JP6835674B2 - Detection element mounting board, detection device and detection module - Google Patents

Description

The present invention relates to a substrate for mounting a detection element, a detection device, and a detection module.

Conventionally, a detection element mounting substrate and a detection device in which an X-ray detection element is mounted on the main surface of an insulating substrate are known (see, for example, Patent Document 1).

In such a substrate for mounting a detection element, it is known that a plurality of vias for attenuating X-rays are arranged inside the insulating substrate.

Japanese Patent Application Laid-Open No. 2009-032936

However, there is a demand for higher accuracy and higher functionality of the detection device. In such a case, X-rays are reflected by the vias and irradiated to the parts other than the vias, which cannot be attenuated well, pass through the substrate for mounting the detection element, and the transmitted X-rays are irradiated to other electronic components and the like. Therefore, there is a concern that the detection device may malfunction and it may be difficult to detect X-rays satisfactorily.

According to one aspect of the present invention, the detection element mounting substrate includes a first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, and the first main surface. A second main surface facing the surface, a second mounting portion for mounting an electronic element on the second main surface, and a plurality of vias, the insulating substrate having a rectangular shape in a plan view and the plurality of vias form a group. A group of vias having a grid portion that is grid-like in the plane perspective, a cutout portion provided so as to cover the grid portion in the plane perspective, and a cutout portion provided inside the grid portion, and the grid. It has an auxiliary layer portion in a region sandwiched between the portion and the cutout portion, and the width of the auxiliary layer portion includes a metal layer whose corner side of the lattice portion is larger than the central portion side of the side of the lattice portion and the insulating substrate. It has a through conductor provided in the thickness direction of the above and provided so as to penetrate the cutout portion.

According to one aspect of the present invention, the detection device includes a detection element mounting substrate having the above configuration, a detection element mounted on the first mounting portion, and an electronic element mounted on the second mounting portion. Have.

According to one aspect of the present invention, the detection module has a module substrate having a connection pad and a detection device having the above configuration connected to the connection pad via solder.

In the detection element mounting substrate according to one aspect of the present invention, the first main surface, the first mounting portion on which the detection element for detecting X-rays is mounted on the first main surface, and the first main surface face each other. A second main surface, a second mounting portion for mounting an electronic element on the second main surface, and a plurality of vias are included, and a rectangular insulating substrate in a plan view and a plurality of vias form a group. It is sandwiched between a group of vias having a grid portion that is grid-like in the plane perspective, a cutout portion that is provided so as to cover the grid portion in the plane perspective and is provided inside the grid portion, and the grid portion and the cutout portion. The width of the auxiliary layer portion is provided in the thickness direction of the insulating substrate and the metal layer whose corner side of the lattice portion is larger than the central portion side of the side of the lattice portion so as to penetrate the cutout portion. It has a through conductor provided in. With the above configuration, the metal layer provided in the auxiliary layer portion satisfactorily shields the X-rays reflected by the vias, and the metal layer is provided at the corner of the lattice portion to be wider than the side portion. The X-rays reflected by the vias on the two sides of the corner can be well shielded and the X-rays can be attenuated, the detection device operates well, and the X-rays can be detected well.

A detection device according to one aspect of the present invention includes a detection element mounting substrate having the above configuration, a detection element mounted on the first mounting portion, and an electronic element mounted on the second mounting portion. Therefore, it is possible to obtain a detection device having excellent reliability.

In the detection module according to one aspect of the present invention, a detection module having an excellent reliability is provided by having a module substrate having a connection pad and a detection device having the above configuration connected to the connection pad via solder. Can be.

(A) is a top view showing the detection device according to the first embodiment of the present invention, and (b) is a bottom view of (a). (A) is an internal upper surface perspective view of the detection device shown in FIG. 1 (a), and (b) is an enlarged internal upper surface perspective view of a main part in part B of (a). (A) is a vertical cross-sectional view taken along the line AA of the detection device shown in FIG. 1 (a), and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). It is an enlarged vertical sectional view of the main part which shows the other example of the detection apparatus in 1st Embodiment of this invention. (A) and (b) are enlarged internal top perspective views of a main part in another example of the detection device according to the first embodiment of the present invention. (A) is a top view showing the detection device according to the second embodiment of the present invention, and (b) is a bottom view of (a). (A) is a first internal upper surface perspective view of the detection device shown in FIG. 6 (a), and (b) is a second internal upper surface perspective view. FIG. 7 is an enlarged internal upper surface perspective view of a main part in which the first inner upper surface and the second inner upper surface of the portion B in FIG. 7A are seen through. (A) is a vertical cross-sectional view taken along the line AA of the detection device shown in FIG. 6 (a), and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a). FIG. 5 is an enlarged internal top view of the main part of the detection device according to the third embodiment of the present invention. (A) is a vertical cross-sectional view of the detection device according to the third embodiment of the present invention, and (b) is an enlarged vertical cross-sectional view of a main part in part C of (a).

