JP6795161B2 - Manufacturing method of substrate with functional film - Google Patents

Description

The present invention relates to a method for manufacturing a substrate with a functional film provided with a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell.

In recent years, film formation technology has been widely used in various fields related to the manufacture of electrical products, including the manufacturing process of lithium batteries, the manufacturing process of panels for solar cells, the manufacturing process of organic EL display panels, the manufacturing process of semiconductors, and the like. .. In the film forming process of such an electric product, the processing temperature is usually high, and high heat resistance is often required for the material used as the film forming substrate.

For this reason, an insulating substrate having heat resistance such as glass, ceramics, and silicate minerals (mica, etc.) may be used as the substrate for film formation. For example, in a lithium battery, a method of forming a plurality of element composites including an electrode layer on a glass film-forming substrate may be adopted (see, for example, Patent Document 1). Further, some organic EL display panels also use a glass film-forming substrate in order to facilitate the handling of the organic resin film in the film-forming process (see, for example, Patent Document 2).

Patent No. 4465578 Japanese Unexamined Patent Publication No. 2016-004112

However, in the conventional method for manufacturing a substrate with a functional film, further thinning of the substrate and improvement in manufacturing efficiency are required, but so far, the demand for improvement in manufacturing efficiency has been sufficiently met. I couldn't say. For example, due to handling restrictions in the manufacturing process, when the film-forming substrate is thin, in most cases a single laminated functional film is formed on each of the single film-forming substrates. is there. On the other hand, when a plurality of laminated functional films for electric products are formed on a relatively large-sized film-forming substrate and then the substrate with the functional film is multi-chamfered, a thick plate is used as the film-forming substrate. Often they were forced to use the same materials.

An object of the present invention is to provide a method for manufacturing a substrate with a functional film, which can achieve both a thinning of a film-forming substrate and an improvement in manufacturing efficiency.

The method for manufacturing a substrate with a functional film according to the present invention is a laminated functional film including a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell (for example, electricity). A substrate with a functional film provided with a laminated functional film for products) is manufactured. Glass is a typical example of the material of the substrate with a functional film, but it is also possible to use an inorganic material (ceramics, silicate mineral, etc.) other than glass. This manufacturing method includes at least the following first to fourth steps.

In the first step, the first film-forming insulating substrate and the second film-forming insulating substrate on which a plurality of laminated functional films are each formed are made to face each other. And place them close to each other. Here, the proximity arrangement means a case where the first insulating substrate for film formation and the second insulating substrate for film formation are directly overlapped with each other, or the first insulating substrate for film formation and the second film-forming insulating substrate are arranged. It is interpreted to include the case where inclusions such as interleaving paper are interposed between the insulating substrates for film formation and indirectly overlapped with each other.

In the second step, the gap between the end faces of the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged close to each other, is sealed with an etching-resistant sealing member. Examples of the etching-resistant sealing member include an etching-resistant sealing agent, an etching-resistant tape, and an etching-resistant film.

In the third step, the first step is to etch only the opposite side of the first insulating substrate for film formation and the second insulating substrate for film formation, which are arranged close to each other, on the side opposite to the surface to be filmed. The film-forming insulating substrate and the second film-forming insulating substrate are made thinner. In this etching process, an etching solution capable of dissolving the first insulating substrate for film formation and the second insulating substrate for film formation is appropriately adopted. When the insulating substrate for film formation is glass, an etching solution containing hydrofluoric acid is used for the single-sided etching treatment.

In the fourth step, the thinned first insulating substrate for film formation and the second insulating substrate for film formation are separated. By performing these first to fourth steps in this order, it is possible to simultaneously reduce the thickness of the film-forming insulating substrate having the plurality of laminated functional films while protecting the plurality of laminated functional films. Therefore, it is possible to manufacture a plurality of substrates with a functional film at a time, and it is also possible to reduce the thickness of the substrate with a functional film. In particular, since it is possible to process two insulating substrates for film formation at the same time, it is easy to improve productivity.

