JP6801341B2 - Resin composition and resin molded product - Google Patents
Resin composition and resin molded product Download PDFInfo
- Publication number
- JP6801341B2 JP6801341B2 JP2016190271A JP2016190271A JP6801341B2 JP 6801341 B2 JP6801341 B2 JP 6801341B2 JP 2016190271 A JP2016190271 A JP 2016190271A JP 2016190271 A JP2016190271 A JP 2016190271A JP 6801341 B2 JP6801341 B2 JP 6801341B2
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- mass
- resin
- polyolefin
- parts
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- 229920005989 resin Polymers 0.000 title claims description 242
- 239000011347 resin Substances 0.000 title claims description 242
- 239000011342 resin composition Substances 0.000 title claims description 74
- 229920000098 polyolefin Polymers 0.000 claims description 159
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 135
- 239000004917 carbon fiber Substances 0.000 claims description 135
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 69
- 239000011247 coating layer Substances 0.000 claims description 48
- 239000000835 fiber Substances 0.000 claims description 29
- 239000004952 Polyamide Substances 0.000 claims description 25
- 229920002647 polyamide Polymers 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 23
- 239000000047 product Substances 0.000 description 63
- 239000004743 Polypropylene Substances 0.000 description 31
- -1 polypropylene Polymers 0.000 description 25
- 229920001155 polypropylene Polymers 0.000 description 23
- 238000012360 testing method Methods 0.000 description 21
- 238000000465 moulding Methods 0.000 description 15
- 238000005452 bending Methods 0.000 description 14
- 238000004898 kneading Methods 0.000 description 13
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 12
- 239000005038 ethylene vinyl acetate Substances 0.000 description 11
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 150000001336 alkenes Chemical class 0.000 description 9
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000012783 reinforcing fiber Substances 0.000 description 9
- 238000001746 injection moulding Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 238000005259 measurement Methods 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
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- 229920005992 thermoplastic resin Polymers 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
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- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical class C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 3
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
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- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
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- 125000000217 alkyl group Chemical group 0.000 description 2
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- 239000003963 antioxidant agent Substances 0.000 description 2
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- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
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- 239000003063 flame retardant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
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- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
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- 238000002156 mixing Methods 0.000 description 2
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- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 2
- 229920002312 polyamide-imide Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
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- 238000007142 ring opening reaction Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
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- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- WQNHWIYLCRZRLR-UHFFFAOYSA-N 2-(3-hydroxy-2,5-dioxooxolan-3-yl)acetic acid Chemical compound OC(=O)CC1(O)CC(=O)OC1=O WQNHWIYLCRZRLR-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
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- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001308 poly(aminoacid) Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 238000004064 recycling Methods 0.000 description 1
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- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
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- 238000001721 transfer moulding Methods 0.000 description 1
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- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、樹脂組成物、及び樹脂成形体に関する。 The present invention relates to a resin composition and a resin molded product.
従来、樹脂組成物としては種々のものが提供され、各種用途に使用されている。
特に、熱可塑性樹脂としてポリオレフィンを含む樹脂組成物は、家電製品や自動車の各種部品、筐体等、また事務機器、電子電気機器の筐体などの部品に使用される。
Conventionally, various resin compositions have been provided and used for various purposes.
In particular, resin compositions containing polyolefin as a thermoplastic resin are used for various parts of home appliances and automobiles, housings, and parts such as office equipment and housings of electronic and electrical equipment.
例えば、特許文献1には、「(a)0.1〜90重量%の少なくとも1種類のポリオレフィン、(b)0.1〜50重量%の少なくとも1種類のポリアミド、(c)0.1〜15重量%の少なくとも1種類の修飾ポリオレフィン、(d)5.0〜75重量%の少なくとも1種類の強化用繊維、(e)0.1〜10重量%の少なくとも1種類の硫黄含有添加剤を含む、3mm以上の長さを有する長繊維強化ポリオレフィン構造体」が開示されている。 For example, Patent Document 1 states that "(a) 0.1 to 90% by weight of at least one type of polyolefin, (b) 0.1 to 50% by weight of at least one type of polyamide, and (c) 0.1 to 0.1. 15% by weight of at least one modified polyolefin, (d) 5.0 to 75% by weight of at least one reinforcing fiber, (e) 0.1 to 10% by weight of at least one sulfur-containing additive. A long fiber reinforced polyolefin structure having a length of 3 mm or more including the above is disclosed.
また、特許文献2には、「酸変性ポリオレフィン(A)ブロックおよびポリアミド(B)ブロックを有し、13C−NMRによるアミド基由来の炭素と、メチル基、メチレン基およびメチン基由来の炭素との比(α)が、0.5/99.5〜12/88であるポリマー(X)を含有してなるポリオレフィン樹脂用改質剤」が開示されている。さらに、特許文献2には、「このポリオレフィン樹脂用改質剤(K)、ポリオレフィン樹脂(D)および無機繊維(E)を含有してなる無機繊維含有ポリオレフィン樹脂組成物。」が開示されている。 Further, Patent Document 2 states that "an acid-modified polyolefin (A) block and a polyamide (B) block are provided, and carbon derived from an amide group by 13 C-NMR and carbon derived from a methyl group, a methylene group and a methine group are used. A modifier for a polyolefin resin containing a polymer (X) having a ratio (α) of 0.5 / 99.5 to 12/88 ”is disclosed. Further, Patent Document 2 discloses "an inorganic fiber-containing polyolefin resin composition containing the modifier (K) for a polyolefin resin, a polyolefin resin (D) and an inorganic fiber (E)." ..
また、特許文献3には、「炭素繊維を含む熱可塑性樹脂成形品において、成形品中に含まれる炭素繊維は、その全含有量が0.5〜30wt%であり、更に1.5mmを超える長さの炭素繊維が0.1〜4.7wt%であることを特徴とする炭素繊維含有熱可塑性樹脂成形品。」が開示されている。 Further, Patent Document 3 states, "In a thermoplastic resin molded product containing carbon fibers, the total content of the carbon fibers contained in the molded product is 0.5 to 30 wt%, further exceeding 1.5 mm. A carbon fiber-containing thermoplastic resin molded article characterized in that the length of the carbon fiber is 0.1 to 4.7 wt%. "
本発明の課題は、ポリオレフィンと炭素繊維とアミド結合及びイミド結合の少なくとも一方を含む樹脂と相溶化剤とを含有する樹脂組成物において、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量がポリオレフィン100質量部に対して20質量部以下である場合、又は、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、ポリオレフィン中で0.1μm未満又は10μm超えの径のドメインを形成している場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物を提供することにある。 An object of the present invention is that in a resin composition containing a polyolefin, carbon fibers, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer, the content of the resin containing at least one of the amide bond and the imide bond is determined. When the amount is 20 parts by mass or less with respect to 100 parts by mass of the polyolefin, or a part of the resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of less than 0.1 μm or more than 10 μm in the polyolefin. It is an object of the present invention to provide a resin composition capable of obtaining a resin molded body having an excellent bending elasticity as compared with the case of the above.
上記課題は、以下の本発明によって達成される。 The above object is achieved by the following invention.
<1>に係る発明は、
ポリオレフィンと、
炭素繊維と、
アミド結合及びイミド結合の少なくとも一方を含む樹脂であって、前記ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である樹脂と、
相溶化剤と、
を含み、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成している樹脂組成物。
The invention according to < 1 > is
With polyolefin
With carbon fiber
A resin containing at least one of an amide bond and an imide bond, wherein the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less.
With a compatibilizer,
Including
A resin composition in which a part of a resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the polyolefin.
<2>に係る発明は、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記炭素繊維の周囲に被覆層を形成している<1>に記載の樹脂組成物。
The invention according to < 2 > is
The resin composition according to < 1 > , wherein a part of the resin containing at least one of the amide bond and the imide bond forms a coating layer around the carbon fiber.
<3>に係る発明は、
前記被覆層と前記ポリオレフィンとの間に、前記相溶化剤の層が介在している<2に記載の樹脂組成物。
The invention according to < 3 > is
The resin composition according to < 2, wherein a layer of the compatibilizer is interposed between the coating layer and the polyolefin.
<4>に係る発明は、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂が、ポリアミドである<1>〜<3>のいずれか1項に記載の樹脂組成物。
The invention according to < 4 > is
The resin composition according to any one of < 1 > to < 3 > , wherein the resin containing at least one of the amide bond and the imide bond is a polyamide.
<5>に係る発明は、
前記相溶化剤が、修飾ポリオレフィンである<1>〜<4>のいずれか1項に記載の樹脂組成物。
The invention according to < 5 > is
The resin composition according to any one of < 1 > to < 4 > , wherein the compatibilizer is a modified polyolefin.
<6>に係る発明は、
前記炭素繊維の平均繊維長が、0.1mm以上2.5mm以下である<1>〜<5>のいずれか1項に記載の樹脂組成物。
The invention according to < 6 > is
The resin composition according to any one of < 1 > to < 5 > , wherein the average fiber length of the carbon fibers is 0.1 mm or more and 2.5 mm or less.
<7>に係る発明は、
前記炭素繊維の含有量が、前記ポリオレフィン100質量部に対し0.1質量部以上200質量部以下である<1>〜<6>のいずれか1項に記載の樹脂組成物。
The invention according to < 7 > is
The resin composition according to any one of < 1 > to < 6 > , wherein the content of the carbon fibers is 0.1 part by mass or more and 200 parts by mass or less with respect to 100 parts by mass of the polyolefin.
<8>に係る発明は、
前記相溶化剤の含有量が、前記アミド結合及びイミド結合の少なくとも一方を含む樹脂100質量部に対し1質量部以上100質量部以下である<1>〜<7>のいずれか1項に記載の樹脂組成物。
The invention according to < 8 > is
The item according to any one of < 1 > to < 7 > , wherein the content of the compatibilizer is 1 part by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the resin containing at least one of the amide bond and the imide bond. Resin composition.
<9>に係る発明は、
前記炭素繊維の質量に対する、前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量が、0.1質量%以上200質量%以下である<1>〜<8>のいずれか1項に記載の樹脂組成物。
The invention according to < 9 > is
The item according to any one of < 1 > to < 8 > , wherein the content of the resin containing at least one of the amide bond and the imide bond with respect to the mass of the carbon fiber is 0.1% by mass or more and 200% by mass or less. Resin composition.
<10>に係る発明は、
前記炭素繊維の質量に対する、前記相溶化剤の含有量が、1質量%以上100質量%以下である<1>〜<9>のいずれか1項に記載の樹脂組成物。
The invention according to < 10 > is
The resin composition according to any one of < 1 > to < 9 > , wherein the content of the compatibilizer with respect to the mass of the carbon fibers is 1% by mass or more and 100% by mass or less.
<11>に係る発明は、
ポリオレフィンと、
炭素繊維と、
アミド結合及びイミド結合の少なくとも一方を含む樹脂であって、前記ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である樹脂と、
相溶化剤と、
を含み、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成している樹脂成形体。
The invention according to < 11 > is
With polyolefin
With carbon fiber
A resin containing at least one of an amide bond and an imide bond, wherein the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less.
With a compatibilizer,
Including
A resin molded product in which a part of a resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the polyolefin.
<12>に係る発明は、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記炭素繊維の周囲に被覆層を形成している<11>に記載の樹脂成形体。
The invention according to < 12 > is
The resin molded product according to < 11 > , wherein a part of the resin containing at least one of the amide bond and the imide bond forms a coating layer around the carbon fiber.
<13>に係る発明は、
前記被覆層と前記ポリオレフィンとの間に、前記相溶化剤の層が介在している<12>に記載の樹脂成形体。
The invention according to < 13 > is
The resin molded product according to < 12 > , wherein a layer of the compatibilizer is interposed between the coating layer and the polyolefin.
<14>に係る発明は、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂が、ポリアミドである<11>〜<13>のいずれか1項に記載の樹脂成形体。
The invention according to < 14 > is
The resin molded product according to any one of < 11 > to < 13 > , wherein the resin containing at least one of the amide bond and the imide bond is polyamide.
<15>に係る発明は、
前記相溶化剤が、修飾ポリオレフィンである<11>〜<14>のいずれか1項に記載の樹脂成形体。
The invention according to < 15 > is
The resin molded product according to any one of < 11 > to < 14 > , wherein the compatibilizer is a modified polyolefin.
<16>に係る発明は、
前記炭素繊維の平均繊維長が、0.1mm以上2.5mm以下である<11>〜<15>のいずれか1項に記載の樹脂成形体。
The invention according to < 16 > is
The resin molded product according to any one of < 11 > to < 15 > , wherein the average fiber length of the carbon fibers is 0.1 mm or more and 2.5 mm or less.
<17>に係る発明は、
前記炭素繊維の含有量が、前記ポリオレフィン100質量部に対し0.1質量部以上200質量部以下である<11>〜<16>のいずれか1項に記載の樹脂成形体。
The invention according to < 17 > is
The resin molded product according to any one of < 11 > to < 16 > , wherein the content of the carbon fibers is 0.1 part by mass or more and 200 parts by mass or less with respect to 100 parts by mass of the polyolefin.
