JP6803296B2 - Exposure equipment and substrate processing equipment - Google Patents

Description

The present invention relates to an exposure apparatus that exposes a substrate and a substrate processing apparatus including the exposure apparatus.

In recent years, in order to miniaturize the pattern formed on a substrate, the development of a photolithography technique using the directed self assembly (DSA) of a block copolymer has been promoted. In such a photolithography technique, the block polymer is modified by exposing one surface of the substrate after heat treatment is applied to the substrate coated with the block polymer. In this process, it is required to accurately adjust the exposure amount of the substrate.

Patent Document 1 describes an exposure apparatus that performs an exposure process on a film (DSA film) containing an inductive self-assembling material on a substrate. The exposure apparatus has a light emitting portion capable of emitting vacuum ultraviolet rays having a strip-shaped cross section, and is configured to be movable from a front position to a rear position of the light emitting portion so that the substrate crosses the path of the vacuum ultraviolet rays from the light emitting portion. To. Before the exposure process, the illuminance of the vacuum ultraviolet rays is detected in advance by the illuminance sensor, and the moving speed of the substrate is calculated based on the detected illuminance so that the vacuum ultraviolet rays of a desired exposure amount are irradiated. During the exposure process, the substrate moves at the calculated moving speed, so that the DSA film on the substrate is irradiated with a desired amount of vacuum ultraviolet rays.

Japanese Unexamined Patent Publication No. 2016-183990

In the above exposure apparatus, if the posture of the substrate with respect to the light irradiation unit is not appropriate, the entire surface of the substrate cannot be uniformly irradiated with vacuum ultraviolet rays. Therefore, in order to improve the processing accuracy of the substrate, it is necessary to properly maintain the posture of the substrate.

An object of the present invention is to provide an exposure apparatus and a substrate processing apparatus capable of appropriately maintaining the posture of a substrate.

(1) The exposure apparatus according to the first invention includes a processing chamber for accommodating a substrate, a light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber, and in the processing chamber and below the light source unit. The mounting portion on which the substrate is mounted and the mounting portion are in the first position when the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, and the light source unit irradiates the substrate with vacuum ultraviolet rays. The elevating part that raises and lowers the mounting part and the cooling part that is arranged below the mounting part in the processing chamber so that the mounting part is in the second position above the first position at the time of The elevating part includes a plurality of support shafts for supporting the mounting portion, a connecting member for connecting the plurality of support shafts to each other, an elevating drive mechanism for raising and lowering the connecting member, a guide member extending in the vertical direction, and a guide member. cooling section by viewing contains a moving portion provided at movably connecting member in the vertical direction, placing portion is the lower surface of the mounting portion when in a first position in contact with the upper surface of the cooling portion along the Cools the mounting portion, and when the mounting portion is in the second position, the lower surface of the mounting portion is separated from the upper surface of the cooling portion .

In this exposure apparatus, when the mounting portion is in the first position, the substrate is carried in and out of the processing chamber, and when the mounting portion is in the second position. , The light source unit irradiates the substrate on the mounting unit with vacuum ultraviolet rays. The mounting portion is supported by a plurality of support shafts, and the connecting member connecting the plurality of support shafts is raised and lowered by an elevating drive mechanism, so that the mounting portion is moved between the first position and the second position. It is raised and lowered.

In this case, since the mounting portion is supported by the plurality of support shafts and the plurality of support shafts are integrally raised and lowered, the mounting portion is supported by only one support shaft, or the plurality of support shafts are supported. It is possible to maintain a stable posture of the mounting portion as compared with the case where each is raised and lowered individually. Further, since the moving member provided on the connecting member moves in the vertical direction along the guide member, the moving of the connecting member in the vertical direction is assisted, and the mounting portion moves up and down stably. As a result, the posture of the substrate with respect to the light source unit can be appropriately maintained, and the processing accuracy of the substrate by vacuum ultraviolet rays can be improved.
Further, since the mounting portion and the cooling portion are in surface contact with each other, the mounting portion can be efficiently cooled. In this case, since the substrate is placed on the cooled mounting portion, the temperature rise of the substrate during irradiation with vacuum ultraviolet rays is suppressed. Therefore, the substrate after irradiation with vacuum ultraviolet rays can be immediately carried out from the processing chamber.

(2) The elevating drive mechanism includes a screw shaft extending in the vertical direction, a rotary drive unit for rotating the screw shaft, and a screw moving member attached to the screw shaft so as to move in the vertical direction by the rotation of the screw shaft. The connecting member may be configured to move in the vertical direction integrally with the screw moving member. In this case, the connecting member can be raised and lowered with a simple configuration.

(3) The rotary drive unit has a rotary shaft extending parallel to the screw shaft, and the elevating drive mechanism has a first pulley that rotates integrally with the screw shaft and a second pulley that rotates integrally with the screw shaft. It may include a pulley and a belt wound around the outer peripheral surface of the first pulley and the outer peripheral surface of the second pulley.

In this case, the degree of freedom in arranging the rotary drive unit is higher than in the case where the screw shaft is directly connected to the rotary drive unit. This makes it possible to make the elevating drive mechanism compact.

( 4 ) The exposure apparatus according to the second invention includes a processing chamber for accommodating a substrate, a light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber, and in the processing chamber and below the light source unit. The mounting portion on which the substrate is mounted and the mounting portion are in the first position when the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, and the light source unit irradiates the substrate with vacuum ultraviolet rays. The elevating part that raises and lowers the mounting part and the mounting part when the mounting part is in the first position so that the mounting part is in the second position above the first position at the time of A cooling unit provided in the processing chamber for cooling and a plurality of support pins extending upward from the cooling unit are provided, and the elevating unit connects a plurality of support shafts for supporting the mounting portion and a plurality of support shafts to each other. The mounting portion includes a connecting member, an elevating drive mechanism for raising and lowering the connecting member, a guide member extending in the vertical direction, and a moving portion provided on the connecting member so as to be movable in the vertical direction along the guide member. The upper end of each of the plurality of support pins is higher than the upper surface of the mounting portion in the first position and lower than the upper surface of the mounting portion in the second position. portion, a plurality of support pins has a plurality of through holes capable of passing, a plurality of support pins, mounting portion penetrates a plurality of through holes of the platform when in the first position.

In this case, with the mounting portion in the first position, the substrate carried into the processing chamber is mounted on a plurality of support pins, and the mounting portion is raised from the first position to the second position. As a result, the substrate is passed from the support pin to the mounting portion. Further, by lowering the mounting portion from the second position to the first position, the substrate is passed from the mounting portion onto the plurality of support pins, and the substrate is carried out of the processing chamber from the plurality of support pins. To. In this way, the substrate can be easily carried into the processing chamber and the substrate can be carried out of the processing chamber.

( 5 ) The exposure apparatus according to the third invention includes a processing chamber for accommodating a substrate, a light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber, and in the processing chamber and below the light source unit. The mounting portion on which the substrate is mounted and the mounting portion are in the first position when the substrate is carried into the processing chamber and the substrate is carried out of the processing chamber, and the light source unit irradiates the substrate with vacuum ultraviolet rays. In this case, the elevating part that raises and lowers the mounting part, the first pedestal that supports the light source part, and the processing chamber are supported so that the mounting part is in the second position above the first position. A second pedestal and a pedestal moving mechanism for moving the second pedestal with respect to the first pedestal are provided , and the elevating portion connects a plurality of support shafts for supporting the mounting portion and a plurality of support shafts to each other. It includes a connecting member, a lifting drive mechanism for raising and lowering the connecting member, a guide member extending in the vertical direction, and a moving portion provided on the connecting member so as to be movable in the vertical direction along the guide member .

In this case, since the light source unit is supported separately from the processing chamber, the light source unit can be easily installed even when the weight of the light source unit is large. Further, by moving the second gantry with respect to the first gantry, the processing chamber can be positioned with respect to the light source unit. As a result, the positional relationship between the light source unit and the processing chamber can be adjusted with high accuracy.

( 6 ) The gantry moving mechanism has a first handle that can be rotated, a support elevating member that can be integrally raised and lowered with the second gantry while supporting the second gantry, and a rotational force of the first handle. It may include an elevating transmission mechanism configured to elevate and elevate the support elevating member by transmitting it to the support elevating member.

In this case, the support elevating member moves up and down when the operator rotates the first handle, and the second gantry moves up and down accordingly. As a result, the processing chamber can be easily positioned in the vertical direction.

( 7 ) The positioning mechanism includes a second handle that can be rotated, a support moving member that supports the second pedestal and can move horizontally together with the second pedestal, and rotation of the second handle. It may include a horizontal transmission mechanism configured to move the support moving member in the horizontal direction by transmitting a force to the support moving member.

In this case, when the operator rotates the second handle, the support moving member moves horizontally, and the second gantry moves horizontally accordingly. Thereby, the horizontal positioning of the processing chamber can be easily performed.

( 8 ) The substrate processing apparatus according to the fourth invention includes a coating processing unit that forms a film on the substrate by applying a processing liquid to the substrate, and a heat treatment unit that heat-treats the substrate on which the film is formed by the coating processing unit. The above-mentioned exposure apparatus for exposing the substrate heat-treated by the heat-treating unit and a development processing unit for developing the substrate exposed by the exposure apparatus are provided.

In this substrate processing apparatus, after a film is formed on the substrate by the coating processing section, the substrate is heat-treated by the heat treatment section. The substrate heat-treated by the heat-treating unit is exposed by the above-mentioned exposure apparatus, and the exposed substrate is subjected to development processing by the development processing unit. In this case, in the exposure apparatus, the posture of the substrate with respect to the light source unit can be appropriately maintained, and the processing accuracy of the substrate by vacuum ultraviolet rays can be improved.

( 9 ) The treatment liquid may contain an inducible self-assembling material. In this case, microphase separation occurs on the substrate by the heat treatment by the heat treatment section. Further, by the exposure treatment by the exposure apparatus and the development treatment by the development processing unit, unnecessary polymers among the plurality of types of polymers are removed from the substrate, and a fine pattern is formed on the substrate.

