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JP6831541B2 - Manufacturing method of optical element - Google Patents
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JP6831541B2 - Manufacturing method of optical element - Google Patents

Manufacturing method of optical element Download PDF

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JP6831541B2
JP6831541B2 JP2018039728A JP2018039728A JP6831541B2 JP 6831541 B2 JP6831541 B2 JP 6831541B2 JP 2018039728 A JP2018039728 A JP 2018039728A JP 2018039728 A JP2018039728 A JP 2018039728A JP 6831541 B2 JP6831541 B2 JP 6831541B2
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optical element
fine particles
treatment
treatment liquid
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JP2019152829A (en
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和人 山内
和人 山内
愛雄 一井
愛雄 一井
浩巳 岡田
浩巳 岡田
尚史 津村
尚史 津村
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JTec Corp
University of Osaka NUC
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JTec Corp
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Description

本発明は、光学素子の製造方法に係わり、更に詳しくは例えば真空紫外線領域から硬X線流域までの波長帯の光学系に使用する光学素子の製造方法に関するものである。 The present invention relates to a method for manufacturing an optical element, and more particularly to a method for manufacturing an optical element used for an optical system in a wavelength band from, for example, a vacuum ultraviolet region to a hard X-ray basin.

真空紫外線領域から軟X線領域、硬X線流域までの波長帯の光は、殆どの物質に吸収されるため、その光学系には透過光学素子は使用できず、物質表面での反射を利用した反射光学素子を使用する必要がある。例えば、大型放射光施設(SPring-8等)やX線自由電子レーザー(SACLA等)で発生させたX線の光学系には、高精度な平面ミラーあるいは球面ミラーや非球面ミラー等の各種の反射型X線ミラーが使われ、それらX線ミラーがミラーマニピュレーターで高精度に姿勢制御されている(特許文献1)。 Since light in the wavelength band from the vacuum ultraviolet region to the soft X-ray region to the hard X-ray basin is absorbed by most substances, a transmission optical element cannot be used in the optical system, and reflection on the surface of the substance is used. It is necessary to use the reflected optical element. For example, the X-ray optical system generated by a large radiation facility (SPring-8, etc.) or an X-ray free electron laser (SACLA, etc.) includes various types of high-precision plane mirrors, spherical mirrors, aspherical mirrors, and the like. Reflective X-ray mirrors are used, and the X-ray mirrors are posture-controlled with high accuracy by a mirror manipulator (Patent Document 1).

従来より、X線ミラーにおいては、各周波数毎の表面粗さの低減によって精度の向上があるとされている。例えば、波動光学シミュレーションによって、10keVの光を集光する場合においては、形状誤差がPVで2nm以下若しくは1nmRMS以下となるようにミラーを製作することが必要であるとされる。これらを製作する手段として、EEM(Elastic Emission Machining)加工及びMSI(Microstitching interferometry)、RADSI(Relative Angle Determinable Stitching Interferometry)計測方法を用いることで製作が可能となっている(特許文献2)。EEMは、微粒子を分散した加工液を光学素子材料の加工面に沿って流動させて、該微粒子を加工面上に略無荷重の状態で接触させ、その際の微粒子と加工面界面での相互作用(一種の化学結合)により、表面原子を原子単位に近いオーダで除去して加工する超精密加工方法である(特許文献3、特許文献4)。このEEM加工によって光学素子表面を所望精度で加工できるものの、EEMプロセスで使用する加工微粒子(SiO等)が表面に多数付着することが避けられないという特徴がある。 Conventionally, it has been said that the accuracy of an X-ray mirror is improved by reducing the surface roughness for each frequency. For example, when condensing 10 keV light by wave optical simulation, it is necessary to manufacture a mirror so that the shape error is 2 nm or less or 1 nm RMS or less in PV. As a means for producing these, EEM (Elastic Emission Machining) processing, MSI (Microstitching interferometry), and RADSI (Relative Angle Determinable Stitching Interferometry) measurement methods can be used for production (Patent Document 2). In EEM, a processing liquid in which fine particles are dispersed is made to flow along a processing surface of an optical element material, and the fine particles are brought into contact with each other on the processing surface in a substantially unloaded state, and the fine particles and the processing surface interface at that time mutually. This is an ultra-precision processing method in which surface atoms are removed on an order close to that of atomic units by action (a kind of chemical bond) (Patent Documents 3 and 4). Although the surface of the optical element can be processed with desired accuracy by this EEM processing, there is a feature that a large number of processed fine particles (SiO 2, etc.) used in the EEM process inevitably adhere to the surface.

X線集光ミラーにおいては、反射面にパーティクルが存在することで、一部の光が散乱してしまうということがあった。しかしながら、パーティクルによる散乱はごく一部の光であり、これまで特に重要視されてこなかったが、近年集光ミラーにおいても当該ミラーに付着するパーティクルが真空装置中で浮遊することで別の光学素子に悪影響を及ぼすことが報告されている(非特許文献1)。また、光学素子の反射面に多層膜を形成する場合、表面に付着したパーティクルによって多層膜にムラができ、反射特性を損なうことになる。 In the X-ray condensing mirror, some light may be scattered due to the presence of particles on the reflecting surface. However, scattering by particles is only a small part of the light and has not been regarded as particularly important until now. However, in recent years, even in a condensing mirror, particles adhering to the mirror float in a vacuum device, resulting in another optical element. Has been reported to have an adverse effect on (Non-Patent Document 1). Further, when a multilayer film is formed on the reflective surface of the optical element, the multilayer film is uneven due to the particles adhering to the surface, and the reflection characteristics are impaired.

また、現在、X線ビームの高品質化が進んでいて、形状誤差PV2nm程度の超高精度ミラーから、回折格子を作ることが増えてきている。この超高精度ミラー表面に、ほこり、パーティクルがあると、リソグラフィ技術を用いて回折格子を製作する際、当該パーティクルがマスクとなって、格子溝に凹凸が発生する。これらの凹凸によって迷光が生じてしまい、目的の波長の光の切り出しに影響を与えてしまうという問題があった(非特許文献2)。 Further, at present, the quality of X-ray beams is being improved, and the number of diffraction gratings made from ultra-high precision mirrors having a shape error of about 2 nm is increasing. If there is dust or particles on the surface of this ultra-high precision mirror, the particles serve as a mask when the diffraction grating is manufactured by using the lithography technique, and unevenness is generated in the lattice groove. There is a problem that stray light is generated due to these irregularities and affects the cutting out of light having a target wavelength (Non-Patent Document 2).

このため、洗浄によって表面を荒らすことなく、パーティクル、ほこりを除去できる技術が必要となっていた。半導体基板の洗浄技術としては、一般にRCA法といわれる洗浄技術で、硫酸過酸化水素水洗浄と、アンモニア過酸化水素洗浄とフッ酸洗浄により表面パーティクルや金属、有機物が除去されることが知られている。しかしながら、X線ミラー等の光学素子が石英基板やSi単結晶基板で、付着微粒子にSiOを含むと、同質の物体であるため、このような通常の洗浄方法では付着微粒子を完全に除去することが困難であり、パーティクルが残存するという問題があった。 For this reason, there has been a need for a technique capable of removing particles and dust without roughening the surface by cleaning. As a cleaning technology for semiconductor substrates, it is known that surface particles, metals, and organic substances are removed by cleaning with hydrogen peroxide solution, ammonia hydrogen peroxide, and hydrofluoric acid, which is a cleaning technology generally called the RCA method. There is. However, if the optical element such as an X-ray mirror is a quartz substrate or a Si single crystal substrate and the adhered fine particles contain SiO 2 , it is an object of the same quality, so that the adhered fine particles are completely removed by such a normal cleaning method. It was difficult to do so, and there was a problem that particles remained.

特開2002−122981号公報JP-A-2002-122981 特開2008−292438号公報Japanese Unexamined Patent Publication No. 2008-292438 特開2000−167770号公報JP 2000-167770 特開2006−159379号公報Japanese Unexamined Patent Publication No. 2006-159379

Katsuhiko Murakami, EUVL Symposium 2011, October 17(http://www.sematech.org/meetings/archives/litho/euvl/10157EUVL/pres/Katsuhiko Murakami.pdf)Katsuhiko Murakami, EUVL Symposium 2011, October 17 (http://www.sematech.org/meetings/archives/litho/euvl/10157EUVL/pres/Katsuhiko Murakami.pdf) 放射光ビームライン光学技術入門(日本放射光学会) p.163Introduction to Radiated Light Beamline Optical Technology (Japanese Society for Synchrotron Radiation) p. 163

そこで、本発明が前述の状況に鑑み、解決しようとするところは、優れた実績のあるEEMプロセスによって、光学素子材料の表面を真空紫外線領域から硬X線流域までの波長帯の光学系に使用することが可能な高い精度に加工するとともに、表面、特に反射面に対する付着微粒子を大幅に低減し、付着微粒子の光学的影響を少なくした高品位の光学素子の製造方法を提供する点にある。 Therefore, in view of the above situation, the present invention attempts to solve the problem by using the surface of the optical element material for an optical system in the wavelength band from the vacuum ultraviolet region to the hard X-ray flow region by an excellent proven EEM process. It is an object of the present invention to provide a method for manufacturing a high-quality optical element, which is processed with high precision capable of processing, significantly reduces the amount of fine particles adhering to the surface, particularly the reflective surface, and reduces the optical influence of the fine particles.

