JP6836712B2 - Manufacturing method of electronic device, projection device and electronic device - Google Patents

Description

The present invention relates to an electronic device, a projection device, and a method for manufacturing the electronic device.

Examples of the device in which the electronic device is incorporated include a projection device that projects a screen of a personal computer, a video image, an image based on image data stored in a memory card or the like, or the like on the screen.

The projection device disclosed in Patent Document 1 includes an electronic device such as a red light source device composed of a red light emitting diode and an excitation light irradiation device composed of a plurality of blue laser diodes, which is also referred to as a blue light source device. The excitation light from the excitation light irradiation device is irradiated to the fluorescence wheel, and the green fluorescent light is emitted from the fluorescence wheel. Then, the red, green, and blue light sources are applied to an electronic device incorporating a display element, and the electronic device emits image light via the projection side optical system to produce a color image on the screen. Is projected.

Further, electronic components such as a red light emitting diode, a blue laser diode, and a display element including a DMD (Digital Micromirror Device) generate heat when driven by a projection device. Therefore, an electronic device including these electronic components is provided with a heat sink for cooling each electronic component.

Japanese Unexamined Patent Publication No. 2013-196946

Generally, electronic components may not be able to exhibit their predetermined performance when dust adheres to them. For example, if dust adheres to a semiconductor light emitting element such as a red light emitting diode or a blue laser diode in a projection device, the brightness may decrease. Further, if dust adheres to a display element such as a DMD and an optical component such as a lens, the image quality may deteriorate due to pixel loss, color unevenness, or the like.

On the other hand, if the members are sealed with an adhesive or a putty-like material in order to strengthen the sealed structure, it becomes necessary to remove the adhesive or the like at the time of maintenance requiring replacement of the members or the like. Therefore, it is difficult to form a closed structure for the connection surface of the member that supports the electronic component that generates heat in consideration of maintainability.

An object of the present invention is to provide an electronic device having good maintainability while reducing the adhesion of dust to electronic components, a projection device provided with the electronic device, and a method for manufacturing the electronic device.

The electronic device of the present invention is a plate-shaped member in which a heat radiating device having a heat transmitting portion and a first opening in which the heat radiating device is arranged on one side and the heat transmitting portion of the heat radiating device is inserted are formed. The substrate, electronic components arranged on the other side of the substrate so that the heat radiating surface is located on the first opening side of the substrate, and the heat of the radiating device in the first opening of the substrate. A sealing member having a tubular portion arranged on the outer periphery with a gap between the transfer portion, the heat transfer portion of the heat radiating device and the heat radiating surface of the electronic component, and the heat transfer portion of the heat radiating device. It is characterized by including a heat conductive member filled between the sealing member and the tubular portion of the sealing member.

The projection device of the present invention includes the above-mentioned electronic device, a light source device including a red light source device, a green light source device, and a blue light source device, and a light source that guides light from the light source device to the electronic component that is a display element. It is characterized by including a side optical system, a projection side optical system that projects an image emitted from the electronic component, and a control unit that controls the light source device and the electronic component.

In the method for manufacturing an electronic device of the present invention, a substrate having a first opening and a heat radiating surface of an electronic component connected via a frame-shaped connecting portion arranged on the substrate are arranged and fixed so as to face each other. The step, the step of placing a tubular sealing member having an annular flat plate portion on one end side, and the step of placing a pressing plate having a second opening on the heat radiating surface, and the pressing plate portion is placed on the pressing plate portion. The step of sandwiching between the plate and the substrate, the step of placing a sheet-shaped heat conductive member having a predetermined thickness on the heat radiating surface of the electronic component, and the step of placing the protruding heat transfer portion of the heat radiating device are described above. Inserted into the first opening of the substrate and the second opening of the presser plate, the sealing member is arranged on the outer periphery of the heat transfer portion, and the end portion of the heat conductive member is sealed. It is characterized by including a step of plastically deforming the heat conductive member so as to be located between the member and the heat transfer portion.

According to the present invention, it is possible to provide an electronic device having good maintainability while reducing the adhesion of dust to electronic components, a projection device provided with the electronic device, and a method for manufacturing the electronic device.

It is an external perspective view which shows the projection apparatus which concerns on embodiment of this invention. It is a figure which shows the functional block of the projection apparatus which concerns on embodiment of this invention. It is a plane schematic diagram which shows the internal structure of the projection apparatus which concerns on embodiment of this invention. It is a schematic diagram which showed a part of the display element apparatus which concerns on embodiment of this invention in the cross section. It is a figure which looked at the sealing member which concerns on embodiment of this invention from above. FIG. 5 is a sectional view taken along line VI-VI of FIG. 5 of a sealing member according to an embodiment of the present invention. It is VII-VII sectional view of FIG. 4 of the display element apparatus which concerns on embodiment of this invention. It is a partially exploded view which showed the display element apparatus which concerns on embodiment of this invention in the cross section. It is a figure which shows the modification of the sealing member which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of the projection device 10. In the present embodiment, the left and right directions in the projection device 10 indicate the left and right directions with respect to the projection direction, and the front and back indicate the front and rear directions with respect to the screen side direction of the projection device 10 and the traveling direction of the light flux.

As shown in FIG. 1, the housing of the projection device 10 has a substantially rectangular parallelepiped shape, and has a side panel including a front panel 12, a back panel 13, a right panel 14 and a left panel 15, and a top panel 11 and a bottom panel 16. It is formed by. The projection device 10 has a projection unit on the left side of the front panel 12. Further, the front panel 12 is provided with a plurality of intake / exhaust holes 17. Although not shown, the projection device 10 includes an Ir receiving unit that receives a control signal from the remote controller.

Further, the upper surface panel 11 is provided with a key / indicator unit 37. The key / indicator unit 37 is notified when a power switch key, a power indicator for notifying power on / off, a projection switch key for switching projection on / off, a light source device, a display element, a control circuit, or the like overheats. Keys and indicators such as an overheat indicator are arranged.

Further, the rear panel 13 is provided with an input / output connector and a power adapter provided with a USB terminal (not shown), a D-SUB terminal for inputting an analog RGB video signal, an S terminal, an RCA terminal, an audio output terminal, and the like. Various terminals such as plugs are provided. Further, a plurality of intake holes are formed on the back panel 13.

Next, the projection device control unit of the projection device 10 will be described with reference to the functional block diagram of FIG. The projection device control unit includes a control unit 38, an input / output interface 22, an image conversion unit 23, a display encoder 24, a display drive unit 26, and the like.

The control unit 38 controls the operation of each circuit in the projection device 10, and is composed of a ROM that fixedly stores operation programs such as a CPU and various settings, a RAM that is used as a work memory, and the like. ing.

Then, the image signals of various standards input from the input / output connector unit 21 by the projection device control unit are in a predetermined format suitable for display by the image conversion unit 23 via the input / output interface 22 and the system bus (SB). After being converted so as to be unified with the image signal of, it is output to the display encoder 24.