According to the present invention, the posture of the substrate with respect to the light source unit can be appropriately maintained.

It is a schematic cross-sectional view which shows the structure of the exposure apparatus which concerns on 1st Embodiment of this invention. It is a schematic diagram for demonstrating the arrangement of an illuminometer. It is a schematic plan view for demonstrating the connection position of a mounting plate and a support shaft. It is a schematic side view which shows the structural example of a drive mechanism. It is a schematic side view which shows the structural example of a drive mechanism. It is an external perspective view of a drive mechanism. It is a schematic cross-sectional view which shows the structural example of a cooling part. It is a functional block diagram which shows the structure of a control part. It is a schematic diagram for demonstrating operation of an exposure apparatus. It is a schematic diagram for demonstrating operation of an exposure apparatus. It is a schematic diagram for demonstrating operation of an exposure apparatus. It is a schematic diagram for demonstrating operation of an exposure apparatus. It is a flowchart which shows an example of the exposure processing performed by the control unit. It is a flowchart which shows an example of the exposure processing performed by the control unit. It is an external perspective view which shows the modification of the exposure apparatus. It is an external perspective view of a positioning mechanism. It is a figure which shows the structure of the horizontal drive mechanism. It is a figure which shows the structure of the vertical drive mechanism. It is sectional drawing of the ball screw mechanism and its peripheral part. It is a figure which shows the arrangement of the horizontal drive mechanism and the vertical drive mechanism on the lower surface side of a stage. It is a schematic block diagram which shows the whole structure of the substrate processing apparatus provided with an exposure apparatus. It is a schematic diagram which shows an example of the processing of a substrate by a substrate processing apparatus. It is a schematic plan view which shows another example of a support shaft and a connecting member.

(1) Configuration of Exposure Device The exposure device according to the embodiment of the present invention will be described below with reference to the drawings. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display device substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, or the like.

FIG. 1 is a schematic cross-sectional view showing a configuration of an exposure apparatus according to an embodiment of the present invention. As shown in FIG. 1, the exposure apparatus 100 includes a control unit 110, a processing chamber 120, a closing unit 130, a light emitting unit 160, a replacement unit 170, and an elevating unit 300. The control unit 110 controls the operations of the processing chamber 120, the closing unit 130, the light projecting unit 160, the replacement unit 170, and the elevating unit 300. The function of the control unit 110 will be described later.

The processing chamber 120 includes a housing 121 having an upper opening and an internal space, an annular member 122 and a covering member 123. A transport opening 121a for transporting the substrate W to be processed is formed on the side surface of the housing 121 between the inside and the outside of the housing 121. In the present embodiment, a film containing an inductive self-assembling material (hereinafter, referred to as a DSA (Directed Self Assembly) film) is formed on the substrate W to be processed. Further, on the bottom surface of the housing 121, a pair of openings 121b through which a pair of support shafts 152, which will be described later pass, are formed.

By arranging the housing 161 of the light projecting unit 160, which will be described later, on the upper part of the housing 121 via the annular member 122, the upper opening of the housing 121 is closed. Seal members s1 and s2 are attached between the housing 121 and the annular member 122, and between the annular member 122 and the housing 161, respectively. Further, a covering member 123 is attached between the housing 121 and the housing 161 so as to cover the outer peripheral surface of the annular member 122.

The closing portion 130 includes a shutter 131, a rod-shaped connecting member 132, and a driving device 133. The connecting member 132 connects the shutter 131 and the driving device 133. The drive device 133 is, for example, a stepping motor. The drive device 133 moves the shutter 131 between an open position where the shutter 131 opens the transfer opening 121a and a closed position where the shutter 131 closes the transfer opening 121a.

A seal member 131a is attached to the shutter 131. When the shutter 131 is in the closed position, the inside of the housing 121 is sealed by the sealing member 131a coming into close contact with the portion of the housing 121 that surrounds the transport opening 121a. In order to prevent friction between the seal member 131a and the housing 121, the drive device 133 separated the shutter 131 from the housing 121 when moving the shutter 131 between the open position and the closed position. Move it up and down in the state.

Position sensors 133a and 133b for detecting the upper limit position and the lower limit position of the shutter 131 are attached to the drive device 133, respectively. The position sensors 133a and 133b give the detection result to the control unit 110. In the present embodiment, the drive device 133 and the drive mechanism 153 described later are provided outside the processing chamber 120. Therefore, even when dust is generated by driving the drive device 133 and the drive mechanism 153, it is possible to prevent the dust from directly entering the housing 121.

A delivery unit 140, a mounting plate 151, and a measurement unit 180 are provided in the housing 121 of the processing chamber 120. The delivery unit 140 includes, for example, a disk-shaped cooling unit 141 and a plurality (three in this example) support pins 142. The cooling unit 141 is arranged in the housing 121 in a horizontal posture. The cooling unit 141 is formed with a pair of openings 141a through which a pair of support shafts 152, which will be described later, pass through. The details of the cooling unit 141 will be described later. The plurality of support pins 142 extend upward from the upper surface of the cooling unit 141. The substrate W to be processed can be placed on the upper ends of the plurality of support pins 142.

The mounting plate 151 is arranged in the housing 121 in a horizontal posture above the cooling unit 141. The mounting plate 151 is formed with a plurality of through holes 151a corresponding to the plurality of support pins 142 on the cooling unit 141. Since the mounting plate 151 is raised and lowered by the elevating portion 300, the mounting plate 151 is placed at a processing position above the upper ends of the plurality of support pins 142 and below the upper ends of the plurality of support pins 142. Moved to the standby position.

The elevating part 300 includes a pair of support shafts 152, a connecting member 310, and a drive mechanism 153. The pair of support shafts 152 are arranged so as to extend in the vertical direction through the pair of openings 121b of the housing 121 and the pair of openings 141a of the cooling portion 141. The mounting plate 151 is fixed to the upper ends of the pair of support shafts 152. A seal member s3 is arranged between the outer peripheral surface of the support shaft 152 and the inner peripheral surface of the opening 121b so that the support shaft 152 can slide in the vertical direction. Below the housing 121, the pair of support shafts 152 are connected by a connecting member 310. Details of the connecting member 310 and the drive mechanism 153 will be described later.

When the mounting plate 151 is in the standby position, the plurality of support pins 142 are inserted into the plurality of through holes 151a, respectively. Further, the mounting plate 151 is cooled by the cooling unit 141 while the mounting plate 151 is in the standby position.

The measuring unit 180 includes an oxygen concentration meter 181 and an ozone concentration meter 182 and an illuminance meter 183. The oxygen concentration meter 181 and the ozone concentration meter 182 and the illuminance meter 183 are connected to the control unit 110 through the connection ports p1, p2 and p3 provided in the housing 121, respectively. The oxygen concentration meter 181 is, for example, a galvanic cell type oxygen sensor or a zirconia type oxygen sensor, and measures the oxygen concentration in the housing 121. The ozone concentration meter 182 measures the ozone concentration in the housing 121.

The illuminometer 183 includes a light receiving element such as a photodiode, and measures the illuminance of vacuum ultraviolet rays applied to the light receiving surface of the light receiving element. Here, the illuminance is the power of the vacuum ultraviolet rays irradiated per unit area of the light receiving surface. The unit of illuminance is represented by, for example, "W / m ² ". In the present embodiment, the illuminometer 183 is attached to the mounting plate 151 so that the light receiving surface of the light receiving element is located at substantially the same height as the surface to be processed of the substrate W.

The light projecting unit 160 includes a housing 161 having a lower opening and an internal space, a light transmitting plate 162, a light source unit 163, and a power supply device 164. In the present embodiment, the translucent plate 162 is a quartz glass plate. As the material of the light transmitting plate 162, another material that transmits vacuum ultraviolet rays, which will be described later, may be used. As described above, the housing 161 is arranged on the upper part of the housing 121 so as to close the upper opening of the housing 121. The translucent plate 162 is attached to the housing 161 so as to close the lower opening of the housing 161. The internal space of the housing 121 and the internal space of the housing 161 are optically accessiblely separated by a light transmitting plate 162.

The light source unit 163 and the power supply device 164 are housed in the housing 161. In the present embodiment, the light source unit 163 is configured by horizontally arranging a plurality of rod-shaped light sources that emit vacuum ultraviolet rays having a wavelength of about 120 nm or more and about 230 nm or less at predetermined intervals. Each light source may be, for example, a xenon excimer lamp, another excimer lamp, a deuterium lamp, or the like. The light source unit 163 emits vacuum ultraviolet rays having a substantially uniform light amount distribution in the housing 121 through the light transmitting plate 162. The area of the emission surface of the vacuum ultraviolet rays in the light source unit 163 is larger than the area of the surface to be processed of the substrate W. The power supply device 164 supplies electric power to the light source unit 163.

A light-shielding member 191 is provided below the light-transmitting plate 162 in the housing 121. The light-shielding member 191 is moved between the light-shielding position and the non-light-shielding position by a drive device (not shown). The light-shielding member 191 does not block the vacuum ultraviolet rays emitted from the light source unit 163 to the illuminometer 183 at the light-shielding position, and does not block the vacuum ultraviolet rays emitted from the light source unit 163 to the illuminance meter 183 at the non-light-shielding position. In FIG. 1, the light-shielding member 191 is in the light-shielding position.

The replacement unit 170 includes pipes 171p, 172p, 173p, valves 171v, 172v and a suction device 173. The pipes 171p and 172p are connected between the air supply port of the housing 121 and the supply source of the inert gas. In the present embodiment, the inert gas is nitrogen gas. Valves 171v and 172v are inserted in the pipes 171p and 172p.

The inert gas is supplied into the housing 121 from the side of the cooling unit 141 through the pipe 171p. The inert gas is supplied into the housing 121 from below the cooling unit 141 through the pipe 172p. The flow rate of the inert gas is adjusted by valves 171v and 172v.

