JP6837454B2 - Painted floor structure for wireless power supply floor and this construction method - Google Patents

Description

The present invention relates to a coated floor structure suitable for wirelessly supplying power from a floor to an automated guided vehicle (hereinafter referred to as AGV) system installed in a factory, a warehouse, or the like, and a method for constructing the coated floor.

Conventionally, the coating film thickness is 1 to 4 mm without significantly reducing the curing shrinkage, preventing warpage and cracking due to the shrinkage of the coating film, maintaining heat resistance and physical properties, and impairing coating workability and surface appearance. A water-based urethane mortar composition that does not warp or crack the surface layer even if it is a thin layer is often used as a floor coating material suitable for the floor on which the AGV of an unmanned transport vehicle system runs. The water-based urethane mortar composition is characterized by containing an aggregate containing polyester polyol, isocyanate and water-hard mortar as a main component (Patent Document 1).

Japanese Unexamined Patent Publication No. 2006-62950

However, the floor to which the aqueous urethane mortar composition was applied contained a hydraulic mortar that was cured by water in the composition, and the cured aqueous urethane mortar composition was not consumed for hydration of the hydraulic mortar. Since water and crystalline water after hydration are contained, there is a problem that the power propagation efficiency is lowered, for example, when power is wirelessly supplied from the floor to the AGV running on the floor.

The problem to be solved by the present invention is for a wireless power supply floor, which has durability in running the AGV and can maintain high power propagation efficiency even when power is wirelessly supplied to the AGV from the floor. The purpose is to provide a coated floor structure and this construction method.

In order to solve the above problems, the invention according to claim 1 is provided with a metal foil layer having a thickness of 15 μm or more and 50 μm or less on the floor base concrete surface, and an epoxy resin, an epoxy resin curing agent, and a bone are provided on the metal foil layer. A coating floor structure for a wireless power supply floor, characterized in that a resin mortar layer having a thickness of 3 to 7 mm made of a material is provided, and a finish coating floor layer having a dielectric loss tangent of 0.05 or less is provided on the resin mortar layer. provide.

The invention according to claim 2 provides the coating floor structure for a wireless power supply floor according to claim 1, wherein the finish coating floor layer comprises an epoxy resin coating floor or a hard urethane resin coating floor.

The invention according to claim 3 provides the coated floor structure for a wireless power supply floor according to claim 1 or 2, wherein the aggregate of the resin mortar layer is made of silica sand or selben.

Further, according to the fourth aspect of the present invention, a metal foil having a thickness of 15 μm or more and 50 μm or less is attached to the floor base concrete surface to form a metal foil layer, and an epoxy resin and an epoxy resin curing agent are formed on the metal foil layer. A resin mortar composed of an aggregate and an aggregate is applied to a thickness of 3 to 7 mm to form a resin mortar layer, and a finish coating material having a dielectric adjacency of 0.05 or less is applied onto the resin mortar layer to form a finish coating floor layer. Provided is a method for constructing a coated floor for a wireless power supply floor, which is characterized by forming a mortar.

The invention according to claim 5 is the method for constructing a floor coating for wireless power supply according to claim 4, wherein the finish coating material is made of an epoxy resin coating material or a hard urethane resin coating material. provide.

The invention according to claim 6 provides the method for constructing a coated floor for a wireless power supply floor according to claim 4 or 5, wherein the aggregate of the resin mortar is made of silica sand or selben. ..

The coated floor structure for a wirelessly fed floor of the present invention has the effect of having durability in running the AGV and having high power propagation efficiency when wirelessly supplying power to the AGV from the floor.

Further, the method for constructing a coated floor for a wireless power supply floor of the present invention has an effect of forming a floor structure having high power propagation efficiency when supplying power to the AGV from the floor wirelessly, having durability against running of the AGV. is there.

Hereinafter, the present invention will be described in detail.