In the fourth step described above, the first insulating substrate for film formation and the second insulating substrate for film formation that are arranged close to each other may be collectively divided by laser processing.

Further, in the first step, it is also possible to interpose a slip sheet between the first film-forming insulating substrate and the second film-forming insulating substrate. The presence of the interleaving paper facilitates the separation of the first film-forming insulating substrate and the second film-forming insulating substrate, and protects the elements and wiring. When the interleaving paper is used, in the fourth step, the first film-forming insulating substrate and the second film-forming insulating substrate may be separated by removing the etching-resistant sealing member. Since some etching-resistant sealing members can be easily peeled off by heating with hot water or the like, this step can be performed by selecting an etching-resistant sealing member in consideration of peelability. It can be easily executed.

After separating the first film-forming insulating substrate and the second film-forming insulating substrate, the thinned first film-forming insulating substrate and the second film-forming insulating substrate are separated. It is preferable to further include a dividing step for dividing. By dividing the thinned insulating substrate for film formation, work efficiency is improved as compared with thinning each of the divided substrates. In addition, the thinner the thickness, the easier it is to divide by laser processing or the like, so that the work efficiency of the division step is also improved.

Further, in the above-mentioned method for manufacturing a substrate with a functional film, it is preferable that the first insulating substrate for film formation and the second insulating substrate for film formation are a composite of elements for a lithium battery. By utilizing the above-mentioned method for manufacturing a substrate with a functional film for manufacturing a lithium battery, it is possible to realize both a thinning of the lithium battery and an improvement in manufacturing efficiency.

According to the present invention, in the manufacture of a substrate with a functional film provided with a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell, the thin film-forming substrate is manufactured. It is possible to achieve both conversion and improvement of manufacturing efficiency.

It is a figure which shows the schematic structure of the film-forming substrate which concerns on one Embodiment of this invention. It is the schematic which shows an example of the state in which two film-forming substrates are overlapped. It is the schematic which shows an example of the state in which two film-forming substrates are overlapped. It is a figure which shows an example of the etching apparatus used for the single-sided etching process for a film-forming substrate. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is a figure which shows an example of the division process with respect to the film-forming substrate. It is the schematic which shows the other example in the state which the two film-forming substrates are superposed. It is a figure which shows another example of the dividing process with respect to the film-forming substrate.

Hereinafter, an embodiment of a method for manufacturing a substrate with a functional film according to the present invention will be described with reference to the drawings. Here, as an example of the method for manufacturing a substrate with a functional film according to the present invention, a method for manufacturing a substrate with a laminated functional film made of an element composite for a lithium battery will be described.

1 (A) to 1 (C) show a schematic configuration of a film-forming glass substrate 10 (corresponding to the substrate with a functional film of the present invention) in the manufacturing process of a lithium battery according to an embodiment of a substrate with a functional film. Is shown. In this embodiment, glass is used as the material of the substrate with a functional film, but in addition to glass, the insulating substrate silicon (Si), silicon dioxide (SiO ₂ ), ceramics, silicate minerals (mammalia, etc.) As long as it is an insulating substrate having heat resistance and can be dissolved by an etching solution containing hydrofluoric acid or the like, it can be appropriately adopted as a film-forming substrate.

A plurality of lithium battery element composites 12 are formed on the film-forming glass substrate 10. In this embodiment, an example is shown in which the lithium battery element composite 12 is arranged in a matrix of 4 rows × 4 columns to form 16 lithium battery composites 12, but the lithium battery element composites The arrangement of 12 is not limited to this.

Each lithium battery element composite 12 includes a positive electrode layer including a current collector layer 122 and a composite oxide layer 124, an electrolyte layer 126, and a negative electrode layer 128 formed on a glass substrate 10 for film formation. There is. The current collector layer 122 is a glass substrate for film formation by a dry film forming method such as a vacuum deposition method, an ion plating method, a CVD method, or sputtering, or a wet film forming method such as an electrolytic plating method or an electroless plating method. Formed on top 10. The composite oxide layer 124 is formed on the current collector layer 122 by sputtering or the like. Then, in the same manner, the electrolyte layer 126 and the negative electrode layer 128 are formed in this order.

