JP6832002B2 - Solder transfer device - Google Patents

Description

The present invention relates to a solder transfer device that transfers linear solder drawn from a bobbin toward a soldering site when various electronic components are soldered to a printed circuit board.

For example, when an electronic component such as a semiconductor chip is soldered to a printed circuit board with a soldering robot, a solder transfer device is used. As disclosed in Patent Document 1, this solder transfer device is arranged in the middle of the solder transfer path by inserting the linear solder drawn from the bobbin into the solder transfer path formed in the body. It is configured to transfer the linear solder to the soldering site through the solder supply nozzle by sandwiching it between the driven roller and the driven roller and driving and rotating the drive roller.

However, in the conventional solder transfer device, the solder transfer path is formed by a hole penetrating the body, and the line is configured so that the linear solder is inserted into the inside of the solder transfer path formed by the hole. When using a solder with a wire diameter of 1 mm or more, it is relatively easy to insert it into the solder transfer path because the wire solder has a certain degree of rigidity, but the wire diameter is less than 1 mm. In particular, when using an ultra-fine linear solder such as 0.15-0.3 mm, the linear solder is very flexible and has a weak waist, so that it is very difficult to insert it into the solder transfer path.

Japanese Unexamined Patent Publication No. 2004-216426

The technical problem of the present invention is that even when a linear solder having a small wire diameter is used, the linear solder can be easily and surely inserted into the solder transfer path, and the solder transfer is excellent in usability. To provide the equipment.

In order to solve the above problems, in the present invention, the solder introduction port for introducing the linear solder, the solder outlet for deriving the linear solder, and the solder introduction port and the solder outlet are linearly arranged. A solder transfer device having a solder transfer path to be connected and a transfer mechanism for transferring linear solder along the solder transfer path has a body and a cover detachably attached to a cover mounting surface of the body. , A transfer path forming groove for forming a solder transfer path is formed in the body so as to open to the cover mounting surface, and the transfer path forming groove has a groove main body having a constant groove width and an outside opening to the cover mounting surface. and a solder insertion opening in which the spread-like, the cover, the transport path forming wall tip fitted to the transport path forming the groove extending to a position close to the groove bottom of the groove main portion is formed, the transfer A solder transfer path is defined between the path forming wall and the groove bottom of the groove main body , and the body is composed of a first groove forming member and a second groove forming member whose facing surfaces face each other via the transfer path forming groove. On the facing surface of the first groove forming member, a flat surface forming one groove wall of the groove main body portion and a first inclined surface forming one mouth wall of the solder insertion port are formed. On the facing surface of the two-groove forming member, a concave step surface forming the other groove wall of the groove main body portion and a second inclined surface forming the other mouth wall of the solder insertion port are formed to form the first groove. A groove main body is formed between the flat surface of the member and the concave surface of the second groove forming member, and the first inclined surface of the first groove forming member and the second inclined surface of the second groove forming member are formed. It is characterized in that a solder insertion port is formed between them.

In the present invention, preferably, a guide plate is provided at the end of the cover to cover the first end surface of the body through which the solder introduction port opens, and the guide plate is formed with a guide portion for guiding the linear solder to the solder introduction port. The guide portion is composed of a U-shaped guide groove facing the solder introduction port and a guide wall having an outward spread shape connected to both groove walls of the guide groove.

Further, in the present invention, the transfer mechanism has a transfer unit drive roller and a transfer unit driven roller facing each other via a solder transfer path, and the roller shaft of the transfer unit drive roller projects to the outside of the body, and the transfer path is provided by the roller shaft. It is desirable that the drive roller can be rotated.

In the solder transfer device of the present invention, since the solder transfer path is defined by the transfer path forming groove formed in the body and the transfer path forming wall formed in the cover, the linear solder is inserted into the solder transfer path. When the soldering is performed, the linear solder is housed in the transfer path forming groove through the opening with the cover removed, and then the cover is attached and the transfer path forming wall is fitted into the transfer path forming groove to fit the transfer path. A linear solder is inserted into the solder transfer path defined by the forming groove and the transfer path forming wall. Therefore, even a linear solder having a small wire diameter can be easily and surely inserted into the solder transfer path.

