Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP6837580B2 - Powdered liquid crystal resin for hot press molded products and hot press molded products - Google Patents
[go: Go Back, main page]

JP6837580B2 - Powdered liquid crystal resin for hot press molded products and hot press molded products - Google Patents

Powdered liquid crystal resin for hot press molded products and hot press molded products Download PDF

Info

Publication number
JP6837580B2
JP6837580B2 JP2019565046A JP2019565046A JP6837580B2 JP 6837580 B2 JP6837580 B2 JP 6837580B2 JP 2019565046 A JP2019565046 A JP 2019565046A JP 2019565046 A JP2019565046 A JP 2019565046A JP 6837580 B2 JP6837580 B2 JP 6837580B2
Authority
JP
Japan
Prior art keywords
liquid crystal
aromatic
derivatives
crystal resin
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019565046A
Other languages
Japanese (ja)
Other versions
JPWO2019221094A1 (en
Inventor
吉昭 田口
吉昭 田口
川崎 達也
達也 川崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Publication of JPWO2019221094A1 publication Critical patent/JPWO2019221094A1/en
Application granted granted Critical
Publication of JP6837580B2 publication Critical patent/JP6837580B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/34Feeding the material to the mould or the compression means
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/06Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Description

本発明は、熱プレス成形品用粉状液晶性樹脂及び熱プレス成形品に関する。 The present invention relates to a powdery liquid crystal resin for a hot press molded product and a hot press molded product.

液晶性ポリエステル樹脂に代表される液晶性樹脂は、高流動性、低バリ性、耐リフロー性等に優れるため、種々の分野で広く用いられている。しかしながら、液晶性樹脂は、成形冷却時に樹脂の流動方向に配向する性質(配向性)を有しているため、得られる成形品は樹脂の流動方向とその直角方向とで物性が異なる異方性を有している場合がある。
熱プレス成形は、樹脂粉体を樹脂が溶融する温度で加熱プレス成形する成形方法であり、樹脂が流動する高温で溶融させる射出成形と比べると液晶性樹脂の配向性を小さく抑えることができるが、得られる成形品の異方性を解消するには至らない。特許文献1には、熱変形温度が異なる複数種の液晶樹脂をそれぞれ粉砕した後、混合して成形材料を調製し、該成形材料を所定の温度範囲でプレス成形する液晶樹脂シートの製造方法が記載されている。
Liquid crystal resins typified by liquid crystal polyester resins are widely used in various fields because they are excellent in high fluidity, low burr property, reflow resistance and the like. However, since the liquid crystal resin has a property (orientation) of being oriented in the flow direction of the resin during molding and cooling, the obtained molded product has anisotropy in which the physical properties differ depending on the flow direction of the resin and the direction perpendicular to the flow direction. May have.
Hot press molding is a molding method in which resin powder is heat press molded at a temperature at which the resin melts, and the orientation of the liquid crystal resin can be suppressed to be smaller than that of injection molding in which the resin powder is melted at a high temperature at which the resin flows. , It is not possible to eliminate the anisotropy of the obtained molded product. Patent Document 1 describes a method for producing a liquid crystal resin sheet, in which a plurality of types of liquid crystal resins having different thermal deformation temperatures are crushed, mixed to prepare a molding material, and the molding material is press-molded in a predetermined temperature range. Have been described.

特開2008−30397号公報Japanese Unexamined Patent Publication No. 2008-30397

本発明は、異方性が小さい熱プレス成形品を製造可能な粉状液晶性樹脂及びそれを用いた熱プレス成形品を提供することを課題とする。 An object of the present invention is to provide a powdery liquid crystal resin capable of producing a hot press molded product having a small anisotropy and a hot press molded product using the same.

本発明は、以下に関するものである。
[1]芳香族ヒドロキシカルボン酸由来の構成単位を全構成単位中90モル%以上含有し、平均粒径が10μm以上300μm以下である、熱プレス成形品用粉状液晶性樹脂。
[2]結晶化度が10%以上60%以下である、[1]に記載の粉状液晶性樹脂。
[3]示差走査熱量計で測定される融点Tm2と融点Tm1のオンセット温度との差ΔTm(Tm2−Tm1オンセット温度)が30℃以上90℃以下である、[1]又は[2]に記載の粉状液晶性樹脂。
[4]示差走査熱量計で測定される融点Tm2が250℃以上400℃以下である、[1]から[3]のいずれかに記載の粉状液晶性樹脂。
[5]示差走査熱量計で測定される融点Tm2よりも10〜30℃高いシリンダー温度及びせん断速度100sec−1で測定した溶融粘度が、10Pa・s以上1000Pa・s以下である、[1]から[4]のいずれかに記載の粉状液晶性樹脂。
[6]最大粒径と平均粒径との比(最大粒径/平均粒径)が5以下である、[1]から[5]のいずれかに記載の粉状液晶性樹脂。
[7][1]から[6]のいずれかに記載の粉状液晶性樹脂を含有する、熱プレス成形品用粉体材料。
[8][1]から[6]のいずれかに記載の粉状液晶性樹脂を用いた熱プレス成形品。
[9]厚みが2mm未満のフィルム状である、[8]に記載の熱プレス成形品。
The present invention relates to the following.
[1] A powdery liquid crystal resin for a thermosetting product, which contains 90 mol% or more of a structural unit derived from an aromatic hydroxycarboxylic acid in all the structural units and has an average particle size of 10 μm or more and 300 μm or less.
[2] The powdery liquid crystal resin according to [1], which has a crystallinity of 10% or more and 60% or less.
[3] In [1] or [2], the difference ΔTm (Tm2-Tm1 onset temperature) between the melting point Tm2 and the onset temperature of the melting point Tm1 measured by the differential scanning calorimeter is 30 ° C. or higher and 90 ° C. or lower. The powdery liquid crystal resin according to the above.
[4] The powdery liquid crystal resin according to any one of [1] to [3], wherein the melting point Tm2 measured by a differential scanning calorimeter is 250 ° C. or higher and 400 ° C. or lower.
[5] From [1], the melt viscosity measured at a cylinder temperature 10 to 30 ° C. higher than the melting point Tm2 measured by a differential scanning calorimeter and a shear rate of 100 sec -1 is 10 Pa · s or more and 1000 Pa · s or less. The powdery liquid crystal resin according to any one of [4].
[6] The powdery liquid crystal resin according to any one of [1] to [5], wherein the ratio of the maximum particle size to the average particle size (maximum particle size / average particle size) is 5 or less.
[7] A powder material for a hot press molded product containing the powdery liquid crystal resin according to any one of [1] to [6].
[8] A thermosetting product using the powdery liquid crystal resin according to any one of [1] to [6].
[9] The hot press molded product according to [8], which is in the form of a film having a thickness of less than 2 mm.

本発明によれば、異方性が小さい熱プレス成形品を製造可能な粉状液晶性樹脂及びそれを用いた熱プレス成形品を提供することができる。 According to the present invention, it is possible to provide a powdery liquid crystal resin capable of producing a hot press molded product having a small anisotropy and a hot press molded product using the same.

実施例1で得られた熱プレス成形フィルムの表面の光学式顕微鏡写真である。It is an optical micrograph of the surface of the heat press molding film obtained in Example 1. FIG. 比較例1で得られた熱プレス成形フィルムの表面の光学式顕微鏡写真である。It is an optical micrograph of the surface of the heat press molding film obtained in Comparative Example 1.

以下、本発明の一実施形態について詳細に説明する。本発明は、以下の実施形態に限定されるものではなく、本発明の効果を阻害しない範囲で適宜変更を加えて実施することができる。 Hereinafter, one embodiment of the present invention will be described in detail. The present invention is not limited to the following embodiments, and can be carried out with appropriate modifications as long as the effects of the present invention are not impaired.

[粉状液晶性樹脂]
本実施形態に係る熱プレス成形品用粉状液晶性樹脂(以下、単に「粉状液晶性樹脂」ともいう。)は、全構成単位中に芳香族ヒドロキシカルボン酸由来の構成単位を90モル%以上含有する。本明細書において、「粉状」との用語は、0.1μm〜1000μm程度の平均粒径を有する微粒子で構成されていることをいい、「平均粒径」とは、レーザー回折/散乱式粒度分布測定法による体積基準の算術平均粒子径を意味する。平均粒径は、例えば、株式会社堀場製作所製レーザー回折/散乱式粒度分布測定装置LA−920を用いて測定することができる。
「液晶性」とは、光学異方性溶融相を形成し得る性質を有することをいう。異方性溶融相の性質は、直交偏光子を利用した慣用の偏光検査法により確認することができる。より具体的には、異方性溶融相の確認は、Leitz偏光顕微鏡を使用し、Leitzホットステージに載せた溶融試料を窒素雰囲気下で40倍の倍率で観察することにより実施できる。液晶性を有する樹脂は、直交偏光子の間で検査したときに、たとえ溶融静止状態であっても偏光は通常透過し、光学的に異方性を示す。
[Powdered liquid crystal resin]
The powdery liquid crystal resin for a thermosetting product according to the present embodiment (hereinafter, also simply referred to as “powdered liquid crystal resin”) contains 90 mol% of the constituent units derived from aromatic hydroxycarboxylic acid in all the constituent units. Contains the above. In the present specification, the term "powder" means that the particles are composed of fine particles having an average particle size of about 0.1 μm to 1000 μm, and the “average particle size” is a laser diffraction / scattering type particle size. It means the arithmetic average particle size based on the volume by the distribution measurement method. The average particle size can be measured using, for example, a laser diffraction / scattering type particle size distribution measuring device LA-920 manufactured by HORIBA, Ltd.
"Liquid crystal" means having a property of being able to form an optically anisotropic molten phase. The properties of the anisotropic molten phase can be confirmed by a conventional polarization inspection method using an orthogonal polarizing element. More specifically, the anisotropic molten phase can be confirmed by observing the molten sample placed on the Leitz hot stage at a magnification of 40 times under a nitrogen atmosphere using a Leitz polarizing microscope. A liquid crystal resin normally transmits polarized light even in a molten and stationary state when inspected between orthogonal polarizers, and exhibits optical anisotropy.

