JP6844962B2 - Laminates, methods for manufacturing them, methods for manufacturing electronic components, and methods for improving the adhesiveness between the separation layer and the substrate in the laminate. - Google Patents

Description

The present invention relates to a laminate, a method for producing the same, a method for producing an electronic component using the laminate, and a method for improving the adhesiveness between the separation layer and the substrate in the laminate.

As a semiconductor package (semiconductor device) including a semiconductor element (electronic component), WLP (Wafer Level Package) and the like are known. For semiconductor packages such as WLP and PLP, fan-in type technology such as fan-in type WLP (Fan-in Wafer Level Package) that rearranges the terminals at the end of the bare chip in the chip area and outside the chip area Fan-out type technologies such as fan-out type WLP (Fan-out Wafer Level Package) for rearranging terminals are known. In particular, the fan-out type technology is applied to a fan-out type PLP (Fan-out Panel Level Package) in which semiconductor elements are arranged and packaged on a panel, and semiconductor devices are integrated, thinned, and miniaturized. Fan-out technologies such as these are attracting attention in order to realize this.

Laminates are used to form encapsulants such as electronic components by semiconductor encapsulation technology, including fan-out technology. For example, Patent Document 1 describes a base material to be ground, a bonding layer in contact with the base material to be ground, a photothermal conversion layer containing a light absorber and a heat-decomposable resin, and a light-transmitting support. However, the photothermal conversion layer is decomposed when the surface of the substrate to be ground on the opposite side of the bonding layer is ground and then irradiated with radiant energy, and the ground substrate and the light are decomposed. A laminate is described that separates it from the permeable support. In such a laminate, the bonding layer is also referred to as an adhesive layer, and the photothermal conversion layer is also referred to as a separation layer.

Japanese Unexamined Patent Publication No. 2004-64040

Since the adhesiveness of the separation layer itself is insufficient in the conventional laminated body, it is necessary to separately provide an adhesive layer in order to reliably bond the substrate for mounting the electronic element and the separation layer. was there. As a result, each of the separation layer and the adhesive layer must be formed individually, which is a heavy load in mass production of the laminated body.

The present invention has been made in view of the above problems, and is a laminate having a separation layer that also functions as an adhesive layer, a method for manufacturing the laminate, a method for manufacturing an electronic component using the laminate, and a laminate. It is an object of the present invention to provide a method for improving the adhesiveness between the separation layer and the substrate.

The present inventor has found that the above problems can be solved by adjusting the surface roughness Sa of the separation layer to 100 Å or more at the interface between the separation layer and the substrate, and has completed the present invention.

A first aspect of the present invention is a laminate including a light-transmitting support, a separation layer, and a substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate to each other.
At the interface between the separation layer and the substrate, the surface roughness Sa of the separation layer is 100 Å or more.
The adhesiveness of the separation layer to the support is a laminate that is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator.

A second aspect of the present invention is to form a coating film made of a photosensitive composition containing a photopolymerization initiator on a light-transmitting support.
After irradiating the coating film with light for decomposing the photopolymerization initiator, the coating film is cured by heating to form a separation layer having a surface roughness Sa of 100 Å or more.
It is a method of manufacturing a laminated body including laminating a substrate on the separation layer.

A third aspect of the present invention is to mount an electronic element on a substrate in the laminated body.
The separation layer in the laminate on which the element is mounted is irradiated with light having a wavelength different from the wavelength of the light for decomposing the photopolymerization initiator to improve the adhesiveness of the separation layer to the support. To lower and
A method for manufacturing an electronic component, which comprises separating the support from the laminate on which the element is mounted.

A fourth aspect of the present invention is a method for improving the adhesiveness between the separation layer and the substrate in a laminated body including a light-transmitting support, a separation layer, and a substrate.
Including adjusting the surface roughness Sa of the separation layer at the interface between the separation layer and the substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate to each other.
The adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator.

According to the present invention, a laminate having a separation layer that also functions as an adhesive layer, a method for manufacturing the laminate, a method for manufacturing an electronic component using the laminate, and an adhesiveness between the separation layer and the substrate in the laminate. It can provide a way to improve. In the above-mentioned laminated body, the adhesiveness between the separation layer and the substrate is excellent even if the adhesive layer is not provided between the separation layer and the substrate.

≪Laminated body≫
The laminate according to the present invention includes a light-transmitting support, a separation layer, and a substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate to each other.
At the interface between the separation layer and the substrate, the surface roughness Sa of the separation layer is 100 Å or more.
The adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator.

The specific use of the laminate according to the present invention is not particularly limited as long as it is used as a laminate in which the substrate is temporarily fixed to the light transmissive support. Specifically, for example, a laminate in which a semiconductor wafer (the substrate) is temporarily fixed to a support plate (the light-transmitting support), which is used in a wafer support system, can be mentioned.

<Light transmissive support>
The support used in the present invention has light transmission. This is intended to allow the light to pass through the support and reach the separation layer when the light is irradiated from the outside of the laminate. Therefore, the support does not necessarily have to transmit all the light, but only the light that should be absorbed by the separation layer (having a desired wavelength) can be transmitted.

Further, in the laminated body according to the present invention, the support is configured to support the substrate. Therefore, the support may have the strength necessary to prevent the substrate from being damaged or deformed when the substrate is processed and conveyed.

From the above viewpoints, examples of the light-transmitting support include a glass plate, an acrylic plate, and the like, and any structure that can fulfill the above-mentioned object can be adopted as the light-transmitting support.

