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JP6817514B2 - Polypropylene resin foam molded product and its manufacturing method - Google Patents
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JP6817514B2 - Polypropylene resin foam molded product and its manufacturing method - Google Patents

Polypropylene resin foam molded product and its manufacturing method Download PDF

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JP6817514B2
JP6817514B2 JP2016118212A JP2016118212A JP6817514B2 JP 6817514 B2 JP6817514 B2 JP 6817514B2 JP 2016118212 A JP2016118212 A JP 2016118212A JP 2016118212 A JP2016118212 A JP 2016118212A JP 6817514 B2 JP6817514 B2 JP 6817514B2
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内山陽平
前田崇之
仁賀助宏
井上貴博
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New Japan Chemical Co Ltd
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Description

本発明は、機械的強度に優れたポリプロピレン系樹脂発泡成形体及びその製造方法に関し、詳しくは、特定のアミド化合物、特にその微細な針状結晶を含有することにより機械的強度が改善されたポリプロピレン系樹脂発泡成形体に関する。 The present invention relates to a polypropylene-based resin foam molded article having excellent mechanical strength and a method for producing the same. Specifically, the present invention is made of polypropylene having improved mechanical strength by containing a specific amide compound, particularly fine acicular crystals thereof. Regarding a resin foam molded product.

従来から、ポリプロピレン系樹脂発泡成形体は、ポリプロピレン系樹脂そのものが持っている優れた耐熱性、機械的特性、加工性に加えて、発泡成形体の特徴である軽量性、断熱性等の性能を有し、省資源でかつリサイクル性に優れた環境にやさしい素材として、自動車、電気電子部品、建築材料などの耐衝撃性や断熱性の要求される分野に幅広く利用されており、前記分野だけでなく緩衝材、包装材、パッキング材等としても今後益々その適用分野の増加が期待されている。 Conventionally, polypropylene-based resin foam molded products have the excellent heat resistance, mechanical properties, and workability of polypropylene-based resins themselves, as well as the lightness and heat insulating properties that are the characteristics of foamed molded products. As an environment-friendly material that is resource-saving and has excellent recyclability, it is widely used in fields that require impact resistance and heat insulation, such as automobiles, electrical and electronic parts, and building materials. It is expected that the fields of application will increase more and more in the future as cushioning materials, packaging materials, packing materials, etc.

また、近年、省資源化、軽量化のために、より発泡倍率の高い発泡成形体が望まれており、ポリプロピレン系樹脂発泡成形体においても同様である。しかし、ポリプロピレン系樹脂は、溶融時の粘度および張力が低いため高発泡倍率の発泡成形体を製造するのが難しく、その改善が必要であり、これまでも様々な改善の試みがなされてきた。たとえば、ポリプロピレン系樹脂粒子に揮発性発泡剤を含有させ、加熱により予備発泡を行なうことを特徴とする発泡成形体製造用のポリプロピレン系樹脂の予備発泡粒子などが開示されている(特許文献1)。また、ポリプロピレン系樹脂発泡成形体の製造技術として、放射線によりポリプロピレンを枝分かれさせる技術(特許文献2)や、過酸化物を使用した枝分かれポリプロピレンの製造方法(特許文献3)などの技術が開示されている。 Further, in recent years, in order to save resources and reduce weight, a foam molded product having a higher foaming ratio has been desired, and the same applies to a polypropylene-based resin foamed molded product. However, since polypropylene-based resins have low viscosity and tension at the time of melting, it is difficult to produce a foam molded product having a high foaming ratio, and improvement thereof is necessary, and various improvements have been attempted so far. For example, there are disclosed pre-foamed particles of polypropylene-based resin for producing a foamed molded article, which are characterized in that polypropylene-based resin particles contain a volatile foaming agent and are pre-foamed by heating (Patent Document 1). .. Further, as a technique for manufacturing a polypropylene-based resin foam molded product, a technique for branching polypropylene by radiation (Patent Document 2) and a technique for manufacturing branched polypropylene using a peroxide (Patent Document 3) are disclosed. There is.

しかしながら、発泡粒子を用いた場合は、発泡粒子同士の接着性不足のために、機械的強度が低下しやすいという問題があった。その改善方法として、β晶核剤を用いた予備発泡粒子の製造方法などが開示されている(特許文献4)が、未だ満足できる機械的強度は得られていないのが現状である。また、放射線や過酸化物を使用した場合、リサイクル性が悪く、汎用的に使用するには大きな問題であり、現実的に使用することは難しかった。 However, when the foamed particles are used, there is a problem that the mechanical strength tends to decrease due to insufficient adhesiveness between the foamed particles. As an improvement method, a method for producing prefoamed particles using a β-crystal nucleating agent is disclosed (Patent Document 4), but the current situation is that satisfactory mechanical strength has not yet been obtained. In addition, when radiation or peroxide is used, the recyclability is poor, which is a big problem for general-purpose use, and it is difficult to use it practically.

特開昭58−65734号公報Japanese Unexamined Patent Publication No. 58-65734 特開昭62−121704号公報Japanese Unexamined Patent Publication No. 62-121704 特開平2−298536号公報Japanese Unexamined Patent Publication No. 2-298536 特開平8−67760号公報Japanese Unexamined Patent Publication No. 8-67760

本発明の目的は、本来ポリプロピレン系樹脂の持っている優れた耐熱性や機械的特性を活かして、更に発泡倍率を上げることのできる、即ち、機械的強度に優れた高発泡倍率のポリプロピレン系樹脂発泡成形体及びその製造方法を提供することである。 An object of the present invention is to make use of the excellent heat resistance and mechanical properties originally possessed by a polypropylene resin to further increase the foaming ratio, that is, a polypropylene resin having a high foaming ratio having excellent mechanical strength. The present invention provides a foam molded product and a method for producing the same.

本発明者らは、上述の状況に鑑み、上記課題を達成すべく鋭意検討した結果、特定のアミド化合物、特にその微細な針状結晶を含むポリプロピレン系樹脂組成物を特定の成形条件にて調製した後、その発泡成形用のポリプロピレン系樹脂組成物を加熱し、次いで発泡剤、特に二酸化炭素を発泡剤として加えた後に、発泡させることにより得られる発泡成形体が、上記課題を達成し得ることを見出し、これに基づいて本発明を完成するに至った。 In view of the above situation, the present inventors have diligently studied to achieve the above problems, and as a result, prepared a polypropylene-based resin composition containing a specific amide compound, particularly its fine acicular crystals, under specific molding conditions. After that, the polypropylene-based resin composition for foam molding is heated, and then a foaming agent, particularly carbon dioxide, is added as a foaming agent, and then foaming is performed so that the foamed molded product can achieve the above-mentioned problems. Was found, and the present invention was completed based on this.

即ち、本発明は、以下のポリプロピレン系樹脂発泡成形体およびその製造方法、更に、そのポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物を提供するものである。 That is, the present invention provides the following polypropylene-based resin foam molded article, a method for producing the same, and a polypropylene-based resin composition for producing the polypropylene-based resin foam molded article.

[項1] 下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物を含有することを特徴とするポリプロピレン系樹脂発泡成形体。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 1] A polypropylene-based resin containing at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2). Foam molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

[項2] 前記アミド化合物が、微細な針状結晶である[項1]に記載のポリプロピレン系樹脂発泡成形体。 [Item 2] The polypropylene-based resin foam molded product according to [Item 1], wherein the amide compound is a fine acicular crystal.

[項3] 前記アミド化合物が、下記一般式(3)で示される少なくとも1種のアミド化合物である[項1]又は[項2]に記載のポリプロピレン系樹脂発泡成形体。
[式(3)中、Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数3〜18の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRは、同一又は異なって、それぞれ炭素数5〜18のシクロアルキル基、下記の一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す
[式(a)〜(d)中、R10は水素原子、炭素数1〜12の直鎖状若しくは分岐鎖状のアルキル基、炭素数6〜10のシクロアルキル基又はフェニル基を表し、R11は炭素数1〜12の直鎖状又は分岐鎖状のアルキル基を表し、R12は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表し、R13は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表す)。]
[Item 3] The polypropylene-based resin foam molded product according to [Item 1] or [Item 2], wherein the amide compound is at least one amide compound represented by the following general formula (3).
[In formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 2 to 18 carbon atoms, a saturated or unsaturated aliphatic dicarboxylic acid residue having 3 to 18 carbon atoms, or a carbon. Representing aromatic dicarboxylic acid residues of numbers 6 to 18, R 8 and R 9 are the same or different cycloalkyl groups having 5 to 18 carbon atoms, respectively, the following general formulas (a) and (b). , Represents a group represented by the general formula (c) or the general formula (d)
[In formulas (a) to (d), R 10 represents a hydrogen atom, a linear or branched alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 6 to 10 carbon atoms, or a phenyl group, and R 11 represents a linear or branched alkyl group having 1 to 12 carbon atoms, R 12 represents a linear or branched alkylene group having 1 to 4 carbon atoms, and R 13 represents a linear or branched alkylene group having 1 to 4 carbon atoms. Represents 1 to 4 linear or branched alkylene groups). ]

[項4] 一般式(3)において、Rが炭素数3〜12の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRが、同一又は異なって、それぞれ炭素数5〜12のシクロアルキル基、又は一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す[項3]に記載のポリプロピレン系樹脂発泡成形体。 [Item 4] In the general formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 3 to 12 carbon atoms and a saturated or unsaturated aliphatic dicarboxylic acid residue having 6 to 10 carbon atoms. , Or an aromatic dicarboxylic acid residue having 6 to 18 carbon atoms, and R 8 and R 9 are the same or different, cycloalkyl groups having 5 to 12 carbon atoms, respectively, or general formulas (a) and general formulas (a). b), The polypropylene-based resin foam molded product according to [Item 3], which represents a group represented by the general formula (c) or the general formula (d).

[項5] 一般式(3)において、Rが炭素数4〜8の飽和の脂肪族ジカルボン酸残基、炭素数6〜8の飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基であり、R及びRが、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基又は1個の炭素数1〜4のアルキル基で置換されていてもよいフェニル基である[項4]に記載のポリプロピレン系樹脂発泡成形体。 [Item 5] In the general formula (3), R 7 is a saturated aliphatic dicarboxylic acid residue having 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having 6 to 8 carbon atoms, or 6 to 6 carbon atoms. Eighteen aromatic dicarboxylic acid residues, R 8 and R 9 each having the same or different number of cyclohexyl groups or one carbon number which may be substituted with one alkyl group having 1 to 4 carbon atoms. Item 4. The polypropylene-based resin foam molded product according to [Item 4], which is a phenyl group that may be substituted with 1 to 4 alkyl groups.

[項6] 一般式(3)において、Rが、下記一般式(e)で表される芳香族ジカルボン酸残基であり、R及びRが、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基である[項5]に記載のポリプロピレン系樹脂発泡成形体。
[Item 6] In the general formula (3), R 7 is an aromatic dicarboxylic acid residue represented by the following general formula (e), and R 8 and R 9 are the same or different, and one each. Item 5. The polypropylene-based resin foam molded article according to [Item 5], which is a cyclohexyl group that may be substituted with an alkyl group having 1 to 4 carbon atoms.

[項7] アミド化合物が、2,6−ナフタレンジカルボン酸ジシクロヘキシルアミドである[項6]に記載のポリプロピレン系樹脂発泡成形体。 [Item 7] The polypropylene-based resin foam molded product according to [Item 6], wherein the amide compound is 2,6-naphthalenedicarboxylic acid dicyclohexylamide.

[項8] 前記アミド化合物が、下記一般式(4)で示される少なくとも1種のアミド化合物である[項1]又は[項2]に記載のポリプロピレン系樹脂発泡成形体。
[式中、R14は、炭素数2〜18の飽和若しくは不飽和の脂肪族トリカルボン酸残基、炭素数3〜18の脂環族トリカルボン酸残基又は炭素数6〜18の芳香族トリカルボン酸残基を表す。3個のR15は、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[Item 8] The polypropylene-based resin foam molded product according to [Item 1] or [Item 2], wherein the amide compound is at least one amide compound represented by the following general formula (4).
[In the formula, R 14 is a saturated or unsaturated aliphatic tricarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic tricarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic tricarboxylic acid having 6 to 18 carbon atoms. Represents a residue. Three R 15 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, having 5 to 30 carbon atoms alicyclic amine residue or C6-30 Represents an aromatic amine residue. ]

[項9] 前記アミド化合物が、下記一般式(5)で示される少なくとも1種のアミド化合物である[項8]に記載のポリプロピレン系樹脂発泡成形体。
[式中、R16、R17、R18は、同一又は異なって、炭素数5〜20の直鎖状若しくは分岐鎖状のアルキル基若しくはアルケニル基、フェニル基、下記一般式(f)で表されるシクロアルキル基、又は下記一般式(g)で表されるアルキル置換シクロアルキル基を表す。]
[式中、xは、1〜8の整数を表す。]
[式中、R19 は、炭素数1〜4の直鎖状若しくは分岐鎖状アルキル基を表す。yは、1〜8の整数を表す。zは1〜4の整数を表す。zが2以上の場合、各々のR19 は互いに同一又は異なってもよい。]
[Item 9] The polypropylene-based resin foam molded product according to [Item 8], wherein the amide compound is at least one amide compound represented by the following general formula (5).
[In the formula, R 16 , R 17 , and R 18 are the same or different, and are represented by the following general formula (f), which are linear or branched alkyl or alkenyl groups or phenyl groups having 5 to 20 carbon atoms. It represents a cycloalkyl group to be used, or an alkyl-substituted cycloalkyl group represented by the following general formula (g). ]
[In the formula, x represents an integer of 1-8. ]
[In the formula, R 19 represents a linear or branched chain alkyl group having 1 to 4 carbon atoms. y represents an integer of 1-8. z represents an integer of 1 to 4. When z is 2 or more, each R 19 may be the same or different from each other. ]

[項10] 前記アミド化合物の含有量が、ポリプロピレン系樹脂100重量部に対して、0.001〜10重量部の範囲である、[項1]〜[項9]の何れかに記載のポリプロピレン系樹脂発泡成形体。 [Item 10] The polypropylene according to any one of [Item 1] to [Item 9], wherein the content of the amide compound is in the range of 0.001 to 10 parts by weight with respect to 100 parts by weight of the polypropylene resin. Based resin foam molded product.

[項11] 前記アミド化合物の含有量が、ポリプロピレン系樹脂100重量部に対して、0.01〜5重量部の範囲である、[項10]に記載のポリプロピレン系樹脂発泡成形体。 [Item 11] The polypropylene-based resin foam molded article according to [Item 10], wherein the content of the amide compound is in the range of 0.01 to 5 parts by weight with respect to 100 parts by weight of the polypropylene-based resin.

[項12] ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.1〜60.0g/10分である[項1]〜[項11]の何れかに記載のポリプロピレン系樹脂発泡成形体。 [Item 12] The polypropylene resin foam molding according to any one of [Item 1] to [Item 11], wherein the melt flow rate of the polypropylene resin at 230 ° C. and a load of 2160 g is 0.1 to 60.0 g / 10 minutes. body.

[項13] ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.2〜40.0g/10分である[項12]に記載のポリプロピレン系樹脂発泡成形体。 [Item 13] The polypropylene-based resin foam molded article according to [Item 12], wherein the melt flow rate of the polypropylene-based resin at 230 ° C. and a load of 2160 g is 0.2 to 40.0 g / 10 minutes.

[項14] (i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物とを240〜330℃の温度範囲まで加熱して溶融混合し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、
(ii)工程(i)で得られた溶融ポリプロピレン系樹脂組成物を80℃以下の温度まで冷却し、固化したポリプロピレン系樹脂組成物中にアミド化合物の微細な針状結晶を析出させる工程、
(iii)工程(ii)で得られたポリプロピレン系樹脂組成物に発泡剤を混合した後、190〜260℃の温度範囲で加熱混合し、その後に発泡させる発泡成形工程
を具備することを特徴とするポリプロピレン系樹脂発泡成形体の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 14] (i) 240 to at least one amide compound selected from the group consisting of a polypropylene-based resin, an amide compound represented by the following general formula (1), and an amide compound represented by the general formula (2). A step of heating to a temperature range of 330 ° C., melting and mixing, and dissolving the amide compound in the melted polypropylene resin.
(Ii) A step of cooling the molten polypropylene-based resin composition obtained in step (i) to a temperature of 80 ° C. or lower and precipitating fine acicular crystals of an amide compound in the solidified polypropylene-based resin composition.
(Iii) The polypropylene-based resin composition obtained in step (ii) is characterized by comprising a foam molding step of mixing a foaming agent, heating and mixing in a temperature range of 190 to 260 ° C., and then foaming. A method for producing a polypropylene-based resin foam molded article.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

[項15] 前記発泡剤が、無機系若しくは有機系化学発泡剤である、[項14]に記載の製造方法 [Item 15] The production method according to [Item 14], wherein the foaming agent is an inorganic or organic chemical foaming agent.

[項16] (i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物とを溶融混合後、冷却固化して、アミド化合物を含有するポリプロピレン系樹脂組成物を製造する工程、
(ii)工程(i)で得られたポリプロピレン系樹脂組成物を、240〜330℃の温度範囲に加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させた後、80℃以下の温度まで冷却し、アミド化合物の微細な針状結晶を均一に含有する所定の形状の成形物を成形する工程、
(iii)工程(ii)で得られた成形物を150〜240℃の温度範囲に加温してから発泡剤を注入し、その後に発泡させる発泡成形工程
を具備することを特徴とするポリプロピレン系樹脂発泡成形体の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 16] (i) A polypropylene resin is melt-mixed with at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2). After that, the process of cooling and solidifying to produce a polypropylene-based resin composition containing an amide compound,
(Ii) The polypropylene-based resin composition obtained in step (i) is heated to a temperature range of 240 to 330 ° C. to dissolve the amide compound in the molten polypropylene-based resin, and then to a temperature of 80 ° C. or lower. A step of cooling and molding a molded product having a predetermined shape containing fine needle-like crystals of an amide compound uniformly.
(Iii) A polypropylene-based product comprising a foam molding step of heating the molded product obtained in step (ii) to a temperature range of 150 to 240 ° C., injecting a foaming agent, and then foaming. A method for manufacturing a resin foam molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

[項17] (i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物とを溶融混合後、冷却固化して、アミド化合物を含有するポリプロピレン系樹脂組成物を製造する工程
(ii)工程(i)で得られたポリプロピレン系樹脂組成物を、240〜330℃の温度範囲に加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させた後、そのままの温度で、又は220〜280℃の温度範囲まで冷却後、発泡剤を注入し、更に150〜220℃の温度範囲まで温度を下げて、その後に発泡させる発泡成形工程
を具備することを特徴とするポリプロピレン系樹脂発泡成形体の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 17] (i) A polypropylene-based resin is melt-mixed with at least one amide compound selected from the group consisting of an amide compound represented by the following general formula (1) and an amide compound represented by the general formula (2). After that, the polypropylene-based resin composition obtained in the steps (ii) and (i) of producing a polypropylene-based resin composition containing an amide compound by cooling and solidifying is heated to a temperature range of 240 to 330 ° C. After dissolving the amide compound in the molten polypropylene resin, cool it at the same temperature or to a temperature range of 220 to 280 ° C, inject a foaming agent, and further lower the temperature to a temperature range of 150 to 220 ° C. A method for producing a polypropylene-based resin foam molded product, which comprises a foam molding step for subsequent foaming.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

[項18] 前記発泡剤が、超臨界状態の不活性ガスである[項16]又は[項17]に記載の製造方法。 [Item 18] The production method according to [Item 16] or [Item 17], wherein the foaming agent is an inert gas in a supercritical state.