液晶性樹脂としては、芳香族ヒドロキシカルボン酸由来の構成単位を含有する、液晶性ポリエステル及び液晶性ポリエステルアミドから選択される少なくとも1種を含むことが好ましい。液晶性ポリエステル及び液晶性ポリエステルアミドとしては、特に限定されないが、芳香族ポリエステル又は芳香族ポリエステルアミドであることが好ましく、全芳香族ポリエステル及び全芳香族ポリエステルアミドから選択される少なくとも一種の樹脂を含むことがより好ましい。また、芳香族ポリエステル又は芳香族ポリエステルアミドを同一分子鎖中に部分的に含むポリエステルを用いることもできる。 The liquid crystal resin preferably contains at least one selected from liquid crystal polyester and liquid crystal polyester amide, which contains a structural unit derived from an aromatic hydroxycarboxylic acid. The liquid crystal polyester and the liquid crystal polyester amide are not particularly limited, but are preferably aromatic polyester or aromatic polyester amide, and include at least one resin selected from total aromatic polyester and total aromatic polyester amide. Is more preferable. Further, an aromatic polyester or a polyester partially containing an aromatic polyester amide in the same molecular chain can also be used.

芳香族ヒドロキシカルボン酸由来の構成単位を含有する芳香族ポリエステル又は芳香族ポリエステルアミドとしては、より具体的には、
(1)主として芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上含むポリエステル;
(2)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上とを含むポリエステル;
(3)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とを含むポリエステル;
(4)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とを含むポリエステルアミド;
(5)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(d)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とを含むポリエステルアミド等、を挙げることができる。さらに上記の構成成分に必要に応じ分子量調整剤を併用してもよい。
More specifically, as an aromatic polyester or an aromatic polyester amide containing a structural unit derived from an aromatic hydroxycarboxylic acid,
(1) Polyester containing one or more selected from structural units derived mainly from aromatic hydroxycarboxylic acids and derivatives thereof;
(2) Mainly derived from (a) one or more selected from the constituent units derived from aromatic hydroxycarboxylic acids and their derivatives, and (b) derived from aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and their derivatives. Polyester containing one or more selected from the constituent units of
(3) Mainly (a) one or more selected from the constituent units derived from aromatic hydroxycarboxylic acids and derivatives thereof, and (b) derived from aromatic dicarboxylic acids, aliphatic dicarboxylic acids, and derivatives thereof. One or more selected from the constituent units of (c) aromatic diols, alicyclic diols, aliphatic diols, and one or more selected from the constituent units derived from their derivatives. And including polyester;
(4) One or more selected mainly from (a) constituent units derived from aromatic hydroxycarboxylic acids and their derivatives, and (b) constituents derived from aromatic hydroxyamines, aromatic diamines, and their derivatives. Polyester containing one or more selected from units and (c) one or more selected from constituent units derived from aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof. Amide;
(5) One or more selected mainly from (a) constituent units derived from aromatic hydroxycarboxylic acids and their derivatives, and (b) constituents derived from aromatic hydroxyamines, aromatic diamines, and their derivatives. One or more selected from the units, (c) one or more selected from the constituent units derived from aromatic dicarboxylic acids, aliphatic dicarboxylic acids, and their derivatives, and (d). Examples thereof include polyesteramides containing one or more selected from aromatic diols, alicyclic diols, aliphatic diols, and structural units derived from their derivatives. Further, a molecular weight adjusting agent may be used in combination with the above-mentioned constituent components, if necessary.

芳香族ヒドロキシカルボン酸としては、例えば、4−ヒドロキシ安息香酸(HBA)、3−ヒドロキシ安息香酸、1−ヒドロキシ−2−ナフトエ酸、3−ヒドロキシ−2−ナフトエ酸、6−ヒドロキシ−2−ナフトエ酸(HNA)、5−ヒドロキシ−1−ナフトエ酸、4'−ヒドロキシ[1,1'−ビフェニル]−4−カルボン酸、及びこれらの誘導体などが挙げられる。上記誘導体としては、例えば、上記芳香族ヒドロキシカルボン酸の芳香環(芳香族環)に、炭素数0〜20(好ましくは炭素数0〜10)の置換基が置換した化合物等が挙げられる。置換基としては、例えば、アルキル基、アルケニル基、アルキニル基、ハロゲン原子、ヒドロキシル基、アルコキシ基、アルケニルオキシ基、アリールオキシ基、アラルキルオキシ基、アシルオキシ基、メルカプト基、アルキルチオ基、アルケニルチオ基、アリールチオ基、アラルキルチオ基、カルボキシル基、アルコキシカルボニル基、アリールオキシカルボニル基、アラルキルオキシカルボニル基、アミノ基、モノ又はジアルキルアミノ基、モノ又はジフェニルアミノ基、アシルアミノ基、エポキシ基含有基、アシル基、オキソ基、イソシアネートなどが挙げられる。液晶性樹脂は、これらの芳香族ヒドロキシカルボン酸由来の構成単位の1種を有するものであってもよいし、2種以上を有するものであってもよい。 Examples of the aromatic hydroxycarboxylic acid include 4-hydroxybenzoic acid (HBA), 3-hydroxybenzoic acid, 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, and 6-hydroxy-2-naphthoe. Acids (HNA), 5-hydroxy-1-naphthoic acid, 4'-hydroxy [1,1'-biphenyl] -4-carboxylic acid, derivatives thereof and the like can be mentioned. Examples of the derivative include a compound in which the aromatic ring (aromatic ring) of the aromatic hydroxycarboxylic acid is substituted with a substituent having 0 to 20 carbon atoms (preferably 0 to 10 carbon atoms). Examples of the substituent include an alkyl group, an alkenyl group, an alkynyl group, a halogen atom, a hydroxyl group, an alkoxy group, an alkenyloxy group, an aryloxy group, an aralkyloxy group, an acyloxy group, a mercapto group, an alkylthio group and an alkenylthio group. Arylthio group, aralkylthio group, carboxyl group, alkoxycarbonyl group, aryloxycarbonyl group, aralkyloxycarbonyl group, amino group, mono or dialkylamino group, mono or diphenylamino group, acylamino group, epoxy group containing group, acyl group, Examples include an oxo group and an isocyanate. The liquid crystal resin may have one kind of the structural unit derived from these aromatic hydroxycarboxylic acids, or may have two or more kinds.

液晶性樹脂を構成する他のモノマーとしては、2,6−ジヒドロキシナフタレン、1,4−ジヒドロキシナフタレン、4,4’−ジヒドロキシビフェニル、ハイドロキノン、レゾルシン、下記一般式(I)で表される化合物、及び下記一般式(II)で表される化合物等の芳香族ジオール;テレフタル酸、イソフタル酸、4,4’−ジフェニルジカルボン酸、2,6−ナフタレンジカルボン酸、及び下記一般式(III)で表される化合物等の芳香族ジカルボン酸;p−アミノフェノール、p−フェニレンジアミン等の芳香族アミン類が挙げられる。

Figure 0006837580
(X:アルキレン(C〜C)、アルキリデン、−O−、−SO−、−SO−、−S−、及び−CO−より選ばれる基である。)
Figure 0006837580
Figure 0006837580
(Y:−(CH−(n=1〜4)及び−O(CHO−(n=1〜4)より選ばれる基である。)Examples of other monomers constituting the liquid crystal resin include 2,6-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl, hydroquinone, resorcin, and compounds represented by the following general formula (I). And aromatic diols such as compounds represented by the following general formula (II); terephthalic acid, isophthalic acid, 4,4'-diphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and the following general formula (III). Aromatic dicarboxylic acids such as compounds to be used; aromatic amines such as p-aminophenol and p-phenylenediamine can be mentioned.
Figure 0006837580
(X: A group selected from alkylene (C 1 to C 4 ), alkylidene, -O-, -SO-, -SO 2- , -S-, and -CO-.)
Figure 0006837580
Figure 0006837580
(Y: A group selected from − (CH 2 ) n − (n = 1 to 4) and −O (CH 2 ) n O − (n = 1 to 4).)

