JP6848414B2 - Method of peeling the joint structure - Google Patents

Description

The present invention relates to a method for peeling a bonded structure in which two bonding materials are bonded.

For example, in various joint structures in which two or more articles are bonded together, the following method is known as a peeling method for peeling the two or more articles from each other.
(1) When the bonded structure is formed by forming a thin film transistor, an organic electroluminescence element, or the like on the upper surface of a resin thin film formed on a glass substrate as a support substrate, the glass substrate and the resin thin film in the support substrate are formed. A method of irradiating the interface with an excima laser to peel off the glass substrate and the resin thin film.
This peeling method is adopted, for example, when manufacturing a resin thin film on which an element is mounted.
(2) For the glass substrate and the resin film, the bonded surfaces obtained by depositing Si on the surfaces to be bonded by sputtering in a vacuum to form a Si layer are bonded to each other in a vacuum. Further, a method of peeling the resin film on which the element is formed from the glass substrate by a physical force when the element or the like is formed on the surface opposite to the joint surface of the resin film.
(3) A method in which a resin film is temporarily fixed on a substrate with a pressure-sensitive adhesive such as silicone, and the resin film is peeled off from the substrate by a physical force.
(4) The joint structure raises the temperature of the joint surfaces obtained by irradiating the surfaces of one resin material and the other resin material to be bonded with vacuum ultraviolet rays in contact with each other, and the joint surfaces are brought into contact with each other. A method of separating the two resin materials from each other by supplying at least one liquid of water and alcohol at 40 ° C. or higher to the bonding interface of the two resin materials (for example, patent). Reference 1).

Japanese Patent No. 5576040

However, in the above peeling method, the following problems occur.
Specifically, in the method of peeling using the excimer laser of the above (1), there is a problem that the resin residue of the resin thin film remains on the glass substrate after the peeling.
Further, in the method of peeling the bonded structure in which the bonded surfaces having the Si layer formed by the sputtering of the above (2) are bonded to each other, the peeling itself can be facilitated, but in the production of the bonded structure. Since it is necessary to perform the joining process in vacuum, there is a problem that the manufacturing process becomes complicated and it is not industrially advantageous.
Further, in the method of peeling off the bonded structure using the pressure-sensitive adhesive according to the above (3), there is a problem that it is difficult to adjust the pressure-sensitive adhesive. Specifically, if the pressure-sensitive adhesive is such that the joint structure can be easily peeled off, the adhesive force between the joint surfaces in the joint structure is low, so that a strong fixing force can be obtained. Is difficult. On the other hand, when the pressure-sensitive adhesive has a high adhesion between the joint surfaces in the joint structure, it is difficult to peel off.
Further, in the method (4) of supplying a liquid of 40 ° C. or higher to the bonding interface and peeling it off, an apparatus for adjusting the temperature of the liquid to 40 ° C. or higher is required, and the step of adjusting the temperature requires time. There is a problem that it requires.

The present invention has been made based on the above circumstances, and an object of the present invention is a joint structure capable of easily peeling a first joint material and a second joint material constituting the joint structure. To provide a method of peeling.

The method for peeling the joint structure of the present invention includes a step A of modifying the surfaces of the first joint material and the second joint material to obtain a joint surface, and a first step with respect to the joint surface of the first joint material. 2 A method for peeling a bonded structure obtained by bonding a first bonding material and a second bonding material, which is obtained in step B of bonding the bonding materials.
The first bonding material has an XX bond (X is Si, Al, Ti, which has a higher polarity than the CO bond) on the bonding surface to be bonded to the second bonding material after undergoing the modification treatment. It is made of a material that can obtain C (carbon atom) such as Cr, Fe, and Cu, which has a smaller electronegativity than C (carbon atom).
The second bonding material is made of a material in which a CO bond is present on the bonding surface to be bonded to the first bonding material after undergoing the modification treatment.
It has a step of peeling the first joint material and the second joint material by supplying a polar liquid made of water or alcohol to the interface between the first joint material and the second joint material in the joint structure. ,
The modification treatment in the step A is performed by irradiating the surfaces of the first bonding material and the second bonding material, which should be the bonding surfaces, with vacuum ultraviolet rays, or by bringing the plasmaized process gas into contact with each other. It is characterized by that.

In the method for peeling the bonded structure of the present invention, the temperature of the polar liquid is preferably room temperature.