[項19] 前記不活性ガスが、二酸化炭素である[項18]に記載の製造方法。 [Item 19] The production method according to [Item 18], wherein the inert gas is carbon dioxide.

[項20] 発泡成形工程における発泡倍率が1.2〜100倍である[項14]〜[項19]の何れかに記載の製造方法。 [Item 20] The production method according to any one of [Item 14] to [Item 19], wherein the foaming ratio in the foam molding step is 1.2 to 100 times.

[項21] 下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物を含有することを特徴とするポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 21] A polypropylene-based resin containing at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2). A polypropylene-based resin composition for producing a foamed molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

[項22] 前記アミド化合物が、微細な針状結晶である[項21]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 22] The polypropylene-based resin composition for producing a polypropylene-based resin foam molded article according to [Item 21], wherein the amide compound is a fine acicular crystal.

[項23] 前記アミド化合物が、下記一般式(3)で示される少なくとも1種のアミド化合物である[項21]又は[項22]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式(3)中、Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数3〜18の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRは、同一又は異なって、それぞれ炭素数5〜18のシクロアルキル基、下記の一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す
(式(a)〜(d)中、R10は水素原子、炭素数1〜12の直鎖状若しくは分岐鎖状のアルキル基、炭素数6〜10のシクロアルキル基又はフェニル基を表し、R11は炭素数1〜12の直鎖状又は分岐鎖状のアルキル基を表し、R12は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表し、R13は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表す)。]
[Item 23] The polypropylene-based resin according to [Item 21] or [Item 22], wherein the amide compound is at least one amide compound represented by the following general formula (3). Composition.
[In formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 2 to 18 carbon atoms, a saturated or unsaturated aliphatic dicarboxylic acid residue having 3 to 18 carbon atoms, or a carbon. Representing aromatic dicarboxylic acid residues of numbers 6 to 18, R 8 and R 9 are the same or different cycloalkyl groups having 5 to 18 carbon atoms, respectively, the following general formulas (a) and (b). , Represents a group represented by the general formula (c) or the general formula (d)
(In formulas (a) to (d), R 10 represents a hydrogen atom, a linear or branched alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 6 to 10 carbon atoms, or a phenyl group, and R 11 represents a linear or branched alkyl group having 1 to 12 carbon atoms, R 12 represents a linear or branched alkylene group having 1 to 4 carbon atoms, and R 13 represents a linear or branched alkylene group having 1 to 4 carbon atoms. Represents 1 to 4 linear or branched alkylene groups). ]

[項24] 一般式(3)において、Rが炭素数3〜12の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRが、同一又は異なって、それぞれ炭素数5〜12のシクロアルキル基、又は一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す[項23]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 24] In the general formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 3 to 12 carbon atoms and a saturated or unsaturated aliphatic dicarboxylic acid residue having 6 to 10 carbon atoms. , Or an aromatic dicarboxylic acid residue having 6 to 18 carbon atoms, and R 8 and R 9 are the same or different, cycloalkyl groups having 5 to 12 carbon atoms, respectively, or general formulas (a) and general formulas (a). b), The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to [Item 23], which represents a group represented by the general formula (c) or the general formula (d).

[項25] 一般式(3)において、Rが炭素数4〜8の飽和の脂肪族ジカルボン酸残基、炭素数6〜8の飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基であり、R及びRが、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基又は1個の炭素数1〜4のアルキル基で置換されていてもよいフェニル基である[項24]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 25] In the general formula (3), R 7 is a saturated aliphatic dicarboxylic acid residue having 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having 6 to 8 carbon atoms, or 6 to 6 carbon atoms. Eighteen aromatic dicarboxylic acid residues, R 8 and R 9 each having the same or different number of cyclohexyl groups or one carbon number which may be substituted with one alkyl group having 1 to 4 carbon atoms. The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to [Item 24], which is a phenyl group which may be substituted with 1 to 4 alkyl groups.

[項26] 一般式(3)において、Rが、一般式(e)
で表される芳香族ジカルボン酸残基であり、R及びRが、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基である[項25]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[Item 26] In the general formula (3), R 7 is the general formula (e).
It is an aromatic dicarboxylic acid residue represented by, and R 8 and R 9 are cyclohexyl groups which are the same or different and may be substituted with one alkyl group having 1 to 4 carbon atoms, respectively. 25] The polypropylene-based resin composition for producing a polypropylene-based resin foam molded body according to the above.

[項27] アミド化合物が、2,6−ナフタレンジカルボン酸ジシクロヘキシルアミドである[項26]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 27] The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to [Item 26], wherein the amide compound is 2,6-naphthalenedicarboxylic acid dicyclohexylamide.

[項28] 前記アミド化合物が、下記一般式(4)で示される少なくとも1種のアミド化合物である[項21]又は[項22]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、R14は、炭素数2〜18の飽和若しくは不飽和の脂肪族トリカルボン酸残基、炭素数3〜18の脂環族トリカルボン酸残基又は炭素数6〜18の芳香族トリカルボン酸残基を表す。3個のR15は、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[Item 28] The polypropylene-based resin according to [Item 21] or [Item 22], wherein the amide compound is at least one amide compound represented by the following general formula (4). Composition.
[In the formula, R 14 is a saturated or unsaturated aliphatic tricarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic tricarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic tricarboxylic acid having 6 to 18 carbon atoms. Represents a residue. Three R 15 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, having 5 to 30 carbon atoms alicyclic amine residue or C6-30 Represents an aromatic amine residue. ]

[項29] 前記アミド化合物が、下記一般式(5)で示される少なくとも1種のアミド化合物である[項28]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、R16、R17、R18は、同一又は異なって、炭素数5〜20の直鎖状若しくは分岐鎖状のアルキル基若しくはアルケニル基、フェニル基、下記一般式(f)で表されるシクロアルキル基、又は下記一般式(g)で表されるアルキル置換シクロアルキル基を表す。]
[式中、xは、1〜8の整数を表す。]
[式中、R19 は、炭素数1〜4の直鎖状若しくは分岐鎖状アルキル基を表す。yは、1〜8の整数を表す。zは1〜4の整数を表す。zが2以上の場合、各々のR19 は互いに同一又は異なってもよい。]
[Item 29] The polypropylene-based resin composition for producing a polypropylene-based resin foam molded article according to [Item 28], wherein the amide compound is at least one amide compound represented by the following general formula (5).
[In the formula, R 16 , R 17 , and R 18 are the same or different, and are represented by the following general formula (f), which are linear or branched alkyl or alkenyl groups or phenyl groups having 5 to 20 carbon atoms. It represents a cycloalkyl group to be used, or an alkyl-substituted cycloalkyl group represented by the following general formula (g). ]
[In the formula, x represents an integer of 1-8. ]
[In the formula, R 19 represents a linear or branched chain alkyl group having 1 to 4 carbon atoms. y represents an integer of 1-8. z represents an integer of 1 to 4. When z is 2 or more, each R 19 may be the same or different from each other. ]

[項30] 前記アミド化合物の含有量が、ポリプロピレン系樹脂100重量部に対して、0.001〜10重量部の範囲である、[項21]〜[項29]の何れかに記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 30] The polypropylene according to any one of [Item 21] to [Item 29], wherein the content of the amide compound is in the range of 0.001 to 10 parts by weight with respect to 100 parts by weight of the polypropylene resin. Polypropylene resin composition for producing foamed molded articles.

[項31] 前記アミド化合物の含有量が、ポリプロピレン系樹脂100重量部に対して、0.01〜5重量部の範囲である、[項30]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 31] The polypropylene-based resin foam molded article according to [Item 30], wherein the content of the amide compound is in the range of 0.01 to 5 parts by weight with respect to 100 parts by weight of the polypropylene-based resin. Polypropylene resin composition.

[項32] ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.1〜60.0g/10分である[項21]〜[項31]の何れかに記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 32] The polypropylene resin foam molding according to any one of [Item 21] to [Item 31], wherein the melt flow rate of the polypropylene resin at 230 ° C. and a load of 2160 g is 0.1 to 60.0 g / 10 minutes. Polypropylene resin composition for body manufacturing.

[項33] ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.2〜40.0g/10分である[項32]に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 [Item 33] The polypropylene-based resin composition for producing a polypropylene-based resin foam molded article according to [Item 32], wherein the melt flow rate of the polypropylene-based resin at 230 ° C. and a load of 2160 g is 0.2 to 40.0 g / 10 minutes. Stuff.

[項34] (i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物を240〜330℃の温度範囲まで加熱して溶融混合し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、
(ii)工程(i)で得られた溶融ポリプロピレン系樹脂組成物を80℃以下の温度まで冷却し、固化したポリプロピレン系樹脂組成物中にアミド化合物の微細な針状結晶を析出させる工程、
を具備することを特徴とするポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
[Item 34] At least one amide compound selected from the group consisting of (i) polypropylene-based resin, an amide compound represented by the following general formula (1), and an amide compound represented by the general formula (2) is 240 to 330. A step of heating to a temperature range of ℃, melting and mixing, and dissolving the amide compound in the melted polypropylene resin.
(Ii) A step of cooling the molten polypropylene-based resin composition obtained in step (i) to a temperature of 80 ° C. or lower and precipitating fine acicular crystals of an amide compound in the solidified polypropylene-based resin composition.
A method for producing a polypropylene-based resin composition for producing a polypropylene-based resin foam molded article, which comprises the above.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

本発明のポリプロピレン系樹脂発泡成形体の製造方法により、ポリプロピレン系樹脂本来の耐熱性や機械的強度等の機械的特性を損なうことなく、発泡倍率を上げることが可能となり、該方法により得られたポリプロピレン系樹脂発泡成形体は優れた機械的特性の要求される自動車用途などにおける軽量化による燃費削減等に貢献することができる。また、本発明のポリプロピレン系樹脂発泡成形体は、優れた機械的特性を有する高発泡成形体として軽量化による燃費削減の要求される自動車用途で有用であることは言うまでもなく、近年の省資源化の要望に適応して様々な用途で使うことができる。 According to the method for producing a polypropylene-based resin foam molded article of the present invention, it is possible to increase the foaming ratio without impairing the mechanical properties such as heat resistance and mechanical strength inherent in polypropylene-based resin, which was obtained by this method. The polypropylene-based resin foam molded product can contribute to reduction of fuel consumption by weight reduction in automobile applications where excellent mechanical properties are required. Further, it goes without saying that the polypropylene-based resin foam molded product of the present invention is useful as a highly foamed molded product having excellent mechanical properties in automobile applications where fuel consumption reduction by weight reduction is required, and resource saving in recent years. It can be used for various purposes according to the needs of.

以下、本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.

<ポリプロピレン系樹脂組成物>
本発明におけるポリプロピレン系樹脂組成物は、ポリプロピレン系樹脂発泡成形体の製造を目的とし、特定のアミド化合物を少なくとも1種含むことを特徴とし、特に前記アミド化合物の態様が微細な針状結晶であることが好ましい。
<Polypropylene resin composition>
The polypropylene-based resin composition in the present invention is characterized by containing at least one specific amide compound for the purpose of producing a polypropylene-based resin foam molded product, and in particular, the aspect of the amide compound is a fine needle-like crystal. Is preferable.

その製造方法は、所望の樹脂組成物が得られる限り、特に限定されることなく、当該技術分野で公知の製造方法、例えば、後述のポリプロピレン系樹脂(粉末又はフレーク)、アミド化合物及び脂肪酸カルシウム塩、並びに必要に応じて他の添加剤を混合する方法を用いることができる。例えば、ポリプロピレン系樹脂とアミド化合物、更に必要に応じてその他の添加剤を混合後、所定の温度で混練し、アミド化合物を溶融ポリプロピレン系樹脂中に溶融混合させた後、冷却固化する方法なども挙げられる。また、前記溶融混合時に、アミド化合物を溶融ポリプロピレン系樹脂中に溶解させた後、冷却固化する方法が、含まれるアミド化合物がより微細な針状結晶になるため、好ましい。 The production method is not particularly limited as long as a desired resin composition can be obtained, and production methods known in the art, for example, polypropylene-based resins (powder or flakes), amide compounds, and fatty acid calcium salts described below. , And a method of mixing other additives as needed can be used. For example, there is also a method in which a polypropylene resin, an amide compound, and other additives, if necessary, are mixed, kneaded at a predetermined temperature, the amide compound is melt-mixed in the molten polypropylene resin, and then cooled and solidified. Can be mentioned. Further, a method in which the amide compound is dissolved in the molten polypropylene-based resin at the time of the melt mixing and then cooled and solidified is preferable because the contained amide compound becomes finer needle-like crystals.

ポリプロピレン系樹脂
本発明に用いられるポリプロピレン系樹脂としては、プロピレンを主要な構成成分とする重合体であって、具体的には、プロピレンホモポリマー、プロピレンを主体とするランダム又はブロックプロピレン共重合体を挙げることができる。
Polypropylene-based resin The polypropylene-based resin used in the present invention is a polymer containing propylene as a main constituent, and specifically, a propylene homopolymer or a random or blocked propylene copolymer mainly composed of propylene. Can be mentioned.

該プロピレン共重合体としては、例えば、プロピレンとコモノマーとのランダム共重合体又はブロック共重合体であって、プロピレンを主成分とするものが例示できる。該コモノマーとしては、プロピレン以外の1−アルケン(エチレン、1−ブテン、1−ペンテン、1−ヘキセン、4−メチルペンテン等)の他、他のコモノマー、例えば、スチレン、無水マレイン酸、(メタ)アクリル酸等を例示できる。また、該共重合体は、プロピレン−エチレン多元共重合体であってもよく、例えば、プロピレン、エチレンに加えて、5−エチリデン−2−ノルボルネン、5−メチレン−2−ノルボルネン、1,4−ヘキサジエン等を含む共重合体等が例示される。 Examples of the propylene copolymer include random copolymers of propylene and comonomer or block copolymers containing propylene as a main component. Examples of the comonomer include 1-alkenes other than propylene (ethylene, 1-butene, 1-pentene, 1-hexene, 4-methylpentene, etc.) and other comonomeres such as styrene, maleic anhydride, (meth). Acrylic acid and the like can be exemplified. The copolymer may be a propylene-ethylene multi-element copolymer, for example, in addition to propylene and ethylene, 5-ethylidene-2-norbornene, 5-methylene-2-norbornene, 1,4-. Examples thereof include copolymers containing hexadiene and the like.

上記共重合体におけるプロピレンの含有量は、70〜99重量%程度、特に80〜98重量%程度であることが好ましい。また、プロピレンを主体とする共重合体のなかでも、プロピレン−エチレン共重合体が好ましい。プロピレン−エチレン共重合体としては、エチレンコンテントが1〜30重量%程度、特に2〜20重量%程度の共重合体が好ましい。 The content of propylene in the above-mentioned copolymer is preferably about 70 to 99% by weight, particularly preferably about 80 to 98% by weight. Further, among the copolymers mainly composed of propylene, a propylene-ethylene copolymer is preferable. As the propylene-ethylene copolymer, a copolymer having an ethylene content of about 1 to 30% by weight, particularly about 2 to 20% by weight is preferable.

本明細書において、上記「エチレンコンテント」とは、プロピレン−エチレンコポリマーに含まれているエチレン含有量(エチレン由来の構造部分の含有量)を意味する。上記エチレンコンテントは、一般的に赤外線スペクトル法(J.Polym.Sci.,7,203(1964))により測定することができる。 In the present specification, the above-mentioned "ethylene content" means the ethylene content (content of structural portion derived from ethylene) contained in the propylene-ethylene copolymer. The ethylene content can generally be measured by the infrared spectral method (J.Polym.Sci., 7,203 (1964)).

また、上記ポリプロピレン系樹脂は、他に少量の熱可塑性樹脂、例えば、高密度ポリエチレン、ポリブテン−1、ポリ−4−メチルペンテン−1等を含んでいるポリマーブレンドとして使用してもよい。但し、ポリマーブレンドを使用する場合、これらポリマーブレンドにおけるポリプロピレン系樹脂の含有割合は、樹脂中、70〜99重量%程度、特に80〜98重量%程度であることが好ましい。 In addition, the polypropylene-based resin may be used as a polymer blend containing a small amount of thermoplastic resin such as high-density polyethylene, polybutene-1, poly-4-methylpentene-1 and the like. However, when polymer blends are used, the content ratio of the polypropylene-based resin in these polymer blends is preferably about 70 to 99% by weight, particularly about 80 to 98% by weight, in the resin.

これらのポリプロピレン系樹脂のメルトフローレート(以下、「MFR」と略記する。JIS K−7210(1999))としては、好ましくは0.1〜60g/10分、より好ましくは0.2〜40g/10分、特に好ましくは0.5〜20g/10分の範囲であることが推奨される。上記ポリマーブレンドのMFRも同様に、0.1〜60g/10分、好ましくは0.2〜40g/10分、より好ましくは0.5〜20g/10分の範囲であることが推奨される。なお、上記のMFRは、荷重2160g、230℃における数値である。 The melt flow rate of these polypropylene resins (hereinafter abbreviated as "MFR"; JIS K-7210 (1999)) is preferably 0.1 to 60 g / 10 minutes, more preferably 0.2 to 40 g / min. It is recommended that it be in the range of 10 minutes, particularly preferably 0.5 to 20 g / 10 minutes. Similarly, it is recommended that the MFR of the polymer blend be in the range of 0.1 to 60 g / 10 minutes, preferably 0.2 to 40 g / 10 minutes, and more preferably 0.5 to 20 g / 10 minutes. The above MFR is a numerical value at a load of 2160 g and 230 ° C.

MFRが0.1g/10分未満では、発泡時の溶融張力が高すぎるため発泡しにくく、MFRが60g/10分を超えると急激な発泡で破泡が生じやすく、いずれの場合も発泡倍率を上げることが難しくなる。 If the MFR is less than 0.1 g / 10 minutes, the melt tension at the time of foaming is too high and it is difficult to foam, and if the MFR exceeds 60 g / 10 minutes, rapid foaming tends to cause foam breakage. It becomes difficult to raise.

また、発泡時の破泡を抑えるために自由末端長鎖分岐を有する高溶融張力ポリプロピレンを 使うこともできる。 It is also possible to use high melt tension polypropylene having a free-ended long chain branch in order to suppress foam breakage during foaming.

