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JP6810083B2 - A method for manufacturing a base for forming a honeycomb structure and a method for manufacturing a honeycomb structure. - Google Patents
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JP6810083B2 - A method for manufacturing a base for forming a honeycomb structure and a method for manufacturing a honeycomb structure. - Google Patents

A method for manufacturing a base for forming a honeycomb structure and a method for manufacturing a honeycomb structure. Download PDF

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JP6810083B2
JP6810083B2 JP2018060773A JP2018060773A JP6810083B2 JP 6810083 B2 JP6810083 B2 JP 6810083B2 JP 2018060773 A JP2018060773 A JP 2018060773A JP 2018060773 A JP2018060773 A JP 2018060773A JP 6810083 B2 JP6810083 B2 JP 6810083B2
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honeycomb structure
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molding base
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JP2019171627A (en
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悠太 今泉
悠太 今泉
和彦 濱塚
和彦 濱塚
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NGK Insulators Ltd
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Description

本発明はハニカム構造体成形用口金の製造方法、ハニカム構造体成形用口金、及びハニカム構造体の製造方法に関する。特に、付加製造法(Additive Manufacturing Method)に適したハニカム構造体成形用口金の製造方法、ハニカム構造体成形用口金、及びハニカム構造体の製造方法に関する。 The present invention relates to a method for manufacturing a honeycomb structure molding base, a honeycomb structure molding base, and a method for manufacturing a honeycomb structure. In particular, the present invention relates to a method for producing a honeycomb structure molding base, a honeycomb structure molding base, and a honeycomb structure manufacturing method suitable for an additive manufacturing method.

セラミック質のハニカム構造体の製造方法としては、従来から、成形原料(坏土)を導入する裏孔と、この裏孔に連通する格子状等のスリットと が形成された口金基体を備えたハニカム構造体成形用口金を用いて押出成形する方法が広く行われている。
このようなハニカム構造体成形用口金のスリットの形成には、例えば、四角形状に配設されている場合は砥石による研削加工、六角形状や四角-八角形状の組合せ等、同一線上に配設されない場合は電極を用いた型彫り放電加工等が用いられる。
このようなハニカム構造体成形用口金の裏孔の形成には、例えば、ドリルやリーマ工具を用いた切削加工や電極を用いた放電加工等が用いられる。
Conventionally, as a method for manufacturing a ceramic honeycomb structure, a honeycomb having a back hole into which a molding material (powder) is introduced and a base having a base having a grid-like slit communicating with the back hole is formed. A method of extrusion molding using a structure molding base is widely used.
In forming the slits of the honeycomb structure molding base, for example, when they are arranged in a square shape, they are not arranged on the same line such as grinding with a grindstone, a combination of hexagonal shape and square-octagonal shape, etc. In this case, die-sinking electric discharge machining using electrodes is used.
For forming the back hole of the honeycomb structure forming base, for example, cutting using a drill or a reamer tool, electric discharge machining using electrodes, or the like is used.

特許文献1においては、裏孔を形成するための板状部材に溝を形成する場合において、その溝によって区画される柱状部の最小幅と、この柱状部の高さとを特定の範囲に規定することによって、高い成形性を実現するとともに、口金基体を構成する二枚の板状部材が剥がれ難いハニカム構造体成形用口金、及びその製造方法を提供することが提案されている。 In Patent Document 1, when a groove is formed in a plate-shaped member for forming a back hole, the minimum width of the columnar portion partitioned by the groove and the height of the columnar portion are defined in a specific range. By doing so, it has been proposed to provide a base for forming a honeycomb structure in which two plate-shaped members constituting a base base are hard to be peeled off, and a method for manufacturing the same, while realizing high moldability.

また、スリットの形成を組付けた部材の間隙として行う方法も知られている(特許文献2)。このようなハニカム構造体成形用口金は複数本の細長い線材を束ねて接合することで、一端側に材料が導入される導入孔を備えた導入層が形成され、他端側に成形体が押出される成形溝を備えた成形層が形成される。 Further, there is also known a method in which slits are formed as gaps between assembled members (Patent Document 2). In such a honeycomb structure molding base, a plurality of elongated wire rods are bundled and joined to form an introduction layer having an introduction hole into which a material is introduced on one end side, and the molded body is extruded on the other end side. A molding layer having a molding groove to be formed is formed.

特許第5361224号公報Japanese Patent No. 5361224 特許第3585815号公報Japanese Patent No. 3585815

特許文献1に記載される加工方法によっては、設計形状に対する制約が生じる場合がある。また、スリット及び裏口の形成に必要な研削加工等において回転工具を用いる方法が使用されるため、孔断面形状が丸形状に制約される。また、このような加工方法では、一般的に板状材料から行い、その大部分を除去する加工を行うことで材料収率が悪い。さらに、ハニカム構造体成形用口金の製造において、複数の異なる設備を使用するため、トータルの製造リードタイムが長くなり、生産性の点で好ましくない。 Depending on the processing method described in Patent Document 1, there may be restrictions on the design shape. Further, since the method using a rotary tool is used in the grinding process required for forming the slit and the back opening, the cross-sectional shape of the hole is restricted to a round shape. Further, in such a processing method, the material yield is generally poor by performing the processing from the plate-shaped material and removing most of it. Further, in the production of the base for forming the honeycomb structure, since a plurality of different facilities are used, the total production lead time becomes long, which is not preferable in terms of productivity.

そして、特許文献2に記載される方法においては、複数本の細長い線材を束ねて接合するという構造が複雑であり、生産コストが増加するほか、累積誤差が大きくなりがちであり、必要精度の確保が困難となる。 In the method described in Patent Document 2, the structure of bundling and joining a plurality of elongated wire rods is complicated, the production cost increases, and the cumulative error tends to increase, so that the required accuracy is ensured. Becomes difficult.

