JP6871124B2 - Crystal device - Google Patents

Description

The present invention relates to a crystal device used in an electronic device or the like.

A crystal device uses the piezoelectric effect of a crystal element to generate a specific frequency. For example, the substrate, the first frame provided on the upper surface of the substrate to provide the first recess, the second frame provided on the lower surface of the substrate to provide the second recess, and the upper surface of the substrate are provided. A crystal device including a crystal element mounted on the electrode pad and an integrated circuit element mounted on the lower surface of the substrate has been proposed (see, for example, Patent Document 1 below).

Japanese Unexamined Patent Publication No. 2000-49560

The conventional crystal device has been remarkably miniaturized, but the package has also been miniaturized. In the miniaturized crystal device, via conductors for connecting the external terminal and the wiring pattern are formed so as to be exposed at the four corners of the second recess. When such a crystal device is mounted on a mounting board of an electronic device or the like, the via conductor connected to the output terminal, which is one of the external terminals, is exposed on the inner peripheral edge of the second frame. , There was a risk that noise would be superimposed on the output signal output from the output terminal.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a crystal device capable of suppressing noise from being superimposed on an output signal.

The crystal device according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer peripheral edge of the upper surface of the substrate, and a second frame provided along the outer peripheral edge of the lower surface of the substrate. The body, the crystal element mounted on the electrode pad provided on the upper surface of the substrate, the integrated circuit element mounted on the connection pad provided on the lower surface of the substrate, and the connection pad and the electrical element provided on the lower surface of the substrate. The connection pattern connected to, the first notch and the second notch provided at the four corners of the inner peripheral edge of the second frame, and the external terminal provided on the lower surface of the second frame, and the connection pattern. And an external terminal are electrically connected, and via conductors provided at the four corners of the inner peripheral edge of the second frame body and a lid body joined to the first frame body are provided, and the curvature of the first notch portion is provided. One of the via conductors located inside the second frame body provided with a radius larger than the radius of curvature of the second notch and provided with the first notch is inside the external terminal. It is electrically connected to the output terminal.

The crystal device according to one aspect of the present invention includes a rectangular substrate, a first frame provided along the outer peripheral edge of the upper surface of the substrate, and a second frame provided along the outer peripheral edge of the lower surface of the substrate. The body, the crystal element mounted on the electrode pad provided on the upper surface of the substrate, the integrated circuit element mounted on the connection pad provided on the lower surface of the substrate, and the connection pad and the electrical element provided on the lower surface of the substrate. The connection pattern connected to, the first notch and the second notch provided at the four corners of the inner peripheral edge of the second frame, and the external terminal provided on the lower surface of the second frame, and the connection pattern. And an external terminal are electrically connected, and via conductors provided at the four corners of the inner peripheral edge of the second frame body and a lid body joined to the first frame body are provided, and the curvature of the first notch portion is provided. One of the via conductors located inside the second frame body provided with a radius larger than the radius of curvature of the second notch and provided with the first notch is inside the external terminal. It is electrically connected to the output terminal. In such a crystal device, a via conductor electrically connected to an output terminal, which is one of the external terminals, is provided inside the second frame, so that the via conductor is exposed inside the second frame. Therefore, when mounting on a mounting board of an electronic device or the like, the bonding material attached to the external terminal, which is an output terminal, does not adhere to the exposed via conductor, so that noise is superimposed on the reference signal. Can be suppressed.

It is an exploded perspective view which shows the crystal device which concerns on this embodiment. (A) is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 1B is a cross-sectional view taken along the line BB of FIG. (A) is a perspective plan view seen from the upper surface of the package constituting the crystal device according to the present embodiment, and (b) is a perspective plan view seen from the upper surface of the substrate of the package constituting the crystal device according to the present embodiment. It is a figure. (A) is a perspective plan view seen from the lower surface of the package constituting the crystal device according to the present embodiment, and (b) is a perspective plan view of the crystal device according to the present embodiment seen from the lower surface. It is sectional drawing which shows the crystal device which concerns on the 1st modification of this embodiment.

As shown in FIGS. 1 and 2, the crystal device in the present embodiment includes a package 110, a crystal element 120 bonded to the upper surface of the package 110, and an integrated circuit element 150 bonded to the lower surface of the package 110. And is included. The package 110 is formed with a first recess K1 surrounded by an upper surface of the substrate 110a and an inner surface of the first frame 110b. Further, a second recess K2 surrounded by the lower surface of the substrate 110a and the inner surface of the second frame 110c is formed. Such a crystal device is used to output a reference signal used in an electronic device or the like.