The pipe 173p branches into a branch pipe 173a and a branch pipe 173b. The branch pipe 173a is connected to the exhaust port of the housing 121, and the end portion of the branch pipe 173b is arranged between the housing 121 and the shutter 131. A suction device 173 is inserted in the pipe 173p. A valve 173v is inserted in the branch pipe 173b. The suction device 173 is, for example, an ejector. The pipe 173p is connected to the exhaust equipment. The suction device 173 discharges the atmosphere inside the housing 121 through the branch pipe 173a and the pipe 173p. Further, the suction device 173 discharges the atmosphere between the housing 121 and the shutter 131 through the branch pipe 173b and the pipe 173p together with dust and the like generated by the movement of the shutter 131. The gas discharged by the suction device 173 is detoxified by the exhaust equipment.

FIG. 2 is a schematic diagram for explaining the arrangement of the illuminance meter 183. As shown in FIG. 2, the translucent plate 162 has a rectangular shape, and the substrate W has a circular shape. Therefore, the vicinity of the corner portion of the light transmitting plate 162 does not overlap with the substrate W at the processing position in a plan view. The mounting plate 151 includes a circular portion 151b overlapping the central portion of the translucent plate 162 and a corner portion 151c overlapping the vicinity of one corner portion of the translucent plate 162 in a plan view. During the exposure process, the substrate W is placed on the circular portion 151b. The illuminometer 183 is attached to the corner portion 151c. According to this arrangement, the illuminance meter 183 can measure the illuminance of the vacuum ultraviolet rays without interfering with the substrate W.

FIG. 3 is a schematic plan view for explaining the connection position between the mounting plate 151 and the support shaft 152. FIG. 3 shows a straight line DL passing through the central CT of the circular portion 151b of the mounting plate 151. The pair of support shafts 152 are arranged so as to overlap the straight line DL in a plan view. Further, in a plan view, the distance between one support shaft 152 and the center CT and the distance between the other support shaft 152 and the center CT are equal to each other. In this case, the pair of support shafts 152 are in point-symmetrical positions with respect to the central CT. Therefore, the mounting plate 151 can be stably supported.

(2) Details of Elevating Part FIG. 4 and FIG. 5 are schematic side views showing a detailed configuration example of the elevating part 300 of FIG. FIG. 6 is an external perspective view of the elevating portion 300. In the following description, the direction parallel to the straight line DL in FIG. 3 on the horizontal plane is referred to as the width direction, and the direction orthogonal to the straight line DL on the horizontal plane is referred to as the front-back direction.

In the examples of FIGS. 4 and 5, the upper surface portion 330 is provided so as to overlap the lower surface of the housing 121, and the bottom surface portion 335 is provided so as to be separated from the upper surface portion 330 by a certain distance downward. A drive mechanism 153 is provided between the upper surface portion 330 and the bottom surface portion 335.

The connecting member 310 is provided so as to extend in the width direction. The lower end of each support shaft 152 is fixed to the connecting member 310 by the fixing member 152a. As a result, the pair of support shafts 152 are connected to each other by the connecting member 310. A through hole 311 is formed in the central portion of the connecting member 310.

The drive mechanism 153 includes a ball screw mechanism 320, a drive device 360 (FIG. 5), and a belt 365 (FIG. 5). The ball screw mechanism 320 includes a screw shaft 321 and a nut 322. The screw shaft 321 includes a screw portion 321a and a mounting portion 321b, and an upper end portion of the screw portion 321a and a lower end portion of the mounting portion 321b are connected to each other. A thread is formed on the outer peripheral surface of the threaded portion 321a. Nut 322 is attached to the through hole 311 of the connecting member 310, threaded portion 321a of the threaded shaft 321 is inserted into the nut 322. A plurality of balls (not shown) roll between the thread of the screw shaft 321 and the thread of the nut 322.

The support plate 331 is provided so as to extend upward from the bottom surface portion 335. One surface of the support plate 331 faces the connecting member 310. A pair of guide rails 340 are provided on one surface of the support plate 331 so as to be arranged in the width direction. Each of the pair of guide rails 340 extends in the vertical direction.

A pair of moving members 345 are fixed to the connecting member 310, respectively. The pair of moving members 345 are provided so as to be linearly movable in the vertical direction along the pair of guide rails 340. Specifically, each moving member 345 is formed with a groove portion extending in the vertical direction, and the guide rail 340 is fitted into the groove portion. A plurality of balls that perform a rolling motion may be arranged between the groove portion of the moving member 345 and the guide rail 340.

As shown in FIG. 5, the support plate 332 is provided so as to extend in the front-rear direction from the upper end portion of the support plate 331. The support plate 332 is connected to the upper surface portion 330 via the connecting plates 333 and 334. As shown in FIG. 4, a cylindrical bearing member 336 is attached to the support plate 332. The mounting portion 321b of the screw shaft 321 is inserted into the bearing member 336 from below the support plate 332. On the upper surface side of the support plate 332, the annular fixing member 323 and the annular pulley 350a are fixed to the mounting portion 321b of the screw shaft 321. By locking the fixing member 323 on the bearing member 336, the screw shaft 321 is rotatably supported with respect to the support plate 332.

As shown in FIG. 5, the drive device 360 is provided so as to be aligned with the ball screw mechanism 320 in the front-rear direction with the support plate 331 interposed therebetween. The upper end of the drive device 360 is attached to the support plate 332. The drive device 360 has a rotating shaft 361 projecting upward, and a pulley 350b is fixed to the rotating shaft 361. The rotating shaft 361 and the screw shaft 321 are parallel to each other, and the endless belt 365 is wound around the pulleys 350a and 350b attached to the upper ends thereof. The drive device 360 rotates the rotating shaft 361 together with the pulley 350b.

In FIG. 6, the connecting plates 333 and 334 are transparently shown. A hole 334a is formed in the connecting plate 334. The belt 365 extends in the front-rear direction through the hole 334a. The rotation of the rotation shaft 361 of the drive device 360 is transmitted to the screw shaft 321 by the belt 365. As the screw shaft 321 rotates, the nut 322 attached to the connecting member 310 moves in the vertical direction on the outer peripheral surface of the screw shaft 321. As a result, the connecting member 310 moves up and down together with the pair of support shafts 152. In this case, the pair of moving members 345 fixed to the connecting member 310 move linearly in the vertical direction along the guide rail 340. As a result, the connecting member 310 maintains a horizontal posture and moves stably in the vertical direction. As a result, the mounting plate 151 of FIG. 1 maintains a horizontal posture and stably moves up and down between the standby position and the processing position.

(3) Cooling section FIG. 7 is a schematic cross-sectional view showing a configuration example of the cooling section 141. The cooling unit 141 of FIG. 7 includes a substantially disk-shaped cooling plate 146 and a heat transfer sheet 148. The cooling plate 146 is made of a metal such as aluminum. A cooling passage 147 is formed inside the cooling plate 146. The cooling passage 147 extends in a spiral shape in, for example, the cooling plate 146. The cooling plate 146 is cooled by circulating a cooling medium (for example, homeothermic water) through the cooling passage 147. The heat transfer sheet 148 is made of a non-metal material having high thermal conductivity (for example, silicon), and is provided so as to cover the upper surface of the cooling plate 146. The opening 141a includes an opening 146a formed in the cooling plate 146 and an opening 148a formed in the heat transfer sheet 148.

The upper surface of the heat transfer sheet 148 corresponds to the contact surface. When the mounting plate 151 of FIG. 1 is in the standby position, the lower surface of the mounting plate 151 comes into contact with the upper surface of the heat transfer sheet 148.

When both the mounting plate 151 of FIG. 1 and the cooling plate 146 of FIG. 7 are made of metal, when they come into direct contact with each other, particles are likely to be generated by so-called metal touch. On the other hand, by providing the heat transfer sheet 148 on the cooling plate 146, it is possible to prevent the mounting plate 151 from coming into direct contact with the cooling plate 146. As a result, the generation of particles due to the metal touch is prevented.

If at least one of the mounting plate 151 and the cooling plate 146 is made of non-metal, or if other measures are taken against the generation of particles, the heat transfer sheet 148 is not provided and the mounting plate is not provided. The lower surface of 151 may be in direct contact with the upper surface of the cooling plate 146.

(4) Schematic operation of the exposure apparatus In the exposure apparatus 100 of FIG. 1, the exposure process is performed by irradiating the substrate W with vacuum ultraviolet rays from the light source unit 163. However, when the oxygen concentration in the housing 121 is high, the oxygen molecules absorb the vacuum ultraviolet rays and separate into oxygen atoms, and the separated oxygen atoms recombine with other oxygen molecules to generate ozone. In this case, the vacuum ultraviolet rays reaching the substrate W are attenuated. The attenuation of vacuum ultraviolet light is greater than the attenuation of ultraviolet light at wavelengths longer than about 230 nm.

Therefore, before the exposure process, the atmosphere inside the housing 121 is replaced with the inert gas by the replacement unit 170. As a result, the oxygen concentration in the housing 121 is reduced. When the oxygen concentration measured by the oxygen concentration meter 181 is reduced to a predetermined concentration, the substrate W is irradiated with vacuum ultraviolet rays from the light source unit 163. Here, the predetermined concentration is preferably an oxygen concentration (for example, 1%) in which ozone is not generated by the vacuum ultraviolet rays emitted by the light source unit 163.

When the exposure amount of the vacuum ultraviolet rays on the substrate W reaches a predetermined set exposure amount, the irradiation of the vacuum ultraviolet rays is stopped and the exposure process is completed. Here, the exposure amount is the energy of the vacuum ultraviolet rays irradiated per unit area of the surface to be processed of the substrate W during the exposure process. The unit of the exposure amount is represented by, for example, "J / m ² ". The exposure amount of the vacuum ultraviolet rays is acquired by integrating the illuminance of the vacuum ultraviolet rays measured by the illuminance meter 183.

In the above exposure process, the substrate W is heated by irradiating the substrate W with vacuum ultraviolet rays. In this case, if the temperature of the substrate W rises above a predetermined temperature (for example, 50 degrees), the substrate W cannot be carried out from the processing chamber 120 and waits until the temperature of the substrate W drops below the predetermined temperature. There is a need to. Therefore, the efficiency of the exposure process of the substrate W is lowered.