Some exemplary embodiments of the invention will be described with reference to the accompanying drawings.

(First Embodiment)
As shown in FIGS. 1 to 3, the detection device according to the first embodiment of the present invention includes a detection element mounting substrate 1 and a detection element 2 mounted on the first main surface 11a of the detection element mounting substrate 1. And the electronic element 3 mounted on the second main surface 11b of the detection element mounting substrate 1. The detection device is connected using solder, for example, on the module substrate constituting the detection module.

The detection element mounting substrate 1 in the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. A second main surface 11b, a second mounting portion 13 for mounting an electronic element 3 on the second main surface 11b, and a plurality of vias 14, a rectangular insulating substrate 11 in a plan view, and a plurality of vias 14. The via group 14G which forms a group 14 and has a grid portion which is grid-like in the plane perspective, and the cutout portion 15a which is provided so as to cover the grid portion in the plane perspective and is provided inside the grid portion. , And an auxiliary layer portion 15 in a region sandwiched between the lattice portion and the cutout portion 15a, and the width of the auxiliary layer portion 15 is a metal layer 16 in which the corner side of the lattice portion is larger than the central portion side of the side in the lattice portion. It has a through conductor 17 which is provided in the thickness direction of the insulating substrate 11 and is provided so as to penetrate the cutout portion 15a. In FIGS. 1 to 3, the detection element mounting substrate 1 and the detection device are mounted on the xy plane in the virtual xyz space. In FIGS. 1 to 3, the upward direction means the positive direction of the virtual z-axis. It should be noted that the distinction between the upper and lower sides in the following description is for convenience, and does not limit the upper and lower sides when the detection element mounting substrate 1 and the like are actually used. Further, the thickness direction of the insulating substrate 11 means the direction of the z-axis in FIGS. 1 to 3.

Further, in the example shown in FIG. 1, the portion overlapping the side surface of the through conductor 17 is shown by a dotted line in a plan perspective. In the example shown in FIG. 2, the portion overlapping with the edge of the metal layer 16 is shown by a dotted line in plan perspective. Further, in the example shown in FIG. 2B, the region to be the auxiliary layer portion 15 is surrounded by a long two-dot chain line. Further, in the examples shown in FIGS. 3B and 4, the region to be the notch portion 15a is surrounded by a dotted line.

The insulating substrate 11 has a first main surface 11a (upper surface in FIGS. 1 to 3), a second main surface 11b (lower surface in FIGS. 1 to 3), and a side surface. The insulating substrate 11 is composed of a plurality of insulating layers 11c, and has a rectangular plate-like shape when viewed from a plan view, that is, a direction perpendicular to the main surface. The insulating substrate 11 functions as a support for supporting the detection element 2 and the electronic element 3, and the detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a and the second mounting of the second main surface 11b. The electronic element 3 is adhered and fixed on the portion 13 via a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like).

For the insulating substrate 11, for example, ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride material sintered body, a silicon nitride material sintered body, a mulite material sintered body, or a glass ceramics sintered body may be used. it can. If the insulating substrate 11 is, for example, an aluminum oxide sintered body, it is _{a raw material powder such as aluminum oxide (Al 2} O ₃ ), silicon oxide (SiO ₂ ), magnesium oxide (MgO), calcium oxide (CaO), and the like. An appropriate organic binder, solvent, etc. are added and mixed to prepare a muddy syrup. A ceramic green sheet is produced by molding this slurry into a sheet shape by adopting a conventionally known doctor blade method, calendar roll method, or the like. Next, the insulating substrate 11 is formed by subjecting the ceramic green sheet to an appropriate punching process, laminating a plurality of ceramic green sheets to form a product, and firing the product at a high temperature (about 1600 ° C.). It will be manufactured.

A first mounting portion 12 for mounting the detection element 2 is provided on the first main surface 11a of the insulating substrate 11, and a second mounting portion 13 for mounting the electronic element 3 on the second main surface 11b of the insulating substrate 11. Is provided. A wiring conductor 18 for electrically connecting to the detection element 2 is led out from the first main surface 11a of the insulating substrate 11. A wiring conductor 18 for electrically connecting to the electronic element 3 is led out from the second main surface 11b of the insulating substrate 11.

The wiring conductor 18 is provided on the main surface and inside of the insulating substrate 11. The wiring conductor 18 is for electrically connecting the detection element 2 and the electronic element 3 mounted on the detection element mounting substrate 1 to the module substrate. The wiring conductor 18 includes a wiring layer provided on the surface or inside of the insulating substrate 11 and a penetrating conductor 17 that electrically connects the wiring layers located above and below the insulating layer 11c constituting the insulating substrate 11 to each other. Includes. In the example shown in FIGS. 1 to 3, the wiring conductor 18 has a plurality of insulating layers 11c of the insulating substrate 11 in the thickness direction (z direction in FIG. 1) from the first main surface 11a to the second main surface 11b. A penetrating conductor 17 is formed.