アミド化合物
本発明で用いられるアミド化合物は、下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物である。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
Amide Compound The amide compound used in the present invention is at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2).
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, 6 to alicyclic amine residue or carbon atoms of 5 to 30 carbon atoms Represents 30 aromatic amine residues. ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]

上記アミド化合物の中でも、好ましいアミド化合物としては、下記一般式(3)で示される少なくとも1種のアミド化合物であることが推奨される。
[式(3)中、Rは、炭素数2〜18、好ましくは炭素数3〜12、特に好ましくは4〜8の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数3〜18、好ましくは6〜10、特に好ましくは6〜8の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRは、同一又は異なって、それぞれ炭素数5〜18のシクロアルキル基、下記の一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す
[式(a)〜(d)中、R10は水素原子、炭素数1〜12の直鎖状若しくは分岐鎖状のアルキル基、炭素数6〜10のシクロアルキル基又はフェニル基を表し、R11は炭素数1〜12の直鎖状又は分岐鎖状のアルキル基を表し、R12は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表し、R13は、炭素数1〜4の直鎖状又は分岐鎖状のアルキレン基を表す)。]
Among the above amide compounds, the preferred amide compound is recommended to be at least one amide compound represented by the following general formula (3).
[In the formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 2 to 18 carbon atoms, preferably 3 to 12 carbon atoms, particularly preferably 4 to 8 carbon atoms, and 3 to 18 carbon atoms. It represents preferably 6 to 10, particularly preferably 6 to 8 saturated or unsaturated alicyclic dicarboxylic acid residues, or 6 to 18 carbon atoms, and R 8 and R 9 are the same. Or differently, it represents a cycloalkyl group having 5 to 18 carbon atoms, and a group represented by the following general formula (a), general formula (b), general formula (c) or general formula (d), respectively.
[In formulas (a) to (d), R 10 represents a hydrogen atom, a linear or branched alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 6 to 10 carbon atoms, or a phenyl group, and R 11 represents a linear or branched alkyl group having 1 to 12 carbon atoms, R 12 represents a linear or branched alkylene group having 1 to 4 carbon atoms, and R 13 represents a linear or branched alkylene group having 1 to 4 carbon atoms. Represents 1 to 4 linear or branched alkylene groups). ]

なかでも、Rが、下記一般式(e)で表される芳香族ジカルボン酸残基であり、R及びRが、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基である上記一般式(3)で示される少なくとも1種のアミド化合物であることが推奨される。
Among them, R 7 is an aromatic dicarboxylic acid residue represented by the following general formula (e), and R 8 and R 9 are the same or different alkyl groups having 1 to 4 carbon atoms, respectively. It is recommended that the amide compound represented by the above general formula (3) is at least one amide compound which is a cyclohexyl group which may be substituted with.

更に、一般式(3)で示されるアミド化合物の中でも、2,6−ナフタレンジカルボン酸ジシクロヘキシルアミドが、本発明の効果の観点より特に推奨される。 Further, among the amide compounds represented by the general formula (3), 2,6-naphthalenedicarboxylic acid dicyclohexylamide is particularly recommended from the viewpoint of the effect of the present invention.

上記一般式(1)で示されるアミド化合物のなかでも、好ましいアミド化合物としては、下記一般式(4)で示される少なくとも1種のアミド化合物であることが推奨される。
[式中、R14は、炭素数2〜18の飽和若しくは不飽和の脂肪族トリカルボン酸残基、炭素数3〜18の脂環族トリカルボン酸残基又は炭素数6〜18の芳香族トリカルボン酸残基を表す。3個のR15は、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族アミン残基、炭素数5〜30の脂環族アミン残基又は炭素数6〜30の芳香族アミン残基を表す。]
Among the amide compounds represented by the general formula (1), at least one amide compound represented by the following general formula (4) is recommended as a preferable amide compound.
[In the formula, R 14 is a saturated or unsaturated aliphatic tricarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic tricarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic tricarboxylic acid having 6 to 18 carbon atoms. Represents a residue. Three R 15 are the same or different, respectively, saturated or unsaturated aliphatic amine residue having 5 to 30 carbon atoms, having 5 to 30 carbon atoms alicyclic amine residue or C6-30 Represents an aromatic amine residue. ]

上記一般式(4)で示されるアミド化合物のなかでも、好ましいアミド化合物としては、下記一般式(5)で示される少なくとも1種のアミド化合物であることが推奨される。
[式中、R16、R17、R18は、同一又は異なって、炭素数5〜20の直鎖状若しくは分岐鎖状のアルキル基若しくはアルケニル基、フェニル基、下記一般式(f)で表されるシクロアルキル基、又は下記一般式(g)で表されるアルキル置換シクロアルキル基を表す。]
[式中、xは、1〜8の整数を表す。]
[式中、R19 は、炭素数1〜4の直鎖状若しくは分岐鎖状アルキル基を表す。yは、1〜8の整数を表す。zは1〜4の整数を表す。zが2以上の場合、各々のR19 は互いに同一又は異なってもよい。]
Among the amide compounds represented by the general formula (4), at least one amide compound represented by the following general formula (5) is recommended as a preferable amide compound.
[In the formula, R 16 , R 17 , and R 18 are the same or different, and are represented by the following general formula (f), which are linear or branched alkyl or alkenyl groups or phenyl groups having 5 to 20 carbon atoms. It represents a cycloalkyl group to be used, or an alkyl-substituted cycloalkyl group represented by the following general formula (g). ]
[In the formula, x represents an integer of 1-8. ]
[In the formula, R 19 represents a linear or branched chain alkyl group having 1 to 4 carbon atoms. y represents an integer of 1-8. z represents an integer of 1 to 4. When z is 2 or more, each R 19 may be the same or different from each other. ]

本明細書及び特許請求の範囲において、Rで表される飽和若しくは不飽和の脂肪族ポリカルボン酸残基、飽和若しくは不飽和の脂環族ポリカルボン酸残基又は芳香族ポリカルボン酸残基とは、対応するポリカルボン酸から全てのカルボキシル基を除いて得られる基を指す。 Within the scope of the present specification and patent claims, a saturated or unsaturated aliphatic polycarboxylic acid residue represented by R 1 , a saturated or unsaturated alicyclic polycarboxylic acid residue or an aromatic polycarboxylic acid residue. Refers to a group obtained by removing all carboxyl groups from the corresponding polycarboxylic acid.

同様に、本明細書及び特許請求の範囲において、Rで表される飽和若しくは不飽和の脂肪族ジカルボン酸残基、飽和若しくは不飽和の脂環族ジカルボン酸残基又は芳香族ジカルボン酸残基とは、対応するジカルボン酸から2つのカルボキシル基を除いて得られる基を指す。 Similarly, in the specification and claims, an aliphatic dicarboxylic acid residue of a saturated or unsaturated represented by R 7, alicyclic dicarboxylic acid residue or an aromatic dicarboxylic acid residue of a saturated or unsaturated Refers to a group obtained by removing two carboxyl groups from the corresponding dicarboxylic acid.

同様に、本明細書及び特許請求の範囲において、R14で表される飽和若しくは不飽和の脂肪族トリカルボン酸残基、飽和若しくは不飽和の脂環族トリカルボン酸残基又は芳香族トリカルボン酸残基とは、対応するトリカルボン酸から3つのカルボキシル基を除いて得られる基を指す。 Similarly, in the specification and claims, aliphatic tricarboxylic acid residue of a saturated or unsaturated represented by R 14, alicyclic tricarboxylic acid residue, or aromatic tricarboxylic acid residues of saturated or unsaturated Refers to a group obtained by removing three carboxyl groups from the corresponding tricarboxylic acid.

また、本明細書及び特許請求の範囲において、R、R又はR14で表される飽和若しくは不飽和の脂肪族ポリ(ジ、トリ)カルボン酸残基、飽和若しくは不飽和の脂環族ポリ(ジ、トリ)カルボン酸残基又は芳香族ポリ(ジ、トリ)カルボン酸残基の炭素数とは、ポリ(ジ、トリ)カルボン酸残基としての炭素数(即ち、対応するポリ(ジ、トリ)カルボン酸の炭素数から含まれるカルボキシル基に相当する炭素数(ポリカルボン酸の場合は2〜6個、ジカルボン酸の場合は2個、トリカルボン酸の場合は3個)を引いたもの)を意味する。 Also, within the scope of this specification and patent claims, saturated or unsaturated aliphatic poly (di, tri) carboxylic acid residues represented by R 1 , R 7 or R 14 , saturated or unsaturated alicyclic group. The carbon number of a poly (di, tri) carboxylic acid residue or an aromatic poly (di, tri) carboxylic acid residue is the number of carbon atoms as a poly (di, tri) carboxylic acid residue (ie, the corresponding poly (ie, corresponding poly). Di, tri) The number of carbon atoms corresponding to the carboxyl group contained in the carboxylic acid (2 to 6 in the case of polycarboxylic acid, 2 in the case of dicarboxylic acid, 3 in the case of tricarboxylic acid) was subtracted from the number of carbon atoms. Things).

一般式(1)で示されるアミド化合物は、一般式(1a)
[式中、R20は前記一般式(1)におけるRと同義である。また、nは前記一般式(1)におけるnと同義である。]
で表される脂肪族、脂環族、又は芳香族のポリカルボン酸と一般式(1b)
[式中、R21は前記一般式(1)におけるRと同義である。]
で表される1種若しくは2種の脂肪族、脂環族又は芳香族のモノアミンをアミド化することにより容易に調製することができる。
The amide compound represented by the general formula (1) is the general formula (1a).
[In the formula, R 20 is synonymous with R 1 in the general formula (1). Further, n has the same meaning as n in the general formula (1). ]
Aliphatic, alicyclic, or aromatic polycarboxylic acids represented by the general formula (1b).
[In the formula, R 21 is synonymous with R 2 in the general formula (1). ]
It can be easily prepared by amidating one or two aliphatic, alicyclic or aromatic monoamines represented by.

本発明に係るアミド化合物は、公知であるか又は公知の方法に従い製造できる。例えば、特開平5−310665号公報や特開平7−188246号公報、特開平7−309821号公報、特表2005−528498号公報などの記載に従って、ポリカルボン酸とモノアミンを原料にアミド化反応を行うことにより製造できる。また、これらのポリカルボン酸の酸無水物、塩化物、該ポリカルボン酸と炭素数1〜4程度の低級アルコールとのエステル化合物等の反応性誘導体をアミド化に供することによっても製造できる。公知の方法に従い製造されたアミド化合物は、若干不純物を含むものであってもよいものの、好ましくは90重量%以上、より好ましくは95重量%以上、特に好ましくは97重量%以上が推奨される。不純物としては、反応中間体又は未反応物由来の部分アミド化物、副反応物由来のイミド化合物等が例示される。 The amide compound according to the present invention can be produced according to a known method or a known method. For example, according to the description of JP-A-5-310665, JP-A-7-188246, JP-A-7-309821, JP-A-2005-528498, etc., the amidation reaction is carried out using polycarboxylic acid and monoamine as raw materials. It can be manufactured by doing. It can also be produced by subjecting reactive derivatives such as acid anhydrides and chlorides of these polycarboxylic acids and ester compounds of the polycarboxylic acids to lower alcohols having about 1 to 4 carbon atoms for amidation. The amide compound produced according to a known method may contain some impurities, but is preferably 90% by weight or more, more preferably 95% by weight or more, and particularly preferably 97% by weight or more. Examples of impurities include partial amidates derived from reaction intermediates or unreactants, imide compounds derived from by-reactants, and the like.

上記脂肪族ポリカルボン酸としては、炭素数2〜18、好ましく3〜15の飽和若しくは不飽和の脂肪族ポリカルボン酸が例示され、より具体的には、マロン酸、ジフェニルマロン酸、コハク酸、フェニルコハク酸、ジフェニルコハク酸、グルタル酸、3,3−ジメチルグルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、1,12−ドデカン二酸、1,14−テトラデカン二酸、1,18−オクタデカン二酸、1,2,3−プロパントリカルボン酸等のジカルボン酸、1,2,3−プロペントリカルボン酸、1,3,5−ペンタントリカルボン酸等のトリカルボン酸、エタンテトラカルボン酸、プロパンテトラカルボン酸、ペンタンテトラカルボン酸、ブタンテトラカルボン酸(特に、1,2,3,4−ブタンテトラカルボン酸)、ドデカンテトラカルボン酸等のテトラカルボン酸、ペンタンペンタカルボン酸等のペンタカルボン酸、テトラデカンヘキサカルボン酸等のヘキサカルボン酸などが?示される。 Examples of the aliphatic polycarboxylic acid include saturated or unsaturated aliphatic polycarboxylic acids having 2 to 18 carbon atoms, preferably 3 to 15 carbon atoms, and more specifically, malonic acid, diphenylmalonic acid, succinic acid, and the like. Phenylsuccinic acid, diphenylsuccinic acid, glutaric acid, 3,3-dimethylglutaric acid, adipic acid, pimeric acid, suberic acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedic acid, Dicarboxylic acids such as 1,18-octadecanedic acid, 1,2,3-propanetricarboxylic acid, tricarboxylic acids such as 1,2,3-propentricarboxylic acid, 1,3,5-pentanetricarboxylic acid, ethanetetracarboxylic acid , Propanetetracarboxylic acid, pentantetracarboxylic acid, butanetetracarboxylic acid (particularly 1,2,3,4-butanetetracarboxylic acid), tetracarboxylic acid such as dodecanetetracarboxylic acid, pentacarboxylic acid such as pentanpentacarboxylic acid Hexacarboxylic acids such as acids and tetradecanehexacarboxylic acids are indicated.

上記脂環族ポリカルボン酸としては、炭素数3〜18、好ましくは6〜15の脂環族ポリカルボン酸が例示され、より具体的には、1,2−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジ酢酸、2−ノルボルネン−5,6−ジカルボン酸等のジカルボン酸、1,3,5−シクロヘキサントリカルボン酸、1,2,3−シクロヘキサントリカルボン酸、1,2,4−シクロヘキサントリカルボン酸等のトリカルボン酸、シクロペンタンテトラカルボン酸、1,2,4,5−シクロヘキサンテトラカルボン酸、テトラヒドロフランテトラカルボン酸、ビシクロ[2.2.2]オクタ−7−エン−2,3,5,6−テトラカルボン酸等のテトラカルボン酸、シクロヘキサンヘキサカルボン酸等のヘキサカルボン酸などが例示される。 Examples of the alicyclic polycarboxylic acid include alicyclic polycarboxylic acids having 3 to 18 carbon atoms, preferably 6 to 15 carbon atoms, and more specifically, 1,2-cyclohexanedicarboxylic acid and 1,3-. Dicarboxylic acids such as cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 1,4-cyclohexanediacetic acid, 2-norbornene-5,6-dicarboxylic acid, 1,3,5-cyclohexanetricarboxylic acid, 1,2,3 -Tricarboxylic acids such as cyclohexanetricarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid, cyclopentanetetracarboxylic acid, 1,2,4,5-cyclohexanetetracarboxylic acid, tetrahydrofurantetracarboxylic acid, bicyclo [2.2.2 ] Tetracarboxylic acids such as octa-7-ene-2,3,5,6-tetracarboxylic acid, hexacarboxylic acids such as cyclohexanehexacarboxylic acid and the like are exemplified.

上記芳香族ポリカルボン酸としては、炭素数6〜18、好ましくは6〜15の芳香族ポリカルボン酸が例示され、より具体的には、p−フェニレンジ酢酸、p−フェニレンジエタン酸、フタル酸、4−tert−ブチルフタル酸、イソフタル酸、5−tert−ブチルイソフタル酸、テレフタル酸、1,8−ナフタル酸、1,4−ナフタレンジカルボン酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、ジフェン酸、3,3’−ビフェニルジカルボン酸、4,4’−ビフェニルジカルボン酸、4,4’−ビナフチルジカルボン酸、ビス(3−カルボキシフェニル)メタン、ビス(4−カルボキシフェニル)メタン、2,2−ビス(3−カルボキシフェニル)プロパン、2,2−ビス(4−カルボキシフェニル)プロパン、3,3’−スルホニルジ安息香酸、4,4’−スルホニルジ安息香酸、3,3’−オキシジ安息香酸、4,4’−オキシジ安息香酸、3,3’−カルボニルジ安息香酸、4,4’−カルボニルジ安息香酸、3,3’−チオジ安息香酸、4,4’−チオジ安息香酸等のジカルボン酸、ヘミメリット酸、トリメシン酸、トリメリット酸、2,5,7−ナフタレントリカルボン酸、1,2,4−ナフタレントリカルボン酸等のトリカルボン酸、ピロメリット酸、ベンゾフェノンテトラカルボン酸、ビフェニルテトラカルボン酸、ビフェニルエーテルテトラカルボン酸、ジフェニルメタンテトラカルボン酸、ペリレンテトラカルボン酸、1,2,5,6−ナフタレンテトラカルボン酸、1,4,5,8−ナフタレンテトラカルボン酸、2,3,6,7−ナフタレンテトラカルボン酸、2,3,6,7−アントラセンテトラカルボン酸、ベンジジン−3,3'−ジカルボキシル−N,N'−四酢酸、ジフェニルプロパンテトラカルボン酸、フタロシアニンテトラカルボン酸等のテトラカルボン酸、ベンゼンペンタカルボン酸等のペンタカルボン酸、ベンゼンヘキサカルボン酸等のヘキサカルボン酸などが例示される。 Examples of the aromatic polycarboxylic acid include aromatic polycarboxylic acids having 6 to 18 carbon atoms, preferably 6 to 15 carbon atoms, and more specifically, p-phenylenediacetic acid, p-phenylenediethaneic acid, and phthalic acid. Acid, 4-tert-butylphthalic acid, isophthalic acid, 5-tert-butylisophthalic acid, terephthalic acid, 1,8-naphthalic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7- Naphthalenedicarboxylic acid, diphenylic acid, 3,3'-biphenyldicarboxylic acid, 4,4'-biphenyldicarboxylic acid, 4,4'-binaphthyldicarboxylic acid, bis (3-carboxyphenyl) methane, bis (4-carboxyphenyl) Methan, 2,2-bis (3-carboxyphenyl) propane, 2,2-bis (4-carboxyphenyl) propane, 3,3'-sulfonyldibenzoic acid, 4,4'-sulfonyldibenzoic acid, 3, 3'-oxydibenzoic acid, 4,4'-oxydibenzoic acid, 3,3'-carbonyldibenzoic acid, 4,4'-carbonyldibenzoic acid, 3,3'-thiodibenzoic acid, 4,4'- Dicarboxylic acids such as thiodibenzoic acid, hemmellitic acid, trimesic acid, trimellitic acid, 2,5,7-naphthalene tricarboxylic acid, tricarboxylic acids such as 1,2,4-naphthalene tricarboxylic acid, pyromellitic acid, benzophenone tetracarboxylic acid Acid, biphenyltetracarboxylic acid, biphenyl ether tetracarboxylic acid, diphenylmethanetetracarboxylic acid, perylenetetracarboxylic acid, 1,2,5,6-naphthalenetetracarboxylic acid, 1,4,5,8-naphthalenetetracarboxylic acid, 2 , 3,6,7-naphthalenetetracarboxylic acid, 2,3,6,7-anthracenetetracarboxylic acid, benzidine-3,3'-dicarboxy-N, N'-tetraacetic acid, diphenylpropanetetracarboxylic acid, phthalocyanine Examples thereof include tetracarboxylic acids such as tetracarboxylic acid, pentacarboxylic acids such as benzenepentacarboxylic acid, and hexacarboxylic acids such as benzenehexacarboxylic acid.