In the present embodiment, the mounting plate 151 is moved to the standby position before the exposure process and is cooled in advance by coming into contact with the cooling unit 141. During the exposure process, the substrate W is placed on the mounting plate 151, the mounting plate 151 is moved to the processing position, and the substrate W is irradiated with vacuum ultraviolet rays in a state where the substrate W is close to the light source unit 163. In this case, since the substrate W is mounted on the cooled mounting plate 151, it is possible to prevent the temperature of the substrate W from rising above a predetermined temperature. As a result, the substrate W does not have to stand by in order to lower the temperature of the substrate W.

Further, in the present embodiment, since the mounting plate 151 is stably raised and lowered while maintaining the horizontal posture by the elevating portion 300, the entire lower surface of the mounting plate 151 is the upper surface of the cooling portion 141 (heat transfer sheet 148). Contact the top surface of). As a result, the entire mounting plate 151 is sufficiently cooled, so that the temperature rise of the substrate W mounted on the mounting plate 151 is sufficiently suppressed.

As described above, in the present embodiment, the illuminance meter 183 is provided on the mounting plate 151 so that the light receiving surface of the light receiving element is located at substantially the same height as the surface to be processed of the substrate W. Therefore, even when the vacuum ultraviolet rays are partially absorbed and attenuated by the oxygen molecules remaining between the substrate W and the light source unit 163, the surface to be processed of the substrate W and the light receiving surface of the illuminometer 183 are substantially the same. Vacuum ultraviolet rays will reach. Therefore, the illuminance measured by the illuminometer 183 is substantially equal to the illuminance of the vacuum ultraviolet rays applied to the surface to be treated of the substrate W.

Further, in the present embodiment, since the mounting plate 151 is stably raised and lowered while maintaining the horizontal posture by the elevating unit 300, the emission surface of the vacuum ultraviolet rays in the light source unit 163 and the mounting plate 151 are maintained in parallel. Will be done. Therefore, it is possible to prevent an error from occurring between the illuminance on the surface to be processed of the substrate W and the illuminance measured by the illuminance meter 183. As a result, the illuminance of the vacuum ultraviolet rays reaching the substrate W can be accurately measured with a simple configuration.

On the other hand, if the illuminance meter 183 is continuously irradiated with vacuum ultraviolet rays for a long period of time, the illuminance meter 183 tends to deteriorate, and the life of the illuminance meter 183 is shortened. In addition, the frequency of maintenance work such as calibration of the illuminance meter 183 increases. In the present embodiment, the light-shielding member 191 moves between the light-shielding position and the non-light-shielding position during the exposure process. In this case, the illuminometer 183 is intermittently irradiated with vacuum ultraviolet rays, and the rate of deterioration of the illuminometer 183 is slower than when the illuminometer 183 is continuously irradiated with vacuum ultraviolet rays. As a result, the life of the illuminance meter 183 is extended. Moreover, the frequency of maintenance work of the illuminance meter 183 can be reduced. It is preferable that the illuminance of the vacuum ultraviolet rays during the period when the light-shielding member 191 is in the light-shielding position is interpolated based on the illuminance during the periods before and after that.

(5) Control unit FIG. 8 is a functional block diagram showing the configuration of the control unit 110 of FIG. As shown in FIG. 8, the control unit 110 includes a blockage control unit 1, an elevating control unit 2, an exhaust control unit 3, an air supply control unit 4, a density acquisition unit 5, a density comparison unit 6, an illuminance acquisition unit 7, and an exposure amount. It includes a calculation unit 8, an exposure amount comparison unit 9, and a light projection control unit 10.

The control unit 110 is composed of, for example, a CPU (Central Processing Unit) and a memory. The control program is stored in advance in the memory of the control unit 110. When the CPU of the control unit 110 executes the control program stored in the memory, the functions of each unit of the control unit 110 are realized.

The blockage control unit 1 controls the drive device 133 so that the shutter 131 moves between the closed position and the open position based on the detection results of the position sensors 133a and 133b in FIG. The elevating control unit 2 controls the drive device 360 of FIG. 5 so that the mounting plate 151 moves between the standby position and the processing position.

The exhaust control unit 3 controls the suction device 173 and the valve 173v so as to exhaust the atmosphere inside the housing 121 and the atmosphere between the housing 121 and the shutter 131 in FIG. The air supply control unit 4 controls the valves 171v and 172v of FIG. 1 so as to supply the inert gas into the housing 121.

The concentration acquisition unit 5 acquires the value of the oxygen concentration measured by the oxygen concentration meter 181 of FIG. The concentration comparison unit 6 compares the oxygen concentration measured by the concentration acquisition unit 5 with a predetermined concentration.

The illuminance acquisition unit 7 acquires the value of the illuminance of the vacuum ultraviolet rays measured by the illuminance meter 183 of FIG. The exposure amount calculation unit 8 determines the vacuum ultraviolet rays to be applied to the substrate W based on the illuminance of the vacuum ultraviolet rays acquired by the illuminance acquisition unit 7 and the irradiation time of the vacuum ultraviolet rays from the light source unit 163 of FIG. 1 to the substrate W. Calculate the exposure amount. The exposure amount comparison unit 9 compares the exposure amount calculated by the exposure amount calculation unit 8 with a predetermined set exposure amount.

The light projection control unit 10 controls the supply of electric power from the power supply device 164 of FIG. 1 to the light source unit 163 so that the light source unit 163 emits vacuum ultraviolet rays based on the comparison result by the density comparison unit 6. Further, the light projection control unit 10 controls the power supply device 164 so that the light source unit 163 stops emitting vacuum ultraviolet rays based on the comparison result by the exposure amount comparison unit 9.

(6) Exposure Processing FIGS. 9 to 12 are schematic views for explaining the operation of the exposure apparatus 100. In FIGS. 9 to 12, some of the components are omitted, and the housing 121 and the housing 161 are shown by alternate long and short dash lines. 13 and 14 are flowcharts showing an example of the exposure process performed by the control unit 110 of FIG. Hereinafter, the exposure process by the control unit 110 will be described with reference to FIGS. 9 to 12.

As shown in FIG. 9, in the initial state of the exposure process, the shutter 131 is in the closed position and the mounting plate 151 is in the standby position. Therefore, the lower surface of the mounting plate 151 and the upper surface of the cooling unit 141 (the upper surface of the heat transfer sheet 148) come into contact with each other. As a result, the mounting plate 151 is pre-cooled by the cooling unit 141. Further, the oxygen concentration in the housing 121 is constantly or periodically measured by the oxygen concentration meter 181 and acquired by the concentration acquisition unit 5. At this point, the oxygen concentration in the housing 121 measured by the oxygen concentration meter 181 is equal to the oxygen concentration in the atmosphere.

First, the blockage control unit 1 moves the shutter 131 to the open position as shown in FIG. 10 (step S1). As a result, the substrate W to be processed can be placed on the upper ends of the plurality of support pins 142 through the transport opening 121a. In this example, the substrate W is placed on the upper ends of the plurality of support pins 142 by the transport device 220 of FIG. 21 described later.

Next, the elevating control unit 2 determines whether or not the substrate W is placed on the upper ends of the plurality of support pins 142 (step S2). When the board W is not mounted, the elevating control unit 2 waits until the board W is mounted on the upper ends of the plurality of support pins 142. When the substrate W is placed, the elevating control unit 2 moves the shutter 131 to the closed position as shown in FIG. 11 (step S3).

Subsequently, the exhaust control unit 3 discharges the atmosphere inside the housing 121 by the suction device 173 of FIG. 1 (step S4). Further, the air supply control unit 4 supplies the inert gas into the housing 121 through the pipes 171p and 172p of FIG. 1 (step S5). The processes of steps S4 and S5 may be started first or at the same time.

After that, the concentration comparison unit 6 determines whether or not the oxygen concentration in the housing 121 has dropped to a predetermined concentration (step S6). If the oxygen concentration has not decreased to a predetermined concentration, the concentration comparison unit 6 waits until the oxygen concentration decreases to a predetermined concentration. When the oxygen concentration drops to a predetermined concentration, the light projection control unit 10 emits vacuum ultraviolet rays by the light source unit 163 (step S7).

Next, the elevating control unit 2 moves the mounting plate 151 to the processing position as shown in FIG. 12 (step S8). As a result, the substrate W is transferred from the plurality of support pins 142 to the mounting plate 151. In this case, the substrate W is brought close to the translucent plate 162 while being cooled by the mounting plate 151. In this state, the substrate W is irradiated with vacuum ultraviolet rays from the light source unit 163 through the light transmitting plate 162, and the DSA film formed on the surface to be treated is exposed.

In the present embodiment, the mounting plate 151 is stably moved to the processing position by maintaining the horizontal posture by the elevating portion 300. As a result, the emission surface of the vacuum ultraviolet rays in the light source unit 163 of FIG. 1 and the surface to be processed of the substrate W on the mounting plate 151 are maintained in parallel. Therefore, the surface to be treated of the substrate W is uniformly irradiated with vacuum ultraviolet rays from the light source unit 163. As a result, the accuracy of the exposure process of the DSA film is improved.

Here, the illuminance acquisition unit 7 causes the illuminance meter 183 to start measuring the illuminance of the vacuum ultraviolet rays, and acquires the measured illuminance from the illuminance meter 183 (step S9). The exposure amount calculation unit 8 calculates the exposure amount of the vacuum ultraviolet rays radiated to the substrate W by integrating the illuminance of the vacuum ultraviolet rays acquired by the illuminance acquisition unit 7 (step S10).

Subsequently, the exposure amount comparison unit 9 determines whether or not the exposure amount calculated by the exposure amount calculation unit 8 has reached the set exposure amount (step S11). When the exposure amount has not reached the set exposure amount, the exposure amount comparison unit 9 waits until the exposure amount reaches the set exposure amount.

When the exposure amount reaches the set exposure amount, the elevating control unit 2 moves the mounting plate 151 to the standby position as shown in FIG. 11 (step S12). As a result, the substrate W is transferred from the mounting plate 151 to the plurality of support pins 142. Further, the lower surface of the mounting plate 151 and the upper surface of the cooling unit 141 (the upper surface of the heat transfer sheet 148) come into contact with each other. As a result, the mounting plate 151 is pre-cooled by the cooling pipe 143a in preparation for the exposure processing of the substrate W that is then carried into the exposure apparatus 100.

