JP6842404B2 - Manufacturing method of adhesive base material - Google Patents

Description

The present invention relates to an adhesive base material and a method for producing an adhesive base material.

In recent years, electronic devices have become smaller and lighter, mainly in portable devices such as watches and mobile phones. Along with this, the semiconductor chips built into these electronic devices are also becoming smaller and smaller.

Wire bonding has been conventionally known as a method of connecting a lead wire to an electrode of a semiconductor chip, but it is not suitable for miniaturization of a semiconductor chip because the space occupied by the wire is large.

Therefore, flip-chip bonding is performed in which the upper surface of the electrode is inverted and directly connected to the electrode substrate (Patent Documents 1 and 2). With this method, it is possible to reduce the size because there is no wire. However, since the conventional method picks up the chips one by one, it takes a very long time to die bond a large number of very small chips such as micro LEDs.

In the transfer member described in Patent Document 3, an adhesive layer is attached to a flat surface on the convex portion of the uneven pattern, but such a transfer member is surface-adhesive when brought into contact with the chip. Since the area of contact between the layer and the chip is large, it is difficult for all the chips to be properly transferred to another adhesive substrate when the chip is picked up and placed on another adhesive substrate. Further, since the area in contact between the flat adhesive layer and the chip is large, the pick-up speed of the chip and the transfer speed to another adhesive substrate are different, and the process becomes complicated.

Japanese Unexamined Patent Publication No. 2016-001752 International Publication WO2014 / 098174 International Publication WO 2016/012409

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an adhesive substrate and a method for producing an adhesive substrate capable of die-bonding a large amount of fine chips in a short time.

In order to solve the above problems, according to the present invention, the adhesive base material has a support base material and an adhesive layer provided on the support base material, and the support base material is provided on one side or both sides. It has a concavo-convex pattern having two or more convex portions, and the adhesive layer is provided on at least the upper surface of the convex portion of the concavo-convex pattern of the supporting base material, and the surface of the adhesive layer on the upper surface of the convex portion is provided. Provided is an adhesive base material having a curved surface.

According to the adhesive substrate of the present invention, it is possible to die bond a large amount of fine chips in a short time.

Further, in this case, it is preferable that the adhesive layer is provided only on the upper surface of the convex portion of the uneven pattern of the supporting base material.

Further, the adhesive layer is also provided in the concave portion of the concave-convex pattern of the supporting base material, and the surface height of the adhesive layer provided in the concave portion of the concave-convex pattern is the height of the convex portion. It is preferable that the adhesive layer is provided at a position lower than the surface height of the adhesive layer provided on the upper surface.

Specific aspects of the adhesive substrate of the present invention can be mentioned. With such an adhesive base material, a large number of fine chips can be selectively picked up, and a large number of chips can be die-bonded in a short time.

Further, in this case, it is preferable that only the surface of the adhesive layer provided on the upper surface of the convex portion of the supporting base material has a curved surface.

With such an adhesive base material, a large amount of fine chips can be selectively picked up more reliably, and a large number of chips can be die-bonded in a short time.

Further, it is preferable that the difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base material and the surface height of the concave portion of the uneven pattern of the support base material is 1 μm to 100 μm at the longest. ..

Further, the difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the supporting base material and the surface height of the adhesive layer provided on the concave portion of the supporting base material shall be a maximum of 1 μm to 100 μm. Is preferable.

The distance between the surface of the adhesive layer provided on the upper surface of the convex portion of the support base material and the surface of the concave portion of the support base material or the surface of the adhesive layer provided in the concave portion is more reliable and fine. A large number of chips can be selectively picked up, and a large number of chips can be die-bonded in a short time.

Further, the maximum thickness of the adhesive layer is preferably 0.01 μm to 100 μm.

An adhesive layer having such a maximum thickness (height) is preferable because the amount of deformation can be reduced when the adhesive base material is pressed against the chip.

Further, it is preferable that the distance between the convex portions adjacent to the uneven pattern of the supporting base material is 1 μm to 100 μm.