<18>に係る発明は、
前記相溶化剤の含有量が、前記アミド結合及びイミド結合の少なくとも一方を含む樹脂100質量部に対し1質量部以上100質量部以下である<11>〜<17>のいずれか1項に記載の樹脂成形体。
The invention according to < 18 > is
The item according to any one of < 11 > to < 17 > , wherein the content of the compatibilizer is 1 part by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the resin containing at least one of the amide bond and the imide bond. Resin molded body.
<19>に係る発明は、
前記炭素繊維の質量に対する、前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量が、0.1質量%以上200質量%以下である<11>〜<18>のいずれか1項に記載の樹脂成形体。
The invention according to < 19 > is
The item according to any one of < 11 > to < 18 > , wherein the content of the resin containing at least one of the amide bond and the imide bond with respect to the mass of the carbon fiber is 0.1% by mass or more and 200% by mass or less. Resin molded body.
<20>に係る発明は、
前記炭素繊維の質量に対する、前記相溶化剤の含有量が、1質量%以上100質量%以下である<11>〜<19>のいずれか1項に記載の樹脂成形体。
The invention according to < 20 > is
The resin molded product according to any one of < 11 > to < 19 > , wherein the content of the compatibilizer with respect to the mass of the carbon fibers is 1% by mass or more and 100% by mass or less.
<1>に係る発明によれば、ポリオレフィンと炭素繊維とアミド結合及びイミド結合の少なくとも一方を含む樹脂と相溶化剤とを含有する樹脂組成物において、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量がポリオレフィン100質量部に対して20質量部以下である場合、又は、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部がポリオレフィン中で 0.1μm未満又は10μm超えの径のドメインを形成している場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<2>に係る発明によれば、アミド結合及びイミド結合の少なくとも一方を含む樹脂が、前記炭素繊維の周囲に被覆層を形成していない場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<3>に係る発明によれば、被覆層とポリオレフィンとの間に、相溶化剤の層が介在していない場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<4>に係る発明によれば、アミド結合及びイミド結合の少なくとも一方を含む樹脂としてイミダゾールを用いた場合と比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<5>に係る発明によれば、相溶化剤としてエポキシコポリマーを用いた場合と比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<6>に係る発明によれば、ポリオレフィンと炭素繊維とアミド結合及びイミド結合の少なくとも一方を含む樹脂と相溶化剤とを含有する樹脂組成物において、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量がポリオレフィン100質量部に対して20質量部以下である場合、又は、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部がポリオレフィン中で0.1μm未満又は10μm超えの径のドメインを形成している場合に比べ、平均繊維長が0.1mm以上2.5mm以下の炭素繊維を含み、かつ曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
According to the invention according to < 1 > , in a resin composition containing a polyolefin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer, a resin containing at least one of the amide bond and the imide bond. When the content of the resin is 20 parts by mass or less with respect to 100 parts by mass of the polyolefin, or a part of the resin containing at least one of the amide bond and the imide bond is less than 0.1 μm or more than 10 μm in the polyolefin. Provided is a resin composition capable of obtaining a resin molded body having an excellent bending elasticity as compared with the case of forming the above.
According to the invention according to < 2 > , a resin molded product having an excellent flexural modulus is higher than that in the case where the resin containing at least one of the amide bond and the imide bond does not form a coating layer around the carbon fibers. The resulting resin composition is provided.
According to the invention according to < 3 >, there is provided a resin composition capable of obtaining a resin molded product having an excellent flexural modulus as compared with the case where a layer of a compatibilizer is not interposed between the coating layer and the polyolefin. Will be done.
According to the invention according to < 4 >, there is provided a resin composition capable of obtaining a resin molded product having an excellent flexural modulus as compared with the case where imidazole is used as a resin containing at least one of an amide bond and an imide bond.
According to the invention according to < 5 >, there is provided a resin composition capable of obtaining a resin molded product having an excellent flexural modulus as compared with the case where an epoxy copolymer is used as a compatibilizer.
According to the invention according to < 6 > , in a resin composition containing a polyolefin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer, a resin containing at least one of the amide bond and the imide bond. When the content of the resin is 20 parts by mass or less with respect to 100 parts by mass of the polyolefin, or a part of the resin containing at least one of the amide bond and the imide bond has a diameter of less than 0.1 μm or more than 10 μm in the polyolefin. Provided is a resin composition capable of obtaining a resin molded product containing carbon fibers having an average fiber length of 0.1 mm or more and 2.5 mm or less and having an excellent bending elasticity as compared with the case of forming the above.
<7>に係る発明によれば、炭素繊維の含有量が、ポリオレフィン100質量部に対し0.1質量部未満又は200質量部超えである場合に比べ、成形性に優れ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<8>に係る発明によれば、相溶化剤の含有量が、アミド結合及びイミド結合の少なくとも一方を含む樹脂100質量部に対し1質量部未満又は100質量部超えである場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<9>に係る発明によれば、炭素繊維の質量に対する、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量が、0.1質量%未満又は200質量%超えである場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
<10>に係る発明によれば、炭素繊維の質量に対する、相溶化剤の含有量が、1質量%未満又は100質量%超えである場合に比べ、曲げり弾性率に優れた樹脂成形体が得られる樹脂組成物が提供される。
According to the invention according to < 7 > , the formability is excellent and the flexural modulus is excellent as compared with the case where the carbon fiber content is less than 0.1 part by mass or more than 200 parts by mass with respect to 100 parts by mass of polyolefin. A resin composition for obtaining a resin molded product is provided.
According to the invention according to < 8 > , the content of the compatibilizer is less than 1 part by mass or more than 100 parts by mass with respect to 100 parts by mass of the resin containing at least one of the amide bond and the imide bond. Provided is a resin composition capable of obtaining a resin molded product having an excellent elastic modulus.
According to the invention according to < 9 > , the content of the resin containing at least one of the amide bond and the imide bond with respect to the mass of the carbon fiber is less than 0.1% by mass or more than 200% by mass, as compared with the case where the resin is bent. Provided is a resin composition capable of obtaining a resin molded product having an excellent elastic modulus.
According to the invention according to < 10 > , a resin molded product having an excellent flexural modulus is higher than that in the case where the content of the compatibilizer with respect to the mass of the carbon fiber is less than 1% by mass or more than 100% by mass. The resulting resin composition is provided.
<11>に係る発明によれば、ポリオレフィンと炭素繊維とアミド結合及びイミド結合の少なくとも一方を含む樹脂と相溶化剤とを含有する樹脂成形体において、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量がポリオレフィン100質量部に対して20質量部以下である場合、又は、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部がポリオレフィン中で0.1μm未満又は10μm超えの径のドメインを形成している場合に比べ、曲げ弾性率に優れた樹脂成形体が提供される。
<12>に係る発明によれば、アミド結合及びイミド結合の少なくとも一方を含む樹脂が、前記炭素繊維の周囲に被覆層を形成していない場合に比べ、曲げ弾性率に優れた樹脂成形体が提供される。
<13>に係る発明によれば、被覆層とポリオレフィンとの間に、相溶化剤の層が介在していない場合に比べ、曲げ弾性率に優れた樹脂成形体が提供される。
<14>に係る発明によれば、アミド結合及びイミド結合の少なくとも一方を含む樹脂としてイミダゾールを用いた場合と比べ、曲げ弾性率に優れた樹脂成形体が提供される。
<15>に係る発明によれば、相溶化剤としてエポキシコポリマーを用いた場合と比べ、曲げ弾性率に優れた樹脂成形体が提供される。
<16>に係る発明によれば、ポリオレフィンと炭素繊維とアミド結合及びイミド結合の少なくとも一方を含む樹脂と相溶化剤とを含有する樹脂成形体において、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量がポリオレフィン100質量部に対して20質量部以下である場合、又は、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部がポリオレフィン中で0.1μm未満又は10μm超えの径のドメインを形成している場合に比べ、平均繊維長が0.1mm以上2.5mm以下の炭素繊維を含み、かつ曲げ弾性率に優れた樹脂成形体が提供される。
According to the invention according to < 11 > , in a resin molded product containing a polyolefin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer, a resin containing at least one of the amide bond and the imide bond. When the content of the resin is 20 parts by mass or less with respect to 100 parts by mass of the polyolefin, or a part of the resin containing at least one of the amide bond and the imide bond is less than 0.1 μm or more than 10 μm in the polyolefin. A resin molded body having an excellent bending elasticity as compared with the case of forming the above is provided.
According to the invention according to < 12 > , a resin molded product having an excellent flexural modulus is higher than that in the case where the resin containing at least one of the amide bond and the imide bond does not form a coating layer around the carbon fibers. Provided.
According to the invention according to < 13 > , a resin molded product having an excellent flexural modulus is provided as compared with the case where a layer of a compatibilizer is not interposed between the coating layer and the polyolefin.
According to the invention according to < 14 > , a resin molded product having an excellent flexural modulus is provided as compared with the case where imidazole is used as the resin containing at least one of an amide bond and an imide bond.
According to the invention according to < 15 > , a resin molded product having an excellent flexural modulus is provided as compared with the case where an epoxy copolymer is used as a compatibilizer.
According to the invention according to < 16 > , in a resin molded product containing a polyolefin, carbon fibers, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer, a resin containing at least one of the amide bond and the imide bond. When the content of the resin is 20 parts by mass or less with respect to 100 parts by mass of the polyolefin, or a part of the resin containing at least one of the amide bond and the imide bond has a diameter of less than 0.1 μm or more than 10 μm in the polyolefin. Provided is a resin molded body containing carbon fibers having an average fiber length of 0.1 mm or more and 2.5 mm or less and having an excellent bending elasticity as compared with the case of forming the above.
<17>に係る発明によれば、炭素繊維の含有量が、ポリオレフィン100質量部に対し0.1質量部未満又は200質量部超えである場合に比べ、成形性に優れ、曲げ弾性率に優れた樹脂成形体が得られる提供される。
<18>に係る発明によれば、相溶化剤の含有量が、アミド結合及びイミド結合の少なくとも一方を含む樹脂100質量部に対し1質量部未満又は100質量部超えである場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる提供される。
<19>に係る発明によれば、炭素繊維の質量に対する、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量が、0.1質量%未満又は200質量%超えである場合に比べ、曲げ弾性率に優れた樹脂成形体が得られる提供される。
<20>に係る発明によれば、炭素繊維の質量に対する、相溶化剤の含有量が、1質量%未満又は100質量%超えである場合に比べ、曲げ弾性率に優れた樹脂成形体が提供される。
According to the invention according to < 17 > , the formability is excellent and the flexural modulus is excellent as compared with the case where the carbon fiber content is less than 0.1 part by mass or more than 200 parts by mass with respect to 100 parts by mass of polyolefin. A resin molded product is obtained.
According to the invention according to < 18 > , the content of the compatibilizer is less than 1 part by mass or more than 100 parts by mass with respect to 100 parts by mass of the resin containing at least one of the amide bond and the imide bond. Provided is that a resin molded product having an excellent elastic modulus can be obtained.
According to the invention according to < 19 > , the content of the resin containing at least one of the amide bond and the imide bond with respect to the mass of the carbon fiber is less than 0.1% by mass or more than 200% by mass, as compared with the case where the resin is bent. Provided is a resin molded product having an excellent elastic modulus.
According to the invention of < 20 > , a resin molded product having an excellent flexural modulus is provided as compared with the case where the content of the compatibilizer with respect to the mass of the carbon fiber is less than 1% by mass or more than 100% by mass. Will be done.
以下、本発明の樹脂組成物及び樹脂成形体の一例である実施形態について説明する。 Hereinafter, embodiments that are examples of the resin composition and the resin molded product of the present invention will be described.
[樹脂組成物]
本実施形態に係る樹脂組成物は、ポリオレフィンと、炭素繊維と、アミド結合及びイミド結合の少なくとも一方を含む樹脂と、相溶化剤と、を含む。そして、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量は、ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である。また、アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部は、ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成している。
以下、アミド結合及びイミド結合の少なくとも一方を含む樹脂を、「特定樹脂」と称することがある。
[Resin composition]
The resin composition according to the present embodiment contains a polyolefin, carbon fibers, a resin containing at least one of an amide bond and an imide bond, and a compatibilizer. The content of the resin containing at least one of the amide bond and the imide bond is such that the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less. Further, a part of the resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the polyolefin.
Hereinafter, a resin containing at least one of an amide bond and an imide bond may be referred to as a "specific resin".