Next, the light projection control unit 10 stops the emission of the vacuum ultraviolet rays from the light source unit 163 (step S13). Further, the illuminance acquisition unit 7 stops the measurement of the illuminance by the illuminance meter 183 (step S14). Subsequently, the exhaust control unit 3 stops the exhaust of the atmosphere in the housing 121 by the suction device 173 (step S15). Further, the air supply control unit 4 stops the supply of the inert gas from the pipes 171p and 172p into the housing 121 (step S16). The processes of steps S13 to S16 may be started first or at the same time.

After that, the blockage control unit 1 moves the shutter 131 to the open position as shown in FIG. 10 (step S17). As a result, the exposed substrate W can be carried out from the plurality of support pins 142 to the outside of the housing 121 through the transport opening 121a. In this example, the substrate W is carried out from the plurality of support pins 142 to the outside of the housing 121 by the transport device 220 of FIG. 21 described later.

Next, the blockage control unit 1 determines whether or not the substrate W has been carried out from the plurality of support pins 142 (step S18). When the board W is not carried out, the blockage control unit 1 waits until the board W is carried out from the plurality of support pins 142. When the substrate W is carried out, the blockage control unit 1 moves the shutter 131 to the blockage position (step S19) as shown in FIG. 9, and ends the exposure process. By repeating the above operation, the exposure processing can be sequentially performed on the plurality of substrates W.

In the above exposure process, the substrate W is irradiated with vacuum ultraviolet rays from the light source unit 163 before the mounting plate 151 is moved to the processing position. In this case, the substrate W is also irradiated with vacuum ultraviolet rays in the process of moving the mounting plate 151 from the standby position to the processing position. Therefore, the exposure of the substrate W is completed in a shorter time. Thereby, the efficiency of the exposure processing of the substrate W can be further improved.

On the other hand, the mounting plate 151 is moved to the processing position while reducing the oxygen concentration in the housing 121, and after the oxygen concentration is lowered to a predetermined concentration and the mounting plate 151 reaches the processing position, the substrate is removed from the light source unit 163. W may be irradiated with vacuum ultraviolet rays. In this case, the exposure of the substrate W is completed in a shorter time.

Further, in the above exposure processing, the mounting plate 151 moves from the processing position to the standby position after the exposure amount of the substrate W reaches the set exposure amount, but the present invention is not limited to this. The mounting plate 151 may move from the processing position to the standby position before the exposure amount of the substrate W reaches the set exposure amount. In this case, the substrate W can be carried out from the processing chamber 120 at an earlier time after the exposure amount of the substrate W reaches the set exposure amount.

(7) Deformation Example of Exposure Device FIG. 15 is an external perspective view showing a modification of the exposure apparatus 100. The difference between the exposure apparatus 100 of FIG. 15 and the exposure apparatus 100 of FIG. 1 will be described. The exposure device 100 of FIG. 15 includes pedestals 400 and 450 and a positioning mechanism 500.

The gantry 400 includes a rectangular bottom surface 405, four columns 410, and a rectangular upper frame 415. Four columns 410 extend upward from the four corners of the upper surface of the bottom surface portion 405. The upper frame 415 is fixed to the upper end of these columns 410. The light projecting unit 160 is placed on the upper frame 415. As a result, the light projecting unit 160 is independently supported by the gantry 400.

The gantry 450 includes a rectangular bottom surface 455, four columns 460, and a rectangular top surface 465. The bottom surface portion 455 is provided on the elevating plate 550 described later. Four columns 460 extend upward from the four corners of the upper surface of the bottom surface portion 455. The upper surface portion 465 is fixed to the upper end portion of these columns 460. The bottom surface portion 455 corresponds to the bottom surface portion 335 of FIG. 4, and the top surface portion 465 corresponds to the top surface portion 330 of FIG. The housing 121 of the processing chamber 120 is placed on the upper surface portion 465, and the drive mechanism 153 of FIGS. 4 to 6 is provided between the bottom surface portion 455 and the upper surface portion 465. In addition to the drive mechanism 153, the drive device 133 of the closing portion 130 of FIG. 1 may be provided between the bottom surface portion 455 and the top surface portion 465.

The positioning mechanism 500 is provided between the bottom surface portion 405 of the gantry 400 and the bottom surface portion 455 of the gantry 450. The positioning mechanism 500 moves the gantry 450 in the horizontal direction and the vertical direction with respect to the gantry 400. As a result, the processing chamber 120 can be positioned with respect to the light projecting unit 160.

When the light projecting unit 160 alone has a large weight, it is difficult to handle the light projecting unit 160 together with other elements (processing chamber 120, elevating unit 300, etc.). In this example, since the light projecting unit 160 is independently supported by the gantry 400, the light projecting unit 160 can be conveyed and installed separately from other elements. As a result, the light projecting unit 160 and other elements can be easily installed, and maintenance of the light projecting unit 160 and other elements can be easily performed. Further, since the processing chamber 120 can be positioned with respect to the light projecting unit 160 by the positioning mechanism 500, the positional relationship between the light projecting unit 160 and the processing chamber 120 can be adjusted with high accuracy. As a result, the processing accuracy of the substrate W can be improved. In particular, it is possible to maintain a high degree of parallelism between the emission surface of the vacuum ultraviolet rays in the light source unit 163 of the light projecting unit 160 and the mounting plate 151 in the processing chamber 120. As a result, the substrate W on the mounting plate 151 can be uniformly irradiated with vacuum ultraviolet rays from the light source unit 163.

A specific configuration of the positioning mechanism 500 will be described. FIG. 16 is an external perspective view of the positioning mechanism 500. As shown in FIG. 16, the positioning mechanism 500 includes a plate-shaped stage 510 arranged horizontally. The stage 510 has a rectangular portion 511 and a protruding portion 512 protruding from one side of the rectangular portion 511. The lifting plate 550 is supported above the rectangular portion 511 by the ball screw mechanism 536 and the plurality of linear guides 545 described later. The shape and dimensions of the elevating plate 550 are substantially the same as the shape and dimensions of the bottom surface portion 455 of the gantry 450 of FIG.

The positioning mechanism 500 includes a horizontal drive mechanism 520 for moving the gantry 450 in the horizontal direction, and a vertical drive mechanism 530 for moving the gantry 450 in the vertical direction. FIG. 17 is a diagram showing a configuration of the horizontal drive mechanism 520. In FIG. 17, stage 510 is shown transparently. As shown in FIG. 17, the horizontal drive mechanism 520 includes a horizontal handle 521, a ball screw mechanism 522, and a pair of linear guides 525. The ball screw mechanism 522 includes a screw shaft 523 and a moving portion 524. The screw shaft 523 extends in one direction on a horizontal plane (hereinafter, referred to as a specified direction) and is rotatably supported by a pair of bearing portions 540. The pair of bearing portions 540 are provided on the upper surface of the bottom surface portion 405 of FIG. A thread is formed on the outer peripheral surface of the screw shaft 523 between the pair of bearing portions 540. A horizontal handle 521 is connected to one end of the screw shaft 523, and the screw shaft 523 and the horizontal handle 521 rotate integrally.

The moving portion 524 is fixed to the lower surface of the stage 510. A through hole 524a is formed in the moving portion 524, and a thread corresponding to the screw shaft 523 is formed on the inner peripheral surface of the through hole 524a. The screw shaft 523 is inserted into the through hole 524a of the moving portion 524. A plurality of balls (not shown) that perform a rolling motion are arranged between the threads of the screw shaft 523 and the threads of the moving portion 524.

By rotating the horizontal handle 521, the screw shaft 523 is rotated. As the screw shaft 523 rotates, the moving portion 524 moves in a specified direction on the outer peripheral surface of the screw shaft 523. As a result, the stage 510 moves in the specified direction.

Each linear guide 525 includes a guide rail 526 and a pair of guide members 527. Each guide rail 526 is fixed to the lower surface of the stage 510 via a fixing member 528. Both the guide rail 526 and the fixing member 528 extend in a long shape in a specified direction. The pair of guide members 527 are fixed to the upper surface of the bottom surface portion 405 of FIG. 15 via the fixing member 529 so as to be arranged in a specified direction. The guide rail 526 can move linearly in a specified direction with respect to the pair of guide members 527. Specifically, each guide member 527 is formed with a groove portion extending in the axial direction, and the guide rail 526 is fitted into the groove portion. A plurality of balls performing a rolling motion may be arranged between the guide rail 526 and the guide member 527. The movement of the stage 510 in the specified direction is assisted by a pair of linear guides 525. As a result, the stage 510 moves stably in the specified direction.

FIG. 18 is a diagram showing the configuration of the vertical drive mechanism 530. As shown in FIG. 18, the vertical drive mechanism 530 includes a vertical handle 531, a gear 532, 533, a pulley 535, a ball screw mechanism 536, a pulley 537, a belt 538, and a plurality of (four in this example) linear guides 545. Including. A gear 532 is connected to the upper and lower handles 531. The vertical handle 531 and the gear 532 rotate integrally around a horizontal axis. The gear 533 is located above the protrusion 512 of the stage 510 and is meshed with the gear 532. The pulley 535 is arranged below the protrusion 512. The gear 533 is connected to the pulley 535 via a connecting shaft 533a extending in the vertical direction so as to penetrate the protrusion 512. As the gear 532 rotates, the gear 533, the connecting shaft 533a, and the pulley 535 rotate integrally around the vertical axis.

FIG. 19 is a cross-sectional view of the ball screw mechanism 536 and its peripheral portion. As shown in FIG. 19, the ball screw mechanism 536 includes a screw shaft 536a, a nut 536b, and a cylindrical elevating member 536c. A bearing member 513 is attached to a substantially central portion of the rectangular portion 511 of the stage 510. The screw shaft 536a extends in the vertical direction through the bearing member 513. The bearing member 513 rotatably supports the screw shaft 536a. Below the stage 510, a pulley 537 is attached to the lower end of the screw shaft 536a. Above the stage 510, a nut 536b is attached to the screw shaft 536a. A plurality of balls (not shown) that perform a rolling motion are arranged between the thread of the screw shaft 536a and the thread of the nut 536b. An elevating member 536c is mounted on the outer peripheral surface of the nut 536b. The upper end of the elevating member 536c is fixed to the lower surface of the elevating plate 550.