It is a side view which shows 1st Embodiment of the solder transfer apparatus which concerns on this invention. It is a rear view of the solder transfer device of FIG. It is a perspective view which looked at the solder transfer apparatus of FIG. 1 from the diagonally upper right. It is a perspective view which looked at the solder transfer apparatus of FIG. 1 from the diagonally upper left. It is an enlarged cross-sectional view along the VV line of FIG. It is an enlarged cross-sectional view along the VI-V line I of FIG. It is an exploded perspective view which shows the solder transfer apparatus of FIG. 3 separated some parts. It is a perspective view which looked at the cover from diagonally below. It is an enlarged view of the main part of FIG. It is a partially enlarged cross-sectional view along the X-ray line of FIG. 10 is a cross-sectional view of FIG. 10 with the cover removed. It is a figure for demonstrating the process of inserting a linear solder into a solder insertion hole, and is the top view in the state which the solder supply needle and a cover are removed. It is a perspective view which shows the 2nd Embodiment of the solder transfer apparatus which concerns on this invention. It is an exploded view of FIG. It is a perspective view of the cover in the solder transfer apparatus of 2nd Embodiment.

1 to 12 show a first embodiment of a solder transfer device according to the present invention. The solder transfer device 100A is assembled to, for example, a soldering robot, and automatically mounts electronic components such as semiconductor chips on a printed circuit board. It is used to automatically supply linear solder to each soldering site when soldering, and in particular, it is extremely fine with a wire diameter of 0.15-0.3 mm. It is suitable when using the linear solder of.

As shown in FIGS. 1 to 7, the solder transfer device 100A includes a device main body 1, a bobbin support portion 2 arranged on one side of the device main body 1, and a nozzle portion provided on the other side of the device main body 1. Has 3 and. The bobbin support portion 2 is a portion for supporting the bobbin 4 around which the linear solder 5 is wound, and the nozzle portion 3 is a portion for supplying the linear solder 5 to the soldering portion through the solder supply nozzle 6. is there.
In the following description, regarding the device main body 1, the side where the nozzle portion 3 is provided is the front side, the side where the bobbin support portion 2 is provided is the back surface, and the top and bottom and left and right are viewed from the front side. Say the direction of the case.

As is clear from FIG. 5, the apparatus main body 1 has a solder introduction port 10 for introducing the linear solder 5 drawn from the bobbin 4, and a solder for deriving the linear solder 5 toward the nozzle portion 3. The lead-out port 11, the solder transfer path 12 that linearly connects the solder introduction port 10 and the solder out-out port 11, the transfer mechanism 13 that transfers the linear solder 5 along the solder transfer path 12, and the linear solder 5 It has a detection mechanism 14 that converts the transfer into an electric signal and detects it. The solder introduction port 10 is provided on the first end surface 15a facing the bobbin support portion 2 side (rear side) of the device main body 1, and the solder outlet 11 is the side (front side) to which the nozzle portion 3 of the device main body 1 is attached. ) Is provided on the second end surface 15b.

As can be seen from FIGS. 6 and 7, the transfer mechanism 13 is a transfer unit drive arranged so as to be rotatable around the axes L1 and L2 parallel to each other at positions facing each other via the solder transfer path 12. It has a roller 13a and a transfer unit driven roller 13b. The transfer unit drive roller 13a is connected to a drive motor 16 disposed inside the apparatus main body 1, and the transfer unit driven roller 13b is arranged so as to follow the transfer unit drive roller 13a and rotate in a driven manner. When the partial drive roller 13a is driven and rotated by the drive motor 16, the linear solder 5 sandwiched between the rollers 13a and 13b is configured to be transferred along the solder transfer path 12. The drive motor 16 is a pulse motor whose rotation is controlled in the forward and reverse directions by a drive pulse.