本発明は、上記先行技術文献に記載される発明の問題点にかんがみ、形状などの設計自由度が高く、材料収率が高く、生産性も高いハニカム構造体成形用口金の製造方法、及びハニカム構造体成形用口金、並びにハニカム構造体の製造方法を提供することを課題の一つとする。 In view of the problems of the invention described in the prior art document, the present invention has a high degree of freedom in designing the shape and the like, a high material yield, and a high productivity, and a method for manufacturing a honeycomb structure molding base, and a honeycomb. One of the problems is to provide a base for forming a structure and a method for manufacturing a honeycomb structure.

本発明者らは、いわゆる3Dプリンターを用いる付加製造法によりハニカム構造体成形用口金を成形し、さらに所定のめっき層を設けることにより、上記課題を解決することが可能であることを見出し、本発明を完成するに至った。具体的には、本発明は以下のように特定される。 The present inventors have found that the above problems can be solved by molding a base for forming a honeycomb structure by an additional manufacturing method using a so-called 3D printer and further providing a predetermined plating layer. The invention was completed. Specifically, the present invention is specified as follows.

(1)成形原料を導入する裏孔と、前記裏孔と連通して成形原料をハニカム構造体に押出成形するためのスリットを有するハニカム構造体成形用口金の製造方法であって、
付加製造法により前記ハニカム構造体成形用口金を造形する工程と、
前記ハニカム構造体成形用口金の、前記裏孔及び前記スリットを構成する部位の少なくとも一部を覆うように、厚み10〜300μmのめっき層を設ける工程
を含むハニカム構造体成形用口金の製造方法。
(2)前記めっき層の厚みが20〜200μmである(1)に記載のハニカム構造体成形用口金の製造方法。
(3)前記ハニカム構造体成形用口金の、前記めっき層が設けられた部位の表面粗さ(Ra)が0.3〜7μmである(1)又は(2)に記載のハニカム構造体成形用口金の製造方法。
(4)前記ハニカム構造体成形用口金の、前記めっき層が設けられた部位の表面粗さ(Ra)が0.3〜3μmである(3)に記載のハニカム構造体成形用口金の製造方法。
(5)さらに、前記めっき層を設ける前、前記裏孔及び前記スリット内に砥粒流動体を流すことにより前記ハニカム構造体成形用口金を研磨する流体研磨工程を含む(1)〜(4)のいずれかに記載のハニカム構造体成形用口金の製造方法。
(6)前記流体研磨工程前における前記ハニカム構造体成形用口金の、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)が5〜20μmであり、前記流体研磨工程により、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)を1〜10μmとする(5)に記載のハニカム構造体成形用口金の製造方法。
(7)前記流体研磨工程により、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)を1〜5μmとする(6)に記載のハニカム構造体成形用口金の製造方法。
(8)前記めっき層が無電解Niめっき層である(1)〜(7)のいずれかに記載のハニカム構造体成形用口金の製造方法。
(9)成形原料を導入する裏孔と、前記裏孔と連通して成形原料をハニカム構造体に押出成形するためのスリットを有するハニカム構造体成形用口金であって、前記裏孔及び前記スリットを構成する部位の少なくとも一部が厚み10〜300μmのめっき層に覆われ、前記めっき層に覆われる部位における表面粗さ(Ra)が0.3〜7μmであるハニカム構造体成形用口金。
(10)焼結体である(9)に記載のハニカム構造体成形用口金。
(11)付加製造法により造形された焼結体である(10)に記載のハニカム構造体成形用口金。
(12)前記めっき層の厚みが20〜200μmである(9)〜(11)のいずれかに記載のハニカム構造体成形用口金。
(13)前記めっき層に覆われる部位における表面粗さ(Ra)が0.3〜5μmである(9)〜(12)のいずれかに記載のハニカム構造体成形用口金。
(14)前記めっき層が無電解Niめっき層である(9)〜(13)のいずれかに記載のハニカム構造体成形用口金。
(15)前記めっき層が最表面にある(9)〜(14)に記載のハニカム構造体成形用口金。
(16)(1)〜(8)のいずれかに記載のハニカム構造体成形用口金の製造方法によりハニカム構造体成形用口金を製造し、さらに当該ハニカム構造体成形用口金を使用してハニカム構造体を押出成形する工程を含むハニカム構造体の製造方法。
(17)(9)〜(15)のいずれかに記載のハニカム構造体成形用口金を使用してハニカム構造体を押出成形する工程を含むハニカム構造体の製造方法。
(1) A method for manufacturing a honeycomb structure molding base having a back hole into which a molding raw material is introduced and a slit for extruding the molding raw material into the honeycomb structure in communication with the back hole.
The process of molding the honeycomb structure molding base by the additional manufacturing method, and
A method for manufacturing a honeycomb structure molding base, which comprises a step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the back hole and a portion constituting the slit of the honeycomb structure molding base.
(2) The method for manufacturing a honeycomb structure molding base according to (1), wherein the thickness of the plating layer is 20 to 200 μm.
(3) The honeycomb structure molding base according to (1) or (2), wherein the surface roughness (Ra) of the portion of the honeycomb structure molding base where the plating layer is provided is 0.3 to 7 μm. How to manufacture the base.
(4) The method for manufacturing a honeycomb structure molding base according to (3), wherein the surface roughness (Ra) of the portion of the honeycomb structure molding base on which the plating layer is provided is 0.3 to 3 μm. ..
(5) Further, (1) to (4) include a fluid polishing step of polishing the honeycomb structure molding base by flowing an abrasive grain fluid through the back hole and the slit before providing the plating layer. The method for manufacturing a base for forming a honeycomb structure according to any one of.
(6) The surface roughness (Ra) of the back hole and the portion constituting the slit of the honeycomb structure molding base before the fluid polishing step is 5 to 20 μm, and the back surface is obtained by the fluid polishing step. The method for manufacturing a honeycomb structure molding base according to (5), wherein the surface roughness (Ra) of the hole and the portion constituting the slit is 1 to 10 μm.
(7) The method for manufacturing a honeycomb structure molding base according to (6), wherein the surface roughness (Ra) of the back hole and the portion constituting the slit is set to 1 to 5 μm by the fluid polishing step.
(8) The method for manufacturing a honeycomb structure molding base according to any one of (1) to (7), wherein the plating layer is an electroless Ni plating layer.
(9) A honeycomb structure molding base having a back hole into which a molding raw material is introduced and a slit for extruding the molding raw material into the honeycomb structure in communication with the back hole, and the back hole and the slit. A honeycomb structure molding base having a surface roughness (Ra) of 0.3 to 7 μm in a portion covered with a plating layer having a thickness of 10 to 300 μm at least a part of the portion constituting the above.
(10) The base for forming a honeycomb structure according to (9), which is a sintered body.
(11) The base for forming a honeycomb structure according to (10), which is a sintered body formed by an additional manufacturing method.
(12) The base for forming a honeycomb structure according to any one of (9) to (11), wherein the thickness of the plating layer is 20 to 200 μm.
(13) The honeycomb structure molding base according to any one of (9) to (12), wherein the surface roughness (Ra) at the portion covered with the plating layer is 0.3 to 5 μm.
(14) The base for forming a honeycomb structure according to any one of (9) to (13), wherein the plating layer is an electroless Ni plating layer.
(15) The base for forming a honeycomb structure according to (9) to (14), wherein the plating layer is on the outermost surface.
(16) The honeycomb structure molding base is manufactured by the method for manufacturing the honeycomb structure molding base according to any one of (1) to (8), and the honeycomb structure molding base is further used to manufacture the honeycomb structure. A method for manufacturing a honeycomb structure, which comprises a step of extruding a body.
(17) A method for manufacturing a honeycomb structure, which comprises a step of extruding the honeycomb structure using the honeycomb structure molding base according to any one of (9) to (15).