上記ポリカルボン酸の中でも、本発明の効果の観点及び原料の入手の容易さの観点から、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、1,2,3−プロペントリカルボン酸、1,2,3,4−ブタンテトラカルボン酸等の脂肪族ポリカルボン酸、1,4−シクロヘキサンジカルボン酸、2−ノルボルネン−5,6−ジカルボン酸、1,2,4−シクロヘキサントリカルボン酸等の脂環族ポリカルボン酸、テレフタル酸、2,6−ナフタレンジカルボン酸、4,4’−ビフェニルジカルボン酸、トリメシン酸、トリメリット酸、ピロメリット酸、ベンゾフェノンテトラカルボン酸、ビフェニルテトラカルボン酸等の芳香族ポリカルボン酸などが推奨され、その中でも、特に、アジピン酸、ピメリン酸、1,4−シクロヘキサンジカルボン酸、テレフタル酸、2,6−ナフタレンジカルボン酸、1,2,3−プロペントリカルボン酸、1,2,3,4−ブタンテトラカルボン酸、トリメシン酸が推奨される。 Among the above polycarboxylic acids, from the viewpoint of the effect of the present invention and the availability of raw materials, adipionic acid, pimelliic acid, suberic acid, azelaic acid, sebacic acid, 1,2,3-propentricarboxylic acid, 1 , 2,3,4-Butanetetracarboxylic acid and other aliphatic polycarboxylic acids, 1,4-cyclohexanedicarboxylic acid, 2-norbornene-5,6-dicarboxylic acid, 1,2,4-cyclohexanetricarboxylic acid and other fats Fragrances such as ring polycarboxylic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-biphenyldicarboxylic acid, trimesic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid Polycarboxylic acids and the like are recommended, among which adipic acid, pimeric acid, 1,4-cyclohexanedicarboxylic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, 1,2,3-propentricarboxylic acid, 1, 2,3,4-butanetetracarboxylic acid and trimesic acid are recommended.

上記脂肪族モノアミンとしては、炭素数5〜30、好ましくは5〜20の飽和若しくは不飽和の脂肪族ものアミンが例示され、より具体的には、ヘキシルアミン、ヘプチルアミン、オクチルアミン、ノニルアミン、デシルアミン、ウンデシルアミン、ドデシルアミン、トリデシルアミン、テトラデシルアミン、ペンタデシルアミン、ヘキサデシルアミン、ヘプタデシルアミン、オクタデシルアミン、ノナデシルアミン、イコシルアミン、ヘンイコシルアミン、ドコシルアミンなどが?示される。 Examples of the aliphatic monoamine include saturated or unsaturated aliphatic amines having 5 to 30 carbon atoms, preferably 5 to 20 carbon atoms, and more specifically, hexylamine, heptylamine, octylamine, nonylamine and decylamine. , Undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, nonadecilamine, icosylamine, henicosylamine, docosylamine, etc. are shown.

上記脂環族モノアミンとしては、炭素数5〜30、好ましくは炭素数5〜28、より好ましくは炭素数5〜18、更に好ましくは炭素数5〜12、特に好ましくは炭素数7〜10の脂環族モノアミンが例示され、より具体的には、炭素数5〜18のシクロアルキルアミン、一般式(6)
[式中、R22は前記一般式(b)におけるR11と同義である。]
で表される化合物、又は一般式(7)
[式中、R23は前記一般式(d)におけるR13と同義である。]
で表される化合物が例示される。
The alicyclic monoamine is a fat having 5 to 30 carbon atoms, preferably 5 to 28 carbon atoms, more preferably 5 to 18 carbon atoms, still more preferably 5 to 12 carbon atoms, and particularly preferably 7 to 10 carbon atoms. Acyclic monoamines are exemplified, and more specifically, cycloalkylamines having 5 to 18 carbon atoms, the general formula (6).
[In the formula, R 22 is synonymous with R 11 in the general formula (b). ]
Compound represented by, or general formula (7)
[In the formula, R 23 is synonymous with R 13 in the general formula (d). ]
The compound represented by is exemplified.

より具体的には、シクロペンチルアミン、シクロヘキシルアミン、2−メチルシクロヘキシルアミン、3−メチルシクロヘキシルアミン、4−メチルシクロヘキシルアミン、2,3−ジメチルシクロヘキシルアミン、2,4−ジメチルシクロヘキシルアミン、2−エチルシクロヘキシルアミン、3−エチルシクロヘキシルアミン、4−エチルシクロヘキシルアミン、2−n−プロピルシクロヘキシルアミン、3−n−プロピルシクロヘキシルアミン、4−n−プロピルシクロヘキシルアミン、2−イソプロピルシクロヘキシルアミン、3−イソプロピルシクロヘキシルアミン、4−イソプロピルシクロヘキシルアミン、2−n−ブチルシクロヘキシルアミン、3−n−ブチルシクロヘキシルアミン、4−n−ブチルシクロヘキシルアミン、2−イソブチルシクロヘキシルアミン、3−イソブチルシクロヘキシルアミン、4−イソブチルシクロヘキシルアミン、2−tert−ブチルシクロヘキシルアミン、3−tert−ブチルシクロヘキシルアミン、4−tert−ブチルシクロヘキシルアミン、4−sec−ブチルシクロヘキシルアミン、4−n−アミルシクロヘキシルアミン、4−イソアミルシクロヘキシルアミン、4−sec−アミルシクロヘキシルアミン、4−tert−アミルシクロヘキシルアミン、4−ヘキシルシクロヘキシルアミン、4−ヘプチルシクロヘキシルアミン、2−オクチルシクロヘキシルアミン、3−オクチルシクロヘキシルアミン、4−オクチルシクロヘキシルアミン、4−ノニルシクロヘキシルアミン、4−デシルシクロヘキシルアミン、4−ウンデシルシクロヘキシルアミン、4−ドデシルシクロヘキシルアミン、4−シクロヘキシルシクロヘキシルアミン、4−フェニルシクロヘキシルアミン、シクロヘプチルアミン、シクロドデシルアミン、シクロヘキシルメチルアミン、α−シクロヘキシルエチルアミン、β−シクロヘキシルエチルアミン、α−シクロヘキシルプロピルアミン、β−シクロヘキシルプロピルアミン、γ−シクロヘキシルプロピルアミンなどが例示される。 More specifically, cyclopentylamine, cyclohexylamine, 2-methylcyclohexylamine, 3-methylcyclohexylamine, 4-methylcyclohexylamine, 2,3-dimethylcyclohexylamine, 2,4-dimethylcyclohexylamine, 2-ethylcyclohexylamine. Amin, 3-ethylcyclohexylamine, 4-ethylcyclohexylamine, 2-n-propylcyclohexylamine, 3-n-propylcyclohexylamine, 4-n-propylcyclohexylamine, 2-isopropylcyclohexylamine, 3-isopropylcyclohexylamine, 4-Isopropylcyclohexylamine, 2-n-butylcyclohexylamine, 3-n-butylcyclohexylamine, 4-n-butylcyclohexylamine, 2-isobutylcyclohexylamine, 3-isobutylcyclohexylamine, 4-isobutylcyclohexylamine, 2- tert-Butylcyclohexylamine, 3-tert-butylcyclohexylamine, 4-tert-butylcyclohexylamine, 4-sec-butylcyclohexylamine, 4-n-amylcyclohexylamine, 4-isoamylcyclohexylamine, 4-sec-amylcyclohexylamine Amin, 4-tert-amylcyclohexylamine, 4-hexylcyclohexylamine, 4-heptylcyclohexylamine, 2-octylcyclohexylamine, 3-octylcyclohexylamine, 4-octylcyclohexylamine, 4-nonylcyclohexylamine, 4-decylcyclohexylamine Amin, 4-undecylcyclohexylamine, 4-dodecylcyclohexylamine, 4-cyclohexylcyclohexylamine, 4-phenylcyclohexylamine, cycloheptylamine, cyclododecylamine, cyclohexylmethylamine, α-cyclohexylamine, β-cyclohexylamine, α Examples thereof include -cyclohexylamine, β-cyclohexylamine, and γ-cyclohexylamine.

上記芳香族モノアミンとしては、炭素数6〜30、好ましくは炭素数5〜20、より好ましくは炭素数7〜18、更に好ましくは炭素数7〜10の芳香族モノアミンが例示され、より具体的には、一般式(8)
[式中、R24は前記一般式(a)におけるR10と同義である。]
で表される化合物、又は一般式(9)
[式中、R25は前記一般式(c)におけるR12と同義である。]
で表される化合物が例示される。
Examples of the aromatic monoamine include aromatic monoamines having 6 to 30 carbon atoms, preferably 5 to 20 carbon atoms, more preferably 7 to 18 carbon atoms, and further preferably 7 to 10 carbon atoms, and more specifically. Is the general formula (8)
[In the formula, R 24 is synonymous with R 10 in the general formula (a). ]
Compound represented by, or general formula (9)
[In the formula, R 25 is synonymous with R 12 in the general formula (c). ]
The compound represented by is exemplified.

より具体的には、アニリン、o−トルイジン、m−トルイジン、p−トルイジン、2−エチルアニリン、3−エチルアニリン、4−エチルアニリン、2−プロピルアニリン、3−プロピルアニリン、4−プロピルアニリン、o−クミジン、m−クミジン、p−クミジン、2−n−ブチルアニリン、3−n−ブチルアニリン、4−n−ブチルアニリン、2−イソブチルアニリン、3−イソブチルアニリン、4−イソブチルアニリン、2−sec−ブチルアニリン、3−sec−ブチルアニリン、4−sec−ブチルアニリン、2−tert−ブチルアニリン、3−tert−ブチルアニリン、4−tert−ブチルアニリン、p−n−アミルアニリン、p−イソアミルアニリン、p−sec−アミルアニリン、p−tert−アミルアニリン、2−n−ペンチルアニリン、3−n−ペンチルアニリン、4−n−ペンチルアニリン、2−イソペンチルアニリン、3−イソペンチルアニリン、4−イソペンチルアニリン、2−sec−ペンチルアニリン、3−sec−ペンチルアニリン、4−sec−ペンチルアニリン、2−tert−ペンチルアニリン、3−tert−ペンチルアニリン、4−tert−ペンチルアニリン、2−ヘキシルアニリン、3−ヘキシルアニリン、4−ヘキシルアニリン、2−ヘプチルアニリン、3−ヘプチルアニリン、4−ヘプチルアニリン、2−オクチルアニリン、3−オクチルアニリン、4−オクチルアニリン、2−ノニルアニリン、3−ノニルアニリン、4−ノニルアニリン、2−デシルアニリン、3−デシルアニリン、4−デシルアニリン、ウンデシルアニリン、ドデシルアニリン、シクロヘキシルアニリン、o−アミノジフェニル、m−アミノジフェニル、p−アミノジフェニル、ベンジルアミン、α−フェニルエチルアミン、β−フェニルエチルアミン、α−フェニルプロピルアミン、β−フェニルプロピルアミン、γ−フェニルプロピルアミン、1−ナフチルアミン、2−ナフチルアミン、1−アミノアントラセン、ジフェニルアミン、ジメチルアニリン、ジエチルアニリン、ジプロピルアニリン、ジイソプロピルアニリン、ジ−n−ブチルアニリン、ジ−sec−ブチルアニリン、ジ−tert−ブチルアニリン、トリメチルアニリン、トリエチルアニリン、トリプロピルアニリン、トリ−tert−ブチルアニリン、アニシジン、エトキシアニリン、ジメトキシアニリン、ジエトキシアニリン、トリメトキシアニリン、トリ−n−ブトキシアニリン、ベンジルアミン、メチルベンジルアミン、ジメチルベンジルアミン、トリメチルベンジルアミン、メトキシベンジルアミン、エトキシベンジルアミン、ジメトキシベンジルアミン、α−フェニルエチルアミン、メトキシフェニルエチルアミン、ジメトキシフェニルエチルアミン、メチルフェニルプロピルアミン等が例示される。 More specifically, aniline, o-toluidine, m-toluidine, p-toluidine, 2-ethylaniline, 3-ethylaniline, 4-ethylaniline, 2-propylaniline, 3-propylaniline, 4-propylaniline, o-Cumidine, m-Cumidine, p-Cumidine, 2-n-butylaniline, 3-n-butylaniline, 4-n-butylaniline, 2-isobutylaniline, 3-isobutylaniline, 4-isobutylaniline, 2- sec-butylaniline, 3-sec-butylaniline, 4-sec-butylaniline, 2-tert-butylaniline, 3-tert-butylaniline, 4-tert-butylaniline, pn-amylaniline, p-isoamyl Aniline, p-sec-amylaniline, p-tert-amylaniline, 2-n-pentylaniline, 3-n-pentylaniline, 4-n-pentylaniline, 2-isopentylaniline, 3-isopentylaniline, 4 -Isopentylaniline, 2-sec-pentylaniline, 3-sec-pentylaniline, 4-sec-pentylaniline, 2-tert-pentylaniline, 3-tert-pentylaniline, 4-tert-pentylaniline, 2-hexyl Anilin, 3-hexylaniline, 4-hexylaniline, 2-heptylaniline, 3-heptylaniline, 4-heptylaniline, 2-octylaniline, 3-octylaniline, 4-octylaniline, 2-nonylaniline, 3-nonyl Aniline, 4-nonylaniline, 2-decylaniline, 3-decylaniline, 4-decylaniline, undecylaniline, dodecylaniline, cyclohexylaniline, o-aminodiphenyl, m-aminodiphenyl, p-aminodiphenyl, benzylamine, α-phenylethylamine, β-phenylethylamine, α-phenylpropylamine, β-phenylpropylamine, γ-phenylpropylamine, 1-naphthylamine, 2-naphthylamine, 1-aminoanthracene, diphenylamine, dimethylaniline, diethylaniline, dipropylaniline, Diisopropylaniline, di-n-butylaniline, di-sec-butylaniline, di-tert-butylaniline, trimethylaniline, triethylaniline, tripropylaniline, tri-tert-butylaniline, anicidin, ethoxyaniline, dimethoxyaniline, diet Xyaniline, trimethoxyaniline, tri-n-butoxyaniline, benzylamine, methylbenzylamine, dimethylbenzylamine, trimethylbenzylamine, methoxybenzylamine, ethoxybenzylamine, dimethoxybenzylamine, α-phenylethylamine, methoxyphenylethylamine, dimethoxy Examples thereof include phenylethylamine and methylphenylpropylamine.

上記モノアミンの中でも、本発明の効果の観点及び原料の入手の容易さの観点から、無置換シクロヘキシルアミン又は置換基として炭素数1〜4の直鎖状?しくは分岐鎖状のアルキル基(特にメチル基)を1〜3個(特に1個)有するシクロヘキシルアミンが推奨される。 Among the above monoamines, from the viewpoint of the effect of the present invention and the availability of raw materials, an unsubstituted cyclohexylamine or a linear or branched alkyl group having 1 to 4 carbon atoms as a substituent (particularly). Cyclohexylamine having 1 to 3 (particularly 1) methyl group) is recommended.

特に好ましい脂環族モノアミンの具体?としては、シクロヘキシルアミン、2−メチルシクロヘキシルアミン、3−メチルシクロヘキシルアミン、4−メチルシクロヘキシルアミン、2−エチルシクロヘキシルアミン、2−n−プロピルシクロヘキシルアミン、2−iso−プロピルシクロヘキシルアミン、2−n−ブチルシクロヘキシルアミン、2−iso−ブチルシクロヘキシルアミン、2−sec−ブチルシクロヘキシルアミン、2−tert−ブチルシクロヘキシルアミンが挙げられる。 Specific examples of particularly preferable alicyclic monoamines include cyclohexylamine, 2-methylcyclohexylamine, 3-methylcyclohexylamine, 4-methylcyclohexylamine, 2-ethylcyclohexylamine, 2-n-propylcyclohexylamine, and 2-iso. Examples thereof include -propylcyclohexylamine, 2-n-butylcyclohexylamine, 2-iso-butylcyclohexylamine, 2-sec-butylcyclohexylamine and 2-tert-butylcyclohexylamine.

上記置換基を有するモノアミンは、シス体、トランス体及びこれら?体?性体の混合物のいずれでもよい。 The monoamine having the above-mentioned substituent may be any of a cis form, a trans form, and a mixture of these isomers.

加えて、好ましいモノアミンとしてアニリン又は炭素数1〜4の直鎖状?しくは分岐鎖状のアルキル基を1〜3個(特に1個)有するアニリンを挙げることができる。 In addition, preferred monoamines include aniline or aniline having 1 to 3 (particularly 1) linear or branched alkyl groups having 1 to 4 carbon atoms.

上記一般式(3)の化合物の中でも、好ましくは、Rが炭素数1〜12程度の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10程度の飽和若しくは不飽和の脂環族ジカルボン酸残基又は炭素数6〜20程度の芳香族ジカルボン酸残基を表し、R及びRが、同一又は異なって、炭素数3〜12程度のシクロアルキル基、又は、一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基である。 Among the compounds of the above general formula (3), preferably, R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having about 1 to 12 carbon atoms, and a saturated or unsaturated alicyclic having about 6 to 10 carbon atoms. It represents a group dicarboxylic acid residue or an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms, and R 8 and R 9 are the same or different, and a cycloalkyl group having about 3 to 12 carbon atoms, or a general formula ( a), a group represented by the general formula (b), the general formula (c) or the general formula (d).

より好ましくは、Rが炭素数4〜8程度の飽和脂肪族ジカルボン酸残基、炭素数6〜8程度の飽和脂環族ジカルボン酸残基又は炭素数6〜20程度の芳香族ジカルボン酸残基であり、R及びRが、1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基又は1個の炭素数1〜4程度のアルキル基で置換されていてもよいフェニル基である。 More preferably, R 7 is a saturated aliphatic dicarboxylic acid residue having about 4 to 8 carbon atoms, a saturated aliphatic dicarboxylic acid residue having about 6 to 8 carbon atoms, or an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms. It is a group, and R 8 and R 9 are substituted with a cyclohexyl group which may be substituted with one alkyl group having about 1 to 4 carbon atoms or an alkyl group having about 1 to 4 carbon atoms. It is also a good phenyl group.

更に好ましくは、Rが炭素数6〜20程度の芳香族ジカルボン酸残基であり、R及びRが、1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基である。 More preferably, R 7 is an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms, and R 8 and R 9 may be substituted with one alkyl group having about 1 to 4 carbon atoms. Is the basis.