According to the method for peeling a bonded structure of the present invention, by supplying a polar liquid to the interface between the first bonding material and the second bonding material, the polar molecules of the polar liquid contain highly polar XX bonds. It is selectively hydrogen-bonded to the bonding surface of the first bonding material. As a result, the high polar state of the joint surface of the first joint material of the joint structure is weakened by the polar liquid, so that the adhesive force between the first joint material and the second joint material is reduced. Therefore, by supplying the polar liquid to the interface between the first joint material and the second joint material of the joint structure, the first joint material and the second joint material can be easily peeled off.

It is explanatory drawing which conceptually shows the manufacturing and peeling apparatus of the bonded structure of this invention.

Hereinafter, embodiments of the present invention will be described.

[Peeling method of joint structure]
The method for peeling the joint structure of the present invention is a method of peeling the first joint material and the second joint material for a specific joint structure formed by joining the first joint material and the second joint material. is there.

[Specific joint structure]
Specifically, the specific joint structure is formed by the step A of modifying the surface of the first joint material to obtain a joint surface and the second joint material being bonded to the joint surface of the first joint material. It is obtained by step B.

[First bonding material]
The first bonding material used for a specific bonding structure has an X-O bond (X is) having a polarity higher than that of the CO bond on the bonding surface to be bonded to the second bonding material by undergoing a modification treatment. It is made of a material from which any atom can be obtained.
X existing on the bonding surface of the first bonding material is an atom having an electronegativity smaller than that of C (carbon atom), such as Si, Al, Ti, Cr, Fe, and Cu.
Examples of the material of the first bonding material include silicon, a silicon compound, and an aluminum compound. Specifically, polydimethylsiloxane (PDMS), silicon, non-alkali glass, alkali glass, borosilicate glass, quartz, and silicone resin. , Sapphire and the like can be used.
The first bonding material can be, for example, a film-like material or a plate-like material, and its thickness can be, for example, 0.02 to 3.0 mm.

[Second joint material]
The second bonding material used for a specific bonding structure is made of, for example, a hydrocarbon compound, and the bonding surface to be bonded to the first bonding material is C from the original or by undergoing a modification treatment. A −O bond (C represents a carbon atom and O represents an oxygen atom) is present.
Specifically, as the second bonding material, polyimide, polyethylene terephthalate, cycloolefin resin such as cycloolefin polymer (COP) or cycloolefin copolymer (COC), polyethylene terephthalate, acrylic resin and the like can be used.
The second bonding material can be, for example, a film-like material or a plate-like material, and its thickness can be, for example, 0.02 to 3.0 mm.

As a combination of the first joint material and the second joint material, an OX bond is present on the joint surface of the first joint material, while a CO bond is present on the joint surface of the second joint material. Any combination may be used as long as the affinity of the first joint material and the second joint material after the modification treatment with respect to the polar liquid on the joint surface has a magnitude relationship.

[Step A]
In step A, the surface of the first joining material, which is the joining surface to be joined to the second joining material, is subjected to a modification treatment. The modification treatment may be any treatment capable of forming an OX bond having a polarity larger than that of the CO bond on the joint surface of the first bonding material, and specifically, for example, irradiating with vacuum ultraviolet rays. A method or a method of bringing into contact with a process gas plasmaized by atmospheric pressure plasma can be used.

<Method of irradiating vacuum ultraviolet rays>
In the method of irradiating vacuum ultraviolet rays, examples of the ultraviolet light source include an excima lamp such as a xenon excimer lamp having a emission line at a wavelength of 172 nm, a low-pressure mercury lamp having an emission line at a wavelength of 185 nm, and a deuterium lamp having an emission line in the wavelength range of 120 to 200 nm. A hydrogen lamp or the like can be preferably used.
The illuminance of the vacuum ultraviolet rays applied to the surface of the first bonding material can be ^{, for example, 5 to 200 mW / cm 2.}
The irradiation time of the vacuum ultraviolet rays on the surface of the first bonding material is appropriately set according to the material constituting the first bonding material, but is preferably 1 second or longer, more preferably 1 to 60 seconds, for example. Seconds.

<Method of bringing plasmaized process gas into contact>
In the method of bringing the plasma-generated process gas into contact, it is preferable to use a process gas containing nitrogen gas, argon gas or the like as a main component and containing 0.01 to 5% by volume of oxygen gas. Alternatively, a mixed gas of nitrogen gas and clean dry air (CDA) can be used.
The processing time for contacting the process gas is, for example, 1 to 60 seconds.