液晶性樹脂は、芳香族ヒドロキシカルボン酸由来の構成単位を全構成単位中90モル%以上含有する。芳香族ヒドロキシカルボン酸由来の構成単位は、好ましくは、93モル%以上であり、より好ましくは95モル%以上である。上限値は、特に限定されず、例えば、98モル%以下とすることができる。芳香族ヒドロキシカルボン酸由来の構成単位を90モル%以上含有する粉状液晶性樹脂(液晶性樹脂微粒子)を用いることで、熱プレス成形時の樹脂の配向性が小さいので、異方性が小さい熱プレス成形品を製造することができる。
液晶性樹脂中の芳香族ヒドロキシカルボン酸由来の構成単位の含有量の測定は、熱分解ガスクロマトグラフィーなどにより行うことができる。
The liquid crystal resin contains 90 mol% or more of the structural units derived from the aromatic hydroxycarboxylic acid in all the structural units. The constituent unit derived from the aromatic hydroxycarboxylic acid is preferably 93 mol% or more, more preferably 95 mol% or more. The upper limit is not particularly limited and can be, for example, 98 mol% or less. By using a powdery liquid crystal resin (liquid crystal resin fine particles) containing 90 mol% or more of a constituent unit derived from aromatic hydroxycarboxylic acid, the orientation of the resin during hot press molding is small, so the anisotropy is small. A thermosetting product can be manufactured.
The content of the structural unit derived from the aromatic hydroxycarboxylic acid in the liquid crystal resin can be measured by thermal decomposition gas chromatography or the like.

液晶性ポリエステル及び液晶性ポリエステルアミドの製造方法は、特に限定されず、上述したモノマー化合物(又はモノマーの混合物)を用いて、直接重合法やエステル交換法を用いて、公知の方法で製造することができるが、通常は、溶融重合法、溶液重合法、スラリー重合法、固相重合法等、又はこれらの2種以上の組み合わせが用いられ、溶融重合法、又は溶融重合法と固相重合法との組み合わせが好ましく用いられる。エステル形成能を有する化合物である場合は、そのままの形で重合に用いてもよく、また、重合の前段階でアシル化剤等を用いて前駆体から該エステル形成能を有する誘導体に変性されたものを用いてもよい。アシル化剤としては、無水酢酸等の無水カルボン酸等を挙げることができる。 The method for producing the liquid crystal polyester and the liquid crystal polyester amide is not particularly limited, and it is produced by a known method using the above-mentioned monomer compound (or a mixture of monomers) by a direct polymerization method or a transesterification method. However, usually, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method, etc., or a combination of two or more of these is used, and a melt polymerization method, or a melt polymerization method and a solid phase polymerization method are used. The combination with is preferably used. When the compound has an ester-forming ability, it may be used as it is for the polymerization, or it is modified from the precursor to the derivative having the ester-forming ability by using an acylating agent or the like in the pre-polymerization step. You may use the thing. Examples of the acylating agent include acetic anhydride and other anhydrous carboxylic acids.

重合に際しては、種々の触媒の使用が可能である。使用可能な触媒の代表的なものとしては、酢酸カリウム、酢酸マグネシウム、酢酸第一錫、テトラブチルチタネート、酢酸鉛、酢酸ナトリウム、三酸化アンチモン、トリス(2,4−ペンタンジオナト)コバルト(III)等の金属塩系触媒、N−メチルイミダゾール、4−ジメチルアミノピリジン等の有機化合物系触媒を挙げることができる。触媒の使用量は、一般にはモノマーの全重量に対して、約0.001〜1質量%であり、特に、約0.01〜0.2質量%が好ましい。 Various catalysts can be used for the polymerization. Typical usable catalysts are potassium acetate, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, antimony trioxide, tris (2,4-pentandionato) cobalt (III). ) And other metal salt-based catalysts, and organic compound-based catalysts such as N-methylimidazole and 4-dimethylaminopyridine. The amount of the catalyst used is generally about 0.001 to 1% by mass, particularly preferably about 0.01 to 0.2% by mass, based on the total weight of the monomer.

液晶性樹脂のASTM D648に準拠して測定される荷重たわみ温度は、150℃以上280℃以下であることが好ましく、より好ましくは160℃以上270℃以下であり、さらに好ましくは170℃以上260℃以下である。荷重たわみ温度を150℃以上280℃以下とすることにより、熱プレス成形時の樹脂の配向性をより小さくすることができ、より異方性が小さい熱プレス成形品を製造することができる。 The deflection temperature under load measured according to ASTM D648 of the liquid crystal resin is preferably 150 ° C. or higher and 280 ° C. or lower, more preferably 160 ° C. or higher and 270 ° C. or lower, and further preferably 170 ° C. or higher and 260 ° C. or lower. It is as follows. By setting the deflection temperature under load to 150 ° C. or higher and 280 ° C. or lower, the orientation of the resin during hot press molding can be made smaller, and a hot press molded product having less anisotropy can be manufactured.

液晶性樹脂には、製造段階で、各種の繊維状、粉粒状、板状の無機及び有機の充填剤を配合することができる。繊維状充填剤としては、ガラス繊維、ミルドガラスファイバー、カーボン繊維、アスベスト繊維、シリカ繊維、シリカ・アルミナ繊維、アルミナ繊維、ジルコニア繊維、窒化硼素繊維、窒化珪素繊維、硼素繊維、チタン酸カリ繊維、ウォラストナイト等の珪酸塩の繊維、硫酸マグネシウム繊維、ホウ酸アルミニウム繊維、更にステンレス、アルミニウム、チタン、銅、真鍮等の金属の繊維状物等の無機質繊維状物質が挙げられる。特に代表的な繊維状充填剤はガラス繊維である。なお、ポリアミド、フッ素樹脂、ポリエステル樹脂、アクリル樹脂などの高融点有機質繊維状物質も使用することができる。
粉粒状充填剤としては、カーボンブラック、黒鉛、シリカ、石英粉末、ガラスビーズ、ガラスバルーン、ガラス粉、硅酸カルシウム、ケイ酸アルミニウム、カオリン、クレー、硅藻土、ウォラストナイト等の硅酸塩、酸化鉄、酸化チタン、酸化亜鉛、三酸化アンチモン、アルミナ等の金属の酸化物、炭酸カルシウム、炭酸マグネシウム等の金属の炭酸塩、硫酸カルシウム、硫酸バリウム等の金属の硫酸塩、その他フェライト、炭化ケイ素、窒化ケイ素、窒化硼素、各種金属粉末等が挙げられる。
板状充填剤としては、マイカ、ガラスフレーク、タルク、各種の金属箔等が挙げられる。
これらの無機及び有機充填剤は一種又は二種以上併用することができる。
充填剤の含有量は、液晶性樹脂100質量部に対して、0〜100質量部とすることができる。
また、液晶性樹脂には、その他の成分として、酸化防止剤、熱安定剤、紫外線吸収剤、滑剤、顔料、結晶核剤等の添加剤が配合されていてもよい。
Various fibrous, powdery, plate-like inorganic and organic fillers can be added to the liquid crystal resin at the manufacturing stage. As the fibrous filler, glass fiber, milled glass fiber, carbon fiber, asbestos fiber, silica fiber, silica / alumina fiber, alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber, Examples thereof include silicate fibers such as wollastonite, magnesium sulfate fibers, aluminum borate fibers, and inorganic fibrous substances such as metal fibrous materials such as stainless steel, aluminum, titanium, copper and brass. A particularly typical fibrous filler is glass fiber. In addition, high melting point organic fibrous substances such as polyamide, fluororesin, polyester resin, and acrylic resin can also be used.
Examples of the powder / granular filler include carbonates such as carbon black, graphite, silica, quartz powder, glass beads, glass balloons, glass powder, calcium silicate, aluminum silicate, kaolin, clay, diatomaceous earth, and wollastonite. , Iron oxide, titanium oxide, zinc oxide, antimony trioxide, metal oxides such as alumina, carbonates of metals such as calcium carbonate and magnesium carbonate, sulfates of metals such as calcium sulfate and barium sulfate, and other ferrites and carbides. Examples thereof include silicon, silicon nitride, boron nitride, and various metal powders.
Examples of the plate-shaped filler include mica, glass flakes, talc, and various metal foils.
These inorganic and organic fillers can be used alone or in combination of two or more.
The content of the filler can be 0 to 100 parts by mass with respect to 100 parts by mass of the liquid crystal resin.
Further, the liquid crystal resin may contain additives such as an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a pigment, and a crystal nucleating agent as other components.