The wiring conductor 18 is a metal powder metallizing containing, for example, tungsten (W), molybdenum (Mo), manganese (Mn) and the like as main components. For example, when the insulating substrate 11 is made of an aluminum oxide sintered body, a metallized paste obtained by adding and mixing an appropriate organic binder and a solvent to a refractory metal powder such as W, Mo or Mn is insulated. A predetermined pattern is printed and applied to the ceramic green sheet for the substrate 11 in advance by a screen printing method, and the ceramic green sheet for the insulating substrate 11 is fired at the same time to be adhered and formed at a predetermined position on the insulating substrate 11. The wiring conductor 18 is formed by, for example, printing and applying a metallized paste for the wiring conductor 18 to a ceramic green sheet for the insulating substrate 11 by a printing means such as a screen printing method and firing it together with the ceramic green sheet for the insulating substrate 11. Will be done. When the wiring conductor 18 is a through conductor 17, for example, a through hole for the through conductor is formed in the ceramic green sheet for the insulating substrate 11 by a processing method such as punching by a mold or punching or laser processing. This through hole is filled with a metallized paste for a through conductor by the above printing means, and is formed by firing together with a ceramic green sheet for an insulating substrate 11. The metallized paste is prepared by adding an appropriate solvent and a binder to the above-mentioned metal powder and kneading the paste to adjust the viscosity to an appropriate level. In addition, in order to increase the bonding strength with the insulating substrate 11, glass powder and ceramic powder may be contained.

The via 14 is provided inside the insulating substrate 11 in the thickness direction of the insulating substrate 11 (z direction in FIG. 1). The via 14 attenuates the X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1, passes through the second main surface 11b side of the insulating substrate 1, and is irradiated to the electronic element 3. It suppresses the occurrence. A material mainly made of tungsten or molybdenum is preferably used for the via 14, and the via 14 is formed by the same method as the through conductor of the wiring conductor 18 described above. In the example shown in FIGS. 1 to 3, the via 14 is provided on the insulating layer 11c provided at the center in the thickness direction of the insulating substrate 11 among the plurality of laminated insulating layers 11c constituting the insulating substrate 11. There is. The via 14 has a circular shape in a plan view. In the element mounting substrate 1 of the first embodiment, the via 14 is cylindrical. The detection element mounting substrate 1 has a plurality of vias 14 inside the insulating substrate 11, and the plurality of vias 14 form a group 14G. Group 14G has a grid portion that is grid-like. Here, the fact that the group 14G has a grid portion indicates that the group 14G of a plurality of vias 14 are arranged in a grid pattern as in the example shown in FIG. In the example shown in FIG. 2, the group 14G of the plurality of vias 14 are arranged in a grid pattern so as to surround the penetrating conductor 17 of the wiring conductor 18 in plan perspective. In this case, the distance between the penetrating conductor 17 and the via 14 of the wiring conductor 18 is larger than the distance between the adjacent vias 14 arranged in the vicinity in the plan perspective, and the plurality of vias 14 are the distance between the adjacent wiring conductors 18. It is arranged along the central portion of the through conductors 17.

The detection element mounting substrate 1 has a plurality of vias 14 inside the insulating substrate 11, and the plurality of vias 14 form a group 14G. Group 14G has a grid portion that is grid-like. Here, the fact that the group 14G has a grid portion indicates that the group 14G of a plurality of vias 14 are arranged in a grid pattern as in the example shown in FIG. In the example shown in FIG. 2, the group 14G of the plurality of vias 14 are arranged in a grid pattern so as to surround the through conductor of the wiring conductor 18 in plan perspective. In this case, the distance between the penetrating conductor of the wiring conductor 18 and the via 14 is larger than the distance between adjacent vias 14 arranged in the vicinity in plan perspective, and the plurality of vias 14 penetrate the adjacent wiring conductor 18. It is arranged along the central part of the conductors.

In the plane perspective, a plurality of vias 14 form a group 14G so as to cover the non-forming portion of the scintillator that converts X-rays into light, and the vias 14 are provided in a grid pattern in the plane perspective. There is. The group 14G is provided wider than the width of the non-formed portion of the scintillator in planar fluoroscopy. By reducing the irradiation of the X-rays transmitted through the insulating substrate 11 to the electronic element 3 mounted on the second mounting portion 13 of the detection element mounting substrate 1, the functional deterioration of the electronic element 3 is suppressed. It can detect and process electrical signals well.