An endless belt 538 is wound around the pulley 535 and the pulley 537. The rotation of the pulley 535 is transmitted to the pulley 537 by the belt 538. By rotating the screw shaft 536a together with the pulley 537, the nut 536b and the elevating member 536c move in the vertical direction on the outer peripheral surface of the screw shaft 536a. As a result, the elevating plate 550 is raised and lowered, and the gantry 450 (FIG. 15) mounted on the elevating plate 550 is raised and lowered.

As shown in FIG. 18, four linear guides 545 are provided at the four corners of the upper surface of the rectangular portion 511 of the stage 510 so as to surround the ball screw mechanism 536. Each linear guide 545 includes a support shaft 545a extending in the vertical direction and a cylindrical guide member 545b. The support shaft 545a is inserted into the hole of the guide member 545b. The guide member 545b is fixed to the upper surface of the stage 510, and the upper end of the support shaft 545a is fixed to the lower surface of the elevating plate 550 (FIG. 16). Each support shaft 545a is maintained in a vertical position by the guide member 545b. Further, when the elevating plate 550 is raised and lowered, each support shaft 545a is linearly moved in the vertical direction by the guide member 545b. The vertical movement of the elevating plate 550 is assisted by a plurality of linear guides 545. As a result, the elevating plate 550 is maintained in a horizontal posture and stably moves in the vertical direction. As a result, the tilt of the gantry 450 shown in FIG. 15 is prevented, and the gantry 450 is stably raised and lowered.

FIG. 20 is a diagram showing the arrangement of the horizontal drive mechanism 520 and the vertical drive mechanism 530 on the lower surface side of the stage 510. As shown in FIG. 20, the horizontal handle 521 and the vertical handle 531 are arranged so as to be adjacent to each other. As a result, the operator can operate the horizontal handle 521 and the vertical handle 531 without making a large movement. Therefore, the processing chamber 120 can be efficiently positioned with respect to the light projecting unit 160. Further, the screw shaft 523 and the pair of guide rails 526 extend in the specified direction, respectively, and the pulleys 535 and 537 are arranged so as to line up in the specified direction. As a result, the ball screw mechanism 522 of the horizontal drive mechanism 520 and the pair of linear guides 525, and the pulleys 535, 537 and the belt 538 of the vertical drive mechanism 530 are compactly arranged below the stage 510. As a result, the increase in size of the positioning mechanism 500 is suppressed.

(8) Substrate Processing Device FIG. 21 is a schematic block diagram showing the overall configuration of the substrate processing device provided with the exposure device 100 of FIG. In the substrate processing apparatus 200 described below, processing using inductive self-assembly (DSA) of block copolymers is performed. Specifically, a treatment liquid containing an inductive self-assembling material is applied onto the surface to be treated of the substrate W. After that, a pattern of two kinds of polymers is formed on the surface to be treated of the substrate W by the microphase separation generated in the induced self-assembling material. The pattern of one of the two polymers is removed by the solvent.

The treatment liquid containing the inductive self-assembling material is called a DSA liquid. Further, a process of removing one of two types of polymer patterns formed on the surface to be processed of the substrate W by microphase separation is called a developing process, and a solvent used in the developing process is called a developing solution.

As shown in FIG. 21, the substrate processing device 200 includes a control device 210, a transfer device 220, a heat treatment device 230, a coating device 240, and a developing device 250 in addition to the exposure device 100. The control device 210 includes, for example, a CPU and a memory, or a microcomputer, and controls the operations of the transfer device 220, the heat treatment device 230, the coating device 240, and the developing device 250. Further, the control device 210 gives a command to the control unit 110 of FIG. 1 to control each part of the exposure device 100 of FIG.

The transport device 220 transports the substrate W to be processed between the exposure device 100, the heat treatment device 230, the coating device 240, and the developing device 250 while holding the substrate W to be processed. The heat treatment apparatus 230 heat-treats the substrate W before and after the coating treatment by the coating apparatus 240 and the development treatment by the developing apparatus 250.

The coating device 240 coats the film by supplying the DSA liquid to the surface to be treated of the substrate W. In the present embodiment, a block copolymer composed of two types of polymers is used as the DSA solution. As a combination of the two polymers, for example, polystyrene-polymethylmethacrylate (PS-PMMA), polystyrene-polydimethylsiloxane (PS-PDMS), polystyrene-polyferrocenyldimethylsilane (PS-PFS), polystyrene-polyethylene oxide (PS-PEO), polystyrene - polyvinylpyridine (PS-PVP), polystyrene - polyhydroxystyrene (PS-PHOST), and polymethyl methacrylate - polymethacrylate polyhedral oligomeric Write down Sukiokisan (PMMA-PMAPOSS), and the like ..

The developing apparatus 250 develops a film by supplying a developing solution to the surface to be processed of the substrate W. As the solvent of the developing solution, for example, toluene, heptane, acetone, propylene glycol monomethyl ether acetate (PGMEA), propylene glycol monomethyl ether (PGME), cyclohexanone, acetic acid, tetrahydrofuran, isopropyl alcohol (IPA) or tetramethylammonium hydroxide (TMAH). ) Etc. can be mentioned.

FIG. 22 is a schematic view showing an example of processing of the substrate W by the substrate processing apparatus 200 of FIG. 21. In FIG. 22, a cross-sectional view shows a state of the substrate W that changes each time the process is performed. In this example, as an initial state before the substrate W is carried into the substrate processing apparatus 200, as shown in FIG. 22A, the underlayer L1 is formed so as to cover the surface to be processed of the substrate W, and the underlayer is formed. A guide pattern L2 made of, for example, a photoresist is formed on L1. Hereinafter, the operation of the substrate processing apparatus 200 will be described with reference to FIGS. 21 and 22.

The transfer device 220 sequentially conveys the substrate W to be processed to the heat treatment device 230 and the coating device 240. In this case, in the heat treatment apparatus 230, the temperature of the substrate W is adjusted to a temperature suitable for forming the DSA film. Further, in the coating device 240, the DSA liquid is supplied to the surface to be treated of the substrate W, and the coating process is performed. As a result, as shown in FIG. 22B, a DSA film L3 composed of two types of polymers is formed in a region on the base layer L1 on which the guide pattern L2 is not formed.

Next, the transfer device 220 transfers the substrate W on which the DSA film L3 is formed to the heat treatment device 230 and the exposure device 100 in this order. In this case, the heat treatment apparatus 230 heat-treats the substrate W to cause microphase separation in the DSA film L3. As a result, as shown in FIG. 22 (c), a pattern Q1 composed of one polymer and a pattern Q2 composed of the other polymer are formed. In this example, the linear pattern Q1 and the linear pattern Q2 are directionally formed along the guide pattern L2.

After that, the substrate W is cooled in the heat treatment apparatus 230. Further, in the exposure apparatus 100, the entire DSA film L3 after the microphase separation is irradiated with vacuum ultraviolet rays for modifying the DSA film L3, and the exposure process is performed. As a result, the bond between one polymer and the other polymer is broken, and the pattern Q1 and the pattern Q2 are separated.

Subsequently, the transfer device 220 transfers the substrate W after the exposure process by the exposure device 100 to the heat treatment device 230 and the developing device 250 in this order. In this case, the substrate W is cooled in the heat treatment apparatus 230. Further, in the developing apparatus 250, the developing solution is supplied to the DSA film L3 on the substrate W, and the developing process is performed. As a result, as shown in FIG. 22D, the pattern Q1 is removed, and finally the pattern Q2 remains on the substrate W. Finally, the transport device 220 collects the developed substrate W from the developing device 250.

(9) Effect In the exposure apparatus 100 according to the present embodiment, when the mounting plate 151 is in the standby position, the substrate W is carried into the processing chamber 120 and the substrate W is carried out of the processing chamber 120. When the mounting plate 151 is in the processing position, the light source unit 163 irradiates the substrate W on the mounting plate 151 with vacuum ultraviolet rays. The mounting plate 151 is supported by a pair of support shafts 152, and the connecting member 310 connecting the pair of support shafts 152 is moved up and down by the drive mechanism 153, so that the mounting plate 151 is placed between the standby position and the processing position. It is raised and lowered by.

In this case, since the mounting plate 151 is supported by the pair of support shafts 152 and the pair of support shafts 152 are integrally raised and lowered, the mounting plate 151 is supported by only one support shaft 152, or The posture of the mounting plate 151 can be stably maintained as compared with the case where the plurality of support shafts 152 are individually raised and lowered. Further, since the moving member 345 provided on the connecting member 310 moves in the vertical direction along the guide rail 340, the moving in the vertical direction of the connecting member 310 is assisted, and the mounting plate 151 moves up and down stably. As a result, the posture of the substrate W with respect to the light source unit 163 can be appropriately maintained, and the processing accuracy of the substrate W by the vacuum ultraviolet rays can be improved.

Further, in the present embodiment, the rotational force of the rotary shaft 361 of the drive device 360 is transmitted to the screw shaft 321 of the ball screw mechanism 320 via the pulley 350b, the belt 365, and the pulley 350a. As a result, the connecting member 310 can be raised and lowered with a simple configuration. Further, since the rotational force is indirectly transmitted from the drive device 360 to the screw shaft 321, the degree of freedom in arranging the drive device 360 is higher than when the screw shaft 321 is directly connected to the drive device 360. Become. This makes it possible to make the drive mechanism 153 compact.