特に、Rが、下記一般式(e)で表される芳香族ジカルボン酸残基であり、R及びRが1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基であることが推奨される。
In particular, R 7 is an aromatic dicarboxylic acid residue represented by the following general formula (e), and R 8 and R 9 may be substituted with one alkyl group having about 1 to 4 carbon atoms. It is recommended to be a cyclohexyl group.

一般式(2)又は一般式(3)で示されるジアミド化合物の中でも、好ましい化合物としては、アジピン酸ジアニリド、テレフタル酸ジ(シクロヘキシルアミド)、テレフタル酸ジ(2−メチルシクロヘキシルアミド)、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミド、N,N’−ジ(2−メチルシクロヘキシル)−2,6−ナフタレンジカルボキサミド、3,9−ビス[4-(N−シクロヘキシルカルバモイル)フェニル]−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス[4-(N−4−tert−ブチルシクロヘキシルカルバモイル)フェニル]−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス{4-[N−(2,4−ジ−tert−ブチルシクロヘキシル)カルバモイル]フェニル}−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン等が例示でき、特に好ましい化合物としてはN,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドが推奨される。 Among the diamide compounds represented by the general formula (2) or the general formula (3), preferable compounds are adipate dianilide, terephthalic acid di (cyclohexylamide), terephthalic acid di (2-methylcyclohexylamide), N, N. '-Dicyclohexyl-2,6-naphthalenedicarboxamide, N, N'-di (2-methylcyclohexyl) -2,6-naphthalenedicarboxamide, 3,9-bis [4- (N-cyclohexylcarbamoyl) phenyl]- 2,4,8,10-Tetraoxaspiro [5,5] undecane, 3,9-bis [4- (N-4-tert-butylcyclohexylcarbamoyl) phenyl] -2,4,8,10-tetraoxa Spiro [5,5] undecane, 3,9-bis {4- [N- (2,4-di-tert-butylcyclohexyl) carbamoyl] phenyl} -2,4,8,10-tetraoxaspiro [5, 5] Undecane and the like can be exemplified, and N, N'-dicyclohexyl-2,6-naphthalenedicarboxamide is recommended as a particularly preferable compound.

一般式(1)においてnが3の整数で示されるトリアミド化合物(即ち、一般式(4)で示されるアミド化合物)の中でも、一般式(5)で示されるアミド化合物や具体的な化合物として、1,2,3−プロパントリカルボン酸トリヘキシルアミド、1,2,3−プロパントリカルボン酸トリドデシルアミド、1,2,3−プロパントリカルボン酸トリオクタデシルアミド、1,2,3−プロパントリカルボン酸トリアニリド、1,2,3−プロパントリカルボン酸トリシクロヘキシルアミド、1,2,3−プロパントリカルボン酸トリス(2−メチルシクロヘキシルアミド)、1,2,3−プロパントリカルボン酸トリス(4−ブチルアニリド)、トリメシン酸トリヘキシルアミド、トリメシン酸トリドデシルアミド、トリメシン酸トリオクタデシルアミド、トリメシン酸トリアニリド、トリメシン酸トリシクロヘキシルアミド、トリメシン酸トリス(2−メチルシクロヘキシルアミド)、トリメシン酸トリス(4−ブチルアニリド)が好ましく、これらの中でも1,2,3−プロパントリカルボン酸トリス(2−メチルシクロヘキシルアミド)、トリメシン酸トリシクロヘキシルアミドなどが好ましい化合物として例示される。さらにその中でも、特にトリメシン酸トリシクロヘキシルアミド、1,2,3−プロパントリカルボン酸トリス(2−メチルシクロヘキシルアミド)が最も好ましい化合物として推奨される。 Among the triamide compounds in which n is represented by an integer of 3 in the general formula (1) (that is, the amide compound represented by the general formula (4)), as the amide compound represented by the general formula (5) or a specific compound, 1,2,3-Propanetricarboxylic acid trihexylamide, 1,2,3-propanetricarboxylic acid tridodecylamide, 1,2,3-propanetricarboxylic acid trioctadecylamide, 1,2,3-propanetricarboxylic acid trianilide, 1,2,3-Propanetricarboxylic acid tricyclohexylamide, 1,2,3-propanetricarboxylic acid tris (2-methylcyclohexylamide), 1,2,3-propanetricarboxylic acid tris (4-butylanilide), trimesic acid Trihexylamide, tridodecylamide trimethicate, trioctadecylamide trimethicate, trianilide trimethicate, tricyclohexylamide trimethicate, tristrimethicate (2-methylcyclohexylamide), tristrimethicate (4-butylanilide) are preferred. Among them, 1,2,3-propanetricarboxylic acid tris (2-methylcyclohexylamide), trimesic acid tricyclohexylamide and the like are exemplified as preferable compounds. Further, among them, particularly trimesic acid tricyclohexylamide and tris 1,2,3-propanetricarboxylic acid (2-methylcyclohexylamide) are recommended as the most preferable compounds.

一般式(1)においてnが4の整数で示されるアミド化合物(即ち、テトラアミド化合物)の中でも、好ましい化合物としては、1,2,3,4−ブタンテトラカルボン酸テトラヘキシルアミド、1,2,3,4−ブタンテトラカルボン酸テトラドデシルアミド、1,2,3,4−ブタンテトラカルボン酸テトラオクタデシルアミド、1,2,3,4−ブタンテトラカルボン酸テトラアニリド、1,2,3,4−ブタンテトラカルボン酸テトラシクロヘキシルアミド、1,2,3,4−ブタンテトラカルボン酸テトラキス(2−メチルシクロヘキシルアミド)、1,2,3,4−ブタンテトラカルボン酸テトラキス(4−ブチルアニリド)が好ましく、これらの中でも1,2,3,4−ブタンテトラカルボン酸テトラシクロヘキシルアミドが特に好ましい。 Among the amide compounds (that is, tetraamide compounds) in which n is represented by an integer of 4 in the general formula (1), preferred compounds are 1,2,3,4-butanetetracarboxylic acid tetrahexylamide, 1,2, 3,4-Butanetetracarboxylic acid tetradodecylamide, 1,2,3,4-butanetetracarboxylic acid tetraoctadecylamide, 1,2,3,4-butanetetracarboxylic acid tetraanilide, 1,2,3,4 -Butanetetracarboxylic acid tetracyclohexylamide, 1,2,3,4-butanetetracarboxylic acid tetrakis (2-methylcyclohexylamide), 1,2,3,4-butanetetracarboxylic acid tetrahexyl (4-butylanilide) Of these, 1,2,3,4-butanetetracarboxylic acid tetracyclohexylamide is particularly preferable.

本発明に係る上記アミド化合物は、それぞれ単独で又は2種以上を適宜組み合わせて使用することができる。 The amide compounds according to the present invention can be used alone or in combination of two or more.

ポリプロピレン系樹脂に溶融混合する前のアミド化合物の最大粒径としては、好ましくは20μm以下、より好ましくは10μm以下、特に好ましくは5μm以下であることが推奨される。最大粒径が20μmを超えると、溶融混合時にアミド化合物の分散不良を起こしたり、アミド化合物が溶融したポリプロピレン系樹脂に溶解し難くなり、溶け残りが生ずる可能性がある。溶け残った未溶解アミド化合物は、次の成形過程で結晶の巨大化(肥大化)の原因となり、得られた成形品の衝撃強度の低下、更には二次加工時の破断等の原因となり、好ましくない。ここで、最大粒径は、レーザー回折方式に基づく方法により測定した場合の粒径を指す。 It is recommended that the maximum particle size of the amide compound before melt-mixing with the polypropylene resin is preferably 20 μm or less, more preferably 10 μm or less, and particularly preferably 5 μm or less. If the maximum particle size exceeds 20 μm, the amide compound may be poorly dispersed during melt mixing, or the amide compound may be difficult to dissolve in the molten polypropylene resin, resulting in undissolved residue. The undissolved amide compound that remains undissolved causes enlargement (enlargement) of crystals in the next molding process, lowers the impact strength of the obtained molded product, and causes breakage during secondary processing. Not preferred. Here, the maximum particle size refers to the particle size when measured by a method based on a laser diffraction method.

本発明に係るアミド化合物の含有量ないし添加量は、ポリプロピレン系樹脂100重量部に対して、好ましくは0.0001〜10重量部、より好ましくは、0.01〜5重量部であることが推奨される。 It is recommended that the content or addition amount of the amide compound according to the present invention is preferably 0.0001 to 10 parts by weight, more preferably 0.01 to 5 parts by weight, based on 100 parts by weight of the polypropylene resin. Will be done.

<発泡剤>
本発明で使用できる発泡剤は、化学発泡剤、物理発泡剤など射出発泡成形に通常使用できるものであればとくに制限はない。化学発泡剤は、前記樹脂組成物と予め混合してから射出成形機に供給され、シリンダー内で分解して炭酸ガス等の気体を発生するものである。化学発泡剤としては、重炭酸ナトリウム、炭酸アンモニウム等の無機系化学発泡剤や、アゾジカルボンアミド、N,N’−ジニトロソペンタテトラミン等の有機系化学発泡剤があげられる。物理発泡剤は、成形機のシリンダー内の溶融樹脂にガス状または超臨界流体として注入され、分散または溶解されるもので、金型内に射出後、圧力開放されることによって発泡剤として機能するものである。物理発泡剤としては、プロパン、ブタン等の脂肪族炭化水素類、シクロブタン、シクロペンタン等の脂環式炭化水素類、クロロジフルオロメタン、ジクロロメタン等のハロゲン化炭化水素類、窒素、炭酸ガス、空気等の無機ガスがあげられる。これらは単独または2種以上混合して使用してよい。
<foaming agent>
The foaming agent that can be used in the present invention is not particularly limited as long as it can be usually used for injection foam molding such as a chemical foaming agent and a physical foaming agent. The chemical foaming agent is supplied to an injection molding machine after being mixed with the resin composition in advance and decomposed in a cylinder to generate a gas such as carbon dioxide gas. Examples of the chemical foaming agent include inorganic chemical foaming agents such as sodium bicarbonate and ammonium carbonate, and organic chemical foaming agents such as azodicarbonamide and N, N'-dinitrosopentatetramine. The physical foaming agent is injected into the molten resin in the cylinder of the molding machine as a gaseous or supercritical fluid, dispersed or dissolved, and functions as a foaming agent by releasing the pressure after injection into the mold. It is a thing. Examples of the physical foaming agent include aliphatic hydrocarbons such as propane and butane, alicyclic hydrocarbons such as cyclobutane and cyclopentane, halogenated hydrocarbons such as chlorodifluoromethane and dichloromethane, nitrogen, carbon dioxide, air and the like. Inorganic gas can be mentioned. These may be used alone or in combination of two or more.

これらの発泡剤の中で、好ましい発泡剤の一つとして、通常の射出成形機が使用でき、均一微細な気泡が得られやすい無機系化学発泡剤が挙げられる。これらの無機系化学発泡剤には、発泡成形体の気泡を安定的に均一微細にするために必要に応じて、例えばクエン酸のような有機酸等の発泡助剤やタルクのような無機微粒子等の発泡核剤を添加してもよい。通常、上記無機系化学発泡剤は取扱性、貯蔵安定性、ポリプロピレン系樹脂への分散性の点から、10〜50重量%濃度のポリオレフィン系樹脂のマスターバッチとして使用されるのが好ましい。 Among these foaming agents, one of the preferable foaming agents is an inorganic chemical foaming agent that can be used in a normal injection molding machine and can easily obtain uniform and fine bubbles. In these inorganic chemical foaming agents, foaming aids such as organic acids such as citric acid and inorganic fine particles such as talc are used as necessary in order to make the bubbles of the foam molded product stable and uniform. Etc. may be added. Usually, the inorganic chemical foaming agent is preferably used as a masterbatch of a polyolefin resin having a concentration of 10 to 50% by mass from the viewpoints of handleability, storage stability, and dispersibility in polypropylene resin.

上記無機系化学発泡剤の添加量は、種類、マスターバッチ中の濃度および所望の発泡倍率によって異なるが、ポリプロピレン系樹脂100重量部に対して、好ましくは0.1〜30重量部程度、より好ましくは0.5〜20重量部程度の範囲で使用される。この範囲で使用することにより、経済的に2倍以上の発泡倍率で、均一微細な気泡を有する射出発泡成成形体が得られやすい。 The amount of the inorganic chemical foaming agent added varies depending on the type, the concentration in the masterbatch, and the desired foaming ratio, but is preferably about 0.1 to 30 parts by weight, more preferably about 100 parts by weight, based on 100 parts by weight of the polypropylene resin. Is used in the range of about 0.5 to 20 parts by weight. By using it in this range, it is easy to obtain an injection-foamed molded product having uniform and fine bubbles at a foaming ratio of 2 times or more economically.

また、前記発泡剤の中で、もう一つの好ましい発泡剤としては、物理発泡剤である炭酸ガスが挙げられる。炭酸ガスは、通常、ポリプロピレン系樹脂等の熱可塑性樹脂を発泡させるために、押出機内に圧入させて供給されるものであり、超臨界状態、亜臨界状態、又は液化された二酸化炭素を用いることもできる。炭酸ガスは、従来の発泡剤以上に微細な気泡を形成させることができ、得られる発泡体の表面平滑性や柔軟性を向上させることができる。 Moreover, among the said foaming agents, another preferable foaming agent is carbon dioxide gas which is a physical foaming agent. Carbon dioxide gas is usually supplied by being press-fitted into an extruder in order to foam a thermoplastic resin such as a polypropylene resin, and carbon dioxide in a supercritical state, a subcritical state, or liquefied carbon dioxide is used. You can also. The carbon dioxide gas can form finer bubbles than the conventional foaming agent, and can improve the surface smoothness and flexibility of the obtained foam.

押出機内に圧入される炭酸ガス等の物理発泡剤の使用量は、ポリプロピレン系樹脂発泡体の発泡倍率に応じて適宜、調整されればよいが、使用量が少ないと、ポリプロピレン系樹脂発泡体の発泡倍率が低くなり、軽量性及び断熱性が低下することがある一方、使用量が多いと、金型内において発泡を生じ、破泡を生じたり、或いは、ポリプロピレン系樹脂発泡体中に大きな空隙が生じることがあるので、ポリプロピレン系樹脂100重量部に対して1〜10重量部程度であるのが好ましく、2〜8重量部程度であるのがより好ましく、3〜6重量部程度であるのが特に好ましい。 The amount of the physical foaming agent such as carbon dioxide that is press-fitted into the extruder may be appropriately adjusted according to the expansion ratio of the polypropylene resin foam, but if the amount used is small, the polypropylene resin foam While the foaming ratio may be low and the lightness and heat insulating properties may be lowered, if the amount used is large, foaming may occur in the mold, causing foam breakage, or large voids in the polypropylene-based resin foam. It is preferably about 1 to 10 parts by weight, more preferably about 2 to 8 parts by weight, and about 3 to 6 parts by weight with respect to 100 parts by weight of the polypropylene-based resin. Is particularly preferable.

また、炭酸ガスを発泡剤に用いる場合は、炭酸ガスを発生させる発泡剤として、炭酸水素ナトリウムを使用することもできる。炭酸水素ナトリウムの場合については、樹脂中への分散性を向上させるため、マスターバッチとして、使用することもできる。 When carbon dioxide gas is used as a foaming agent, sodium hydrogen carbonate can also be used as the foaming agent for generating carbon dioxide gas. In the case of sodium hydrogen carbonate, it can also be used as a masterbatch in order to improve the dispersibility in the resin.

マスターバッチは、通常、熱可塑性の基材樹脂に、添加剤等を高濃度で練り込み、ペレット状とすることにより、製造することができる。基材樹脂としては、ポリプロピレン系樹脂に対する相溶性に優れるものであれば、特に限定されず、例えば、ホモポリプロピレン、ブロックポリプロピレン、ランダムポリプロピレン、低密度ポリエチレン、高密度ポリエチレン等のポリオレフィン系樹脂などが好適に使用することができる。 A masterbatch can usually be produced by kneading an additive or the like in a thermoplastic base resin at a high concentration to form a pellet. The base resin is not particularly limited as long as it has excellent compatibility with polypropylene-based resins, and for example, polyolefin-based resins such as homopolypropylene, block polypropylene, random polypropylene, low-density polyethylene, and high-density polyethylene are preferable. Can be used for.

<他の添加剤>
本発明に係るポリプロピレン系樹脂組成物には、使用目的やその用途に応じて、適宜、従来公知のポリオレフィン用改質剤を本発明の効果を損なわない程度の範囲で配合してもよい。特に、本発明に係るアミド化合物の効果を阻害する添加剤については、その効果を損なわない範囲で配合することが好ましい。
<Other additives>
The polypropylene-based resin composition according to the present invention may be appropriately blended with a conventionally known modifier for polyolefin, depending on the purpose of use and its use, to the extent that the effects of the present invention are not impaired. In particular, the additive that inhibits the effect of the amide compound according to the present invention is preferably blended within a range that does not impair the effect.

かかるポリオレフィン用改質剤としては、例えば、ポリオレフィン等衛生協議会編「ポジティブリストの添加剤要覧」(2001年5月)に記載されている各種添加剤が挙げられ、より具体的には、安定剤(金属化合物、エポキシ化合物、窒素化合物、燐化合物、硫黄化合物、フェノール系化合物、UV吸収剤等)、界面活性剤(非イオン性、陰イオン性、両イオン性、陽イオン性等)、滑剤(パラフィン、ワックス等の脂肪族炭化水素、炭素数8〜22程度の高級脂肪酸、炭素数8〜18程度の脂肪族アルコール、ポリグリコール、炭素数4〜22程度の高級脂肪酸と炭素数4〜18程度の脂肪族1価アルコールとのエステル、炭素数8〜22程度の高級脂肪酸アマイド、シリコーン油、ロジン誘導体等)、充填剤(酸化物、水酸化物、炭酸塩、硫酸塩、ケイ酸塩等)、ポリマー添加剤、本発明に係るアミド化合物以外の有機造核剤等の各種添加剤が例示される。 Examples of such modifiers for polyolefins include various additives described in "Positive List Additives Handbook" (May 2001) edited by the Sanitary Council for Polyolefins, etc., and more specifically, they are stable. Agents (metal compounds, epoxy compounds, nitrogen compounds, phosphorus compounds, sulfur compounds, phenolic compounds, UV absorbers, etc.), surfactants (nonionic, anionic, amphoteric, cationic, etc.), lubricants (Alphatic hydrocarbons such as paraffin and wax, higher fatty acids with 8 to 22 carbon atoms, aliphatic alcohols with 8 to 18 carbon atoms, polyglycols, higher fatty acids with 4 to 22 carbon atoms and 4 to 18 carbon atoms. Esther with an aliphatic monovalent alcohol of about 8 to 22, higher fatty acid amide having about 8 to 22 carbon atoms, silicone oil, rosin derivative, etc.), filler (oxide, hydroxide, carbonate, sulfate, silicate, etc.) ), Polymer additives, and various additives such as organic nucleating agents other than the amide compound according to the present invention are exemplified.

