JP6835540B2 - Ceramic wiring board, probe board and probe card - Google Patents

Description

The present invention relates to a ceramic wiring board, a probe board using the ceramic wiring board, and a probe card.

A probe card used for electrical inspection of a semiconductor element includes a probe board provided with probe pins and a circuit board connected to the probe board and connected to an external circuit. The probe board is for electrically connecting a terminal electrode connected to an external circuit of the circuit board and a minute electrode of a semiconductor element with which the probe pin is in contact. A metal projecting member is joined to the surface of the probe board facing the circuit board, and the probe board is fixed to the circuit board via the projecting member (see, for example, Patent Document 1).

The protruding member is also used to adjust the flatness of the probe board by making the protruding end a screw (bolt) and adjusting the position of the end with a nut or the like provided on the circuit board side. (See, for example, Patent Document 2).

Further, as the probe substrate, a ceramic wiring board in which wiring is formed on the ceramic substrate is used. When producing a ceramic wiring board, the main surface of the ceramic substrate may be polished (see, for example, Patent Document 3). As a result, a probe substrate having a flat main surface and fine wiring can be produced.

Japanese Unexamined Patent Publication No. 2011-165945 Japanese Unexamined Patent Publication No. 2011-141263 Japanese Unexamined Patent Publication No. 2010-93197

In a conventional probe substrate, the protruding member is joined to a metal layer provided on the main surface of the probe card with a brazing material. An external force is applied to the projecting member when the probe substrate is fixed to the circuit board, when the flatness is adjusted, or the like. When the main surface of the probe substrate to which the projecting member is joined via the brazing material and the metal layer is polished for flattening, microcracks are formed on the main surface which is the polished surface by this polishing process. Existing. Therefore, when an external force is applied to the projecting member, stress is also applied to the main surface of the probe substrate, and the ceramic substrate is likely to break from the microcracks, so that the bonding strength of the projecting member may be low. In particular, when a material such as mullite or co-fired ceramic that can be simultaneously fired with a low thermal expansion or low resistance conductor is used, the strength is smaller than that of a conventionally used substrate material such as alumina. Therefore, the joint strength of the protruding member tends to be small.

The ceramic wiring board of the present disclosure has a first main surface and a second main surface facing each other, and at least the first main surface is a polished surface, and the first main surface of the ceramic substrate. A main surface, a wiring conductor provided inside the second main surface and the inside, a recess provided on the first main surface of the ceramic substrate having a bottom surface and an inner wall surface, and only the bottom surface in the recess. The metal film provided on the inner wall surface is separated from the metal film, and is provided so as to extend from the corner portion between the bottom surface of the recess and the inner wall surface to the inside of the ceramic substrate. are provided with the second metal film, one end is joined via a brazing material to the metal layer of the bottom surface of the recess, a projecting member and the other end projects from the first main surface, a.
The other ceramic wiring boards of the present disclosure include a ceramic substrate having a first main surface and a second main surface facing each other, and at least the first main surface is a polished surface, and the first main surface of the ceramic substrate. A main surface of 1, the second main surface and a wiring conductor provided inside, a recess provided on the first main surface of the ceramic substrate, having a bottom surface and an inner wall surface, and the recess in the recess. A metal film provided only on the bottom surface is not connected to the wiring conductor, but is connected to the outer edge of the metal film, and a plurality of metal columns extending from the bottom surface of the recess to the inside of the ceramic substrate, and one end thereof. It includes a protruding member that is joined to the metal film on the bottom surface of the recess via a brazing material and the other end of which protrudes from the first main surface.

Further, the probe substrate of the present disclosure includes the above-mentioned ceramic wiring board and probe pins electrically connected to the wiring conductor of the ceramic wiring board.

Further, the probe card of the present disclosure is arranged so as to face the probe substrate and the first main surface of the ceramic wiring board of the probe substrate, and the probe substrate is fixed via the projecting member. It is equipped with a circuit board.

According to the ceramic wiring board of the present disclosure, even if the first main surface of the ceramic substrate is a polished surface, the bottom surface of the recess provided on the first main surface is not a polished surface, and microcracks due to polishing are not present. Since it does not exist, the joining strength of the protruding member joined only to the bottom surface of the recess is high. When the second metal film as described above is provided, the possibility of cracks starting from the corner between the bottom surface of the recess and the inner wall surface can be reduced, and the metal film is the inner wall surface of the recess. Away from
Therefore, the possibility that the corner portion between the inner wall surface of the recess and the first main surface is chipped is also reduced. Further, when a plurality of metal columns connected to the outer edge portion of the metal film and extending inside the ceramic substrate are provided, the bonding strength of the metal film to the ceramic substrate is high.

Further, the probe substrate of the present disclosure using such a ceramic wiring board and the probe card of the present disclosure using the probe substrate have high bonding strength of the protruding member, and thus are highly reliable.

It is sectional drawing which shows an example of embodiment of a probe card. (A) is an enlarged cross-sectional view showing a portion A of the ceramic wiring board in the probe card shown in FIG. 1, and (b) is a plan view of (a). (A) is an enlarged sectional view showing a main part of another example of a ceramic wiring board, and (b) is a plan view of (a). (A) is an enlarged sectional view showing a main part of another example of a ceramic wiring board, and (b) is a plan view of (a). (A) is an enlarged sectional view showing a main part of another example of a ceramic wiring board, and (b) is a plan view of (a). (A) is an enlarged sectional view showing a main part of another example of a ceramic wiring board, and (b) is a plan view of (a). (A) is an enlarged cross-sectional view showing a main part of another example of the ceramic wiring board, and (b) is a plan view showing a part of the ceramic wiring board in (a) omitted. (A) is an enlarged cross-sectional view showing a main part of another example of the ceramic wiring board, and (b) is a plan view showing a part of the ceramic wiring board in (a) omitted. (A) is an enlarged cross-sectional view showing a main part of another example of the ceramic wiring board, and (b) is a plan view showing a part of the ceramic wiring board in (a) omitted. (A) is an enlarged cross-sectional view showing a main part of another example of the ceramic wiring board, and (b) is a plan view showing a part of the ceramic wiring board in (a) omitted. Both (a) and (b) are enlarged cross-sectional views showing a main part of another example of a ceramic wiring board. It is sectional drawing which shows the main part of another example of a probe card enlarged.

Hereinafter, embodiments of the ceramic wiring board 3, the probe board 2, and the probe card 1 will be described with reference to the drawings.

FIG. 1 is a cross-sectional view showing an example of an embodiment of the probe card 1, and FIG. 2 is an enlarged cross-sectional view showing a portion A of the ceramic wiring board 3 in the probe card 1 shown in FIG. Further, FIGS. 3 to 6 show enlarged main parts of other examples of the ceramic wiring board 3, in which (a) is a cross-sectional view and (b) is a plan view of (a). is there.