<Board>
The substrate used in the present invention is not particularly limited, and may be an inorganic material layer or an organic material layer. Examples of the inorganic material layer include semiconductor wafers such as silicon wafers and glass substrates. Examples of the organic material layer include those used as a flexible substrate, a molding material, and the like. Examples of the organic matter contained in the organic material layer include polyester (for example, PET, polyethylene naphthalate), polyacrylate (for example, polymethylmethacrylate), polycarbonate, polypropylene, high-density or low-density polyethylene, and the like.

<Separation layer>
The separation layer used in the present invention comprises a cured product of a photosensitive composition containing a photopolymerization initiator, and more specifically, the photosensitive composition further comprises a resin, a photopolymerizable monomer, and light. Contains an absorber. Hereinafter, each component contained in the above-mentioned photosensitive composition will be described.

[Photopolymerization initiator]
The photopolymerization initiator is not particularly limited, and conventionally known photopolymerization initiators can be used. The photopolymerization initiator may be used alone or in combination of two or more. Examples of the photopolymerization initiator include acetophenones such as acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone and p-tert-butylacetophenone; benzophenone, 2 -Benzophenones such as chlorobenzophenone, p, p'-bisdimethylaminobenzophenone; benzoin ethers such as benzoin methyl ether, benzoin isopropyl ether, benzoin isobutyl ether; thioxanthene, 2-chlorothioxanthene, 2,4-diethyl Sulfur compounds such as thioxanthene, 2-methylthioxanthene, 2-isopropylthioxanthene; anthracinones such as 2-ethylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-diphenylanthraquinone; benzoylperoxide, cumene Organic peroxides such as peroxide; thiol compounds such as 2-mercaptobenzoimidal, 2-mercaptobenzoxazole, 2-mercaptobenzothiazole; 2- (o-chlorophenyl) 4,5-di (m-methoxyphenyl) )-Imidazolyl compounds such as imidazolyl dimer; Triazine compounds such as p-methoxytriazine; 2,4,6-tris (trichloromethyl) -s-triazine, 2-methyl-4,6-bis (trichloromethyl)- s-triazine, 2- [2- (5-methylfuran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (fran-2-yl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- [2- (4-diethylamino-2-methylphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2-[ 2- (3,4-dimethoxyphenyl) ethenyl] -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, Halomethyl such as 2- (4-ethoxystyryl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-n-butoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine Triazine compounds having a group; aminoketone compounds such as 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane-1-one; oximue Oxime-based photopolymerization initiators such as stealth compounds (eg, etanone-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyloxime)); And so on.

Among these, an oxime-based photopolymerization initiator is preferable, and an oxime ester compound is more preferable, from the viewpoint of sufficiently maintaining the sensitivity of the photosensitive composition. As such an oxime ester compound, a compound represented by the following formula (C-1) is preferable.

In the above formula (C-1), R ^c1 represents -NO ₂ or -COR ^c5 . Further, R ^c5 represents a heterocyclic group, a fused cyclic aromatic group, or an aromatic group which may have a substituent. R ^{c2 to} R ^c4 each independently represent a monovalent organic group.

^Examples of the heterocyclic group represented by R c5 include a 5-membered ring or more, preferably a 5-membered ring or a 6-membered ring heterocyclic group containing at least one atom of a nitrogen atom, a sulfur atom and an oxygen atom. Examples of heterocyclic groups include nitrogen-containing 5-membered ring groups such as pyrrolyl group, imidazolyl group and pyrazolyl group; nitrogen-containing 6-membered ring groups such as pyridyl group, pyrazinyl group, pyrimidyl group and pyridadinyl group; thiazolyl group and isothiazolyl group. Such as nitrogen-containing sulfur-containing groups; nitrogen-containing oxygen-containing groups such as oxazolyl group and isooxazolyl group; sulfur-containing groups such as thienyl group and thiopyranyl group; oxygen-containing groups such as furyl group and pyranyl group; and the like. Among these, those containing one nitrogen atom or one sulfur atom are preferable. This heterocycle may contain a fused ring. Examples of the heterocyclic group containing a fused ring include a benzothienyl group and the like.

^Examples of the fused cyclic aromatic group represented by R c5 include a naphthyl group, an anthryl group, a phenanthryl group and the like. Moreover, ^{as an aromatic group represented by R c1} , a phenyl group can be mentioned.

The heterocyclic group, the fused cyclic aromatic group, or the aromatic group may have a substituent. In particular, when R ^c5 is an aromatic group, it preferably has a substituent. Examples of such substituents include -NO ₂ , -CN, -SO ₂ R ^c6 , -COR ^c6 , -NR ^c7 R ^c8 , -R ^c9 , -OR ^c9 , ^{-OR c10 -OR c11,} etc. Can be mentioned.

Each of R ^c6 independently represents an alkyl group, which may be substituted with a halogen atom, or may be interrupted by an ether bond, a thioether bond, or an ester bond. The alkyl group in R ^c6 preferably has 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an isobutyl group.

R ^c7 and R ^c8 independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and these may be substituted with a halogen atom. Among these, the alkyl group and the alkylene portion of the alkoxy group are ether-bonded. It may be interrupted by a thioether bond or an ester bond. Further, R ^c7 and R ^c8 may be bonded to form a ring structure. The alkyl group or alkoxy group in R ^c7 and R ^c8 preferably has 1 to 5 carbon atoms, and for example, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a methoxy group, an ethoxy group, and the like. Propyl group and the like can be mentioned.

As a ring structure that can be formed by combining ^{R c7} and R ^{c8, a heterocycle can be mentioned.} Examples of this heterocycle include a 5-membered ring containing at least a nitrogen atom, preferably a 5- to 7-membered heterocycle. This heterocycle may contain a fused ring. Examples of the heterocycle include a piperidine ring, a morpholine ring, a thiomorpholine ring and the like. Of these, the morpholine ring is preferred.