Further, it is preferable that the width of the convex portion of the uneven pattern of the supporting base material is 1 μm to 100 μm.

Such an interval between adjacent convex portions of the supporting base material and the width of the convex portions are preferable because fine chips can be reliably picked up.

Further, the adhesive strength of the adhesive layer is 23 ° C., a peeling angle of 180 °, and a peeling speed of 300 mm / min. The adhesive strength at the time of peeling under the above conditions is preferably 0.05 to 50 (N / 25 mm width).

When the adhesive strength of the adhesive layer in the present invention is within this range, it is preferable because it has sufficient adhesiveness to pick up the microchip.

Further, it is preferable that the adhesive base material is for micro LED transfer.

The adhesive substrate of the present invention is useful for micro LED transfer because it can selectively pick up a large number of fine chips and die bond a large number of chips in a short time.

Further, in the present invention, the method for producing an adhesive base material has a curved surface on the surface of at least the upper surface of the convex portion of the support base material by applying an adhesive from a nozzle by electrostatic force. Provided is a method for producing an adhesive base material, which comprises forming an adhesive layer.

By applying the adhesive by electrostatic force in this way, the adhesive base material of the present invention in which the pressure-sensitive adhesive layer having a curved surface is provided on the upper surface of the convex portion of the support base material can be produced in a short time. it can.

In the adhesive base material of the present invention, a concavo-convex pattern is arranged on the surface of the support base material, and at least an adhesive layer is provided on the upper surface of the convex portion of the concavo-convex pattern of the support base material, and the adhesive layer on the upper surface of the convex portion is provided. Since the layer surface has a curved surface, a large number of fine chips can be selectively picked up, and a large number of chips can be die-bonded in a short time. Therefore, it is useful as a base material for chip transfer.

FIG. 5A is a schematic cross-sectional view showing one embodiment of the adhesive base material of the present invention, and FIG. 3B is a schematic cross-sectional view showing another embodiment of the adhesive base material of the present invention. It is a flow figure explaining the manufacturing process of the support base material which has a concavo-convex pattern by lithography. It is a photograph of a supporting base material having a width of 10 μm, a height of 10 μm, and an interval of 10 μm of the convex portions. It is a photograph of the adhesive base material of Example 1 in which an adhesive layer was formed on the support base material of FIG. It is a photograph of a supporting base material having a width of 5 μm, a height of 10 μm, and an interval of 5 μm of the convex portions. It is a photograph of the adhesive base material of Example 2 in which an adhesive layer was formed on the support base material of FIG. It is a photograph of a supporting base material having a width of 30 μm, a height of 50 μm, and an interval of 30 μm of the convex portions. It is a photograph of the adhesive base material of Example 3 in which an adhesive layer was formed on the support base material of FIG. 7. It is the schematic sectional drawing of the adhesive base material of the comparative example 1. FIG. It is the schematic sectional drawing of the adhesive base material of the comparative example 2. FIG. It is the schematic sectional drawing of the adhesive base material of the comparative example 3. FIG. It is an image diagram of the process of selectively picking and placing red, green, and blue micro LEDs in the adhesion test of Examples and Comparative Examples.

As a result of diligent studies to achieve the above object, the present inventor is an adhesive base material having a support base material and an adhesive layer provided on the support base material, and the support base material is a support base material. It has a concavo-convex pattern having two or more convex portions on one side or both sides, and the adhesive layer is provided on at least the upper surface of the convex portion of the concavo-convex pattern of the supporting base material, and the upper surface of the convex portion. If the surface of the adhesive layer is an adhesive substrate having a curved surface, a large number of fine chips can be selectively picked up, and by pressing the circuit electrodes of the substrate, a large number of chips can be picked up in a short time. They have found that they can be electrically connected, and have come up with the present invention. Hereinafter, the adhesive base material of the present invention and the method for producing the adhesive base material will be described in detail.