近年では、機械的強度に優れた樹脂成形体を得るために、母材(マトリックス)としてのポリオレフィンと強化繊維とを含む樹脂組成物が用いられている。
このような樹脂組成物では、強化繊維とポリオレフィンとの親和性が低いと、この両者の界面に空間が生じ、かかる界面における密着性が低下することがある。
特に、樹脂組成物中の強化繊維として炭素繊維を用いた場合には、ガラス繊維等に比べ高い機械的強度を求められるが、炭素繊維表面の水酸基、カルボキシル基などポリオレフィンとの接着に寄与する極性基が、ガラス繊維に比べて少ないため、炭素繊維とポリオレフィンとの界面における密着性は低下する。その結果、機械的強度、特に曲げ弾性率は、炭素繊維の配合の割に高まり難い。特に、繰り返し曲げる負荷を加えた場合、炭素繊維とポリオレフィンとの界面での剥離が進行しやすいため、初期からの曲げ弾性率の低下は大きくなる傾向がある。
In recent years, in order to obtain a resin molded product having excellent mechanical strength, a resin composition containing polyolefin as a base material (matrix) and reinforcing fibers has been used.
In such a resin composition, if the affinity between the reinforcing fiber and the polyolefin is low, a space is formed at the interface between the reinforcing fiber and the polyolefin, and the adhesion at the interface may be lowered.
In particular, when carbon fiber is used as the reinforcing fiber in the resin composition, higher mechanical strength is required as compared with glass fiber or the like, but the polarity that contributes to adhesion to polyolefin such as hydroxyl group and carboxyl group on the surface of carbon fiber. Since the number of groups is smaller than that of glass fiber, the adhesion at the interface between the carbon fiber and the polyolefin is lowered. As a result, the mechanical strength, particularly the flexural modulus, is unlikely to increase for the composition of the carbon fibers. In particular, when a load of repeated bending is applied, peeling at the interface between the carbon fiber and the polyolefin tends to proceed, so that the bending elastic modulus tends to decrease significantly from the initial stage.
そこで、本実施形態に係る樹脂組成物は、ポリオレフィンと、炭素繊維と、アミド結合及びイミド結合の少なくとも一方を含む樹脂(特定樹脂)と、相溶化剤と、の4成分を含む。それに加え、ポリオレフィン100質量部に対する特定樹脂の含有量を20質量部超え100質量部以下とする。
この構成とすることで、曲げ弾性率に優れる樹脂成形体が得られる。このような効果が得られる作用については明確ではないが、以下のように推測される。
Therefore, the resin composition according to the present embodiment contains four components of a polyolefin, carbon fibers, a resin containing at least one of an amide bond and an imide bond (specific resin), and a compatibilizer. In addition, the content of the specific resin with respect to 100 parts by mass of polyolefin is set to more than 20 parts by mass and 100 parts by mass or less.
With this configuration, a resin molded body having an excellent flexural modulus can be obtained. The action to obtain such an effect is not clear, but it is presumed as follows.
本実施形態に係る樹脂組成物から樹脂成形体を得る際、かかる樹脂組成物を熱溶融混合すると、母材としてのポリオレフィンと相溶化剤とが溶融し、また、相溶化剤の分子内の一部と特定樹脂の分子内に含まれるアミド結合又はイミド結合とで両者が相溶して、特定樹脂が樹脂組成物中で分散することとなる。
この状態の中で、特定樹脂が炭素繊維と接触すると、特定樹脂の分子鎖に沿って多数含まれるアミド結合又はイミド結合と、炭素繊維の表面に僅かながら存在する極性基と、が親和力(引力及び水素結合)にて複数の箇所で物理的に接着する。また、一般的にポリオレフィンと特定樹脂とは相溶性が低いため、ポリオレフィンと特定樹脂との間の斥力により、特定樹脂と炭素繊維との接触頻度が上がり、その結果として、特定樹脂の炭素繊維に対する接着量や接着面積が上がる。このように、炭素繊維の周囲に特定樹脂による被覆層が形成される(図1参照)。なお、図1中、PPはポリオレフィンを示し、CFが炭素繊維を示し、CLは被覆層を示している。
そして、被覆層を形成する特定樹脂も相溶化剤の分子内の一部の反応基と化学反応、極性基同士で静電的相互作用を行うことで相溶されるため、この相溶化剤がポリオレフィンとも相溶することで、引力と斥力とが平衡状態が形成され、特定樹脂による被覆層は、薄く、かつ均一に近い状態で形成されることとなる。特に、炭素繊維の表面に存在するカルボキシ基と特定樹脂の分子内に含まれるアミド結合又はイミド結合との親和性は高いため、炭素繊維の周囲には特定樹脂による被覆層が形成され易く、薄膜で且つ均一性に優れる被覆層になると考えられる。
When a resin molded product is obtained from the resin composition according to the present embodiment, when the resin composition is thermally melt-mixed, the polyolefin as the base material and the compatibilizer are melted, and one of the compatibilizers in the molecule. The portion and the amide bond or the imide bond contained in the molecule of the specific resin are compatible with each other, and the specific resin is dispersed in the resin composition.
In this state, when the specific resin comes into contact with the carbon fiber, the amide bond or imide bond contained in large numbers along the molecular chain of the specific resin and the polar group slightly present on the surface of the carbon fiber have an affinity (attractive force). And hydrogen bonds) to physically bond at multiple points. Further, since the compatibility between the polyolefin and the specific resin is generally low, the repulsive force between the polyolefin and the specific resin increases the contact frequency between the specific resin and the carbon fiber, and as a result, the specific resin has a low compatibility with the carbon fiber. The amount of adhesion and the area of adhesion increase. In this way, a coating layer made of the specific resin is formed around the carbon fibers (see FIG. 1). In FIG. 1, PP indicates polyolefin, CF indicates carbon fiber, and CL indicates a coating layer.
Then, the specific resin forming the coating layer is also compatible with some reactive groups in the molecule of the compatibilizer by performing a chemical reaction and electrostatic interaction between the polar groups, so that the compatibilizer is used. By being compatible with polyolefin, an equilibrium state is formed between the attractive force and the repulsive force, and the coating layer made of the specific resin is formed in a thin and nearly uniform state. In particular, since the carboxy group existing on the surface of the carbon fiber has a high affinity for the amide bond or the imide bond contained in the molecule of the specific resin, a coating layer made of the specific resin is likely to be formed around the carbon fiber, resulting in a thin film. It is considered that the coating layer is excellent in uniformity.
一方で、このような作用を有する特定樹脂をポリオレフィン100質量部に対して20質量部超え100質量部以下といった範囲で多く含ませることで、特定樹脂量に対して相対的に相溶化剤量が少なくなり、特定樹脂がポリオレフィン中に広がり難くなり、炭素繊維の周囲に局在化する傾向が高まる。それにより、炭素繊維の周囲全体にわたって、特定樹脂による被覆層がある程度厚膜化しつつ均一に近い状態で形成されると考えられる。
なお、被覆層は炭素繊維の周囲全体を被覆していることが好ましいが、一部被覆されていない部分があってもよい。
On the other hand, by including a large amount of the specific resin having such an action in the range of more than 20 parts by mass and 100 parts by mass or less with respect to 100 parts by mass of the polyolefin, the amount of the compatibilizer can be increased relative to the amount of the specific resin. The amount is reduced, the specific resin is less likely to spread in the polyolefin, and the tendency to be localized around the carbon fiber is increased. As a result, it is considered that the coating layer made of the specific resin is formed in a nearly uniform state while being thickened to some extent over the entire circumference of the carbon fibers.
The coating layer preferably covers the entire periphery of the carbon fiber, but there may be a partially uncoated portion.
さらに、特定樹脂の一部がポリオレフィン中で上記範囲の径のドメインを形成していること、つまり、被覆層の形成に寄与せず、遊離している特定樹脂がポリオレフィン中で細かく分散していると、機械的強度、特に曲げ弾性率が向上する。これは、1)ポリオレフィン中に分散した特定樹脂のドメインが曲げ等の機械的負荷を分散する役割を担うと共に、2)特定樹脂のドメインが細かく、特定樹脂のドメインとポリオレフィンとの界面への応力集中が緩和されるためと考えられるためである。 Further, a part of the specific resin forms a domain having a diameter in the above range in the polyolefin, that is, the specific resin that is free does not contribute to the formation of the coating layer and is finely dispersed in the polyolefin. And the mechanical strength, especially the flexural modulus is improved. This is because 1) the domain of the specific resin dispersed in the polyolefin plays a role of dispersing the mechanical load such as bending, and 2) the domain of the specific resin is fine and the stress on the interface between the domain of the specific resin and the polyolefin This is because it is thought that the concentration is eased.
以上のことから、炭素繊維とポリオレフィンとの界面の密着性が高まり、かつ特定樹脂がポリオレフィン中で細かく分散していることから、機械的強度、特に曲げ弾性率に優れた樹脂成形体が得られると推測される。 From the above, since the adhesion of the interface between the carbon fiber and the polyolefin is enhanced and the specific resin is finely dispersed in the polyolefin, a resin molded product having excellent mechanical strength, particularly bending elastic modulus, can be obtained. It is presumed.
また、特定樹脂の一部がポリオレフィン中で上記範囲の径のドメインを形成していることで、成形性も向上する。 Further, since a part of the specific resin forms a domain having a diameter in the above range in the polyolefin, the moldability is also improved.
ここで、炭素繊維の繊維長が短くなると、炭素繊維の樹脂強化能が低下する傾向がある。特に、近年のリサイクル化の要望により、炭素繊維で強化された樹脂成形体を粉砕して再利用することも進められており、樹脂成形体の粉砕時に炭素繊維の繊維長が短くなることが多い。また、樹脂組成物を製造するときの熱溶融混練時に炭素繊維の繊維長が短くなることもある。そのため、繊維長が短くなった炭素繊維を含む樹脂組成物により樹脂成形体を成形すると、機械的強度、特に曲げ弾性率が低下する傾向が高くなる。
しかし、炭素繊維を含む樹脂成形体を粉砕し、炭素繊維が短繊維化されたリサイクル品を原料として使用したり、熱溶融混練時に炭素繊維が短繊維化しても、本実施形態に係る樹脂組成物は、曲げ弾性率に優れた樹脂成形体が得られるため有用である。
Here, when the fiber length of the carbon fiber is shortened, the resin reinforcing ability of the carbon fiber tends to decrease. In particular, in recent years, due to the demand for recycling, the resin molded product reinforced with carbon fibers has been crushed and reused, and the fiber length of the carbon fiber is often shortened when the resin molded product is crushed. .. In addition, the fiber length of the carbon fibers may be shortened during heat melt kneading during the production of the resin composition. Therefore, when a resin molded product is molded from a resin composition containing carbon fibers having a shortened fiber length, the mechanical strength, particularly the flexural modulus, tends to decrease.
However, even if the resin molded body containing the carbon fibers is crushed and a recycled product in which the carbon fibers are shortened is used as a raw material, or the carbon fibers are shortened during hot melt kneading, the resin composition according to the present embodiment. The material is useful because a resin molded body having an excellent bending elasticity can be obtained.
ここで、本実施形態に係る樹脂組成物及びそれにより得られる樹脂成形体は、樹脂組成物(例えばペレット)の製造のときの熱溶融混練、及び射出成型により、炭素繊維の周囲に特定樹脂による被覆層が形成され、当該被覆層の厚さが50nm以上700nm以下となる構造を有することが好ましい。 Here, the resin composition according to the present embodiment and the resin molded product obtained by the resin composition are made of a specific resin around the carbon fibers by heat melt kneading and injection molding during the production of the resin composition (for example, pellets). It is preferable that the coating layer is formed and has a structure in which the thickness of the coating layer is 50 nm or more and 700 nm or less.
本実施形態に係る樹脂組成物において、特定樹脂による被覆層の厚さは、50nm以上700nm以下であり、曲げ弾性率の更なる向上の点から、50nm以上650nm以下が好ましい。被覆層の厚みを50nm以上とすると、曲げ弾性率が向上し、被覆層の厚みを700nm以下とすると、被覆層を介した炭素繊維とポリオレフィンとの界面が脆弱となることを抑え、曲げ弾性率の低下が抑制される。 In the resin composition according to the present embodiment, the thickness of the coating layer made of the specific resin is 50 nm or more and 700 nm or less, and is preferably 50 nm or more and 650 nm or less from the viewpoint of further improving the flexural modulus. When the thickness of the coating layer is 50 nm or more, the flexural modulus is improved, and when the thickness of the coating layer is 700 nm or less, the interface between the carbon fiber and the polyolefin via the coating layer is suppressed from becoming brittle, and the flexural modulus is suppressed. The decrease is suppressed.
被覆層の厚さは、次の方法により測定された値である。測定対象物を液体窒素中で破断させ、電子顕微鏡(Keyence社製VE−9800)を用いて、その断面を観察する。その断面において、炭素繊維の周囲に被覆する被覆層の厚みを100箇所計測し、その平均値として算出する。
なお、被覆層の確認は、上記断面観察により実施する。
The thickness of the coating layer is a value measured by the following method. The object to be measured is broken in liquid nitrogen, and its cross section is observed using an electron microscope (VE-9800 manufactured by Keyence Corporation). In the cross section, the thickness of the coating layer covering around the carbon fiber is measured at 100 points and calculated as the average value.
The coating layer is confirmed by observing the cross section.