The thickness of the via 14 (the length of the insulating substrate 11 in the Z direction) is set by the intensity of X-rays, and is formed to be, for example, about 100 μm to 300 μm. In the example shown in FIG. 3, the via 14 is formed on one insulating layer 11c arranged at the center of the insulating substrate 11 in the thickness direction. However, as in the example shown in FIG. 4, the insulating substrate 11 is formed. A plurality of insulating layers 11c may be formed inside the structure. For example, vias 14 having a thickness of 100 μm are formed on two insulating layers 11c, respectively, and these insulating layers 11c are stacked in the thickness direction of the insulating substrate 11 to form vias 14 having a thickness of 200 μm. It doesn't matter. In this case, by reducing the thickness of one insulating layer 11c on which the via 14 is provided, the thickness of the one insulating layer 11c is increased when the substrate 1 for mounting the detection element is manufactured. Since it is possible to prevent cracks from occurring between the vias 14 and to reduce the distance between the vias 14 in the same insulating layer 11c, a plurality of vias 14 are densely packed in the insulating substrate 11 in a grid pattern. Even if the heat of the electronic element 3 or the like is transferred to the detection element mounting substrate 1 when the detection device is operated and stress is generated due to the thermal expansion difference between the insulating layer 11c and the via 14, the plurality of vias 14 may be provided. Stress is dispersed in the lattice portion of the group 14G according to the above, and it is possible to suppress the occurrence of distortion in the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. The thickness of one insulating layer 11c on which the via 14 is provided is preferably not more than the diameter of the via 14. Further, in order to make the effect in each group 14G efficient, it is preferable that the thicknesses of the respective insulating layers 11c are the same, that is, they are provided evenly. Further, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is the stress of the group 14G due to the plurality of vias 14 when the stress is applied to the side surface side of the insulating substrate 11. In order to prevent the dispersion from being out of balance, it is preferable that the arrangement is larger than the distance between adjacent vias 14. More preferably, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is at least twice the distance between the adjacent vias 14.

Further, if the thickness of the insulating layer 11c on the first main surface 11a side and the thickness of the insulating layer 11c on the second main surface 11b side are made larger than the thickness of the insulating layer 11c on which the via 14 is provided, the via 14 is formed. By holding the provided insulating layer 11c so as to sandwich it, it is possible to suppress heat generation during operation of the detection device and distortion of the detection element mounting substrate 1, and it is possible to detect X-rays satisfactorily. ..

Further, in plan perspective, the group 14G formed by the plurality of vias 14 has an extending portion L extending from the lattice portion. With such a configuration, heat of the electronic element 3 or the like is transferred to the substrate 1 for mounting the detection element when the detection device is operated, and stress is generated due to the difference in thermal expansion between the insulating layer 11c which is an insulator and the via 14 which is a metal conductor. Even if an attempt is made, the stress is dispersed in the lattice portion of the group 14G by the plurality of vias 14 and the extension portion L extending from the lattice portion, and it is possible to suppress the occurrence of distortion even in the vicinity of the outside of the lattice portion. It can detect X-rays well.

In the extending portion L as well, the distance between the via 14 arranged on the outermost peripheral side of the insulating substrate 11 and the insulating substrate 11 is at least twice the distance between the adjacent vias 14 as described above. It is preferable to have.

In the plan perspective, the extending portion L extending from the lattice portion is provided on the peripheral edge portion of the insulating substrate 11. With such a configuration, heat of the electronic element 3 or the like is transferred to the detection element mounting substrate 1 when the detection device is operated, and the insulating layer 11c which is an insulator and the metal are formed on the peripheral edge (outer edge) of the detection element mounting substrate 1. Even if stress due to the difference in thermal expansion with the conductor via 14 is about to be generated, the stress is dispersed by the lattice portion of the group 14G due to the plurality of vias 14 and the extending portion L extending from the lattice portion, and the detection element. It is possible to suppress the occurrence of distortion even at the peripheral edge of the mounting substrate 1, and it is possible to detect X-rays satisfactorily.

The detection element mounting substrate 1 is provided so as to cover the grid portion in planar fluoroscopy, and is provided with a cutout portion 15a provided inside the grid portion and an auxiliary layer in a region sandwiched between the grid portion and the cutout portion 15a. It has a portion 15, and in the width of the auxiliary layer portion 15, the corner side W1 of the lattice portion has a metal layer 16 larger than the central portion side W2 of the side of the lattice portion (W1> W2). Further, the detection element mounting substrate 1 has a through conductor 17 provided in the thickness direction of the insulating substrate 11 and provided so as to penetrate the cutout portion 15a.