Further, the detection mechanism 14 is arranged at positions facing each other via the solder transfer path 12 so as to be rotatable around the axes L3 and L4 parallel to each other and parallel to the axes L1 and L2. It has a 14a and a detection unit driven roller 14b, and is configured so that both rollers 14a and 14b rotate following the transfer of the linear solder 5. An encoder (not shown) arranged inside the apparatus main body 1 is connected to the detection unit drive roller 14a, and when the detection unit drive roller 14a rotates, the transfer amount of the linear solder 5 is an electric signal (pulse) by the encoder. It is converted into a signal) and detected, and the detection signal is fed back to a control device (not shown) to be used for controlling the drive motor 16.

The configuration of the device main body 1 will be described in more detail. The device main body 1 has a body 20 and a cover 22 detachably attached to a cover mounting surface 21 on the upper surface of the body 20. Further, the body 20 has a base portion 23, a roller support portion 24 provided on the upper portion of the base portion 23, and a groove forming portion 25 provided on the upper portion of the roller support portion 24.

The base portion 23 is a portion that is the basis of the apparatus main body 1, and has a hollow box shape. The drive motor 16 and the encoder are housed therein, and the bobbin support portion 2 extends from one end thereof. ..

The roller support portion 24 is displaced in a direction orthogonal to the solder transfer path 12 via a pair of guide rails 28 (see FIGS. 6 and 12) on the upper surface of the fixing plate 24a fixed to the base portion 23 and the fixing plate 24a. It has a movable plate 24b arranged so as to be flexible, and the transfer unit drive roller 13a of the transfer mechanism 13 is supported by the fixed plate 24a via the support shaft 13d, and the detection unit drive roller of the detection mechanism 14 is supported. 14a is supported via a support shaft (not shown), the transfer portion driven roller 13b of the transfer mechanism 13 is supported by the movable plate 24b via the support shaft 13e, and the detection unit driven roller 14b of the detection mechanism 14 is supported. It is supported via a support shaft (not shown).

Further, in the movable plate 24b, by tightening or loosening the clamp screw 29, linear solder 5 is placed between the opposing rollers 13a and 13b of the transfer mechanism 13 and between the opposing rollers 14a and 14b of the detection mechanism 14, respectively. The sandwiching position and the release position where the opposing rollers 13a and 13b of the transfer mechanism 13 and the opposing rollers 14a and 14b of the detection mechanism 14 are separated from each other and release the linear solder 5 are displaced. It is configured.

That is, when the clamp screw 29 is tightened and the movable plate 24b is displaced to the sandwiching position, as shown in FIGS. 5 and 6, the transfer portion driven roller 13b of the transfer mechanism 13 is positioned close to the transfer portion drive roller 13a. Along with the displacement, the detection unit driven roller 14b of the detection mechanism 14 is displaced to a position close to the detection unit drive roller 14a, and the linear solder 5 is clamped between the transfer mechanism 13 and the opposing rollers of the detection mechanism 14, respectively. In this case, the holding position of the movable plate 24b is strictly set by a stopper mechanism (not shown) so that the solder holding interval between the opposing rollers matches the wire diameter of the linear solder 5.

Further, when the clamp screw 29 is loosened and the movable plate 24b is retracted to the release position, as shown in the chain line position in FIG. 6 and the solid line position in FIG. 12, the transfer unit driven roller 13b of the transfer mechanism 13 changes to the transfer unit drive roller 13a. The detection unit driven roller 14b of the detection mechanism 14 is displaced to a position separated from the detection unit drive roller 14a, and the holding state of the linear solder 5 is released. Then, in this state, as will be described later, the work of inserting the linear solder 5 into the solder transfer path 12 is performed.