粉状液晶性樹脂の平均粒径は、10μm以上300μm以下であり、好ましくは10μm以上100μm以下であり、より好ましくは10μm以上50μm以下である。平均粒径を10m以上300μm以下とすることにより、熱プレス成形時の樹脂の配向性を小さくすることができ、異方性が小さい熱プレス成形品を製造することができる。「平均粒径」については上記のとおりである。 The average particle size of the powdery liquid crystal resin is 10 μm or more and 300 μm or less, preferably 10 μm or more and 100 μm or less, and more preferably 10 μm or more and 50 μm or less. By setting the average particle size to 10 m or more and 300 μm or less, the orientation of the resin during hot press molding can be reduced, and a hot press molded product having low anisotropy can be manufactured. The "average particle size" is as described above.

粉状液晶性樹脂は、最大粒径と平均粒径との比(最大粒径/平均粒径)が、5以下であることが好ましく、2.5以下であることがより好ましい。下限値は特に限定されず、1以上とすることができる。なお、「最大粒径」とは、レーザー回折/散乱式粒度分布測定法により測定した値のうち、最大値のことをいう。最大粒径と平均粒径との比(最大粒径/平均粒径)を5以下とすることにより、熱プレス成形時の粉体流動性を向上することができる。 The ratio of the maximum particle size to the average particle size (maximum particle size / average particle size) of the powdery liquid crystal resin is preferably 5 or less, and more preferably 2.5 or less. The lower limit is not particularly limited and may be 1 or more. The "maximum particle size" means the maximum value among the values measured by the laser diffraction / scattering type particle size distribution measurement method. By setting the ratio of the maximum particle size to the average particle size (maximum particle size / average particle size) to 5 or less, the powder fluidity during hot press molding can be improved.

上記平均粒径を有する粉状液晶性樹脂の製造は、上記液晶性樹脂の製造方法によって得られた液晶性樹脂をそのまま粉状液晶性樹脂として用いることもできるし、上記液晶性樹脂の製造方法によって得られた液晶性樹脂をペレット、繊維、フィルム等に成形したものを、ジェットミル、ビーズミル、ハンマーミル、ボールミル、カッターミル、石臼型摩砕機等を用いた、乾式粉砕、湿式粉砕、冷凍粉砕により粉砕処理したものを用いることもできる。また、溶媒中に液晶性樹脂を溶解させた後にスプレードライする方法、溶媒中でエマルションを形成した後で貧溶媒に接触させる貧溶媒析出法、溶媒中でエマルションを形成した後で有機溶媒を乾燥除去する液中乾燥法等を用いることもできる。液晶性樹脂と非液晶性樹脂とを混ぜ合わせた後、非液晶性樹脂を溶媒で溶解除去して上記平均粒径を有する粉状液晶性樹脂を得る方法を用いることもできる。また、液晶性樹脂のオリゴマーを粉砕処理した後、固相重合して上記平均粒径を有する粉状液晶性樹脂を得る方法を用いることもできる。 In the production of the powdery liquid crystal resin having the average particle size, the liquid crystal resin obtained by the method for producing the liquid crystal resin can be used as it is as the powder liquid liquid resin, or the method for producing the liquid crystal resin. The liquid crystal resin obtained by the above method is molded into pellets, fibers, films, etc., and then dried, wet, and frozen using a jet mill, bead mill, hammer mill, ball mill, cutter mill, stone mill type grinder, etc. It is also possible to use the one crushed by. In addition, a method of dissolving the liquid crystal resin in a solvent and then spray-drying, a poor solvent precipitation method of forming an emulsion in the solvent and then contacting the poor solvent, and a method of forming the emulsion in the solvent and then drying the organic solvent. An in-liquid drying method or the like for removing can also be used. A method of mixing the liquid crystal resin and the non-liquid crystal resin and then dissolving and removing the non-liquid crystal resin with a solvent to obtain a powdery liquid crystal resin having the above average particle size can also be used. Alternatively, a method can be used in which the oligomer of the liquid crystal resin is pulverized and then solid-phase polymerized to obtain a powdery liquid crystal resin having the above average particle size.

中でも、粉状液晶性樹脂を構成する液晶性樹脂のガラス転移温度Tgよりも30℃〜50℃低い環境下で上記平均粒径に微粒子化された粉体であることが好ましい。例えば、液晶性樹脂のガラス転移温度Tgよりも−40℃の環境下(Tgよりも40℃低い環境下)で微粒子化された粉体を用いることができる。液晶性樹脂のガラス転移温度Tgよりも30℃〜50℃低い環境下で微粒子化された粉体は、通常、粒度分布が狭く、粉体流動性に優れ、かつ結晶化度が低い。 Above all, it is preferable that the powder is finely divided to the above average particle size in an environment lower than the glass transition temperature Tg of the liquid crystal resin constituting the powdery liquid crystal resin by 30 ° C. to 50 ° C. For example, it is possible to use a powder finely divided in an environment of −40 ° C. (40 ° C. lower than Tg) of the liquid crystal resin having a glass transition temperature of Tg. A powder finely divided in an environment lower than the glass transition temperature Tg of a liquid crystal resin at 30 ° C. to 50 ° C. usually has a narrow particle size distribution, excellent powder fluidity, and a low crystallinity.

粉状液晶性樹脂の結晶化度は、10%以上60%以下であり、好ましくは12%以上58%以下であり、より好ましくは15%以上55%以下である。粉状液晶性樹脂の結晶化度を10%以上60%以下とすることにより、熱プレス成形時の樹脂の配向性をより小さくすることができ、より異方性が小さい熱プレス成形品を製造することができる。また、熱プレス成形品の強度を高めるとともに耐熱性をより高めることができる。結晶化度の測定は、X線回折装置により行うことができる。結晶化度が上記範囲に満たない場合、液晶性樹脂を熱処理することで上記範囲に調整することができる。例えば、液晶性樹脂をガラス転移温度Tg以上融点Tm2以下の温度の範囲で熱処理することにより結晶化度を上記範囲に調整することができる。なお、ガラス転移温度Tgの測定は、動的粘弾性測定により行うことができる。 The crystallinity of the powdery liquid crystal resin is 10% or more and 60% or less, preferably 12% or more and 58% or less, and more preferably 15% or more and 55% or less. By setting the crystallinity of the powdery liquid crystal resin to 10% or more and 60% or less, the orientation of the resin during hot press molding can be made smaller, and a hot press molded product with less anisotropy can be manufactured. can do. In addition, the strength of the hot press molded product can be increased and the heat resistance can be further increased. The crystallinity can be measured by an X-ray diffractometer. When the crystallinity is less than the above range, it can be adjusted to the above range by heat-treating the liquid crystal resin. For example, the crystallinity can be adjusted to the above range by heat-treating the liquid crystal resin in the temperature range of the glass transition temperature Tg or more and the melting point Tm2 or less. The glass transition temperature Tg can be measured by dynamic viscoelasticity measurement.

粉状液晶性樹脂の示差走査熱量計で測定される融点Tm2は、250℃以上400℃以下であり、好ましくは260℃以上380℃以下であり、より好ましくは280℃以上350℃以下である。融点Tm2を250℃以上400℃以下とすることにより、熱プレス成形時の樹脂の配向性をより小さくすることができ、より異方性が小さい熱プレス成形品を製造することができる。また、熱プレス成形品の強度を高めるとともに耐熱性をより高めることができる。
なお、融点Tm2は、JIS K−7121(1999)に基づいた方法により、室温から20℃/分の昇温速度で加熱(1stRUN)した際に観測される吸熱ピークにおけるピークトップの温度(融点Tm1)の測定後、(融点Tm1+40)℃で2分間保持し、次いで20℃/分の降温速度で室温まで冷却し、再度室温から20℃/分の昇温速度で加熱(2ndRUN)した際に観測される2ndRUNの吸熱ピークにおけるピークトップの温度とする。後述する融点Tm1のオンセット温度(ピークの立ち上がり開始温度)は、上記1stRUNの吸熱ピークにおけるオンセットの温度とする。
The melting point Tm2 measured by a differential scanning calorimeter of a powdery liquid crystal resin is 250 ° C. or higher and 400 ° C. or lower, preferably 260 ° C. or higher and 380 ° C. or lower, and more preferably 280 ° C. or higher and 350 ° C. or lower. By setting the melting point Tm2 to 250 ° C. or higher and 400 ° C. or lower, the orientation of the resin during hot press molding can be made smaller, and a hot press molded product having less anisotropy can be manufactured. In addition, the strength of the hot press molded product can be increased and the heat resistance can be further increased.
The melting point Tm2 is the peak top temperature (melting point Tm1) at the heat absorption peak observed when heating (1st RUN) from room temperature at a heating rate of 20 ° C./min by a method based on JIS K-7121 (1999). ), Held at (melting point Tm1 + 40) ° C. for 2 minutes, then cooled to room temperature at a temperature lowering rate of 20 ° C./min, and then heated again from room temperature at a heating rate of 20 ° C./min (2ndRUN). Let it be the temperature of the peak top at the heat absorption peak of the 2nd RUN to be performed. The onset temperature (peak rising start temperature) at the melting point Tm1, which will be described later, is the onset temperature at the endothermic peak of the 1st RUN.