Similar to the via 14, the metal layer 16 is provided in a grid pattern so as to overlap the non-forming portion of the scintillator that converts X-rays into light in the plane perspective, and is a group of a plurality of vias 14 in the plane perspective. It is provided so as to overlap with 14G. The width of the metal layer 16 (distance between adjacent cutout portions 15a) is set to be larger than the width of the plurality of vias 14 (interval between adjacent auxiliary layer portions 15). When the metal layer 16 is provided so as to overlap the group 14G of the plurality of vias 14, the metal layer 16 satisfactorily holds the plurality of vias 14 and suppresses the distortion of the detection element mounting substrate 1, and the vias 14 suppress the distortion. X-rays can be well attenuated and X-rays can be detected well.

A material mainly made of tungsten or molybdenum is preferably used for such a metal layer 16, and it can be manufactured by the same manufacturing method as that of the wiring conductor 18 described above. When the width of the metal layer 16 is made larger than the width of the lattice portion in the plan view, the metal layer 16 satisfactorily holds a plurality of vias 14, and when the detection device is operated, the metal layer 16 is attached to the detection element mounting substrate 1. It is possible to suppress the occurrence of distortion, and it is possible to detect X-rays satisfactorily.

A metal plating layer is adhered to the surface of the wiring conductor 18 exposed from the insulating substrate 11 by an electroplating method or an electroless plating method. The metal plating layer is made of a metal having excellent corrosion resistance such as nickel, copper, and gold and connectivity with the connecting member 4. For example, a nickel plating layer having a thickness of about 0.5 to 5 μm and a gold plating layer having a thickness of about 0.1 to 3 μm. And are sequentially adhered. by this,
Corrosion of the wiring conductor 18 can be effectively suppressed, and the connection between the wiring conductor 18 and the connecting member 4 and the connection between the wiring conductor 18 and the connection pad for connection formed on the module substrate can be strengthened.

The detection element 2 is mounted on the first mounting portion 12 of the first main surface 11a of the detection element mounting substrate 1, and the electronic element 3 is mounted on the second mounting portion 13 of the second main surface 11b of the detection element mounting substrate 1. A detection device can be manufactured by mounting the device.

The detection element 2 is an element for converting X-rays incident on the detection element mounting substrate 1 into an electric signal. The detection element 2 has, for example, a scintillator that converts X-rays into light and a photodiode that converts light into an electric signal. The X-rays incident on the detection device are converted into light by a scintillator, and the light is converted into an electric signal by a photodiode. The electronic element 3 is an element for detecting an electric signal output from the detection element 2 and processing it as information, and is, for example, an integrated circuit device. The detection element 2 and the electronic element 3 are wired to the electrode of the detection element 2 or the electrode of the electronic element 3 via, for example, a connecting member 4 such as a solder bump, a gold bump, or a conductive resin (anisometric conductive resin or the like). The conductor 18 is electrically and mechanically connected to be mounted on the detection element mounting substrate 1.

The wiring conductor 18 of the detection device of the present embodiment is connected to the connection pad of the module substrate via solder to form a detection module.

The detection element mounting substrate 1 in the present embodiment is relative to the first main surface 11a, the first mounting portion 12 on which the detection element 2 for detecting X-rays is mounted on the first main surface 11a, and the first main surface 11a. A second main surface 11b, a second mounting portion 13 for mounting an electronic element 3 on the second main surface 11b, and a plurality of vias 14, a rectangular insulating substrate 11 in a plan view, and a plurality of vias 14. The via group 14G which forms a group 14 and has a grid portion which is grid-like in the plane perspective, and the cutout portion 15a which is provided so as to cover the grid portion in the plane perspective and is provided inside the grid portion. , And an auxiliary layer portion 15 in a region sandwiched between the lattice portion and the cutout portion, and the width of the auxiliary layer portion 15 is a metal layer 16 in which the corner side W1 of the lattice portion is larger than the central side W2 of the side in the lattice portion. And a through conductor 17 provided in the thickness direction of the insulating substrate 11 and provided so as to penetrate the cutout portion 15a. With the above configuration, the metal layer 16 provided on the auxiliary layer portion 15 satisfactorily shields the X-rays reflected by the vias, and the metal layer 16 is provided wider than the side portion at the corner portion of the lattice portion. Therefore, the X-rays reflected by the vias on the two sides sandwiching the corner of the lattice portion can be satisfactorily shielded and the X-rays can be attenuated, the detection device operates well, and the X-rays are detected satisfactorily. be able to.

The cutout portion 15a may have a quadrangular shape in planar perspective as shown in FIG. 5 (a), or a polygonal shape such as an octagonal shape in planar perspective as shown in FIG. 5 (b). Absent. In the example shown in FIG. 5, as in the example shown in FIG. 2B, the portion overlapping the edge of the metal layer 16 is shown by a dotted line in a plan perspective, and the region to be the auxiliary layer portion 15 is shown. It is surrounded by a long two-dot chain line.