R ^c9 represents an alkyl group in which some or all of the hydrogen atoms may be substituted with halogen atoms. The alkyl group in R ^c9 preferably has 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and an isobutyl group.

R ^c10 and R ^c11 each independently represent an alkyl group, which may be substituted with a halogen atom, or may be interrupted by an ether bond, a thioether bond, or an ester bond. The preferred number of carbon atoms and specific examples thereof are the same as those described in R ^c6 above.

Among these, ^{as R c5} , a phenyl group having a pyrrolyl group, a pyridyl group, a thienyl group, a thiopyralyl group, a benzothienyl group, a naphthyl group and a substituent can be mentioned as a preferable example.

In the above formula (C-1), R ^c2 represents a monovalent organic group. As the organic group, groups represented by -R ^c12 , -OR ^c12 , ^{-COR c12} , -SR ^c12 , and -NR ^c12 R c13 are preferable. R ^c12 and R ^c13 independently represent an alkyl group, an alkenyl group, an aryl group, an aralkyl group, or a heterocyclic group, which may be substituted with a halogen atom, an alkyl group, or a heterocyclic group, and these may be substituted. Of these, the alkylene moiety of the alkyl group and the aralkyl group may be interrupted by an unsaturated bond, an ether bond, a thioether bond or an ester bond. Further, R ^c12 and R ^c13 may be bonded to form a ring structure together with a nitrogen atom.

As the ^{alkyl group represented by R c12} and R c13, those having 1 to 20 carbon atoms are preferable, and those having 1 to 5 carbon atoms are more preferable. Examples of alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, sec-pentyl group. Group, tert-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, isooctyl group, sec-octyl group, tert-octyl group, n-nonyl group, isononyl group, n-decyl group, isodecyl group. Such as linear or branched group. Moreover, this alkyl group may have a substituent. Examples of those having a substituent include a methoxyethoxyethyl group, an ethoxyethoxyethyl group, a propyroxyethoxyethyl group, a methoxypropyl group and the like.

As the ^{alkenyl group represented by R c12} and R c13, those having 1 to 20 carbon atoms are preferable, and those having 1 to 5 carbon atoms are more preferable. Examples of the alkenyl group include a linear or branched chain group such as a vinyl group, an allyl group, a butenyl group, an ethenyl group and a propynyl group. Moreover, this alkenyl group may have a substituent. Examples of those having a substituent include a 2- (benzoxazole-2-yl) ethenyl group and the like.

As the ^{aryl group represented by R c12} and R c13, those having 6 to 20 carbon atoms are preferable, and those having 6 to 10 carbon atoms are more preferable. Examples of the aryl group include a phenyl group, a tolyl group, a xsilyl group, an ethylphenyl group, a naphthyl group, an anthryl group, a phenanthryl group and the like.

As the ^{aralkyl group represented by R c12} and R c13, those having 7 to 20 carbon atoms are preferable, and those having 7 to 12 carbon atoms are more preferable. Examples of the aralkyl group include a benzyl group, an α-methylbenzyl group, an α, α-dimethylbenzyl group, a phenylethyl group, a phenylethenyl group and the like.

^Examples of the heterocyclic group represented by R ^c12 and R c13 include a 5-membered ring or more, preferably a 5- to 7-membered heterocyclic group containing at least one atom of a nitrogen atom, a sulfur atom and an oxygen atom. This heterocyclic group may contain a fused ring. Examples of the heterocyclic group include a pyrrolyl group, a pyridyl group, a pyrimidyl group, a frill group, a thienyl group and the like.

Of these R ^c12 and R ^c13 , the alkylene moiety of the alkyl group and the aralkyl group may be interrupted by an unsaturated bond, an ether bond, a thioether bond or an ester bond.

Further, as a ring structure that can be formed by combining ^{R c12} and R ^{c13, a heterocycle can be mentioned.} Examples of this heterocycle include a 5-membered ring containing at least a nitrogen atom, preferably a 5- to 7-membered heterocycle. This heterocycle may contain a fused ring. Examples of the heterocycle include a piperidine ring, a morpholine ring, a thiomorpholine ring and the like.

Of these, R ^c2 is most preferably a methyl group, an ethyl group, a propyl group, or a phenyl group.

In the above formula (C-1), R ^c3 represents a monovalent organic group. Examples of the organic group include an alkyl group having 1 to 5 carbon atoms, an aryl group having 6 to 12 carbon atoms which may have a substituent, a group represented by the following formula (C-2), or a substituent. A heterocyclic group which may have is preferable. Examples of the substituent include the same groups as in the case of ^{R c5.} Examples of the aryl group having 6 to 12 carbon atoms include a phenyl group, a naphthyl group, an anthryl group, a phenanthryl group and the like.

In the above formula (C-2), R ^c14 represents an alkylene group having 1 to 5 carbon atoms which may be interrupted by an oxygen atom. Examples of such an alkylene group include a methylene group, an ethylene group, an n-propylene group, an isopropylene group, an n-butylene group, an isobutylene group, a sec-butylene group, an n-pentylene group, an isopentylene group and a sec-pentylene group. Examples include linear or branched groups. Of these, R ^c14 is most preferably an isopropylene group.

In the above formula (C-2), R ^c15 represents a monovalent organic group represented by −NR ^c16 R ^{c17 (R c16} and R ^c17 each independently represent a monovalent organic group). Among such organic groups, if ^{the structure of R c15} is represented by the following formula (C-3), it is preferable in that the solubility of the photopolymerization initiator can be improved.