粉状液晶性樹脂は、示差走査熱量計で測定される融点Tm2と融点Tm1のオンセット温度との差ΔTm(Tm2−Tm1オンセット温度)が30℃以上90℃以下であることが好ましく、40℃以上80℃以下であることがより好ましい。融点Tm2と融点Tm1のオンセット温度との差ΔTmをこの範囲とすることにより、熱プレス成形時の加工性を向上させるとともに、熱プレス成形品の耐熱性をより良好にすることができる。 The powdery liquid crystal resin preferably has a difference ΔTm (Tm2-Tm1 onset temperature) between the melting point Tm2 and the onset temperature of the melting point Tm1 measured by a differential scanning calorimeter of 30 ° C. or higher and 90 ° C. or lower. More preferably, it is ℃ or more and 80 ℃ or less. By setting the difference ΔTm between the melting point Tm2 and the onset temperature of the melting point Tm1 in this range, the workability at the time of hot press molding can be improved and the heat resistance of the hot press molded product can be improved.

粉状液晶性樹脂は、示差走査熱量計で測定される融点Tm2よりも10〜30℃高いシリンダー温度及びせん断速度100sec−1で測定した溶融粘度が、10Pa・s以上1000Pa・s以下であることが好ましく、50Pa・s以上800Pa・s以下であることがより好ましい。なお、「融点Tm2よりも10〜30℃高いシリンダー温度」で測定した溶融粘度とは、シリンダー温度が融点Tm2よりも10〜30℃高い温度のうち液晶性樹脂の種類によって適宜選択したいずれか一の温度で測定した溶融粘度を意味しており、融点Tm2よりも10〜30℃高い温度範囲の全てにおいて測定した溶融粘度が上記範囲内でなくともよい。粉状液晶性樹脂の溶融粘度を上記範囲とすることにより、熱プレス成形品の外観を良好にすることができる。溶融粘度の調整は、液晶性樹脂の溶融重合時の最終重合温度を調整することで行うことができる。例えば、液晶性樹脂の溶融重合時の最終重合温度を300℃超で行うことにより溶融粘度を10Pa・sとすることができる。The powdery liquid crystal resin has a cylinder temperature 10 to 30 ° C. higher than the melting point Tm2 measured by a differential scanning calorimeter and a melt viscosity measured at a shear rate of 100 sec -1 of 10 Pa · s or more and 1000 Pa · s or less. Is preferable, and more preferably 50 Pa · s or more and 800 Pa · s or less. The melt viscosity measured at "a cylinder temperature 10 to 30 ° C. higher than the melting point Tm2" is any one of the temperatures in which the cylinder temperature is 10 to 30 ° C. higher than the melting point Tm2, which is appropriately selected depending on the type of liquid crystal resin. It means the melt viscosity measured at the above temperature, and the melt viscosity measured in all the temperature ranges 10 to 30 ° C. higher than the melting point Tm2 does not have to be within the above range. By setting the melt viscosity of the powdery liquid crystal resin in the above range, the appearance of the hot press molded product can be improved. The melt viscosity can be adjusted by adjusting the final polymerization temperature at the time of melt polymerization of the liquid crystal resin. For example, the melt viscosity can be set to 10 Pa · s by setting the final polymerization temperature at the time of melt polymerization of the liquid crystal resin to more than 300 ° C.

粉状液晶性樹脂中の微粒子の形状は、特に限定されず、球状(略球状を含む)、紡錘状、不定形の粒子状、フィブリル状、繊維状等いずれの形態であってもよいが、粉体流動性の点で、球状(略球状を含む)、不定形の粒子状であることが好ましい。 The shape of the fine particles in the powdery liquid crystal resin is not particularly limited, and may be in any form such as spherical (including substantially spherical), spindle-shaped, amorphous particulate, fibril-like, and fibrous. In terms of powder fluidity, it is preferably spherical (including substantially spherical) or irregularly shaped particles.

[熱プレス成形品]
熱プレス成形品は、上記した粉状液晶性樹脂を用いて形成された成形品である。上記した粉状液晶性樹脂を用いて形成されているので、異方性が小さい熱プレス成形品とすることができる。異方性が小さいので、樹脂の流動方向とその直角方向とで強度や耐熱性等の物性を均一化することができ、信頼性の高い成形品とすることができる。よって、高温下で使用される自動車部品、半田リフロー工程にて実装される電気・電子部品、フレキシブル銅張積層板等として好ましく用いることができる。熱プレス成形品は、例えば、厚みが2mm未満のフィルム状成形品であるように構成することができる。
[Hot press molded product]
The hot press molded product is a molded product formed by using the above-mentioned powdery liquid crystal resin. Since it is formed by using the powdery liquid crystal resin described above, it can be a hot press molded product having a small anisotropy. Since the anisotropy is small, physical properties such as strength and heat resistance can be made uniform in the flow direction of the resin and the direction perpendicular to the flow direction thereof, and a highly reliable molded product can be obtained. Therefore, it can be preferably used as an automobile part used at a high temperature, an electric / electronic part mounted in a solder reflow process, a flexible copper-clad laminate, and the like. The hot press molded product can be configured to be, for example, a film-shaped molded product having a thickness of less than 2 mm.

熱プレス成形品の製造は、上記した粉状液晶性樹脂を含む粉体材料を、加熱プレス成形機により、粉状液晶性樹脂の上記融点Tm2以上の温度(例えば250℃〜400℃)でプレス成形して得ることができる。成形時の圧力は、特に限定されず、所望の厚みに成形できる圧力とすることができる。 In the production of the hot press molded product, the powder material containing the powdery liquid crystal resin is pressed by a heat press molding machine at a temperature (for example, 250 ° C. to 400 ° C.) of the powdery liquid crystal resin having a melting point of Tm2 or more. It can be obtained by molding. The pressure at the time of molding is not particularly limited, and can be a pressure capable of molding to a desired thickness.

粉体材料は、上記した粉状液晶性樹脂を1種以上含有している。粉状液晶性樹脂の総含有量は、熱プレス成形用粉体材料中50質量%以上であることが好ましく、70質量%以上であることがより好ましい。上限値は、特に限定されず、例えば、95質量%以下とすることができる。 The powder material contains one or more of the above-mentioned powdery liquid crystal resins. The total content of the powdery liquid crystal resin is preferably 50% by mass or more, and more preferably 70% by mass or more in the powder material for hot press molding. The upper limit value is not particularly limited and may be, for example, 95% by mass or less.

粉体材料は、得られる成形品に求められる物性や用途に応じて、粉状液晶性樹脂の他に、無機充填剤等の添加剤を含有することもできる。無機充填剤としては、平均粒径が500nm以下、又は400nm以下の粉粒状充填剤、板状充填剤や、平均繊維長が100μm以下の繊維状充填剤等を挙げることができる。無機充填剤の材質は、特に限定されず、例えば、上記した液晶性樹脂に配合することができる無機充填剤と同様のものを用いることができる。上記平均粒径を有する粉粒状充填剤、板状充填剤を用いることで、上記液晶性樹脂微粒子の粉体流動性や分散性を高めることができる。上記平均粒径を有する繊維状充填剤を用いることで、得られる熱プレス成形品の強度をより高めることができる。なお、平均粒径は、上記した樹脂微粒子と同じ方法で測定することができる。平均繊維長は、例えば、株式会社ニコレ製画像測定器LUZEXFSを用いて測定することができる。無機充填剤の含有量は、粉体材料中50質量%以下であることが好ましく、30質量%以下であることがより好ましい。 The powder material may contain additives such as an inorganic filler in addition to the powdery liquid crystal resin, depending on the physical characteristics and applications required for the obtained molded product. Examples of the inorganic filler include a powder-granular filler having an average particle size of 500 nm or less or 400 nm or less, a plate-shaped filler, and a fibrous filler having an average fiber length of 100 μm or less. The material of the inorganic filler is not particularly limited, and for example, the same material as the inorganic filler that can be blended with the liquid crystal resin described above can be used. By using the powder granular filler and the plate-shaped filler having the average particle size, the powder fluidity and dispersibility of the liquid crystal resin fine particles can be improved. By using the fibrous filler having the above average particle size, the strength of the obtained hot press molded product can be further increased. The average particle size can be measured by the same method as the above-mentioned resin fine particles. The average fiber length can be measured using, for example, the image measuring device LUZEXFS manufactured by Nicolet Co., Ltd. The content of the inorganic filler is preferably 50% by mass or less, more preferably 30% by mass or less in the powder material.

粉状液晶性樹脂との混合材料とする場合の混合方法は、従来公知の方法を用いることができ、例えば、振とうによる混合方法、ボールミル等の粉砕を伴う混合方法、ヘンシェルミキサー等の攪拌翼による混合方法等を用いることができる。その他の添加剤として、酸化防止剤、熱安定剤、紫外線吸収剤、滑剤等を用いることもできる。 As a mixing method in the case of using a powdery liquid crystal resin as a mixing material, a conventionally known method can be used, for example, a mixing method by shaking, a mixing method involving pulverization of a ball mill or the like, a stirring blade of a Henschel mixer or the like. The mixing method according to the above can be used. As other additives, antioxidants, heat stabilizers, ultraviolet absorbers, lubricants and the like can also be used.