(10) Other Embodiments (a) In the above embodiment, the mounting plate 151 is supported by a pair of support shafts 152, but the mounting plate 151 may be supported by three or more support shafts 152. .. FIG. 23 is a schematic plan view showing another example of the support shaft 152 and the connecting member 310. In FIG. 23, the mounting plate 151 is indicated by an alternate long and short dash line. In the example of FIG. 23, the mounting plate 151 is supported by three support shafts 152. The three support shafts 152 are connected by a connecting member 315. The connecting member 315 includes connecting portions 315a, 315b, 315c. The connecting portion 315a extends in the width direction. The connecting portions 315b and 315c extend in the front-rear direction from both ends of the connecting portion 315a so as to sandwich the drive device 360 and approach each other. One end of the connecting portion 315b and one end of the connecting portion 315c are connected to each other. The lower ends of the two support shafts 152 are fixed to both ends of the connecting portion 315a, and the lower ends of the remaining one support shaft 152 are fixed to the connecting portion between the connecting portion 315b and the connecting portion 315c.

A nut 322 of the ball screw mechanism 320 and a pair of moving members 345 are attached to the connecting portion 315a. The screw shaft 321 is inserted into the nut 322, and the guide rail 340 is fitted into the moving member 345. Similar to the examples of FIGS. 4 to 6, the rotational force of the drive device 360 is transmitted to the screw shaft 321 to raise and lower the connecting member 315 together with the nut 322. In this case, the moving member 345 moves in the vertical direction along the guide rail 340 to assist the moving of the connecting member 315. As a result, the mounting plate 151 is stably raised and lowered.

In a plan view, the three support shafts 152 are arranged at equal intervals with respect to the center CT of the circular portion 151b of the mounting plate 151, and the distances from the center CT of the substrate W to the three support shafts 152 are equal to each other. .. In this way, the mounting plate 151 is supported by three or more support shafts 152 symmetrically arranged with respect to the central CT, so that the posture of the mounting plate 151 becomes more stable.

(B) In the above embodiment, a pair of guide rails 340 and a pair of moving members 345 are provided, but the number of guide rails 340 and moving members 345 is not limited to this. Only one set of the guide rail 340 and the moving member 345 may be provided, or three or more sets of the guide rail 340 and the moving member 345 may be provided.

(C) In the above embodiment, the rotational force of the drive device 360 is transmitted to the screw shaft 321 of the ball screw mechanism 320 via the pulley 350b, the belt 365 and the pulley 350a, but the drive device 360 directly connects the screw shaft 321. You may rotate the ball. In this case, for example, the lower end of the screw shaft 321 is directly connected to the drive device 360.

(D) In the above embodiment, the emission surface of the vacuum ultraviolet rays is larger than the surface to be treated of the substrate W, and the entire surface of the substrate W is exposed, but the present invention is not limited thereto. The emission surface of the vacuum ultraviolet rays may be smaller than the surface to be processed of the substrate W. Further, the vacuum ultraviolet rays are emitted in a band shape, and the surface to be processed of the substrate W is relatively moved from the emission surface of the vacuum ultraviolet rays, so that the entire surface to be processed of the substrate W is irradiated with the vacuum ultraviolet rays.

(E) In the above embodiment, the inert gas is supplied into the housing 121 during the exposure process, but the present invention is not limited to this. If the oxygen concentration in the housing 121 can be sufficiently reduced during the exposure process, the inert gas may not be supplied into the housing 121.

(F) In the above embodiment, the illuminance meter 183 is attached to the mounting plate 151, but the present invention is not limited thereto. For example, the illuminance meter 183 may be provided so as to be movable in the vertical direction separately from the mounting plate 151, or the illuminance meter 183 may be fixedly provided in the housing 121. However, it is preferable that the light receiving surface of the illuminometer 183 can be arranged at substantially the same height as the surface to be processed of the substrate W mounted on the mounting plate 151 at the processing position.

(G) In the above embodiment, the DSA solution is used as the treatment solution, but the present invention is not limited thereto. Other treatment liquids different from the DSA liquid may be used.

(11) Correspondence relationship between each component of the claim and each part of the embodiment The following describes an example of the correspondence between each component of the claim and each component of the embodiment. Not limited to examples.

In the above embodiment, the exposure apparatus 100 is an example of the exposure apparatus, the processing chamber 120 is an example of the processing chamber, the light source unit 163 is an example of the light source unit, and the mounting plate 151 is an example of the mounting unit. The elevating part 300 is an example of the elevating part, the standby position is an example of the first position, the processing position is an example of the second position, and the support shaft 152 is an example of the support shaft. The member 310 is an example of a connecting member, the drive mechanism 153 is an example of an elevating drive mechanism, the guide rail 340 is an example of a guide member, and the moving member 345 is an example of a moving portion.

Further, the screw shaft 321 is an example of a screw shaft, the drive device 360 is an example of a rotary drive unit, the nut 322 is an example of a moving member, the rotary shaft 361 is an example of a rotary shaft, and the pulley 350a is a first. No. 1 pulley, pulley 350b is an example of a second pulley, belt 365 is an example of a belt, cooling unit 141 is an example of a cooling unit, and support pin 142 is an example of a support pin. The through hole 151a is an example of the through hole, the gantry 400 is an example of the first gantry, the gantry 450 is an example of the second gantry, and the positioning mechanism 500 is an example of the gantry moving mechanism for vertical use. The handle 531 is an example of the first handle, the elevating plate 550 is an example of the support elevating member, and the gears 532, 533, the pulley 535, the ball screw mechanism 536, the pulley 537 and the belt 538 are examples of the elevating transmission mechanism. The horizontal handle 521 is an example of the second handle, the stage 510 is an example of the support moving member, and the ball screw mechanism 522 is an example of the horizontal transmission mechanism.

Further, the substrate processing device 200 is an example of a substrate processing device, the coating device 240 is an example of a coating processing unit, the heat treatment device 230 is an example of a heat treatment unit, and the developing device 250 is an example of a developing processing unit.

As each component of the claim, various other components having the structure or function described in the claim can also be used.
(12) Reference form
(12-1) The exposure apparatus according to this reference embodiment includes a processing chamber for accommodating a substrate, a light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber, and a light source unit in the processing chamber and below the light source unit. The mounting section on which the substrate is mounted and the mounting section when the substrate is carried into the processing chamber and carried out of the processing chamber are in the first position, and the light source unit emits vacuum ultraviolet rays to the substrate. A lifting portion for raising and lowering the mounting portion is provided so that the mounting portion is in a second position above the first position during irradiation, and the lifting portion is provided with a plurality of supports for supporting the mounting portion. A shaft, a connecting member for connecting a plurality of support shafts to each other, an elevating drive mechanism for raising and lowering the connecting member, a guide member extending in the vertical direction, and a movement provided in the connecting member so as to be movable in the vertical direction along the guide member. Including part.
In this exposure apparatus, when the mounting portion is in the first position, the substrate is carried in and out of the processing chamber, and when the mounting portion is in the second position. , The light source unit irradiates the substrate on the mounting unit with vacuum ultraviolet rays. The mounting portion is supported by a plurality of support shafts, and the connecting member connecting the plurality of support shafts is raised and lowered by an elevating drive mechanism, so that the mounting portion is moved between the first position and the second position. It is raised and lowered.
In this case, since the mounting portion is supported by the plurality of support shafts and the plurality of support shafts are integrally raised and lowered, the mounting portion is supported by only one support shaft, or the plurality of support shafts are supported. It is possible to maintain a stable posture of the mounting portion as compared with the case where each is raised and lowered individually. Further, since the moving member provided on the connecting member moves in the vertical direction along the guide member, the moving of the connecting member in the vertical direction is assisted, and the mounting portion moves up and down stably. As a result, the posture of the substrate with respect to the light source unit can be appropriately maintained, and the processing accuracy of the substrate by vacuum ultraviolet rays can be improved.
(12-2) The elevating drive mechanism includes a screw shaft extending in the vertical direction, a rotary drive unit for rotating the screw shaft, and a screw moving member attached to the screw shaft so as to move in the vertical direction due to the rotation of the screw shaft. Including, the connecting member may be configured to move in the vertical direction integrally with the screw moving member. In this case, the connecting member can be raised and lowered with a simple configuration.
(12-3) The rotary drive unit has a rotary shaft extending parallel to the screw shaft, and the elevating drive mechanism has a first pulley that rotates integrally with the screw shaft and a first pulley that rotates integrally with the rotary shaft. The second pulley and a belt wound around the outer peripheral surface of the first pulley and the outer peripheral surface of the second pulley may be included.
In this case, the degree of freedom in arranging the rotary drive unit is higher than in the case where the screw shaft is directly connected to the rotary drive unit. This makes it possible to make the elevating drive mechanism compact.
(12-4) The exposure apparatus may further include a cooling unit provided in the processing chamber so as to cool the mounting unit when the mounting unit is in the first position. In this case, since the substrate is placed on the cooled mounting portion, the temperature rise of the substrate during irradiation with vacuum ultraviolet rays is suppressed. Therefore, the substrate after irradiation with vacuum ultraviolet rays can be immediately carried out from the processing chamber.
(12-5) The mounting portion may have a lower surface, and the cooling portion may have a contact surface that contacts the lower surface of the mounting portion. In this case, since the mounting portion and the cooling portion are in surface contact with each other, the mounting portion can be efficiently cooled.
(12-6) The exposure apparatus further includes a plurality of support pins extending upward from the cooling portion, the mounting portion has an upper surface on which the substrate is mounted, and the upper end of each of the plurality of support pins is the first. Higher than the upper surface of the mounting portion at the position of and lower than the upper surface of the mounting portion at the second position, the mounting portion has a plurality of through holes through which a plurality of support pins can pass. The support pin may penetrate a plurality of through holes of the mounting portion when the mounting portion is in the first position.
In this case, with the mounting portion in the first position, the substrate carried into the processing chamber is mounted on a plurality of support pins, and the mounting portion is raised from the first position to the second position. As a result, the substrate is passed from the support pin to the mounting portion. Further, by lowering the mounting portion from the second position to the first position, the substrate is passed from the mounting portion onto the plurality of support pins, and the substrate is carried out of the processing chamber from the plurality of support pins. To. In this way, the substrate can be easily carried into the processing chamber and the substrate can be carried out of the processing chamber.
(12-7) Even if a first pedestal that supports the light source unit, a second pedestal that supports the processing chamber, and a pedestal moving mechanism that moves the second pedestal with respect to the first pedestal are further provided. Good.
In this case, since the light source unit is supported separately from the processing chamber, the light source unit can be easily installed even when the weight of the light source unit is large. Further, by moving the second gantry with respect to the first gantry, the processing chamber can be positioned with respect to the light source unit. As a result, the positional relationship between the light source unit and the processing chamber can be adjusted with high accuracy.
(12-8) The gantry moving mechanism includes a first handle that can be rotated, a support elevating member that can move up and down integrally with the second gantry while supporting the second gantry, and rotation of the first handle. It may include an elevating transmission mechanism configured to elevate and elevate the support elevating member by transmitting a force to the support elevating member.
In this case, the support elevating member moves up and down when the operator rotates the first handle, and the second gantry moves up and down accordingly. As a result, the processing chamber can be easily positioned in the vertical direction.
(12-9) The positioning mechanism includes a second handle that can be rotated, a support moving member that supports the second pedestal and can move horizontally together with the second pedestal, and a second handle. It may include a horizontal transmission mechanism configured to move the support moving member in the horizontal direction by transmitting the rotational force of the support moving member to the support moving member.
In this case, when the operator rotates the second handle, the support moving member moves horizontally, and the second gantry moves horizontally accordingly. Thereby, the horizontal positioning of the processing chamber can be easily performed.
(12-10) The substrate processing apparatus according to this reference embodiment has a coating processing unit that forms a film on the substrate by applying a processing liquid to the substrate, and a heat treatment unit that heat-treats the substrate on which the film is formed by the coating processing unit. The above-mentioned exposure apparatus that exposes the substrate heat-treated by the heat-treating unit, and a development processing unit that develops the substrate exposed by the exposure apparatus are provided.
In this substrate processing apparatus, after a film is formed on the substrate by the coating processing section, the substrate is heat-treated by the heat treatment section. The substrate heat-treated by the heat-treating unit is exposed by the above-mentioned exposure apparatus, and the exposed substrate is subjected to development processing by the development processing unit. In this case, in the exposure apparatus, the posture of the substrate with respect to the light source unit can be appropriately maintained, and the processing accuracy of the substrate by vacuum ultraviolet rays can be improved.
(12-11) The treatment liquid may contain an inducible self-assembling material. In this case, microphase separation occurs on the substrate by the heat treatment by the heat treatment section. Further, by the exposure treatment by the exposure apparatus and the development treatment by the development processing unit, unnecessary polymers among the plurality of types of polymers are removed from the substrate, and a fine pattern is formed on the substrate.