In the above formula (C-3), R ^c18 and R ^c19 each independently represent an alkyl group having 1 to 5 carbon atoms. Examples of such alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, sec-. Examples thereof include a pentyl group and a tert-pentyl group. Of these, R ^c18 and R ^c19 are most preferably methyl groups.

^Examples of the heterocyclic group represented by R c3 include a 5-membered ring or more, preferably a 5-membered ring or a 6-membered ring heterocyclic group containing at least one atom of a nitrogen atom, a sulfur atom and an oxygen atom. Examples of heterocyclic groups include nitrogen-containing 5-membered ring groups such as pyrrolyl group, imidazolyl group and pyrazolyl group; nitrogen-containing 6-membered ring groups such as pyridyl group, pyrazinyl group, pyrimidyl group and pyridadinyl group; thiazolyl group and isothiazolyl group. Such as nitrogen-containing sulfur-containing groups; nitrogen-containing oxygen-containing groups such as oxazolyl group and isooxazolyl group; sulfur-containing groups such as thienyl group and thiopyranyl group; oxygen-containing groups such as furyl group and pyranyl group; and the like. Among these, those containing one nitrogen atom or one sulfur atom are preferable. This heterocycle may contain a fused ring. Examples of the heterocyclic group containing a fused ring include a benzothienyl group and the like.

Moreover, the heterocyclic group may have a substituent. Examples of the substituent include the same groups as in the case of ^{R c5.}

In the above formula (C-1), R ^c4 represents a monovalent organic group. Among these, an alkyl group having 1 to 5 carbon atoms is preferable. Examples of such alkyl groups include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, n-pentyl group, isopentyl group, sec-. Examples thereof include a pentyl group and a tert-pentyl group. Of these, R ^c4 is most preferably a methyl group.

The content of the photopolymerization initiator is preferably 0.1 to 50% by mass, more preferably 1 to 45% by mass, based on the solid content of the photosensitive composition used in the present invention. Within the above range, sufficient heat resistance and chemical resistance can be obtained, and curing defects can be suppressed.

[resin]
The photosensitive composition used in the present invention contains a resin. The resin may be used alone or in combination of two or more.

The resin is not particularly limited, and for example, (meth) acrylic acid, fumaric acid, maleic acid, monomethyl fumarate, monoethyl fumarate, 2-hydroxyethyl (meth) acrylate, ethylene glycol monomethyl ether (meth) acrylate, ethylene. Glycol monoethyl ether (meth) acrylate, glycerol (meth) acrylate, (meth) acrylamide, acrylonitrile, methacrylonitrile, methyl (meth) acrylate, ethyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) Acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol diacrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, butylene glycol dimethacrylate, propylene glycol di (meth) acrylate , Trimethylol propanetri (meth) acrylate, tetramethylol propanetetra (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) ) A homopolymer obtained by independently polymerizing monomers such as acrylate, 1,6-hexanediol di (meth) acrylate, cardoepoxydiacrylate, ethylene, and styrene; obtained by copolymerizing two or more of the above monomers. Copolymers; Polyhydric alcohols and polyester prepolymers obtained by condensing monobasic acids or polybasic acids with (meth) acrylic acids; polyester (meth) acrylates obtained by reacting them with polyols and two Polyurethane (meth) acrylate obtained by reacting with a compound having an isocyanate group and then reacting with (meth) acrylic acid; bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol or cresol Epoxy such as novolak type epoxy resin, resole type epoxy resin, triphenol methane type epoxy resin, polycarboxylic acid polyglycidyl ester, polyol polyglycidyl ester, aliphatic or alicyclic epoxy resin, amine epoxy resin, dihydroxybenzene type epoxy resin, etc. Epoxy obtained by reacting a resin with (meth) acrylic acid. T) Examples include acrylate resin. Further, a resin obtained by reacting an epoxy (meth) acrylate resin with a polybasic acid anhydride can also be preferably used.

Further, as another resin, a resin obtained by further reacting a reaction product of an epoxy compound and an unsaturated group-containing carboxylic acid compound with a polybasic acid anhydride can also be preferably used. Among them, the resin represented by the following formula (A-7) is preferable because of its high curability.

In the above formula (A-7), X represents a group represented by the following formula (A-8).

In the above formula (A-8), ^Ra3 independently represents a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, or a halogen atom, and ^Ra4 independently represents a hydrogen atom or a methyl group. W represents a single bond or a group represented by the following formula (A-9).

Further, in the above formula (A-7), Y represents a residue obtained by removing the acid anhydride group (-CO-O-CO-) from the dicarboxylic acid anhydride. Examples of dicarboxylic acid anhydrides are maleic anhydride, succinic anhydride, itaconic anhydride, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorendic anhydride, methyltetrahydro. Examples thereof include phthalic anhydride and glutaric anhydride.

Further, in the above formula (A-7), Z represents a residue obtained by removing two acid anhydride groups from the tetracarboxylic dianhydride. Examples of the tetracarboxylic dianhydride include pyromellitic dianhydride, benzophenone tetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, biphenyl ether tetracarboxylic dianhydride and the like.
Further, in the above formula (A-7), m represents an integer of 0 to 20.

The acid value of the resin represented by the above formula (A-7) is preferably 10 to 150 mgKOH / g, more preferably 70 to 110 mgKOH / g in terms of resin solid content. Sufficient developability can be obtained by setting the acid value to 10 mgKOH / g or more. Further, by setting the acid value to 150 mgKOH / g or less, sufficient curability can be obtained and the surface property can be improved.

The mass average molecular weight of the resin represented by the above formula (A-7) is preferably 1000 to 40,000, more preferably 2000 to 30,000. By setting the mass average molecular weight to 1000 or more, heat resistance and film strength can be improved. Further, by setting the mass average molecular weight to 40,000 or less, sufficient solubility in a developing solution can be obtained. In the present specification, the mass average molecular weight refers to the standard polystyrene equivalent measured by gel permeation chromatography (GPC).