In the probe card 1 shown in FIG. 1, a probe board 2 in which a probe pin 12 is connected to a wiring conductor 5 of a ceramic wiring board 3 is fixed to a circuit board 13 by a protruding member 7 and a fixing member 14 of the ceramic wiring board 3. It is composed of.

The ceramic wiring board 3 of the present disclosure has a first main surface 41 and a second main surface 42 facing each other, and at least the first main surface is a polished surface, and the ceramic substrate 4 and the ceramic substrate 4 are the first. A recess 6 having a bottom surface 61 and an inner wall surface 62 provided on the first main surface 41 of the ceramic substrate 4 and a wiring conductor provided inside the main surface 41, the second main surface 42, and the inside of the ceramic substrate 4. One end is joined only to the bottom surface 61 of the recess 6 via a bonding material 8, and the other end is provided with a projecting member 7 projecting from the first main surface 41.

According to the ceramic wiring board 3 of the present disclosure, even if the first main surface 41 of the ceramic substrate 4 is a polished surface, the bottom surface 61 of the recess 6 provided in the first main surface 41 is not a polished surface. Since there are no microcracks due to the polishing process, the bonding strength of the protruding member 7 bonded only to the bottom surface 61 of the recess 6 is high.

The projecting member 7 may be directly joined to the bottom surface 61 of the recess 6 via the joining member 8 as in the examples shown in FIGS. 3 and 5. In this case, as the bonding material 8 that can be directly bonded to the ceramic, for example, a brazing material containing a resin adhesive or an active metal (active brazing material) can be used.

Further, as in the examples shown in FIGS. 1 and 2, even if a film or the like for improving the bondability of the bonding material 8 is provided on the bottom surface 61 of the recess 6, the bottom surface 61 of the recess 6 is joined via this film. Good. Specifically, as shown in the examples shown in FIGS. 1 and 2, a metal film 9 is provided only on the bottom surface 61 in the recess 6, and one end of the protruding member 7 passes through the metal film 9 via the brazing material 81. It may be joined. That is, one end of the protruding member 7 may be joined only to the bottom surface 61 of the recess 6 via the brazing material 81 which is the joining material 8 and the metal film 9. Since the projecting member 7 is joined to the metal film 9 provided on the bottom surface 61 of the recess 6 which is not the polished surface, the joining strength is high as described above. Further, the heat resistance and the bonding strength are further improved as compared with the case where the bonding material 8 is a resin adhesive. Compared with the case where the bonding material 8 is an active brazing material, labor and cost at the time of manufacturing can be reduced.

Here, if the metal film 9 is provided not only on the bottom surface 61 of the recess 6 but also on the inner wall surface 62, when an external force is applied to the projecting member 7, the metal film 9 on the brazing material 81 and the inner wall surface 62 is interposed. Therefore, stress is applied to the inner wall surface 62. For example, a stress that pulls the inner wall surface 62 is applied, and as a result, a tensile stress is also applied to the first main surface 41 that is in contact with the inner wall surface 62. When stress is applied to the first main surface 41, large cracks are generated in the ceramic substrate 4 starting from the microcracks existing in the first main surface 41, and between the inner wall surface 62 and the first main surface 41. The corners may be chipped. If particles generated by chipping come into contact with a fine probe or an electrode of a semiconductor element during an electrical inspection of a semiconductor element, the inspection cannot be performed accurately. This also applies when the metal film 9 is not provided, that is, when the projecting member 7 is joined to the bottom surface 61 and the inner wall surface 62 of the recess 6 via the joining member 8.

However, according to the ceramic wiring board 3 of the present disclosure, since the metal film 9 is provided only on the bottom surface 61 in the recess 6 and not on the inner wall surface 62, even if an external force is applied to the projecting member 7, it will be waxed. Stress is suppressed from being applied to the first main surface 41 through the material 81 and the metal film 9, and there is a possibility that the corner portion between the inner wall surface 62 of the recess 6 and the first main surface 41 may be chipped. Almost gone. This is the same even when it is directly bonded only to the bottom surface 61 of the recess 6 via the bonding material 8.

Further, in both the example shown in FIG. 2 and the example shown in FIG. 4, the metal film 9 is provided so as to cover the entire surface of the bottom surface 61. However, in the example shown in FIG. 4, the brazing material 81 (bonding material 8) is provided so as to cover the entire surface of the metal film 9, whereas in the example shown in FIG. 2, the brazing material 81 (bonding material 8) is provided. ) Is located inside the outer edge of the metal film 9, and is provided away from the inner wall surface 62 of the recess 6. Even in the case of the example shown in FIG. 4, the brazing material 81 is bonded only to the metal film 9, and is not bonded even if it is in contact with the inner wall surface 62. When the metal film 9 covers the entire surface of the bottom surface 61 and the brazing material 81 covers the entire surface of the metal film 9, the brazing material 81 easily comes into contact with the inner wall surface 62 of the recess 6. This is especially likely to occur when the amount of brazing material 81 is large. When the brazing material 81 is in contact with the inner wall surface 62 of the recess, stress may be applied to the inner wall surface 62 via the brazing material 81 when an external force is applied to the protruding member 7. In addition, stress may be applied to the inner wall surface 62 due to thermal expansion of the brazing filler metal 81 itself. However, as in the example shown in FIG. 2, when the brazing material 81 (bonding material 8) is located inside the outer edge of the metal film 9 and is provided away from the inner wall surface 62 of the recess 6, the brazing material 81 Since no stress is directly applied to the inner wall surface 62, no stress is applied to the first main surface 41 in contact with the inner wall surface 62. Therefore, the possibility that the corner portion between the inner wall surface 62 of the recess 6 and the first main surface 41 is chipped is further reduced.

Further, when an external force is applied to the projecting member 7 when the probe board is fixed to the circuit board 13 or when the flatness is adjusted, stress is applied to the bottom surface 61 of the recess 6, and the bottom surface 61 of the recess 6 and the inner wall surface 62 Stress is concentrated on the corners between them, and cracks may occur in the ceramic substrate 4 starting from these corners. Further, when stress is applied to the corner portion between the bottom surface 61 and the inner wall surface 62, stress is also applied to the inner wall surface 62, and stress may be applied to the first main surface 41 as well. Even if the metal film 9 covers the entire surface of the bottom surface 61, if the brazing material 81 (bonding material 8) is located inside the outer edge of the metal film 9 and is provided away from the inner wall surface 62 of the recess 6. The stress applied to the bottom surface 61 located below the outer edge of the metal film 9 is reduced, and the stress applied to the corner portion between the bottom surface 61 and the inner wall surface 62 is reduced. Therefore, the possibility of cracks occurring at the corners between the bottom surface 61 and the inner wall surface 62 is reduced, and the stress applied to the first main surface 41 is reduced to reduce the stress applied to the inner wall surface 62 and the first main surface 41. The chipping of the corner between and is further reduced. This is because the bonding material 8 in the example shown in FIG. 5 covers the entire surface of the bottom surface 61, whereas the bonding material 8 in the example shown in FIG. 3 is located inside the outer edge of the bottom surface 61 and has a recess 6. The same applies when it is provided away from the inner wall surface 62. That is, regardless of the presence or absence of the metal film 8, if the bonding material 8 is located inside the outer edge of the bottom surface 61 of the recess 6 and is provided away from the inner wall surface 62 of the recess 6, the inner wall surface 62 and the first The chipping of the corner portion between the main surface 41 and the main surface 41 is further reduced, and the possibility of cracks occurring at the corner portion between the bottom surface 61 and the inner wall surface 62 is reduced.