The groove forming portion 25 is a portion that forms the solder transfer path 12 in cooperation with the cover 22, and as is clear from FIG. 7, the groove forming portion 25 faces the left side and the right side of the body 20 via the solder transfer path 12. The first groove forming member 25a and the second groove forming member 25b are arranged so that the side surfaces which are the surfaces face each other, and these first groove forming member 25a and the second groove are connected to each other by the coupling screw 30. A transfer path forming groove 31 for forming the solder transfer path 12 is formed between the forming member 25b and the cover mounting surface 21 which is the upper surface of the body 20. As shown in FIGS. 10 and 11, the transfer path forming groove 31 has a Y-shaped cross-sectional shape, and is outside the groove body portion 31a on the groove bottom side having a constant groove width and the cover mounting surface 21. It has a solder insertion port 31b that opens in a wide shape, and the direction of the depth D of the transfer path forming groove 31 is a direction parallel to the axes L1, L2, L3, and L4 of the rollers 13a, 13b, 14a, and 14b. is there.

The transfer path forming groove 31 is formed as follows. That is, a flat surface 32 that forms one of the left and right groove walls of the groove main body 31a on the facing surface of the first groove forming member 25a, and one of the left and right mouth walls of the solder insertion port 31b. A first inclined surface 33 forming a wall is formed, and a concave step surface 34 forming the other groove wall of the groove main body 31a and the other of the solder insertion port 31b are formed on the facing surface of the second groove forming member 25b. The second inclined surface 35 forming the mouth wall is formed, and the first groove forming member 25a and the second groove forming member 25b are joined to each other by the coupling screw 30 to form the first groove forming member 25a. A groove main body 31a is formed between the flat surface 32 and the concave surface 34 of the second groove forming member 25b, and the first inclined surface 33 of the first groove forming member 25a and the second groove forming member 25b are formed. A solder insertion port 31b is formed between the two inclined surfaces 35. The first inclined surface 33 and the second inclined surface 35 are surfaces that are inclined in opposite directions at the same angle with respect to the virtual plane that divides the transfer path forming groove 31 into two left and right.

The groove width W1 of the groove main body 31a is formed to be slightly larger than the wire diameter of the linear solder 5.
Further, the opening width W2 of the solder insertion port 31b is about 5 to 15 times the groove width W1 of the groove main body 31a, and the depth D2 of the solder insertion port 31b is 1/2 of the depth D1 of the groove main body 31a. In the illustrated embodiment, the opening width W2 of the solder insertion port 31b is formed to be about 10 times the groove width W1 of the groove main body 31a, and the depth D2 of the solder insertion port 31b is formed to be about -1 times. , The groove body portion 31a is formed to be equal to or slightly smaller than the depth D1. This not only facilitates the work of inserting the linear solder 5 into the groove main body 31a through the solder insertion port 31b, but also into the groove main body 31a when the cover 22 is attached to the body 20 as described later. The transfer path forming wall 46 can be fitted smoothly and reliably through the solder insertion port 31b.

Further, as is clear from FIGS. 5 and 12, the first groove forming member 25a has a circular relief hole 36a into which the transfer portion drive roller 13a is fitted and a circular relief hole 36a into which the detection portion drive roller 14a is fitted. Holes 37a are formed, and in the second groove forming member 25b, an elongated hole-shaped escape hole 36b into which the transfer portion driven roller 13b is fitted and an elongated hole-shaped escape hole 37b into which the detection portion driven roller 14b is fitted are formed. Are formed, and the opposing escape holes 36a and 36b and 37a and 37b communicate with each other.

As is clear from FIG. 8, the cover 22 integrally connects the first cover member 22a and the second cover member 22b arranged so as to face each other via the solder transfer path 12 with a cover coupling screw 40. By screwing the cover mounting screw 41 into the screw hole 43 of the cover mounting surface 21, the cover mounting screw 41 is detachably attached to the body 20.
Two positioning pins 44 having a tapered conical shape are formed on the inner surface of the cover 22, and the positioning pins 44 are fitted into the conical positioning holes 45 of the cover mounting surface 21 to fit the body 20. The cover 22 is positioned with respect to the relative.