The resin represented by the above formula (A-7) may be used in combination with the above-mentioned homopolymer and / or copolymer. Examples of the homopolymer include (meth) acrylic acid and the like. Examples of the copolymer include a copolymer of styrene and (meth) acrylic acid.

The content of the resin is preferably 20 to 70% by mass, preferably 35 to 50% by mass, based on the solid content of the photosensitive composition used in the present invention, from the viewpoints of sensitivity, developability, chemical resistance, weather resistance and the like. More preferably, it is by mass%.

[Photopolymerizable monomer]
The photopolymerizable monomer is not particularly limited, and conventionally known monofunctional monomers and polyfunctional monomers can be used. The photopolymerizable monomer may be used alone or in combination of two or more.

Examples of the monofunctional monomer include (meth) acrylamide, methylol (meth) acrylamide, methoxymethyl (meth) acrylamide, ethoxymethyl (meth) acrylamide, propoxymethyl (meth) acrylamide, butoxymethoxymethyl (meth) acrylamide, and N-methylol. (Meta) acrylamide, N-hydroxymethyl (meth) acrylamide, (meth) acrylic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride, citraconic acid, citraconic anhydride, crotonic acid, 2-acrylamide -2-Methylpropanesulfonic acid, tert-butylacrylamide sulfonic acid, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-hydroxy Ethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-phenoxy-2-hydroxypropyl (meth) acrylate, 2- (meth) acryloyloxy-2-hydroxypropyl phthalate , Glycerin mono (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dimethylamino (meth) acrylate, glycidyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3 -Tetrafluoropropyl (meth) acrylate, half (meth) acrylate of phthalic acid derivative and the like can be mentioned. The monofunctional monomer can be used alone or in combination of two or more.

On the other hand, examples of the polyfunctional monomer include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, and butylene. Glycoldi (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, trimethylpropantri (meth) acrylate, glycerindi (meth) acrylate, pentaerythritol triacrylate, penta Elythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol penta (meth) acrylate Pentaerythritol hexa (meth) acrylate, 2,2-bis (4- (meth) acryloxidiethoxyphenyl) propane, 2,2-bis (4- (meth) acryloxipolyethoxyphenyl) propane, 2-hydroxy- 3- (Meta) acryloyloxypropyl (meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, diglycidyl phthalate di (meth) acrylate, glycerin triacrylate, glycerin Polyglycidyl ether poly (meth) acrylate, urethane (meth) acrylate (that is, tolylene diisocyanate), reaction product of trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, etc. and 2-vidroxyethyl (meth) acrylate, methylenebis (meth) acrylamide, Examples thereof include polyfunctional monomers such as (meth) acrylamide methylene ether, a condensate of polyhydric alcohol and N-methylol (meth) acrylamide, and triacrylic formal. The polyfunctional monomer can be used alone or in combination of two or more.

The content of the photopolymerizable monomer is preferably 10 to 50% by mass, more preferably 20 to 40% by mass, based on the resin. By setting it within the above range, the curability can be effectively improved.

[Light absorber]
The light absorber is not particularly limited, and examples thereof include carbon black and a combination of two or more pigments having different absorption wavelengths. By using carbon black, it is possible to absorb light with high efficiency. Further, by using a combination of two or more kinds of pigments having different absorption wavelengths, a wide range of wavelengths can be absorbed. The light absorber may be used alone or in combination of two or more.

As the carbon black, known carbon blacks such as channel black, furnace black, thermal black, and lamp black can be used, and channel black and furnace black are preferably used.

Examples of the pigment used for the combination of two or more kinds of pigments having different absorption wavelengths include compounds classified as Pigments in the Color Index (CI; The Society of Dyers and Colorists). Examples include those having the following color index (CI) numbers and black pigments described later. These pigments may be in any combination as long as they are two or more kinds having different absorption wavelengths.

C. I. Pigment Yellow 1 (hereinafter, "CI Pigment Yellow" is the same and only the number is described), 3, 11, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 55, 60, 61, 65, 71, 73, 74, 81, 83, 86, 93, 95, 97, 98, 99, 100, 101, 104, 106, 108, 109, 110, 113, 114, 116, 117, 119, 120, 125, 126, 127, 128, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 155, 156, 166, 167, 168, 175, 180, 185;
C. I. Pigment Orange 1 (hereinafter, "CI Pigment Orange" is the same and only the number is described), 5, 13, 14, 16, 17, 24, 34, 36, 38, 40, 43, 46, 49, 51, 55, 59, 61, 63, 64, 71, 73;
C. I. Pigment Violet 1 (hereinafter, "CI Pigment Violet" is the same and only the number is described), 19, 23, 29, 30, 32, 36, 37, 38, 39, 40, 50;
C. I. Pigment Red 1 (hereinafter, "CI Pigment Red" is the same and only the number is described), 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 14, 15, 16, 17, 18, 19, 21, 22, 23, 30, 31, 32, 37, 38, 40, 41, 42, 48: 1, 48: 2, 48: 3, 48: 4, 49: 1, 49: 2, 50: 1, 52: 1, 53: 1, 57, 57: 1, 57: 2, 58: 2, 58: 4, 60: 1, 63: 1, 63: 2, 64: 1, 81: 1, 83, 88, 90: 1, 97, 101, 102, 104, 105, 106, 108, 112, 113, 114, 122, 123, 144, 146, 149, 150, 151, 155, 166, 168, 170, 171, 172, 174, 175, 176, 177, 178, 179, 180, 185, 187, 188, 190, 192, 193, 194, 202, 206, 207, 208, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 242, 243, 245, 254, 255, 264, 265;
C. I. Pigment Blue 1 (hereinafter, "CI Pigment Blue" is the same and only the number is described), 2, 15, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 66;
C. I. Pigment Green 7, C.I. I. Pigment Green 36, C.I. I. Pigment Green 37;
C. I. Pigment Brown 23, C.I. I. Pigment Brown 25, C.I. I. Pigment Brown 26, C.I. I. Pigment Brown 28;
C. I. Pigment Black 1, Pigment Black 7.