本発明は、前述の課題解決のために、以下に構成する光学素子の製造方法を提供する。 The present invention provides a method for manufacturing an optical element having the following structure in order to solve the above-mentioned problems.

(1)
光学素子材料と化学的な反応性のある加工微粒子を分散した加工液を加工面に沿って流動させて、該加工微粒子と加工面界面での化学的な相互作用により、該加工微粒子に化学結合した表面原子を、加工液の煎断流によって該加工微粒子と共に除去するEEMプロセスを用いて、所望精度の表面を創成するEEM加工工程と、
遷移金属元素からなる触媒金属微粒子を分散させた水を含む処理液の存在下で、処理パッドと被処理物表面とを接触させながら相対的に変位させ、水と触媒金属表面とを相互作用させ、光学素子材料表面に接触した触媒金属の触媒機能によって光学素子材料の直接的な加水分解あるいは光学素子材料の酸化と該酸化膜の加水分解を進行させ、加水分解による分解生成物を光学素子材料から除去する、加工基準面を有しない触媒援用エッチングプロセスを用いて、光学素子材料表面のうち少なくとも反射面となる表面を、該表面に付着した前記加工微粒子を含む付着微粒子とともに一様に除去する表面処理工程と、
により製作されることを特徴とする、光学素子の製造方法。
(1)
A processing liquid in which processed fine particles that are chemically reactive with the optical element material are dispersed is made to flow along the processed surface, and chemically bonded to the processed fine particles by a chemical interaction between the processed fine particles and the interface between the processed particles. An EEM processing step of creating a surface with desired accuracy by using an EEM process of removing the formed surface atoms together with the processed fine particles by decoction of the processing liquid.
In the presence of a treatment liquid containing water in which catalyst metal fine particles composed of transition metal elements are dispersed , the treatment pad and the surface of the object to be treated are relatively displaced while being in contact with each other, and the water and the surface of the catalyst metal interact with each other. The catalytic function of the catalytic metal in contact with the surface of the optical element material promotes the direct hydrolysis of the optical element material or the oxidation of the optical element material and the hydrolysis of the oxide film, and the decomposition product due to the hydrolysis is used as the optical element material. Using a catalyst-assisted etching process that does not have a processing reference surface, at least the surface of the optical element material, which is a reflective surface, is uniformly removed together with the adhered fine particles including the processed fine particles adhering to the surface. Surface treatment process and
A method of manufacturing an optical element, which is characterized by being manufactured by.

(2)
前記EEM加工工程は、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、高周波数領域(1μm×1μm領域)において、表面粗さが0.13nmRMS以下になるような加工を行う工程、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、中周波数領域(100μm×100μm領域)において、表面粗さが0.15nmRMS以下になるような加工を行う工程、
前記回転球型加工ヘッドによる単位加工痕又は前記加工液をノズルから噴出させ、加工面に沿った加工液の高剪断流を形成するノズル型加工ヘッドによる単位加工痕を、加工面に対して相対的に走査するとともに、加工ヘッドの滞在時間を数値制御して空間的に除去量を決める数値制御EEMにより、低周波数領域(1mm以上から前記反射面の有効領域)において、形状誤差が1nmRMS以下になるような加工を行う工程、
のうち少なくとも1つの工程を含む、(1)記載の光学素子の製造方法。
(2)
The EEM processing step is
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.13 nm RMS or less in the high frequency region (1 μm × 1 μm region). Processing process,
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.15 nm RMS or less in the medium frequency region (100 μm × 100 μm region). Processing process,
Unit machining marks by the rotary spherical machining head or unit machining marks by the nozzle-type machining head that eject the machining fluid from the nozzle to form a high shear flow of the machining fluid along the machining surface are relative to the machining surface. In the low frequency region (from 1 mm or more to the effective region of the reflective surface), the shape error is reduced to 1 nm RMS or less by numerically controlling EEM that numerically controls the residence time of the processing head and spatially determines the removal amount. The process of processing
The method for manufacturing an optical element according to (1), which comprises at least one step.

(3)
前記処理パッドは、少なくとも表面に遷移金属元素からなる触媒金属を有する構造で、該触媒が加工基準面とならない、(1)又は(2)記載の光学素子の製造方法。
(3)
The method for manufacturing an optical element according to (1) or (2) , wherein the processing pad has a structure having a catalyst metal composed of a transition metal element at least on its surface, and the catalyst does not serve as a processing reference surface .

(4)
前記処理パッドとして、表面に触媒金属細線からなる不織布若しくは織布を設けた構造の処理パッドを用いる、(3)記載の洗浄方法。
(4)
The cleaning method according to (3), wherein as the processing pad, a processing pad having a structure in which a non-woven fabric or a woven fabric made of a thin catalyst metal wire is provided on the surface .

(5)
前記処理パッドとして、表面に触媒金属細線からなる不織布若しくは織布を設けた構造の処理パッドを用いる、(3)記載の洗浄方法。
(5)
The cleaning method according to (3), wherein as the processing pad, a processing pad having a structure in which a non-woven fabric or a woven fabric made of a thin catalyst metal wire is provided on the surface .

(6)
前記表面処理工程によって光学素子材料表面の付着微粒子を除去した後、当該表面処理工程によって付着する金属系微粒子を、酸若しくはアルカリ溶液により、溶解除去させる洗浄工程を含むことを特徴とする、(1)〜(5)何れか1に記載の光学素子の製造方法。
(6)
It is characterized by including a cleaning step of removing the adhered fine particles on the surface of the optical element material by the surface treatment step and then dissolving and removing the metallic fine particles adhering by the surface treatment step with an acid or an alkaline solution (1). )-(5) The method for manufacturing an optical element according to any one of 1.

(7)
前記表面処理工程での水を含む処理液の流れは、除去ユニットに処理液を供給して該除去ユニットの周囲から処理液を外側に流す工程と、該除去ユニットの周囲から処理液を排出する工程とを含む、(1)〜(6)何れか1に記載の光学素子の製造方法。
(7)
The flow of the treatment liquid containing water in the surface treatment step includes a step of supplying the treatment liquid to the removal unit and flowing the treatment liquid outward from the periphery of the removal unit, and discharging the treatment liquid from the periphery of the removal unit. The method for manufacturing an optical element according to any one of (1) to (6), which includes a step.

(8)
前記表面処理工程での水を含む処理液の流れは、除去ユニットの周囲に処理液を供給する工程と、該除去ユニットの周囲から処理液を内側に吸い込んで排出する工程とを含む、(1)〜(6)何れか1に記載の光学素子の製造方法。
(8)
The flow of the treatment liquid containing water in the surface treatment step includes a step of supplying the treatment liquid around the removal unit and a step of sucking the treatment liquid inward from the periphery of the removal unit and discharging the treatment liquid (1). )-(6) The method for manufacturing an optical element according to any one of 1.

(9)
前記表面処理工程での水を含む処理液の流れは、除去ユニットから処理液を流す工程と、その処理液がオーバーフローにより洗浄領域から排出される工程を含む、(1)〜(6)何れか1に記載の光学素子の製造方法。
(9)
The flow of the treatment liquid containing water in the surface treatment step includes any of (1) to (6), including a step of flowing the treatment liquid from the removal unit and a step of discharging the treatment liquid from the cleaning region due to overflow. The method for manufacturing an optical element according to 1.

(10)
前記表面処理工程は、水を含む処理液が入った処理槽内で、バッチ処理されることを特徴とする、(1)〜(6)何れか1に記載の光学素子の製造方法。
(10)
The method for manufacturing an optical element according to any one of (1) to (6), wherein the surface treatment step is batch-treated in a treatment tank containing a treatment liquid containing water.

(11)
前記光学素子材料が、Si単結晶又は酸化物である、(1)〜(10)何れか1に記載の光学素子の製造方法。
(11)
The method for producing an optical element according to any one of (1) to (10), wherein the optical element material is a Si single crystal or an oxide.

12
前記表面処理工程における水を含む処理液は、純水又は超純水に、酸化促進剤、pH調整液、緩衝液、分解生成物の溶解を助ける錯体溶液の少なくとも1種を混合したものである、(1)〜(11)何れか1に記載の光学素子の製造方法。
( 12 )
The treatment solution containing water in the surface treatment step is a mixture of pure water or ultrapure water mixed with at least one of an oxidation accelerator, a pH adjusting solution, a buffer solution, and a complex solution that helps dissolve decomposition products. , (1) to ( 11 ) The method for manufacturing an optical element according to any one of 1.