In the examples shown in FIGS. 2 and 4, the metal film 9 covers the entire bottom surface 61 of the recess 6, and the outer surface of the metal film 9 is in contact with the inner wall surface 62 of the recess 6. On the other hand, as in the example shown in FIG. 6, the metal film 9 may be separated from the inner wall surface 62 of the recess 6 on the bottom surface 61 of the recess 6. In this way, the brazing material 81 bonded to the metal film 9 does not come into contact with the inner wall surface 62 of the recess 6, so that the stress caused by the external force applied to the projecting member 7 is not transmitted to the inner wall surface 62. .. Further, since the brazing material 81 is located inside the outer edge of the bottom surface 61 of the recess 6 and is provided away from the inner wall surface 62 of the recess 6, it is located near the corner between the bottom surface 61 and the inner wall surface 62. The applied stress is reduced. Therefore, the possibility that the corner portion between the inner wall surface 62 of the recess 6 and the first main surface 41 is chipped is further reduced, and the corner portion between the bottom surface 61 and the inner wall surface 62 is cracked. The possibility of doing so is reduced.

7 and 8 show enlarged main parts of other examples of the ceramic wiring board 3, in which (a) is a cross-sectional view and (b) is the ceramic wiring board 3 in (a). It is a top view which shows by omitting a part. In order to make it easier to see the positional relationship between the metal film 9 and the metal column 10, the projecting member 7 and the joining material 8 in the ceramic wiring substrate 3 are omitted, and the metal column 10 hidden in the metal film 9 is transmitted and shown by a broken line. There is.

The ceramic wiring board 3 may have a metal column 10 which is connected to the metal film 9 and extends from the bottom surface 61 of the recess 6 to the inside of the ceramic board 4 as in the examples shown in FIGS. 7 and 8. In such a configuration, the metal pillar 10 connected to the metal film 9 acts like a pile driven into the ceramic substrate 4, so that the bonding strength of the metal film 9 to the ceramic substrate 4 is higher. It becomes.

The length (depth) of the metal column 10 is not particularly limited, but when the ceramic substrate 4 is a multilayer substrate composed of a plurality of ceramic layers, it is at least the length of one ceramic layer. There is no particular limitation on the thickness (diameter) of the metal pillars 10, and there is no particular limitation on the number and arrangement of the metal pillars 10. When the projecting member 7 has a flange at the end on the side where the metal film 9 is joined and the thickness of the flange is relatively thin, the position is located inside the flange in the plan view of the metal film 9. Since a large stress is likely to be applied to the portion to be formed, it is effective to arrange the metal column 10 so as to connect to the portion. Further, since a large stress is likely to be applied to the outer peripheral portion of the metal film 9, it is also effective to arrange the metal column 10 so as to connect to the outer edge portion of the metal film 9. In this case, in order to suppress the bias of stress in the metal film 9, metal columns 10 having the same size can be arranged at equal intervals in the circumferential direction along the outer circumference of the metal film 9. In the example shown in FIG. 7, one having a large diameter is arranged at the center of the metal film 9, and eight having a small diameter are arranged at the outer edge of the metal film 9 at equal intervals in the circumferential direction. In the example shown in FIG. 8, the diameter of the metal film 9 is smaller than that in the example shown in FIG. 7, and the outer edge thereof is separated from the inner wall surface 62 of the recess 6, so that the metal pillar 10 connected to the outer edge portion is also formed. , It is separated from the inner wall surface 62 of the recess 6 as compared with the example shown in FIG.

Further, as shown in the example shown in FIG. 9, the ceramic wiring board 3 is separated from the metal film 9 and extends from the corner portion between the bottom surface 61 and the inner wall surface 62 of the recess 6 to the inside of the ceramic substrate 4. It may have a second metal film 11 provided. When an external force is applied to the projecting member 7 when the probe board is fixed to the circuit board 13 or when the flatness is adjusted, stress is applied to the bottom surface 61 of the recess 6, and between the bottom surface 61 of the recess 6 and the inner wall surface 62. Stress is concentrated on the corners, and cracks may occur in the ceramic substrate 4 starting from these corners. If the second metal film 11 is provided extending from the corner to the inside of the ceramic substrate 4, the stress is relaxed by the second metal layer which is softer than the ceramic. It is possible to reduce the possibility of cracks starting from the corners. Further, the second metal film 11 is separated from the metal film 9, that is, the metal film 9 is separated from the inner wall surface 62 of the recess 6 on the bottom surface 61 of the recess 6. Therefore, as described above, the stress applied to the vicinity of the corner portion between the bottom surface 61 and the inner wall surface 62 is reduced, and the corner portion between the inner wall surface 62 of the recess 6 and the first main surface 41 is chipped. The possibility is further reduced.

The second metal film 11 may extend from the corner portion to the inside of the recess 6. Even in this case, the second metal film 11 is separated from the metal film 9. Therefore, as described above, the brazing material 81 does not come into contact with the inner wall surface 62 of the recess 6, and the stress applied to the vicinity of the corner between the bottom surface 61 and the inner wall surface 62 is reduced. The possibility that the corner portion between the inner wall surface 62 and the first main surface 41 is chipped can be further reduced.

Further, as in the example shown in FIG. 10, the metal film 9 is provided so as to extend from the bottom surface 61 of the recess 6 to the inside of the ceramic substrate 4 beyond the corner portion between the bottom surface 61 of the recess 6 and the inner wall surface 62. It may have been. In other words, the outer edge of the metal film 9 is located inside the ceramic substrate 4 around the recess 6. It can be said that the metal film 9 extends to the inner wall surface 62 and is integrated with the second metal film 11. Even in such a case, the stress is relaxed by the edge of the metal film 9 located inside the ceramic substrate 4, which corresponds to the second metal film 11, and cracks starting from the corners may occur. Can be reduced.