Further, the display encoder 24 expands and stores the input image signal in the video RAM 25, generates a video signal from the stored contents of the video RAM 25, and outputs the video signal to the display drive unit 26.

The display drive unit 26 functions as a display element control means, and drives the display element 51, which is a spatial light modulation element (SOM), at an appropriate frame rate in response to the image signal output from the display encoder 24. To do. The projection device 10 irradiates the display element 51 with a bundle of light rays emitted from the light source device 60 via the light source side optical system to form an optical image (image light) with the reflected light of the display element 51 and project the light. An image is projected and displayed on a screen (not shown) via a side optical system. The movable lens group 235 of the projection side optical system is driven by the lens motor 45 for zoom adjustment and focus adjustment.

The image compression / decompression unit 31 performs a recording process in which the luminance signal and the color difference signal of the image signal are data-compressed by processing such as ADCT and Huffman coding and sequentially written to the memory card 32 which is a detachable recording medium.

Further, the image compression / decompression unit 31 reads the image data recorded in the memory card 32 in the playback mode, decompresses the individual image data constituting the series of moving images in units of one frame, and converts the image data into an image. A process is performed in which the data is output to the display encoder 24 via the unit 23 and a moving image or the like can be displayed based on the image data stored in the memory card 32.

The operation signal of the key / indicator unit 37 composed of the main key and the indicator provided on the upper surface panel 11 of the housing is directly sent to the control unit 38, and the key operation signal from the remote controller is the Ir receiving unit 35. The code signal received by the Ir processing unit 36 and demodulated by the Ir processing unit 36 is output to the control unit 38.

A voice processing unit 47 is connected to the control unit 38 via a system bus (SB). The audio processing unit 47 includes a sound source circuit such as a PCM sound source, converts audio data into analog in the projection mode and the reproduction mode, and drives the speaker 48 to emit loud sound.

Further, the control unit 38 controls a light source control circuit 41 as a light source control means, and the light source control circuit 41 so that light in a predetermined wavelength band required at the time of image generation is emitted from the light source device 60. , Individual control for emitting red, green and blue wavelength band light of the light source device 60 is performed.

The control unit 38 causes the cooling fan drive control circuit 43 to detect the temperature by a plurality of temperature sensors provided in the light source device 60 or the like, and controls the rotation speed of the cooling fan from the result of the temperature detection. Further, the control unit 38 keeps the cooling fan rotating even after the power of the projection device main body is turned off by a timer or the like in the cooling fan drive control circuit 43, or the power supply of the projection device 10 main body depends on the result of temperature detection by the temperature sensor. It also controls such as turning off.

Next, the internal structure of the projection device 10 will be described with reference to FIG. FIG. 3 is a schematic plan view showing the internal structure of the projection device 10. The projection device 10 includes a control circuit board 241 in the vicinity of the left panel 15. The control circuit board 241 includes a power supply circuit block, a light source control block, and the like. On the right side panel 14 side of the control circuit board 241, a display element 51 and a display element device 300 which is an electronic device including a heat sink 190 as a heat radiating device for cooling the display element 51 are arranged. In this embodiment, DMD is used as the display element 51. Further, the projection device 10 is provided with a light source device 60 on the front right side of the projection device 10 housing. Further, a light source side optical system 170 is arranged between the light source device 60 and the back panel 13. A projection side optical system 220 is arranged on the left side panel 15 side of the projection device 10.

The light source device 60 includes an excitation light irradiation device 70, a red light source device 120, and a green light source device 80. The excitation light irradiation device 70 is not only a light source for blue wavelength band light (blue light source device) but also an excitation light source. The red light source device 120 is a light source for red wavelength band light. The green light source device 80 is a light source for green wavelength band light, and is composed of an excitation light irradiation device 70 and a fluorescent screen device 100.

The light source device 60 is provided with a light guide optical system 140. The light guide optical system 140 guides light in each of the blue, red, and green wavelength bands emitted from the excitation light irradiation device 70, the red light source device 120, and the green light source device 80, and emits the light to the light source side optical system 170. To do.

The excitation light irradiation device 70 is arranged in the vicinity of the front panel 12 at a substantially central portion on the front side in the housing of the projection device 10. The excitation light irradiation device 70 is provided with a blue laser diode 71 which is a plurality of semiconductor light emitting elements arranged so that the optical axis is parallel to the right side panel 14 and the left side panel 15. A heat sink 81 is provided on the front panel 12 side of the blue laser diode 71. Further, on the optical axis of each blue laser diode 71, a plurality of collimator lenses 73 that convert the emitted light from each blue laser diode 71 into parallel light so as to enhance the directivity are arranged. In the present embodiment, a total of eight blue laser diodes 71 and a collimator lens 73 in 2 rows and 4 columns are arranged in the excitation light irradiation device 70.

The red light source device 120 is arranged side by side on the right side of the excitation light irradiation device 70, and includes a red light source 121 and a condenser lens group 125. The red light source 121 is arranged so that the optical axis is parallel to the emitted light of the blue laser diode 71. The red light source 121 is a red light emitting diode which is a semiconductor light emitting element that emits light in the red wavelength band. The condenser lens group 125 collects the red wavelength band light emitted from the red light source 121. The optical axis of the red wavelength band light emitted by the red light source device 120 intersects the optical axis of the blue wavelength band light emitted from the excitation light irradiation device 70 and subsequently reflected by the first reflection mirror 141.

The red light source device 120 includes a heat sink 130 on the front panel 12 side of the red light source 121. On the other hand, a cooling fan 261 is arranged on the left side of the excitation light irradiation device 70. The cooling air from the cooling fan 261 is blown to the heat sink 81 of the excitation light irradiation device 70 and the heat sink 130 of the red light source device 120. Therefore, the blue laser diode 71 and the red light source 121 are cooled by the heat sinks 81 and 130, respectively.

The fluorescent plate device 100 constituting the green light source device 80 is arranged in the vicinity of the right panel 14. The phosphor plate device 100 is arranged on the optical path of the excitation light emitted from the excitation light irradiation device 70 and subsequently reflected by the first reflection mirror 141.

Here, the fluorescent plate device 100 includes a fluorescent plate 101, a motor 110, a condenser lens group 111, and a condenser lens 115. The fluorescent plate 101 is a fluorescent wheel and is arranged so as to be parallel to the right panel 14, that is, to be parallel to the optical axis of the emitted light of the excitation light irradiation device 70.

The motor 110 rotates and drives the fluorescent plate 101. The condensing lens group 111 condenses the light bundle of the excitation light emitted from the excitation light irradiation device 70 and reflected by the first reflection mirror 141 on the fluorescent plate 101, and is emitted from the fluorescent plate 101 in the direction of the left panel 15. Condenses a bundle of rays. The condenser lens 115 collects a bundle of light rays transmitted or diffused by the fluorescent plate 101. A cooling fan 262 is arranged on the right side panel 14 side of the motor 110, and the fluorescent plate device 100 and the like are cooled by the cooling fan 262.