That is, the present invention is an adhesive base material having a support base material and an adhesive layer provided on the support base material, and the support base material has two or more convex portions on one side or both sides. It has a concavo-convex pattern, and the adhesive layer is provided at least on the upper surface of the convex portion of the concavo-convex pattern of the supporting base material, and the surface of the adhesive layer on the upper surface of the convex portion has a curved surface. Provided is a characteristic adhesive base material.

As a specific embodiment of such an adhesive base material of the present invention, as shown in FIG. 1 (A), the convex surface of the support base material 1 having a concavo-convex pattern having two or more convex portions on one side or both sides. An adhesive base material 100A in which the adhesive layer 2a is provided only on the upper surface 1'of the portion and the surface of the adhesive layer 2a on the upper surface 1'of the convex portion has a curved surface can be mentioned. As another aspect, as shown in FIG. 1B, the adhesive layer 2a is provided on the upper surface 1'of the convex portion of the supporting base material 1, and the unevenness of the supporting base material 1 is provided in addition to the adhesive layer 2a. The adhesive layer 2b is also provided in the concave portion of the pattern, and the surface height of the adhesive layer 2b provided in the concave portion of the concave-convex pattern is the surface of the adhesive layer 2a provided on the upper surface 1'of the convex portion. Examples thereof include an adhesive base material 100B provided so as to be located at a position lower than the height. Hereinafter, the supporting base material and the adhesive layer in the present invention will be described in detail.

[Supporting base material]
The supporting base material 1 used in the present invention is not particularly limited as long as it has a concavo-convex pattern having two or more convex portions on one side or both sides, particularly a regular concavo-convex pattern. .. Such a supporting base material 1 can be produced by using, for example, glass, a ceramics substrate, a silicon wafer, a glass epoxy laminated substrate, a polyimide laminated substrate, a paper phenol substrate, a silicone resin substrate, a fluororesin substrate, a polyester substrate, or the like. it can.

The method of providing the concavo-convex pattern is not particularly limited, and for example, a support base material 1 in which the concavo-convex pattern is directly formed on the workpiece by photolithography can be used.

The method for producing the supporting base material 1 having an uneven pattern by photolithography may follow a conventionally known method, and as shown in FIG. 2, the photoresist 4 is applied to the workpiece 3, then exposed, and then exposed. The supporting substrate 1 having an uneven pattern can be obtained by developing, then etching, and then cleaning the excess resist.

Further, a molding material is pressed against the uneven pattern produced by such a method to form a mold, and a thermosetting resin, a thermoplastic resin, or the like is poured into the mold to obtain a supporting base material 1 having the uneven pattern. good.

Further, the supporting base material 1 having the uneven pattern in the present invention may be arranged by applying an adhesive on another substrate. The pressure-sensitive adhesive in this case may be the same as or different from the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer provided on the upper surface of the convex portion of the support base material 1 in the present invention. Examples of other substrates include substrates similar to those used for producing the support base material.

The size and spacing of the uneven pattern of the support base material 1 are not particularly limited and can be appropriately selected according to the chip size to be picked up. However, in order to pick up fine chips, FIG. 1 is shown. The width 101 of the convex portion can be 1 μm to 100 μm, preferably 1 μm to 20 μm, and more preferably 1 μm to 10 μm.

Further, the heights 103a and 103b are preferably 1 μm to 100 μm, preferably 1 μm to 20 μm, and more preferably 1 μm to 10 μm according to the width 101. As shown in FIG. 1A, the height 103a referred to here is the surface height of the adhesive layer 2a provided on the upper surface of the convex portion of the supporting base material and the surface height of the concave portion of the supporting base material. The longest distance of the difference, and the height 103b, is the surface height of the adhesive layer provided on the upper surface of the convex portion of the supporting base material and the concave portion of the supporting base material, as shown in FIG. 1 (B). It is the longest distance of the difference from the surface height of the adhesive layer provided in.

The distance 102 between adjacent convex portions is preferably 1 μm to 100 μm, preferably 1 μm to 50 μm, and more preferably 1 μm to 20 μm. In the present invention, the width, height, and spacing of the convex portions refer to the values measured by the scanning electron microscope.