以下に実施例を示して本発明を更に具体的に説明するが、これらの実施例により本発明の解釈が限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to Examples, but the interpretation of the present invention is not limited by these Examples.

実施例及び比較例で用いた液晶性樹脂LCP1〜4を以下のようにして製造した。
[製造例1]LCP1:全芳香族ポリエステル
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に325℃まで3.5時間かけて昇温し、そこから20分かけて5Torr(即ち667Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら重縮合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてLCP1ペレットを得た。
(原料)
4−ヒドロキシ安息香酸(HBA);1660g(73モル%)
6−ヒドロキシ−2−ナフトエ酸(HNA);837g(27モル%)
金属触媒(酢酸カリウム触媒);165mg
アシル化剤(無水酢酸);1714g
The liquid crystal resin LCPs 1 to 4 used in Examples and Comparative Examples were produced as follows.
[Production Example 1] LCP1: After charging the following raw materials into an all-aromatic polyester polymerization vessel, the temperature of the reaction system was raised to 140 ° C., and the reaction was carried out at 140 ° C. for 1 hour. Then, the temperature is further raised to 325 ° C. over 3.5 hours, and then the pressure is reduced to 5 Torr (that is, 667 Pa) over 20 minutes while distilling acetic acid, excess acetic anhydride, and other low boiling points. Polycondensation was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the mixture from a reduced pressure state to a pressurized state through normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain LCP1 pellets.
(material)
4-Hydroxybenzoic acid (HBA); 1660 g (73 mol%)
6-Hydroxy-2-naphthoic acid (HNA); 837 g (27 mol%)
Metal catalyst (potassium acetate catalyst); 165 mg
Acylating agent (acetic anhydride); 1714 g

[製造例2]LCP2:全芳香族ポリエステル
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に330℃まで3.5時間かけて昇温し、そこから15分かけて10Torr(即ち1330Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら重縮合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてLCP2ペレットを得た。
(原料)
4−ヒドロキシ安息香酸(HBA);2524g(79.3モル%)
6−ヒドロキシ−2−ナフトエ酸(HNA);867g(20モル%)
テレフタル酸(TA);27g(0.3モル%)
金属触媒(酢酸カリウム触媒);150mg
アシル化剤(無水酢酸);2336g
[Production Example 2] LCP2: After charging the following raw materials into an all-aromatic polyester polymerization vessel, the temperature of the reaction system was raised to 140 ° C., and the reaction was carried out at 140 ° C. for 1 hour. Then, the temperature is further raised to 330 ° C. over 3.5 hours, and then the pressure is reduced to 10 Torr (that is, 1330 Pa) over 15 minutes while distilling acetic acid, excess acetic anhydride, and other low boiling points. Polycondensation was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the mixture from a reduced pressure state to a pressurized state through normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain LCP2 pellets.
(material)
4-Hydroxybenzoic acid (HBA); 2524 g (79.3 mol%)
6-Hydroxy-2-naphthoic acid (HNA); 867 g (20 mol%)
Terephthalic acid (TA); 27 g (0.3 mol%)
Metal catalyst (potassium acetate catalyst); 150 mg
Acylating agent (acetic anhydride); 2336 g

[製造例3]LCP3:全芳香族ポリエステルアミド
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に340℃まで4.5時間かけて昇温し、そこから15分かけて10Torr(即ち1330Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら重縮合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてLCP3ペレットを得た。
(原料)
4−ヒドロキシ安息香酸(HBA);1380g(60モル%)
6−ヒドロキシ−2−ナフトエ酸(HNA);157g(5モル%)
テレフタル酸(TA);484g(17.5モル%)
4,4’−ジヒドロキシビフェニル(BP);388g(12.5モル%)
4−アセトキシアミノフェノール(APAP);160g(5モル%)
金属触媒(酢酸カリウム触媒);110mg
アシル化剤(無水酢酸);1659g
[Production Example 3] LCP3: Total Aromatic Polyester Amid After charging the following raw materials into a polymerization vessel, the temperature of the reaction system was raised to 140 ° C., and the reaction was carried out at 140 ° C. for 1 hour. Then, the temperature is further raised to 340 ° C. over 4.5 hours, and then the pressure is reduced to 10 Torr (that is, 1330 Pa) over 15 minutes while distilling acetic acid, excess acetic anhydride, and other low boiling points. Polycondensation was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the mixture from a reduced pressure state to a pressurized state through normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain LCP3 pellets.
(material)
4-Hydroxybenzoic acid (HBA); 1380 g (60 mol%)
6-Hydroxy-2-naphthoic acid (HNA); 157 g (5 mol%)
Terephthalic acid (TA); 484 g (17.5 mol%)
4,4'-Dihydroxybiphenyl (BP); 388 g (12.5 mol%)
4-acetoxyaminophenol (APAP); 160 g (5 mol%)
Metal catalyst (potassium acetate catalyst); 110 mg
Acylating agent (acetic anhydride); 1659 g

[製造例4]LCP4:全芳香族ポリエステル
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に360℃まで5.5時間かけて昇温し、そこから30分かけて5Torr(即ち667Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら溶融重合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてペレットを得た。得られたペレットを、窒素雰囲気下で室温から290℃まで20分かけて昇温し、3時間保持した後、放冷し、LCP4ペレットを得た。
(原料)
4−ヒドロキシ安息香酸(HBA);37g(2モル%)
6−ヒドロキシ−2−ナフトエ酸(HNA);1218g(48モル%)
テレフタル酸(TA);560g(25モル%)
4,4’−ジヒドロキシビフェニル(BP);628g(25モル%)
金属触媒(酢酸カリウム触媒);165mg
アシル化剤(無水酢酸);1432g
[Production Example 4] LCP4: After charging the following raw materials into an all-aromatic polyester polymerization vessel, the temperature of the reaction system was raised to 140 ° C., and the reaction was carried out at 140 ° C. for 1 hour. Then, the temperature is further raised to 360 ° C. over 5.5 hours, and then the pressure is reduced to 5 Torr (that is, 667 Pa) over 30 minutes while distilling acetic acid, excess acetic anhydride, and other low boiling points. Melt polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to bring the mixture from a reduced pressure state to a pressurized state through normal pressure, the polymer was discharged from the lower part of the polymerization vessel, and the strands were pelletized to obtain pellets. The obtained pellets were heated in a nitrogen atmosphere from room temperature to 290 ° C. over 20 minutes, held for 3 hours, and then allowed to cool to obtain LCP4 pellets.
(material)
4-Hydroxybenzoic acid (HBA); 37 g (2 mol%)
6-Hydroxy-2-naphthoic acid (HNA); 1218 g (48 mol%)
Terephthalic acid (TA); 560 g (25 mol%)
4,4'-Dihydroxybiphenyl (BP); 628 g (25 mol%)
Metal catalyst (potassium acetate catalyst); 165 mg
Acylating agent (acetic anhydride); 1432 g

(荷重たわみ温度)
製造例のペレットを、成形機(住友重機械工業(株)製 「SE100DU」)を使用して、以下の成形条件で成形し、80mm×10mm×3.2mmの試験片を作製した。この試験片を用いて、ASTM D648に準拠し、荷重たわみ温度を測定した。なお、曲げ応力としては、1.8MPaを用いた。結果を表1に示した。
〔成形条件〕
シリンダー温度:
300℃(LCP1)
340℃(LCP2)
350℃(LCP3)
370℃(LCP4)
金型温度: 80℃
射出速度: 33mm/sec
(Deflection temperature under load)
The pellets of the production example were molded using a molding machine (“SE100DU” manufactured by Sumitomo Heavy Industries, Ltd.) under the following molding conditions to prepare a test piece of 80 mm × 10 mm × 3.2 mm. Using this test piece, the deflection temperature under load was measured according to ASTM D648. As the bending stress, 1.8 MPa was used. The results are shown in Table 1.
〔Molding condition〕
Cylinder temperature:
300 ° C (LCP1)
340 ° C (LCP2)
350 ° C (LCP3)
370 ° C (LCP4)
Mold temperature: 80 ° C
Injection speed: 33 mm / sec

[実施例1]
LCP1をマスコロイダー(増幸産業株式会社製、MKZA10−15JP)を用いて、水温35℃の環境下で湿式粉砕処理した後、スプレードライして粉状液晶性樹脂を得た。この粉状液晶性樹脂の溶融粘度、平均粒径及び最大粒径、結晶化度、並びに融点(Tm2,Tm1オンセット温度)について、以下に示す方法で測定した。
得られた粉状液晶性樹脂を使用して、熱プレス成形機(株式会社東洋精機製作所製「Mini Test Press−10」)を用いて、プレス温度290℃、圧力3MPaの条件で、半径50mm×厚さ0.1mmであるフィルムを作製した。得られたフィルムについて、以下に示す方法で樹脂の配向性を評価した。
[Example 1]
LCP1 was wet-pulverized using a mass colloider (MKZA10-15JP, manufactured by Masuyuki Sangyo Co., Ltd.) in an environment of a water temperature of 35 ° C., and then spray-dried to obtain a powdery liquid crystal resin. The melt viscosity, average particle size and maximum particle size, crystallinity, and melting point (Tm2, Tm1 onset temperature) of this powdery liquid crystal resin were measured by the methods shown below.
Using the obtained powdery liquid crystal resin, using a thermosetting machine (“Mini Test Press-10” manufactured by Toyo Seiki Seisakusho Co., Ltd.), under the conditions of a press temperature of 290 ° C. and a pressure of 3 MPa, a radius of 50 mm × A film having a thickness of 0.1 mm was produced. The orientation of the resin of the obtained film was evaluated by the method shown below.