In the plan perspective, when the width of the auxiliary layer portion 15 gradually increases from the central portion side W2 of the lattice portion to the corner portion side W1 of the lattice portion, the width of the auxiliary layer portion 15 only in the corner portion is increased. Compared to the X-rays, the X-rays reflected near the corners of the grid portion are more easily shielded by the metal layer 16 of the auxiliary layer portion 15, and the X-rays reflected by the vias on the two sides sandwiching the corners of the grid portion. Can be satisfactorily shielded to attenuate X-rays, the detection device can operate satisfactorily, and X-rays can be satisfactorily detected.

Further, in the plan perspective, if the cutout portion 15a is circular, the X-rays reflected near the corner portion of the lattice portion can be easily shielded by the metal layer 16 of the auxiliary layer portion 15, and the two sides sandwiching the corner portion can be easily shielded. The X-rays reflected from the direction can be satisfactorily shielded and the X-rays can be attenuated, and the X-rays can be detected satisfactorily.

Further, when the surface density of the metal layer 16 is higher than that of the via 14, the X-rays reflected well by the metal layer 16 of the auxiliary layer portion 15 can be attenuated. For example, the content ratio of tungsten or molybdenum in the metal layer 16 may be larger than the content ratio of tungsten or molybdenum in the via 14. When the via 14 is a metal conductor using molybdenum as the main raw material, the metal layer 16 is a metal conductor using tungsten as the main raw material, so that the surface density of the metal layer 16 is larger than the surface density of the via 14. It doesn't matter.

In the detection device according to one aspect of the present invention, the detection element mounting substrate 1 having the above configuration, the detection element 2 mounted on the first mounting portion 12, and the electronic element 3 mounted on the second mounting portion 13 are provided. By having it, it is possible to obtain a detection device having excellent reliability.

In the detection module according to one aspect of the present invention, a detection module having an excellent reliability is provided by having a module substrate having a connection pad and a detection device having the above configuration connected to the connection pad via solder. Can be.

(Second Embodiment)
Next, the detection device according to the second embodiment of the present invention will be described with reference to FIGS. 6 to 9.

The detection device according to the second embodiment of the present invention differs from the detection device according to the first embodiment described above in that a plurality of vias 14 (one via 14a and the other via 14b) have two insulating layers 11c. The point is that one via 14a and the other via 14b are provided so as to be offset from each other in plan perspective.

Further, in the example shown in FIG. 6, the portion overlapping the side surface of the through conductor 17 is shown by a dotted line in a plan perspective. In the examples shown in FIGS. 7 and 8, the portion overlapping the edge of the metal layer 16 and the portion overlapping the side surface of the other via 14b are shown by dotted lines in plan perspective. Further, in the example shown in FIG. 8, the region to be the auxiliary layer portion 15 is surrounded by a long two-dot chain line. Further, in the example shown in FIG. 9, the region to be the notch portion 15a is surrounded by a dotted line.

According to the detection element mounting substrate 1 in the second embodiment of the present invention, the metal layer 16 provided in the auxiliary layer portion 15 reflects with vias, similarly to the detection device substrate 1 in the first embodiment. The metal layer 16 shields X-rays well, and since the metal layer 16 is provided wider than the sides at the corners of the lattice portion, the X-rays reflected by the vias on the two sides sandwiching the corners of the lattice portion are good. The X-rays can be attenuated by shielding the X-rays, the detection device operates well, and the X-rays can be detected well.

Further, since a plurality of vias 14 are provided so as to be offset in the plane direction, the reflection of the vias 14 is reduced, the irradiation of the cutout portion 15a side of the auxiliary layer portion 15 is reduced, and X-rays are detected better. can do.

Further, the group 14G of the via 14 has a grid-like lattice portion in each of the insulating layers 11c. One via 14a and the other via 14b are provided on the respective insulating layers 11c with the same diameter and the same thickness. Further, one via 14a and the other via 14b having a circular shape are arranged so as to be offset from each other in plan perspective. That is, the vias 14b provided on one of the insulating layers 11c are sandwiched between the plurality of vias 14a provided on the other insulating layer 11c in a plan view as in the examples shown in FIGS. 4 to 7. It is arranged so as to cover it. Further, the plurality of vias 14a provided on the other insulating layer 11c are similarly arranged so as to cover between the one vias 14b in the plan perspective. As a result, in planar fluoroscopy, the non-formed portion of the via 14 in the group 14G of the plurality of via 14 is reduced, and the X-rays irradiated to the first main surface 11a side of the detection element mounting substrate 1 are satisfactorily blocked. , It is possible to satisfactorily suppress the irradiation of the electronic element 3 by transmitting through the second main surface 11b side of the insulating substrate 11.

The thickness of the insulating layer 11c provided with one via 14a and the other via 14b is preferably not more than the diameter of each via 14. Further, in order to make the effect of each group 14G efficient, it is preferable that the thickness of the insulating layer 11c of the insulating layer 11ca provided with the one via 14a and the other via 14b is the same.