Further, as can be seen from FIG. 11, a thin plate-shaped transfer path forming wall 46 extending along the joint portion between the first cover member 22a and the second cover member 22b is formed on the inner surface of the cover 22, and the cover 22 is formed. Is attached to the body 20, as shown in FIG. 10, the transfer path forming wall 46 fits into the transfer path forming groove 31, and its tip extends to a position close to the groove bottom of the transfer path forming groove 31. As a result, the solder transfer path 12 is defined between the tip of the transfer path forming wall 46 and the groove bottom of the transfer path forming groove 31. Therefore, the height H1 of the portion of the transfer path forming wall 46 that fits in the transfer path forming groove 31 is formed to be smaller than the depth D of the transfer path forming groove 31 by the vertical width S of the solder transfer path 12. Has been done.
The two cuts 46a formed at the intermediate positions of the transfer path forming wall 46 are cuts for escaping from the rollers of the transfer mechanism 13 and the detection mechanism 14.

In the illustrated embodiment, the transfer path forming wall 46 is integrally formed with the second cover member 22b, but the transfer path forming wall 46 can also be integrally formed with the first cover member 22a. Alternatively, it can be formed into an independent member and integrally connected to the cover 22.

Further, a shaft lead-out hole 47 is formed in the first cover member 22a, and the roller shaft 13c of the transfer unit drive roller 13a of the transfer mechanism 13 projects from the shaft lead-out hole 47 to the outside. By rotating the 13c with a finger, the linear solder 5 sandwiched between the transfer unit drive roller 13a and the transfer unit driven roller 13b can be advanced or retracted.
The other rollers and roller shafts of the transfer mechanism 13 and the detection mechanism 14 are covered with a cover 22.

A guide plate 48 that covers a part of the first end surface 15a through which the solder introduction port 10 of the body 20 opens is attached to one end of the cover 22, and the linear solder 5 from the bobbin 4 is soldered to the guide plate 48. A solder guide 49 leading to the mouth 10 is formed. As shown in FIG. 9, the solder guide 49 has a U-shaped guide groove 49a facing the solder introduction port 10 and guide walls 49b and 49b having an outward spread shape connected to both groove walls of the guide groove 49a. However, the wall surface of the guide wall 49b has a curved surface that is convex outward.

By providing such a guide plate 48, even if the introduction angle of the linear solder 5 drawn out from the bobbin 4 and introduced into the solder introduction port 10 at the time of soldering changes due to a change in the drawing position, the guide wall The linear solder 5 is surely guided to the solder introduction port 10 by the 49b and the guide groove 49a.

Further, the bobbin support portion 2 has a support plate 53 extending from the base portion 23 of the apparatus main body 1, and a bobbin support shaft 54 that rotatably supports the bobbin 4 is provided at the tip of the support plate 53 in a solder transfer path. It is cantilevered in a posture orthogonal to 12 and parallel to the depth direction of the transfer path forming groove 31, and a collar 55 for preventing the bobbin 4 from falling off is detachably attached to the tip of the bobbin support shaft 54. It is attached.

On the other hand, the nozzle portion 3 has a solder supply nozzle 6 and a square block-shaped mounting portion 57 provided at the base end portion of the solder supply nozzle 6, and the mounting portion 57 is attached to the body 20. It is attached to the apparatus main body 1 by being fixed to the nozzle attachment portion 20a formed on the second end surface 15b of the groove forming portion 25 with the nozzle fixing screw 59. The solder supply nozzle 6 extends coaxially with the solder transfer path 12.

In the solder transfer device 100A having the above configuration, the work of inserting the linear solder 5 drawn out from the bobbin 4 into the solder transfer path 12 of the device main body 1 is performed as follows.