[Adhesive layer]
The adhesive base materials 100A and 100B of the present invention are characterized in that, at least, the adhesive layer 2a is provided on the upper surface 1'of the convex portion of the concave-convex pattern of the supporting base material 1, and the surface of the adhesive layer 2a has a curved surface. .. An adhesive base material having an adhesive layer 2a having such a shape can disperse the pressing pressure at the time of picking up the microchip and reduce the pressure applied to the chip, and can be peeled off with low stress by reducing the adhesion area. be able to. Therefore, it is possible to die bond a large number of fine chips in a short time. Further, the adhesive layer in the present invention may be formed in the concave portion of the concave-convex pattern of the support base material 1, but it is preferable that only the surface of the adhesive layer 2a on the upper surface of the convex portion of the support base material has a curved surface.

The adhesive strength of the adhesive layer is not particularly limited, but the 180-degree peel strength is preferably 0.05 to 50 (N / 25 mm width), more preferably 0.1 to 40 (N / 25 mm width), and 0.15. ~ 30 (N / 25 mm width) is more preferable. Within this range, it has sufficient adhesiveness to pick up a microchip.

The adhesive strength in the present invention is measured by the method described in JIS Z 0237: 2009, and has a temperature of 23 ° C. and a peeling speed of 300 mm / min. , Peeling angle: Refers to the peeling strength when peeling under the condition of 180 °.

The maximum thickness (height) of the adhesive layer is not particularly limited, but it is preferable that the amount of deformation is small when the substrate for chip transfer is pressed against the chip, and the amount of deformation is preferably 0.01 μm to 100 μm, preferably 0.01 μm. It is preferably ~ 50 μm, more preferably 0.05 μm to 30 μm.

The pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the present invention is not particularly limited, and examples thereof include those that cure after application, such as acrylic pressure-sensitive adhesive, silicone pressure-sensitive adhesive, urethane pressure-sensitive adhesive, latex pressure-sensitive adhesive, and epoxy pressure-sensitive adhesive.

The method for forming the adhesive layer is not particularly limited, but the surface of the adhesive layer on the upper surface of the convex portion of the supporting base material needs to have a curved surface. In particular, as shown in FIG. 1A, it is preferable to form the adhesive layer 2a having a curved surface only on the upper surface of the convex portion of the support base material 1. Alternatively, as shown in FIG. 1B, an adhesive layer 2a having a curved surface on the upper surface 1'of the convex portion of the support base material 1 is provided, and an adhesive layer 2b is also provided on the concave portion of the concave-convex pattern of the support base material 1. It is preferable to form the adhesive layer 2b provided in the concave portion of the pattern so that the surface height is lower than the surface height of the adhesive layer 2a provided on the upper surface of the convex portion.

Therefore, if the adhesive is simply applied with a spin coater or a normal pressure spray, the adhesive applied to the convex portion of the supporting base material will flow, and the adhesive layer will not be formed on the upper surface of the convex portion, or the adhesive of the concave portion will be adhered. The height of the layer and the height of the adhesive layer on the convex portion become the same, and it becomes impossible to selectively pick up fine flip chips.

An adhesive layer 2a having a curved surface is formed only on the upper surface 1'of the convex portion of the support base material 1 (FIG. 1 (A)), or the adhesive layer 2b is also formed on the concave portion of the uneven pattern of the support base material 1. The surface height of the adhesive layer 2b provided in the concave portion of the concave-convex pattern is formed so that the surface provided on the upper surface of the convex portion is lower than the surface height of the adhesive layer 2a having a curved surface. Specific methods for (FIG. 1B) include, for example, applying an adhesive from above the convex portion using a fine nozzle, or electrostatically applying (electrospray).