前記有機造核剤として、例えば、従来公知のポリプロピレン用の造核剤が例示される。 Examples of the organic nucleating agent include conventionally known nucleating agents for polypropylene.

具体的には、下記一般式(10)
[式中、R26は水素原子、炭素数1〜12程度の直鎖状若しくは分岐鎖状のアルキル基、フェニル基、ベンジル基、シクロヘキシル基又はカルボキシル基を表し、aは0〜12程度の整数を表し、Aは下記の一般式(h)、一般式(i)、一般式(j)、一般式(k)又は一般式(l)で表される基を表す
(式(h)〜(l)中、R27は、水素原子、炭素数1〜12程度の直鎖状若しくは分岐鎖状のアルキル基又はハロゲン原子を表し、bは1〜4程度の整数、cは1〜6程度の整数を表す。尚、b又はcが2以上の整数の場合、2個以上のR20は同一又は異なってもよい)。]
で表される化合物、有機二塩基酸のカルシウム塩、マグネシウム塩、バリウム塩(例えばピメリン酸カルシウム、テレフタル酸カルシウム等)、12−ヒドロキシステアリン酸カリウム、安息香酸マグネシウム、コハク酸マグネシウム、フタル酸マグネシウム等、ベンゼンスルホン酸ナトリウム、ナフタリンスルホン酸ナトリウム等の芳香族スルホン酸化合物、ジカルボン酸ジエステル類又はトリカルボン酸トリエステル類、テトラオキサスピロ化合物類、イミドカルボン酸誘導体、フタロシアニンブルー等のフタロシアニン系、キナクリドン、キナクリドンキノン等のキナクリドン系等の顔料、前記有機二塩基酸と周期律表第IIA族金属の酸化物、水酸化物又は塩とからなる二成分系等が例示される。
Specifically, the following general formula (10)
[In the formula, R 26 represents a hydrogen atom, a linear or branched alkyl group having about 1 to 12 carbon atoms, a phenyl group, a benzyl group, a cyclohexyl group or a carboxyl group, and a is an integer of about 0 to 12. Represents A, and represents a group represented by the following general formula (h), general formula (i), general formula (j), general formula (k) or general formula (l).
(In formulas (h) to (l), R 27 represents a hydrogen atom, a linear or branched alkyl group having about 1 to 12 carbon atoms or a halogen atom, and b is an integer of about 1 to 4. c represents an integer of about 1 to 6. When b or c is an integer of 2 or more, two or more R 20s may be the same or different). ]
Compound represented by, calcium salt of organic dibasic acid, magnesium salt, barium salt (for example, calcium pimelliate, calcium terephthalate, etc.), potassium 12-hydroxystearate, magnesium benzoate, magnesium succinate, magnesium phthalate, etc. , Aromatic sulfonic acid compounds such as sodium benzene sulfonate and sodium naphthaline sulfonate, dicarboxylic acid diesters or tricarboxylic acid triesters, tetraoxaspiro compounds, imidecarboxylic acid derivatives, phthalocyanines such as phthalocyanine blue, quinacridone, quinacridone. Examples thereof include quinacridone-based pigments such as quinone, and two-component systems composed of the organic dibasic acid and oxides, hydroxides, or salts of Group IIA metals of the periodic table.

<ポリプロピレン系樹脂発泡成形体の製造方法>
本発明のポリプロピレン系樹脂発泡成形体の製造方法は、本発明に係るアミド化合物、好ましくはその微細な針状結晶を含有するポリプロピレン系樹脂組成物を用い、該アミド化合物からなる微細な針状結晶が十分に存在する状態で発泡成形することにより、機械的特性に優れた高発泡倍率のポリプロピレン系樹脂発泡成形体を製造することを特徴とする。更に、得られたポリプロピレン系樹脂発泡成形体を当該技術分野で採用されている方法にて二次加工することにより、二次加工成形品を得ることもできる。
<Manufacturing method of polypropylene resin foam molded product>
The method for producing a polypropylene-based resin foam molded article of the present invention uses an amide compound according to the present invention, preferably a polypropylene-based resin composition containing fine needle-like crystals thereof, and fine needle-like crystals composed of the amide compound. It is characterized in that a polypropylene-based resin foam-molded article having an excellent mechanical property and a high foaming ratio is produced by foam-molding in a state in which Further, a secondary processed molded product can also be obtained by secondary processing the obtained polypropylene-based resin foam molded product by a method adopted in the art.

以下、推奨されるポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物及びポリプロピレン系樹脂発泡成形体の製造条件について、製造工程に沿って詳しく説明する。 Hereinafter, the recommended polypropylene-based resin composition for producing a polypropylene-based resin foam-molded article and the production conditions of the polypropylene-based resin foam-molded article will be described in detail along with the production process.

先ず、ポリプロピレン系樹脂組成物の製法方法としては、通常次の手順(工程)が採用される。 First, as a method for producing a polypropylene-based resin composition, the following procedure (step) is usually adopted.

ポリプロピレン系樹脂(粉末又はフレーク)、アミド化合物及び必要に応じて他の添加剤を混合して、ドライブレンド物を得る。混合方法には特に制限はなく、ヘンシェルミキサー、Vブレンダー、スーパーミキサー、タンブラー等の公知の混合機を用いて混合する。混合温度は、通常室温〜100℃程度であり、混合時間は、装置の回転速度等にもよるが、一般に1〜60分間程度である。 A polypropylene resin (powder or flakes), an amide compound and, if necessary, other additives are mixed to obtain a dry blend. The mixing method is not particularly limited, and the mixture is mixed using a known mixer such as a Henschel mixer, a V blender, a super mixer, or a tumbler. The mixing temperature is usually about room temperature to 100 ° C., and the mixing time is generally about 1 to 60 minutes, although it depends on the rotation speed of the device and the like.

また、前記ドライブレンド物の代わりに、例えば、ポリプロピレン系樹脂(粉末又はフレーク)とアミド化合物や必要に応じて他の添加剤を高濃度に配合した高濃度添加剤配合物(例えば、上記添加剤を高濃度にポリプロピレン系樹脂に配合したマスターバッチ等)をポリプロピレン系樹脂(粉末又はフレーク)や必要に応じて他の添加剤を配合した未混練原料を(高濃度添加剤配合物組成物)として用いることもできる。 Further, instead of the dry blend, for example, a high-concentration additive formulation (for example, the above-mentioned additive) in which a polypropylene resin (powder or flake) and an amide compound or, if necessary, another additive is blended in a high concentration. As a polypropylene resin (powder or flakes) and an unkneaded raw material containing other additives as needed (high-concentration additive compounding composition) It can also be used.

続いて、当該技術分野で採用されている一軸あるいは二軸押出機、タンデム型混練押出機等によって、そのドライブレンド物又は前記高濃度添加剤配合物組成物を、ポリプロピレン樹脂が溶融する温度(Tm)以上、好ましくはポリプロピレン系樹脂にアミド化合物が溶解する温度(以下、「T」と記載する)以上の混練温度で混練した後、ダイスより吐出された溶融ポリプロピレン系樹脂組成物を素早く水等の冷媒槽に導き、冷却固化させる。次に、冷却固化したストランド状のポリプロピレン系樹脂組成物をペレタイザー等の破断機で適当な長さにカッティングし、ペレット状のポリプロピレン系樹脂組成物に得る。なお、ここで言う「アミド化合物の溶解温度」とは、ポリプロピレン系樹脂組成物(目的とするポリプロピレン系樹脂成形体の組成と一致している組成物)において存在する当該アミド化合物が完全に溶解する温度を意味する。 Subsequently, the temperature (Tm) at which the polypropylene resin melts the dry blend or the high-concentration additive compound composition by a single-screw or twin-screw extruder, a tandem type kneading extruder, or the like adopted in the technical field. ) Above, preferably, after kneading at a kneading temperature equal to or higher than the temperature at which the amide compound dissolves in the polypropylene resin (hereinafter referred to as “T 2 ”), the molten polypropylene resin composition discharged from the die is quickly mixed with water or the like. It is guided to the refrigerant tank of the above and cooled and solidified. Next, the cooled and solidified strand-shaped polypropylene-based resin composition is cut to an appropriate length with a breaking machine such as a pelletizer to obtain a pellet-shaped polypropylene-based resin composition. The "melting temperature of the amide compound" referred to here means that the amide compound existing in the polypropylene-based resin composition (composition that matches the composition of the target polypropylene-based resin molded product) is completely dissolved. Means temperature.

前記Tの具体的な温度範囲は、樹脂の種類やアミド化合物の種類及び配合量等により異なり、一概には規定できないが、通常、240〜330℃程度、好ましくは250〜320℃程度の温度範囲が推奨される。 The specific temperature range of T 2 varies depending on the type of resin, the type of amide compound, the blending amount, etc., and cannot be unconditionally defined, but is usually about 240 to 330 ° C, preferably about 250 to 320 ° C. Range is recommended.

ここで、ポリプロピレン系樹脂発泡成形体の強度等の観点から、前記ポリプロピレン系樹脂組成物中のアミド化合物が針状結晶であり、更にその針状結晶がより微細であることが推奨される。針状結晶状のアミド化合物を含むポリプロピレン系樹脂組成物を得る方法としては、予め針状結晶状のアミド化合物を添加し、該アミド化合物が溶解しない条件で混練する方法もあるが、前述の推奨例のように、より微細な針状結晶を得るためには、添加したアミド化合物をいったん溶融ポリプロピレン系樹脂中に溶解させ、その後冷却して固化する際に針状結晶としてポリプロピレン系樹脂中に析出させる方法、即ち、ポリプロピレン系樹脂及びアミド化合物を含む組成物を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、及び前記工程で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の結晶を析出させる工程による方法が効果的である。 Here, from the viewpoint of the strength of the polypropylene-based resin foam molded product, it is recommended that the amide compound in the polypropylene-based resin composition is a needle-like crystal, and the needle-like crystal is finer. As a method for obtaining a polypropylene-based resin composition containing an acicular crystalline amide compound, there is also a method in which an acicular crystalline amide compound is added in advance and kneaded under conditions in which the amide compound is not dissolved. As in the example, in order to obtain finer acicular crystals, the added amide compound is once dissolved in the molten polypropylene resin, and then precipitated as acicular crystals in the polypropylene resin when cooled and solidified. That is, the step of heating the composition containing the polypropylene resin and the amide compound to dissolve the amide compound in the molten polypropylene resin, and cooling the polypropylene resin composition in the molten state obtained in the above step. Then, the method by the step of precipitating the crystal of the amide compound is effective.

続いて、ポリプロピレン系樹脂発泡成形体の製法方法としては、通常次の手順(工程)が採用される。 Subsequently, the following procedure (step) is usually adopted as a method for producing the polypropylene-based resin foam molded product.

本発明に係るポリプロピレン系樹脂発泡成形体は、上記ポリプロピレン系樹脂組成物から、当該技術分野で採用されている型内発泡成形法、射出発泡成形法、プレス発泡成形法、押出発泡成形法、スタンパブル発泡成形法などの通常使われている発泡成形法により成形することができる。また、本発明の発泡成形体は、インサート成形、接着などの方法により表皮材を貼合して加飾発泡成形体とすることもできる。 The polypropylene-based resin foam molded product according to the present invention is obtained from the above-mentioned polypropylene-based resin composition by an in-mold foam molding method, an injection foam molding method, a press foam molding method, an extrusion foam molding method, and a stampable. It can be molded by a commonly used foam molding method such as a foam molding method. Further, the foam molded product of the present invention can be made into a decorative foam molded product by laminating skin materials by a method such as insert molding or adhesion.

ここで重要なことは、ポリプロピレン系樹脂成形体を発泡成形する時点においてアミド化合物の微細な針状結晶がポリプロピレン系樹脂組成物やポリプロピレン系樹脂成形物中に存在することであり、特にその結晶が均一に存在していることである。 What is important here is that fine acicular crystals of the amide compound are present in the polypropylene-based resin composition and the polypropylene-based resin molded product at the time of foam-molding the polypropylene-based resin molded product, and in particular, the crystals are present. It is to exist uniformly.

たとえば、上記発泡成形する時点でアミド化合物の微細な針状結晶を均一に存在させる方法としては、次のような方法が挙げられる。 For example, as a method for uniformly presenting fine acicular crystals of the amide compound at the time of foam molding, the following method can be mentioned.

第一の方法は、アミド化合物の微細な針状結晶を含む上記発泡成形用ポリプロピレン系樹脂組成物に発泡剤を混合した後、該アミド化合物がポリプロピレン樹脂中で溶解しない温度範囲で加熱混合後、発泡成形する方法が挙げられる。 The first method is to mix a foaming agent with the polypropylene resin composition for foam molding containing fine needle-like crystals of the amide compound, and then heat and mix in a temperature range in which the amide compound does not dissolve in the polypropylene resin. A method of foam molding can be mentioned.

ここで、上記アミド化合物がポリプロピレン系樹脂に溶解しない温度範囲としては、好ましくは(T+10℃)〜(T−10℃)、より好ましくは(T+15℃)〜(T−15℃)、特に(T+20℃)〜(T−15℃)の温度範囲が推奨される。 Here, the temperature range in which the amide compound does not dissolve in the polypropylene resin, preferably (T 1 + 10 ℃) ~ (T 2 -10 ℃), more preferably (T 1 + 15 ℃) ~ (T 2 -15 ° C.), in particular a temperature range of (T 1 + 20 ℃) ~ (T 2 -15 ℃) is recommended.

ここで、Tは、使用するポリプロピレン系樹脂の融点であり、Tは上述の通りである。なお、当該温度範囲の関係には、(T+10℃)<(T−10℃)、(T+15℃)<(T−15℃)、或いは(T+20℃)<(T−15℃)が成立する。 Here, T 1 is the melting point of the polypropylene-based resin used, and T 2 is as described above. Incidentally, the relationship of the temperature range, (T 1 + 10 ℃) <(T 2 -10 ℃), (T 1 + 15 ℃) <(T 2 -15 ℃), or (T 1 + 20 ℃) < (T 2 -15 ℃) is established.

より具体的には、上記温度範囲は、アミド化合物の種類及び配合量にもよるが、190〜260℃程度、好ましくは200〜240℃程度、更に好ましくは200〜230℃程度の範囲である。温度を190℃以上に設定することによって、未溶融樹脂の発生が抑制され、260℃以下に設定することによって、ポリプロピレン系樹脂発泡成形体の強度等の物性を優位に向上させる傾向が認められる。 More specifically, the temperature range is about 190 to 260 ° C., preferably about 200 to 240 ° C., and more preferably about 200 to 230 ° C., although it depends on the type and amount of the amide compound. By setting the temperature to 190 ° C. or higher, the generation of unmelted resin is suppressed, and by setting the temperature to 260 ° C. or lower, there is a tendency to significantly improve the physical properties such as the strength of the polypropylene-based resin foam molded product.

第二の方法は、アミド化合物の結晶を含む上記発泡成形用ポリプロピレン系樹脂組成物を再度アミド化合物が溶融ポリプロピレン系樹脂中に溶解する温度まで加熱し、その後発泡温度まで冷却固化し、そこで発泡剤を混入して発泡させるか、または、完全に冷却固化して成形物とし、続いてその成形物を再度発泡温度まで加熱した後に発泡剤を混入して発泡させる方法が挙げられる。 In the second method, the polypropylene-based resin composition for foam molding containing crystals of the amide compound is heated again to a temperature at which the amide compound dissolves in the molten polypropylene-based resin, and then cooled and solidified to the foaming temperature, where the foaming agent is used. Is mixed and foamed, or the molded product is completely cooled and solidified to form a molded product, and then the molded product is heated to the foaming temperature again and then a foaming agent is mixed and foamed.

上記発泡温度は、樹脂、発泡剤の種類、更に発泡倍率等により異なるが、通常、好ましくは120〜240℃、より好ましくは150〜240℃、更に好ましくは150〜220℃、特に好ましくは150〜180℃の温度範囲が推奨される。 The foaming temperature varies depending on the resin, the type of foaming agent, the foaming ratio, etc., but is usually preferably 120 to 240 ° C, more preferably 150 to 240 ° C, still more preferably 150 to 220 ° C, and particularly preferably 150 to. A temperature range of 180 ° C is recommended.

前記成形物中のβ晶含量は、本発明の効果を奏する限り、特に限定されるものではないが、発泡成形性の観点より、20〜90%程度とすることが好ましく、50〜90%程度とすることがより好ましく、特に60〜85%程度とすることが最も好ましい。 The β crystal content in the molded product is not particularly limited as long as the effect of the present invention is exhibited, but is preferably about 20 to 90%, preferably about 50 to 90%, from the viewpoint of foam moldability. More preferably, and particularly preferably about 60 to 85%.

尚、β晶含量は、ポリプロピレン系樹脂成形体を適当な大きさに切り取ったサンプルを、窒素雰囲気下、昇温速度20℃/minでDSC装置(パーキンエルマー社製「ダイヤモンドDSC」)により示差走査熱量分析を行い、このとき得られるDSCサーモグラムのα晶とβ晶の融解熱量から以下の式に従い求めた値である。
β晶含量(%)=100×Hβ/(Hα+Hβ
[式中、Hβはβ晶の融解熱量を示し、Hαはα晶の融解熱量を示す。]。
For the β crystal content, a sample obtained by cutting a polypropylene-based resin molded product into an appropriate size is differentially scanned by a DSC device (“Diamond DSC” manufactured by PerkinElmer) in a nitrogen atmosphere at a heating rate of 20 ° C./min. It is a value obtained from the calorific value of the α crystal and β crystal of the DSC thermogram obtained at this time according to the following formula.
β crystal content (%) = 100 × H β / (H α + H β )
[In the formula, H β indicates the amount of heat of fusion of β crystal, and H α indicates the amount of heat of fusion of α crystal. ].

本発明に係るポリプロピレン系樹脂発泡成形体の発泡倍率は、特に制約はないが、通常1.2〜100倍程度、好ましくは1.5〜60倍程度、より好ましくは2.0〜40倍程度の範囲であることが推奨される。 The foaming ratio of the polypropylene-based resin foam molded product according to the present invention is not particularly limited, but is usually about 1.2 to 100 times, preferably about 1.5 to 60 times, and more preferably about 2.0 to 40 times. It is recommended to be in the range of.

本発明に係るポリプロピレン系樹脂発泡成形体は、更に真空成形、圧空成形等の通常の熱成形方法などの方法を用いて二次加工して、所望の形状の二次加工成形品とすることもできる。 The polypropylene-based resin foam molded product according to the present invention may be further subjected to secondary processing using a method such as a normal thermoforming method such as vacuum forming or compressed air forming to obtain a secondary processed molded product having a desired shape. it can.

かくして得られた本発明に係るポリプロピレン系樹脂発泡成形体は、軽量でかつ強度等の物性に優れており、従来公知のポリプロピレン系樹脂成形体が使用されてきた分野と同様の分野において利用することができる。特に、自動車部品、機械光学部品、化学工業部品、家電部品等の成形品として使用することができる。更に、得られた発泡成形体は断熱性にも優れており、自動車部品、電機部品や建材等の分野で利用することができる。 The polypropylene-based resin foam molded product according to the present invention thus obtained is lightweight and has excellent physical properties such as strength, and can be used in the same fields as those in which conventionally known polypropylene-based resin molded products have been used. Can be done. In particular, it can be used as a molded product such as an automobile part, a mechanical optical part, a chemical industry part, and a home electric appliance part. Further, the obtained foam molded product has excellent heat insulating properties, and can be used in the fields of automobile parts, electric parts, building materials and the like.