It is preferable that the surface of the second bonding material, which is the bonding surface to be bonded to the first bonding material, is also modified in the same manner as the first bonding material.

[Step B]
In step B, the first joint material and the second joint material are stacked so that the respective joint surfaces are in contact with each other to obtain a stacked body, and the stacked body is heated and / or pressurized as necessary. As a result, the second bonding material is bonded to the bonding surface of the first bonding material, whereby a specific bonding structure is obtained.

<Heating conditions>
When heating the stack, the heating temperature is, for example, 40 to 150 ° C., and the heating time is, for example, 1 to 300 seconds.

<Pressurization conditions>
The pressurization of the stacked body may be performed, for example, under constant pressurizing conditions, or may be performed in a plurality of stages, for example, two stages by appropriately adjusting the processing conditions.
The pressurizing conditions can be appropriately set according to the material constituting the substrate and the heating temperature.
Specific pressurization conditions are, for example, 0.1 to 5 MPa, and the pressurization time is, for example, 1 to 300 seconds. Further, when the pressurizing treatment on the substrate is performed in two stages, for example, the pressing force in the second pressurizing treatment should be set smaller than the pressing force in the first pressurizing treatment within the above numerical range. Can be done. Further, the pressurizing time in the second pressurizing treatment can be set longer than the pressurizing time in the first pressurizing treatment within the above numerical range. Further, after the first pressurization, the heat treatment can be performed without pressurizing.

[Polar liquid supply process]
In the present invention, a step of supplying a polar liquid for peeling the first joint material and the second joint material in a specific joint structure will be specifically described.
The peeling of the first bonding material and the second bonding material in a specific bonding structure supplies a polar liquid composed of water or alcohol to the interface (bonding interface) between the first bonding material and the second bonding material. By doing so.
The polar liquid can be supplied to the bonding interface between the first bonding material and the second bonding material, for example, by immersing in a water tank filled with the polar liquid. It can also be performed, for example, by injecting only a part of the bonding interface with a syringe or the like. In this case, the polar liquid can be supplied to the entire bonding interface by capillary force or the like. It can also be done, for example, by exposing a particular bonded structure to an atmosphere in which the vapor of polar liquid is present.

In this polar liquid supply step, peeling proceeds by the following reaction mechanism.
That is, first, in a specific joint structure, an OX bond is present on the joint surface of the first joint material, while a CO bond is present on the joint surface of the second joint material. As a result, the polarity of the joint surface of the second joint material is set to be relatively smaller than the polarity of the joint surface of the first joint material. Then, at the joining interface of the specific joining structure in which the joining surface of the first joining material containing the XX bond and the joining surface of the second joining material containing the CO bond are in contact with each other in this way, respectively. A hydrogen bond is formed by an attractive interaction between the polar components existing on the bonding surface of the above. Depending on the material of the first bonding material and the second bonding material, a chemical reaction such as a dehydration condensation reaction may occur between these polar components to form a covalent bond.
When highly polar molecules (polar molecules) infiltrate the bonding interface of such a specific bonding structure, the polar molecules have an affinity for the bonding surface of the first bonding material due to the presence of highly polar OX bonds. Since the value is high and the polarity of the joint surface of the second bonding material is small, that is, the affinity with the polar liquid is low, polar molecules are hydrogen-bonded to the bonding surface of the first bonding material to be energetically stable. The hydrogen bond formed by the polar molecule causes cleavage of the hydrogen bond formed between the first bonding material and the second bonding material, hydrolysis of the covalent bond, and the like.
That is, since the high polar state on the joint surface of the first joint material of a specific joint structure is weakened by the polar liquid, the adhesive force between the first joint material and the second joint material is reduced, and as a result, the first joint is formed. The material and the second bonding material can be easily peeled off.