When manufacturing the film-forming glass substrate 10 to which the lithium battery element composite 12 is attached, first, as shown in FIGS. 2A and 2B, a plurality of lithium battery element composites 12 are manufactured. Two sheets of film-forming glass 10 on which the film is formed are prepared, and these two film-forming glass substrates 10 are superposed on each other with their surfaces to be film-formed facing each other. When stacking two glass substrates 10 for film formation, there are cases where the two glass substrates 10 are laminated so as to be indirect contact with each other with a slip sheet or the like sandwiched between them, and cases where the two glass substrates 10 for film formation are laminated so as to be in direct contact with each other without interposing the interlacing paper or the like. It is possible to match.

3 (A) to 3 (D) show an example in which the glass substrate 10 for film formation is indirectly overlapped with the interleaving paper 14 sandwiched between them. Here, a high-performance sheet such as an FPD interleaving paper (for example, manufactured by Tokushu Tokai Paper Co., Ltd.) is used as the interleaving paper 14, but ordinary printing paper, film, or the like can also be used. The purpose of using the interleaving paper 14 is to protect wiring and elements, improve the peelability between the glass substrates 10 for film formation, and the like.

As shown in FIG. 3 (B), when the two film-forming glass substrates 10 are stacked with the interleaving paper 14 interposed therebetween, then, as shown in FIG. 3 (C), the two film-forming glass substrates 10 are stacked. The gap between the end faces of the substrate 10 is sealed with the etching resistant sealing member 16. The etching-resistant sealing member 16 preferably has both an adhesive function for adhering two film-forming glass substrates 10 and a sealing agent function (such as a liquid crystal cell sealant). However, an adhesive layer for adhering the two glass substrates 10 for film formation and a sealant may be provided separately.

Simply sealing the gap between the end faces of the two film-forming glass substrates 10 with the etching-resistant sealing member 16 may cause the end faces of the film-forming glass substrate 10 to be etched, which may cause a problem. Conceivable. Therefore, not only the gap between the end faces but also the end faces themselves may be covered with an etching resistant member if necessary. The end face of the film-forming glass substrate 10 can be coated by attaching an etching-resistant tape or film, applying an etching-resistant paint, or the like. An example of an etching resistant film is a film for various electronics manufactured by Sumiron Co., Ltd. (example: EC series). An example of an etching resistant sealant is an adhesive solution manufactured by Denka Corporation (eg, Templock).

Subsequently, as shown in FIG. 3D, only the opposite side of the two glass substrates 10 for film formation, which are overlapped with each other with the interleaving paper 14 sandwiched between them, is etched. The two glass substrates 10 for film formation are thinned.

In this embodiment, the film-forming glass substrate 10 on which the 16 lithium battery element composites 12 are formed is subjected to single-sided etching treatment to have a thickness of about 0.50 to 1.00 mm to 0.03 to 0.10 mm. Make it as thin as possible. Even a glass member can be bent by reducing the thickness to 0.10 mm or less. Therefore, the glass substrate 10 for film formation can be used for products that require flexibility.

In the single-sided etching treatment, as shown in FIG. 4A, the film-forming glass substrate 10 is introduced into the etching apparatus 50 and subjected to the etching treatment with an etching solution containing hydrofluoric acid, hydrochloric acid, or the like. In the etching apparatus 50, while the film-forming glass substrate 10 is conveyed by the conveying roller, the etching solution is brought into contact with one side of the film-forming glass substrate 10 in the etching chamber 52 to perform single-sided etching on the film-forming glass substrate 10. Processing is done.

Since a cleaning chamber for washing away the etching solution adhering to the film-forming glass substrate 10 is provided after the etching chamber 52 in the etching apparatus 50, the etching solution is removed from the film-forming glass substrate 10. In this state, it is discharged from the etching apparatus 50.

