JP6864354B2 - Time difference cutting method for glass substrate - Google Patents

Description

The present invention relates to a method for dividing a glass substrate having brittleness, and more specifically, the adsorption force applied to the glass substrate settled on the adsorption stage is partially different to realize efficient division. It relates to the time difference cutting method of the glass substrate which can be done.

As a method for precisely cutting a brittle glass substrate to a required size, a laser beam is irradiated along the planned division line displayed on the glass substrate, or a cut wheel is pressurized and scribed on the glass substrate. A method of applying a bending force to the scribe line after forming the glass is generally used.

In addition, the dividing process that applies bending force to the glass substrate uses a contact method that applies physical force to the substrate using a roller or pusher, and a laser or steam. Then, there is a non-contact method in which the substrate is heated and then cooled.

In Korean Patent Publication No. 10-2014-0018504 (hereinafter referred to as Patent Document 1), a rolling portion is provided at the bottom of the substrate to be transferred while being mounted on the flexible attachment pad, and the substrate is a rolling portion. Disclosed is a technique that induces the scribe line to widen and divide while being bent downwards.

For reference, during the bending process of the substrate, tensile stress is generated on the surface of the substrate, that is, the upper surface on which the scribe line is formed, whereas compressive stress is generated on the lower surface.

The tensile stress generated on the surface of the substrate causes cracks to proceed in the thickness direction of the substrate, while the compressive stress acts to prevent the cracks from progressing. As the compressive stress increases, crack propagation is poor, so a stronger bending force must be applied or the bending angle must be increased.

The problem is that as the bending angle increases, the amount of stress applied to the substrate increases. For example, when the amount of stress applied to the substrate is large, not only a large amount of chipping occurs at the time of division, but also irregular protrusions are formed on the cross section of the substrate after division, and the cross section of the substrate itself is also formed diagonally. To.

This means that if the compressive stress applied to the substrate is small, the bending angle can be reduced proportionally. That is, when the substrate is divided by a smaller force, the amount of stress applied to the substrate is reduced, chipping does not occur, and a uniform cross section of the substrate can be obtained.

By the way, most of the conventional substrate break-related techniques including the apparatus of the publication publication only disclose the configuration of the dividing apparatus itself, and do not disclose the contents for reducing the bending angle of the substrate.

Korean Patent Publication No. 2014-0018504

The present invention was created to solve the above-mentioned problems of the prior art, and the suction force applied to the glass substrate settled on the suction stage is partially different, and the suction force is smaller and more efficient. It is an object of the present invention to provide a time difference cutting method of a glass substrate capable of realizing the cutting.

Further, the present invention provides a time difference cutting method for a glass substrate, which minimizes the stress applied to the substrate during the bending process, causes almost no damage to the substrate, and causes no chipping, so that a good cross section can be obtained. There is a purpose to do.

Further, the present invention can reduce the depth of the scribe line by allowing the division to be performed with a smaller bending force, which not only reduces the energy consumption required for processing the scribe line, but also reduces the scribe line. It is an object of the present invention to provide a time difference cutting method for a glass substrate that does not cause chipping due to formation.

The time difference cutting method of the glass substrate of the present invention for achieving the above object is a glass substrate charging step in which the glass substrate to be divided is charged into the scribing device, and the glass substrate set in the scribing device. The scribing step of forming a scribing line on the surface, starting from the edge line on one side of the glass substrate and reaching the edge line on the other side, and the glass having completed the scribing step. A fixed position stage in which the substrate is transferred to and aligned with a suction table provided with a large number of suction ports, and a suction port for outputting the vacuum pressure among the large number of suction ports are determined after the completion of the fixed position step. A partial suction step in which a suction region determination step, a partial suction step in which a vacuum pressure is applied to a suction port selected through the suction region determination step to partially suck and fix the glass substrate on the upper surface of the suction table, and a suction on the suction table. It is characterized by including a bending step in which the scribing line of the glass substrate in the state of being bent is bent to divide the glass substrate.

Further, the adsorption region includes a first adsorption region including two or more adsorption ports and a second adsorption region including a number of adsorption ports smaller than the number of adsorption ports in the first adsorption region. In the suction region determination step, a suction port for outputting vacuum pressure is selected, the first suction region is located close to the edge line on one side of the glass substrate, and the second suction region is the glass. It is characterized in that it is a process of determining to be located close to the edge line on the other side of the substrate.