[実施例2]
液晶性樹脂を表1に示すとおりとし、プレス温度を330℃とした以外は、実施例1と同様にしてプレス成形フィルムを得た。得られた粉状液晶性樹脂及びフィルムについて、実施例1と同様にして、各種物性を測定し、樹脂の配向性を評価した。
[Example 2]
A press-molded film was obtained in the same manner as in Example 1 except that the liquid crystal resin was as shown in Table 1 and the press temperature was 330 ° C. With respect to the obtained powdery liquid crystal resin and film, various physical properties were measured in the same manner as in Example 1, and the orientation of the resin was evaluated.

[比較例1]
液晶性樹脂を表1に示すとおりとし、プレス温度を340℃とした以外は、実施例1と同様にしてプレス成形フィルムを得た。得られた粉状液晶性樹脂及びフィルムについて、実施例1と同様にして、各種物性を測定し、樹脂の配向性を評価した。
[Comparative Example 1]
A press-molded film was obtained in the same manner as in Example 1 except that the liquid crystal resin was as shown in Table 1 and the press temperature was 340 ° C. With respect to the obtained powdery liquid crystal resin and film, various physical properties were measured in the same manner as in Example 1, and the orientation of the resin was evaluated.

[比較例2]
LCP2のペレットをそのまま使用した以外は、実施例2と同様にして熱プレス成形フィルムを得た。得られた粉状液晶性樹脂及びフィルムについて、実施例1と同様にして、各種物性を測定し、樹脂の配向性を評価した。
[Comparative Example 2]
A heat press-molded film was obtained in the same manner as in Example 2 except that the pellets of LCP2 were used as they were. With respect to the obtained powdery liquid crystal resin and film, various physical properties were measured in the same manner as in Example 1, and the orientation of the resin was evaluated.

[比較例3]
液晶性樹脂を表1に示すとおりとし、プレス温度を360℃とした以外は、実施例1と同様にして熱プレス成形フィルムを得た。得られた粉状液晶性樹脂及びフィルムについて、実施例1と同様にして、各種物性を測定し、樹脂の配向性を評価した。
[Comparative Example 3]
A thermosetting film was obtained in the same manner as in Example 1 except that the liquid crystal resin was as shown in Table 1 and the press temperature was 360 ° C. With respect to the obtained powdery liquid crystal resin and film, various physical properties were measured in the same manner as in Example 1, and the orientation of the resin was evaluated.

[測定及び評価]
粉状液晶性樹脂の溶融粘度、平均粒径及び最大粒径、結晶化度、並びに融点(Tm2,Tm1オンセット温度)の測定方法、及び樹脂の配向状況の評価方法は、以下のとおりである。結果を表1に示した。
[Measurement and evaluation]
The method for measuring the melt viscosity, average particle size and maximum particle size, crystallinity, and melting point (Tm2, Tm1 onset temperature) of the powdery liquid crystal resin, and the method for evaluating the orientation state of the resin are as follows. .. The results are shown in Table 1.

(溶融粘度)
キャピラリー式レオメーター(株式会社東洋精機製作所製キャピログラフ1D:ピストン径10mm)を用いて、以下の条件で、ISO 11443に準拠し、見かけの溶融粘度を測定した。測定には、内径1mm、長さ20mmのオリフィスを用いた。
シリンダー温度:
300℃(LCP1)
340℃(LCP2)
350℃(LCP3)
370℃(LCP4)
せん断速度:100sec−1
(Melting viscosity)
Using a capillary rheometer (Capillary Graph 1D manufactured by Toyo Seiki Seisakusho Co., Ltd .: piston diameter 10 mm), the apparent melt viscosity was measured in accordance with ISO 11443 under the following conditions. An orifice having an inner diameter of 1 mm and a length of 20 mm was used for the measurement.
Cylinder temperature:
300 ° C (LCP1)
340 ° C (LCP2)
350 ° C (LCP3)
370 ° C (LCP4)
Shear velocity: 100 sec -1

(平均粒径及び最大粒径)
レーザー回折/散乱式粒度分布測定装置(株式会社堀場製作所製、LA−920)を用い、分散溶媒としてメタノールを用いて、平均粒径及び最大粒径を測定した。なお、平均粒径は、体積基準の算術平均粒子径である。
(Average particle size and maximum particle size)
The average particle size and the maximum particle size were measured using a laser diffraction / scattering particle size distribution measuring device (LA-920, manufactured by HORIBA, Ltd.) and methanol as a dispersion solvent. The average particle size is an arithmetic average particle size based on the volume.

(結晶化度)
X線回折装置(ブルカー社製、D2 PHASER)を用いて、得られる回折情報(広角X線回折図形または広角X線回折プロファイル)から、非晶に由来する散乱領域と結晶に由来する散乱領域とを分け、W.Ruland,Acta Cryst.,14,1180(1961)に記載の方法に準拠し、以下の式(I)により、結晶化度を測定した。
結晶化度(%)=[結晶由来散乱強度/(結晶由来散乱強度+非結晶由来散乱強度)]×100・・・(I)
(Crystallinity)
From the diffraction information (wide-angle X-ray diffraction pattern or wide-angle X-ray diffraction profile) obtained by using an X-ray diffractometer (D2 PHASER, manufactured by Bruker), a scattering region derived from amorphous and a scattering region derived from crystal Divided into W. Ruland, Acta Cryst. , 14, 1180 (1961), and the crystallinity was measured by the following formula (I).
Crystallinity (%) = [Crystal-derived scattering intensity / (Crystal-derived scattering intensity + non-crystal-derived scattering intensity)] × 100 ... (I)

(融点Tm2及び融点Tm1オンセット温度)
示差走査熱量計(株式会社日立ハイテクサイエンス製、DSC7000X)を用いて、室温から20℃/分の昇温速度で加熱(1stRUN)した際に観測される吸熱ピークにおけるピークトップの温度(融点Tm1)の測定後、(融点Tm1+40)℃の温度で2分間保持し、次いで20℃/分の降温速度で室温まで冷却し、再度室温から20℃/分の昇温速度で加熱した際に観測される2ndRUNの吸熱ピークにおけるピークトップの温度を融点Tm2として測定した。また、1stRUNの吸熱ピークにおけるオンセットの温度(ピークが立ち上がり始める温度)を融点Tm1オンセット温度として測定した。
(Melting point Tm2 and melting point Tm1 onset temperature)
The peak top temperature (melting point Tm1) at the heat absorption peak observed when heating (1stRUN) from room temperature at a heating rate of 20 ° C./min using a differential scanning calorimeter (DSC7000X, manufactured by Hitachi High-Tech Science Co., Ltd.). After the measurement, the temperature is kept at (melting point Tm1 + 40) ° C. for 2 minutes, then cooled to room temperature at a temperature lowering rate of 20 ° C./min, and then heated again from room temperature at a heating rate of 20 ° C./min. The temperature of the peak top at the heat absorption peak of 2ndRUN was measured as the melting point Tm2. Further, the onset temperature (the temperature at which the peak starts to rise) at the endothermic peak of 1stRUN was measured as the melting point Tm1 onset temperature.

(樹脂の配向性評価)
フィルムの表面写真を光学式顕微鏡(超深度マルチアングル顕微鏡、KEYENCE社製、「VHX−D510」)を用いて撮影した。得られた写真を図1,2に示した。表面を観察し、以下の基準に沿って評価した。
良 :筋模様が存在しない。
不良:筋模様が存在する。

Figure 0006837580
(Evaluation of resin orientation)
A surface photograph of the film was taken using an optical microscope (ultra-depth multi-angle microscope, "VHX-D510" manufactured by KEYENCE). The obtained photographs are shown in FIGS. 1 and 2. The surface was observed and evaluated according to the following criteria.
Good: There is no streak pattern.
Defective: There is a streak pattern.