1 ... Blockage control unit, 2 ... Elevation control unit, 3 ... Exhaust control unit, 4 ... Air supply control unit, 5 ... Density acquisition unit, 6 ... Density comparison unit, 7 ... Illumination acquisition unit, 8 ... Exposure calculation unit, 9 ... exposure amount comparison unit, 10 ... light projection control unit, 100 ... exposure device, 110 ... control unit, 120 ... processing room, 121 ... housing, 121a ... transfer opening, 121b, 141a ... opening, 122 ... annular member , 123 ... Covering member, 130 ... Closing part, 131 ... Shutter, 131a, s1 to s3 ... Sealing member, 140 ... Delivery part, 141 ... Cooling part, 142 ... Support pin, 151 ... Mounting plate, 151a ... Through hole, 151b ... Circular part, 151c ... Square part, 152 ... Support shaft, 153 ... Drive mechanism, 160 ... Light projector, 161 ... Housing, 162 ... Translucent plate, 163 ... Light source part, 164 ... Power supply device, 170 ... Replacement part , 171p to 173p ... piping, 171v to 173v ... valve, 173 ... suction device, 173a, 173b ... branch pipe, 180 ... measuring unit, 181 ... oxygen concentration meter, 182 ... ozone concentration meter, 183 ... illuminance meter, 200 ... substrate Processing device, 210 ... control device, 220 ... transfer device, 230 ... heat treatment device, 240 ... coating device, 250 ... developing device, 300 ... elevating part, 310 ... connecting member, 320, 522,536 ... ball screw mechanism, 340 ... Guide rail, 345 ... moving member, 350a, 350b, 535, 537 ... pulley, 360 ... drive device, 361 ... rotating shaft, 365,538 ... belt, 400, 450 ... pedestal, 500 ... positioning mechanism, 510 ... stage, 520 ... Horizontal drive mechanism, 521 ... Horizontal handle, 525,545 ... Linear guide, 531 ... Vertical handle, 532,533 ... Gear, L1 ... Underlayer, L2 ... Guide pattern, L3 ... DSA film, Q1, Q2 ... Pattern , W ... Substrate

Claims (9)

A processing room for accommodating the substrate and
A light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber,
A mounting portion on which the substrate is mounted in the processing chamber and below the light source portion,
The pre-described mounting portion is in the first position when the substrate is carried into the processing chamber and when the substrate is carried out of the processing chamber, and the pre-described mounting portion is used when the light source unit irradiates the substrate with vacuum ultraviolet rays. The elevating part that raises and lowers the above-mentioned placing part so that is in the second position above the first position .
The treatment chamber is provided with a cooling unit arranged below the above-mentioned storage unit.
The elevating part
With a plurality of support shafts that support the above-mentioned resting part,
A connecting member that connects the plurality of support shafts to each other,
An elevating drive mechanism that raises and lowers the connecting member,
A guide member that extends in the vertical direction and
Look including a moving portion provided in the connecting member movably in the vertical direction along the guide member,
When the pre-described resting portion is in the first position, the lower surface of the pre-described resting portion contacts the upper surface of the cooling portion, so that the cooling portion cools the pre-described resting portion, and the pre-described resting portion cools the pre-described resting portion. An exposure apparatus in which the lower surface of the above-mentioned placing portion is separated from the upper surface of the cooling portion when the position is 2 . The elevating drive mechanism
A screw shaft that extends in the vertical direction,
A rotary drive unit that rotates the screw shaft,
Including a screw moving member attached to the screw shaft so as to move in the vertical direction by rotation of the screw shaft.
The exposure apparatus according to claim 1, wherein the connecting member is configured to move in the vertical direction integrally with the screw moving member. The rotary drive unit has a rotary shaft extending parallel to the screw shaft.
The elevating drive mechanism
A first pulley that rotates integrally with the screw shaft,
A second pulley that rotates integrally with the rotating shaft,
The exposure apparatus according to claim 2, further comprising a belt wound around an outer peripheral surface of the first pulley and an outer peripheral surface of the second pulley. A processing room for accommodating the substrate and
A light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber,
A mounting portion on which the substrate is mounted in the processing chamber and below the light source portion,
The pre-described mounting portion is in the first position when the substrate is carried into the processing chamber and when the substrate is carried out of the processing chamber, and the pre-described mounting portion is used when the light source unit irradiates the substrate with vacuum ultraviolet rays. The elevating part that raises and lowers the above-mentioned placing part so that is in the second position above the first position.
A cooling unit provided in the processing chamber so as to cool the previously described placing portion when the previously described placing portion is in the first position,
With a plurality of support pins extending upward from the cooling unit,
With
The elevating part
With a plurality of support shafts that support the above-mentioned resting part,
A connecting member that connects the plurality of support shafts to each other,
An elevating drive mechanism that raises and lowers the connecting member,
A guide member that extends in the vertical direction and
Including a moving portion provided on the connecting member so as to be movable in the vertical direction along the guide member.
The above-mentioned mounting portion has an upper surface on which the substrate is mounted, and has an upper surface.
The upper end of each of the plurality of support pins is higher than the upper surface of the pre-described rest at the first position and lower than the upper surface of the pre-position at the second position.
The above-mentioned mounting portion has a plurality of through holes through which the plurality of support pins can pass.
An exposure apparatus in which the plurality of support pins penetrate the plurality of through holes of the previously described mounting portion when the previously described mounting portion is in the first position. A processing room for accommodating the substrate and
A light source unit provided so as to be able to irradiate vacuum ultraviolet rays downward toward the processing chamber,
A mounting portion on which the substrate is mounted in the processing chamber and below the light source portion,
The pre-described mounting portion is in the first position when the substrate is carried into the processing chamber and when the substrate is carried out of the processing chamber, and the pre-described mounting portion is used when the light source unit irradiates the substrate with vacuum ultraviolet rays. The elevating part that raises and lowers the above-mentioned placing part so that is in the second position above the first position.
A first gantry that supports the light source unit and
A second gantry that supports the processing chamber and
A gantry moving mechanism for moving the second gantry with respect to the first gantry is provided.
The elevating part
With a plurality of support shafts that support the above-mentioned resting part,
A connecting member that connects the plurality of support shafts to each other,
An elevating drive mechanism that raises and lowers the connecting member,
A guide member that extends in the vertical direction and
An exposure apparatus including a moving portion provided on the connecting member so as to be movable in the vertical direction along the guide member . The gantry moving mechanism
The first handle that can be rotated and
A support elevating member that can be integrally raised and lowered with the second gantry while supporting the second gantry.
The exposure apparatus according to claim 5 , further comprising an elevating transmission mechanism configured to elevate and elevate the support elevating member by transmitting the rotational force of the first handle to the support elevating member. The gantry moving mechanism
A second handle that can be rotated and
A support moving member that can move in the horizontal direction integrally with the second pedestal while supporting the second pedestal.
The exposure apparatus according to claim 5 or 6 , further comprising a horizontal transmission mechanism configured to move the support moving member in the horizontal direction by transmitting the rotational force of the second handle to the support moving member. A coating treatment unit that forms a film on the substrate by applying the treatment liquid to the substrate,
A heat treatment unit that heat-treats the substrate on which the film is formed by the coating treatment unit,
The exposure apparatus according to any one of claims 1 to 7 , which exposes the substrate heat-treated by the heat-treated portion.
A substrate processing apparatus including a developing processing unit that develops a substrate exposed by the exposure apparatus. The substrate processing apparatus according to claim 8 , wherein the treatment liquid contains an inductive self-assembling material.

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