Further, the first adsorption region and the second adsorption region are characterized in that they are symmetrical with respect to the scribe line.

At the same time, a non-adsorption region in which the output of the vacuum pressure is blocked and no adsorption force is applied to the glass substrate is located between the first adsorption region and the second adsorption region.

The time difference cutting method of the glass substrate of the present invention performed as described above partially differs the suction force applied to the glass substrate settled on the suction stage, and realizes efficient cutting with a smaller force. To be able to.

Further, the present invention minimizes the stress applied to the substrate during the bending process so that the substrate is hardly damaged and chipping does not occur, so that a good cross section can be obtained.

Further, the present invention can reduce the depth of the scribe line by allowing the division to be performed with a smaller bending force, which not only reduces the energy consumption required for processing the scribe line, but also reduces the scribe line. Prevent the occurrence of chipping due to the formation.

FIG. 1 is a sequence diagram showing the time difference cutting method of the glass substrate according to the embodiment of the present invention in an organized manner. FIG. 2 is a diagram for explaining the principle of the time difference cutting method of the glass substrate according to the embodiment of the present invention. FIG. 3 is a diagram for explaining the principle of the time difference cutting method of the glass substrate according to the embodiment of the present invention. FIG. 4 is a graph showing the test results of dividing the glass substrate through the time difference cutting method of the glass substrate according to the embodiment of the present invention. FIG. 5 is a graph showing the difference between the time difference cutting method of the glass substrate according to the embodiment of the present invention and the result of the cutting by the general total adsorption cutting method.

Hereinafter, a more detailed description will be given with reference to the drawings attached to an embodiment of the present invention.

Basically, in the time difference cutting method of the glass substrate according to the present embodiment, when the glass substrate on which the scribe line is formed is divided, cracks start from one edge of the glass substrate and the opposite side along the scribe line. It has the characteristic of inducing it to propagate to the edge of the glass.

The above-mentioned time difference means that a time difference is given between the moment when a crack is generated at the edge portion on one side and the moment when a crack is generated at the edge portion on the other side. That is, the crack is generated first at the edge portion on one side, and the crack is generated later at the edge portion on the other side. The time difference cannot be confirmed with the naked eye.

By setting a time difference in the division as described above, not only the division is performed with a smaller force, but also from the data of the experimental results described later, it is confirmed that the shape of the cut surface is good and the occurrence of diagonal cracks is significantly reduced. can do.

FIG. 1 is a sequence diagram showing the time difference cutting method of the glass substrate according to the embodiment of the present invention in an organized manner. Further, FIGS. 2 and 3 are diagrams for explaining the principle of the time difference cutting method for the glass substrate according to the embodiment of the present invention.

As shown in FIG. 1, the time difference cutting method of the glass substrate according to this embodiment includes a glass substrate loading stage (100), a scribe stage (102), a substrate transfer stage (104), and a fixed position stage (1). It is composed of 106), an adsorption region determination step (108), a partial adsorption step (110), and a bending step (112).

First, the glass substrate charging stage (100) is a process of charging the divided glass substrate (11) into the scribe device. The scribe device is a device that forms a linear scribe line (11c) having a certain depth on the upper surface of the glass substrate (11). As a method of forming the scribe line (11c) on the brittle glass substrate (11), either a method using a laser beam or a method using a cutting wheel can be used.

When the setting of the glass substrate (11) in the apparatus is completed through the glass substrate charging step (100), the scribe step (102) is performed. The scribe step (102) is the process of forming a scribe line (11c) on the surface of the waiting glass substrate (11).

In particular, the scribe line (11c) should be in the form of a straight line starting from the edge line (11a) on one side of the glass substrate (11) and reaching the edge line (11b) on the other side. The division of the glass substrate (11) is performed from the scribe line (11c). That is, the scribe line (11c) is the dividing line.

When the scribe line (11c) is formed on the glass substrate (11) through the scribe step (102), the substrate transfer step (104) is performed. The substrate transfer stage (104) is a process of moving the glass substrate (11) remaining in the scribe device to the suction table (17). A normal conveyor device is used for the transfer of the glass substrate (11).