本発明によれば、自由度の高い口金設計が可能となり、付加加工であるため材料収率が良く、また単設備で基本構造を形成可能なため、製造リードタイムを従来方法と比べ大幅に抑制可能である。 According to the present invention, it is possible to design a base with a high degree of freedom, the material yield is good because of additional processing, and the basic structure can be formed with a single facility, so that the manufacturing lead time is significantly suppressed as compared with the conventional method. It is possible.

本発明の一実施形態により製造されるハニカム構造体成形用口金を模式的に示す斜視図である。It is a perspective view which shows typically the mouthpiece for forming a honeycomb structure manufactured by one Embodiment of this invention. 図1に示すハニカム構造体成形用口金によって押出成形されたハニカム構造体を示す斜視図である。It is a perspective view which shows the honeycomb structure extruded by the honeycomb structure molding base shown in FIG. 実施例及び比較例における付加製造法に使用されるハニカム構造体成形用口金の設計図の一つである。It is one of the design drawings of the base for forming a honeycomb structure used in the addition manufacturing method in Examples and Comparative Examples.

以下、図面を参照して、本発明のハニカム構造体成形用口金(以下、単に「口金」ということがある)の製造方法、及びハニカム構造体成形用口金、並びにハニカム構造体の製造方法の実施の形態について詳細に説明するが、本発明は、これに限定されて解釈されるものではなく、本発明の範囲を逸脱しない限りにおいて、当業者の知識に基づいて、種々の変更、修正、改良を加え得るものである。 Hereinafter, with reference to the drawings, a method for manufacturing a honeycomb structure molding base (hereinafter, may be simply referred to as a “base”) of the present invention, a honeycomb structure molding base, and a method for manufacturing a honeycomb structure. The present invention will be described in detail, but the present invention is not construed as being limited thereto, and various changes, modifications, and improvements are made based on the knowledge of those skilled in the art without departing from the scope of the present invention. Can be added.

(1.ハニカム構造体成形用口金)
本発明において、製造しようとするハニカム構造体成形用口金は、成形原料を導入する裏孔と、前記裏孔と連通して成形原料をハニカム構造体に押出成形するためのスリットという基本的構造を有すれば足り、その具体的形状等は制約されない。
典型的には、本発明の一実施形態において、ハニカム構造体成形用口金は、図1に示されるように、少なくとも二つの面5、6を有し、一方の面5に成形原料を導入する裏孔3が形成されるとともに、他方の面6に裏孔3と連通するスリット4が形成された板状の口金基体2を備え、裏孔3に導入した成形原料をスリット4から押出してハニカム構造体10(図2参照)を成形するハニカム構造体成形用口金1である。
(1. Honeycomb structure molding base)
In the present invention, the base for forming a honeycomb structure to be manufactured has a basic structure of a back hole into which a molding raw material is introduced and a slit for extruding the molding raw material into the honeycomb structure in communication with the back hole. It suffices if it exists, and its specific shape is not restricted.
Typically, in one embodiment of the present invention, the honeycomb structure molding base has at least two surfaces 5, 6 as shown in FIG. 1, and a molding material is introduced into one surface 5. A plate-shaped base base 2 having a back hole 3 formed and a slit 4 communicating with the back hole 3 formed on the other surface 6 is provided, and a molding material introduced into the back hole 3 is extruded from the slit 4 to form a honeycomb. This is a honeycomb structure molding base 1 for molding the structure 10 (see FIG. 2).

