm) having the configuration shown in FIG. 4 and a quartz glass substrate (152 mm × 152 mm × 6.35 mm) having the configuration shown in FIG. A replica molding substrate 20 having a base 21 made of)) was prepared. As the master mold 10, a master mold 10 in which a hole-shaped fine uneven pattern 13 having a size of 40 nm was formed in the pattern region 12 set on the first surface 11A was prepared. Further, as the master mold 10 and the replica molding substrate 20, those having recesses 14 and 24 having a diameter of 65 mm and a depth of 5.35 mm were formed at substantially the center of the second surfaces 11B and 21B. Further, as the replica molding substrate 20, a substrate in which a hard mask layer 23 (thickness: 5 nm) made of metallic chromium is formed on the first surface 21A was used.

The master mold 10 was held by the mold holder 102 of the imprinting apparatus 100 having the configuration shown in FIG. 7, and the replica molding board 20 was held by the board stage 101. Then, the first pressure adjusting unit 112 applies a pressure of 4000 Pa into the recessed portion 14 of the master mold 10, and the second pressure adjusting unit 113 applies a pressure of 3400 Pa into the recessed portion 24 of the replica molding substrate 20. , The first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 were curved in a convex shape. The curvatures of the first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are measured by the laser displacement meter (LK-) attached to the imprint device 100. When measured using G5000 (manufactured by KEYENCE CORPORATION), the former curvature r was 0.0214 and the latter curvature r was 0.0212.

Next, the imprint resin 30 applied on the first surface 21A (hard mask layer 23) of the replica molding substrate 20 in which the first surface 21A (thin plate portion 25) is curved in a convex shape, and the master mold 10 The first surface 11A (thin plate portion 15) curved in a convex shape is brought into contact with the pressure damping rate in the first space 106 and the pressure damping rate in the second space 107 is set to 1: 0.94 to 1. While maintaining within the range of 07, the first surfaces 11A and 21A (thin plate portions 15 and 25) of the master mold 10 and the replica molding substrate 20 are returned to the original flat surfaces, and between the first surfaces 11A and 21A. The imprint resin 30 was developed in the above. After the imprint resin 30 was cured, the master mold 10 was separated to form a resist pattern 31 on the first surface 21A (hard mask layer 23) of the replica molding substrate 20.

The position accuracy of the resist pattern 31 formed on the first surface 21A (hard mask layer 23) of the replica molding substrate 20 was measured and evaluated using a coordinate measuring device (IPRO Series, manufactured by KLA Tencor Co., Ltd.). As a result, the position accuracy (3σ) was 2.25 nm in the X direction and 2.88 nm in the Y direction.

[Comparative Example 1]
Example 1 except that the pressure applied in the first space 106 by the first pressure adjusting unit 112 and the pressure applied in the second space 107 by the second pressure adjusting unit 113 are both set to 4000 Pa. The imprint process was performed in the same manner as in the above manner to form the resist pattern 31 on the first surface 21A (hard mask layer 23) of the replica molding substrate 20. The curvatures of the first surface 11A (thin plate portion 15) of the master mold 10 and the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are measured by the laser displacement meter (LK-) attached to the imprint device 100. When measured using G5000 (manufactured by KEYENCE CORPORATION), the curvature of the former was 0.0214 and the curvature of the latter was 0.0249.

The position accuracy of the resist pattern 31 formed on the first surface 21A (hard mask layer 23) of the replica molding substrate 20 was measured and evaluated using a coordinate measuring device (IPRO Series, manufactured by KLA Tencor Co., Ltd.). As a result, the position accuracy (3σ) was 2.61 nm in the X direction and 3.32 nm in the Y direction.

From the above results, the curvature of the first surface 11A (thin plate portion 15) of the master mold 10 and the curvature of the first surface 21A (thin plate portion 25) of the replica molding substrate 20 are substantially the same. The pressure attenuation rate when the first surfaces 11A and 21A (thin plate portions 15 and 25) are curved in a convex shape and the first surfaces 11A and 21A (thin plate portions 15 and 25) are returned to the original flat surface is substantially the same. It was clarified that the resist pattern 31 can be formed with excellent position accuracy. Therefore, it is considered that the replica mold 1 having the fine concavo-convex pattern 2 having excellent position accuracy can be manufactured through the etching process using the resist pattern 31 having excellent position accuracy as a mask.

The present invention is useful as a method for manufacturing a replica mold used in a nanoimprint step for forming a fine uneven pattern on a semiconductor substrate or the like in the manufacturing process of a semiconductor device.

1 ... Replica mold 2 ... Fine concavo-convex pattern 10 ... Master mold 20 ... Replica mold substrate 11, 21 ... Base 12 ... Pattern area 13 ... Fine concavo-convex pattern 14, 24 ... Recessed part 15, 25 ... Thin plate part 100 ... Imprint device 101 ... Substrate stage 102 ... Mold holder 111 ... Control unit 112 ... First pressure adjustment unit 113 ... Second pressure adjustment unit

Claims (11)