In particular, in electrostatic coating, a positively or negatively charged adhesive is applied to the base material by the attractive force of static electricity, so that it is often applied to places where the distance between the nozzle and the base material is short, and it takes a short time without fine control. The surface height of the adhesive layer 2b provided in the concave portion of the concave-convex pattern is such that the adhesive layer 2a having a curved surface is formed only on the upper surface 1'of the convex portion of the support base material 1. It is preferable because the pressure-sensitive adhesive can be applied so as to form the pressure-sensitive adhesive layers 2a and 2b such that the surface provided on the upper surface of the surface is lower than the surface height of the pressure-sensitive adhesive layer 2a having a curved surface.

The shape of the nozzle is not particularly limited, but a circular shape is desirable in order to apply a voltage uniformly to the dispersion liquid. The diameter of the nozzle is not particularly limited and can be appropriately selected according to the width and spacing of the pattern. For example, in order to form an adhesive layer in a convex pattern having a width of 10 μm, a height of 10 μm, and a spacing of 10 μm, It is preferably 5 μm to 500 μm, preferably 10 μm to 300 μm, and more preferably 20 μm to 100 μm.

Within this range, the adhesive layer 2a having a curved surface is formed only on the upper surface of the convex portion of the support base material 1, or the surface height of the adhesive layer 2b provided in the concave portion of the support base material 1 is increased. The adhesive can be applied so that the adhesive layers 2a and 2b are formed so that the surface provided on the upper surface of the convex portion is lower than the surface height of the adhesive layer 2a having a curved surface.

The voltage to be applied is not particularly limited, but is, for example, 1,000 V to 10,000 V, preferably 1,000 V to 8,000 V, and more preferably 1,000 V to 5,000 V. The distance between the tip of the nozzle and the supporting base material is, for example, 10 μm to 3,000 μm, preferably 10 μm to 2,000 μm.

The method for curing the adhesive layer varies depending on the type of resin, but is not particularly limited, and examples thereof include thermosetting, photocuring, and moisture curing.

Since the adhesive substrate in the present invention can selectively pick up a large amount of fine chips and die bond a large number of chips in a short time, it is suitably used for a bonding head for micro LED transfer. To.

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.

(Example 1)
A photoresist film 4 is formed on a silicon wafer (workpiece 3) on which an oxide film is formed, and a concavo-convex pattern having a convex portion width of 10 μm, a height of 10 μm, and an interval of 10 μm is formed by using a known photolithography method. , A supporting base material having a concavo-convex pattern was produced (FIGS. 2 and 3). Next, using methyl ethyl ketone (MEK), the addition-curing silicone pressure-sensitive adhesive KR-3700 (manufactured by Shin-Etsu Chemical Industry Co., Ltd., adhesive strength: 8.7 N / 25 mm) was diluted to a solid content concentration of 1.25% by mass. , The adhesive is applied to the upper surface of the convex portion of the uneven pattern using an electrostatic spray / coating experimental machine (manufactured by Apic Yamada Co., Ltd.) to obtain an adhesive base material having an adhesive layer having a curved surface only on the convex portion. Manufactured (Fig. 4).

(Example 2)
By the same method as in Example 1, a concavo-convex pattern having a convex portion width of 5 μm, a height of 10 μm, and an interval of 5 μm is formed on a silicon wafer (workpiece 3) on which an oxide film is formed, and a support group having the concavo-convex pattern is formed. A material was prepared (Fig. 5). Next, using methyl ethyl ketone (MEK), an addition-curing silicone pressure-sensitive adhesive X-40-3270-1 (manufactured by Shin-Etsu Chemical Industry Co., Ltd., adhesive strength: 0.15 N / 25 mm) was added to a solid content concentration of 1.25 mass. %, And the adhesive is applied to the upper surface of the convex portion of the uneven pattern using an electrostatic spray / coating experimental machine (manufactured by Apic Yamada Co., Ltd.), and the adhesive layer having a curved surface is provided only on the convex portion. A sex substrate was produced (Fig. 6).