なお、後述のように、本発明によれば、自由度の高い口金設計が可能であるから、製造しようとするハニカム構造体成形用口金は、図1に示される構造よりも複雑であってもよい。 As will be described later, according to the present invention, it is possible to design a base with a high degree of freedom. Therefore, even if the base for forming a honeycomb structure to be manufactured is more complicated than the structure shown in FIG. Good.

後述のように、付加製造法によりハニカム構造体成形用口金を製造する場合、付加製造法の技術上の制約により、ハニカム構造体を押出成形する際に成形原料とハニカム構造体成形用口金が接触する部分、すなわち、ハニカム構造体成形用口金の裏孔及びスリットを構成する部位の表面の凹凸が従来の製造方法よりも高い場合がある。この場合、成形原料が流動せず、あるいは意図した流動をせず、正確かつ均一な流量調節が困難となるという問題がある。 As will be described later, when the honeycomb structure molding base is manufactured by the addition manufacturing method, the molding raw material and the honeycomb structure molding base come into contact with each other when the honeycomb structure is extruded due to the technical restrictions of the addition manufacturing method. The unevenness of the surface of the portion to be formed, that is, the back hole of the honeycomb structure molding base and the portion forming the slit may be higher than that of the conventional manufacturing method. In this case, there is a problem that the molding raw material does not flow or does not flow as intended, and it becomes difficult to accurately and uniformly adjust the flow rate.

本発明者は、この問題点についてさらに鋭意検討した結果、ハニカム構造体成形用口金の裏孔及びスリットを構成する部位の表面の少なくとも一部に厚み10〜300μmのめっき層を設けることで、当該部位における表面粗さ(Ra)を低減することを見出した。すなわち、厚み10〜300μmの上記めっき層を設けることにより、付加製造法という全く新しい製造方法による利点を享受しつつも、正確かつ均一な流量調節が可能となり、そのため、高密度で高精度の隔壁を有したハニカム構造体の押出成形が可能となる。この観点から、上記めっき層は、ハニカム構造体を押出成形する際に成形原料とハニカム構造体成形用口金が接触する部分、すなわち、ハニカム構造体成形用口金の裏孔及びスリットを構成する部位の表面すべてについて設けることが好ましい。 As a result of further diligent studies on this problem, the present inventor has provided a plating layer having a thickness of 10 to 300 μm on at least a part of the surface of the back hole and the portion forming the slit of the honeycomb structure molding base. It has been found to reduce the surface roughness (Ra) at the site. That is, by providing the plating layer having a thickness of 10 to 300 μm, it is possible to accurately and uniformly adjust the flow rate while enjoying the advantage of the completely new manufacturing method of the addition manufacturing method. Therefore, a high-density and high-precision partition wall is provided. The honeycomb structure having the above can be extruded. From this point of view, the plating layer is a portion where the molding raw material and the honeycomb structure molding base come into contact with each other when the honeycomb structure is extruded, that is, a portion forming a back hole and a slit of the honeycomb structure molding base. It is preferable to provide it on the entire surface.

めっき層の厚みが10μmより薄いと、当該部位における表面粗さ(Ra)低減の効果が十分ではない。この観点から、めっき層の厚みは20μm以上であることがより好ましく、30μm以上であることがより好ましい。また、めっき層の厚みが300μmより厚いと、めっき処理に要する工数が長大化するとともに裏孔が縮小することでハニカム構造体の押し出し時の圧力が増大する。この観点から、めっき層の厚みは250μm以下であることがより好ましく、200μm以下であることがより好ましい。 If the thickness of the plating layer is thinner than 10 μm, the effect of reducing the surface roughness (Ra) at the site is not sufficient. From this viewpoint, the thickness of the plating layer is more preferably 20 μm or more, and more preferably 30 μm or more. Further, when the thickness of the plating layer is thicker than 300 μm, the man-hours required for the plating process are lengthened and the back holes are reduced, so that the pressure at the time of extruding the honeycomb structure is increased. From this viewpoint, the thickness of the plating layer is more preferably 250 μm or less, and more preferably 200 μm or less.

また、ハニカム構造体の押し出しを容易にする観点から、上記めっき層が設けられた部位上記めっき層が設けられた部位における表面粗さ(Ra)を0.3〜7μmとすることが好ましい。表面粗さ(Ra)を0.3μmより小さくしても効果が薄く、また製造上の困難が増加するため、0.3μmを下限とする。この観点から、表面粗さ(Ra)は0.5μm以上であることがより好ましく、0.7μm以上であることがより好ましい。一方、表面粗さ(Ra)が7μmを超えると、正確かつ均一な流量調節が困難となる。この観点から、上記めっき層が設けられた部位における表面粗さ(Ra)は5μm以下であることがより好ましく、3μm以下であることがより好ましい。 Further, from the viewpoint of facilitating the extrusion of the honeycomb structure, it is preferable that the surface roughness (Ra) at the portion where the plating layer is provided is 0.3 to 7 μm at the portion where the plating layer is provided. Even if the surface roughness (Ra) is made smaller than 0.3 μm, the effect is small and the manufacturing difficulty increases. Therefore, the lower limit is 0.3 μm. From this viewpoint, the surface roughness (Ra) is more preferably 0.5 μm or more, and more preferably 0.7 μm or more. On the other hand, if the surface roughness (Ra) exceeds 7 μm, it becomes difficult to accurately and uniformly adjust the flow rate. From this point of view, the surface roughness (Ra) at the site where the plating layer is provided is more preferably 5 μm or less, and more preferably 3 μm or less.