本実施形態に係る樹脂組成物及びそれにより得られる樹脂成形体において、ポリオレフィン中での特定樹脂のドメインの径は、0.1μm以上10μm以下であるが、曲げ弾性率の更なる向上の観点から、0.5μm以上5μm以下であることが好ましい。 In the resin composition according to the present embodiment and the resin molded product obtained thereby, the diameter of the domain of the specific resin in the polyolefin is 0.1 μm or more and 10 μm or less, but from the viewpoint of further improving the flexural modulus. , 0.5 μm or more and 5 μm or less is preferable.
ポリオレフィン中での特定樹脂のドメインの径は、例えば、1)相溶化剤の含有量の増減、2)熱溶融混練温度、成形温度の調整、3)熱溶融混練、成形時の混合力又は分散力等により調整される。 The diameter of the domain of the specific resin in the polyolefin is, for example, 1) increase / decrease in the content of the compatibilizer, 2) adjustment of the heat melt kneading temperature and molding temperature, and 3) heat melt kneading, mixing force or dispersion during molding. It is adjusted by force.
特定樹脂のドメインの径は、次の方法により測定された値である。
即ち、測定対象物の試料片をエポキシ樹脂に包埋し、自動研磨機(BUEHLER製Vector)で精密研磨断面を作製する。
次に、SEM(日立製S−3400N,加速電圧15KV)を用いて、試料片の研磨断面を倍率1500倍でランダムに3視野撮影し、画像解析ソフト(ImageProPlus)を用いて、特定樹脂の炭素繊維の被覆層成分と遊離成分(特定樹脂のドメインに相当)を全て抽出するように輝度レンジを設定する。
その後、被覆層成分を手動で選択除外し、遊離成分(特定樹脂のドメインに相当)のみを測定項目として、直径・オブジェクト数を選択、計算し、個々のドメインの大きさ(直径=円相当径)及び個数を求め、ここから、ドメインの大きさ(直径)の平均値を求める。
The diameter of the domain of the specific resin is a value measured by the following method.
That is, the sample piece of the object to be measured is embedded in epoxy resin, and a precision polishing cross section is prepared by an automatic polishing machine (Vector manufactured by BUEHLER).
Next, using SEM (Hitachi S-3400N, accelerating voltage 15KV), the polished cross section of the sample piece was randomly photographed in three fields at a magnification of 1500 times, and carbon of the specific resin was photographed using image analysis software (ImageProPlus). The brightness range is set so as to extract all the coating layer component and the free component (corresponding to the domain of the specific resin) of the fiber.
After that, the coating layer component is manually selected and excluded, and the diameter and the number of objects are selected and calculated with only the free component (corresponding to the domain of the specific resin) as the measurement item, and the size of each domain (diameter = equivalent circle diameter). ) And the number, and from this, the average value of the size (diameter) of the domain is calculated.
なお、本実施形態に係る樹脂組成物(及びその樹脂成形体)では、例えば、かかる被覆層とポリオレフィンとの間を相溶化剤が一部相溶する構成をとる。
具体的には、例えば、特定樹脂による被覆層と母材であるポリオレフィンとの間には、相溶化剤の層が介在していることがよい(図2参照)。つまり、被覆層の表面に相溶化剤の層が形成され、この相溶化剤の層を介して、被覆層とポリオレフィンが隣接していることがよい。相溶化剤の層は被覆層に比べ薄く形成されるが、相溶化剤の層の介在により、被覆層とポリオレフィンとの密着性(接着性)が高まり、機械的強度、特に曲げ弾性率に優れた樹脂成形体が得られ易くなる。なお、図2中、PPはポリオレフィンを示し、CFが炭素繊維を示し、CLは被覆層、CAは相溶化剤の層を示している。
In the resin composition (and its resin molded product) according to the present embodiment, for example, the compatibilizer is partially compatible between the coating layer and the polyolefin.
Specifically, for example, a layer of a compatibilizer may be interposed between the coating layer made of the specific resin and the polyolefin as the base material (see FIG. 2). That is, it is preferable that a layer of the compatibilizer is formed on the surface of the coating layer, and the coating layer and the polyolefin are adjacent to each other via the layer of the compatibilizer. The layer of the compatibilizer is formed thinner than the coating layer, but the presence of the compatibilizer layer enhances the adhesion (adhesiveness) between the coating layer and the polyolefin, and is excellent in mechanical strength, especially flexural modulus. It becomes easy to obtain a resin molded product. In FIG. 2, PP indicates polyolefin, CF indicates carbon fiber, CL indicates a coating layer, and CA indicates a compatibilizer layer.
特に、相溶化剤の層は、被覆層とは結合(水素結合、相溶化剤と特定樹脂との官能基の反応による共有結合等)し、ポリオレフィンとは相溶した状態で、被覆層とポリオレフィンの間に介在していることがよい。この構成は、例えば、相溶化剤として、母材であるポリオレフィンと同じ構造又は相溶する構造を有し、且つ、分子内の一部に前述した特定樹脂の官能基と反応する部位を含む相溶化剤を適用すると実現され易い。
具体的には、例えば、ポリオレフィン、特定樹脂としてポリアミド、及び相溶化剤として無水マレイン酸修飾ポリオレフィンを適用した場合、無水マレイン酸修飾ポリオレフィンの層(相溶化剤の層)は、その無水マレイン酸部位が開環して生成したカルボキシ基がポリアミドの層(被覆層)のアミン残基と反応して結合し、そのポリオレフィン部位がポリオレフィンと相溶した状態で介在していることがよい。
In particular, the layer of the compatibilizer is bonded to the coating layer (hydrogen bond, covalent bond by the reaction of the functional group of the compatibilizer and the specific resin, etc.) and is compatible with the polyolefin, and the coating layer and the polyolefin are in a state of being compatible with each other. It is good to intervene between. In this configuration, for example, as a compatibilizer, a phase having the same structure or a compatible structure as the polyolefin as the base material, and including a part in the molecule that reacts with the functional group of the specific resin described above. It is easy to realize by applying a solubilizer.
Specifically, for example, when a polyolefin, a polyamide as a specific resin, and a maleic anhydride-modified polyolefin are applied as a compatibilizer, the layer of the maleic anhydride-modified polyolefin (layer of the compatibilizer) is the maleic anhydride moiety. It is preferable that the carboxy group generated by opening the ring reacts with the amine residue of the polyamide layer (coating layer) to bond, and the polyolefin moiety is interposed in a state of being compatible with the polyolefin.
ここで、相溶化剤の層が、被覆層とポリオレフィンとの間に介在していることを確認する方法は、次の通りである。
解析装置として赤外分光分析装置(サーモフィッシャー社製NICOLET6700FT−IR)を用いる。例えば、ポリオレフィンとしてポリプロピレン(以下PP)、ポリアミドとしてPA66と修飾ポリオレフィンとしてマレイン酸変性ポリプロピレン(以下MA−PP)との樹脂組成物(又は樹脂成形体)の場合、その混合物、PPとPA66との混合物、PPとMA−PPとの混合物、参照としてPP単体、PA66単体、MA−PP単体のIRスペクトルをKBr錠剤法で取得し、混合物における酸無水物由来(MA−PPに特徴的なピーク)の波数1820cm−1以上1750cm−1以下の範囲のピーク面積を比較解析する。PPとPA66とMA−PPとの混合物において、酸無水物ピーク面積の減少を確認し、MA−PPとPA66とが反応していることを確認する。これにより、被覆層とポリオレフィンとの間に相溶化剤の層(結合層)が介在していることが確認できる。詳しくは、MA−PPとPA66とが反応していると、MA−PPの環状マレイン化部分が開環してPA66のアミン残基が化学結合することで環状マレイン化部分が減るので、被覆層とポリオレフィンとの間に相溶化剤の層(結合層)が介在していると確認できる。
Here, the method for confirming that the layer of the compatibilizer is interposed between the coating layer and the polyolefin is as follows.
An infrared spectroscopic analyzer (NICOLET 6700FT-IR manufactured by Thermo Fisher Scientific Co., Ltd.) is used as the analysis apparatus. For example, in the case of a resin composition (or resin molded product) of polypropylene (hereinafter PP) as a polyolefin, PA66 as a polyamide and maleic acid-modified polypropylene (hereinafter MA-PP) as a modified polyolefin, a mixture thereof, or a mixture of PP and PA66. , PP and MA-PP mixture, as a reference, the IR spectra of PP alone, PA66 alone, and MA-PP alone were obtained by the KBr tablet method and derived from acid anhydride (peak characteristic of MA-PP) in the mixture. comparative analysis of the peak area of the wave number 1820 cm -1 or 1750 cm -1 or less. In the mixture of PP, PA66 and MA-PP, a decrease in the peak area of acid anhydride is confirmed, and it is confirmed that MA-PP and PA66 are reacting. From this, it can be confirmed that a layer of the compatibilizer (bonding layer) is interposed between the coating layer and the polyolefin. Specifically, when MA-PP and PA66 are reacting, the cyclic maleinated portion of MA-PP is ring-opened and the amine residue of PA66 is chemically bonded to reduce the cyclic maleated portion. It can be confirmed that a layer of the compatibilizer (bonding layer) is interposed between the polypropylene and the polyolefin.
以下、本実施形態に係る樹脂組成物の各成分の詳細について説明する。 Hereinafter, details of each component of the resin composition according to the present embodiment will be described.
−ポリオレフィン(A)−
ポリオレフィンは、樹脂組成物の母材であり、炭素繊維により強化される樹脂成分である(マトリックス樹脂とも呼ばれる)。
ポリオレフィンは、1種を単独で用いてもよいし、2種以上を併用してもよい。
-Polyolefin (A)-
Polyolefin is a base material of a resin composition and is a resin component reinforced by carbon fibers (also called a matrix resin).
One type of polyolefin may be used alone, or two or more types may be used in combination.
ポリオレフィンとしては、オレフィンに由来する繰り返し単位を含む樹脂であって、樹脂全体に対し30質量%)以下であれば、オレフィン以外の単量体に由来する繰り返し単位を含んでいてもよい。
ポリオレフィンは、オレフィン(必要に応じて、オレフィン以外の単量体)の付加重合によって得られる。
また、ポリオレフィンを得るための、オレフィン及びオレフィン以外の単量体は、それぞれ、1種であってもよいし、2種以上であってもよい。
なお、ポリオレフィンは、コポリマーであってもよいし、ホモポリマーであってよい。また、ポリオレフィンは、直鎖状であってもよいし、分岐鎖状であってもよい。
The polyolefin is a resin containing a repeating unit derived from an olefin, and may contain a repeating unit derived from a monomer other than the olefin as long as it is 30% by mass or less with respect to the entire resin.
Polyolefins are obtained by addition polymerization of olefins (optionally non-olefin monomers).
Further, the olefin and the monomers other than the olefin for obtaining the polyolefin may be one kind or two or more kinds, respectively.
The polyolefin may be a copolymer or a homopolymer. Further, the polyolefin may be linear or branched.
ここで、オレフィンとしては、直鎖状又は分岐状の脂肪族オレフィン、脂環式オレフィンが挙げられる。
脂肪族オレフィンとしては、エチレン、プロピレン、1−ブテン、1−ヘキセン、4−メチル−1−ペンテン、1−オクテン、1−デセン、1−ヘキサデセン、1−オクタデセン等のα−オレフィンが挙げられる。
また、脂環式オレフィンとしては、シクロペンテン、シクロヘプテン、ノルボルネン、5−メチル−2−ノルボルネン、テトラシクロドデセン、ビニルシクロヘキサン等が挙げられる。
中でも、コストの点から、α−オレフィンが好ましく、エチレン、プロピレンがより好ましく、特にプロピレンが好ましい。
Here, examples of the olefin include a linear or branched aliphatic olefin and an alicyclic olefin.
Examples of the aliphatic olefin include α-olefins such as ethylene, propylene, 1-butene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene, 1-hexadecene and 1-octadecene.
Examples of the alicyclic olefin include cyclopentene, cycloheptene, norbornene, 5-methyl-2-norbornene, tetracyclododecene, vinylcyclohexane and the like.
Among them, from the viewpoint of cost, α-olefin is preferable, ethylene and propylene are more preferable, and propylene is particularly preferable.
また、オレフィン以外の単量体としては、公知の付加重合性化合物から選択される。
付加重合性化合物としては、例えば、スチレン、メチルスチレン、α−メチルスチレン、β−メチルスチレン、t−ブチルスチレン、クロロスチレン、クロロメチルスチレン、メトキシスチレン、スチレンスルホン酸又はその塩等のスチレン類;(メタ)アクリル酸アルキル、(メタ)アクリル酸ベンジル、(メタ)アクリル酸ジメチルアミノエチル等の(メタ)アクリル酸エステル;塩化ビニル等のハロビニル類;酢酸ビニル、プロピオン酸ビニル等のビニルエステル類;ビニルメチルエーテル等のビニルエーテル類;ビニリデンクロリド等のハロゲン化ビニリデン類;N−ビニルピロリドン等のN−ビニル化合物類;等が挙げられる。
The monomer other than the olefin is selected from known addition-polymerizable compounds.