As the metal foil used for the metal foil layer constituting the present invention, copper foil, aluminum foil, stainless foil, iron foil and the like can be used, and the thickness is preferably 15 μm or more in order to improve the power propagation efficiency. Further, it is preferably 50 μm or less from the viewpoint of workability when it is attached to the base concrete. The metal leaf layer is used for the purpose of maintaining high power propagation efficiency when wirelessly supplying power from the floor to the AGV, and if the thickness is less than 15 μm, the power propagation efficiency may decrease, and particularly the base material. When a metal foil is attached to the surface of the underlying concrete due to minute irregularities of the concrete, if a defect is generated due to a hole in the metal foil, the power propagation efficiency may be significantly reduced. If the thickness exceeds 50 μm, the workability of the work when the metal foil is attached to the surface of the underlying concrete becomes insufficient.

The epoxy resin in the resin mortar composed of the epoxy resin, the epoxy resin curing agent, and the aggregate used for forming the resin mortar layer constituting the present invention is, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, and phenol novolac. Type epoxy resin, bisphenol AD type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, alicyclic epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, heterocyclic epoxy resin, diarylsulfone type epoxy resin, Hydroquinone type epoxy resins and their modified products can be used alone or in combination.

Of these epoxy resins, bisphenol A type epoxy resins and bisphenol F type epoxy resins, which have low viscosity and are easy to handle, are particularly preferable. In order to improve the workability of the resin mortar, 15 to 45 parts by weight of the diluent is added to 100 parts by weight of the epoxy resin. As the diluent, a reactive diluent or a non-reactive diluent can be used, and can be used in combination.

Further, the diluent is preferably a reactive diluent from the viewpoint of ensuring durability against repeated running of a high-load AGV. Among the reactive diluents, the monofunctional diluents include allyl glycidyl ether, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, o-cresyl glycidyl ether, t-butyl phenyl glycidyl ether, sec-butylphenol monoglycidyl ether, and 2 Resolsinol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6 hexanediol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, hexahydrophthalic acid diglycidyl ester as functional, glycerol as polyfunctional Polyglycidyl ether, trimethylolpropane polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, sorbitol polyglycidyl ether and the like can be used.

As the non-reactive diluent, benzyl alcohol, butyl diglycol, pine oil, xylene resin, toluene resin, mineral spirit, kerosene and the like can be used.

Examples of the epoxy resin curing agent used in the present invention include amine compounds such as aliphatic polyamines, modified aliphatic polyamines, polyamide amines, polyamides, alicyclic polyamines, modified alicyclic polyamines, modified aromatic polyamines, and tertiary amines. For example, polyethylene tetramine, tetraethylene pentamine, diethyl aminopropylamine, N-aminoethyl piperazine, isophorone diamine, metaxylene diamine, 2,4,6-trisdimethylaminomethylphenol and the like can be used. These can be used alone or in combination.

The blending amount of the epoxy resin curing agent with respect to the epoxy resin or the mixture of the epoxy resin and the diluent is preferably such that the number of active hydrogen groups relative to the number of epoxy groups is 0.7 to 1.3. If it is less than 0.7, the strength of the cured product may be insufficient, and if it exceeds 1.3, the epoxy resin curing agent becomes excessive, and the finish coating floor layer on the resin mortar layer and the resin mortar layer adhere to each other. Insufficient sex may occur.

As the aggregate used for the resin mortar used in the present invention, it is preferable that the aggregate has a high insulating property that does not reduce the power propagation efficiency when power is wirelessly supplied to the AGV, and in particular, silica sand, ceramics, insulators, etc. Cerven obtained by crushing ceramics is preferable. The particle size of the aggregate is preferably 0.075 to 0.43 mm for silica sand and 0.05 to 1.5 mm for cerben. If the particle size of the silica sand is less than 0.075 mm, the workability when applying the resin mortar is lowered, and if it exceeds 0.45 mm, the strength of the resin mortar layer may be insufficient. If the particle size of selben is less than 0.05 mm, the workability when applying the resin mortar is lowered, and if it exceeds 1.5 mm, the strength of the resin mortar layer becomes insufficient.