For example, as compared with the invention described in Patent Document 1, in the invention described in Patent Document 1, the two substrates to be bonded are made of the same material each made of a cycloolefin polymer (COP). It is described that each of the bonding surfaces to be bonded to the substrate is irradiated with vacuum ultraviolet light to be modified and then bonded.
However, the substrate made of a hydrocarbon compound such as COP has a small polarity of the joint surface after the modification treatment, that is, has a low affinity for water. Therefore, in the peeling method in the invention described in Patent Document 1, as shown in Table 3, at the bonding interface of the bonded structure in which one substrate made of COP and the other substrate made of COP are joined together. It is described that the peeling could not be performed when water at room temperature (18 ° C.) was supplied. Therefore, in the invention described in Patent Document 1, it is necessary to supply hot water at 40 ° C. or higher to the bonding interface of the bonded structure in which one substrate made of COP and the other substrate made of COP are bonded together. It becomes.
On the other hand, in the method for peeling the joint structure of the present invention, the polar liquid is used for peeling by utilizing the magnitude of the polarity between the joint surface of the first joint material and the joint surface of the second joint material. The first bonding material and the second bonding material can be easily peeled off regardless of the temperature.

[Polar liquid]
The polar liquid is composed of water or alcohol, and as the alcohol, ethanol, 2-propanol and the like can be specifically used.
The temperature of the polar liquid can be room temperature. The temperature of the polar liquid may be a temperature that does not cause deterioration of the material constituting the specific bonded structure, even if it is not at room temperature.

According to the method for peeling the bonded structure as described above, by supplying the polar liquid to the bonding interface between the first bonding material and the second bonding material, the polar molecules of the polar liquid form a highly polar XX bond. It is selectively hydrogen-bonded to the bonding surface of the first bonding material containing. As a result, the high polar state of the joint surface of the first joint material of the specific joint structure is weakened by the polar liquid, so that the adhesive force between the first joint material and the second joint material is reduced. Therefore, by supplying the polar liquid to the interface between the first joint material and the second joint material of the specific joint structure, the first joint material and the second joint material can be easily peeled off.

[Manufacturing and peeling equipment for joint structures]
The joining structure manufacturing and peeling device of the present invention is a device that manufactures a joining structure and further performs the above-mentioned peeling method of the joining structure, and modifies the surface of the first joining material to form a joining surface. A specific joining obtained by joining the first joining material and the second joining material, which was obtained by the step A of obtaining the first joining material and the step B of bonding the second joining material to the joining surface of the first joining material. It is provided with a joining mechanism for manufacturing a structure and a polar liquid supply mechanism for supplying a polar liquid made of water or alcohol to the joining interface between the first joining material and the second joining material in a specific joining structure. ..
Specifically, as shown in FIG. 1, a reforming treatment unit 10 that performs step A for modifying at least the surface of the first bonding material 11 to obtain a bonding surface 12, and the first bonding material 11 A joining mechanism including a joining portion 20 for obtaining a specific joining structure 17 by performing step B of bonding the second joining material 15 to the joining surface 12 of the above, and a device 18 on one surface of the specific joining structure 17. The polar liquid supply mechanism including the element forming portion 30 forming the element forming portion 30 and the peeling portion 40 for supplying the polar liquid M to the specific joining structure 17, the first joining material 11 and the second joining material 15 which are workpieces, or these. It is provided with a work transfer unit 50 that conveys the specific joined structure 17 that has been joined.

The reforming treatment unit 10 has a surface that becomes a bonding surface 12 (or a bonding surface 16 of the second bonding material 15) of the first bonding material 11 when the modification process is performed by, for example, a method of irradiating vacuum ultraviolet rays. An ultraviolet light source 19 that radiates vacuum ultraviolet L is provided in a state of facing each other. Examples of the ultraviolet light source 19 include those as described above.
The reforming treatment unit 10 may be configured such that the reforming treatment is performed by a method of bringing the process gas plasmaized by the atmospheric pressure plasma into contact with each other.

The joint portion 20 is stacked so that the joint surface 12 of the first joint material 11 and the joint surface 16 of the second joint material 15 are in contact with each other, or the stacked stacked bodies are heated and heated as necessary. / Or it is configured to pressurize.
Specifically, the pressurizing means 21 for pressurizing the stacked body mounted on the mounting table 22 provided with the heating means is provided.

The element forming portion 30 places a device 18 such as a transistor or an organic electroluminescence element on the surface of a specific bonding structure 17 (on the surface 15A opposite to the bonding surface 16 of the second bonding material 15 in FIG. 1). It is what forms.
In the element forming portion 30, if necessary, a functional layer such as a protective layer or a gas barrier layer may be formed on the surface of the specific joining structure 17.