Examples of the addition polymerizable compound include styrenes such as styrene, methylstyrene, α-methylstyrene, β-methylstyrene, t-butylstyrene, chlorostyrene, chloromethylstyrene, methoxystyrene, styrenesulfonic acid or a salt thereof; (Meta) acrylic acid esters such as alkyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate; halovinyls such as vinyl chloride; vinyl esters such as vinyl acetate and vinyl propionate; Vinyl ethers such as vinyl methyl ether; halogenated vinylidene such as vinylidene chloride; N-vinyl compounds such as N-vinylpyrrolidone; and the like can be mentioned.
好適なポリオレフィンとしては、ポリプロピレン(PP)、ポリエチレン(PE)、ポリブテン、ポリイソブチレン、クマロン・インデン樹脂、テルペン樹脂、エチレン・酢酸ビニル共重合樹脂(EVA)等が挙げられる。
中でも、オレフィンに由来する繰り返し単位のみを含む樹脂であることが好ましく、特に、コストの点から、ポリプロピレンが好ましい。
Suitable polyolefins include polypropylene (PP), polyethylene (PE), polybutene, polyisobutylene, kumaron-inden resin, terpene resin, ethylene-vinyl acetate copolymer resin (EVA) and the like.
Of these, a resin containing only a repeating unit derived from an olefin is preferable, and polypropylene is particularly preferable from the viewpoint of cost.
ポリオレフィンの分子量は、特に限定されず、樹脂の種類、成形条件や樹脂成形体に用途等に応じて決定すればよい。例えば、ポリオレフィンの重量平均分子量(Mw)は、1万以上30万以下の範囲が好ましく、1万以上20万以下の範囲がより好ましい。
また、ポリオレフィンのガラス転移温度(Tg)又は融点(Tm)は、上記分子量と同様、特に限定されず、樹脂の種類、成形条件や樹脂成形体に用途等に応じて決定すればよい。例えば、ポリオレフィンの融点(Tm)は、100℃以上300℃以下の範囲が好ましく、150℃以上250℃以下の範囲がより好ましい。
The molecular weight of the polyolefin is not particularly limited, and may be determined according to the type of resin, molding conditions, application to the resin molded product, and the like. For example, the weight average molecular weight (Mw) of polyolefin is preferably in the range of 10,000 or more and 300,000 or less, and more preferably in the range of 10,000 or more and 200,000 or less.
Further, the glass transition temperature (Tg) or melting point (Tm) of the polyolefin is not particularly limited as in the above molecular weight, and may be determined according to the type of resin, molding conditions, application to the resin molded product, and the like. For example, the melting point (Tm) of the polyolefin is preferably in the range of 100 ° C. or higher and 300 ° C. or lower, and more preferably in the range of 150 ° C. or higher and 250 ° C. or lower.
なお、ポリオレフィンの重量平均分子量(Mw)及び融点(Tm)は、以下のようにして測定された値を示す。
即ち、ポリオレフィンの重量平均分子量(Mw)は、ゲルパーミエーションクロマトグラフィ(GPC)により、以下の条件で行う。GPC装置としては高温GPCシステム「HLC−8321GPC/HT」、溶離液としてo−ジクロロベンゼンを用いる。ポリオレフィンを一旦高温(140℃以上150℃以下の温度)でo−ジクロロベンゼンに溶融・ろ過し、ろ液を測定試料とする。測定条件としては、試料濃度0.5%、流速0.6ml/min.、サンプル注入量10μl、RI検出器を用いて行う。また、検量線は、東ソー社製「polystylene標準試料TSK standard」:「A−500」、「F−1」、「F−10」、「F−80」、「F−380」、「A−2500」、「F−4」、「F−40」、「F−128」、「F−700」の10サンプルから作成する。
また、ポリオレフィンの融点(Tm)は、示差走査熱量測定(DSC)により得られたDSC曲線から、JIS K 7121−1987「プラスチックの転移温度測定方法」の融解温度の求め方に記載の「融解ピーク温度」により求める。
The weight average molecular weight (Mw) and melting point (Tm) of the polyolefin show the values measured as follows.
That is, the weight average molecular weight (Mw) of the polyolefin is determined by gel permeation chromatography (GPC) under the following conditions. A high-temperature GPC system "HLC-8321GPC / HT" is used as the GPC apparatus, and o-dichlorobenzene is used as the eluent. The polyolefin is once melted and filtered into o-dichlorobenzene at a high temperature (temperature of 140 ° C. or higher and 150 ° C. or lower), and the filtrate is used as a measurement sample. The measurement conditions were a sample concentration of 0.5% and a flow velocity of 0.6 ml / min. , Sample injection volume 10 μl, using an RI detector. The calibration curve is "polystylene standard sample TSK standard" manufactured by Tosoh Corporation: "A-500", "F-1", "F-10", "F-80", "F-380", "A-". It is prepared from 10 samples of "2500", "F-4", "F-40", "F-128", and "F-700".
Further, the melting point (Tm) of the polyolefin is determined from the DSC curve obtained by differential scanning calorimetry (DSC), as described in "Melting peak" described in "Method for measuring transition temperature of plastics" of JIS K 7121-1987. Obtained by "temperature".
ポリオレフィンの含有量は、樹脂成形体の用途等に応じて、決定すればよいが、例えば、樹脂組成物の全質量に対して、5質量%以上95質量%以下が好ましく、10質量%以上95質量%以下がより好ましく、20質量%以上95質量%以下が更に好ましい。 The content of the polyolefin may be determined according to the use of the resin molded product and the like. For example, the content of the polyolefin is preferably 5% by mass or more and 95% by mass or less, and 10% by mass or more and 95% by mass or more, based on the total mass of the resin composition. More preferably, it is 20% by mass or more and 95% by mass or less.
−炭素繊維−
炭素繊維としては、公知の炭素繊維が用いられ、PAN系炭素繊維及びピッチ系炭素繊維のいずれもが用いられる。
-Carbon fiber-
As the carbon fiber, a known carbon fiber is used, and both a PAN-based carbon fiber and a pitch-based carbon fiber are used.
炭素繊維は、公知の表面処理が施されたものであってもよい。
炭素繊維の表面処理としては、例えば、酸化処理、サイジング処理が挙げられる。
炭素繊維の形態は、特に限定されず、樹脂成形体の用途等に応じて選択すればよい。炭素繊維の形態としては、例えば、多数の単繊維から構成される繊維束、繊維束を集束したもの、繊維を二次元又は三次元に織った織物等が挙げられる。
The carbon fiber may be one that has been subjected to a known surface treatment.
Examples of the surface treatment of the carbon fiber include an oxidation treatment and a sizing treatment.
The form of the carbon fiber is not particularly limited, and may be selected depending on the intended use of the resin molded product and the like. Examples of the form of carbon fibers include fiber bundles composed of a large number of single fibers, bundles of fiber bundles, and woven fabrics in which fibers are woven two-dimensionally or three-dimensionally.
炭素繊維の繊維径、繊維長等は、特に限定されず、樹脂成形体の用途等に応じて選択すればよい。
ただし、炭素繊維の繊維長が短くても、曲げ弾性率に優れた樹脂成形体が得られるため、炭素繊維の平均繊維長は、0.1mm以上2.5mm以下(好ましくは0.2mm以上2.0mm以下)であってもよい。
また、炭素繊維の平均直径は、例えば、5.0μm以上10.0μm以下(好ましくは6.0μm以上8.0μm以下)であってもよい。
The fiber diameter, fiber length, and the like of the carbon fiber are not particularly limited, and may be selected according to the application of the resin molded product and the like.
However, even if the fiber length of the carbon fibers is short, a resin molded body having an excellent flexural modulus can be obtained. Therefore, the average fiber length of the carbon fibers is 0.1 mm or more and 2.5 mm or less (preferably 0.2 mm or more 2). It may be 0.0 mm or less).
Further, the average diameter of the carbon fibers may be, for example, 5.0 μm or more and 10.0 μm or less (preferably 6.0 μm or more and 8.0 μm or less).
ここで、炭素繊維の平均繊維長の測定方法は、次の通りである。炭素繊維を光学顕微鏡によって倍率100で観察し、炭素繊維の長さを測定する。そして、この測定を炭素繊維200個について行い、その平均値を炭素繊維の平均繊維長とする。
一方、炭素繊維の平均直径の測定方法は、次の通りである。炭素繊維の長さ方向に直交する断面を、SEM(走査型電子顕微鏡)によって倍率1000倍で観察し、炭素繊維の直径を測定する。そして、この測定を炭素繊維100個について行い、その平均値を炭素繊維の平均直径とする。
Here, the method for measuring the average fiber length of carbon fibers is as follows. The carbon fibers are observed with an optical microscope at a magnification of 100, and the length of the carbon fibers is measured. Then, this measurement is performed on 200 carbon fibers, and the average value is taken as the average fiber length of the carbon fibers.
On the other hand, the method for measuring the average diameter of carbon fibers is as follows. A cross section orthogonal to the length direction of the carbon fiber is observed by an SEM (scanning electron microscope) at a magnification of 1000 times, and the diameter of the carbon fiber is measured. Then, this measurement is performed on 100 carbon fibers, and the average value thereof is taken as the average diameter of the carbon fibers.
炭素繊維としては、市販品を用いてもよい。
PAN系炭素繊維の市販品としては、東レ(株)製の「トレカ(登録商標)」、東邦テナックス(株)製の「テナックス」、三菱レイヨン(株)製の「パイロフィル(登録商標)」等が挙げられる。その他、PAN系炭素繊維の市販品としては、Hexcel社製、Cytec社製,Dow−Aksa社製、台湾プラスチック社製,SGL社製の市販品も挙げられる。
ピッチ系炭素繊維の市販品としては、三菱レイヨン(株)製の「ダイリアード(登録商標)」、日本グラファイトファイバー(株)製の「GRANOC」、(株)クレハ製の「クレカ」等が挙げられる。その他、ピッチ系炭素繊維の市販品としては、大阪ガスケミカル(株)製、Cytec社製の市販品も挙げられる。
As the carbon fiber, a commercially available product may be used.
Commercially available PAN-based carbon fibers include "Treca (registered trademark)" manufactured by Toray Industries, Inc., "Tenax" manufactured by Toho Tenax Co., Ltd., and "Pyrofil (registered trademark)" manufactured by Mitsubishi Rayon Co., Ltd. Can be mentioned. In addition, examples of commercially available PAN-based carbon fibers include commercially available products manufactured by Hexcel, Cytec, Dow-Axa, Formosa Plastics, and SGL.
Examples of commercially available pitch-based carbon fibers include "Dyriad (registered trademark)" manufactured by Mitsubishi Rayon Corporation, "GRANOC" manufactured by Nippon Graphite Fiber Co., Ltd., and "Kureka" manufactured by Kureha Corporation. .. In addition, examples of commercially available pitch-based carbon fibers include commercially available products manufactured by Osaka Gas Chemical Co., Ltd. and Cytec.
なお、炭素繊維は、1種を単独で用いてもよいし、2種以上を併用してもよい。 As the carbon fiber, one type may be used alone, or two or more types may be used in combination.
炭素繊維の含有量は、母材であるポリオレフィン100質量部に対し0.1質量部以上200質量部以下であること好ましく、1質量部以上180質量部以下であることがより好ましく、5質量部以上150質量部以下であることが更に好ましい。
炭素繊維がポリオレフィン100質量部に対し0.1質量部以上含まれることで、樹脂組成物の強化が図られ、また、炭素繊維の含有量を、ポリオレフィン100質量部に対し200質量部以下とすることで、樹脂成形体を得る際の成形性が良好になる。
なお、炭素繊維以外の強化繊維を用いる場合、強化繊維の全質量に対して80質量%以上を炭素繊維とすることが好ましい。
The content of the carbon fiber is preferably 0.1 part by mass or more and 200 parts by mass or less, more preferably 1 part by mass or more and 180 parts by mass or less with respect to 100 parts by mass of the polyolefin as the base material, and 5 parts by mass. It is more preferably 150 parts by mass or less.
The resin composition is strengthened by containing 0.1 part by mass or more of carbon fibers with respect to 100 parts by mass of polyolefin, and the content of carbon fibers is set to 200 parts by mass or less with respect to 100 parts by mass of polyolefin. As a result, the moldability when obtaining the resin molded product is improved.
When reinforcing fibers other than carbon fibers are used, it is preferable that 80% by mass or more of the reinforcing fibers is carbon fibers with respect to the total mass of the reinforcing fibers.
ここで、以降、ポリオレフィン100質量部に対する含有量(質量部)は、「phr(per hundred resin)と略記することがある。
この略記を使用した場合、上記炭素繊維の含有量は、0.1phr以上200phr以下となる。
Here, hereinafter, the content (parts by mass) with respect to 100 parts by mass of polyolefin may be abbreviated as "phr (per hungred resin)".
When this abbreviation is used, the content of the carbon fiber is 0.1 phr or more and 200 phr or less.