First, as shown in FIG. 7, the nozzle portion 3 is removed from the body 20, and the cover mounting screw 41 is loosened to remove the cover 22 from the body 20 (see FIG. 11), and then the clamp is removed as shown in FIG. By loosening the screw 29 and retracting the movable plate 24b to the released position, the transfer unit driven roller 13b of the transfer mechanism 13 is separated from the transfer unit drive roller 13a, and the detection unit driven roller 14b of the detection mechanism 14 is driven by the detection unit. Separated from the roller 14a.

Next, the linear solder 5 wound around the bobbin 4 is pulled out to a length at which the tip passes through the second end surface 15b of the body 20, and the drawn linear solder 5 is placed inside the transfer path forming groove 31 of the body 20. It is accommodated from above through the solder insertion port 31b over the entire length of the transfer path forming groove 31, and is pushed to a position where it contacts the groove bottom of the groove main body 31a as shown in FIG.

Subsequently, when the cover 22 is attached to the cover mounting surface 21 of the body 20 with the cover mounting screw 41, the transfer path forming wall 46 is fitted into the transfer path forming groove 31, and as shown in FIG. 10, the transfer path forming wall is formed. When the tip of the 46 reaches a position close to the bottom of the transfer path forming groove 31, the solder transfer path 12 is defined between the tip of the transfer path forming wall 46 and the groove bottom of the transfer path forming groove 31. The linear solder 5 is housed in the solder.

At that time, as can be seen from FIG. 8, the height H1 of the transfer path forming wall 46 of the cover 22 is formed lower than the height H2 of the positioning pin 44 and the height H3 of the guide plate 48, so that the cover 22 is formed. When attached to the body 20, the transfer path forming wall 46 is fitted into the transfer path forming groove 31 after the cover 22 is positioned with respect to the body 20 by the positioning pin 44 and the guide plate 48. Therefore, in combination with the fact that the solder insertion port 31b having a widened tip is formed in the transfer path forming groove 31, the transfer path forming wall 46 can be smoothly and accurately fitted to the transfer path forming groove 31. Therefore, deformation of the transfer path forming wall 46 and damage to the transfer path forming groove 31 due to a fitting defect are prevented. This effect is the same when the cover 22 is removed from the body 20.

Next, by tightening the clamp screw 29 to displace the movable plate 24b to the holding position and fix it at that position, as shown in FIG. 5 and the chain line in FIG. 12, the transfer unit driven roller of the transfer mechanism 13 The 13b is close to the transfer unit drive roller 13a, and the detection unit driven roller 14b of the detection mechanism 14 is close to the detection unit drive roller 14a, and the linear solder 5 is sandwiched between the opposing rollers with respect to the solder transfer path 12. The insertion work of the linear solder 5 is completed. As a result, even an ultrafine linear solder 5 having a wire diameter of 0.15-0.3 mm can be easily and surely inserted into the solder transfer path 12.

After that, the roller shaft 13c of the transfer unit drive roller 13a protruding from the cover 22 is rotated by a finger to rotate the transfer unit drive roller 13a, whereby the linear solder 5 is retracted and the tip of the linear solder 5 is soldered. If the solder transfer device 100A is returned to the position immediately before protruding from the lead-out port 11 and the nozzle portion 3 is attached to the body 20 as shown in FIGS. 1 to 5, the solder transfer device 100A becomes usable.

When the transfer unit drive roller 13a of the transfer mechanism 13 is driven and rotated at a required angle by the drive motor 16 when the solder transfer device 100A is used, the linear solder 5 is driven by the required amount toward the soldered portion through the nozzle unit 3. Will be supplied. At this time, the detection unit drive roller 14a and the detection unit driven roller 14b rotate in conjunction with the transfer of the linear solder 5, the transfer amount of the linear solder 5 is converted into an electric signal by the encoder, and the detection signal is controlled. By feeding back to the device, it is used for controlling the drive motor 16.