The peeling portion 40 is a polar liquid supply mechanism that supplies the polar liquid M to the specific joint structure 17, and specifically, the polar liquid supply mechanism is, specifically, for example, the supply of the polar liquid M is filled with the polar liquid M. In the case of immersing in the water tank 41, the water tank 41 filled with the polar liquid M and a means (not shown) for immersing the specific bonded structure 17 in the water tank 41 may be used. it can.
When the polar liquid M is supplied by injecting the polar liquid M into the bonding interface 17S of the specific bonding structure 17 with a syringe or the like, the end of the bonding interface 17S of the specific bonding structure 17 or the first bonding is performed. A syringe is provided so as to inject the polar liquid M into the through hole formed in the material 11 or the second bonding material 15. Alternatively, it may have a configuration in which the end portion of the joining interface 17S of the specific joining structure 17 is immersed in the above-mentioned water tank 41.
Further, when the supply of the polar liquid M is performed by exposing the specific bonding structure 17 to the atmosphere in which the vapor of the polar liquid M is present, the processing space in which the vapor of the polar liquid M is present and the specific bonding structure It can consist of a means of exposing the body 17 to the processing space.

The peeling portion 40 is provided with means for supplying the polar liquid M to the joining interface 17S and then peeling it between the first joining material 11 and the second joining material 15 by a physical force, if necessary. You may.

The work transfer section 50 connects the reforming section 10, the joining section 20, the element forming section 30, and the peeling section 40 in this order to the work (first joining material 11, second joining material 15, or a specific joining to which these are joined. It has a function of transporting the structure 17) and delivering the work to each part.
Specifically, a horizontal transport means 51 that moves in the horizontal direction (indicated by an arrow X in FIG. 1) and a vertical transport means 52 that moves in a vertical direction (indicated by an arrow Y in FIG. 1) perpendicular to the horizontal direction. Consists of.

According to the above-mentioned manufacturing and peeling apparatus for the joint structure, the specific joint structure can be peeled only by a simple step of supplying the polar liquid M to the joint interface of the specific joint structure.

Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

Hereinafter, specific examples of the method for peeling the bonded structure of the present invention will be described, but the present invention is not limited to the following examples.

[Example 1 of Fabrication of Bonded Structure]
The following first joint material and second joint material were prepared.
The first bonding material is a rectangular film having a length and width of 15 mm × 50 mm and a thickness of 200 μm made of polydimethylsiloxane (PDMS). However, a polyimide resin film having a thickness of 50 μm was previously attached to the surface opposite to the surface to be the joint surface in order to reinforce the strength.
The second bonding material is a rectangular film having a length and width of 15 mm × 50 mm and a thickness of 50 μm made of a polyimide resin (PI).

[Step A: Modification process]
A vacuum with a peak wavelength of 172 nm in the atmosphere using a xenon excimer lamp "Min-excimer" (manufactured by Ushio Denki Co., Ltd.) for each of the surfaces to be the joint surfaces of the first joint material and the second joint material. The ultraviolet rays were irradiated under the conditions that the illuminance was 7 mW / cm ² and the irradiation time was 30 seconds (for the first bonding material) or 10 seconds (for the second bonding material).

[Step B: Lamination]
The first joint material and the second joint material after the reforming treatment are stacked so that their joint surfaces are in contact with each other to obtain a stacked body, and then this stacked body is heated in a heating furnace having a furnace temperature of 150 ° C. The first bonding material and the second bonding material were bonded by heat treatment in the room for 5 minutes, and cooled to room temperature to prepare a bonded structure [1].

[Production Example 2 of Bonded Structure]
The following first joint material and second joint material were prepared.
The first bonding material is a sapphire plate having a length and width of 15 mm × 50 mm and a thickness of 300 μm.
The second bonding material is a rectangular film having a length and width of 15 mm × 50 mm and a thickness of 50 μm made of a cycloolefin polymer (COP).

[Step A: Modification process]
In step A of Production Example 1 of the bonded structure, the modification treatment was carried out in the same manner except that the irradiation time of the second bonding material with vacuum ultraviolet rays was changed to 600 seconds.

[Step B: Lamination]
Preparation of Joined Structure In step B of Example 1, the joined structure [2] was prepared in the same manner except that the temperature inside the furnace was changed to 100 ° C.

[Production Example 3 of Bonded Structure]
The following first joint material and second joint material were prepared.
The first bonding material is a non-alkali glass plate having a length and width of 15 mm × 50 mm and a thickness of 700 μm.
The second bonding material is a rectangular film having a length and width of 15 mm × 50 mm and a thickness of 50 μm made of a cycloolefin polymer (COP).