Black pigments include carbon black, titanium black, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, silver, tin and other metal oxides, composite oxides, metal sulfides, metal sulfates, and metal alloys. Alternatively, various pigments such as metal carbonates, regardless of whether they are organic or inorganic, can be mentioned.

The content of the light absorber is 50% by mass or less with respect to the solid content of the photosensitive composition used in the present invention from the viewpoint of the surface roughness Sa of the obtained separation layer, the adhesiveness between the separation layer and the substrate, and the like. It is preferably 5 to 48% by mass, and even more preferably 20 to 45% by mass.

[Organic solvent]
The photosensitive composition used in the present invention preferably contains an organic solvent for dilution. Examples of this organic solvent include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol mono-n-propyl ether, ethylene glycol mono-n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol mono-n-propyl ether. , Diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono-n-butyl ether, di (Poly) alkylene glycols such as propylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, and tripropylene glycol monoethyl ether. Monoalkyl ethers; (poly) alkylene glycol monoalkyl such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, etc. Ether acetates; Other ethers such as diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran; ketones such as methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone; methyl 2-hydroxypropionate, 2-hydroxy Lactate alkyl esters such as ethyl propionate; ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethoxy Ethyl acetate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, ethyl acetate, n acetate -Propyl, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, methyl pyruvate, pyruvate Other esters such as ethyl acetate, n-propyl pyruvate, methyl acetoacetamide, ethyl acetoacetate, ethyl 2-oxobutanoate; aromatic hydrocarbons such as toluene and xylene; N-methylpyrrolidone, N, N-dimethyl Examples thereof include amides such as formamide and N, N-dimethylacetamide. The organic solvent can be used alone or in combination of two or more.

Among these, propylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, cyclohexanone, and 3-methoxybutyl acetate are resin and photopolymerizable. It is preferable because it exhibits excellent solubility in monomers and photopolymerization initiators and can improve the dispersibility of insoluble components such as black pigments.

The content of the component (S) is preferably such that the solid content concentration of the photosensitive composition used in the present invention is 5 to 30% by mass, and more preferably 15 to 25% by mass.

[Other ingredients]
The photosensitive composition used in the present invention may contain an additive if necessary. Additives include sensitizers, curing accelerators, cross-linking agents, dispersion aids, fillers, adhesion promoters, antioxidants, UV absorbers, anti-aggregation agents, thermal polymerization inhibitors, defoamers, surfactants. Examples include agents.

[Method for preparing photosensitive composition]
The photosensitive composition used in the present invention is obtained by mixing all the above components with a stirrer. In addition, you may filter using a membrane filter so that the obtained composition becomes uniform.

At the interface between the separation layer and the substrate, the surface roughness Sa of the separation layer is 100 Å or more, preferably 100 to 500 Å, and more preferably 200 to 400 Å. When the Sa is 100 Å or more, the adhesiveness between the separation layer and the substrate tends to be improved. The results are shown in Table 2. In this specification, the surface roughness Sa is measured in accordance with ISO25178.

The adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator. As a result, when the laminate is prepared, when light irradiation is performed to decompose the photopolymerization initiator, the adhesiveness of the separation layer to the support is ensured, and then, at a desired time point, the photopolymerization initiator is used. By irradiating light having a wavelength different from the wavelength of light that decomposes the above, the adhesiveness of the separation layer to the support is lowered, and a structure having the separation layer, for example, an electronic element is mounted on the substrate. The support can be separated from the laminate.

≪Manufacturing method of laminated body≫
The method for producing a laminate according to the present invention is to form a coating film made of a photosensitive composition containing a photopolymerization initiator on a light-transmitting support (hereinafter, also referred to as a "coating film forming step". )When,
After irradiating the coating film with light for decomposing the photopolymerization initiator, the coating film is cured by heating to form a separation layer having a surface roughness Sa of 100 Å or more (hereinafter, "separation layer"). Also called "forming process"),
It includes laminating a substrate on the separation layer (hereinafter, also referred to as a “board laminating step”). As the photosensitive composition in the method for producing a laminate, the above-mentioned photosensitive composition described above can be used for the separation layer.

In the coating film forming step, the coating film can be formed by, for example, a method of spin-coating the photosensitive composition containing an organic solvent onto a light-transmitting support. At that time, the organic solvent may be evaporated to dry the coating film as appropriate.

In the separation layer forming step, a separation layer having a surface roughness Sa of 100 Å or more can be formed by adjusting the sensitivity of the photopolymerization initiator, the heating temperature, the thickness of the coating film, and the like. From this point of view, the photopolymerization initiator is preferably an oxime-based photopolymerization initiator, and the exposure amount varies depending on the composition of the photosensitive composition ^{, and is preferably about 20} to 300 mJ / cm 2, more preferably about 50 to 50. It is about 250 mJ / cm ^2. From the same viewpoint, the heating temperature is preferably equal to or higher than the curing temperature of the photosensitive composition, specifically 190 ° C. or higher, and the thickness of the coating film is preferably 1.0 μm or higher (for example, 1.0). ~ 2.0 μm). The upper limit of the heating temperature is not particularly limited, and is, for example, 350 ° C. or lower, preferably 300 ° C. or lower, and more preferably 270 ° C. or lower.