13 to 15 show a second embodiment of the solder transfer device, and the main difference between the solder transfer device 100B of the second embodiment and the solder transfer device 100A of the first embodiment is the solder transfer device. In 100A, the solder insertion port 31b of the transfer path forming groove 31 opens on the upper surface of the body 20, and all the rollers 13a, 13b, 14a, 14b are provided on the body 20, whereas the second embodiment is performed. In the solder transfer device B of the embodiment, the solder insertion port 31b of the transfer path forming groove 31 opens on the side surface of the body 20, and the transfer unit drive roller 13a and the detection unit drive roller 14a are provided on the body 20 to provide the transfer unit. The point is that the driven roller 13b and the detection unit driven roller 14b are provided on the cover 22. Further, the solder transfer device B of the second embodiment is different from the solder transfer device 100A of the first embodiment in that the bobbin support shaft 54 of the bobbin support portion 2 is provided sideways.

Hereinafter, the main configuration of the solder transfer device 100B of the second embodiment, which is different from the solder transfer device 100A of the first embodiment, will be described.

First, in the body 20, the first groove forming member 25a and the second groove forming member 25b constituting the groove forming portion 25 are arranged in a vertically overlapped state, and the lower surface of the upper first groove forming member 25a is arranged. A transfer path forming groove 31 is formed laterally between the (opposing surface) and the upper surface (opposing surface) of the lower second groove forming member 25b, and the solder insertion port 31b of the transfer path forming groove 31 is the body 20. It opens on the right side. Therefore, the direction of the depth of the transfer path forming groove 31 is the horizontal direction, and the right side surface of the body 20 is the cover mounting surface 21.

Further, in the body 20, on one side of the solder transfer path 12 (opposite the cover mounting surface 21), the transfer unit drive roller 13a and the detection unit drive roller 14a are in a posture in which the axes L1 and L2 are oriented in the vertical direction. The transfer path forming groove 31 crosses the arrangement so as to straddle the upper first groove forming member 25a and the lower second groove forming member 25b, in other words, substantially the center position of the vertical width of the side surfaces of the rollers 13a and 14a. In such an arrangement, the transfer part driven roller 13b and the detection part driven roller 14b attached to the cover 2 are fitted to the other side (cover mounting surface 21 side) of the solder transfer path 12 so as to be rotatable. The recesses 61 and 62 are formed so as to be cut from the cover mounting surface 21 side toward the transfer unit drive roller 13a and the detection unit drive roller 14a.
Therefore, the direction of the depth of the transfer path forming groove 31 and the axis L1 of the transfer unit drive roller 13a and the axis L2 of the detection unit drive roller 14a are orthogonal to each other.

On the other hand, as can be seen from FIG. 15, the cover 22 covers the first cover member 22a and the second cover member 22b arranged vertically, and the third cover member 22c that covers a part of the upper surface of the body 20. The transfer path forming wall 46 is formed at the boundary between the first cover member 22a and the second cover member 22b, and the third cover member 22c is formed by integrally connecting with the coupling screw 40. The transfer unit driven roller 13b and the detection unit driven roller 14b are supported by the support shafts 13e and 14e so as to be rotatable, respectively. The positional relationship between the transfer path forming wall 46 and the transfer section driven roller 13b and the detection section driven roller 14b is such that the transfer path forming wall 46 is located approximately in the center of the vertical width of the side surfaces of the transfer section driven roller 13b and the detection section driven roller 14b. Is a relationship that is located.

Then, after inserting the linear solder into the transfer path forming groove 31 with the cover 22 removed from the body 20 as shown in FIG. 14, the cover 22 is attached to the body 20 with a screw (not shown) as shown in FIG. When attached to the cover mounting surface 21 on the side surface of the above, the transfer path forming wall 46 is fitted into the transfer path forming groove 31 and is fitted with the tip of the transfer path forming wall 46 as in the case described with reference to FIGS. 10 and 11. A solder transfer path 12 is defined between the transfer path forming groove 31 and the groove bottom, and the linear solder 5 is accommodated therein. Further, the transfer unit driven roller 13b and the detection unit driven roller 14b are fitted in the recesses 61 and 62, and between the transfer unit drive roller 13a and the transfer unit driven roller 13b, and between the detection unit drive roller 14a and the detection unit driven roller 14a. The linear solder 5 is sandwiched between the rollers 14b and the rollers 14.