また、二次加工後の二次加工成形品も、同様に、従来のポリプロピレン系樹脂成形体が使用されてきたと同様の分野において利用できる。 Further, the secondary processed molded product after the secondary processing can also be used in the same field as the conventional polypropylene-based resin molded product has been used.

以下に実施例及び比較例を示し、本発明を詳しく説明するが、本発明はこれらの実施例によって制約されるものではない。尚、実施例や比較例中のポリプロピレン系樹脂組成物中のアミド化合物の針状結晶形成の有無およびポリプロピレン系樹脂組成物のβ晶含有量、発泡倍率、ポリプロピレン系樹脂発泡成形体の曲げ強度、比強度は、以下の方法により求めた。 Examples and comparative examples are shown below, and the present invention will be described in detail, but the present invention is not limited by these examples. The presence or absence of acicular crystals of the amide compound in the polypropylene resin composition in Examples and Comparative Examples, the β crystal content of the polypropylene resin composition, the expansion ratio, the bending strength of the polypropylene resin foam molded product, and the like. The specific strength was determined by the following method.

<ポリプロピレン系樹脂組成物及び発泡成形前の成形物の評価>
(1)アミド化合物の針状結晶形成の有無
ポリプロピレン系樹脂組成物又は成形物中のアミド化合物の針状結晶形成の有無については、ホットステージ付属の光学顕微鏡を用いて、ポリプロピレン系樹脂組成物またはポリプロピレン系樹脂成形物を180℃に昇温しそのまま温度で保持した状態で、顕微鏡観察を行うことにより、針状結晶形成の有無を目視にて確認した。
<Evaluation of polypropylene resin composition and molded product before foam molding>
(1) Presence or absence of needle-like crystal formation of the amide compound The presence or absence of needle-like crystal formation of the amide compound in the polypropylene-based resin composition or molded product is determined by using an optical microscope attached to a hot stage. The presence or absence of acicular crystal formation was visually confirmed by observing with a microscope while the polypropylene-based resin molded product was heated to 180 ° C. and kept at the same temperature.

(2)β晶含有量の測定
β晶含有量は、樹脂組成物または成形物を適当な大きさに切り取ったサンプルを、窒素雰囲気下、昇温速度20℃/minで示差走査熱量計(パーキンエルマー社製「ダイヤモンドDSC」)により示差走査熱量分析(DSC分析)を行い、このとき得られるDSCサーモグラムのα晶とβ晶の融解熱量から以下の式に従って求めた。
β晶含量(%)=100×Hβ/(Hα+Hβ
[式中、Hβはβ晶の融解熱量を示し、Hαはα晶の融解熱量を表す。]。
(2) Measurement of β-crystal content The β-crystal content is a differential scanning calorimeter (Perkin) obtained by cutting a resin composition or a molded product into an appropriate size in a nitrogen atmosphere at a heating rate of 20 ° C./min. Differential scanning calorimetry (DSC analysis) was performed by "Diamond DSC" manufactured by Elmer Co., Ltd., and the calorimetry of α and β crystals of the DSC thermogram obtained at this time was calculated according to the following formula.
β crystal content (%) = 100 × H β / (H α + H β )
[In the formula, H β represents the amount of heat of fusion of β crystals, and H α represents the amount of heat of fusion of α crystals. ].

(3)発泡特性(発泡倍率)
発泡特性の評価は、サンプルとして発泡成形前の樹脂組成物又は成形物を用いて、以下の方法により発泡倍率を測定した。
上記サンプルを分割形式の金型のキャビティ内に収容した状態で型締めした後、155℃に加熱し、圧力20MPaの超臨界状態の二酸化炭素を注入し、20分間の含浸を行った。20分間含浸した後、10MPa/秒の減圧速度で圧力を開放することにより、発泡体を得た後、得られた発泡体の質量及び浮力を天びん法にて測定し,発泡後の密度と発泡前の密度との比から、発泡倍率を求めた。発泡倍率が高い程、発泡性が良く、発泡特性に優れると言える。
(3) Foaming characteristics (foaming magnification)
For the evaluation of the foaming characteristics, the foaming ratio was measured by the following method using a resin composition or a molded product before foam molding as a sample.
The sample was molded while being housed in the cavity of a split mold, heated to 155 ° C., infused with carbon dioxide in a supercritical state at a pressure of 20 MPa, and impregnated for 20 minutes. After impregnating for 20 minutes, the pressure is released at a depressurizing rate of 10 MPa / sec to obtain a foam, and then the mass and buoyancy of the obtained foam are measured by the balance method, and the density and foaming after foaming are measured. The foaming ratio was determined from the ratio with the previous density. It can be said that the higher the foaming ratio, the better the foamability and the better the foaming characteristics.

<発泡成形体の評価> <Evaluation of foam molded product>

(4)曲げ強度および比強度
万能材料試験機(インストロン社製)を用いて、JIS K 7203(1982)に準じて曲げ強度(MPa)を測定した。
なお、試験温度は25℃、試験速度は10mm/分とした。
さらに、得られた曲げ強度より、下式を用いて、密度あたりの強度である比強度を求めた。
比強度(kN・m/kg)=曲げ強度(MPa)/密度(g/cm
なお、密度は、ポリプロピレンの密度を0.9g/cmとして、その密度を発泡倍率で割った値を用いた。
曲げ強度および比強度の値が大きいほど機械的強度に優れていると言える。
(4) Bending strength and specific strength The bending strength (MPa) was measured according to JIS K 7203 (1982) using a universal material testing machine (manufactured by Instron).
The test temperature was 25 ° C. and the test speed was 10 mm / min.
Furthermore, from the obtained bending strength, the specific strength, which is the strength per density, was determined using the following formula.
Specific strength (kN ・ m / kg) = bending strength (MPa) / density (g / cm 3 )
As the density, the density of polypropylene was 0.9 g / cm 3 , and the density was divided by the expansion ratio.
It can be said that the larger the values of bending strength and specific strength, the better the mechanical strength.

[実施例1]
ポリプロピレン系樹脂としてポリプロピレンホモポリマー(MFR=10g/10分(荷重2160g、温度230℃),融点;168℃)100重量部、アミド化合物として2,6−ナフタレンジカルボン酸ジシクロヘキシルアミド(アミド化合物1、新日本理化(株)社製「エヌジェスターNU−100」)0.2重量部、及びその他添加剤としてステアリン酸カルシウム(日東化成工業(株)社製、商品名「Ca−St」)0.05重量部、テトラキス[メチレン−3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]メタン(BASFジャパン(株)製、商品名「IRGANOX1010」)0.05重量部、テトラキス(2,4−ジ−tert−ブチルフェニル)ホスファイト(BASFジャパン(株)製、商品名「IRGAFOS168」)0.05重量部をドライブレンドした。そのドライブレンド物を二軸押出機((株)テクノベル社製 L/D=45、スクリュー径15mmにて混練温度(樹脂温度)を用いて加熱温度280℃にて溶融混合して、前記アミド化合物を溶解させ、押し出されたストランドを冷却し、ペレタイザーでカッティングして、ポリプロピレン系樹脂組成物を調製した(工程(i)〜工程(ii))。なお、押し出されたストランドが透明であることを目視でも確認した。
[Example 1]
100 parts by weight of polypropylene homopolymer (MFR = 10 g / 10 min (load 2160 g, temperature 230 ° C.), melting point; 168 ° C.) as polypropylene resin, 2,6-naphthalenedicarboxylic acid dicyclohexylamide (amide compound 1, new) as amide compound 0.2 parts by weight of "Ngester NU-100" manufactured by Nippon Rika Co., Ltd., and 0.05 weight of calcium stearate (manufactured by Nitto Kasei Kogyo Co., Ltd., trade name "Ca-St") as other additives. Part, tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane (manufactured by BASF Japan Co., Ltd., trade name "IRGANOX1010") 0.05 parts by weight, tetrakis (2) , 4-Di-tert-butylphenyl) Phosphite (manufactured by BASF Japan, Inc., trade name "IRGAFOS168") was dry-blended in an amount of 0.05 parts by weight. The dry blend is melt-mixed at a heating temperature of 280 ° C. using a kneading temperature (resin temperature) at a twin-screw extruder (L / D = 45, manufactured by Technobel Co., Ltd.) with a screw diameter of 15 mm to obtain the amide compound. Was melted, the extruded strand was cooled, and the extruded strand was cut with a pelletizer to prepare a polypropylene resin composition (steps (i) to (ii)). The extruded strand was transparent. It was also confirmed visually.

続いて、得られたポリプロピレン系樹脂組成物を射出温度(加熱温度)280℃、金型温度(冷却温度)40℃の条件下で成形して、ポリプロピレン系樹脂成形物を得た(工程(iii))。得られたポリプロピレン系樹脂成形物を用いて、上記(3)の方法により発泡特性(発泡倍率)を求めて、その結果を表1に示した。また、上記(1)の方法によりアミド化合物の針状結晶の生成状態を、(2)の方法によりβ晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。 Subsequently, the obtained polypropylene-based resin composition was molded under the conditions of an injection temperature (heating temperature) of 280 ° C. and a mold temperature (cooling temperature) of 40 ° C. to obtain a polypropylene-based resin molded product (step (iii). )). Using the obtained polypropylene-based resin molded product, the foaming characteristics (foaming ratio) were determined by the method (3) above, and the results are shown in Table 1. Further, as a result of confirming the formation state of acicular crystals of the amide compound by the method (1) above and the β crystal content by the method (2), the formation of fine acicular crystals of the amide compound was confirmed. The β crystal content of% or more was confirmed.

次に、得られた成形物を幅10mm、高さ4mm、長さ65mmの金型内に設置した後、分割形式の金型のキャビティ内に収容した状態で型締めした後、155℃に加熱し、圧力20MPaの超臨界状態の二酸化炭素を注入し、20分間二酸化炭素の含浸を行った。その後、圧力を開放することにより、発泡倍率2.3倍の発泡成形体を得た(工程(iv))。得られた発泡成形体を用いて、曲げ強度、比強度を測定し、それの結果をまとめて表1に示した。 Next, the obtained molded product was placed in a mold having a width of 10 mm, a height of 4 mm, and a length of 65 mm, and then molded while being housed in the cavity of the split mold, and then heated to 155 ° C. Then, carbon dioxide in a supercritical state at a pressure of 20 MPa was injected, and carbon dioxide was impregnated for 20 minutes. Then, by releasing the pressure, a foam molded product having a foaming ratio of 2.3 times was obtained (step (iv)). Bending strength and specific strength were measured using the obtained foamed molded product, and the results are summarized in Table 1.

[実施例2]
アミド化合物1の配合量0.2重量部を0.1重量部に、溶融混合時の加熱温度280℃を270℃に、成形物製造時の加熱温度280℃を270℃に変えた以外は、実施例1と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 2]
Except that the blending amount of amide compound 1 was changed from 0.2 parts by weight to 0.1 parts by weight, the heating temperature during melt mixing was changed from 280 ° C to 270 ° C, and the heating temperature during molding production was changed from 280 ° C to 270 ° C. The same procedure as in Example 1 was carried out to obtain a polypropylene-based resin molded product and a polypropylene-based resin foam molded product. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the formation of fine needle-like crystals of the amide compound was confirmed, and 80% or more. The β crystal content was confirmed.

[実施例3]
アミド化合物1の配合量0.2重量部を0.05重量部に、溶融混合時の加熱温度280℃を260℃に、成形物製造時の加熱温度280℃を260℃に変えた以外は、実施例1と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示したまた、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 3]
Except for changing the blending amount of amide compound 1 to 0.05 parts by weight, the heating temperature of 280 ° C. during melt mixing to 260 ° C., and the heating temperature of 280 ° C. during molding production to 260 ° C. The same procedure as in Example 1 was carried out to obtain a polypropylene-based resin molded product and a polypropylene-based resin foam molded product. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The obtained results are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, fine needles of the amide compound were confirmed. The formation of compound crystals was confirmed, and the β crystal content of 80% or more was confirmed.

[実施例4]
成形物製造時の冷却温度40℃を80℃に変えた以外は、実施例3と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 4]
A polypropylene-based resin molded product and a polypropylene-based resin foam molded product were obtained in the same manner as in Example 3 except that the cooling temperature of 40 ° C. during the production of the molded product was changed to 80 ° C. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the formation of fine needle-like crystals of the amide compound was confirmed, and 80% or more. The β crystal content was confirmed.

[実施例5]
アミド化合物としてアミド化合物1に変えて3,9‐ビス[4‐(N‐シクロヘキシルカルバモイル)フェニル]‐2,4,8,10‐テトラオキサスピロ[5.5]ウンデカン(アミド化合物2)を用いた以外は、実施例2と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 5]
As the amide compound, 3,9-bis [4- (N-cyclohexylcarbamoyl) phenyl] -2,4,8,10-tetraoxaspiro [5.5] undecane (amide compound 2) was used instead of amide compound 1. A polypropylene-based resin molded product and a polypropylene-based resin foam molded product were obtained in the same manner as in Example 2 except for the above. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the formation of fine needle-like crystals of the amide compound was confirmed, and 80% or more. The β crystal content was confirmed.

[実施例6]
アミド化合物としてアミド化合物1に変えて1,3,5−ベンゼントリカルボン酸トリス(2,3−ジメチルシクロヘキシルアミド(アミド化合物3)を用いた以外は、実施例2と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 6]
The same procedure as in Example 2 was carried out except that tris 1,3,5-benzenetricarboxylic acid (2,3-dimethylcyclohexylamide (amide compound 3)) was used instead of the amide compound 1 as the amide compound. A resin molded product and a polypropylene-based resin foam molded product were obtained. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The obtained results are summarized in Table 1. Further, as a result of confirming the formation state of acicular crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the amide compound was fine. The formation of acicular crystals was confirmed, and the β crystal content of 80% or more was confirmed.

[実施例7]
アミド化合物としてアミド化合物1に変えて1,3,5−ベンゼントリカルボン酸トリスシクロオクチルアミド(アミド化合物4)を用いた以外は、実施例2と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 7]
The polypropylene-based resin molded product and polypropylene were carried out in the same manner as in Example 2 except that 1,3,5-benzenetricarboxylic acid triscyclooctylamide (amide compound 4) was used instead of the amide compound 1 as the amide compound. A based resin foam molded product was obtained. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the formation of fine needle-like crystals of the amide compound was confirmed, and 80% or more. The β crystal content was confirmed.

[実施例8]
アミド化合物としてアミド化合物1に変えて1,4−ベンゼンジカルボン酸ジシクロヘキシルアミド(アミド化合物5)を用いた以外は、実施例2と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態、β晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 8]
The polypropylene-based resin molded product and the polypropylene-based resin foam molding were carried out in the same manner as in Example 2 except that 1,4-benzenedicarboxylic acid dicyclohexylamide (amide compound 5) was used instead of the amide compound 1 as the amide compound. I got a body. The β crystal content, foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based resin molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of needle-like crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the formation of fine needle-like crystals of the amide compound was confirmed, and 80% or more. The β crystal content was confirmed.

[実施例9]
工程(i)における溶融混合時の加熱温度280℃を200℃に、成形物製造時の加熱温度280℃を200℃に変えた以外は、実施例1と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系成形物及びポリプロピレン系樹脂発泡成形体を用いて、β晶含有量、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。また、実施例1と同様にして成形物中のアミド化合物の針状結晶の生成状態及びβ晶含有量を確認した結果、β晶含有量は80%以上であったが、アミド化合物の針状結晶の生成状態に関して、微細な針状結晶も生成しているが、それ以上に塊状のアミド化合物が多数存在している状態であることが確認された。
[Example 9]
Polypropylene resin molding was carried out in the same manner as in Example 1 except that the heating temperature of 280 ° C. during melt mixing in step (i) was changed to 200 ° C. and the heating temperature of 280 ° C. during molding product production was changed to 200 ° C. A product and a polypropylene-based resin foam molded product were obtained. The β crystal content, expansion ratio, bending strength, and specific strength were measured using the obtained polypropylene-based molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1. Further, as a result of confirming the formation state of acicular crystals of the amide compound and the β crystal content in the molded product in the same manner as in Example 1, the β crystal content was 80% or more, but the acicular compound was acicular. Regarding the state of crystal formation, it was confirmed that fine needle-like crystals were also formed, but more massive amide compounds were present.

[比較例1]
アミド化合物を添加しない以外は、実施例3と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。但し、得られた発泡成形体は発泡性が悪く、所定の発泡倍率には達せず、1.1倍であった。得られたポリプロピレン系成形物及びポリプロピレン系樹脂発泡成形体を用いて、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。
[Comparative Example 1]
A polypropylene-based resin molded product and a polypropylene-based resin foam molded product were obtained in the same manner as in Example 3 except that the amide compound was not added. However, the obtained foamed molded product had poor foamability and did not reach a predetermined foaming ratio, which was 1.1 times. The foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1.

[比較例2]
アミド化合物を添加しない以外は、実施例4と同様に実施して、ポリプロピレン系樹脂成形物及びポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系成形物及びポリプロピレン系樹脂発泡成形体を用いて、発泡倍率、曲げ強度、比強度を測定した。得られた結果をまとめて表1に示した。
[Comparative Example 2]
A polypropylene-based resin molded product and a polypropylene-based resin foam molded product were obtained in the same manner as in Example 4 except that the amide compound was not added. The foaming ratio, bending strength, and specific strength were measured using the obtained polypropylene-based molded product and polypropylene-based resin foam molded product. The results obtained are summarized in Table 1.

[参考値]
実施例1で得られたポリプロピレン系樹脂成形物を用いて、発泡体作製工程(工程iii))を実施せず、上記発泡成形体と同様にして、曲げ強度、比強度を測定した。得られた結果を表1に示した。
[Reference value]
Using the polypropylene-based resin molded product obtained in Example 1, the bending strength and the specific strength were measured in the same manner as in the foam molded product without carrying out the foam manufacturing step (step iii)). The results obtained are shown in Table 1.