The subsequent fixed position step (106) is a process of positioning the glass substrate (11) on the suction table (17).

Referring to FIG. 2, the adsorption table (17) is composed of two paired adsorption stages (17a, 17b). The suction stages (17a, 17b) are separated at regular intervals and have a large number of suction ports (19) on the upper surface thereof.

Each suction port (19) is connected to an external vacuum pump (not shown), outputs the vacuum pressure at the time of operation of the vacuum pump, and sucks and fixes the glass substrate (11). In particular, the suction port (19) can be selectively operated by being individually controlled by a controller (not shown). For example, a suction port that outputs a vacuum pressure can be selected. That is, the working suction port (19b) that outputs the vacuum pressure by the vacuum pump and the non-working suction port (19a) that does not output the negative pressure can be determined as necessary.

Assuming that the glass substrate (11) is located on the upper surface of the suction table (17), the working suction port (19b) serves to suck the glass substrate (11) and fix it on the upper surface of the suction table (17). And the non-actuated suction port (19a) has no effect.

In the fixed position stage (106), the glass substrate (11) is set on the upper surface of the suction table (17), and the scribe line (11c) is set so as to be located between the suction stages (17a, 17b). Is.

Since the adsorption stages (17a, 17b) on both sides are separated at regular intervals, the central portion of the separation space of the adsorption stages (17a, 17b) in the width direction as shown in FIG. 2 or 3. The scribe line (11c) can be easily positioned.

Through the fixed position step (106), a large number of suction ports (19) are located under the glass substrate (11).

Following the fixed position step (106), the adsorption region determination step (108) is performed. The suction region determination step (108) is a process of determining whether to output the vacuum pressure to one of the many suction ports (19). As described above, since each suction port (19) is individually controlled by the controller, vacuum pressure can be provided only to a part of the selected suction ports.

As illustrated in FIG. 2, the first adsorption region (21) is located near the edge line (11a) on one side of the glass substrate (11), and the second suction region (21) is located near the edge line (11b) on the other side. Adsorption region (23) can be located. Conversely, as shown in FIG. 3, the second adsorption region (23) is located near the edge line (11a) on one side, and the first adsorption region (23) is located near the edge line (11b) on the other side. (21) can also be positioned.

The suction region means an area including a large number of working suction ports (19b). The area between the first adsorption region (21) and the second adsorption region (23) includes a non-actuated adsorption port (19a) that does not act as a non-adsorption region (25).

At the same time, the first adsorption region (21), the second adsorption region (23), and the non-adsorption region (25) are symmetrical about the scribe line (11c).

Through the adsorption region determination step (108), the adsorption regions (21, 23) are gathered at both end portions of the glass substrate (11).

In particular, the number of working suction ports (19b) contained inside the first suction region (21) is relatively larger than the number of working suction ports (19b) contained in the second suction region (23). .. The relatively large number of working suction ports (19b) means that the suction force is stronger. Therefore, the first adsorption region (21) brings the glass substrate (11) into close contact with the upper surface of the adsorption stage (17a, 17b) with a stronger force than the second adsorption region (23).

The stronger the suction force of the glass substrate (11) with respect to the upper surface of the suction stage (17a, 17b), the smaller the fine spacing of the glass substrate (11) with respect to the upper surface of the suction stage.

Therefore, from a microscopic point of view, in one glass substrate (11), the portion of the first adsorption region (21) is larger than the portion of the second adsorption region (23) in the adsorption stages (17a, 17b). ) Is close.

In such a situation, when the suction stage (17a or 17b) on one side is bent so as to be inclined downward, for example, the bending force generated from the suction stage is first transmitted to the first suction region (21). To. This is the reason why the scribe line (11c) in the portion where the first adsorption region (21) is located is divided first.

As shown in FIG. 2, when a bending force is applied to the glass substrate (11) while the first suction region (21) is located close to the right edge line (11a) on the drawing, the scribe line on the drawing is applied. A crack is generated at the right end of (11c), and the generated crack momentarily moves in the direction of arrow a. One end and the other end of the glass substrate (11) are separated with a time lag.