本発明において、めっき層の厚みは、画像測定顕微鏡により、裏孔又はスリット幅をめっき前後で測定し、差分により算出される値をめっき層の厚みとして示される。具体的には、裏孔及びスリットについてそれぞれ任意にめっき層がある5箇所について、裏孔径とスリット間隙量を測定し、その平均値をとる。 In the present invention, the thickness of the plating layer is shown as the thickness of the plating layer by measuring the back hole or slit width before and after plating with an image measuring microscope and calculating the difference. Specifically, the back hole diameter and the slit gap amount are measured at five locations where each of the back hole and the slit has a plating layer arbitrarily, and the average value is taken.

なお、本発明にいう「表面粗さ(Ra)」とは、JIS B0601(2013)「製品の幾何特性仕様(GPS)− 表面性状:輪郭曲線方式 − 用語,定義及び表面性状パラメータ表面粗さ − 定義及び表示」の「4.2.1 輪郭曲線の算術平均高さ」「算術平均粗さ Ra」に準拠して測定した表面粗さを意味する。本発明においては、基準長さL=4mmとする。 The term "surface roughness (Ra)" as used in the present invention refers to JIS B0601 (2013) "Product Geometric Characteristic Specifications (GPS) -Surface Material: Contour Curve Method-Terms, Definitions and Surface Material Parameters Surface Roughness-" It means the surface roughness measured in accordance with "4.2.1 Arithmetic mean height of contour curve" and "Arithmetic mean roughness Ra" of "Definition and display". In the present invention, the reference length L = 4 mm.

そして、後述のように、本発明は付加製造法によりハニカム構造体成形用口金を製造することも想定しているため、この場合におけるハニカム構造体成形用口金は焼結体であり、具体的には、付加製造法により造形された焼結体である。 As will be described later, since the present invention also assumes that the honeycomb structure molding base is manufactured by the additional manufacturing method, the honeycomb structure molding base in this case is a sintered body, and specifically. Is a sintered body formed by an additional manufacturing method.

また、上記めっき層の種類は、特に限定されず、例えば、電気Niめっきなどを採用することができる。中でも、めっきの均一性の理由から、無電解Niめっき層を採用することが好ましい。無電解Niめっき層を設ける方法は限定されず、種々の公知の方法により設けることができる。 The type of the plating layer is not particularly limited, and for example, electric Ni plating or the like can be adopted. Above all, it is preferable to use an electroless Ni plating layer for the reason of plating uniformity. The method of providing the electroless Ni plating layer is not limited, and various known methods can be used.

また、ハニカム構造体成形用口金は、長寿命化や耐摩耗性の観点から、耐摩耗性材料でコーティングされることがあるが、本発明においては、めっき層を設けることにより、ハニカム構造体成形用口金として必要な耐磨耗性能を獲得することができるので、このようなコーティングを用いることは必ずしも必要ではない。すなわち、本発明において、上記めっき層がハニカム構造体成形用口金の最表面に設けることができる。 Further, the honeycomb structure molding base may be coated with an abrasion resistant material from the viewpoint of extending the life and abrasion resistance, but in the present invention, the honeycomb structure forming is formed by providing the plating layer. It is not always necessary to use such a coating, as it is possible to obtain the wear resistance required for the mouthpiece. That is, in the present invention, the plating layer can be provided on the outermost surface of the honeycomb structure molding base.

(2.ハニカム構造体成形用口金の製造方法)
本発明のハニカム構造体成形用口金の製造方法は、付加製造法 により前記ハニカム構造体成形用口金を造形する工程と、前記ハニカム構造体成形用口金の、前記裏孔及び前記スリットを構成する部位の少なくとも一部を覆うように、厚み10〜300μmのめっき層を設ける工程を含む。
(2. Manufacturing method of honeycomb structure molding base)
The method for manufacturing the honeycomb structure molding base of the present invention includes a step of molding the honeycomb structure molding base by an additional manufacturing method, and a portion of the honeycomb structure molding base that constitutes the back hole and the slit. A step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the honeycomb is included.

典型的には、ハニカム構造体成形用口金を構成する金属又は合金の粉末の薄層を形成し、この薄層における粉末を、電子ビームやレーザーで焼結又は溶融結合により固化させて造形物層を形成し、この造形物層を積層することにより積層造形物を製造することができる。
好ましくは、造形用のステージに、ハニカム構造体成形用口金を構成する金属又は合金の粉末敷き詰めて薄層を形成し、次いで、当該薄層に対し、造形すべき部分に電子ビームを照射して前記粉末を溶解させ、その後自然冷却により凝固させる工程を複数回繰り返して行うことで、ハニカム構造体成形用口金を製造することができる。
Typically, a thin layer of metal or alloy powder constituting a honeycomb structure molding base is formed, and the powder in this thin layer is solidified by sintering or melt bonding with an electron beam or a laser to form a molded product layer. Is formed, and the laminated molded product can be manufactured by laminating the molded product layer.
Preferably, a thin layer is formed by laying powder of a metal or alloy constituting a honeycomb structure molding base on a molding stage, and then the thin layer is irradiated with an electron beam at a portion to be molded. A honeycomb structure molding base can be manufactured by repeating the steps of melting the powder and then solidifying it by natural cooling a plurality of times.

付加製造法によれば、余分な材料を除去する加工が必要ではなく、又は非常に少量に抑えられるからことで材料収率は従来技術と比較して著しく高くなる。また、単設備で基本構造を形成可能なため、製造リードタイムを従来方法と比べ大幅に抑制可能である。 According to the addition manufacturing method, the material yield is remarkably high as compared with the prior art because the processing for removing the excess material is not necessary or can be suppressed to a very small amount. In addition, since the basic structure can be formed with a single facility, the manufacturing lead time can be significantly reduced as compared with the conventional method.