The blending amount of the aggregate in the resin mortar is preferably 40 to 80 parts by weight, preferably 40 parts by weight, based on 100 parts by weight of the epoxy resin or the mixture of the epoxy resin and the diluent and the epoxy resin curing agent. If the amount is less than 80 parts by weight, the workability when applying the resin mortar is lowered.

The resin mortar layer preferably has a thickness of 3 to 7 mm, and if it is less than 3 mm, cracks or peeling may occur due to repeated running of AGV, etc., and if it exceeds 7 mm, the smoothness when applying the resin mortar may be insufficient. is there.

The finish coating floor layer constituting the present invention preferably has a dielectric loss tangent of 0.05 or less, which indicates the degree of electrical energy loss, and is durable against repeated running of AGV, and particularly has a dielectric loss tangent of 0. If it exceeds .05, the power propagation efficiency when wirelessly supplying power from the floor to the AGV becomes insufficient. Further, the thickness of the finish coating floor layer is preferably 0.5 to 2 mm, and if it is less than 0.5 mm, the durability against running of the AGV becomes insufficient, and if it exceeds 2 mm, the power propagation efficiency may be insufficient.

As a finish coating flooring material having a dielectric loss tangent of 0.05 or less and durability against repeated running of AGV, specifically, the JIS K 7215 type D durometer hardness of the coating film shown in the present application is 70. The above epoxy resin-coated flooring material and hard urethane resin-coated flooring material can be used. As the epoxy resin-coated floor material, in principle, a solvent-free coated floor material in which a filling filler such as calcium carbonate is mixed with the epoxy resin and the epoxy resin curing agent is preferable, and the epoxy resin-coated floor material is usually on the floor base concrete. It is applied to a thickness of about 0.8 to 1.5 mm with a gold iron or the like and cured to form an epoxy resin coated floor.

The hard urethane resin coated flooring material is, in principle, a solvent-free coated flooring material containing castor oil polyol, castor oil-modified polyol, metaphenylenedi isocyanate, aluminum hydroxide and other filling fillers, and is usually applied to the concrete under the floor. It is applied to a thickness of about 1 to 1.5 mm with a gold iron or the like and cured to form a hard urethane resin coated floor.

Hereinafter, examples and comparative examples will be specifically described.

[Examples and Comparative Examples]
A copper foil with a thickness of 35 μm (manufactured by Mitsui Mining & Smelting Co., Ltd.) is used as the metal leaf to be attached to the concrete surface of the floor base, and a plain weave mesh made by SUS304 (wire diameter 0.06 mm, 150 Mesh, manufactured by Nippon Mesh Kogyo Co., Ltd.) is used for comparison. It was used. Epoxy resin adhesive Aika Aibon E5050 (trade name, main agent: curing agent = 1: 1 (weight ratio), manufactured by Aica Kogyo Co., Ltd.) was used to attach the copper foil to the floor base concrete, and a SUS304 plain woven mesh was used. For sticking to the concrete surface of the floor base, the following Joliace JE55HA A and B were mixed at 100:40.

The epoxy resin and the epoxy resin curing agent used in the resin mortar, Joris Ace JE55H A (trade name, bisphenol A type liquid epoxy resin and _{C 10} alkyl monoglycidyl ethers containing an epoxy equivalent: 280, viscosity 0.5 Pa · s / 23 ° C, manufactured by Aika Kogyo Co., Ltd.) and Joliace JE55H B (trade name, containing modified alicyclic polyamine and modified aliphatic polyamine, active hydrogen equivalent: 112, viscosity 0.1 Pa · s / 23 ° C, manufactured by Aika Kogyo Co., Ltd.) Was used, and the mixing ratio of Joliace JE55HA A and B was 100:40 by weight. As aggregates for resin mortar, Tohoku silica sand No. 5 (trade name, particle diameter 0.106 mm to 0.60 mm), Tohoku silica sand No. 6 (trade name, particle diameter 0.075 mm to 0.425 mm), Cerven B (particle diameter) 0.5 to 1.5 mm) and Cerven C (particle size 0.05 to 0.5 mm) are used, and the aggregate is a mixture of Tohoku mortar No. 5 and Tohoku mortar No. 6 at a weight ratio of 2: 1. Aggregate A was used, and a mixture of Cerven B and Cerven C at a ratio of 2: 1 was used as aggregate B. As for the compounding ratio of the epoxy resin, the epoxy resin curing agent and the aggregate, 600 parts by weight of the aggregate was mixed with 100 parts by weight of the mixture of Joliace JE55HA A and B.