Since the coating film contains a light absorber, when the light is irradiated as described above, the light reaches only the vicinity of the coating film surface, and the photocurable region is limited to the vicinity of the coating film surface. After that, when the coating film is heated, unevenness is generated in the photocured region near the surface of the coating film due to the influence of heat convection generated inside the uncured coating film, and as a result, the surface roughness Sa becomes 100 Å or more. Guessed. Since the above-mentioned heat convection is likely to occur, it is presumed that the thickness of the coating film is preferably 1.0 μm or more.

In the substrate laminating step, the substrate is laminated on the separation layer by bringing the substrate into contact with the separation layer and appropriately applying pressure. At this time, since the surface roughness Sa of the separation layer at the interface with the substrate is 100 Å or more, the adhesiveness between the separation layer and the substrate tends to be excellent.

≪Manufacturing method of electronic parts≫
The method for manufacturing an electronic component according to the present invention is to mount an electronic element on a substrate in the above-mentioned laminate.
The separation layer in the laminate on which the element is mounted is irradiated with light having a wavelength different from the wavelength of the light for decomposing the photopolymerization initiator to improve the adhesiveness of the separation layer to the support. To lower and
This includes separating the support from the laminate on which the element is mounted. In this method, electronic components can be manufactured more easily by using a laminate containing a substrate formed of a material suitable for electronic components.

That is, during the process of mounting the electronic element on the substrate, the substrate is firmly adhered to the light-transmitting support, so that the substrate can be easily processed and transported. On the other hand, after the process, the substrate and the light transmissive support can be easily separated. Therefore, electronic components can be easily manufactured without damaging the electronic elements mounted on the substrate. Examples of the electronic element include a transistor, a diode, an IC, an LSI, a semiconductor element such as a CPU, and other elements.

≪Method of improving the adhesiveness between the separation layer and the substrate in the laminated body≫
The method for improving the adhesiveness between the separation layer and the substrate in the laminate according to the present invention is the adhesion between the separation layer and the substrate in the laminate including the light transmitting support, the separation layer, and the substrate. It ’s a way to improve sex,
Including adjusting the surface roughness Sa of the separation layer at the interface between the separation layer and the substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate to each other.
The adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator.

As described above, the present invention has been made based on the finding that the surface roughness Sa of the separation layer and the adhesiveness between the separation layer and the substrate are related. Based on this knowledge, in this method, by adjusting the Sa, the adhesiveness between the separation layer and the substrate can be improved in the laminated body. The Sa can be adjusted, for example, by adjusting the sensitivity of the photopolymerization initiator, the heating temperature, the thickness of the coating film, and the like when forming the separation layer, as described above.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to these Examples. In the following description, "part" and "%" are based on mass.

<Synthesis example 1>
First, in a 500 ml four-necked flask, 235 g of bisphenol fluoride type epoxy resin (epoxy equivalent 235), 110 mg of tetramethylammonium chloride, 100 mg of 2,6-di-tert-butyl-4-methylphenol, and 72.0 g of acrylic acid. Was charged, and the mixture was heated and dissolved at 90 to 100 ° C. while blowing air at a rate of 25 ml / min. Next, the temperature of the solution was gradually raised while the solution was cloudy, and the solution was heated to 120 ° C. to completely dissolve the solution. At this time, the solution gradually became transparent and viscous, but stirring was continued as it was. During this period, the acid value was measured, and heating and stirring were continued until the acid value became less than 1.0 mgKOH / g. It took 12 hours for the acid value to reach the target value. Then, it was cooled to room temperature to obtain a colorless transparent solid bisphenol fluorene type epoxy acrylate represented by the following formula (A-10).

Next, 600 g of 3-methoxybutyl acetate was added to 307.0 g of the above-mentioned bisphenol fluorene type epoxy acrylate thus obtained to dissolve it, and then 80.5 g of benzophenone tetracarboxylic dianhydride and 1 g of tetraethylammonium bromide were added. The mixture was mixed, gradually heated, and reacted at 110 to 115 ° C. for 4 hours. After confirming the disappearance of the acid anhydride group, 38.0 g of 1,2,3,6-tetrahydrophthalic anhydride was mixed and reacted at 90 ° C. for 6 hours to obtain resin A1. The disappearance of the acid anhydride group was confirmed by the IR spectrum.
This resin A1 corresponds to the resin represented by the above formula (A-7).

・溶剤
３−メトキシブチルアセテート／シクロヘキサノン／プロピレングリコールモノメチルエーテルアセテート＝５０／２５／２５（質量比）の混合溶剤 <Examples 1 to 3 and Comparative Examples 1 to 5>
In the amount shown in Table 1, components other than the solvent shown below are dissolved in the solvent, mixed with a stirrer for 2 hours, filtered with a membrane filter having a pore size of 5 μm, and a photosensitive composition having a solid content concentration of 20% by mass. Was prepared.
・ Carbon black (manufactured by Mikuni Color Co., Ltd.)
-Resin mixture (mixture of resin A1 / resin A2 = 9/1 (mass ratio))
Resin A1 obtained in Synthesis Example 1
Copolymer of styrene / methacrylic acid = 80/20 (mass ratio) (resin A2, mass average molecular weight 13000)
・ Photopolymerizable monomer Dipentaerythritol hexaacrylate (manufactured by Nippon Kayaku Co., Ltd.)
-High-sensitivity photopolymerization initiator "OXE-02" (manufactured by BASF; ethanone-1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] -1- (O-acetyl) Oxime))
-Low-sensitivity photopolymerization initiator "Triazine PMS" (manufactured by Sibel Hegner Japan; 4-methoxystyryl-bis (trichloromethyl) -s-triazine; structural formula is as follows)