ハニカム構造体成形用口金を構成する金属又は合金の材料は限定されず、必要に応じて種々の材料を選択することができる。例えば、ステンレス合金や超硬合金を用いることができる。ステンレス合金、例えば、SUS630(C:0.07以下,Si:1.00以下,Mn:1.00以下,P:0.040以下,S:0.030以下,Ni:3.00〜5.00,Cr:15.50〜17.50,Cu:3.00〜5.00,Nb+Ta:0.15〜0.45,Fe:残部(単位は質量%))を好適例として挙げることができる。
超硬合金としては、例えば、炭化タングステンを、鉄(Fe)、コバルト(Co)、ニッケル(Ni)、チタン(Ti)、及びクロム(Cr)からなる群より選択される少なくとも一つの金属で焼結した炭化タングステン基超硬合金を好適例として挙げることができる。
いずれの材料も、付加製造法に利用可能である限り、本発明において用いることができる。
The material of the metal or alloy constituting the base for forming the honeycomb structure is not limited, and various materials can be selected as needed. For example, stainless alloys and cemented carbides can be used. Stainless alloy, for example, SUS630 (C: 0.07 or less, Si: 1.00 or less, Mn: 1.00 or less, P: 0.040 or less, S: 0.030 or less, Ni: 3.00 to 5. 00, Cr: 15.50 to 17.50, Cu: 3.00 to 5.00, Nb + Ta: 0.15 to 0.45, Fe: balance (unit: mass%)) can be mentioned as a preferable example. ..
As the cemented carbide, for example, tungsten carbide is calcined with at least one metal selected from the group consisting of iron (Fe), cobalt (Co), nickel (Ni), titanium (Ti), and chromium (Cr). A bonded tungsten carbide-based cemented carbide can be mentioned as a suitable example.
Any material can be used in the present invention as long as it is available in the additive manufacturing process.

また、前述の理由で、付加製造法によりハニカム構造体成形用口金を造形した後、当該ハニカム構造体成形用口金の裏孔及びスリットを構成する部位の少なくとも一部を覆うように、厚み10〜300μmのめっき層を設ける必要がある。この観点から、上記めっき層は、ハニカム構造体を押出成形する際に成形原料とハニカム構造体成形用口金が接触する部分、すなわち、ハニカム構造体成形用口金の裏孔及びスリットを構成する部位の表面すべてについて設けることが好ましい。 Further, for the above-mentioned reason, after the honeycomb structure molding base is formed by the additional manufacturing method, the thickness 10 to 10 so as to cover at least a part of the back hole and the portion constituting the slit of the honeycomb structure molding base. It is necessary to provide a plating layer of 300 μm. From this point of view, the plating layer is a portion where the molding raw material and the honeycomb structure molding base come into contact with each other when the honeycomb structure is extruded, that is, a portion forming a back hole and a slit of the honeycomb structure molding base. It is preferable to provide it on the entire surface.

また、めっき層の厚み、及び当該めっき層が設けられた部位における表面粗さ(Rz)の好ましい範囲は前述のとおりである。 Further, the preferable ranges of the thickness of the plating layer and the surface roughness (Rz) at the portion where the plating layer is provided are as described above.

また、上記めっき層を設けた後の、ハニカム構造体成形用口金の裏孔又はスリットを構成する部位の表面の表面粗さ(Ra)を上記範囲とすることを容易にするため、上記めっき層を設ける前、口金の裏孔及びスリット内に砥粒流動体を流すことによりハニカム構造体成形用口金を研磨する流体研磨工程を含むことが好ましい。
典型的には、ダイヤモンドや炭化ケイ素などの砥粒を含む流動体(オイルなど)をハニカム構造体成形用口金内に繰り返し通過させることにより研磨することができる。砥粒流動体の組成及び研磨工程の条件は、制限されず、必要に応じて適宜選択・変更することができる。
Further, in order to facilitate the surface roughness (Ra) of the surface of the portion forming the back hole or slit of the honeycomb structure molding base after the plating layer is provided, the plating layer is provided. It is preferable to include a fluid polishing step of polishing the base for forming the honeycomb structure by flowing the abrasive grain fluid into the back hole and the slit of the base before providing the base.
Typically, it can be polished by repeatedly passing a fluid (oil or the like) containing abrasive grains such as diamond or silicon carbide through the honeycomb structure forming base. The composition of the abrasive grain fluid and the conditions of the polishing process are not limited, and can be appropriately selected and changed as necessary.

また、上記めっき層を設けた後の、ハニカム構造体成形用口金の裏孔又はスリットを構成する部位の表面の表面粗さ(Ra)を上記範囲とすることを容易にする観点から、上記流体研磨工程前におけるハニカム構造体成形用口金の裏孔及びスリットを構成する部位の表面粗さ(Ra)が5〜20μmであり、上記流体研磨工程により、口金の裏孔及びスリットを構成する部位の表面粗さ(Ra)を1〜10μmとすることが好ましい。特に、上記流体研磨工程により、口金の裏孔及びスリットを構成する部位の表面粗さ(Ra)を1〜5μmとすれば、めっき層の厚みを薄くすることができるので好適である。 Further, from the viewpoint of facilitating the surface roughness (Ra) of the surface of the portion forming the back hole or slit of the honeycomb structure molding base after the plating layer is provided, the above fluid The surface roughness (Ra) of the part forming the back hole and the slit of the honeycomb structure molding base before the polishing step is 5 to 20 μm, and the part forming the back hole and the slit of the mouthpiece by the above-mentioned fluid polishing step. The surface roughness (Ra) is preferably 1 to 10 μm. In particular, if the surface roughness (Ra) of the portion forming the back hole and the slit of the mouthpiece is set to 1 to 5 μm by the above fluid polishing step, the thickness of the plating layer can be reduced, which is preferable.