The fluorescence plate 101 is provided with a fluorescence emission region and a transmission region continuously in the circumferential direction. The fluorescence light emitting region receives the light emitted from the excitation light irradiation device 70 via the condenser lens group 111 as the excitation light, and emits the fluorescence light in the green wavelength band. The transmission region transmits or diffuses the excitation light emitted from the excitation light irradiation device 70.

As the base material of the fluorescent plate 101, a metal base material made of copper, aluminum, or the like can be used. An annular groove is formed on the surface of the base material on the excitation light irradiation device 70 side. Further, the bottom of this groove is mirrored by silver vapor deposition or the like, and a layer of green phosphor is laid on the bottom. Further, a transparent base material having translucency is fitted into the cut-out translucent portion of the base material in the transmission region. Further, when a region for diffusing and transmitting excitation light is arranged as a transmission region, a transparent base material having fine irregularities formed on the surface by sandblasting or the like is fitted.

When the green phosphor layer of the fluorescent plate 101 is irradiated with the blue wavelength band light emitted from the excitation light irradiation device 70, the green phosphor is excited and emits the green wavelength band light in all directions. The fluorescently emitted green wavelength band light is emitted to the left panel 15 side and incident on the condenser lens group 111. On the other hand, the blue wavelength band light emitted from the excitation light irradiation device 70 incident on the transmission region is transmitted or diffused and transmitted through the fluorescent plate 101, and is arranged on the back side (in other words, the right panel 14 side) of the fluorescent plate 101. It is incident on the condenser lens 115.

The light guide optical system 140 is a condensing lens that condenses light bundles in the blue wavelength band, red wavelength band, and green wavelength band, and guides the light bundles in each color wavelength band to the same optical axis by converting the optical axes. It is equipped with a reflective mirror, a dichroic mirror, etc. Specifically, the light guide optical system 140 includes a first reflection mirror 141, a condenser lens 151, a diffuser plate 152, a first dichroic mirror 142, a second reflection mirror 143, a condenser lens 146, a third reflection mirror 149, and a collection. It is composed of an optical lens 147, a condenser lens 145, and a second dichroic mirror 148.

The first reflection mirror 141 is arranged on the back panel 13 side of the excitation light irradiation device 70. The first reflection mirror 141 converts the optical axis of the blue wavelength band light emitted from the excitation light irradiation device 70 by 90 degrees in the direction of the right panel 14.

The condenser lens 151 is arranged on the right side panel 14 side of the first reflection mirror 141. The diffuser plate 152 is arranged on the right side panel 14 side of the condenser lens 151. The excitation light reflected by the first reflection mirror 141 is collected by the condenser lens 151 and diffused by the diffuser plate 152.

The first dichroic mirror 142 is located at a position where the blue wavelength band light diffused and transmitted through the diffuser plate 152, the green wavelength band light emitted from the fluorescent plate 101, and the red wavelength band light emitted from the red light source device 120 intersect. Have been placed. The first dichroic mirror 142 transmits blue wavelength band light and red wavelength band light, and reflects green wavelength band light. The optical axis of the green wavelength band light is converted by 90 degrees in the 13 direction of the back panel.

Further, the second reflection mirror 143 is arranged between the condenser lens 115 and the right panel 14. The second reflection mirror 143 reflects the blue wavelength band light and converts the optical axis of the blue wavelength band light by 90 degrees in the rear panel 13 direction. A condenser lens 146 is arranged on the back panel 13 side of the second reflection mirror 143. Further, a third reflection mirror 149 is arranged on the back panel 13 side of the condenser lens 146. The third reflection mirror 149 converts the optical axis of the blue wavelength band light reflected by the second reflection mirror 143 and incident through the condenser lens 146 by 90 degrees toward the left panel 15. A condenser lens 147 is arranged on the left panel 15 side of the third reflection mirror 149.

On the other hand, a condenser lens 145 is arranged on the back panel 13 side of the first dichroic mirror 142. The red wavelength band light transmitted through the first dichroic mirror 142 and the green wavelength band light reflected by the first dichroic mirror 142 so as to coincide with the optical axis of the red wavelength band light are incident on the condenser lens 145.

Further, a second dichroic mirror 148 is arranged at a position on the back panel 13 side of the condenser lens 145 and on the left side panel 15 side of the condenser lens 147. The second dichroic mirror 148 reflects the red wavelength band light and the green wavelength band light, and transmits the blue wavelength band light. The red wavelength band light and the green wavelength band light transmitted through the condenser lens 145 are reflected by the second dichroic mirror 148 and incident on the condenser lens 173 of the light source side optical system 170.

On the other hand, the blue wavelength band light transmitted through the condenser lens 147 passes through the second dichroic mirror 148 and is incident on the condenser lens 173. Therefore, the optical axes of the blue wavelength band light, the red wavelength band light, and the green wavelength band light are matched by being transmitted or reflected by the second dichroic mirror 148.

The light source side optical system 170 includes a condenser lens 173, a light tunnel 175, a condenser lens 178, a condenser lens 179, an irradiation mirror 185, and a condenser lens 195. Since the condenser lens 195 emits the image light emitted from the display element 51 arranged on the back panel 13 side of the condenser lens 195 toward the fixed lens group 225 and the movable lens group 235, the projection side optical system 220 It is also part of.

The condenser lens 173 is arranged between the light tunnel 175 and the second dichroic mirror 148. The condensing lens 173 condenses the light source light on the incident port of the light tunnel 175. The blue wavelength band light, the red wavelength band light, and the green wavelength band light collected by the condenser lens 173 are incident on the light tunnel 175. The light beam incident on the light tunnel 175 has a uniform intensity distribution due to the light tunnel 175.

The condenser lenses 178 and 179 are arranged on the optical axis on the left panel 15 side of the light tunnel 175. The light beam emitted from the light tunnel 175 is irradiated to the irradiation mirror 185 via the condenser lenses 178 and 179, and is reflected by the irradiation mirror 185 to the condenser lens 195. The light beam reflected by the irradiation mirror 185 is irradiated to the display element 51 at a predetermined angle via the condenser lens 195. The display element 51 is cooled by a heat sink 190 provided on the back panel 13 side. The display element device 300 holds optical components such as a display element 51, a heat sink 190, a condenser lens 195, a condenser lens 179, an irradiation mirror 185, and a projection side optical system 220 by a holding member 310.

The light bundle, which is the light source light emitted from the image forming surface of the display element 51 by the light source side optical system 170, is reflected by the image forming surface of the display element 51 and projected onto the screen as projected light via the projection side optical system 220. Will be done.