In addition, as finish coating flooring materials, solvent-free epoxy resin coating flooring material Joliace JE-20G (coating thickness 1.0 mm, trade name, manufactured by Aica Kogyo Co., Ltd.) and hard urethane resin coating flooring material Aica Pure JJ-103 (Coating thickness 1.2 mm, trade name, manufactured by Aica Kogyo Co., Ltd.) is used, and for comparison with this, a water-hard urethane resin-coated floor material made of a water-based urethane mortar composition Aica Pure Hard JJ-560 (Coating thickness) 3.0 mm, trade name, manufactured by Aica Kogyo Co., Ltd.) was used. The solvent-free epoxy resin-coated floor material and the hard urethane resin-coated floor material were applied onto the resin mortar layer to form a finish-coated floor layer. When the hydraulic urethane resin coated floor material was used as the finish coated floor material, it was applied directly onto the copper foil without applying the above resin mortar.

Using the above materials, copper foil or SUS304 plain woven mesh is attached to the floor base concrete surface in the combination shown in Table 1, and then resin mortar is applied to provide a resin mortar layer (Nothing for Comparative Example 3). ), Then, by applying the finish coating floor material to provide the finish coating floor layer, the coating floor structure for the wireless power supply floor of Examples 1 to 4 and Comparative Examples 1 to 3 was obtained.

[Evaluation items and evaluation methods]

[Power propagation efficiency]
A power transmission electrode (made of copper foil) having a length of 150 mm, a width of 1800 mm, and a thickness of 35 μm is laid on the finish-coated floor layers of Examples 1 to 4 and Comparative Examples 1 to 3 in Table 1 to transmit power. The end of the electrode is connected to the port 1 of the vector network analyzer MS46122A (manufactured by Anritsu), and the other end is connected to the port 2. The copper foil or SUS304 plain weave mesh was shared with the ground of the vector network analyzer, and the power propagation efficiency η _max was calculated from the 2-port S parameter measured by the vector network analyzer by the following formula.
_{η max = (| S 21 |} / | S 12 |) (K- (K 2 -1) 1/2)
(K was calculated as follows. K = (1- | S ₁₁ | ^2- | S ₂₂ | ² + | S ₁₁ x S _22- S ₁₂ x S ₂₁ | ² ) / (2 x | S ₁₂ x S ₂₁₎ ｜),
S ₁₁ : Ratio of the strength of the signal input from port 1 to the strength of the signal when the signal is reflected back to port 1 S ₁₂ : The strength of the signal input from port 2 and the signal Ratio of signal strength when transmitted to port 1 S ₂₁ : Ratio of signal strength input from port 1 to signal strength when the signal is transmitted to _{port 2 S 22} : From port 2 The ratio of the strength of the input signal to the strength of the signal when the signal is reflected back to port 2 _{is η max.} A lossless and optimal matching circuit can be connected to both ports of the 2-port network. It represents the power propagation efficiency transmitted from port 1 to port 2 at the time.