このような本発明の光学素子の製造方法によれば、優れた実績のあるEEMプロセスによって光学素子材料表面を所望精度に加工することができるEEM加工工程と、EEMプロセスで用いた加工微粒子を含む付着微粒子を光学素子材料表面から除去する表面処理工程とを備え、表面処理工程は、遷移金属元素からなる触媒金属微粒子を分散させた水を含む処理液の存在下で、処理パッドと被処理物表面とを接触させながら相対的に変位させ、水と触媒金属表面とを相互作用させ、光学素子材料表面に接触した触媒金属の触媒機能によって光学素子材料の直接的な加水分解あるいは光学素子材料の酸化と該酸化膜の加水分解を進行させ、加水分解による分解生成物を光学素子材料から除去する、加工基準面を有しない触媒援用エッチングプロセスを用いているので、光学素子材料表面のうち少なくとも反射面となる表面を、該表面に付着した前記加工微粒子を含む付着微粒子とともに一様に除去することにより、確実に光学素子材料表面から付着微粒子を除去することができ、しかも光学素子材料表面は数原子層だけの除去で済むので、短時間で行うことができ、またEEM加工工程で創成した表面の形状精度及び表面粗さを損なうことがない。つまり、表面処理工程の触媒援用エッチングプロセスは、触媒金属表面と接する部位のみが表面処理領域となるので、EEM加工工程で創成した表面の形状精度を維持することができる。 According to the method for manufacturing an optical element of the present invention, the EEM processing step capable of processing the surface of the optical element material with a desired accuracy by the EEM process having an excellent track record and the processed fine particles used in the EEM process are included. The surface treatment step includes a surface treatment step of removing the adhered fine particles from the surface of the optical element material, and the surface treatment step includes a treatment pad and an object to be treated in the presence of a treatment liquid containing water in which catalytic metal fine particles composed of transition metal elements are dispersed . The surface of the optical element material is directly hydrolyzed or the optical element material is subjected to the catalytic function of the catalytic metal in contact with the surface of the optical element material by interacting with water and the surface of the catalytic metal . Since a catalyst-assisted etching process having no processing reference plane is used, which promotes oxidation and hydrolysis of the oxide film and removes decomposition products from the hydrolysis from the optical element material, at least reflection on the surface of the optical element material is used. By uniformly removing the surface to be the surface together with the adhered fine particles including the processed fine particles adhering to the surface, the adhered fine particles can be reliably removed from the surface of the optical element material, and the number of the optical element material surfaces is large. Since only the atomic layer needs to be removed, it can be performed in a short time, and the shape accuracy and surface roughness of the surface created in the EEM processing step are not impaired. That is, in the catalyst-assisted etching process of the surface treatment step, only the portion in contact with the surface of the catalyst metal becomes the surface treatment region, so that the shape accuracy of the surface created in the EEM processing step can be maintained.

前記EEM加工工程は、弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、高周波数領域(1μm×1μm領域)において、表面粗さが0.13nmRMS以下になるような加工を行う工程、弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、中周波数領域(100μm×100μm領域)において、表面粗さが0.15nmRMS以下になるような加工を行う工程、前記回転球型加工ヘッドによる単位加工痕又は前記加工液をノズルから噴出させ、加工面に沿った加工液の高剪断流を形成するノズル型加工ヘッドによる単位加工痕を、加工面に対して相対的に走査するとともに、加工ヘッドの滞在時間を数値制御して空間的に除去量を決める数値制御EEMにより、低周波数領域(1mm以上から前記反射面の有効領域)において、形状誤差が1nmRMS以下になるような加工を行う工程、のうち少なくとも1つの工程を含むので、光学素子材料の表面を真空紫外線領域から硬X線流域までの波長帯の光学系に使用することが可能な高い精度に加工することができる。 In the EEM processing step, the surface roughness is 0 in the high frequency region (1 μm × 1 μm region) by the rotating sphere type processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere. In the middle frequency region (100 μm × 100 μm region), a rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by rotating the elastic rotating sphere in the process of processing to 13 nm RMS or less. In the process of processing so that the surface roughness is 0.15 nm RMS or less, the unit processing marks by the rotary spherical processing head or the processing liquid is ejected from the nozzle to generate a high shear flow of the processing liquid along the processing surface. The unit machining marks formed by the nozzle-type machining head are scanned relative to the machining surface, and the staying time of the machining head is numerically controlled to spatially determine the amount of removal. Since at least one step of processing is performed so that the shape error is 1 nm RMS or less in the effective region of the reflective surface from 1 mm or more), the surface of the optical element material is moved from the vacuum ultraviolet region to the hard X-ray flow region. It can be processed with high accuracy that can be used for optical systems in the frequency bands up to.

また、前記表面処理工程によって光学素子材料表面の付着微粒子を除去した後、当該表面処理工程によって付着する金属系微粒子を、酸若しくはアルカリ溶液により、溶解除去させる洗浄工程を実行することにより、更に確実に付着微粒子を少なくすることができ、高品位のX線光学素子を提供することができる。 Further, it is more reliable by executing a cleaning step of removing the adhered fine particles on the surface of the optical element material by the surface treatment step and then dissolving and removing the metallic fine particles adhering by the surface treatment step with an acid or alkaline solution. It is possible to reduce the amount of fine particles adhering to the alkali, and it is possible to provide a high-quality X-ray optical element.

本発明に係る光学素子の製造方法によって、光学素子材料の表面状態の変化を模式的に示した説明用断面図である。It is explanatory cross-sectional view which shows typically the change of the surface state of the optical element material by the manufacturing method of the optical element which concerns on this invention. EEM加工工程に用いる回転球型加工ヘッド方式EEMの簡略説明図である。It is a simplified explanatory drawing of the rotary ball type processing head system EEM used in the EEM processing process. EEM加工工程に用いるノズル型加工ヘッド方式EEMの簡略説明図である。It is a simplified explanatory drawing of the nozzle type processing head system EEM used in the EEM processing process. X線光学素子用ガラス基板の加工前と、回転球型加工ヘッド方式EEMによる加工後の表面を位相シフト干渉顕微鏡と原子間力顕微鏡(AFM)で観察した結果を示している。The results of observing the surfaces of the glass substrate for an X-ray optical element before processing and after processing by the rotating sphere processing head method EEM with a phase shift interference microscope and an atomic force microscope (AFM) are shown. 表面処理工程におけるバッチ処理装置の簡略説明図である。It is a simplified explanatory drawing of the batch processing apparatus in a surface treatment process. 表面処理工程に用いる吐出水流方式の処理装置の簡略説明図である。It is a simplified explanatory drawing of the discharge water flow type processing apparatus used in a surface treatment process. 表面処理工程に用いる吸引水流方式の処理装置の簡略説明図である。It is a simplified explanatory drawing of the suction water flow type processing apparatus used in a surface treatment process. 表面処理工程に用いる回転水流方式の処理装置の簡略説明図である。It is a simplified explanatory drawing of the rotating water flow type processing apparatus used in a surface treatment process.

次に、添付図面に示した実施形態に基づき、本発明を更に詳細に説明する。図1は本発明に係る光学素子の製造方法によって、光学素子材料の表面状態の変化を模式的に示したものである。図中符号Aは光学素子、1は光学素子材料、2は表面、3は付着微粒子、4は加工微粒子、5は汚染微粒子、6は金属系微粒子を示している。 Next, the present invention will be described in more detail based on the embodiments shown in the accompanying drawings. FIG. 1 schematically shows a change in the surface state of an optical element material according to the method for manufacturing an optical element according to the present invention. In the figure, reference numeral A is an optical element, 1 is an optical element material, 2 is a surface, 3 is an adhered fine particle, 4 is a processed fine particle, 5 is a contaminated fine particle, and 6 is a metallic fine particle.

本発明によって、光学素子Aは、光学素子材料1と化学的な反応性のある加工微粒子4を分散した加工液を加工面に沿って流動させて、該加工微粒子4と加工面界面での化学的な相互作用により、該加工微粒子4に化学結合した表面原子を、加工液の煎断流によって該加工微粒子4と共に除去するEEMプロセスを用いて、所望精度の表面2を創成するEEM加工工程(図1(a)、(b)参照)と、水を含む処理液と、触媒金属表面とを相互作用させ、触媒機能によって光学素子材料1の直接的な加水分解あるいは光学素子材料の酸化と該酸化膜の加水分解を進行させ、加水分解による分解生成物を光学素子材料1から除去する触媒援用エッチングプロセスを用いて、光学素子材料表面2のうち少なくとも反射面となる表面2に付着した前記加工微粒子4を含む付着微粒子3を除去する表面処理工程(図1(c)参照)と、により製作される。 According to the present invention, the optical element A causes a processing liquid in which processing particles 4 having chemical reactivity with the optical element material 1 are dispersed to flow along the processing surface, and chemicals at the interface between the processing fine particles 4 and the processing surface. An EEM processing step of creating a surface 2 with desired accuracy by using an EEM process in which surface atoms chemically bonded to the processed fine particles 4 are removed together with the processed fine particles 4 by decoction of the processing liquid by the above-mentioned interaction. (See FIGS. 1A and 1B), the treatment liquid containing water, and the surface of the catalytic metal are allowed to interact with each other, and the catalytic function causes direct hydrolysis of the optical element material 1 or oxidation of the optical element material. The processing adhering to at least the surface 2 of the optical element material surface 2, which is a reflective surface, by using a catalyst-assisted etching process for advancing the hydrolysis of the oxide film and removing the decomposition products due to the hydrolysis from the optical element material 1. It is produced by a surface treatment step (see FIG. 1C) for removing adhered fine particles 3 including fine particles 4.