[実施例10]
ポリプロピレン系樹脂としてポリプロピレンホモポリマー(MFR=10g/10分(荷重2160g、温度230℃),融点;168℃)100重量部、アミド化合物として2,6−ナフタレンジカルボン酸ジシクロヘキシルアミド(アミド化合物1)0.2重量部、及びその他添加剤としてステアリン酸カルシウム(日東化成工業(株)社製、商品名「Ca−St」)0.05重量部、テトラキス[メチレン−3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]メタン(チバスペシャルティーケミカルズ社製、商品名「IRGANOX1010」)0.05重量部、テトラキス(2,4−ジ−tert−ブチルフェニル)ホスファイト(チバスペシャルティーケミカルズ社製、商品名「IRGAFOS168」)0.05重量部をドライブレンドした。そのドライブレンド物を二軸押出機((株)テクノベル社製 L/D=45、スクリュー径15mmを用いて加熱温度280℃で溶融混合して、前記アミド化合物を溶解させ、押し出されたストランドを冷却し、ペレタイザーでカッティングして、ポリプロピレン系樹脂組成物を調製した。その後、得られたポリプロピレン系樹脂組成物と炭酸水素ナトリウム系発泡剤マスターバッチ(永和化成工業社製ポリスレンEE205A)4部をドライブレンドし、Tダイ押出機を用いて200℃の樹脂温度で溶融混合してシート状に押出し、表面温度120℃のチルロールで冷却固化し、厚さ200μmのポリプロピレン発泡成形体を得た。得られたポリプロピレン系樹脂発泡成形体を用いて、曲げ強度を測定した。得られた結果を表2に示した。また、上記(1)の方法により、ポリプロピレン系樹脂組成物中のアミド化合物の針状結晶の生成状態を、(2)の方法によりβ晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 10]
100 parts by weight of polypropylene homopolymer (MFR = 10 g / 10 minutes (load 2160 g, temperature 230 ° C.), melting point; 168 ° C.) as polypropylene resin, 2,6-naphthalenedicarboxylic acid dicyclohexylamide (amide compound 1) 0 as amide compound .2 parts by weight, and 0.05 parts by weight of calcium stearate (manufactured by Nitto Kasei Kogyo Co., Ltd., trade name "Ca-St") as other additives, tetrakis [methylene-3- (3,5-di-tert) -Butyl-4-hydroxyphenyl) propionate] methane (manufactured by Ciba Specialty Chemicals, trade name "IRGANOX1010") 0.05 parts by weight, tetrakis (2,4-di-tert-butylphenyl) phosphite (Ciba Specialty) 0.05 parts by weight of Chemicals (trade name "IRGAFOS168")) was dry-blended. The dry blend was melt-mixed at a heating temperature of 280 ° C. using a twin-screw extruder (L / D = 45, manufactured by Technobel Co., Ltd.) and a screw diameter of 15 mm to dissolve the amide compound, and the extruded strand was produced. The polypropylene-based resin composition was prepared by cooling and cutting with a pelletizer. Then, 4 parts of the obtained polypropylene-based resin composition and sodium hydrogen carbonate-based foaming agent master batch (Polyslen EE205A manufactured by Eiwa Kasei Kogyo Co., Ltd.) were dried. The mixture was blended, melt-mixed at a resin temperature of 200 ° C. using a T-die extruder, extruded into a sheet, and cooled and solidified with a chill roll having a surface temperature of 120 ° C. to obtain a polypropylene foam molded product having a thickness of 200 μm. The bending strength was measured using the polypropylene-based resin foam molded product. The obtained results are shown in Table 2. Further, the needle-like shape of the amide compound in the polypropylene-based resin composition by the method (1) above. As a result of confirming the β crystal content in the crystal formation state by the method (2), the formation of fine needle-like crystals of the amide compound was confirmed, and the β crystal content of 80% or more was confirmed.

[実施例11]
アミド化合物の配合量0.2重量部を0.05重量部に、溶融混合時の加熱温度280℃を260℃に変えた以外は、実施例9と同様に実施して、ポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂発泡成形体を用いて、曲げ強度を測定した。得られた結果を表2に示した。また、上記(1)の方法により、ポリプロピレン系樹脂組成物中のアミド化合物の針状結晶の生成状態を、(2)の方法によりβ晶含有量を確認した結果、アミド化合物の微細な針状結晶の生成が確認され、80%以上のβ晶含有量が確認された。
[Example 11]
Polypropylene resin foam molding was carried out in the same manner as in Example 9 except that 0.2 parts by weight of the amide compound was changed to 0.05 parts by weight and the heating temperature of 280 ° C. during melt mixing was changed to 260 ° C. I got a body. The bending strength was measured using the obtained polypropylene-based resin foam molded product. The results obtained are shown in Table 2. Further, as a result of confirming the formation state of needle-like crystals of the amide compound in the polypropylene-based resin composition by the method (1) above and the β crystal content by the method (2), the fine needle-like shape of the amide compound was confirmed. The formation of crystals was confirmed, and the β crystal content of 80% or more was confirmed.

[比較例3]
アミド化合物を添加しない以外は、実施例11と同様に実施して、ポリプロピレン系樹脂発泡成形体を得た。得られたポリプロピレン系樹脂発泡成形体を用いて、曲げ強度を測定した。得られた結果を表2に示した。
[Comparative Example 3]
A polypropylene-based resin foam molded product was obtained in the same manner as in Example 11 except that the amide compound was not added. The bending strength was measured using the obtained polypropylene-based resin foam molded product. The results obtained are shown in Table 2.

上記表1及び表2の結果より、以下のことがわかる。(a)実施例と比較例の結果を比べると、本発明のアミド化合物を配合することにより発泡特性が著しく向上し、更に機械的特性が大きく改善されていることがわかる。この結果は、本発明のアミド化合物の核剤効果等に起因するものと推測される。(b)更に、実施例1〜8の結果より、含有するアミド化合物を微細な針状結晶にすることにより、得られた発泡成形体の機械的強度をより一層向上することが可能であることがわかる。この結果は、発泡成形過程において、本発明のアミド化合物の微細な針状結晶がポリプロピレン系樹脂の配向をコントロールしているものと推測される。以上の結果より、本発明の適用により従来達成できなかった高発泡で高強度のポリプロピレン系樹脂発泡成形体が容易に得られることが確認された。 From the results in Tables 1 and 2 above, the following can be seen. Comparing the results of (a) Example and Comparative Example, it can be seen that the foaming characteristics are remarkably improved and the mechanical properties are greatly improved by blending the amide compound of the present invention. It is presumed that this result is due to the nuclear agent effect of the amide compound of the present invention. (B) Furthermore, from the results of Examples 1 to 8, it is possible to further improve the mechanical strength of the obtained foamed molded product by forming the contained amide compound into fine needle-like crystals. I understand. From this result, it is presumed that the fine needle-like crystals of the amide compound of the present invention control the orientation of the polypropylene-based resin in the foam molding process. From the above results, it was confirmed that a polypropylene-based resin foam molded product having high foaming and high strength, which could not be achieved conventionally, can be easily obtained by applying the present invention.

本発明により、ポリプロピレン系樹脂発泡成形体の製造において、ポリプロピレン系樹脂発泡成形体本来の優れた特性を保持しつつ、高発泡化が可能となり、更に得られたポリプロピレン系樹脂発泡成形体の強度の改善が可能となり、これまで以上に様々な用途へのポリプロピレン系樹脂発泡成形体の応用が可能となった。また、機械的特性を損なうことなく、高発泡化することにより、軽量化、省資源化、省エネルギー化が期待され、自動車や電気分野での用途拡大が期待される。更に、断熱材用途においても、高発泡化により一層断熱効果が高まり、省エネルギー化への寄与も期待される。 INDUSTRIAL APPLICABILITY According to the present invention, in the production of a polypropylene-based resin foam molded product, high foaming is possible while maintaining the original excellent characteristics of the polypropylene-based resin foam molded product, and the strength of the obtained polypropylene-based resin foam molded product is further increased. Improvements have become possible, and polypropylene-based resin foam molded products can be applied to various applications more than ever before. In addition, high foaming without impairing mechanical properties is expected to reduce weight, resources, and energy, and is expected to expand applications in the fields of automobiles and electricity. Furthermore, even in the use of heat insulating materials, high foaming further enhances the heat insulating effect and is expected to contribute to energy saving.

Claims (15)

下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物の針状結晶を含有することを特徴とするポリプロピレン系樹脂発泡成形体。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族基、炭素数5〜30の脂環族基又は炭素数6〜30の芳香族基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
A polypropylene-based resin containing needle-like crystals of at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2). Foam molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, fatty radicals of saturated or unsaturated 5 to 30 carbon atoms, alicyclic groups or aromatic having 6 to 30 carbon atoms having 5 to 30 carbon atoms Represents a group . ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]
前記アミド化合物が、下記一般式(3)で示される少なくとも1種のアミド化合物である請求項1に記載のポリプロピレン系樹脂発泡成形体。
[式(3)中、Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数3〜18の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRは、同一又は異なって、それぞれ炭素数5〜18のシクロアルキル基を表す。]
The polypropylene-based resin foam molded product according to claim 1, wherein the amide compound is at least one amide compound represented by the following general formula (3).
[In formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 2 to 18 carbon atoms, a saturated or unsaturated alicyclic dicarboxylic acid residue having 3 to 18 carbon atoms, or a carbon. Representing aromatic dicarboxylic acid residues of numbers 6-18, R 8 and R 9 represent the same or different cycloalkyl groups having 5 to 18 carbon atoms, respectively. ]
(i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物とを240〜330℃の温度範囲まで加熱して溶融混合し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、
(ii)工程(i)で得られた溶融ポリプロピレン系樹脂組成物を80℃以下の温度まで冷却し、固化したポリプロピレン系樹脂組成物中にアミド化合物の針状結晶を析出させる工程、
(iii)工程(ii)で得られたポリプロピレン系樹脂組成物に発泡剤を混合した後、190〜260℃の温度範囲で加熱混合し、その後に発泡させる発泡成形工程
を具備することを特徴とするポリプロピレン系樹脂発泡成形体の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族基、炭素数5〜30の脂環族基又は炭素数6〜30の芳香族基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
(I) A polypropylene resin and at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2) at a temperature of 240 to 330 ° C. A step of heating to a range, melting and mixing, and dissolving the amide compound in the melted polypropylene resin,
(Ii) A step of cooling the molten polypropylene-based resin composition obtained in step (i) to a temperature of 80 ° C. or lower and precipitating acicular crystals of an amide compound in the solidified polypropylene-based resin composition.
(Iii) The polypropylene-based resin composition obtained in step (ii) is characterized by comprising a foam molding step of mixing a foaming agent, heating and mixing in a temperature range of 190 to 260 ° C., and then foaming. A method for producing a polypropylene-based resin foam molded article.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, fatty radicals of saturated or unsaturated 5 to 30 carbon atoms, alicyclic groups or aromatic having 6 to 30 carbon atoms having 5 to 30 carbon atoms Represents a group . ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]
(i)ポリプロピレン系樹脂と下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物とを溶融混合後、冷却固化して、アミド化合物を含有するポリプロピレン系樹脂組成物を製造する工程
(ii)工程(i)で得られたポリプロピレン系樹脂組成物を、240〜330℃の温度範囲に加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させた後、80℃以下の温度まで冷却し、アミド化合物の針状結晶を含有する所定の形状の成形物を成形する工程、
(iii)工程(ii)で得られた成形物を150〜240℃の温度範囲に加熱してから発泡剤を注入し、その後に発泡させる発泡成形工程
を具備することを特徴とするポリプロピレン系樹脂発泡成形体の製造方法。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族基、炭素数5〜30の脂環族基又は炭素数6〜30の芳香族基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
(I) A polypropylene resin and at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2) are melt-mixed and then cooled and solidified. Then, the polypropylene-based resin composition obtained in the steps (ii) and (i) of producing the polypropylene-based resin composition containing the amide compound was heated to a temperature range of 240 to 330 ° C. and melted. A step of dissolving an amide compound in a resin and then cooling it to a temperature of 80 ° C. or lower to form a molded product having a predetermined shape containing acicular crystals of the amide compound.
(Iii) A polypropylene-based resin comprising a foam molding step of heating the molded product obtained in step (ii) to a temperature range of 150 to 240 ° C., injecting a foaming agent, and then foaming. A method for manufacturing a foam molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, fatty radicals of saturated or unsaturated 5 to 30 carbon atoms, alicyclic groups or aromatic having 6 to 30 carbon atoms having 5 to 30 carbon atoms Represents a group . ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]
前記発泡剤が、超臨界状態の不活性ガスである請求項4に記載の製造方法。 The production method according to claim 4, wherein the foaming agent is an inert gas in a supercritical state. 前記不活性ガスが、二酸化炭素である請求項5に記載の製造方法。 The production method according to claim 5, wherein the inert gas is carbon dioxide. 発泡成形工程における発泡倍率が1.2〜100倍である請求項3〜6の何れかに記載の製造方法。 The production method according to any one of claims 3 to 6, wherein the foaming ratio in the foam molding step is 1.2 to 100 times. 下記一般式(1)で示されるアミド化合物及び一般式(2)で示されるアミド化合物からなる群より選ばれた少なくとも1種のアミド化合物の針状結晶を含有することを特徴とするポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、nは、2〜6の整数を表す。Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ポリカルボン酸残基、炭素数3〜18の脂環族ポリカルボン酸残基又は炭素数6〜18の芳香族ポリカルボン酸残基を表す。2〜6個のRは、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族基、炭素数5〜30の脂環族基又は炭素数6〜30の芳香族基を表す。]
[式中、R、R、R及びRは、同一又は異なって、それぞれ、水素原子、炭素数1〜20のアルキル基、炭素数5〜20の置換基を有してもよいシクロアルキル基、又は炭素数6〜20の置換基を有してもよいアリール基を表す。なお、RとR、及びRとRは、それぞれ同時に水素原子を表すことはない。また、RとRと、又はRとRとが、それぞれ、互いに結合してアルキレン基を形成してもよい。]
A polypropylene-based resin containing needle-like crystals of at least one amide compound selected from the group consisting of the amide compound represented by the following general formula (1) and the amide compound represented by the general formula (2). A polypropylene-based resin composition for producing a foamed molded product.
[In the formula, n represents an integer of 2 to 6. R 1 is a saturated or unsaturated aliphatic polycarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic polycarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic polycarboxylic acid residue having 6 to 18 carbon atoms. Represents a group. 2-6 R 2 are the same or different, respectively, fatty radicals of saturated or unsaturated 5 to 30 carbon atoms, alicyclic groups or aromatic having 6 to 30 carbon atoms having 5 to 30 carbon atoms Represents a group . ]
[In the formula, R 3 , R 4 , R 5 and R 6 may have the same or different hydrogen atom, an alkyl group having 1 to 20 carbon atoms, and a substituent having 5 to 20 carbon atoms, respectively. Represents a cycloalkyl group or an aryl group which may have a substituent having 6 to 20 carbon atoms. Note that R 3 and R 4 and R 5 and R 6 do not represent hydrogen atoms at the same time, respectively. Further, R 3 and R 4 or R 5 and R 6 may be bonded to each other to form an alkylene group. ]
前記アミド化合物が、下記一般式(3)で示される少なくとも1種のアミド化合物である請求項8に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式(3)中、Rは、炭素数2〜18の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数3〜18の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRは、同一又は異なって、それぞれ炭素数5〜18のシクロアルキル基を表す。]
The polypropylene-based resin composition for producing a polypropylene-based resin foam molded article according to claim 8, wherein the amide compound is at least one amide compound represented by the following general formula (3).
[In formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 2 to 18 carbon atoms, a saturated or unsaturated alicyclic dicarboxylic acid residue having 3 to 18 carbon atoms, or a carbon. Representing aromatic dicarboxylic acid residues of numbers 6-18, R 8 and R 9 represent the same or different cycloalkyl groups having 5 to 18 carbon atoms, respectively. ]
一般式(3)において、Rが炭素数3〜12の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜18の芳香族ジカルボン酸残基を表し、R及びRが、同一又は異なって、それぞれ炭素数5〜12のシクロアルキル基を表す請求項9に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 In the general formula (3), R 7 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 3 to 12 carbon atoms, a saturated or unsaturated aliphatic dicarboxylic acid residue having 6 to 10 carbon atoms, or a carbon number of carbon atoms. The production of a polypropylene-based resin foam molded product according to claim 9, which represents 6 to 18 aromatic dicarboxylic acid residues, and R 8 and R 9 represent the same or different cycloalkyl groups having 5 to 12 carbon atoms, respectively. Polypropylene-based resin composition for. 一般式(3)において、Rが、一般式(e)
で表される芳香族ジカルボン酸残基であり、R及びRが、シクロヘキシル基である請求項10に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
In the general formula (3), R 7 is the general formula (e).
The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to claim 10, wherein the aromatic dicarboxylic acid residue represented by the above, and R 8 and R 9 are cyclohexyl groups.
アミド化合物が、2,6−ナフタレンジカルボン酸ジシクロヘキシルアミドである請求項11に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to claim 11, wherein the amide compound is 2,6-naphthalenedicarboxylic acid dicyclohexylamide. 前記アミド化合物が、下記一般式(4)で示される少なくとも1種のアミド化合物である請求項8に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、R14は、炭素数2〜18の飽和若しくは不飽和の脂肪族トリカルボン酸残基、炭素数3〜18の脂環族トリカルボン酸残基又は炭素数6〜18の芳香族トリカルボン酸残基を表す。3個のR15は、同一又は異なって、それぞれ、炭素数5〜30の飽和若しくは不飽和の脂肪族基、炭素数5〜30の脂環族基又は炭素数6〜30の芳香族基を表す。]
The polypropylene-based resin composition for producing a polypropylene-based resin foam molded article according to claim 8, wherein the amide compound is at least one amide compound represented by the following general formula (4).
[In the formula, R 14 is a saturated or unsaturated aliphatic tricarboxylic acid residue having 2 to 18 carbon atoms, an alicyclic tricarboxylic acid residue having 3 to 18 carbon atoms, or an aromatic tricarboxylic acid having 6 to 18 carbon atoms. Represents a residue. Three R 15 are the same or different, respectively, fatty radicals of saturated or unsaturated 5 to 30 carbon atoms, an alicyclic radical or an aromatic group having 6 to 30 carbon atoms having 5 to 30 carbon atoms Represent. ]
前記アミド化合物が、下記一般式(5)で示される少なくとも1種のアミド化合物である請求項13に記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。
[式中、R16、R17、R18は、同一又は異なって、炭素数5〜20の直鎖状若しくは分岐鎖状のアルキル基若しくはアルケニル基、フェニル基、下記一般式(f)で表されるシクロアルキル基を表す。]
[式中、xは、1〜8の整数を表す。]
The polypropylene-based resin composition for producing a polypropylene-based resin foam molded product according to claim 13, wherein the amide compound is at least one amide compound represented by the following general formula (5).
[In the formula, R 16 , R 17 , and R 18 are the same or different, and are represented by the following general formula (f), which are linear or branched alkyl or alkenyl groups or phenyl groups having 5 to 20 carbon atoms. Represents the cycloalkyl group to be formed. ]
[In the formula, x represents an integer of 1-8. ]
ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.1〜60.0g/10分である請求項8〜14の何れかに記載のポリプロピレン系樹脂発泡成形体製造用のポリプロピレン系樹脂組成物。 The polypropylene resin composition for producing a polypropylene resin foam molded product according to any one of claims 8 to 14, wherein the melt flow rate of the polypropylene resin at 230 ° C. and a load of 2160 g is 0.1 to 60.0 g / 10 minutes. Stuff.
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