(Example 3)
In the same manner as in Example 1, a concavo-convex pattern having a convex portion width of 30 μm, a height of 50 μm, and an interval of 30 μm was formed on a silicon wafer (workpiece 3) on which an oxide film was formed to prepare a mold. An addition-curable dimethyl silicone resin was poured into the mold, heated at 150 ° C. for 4 hours to cure, and peeled off to prepare a silicone resin mold in which the uneven pattern was the reverse of that of a silicon wafer. An addition-curable methylphenyl silicone resin was poured into the prepared mold, heated at 150 ° C. for 4 hours to cure, and peeled off to prepare a silicone resin supporting base material having an uneven pattern (FIG. 7). Next, as the adhesive layer, methyl ethyl ketone (MEK) was used to dilute the acrylic resin-based adhesive Oliveine BPW6570 (manufactured by Toyochem Co., Ltd., adhesive strength: 25.6 N / 25 mm) to a solid content concentration of 10% by mass, and the adhesive The agent was applied to the upper surface of the convex portion of the uneven pattern using an electrostatic spray / coating experimental machine (manufactured by Apic Yamada Co., Ltd.) to produce an adhesive base material having an adhesive layer having a curved surface only on the convex portion (). FIG. 8).

(Comparative Example 1)
By the same method as in Example 1, a concavo-convex pattern having a convex portion width of 10 μm, a height of 10 μm, and an interval of 10 μm is formed on a silicon wafer (workpiece 3) on which an oxide film is formed, and a support group having the concavo-convex pattern is formed. The material was prepared. Next, as an adhesive layer, methyl ethyl ketone (MEK) was used to add a curable silicone adhesive KR-3700 (manufactured by Shinetsu Chemical Industry Co., Ltd., adhesive strength: 8.7 N / 25 mm) with a solid content concentration of 1.25 mass%. The adhesive is applied to the uneven pattern using a spin coater (manufactured by Active Co., Ltd.), and the adhesive layer 20 is provided only in the concave portion of the supporting base material 10 as shown in FIG. An adhesive base material having no adhesive layer in the portion was prepared.

(Comparative Example 2)
A silicone resin supporting base material having an uneven pattern was produced in the same manner as in Example 3 except that the width of the convex portion was changed to 10 μm, the height was changed to 10 μm, and the interval was changed to 10 μm. Next, as an adhesive layer, methyl ethyl ketone (MEK) was used to add a curable silicone adhesive KR-3700 (manufactured by Shinetsu Chemical Industry Co., Ltd., adhesive strength: 8.7 N / 25 mm) with a solid content concentration of 1.25 mass%. The pressure-sensitive adhesive is applied to the uneven pattern using a hand spray gun, and the concave portion of the support base material 10 is filled with the adhesive layer 20 as shown in FIG. 10, and has no uneven pattern, that is, An adhesive base material having a flat surface of the adhesive layer 20 formed on the upper surface and the concave portion of the convex portion was produced.

(Comparative Example 3)
A silicone resin supporting base material having an uneven pattern was produced in the same manner as in Example 3 except that the width of the convex portion was changed to 20 μm, the height was changed to 50 μm, and the interval was changed to 20 μm. Next, as an adhesive layer, an addition-curable silicone adhesive KR-3700 (manufactured by Shin-Etsu Chemical Co., Ltd., adhesive strength: 8.7 N / 25 mm) was screen-printed, and the supporting base material 10 as shown in FIG. An adhesive base material having a rectangular adhesive layer 20 on the convex portion of the surface was prepared.

[Adhesion test]
Using the adhesive substrates obtained in Examples 1 to 3 and Comparative Examples 1 to 3, the red, green, and blue micro LEDs arranged as shown in FIG. 12 were selectively transferred by pick and place. Those that were selectively transcribed were marked with ◯, and those that could not be transcribed were marked with x. The results are shown in Table 1.

As shown in Table 1, if the adhesive substrate of the present invention (Examples 1 to 3) is used, many micro LEDs can be selectively picked and placed at one time, and therefore, it is suitably used for transfer of micro LEDs. Can be done.

