JP6860086B2 - ループヒートパイプ及び電子機器 - Google Patents
ループヒートパイプ及び電子機器 Download PDFInfo
- Publication number
- JP6860086B2 JP6860086B2 JP2019556464A JP2019556464A JP6860086B2 JP 6860086 B2 JP6860086 B2 JP 6860086B2 JP 2019556464 A JP2019556464 A JP 2019556464A JP 2019556464 A JP2019556464 A JP 2019556464A JP 6860086 B2 JP6860086 B2 JP 6860086B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporator
- working fluid
- pipe
- metal layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図5は、本実施形態に係る電子機器の分解斜視図である。
本実施形態では、第1実施形態で説明した溝47の形状のバリエーションについて説明する。
Claims (6)
- 相対する第1の内側表面と第2の内側表面とを内部に備え、かつ、液相の作動流体を蒸発させる蒸発器と、
前記蒸発器の内部に設けられ、平面視で複数の歯を備えた櫛歯状の多孔質体と、
前記第1の内側表面と前記第2の内側表面のうちの少なくとも一方に設けられ、平面視で前記歯のそれぞれに重なる複数の溝と、
前記作動流体を液化する凝縮器と、
前記蒸発器と前記凝縮器とを接続すると共に、液相の前記作動流体が流れる液管と、
前記蒸発器と前記凝縮器とを接続すると共に、前記作動流体の蒸気が流れ、かつ前記液管と共にループ状の管路を形成する蒸気管と、
を有するループヒートパイプ。 - 前記溝は、前記歯の先端まで延びることを特徴とする請求項1に記載のループヒートパイプ。
- 前記溝の幅は、前記歯の先端に向かって広くなることを特徴とする請求項1又は請求項2に記載のループヒートパイプ。
- 前記蒸発器、前記多孔質体、前記液管、及び前記蒸気管の各々は、第1の表面金属層、中間金属層、及び第2の表面金属層を順に積層してなり、
前記多孔質体に対応する部分の前記中間金属層に複数の孔が形成されたことを特徴とする請求項1乃至請求項3のいずれかに記載のループヒートパイプ。 - 前記孔の直径は、前記溝の幅よりも小さいことを特徴とする請求項4に記載のループヒートパイプ。
- 発熱部品と、
前記発熱部品を冷却するループヒートパイプとを備え、
前記ループヒートパイプが、
相対する第1の内側表面と第2の内側表面とを内部に備え、かつ、液相の作動流体を蒸発させる蒸発器と、
前記蒸発器の内部に設けられ、平面視で複数の歯を備えた櫛歯状の多孔質体と、
前記第1の内側表面と前記第2の内側表面のうちの少なくとも一方に設けられ、平面視で前記歯のそれぞれに重なる複数の溝と、
前記作動流体を液化する凝縮器と、
前記蒸発器と前記凝縮器とを接続すると共に、液相の前記作動流体が流れる液管と、
前記蒸発器と前記凝縮器とを接続すると共に、前記作動流体の蒸気が流れ、かつ前記液管と共にループ状の管路を形成する蒸気管とを有することを特徴とする電子機器。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2017/042853 WO2019106762A1 (ja) | 2017-11-29 | 2017-11-29 | ループヒートパイプ及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2019106762A1 JPWO2019106762A1 (ja) | 2020-11-19 |
| JP6860086B2 true JP6860086B2 (ja) | 2021-04-14 |
Family
ID=66665493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019556464A Expired - Fee Related JP6860086B2 (ja) | 2017-11-29 | 2017-11-29 | ループヒートパイプ及び電子機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11044830B2 (ja) |
| JP (1) | JP6860086B2 (ja) |
| WO (1) | WO2019106762A1 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7015197B2 (ja) * | 2018-03-26 | 2022-02-02 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7204374B2 (ja) * | 2018-08-13 | 2023-01-16 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| EP3751973B1 (en) * | 2019-04-28 | 2021-12-15 | SZ DJI Technology Co., Ltd. | Heat dissipation assembly and motion camera |
| CN114305270B (zh) * | 2020-09-30 | 2023-10-27 | 广东美的厨房电器制造有限公司 | 蒸汽发生装置和具有其的蒸汽拖把 |
| CN113008059B (zh) * | 2021-03-15 | 2022-06-10 | 青岛青科新钰材料科技有限公司 | 可用于电子产品的网络式铝基板多热沉板式散热器 |
| JP2022142665A (ja) * | 2021-03-16 | 2022-09-30 | 富士通株式会社 | 冷却装置 |
| CN115151119A (zh) * | 2021-03-29 | 2022-10-04 | 北京小米移动软件有限公司 | 电子设备 |
| EP4123702A1 (en) * | 2021-07-20 | 2023-01-25 | Nokia Technologies Oy | Apparatus for cooling electronic circuitry components and photonic components |