Further, for the same reason as described above, the extending portion L is provided on the insulating layer 11c provided with one via 14a and the insulating layer 11c provided with the other via 14b, as in the example shown in FIG. Is preferable.

The detection element mounting substrate 1 of the second embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

(Third Embodiment)
Next, the detection device according to the third embodiment of the present invention will be described with reference to FIGS. 10 and 11. The difference from the detection device of the above-described embodiment is that the via 14a composed of a plurality of vias 14 is provided on the three insulating layers 11c, and the via 14 provided on the three insulating layers 11c (first via 14c). , The second via 14d and the third via 14e) are the points at which the vias 14 are arranged so as to be offset from each other in the plan perspective.

Further, in the example shown in FIG. 9, in planar perspective, a portion overlapping the edge of the metal layer 16, a portion overlapping the side surface of the first via 14c, and a portion overlapping the side surface of the third via 14e are dotted. It is shown in. Further, in the example shown in FIG. 9, the region to be the auxiliary layer portion 15 is surrounded by a long two-dot chain line. Further, in the example shown in FIG. 10, the portion overlapping the side surface of the first via 14c and the portion overlapping the side surface of the third via 14e are indicated by dotted lines in the vertical cross-sectional perspective, and the notch portion 15a is formed. The area is surrounded by a dotted line.

According to the detection element mounting substrate 1 according to the third embodiment of the present invention, the metal layer 16 provided in the auxiliary layer portion 15 reflects by vias, similarly to the detection device substrate 1 of the first embodiment. Since the metal layer 16 is provided wider than the sides at the corners of the lattice portion, the X-rays reflected by the vias on the two sides sandwiching the corners of the lattice portion are reflected. The X-rays can be well shielded and attenuated, the detection device operates well, and the X-rays can be detected well.

Further, since a plurality of vias 14 are provided so as to be offset in the plane direction, the reflection of the vias 14 is reduced, the irradiation of the cutout portion 15a side of the auxiliary layer portion 15 is reduced, and X-rays are detected better. can do.

According to the detection element mounting substrate 1 according to the third embodiment of the present invention, the heat of the electronic element 3 or the like is generated when the detection device is operated, as in the case of the detection device mounting substrate 1 of the first embodiment. Even if stress is transmitted to the substrate 1 due to the difference in thermal expansion between the insulating layer 11c and the via 14, the stress is dispersed in the lattice portion of the group 14G due to the plurality of vias 14, and the substrate 1 for mounting the detection element is distorted. Can be suppressed, and X-rays can be detected satisfactorily.

Further, the group 14G of the via 14 has a grid-like lattice portion in each of the insulating layers 11c. The first via 14c, the second via 14d, and the third via 14e are provided on the respective insulating layers 11c with the same diameter and the same thickness. Further, the vias 14 provided in the respective insulating layers 11c are arranged so as to be offset from each other in plan perspective. That is, the first via 14c is provided so as to cover between the second via 14d and the third via 14e in plan perspective. The first via 14c provided on the first insulating layer 11c, the second via 14d provided on the second insulating layer 11c, and the via 14c provided on the third insulating layer 11c are flat surfaces. In perspective, the virtual lines connecting the centers of the adjacent circular vias 14 are arranged so as to form a triangle. With this configuration, in planar perspective, the first via 14c is arranged so as to cover between the second via 14d and the third via 14, and the non-forming portion of the via 14 in the group 14G of the plurality of vias 14 It is good that the X-rays emitted to the first main surface 11a side of the detection element mounting substrate 1 are satisfactorily blocked, transmitted to the second main surface 11b side, and irradiated to the electronic element 3. Can be suppressed. The first via 14c, the second via 14d, and the third via 14e are arranged so that the virtual lines connecting the centers of the respective vias 14 have a regular triangular shape in plan perspective. It is more preferable to be. In the above case, the vias 14 (first via 14c, second via 14d, third via 14c) provided on the three insulating layers 11c are planar perspectives of the vias 14 provided on the same insulating layer 11c. If the distance is set to twice the diameter, the space between the vias 14 can be well covered.

Further, even if the number of vias 14 in one insulating layer 11c in the insulating substrate 11 is reduced, a plurality of grid-like groups 14G can be densely provided in the insulating substrate 11 in plan perspective, and thus for mounting a detection element. At the time of manufacturing the substrate 1, it is possible to prevent the occurrence of cracks between adjacent vias 14 in one insulating layer 11c.

The thickness of the insulating layer 11c provided with the first via 14c, the second via 14d, and the third via 14e is preferably not more than the diameter of each via 14. Further, in order to make the effect of each group 14G efficient, the thickness of the insulating layer 11c of the insulating layer 11c provided with the first via 14c, the second via 14d, and the third via 14e may be the same. preferable.