As an example of a method of bringing the etching solution into contact with the film-forming glass substrate 10, as shown in FIG. 4A, the etching solution is sprayed on the film-forming glass substrate 10 in each etching chamber 52 of the etching apparatus 50. Spray etching can be mentioned.

Further, instead of the spray etching, as shown in FIG. 4 (B), the overflow type etching chamber 54 may adopt a configuration in which the film forming glass substrate 10 is conveyed while being in contact with the overflowed etching solution. It is possible.

Further, as shown in FIG. 4C, dip-type etching is adopted in which one or more glass substrates 10 for film formation stored in a carrier are immersed in the etching tank 56 in which the etching solution is stored. It is also possible.

In either case, the etching rate increases or decreases depending on the concentration of hydrofluoric acid contained in the etching solution. Therefore, the optimum concentration of hydrofluoric acid is in the range of 1% by weight to 15% by weight depending on the etching amount. It is important to set to. When the film-forming glass substrate 10 passes through the etching apparatus 50, the film-forming glass substrate 10 is subjected to single-sided etching to reduce the thickness.

In the peeling step after the single-sided etching step, as shown in FIGS. 5 (A) to 5 (D), the two thinned glass substrates 10 for film formation are peeled off. First, as shown in FIGS. 5A and 5B, the edge portion of the film-forming glass substrate 10 including the contact portion with the etching-resistant sealing member 16 is separated. The edge portion of the film-forming glass substrate 10 may be separated by, for example, laser cutting by irradiating a laser beam.

When the edge portion of the film-forming glass substrate 10 is separated, the two film-forming glass substrates 10 and the interleaving paper 14 are separated as shown in FIGS. 5 (C) and 5 (D). Following the separation of the two film-forming glass substrates 10 and the interleaving paper 14, a division step of dividing the thinned film-forming glass substrate 10 is executed.

In the dividing step, as shown in FIGS. 6 (A) and 6 (B), a plurality of lithium battery element composites 12 formed on the film-forming glass substrate 10 are separated into a single piece. The film glass substrate 10 is divided. Since the film-forming glass substrate 10 is thinned, it can be divided by irradiating a laser beam and performing an ablation treatment, a filtration treatment, or the like. In addition to laser processing, it can also be divided by scrub break processing, etching processing, and the like.

Subsequently, with reference to FIGS. 7 and 8, an example in which two glass substrates 10 for film formation are overlapped so as to be in direct contact with each other without interposing the above-mentioned interleaving paper or the like will be described. As shown in FIG. 7 (B), when the two film-forming glass substrates 10 are stacked with the interleaving paper 14 interposed therebetween, then, as shown in FIG. 7 (C), the two film-forming glass substrates 10 are stacked. The gap between the end faces of the substrate 10 is sealed with the etching resistant sealing member 16. Similar to the configuration of FIG. 3 described above, the etching-resistant sealing member 16 has both the function of an adhesive for adhering the two glass substrates 10 for film formation and the function of a sealing agent (sealing agent for liquid crystal cells, etc.). ) Is preferable. However, an adhesive layer for adhering the two glass substrates 10 for film formation and a sealant may be provided separately.

Similar to the above, it is preferable to cover not only the gap between the end faces of the two glass substrates 10 for film formation but also the end faces themselves with an etching resistant member, if necessary. The end face of the film-forming glass substrate 10 can be coated by attaching an etching-resistant tape or film, applying an etching-resistant paint, or the like. An example of an etching resistant film is a film for various electronics manufactured by Sumiron Co., Ltd. (example: EC series). An example of an etching resistant sealant is an adhesive solution manufactured by Denka Corporation (eg, Templock).

Subsequently, as shown in FIG. 8A, only the opposite side of the two glass substrates 10 for film formation, which are overlapped with each other with the interleaving paper 14 sandwiched between them, is etched. The two glass substrates 10 for film formation are thinned. Then, as shown in FIG. 8B, the two thinned glass substrates 10 for film formation are collectively divided by laser processing. By this dividing process, as shown in FIG. 8C, the two glass substrates 10 for film formation are separated from each other at the same time.