-Solvent 3-methoxybutyl acetate / cyclohexanone / propylene glycol monomethyl ether acetate = 50/25/25 (mass ratio) mixed solvent

<Evaluation>
[Evaluation of surface roughness Sa]
The photosensitive composition prepared in Examples or Comparative Examples was applied onto a glass substrate (made by Corning, EXG) using a spin coater (TR25000: manufactured by Tokyo Ohka Kogyo Co., Ltd.), and dried at 100 ° C. for 60 seconds. A coating film having a film thickness of 1.0 μm was formed. Next, this coating film was irradiated with ultraviolet rays (wavelength 365 nm, exposure amount: as shown in Table 1) using a mirror projection aligner (TME-150RTO: manufactured by Topcon). Then, post-baking was performed in a circulating oven at the post-baking temperature shown in Table 1 for 20 minutes to obtain a cured film.

The surface roughness Sa of the cured film formed on the glass substrate was measured by an optical interference microscope Talisurf CCI6000 in accordance with ISO25178.

[Evaluation of Cu thin film adhesion]
Using the photosensitive composition prepared in Examples or Comparative Examples, a cured film was formed on the glass substrate in the same manner as in the above [Evaluation of Surface Roughness Sa].
A Cu thin film having a thickness of 0.7 μm was formed on the cured film by sputtering, and a crosshatch test was performed to evaluate the adhesion between the cured film and the Cu thin film. Specifically, in accordance with ISO2409 (ASTM D-3359), a Cu thin film is cross-cut (11 cuts in each of the vertical and horizontal directions) at intervals of 2.0 mm, and an adhesive tape is strongly attached to the cross-cut portion. After that, the adhesive tape was rapidly peeled off, the presence or absence of peeling of the Cu thin film was examined, and evaluation was made on a 6-point scale from class 0B to class 5B. The results are shown in Table 2.

As can be seen from Tables 1 and 2, it was confirmed that when the surface roughness Sa of the separation layer was adjusted to 100 Å or more at the interface between the separation layer and the substrate, the adhesiveness between the separation layer and the substrate was excellent. It was confirmed that Sa can be adjusted by the sensitivity of the photopolymerization initiator, the amount of a light absorber such as carbon black, the exposure amount, and the post-bake temperature.

Claims (13)

A laminate including a light-transmitting support, a separation layer, and a substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate.
The photopolymerization initiator is an oxime-based photopolymerization initiator.
The separation layer and the substrate are in contact with each other.
At the interface between the separation layer and the substrate, the surface roughness Sa of the separation layer is 100 Å or more.
A laminate in which the adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of light that decomposes the photopolymerization initiator. A laminate including a light-transmitting support, a separation layer, and a substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate.
The photopolymerization initiator is an oxime-based photopolymerization initiator.
At the interface between the separation layer and the substrate, the surface roughness Sa of the separation layer is 100 Å or more.
A laminate in which the adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of light that decomposes the photopolymerization initiator. The laminate according to claim 1 or 2 , wherein the photosensitive composition further contains a resin, a photopolymerizable monomer, and a light absorber. Forming a coating film composed of a photosensitive composition containing a photopolymerization initiator on a light-transmitting support, and
After irradiating the coating film with light for decomposing the photopolymerization initiator, the coating film is cured by heating to form a separation layer having a surface roughness Sa of 100 Å or more.
A method for producing a laminated body, which comprises laminating a substrate on the separation layer. The method according to claim 4 , wherein the photopolymerization initiator is an oxime-based photopolymerization initiator. The method according to claim 4 or 5 , wherein the heating temperature is equal to or higher than the curing temperature of the photosensitive composition. The method according to any one of claims 4 to 6 , wherein the photosensitive composition further contains a resin, a photopolymerizable monomer, and a light absorber. The method according to claim 7 , wherein the content of the light absorber in the photosensitive composition is 50% by mass or less. The method according to claim 7 or 8 , wherein the light absorber is carbon black or a combination of two or more pigments having different absorption wavelengths. The method according to any one of claims 4 to 9 , wherein the thickness of the coating film is 1.0 μm or more. The electronic element is mounted on the substrate in the laminate according to any one of claims 1 to 3.
The separation layer in the laminate on which the element is mounted is irradiated with light having a wavelength different from the wavelength of the light for decomposing the photopolymerization initiator to improve the adhesiveness of the separation layer to the support. To lower and
A method for manufacturing an electronic component, which comprises separating the support from the laminate on which the element is mounted. A method for improving the adhesiveness between the separation layer and the substrate in a laminated body including a light-transmitting support, a separation layer, and a substrate.
Including adjusting the surface roughness Sa of the separation layer at the interface between the separation layer and the substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate.
The photopolymerization initiator is an oxime-based photopolymerization initiator.
The separation layer and the substrate are in contact with each other.
A method in which the adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator. A method for improving the adhesiveness between the separation layer and the substrate in a laminated body including a light-transmitting support, a separation layer, and a substrate.
Including adjusting the surface roughness Sa of the separation layer at the interface between the separation layer and the substrate.
The separation layer is made of a cured product of a photosensitive composition containing a photopolymerization initiator, is provided between the support and the substrate, and adheres the support and the substrate.
The photopolymerization initiator is an oxime-based photopolymerization initiator.
A method in which the adhesiveness of the separation layer to the support is reduced by irradiation with light having a wavelength different from the wavelength of the light that decomposes the photopolymerization initiator.