It has a base portion having a first surface and a second surface facing the first surface, and a fine uneven pattern is formed in a pattern region set on the first surface side of the base portion, and the second surface of the base portion is formed. It is a method of manufacturing a replica mold using a master mold in which a recess is formed substantially in the center of a plan view on the surface side.
A replica molding substrate having a base having a first surface and a second surface facing the first surface, and a recess formed in a substantially center of a plan view on the second surface side of the base, and the master mold. The first step to prepare and
By adjusting the pressure in the recessed portion of the replica molding substrate, the first surface side of the replica molding substrate is convexly curved, and by adjusting the pressure in the recessed portion of the master mold, the pressure is adjusted. In a state where at least the pattern region on the first surface side of the master mold is convexly curved, the first surface of the replica molding substrate and the first surface of the master mold are covered between them. The second step of contacting with the transfer material intervening,
The pressure in the recessed portion of the replica molding substrate and the pressure in the recessed portion of the master mold are adjusted to a predetermined pressure to transfer the fine uneven pattern to the material to be transferred. Third step and
It has a fourth step of separating the material to be transferred and the master mold to which the fine uneven pattern has been transferred.
In the second step, the curvature of the first surface of the replica molding substrate curved in a convex shape and the curvature of the pattern region of the first surface of the master mold curved in a convex shape are substantially the same. The pressures in the recessed portion of the replica molding substrate and in the recessed portion of the master mold are adjusted so as to be.
In the third step, the inside of the recessed portion of the replica molding substrate and the said portion of the replica molding substrate so that the pressure change ratios in the recessed portion of the replica molding substrate and in the recessed portion of the master mold are substantially the same. A method for manufacturing a replica mold, which comprises adjusting the respective pressures in the recessed portion of the master mold. In the second step, the correlation between the pressure in the recessed portion of the replica molding substrate and the curvature of the first surface, and the correlation between the pressure in the recessed portion of the master mold and the curvature of the first surface. The replica mold according to claim 1, wherein the pressures in the recessed portion of the replica molding substrate and in the recessed portion of the master mold are adjusted based on the correlation between the two. Manufacturing method. The method for manufacturing a replica mold according to claim 1 or 2, wherein the replica molding substrate includes a hard mask layer provided on the first surface. In the third step, the respective pressures in the recessed portion of the master mold and the pressures in the recessed portion of the replica molding substrate are adjusted until they become the pressures before the adjustment in the second step. The method for manufacturing a replica mold according to any one of claims 1 to 3, wherein the replica mold is manufactured. The flatness of the pattern region on the first surface of the master mold is determined in advance.
In the third step, the pressure in the recessed portion of the master mold is adjusted until the flatness falls within a predetermined range, and the pressure in the recessed portion of the replica molding substrate is before the adjustment in the second step. The method for manufacturing a replica mold according to any one of claims 1 to 3, wherein the pressure in the recessed portion of the replica molding substrate is adjusted until the pressure reaches the above. The method for manufacturing a replica mold according to claim 5, wherein the pressure in the recessed portion of the master mold is adjusted until the flatness becomes 100 nm or less. A base having a first surface and a second surface facing the first surface, a fine concavo-convex pattern formed in a pattern region set on the first surface side of the base, and a fine uneven pattern formed on the second surface side of the base. Using an imprint mold provided with a recessed portion, the first surface of the substrate to be transferred, which has a first surface and a second surface facing the first surface and has a recessed portion formed on the second surface side. , An imprint device for transferring the fine uneven pattern of the imprint mold.
A stage that holds the transfer substrate and
A mold holder that holds the imprint mold so that the fine concavo-convex pattern faces the first surface of the transfer substrate.
A first pressure adjusting portion capable of bending the first surface side of the imprint mold by adjusting the pressure in the recessed portion of the imprint mold.
A second pressure adjusting portion capable of bending the first surface side of the transferred substrate by adjusting the pressure in the recessed portion of the transferred substrate.
A control unit for controlling the pressure adjustment by the first pressure adjusting unit and the second pressure adjusting unit is provided.
The control unit
The curvature of the first surface of the imprint mold and the convex curvature of the imprint mold before the first surface of the imprint mold and the first surface of the substrate to be transferred come into contact with each other. The pressure adjustment by the first pressure adjusting unit and the second pressure adjusting unit is controlled so that the curvature of the first surface of the substrate to be transferred is substantially the same.
After the first surface of the convexly curved imprint mold and the first surface of the convexly curved substrate to be transferred come into contact with each other via a material to be transferred located between them, the inn The pressure is adjusted by the first pressure adjusting unit and the second pressure adjusting unit so that the pressure change ratios in the recessed portion of the print mold and in the recessed portion of the substrate to be transferred are substantially the same. An imprinting device characterized by being controlled. The control unit controls the pressure adjustment by the first pressure adjusting unit based on the correlation between the pressure in the recessed portion of the imprint mold and the curvature of the first surface, and the recessed portion of the transferred substrate. The imprint device according to claim 7, wherein the pressure adjustment by the second pressure adjusting unit is controlled based on the correlation between the pressure in the unit and the curvature of the first surface. After the first surface of the convexly curved imprint mold and the first surface of the convexly curved substrate to be transferred come into contact with each other via a material to be transferred located between them, the first surface is described. 1 The pressure adjusting unit is the pressure adjusting unit of the imprint mold until the pressure in the recess of the imprint mold becomes the pressure in the recess before the first surface of the imprint mold is convexly curved. The pressure in the recess is adjusted, and the second pressure adjusting section is the pressure in the recess before the pressure in the recess of the transfer substrate causes the first surface of the transfer substrate to be convexly curved. The imprinting apparatus according to claim 7 or 8 , wherein the pressure in the recessed portion of the transfer substrate is adjusted until the pressure becomes. The first pressure adjusting unit uses a material to be transferred in which the first surface of the imprint mold curved in a convex shape and the first surface of the substrate to be transferred in a convex shape are located between them. After contacting through the imprint mold, the first pressure adjusting unit adjusts the pressure in the recessed portion of the imprint mold until the flatness of the pattern region on the first surface of the imprint mold falls within a predetermined range. The imprinting apparatus according to any one of claims 7 to 9 , wherein the imprinting apparatus is made. Imprint apparatus according to claim 1 0, characterized in that the flatness adjust the pressure in the recess portion of the imprint mold until 100nm or less.

Images