Figure 0006837580

Claims (6)

芳香族ヒドロキシカルボン酸由来の構成単位を全構成単位中90モル%以上含有し、平均粒径が10μm以上50μm以下であり、結晶化度が10%以上60%以下であり、
(1)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上からなるポリエステル;
(2)(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上とからなるポリエステル;
(3)(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とからなるポリエステル;
(4)(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とからなるポリエステルアミド;、及び
(5)(a)芳香族ヒドロキシカルボン酸及びその誘導体由来の構成単位から選択される1種又は2種以上と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上と、(d)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体由来の構成単位から選択される1種又は2種以上、とからなるポリエステルアミド;
からなる群から選ばれる少なくとも一種を含む、熱プレス成形品用粉状液晶性樹脂。
It contains 90 mol% or more of the structural units derived from aromatic hydroxycarboxylic acids, the average particle size is 10 μm or more and 50 μm or less, and the crystallinity is 10% or more and 60% or less.
(1) Polyester consisting of one or more selected from the structural units derived from aromatic hydroxycarboxylic acids and their derivatives;
(2) One or more selected from the constituent units derived from (a) aromatic hydroxycarboxylic acids and derivatives thereof, and (b) derived from aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof. Polyester consisting of one or more selected from the structural units;
(3) (a) One or more selected from the constituent units derived from aromatic hydroxycarboxylic acids and derivatives thereof, and (b) derived from aromatic dicarboxylic acids, aliphatic dicarboxylic acids, and derivatives thereof. One or more selected from the constituent units, and (c) one or more selected from the constituent units derived from aromatic diols, alicyclic diols, aliphatic diols, and derivatives thereof. Polyol consisting of;
(4) One or more selected from (a) constituent units derived from aromatic hydroxycarboxylic acids and derivatives thereof, and (b) constituent units derived from aromatic hydroxyamines, aromatic diamines, and derivatives thereof. Polyesteramide consisting of one or more selected from, and (c) one or two or more selected from the constituent units derived from (c) aromatic dicarboxylic acid, alicyclic dicarboxylic acid, and derivatives thereof. ;, And (5) (a) one or more selected from the constituent units derived from aromatic hydroxycarboxylic acids and derivatives thereof, and (b) derived from aromatic hydroxyamines, aromatic diamines, and derivatives thereof. One or more selected from the constituent units of (c) aromatic dicarboxylic acid, alicyclic dicarboxylic acid, and one or more selected from the constituent units derived from their derivatives. d) A polyesteramide consisting of one or more selected from the constituent units derived from aromatic diols, alicyclic diols, aliphatic diols, and derivatives thereof;
A powdery liquid crystal resin for a thermosetting product, which comprises at least one selected from the group consisting of.
示差走査熱量計で測定される融点Tm2と融点Tm1のオンセット温度との差ΔTm(Tm2−Tm1オンセット温度)が30℃以上90℃以下である、請求項1に記載の粉状液晶性樹脂。 The powdery liquid crystal resin according to claim 1, wherein the difference ΔTm (Tm2-Tm1 onset temperature) between the melting point Tm2 and the onset temperature of the melting point Tm1 measured by a differential scanning calorimeter is 30 ° C. or higher and 90 ° C. or lower. .. 示差走査熱量計で測定される融点Tm2が250℃以上400℃以下である、請求項1又は2に記載の粉状液晶性樹脂。 The powdery liquid crystal resin according to claim 1 or 2, wherein the melting point Tm2 measured by a differential scanning calorimeter is 250 ° C. or higher and 400 ° C. or lower. 示差走査熱量計で測定される融点Tm2よりも10〜30℃高いシリンダー温度及びせん断速度100sec−1で測定した溶融粘度が、10Pa・s以上1000Pa・s以下である、請求項1から3のいずれか一項に記載の粉状液晶性樹脂。 Any of claims 1 to 3, wherein the melt viscosity measured at a cylinder temperature 10 to 30 ° C. higher than the melting point Tm2 measured by a differential scanning calorimeter and a shear rate of 100 sec -1 is 10 Pa · s or more and 1000 Pa · s or less. The powdery liquid crystal resin according to item 1. 最大粒径と平均粒径との比(最大粒径/平均粒径)が5以下である、請求項1から4のいずれか一項に記載の粉状液晶性樹脂。 The powdery liquid crystal resin according to any one of claims 1 to 4, wherein the ratio of the maximum particle size to the average particle size (maximum particle size / average particle size) is 5 or less. 請求項1から5のいずれか一項に記載の粉状液晶性樹脂を含有する、熱プレス成形品用粉体材料。 A powder material for a hot press molded product, which contains the powdery liquid crystal resin according to any one of claims 1 to 5.
JP2019565046A 2018-05-18 2019-05-14 Powdered liquid crystal resin for hot press molded products and hot press molded products Active JP6837580B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018095842 2018-05-18
JP2018095842 2018-05-18
PCT/JP2019/019032 WO2019221094A1 (en) 2018-05-18 2019-05-14 Powdery liquid-crystalline resin for hot-press-molded article and hot-press-molded article

Publications (2)

Publication Number Publication Date
JPWO2019221094A1 JPWO2019221094A1 (en) 2020-05-28
JP6837580B2 true JP6837580B2 (en) 2021-03-03

Family

ID=68539760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019565046A Active JP6837580B2 (en) 2018-05-18 2019-05-14 Powdered liquid crystal resin for hot press molded products and hot press molded products

Country Status (4)

Country Link
JP (1) JP6837580B2 (en)
CN (1) CN112119115B (en)
TW (1) TWI808176B (en)
WO (1) WO2019221094A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115087692B (en) * 2020-03-06 2024-02-13 株式会社村田制作所 Liquid crystal polymer film and method for producing same
CN116888196A (en) * 2021-02-02 2023-10-13 住友化学株式会社 Liquid crystal polyester powder, composition, method for manufacturing composition, method for manufacturing film, and method for manufacturing laminated body

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139921A (en) * 1986-12-01 1988-06-11 Unitika Ltd Production of powder
JP2002275283A (en) * 2001-03-21 2002-09-25 Sekisui Chem Co Ltd Liquid crystal resin fiber reinforced film, laminated sheet and interior materials for automobiles
JP2003292638A (en) * 2002-03-29 2003-10-15 Kuraray Co Ltd High heat resistant film
JP2005178056A (en) * 2003-12-17 2005-07-07 Polyplastics Co Molding method of liquid crystalline polyester resin
JP2010150487A (en) * 2008-12-26 2010-07-08 Toyo Seikan Kaisha Ltd Ethylene terephthalate-based polyester resin for molding container and method for manufacturing the same
JP2011000791A (en) * 2009-06-18 2011-01-06 Nissei Plas-Tech Corp Method for molding crystalline liquid crystal polymer, and molding thereof
JP6017675B2 (en) * 2013-03-26 2016-11-02 日本軽金属株式会社 Metal-resin bonded body and manufacturing method thereof
CN105593266B (en) * 2013-07-31 2017-12-12 东丽株式会社 The manufacture method and liquid crystal polyester of liquid crystal polyester
JP6576802B2 (en) * 2015-11-25 2019-09-18 上野製薬株式会社 Liquid crystal polymer

Also Published As

Publication number Publication date
CN112119115A (en) 2020-12-22
TW202003627A (en) 2020-01-16
WO2019221094A1 (en) 2019-11-21
CN112119115B (en) 2024-08-06
TWI808176B (en) 2023-07-11
JPWO2019221094A1 (en) 2020-05-28

Similar Documents

Publication Publication Date Title
JP6576808B2 (en) Liquid crystal polymer
JP6473796B1 (en) Liquid crystal polyester resin composition and molded body
KR102847953B1 (en) Liquid crystal polymer composition
JP5087958B2 (en) Molded product comprising liquid crystalline resin composition
JP6788150B2 (en) Powdered liquid crystal resin for press-molded products, press-molded products and their manufacturing methods
CN112334516B (en) Method for producing liquid crystalline resin fine particles
JP6576802B2 (en) Liquid crystal polymer
JP6837580B2 (en) Powdered liquid crystal resin for hot press molded products and hot press molded products
JP7325972B2 (en) POWDER MATERIAL FOR 3D PRINTER, THREE-DIMENSIONAL PRODUCT AND MANUFACTURING METHOD THEREOF
JP6294690B2 (en) Liquid crystalline polyester composition
JP7498641B2 (en) Liquid crystal polymer composition
WO2019151184A1 (en) Resin composition
JP2010077397A (en) Liquid crystal polyester particle, and method of manufacturing modified liquid crystal polyester particle using the same
JP7084133B2 (en) Liquid crystal resin manufacturing method
JP2023135620A (en) Liquid crystal resins, liquid crystal resin compositions, and molded products thereof
TWI874733B (en) Conductive liquid crystal resin composition
JP2010168576A (en) Liquid crystalline polyester powder and method for producing the same
JP7274303B2 (en) Liquid crystalline resin powder for thermoplastic prepreg and thermoplastic prepreg
JP4884920B2 (en) Liquid crystal polymer composition and molded article comprising the same
WO2022153945A1 (en) Liquid crystal polyester composition, method for producing liquid crystal polyester composition, and method for producing injection molded article
TW202600790A (en) Liquid crystal polymer composition

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20191122

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191122

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20191122

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200427

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200728

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200917

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201117

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210106

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210209

R150 Certificate of patent or registration of utility model

Ref document number: 6837580

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250