−イミド結合及びアミド結合の少なくとも一方を含む樹脂(特定樹脂)−
特定樹脂は、特定の部分構造を含み、前述したように、炭素繊維の周囲を被覆しうる樹脂である。
この特定樹脂について、詳細に説明する。
-Resin containing at least one of imide bond and amide bond (specific resin)-
The specific resin is a resin that contains a specific partial structure and can coat the periphery of carbon fibers as described above.
This specific resin will be described in detail.
特定樹脂は、ポリオレフィンとの相溶性が低い樹脂、具体的にはポリオレフィンとは溶解度パラメータ(SP値)が異なる樹脂であることが好ましい。
ここで、ポリオレフィンと特定樹脂とのSP値の差としては、両者間の相溶性、両者間の斥力の点から、3以上が好ましく、3以上6以下がより好ましい。
ここでいうSP値とは、Fedorの方法により算出された値である、具体的には、溶解度パラメータ(SP値)は、例えば、Polym.Eng.Sci.,vol.14,p.147(1974)の記載に準拠し、下記式によりSP値を算出する。
式:SP値=√(Ev/v)=√(ΣΔei/ΣΔvi)
(式中、Ev:蒸発エネルギー(cal/mol)、v:モル体積(cm3/mol)、Δei:それぞれの原子又は原子団の蒸発エネルギー、Δvi:それぞれの原子又は原子団のモル体積)
なお、溶解度パラメータ(SP値)は、単位として(cal/cm3)1/2を採用するが、慣行に従い単位を省略し、無次元で表記する。
The specific resin is preferably a resin having low compatibility with polyolefin, specifically, a resin having a solubility parameter (SP value) different from that of polyolefin.
Here, the difference in SP value between the polyolefin and the specific resin is preferably 3 or more, and more preferably 3 or more and 6 or less, from the viewpoint of compatibility between the two and repulsive force between the two.
The SP value referred to here is a value calculated by the Fedor method. Specifically, the solubility parameter (SP value) is, for example, Polym. Eng. Sci. , Vol. 14, p. Based on the description of 147 (1974), the SP value is calculated by the following formula.
Formula: SP value = √ (Ev / v) = √ (ΣΔei / ΣΔvi)
(In the formula, Ev: evaporation energy (cal / mol), v: molar volume (cm 3 / mol), Δei: evaporation energy of each atom or atomic group, Δvi: molar volume of each atom or atomic group)
As the solubility parameter (SP value), (cal / cm 3 ) 1/2 is adopted as the unit, but the unit is omitted according to the practice and is expressed dimensionlessly.
また、特定樹脂は、分子内にイミド結合及びアミド結合の少なくとも一方を含む。
イミド結合又はアミド結合を含むことで、炭素繊維の表面に存在する極性基との間で親和性が発現する。
特定樹脂の具体的な種類としては、イミド結合及びアミド結合の少なくとも一方を主鎖に含む熱可塑性樹脂が挙げられ、具体的には、ポリアミド(PA)、ポリイミド(PI)、ポリアミドイミド(PAI)、ポリエーテルイミド(PEI)、ポリアミノ酸等が挙げられる。
In addition, the specific resin contains at least one of an imide bond and an amide bond in the molecule.
By including an imide bond or an amide bond, an affinity is developed with the polar group present on the surface of the carbon fiber.
Specific types of the specific resin include thermoplastic resins having at least one of an imide bond and an amide bond in the main chain, and specifically, polyamide (PA), polyimide (PI), and polyamideimide (PAI). , Polyetherimide (PEI), polyamino acids and the like.
特定樹脂としては、ポリオレフィンとの相溶性が低く、SP値が異なる方が好ましいため、ポリオレフィンとは種類の異なる熱可塑性樹脂を用いることが好ましい。
中でも、曲げ弾性率の更なる向上の点、炭素繊維との密着性に優れる点から、ポリアミド(PA)が好ましい。
As the specific resin, it is preferable that the compatibility with polyolefin is low and the SP value is different. Therefore, it is preferable to use a thermoplastic resin different from that of polyolefin.
Among them, polyamide (PA) is preferable from the viewpoint of further improving the flexural modulus and excellent adhesion to carbon fibers.
ここで、特定樹脂と炭素繊維との密着性は、例えば、界面せん断強度といった指標にて評価される。
界面せん断強度は、マイクロドロップレット法を用いて測定される。ここで、図3に示す試験の模式図を用いて、マイクロドロップレット法について説明する。
マイクロドロップレット法とは、単繊維fに液体樹脂を塗布し、ドロップレットD(樹脂粒、樹脂玉とも呼ばれる)をつけ、このドロップレットDを固定した後に、矢印方向に単繊維fの引き抜き試験を行うことで、両者の界面接着性を評価する方法である。
そして、この試験を元に、下記式を用いて、界面せん断強度(τ)が算出される。
Here, the adhesion between the specific resin and the carbon fiber is evaluated by an index such as interfacial shear strength.
Interfacial shear strength is measured using the microdroplet method. Here, the microdroplet method will be described with reference to the schematic diagram of the test shown in FIG.
The microdroplet method is a test in which a liquid resin is applied to a single fiber f, a droplet D (also called a resin grain or a resin ball) is attached, the droplet D is fixed, and then the single fiber f is pulled out in the direction of an arrow. This is a method of evaluating the interfacial adhesiveness between the two.
Then, based on this test, the interfacial shear strength (τ) is calculated using the following formula.
式中、τは界面せん断強度を表し、Fは引抜荷重を表し、dは単繊維の繊維径を表し、Lはドロップレット長を表す。
算出された界面せん断強度(τ)の値が大きいほど、炭素繊維と特定樹脂との密着性が高いことを示し、この値が大きな炭素繊維及び特定樹脂の組み合わせを選択することにより、より高い曲げ弾性率を有する樹脂成形体が形成される、といった指標ともなる。
In the formula, τ represents the interfacial shear strength, F represents the pull-out load, d represents the fiber diameter of the single fiber, and L represents the droplet length.
The larger the value of the calculated interfacial shear strength (τ) is, the higher the adhesion between the carbon fiber and the specific resin is, and by selecting the combination of the carbon fiber and the specific resin having a large value, the bending is higher. It is also an index that a resin molded body having an elastic modulus is formed.
ポリアミドとしては、ジカルボン酸とジアミンとを共縮重合したもの、ラクタムを開環重縮合したもの、が挙げられる。
ジカルボン酸としては、シュウ酸、アジピン酸、スベリン酸、セバシン酸、テレフタル酸、イソフタル酸、1,4−シクロヘキサンジカルボン酸、マロン酸、コハク酸、グルタル酸、ピメリン酸、アゼライン酸、フタル酸、等が挙げられ、中でも、アジピン酸、テレフタル酸が好ましい。
ジアミンとしては、エチレンジアミン、ペンタメチレンジアミン、ヘキサメチレンジアミン、ノナンジアミン、デカメチレンジアミン、1,4−シクロヘキサンジアミン、p−フェニレンジアミン、m−フェニレンジアミン、m−キシレンジアミン等が挙げられ、中でも、ヘキサメチレンジアミンが好ましい。
ラクタムとしては、ε−カプロラクタム、ウンデカンラクタム、ラウリルラクタム等が挙げられ、中でも、ε−カプロラクタムが好ましい。
Examples of the polyamide include those obtained by copolymerizing dicarboxylic acid and diamine, and those obtained by ring-opening polycondensation of lactam.
Examples of the dicarboxylic acid include oxalic acid, adipic acid, suberic acid, sebacic acid, terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, malonic acid, succinic acid, glutaric acid, pimelic acid, azelaic acid, phthalic acid, etc. Among them, adipic acid and terephthalic acid are preferable.
Examples of the diamine include ethylenediamine, pentamethylenediamine, hexamethylenediamine, nonanediamine, decamethylenediamine, 1,4-cyclohexanediamine, p-phenylenediamine, m-phenylenediamine, m-xylenediamine and the like. Among them, hexamethylene. Diamine is preferred.
Examples of the lactam include ε-caprolactam, undecane lactam, lauryl lactam and the like, and among them, ε-caprolactam is preferable.
ポリアミドとしては、炭素繊維との親和性(接着性)の点、樹脂成形体の成形性の点から、ε−カプロラクタムを開環重縮合したポリアミド(PA6)、6.6ナイロン、6.10ナイロン、1〜12ナイロン、芳香族ナイロンで知られるMXD,HT−1m、6−Tナイロン、ポリアミノトリアゾール、ポリベンツイミダゾール、ポリオキサジアゾール、ポリアミドイミド、ピペラジン系ポリイミドであることが好ましく、中でも、6.6ナイロンが好ましい。 As the polyamide, polyamide (PA6), 6.6 nylon, and 6.10 nylon obtained by ring-opening and polycondensing ε-caprolactam from the viewpoint of affinity (adhesiveness) with carbon fibers and moldability of the resin molded body. , 1-12 nylon, MXD, HT-1m, 6-T nylon known as aromatic nylon, polyaminotriazole, polybenzimidazole, polyoxadiazol, polyamideimide, piperazine-based polyimide, among others, 6 6.6 Nylon is preferred.
特定樹脂の分子量は、特に限定されず、樹脂組成物中に併存するポリオレフィンよりも熱溶融し易ければよい。例えば、特定樹脂がポリアミドであれば、その重量平均分子量は、1万以上30万以下の範囲が好ましく、1万以上10万以下の範囲がより好ましい。
また、特定樹脂のガラス転移温度又は溶融温度(融点)は、上記分子量と同様、特に限定されず、樹脂組成物中に併存するポリオレフィンよりも熱溶融し易ければよい。例えば、特定樹脂がポリアミドであれば、その融点(Tm)は、100℃以上400℃以下の範囲が好ましく、150℃以上350℃以下の範囲がより好ましい。
The molecular weight of the specific resin is not particularly limited as long as it is easier to heat-melt than the polyolefin coexisting in the resin composition. For example, when the specific resin is polyamide, its weight average molecular weight is preferably in the range of 10,000 or more and 300,000 or less, and more preferably in the range of 10,000 or more and 100,000 or less.
Further, the glass transition temperature or the melting temperature (melting point) of the specific resin is not particularly limited as in the above molecular weight, and it may be easier to heat-melt than the polyolefin coexisting in the resin composition. For example, when the specific resin is polyamide, its melting point (Tm) is preferably in the range of 100 ° C. or higher and 400 ° C. or lower, and more preferably in the range of 150 ° C. or higher and 350 ° C. or lower.
特定樹脂の含有量は、ポリオレフィン100質量部に対し20質量部超え100質量部以下であり、曲げ弾性率の向上の観点から、30質量部以上90質量部以下であることが好ましく、40質量部以上80質量部以下であることが更に好ましい。 The content of the specific resin is more than 20 parts by mass and 100 parts by mass or less with respect to 100 parts by mass of polyolefin, and is preferably 30 parts by mass or more and 90 parts by mass or less, preferably 40 parts by mass, from the viewpoint of improving the flexural modulus. It is more preferably 80 parts by mass or less.
炭素繊維の質量に対する特定樹脂の含有量としては、曲げ弾性率の向上の観点から、0.1質量%以上200質量%以下であることが好ましく、10質量%以上150質量%以下であることがより好ましく、12質量%以上120質量%以下であることが更に好ましい。
炭素繊維の質量に対する特定樹脂の含有量が、0.1質量%以上であると炭素繊維と特定樹脂との親和性が高まり易くなり、200質量%以下であると樹脂流動性が向上する。
The content of the specific resin with respect to the mass of the carbon fibers is preferably 0.1% by mass or more and 200% by mass or less, and preferably 10% by mass or more and 150% by mass or less, from the viewpoint of improving the flexural modulus. More preferably, it is 12% by mass or more and 120% by mass or less.
When the content of the specific resin with respect to the mass of the carbon fibers is 0.1% by mass or more, the affinity between the carbon fibers and the specific resin tends to increase, and when it is 200% by mass or less, the resin fluidity improves.
−相溶化剤−
相溶化剤は、ポリオレフィンと特定樹脂との親和性を高める樹脂である。
相溶化剤としては、ポリオレフィンに応じて決定すればよい。
相溶化剤としては、ポリオレフィンと同じ構造又は相溶する構造を有し、且つ、分子内の一部に前述した特定樹脂と親和性を有する部位又は特定樹脂の官能基と反応する部位を含むものが好ましい。
-Solution agent-
The compatibilizer is a resin that enhances the affinity between the polyolefin and the specific resin.
The compatibilizer may be determined according to the polyolefin.
The compatibilizer includes a site having the same structure as that of polyolefin or a structure compatible with the polyolefin, and having a part in the molecule having an affinity for the above-mentioned specific resin or a site reacting with a functional group of the specific resin. Is preferable.
具体的には、相溶化剤としては、修飾ポリオレフィンを用いることが好ましい。
ここで、ポリオレフィンがポリプロピレン(PP)であれば修飾ポリオレフィンとしては修飾ポリプロピレン(PP)が好ましく、同様に、ポリオレフィンがエチレン・酢酸ビニル共重合樹脂(EVA)であれば修飾ポリオレフィンとしては修飾エチレン・酢酸ビニル共重合樹脂(EVA)が好ましい。
Specifically, it is preferable to use modified polyolefin as the compatibilizer.