[Dissipation factor]
Using the above materials, a plate-shaped test piece having a thickness of 5 mm × 10 cm × 10 cm was prepared for the resin mortar layer, and the finish coating floor layer was thick for Examples 1 to 4 and Comparative Examples 1 and 2. A test piece having a size of 1 mm × 10 cm × 10 cm was prepared, and for Comparative Example 3, a test piece having a thickness of 3 mm × 10 cm × 10 cm was prepared. Regarding the system, in Examples 1 to 4, Comparative Example 1 and Comparative Example 2, the resin mortar layer had a thickness of 5 mm, and a finish coating floor layer was applied thereto with a thickness of 1 mm to a total thickness of 6 mm. A test piece of × 10 cm × 10 cm was prepared. Each test piece was prepared at 23 ° C. and cured at 23 ° C. for 7 days. Aluminum tape was adhered to the front surface and the bottom surface of the test piece, the series impedance Z was measured by a vector network analyzer MS46122A (manufactured by Anritsu), and the dielectric loss tangent tan δ was calculated by the following formula.
tan δ = ｜ Re {Z} / Im {Z} ｜
Re {Z} represents the real part of Z, and Im {Z} represents the imaginary part of Z.
In the measurement, the measurement frequency range of 1.56 MHz to 51.56 MHz was measured in increments of 0.05 MHz, and tan δ at 13.56 MHz was defined as the dielectric loss tangent referred to here. In the system for Comparative Example 3, the dielectric loss tangent values of the finish coating floor layer are shown in Table 2 as they are.

[Compression strength]
JIS K 6911 5.19 Compliant with compressive strength, resin mortar or hydraulic urethane resin coated flooring is cured in the shape of 12.7 mm in length × 12.7 mm in width × 25.4 mm in height at 23 ° C for 7 days. Cure. Then, it was compressed at 23 ° C. using an Instron universal material tester (manufactured by Instron) at a loading speed of 1 mm / min, and the compressive strength (N / mm ² ) was measured.

[Durometer hardness]
Each of the epoxy resin-coated floor material, the rigid urethane-coated floor material, and the water-hard urethane resin-coated floor material is poured into a mold having a size of 40 mm × 60 mm × 4 mm (thickness) and cured. After curing at 23 ° C. for 7 days, the measurement was performed at 23 ° C. using a type D durometer according to JIS K 7215 (plastic durometer hardness).

[Evaluation results]
The evaluation results are shown in Table 2.

[Summary]
In Examples 1 to 4, since the power propagation efficiency is high and the dielectric loss tangent of each layer is 0.05 or less, it is determined that the power propagation efficiency is high when power is wirelessly supplied to the AGV from the floor. Further, the compression strength of the resin mortar layer was 30 N / mm ² or more, and the durometer hardness (type D) of the finish coating floor layer was 70 or more, so that it was judged to have durability in running AGV.

Claims (6)

A metal foil layer having a thickness of 15 μm or more and 50 μm or less is provided on the surface of the concrete under the floor, and a resin mortar layer having a thickness of 3 to 7 mm composed of an epoxy resin, an epoxy resin curing agent, and an aggregate is provided on the metal foil layer. A coating floor structure for a wireless power supply floor, characterized in that a finish coating floor layer having a dielectric positive contact of 0.05 or less is provided on the resin mortar layer. The coated floor structure for a wireless power supply floor according to claim 1, wherein the finish coated floor layer is composed of an epoxy resin coated floor or a hard urethane resin coated floor. The coated floor structure for a wireless power supply floor according to claim 1 or 2, wherein the aggregate of the resin mortar layer is made of silica sand or cerben. A metal foil having a thickness of 15 μm or more and 50 μm or less is attached to the floor base concrete surface to form a metal foil layer, and a resin mortar composed of an epoxy resin, an epoxy resin curing agent, and an aggregate is formed on the metal foil layer. A wireless power supply characterized in that a resin mortar layer is formed by applying to ~ 7 mm, and a finish coating floor material having a dielectric adjacency of 0.05 or less is applied onto the resin mortar layer to form a finish coating floor layer. Construction method of coated floor for floor. The method for constructing a coated floor for a wireless power supply floor according to claim 4, wherein the finish coated floor material is made of an epoxy resin coated floor material or a hard urethane resin coated floor material. The method for constructing a coated floor for a wireless power supply floor according to claim 4 or 5, wherein the aggregate of the resin mortar is made of silica sand or selben.