| US12526958B2 (en) | 2023-08-02 | 2026-01-13 | Qualcomm Incorporated | Hybrid device cooling system |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3552395B2 (ja) | 1996-03-27 | 2004-08-11 | 三菱電機株式会社 | ループヒートパイプ |
| DE19710783C2 (de) * | 1997-03-17 | 2003-08-21 | Curamik Electronics Gmbh | Kühler zur Verwendung als Wärmesenke für elektrische Bauelemente oder Schaltkreise |
| US6386278B1 (en) * | 1998-08-04 | 2002-05-14 | Jurgen Schulz-Harder | Cooler |
| JP3591339B2 (ja) | 1998-11-16 | 2004-11-17 | 三菱電機株式会社 | ループ型ヒートパイプ |
| JP5447070B2 (ja) * | 2010-03-25 | 2014-03-19 | 富士通株式会社 | ループ型ヒートパイプおよび電子機器 |
| JP5589666B2 (ja) * | 2010-08-18 | 2014-09-17 | 富士通株式会社 | 半導体装置 |
| JP5741354B2 (ja) | 2011-09-29 | 2015-07-01 | 富士通株式会社 | ループ型ヒートパイプ及び電子機器 |
| JP6190349B2 (ja) * | 2013-12-05 | 2017-08-30 | 株式会社神戸製鋼所 | 熱交換器 |
| JP6146484B2 (ja) * | 2013-12-13 | 2017-06-14 | 富士通株式会社 | ループ型ヒートパイプとその製造方法、及び電子機器 |
| JP6413306B2 (ja) * | 2014-04-09 | 2018-10-31 | 富士通株式会社 | ヒートパイプ内蔵フレーム板及び電子機器 |
| JP6485075B2 (ja) * | 2015-01-29 | 2019-03-20 | 富士通株式会社 | ループヒートパイプ及びループヒートパイプの製造方法 |
| JP6451860B2 (ja) | 2015-09-03 | 2019-01-16 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
| JP2017110869A (ja) * | 2015-12-17 | 2017-06-22 | 富士通株式会社 | ループヒートパイプ構造、製造方法及び電子機器 |
| WO2017203574A1 (ja) * | 2016-05-23 | 2017-11-30 | 富士通株式会社 | ループヒートパイプ及びその製造方法並びに電子機器 |
| JP6291000B2 (ja) * | 2016-09-01 | 2018-03-07 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP6886904B2 (ja) * | 2017-09-20 | 2021-06-16 | 新光電気工業株式会社 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法、電子機器 |
| US10976111B2 (en) * | 2017-10-27 | 2021-04-13 | Shinko Electric Industries Co., Ltd. | Loop type heat pipe |
| JP6889093B2 (ja) * | 2017-11-29 | 2021-06-18 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
| JP7028659B2 (ja) * | 2018-01-30 | 2022-03-02 | 新光電気工業株式会社 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法 |
| JP6943786B2 (ja) * | 2018-02-05 | 2021-10-06 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP6400240B1 (ja) * | 2018-02-05 | 2018-10-03 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| TWI660149B (zh) * | 2018-04-16 | 2019-05-21 | 泰碩電子股份有限公司 | 具有液彈管的迴路熱管 |
| TWI660151B (zh) * | 2018-04-26 | 2019-05-21 | 泰碩電子股份有限公司 | 在冷凝段有部分填滿毛細材的迴路熱管 |
| JP7027253B2 (ja) * | 2018-05-30 | 2022-03-01 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
| JP7305512B2 (ja) * | 2019-10-17 | 2023-07-10 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
-
2017
- 2017-11-29 JP JP2019556464A patent/JP6860086B2/ja not_active Expired - Fee Related
- 2017-11-29 WO PCT/JP2017/042853 patent/WO2019106762A1/ja not_active Ceased
-
2020
- 2020-05-19 US US16/877,547 patent/US11044830B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20200281096A1 (en) | 2020-09-03 |
| JPWO2019106762A1 (ja) | 2020-11-19 |
| US11044830B2 (en) | 2021-06-22 |
| WO2019106762A1 (ja) | 2019-06-06 |
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