When the metal film 9 and the second metal film 11 are separated from each other as in the example shown in FIG. 9, the metal film 9 and the second metal film 11 are in contact with each other and integrated as in the example shown in FIG. In both cases, the stress is relaxed by the portion extending from the corner portion of the metal film 9 to the inside of the ceramic substrate 4 or the second metal film 11. However, when the metal film 9 and the second metal film 11 are separated from each other, the stress itself applied to the vicinity of the corner between the bottom surface 61 and the inner wall surface 62 is reduced, so that the bottom surface 61 and the inner wall surface 62 The possibility of cracks occurring in the corners between the two can be further reduced.

As in the example shown in FIG. 11, the inner wall surface 62 of the recess 6 may have at least one of a bent portion and a curved portion between the bottom surface 61 and the first main surface 41. .. The inner wall surface 62 of the example shown in FIG. 11 (a) has a bent portion between the bottom surface 61 and the first main surface 41, and the inner wall surface 62 of the example shown in FIG. 11 (b) has a bent portion. The entire surface is curved from the bottom surface 61 to the first main surface 41. With such a configuration, when stress is transmitted from the bottom surface 61 of the recess 6 to the first main surface 41, the stress is dispersed in the bent portion and the curved portion, so that the first main surface The stress transmitted to 41 is small. Therefore, the possibility that the corner portion between the inner wall surface 62 of the recess 6 and the first main surface 41 is chipped can be further reduced.

Further, in the example shown in FIG. 11A, the upper and lower portions of the bent portion on the inner wall surface 62 are located on the right side with respect to the paper surface, and the lower side is located on the left side. When the upper side (first main surface 41 side) of the recess 6 is composed of two ceramic layers, it is said that holes of the same size are arranged so as to be offset in the left-right direction between the upper and lower ceramic layers. , The recess 6 having such an inner wall surface 62. Similarly, in the case where the upper side of the bottom surface 61 of the recess 6 is composed of two ceramic layers, if the sizes of the holes are different between the upper and lower ceramic layers, the upper side of the bent portion is the outer side (in the left-right direction) or It is a recess 6 having an inner wall surface 62 such that it is located inside.

The ceramic substrate 4 is made of, for example, a ceramic sintered body such as an alumina-based sintered body, a mullite-based sintered body, or a glass-ceramic sintered body, and has a first main surface 41 and a second main surface 42 facing each other. It is a plate-shaped substrate to have. The ceramic substrate 4 can be a multilayer ceramic substrate in which a plurality of ceramic layers made of these ceramic sintered bodies are laminated. When Murite is used as the ceramic substrate 4, since the thermal expansion coefficient of Murite is similar to that of the silicon wafer, a probe card 1 provided with a probe substrate 2 having probe pins 12 provided on the ceramic wiring board 3 is used. When the burn-in test is performed, the position of the tip of the probe pin 12 on the ceramic wiring board 3 is displaced from the terminal on the silicon wafer even when the test is performed at a high temperature (for example, 125 ° C.) and a low temperature (for example, -40 ° C.). It will be difficult. Further, glass ceramic is also called a so-called low-temperature fired substrate, and low-resistance copper, silver, or the like can be used for the wiring conductor 5, so ceramic wiring having excellent electrical characteristics such as power supply characteristics and high-frequency characteristics. It becomes a substrate 3, a probe substrate, and a probe card 1.

The shape of the ceramic substrate 4 in a plan view is, for example, a polygonal plate shape such as a square shape, a rectangular shape, and an octagonal shape, or a circular shape. For example, the thickness can be 3 mm to 10 mm, and in the case of a rectangle, it can be 100 mm × 100 mm to 300 mm × 300 mm, and in the case of a circular shape, it can be 100 mm to 300 mm in diameter. At least the first main surface 41 of the ceramic substrate 4 is flattened by polishing. The flattened first main surface 41 is a surface of the probe card 1 facing the circuit board 13, and the wiring conductor 5 on the first main surface 41 and the wiring conductor of the circuit board 13 are electrically connected to each other. Be connected. This connection is flattened so as to be uniform over the entire surface of the first main surface 41 of the ceramic wiring board 4. Similarly, the second main surface 42, which is electrically connected to the semiconductor element on the silicon wafer via the probe pin 12, may also be polished and flattened. When both main surfaces of the ceramic substrate 4 are polished surfaces, the thickness of the ceramic substrate 4 becomes substantially uniform over the entire surface, and electrical connection with an inspection target such as a semiconductor element on the circuit board 13 and a silicon wafer. Becomes good.

The wiring conductor 5 is made of a metal material such as tungsten, molybdenum, manganese, copper, chromium, nickel, silver, palladium, gold or platinum. Further, the wiring conductor 5 may be made of an alloy material of these metal materials. These metal materials (alloy materials) are provided inside the first main surface 41, the second main surface 42, and the inside of the ceramic substrate 4 in the form of, for example, a metallized conductor (thick film conductor), a thin film conductor, or a plated conductor. ing. A film-like conductor is provided on the first main surface 41, the second main surface 42, and the inside (ceramic interlayer) of the ceramic substrate 4, and a columnar shape penetrating the ceramic layer to connect the film-like conductors. Conductor (through conductor) is provided. The thickness of the film-shaped conductor is, for example, 5 μm to 20 μm, and the columnar conductor is, for example, a columnar conductor having a diameter of 30 μm to 100 μm.

A plurality of insulating layers made of a resin such as polyimide are provided on the second main surface 42 of the ceramic substrate 4 on which the wiring conductor 5 is formed, and the wiring conductor 5 is provided on the surface of the ceramic substrate 4 via the resin layer. May be good. The resin layer and the wiring conductor 5 provided on the surface and inside of the resin layer can be formed of a thin film conductor to obtain finer wiring. As a result, the distance between the probe pins 12 connected to the wiring conductor 5 formed on the surface of the resin layer can be made smaller.

The recess 6 is provided on the first main surface 41 of the ceramic substrate 4, and has a bottom surface 61 and an inner wall surface 62. As described above, the first main surface 41 is a polished surface, but the bottom surface 61 of the recess 6 is not a polished surface. Although the inner wall surface 62 is not a polished surface, the very vicinity of the first main surface 41 may be polished when the first main surface 41 is polished.

The shape of the recess 6 in a plan view is circular in the examples shown in FIGS. 2 to 10, but is not limited to this, and may be a polygonal shape such as a square shape. It may be selected according to the shape of the protruding member 7 joined to the bottom surface 61 of the recess 6. Further, in the examples shown in FIGS. 2 to 6, the shape of the joint surface of the protruding member 7 is circular, whereas the shape of the concave portion 6 in a plan view is also circular, but the shape is different from that of the protruding member 7. There may be. If the shape of the recess 6 (shape of the bottom surface 61) is the same (similar shape) as the shape of the protruding member 7 (joint surface), the stress applied to the corner between the bottom surface 61 and the inner wall surface 62 of the recess 6 varies. Since it can be made smaller and stress is less likely to be concentrated, the possibility of cracks occurring at the corner between the bottom surface 61 and the inner wall surface 62 can be reduced. Further, if the shape of the bottom surface 61 is a shape having no corners such as a circular shape, there is no portion where stress is concentrated, so that cracks occur at the corners between the bottom surface 61 and the inner wall surface 62. The possibility can be further reduced.