Here, if the polyolefin is polypropylene (PP), modified polypropylene (PP) is preferable as the modified polyolefin, and similarly, if the polyolefin is ethylene-vinyl acetate copolymer resin (EVA), the modified polyolefin is modified ethylene-acetic acid. Vinyl copolymer resin (EVA) is preferable.
修飾ポリオレフィンとしては、カルボキシ基、カルボン酸無水物残基、カルボン酸エステル残基、イミノ基、アミノ基、エポキシ基等を含む修飾部位が導入されたポリオレフィンが挙げられる。
ポリオレフィンに導入される修飾部位としては、ポリオレフィンと特定樹脂との親和性の更なる向上の点、成形加工時の上限温度の点から、カルボン酸無水物残基を含むことが好ましく、特に、無水マレイン酸残基を含むことが好ましい。
Examples of the modified polyolefin include a polyolefin having a modified site containing a carboxy group, a carboxylic acid anhydride residue, a carboxylic acid ester residue, an imino group, an amino group, an epoxy group and the like introduced therein.
The modification site introduced into the polyolefin preferably contains a carboxylic acid anhydride residue from the viewpoint of further improving the affinity between the polyolefin and the specific resin and the upper limit temperature during molding, and is particularly anhydrous. It preferably contains a maleic anhydride residue.
修飾ポリオレフィンは、上述した修飾部位を含む化合物をポリオレフィンに反応させて直接化学結合する方法や、上述した修飾部位を含む化合物を用いてグラフト鎖を形成し、このグラフト鎖をポリオレフィンに結合させる方法などがある。
上述した修飾部位を含む化合物としては、無水マレイン酸、無水フマル酸、無水クエン酸、N−フェニルマレイミド、N−シクロヘキシルマレイミド、グリシジル(メタ)アクリレート、グリシジルビニルベンゾエート、N−〔4−(2,3−エポキシプロポキシ)−3,5−ジメチルベンジル〕アクリルアミド、アルキル(メタ)アクリレート、及びこれらの誘導体が挙げられる。
なお、上記の中でも、不飽和カルボン酸である無水マレイン酸をポリオレフィンと反応させてなる修飾ポリオレフィンが好ましい。
The modified polyolefin can be obtained by reacting a compound containing the above-mentioned modified site with a polyolefin to directly chemically bond the modified polyolefin, or using a compound containing the above-mentioned modified site to form a graft chain and binding the graft chain to the polyolefin. There is.
Examples of the compound containing the above-mentioned modification site include maleic anhydride, fumaric anhydride, citric anhydride, N-phenylmaleimide, N-cyclohexylmaleimide, glycidyl (meth) acrylate, glycidyl vinylbenzoate, and N- [4- (2,2). 3-Epoxypropoxy) -3,5-dimethylbenzyl] acrylamide, alkyl (meth) acrylates, and derivatives thereof.
Among the above, modified polyolefin obtained by reacting maleic anhydride, which is an unsaturated carboxylic acid, with polyolefin is preferable.
修飾ポリオレフィンとして具体的には、無水マレイン酸修飾ポリプロピレン、無水マレイン酸修飾ポリエチレン、無水マレイン酸修飾エチレン・酢酸ビニル共重合樹脂(EVA)、これらの付加体又は共重合等の酸修飾ポリオレフィンが挙げられる。 Specific examples of the modified polyolefin include maleic anhydride-modified polypropylene, maleic anhydride-modified polyethylene, maleic anhydride-modified ethylene-vinyl acetate copolymer resin (EVA), and acid-modified polyolefins such as adducts or copolymers thereof. ..
修飾ポリオレフィンとしては、市販品を用いてもよい。
修飾プロピレンとしては、三洋化成工業(株)製のユーメックス(登録商標)シリーズ(100TS、110TS、1001、1010)等が挙げられる。
修飾ポリエチレンとしては、三洋化成工業(株)製のユーメックス(登録商標)シリーズ(2000)、三菱化学(株)製のモディック(登録商標)シリーズ等が挙げられる。
修飾エチレン・酢酸ビニル共重合樹脂(EVA)としては、三菱化学(株)のモディック(登録商標)シリーズ等が挙げられる。
As the modified polyolefin, a commercially available product may be used.
Examples of the modified propylene include Youmex (registered trademark) series (100TS, 110TS, 1001, 1010) manufactured by Sanyo Chemical Industries, Ltd.
Examples of the modified polyethylene include Youmex (registered trademark) series (2000) manufactured by Sanyo Chemical Industries, Ltd., Modic (registered trademark) series manufactured by Mitsubishi Chemical Industries, Ltd., and the like.
Examples of the modified ethylene-vinyl acetate copolymer resin (EVA) include the Modic (registered trademark) series of Mitsubishi Chemical Corporation.
なお、相溶化剤の分子量は、特に限定されないが、加工性の点から、0.5万以上10万以下の範囲が好ましく、0.5万以上8万以下の範囲がより好ましい。 The molecular weight of the compatibilizer is not particularly limited, but from the viewpoint of processability, the range is preferably 5,000 or more and 100,000 or less, and more preferably 5,000 or more and 80,000 or less.
相溶化剤の含有量は、ポリオレフィン100質量部に対し1質量部以上50質量部以下であることが好ましく、2質量部以上40質量部以下であることがより好ましく、5質量部以上30質量部以下であることが更に好ましい。
相溶化剤の含有量は、特定樹脂100質量部に対し1質量部以上100質量部以下であることが好ましく、5質量部以上70質量部以下であることがより好ましく、10質量部以上50質量部以下であることが更に好ましい。
相溶化剤の含有量が上記の範囲であることで、ポリオレフィンと特定樹脂との親和性が高められ、曲げ弾性率の向上が図られる。
The content of the compatibilizer is preferably 1 part by mass or more and 50 parts by mass or less, more preferably 2 parts by mass or more and 40 parts by mass or less, and 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the polyolefin. The following is more preferable.
The content of the compatibilizer is preferably 1 part by mass or more and 100 parts by mass or less, more preferably 5 parts by mass or more and 70 parts by mass or less, and 10 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the specific resin. It is more preferably less than a part.
When the content of the compatibilizer is in the above range, the affinity between the polyolefin and the specific resin is enhanced, and the flexural modulus can be improved.
炭素繊維の質量に対する相溶化剤の含有量としては、1質量%以上100質量%以下であることが好ましく、5質量%以上70質量%以下であることがより好ましく、10質量%以上50質量%以下であることがさらに好ましい。
炭素繊維の質量に対する相溶化剤の含有量が、1質量%以上であると炭素繊維と特定樹脂との親和性が得られ易い。100質量%以下であると変色や劣化の原因となる未反応官能基の残存が抑制される。
The content of the compatibilizer with respect to the mass of the carbon fiber is preferably 1% by mass or more and 100% by mass or less, more preferably 5% by mass or more and 70% by mass or less, and 10% by mass or more and 50% by mass or less. The following is more preferable.
When the content of the compatibilizer with respect to the mass of the carbon fiber is 1% by mass or more, the affinity between the carbon fiber and the specific resin can be easily obtained. If it is 100% by mass or less, the residual unreacted functional groups that cause discoloration and deterioration are suppressed.
−その他の成分−
本実施形態に係る樹脂組成物は、上記各成分の他、その他の成分を含んでもよい。
その他の成分としては、例えば、難燃剤、難燃助剤、加熱された際の垂れ(ドリップ)防止剤、可塑剤、酸化防止剤、離型剤、耐光剤、耐候剤、着色剤、顔料、改質剤、帯電防止剤、加水分解防止剤、充填剤、炭素繊維以外の補強剤(タルク、クレー、マイカ、ガラスフレーク、ミルドガラス、ガラスビーズ、結晶性シリカ、アルミナ、窒化ケイ素、窒化アルミニウム、ボロンナイトライド等)等の周知の添加剤が挙げられる。
その他の成分は、例えば、ポリオレフィン100質量部に対し0質量部以上10質量部以下がよく、0質量部以上5質量部以下がより好ましい。ここで、「0質量部」とはその他の成分を含まない形態を意味する。
-Other ingredients-
The resin composition according to the present embodiment may contain other components in addition to the above-mentioned components.
Other components include, for example, flame retardants, flame retardants, anti-drip agents when heated, plastic agents, antioxidants, mold release agents, lightfasteners, weatherproofing agents, colorants, pigments, etc. Modifiers, antistatic agents, antioxidants, fillers, reinforcements other than carbon fibers (talc, clay, mica, glass flakes, milled glass, glass beads, crystalline silica, alumina, silicon nitride, aluminum nitride, Well-known additives such as boron nitride, etc.) can be mentioned.
The other components are, for example, preferably 0 parts by mass or more and 10 parts by mass or less, and more preferably 0 parts by mass or more and 5 parts by mass or less with respect to 100 parts by mass of polyolefin. Here, "0 parts by mass" means a form containing no other components.
(樹脂組成物の製造方法)
本実施形態に係る樹脂組成物は、上記各成分を溶融混練することにより製造される。
ここで、溶融混練の手段としては公知の手段が用いられ、例えば、二軸押出し機、ヘンシェルミキサー、バンバリーミキサー、単軸スクリュー押出機、多軸スクリュー押出機、コニーダ等が挙げられる。
溶融混練の際の温度(シリンダ温度)としては、樹脂組成物を構成する樹脂成分の融点等に応じて、決定すればよい。
(Manufacturing method of resin composition)
The resin composition according to the present embodiment is produced by melt-kneading each of the above components.
Here, as the means for melt-kneading, known means are used, and examples thereof include a twin-screw extruder, a Henschel mixer, a Banbury mixer, a single-screw screw extruder, a multi-screw screw extruder, and a conider.
The temperature (cylinder temperature) at the time of melt-kneading may be determined according to the melting point of the resin component constituting the resin composition and the like.
特に、本実施形態に係る樹脂組成物は、ポリオレフィンと、炭素繊維と、特定樹脂と、相溶化剤と、を溶融混練する工程を含む製造方法により得られることが好ましい。ポリオレフィンと、炭素繊維と、特定樹脂と、相溶化剤と、を一括して溶融混練すると、炭素繊維の周囲に特定樹脂による被覆層が薄く且つ均一に近い状態で形成され、また、ポリオレフィン中で特定樹脂のドメインが細かく分散され易くなり、曲げ弾性率が高まる。 In particular, the resin composition according to the present embodiment is preferably obtained by a production method including a step of melt-kneading a polyolefin, carbon fibers, a specific resin, and a compatibilizer. When the polyolefin, the carbon fiber, the specific resin, and the compatibilizer are collectively melt-kneaded, a coating layer made of the specific resin is formed around the carbon fiber in a thin and nearly uniform state, and in the polyolefin. The domain of the specific resin is easily dispersed finely, and the flexural modulus is increased.
[樹脂成形体]
本実施形態に係る樹脂成形体は、ポリオレフィンと、炭素繊維と、アミド結合及びイミド結合の少なくとも一方を含む樹脂(特定樹脂)と、相溶化剤と、を含む。そして、アミド結合及びイミド結合の少なくとも一方を含む樹脂の含有量は、ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である。また、特定樹脂の一部は、ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成している。つまり、本実施形態に係る樹脂成形体は、本実施形態に係る樹脂組成物と同じ組成で構成されている。
[Resin molded product]
The resin molded product according to the present embodiment contains a polyolefin, carbon fibers, a resin containing at least one of an amide bond and an imide bond (specific resin), and a compatibilizer. The content of the resin containing at least one of the amide bond and the imide bond is such that the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less. In addition, a part of the specific resin forms a domain having a diameter of 0.1 μm or more and 10 μm or less in polyolefin. That is, the resin molded product according to the present embodiment has the same composition as the resin composition according to the present embodiment.
なお、本実施形態に係る樹脂成形体は、本実施形態に係る樹脂組成物を調製しておき、この樹脂組成物を成形して得られたものであってもよいし、炭素繊維以外の成分を含む組成物を調製し、成形時に、かかる組成物と炭素繊維とを混合して得られたものであってもよい。
成形方法は、例えば、射出成形、押し出し成形、ブロー成形、熱プレス成形、カレンダ成形、コーティング成形、キャスト成形、ディッピング成形、真空成形、トランスファ成形などを適用してよい。
The resin molded product according to the present embodiment may be obtained by preparing the resin composition according to the present embodiment and molding the resin composition, or may be a component other than carbon fibers. A composition containing the above may be prepared and obtained by mixing the composition with carbon fiber at the time of molding.
As the molding method, for example, injection molding, extrusion molding, blow molding, hot press molding, calender molding, coating molding, cast molding, dipping molding, vacuum molding, transfer molding and the like may be applied.