[Step A: Modification process]
In step A of Production Example 1 of the bonded structure, the modification treatment was carried out in the same manner except that the irradiation time of the second bonding material with vacuum ultraviolet rays was changed to 600 seconds.

[Step B: Lamination]
Preparation of Joined Structure In step B of Example 1, the joined structure [3] was prepared in the same manner except that the temperature inside the furnace was changed to 100 ° C.

<Example 1A>
The above-mentioned bonded structure [1] was subjected to a step of supplying a polar liquid by immersing it in water (polar liquid) at 20 ° C. for 60 seconds.
Then, as a peeling test, a 90 ° peeling test was performed under the condition of a tensile speed of 50 mm / min. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Example 1B>
The above-mentioned bonded structure [1] was subjected to a step of supplying a polar liquid by immersing it in water (polar liquid) at 40 ° C. for 60 seconds.
Then, as a peeling test, a 90 ° peeling test was performed under the condition of a tensile speed of 50 mm / min. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Example 1C>
The above-mentioned bonded structure [1] was subjected to a step of supplying a polar liquid by immersing it in ethanol (polar liquid) at 20 ° C. for 60 seconds.
Then, as a peeling test, a 90 ° peeling test was performed under the condition of a tensile speed of 50 mm / min. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Example 2A>
The above-mentioned bonded structure [2] was subjected to a step of supplying a polar liquid by immersing it in water (polar liquid) at 20 ° C. for 60 seconds.
Then, as a peeling test, a 90 ° peeling test was performed under the condition of a tensile speed of 50 mm / min. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Example 3A>
The above-mentioned bonded structure [3] was subjected to a step of supplying a polar liquid by immersing it in water (polar liquid) at 20 ° C. for 60 seconds.
Then, as a peeling test, a 90 ° peeling test was performed under the condition of a tensile speed of 50 mm / min. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Comparative example 1>
The above-mentioned bonded structure [1] was subjected to a 90 ° peeling test under the condition of a tensile speed of 50 mm / min as a peeling test without performing the polar liquid supply step. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Comparative example 2>
The above-mentioned bonded structure [2] was subjected to a 90 ° peeling test under the condition of a tensile speed of 50 mm / min as a peeling test without performing the polar liquid supply step. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

<Comparative example 3>
The above-mentioned bonded structure [3] was subjected to a 90 ° peeling test under the condition of a tensile speed of 50 mm / min as a peeling test without performing the polar liquid supply step. The peeling properties were evaluated using the maximum load at the time of this peeling test as the peeling load. The results are shown in Table 1.

From the above results, it was confirmed that the first joint material and the second joint material can be peeled off with no load or with a small peeling load by going through the polar liquid supply step.

10 Modification processing part 11 1st joint material 12 Joint surface 15 2nd joint material 15A Opposite surface 16 Joint surface 17 Specific joint structure 17S Joint interface 18 Device 19 Ultraviolet light source 20 Joint 21 Pressurizing means 22 Mounting table 30 Element forming part 40 Peeling part 41 Water tank 50 Work transport part 51 Horizontal transport means 52 Vertical transport means L Vacuum ultraviolet M Polar liquid

Claims (2)

Obtained by the step A of modifying the surfaces of the first joint material and the second joint material to obtain a joint surface, and the step B of laminating the second joint material to the joint surface of the first joint material. This is a method for peeling a joint structure in which a first joint material and a second joint material are joined.
The first bonding material has an XX bond (X is Si, Al, Ti, which has a higher polarity than the CO bond) on the bonding surface to be bonded to the second bonding material after undergoing the modification treatment. It is made of a material that can obtain C (carbon atom) such as Cr, Fe, and Cu, which has a smaller electronegativity than C (carbon atom).
The second bonding material is made of a material in which a CO bond is present on the bonding surface to be bonded to the first bonding material after undergoing the modification treatment.
It has a step of peeling the first joint material and the second joint material by supplying a polar liquid made of water or alcohol to the interface between the first joint material and the second joint material in the joint structure. ,
The modification treatment in the step A is performed by irradiating the surfaces of the first bonding material and the second bonding material, which should be the bonding surfaces, with vacuum ultraviolet rays, or by bringing the plasmaized process gas into contact with each other. A method for peeling a bonded structure. The method for peeling a bonded structure according to claim 1, wherein the temperature of the polar liquid is room temperature.

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