Since the configurations and operations of the solder transfer device 100B of the second embodiment other than the above are substantially the same as those of the solder transfer device 100A of the first embodiment, the first embodiment has the same main components as those of the first embodiment. The same reference numerals as those given and the description thereof will be omitted.

The solder transfer devices 100A and 100B of the present invention can be used in a posture in which the direction of the depth D of the transfer path forming groove 31 is oriented vertically or horizontally.
Further, the solder transfer devices 100A and 100B are not limited to the configuration in which the solder supply nozzle 6 is directly attached to the device main body 1, and the device main body 1 and the solder supply nozzle 6 are connected to the solder supply nozzle 6 installed at another place. It may be configured to supply linear solder through a tube.

5 Linear solder 10 Solder introduction port 11 Solder outlet 12 Solder transfer path 13 Transfer mechanism 13a Transfer section drive roller 13b Transfer section driven roller 13c Roller shaft 15a First end surface 20 Body 21 Cover mounting surface 22 Cover 25a First groove forming member 25b 2nd groove forming member 31 Transfer path forming groove 31a Groove body 31b Solder insertion port 32 Flat surface 33 1st inclined surface 34 Concave step surface 35 2nd inclined surface 46 Transfer path forming wall 47 Axis lead-out hole 48 Guide plate 49 Solder Guide part 49a Guide groove 49b Guide wall 100A, 100B Solder transfer device

Claims (3)

Along the solder transfer path, which linearly connects the solder introduction port for introducing the linear solder, the solder outlet for deriving the linear solder, the solder introduction port and the solder outlet, and the solder transfer path. In a solder transfer device having a transfer mechanism for transferring linear solder,
The solder transfer device has a body and a cover detachably attached to the cover mounting surface of the body.
A transfer path forming groove forming a solder transfer path is formed in the body so as to open to the cover mounting surface, and the transfer path forming groove is formed in a groove main body having a constant groove width and an outside opening to the cover mounting surface. It has a widened solder insertion slot and
The cover, the tip fits into the transport path forming the grooves are formed flow path forming wall extending to a position close to the groove bottom of the groove body portion, the groove bottom of the transfer path forming wall and the groove body portion A solder transfer path is defined between them ,
The body has a first groove forming member and a second groove forming member whose facing surfaces face each other via a transfer path forming groove, and one groove of a groove main body portion is provided on the facing surface of the first groove forming member. A flat surface forming the wall and a first inclined surface forming one mouth wall of the solder insertion port are formed, and the other groove wall of the groove main body is formed on the facing surface of the second groove forming member. A concave step surface and a second inclined surface forming the other mouth wall of the solder insertion port are formed, and a groove main body portion is formed between the flat surface of the first groove forming member and the concave step surface of the second groove forming member. Is formed, and a solder insertion port is formed between the first inclined surface of the first groove forming member and the second inclined surface of the second groove forming member.
A solder transfer device characterized by this. A guide plate is provided at the end of the cover to cover the first end surface of the body through which the solder introduction port opens, and the guide plate is formed with a solder guide portion for guiding the linear solder to the solder introduction port, and the solder guide portion is formed. The solder transfer device according to claim 1 , further comprising a U-shaped guide groove facing the solder introduction port and a guide wall having an outward spread shape connected to both groove walls of the guide groove. The transfer mechanism has a transfer unit drive roller and a transfer unit driven roller that face each other via a solder transfer path. The roller shaft of the transfer unit drive roller projects to the outside of the body, and the transfer path drive roller can be rotated by the roller shaft. The solder transfer device according to claim 1 or 2 , wherein the solder transfer device is characterized by the above.

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