Here, the projection side optical system 220 is composed of a condenser lens 195, a movable lens group 235, a fixed lens group 225, and the like. The movable lens group 235 is formed so as to be movable by a lens motor. Further, the movable lens group 235 and the fixed lens group 225 are built in the fixed lens barrel. Therefore, the projection side optical system 220 is configured as a variable focus type lens capable of zoom adjustment and focus adjustment.

By configuring the projection device 10 in this way, when the fluorescent plate 101 is rotated and light is emitted from the excitation light irradiation device 70 and the red light source device 120 at different timings, the blue, red, and green wavelength band lights are induced. It is sequentially incident on the condensing lens 173 and the light tunnel 175 of the light source side optical system 170 via the optical optical system 140, and further incident on the display element 51. Therefore, a color image can be projected on the screen by displaying the light of each color in a time-division manner according to the data displayed by the DMD which is the display element 51 of the projection device 10.

Next, the display element device 300, which is an electronic device, will be described. As shown in FIG. 4, the display element device 300 includes a display element 51 which is an electronic component, a heat sink 190 which is a heat dissipation device, a condenser lens 195, a condenser lens 179, an irradiation mirror 185, and a projection side optical system 220. Is integrally held by the holding member 310. In FIG. 4, only the portion where the holding member 310 holds the display element 51 and the heat sink 190 is shown in a cross-sectional view.

An optical path space 312 is formed in the center of the holding member 310. A condenser lens 195 is held in the optical path space 312. On the other hand, a substrate 320 is provided on the rear end surface of the holding member 310. A long rectangular first opening 321 long in the left-right direction is formed in the center of the substrate 320 (see also FIG. 7). A heat sink 190 is arranged on the back panel 13 side (that is, the back side) in FIG. 3, which is one side of the substrate 320. The display element 51 is arranged on the front panel 12 side (that is, the front side) in FIG. 3, which is the other side of the first opening 321 of the substrate 320. A micromirror is arranged on the front surface of the display element 51, and a heat radiating surface is provided on the back surface.

The display element 51 is frontally supported by the contact surface of the front edge portion of the display element 51 contacting the front viewing frame-shaped step portion 314 formed in the optical path space 312 on the back side of the condenser lens 195. .. The display element 51 is connected to a socket 52 for the display element 51 formed in a front view frame shape at the edge portion on the back side. The socket 52 has an opening 521 in the center and is arranged at the front edge of the first opening 321 of the substrate 320. The connection terminal 52a protrudes from the back surface of the socket 52. The connection terminal 52a is electrically connected to the substrate 320. Therefore, due to the length of the connection terminal 52a, the back surface of the socket 52 is separated from the front surface of the substrate 320 by a predetermined gap. In this way, the socket 52 functions as a connecting portion of electronic components for electrically connecting the display element 51 to the substrate 320.

A frame-shaped cushion 53 is provided on the outer periphery of the display element 51 and the socket 52 between the step portion 314 and the substrate 320. For the cushion 53, an elastic material such as resin, rubber, or non-woven fabric can be used. The cushion 53 is arranged from the front side of the substrate 320 to the back side of the step portion 314.

A pressing plate 330 formed of a metal such as aluminum or a resin is provided on the back surface side of the substrate 320. A sheet metal member 340 is provided on the back side of the presser plate 330. Bolts 350 are inserted into the holes for the bolts in the sheet metal member 340, the pressing plate 330, and the substrate 320. Then, two bolts 350 are screwed into the two left and right female screw portions 316 formed on the holding member 310. Therefore, the sheet metal member 340, the pressing plate 330, and the substrate 320 are fixed to the holding member 310. Further, in the central portion of the pressing plate 330 and the sheet metal member 340, a second opening 331 and an opening 341 narrower than the first opening 321 of the substrate 320 are formed, respectively. The second opening 331 and the opening 341 of the pressing plate 330 and the sheet metal member 340 may have the same shape as the first opening 321 of the substrate 320.

A spacer 390 is provided between the sheet metal member 340 and the heat sink 190. At the center of the spacer 390, an opening 391 having the same shape as the second opening 331 and the opening 341 of the substrate 320, the pressing plate 330, and the sheet metal member 340 is formed.

The heat sink 190, which is a heat radiating device, has a plurality of heat radiating fins 191 as heat radiating portions on the back surface. In FIG. 4, a plurality of heat radiating fins 191 are arranged in the direction from the front side to the back side. Therefore, the plurality of heat radiation fins 191 are formed with the left-right direction of FIG. 4 as the longitudinal direction. Further, the plurality of grooves formed between the heat radiation fins 191 are formed in the left-right direction in FIG.

A protruding heat transfer portion 192 is formed on the front side of the heat sink 190. The cross section of the heat transfer unit 192 in front view has an elongated rectangular shape as shown in FIG. As shown in FIG. 4, the heat transfer unit 192 is formed in a size that can be inserted into the first opening 3211, the second opening 331, the opening 341, and the opening 391. The heat sink 190 can be formed by extrusion molding. It should be noted that protrusions may be formed on the four side surfaces of the heat sink 190 except for the corners of the outer periphery of the heat transfer portion 192. In this case, the protrusion is formed so as to be inclined from the heat radiation fin 191 side to the display element 51 side. The height of the protrusion is high on the heat radiation fin 191 side, and the height is gradually lowered by hanging on the display element 51 side.

The sheet metal member 340 is formed with leaf spring portions 342 on each of the left and right sides. A female screw portion 343 is formed on each leaf spring portion 342. Bolts 360 are inserted into the two bolt holes 193 on the left and right of the heat sink 190. The bolt 360 is also inserted into the bolt hole 392 of the spacer 390 and screwed into the female thread portion 343 of the leaf spring portion 342. As a result, the spacer 390 and the heat sink 190 are fixed to the sheet metal member 340 and urged toward the display element 51 on the front side by the urging force of the leaf spring portion 342 that functions as the urging means.

The tip of the bolt 360 is located in the hole 332 of the presser plate 330. This prevents interference between the tip of the bolt 360 and the back surface of the substrate 320.

Next, the sealing member 370 will be described with reference to FIGS. 5 and 6. FIG. 5 is a view of the sealing member 370 as viewed from above in FIG. 4, and FIG. 6 is a sectional view taken along line VI-VI of FIG. 5 of the sealing member 370. Hereinafter, in the description of the sealing member 370, the front side of FIG. 5, which is the side on which the heat sink 190 is arranged, is the back surface, and the opposite side is the front surface.

The sealing member 370 is formed in a substantially tubular shape as a whole. As the sealing member 370, a material having electrical insulation and heat resistance is used, and for example, a flexible material such as an insulating metal, a resin, and rubber can be used. Further, a material having thermal conductivity can be used for the sealing member 370. The sealing member 370 has a tubular portion 371 formed in a substantially rectangular tubular shape in a plan view (see FIG. 5). An annular flat plate portion 372 that stands upright toward the outside is formed on the outer periphery of the tubular portion 371 on one end side on the heat sink 190 side. The outer shape of the flat plate portion 372 is formed to have a substantially rectangular shape in a plan view. Further, a rectangular opening 373 is formed in the center of the tubular portion 371.