As shown in FIG. 3, when a bending force is applied to the glass substrate (11) while the first suction region (21) is located close to the left edge line (11b) on the drawing, the scribe line on the drawing is applied. A crack occurs at the left end of (11c), and the generated crack propagates along the direction of arrow b and reaches the opposite end. Similar to FIG. 2, a momentary time difference can be created in the division of both ends of the glass substrate (11).

When the positions of the first adsorption region (21) and the second adsorption region (23) are determined through the adsorption region determination step (108), the partial adsorption step (110) is performed. In the partial adsorption step (110), vacuum pressure is applied to the adsorption ports contained inside the first adsorption region (21) and the second adsorption region (23), and the glass substrate (11) is attached to the adsorption stage (17a, This is the process of partially fixing to 17b).

The subsequent bending step (112) is a process in which the suction stages (17a, 17b) are physically displaced to apply a bending force to the glass substrate (11). A known method can be used for such a bending step.

On the other hand, as described above, in the method for dividing the glass substrate according to the present embodiment, cracks are triggered from one end or the other end of the scribe line (11c) by adjusting the suction force of the suction table, and the cracks are inspired. It has the principle of propagating to the opposite side, and it is confirmed that the occurrence of diagonal cracks is remarkably reduced compared to the conventional whole simultaneous adsorption method, and that there is almost no chipping or chipping phenomenon at the time of division. Can be done.

FIG. 4 is a graph showing the results of a test in which three glass substrates are sequentially divided through the time difference cutting method of the glass substrate according to the embodiment of the present invention, and 48 points in the longitudinal direction of the scribe line (11c). The value obtained by measuring the diagonal crack value at.

As shown in the graph of FIG. 4, as a result of three tests, it can be confirmed that the value of the oblique crack is in the range of -20 μm to +20 μm. The above value is included with a margin within the limit value of ± 50 μm.

FIG. 5 is a graph showing the difference between the time difference cutting method of the glass substrate according to the embodiment of the present invention and the cutting result by the general total adsorption cutting method.

As shown in FIG. 5, in the case of the time difference cutting method according to this embodiment (displayed as Edge adsorption in the graph), compared to the case where diagonal cracks are contained within the range of ± 20 μm. It can be seen that the deviation of the oblique crack value is extremely wide in the total adsorption division method, and in particular, the oblique crack at some measurement positions reaches approximately 70 μm. That is, the shape of the divided portion becomes very poor.

Although the present invention has been described in detail through specific examples, the present invention is not limited to the above-mentioned examples, and various modifications can be made by a person having ordinary knowledge within the scope of the technical idea of the present invention. Is.

11 Glass substrate 11a Edge line 11b Edge line 11c Scribly line 17 Suction table 17a Suction stage 17b Suction stage 19 Suction port 19a Non-working suction port 19b Working suction port 21 First suction area 23 Second suction area 25 Non-suction area

Claims (2)

At the glass substrate loading stage, where the dividing glass substrate is loaded into the scribe device,
A scribe line is formed on the surface of the glass substrate set in the scribe device, and a linear scribe line is formed starting from one edge line of the glass substrate and reaching the other edge line. The scribe stage and
A fixed-position step in which the glass substrate that has completed the scribe step is transferred to a suction table side provided with a large number of suction ports and aligned.
After the completion of the fixed position step, a suction region determination step for determining a suction port that outputs a vacuum pressure among a large number of suction ports, and a suction region determination step.
A partial suction step in which a vacuum pressure is applied to the suction port selected through the suction region determination step to partially suck and fix the glass substrate on the upper surface of the suction table.
The look containing a step bending performing cutting by bending the scribe line of the glass substrate in a state of being attracted to the suction table, and
The adsorption region is
It consists of a first adsorption region containing two or more adsorption ports and a second adsorption region containing a smaller number of adsorption ports than the number of adsorption ports in the first adsorption region.
The adsorption region determination step is
A suction port for outputting the vacuum pressure is selected, but the first suction region is located close to the edge line on one side of the glass substrate, and the second suction region is located on the edge line on the other side of the glass substrate. It is a process of deciding to be close to each other,
A method for cutting a time difference of a glass substrate, characterized in that the first adsorption region and the second adsorption region are symmetrical with respect to the scribe line. It said first adsorption region between the second suction region, in claim 1, characterized in that the non-suction region of not applying suction force to the glass substrate output vacuum pressure is shut off is located The time difference cutting method of the glass substrate described.

Images