更に、本発明の光学素子の製造方法には、前記表面処理工程によって光学素子材料表面2の付着微粒子3を除去した後、当該表面処理工程によって付着する金属系微粒子6を、酸若しくはアルカリ溶液により、溶解除去させる洗浄工程(図1(d)参照)を含むことを特徴としている。ここで、付着微粒子3には、EEMプロセスで使用する加工微粒子4の他に埃や不純物質等の汚染加工微粒子4が含まれる。 Further, in the method for manufacturing an optical element of the present invention, after removing the adhered fine particles 3 on the surface 2 of the optical element material by the surface treatment step, the metal-based fine particles 6 adhered by the surface treatment step are subjected to an acid or alkaline solution. It is characterized by including a cleaning step of dissolving and removing (see FIG. 1D). Here, the adhered fine particles 3 include contaminated fine particles 4 such as dust and impurities in addition to the processed fine particles 4 used in the EEM process.

ここで、前記EEM加工工程は、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、高周波数領域(1μm×1μm領域)において、表面粗さが0.13nmRMS以下になるような加工を行う工程、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、中周波数領域(100μm×100μm領域)において、表面粗さが0.15nmRMS以下になるような加工を行う工程、
前記回転球型加工ヘッドによる単位加工痕又は前記加工液をノズルから噴出させ、加工面に沿った加工液の高剪断流を形成するノズル型加工ヘッドによる単位加工痕を、加工面に対して相対的に走査するとともに、加工ヘッドの滞在時間を数値制御して空間的に除去量を決める数値制御EEMにより、低周波数領域(1mm以上から前記反射面の有効領域)において、形状誤差が1nmRMS以下になるような加工を行う工程、
のうち少なくとも1つの工程を含むものである。
Here, the EEM processing step is
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.13 nm RMS or less in the high frequency region (1 μm × 1 μm region). Processing process,
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.15 nm RMS or less in the medium frequency region (100 μm × 100 μm region). Processing process,
Unit machining marks by the rotary spherical machining head or unit machining marks by the nozzle-type machining head that eject the machining fluid from the nozzle to form a high shear flow of the machining fluid along the machining surface are relative to the machining surface. In the low frequency region (from 1 mm or more to the effective region of the reflective surface), the shape error is reduced to 1 nm RMS or less by numerically controlling EEM that numerically controls the residence time of the processing head and spatially determines the removal amount. The process of processing
Of these, at least one step is included.

光学素子材料及び光学素子の表面をどのような形状及び表面粗さに加工するかは、目的の光学系の主たる波長や要求精度に依存する。そして、光学系の一定の特性を実現するために、光学素子表面の各空間周波数に対するパワースペクトル密度(PSD)を規定値以下にすることが要求される。 The shape and surface roughness of the optical element material and the surface of the optical element depend on the main wavelength and required accuracy of the target optical system. Then, in order to realize a certain characteristic of the optical system, it is required that the power spectral density (PSD) for each spatial frequency on the surface of the optical element is set to a specified value or less.

前記光学素子材料としては、Si単結晶又は酸化物が挙げられる。Si単結晶は、非常に純度が高く格子欠陥が少ないものが提供されているので、X線領域の反射光学系の材料として適している。また、石英ガラスや極低膨張ガラスセラミックス等の単成分又は多成分系の酸化物も良好に使用できる。その他に、X線光学系やEUV光学系に使用される光学素子材料も対象となる。 Examples of the optical element material include Si single crystal and oxide. Since a Si single crystal having extremely high purity and few lattice defects is provided, it is suitable as a material for a catadioptric system in the X-ray region. Further, single-component or multi-component oxides such as quartz glass and ultra-low expansion glass ceramics can also be used satisfactorily. In addition, optical element materials used in X-ray optical systems and EUV optical systems are also targeted.

図1(a)は、加工前の光学素子材料1を示している。この光学素子材料1をEEM加工工程によって表面2を所定の形状及び表面粗さに加工すると、図1(b)に示すようにEEMプロセスで使用したコロイダルシリカ(SiO)等の加工微粒子4やその他の汚染加工微粒子4が表面2に付着することは避けられない。そこで、触媒金属を援用した表面処理工程によって、光学素子材料1の表面2を数原子層だけ除去することにより、付着微粒子3を取り除くのであるが、図1(c)に示すように触媒金属に起因する金属系微粒子6が表面2に付着する。この金属系微粒子6は、数密度が少なく、しかも酸若しくはアルカリ溶液による洗浄工程により、母材の光学素子材料1を変化させずに容易に溶解除去させることができる。それにより、図1(d)に示すようなパーティクルフリーな光学素子Aを製造することができるのである。 FIG. 1A shows the optical element material 1 before processing. When the surface 2 of the optical element material 1 is processed into a predetermined shape and surface roughness by the EEM processing step, as shown in FIG. 1 (b), the processed fine particles 4 such as colloidal silica (SiO 2 ) used in the EEM process and It is inevitable that other contaminated fine particles 4 adhere to the surface 2. Therefore, the adhered fine particles 3 are removed by removing only a few atomic layers from the surface 2 of the optical element material 1 by a surface treatment step using a catalyst metal. As shown in FIG. 1 (c), the catalyst metal is used. The resulting metallic fine particles 6 adhere to the surface 2. The metal-based fine particles 6 have a low number density, and can be easily dissolved and removed without changing the optical element material 1 of the base material by a cleaning step with an acid or alkaline solution. As a result, the particle-free optical element A as shown in FIG. 1D can be manufactured.

表1は、各工程後の光学素子材料1の表面2に付着したパーティクル残存数を示している。先ず、EEM加工工程後、純水洗浄のみの場合、60mm×60mmの範囲でパーティクル残存数は60351個である。EEM加工工程後、柔らかい布を用い超純水を洗浄液として洗浄した場合、パーティクル残存数は452個となった。ここで、布は、ポリエステル超極細繊維を用いたワイプである。そして、EEM加工工程後、表面処理工程の後には、パーティクル残存数は10個未満となった。 Table 1 shows the number of remaining particles adhering to the surface 2 of the optical element material 1 after each step. First, after the EEM processing step, in the case of pure water cleaning only, the number of remaining particles is 60351 in the range of 60 mm × 60 mm. After the EEM processing step, when ultrapure water was washed as a cleaning liquid using a soft cloth, the number of remaining particles was 452. Here, the cloth is a wipe using polyester ultrafine fibers. After the EEM processing step and the surface treatment step, the number of remaining particles was less than 10.

次に、EEM加工工程及び表面処理工程を以下に説明する。 Next, the EEM processing step and the surface treatment step will be described below.

[EEM加工工程]
EEM加工工程は、前述のように光学素子材料1と化学的な反応性のある加工微粒子4を分散した加工液を加工面に沿って流動させて、該加工微粒子4と加工面界面での化学的な相互作用により、該加工微粒子4に化学結合した表面原子を、加工液の煎断流によって該加工微粒子4と共に除去するEEMプロセスを用いている。加工液の剪断流を発生させる方法によって、主に回転球型加工ヘッド方式EEMとノズル型加工ヘッド方式EEMとがある。
[EEM processing process]
In the EEM processing step, as described above, a processing liquid in which the optical element material 1 and the chemically reactive processed fine particles 4 are dispersed is flowed along the processed surface, and the chemical at the interface between the processed fine particles 4 and the processed surface is performed. The EEM process is used in which the surface atoms chemically bonded to the processed fine particles 4 are removed together with the processed fine particles 4 by the decoction flow of the processing liquid by the above-mentioned interaction. There are mainly a rotary ball type machining head method EEM and a nozzle type machining head method EEM depending on the method of generating the shear flow of the machining liquid.

<回転球型加工ヘッド方式EEM>
図2に、回転球型加工ヘッド方式EEMを簡略的に示す。回転球型加工ヘッド方式EEMは、純水若しくは超純水に加工微粒子4を一様に分散した加工液を入れた加工槽内に、弾性回転球11と光学素子材料1とを配し、該光学素子材料1の表面2に対して前記弾性回転球11を一定荷重Fにて押圧しながら回転させることにより、該弾性回転球11と表面2間に加工液を巻き込んで流動させ、該加工液の流動による流体動圧と荷重との釣り合いによって所定の間隔を維持しながら加工するのである。図2中符号Pは加工液の流れを示している。前記弾性回転球11として、ポリウレタンからなる球体を用い、該弾性回転球11をモータ駆動される回転軸の先端に設けている。ここで、前記弾性回転球11として円板状や円柱状のものを用いることも可能である。
<Rotating sphere processing head method EEM>
FIG. 2 briefly shows the rotary spherical processing head type EEM. In the rotary sphere type processing head method EEM, the elastic rotary sphere 11 and the optical element material 1 are arranged in a processing tank containing a processing liquid in which the processing fine particles 4 are uniformly dispersed in pure water or ultrapure water. By rotating the elastic rotating sphere 11 while pressing it against the surface 2 of the optical element material 1 with a constant load F, the processing liquid is entrained and flowed between the elastic rotating sphere 11 and the surface 2 to flow the processing liquid. The processing is performed while maintaining a predetermined interval by balancing the fluid dynamic pressure and the load due to the flow of the water. Reference numeral P in FIG. 2 indicates the flow of the processing liquid. As the elastic rotating sphere 11, a sphere made of polyurethane is used, and the elastic rotating sphere 11 is provided at the tip of a rotating shaft driven by a motor. Here, it is also possible to use a disk-shaped or columnar elastic rotating sphere 11.