Further, a cushioning member 374 is continuously provided in an annular shape on the outer peripheral side surface of the tubular portion 371. As the cushioning member 374, an elastic member such as rubber can be used, and an annular member such as an O-ring may be provided by winding it around the outer circumference of the tubular portion 371, or may be provided by attaching an elastic member. May be good.

As shown in FIG. 4, the tubular portion 371 of the sealing member 370 is arranged between the outer circumference of the heat transfer portion 192 and the inner circumference of the first opening 321 and the opening 521 of the socket 52. At this time, a gap is formed between the tubular portion 371 and the heat transfer portion 192. Further, the cushioning member 374 provided on the outer circumference of the cylinder portion 371 shown in FIGS. 5 and 6 is arranged between the outer circumference of the cylinder portion 371 and the inner circumference of the first opening 321 and the opening 521. The flat plate portion 372 is sandwiched between the substrate 320 and the pressing plate 330. The lower end 371a of the tubular portion 371 is formed up to the heat radiating surface of the display element 51. The lower end 371a may be formed so as to be in contact with the display element 51.

The tubular portion 371 formed in the shape of a square tube of the sealing member 370 is made of a deformable material. Therefore, when the heat transfer portion 192 of the heat sink 190 is pressed, the sealing member 370 is pushed outward by the protrusion formed in the heat transfer portion 192 of the heat sink 190, so that the cushioning member 374 and the outer substrate 320 You will definitely be in contact. Also. When the heat transfer portion 192 of the heat sink 190 is inserted into the tubular portion 371 of the sealing member 370 and pressed, the protrusion formed on the heat transfer portion 192 of the heat sink 190 is formed to be inclined, so that the heat sink 190 is smoothed. Can be inserted into.

A heat conductive member 380 such as a heat conductive putty is provided between the front end surface of the heat transfer unit 192 and the back surface of the display element 51. Further, the end portion 381 of the heat conductive member 380 is located closer to the heat radiation fin 191 of the heat sink 190 than the tip surface of the heat transfer portion 192 so as to be located between the inner surface of the tubular portion 371 and the heat transfer portion 192. ing.

The thermally conductive member 380 is a clay-like material having thermal conductivity, flame retardancy, electrical insulation and the like, and mainly made of silicon and having a low hardness. Therefore, the heat conductive member 380 can be easily plastically deformed with a low load and has high adhesion. The front end surface of the heat transfer unit 192 and the back surface of the display element 51 are in close contact with each other via a heat conductive member 380.

The display element 51 of the display element device 300 generates heat when the projection device 10 is driven. Then, the heat generated by the display element 51 is transferred from the heat radiating surface on the back surface side of the display element 51 to the heat transfer unit 192 via the heat conductive member 380. Then, the heat transferred to the heat transfer unit 192 is dissipated by the plurality of heat radiating fins 191 of the heat sink 190.

Next, the dustproof function of the display element device 300 of the present embodiment will be described. When the projection device 10 is activated, the external air taken in by the cooling fans 261,262 (see FIG. 3) circulates inside the projection device 10 and is exhausted. At this time, even in a normal usage environment, dust is mixed in the external air taken into the projection device 10.

Normally, the optical path space 312 is shielded from the space on the heat radiation fin 191 side of the heat sink 190, and it is desirable that the external space does not invade. A small gap on the surface causes an inflow of air. In the present embodiment, by providing the sealing member 370, the degree of shielding between the optical path space 312 and the space on the heat radiation fin 191 side can be improved.

As specifically shown in FIG. 4, it is assumed that the external air enters through the boundary a between the heat sink 190 and the spacer 390 and the gap b between the spacer 390 and the sheet metal member 340. The external air that has entered from the boundary a passes through the gap between the opening 391 and the heat transfer portion 192, the gap between the opening 341 and the heat transfer portion 192, and the gap between the second opening 331 and the heat transfer portion 192. To reach. Further, the external air that has entered through the gap b reaches the gap between the opening 341 and the heat transfer unit 192, and the gap between the second opening 331 and the heat transfer unit 192. Further, the inner circumference of the substrate 320 is covered with the cylinder portion 371, and the external air entering from the boundary a and the gap b reaches the gap between the cylinder portion 371 and the heat transfer portion 192. However, the gap between the inner circumference of the tubular portion 371 and the outer circumference of the heat transfer portion 192 is sealed by the heat conductive member 380 from the middle. Therefore, the outside air is prevented from entering after that.

Further, it is assumed that the outside air invades from the boundary c between the substrate 320 and the holding plate 330. The external air that has entered from the boundary c moves along the surface direction of the substrate 320 and the pressing plate 330 and reaches the first opening 321 side of the substrate 320, but is sealed by the flat plate portion 372 of the sealing member 370 on the way. Therefore, further intrusion is prevented.

Further, it is assumed that the outside air enters from the boundary d between the holding member 310 and the substrate 320. The external air that has entered from the boundary d moves along the surface direction of the holding member 310 and the substrate 320 and reaches the socket 52 side, but since it is sealed by the cushion 53 on the way, further intrusion is prevented. To. Therefore, even if external air invades due to the gaps b and the boundaries a, c, and d formed between the heat sink 190, the spacer 390, the holding plate 330, the substrate 320, and the holding member 310, the sealing member 370 and heat The conductive member 380 or the cushion 53 can effectively prevent dust contained in the external space from entering the optical path space 312.

The contact portion where the contact surface of the front edge portion of the display element 51 and the back surface of the step portion 314 are in contact with each other is not sealed. However, due to the cushion 53, dust of external air adheres to a plurality of micromirrors on the front side of the display element 51 from the outer periphery of the display element 51 via a contact portion where the display element 51 and the step portion 314 come into contact with each other. There is nothing to do.

Since the holding member 310 is sufficiently larger than the display element 51, the holding member 310 is hardly deformed by heat generation of the display element 51. Therefore, the cushion 53, the holding member 310, and the substrate 320 are brought into close contact with each other to prevent dust from entering from the outside of the cushion 53.

Next, a method of manufacturing the display element device 300 will be described with reference to FIGS. 8 and 4. In this manufacturing method, a substrate 320 having a first opening 321 and a heat radiating surface of a display element 51 which is an electronic component connected via a socket 52 which is a frame-shaped connecting portion arranged in the substrate 320 are formed. A step of arranging and fixing them so as to face each other, a step of mounting a tubular sealing member 370 having an annular flat plate portion 372 on one end side, and a holding plate 330 having a second opening 331 mounted on the heat radiating surface thereof. A step of placing the flat plate portion 372 between the pressing plate 330 and the substrate 320, a step of placing a sheet-shaped heat conductive member 380 having a predetermined thickness on the heat radiating surface of the electronic component, and a heat radiating device. The protruding heat transfer portion 192 of the (heat sink 190) is inserted into the first opening 321 and the second opening 331 to arrange the sealing member 370 on the outer periphery of the heat transfer portion 192, and the heat conductive member 380. Includes a step of plastically deforming the thermally conductive member 380 so that the end 381 of the is located between the sealing member 370 and the heat transfer portion 192.