The thickness of each via 14 (14c to 14e) is the thickness of the adjacent via 14 (14c to 14e) in plan perspective.
It is preferable that the gap is at least 14c to 14e).

Further, also in the element mounting substrate 1 of the third embodiment, for the same reason as described above, the three insulating layers 11c provided with the first via 14c, the second via 14d, and the third via 14e are provided. It is preferable to provide an extension portion L for each.

The detection element mounting substrate 1 of the third embodiment can be manufactured by using the same manufacturing method as the detection element mounting substrate 1 of the first embodiment described above.

The present invention is not limited to the examples of the above-described embodiments, and various modifications can be made. For example, the insulating substrate 11 may have a rectangular shape having a notch or a chamfered portion on a side surface or a corner portion in a plan view.

Further, in the detection element mounting substrate 1 of the first embodiment, as shown in the example shown in FIG. 4, the vias 14 are arranged on a plurality of insulating layers 11c so that the vias 14 overlap each other in planar fluoroscopy. Although an example is shown, in the detection element mounting substrate 1 of the second and third embodiments, the vias 14 are arranged on the plurality of insulating layers 11c, and the vias 14 are arranged in a plane perspective. It may be provided so as to overlap each other.

Further, in the detection element mounting substrate 1 of the first embodiment and the detection element mounting substrate 1 of the third embodiment, the group 14G of the via 14 is provided in the central portion of the insulating substrate 11 in the thickness direction. However, it may be provided unevenly on one main surface side of the insulating substrate 11. The group 14G of the via 14 may be provided unevenly on the side of the first main surface 11a on which the detection element 2 is mounted, for example. Since it is provided on the first main surface 11a side close to the detection element 2, the misalignment of the via 14 with respect to the X-rays irradiated to the first main surface 11a of the insulating substrate 11 via the non-forming portion of the scintillator is suppressed, and the position is satisfactorily improved. X-rays can be shielded by group 14G of via 14 and metal layer 16.

Further, in the detection element mounting substrate 1 of the third embodiment, the first via 14c, the second via 14d, and the third via 14e are provided on the insulating layer 11c composed of three layers. A plurality of sets may be provided in the thickness direction with the insulating layer 11c composed of layers as one set. For example, vias 14 are placed in the order of the first via 14c, the second via 14d, the third via 14e, the first via 14c, the second via 14d, and the third via 14e on the six-layer insulating layer 11c. It may be formed. As a result, X-rays can be shielded more effectively.

Further, the detection element mounting substrate 1 may be manufactured in the form of a large number of detection element mounting substrates.

1 ... Substrate for mounting detection elements
11 ... Insulation substrate
11a ・ ・ ・ First main surface
11b ・ ・ ・ 2nd main surface
12 ... 1st mounting part
13 ... 2nd mounting part
14 (14a, 14b) ... Via
14c ・ ・ ・ First via
14d ・ ・ ・ Second via
14e ・ ・ ・ Third beer
14G ... (of multiple vias) group
15 ... Auxiliary layer
15a ・ ・ ・ Cutout
16 ... Metal layer
17 ... Through conductor
18 ... Wiring conductor
15 ... Wiring conductor
16 ... Metal layer 2 ... Detection element 3 ... Electronic element 4 ... Connecting member

Claims (5)

A first main surface, a first mounting portion on which a detection element for detecting X-rays is mounted on the first main surface, a second main surface facing the first main surface, and an electronic element on the second main surface. A second mounting part on which the X-rays are mounted, and an insulating substrate that is rectangular in plan view and includes a plurality of vias.
A group of vias in which the plurality of vias form a group and have a grid portion that is grid-like in plan perspective,
In plan perspective, it has a cutout portion provided inside the grid portion and an auxiliary layer portion in a region sandwiched between the grid portion and the cutout portion, which is provided so as to cover the lattice portion. The width of the auxiliary layer portion is a metal layer in which the corner side of the lattice portion is larger than the central portion side of the side in the lattice portion.
A substrate for mounting a detection element, which is provided in the thickness direction of the insulating substrate and has a through conductor provided so as to penetrate the cutout portion. The substrate for mounting a detection element according to claim 1, wherein the width of the auxiliary layer portion gradually increases from the central portion side of the lattice portion to the corner side of the lattice portion in the plan perspective. The substrate for mounting a detection element according to claim 1 or 2, wherein the cutout portion is circular in plan perspective. The substrate for mounting the detection element according to any one of claims 1 to 3.
The detection element mounted on the first mounting portion and
A detection device comprising an electronic element mounted on the second mounting portion. Module board with connection pad and
The detection module according to claim 4, further comprising the detection device according to claim 4, which is connected to the connection pad via solder.