Regarding the size of the recess 6, the depth of the recess 6 can be, for example, 3% to 30% of the thickness of the ceramic substrate 4. If the depth of the recess 6 is deep, for example, even if the thickness of the flange portion of the projecting member 7 is increased in order to increase the joint strength, it is difficult to interfere with the circuit board 13. Further, if the depth of the recess 6 is too deep, the strength of the ceramic substrate 4 tends to decrease. On the other hand, if the depth of the recess 6 is too shallow, the distance between the bottom surface 61 of the recess 6 and the first main surface 41 becomes too close, and the stress applied to the bottom surface 61 is easily transmitted to the first main surface 41. The joint strength of the projecting member 7 may decrease. Therefore, the depth of the recess 6 may be specifically about 0.1 mm to 1 mm.

The size of the recess 6 in a plan view can be set according to the arrangement of the wiring conductor 5 provided on the first main surface 41 and the size of the protruding member 7. The size may be one size larger than the size of the projecting member 7, and the strength of the ceramic substrate 4 may not be excessively reduced. Specifically, for example, if the shape of the recess 6 in a plan view is square, it can be 8 mm × 8 mm to 40 mm × 40 mm, and if it is circular, it can be 8 mm to 40 mm in diameter. .. The size of the recess 6 shown here in a plan view is the size of the bottom surface 61 or the opening. As shown in the example shown in FIG. 11B, the size of the recess 6 in a plan view is not limited to that which is constant from the bottom surface 6 to the first main surface 41 (opening). Further, the shape of the recess 6 in a plan view is not limited to that which is constant from the bottom surface 6 to the first main surface 41 (opening).

As described above, the inner wall surface 62 of the recess 6 may have at least one of a bent portion and a curved portion between the bottom surface 61 and the first main surface 41. In the example shown in FIG. 11, the inner wall surface 62 has either a bent portion or a curved portion, but the inner wall surface 62 of the recess 6 has a bent portion and a curved portion. You may have both. For example, the portion of the inner wall surface 62 located above and below the bent portion may be a curved surface.

The metal film 9 can be made of the same metal material and the same form as the film-like conductor of the wiring conductor 5, and is provided on the bottom surface 61 of the recess 6 of the ceramic substrate 4. As described above, the metal film 9 is provided only on the bottom surface 61 in the recess 6, and is not provided on the inner wall surface 62. The shape and size of the metal film 9 in a plan view can be set according to the shape and size of the protruding member 7 (bottom surface). When the size of the metal film 9 is made one size larger than the size of the projecting member 7 (bottom surface), the side surface as well as the bottom surface of the projecting member 7 can be a joint surface, and the bonding strength of the projecting member 7 can be increased. .. Specifically, for example, if the shape of the metal film 9 in a plan view is square, it can be 8 mm × 8 mm to 20 mm × 20 mm, and even if the shape of the metal film 9 in a plan view is circular. For example, the diameter can be 8 mm to 20 mm. When the metal film 9 is separated from the inner wall surface 62, for example, it may be separated from the inner wall surface 62 by 0.5 mm to 4 mm over the entire circumference. Further, when the metal film 9 extends from the bottom surface 61 of the recess 6 to the inside of the ceramic substrate 4 beyond the corner portion between the bottom surface 61 of the recess 6 and the inner wall surface 62, it is 0 from the corner portion. It can be provided up to a position of .5 mm to 4 mm. The thickness of the metal film 9 can be, for example, 5 μm to 20 μm. In the examples shown in FIGS. 2 to 6, the shape of the joint surface of the protruding member 7 is circular, whereas the shape of the metal film 9 in a plan view is also circular, but the shape of the metal film 9 in a plan view is The shape may be different from that of the projecting member 7. Further, the shape of the metal film 9 may be different from the shape of the bottom surface 61 of the recess 6.

The second metal film 11 can be a metallized conductor (thick film conductor) made of the same metal material as the film-like conductor of the wiring conductor 5, and can be formed from a corner between the bottom surface 61 and the inner wall surface 62 of the recess 6. It is provided so as to extend to the inside of the ceramic substrate 4. The second metal film 11 can be provided, for example, extending from the corner portion to the inside of the ceramic substrate 4 by 0.5 mm to 4 mm. Further, when the second metal film 11 extends from the corner portion to the inside of the recess 6 and the bottom surface 61 of the recess 6, the second metal film 11 can be provided, for example, extending from the corner portion by 0.5 mm to 3 mm. The second metal film 11 is provided apart from the metal film 9, but can be provided, for example, 0.5 mm to 4 mm apart.

One end of the metal column 10 is connected to the metal film 9, and the other end extends from the bottom surface 61 of the recess 6 to the inside of the ceramic substrate 4. The metal pillar 10 can be formed of the same metal material and the same method as the columnar conductor (through conductor) of the wiring conductor 5. The length extending from the bottom surface 61 of the recess 6 to the inside of the ceramic substrate 4 can be, for example, 0.2 mm to 1 mm depending on the thickness of the ceramic layer and the number of layers of the ceramic layer penetrating. The metal pillar 10 is, for example, cylindrical, and the diameter can be, for example, 30 μm to 100 μm, similarly to the columnar conductor (through conductor) of the wiring conductor 5. Further, as described above, the plurality of metal columns 10 may have different diameters from each other, or may have different lengths from each other. In the examples shown in FIGS. 7 and 8, one metal column 10 connected to the central portion of the metal film 9 has a large diameter, but instead of this, one having a small diameter, for example, The same effect can be obtained by arranging a plurality of those having the same diameter as those arranged on the outer edge of the metal film 9 at small intervals. Further, the through conductor of the wiring conductor 5, the metal pillar 10 at the outer edge of the metal film 9, and the metal pillar 10 at the center of the metal film 9 can be formed efficiently by having the same diameter.

As the projecting member 7, for example, a member made of an alloy material such as Fe—Ni—Co alloy or Fe—Ni alloy can be used, and the projecting member 7 can be formed by press working, cutting, or the like. When the material is made of a material having a coefficient of thermal expansion similar to that of the ceramic substrate 4, the residual stress after bonding with the ceramic substrate 4 is small and the bonding strength is unlikely to decrease. In order to protect the surface, the projecting member 7 may be made of the above alloy and the surface is nickel-plated or the like. When a brazing material is used as the bonding material 8, gold plating may be performed after nickel plating in consideration of the wettability of the brazing material.