Specifically, it is as follows. First, in FIG. 8, the display element 51 is placed on the step portion 314 of the holding member 310. At this time, the display element 51 is placed on the step portion 314 so that the heat radiating surface on the back surface side is on the heat sink 190 side. Next, the socket 52 is connected to the front edge of the first opening 321 of the substrate 320, and the substrate 320 having the cushion 53 arranged on the outer periphery of the socket 52 is arranged at the rear end of the holding member 310. After that, the sealing member 370 is placed from the back surface side of the substrate 320. The presser plate 330 is arranged on the back side of the substrate 320, and the sheet metal member 340 is arranged on the back side of the presser plate 330. Then, the bolt 350 is screwed into the female threaded portion 316 of the holding member 310 to fix the sheet metal member 340, the pressing plate 330, and the substrate 320 to the holding member 310.

Next, the heat conductive member 380 formed in the form of a sheet is placed on the heat radiating surface of the display element 51. After that, the heat transfer portion 192 of the heat sink 190 is inserted into the first opening 321, the second opening 331, the opening 341, and the opening 391 of the substrate 320, the pressing plate 330, the sheet metal member 340, and the spacer 390 to transfer heat. The tip surface of the portion 192 and the heat conductive member 380 are brought into contact with each other. Then, the bolt 360 is inserted into the bolt holes 193 and 392 of the heat sink 190 and the spacer 390, and the bolt 360 and the female screw portion 343 in the leaf spring portion 342 of the sheet metal member 340 are screwed together.

When the bolt 360 is tightened, the heat sink 190 moves to the front side while being urged toward the front side by the leaf spring portion 342. Then, a load is applied to the heat conductive member 380 by the heat transfer unit 192, and the heat conductive member 380 is plastically deformed. Due to the plastic deformation of the heat conductive member 380, the heat conductive member 380 between the tip surface of the heat transfer unit 192 and the heat radiation surface of the display element 51 is crushed and thinned, and as shown in FIG. , The heat conductive member 380 begins to fill the gap between the heat radiating surface of the display element 51 and the heat transfer unit 192. Then, by further tightening the bolt 360, the heat conductive member 380 is filled between the outer circumference of the heat transfer portion 192 and the inner circumference of the cylinder portion 371. The substrate 320 and the pressing plate 330 are sealed by the flat plate portion 372 of the sealing member 370.

In the above manufacturing method, the display element 51 is placed on the holding member 310, the substrate 320 and the like are placed on the holding member 310 and fixed, and then the heat conductive member 380 is placed on the heat radiating surface of the display element 51. However, if the display element 51 is connected to the socket 52 before arranging the substrate 320 on the holding member 310, the heat conductive member 380 is placed on the heat radiating surface of the display element 51, and then the substrate 320 and the like are mounted. It may be arranged and fixed to the holding member 310.

Next, a modified example of the sealing member 370 will be described. FIG. 9 is a diagram showing a sealing member 370A which is a modified example of the sealing member 370. This figure is a cross-sectional view at a position corresponding to the VI-VI cross section of FIG. In the following description, the same components as those of the sealing member 370 are designated by the same reference numerals, and the description thereof will be omitted or simplified.

The sealing member 370 is formed so that the thickness of the lower end 371a of the tubular portion 371 gradually becomes thinner. Specifically, the tubular portion 371 formed in a square tubular shape has a parallel inner peripheral surface 371b substantially parallel to the outer peripheral surface on the back surface side, and the distance from the outer peripheral surface gradually increases toward the lower end 371a on the front surface side. It has an inclined inner peripheral surface 371c that is closer and inclined in a convex curved shape with respect to the inside.

Such a sealing member 370A is arranged so as to be located on the outer periphery of the heat transfer unit 192 as shown in FIG. 4, and the heat transfer unit 192 is urged toward the display element 51 on which the heat conductive member 380 is arranged. Then, the contact area between the heat conductive member 380 and the heat radiating surface of the display element 51 can be made wider. Therefore, it is possible to prevent the heat conductive member 380 from flowing out to the socket 52, the substrate 320, and the holding plate 330, and to enhance the heat dissipation effect and the dustproof effect of the heat generated by the display element 51. The inclined inner peripheral surface 371c may be a flat inclined surface.

As described above, according to the present embodiment, since the heat conductive member 380 does not invade the gaps between the substrate 320 and the socket 52, brushing or the like is performed during maintenance such as attaching or detaching the heat sink 190 or the like due to parts replacement or the like. The cleaning work of the heat conductive member 380 can be omitted. Further, it is possible to eliminate the concern that the moisture or the like of the display element 51 invades the gaps between the parts and deteriorates the metal portion. Therefore, the display element device 300 can improve dustproofness and maintainability while having heat dissipation.

Further, by using a heat conductive resin or an insulating treated member as the material of the sealing member 370, the heat of the display element 51 can be efficiently transferred to the holding plate 330 side which is a metal part. Therefore, since the heat generated from the display element 51 can be dispersed and sent to a plurality of places, the cooling of the display element 51 can be advantageously promoted.

Although the electronic device of the present embodiment has been described above, the heat transfer portion 192 of the heat sink 190 may have a contact surface with the heat conductive member 380 having another configuration. For example, the heat transfer unit 192 may be provided with a groove on the contact surface with the heat conductive member 380. A plurality of grooves may be provided in a straight line or may be provided in a plurality of directions. Further, the groove portion may be formed in a circular shape or a quadrangular shape. Further, the cross-sectional shape of the groove portion may be a concave curved shape or a concave rectangular shape. The shape and depth of such a groove may be changed depending on the position of the heat transfer unit 192 on the contact surface with the heat conductive member 380.

Although the display element device 300, which is an electronic device, is configured in this way, the present invention can also be another electronic device including other electronic components. For example, it may be an electronic device including a semiconductor light emitting element such as a light emitting diode or a laser diode. In this case, the heat transfer portion may have another shape such as a columnar shape according to the shape of the heat radiating surface of the electronic component.

Further, as an urging means for urging the heat sink 190 to the front side, the leaf spring portion 342 is formed on the sheet metal member 340 in the present embodiment, but the present invention is not limited to this, and a coil spring or the like wound around the bolt 360 is used. You can also do it.

Further, the flat plate portion 372 of the sealing member 370 may be provided with a protrusion having a convex curved cross section on the substrate 320 side or the pressing plate 330 side. The protrusions can be formed in an annular shape along the flat plate portion 372. Thereby, a stronger sealing structure can be formed.