The process of collectively dividing the two glass substrates 10 for film formation shown in FIG. 8B by a laser processing process is generally easier to perform when the above-mentioned interleaving paper 14 does not exist. However, when a slip sheet 14 having a characteristic that allows the laser beam to easily pass through (for example, a highly transparent slip sheet) is used, the dividing process as shown in FIG. 8B is performed even in the presence of the slip sheet 14. It is possible to do.

Although not shown, the end face and the vicinity of the end face of the film-forming glass substrate 10 are used in place of the etching-resistant sealing member 16 or together with the etching-resistant sealing member 16 using an etching-resistant tape. May be coated. In this case, a frame-shaped thick plate portion is formed without etching the attachment position of the etching resistant tape, but the lithium battery element composite 12 can be formed without any problem by appropriately cutting the inside of the thick plate portion. The attached glass substrate 10 for film formation can be obtained. Since the frame-shaped thick plate portion contributes to maintaining the firmness of the thinned glass substrate 10 for film formation, there is also an advantage that the glass substrate 10 for film formation can be easily handled. ..

In the above-mentioned method for manufacturing a substrate with a functional film, only an example in which the laminated functional film is a composite of elements for a lithium battery has been described, but an element laminate for an organic EL display other than the element laminate for a lithium battery and the sun Even a laminated functional film such as a battery element laminate can be treated by the same method as described above.

According to the above-described embodiment, it is possible to manufacture a plurality of functional film-equipped substrates at the same time instead of manufacturing a single functional film-equipped substrate, thereby improving the production efficiency of the functional film-equipped substrate. Becomes possible. Moreover, since it is possible to appropriately reduce the thickness of the substrate having a plurality of laminated functional films, it is possible to simultaneously reduce the thickness of the film-forming substrate and improve the manufacturing efficiency.

The description of the embodiments described above should be considered exemplary in all respects and not restrictive. The scope of the present invention is indicated by the scope of claims, not by the above-described embodiment. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the claims.

10-Substrate for film formation 12-Element composite for lithium battery 14-Interlace 16-Etching resistant sealing member

Claims (3)

A method for manufacturing a substrate with a functional film, which comprises a laminated functional film such as an element laminate for a lithium battery, an element laminate for an organic EL display, and an element laminate for a solar cell.
A first insulating substrate for film formation and a second insulating substrate for film formation, which are made of glass on which a plurality of laminated functional films are formed, are arranged close to each other with their surfaces to be filmed facing each other. The first step to do and
A second step of sealing the gap between the end faces of the first film-forming insulating substrate and the second film-forming insulating substrate, which are arranged close to each other, with an etching-resistant sealing member.
The first formation is performed by etching only the opposite side of the first insulating substrate for film formation and the second insulating substrate for film formation, which are arranged close to each other, on the side opposite to the surface to be filmed. A third step of reducing the thickness of the film insulating substrate and the second film insulating substrate to 0.10 mm or less , and
A fourth step of separating the thinned insulating substrate for film formation and the second insulating substrate for film formation,
At least look at including the,
In the fourth step, with a functional film, the first insulating substrate for film formation and the second insulating substrate for film formation, which are arranged close to each other, are collectively separated by laser processing. Substrate manufacturing method. In the second step, the gap between the end faces of the first insulating substrate for film formation and the second insulating substrate for film formation, which are arranged close to each other, is sealed with an etching-resistant sealing member. The end face and the vicinity of the end face of the first insulating substrate for film formation and the second insulating substrate for film formation are coated with an etching resistant tape.
In the third step, the coating position of the etching resistant tape is not etched and becomes a frame-shaped thick plate portion, and
The method for manufacturing a substrate with a functional film according to claim 1, wherein in the fourth step, the inside of the thick plate portion is cut by a laser processing process . The first step, according to claim 1 or 2, is characterized in that an interleaving paper through which a laser beam is passed is interposed between the first insulating substrate for film formation and the insulating substrate for film formation. The method for manufacturing a substrate with a functional film described.

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