The shape of the projecting member 7 is, for example, in the case of the example shown in FIG. 1, a male screw (bolt), and has a flange at the end on the side to be joined. The projecting member 7 may be a columnar one having no flange portion, or may be a so-called hexagon bolt. The head of a normal hexagon bolt is thick, and the head protrudes greatly from the recess 6 and easily interferes with the circuit board 13. Therefore, as shown in the examples shown in FIGS. 1 to 11, columnar screw portions are joined. It is possible to have a disc-shaped flange at one end (one end) on the side. By having the flange portion, it is possible to increase the bonding area with the ceramic substrate 4 and increase the bonding strength without increasing the overall size. In these examples, one end (one end surface) of the projecting member 7 has a circular shape, but the present invention is not limited to this, and may be a polygonal shape such as a square shape. If one end surface has a shape having no corners such as a circular shape, when an external force is applied to the projecting member 7, there is no portion where stress tends to concentrate at the joint with the ceramic substrate 1, so that the joint strength Will be high. The shape of the projecting member 7 is not limited to this, and may be, for example, a nut having a female screw as shown in FIG. 12, or a male screw from one end to the other end. It may not be one piece but may be divisible. As the separable projecting member, for example, one end side is a male screw as shown in FIG. 1, and the other end side has a female screw portion to which the male screw is bonded at one end and is coupled to the fixing member 14 at the other end. Those having a male screw portion can be mentioned. Further, the protruding member 7 may be one in which one end portion having no threaded portion and the other end portion having the threaded portion are joined. Even when one end of the projecting member 7 is tilted and connected to the first main surface 41, the ceramic substrate 4 is joined by correcting the tilt of the other end having the threaded portion thereafter. It is possible to apply stress uniformly to the joint with.

The dimension of the projecting member 7 is not particularly limited as long as one end of the projecting member 7 fits in the recess 6 and the length corresponds to the distance between the probe substrate 2 and the circuit board 13. When the shape of the projecting member 7 is as shown in FIG. 1, for example, the threaded portion has a diameter of 2 mm to 15 mm and a length of 4 mm to 50 mm, and the flange has a diameter of, for example, 7 mm to 19 mm and a thickness. Can be 0.5 mm to 3 mm.

Further, one end of the protruding member 7 to be joined to the bottom surface 61 of the recess 6 or the metal film 9 is from the joint surface facing the bottom surface 61 of the recess 6 to the inner wall surface 62 of the recess 6, as shown in FIG. The shape may have a C-plane or an R-plane on the side surface facing the surface. Since the bonding material 8 tends to accumulate on the peripheral edge of the projecting member 7 on the joint surface side, the meniscus easily spreads on the side surface of the projecting member 7 while suppressing the length of the bonding material 8 that wets and spreads outward. Since it is easy to form and suppress the spread of the meniscus, the degree of freedom in design is improved. This also applies when the shape of the projecting member 7 has a flange at the end of the threaded portion on the joint side, as in the example shown in FIGS. 1 to 11.

As the bonding material 8, a resin adhesive, a brazing material, or an active brazing material can be used. As the resin adhesive, it is preferable to use a resin having strong adhesive strength and heat resistance, and examples thereof include epoxy-based resins. An inorganic filler having a coefficient of thermal expansion lower than that of the resin component may be added to the resin adhesive in order to reduce the coefficient of thermal expansion and bring it closer to the coefficient of thermal expansion of the ceramic substrate 4 and the protruding member, if necessary. As the brazing material, various silver brazing, Au-Sn eutectic alloys and various solders can be used, but when silver brazing and Au-Sn eutectic alloys are used, long-term temperature cycle reliability and heat resistance deteriorate. It is hard to occur. The active brazing material is obtained by further adding powder of at least one active metal material among titanium, hafnium and zirconium to various silver brazing materials. When active wax is used, the brazing material can be directly bonded to the ceramic substrate 4 by creating a vacuum or an inert atmosphere.

An example of the manufacturing method of the ceramic wiring board 3 as described above will be described.

The ceramic substrate 4 can be produced by laminating and firing a plurality of green sheets to be ceramic layers. In the case the ceramic substrate 4, for example made of mullite sintered body, in the preparation of the green sheet, firstly, mullite _{(3Al 2 O 3 · 2SiO 2} ) as a powder and additives, _Mn 2 _{O 3} powder, TiO _A slurry is prepared by adding an organic binder and a solvent to a mixed powder to which 2 powder and MoO _{3 powder are added, and sufficiently mixing and dispersing using a ball mill or the like.} A green sheet can be produced from this slurry by a molding method such as a doctor blade method or an injection method. Alternatively, an organic binder can be added to the mixed powder to prepare a green sheet having a predetermined thickness by a method such as press molding or rolling molding. The thickness of the green sheet can be, for example, 50 to 300 μm, but is not particularly limited.

The mixed powder contains one or more oxide powders selected from the group of Ca, Sr, B and Cr in order to densify the mullite sintered body and enhance the simultaneous sinterability with the wiring conductor 5. , Or a powder consisting of carbonate, nitrate and acetate that can form oxides by calcination may be added.

Through holes are formed in this green sheet by, for example, a hole forming method such as die punching, a microdrill, or a laser. The through hole is provided in a portion of the wiring conductor 5 that serves as a through conductor, a portion that serves as a recess 6, and a portion that serves as a metal pillar 10.

Further, the conductor paste is filled in the through holes for the through conductor and the metal pillar 10 by screen printing, for example, and the wiring conductor 5 between the ceramic layers is filled with the green sheet by a printing method such as screen printing or gravure printing. The metal film 9 and the second metal film 11 are printed and applied to the main surface of the green sheet. The conductor paste is prepared by adding an organic binder, a solvent, or the like to a mixed metal powder obtained by mixing copper (Cu) powder and tungsten (W) powder or molybdenum (Mo) powder in a predetermined ratio. It can be prepared by mixing sufficiently using this mill or the like. In addition to the above metal powder, alumina powder or a mixed powder having the same composition as the ceramic substrate 4 may be added to the conductor paste in order to improve the adhesion to the ceramic substrate 4, and further, Ti. Such as active metals or oxides thereof may be added.

The conductor paste does not have to have the same composition, and the composition may be partially changed according to the required wiring resistance and electrical characteristics. For example, in the wiring conductor 5, a through conductor having a diameter of about 30 to 100 μm generally has a larger cross-sectional area than a film-like conductor between ceramic layers having a thickness of about 5 to 20 μm and a width of about 20 to 100 μm. Since there is a tendency, the penetrating conductor and the film-like conductor between the wide ceramic layers may be partially formed of tungsten (W), molybdenum (Mo), or an alloy thereof. In this way, it is possible to alleviate partial deformation due to the difference in firing shrinkage between the ceramic layer and the through conductor while suppressing the influence on the electrical characteristics.