As described above, according to the embodiment of the present invention, the electronic device (display element device 300) and the projection device 10 provided with the electronic device include a sealing member 370 and a heat conductive member 380. The sealing member 370 includes a tubular portion 371 arranged on the outer periphery of the first opening 321 of the substrate 320 and the second opening 331 of the holding plate 330 with a gap from the heat transfer portion 192 of the heat sink 190, and the tubular portion. An annular flat plate portion 372 sandwiched between the substrate 320 and the pressing plate 330 is provided on one end side of the 371. Further, the heat conductive member 380 is filled between the heat transfer portion 192 and the heat radiation surface of the display element 51, and between the heat transfer portion 192 and the cylinder portion 371. Therefore, the heat conductive member 380 is filled between the inner circumference of the tubular portion 371 and the outer circumference of the heat transfer portion 192, and a sealing structure for preventing the intrusion of dust can be formed. Therefore, it is possible to configure the electronic device and the projection device 10 with good maintainability while reducing the adhesion of dust to the electronic components.

Further, the electronic device further provided with the cushioning member 374 in which the tubular portion 371 is formed in an annular shape on the outer peripheral side surface is also sealed between the outer periphery of the tubular portion 371 and the inner circumference of the first opening 321 and the opening 521. Since the stop structure is formed, it is possible to more reliably prevent the intrusion of outside air.

Further, in the electronic device in which the flat plate portion 372 is formed toward the outside of the first opening 321 of the substrate 320 and the second opening 331 of the presser plate 330, the relative positions of the substrate 320 and the presser plate 330 are in the plane direction. Even if the flat plate portion 372 is displaced, the width of the flat plate portion 372 is wider than the gap between the heat transfer portion 192 and the tubular portion 371, so that the sealing structure and the arrangement relationship of the heat conductive member 380 are not disrupted, and external air invades. Can be reliably prevented.

Further, an electronic device in which the other end side of the tubular portion 371 in the axial direction extends to the heat radiation surface of the display element 51, which is an electronic component, has thermal conductivity from the heat radiation surface of the display element 51 to the heat transfer portion 192. While filling with the member 380, it is possible to easily prevent the heat conductive member 380 from leaking to surrounding parts such as the socket 52 and the substrate 320. Therefore, when replacing parts such as the heat sink 190, it is possible to save the trouble of removing the heat conductive member 380.

Further, the electronic device in which the heat radiating device is urged toward the electronic component side by the urging means enhances the adhesion between the display element 51 and the heat transfer unit 192 via the heat conductive member 380 and also has thermal conductivity. The end portion 381 of the member 380 can be positioned on the outer peripheral side of the heat transfer portion 192 by plastic deformation. Therefore, it is possible to form a sealing structure that reduces the thermal resistance from the display element 51 to the heat sink 190 and prevents the intrusion of external air into the optical path space 312.

Further, the electronic device in which the urging means is the leaf spring portion 342 having the female screw portion 343 for fixing the heat radiating device with the bolt 360 can easily configure the urging means.

The method of manufacturing the electronic device (display element device 300) of the present embodiment includes a step of arranging and fixing the substrate 320 and the heat radiating surface of the electronic component (display element 51) facing each other, and an annular shape on one end side of the heat radiating surface. A step of placing a tubular sealing member 370 having a flat plate portion 372 and a step of placing a pressing plate 330 having a second opening 331 and sandwiching the flat plate portion 372 between the pressing plate 330 and the substrate 320. And the process of placing the heat conductive member 380 on the heat dissipation surface of the electronic component, and the heat transfer part 192 of the heat dissipation device (heat sink 190) is inserted into the first opening 321 and the second opening 331 and sealed. The member 370 is arranged on the outer periphery of the heat transfer portion 192, and the heat conductive member 380 is plastically deformed so that the end portion 381 of the heat conductive member 380 is located between the sealing member 370 and the heat transfer portion 192. Including the process. Therefore, the heat conductive member 380 is filled between the inner circumference of the tubular portion 371 and the outer circumference of the heat transfer portion 192, and a sealing structure for preventing the intrusion of dust can be formed. Therefore, it is possible to configure the electronic device and the projection device 10 with good maintainability while reducing the adhesion of dust to the electronic components.

Although it is said that an annular flat plate portion 372 that stands upright toward the outside is formed on the outer periphery of the sealing member 370 on the one end side of the heat sink 190 side, the flat plate portion 372 may be omitted.

Moreover, the embodiment described above is presented as an example, and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

The inventions described in the first claims of the present application are described below.
[1] A heat radiating device having a heat transfer unit and
A substrate of a plate-shaped member in which the heat radiating device is arranged on one side and a first opening into which the heat transfer portion of the heat radiating device is inserted is formed.
Electronic components arranged on the other surface side of the substrate so that the heat dissipation surface is located on the first opening side of the substrate.
A sealing member having a tubular portion arranged on the outer periphery of the first opening of the substrate with a gap from the heat transfer portion of the heat radiating device.
A heat conductive member filled between the heat transfer portion of the heat radiating device and the heat radiating surface of the electronic component, and between the heat transfer portion of the heat radiating device and the tubular portion of the sealing member. ,
An electronic device comprising.
[2] Further provided with a holding plate which is arranged between the heat radiating device and the substrate and has a second opening into which the heat transfer portion is inserted.
The sealing member includes an annular flat plate portion sandwiched between the substrate and the holding plate on one end side of the tubular portion.
The heat transfer portion is formed in a protruding shape and is formed in a protruding shape.
The heat radiating device is arranged on one side of the substrate.
The electronic components are connected via a frame-shaped connecting portion arranged on the substrate.
The electronic device according to the above [1].
[3] The electronic device according to the above [1] or the above [2], wherein the tubular portion further includes a cushioning member formed in an annular shape on an outer peripheral side surface.
[4] The electronic device according to the above [2], wherein the flat plate portion is formed toward the outside of the first opening and the second opening.
[5] The electron according to any one of the above [1] to [4], wherein the other end side of the cylinder portion in the axial direction is formed up to the heat radiation surface of the electronic component. apparatus.
[6] The electronic device according to any one of the above [1] to [5], wherein the heat radiating device is urged toward the electronic component side by an urging means.
[7]
The electronic device according to the above [6], wherein the urging means is a leaf spring having a female screw portion for fixing the heat radiating device with a bolt.
[8] A plurality of heat radiating fins provided at positions facing the heat transfer unit of the heat radiating device are provided.
Protrusions are formed on a part of each side surface of the heat transfer portion except for the corners on the outer peripheral side surface.
The protrusion is formed so as to be inclined from the heat radiation fin side to the electronic component side.
According to the above [1] to [7], the protrusion is formed so as to be inclined so that the height gradually decreases from the heat radiation fin side to the electronic component side. The electronic device described.
[9] The electronic device according to any one of the above [1] to [8],
A light source device including a red light source device, a green light source device, and a blue light source device,
A light source side optical system that guides light from the light source device to the electronic component that is a display element, and
A projection side optical system that projects an image emitted from the electronic component,
A control unit that controls the light source device and the electronic components,
A projection device characterized by comprising.
[10] A step of arranging and fixing a substrate having a first opening and a heat radiating surface of an electronic component connected via a frame-shaped connecting portion arranged on the substrate so as to face each other.
A step of placing a tubular sealing member having an annular flat plate portion on one end side on the heat radiating surface, and
A step of placing a pressing plate having a second opening and sandwiching the flat plate portion between the pressing plate and the substrate.
A step of placing a sheet-shaped heat conductive member having a predetermined thickness on the heat radiating surface of the electronic component, and
The protruding heat transfer portion of the heat radiating device is inserted into the first opening of the substrate and the second opening of the presser plate so that the sealing member is arranged on the outer periphery of the heat transfer portion, and the heat transfer device is arranged. A step of plastically deforming the heat conductive member so that the end portion of the heat conductive member is located between the sealing member and the heat transfer part.
A method of manufacturing an electronic device, which comprises.