前述のように、前記めっき層は、無電解Niめっき層であることが好ましい。無電解Niめっき層を設ける方法は特に限定されず、種々の公知の方法を用いることができる。無電解Niめっきは、ニッケルと、次亜リン酸ナトリウム、ホウ水酸化ナトリウム等の還元剤とを含有させためっき液を、80〜100℃程度に加熱して、ハニカム構造体成形用口金をめっき液中に所定時間浸して行うことができる。 As described above, the plating layer is preferably an electroless Ni plating layer. The method of providing the electroless Ni plating layer is not particularly limited, and various known methods can be used. In electroless Ni plating, a plating solution containing nickel and a reducing agent such as sodium hypophosphate and sodium borohydroxide is heated to about 80 to 100 ° C. to plate a base for forming a honeycomb structure. It can be carried out by immersing it in a liquid for a predetermined time.

(3.ハニカム構造体の製造方法)
本発明のハニカム構造体の製造方法は、一側面において、本発明のハニカム構造体成形用口金の製造方法によりハニカム構造体成形用口金を製造し、さらに当該ハニカム構造体成形用口金を使用してハニカム構造体を押出成形する工程を含むハニカム構造体の製造方法である。
(3. Manufacturing method of honeycomb structure)
In one aspect, the method for manufacturing a honeycomb structure of the present invention manufactures a honeycomb structure molding base by the method for manufacturing a honeycomb structure molding base of the present invention, and further uses the honeycomb structure molding base. This is a method for manufacturing a honeycomb structure, which includes a step of extrusion-molding the honeycomb structure.

また、本発明のハニカム構造体の製造方法は、一側面において、本発明のハニカム構造体成形用口金を使用してハニカム構造体を押出成形する工程を含むハニカム構造体の製造方法である。 Further, the method for manufacturing a honeycomb structure of the present invention is a method for manufacturing a honeycomb structure including a step of extruding the honeycomb structure using the base for forming the honeycomb structure of the present invention on one side.

以下、本発明を実施例により具体的に説明するが、本発明は以下の実施例に限定されるものではない。 Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to the following Examples.

[組成]
ハニカム構造体成形用口金の原料となる粉末として、ステンレス金属粉末(Mn:1.00以下,Mo:0.3以下,Ni:3.00〜5.00,Cr:15.50〜17.50,Cu:3.00〜5.00,Fe:70〜80(単位は質量%))を用意した。
[composition]
Stainless metal powder (Mn: 1.00 or less, Mo: 0.3 or less, Ni: 3.00 to 5.00, Cr: 15.50 to 17.50) as a powder that is a raw material for the base for forming a honeycomb structure. , Cu: 3.00 to 5.00, Fe: 70 to 80 (unit: mass%)) were prepared.

[付加製造]
各実施例及び比較例のハニカム構造体成形用口金は、3Dsystems社製3DプリンターProX300を使用し、上記ステンレス金属粉末をステージ上に薄層に形成し、これに電子ビームを照射して、ステンレス金属粉末を固化させて造形物層を形成し、この造形物層を繰り返し積層することによって、図1に示される基本的構造を有するものを作製した。造形において使用される口金の設計図は図3に示される。
[Additional manufacturing]
As the base for forming the honeycomb structure of each example and the comparative example, a 3D printer ProX300 manufactured by 3Dsystems was used to form the stainless metal powder in a thin layer on the stage, and an electron beam was irradiated to the thin layer to form the stainless metal. The powder was solidified to form a molded product layer, and the molded product layer was repeatedly laminated to prepare a product having the basic structure shown in FIG. The design drawing of the base used in the modeling is shown in FIG.

[めっき層]
各実施例について、上記付加製造により造形されるハニカム構造体成形用口金について、
エクスツルードホーン社製流体研磨機EX−4350を使用して流体研磨を行い、脱脂処理した後、35%塩酸浴に1分間浸漬し、塩化ニッケル酸性浴にて電解めっきを行い、その直後リン酸ニッケル浴にて、無電解めっきを連続する一回のめっき工程により行い、表1に示される厚みの無電解Niめっき層を、当該口金の裏孔及びスリットの表面に設けた。無電解Niめっき層の厚みの測定方法は前述のとおりである。
なお、上記流体研磨を行う前の、ハニカム構造体成形用口金の裏孔及びスリットの表面粗さ(Ra)、及び上記流体研磨を行った後、上記無電解Niめっき層を設ける前のハニカム構造体成形用口金の裏孔及びスリットの表面粗さ(Ra)は表1に示される。表面粗さ(Ra)の測定方法は前述のとおりである。
[Plating layer]
For each embodiment, regarding the honeycomb structure molding base formed by the above-mentioned additional manufacturing.
Fluid polishing is performed using the EX-4350 fluid polishing machine manufactured by Extrude Horn, and after degreasing, it is immersed in a 35% hydrochloric acid bath for 1 minute, electroplated in a nickel chloride acidic bath, and immediately after that, phosphorus Electroless plating was performed in a nickel acid bath by one continuous plating step, and an electroless Ni plating layer having the thickness shown in Table 1 was provided on the back hole and the surface of the slit of the mouthpiece. The method for measuring the thickness of the electroless Ni plating layer is as described above.
The surface roughness (Ra) of the back hole and slit of the base for forming the honeycomb structure before the fluid polishing, and the honeycomb structure after the fluid polishing and before the electroless Ni plating layer is provided. The surface roughness (Ra) of the back hole and the slit of the body molding base is shown in Table 1. The method for measuring the surface roughness (Ra) is as described above.