After that, a plurality of green sheets including a green sheet printed and coated with a conductor paste having through holes to be recesses 6 are aligned and laminated and pressure-bonded to prepare a laminated body. With or without a through hole as a recess 6, all green sheets may be laminated and crimped at once, or only a plurality of green sheets having a through hole as a recess 6 may be laminated and crimped. , A laminated body obtained by laminating and crimping only a plurality of green sheets having no through holes to be recesses 6 may be produced, and the respective laminated bodies may be laminated and crimped.

By firing the laminate in a non-oxidizing atmosphere (nitrogen atmosphere or mixed atmosphere of nitrogen and hydrogen), a wiring board having a wiring conductor 5 and a recess 6 is obtained.

Next, by polishing the main surface of the wiring board having the recess 6 so that the bottom surface of the recess 6 is not polished, the wiring board having the recess 6 on the first main surface 41 which is the polished surface is obtained. The main surface having no recess 6 may also be polished so that both the first main surface 41 and the second main surface 42 are polished surfaces. The polishing process is performed by mechanical polishing using a grindstone or abrasive grains, or chemical mechanical polishing using an abrasive in which the abrasive grains are suspended in a reactive solvent. Microcracks are generated on the polished surface formed by this polishing process. Microcracks can also be reduced by performing lapping polishing using free abrasive grains as the finishing of the polishing process. Further, when the wiring conductor 5 is formed of a thin film, the surface roughness of the polished surface may be, for example, an arithmetic mean roughness (Ra) of 0.3 μm or less.

The wiring conductor 5 on the main surface of the ceramic substrate 4 can be manufactured, for example, as follows. For example, by using a thin film forming method such as a sputtering method, first, a bonded metal layer such as titanium or chromium of about 0.1 to 3 μm is formed on the entire surface of the main surface of the wiring board having the wiring conductor 5 inside the ceramic substrate 4. To do. Next, a main conductor layer such as copper having a size of about 2 to 10 μm is formed on the entire surface of the bonded metal layer to form a conductive thin film layer. A barrier layer or the like may be formed if necessary. Then, the wiring conductor 5 of the thin film can be formed by patterning the conductive thin film layer by photolithography.

At this time, when the metal film 9 is previously formed as a metallized layer with a conductor paste, the metallized layer may be exposed, or a thin film conductor layer may be further provided on the metallized layer to form the metal film 9. Further, the central portion of the metal film 9 may be formed of a metallized layer, and the outer edge portion may be formed of a thin film. Since the central part where more stress is applied is formed by a metallized layer with higher joint strength and the outer edge part forming the outer shape is formed by a thin film with high dimensional accuracy, both joint strength and dimensional accuracy can be achieved at a high level. .. When the metallized layer 9 is not formed, the metal layer 9 is also formed of a thin film at the same time as the wiring conductor 5 is formed, resulting in higher dimensional accuracy.

A nickel film of about 1 to 10 μm and a gold film of about 0.1 to 3 μm are sequentially formed on the surface of the wiring conductor 5 and the surface of the metal film 9 to protect the surfaces of the wiring conductor 5 and the metal film 9. , The bondability of brazing material, solder, etc. can be improved. The nickel film and the gold film can be formed of a plating film or a thin film obtained by electrolytic plating.

Next, the ceramic wiring board 3 is formed by joining the projecting member 7 to the bottom surface 61 of the recess 6 via the bonding material 8. When the bonding material 8 is an adhesive, for example, a liquid thermosetting epoxy adhesive is applied to one end surface of the projecting member 7, and this one end surface is pressed against the bottom surface 6 of the recess 6, to cure the adhesive. By giving a thermal history (for example, holding 150 ° C. for 60 minutes), the adhesive can be cured and joined. When the bonding material 8 is an active brazing material, for example, an active eutectic silver wax paste is applied to one end surface of the projecting member 7, and the one end surface is pressed against the bottom surface 6 of the recess 6 to melt the active eutectic silver wax. Melt bonding can be performed by giving a thermal history under the conditions (for example, holding 830 ° C. for 10 minutes in an inert atmosphere). The amount and the force at which one end surface is pressed are adjusted so that the adhesive or the active brazing material is not joined to the inner wall surface 62 of the recess 6. When the bonding material 8 is a brazing material, for example, an Au—Sn eutectic alloy brazing sheet is arranged between the metal film 9 and the projecting member 7, and the melting conditions of the Au—Sn eutectic alloy brazing material (for example, Melt bonding can be performed by giving a thermal history of 320 ° C. for 10 minutes in a nitrogen atmosphere).

In the example shown in FIG. 4, the bonding material 8 covers the entire surface of the metal film 9, and the outer peripheral end of the bonding material 8 is located at the outer peripheral end of the metal film 9, whereas the examples shown in FIGS. 2 and 6 are shown. Then, the outer peripheral end of the bonding material 8 is located inside the outer peripheral end of the metal film 9 and is separated from the outer peripheral end. With such a configuration, at the outer edge portion of the exposed metal film 9, the bonding material 8 due to heat when the projecting member 7 is joined and the residue due to the thermal stress between the projecting member 7 and the ceramic substrate 4 Since the stress can be relaxed, the joint strength of the protruding member 7 is increased.

Here, when a sheet having an Au—Sn alloy brazing thickness is used as the bonding material 8 (brazing material 81), the gold plating thickness on the surface of the metal film 9 is made thicker than the gold plating thickness on the surface of the protruding member 7. You can form it. In this way, when the bonding material 8 (brazing material 81) is melted by the heat applied at the time of joining, the gold plating on the surface of the metal film 9 is more than the gold plating on the surface of the protruding member 7 (brazing material 81). In the composition of the Au—Sn alloy, the metal film 9 side deviates more from the eutectic composition, and the melting point becomes higher. Then, rather than the joining material 8 (wax material 81) flowing to the outer peripheral side of the metal film 9, the height of crawling up on the side surface of the joining portion of the protruding member 7 tends to be larger. Therefore, it becomes difficult for the bonding material 8 (brazing material 81) to flow to the outer peripheral edge of the metal film 9, and the bonding strength of the protruding member 7 increases. As a result, the metal film 8 can be made smaller, so that the degree of freedom in design is high.

It should be noted that if the projecting member 7 is not joined perpendicularly to the bottom surface 61 of the recess 6 but is joined so as to be perpendicular to the first main surface 41 of the ceramic substrate 4, the ceramic substrate 4 is effectively deformed. It can be prevented by the protruding member 7.

The probe substrate 2 includes the ceramic wiring board 3 as described above, and the probe pin 12 electrically connected to the wiring conductor 5 of the ceramic wiring board 3. More specifically, the probe pin 12 is joined to the wiring conductor 5 located on the second main surface 42 of the ceramic substrate 4.