On the other hand, in Comparative Example 1, the LED could not be picked up because the adhesive layer was not provided on the convex portion of the supporting base material as in the example. Further, in Comparative Example 2, since the adhesive layer was provided in all of the concave portion and the convex portion, the LED could not be selectively picked up. Also, the picked up LED could not be transferred. In Comparative Example 3, the LED could be selectively picked up, but it could not be transferred to another adhesive substrate because the contact area between the chip and the adhesive layer was large.

The present invention is not limited to the above embodiment. The above-described embodiment is an example, and any object having substantially the same configuration as the technical idea described in the claims of the present invention and exhibiting the same effect and effect is the present invention. Included in the technical scope of.

1, 10 ... Supporting base material, 1'... Upper surface of the convex portion of the supporting base material, 2a, 2b, 20 ... Adhesive layer, 3 ... Work piece, 4 ... Photoresist, 100A, 100B ... Adhesive base material, 101 ... Width of the convex portion, 102 ... Spacing of adjacent convex portions, 103a, 103b ... Height.

Claims (11)

A method for producing an adhesive base material having a support base material and an adhesive layer provided on the support base material.
The supporting base material has an uneven pattern having two or more convex portions on one side or both sides.
The adhesive layer is at least provided on the upper surface of the convex portion of the concavo-convex pattern of the supporting substrate, Ri manufacturing method der adhesive base material which the adhesive layer surface of the upper surface of the convex portion has a curved surface, A method for producing an adhesive base material , which comprises applying an adhesive from a nozzle by electrostatic force to form an adhesive layer having a curved surface on at least the upper surface of the convex portion of the support base material . The adhesive layer is, the production method of the adhesive base material according to claim 1, characterized in Tei Rukoto provided only on the upper surface of the convex portion of the concavo-convex pattern of the supporting substrate. The adhesive layer, the well is provided in the recess of the uneven pattern of the supporting substrate in contact it is, and the surface height of the adhesive layer provided on the concave portion of the concavo-convex pattern is provided on the upper surface of the convex portion method for producing adhesive base material according to claim 1 above, wherein the Tei Rukoto provided so as to be lower than the surface height of the adhesive layer which is. Wherein only the surface of the supporting substrate the adhesive layer provided on the upper surface of the convex portion of the method for producing an adhesive base material according to claim 3, characterized that you have to have a curved surface. And the surface height of the adhesive layer provided on the upper surface of the convex portion of the supporting substrate, and wherein the longest 1μm~100μm and to Rukoto the difference between the surface height of the concave portion of the concavo-convex pattern of the supporting substrate The method for producing an adhesive base material according to claim 2. Wherein the surface height of the support the adhesive layer provided on the upper surface of the convex portion of the substrate, the longest 1μm~100μm and to Rukoto the difference between the surface height of the pressure-sensitive adhesive layer provided on the concave portion of the supporting substrate The method for producing an adhesive base material according to claim 3 or 4, wherein the adhesive base material is produced. Production method of the adhesive base material as claimed in any one of claims 6, wherein to Rukoto and 0.01μm~100μm the maximum thickness of the adhesive layer. Production method of the adhesive base material as claimed in any one of claims 7 to the uneven pattern, wherein 1μm~100μm and to Rukoto an interval between the convex portions adjacent in the supporting substrate .. Production method of the adhesive base material as claimed in any one of claims 8, wherein the width 1μm~100μm and to Rukoto of the convex portion of the concavo-convex pattern of the supporting substrate. The adhesive strength of the adhesive layer was adjusted to 23 ° C., a peeling angle of 180 °, and a peeling speed of 300 mm / min, in accordance with JIS Z 0237: 2009. In adhesive strength at the peeling of the condition, 0.05~50 (N / 25mm width) and to the claim 1, characterized in Rukoto according to any one of claims 9 tacky substrate Manufacturing method . It said adhesive base material, the production method of the adhesive base material according to claims 1, characterized in be used in actual micro LED transfer to any one of claims 10.