ここで、前記弾性回転球11を前記表面2へ一定荷重Fで押圧しながら一定方向に回転させると、図2に示したように、加工液は該弾性回転球11と表面2間に巻き込まれ、それから該表面2に沿った方向に流れる局所的な加工液流が発生し、それにより前記弾性回転球11と表面2との間に発生する流体動圧によって、該弾性回転球11と表面2との間に1μm程度の隙間が維持され、そして加工液流に伴い加工液中の加工微粒子4は前記表面2に接触しながら次々に該表面2と弾性回転球11間を通過し、該表面2と加工微粒子4との界面での化学的な相互作用により該表面2の加工を進行させるのである。 Here, when the elastic rotating sphere 11 is rotated in a certain direction while being pressed against the surface 2 with a constant load F, the working fluid is caught between the elastic rotating sphere 11 and the surface 2 as shown in FIG. Then, a local processing liquid flow flowing in the direction along the surface 2 is generated, and the fluid dynamic pressure generated between the elastic rotating sphere 11 and the surface 2 causes the elastic rotating sphere 11 and the surface 2 to flow. A gap of about 1 μm is maintained between the two, and the machining fine particles 4 in the machining fluid pass between the surface 2 and the elastic rotating sphere 11 one after another while contacting the surface 2 with the flow of the machining fluid, and the surface thereof. The processing of the surface 2 is advanced by the chemical interaction between 2 and the processed fine particles 4.

また、広い面積の表面2を連続的に加工するには、回転球型加工ヘッドによる単位加工痕を前記光学素子材料1に対して相対的に走査することにより行える。ここで、回転球型加工ヘッドは、前記弾性回転球11を含む部分のことである。一方、表面2の局所加工を行うには、予め計測した加工前の表面プロファイルから目的面プロファイルを差し引いて求めた加工量に応じて回転球型加工ヘッドの滞在時間を数値制御すれば、表面2の部位毎に加工量を制御できる。尚、単位加工痕とは、光学素子材料1の表面2に対して回転球型加工ヘッドの位置を静止した状態で、単位時間に加工される除去プロファイルのことである。 Further, in order to continuously process the surface 2 having a large area, the unit processing marks by the rotary spherical processing head can be scanned relative to the optical element material 1. Here, the rotary sphere type processing head is a portion including the elastic rotary sphere 11. On the other hand, in order to perform local machining of the surface 2, the staying time of the rotary spherical machining head can be numerically controlled according to the machining amount obtained by subtracting the target surface profile from the surface profile before machining measured in advance. The amount of processing can be controlled for each part. The unit processing mark is a removal profile that is processed in a unit time with the position of the rotary spherical processing head stationary with respect to the surface 2 of the optical element material 1.

尚、本実施形態の回転球型加工ヘッド方式EEMでは、前記弾性回転球11と表面2との間に1μm程度の隙間が形成され、この隙間を維持することが非接触加工には重要である。そのため、ここで使用できる加工微粒子4の粒径は、前述の隙間よりも十分に小さくなければならない。通常は、粒径が0.1μm程度のシリカ(SiO)からなる加工微粒子4を用いて加工する。尚、加工微粒子は、加工対象の光学素子材料に応じて変更することができる。 In the rotary ball type machining head system EEM of the present embodiment, a gap of about 1 μm is formed between the elastic rotary ball 11 and the surface 2, and it is important for non-contact machining to maintain this gap. .. Therefore, the particle size of the processed fine particles 4 that can be used here must be sufficiently smaller than the above-mentioned gap. Usually, the processed fine particles 4 made of silica (SiO 2 ) having a particle size of about 0.1 μm are used for processing. The processed fine particles can be changed according to the optical element material to be processed.

<ノズル型加工ヘッド方式EEM>
図3に、ノズル型加工ヘッド方式EEMを簡略的に示す。ノズル型加工ヘッド方式EEMは、加工ノズル21と光学素子材料2を加工槽内の加工液中に浸漬し、該加工ノズル21の先端面を光学素子材料2の表面2に対して平行に配するとともに、噴出方向を表面2に対して垂直に配し、光学素子材料2の表面原子と化学的な反応性のある加工微粒子4を均一に分散させた加工液を、前記加工ノズル21の噴出口22から液中にて噴出させ、前記表面2近傍に沿って加工液の高剪断流を発生させ、表面原子と化学結合した加工微粒子4を高剪断流にて取り除いて表面原子を除去し、加工を進行させる。図3中符号Pは加工液の流れを示している。
<Nozzle type processing head method EEM>
FIG. 3 briefly shows the nozzle type processing head method EEM. In the nozzle-type machining head system EEM, the machining nozzle 21 and the optical element material 2 are immersed in the machining fluid in the machining tank, and the tip surface of the machining nozzle 21 is arranged parallel to the surface 2 of the optical element material 2. At the same time, the ejection direction is arranged perpendicular to the surface 2, and the processing liquid in which the surface atoms of the optical element material 2 and the processed fine particles 4 having chemical reactivity are uniformly dispersed is discharged to the ejection port of the processing nozzle 21. It is ejected from 22 in the liquid to generate a high shear flow of the processing liquid along the vicinity of the surface 2, and the processed fine particles 4 chemically bonded to the surface atoms are removed by the high shear flow to remove the surface atoms for processing. To proceed. Reference numeral P in FIG. 3 indicates a flow of the processing liquid.

そして、広い面積の表面2を連続的に加工するには、ノズル型加工ヘッドによる単位加工痕を表面2に対して相対的に走査するのである。ここで、ノズル型加工ヘッドは、前記加工ノズル21を含む部分のことである。一方、表面2の局所加工を行うには、予め計測した加工前の表面プロファイルから目的面プロファイルを差し引いて求めた加工量に応じてノズル型加工ヘッドの滞在時間を数値制御して加工する。また、前記加工ノズル21の噴出口22は、円孔の他、横長のスリット孔も可能である。前記噴出口22が、円孔の場合、単位加工痕が小さくなるので局所加工に適し、スリット孔の場合には広い面積を一様に加工するのに適している。尚、前記加工ノズル21の噴出口22による加工液の噴出方向が、光学素子材料1の表面2に対して傾斜しても構わない。その場合には、単位加工痕のプロファイルが対称ではなくなる。 Then, in order to continuously process the surface 2 having a large area, the unit processing marks by the nozzle-type processing head are scanned relative to the surface 2. Here, the nozzle type processing head is a portion including the processing nozzle 21. On the other hand, in order to locally process the surface 2, the residence time of the nozzle-type processing head is numerically controlled according to the processing amount obtained by subtracting the target surface profile from the surface profile before processing measured in advance. Further, the ejection port 22 of the processing nozzle 21 can have a horizontally long slit hole in addition to a circular hole. When the spout 22 is a circular hole, the unit machining mark is small, so that it is suitable for local machining, and when it is a slit hole, it is suitable for uniformly machining a wide area. The direction in which the processing liquid is ejected from the ejection port 22 of the processing nozzle 21 may be inclined with respect to the surface 2 of the optical element material 1. In that case, the profile of the unit processing mark is not symmetrical.

予め、加工槽内に純水若しくは超純水に微粒子を分散させた加工液を満たしておき、この加工液内に加工ノズル21から前記加工液を噴射し、光学素子材料2の表面2に沿った所定の剪断流を作ることが最も効率的である。この場合、加工液をポンプで循環させて使用することができる。尚、前記加工槽内に純水若しくは超純水のみを入れ、加工ノズル21から前記加工液を噴射しても構わない。更に、加工ノズル21から純水若しくは超純水のみを噴き出す場合には、純水若しくは超純水の流れに合わせて別の供給口より加工微粒子4を分散させた加工液を供給してもよい。 The processing tank is previously filled with a processing liquid in which fine particles are dispersed in pure water or ultrapure water, and the processing liquid is sprayed into the processing liquid from the processing nozzle 21 along the surface 2 of the optical element material 2. It is most efficient to create a given shear flow. In this case, the processing liquid can be circulated by a pump for use. It is also possible to put only pure water or ultrapure water in the processing tank and inject the processing liquid from the processing nozzle 21. Further, when only pure water or ultrapure water is ejected from the processing nozzle 21, a processing liquid in which processing fine particles 4 are dispersed may be supplied from another supply port according to the flow of pure water or ultrapure water. ..

また、ノズル型加工ヘッド方式EEMでは、加工ノズル21の先端と光学素子材料表面2とのギャップを10μm以上と比較的広く取れるので、平均粒径が10nm〜10μmと広い範囲の加工微粒子4を使用することができる。但し、微粒子の粒径が大きくなり過ぎると表面2に加工微粒子4の接触による引っ掻き傷が生じるので、実用上は上限を数μm程度とし、また粒径が小さくなり過ぎると表面2に付着した加工微粒子4を取り除くための剪断流を極端に速くする必要があるので、実用上は下限を0.1μm程度とすることが好ましい。実際には、加工微粒子4として、複数の微粒子の集合体である凝集微粒子を用いて加工速度を速めている。前記凝集微粒子としては、粒径が1〜100nmのSiO微粒子が凝集して平均径が0.5〜5μmの集合体となったものを用いる。そして、前記加工液中の加工微粒子4(凝集微粒子)の濃度は3〜7vol%とすることが好ましい。 Further, in the nozzle type processing head method EEM, since the gap between the tip of the processing nozzle 21 and the surface 2 of the optical element material can be relatively wide as 10 μm or more, the processed fine particles 4 having an average particle size of 10 nm to 10 μm are used. can do. However, if the particle size of the fine particles becomes too large, the surface 2 will be scratched by the contact of the processed fine particles 4, so the upper limit is practically set to about several μm, and if the particle size becomes too small, the processing adheres to the surface 2. Since it is necessary to make the shear flow for removing the fine particles 4 extremely fast, it is practically preferable to set the lower limit to about 0.1 μm. Actually, as the processed fine particles 4, the processing speed is increased by using agglomerated fine particles which are aggregates of a plurality of fine particles. As the aggregated fine particles, those in which SiO 2 fine particles having a particle size of 1 to 100 nm are aggregated to form an aggregate having an average diameter of 0.5 to 5 μm is used. The concentration of the processed fine particles 4 (aggregated fine particles) in the processing liquid is preferably 3 to 7 vol%.