本実施形態に係る樹脂成形体の成形方法は、形状の自由度が高い点で、射出成形が好ましい。
射出成形のシリンダ温度は、例えば180℃以上300℃以下であり、好ましくは200℃以上280℃以下である。射出成形の金型温度は、例えば30℃以上100℃以下であり、30℃以上60℃以下がより好ましい。
射出成形は、例えば、日精樹脂工業製NEX150、日精樹脂工業製NEX300、住友機械製SE50D等の市販の装置を用いて行ってもよい。
The method for molding the resin molded product according to the present embodiment is preferably injection molding because it has a high degree of freedom in shape.
The cylinder temperature for injection molding is, for example, 180 ° C. or higher and 300 ° C. or lower, preferably 200 ° C. or higher and 280 ° C. or lower. The mold temperature for injection molding is, for example, 30 ° C. or higher and 100 ° C. or lower, more preferably 30 ° C. or higher and 60 ° C. or lower.
Injection molding may be performed using commercially available devices such as NEX150 manufactured by Nissei Resin Industry Co., Ltd., NEX300 manufactured by Nissei Resin Industry Co., Ltd., and SE50D manufactured by Sumitomo Heavy Industries.
本実施形態に係る樹脂成形体は、電子・電気機器、事務機器、家電製品、自動車内装材、容器などの用途に好適に用いられる。より具体的には、電子・電気機器や家電製品の筐体;電子・電気機器や家電製品の各種部品;自動車の内装部品;CD−ROMやDVD等の収納ケース;食器;飲料ボトル;食品トレイ;ラップ材;フィルム;シート;などである。
特に、本実施形態に係る樹脂成形体は、強化繊維として炭素繊維を適用しているため、より機械的強度に優れた樹脂成形体となることから、金属部品への代替用途に好適となる。
The resin molded product according to the present embodiment is suitably used for applications such as electronic / electrical equipment, office equipment, home appliances, automobile interior materials, and containers. More specifically, housings for electronic / electrical equipment and home appliances; various parts for electronic / electrical equipment and home appliances; interior parts for automobiles; storage cases for CD-ROMs and DVDs; tableware; beverage bottles; food trays Wrap material; film; sheet; etc.
In particular, since the resin molded product according to the present embodiment uses carbon fiber as the reinforcing fiber, it becomes a resin molded product having more excellent mechanical strength, and is therefore suitable for alternative use to metal parts.
以下に実施例を挙げて本発明を具体的に説明するが、本発明はこれらの実施例に制限されるものではない。 The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples.
[実施例1〜12、比較例1〜13]
表1〜表2に従った成分(表中の数値は部数を示す)を、2軸混練装置(東芝機械製、TEM58SS)にて、下記の混練条件、および表1〜表2に示す溶融混練温度(シリンダ温度)で混練し、樹脂組成物のペレットを得た。なお、得られたペレットを600℃で2時間焼成し、残留した炭素繊維の平均繊維長を前述の方法で測定した。測定結果を表1〜表2に示す。
[Examples 1 to 12, Comparative Examples 1 to 13]
The components according to Tables 1 and 2 (the numerical values in the table indicate the number of copies) are kneaded in a twin-screw kneader (manufactured by Toshiba Machine Co., Ltd., TEM58SS) under the following kneading conditions and melt kneading shown in Tables 1 and 2. Kneading was performed at a temperature (cylinder temperature) to obtain pellets of the resin composition. The obtained pellets were calcined at 600 ° C. for 2 hours, and the average fiber length of the remaining carbon fibers was measured by the above method. The measurement results are shown in Tables 1 and 2.
−混練条件−
・スクリュー径:φ58mm
・回転数:300rpm
・吐出ノズル径:1mm
-Kneading conditions-
・ Screw diameter: φ58mm
・ Rotation speed: 300 rpm
・ Discharge nozzle diameter: 1 mm
得られたペレットを、射出成形機(日精樹脂工業製、NEX150)にて、表1〜表2に示す射出成形温度(シリンダ温度)、金型温度50℃で、ISO多目的ダンベル試験片(ISO527引張試験、ISO178曲げ試験に対応)(試験部厚さ4mm、幅10mm)と、D2試験片(長さ60mm、幅60mm、厚み2mm)と、を成形した。 The obtained pellets are subjected to an injection molding machine (manufactured by Nissei Resin Industry Co., Ltd., NEX150) at the injection molding temperature (cylinder temperature) and the mold temperature of 50 ° C. shown in Tables 1 and 2, and the ISO multipurpose dumbbell test piece (ISO527 tension). A D2 test piece (length 60 mm, width 60 mm, thickness 2 mm) was formed into a test (corresponding to the ISO178 bending test) (test portion thickness 4 mm, width 10 mm).
[評価]
得られた2種の試験片を用いて、以下のような評価を行った。評価結果を表1〜表2に示す。
[Evaluation]
The following evaluations were performed using the obtained two types of test pieces. The evaluation results are shown in Tables 1 and 2.
−引張弾性率、伸び−
得られたISO多目的ダンベル試験片について、評価装置(島津製作所製、精密万能試験機オートグラフAG−IS 5kN)を用いてISO527に準拠する方法で、引張り弾性率、及び伸びについて測定した。
-Tensile modulus, elongation-
The obtained ISO multipurpose dumbbell test piece was measured for tensile elastic modulus and elongation by a method conforming to ISO527 using an evaluation device (manufactured by Shimadzu Corporation, Autograph AG-IS 5kN, a precision universal testing machine).
−曲げ弾性率−
得られたISO多目的ダンベル試験片について、万能試験装置(島津製作所社製、オートグラフAG−Xplus)を用いて、ISO178に準拠する方法で、曲げ弾性率を測定した。
-Bending modulus-
The flexural modulus of the obtained ISO multipurpose dumbbell test piece was measured by a method conforming to ISO178 using a universal test device (manufactured by Shimadzu Corporation, Autograph AG-Xplus).
−荷重たわみ温度(HDT)−
得られたISO多目的ダンベル試験片について、HDT測定装置(東洋精機(株)製、HDT−3)を用いて、ISO178曲げ試験に準拠する方法で、1.8MPaの荷重における荷重たわみ温度(℃)を測定した。
-Weight Deflection Temperature (HDT)-
The obtained ISO multipurpose dumbbell test piece is subjected to a deflection temperature (° C.) under a load of 1.8 MPa by a method conforming to the ISO178 bending test using an HDT measuring device (HDT-3 manufactured by Toyo Seiki Co., Ltd.). Was measured.
−寸法変化率−
得られたD2試験片を、28℃、31%RHの条件下で24hr放置し、試験片のTD方向及びMD方向のそれぞれについて、放置前後での試験片の寸法変化率(%)を測定した。
なお、寸法変化は、顕微測長装置(オリンパス製、STM6−LM)により測定した。
-Dimensional change rate-
The obtained D2 test piece was left to stand for 24 hours under the conditions of 28 ° C. and 31% RH, and the dimensional change rate (%) of the test piece before and after leaving was measured in each of the TD direction and the MD direction of the test piece. ..
The dimensional change was measured by a microscopic length measuring device (manufactured by Olympus, STM6-LM).
−被覆層の有無−
得られたD2試験片を用いて、既述の方法に従って、特定樹脂による被覆層の有無を確認した。
-Presence or absence of coating layer-
Using the obtained D2 test piece, the presence or absence of a coating layer made of a specific resin was confirmed according to the method described above.
−特定樹脂のドメイン径の測定−
得られたD2試験片を用いて、既述の方法に従って、熱可塑性樹脂中での特定樹脂のドメイン径を測定した。
-Measurement of domain diameter of specific resin-
Using the obtained D2 test piece, the domain diameter of the specific resin in the thermoplastic resin was measured according to the method described above.
なお、表1〜表2の材料種の詳細は、以下の通りである。
−熱可塑性樹脂−
・ポリプロピレン(ノバテック(登録商標)PP MA3、日本ポリプロ(株)製)、SP値:9.3
−強化繊維−
・炭素繊維(表面処理有、チョップド炭素繊維トレカ(登録商標)、東レ(株)製、平均繊維長20mm、平均直径7μm)
−特定樹脂−
・ポリアミドPA6(PA6、ザイテル(登録商標)7331J、Dupont社製)、SP値:13.6
・ポリアミドPA66(PA66、101L、Dupont社製)、SP値:11.6
・ポリアミドPA1010(PA1010、Hiprolon 200、アルケマ社製)
・ポリアミドMXD6(MXD6、三菱ガス化学社製)
・ポリアミドPA9T(ナイロン9T、GENESTAR PA9T、クラレ製)
−相溶化剤−
・無水マレイン酸修飾ポリプロピレン(ユーメックス(登録商標)110TS、三洋化成工業(株)製
・無水マレイン酸修飾ポリエチレン(モディックM142、三菱化学(株)製)
・無水マレイン酸修飾EVA:無水マレイン酸修飾エチレン・酢酸ビニル共重合樹脂(モディックA543、三菱化学(株)製)
The details of the material types in Tables 1 and 2 are as follows.
-Thermoplastic resin-
-Polypropylene (Novatec (registered trademark) PP MA3, manufactured by Japan Polypropylene Corporation), SP value: 9.3
-Reinforcing fiber-
-Carbon fiber (with surface treatment, chopped carbon fiber Treca (registered trademark), manufactured by Toray Industries, Inc., average fiber length 20 mm, average diameter 7 μm)
-Specific resin-
-Polyamide PA6 (PA6, Zytel (registered trademark) 7331J, manufactured by DuPont), SP value: 13.6
-Polyamide PA66 (PA66, 101L, manufactured by DuPont), SP value: 11.6
-Polyamide PA1010 (PA1010, Hipprolon 200, manufactured by Arkema)
-Polyamide MXD6 (MXD6, manufactured by Mitsubishi Gas Chemical Company)
-Polyamide PA9T (nylon 9T, GENESTAR PA9T, made by Kuraray)
-Solution agent-
-Maleic anhydride-modified polypropylene (Umex (registered trademark) 110TS, manufactured by Sanyo Chemical Industries, Ltd.-Maleic anhydride-modified polyethylene (Modic M142, manufactured by Mitsubishi Chemical Corporation))
-Maleic anhydride-modified EVA: Maleic anhydride-modified ethylene-vinyl acetate copolymer resin (Modic A543, manufactured by Mitsubishi Chemical Corporation)
上記結果から、本実施例では、比較例に比べ、炭素繊維の繊維長が短くても、曲げ弾性率が優れた成形体が得られることがわかる。 From the above results, it can be seen that in this example, a molded product having an excellent flexural modulus can be obtained even if the fiber length of the carbon fibers is shorter than in the comparative example.
なお、各実施例で作製した成形体を既述方法により分析したところ、被覆層とポリオレフィンとの間に、使用した相溶化剤の層(無水マレイン酸修飾ポリプロピレンの層)が介在していること(被覆層の表面に相溶化剤の層が形成されていること)が確認された。 When the molded product produced in each example was analyzed by the above-mentioned method, a layer of the compatibilizer used (maleic anhydride-modified polypropylene layer) was interposed between the coating layer and the polyolefin. (The layer of the compatibilizer is formed on the surface of the coating layer) was confirmed.
Claims (20)
炭素繊維と、
アミド結合及びイミド結合の少なくとも一方を含む樹脂であって、前記ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である樹脂と、
相溶化剤と、
を含み、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成し、
前記相溶化剤の含有量が、前記ポリオレフィン100質量部に対し5質量部以上30質量部以下である、非架橋の樹脂組成物。 With polyolefin
With carbon fiber
A resin containing at least one of an amide bond and an imide bond, wherein the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less.
With a compatibilizer,
Including
A part of the resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the polyolefin .
A non-crosslinked resin composition in which the content of the compatibilizer is 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the polyolefin .
炭素繊維と、
アミド結合及びイミド結合の少なくとも一方を含む樹脂であって、前記ポリオレフィン100質量部に対する含有量が20質量部超え100質量部以下である樹脂と、
相溶化剤と、
を含み、
前記アミド結合及びイミド結合の少なくとも一方を含む樹脂の一部が、前記ポリオレフィン中で0.1μm以上10μm以下の径のドメインを形成し、
前記相溶化剤の含有量が、前記ポリオレフィン100質量部に対し5質量部以上30質量部以下である、非架橋の樹脂成形体。 With polyolefin
With carbon fiber
A resin containing at least one of an amide bond and an imide bond, wherein the content with respect to 100 parts by mass of the polyolefin is more than 20 parts by mass and 100 parts by mass or less.
With a compatibilizer,
Including
A part of the resin containing at least one of the amide bond and the imide bond forms a domain having a diameter of 0.1 μm or more and 10 μm or less in the polyolefin .
A non-crosslinked resin molded product in which the content of the compatibilizer is 5 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the polyolefin .
The resin molded product according to any one of claims 11 to 19, wherein the content of the compatibilizer with respect to the mass of the carbon fibers is 1% by mass or more and 100% by mass or less.
Priority Applications (1)
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|---|---|---|---|
| JP2016190271A JP6801341B2 (en) | 2016-09-28 | 2016-09-28 | Resin composition and resin molded product |
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