10 Projector 11 Top panel 12 Front panel 13 Back panel 14 Right panel 15 Left panel 16 Bottom panel 17 Intake and exhaust holes 21 Input / output connector 22 Input / output interface 23 Image conversion 24 Display encoder 25 Video RAM 26 Display drive 31 Image compression / Extension unit 32 Memory card 35 Ir receiver 36 Ir processing unit 37 Key / Indicator unit 38 Control unit 41 Light source control circuit 43 Cooling fan drive control circuit 45 Lens motor 47 Sound processing unit 48 Speaker 51 Display element 52 Socket (connection unit) 52a Connection terminal 53 Cushion 60 Light source device 70 Excitation light irradiation device 71 Blue laser diode 73 Collimeter lens 80 Green light source device 81 Heat sink 100 Fluorescent plate device 101 Fluorescent plate 110 Motor 111 Condensing lens group 115 Condensing lens 120 Red light source device 121 Red light source 125 Condensing lens group 130 Heat sink 140 Light guide optical system 141 First reflective mirror 142 First dichroic mirror 143 Second reflective mirror 145 Condensing lens 146 Condensing lens 147 Condensing lens 148 Second dichroic mirror 149 Third reflective mirror 151 Optical lens 152 Diffusing plate 170 Light source side optical system 173 Condensing lens 175 Light tunnel 178 Condensing lens 179 Condensing lens 185 Irradiation mirror 190 Heat sink (heat dissipation device) 191 Heat dissipation fin (radiation part)
192 Heat transfer part 193 Bolt hole 195 Condenser lens 220 Projection side optical system 225 Fixed lens group 235 Movable lens group 241 Control circuit board 261 Cooling fan 262 Cooling fan 300 Display element device 310 Holding member 312 Optical path space 314 Step part 316 Female thread part 320 Substrate 321 First opening 330 Pressing plate 331 Second opening 332 Hole 340 Sheet metal member 341 Opening 342 Leaf spring 343 Female thread 350 Bolt 360 Bolt 370 Sealing member 370A Sealing member 371 Cylinder 371a Lower end 371b In parallel Peripheral surface 371c Inclined inner peripheral surface 372 Flat plate part 372a Projection part 373 Opening part 374 Cushioning member 380 Thermal conductive member 381 End part 390 Spacer 391 Opening part 392 Bolt hole 521 Opening part a, c, d Boundary b

Claims (10)

A heat radiating device with a heat transfer unit and
A substrate of a plate-shaped member in which the heat radiating device is arranged on one side and a first opening into which the heat transfer portion of the heat radiating device is inserted is formed.
Electronic components arranged on the other surface side of the substrate so that the heat dissipation surface is located on the first opening side of the substrate.
A sealing member having a tubular portion arranged on the outer periphery of the first opening of the substrate with a gap from the heat transfer portion of the heat radiating device.
A heat conductive member filled between the heat transfer portion of the heat radiating device and the heat radiating surface of the electronic component, and between the heat transfer portion of the heat radiating device and the tubular portion of the sealing member. ,
An electronic device comprising. Further provided is a holding plate which is arranged between the heat radiating device and the substrate and has a second opening into which the heat transfer portion is inserted.
The sealing member includes an annular flat plate portion sandwiched between the substrate and the holding plate on one end side of the tubular portion.
The heat transfer portion is formed in a protruding shape and is formed in a protruding shape.
The heat radiating device is arranged on one side of the substrate.
The electronic components are connected via a frame-shaped connecting portion arranged on the substrate.
The electronic device according to claim 1. The electronic device according to claim 1 or 2, wherein the tubular portion further includes a cushioning member formed in an annular shape on the outer peripheral side surface. The electronic device according to claim 2, wherein the flat plate portion is formed toward the outside of the first opening and the second opening. The electronic device according to any one of claims 1 to 4, wherein the other end side of the tubular portion in the axial direction is formed up to the heat radiating surface of the electronic component. The electronic device according to any one of claims 1 to 5, wherein the heat radiating device is urged toward the electronic component side by an urging means. The electronic device according to claim 6, wherein the urging means is a leaf spring having a female screw portion for fixing the heat radiating device with a bolt. A plurality of heat radiating fins provided at positions facing the heat transfer unit of the heat radiating device are provided.
The heat transfer portion is a projecting cross section are formed on the front side of the heat dissipation device is a rectangular shape in front view,
Protrusions are formed on a part of each side surface of the heat transfer portion except for the corners on the outer peripheral side surface.
The protrusion is formed so as to be inclined from the heat radiation fin side to the electronic component side.
The first to seventh aspects of the invention, wherein the protrusion is formed so as to be inclined so that the height gradually decreases from the heat radiation fin side to the electronic component side. Electronic device. The electronic device according to any one of claims 1 to 8.
A light source device including a red light source device, a green light source device, and a blue light source device,
A light source side optical system that guides light from the light source device to the electronic component that is a display element, and
A projection side optical system that projects an image emitted from the electronic component,
A control unit that controls the light source device and the electronic components,
A projection device characterized by comprising. A step of arranging and fixing a substrate having a first opening and a heat radiating surface of an electronic component connected via a frame-shaped connecting portion arranged on the substrate so as to face each other.
A step of placing a tubular sealing member having an annular flat plate portion on one end side on the heat radiating surface, and
A step of placing a pressing plate having a second opening and sandwiching the flat plate portion between the pressing plate and the substrate.
A step of placing a sheet-shaped heat conductive member having a predetermined thickness on the heat radiating surface of the electronic component, and
The protruding heat transfer portion of the heat radiating device is inserted into the first opening of the substrate and the second opening of the presser plate so that the sealing member is arranged on the outer periphery of the heat transfer portion, and the heat transfer device is arranged. A step of plastically deforming the heat conductive member so that the end portion of the heat conductive member is located between the sealing member and the heat transfer part.
A method of manufacturing an electronic device, which comprises.

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