そして、凝集微粒子を用いて高速加工した後、通常の微粒子を用いて仕上げ加工すれば、超精密な加工を短時間で行うことができる。尚、凝集微粒子を用いた高速加工から仕上げ加工へ変更するには、単に加工液を交換するだけで済むので簡単である。 Then, if high-speed processing is performed using the aggregated fine particles and then finish processing is performed using ordinary fine particles, ultra-precision processing can be performed in a short time. It is easy to change from high-speed processing using agglomerated fine particles to finishing processing because it is only necessary to replace the processing liquid.

図4には、X線光学素子用ガラス基板を回転球型加工ヘッド方式EEMによって加工し、加工前と加工後の表面を位相シフト干渉顕微鏡(Zygo社、NewView)と原子間力顕微鏡(AFM)で観察した結果を示している。AFM像は、1μm×1μmの範囲で高周波数領域に対応し、位相シフト干渉顕微鏡像は140μm×110μmの範囲で中周波数領域に対応している。高周波数領域では、加工前の表面粗さが0.228nmRMS(0.158nmRa)であったのが、加工後には表面粗さが0.097nmRMS(0.077nmRa)になった。また、中周波数領域では、加工前の表面粗さが0.152nmRMS(0.122nmRa)であったのが、加工後には表面粗さが0.125nmRMS(0.100nmRa)になった。 In FIG. 4, a glass substrate for an X-ray optical element is processed by a rotating sphere processing head method EEM, and the surfaces before and after processing are subjected to a phase shift interference microscope (Zygo, NewView) and an atomic force microscope (AFM). The results observed in are shown. The AFM image corresponds to the high frequency region in the range of 1 μm × 1 μm, and the phase shift interference microscope image corresponds to the medium frequency region in the range of 140 μm × 110 μm. In the high frequency region, the surface roughness before processing was 0.228 nmRMS (0.158 nmRa), but after processing, the surface roughness became 0.097 nmRMS (0.077 nmRa). Further, in the medium frequency region, the surface roughness before processing was 0.152 nmRMS (0.122 nmRa), but after processing, the surface roughness became 0.125 nmRMS (0.100 nmRa).

一般的に、回転球型加工ヘッド方式EEMは、高周波数領域及び中周波数領域での表面粗さの改善に適し、ノズル型加工ヘッド方式EEMは、低周波数領域での形状修正に適している。従って、先ずノズル型加工ヘッド方式EEMによって所定精度で表面形状を創成した後、回転球型加工ヘッド方式EEMによって形状精度を維持したまま表面粗さを一様に改善するという加工が最も好ましい。 In general, the rotary spherical processing head type EEM is suitable for improving the surface roughness in the high frequency region and the medium frequency region, and the nozzle type processing head type EEM is suitable for shape correction in the low frequency region. Therefore, it is most preferable that the surface shape is first created with a predetermined accuracy by the nozzle type processing head method EEM, and then the surface roughness is uniformly improved while maintaining the shape accuracy by the rotary ball type processing head method EEM.

[表面処理工程]
表面処理工程は、水を含む処理液と、触媒金属表面とを相互作用させ、触媒機能によって光学素子材料1の直接的な加水分解あるいは光学素子材料1の酸化と該酸化膜の加水分解を進行させ、加水分解による分解生成物を光学素子材料1から除去する触媒援用エッチングプロセスを用いて、光学素子材料表面2のうち少なくとも反射面となる表面に付着した前記加工微粒子4を含む付着微粒子3を除去する工程である。光学素子材料1が酸化物であれば、直接的な加水分解になり、酸化物でなければ、酸化と該酸化膜の加水分解を進行させることになる。
[Surface treatment process]
In the surface treatment step, the treatment liquid containing water interacts with the surface of the catalytic metal, and the catalytic function proceeds with the direct hydrolysis of the optical element material 1 or the oxidation of the optical element material 1 and the hydrolysis of the oxide film. Using a catalyst-assisted etching process for removing the decomposition products due to hydrolysis from the optical element material 1, the adhered fine particles 3 containing the processed fine particles 4 attached to at least the surface of the optical element material surface 2 to be a reflective surface are removed. This is the process of removing. If the optical element material 1 is an oxide, it will be directly hydrolyzed, and if it is not an oxide, oxidation and hydrolysis of the oxide film will proceed.

前記触媒援用エッチングプロセスは、光学素子材料の酸化と、酸化物あるいは酸化膜の加水分解の双方を促進する触媒金属を用いて、光学素子材料が酸化物でなければ、触媒金属に接触する光学素子材料の表面を酸化させ、更に水分子が解離して酸化膜を構成する酸素元素と他の元素のバックボンドを切って吸着し、加水分解による分解生成物の生成を水中に溶出させ、光学素子材料が酸化物であれば、水分子が解離して酸化物を構成する酸素元素と他の元素のバックボンドを切って吸着し、加水分解による分解生成物の生成を水中に溶出させるのである。ここで、分解生成物に機械的な力を与えることで、水中への溶出を促進させることができる。また、光学素子材料の酸化を促進させために、水を主たる成分とする溶液中に酸化促進剤を添加したり、加水分解による分解生成物の溶解を助ける錯体、例えばアンモニアを添加することもある。また、溶液のpHは加工速度に影響を及ぼすので、溶液にHNO水溶液、リン酸緩衝液、KOH水溶液等を添加してpHを調整することも好ましい。 The catalyst-assisted etching process uses a catalyst metal that promotes both oxidation of the optical element material and hydrolysis of the oxide or oxide film, and if the optical element material is not an oxide, the optical element comes into contact with the catalyst metal. The surface of the material is oxidized, and the water molecules are dissociated to cut and adsorb the back bond between the oxygen element and other elements that make up the oxide film, and the decomposition product produced by hydrolysis is eluted into the water to form an optical element. If the material is an oxide, the water molecules dissociate and cut and adsorb the back bond between the oxygen element and other elements that make up the oxide, and elute the production of decomposition products by hydrolysis into the water. Here, by applying a mechanical force to the decomposition product, elution into water can be promoted. Further, in order to promote the oxidation of the optical element material, an oxidation accelerator may be added to a solution containing water as a main component, or a complex that assists the dissolution of decomposition products by hydrolysis, for example, ammonia may be added. .. Further, since the pH of the solution affects the processing speed, it is also preferable to adjust the pH by adding an HNO 3 aqueous solution, a phosphate buffer solution, a KOH aqueous solution or the like to the solution.

触媒金属として、遷移金属元素が好ましく、電子のd軌道がフェルミレベル近傍であれば良好に使用できる。例えば仕事関数の大きなPtをはじめ、Pd、Ru、Ni、Co、Cr、Mo等を用いることが可能である。更に、触媒金属は、金属元素単体でも、複数の金属元素からなる合金でもよい。 The transition metal element is preferable as the catalyst metal, and it can be used satisfactorily as long as the d-orbital of the electron is near the Fermi level. For example, Pd, Ru, Ni, Co, Cr, Mo, etc., which have a large work function, can be used. Further, the catalyst metal may be a single metal element or an alloy composed of a plurality of metal elements.

本発明の表面処理工程における触媒援用エッチングプロセスは、原理的にはCARE(CAtalyst-Referred Etching)と同じであるが、本発明では触媒を加工基準面とする必要がなく、光学素子材料1の表面2を数原子層だけ付着微粒子3とともに一様に除去できればその目的は達せられる。CAREの加工原理は、特許第5754754号公報、特許第6188152号公報、特許第6206847号公報に詳しく記載されている。 The catalyst-assisted etching process in the surface treatment step of the present invention is basically the same as CARE (CAtalyst-Referred Etching), but in the present invention, the catalyst does not need to be a processing reference surface, and the surface of the optical element material 1 is used. The purpose can be achieved if only a few atomic layers of 2 can be uniformly removed together with the adhered fine particles 3. The processing principle of CARE is described in detail in Japanese Patent No. 5754754, Japanese Patent No. 6188152, and Japanese Patent No. 6206847.