The probe pin 12 is made of, for example, a metal such as nickel or tungsten. If the probe pin 12 is made of nickel, it is produced, for example, as follows. First, female molds of a plurality of probe pins are formed on one surface of a silicon wafer by etching, and a metal made of nickel is adhered to the formed surfaces by a plating method. Then, the female mold is further embedded with nickel, and nickel on the wafer other than the embedded nickel is removed by processing such as an etching method to produce a silicon wafer in which nickel probe pins are embedded. The nickel probe pin embedded in the silicon wafer is bonded to the wiring conductor 5 located on the second main surface 42 of the ceramic substrate 4 with a bonding material such as solder. Then, the probe substrate 2 is obtained by removing the silicon wafer with an aqueous potassium hydroxide solution.

Since such a probe board 2 has a high bonding strength of the protruding member 7, when it is used for the probe card 1, the protruding member is even if an external force is applied when the probe board 2 is attached and fixed to the circuit board 13 or when the flatness is adjusted. The possibility that the 7 is removed or the ceramic substrate 4 is chipped is reduced.

In the example shown in FIG. 1, the wiring conductor 5 and the probe pin 12 are not provided in the central portion of the second main surface 42 of the probe substrate 2, but the probe pin is arranged according to the arrangement of the electrodes of the semiconductor element to be measured. Since 12 is arranged, it is not limited to this example.

The probe card 1 is a circuit board that is arranged so as to face the above-mentioned probe board 2 and the first main surface 41 of the ceramic wiring board 3 of the probe board 2, and the probe board 2 is fixed via a protruding member 7. It is basically composed of 13. More specifically, for example, as shown in FIG. 1, the probe substrate 2 is fixed to the circuit board 13 with the support member 15, the projecting member 7, and the fixing member 14, and the first main surface of the ceramic wiring board 3 is fixed. The probe card 1 is formed by electrically connecting the wiring conductor 5 on the 41 and the electrode 16 on the surface of the circuit board 13 with the connecting member 17.

Since such a probe card 1 has a high bonding strength of the protruding member 7, it is highly reliable.

The circuit board 13 is a printed circuit board for mediating the connection between the tester for determining the operating state of the semiconductor element and the probe board 2 (probe pin 12), and is formed of a glass epoxy multilayer board.

The connecting member 17 is a metal pin or the like. One end of the connecting member 17 is fixed to the wiring conductor 5 on the first main surface 41 of the ceramic wiring board 3 with a brazing material, solder, or the like. The other end of the connecting member 17 is in contact with the circuit board 13. As a result, the circuit board 13 and the probe board 2 are electrically connected.

The support member 15 has a frame shape and is fixed to the outer edge portion of the circuit board 13. The circuit board 13 and the probe board 2 are mechanically fixed at the peripheral edge together with a frame (not shown). The support member 15 and the frame body are mainly made of a metal having high rigidity and low thermal expansion such as 42 alloy and Invar. In the example shown in FIG. 1, the support member 15 is hooked on the peripheral edge of the ceramic substrate 4, the peripheral edge of the probe substrate 2 is fixed by the support member 15, and the central portion of the probe substrate 2 is a protruding member 7. And it is fixed by the fixing member 14. In a state where the peripheral edge portion of the probe substrate 2 is fixed by the support member 15, the distance between the central portion of the probe substrate 2 and the central portion of the circuit board 13 is adjusted by the projecting member 17 and the fixing member 14, so that the probe substrate 2 The flatness of the can be adjusted.

In the example shown in FIG. 1, the recess 6 is provided in only one place in the center of the ceramic substrate 4 and only one fixing member 7 is joined, but the present invention is not limited to this example. For example, a plurality of recesses 6 may be provided in addition to the central portion of the ceramic substrate 4, and the projecting members 7 may be joined to the bottom surface 61 of each recess 6. When a plurality of projecting members 7 are provided, the flatness can be adjusted more finely.

Further, the probe card 1 is not limited to the example shown in FIG. 1, and for example, an interposer substrate may be further provided between the circuit board 13 and the probe substrate 2.

1 ... Probe card 2 ... Probe board 3 ... Ceramic wiring board 4 ... Ceramic board 41 ... 1st main surface 42 ... 2nd main surface 5 ... Wiring conductor 6 ...・ Concave part 61 ・ ・ Bottom surface 62 ・ ・ Inner wall surface 7 ・ ・ ・ Protruding member 8 ・ ・ ・ Joining material 81 ・ ・ Wax material 9 ・ ・ ・ Metal film 10 ・ ・ Metal column 11 ・ ・ Second metal film 12 ・ ・Probe pin 13 ... Circuit board 14 ... Fixing member 15 ... Support member 16 ... Electrode 17 ... Connecting member

Claims (9)

A ceramic substrate having a first main surface and a second main surface facing each other, and at least the first main surface is a polished surface.
The first main surface of the ceramic substrate, the second main surface, and the wiring conductors provided inside,
A recess provided on the first main surface of the ceramic substrate and having a bottom surface and an inner wall surface,
A metal film provided in the recess only on the bottom surface away from the inner wall surface,
A second metal film that is separated from the metal film and extends from a corner between the bottom surface and the inner wall surface of the recess to the inside of the ceramic substrate.
One end is joined to the metal film on the bottom surface of the recess via a brazing material, and the other end is a projecting member protruding from the first main surface.
Ceramic wiring board. A ceramic substrate having a first main surface and a second main surface facing each other, and at least the first main surface is a polished surface.
The first main surface of the ceramic substrate, the second main surface, and the wiring conductors provided inside,
A recess provided on the first main surface of the ceramic substrate and having a bottom surface and an inner wall surface,
A metal film provided only on the bottom surface in the recess,
A plurality of metal columns that are not connected to the wiring conductor but are connected to the outer edge of the metal film and extend from the bottom surface of the recess to the inside of the ceramic substrate.
One end is joined to the metal film on the bottom surface of the recess via a brazing material, and the other end is a projecting member protruding from the first main surface.
Ceramic wiring board. The metal film is connected, the ceramic wiring board according from the bottom surface to claim 1 having a metal column extending inside the ceramic substrate of the recess. The ceramic wiring board according to claim 2, wherein the metal film is separated from the inner wall surface of the recess on the bottom surface of the recess. The ceramic wiring according to claim 2 or 4, further comprising a second metal film extending from a corner portion between the bottom surface of the recess and the inner wall surface to the inside of the ceramic substrate. substrate. The ceramic wiring according to claim 2, wherein the metal film extends from the bottom surface of the recess to the inside of the ceramic substrate beyond a corner portion between the bottom surface of the recess and the inner wall surface. substrate. The inner wall surface of the recess has any one of claims 1 to 6 having at least one of a bent portion and a curved portion between the bottom surface and the first main surface. The ceramic wiring board described. A probe substrate including the ceramic wiring board according to any one of claims 1 to 7, and a probe pin electrically connected to the wiring conductor of the ceramic wiring board. The probe substrate according to claim 8 and a circuit board that is arranged so as to face the first main surface of the ceramic wiring board of the probe substrate and to which the probe substrate is fixed via the projecting member. Provide probe card.

Images