製造される各実施例及び比較例のハニカム構造体成形用口金を用いて、坏土を押し出してハニカム構造体を成形し、予期された性状を有するハニカム構造体を製造することができた場合には「〇」、予期された性状を有するハニカム構造体を製造することができなかった場合には「×」とし、表1に成形性として示した。 When the honeycomb structure can be manufactured by extruding the clay using the honeycomb structure molding caps of the manufactured Examples and Comparative Examples to produce the honeycomb structure having the expected properties. Is "◯", and when a honeycomb structure having the expected properties could not be produced, it was marked with "x", and is shown as moldability in Table 1.

1…ハニカム構造体成形用口金
2…口金基体
3…裏孔
4…スリット
5、6…ハニカム構造体成形用口金の両面
10…ハニカム構造体
11…隔壁
12…セル
1 ... Honeycomb structure molding base 2 ... Base base 3 ... Back hole 4 ... Slits 5, 6 ... Both sides of honeycomb structure molding base 10 ... Honeycomb structure 11 ... Partition 12 ... Cell

Claims (9)

成形原料を導入する裏孔と、前記裏孔と連通して成形原料をハニカム構造体に押出成形するためのスリットを有するハニカム構造体成形用口金の製造方法であって、
付加製造法により前記ハニカム構造体成形用口金を造形する工程と、
前記ハニカム構造体成形用口金の、前記裏孔及び前記スリットを構成する部位の少なくとも一部を覆うように、厚み10〜300μmのめっき層を設ける工程
を含むハニカム構造体成形用口金の製造方法。
A method for manufacturing a honeycomb structure molding base, which has a back hole into which a molding raw material is introduced and a slit for extruding the molding raw material into the honeycomb structure in communication with the back hole.
The process of molding the honeycomb structure molding base by the additional manufacturing method, and
A method for manufacturing a honeycomb structure molding base, which comprises a step of providing a plating layer having a thickness of 10 to 300 μm so as to cover at least a part of the back hole and a portion constituting the slit of the honeycomb structure molding base.
前記めっき層の厚みが20〜200μmである請求項1に記載のハニカム構造体成形用口金の製造方法。 The method for manufacturing a honeycomb structure molding base according to claim 1, wherein the thickness of the plating layer is 20 to 200 μm. 前記ハニカム構造体成形用口金の、前記めっき層が設けられた部位の表面粗さ(Ra)が0.3〜7μmである請求項1又は2に記載のハニカム構造体成形用口金の製造方法。 The method for manufacturing a honeycomb structure molding base according to claim 1 or 2, wherein the surface roughness (Ra) of the portion of the honeycomb structure molding base provided with the plating layer is 0.3 to 7 μm. 前記ハニカム構造体成形用口金の、前記めっき層が設けられた部位の表面粗さ(Ra)が0.3〜3μmである請求項3に記載のハニカム構造体成形用口金の製造方法。 The method for manufacturing a honeycomb structure molding base according to claim 3, wherein the surface roughness (Ra) of the portion of the honeycomb structure molding base provided with the plating layer is 0.3 to 3 μm. さらに、前記めっき層を設ける前、前記裏孔及び前記スリット内に砥粒流動体を流すことにより前記ハニカム構造体成形用口金を研磨する流体研磨工程を含む請求項1〜4のいずれかに記載のハニカム構造体成形用口金の製造方法。 Further, according to any one of claims 1 to 4, further comprising a fluid polishing step of polishing the honeycomb structure molding base by flowing an abrasive grain fluid through the back hole and the slit before providing the plating layer. Method for manufacturing a base for forming a honeycomb structure. 前記流体研磨工程前における前記ハニカム構造体成形用口金の、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)が5〜20μmであり、前記流体研磨工程により、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)を1〜10μmとする請求項5に記載のハニカム構造体成形用口金の製造方法。 The surface roughness (Ra) of the back hole and the portion constituting the slit of the honeycomb structure molding base before the fluid polishing step is 5 to 20 μm, and the back hole and the back hole and the said portion are subjected to the fluid polishing step. The method for manufacturing a honeycomb structure molding base according to claim 5, wherein the surface roughness (Ra) of the portion constituting the slit is 1 to 10 μm. 前記流体研磨工程により、前記裏孔及び前記スリットを構成する部位の表面粗さ(Ra)を1〜5μmとする請求項6に記載のハニカム構造体成形用口金の製造方法。 The method for manufacturing a honeycomb structure molding base according to claim 6, wherein the surface roughness (Ra) of the back hole and the portion constituting the slit is set to 1 to 5 μm by the fluid polishing step. 前記めっき層が無電解Niめっき層である請求項1〜7のいずれかに記載のハニカム構造体成形用口金の製造方法。 The method for manufacturing a honeycomb structure molding base according to any one of claims 1 to 7, wherein the plating layer is an electroless Ni plating layer. 請求項1〜8のいずれかに記載のハニカム構造体成形用口金の製造方法によりハニカム構造体成形用口金を製造し、さらに当該ハニカム構造体成形用口金を使用してハニカム構造体を押出成形する工程を含むハニカム構造体の製造方法。 The honeycomb structure molding base is manufactured by the method for manufacturing the honeycomb structure molding base according to any one of claims 1 to 8, and the honeycomb structure is extruded using the honeycomb structure molding base. A method for manufacturing a honeycomb structure including a step.
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