前記表面処理工程は、水を含む処理液の存在下で、触媒金属表面を光学素子材料1の表面2に所定接触圧力で接触させながら該触媒金属表面と光学素子材料表面2を相対的に移動させて該表面2の分解生成物を除去する工程を含む。最も簡単な構成は、図5に示すように除去ユニット31と光学素子材料1とを処理槽(図示せず)内に配置し、水を含む処理液内で相互に接触させながら回転と平行移動を行うものである。図5に示した方式は、いわゆるバッチ処理装置になる。ここで、前記除去ユニット31は、回転軸となるサポート部32の先端に設けた処理パッド33の少なくとも表面に触媒金属を形成した構造である。具体的には、前記処理パッド33は、合成樹脂又はゴムのバルク中に前記触媒金属を埋め込んで、該触媒金属の少なくとも一部がパッド表面に露出した構造、あるいは合成樹脂又はゴム表面に前記触媒金属を成膜した構造である。また、触媒金属細線を処理パッド33の表面に設けても良く、その形態は不織布、織布のどちらでも良い。また、触媒金属細線は、バルクでも、合成繊維の表面に触媒金属をめっきしたものでも良い。 In the surface treatment step, the catalyst metal surface and the optical element material surface 2 are relatively moved while being brought into contact with the surface 2 of the optical element material 1 at a predetermined contact pressure in the presence of a treatment liquid containing water. The step of removing the decomposition product of the surface 2 is included. In the simplest configuration, as shown in FIG. 5, the removal unit 31 and the optical element material 1 are arranged in a processing tank (not shown), and rotate and translate while being in contact with each other in a processing liquid containing water. Is to do. The method shown in FIG. 5 is a so-called batch processing apparatus. Here, the removal unit 31 has a structure in which a catalyst metal is formed on at least the surface of a processing pad 33 provided at the tip of a support portion 32 that serves as a rotation axis. Specifically, the treatment pad 33 has a structure in which the catalyst metal is embedded in a bulk of the synthetic resin or rubber and at least a part of the catalyst metal is exposed on the pad surface, or the catalyst is formed on the synthetic resin or rubber surface. It is a structure in which metal is deposited. Further, the catalyst metal fine wire may be provided on the surface of the processing pad 33, and the form thereof may be either a non-woven fabric or a woven fabric. Further, the thin catalyst metal wire may be bulk or the surface of the synthetic fiber may be plated with the catalyst metal.

また、前記処理液として、触媒金属微粒子をコロイド状に分散させた水を含む処理液を用いることが最も好ましい。この場合、触媒金属を表面に設けた前記処理パッド33の代わりに、CMPで使用される通常の処理パッドを用い、該処理パッド中に触媒金属微粒子を担持させた状態で処理パッド33と光学素子材料表面2を擦り合わせることにより、該光学素子材料表面2の数原子層を前記付着微粒子3とともに除去するのである。勿論、前述の表面に触媒金属を設けた処理パッド33と、触媒金属微粒子をコロイド状に分散させた処理液を併用することも可能である。 Further, as the treatment liquid, it is most preferable to use a treatment liquid containing water in which catalyst metal fine particles are dispersed in a colloidal form. In this case, instead of the processing pad 33 provided with the catalyst metal on the surface, a normal processing pad used in CMP is used, and the processing pad 33 and the optical element are supported with the catalyst metal fine particles supported in the processing pad. By rubbing the material surface 2 together, the several atomic layers of the optical element material surface 2 are removed together with the adhered fine particles 3. Of course, it is also possible to use the treatment pad 33 provided with the catalyst metal on the surface and the treatment liquid in which the catalyst metal fine particles are dispersed in a colloidal form.

ここで、触媒金属の作用によって光学素子材料表面2に形成された分解生成物やパーティクルを該表面2から速やかに移動させるために、図6及び図7に示すように、処理液の強制的な流れを作ることも好ましい。図6及び図7は、前記除去ユニット31のサポート部32の中心に流路34を形成し、図6に示した吐出水流方式の処理装置は、水を含む処理液を、除去ユニット31のサポート部32に設けた流路34に供給し、該除去ユニット31の処理パッド33の周囲から処理液を外側に流す工程と、該除去ユニット31の周囲から処理液を排出する工程(図示せず)とを含むものであり、図7に示した吸引水流方式の処理装置は、水を含む処理液を、除去ユニット31の周囲に処理液を供給する工程(図示せず)と、該除去ユニット31の処理パッド33の周囲から処理液を内側に吸い込んでサポート部32に設けた流路34から排出する工程とを含むものである。図6及び図7中符号Qは水を含む処理液の流れを示している。ここで、図6に示した構成において、除去ユニット31の処理パッド33の周囲から外側に流した処理液を、オーバーフローにより洗浄領域から排出される工程を含むようにしても良い。いわゆる掛け流し処理である。 Here, as shown in FIGS. 6 and 7, in order to rapidly move the decomposition products and particles formed on the surface 2 of the optical element material by the action of the catalyst metal from the surface 2, the treatment liquid is forced. It is also preferable to make a flow. 6 and 7 show a flow path 34 formed at the center of the support portion 32 of the removal unit 31, and the discharge water flow type treatment device shown in FIG. 6 supports the treatment liquid containing water with the removal unit 31. A step of supplying the treatment liquid to the flow path 34 provided in the unit 32 and flowing the treatment liquid outward from the periphery of the treatment pad 33 of the removal unit 31 and a step of discharging the treatment liquid from the periphery of the removal unit 31 (not shown). The suction water flow type treatment apparatus shown in FIG. 7 includes a step (not shown) of supplying the treatment liquid containing water to the periphery of the removal unit 31 and the removal unit 31. This includes a step of sucking the treatment liquid inward from the periphery of the treatment pad 33 and discharging the treatment liquid from the flow path 34 provided in the support portion 32. Reference numerals Q in FIGS. 6 and 7 indicate the flow of the treatment liquid containing water. Here, in the configuration shown in FIG. 6, a step of discharging the treatment liquid flowing from the periphery of the treatment pad 33 of the removal unit 31 to the outside from the cleaning region by overflow may be included. This is a so-called flowing process.

図6の吐出水流方式の処理装置の除去ユニット31の周囲から処理液を排出する工程(手段)は、除去ユニット31の周囲に配置した吸い上げパイプ若しくは除去ユニット31に設けた吸い上げ流路で構成できる。図7の吸引水流方式の処理装置における除去ユニット31の周囲に処理液を供給する工程(手段)は、除去ユニット31の周囲に配置した吐出パイプ若しくは除去ユニット31に設けた吐出流路で構成できる。勿論、図6及び図7に示した構成を処理槽内に配置し、処理槽内の処理液中で処理を行うようにすれば、図6の除去ユニットの周囲から処理液を排出する工程(手段)と、図7の除去ユニットの周囲に処理液を供給する工程は処理槽内の処理液溜まりに対する処理液の出し入れで代用できる。つまり、吐出水流方式の処理装置における処理液を排出する工程(手段)は、処理槽内の処理液溜まりに混合する工程に相当し、吸引水流方式の処理装置における除去ユニット31の周囲に処理液を供給する工程は、処理槽内の処理液溜まりから処理液を吸い込む工程に相当する。 The step (means) of discharging the treatment liquid from the periphery of the removal unit 31 of the discharge water flow type processing device of FIG. 6 can be configured by a suction pipe arranged around the removal unit 31 or a suction flow path provided in the removal unit 31. .. The step (means) of supplying the treatment liquid around the removal unit 31 in the suction water flow type treatment device of FIG. 7 can be configured by a discharge pipe arranged around the removal unit 31 or a discharge flow path provided in the removal unit 31. .. Of course, if the configurations shown in FIGS. 6 and 7 are arranged in the treatment tank and the treatment is performed in the treatment liquid in the treatment tank, the process of discharging the treatment liquid from the periphery of the removal unit of FIG. 6 ( Means) and the step of supplying the treatment liquid around the removal unit of FIG. 7 can be substituted by putting in and taking out the treatment liquid with respect to the treatment liquid pool in the treatment tank. That is, the step (means) of discharging the treatment liquid in the discharge water flow type treatment device corresponds to the step of mixing with the treatment liquid pool in the treatment tank, and the treatment liquid is around the removal unit 31 in the suction water flow type treatment device. The step of supplying the treatment liquid corresponds to the step of sucking the treatment liquid from the treatment liquid pool in the treatment tank.

図8は、回転水流方式の処理装置を示している。除去ユニット31として、EEMで使用するような弾性回転球35と水を含む処理液中に触媒金属微粒子をコロイド状に分散させた処理液を用い、該弾性回転球35の回転によって光学素子材料表面2に沿った処理液の流れQを作り、処理領域から分解生成物やパーティクルを該表面2から速やかに移動させることができる。 FIG. 8 shows a rotating water flow type processing device. As the removal unit 31, a treatment liquid in which catalyst metal fine particles are colloidally dispersed in a treatment liquid containing an elastic rotating sphere 35 and water as used in EEM is used, and the surface of the optical element material is rotated by the rotation of the elastic rotating sphere 35. It is possible to create a flow Q of the treatment liquid along No. 2 and quickly move decomposition products and particles from the surface 2 from the treatment region.

[洗浄工程]
洗浄工程は、前記表面処理工程によって光学素子材料表面2の付着微粒子3を除去した後、当該表面処理工程によって付着する金属系微粒子6を、酸若しくはアルカリ溶液により、溶解除去させる工程である。
[Washing process]
The cleaning step is a step of removing the adhered fine particles 3 on the surface 2 of the optical element material by the surface treatment step, and then dissolving and removing the metallic fine particles 6 adhered by the surface treatment step with an acid or an alkaline solution.

前記光学素子材料がSi単結晶又は酸化物であると、表面に付着する金属系微粒子は該表面構成と全く異質な物質であるので、金属系微粒子のみを洗浄工程によって選択的に溶解除去することが容易である。 When the optical element material is a Si single crystal or an oxide, the metal-based fine particles adhering to the surface are substances completely different from the surface composition. Therefore, only the metal-based fine particles should be selectively dissolved and removed by a cleaning step. Is easy.

A 光学素子
1 光学素子材料
2 表面
3 付着微粒子
4 加工微粒子
5 汚染微粒子
6 金属系微粒子
11 弾性回転球
21 加工ノズル
22 噴出口
31 除去ユニット
32 サポート部
33 処理パッド
34 流路
35 弾性回転球
P 加工液の流れ
Q 処理液の流れ

A Optical element 1 Optical element Material 2 Surface 3 Adhering fine particles 4 Processed fine particles 5 Contaminated fine particles 6 Metal-based fine particles 11 Elastic rotating sphere 21 Processing nozzle 22 Ejection 31 Removal unit 32 Support 33 Processing pad 34 Flow path 35 Elastic rotating sphere P processing Liquid flow Q Treatment liquid flow

Claims (12)

光学素子材料と化学的な反応性のある加工微粒子を分散した加工液を加工面に沿って流動させて、該加工微粒子と加工面界面での化学的な相互作用により、該加工微粒子に化学結合した表面原子を、加工液の煎断流によって該加工微粒子と共に除去するEEMプロセスを用いて、所望精度の表面を創成するEEM加工工程と、
遷移金属元素からなる触媒金属微粒子を分散させた水を含む処理液の存在下で、処理パッドと被処理物表面とを接触させながら相対的に変位させ、水と触媒金属表面とを相互作用させ、光学素子材料表面に接触した触媒金属の触媒機能によって光学素子材料の直接的な加水分解あるいは光学素子材料の酸化と該酸化膜の加水分解を進行させ、加水分解による分解生成物を光学素子材料から除去する、加工基準面を有しない触媒援用エッチングプロセスを用いて、光学素子材料表面のうち少なくとも反射面となる表面を、該表面に付着した前記加工微粒子を含む付着微粒子とともに一様に除去する表面処理工程と、
により製作されることを特徴とする、光学素子の製造方法。
A processing liquid in which processed fine particles that are chemically reactive with the optical element material are dispersed is made to flow along the processed surface, and chemically bonded to the processed fine particles by a chemical interaction between the processed fine particles and the interface between the processed particles. An EEM processing step of creating a surface with desired accuracy by using an EEM process of removing the formed surface atoms together with the processed fine particles by decoction of the processing liquid.
In the presence of a treatment liquid containing water in which catalyst metal fine particles composed of transition metal elements are dispersed , the treatment pad and the surface of the object to be treated are relatively displaced while being in contact with each other, and the water and the surface of the catalyst metal interact with each other. The catalytic function of the catalytic metal in contact with the surface of the optical element material promotes the direct hydrolysis of the optical element material or the oxidation of the optical element material and the hydrolysis of the oxide film, and the decomposition product due to the hydrolysis is used as the optical element material. Using a catalyst-assisted etching process that does not have a processing reference surface, at least the surface of the optical element material, which is a reflective surface, is uniformly removed together with the adhered fine particles including the processed fine particles adhering to the surface. Surface treatment process and
A method of manufacturing an optical element, which is characterized by being manufactured by.
前記EEM加工工程は、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、高周波数領域(1μm×1μm領域)において、表面粗さが0.13nmRMS以下になるような加工を行う工程、
弾性回転球の回転により加工面に沿った前記加工液の高剪断流を形成する回転球型加工ヘッドにより、中周波数領域(100μm×100μm領域)において、表面粗さが0.15nmRMS以下になるような加工を行う工程、
前記回転球型加工ヘッドによる単位加工痕又は前記加工液をノズルから噴出させ、加工面に沿った加工液の高剪断流を形成するノズル型加工ヘッドによる単位加工痕を、加工面に対して相対的に走査するとともに、加工ヘッドの滞在時間を数値制御して空間的に除去量を決める数値制御EEMにより、低周波数領域(1mm以上から前記反射面の有効領域)において、形状誤差が1nmRMS以下になるような加工を行う工程、
のうち少なくとも1つの工程を含む、請求項1記載の光学素子の製造方法。
The EEM processing step is
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.13 nm RMS or less in the high frequency region (1 μm × 1 μm region). Processing process,
The rotating sphere-shaped processing head that forms a high shear flow of the processing liquid along the processing surface by the rotation of the elastic rotating sphere so that the surface roughness becomes 0.15 nm RMS or less in the medium frequency region (100 μm × 100 μm region). Processing process,
Unit machining marks by the rotary spherical machining head or unit machining marks by the nozzle-type machining head that eject the machining fluid from the nozzle to form a high shear flow of the machining fluid along the machining surface are relative to the machining surface. In the low frequency region (from 1 mm or more to the effective region of the reflective surface), the shape error is reduced to 1 nm RMS or less by numerically controlling EEM that numerically controls the residence time of the processing head and spatially determines the removal amount. The process of processing
The method for manufacturing an optical element according to claim 1, which comprises at least one step.
前記処理パッドは、少なくとも表面に遷移金属元素からなる触媒金属を有する構造で、該触媒が加工基準面とならない、請求項1又は2記載の光学素子の製造方法。 The method for manufacturing an optical element according to claim 1 or 2 , wherein the processing pad has a structure having a catalyst metal composed of a transition metal element at least on its surface, and the catalyst does not serve as a processing reference surface . 前記処理パッドとして、CMP用処理パッド中に前記触媒金属微粒子を担持させた構造の処理パッドを用いる、請求項記載の光学素子の製造方法。 The method for manufacturing an optical element according to claim 3 , wherein a processing pad having a structure in which the catalyst metal fine particles are supported in a CMP processing pad is used as the processing pad . 前記処理パッドとして、表面に触媒金属細線からなる不織布若しくは織布を設けた構造の処理パッドを用いる、請求項記載の洗浄方法。 The cleaning method according to claim 3 , wherein the processing pad has a structure in which a non-woven fabric or a woven fabric made of a thin catalyst metal wire is provided on the surface . 前記表面処理工程によって光学素子材料表面の付着微粒子を除去した後、当該表面処理工程によって付着する金属系微粒子を、酸若しくはアルカリ溶液により、溶解除去させる洗浄工程を含むことを特徴とする、請求項1〜5何れか1項に記載の光学素子の製造方法。 The claim comprises a cleaning step of removing adhered fine particles on the surface of the optical element material by the surface treatment step, and then dissolving and removing the metallic fine particles adhering by the surface treatment step with an acid or an alkaline solution. The method for manufacturing an optical element according to any one of 1 to 5. 前記表面処理工程での水を含む処理液の流れは、除去ユニットに処理液を供給して該除去ユニットの周囲から処理液を外側に流す工程と、該除去ユニットの周囲から処理液を排出する工程とを含む、請求項1〜6何れか1項に記載の光学素子の製造方法。 The flow of the treatment liquid containing water in the surface treatment step includes a step of supplying the treatment liquid to the removal unit and flowing the treatment liquid to the outside from the periphery of the removal unit, and discharging the treatment liquid from the periphery of the removal unit. The method for manufacturing an optical element according to any one of claims 1 to 6, which includes a step. 前記表面処理工程での水を含む処理液の流れは、除去ユニットの周囲に処理液を供給する工程と、該除去ユニットの周囲から処理液を内側に吸い込んで排出する工程とを含む、請求項1〜6何れか1項に記載の光学素子の製造方法。 A claim that the flow of the treatment liquid containing water in the surface treatment step includes a step of supplying the treatment liquid around the removal unit and a step of sucking the treatment liquid inward from the periphery of the removal unit and discharging the treatment liquid. The method for manufacturing an optical element according to any one of 1 to 6. 前記表面処理工程での水を含む処理液の流れは、除去ユニットに処理液を供給して該除去ユニットの周囲から処理液を外側に流す工程と、その処理液がオーバーフローにより洗浄領域から排出される工程を含む、請求項1〜6何れか1項に記載の光学素子の製造方法。 The flow of the treatment liquid containing water in the surface treatment step is a step of supplying the treatment liquid to the removal unit and flowing the treatment liquid to the outside from the periphery of the removal unit, and the treatment liquid is discharged from the cleaning region due to overflow. The method for manufacturing an optical element according to any one of claims 1 to 6, which includes the steps of 前記表面処理工程は、水を含む処理液が入った処理槽内で、バッチ処理されることを特徴とする、請求項1〜6何れか1項に記載の光学素子の製造方法。 The method for manufacturing an optical element according to any one of claims 1 to 6, wherein the surface treatment step is batch-treated in a treatment tank containing a treatment liquid containing water. 前記光学素子材料が、Si単結晶又は酸化物である、請求項1〜10何れか1項に記載の光学素子の製造方法。 The method for manufacturing an optical element according to any one of claims 1 to 10, wherein the optical element material is a Si single crystal or an oxide. 前記表面処理工程における水を含む処理液は、純水又は超純水に、酸化促進剤、pH調整液、緩衝液、分解生成物の溶解を助ける錯体溶液の少なくとも1種を混合したものである、請求項1〜11何れか1項に記載の光学素子の製造方法。 The treatment solution containing water in the surface treatment step is a mixture of pure water or ultrapure water mixed with at least one of an oxidation accelerator, a pH adjusting solution, a buffer solution, and a complex solution that helps dissolve decomposition products. The method for manufacturing an optical element according to any one of claims 1 to 11 .
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