The substrate 110a has a rectangular shape, and is for mounting the crystal element 120 mounted on the upper surface and the integrated circuit element 150 mounted on the lower surface. The substrate 110a is provided with an electrode pad 111 for mounting the crystal element 120 on the upper surface, and a connection pad 115 for mounting the integrated circuit element 150 on the lower surface. Further, an electrode pad 111 for joining the crystal element 120 is provided along one side of the substrate 110a. External terminals 112 are provided at the four corners of the lower surface of the second frame body 110c. Further, as shown in FIG. 4, a pair of measurement pads 118 are provided in the center of the lower surface of the substrate 110a, and the integrated circuit element 150 is mounted so as to surround the pair of measurement pads 118. Two connection pads 115 are provided. Further, the external terminals 112 are electrically connected to the four external terminals inside the connection pad 115.

The substrate 110a is made of an insulating layer which is a ceramic material such as alumina ceramics or glass-ceramics. The substrate 110a may be one in which one layer of insulating layers is used, or one in which a plurality of layers of insulating layers are laminated. As shown in FIG. 3, wiring for electrically connecting the electrode pad 111 provided on the upper surface and the measuring pad 118 provided on the lower surface of the substrate 110a on the surface and inside of the substrate 110a. A pattern 113 and a via conductor 114 are provided. Further, on the surface of the substrate 110a, a connection pattern 117 for electrically connecting the connection pad 115 and the measurement pad 118 provided on the lower surface and the external terminal 112 provided on the lower surface of the second frame body 110c is provided. It is provided.

The first frame body 110b is arranged on the upper surface of the substrate 110a, and is for forming the first recess K1 on the upper surface of the substrate 110a. Further, the second frame body 110c is arranged on the lower surface of the substrate 110a, and is for forming the second recess K2 on the lower surface of the substrate 110a. The first frame 110b and the second frame 110c are made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, and are integrally formed with the substrate 110a.

The electrode pad 111 is for mounting the crystal element 120. A pair of electrode pads 111 are provided on the upper surface of the substrate 110a, and are provided adjacent to each other along one side of the substrate 110a. As shown in FIGS. 3 and 4, the electrode pad 111 is electrically connected to the measurement pad 118 provided on the lower surface of the substrate 110a via the wiring pattern 113 and the conductor portion 114 provided on the upper surface of the substrate 110a. It is connected to the.

As shown in FIG. 3, the electrode pad 111 is composed of a first electrode pad 111a and a second electrode pad 111b. The conductor portion 114 is composed of a first conductor portion 114a and a second conductor portion 114b. Further, the wiring pattern 113 is composed of the first wiring pattern 113a and the second wiring pattern 113b.

Further, the first electrode pad 111a is electrically connected to one end of the first wiring pattern 113a provided on the substrate 110a. Further, the other end of the first wiring pattern 113a is electrically connected to the first measurement pad 118a, which will be described later, via the first conductor portion 114a. Therefore, the first electrode pad 111a is electrically connected to the first measurement pad 118a. The second electrode pad 111b is electrically connected to one end of the second wiring pattern 113b provided on the substrate 110a. Further, the other end of the second wiring pattern 113b is electrically connected to the second measurement pad 118b, which will be described later, via the second conductor portion 114b. Therefore, the second electrode pad 111b is electrically connected to the second measurement pad 118b.

The external terminal 112 is for mounting on a mounting board of an electronic device or the like. The external terminals 112 are provided at the four corners of the lower surface of the second frame body 110c. The external terminals 112 are electrically connected to four of the six connection pads 115 provided on the lower surface of the substrate 110a. Further, the third external terminal 112c is connected to a mounting pad connected to a ground potential which is a reference potential on a mounting board of an electronic device or the like. As a result, the lid 130 joined to the sealing conductor pattern H is connected to the third external terminal 112c, which has a ground potential. Therefore, the shielding property in the first recess K1 by the lid body 130 is improved. Further, the first external terminal 112a is used as a functional terminal, the second external terminal 112b is used as an output terminal, and the fourth external terminal 112d is used as a power supply voltage terminal. The functional terminal is used as a write / read terminal and a frequency control terminal by switching. Here, the write / read terminal is a terminal for writing the temperature compensation control data to the storage element unit and reading the temperature compensation control data written in the storage element unit. The frequency control terminal is a terminal for correcting the temperature characteristics of the crystal element by changing the load capacitance of the variable capacitance diode of the oscillation circuit unit when a voltage is applied.

As shown in FIG. 4B, the external terminals 112 are provided at the four corners of the lower surface of the second frame body 110c, and are the first external terminal 112a, the second external terminal 112b, the third external terminal 112c, and the fourth external terminal. It is composed of 112d. The external terminals 112 are electrically connected to the connection pads 115 provided on the lower surface of the substrate 110a. Further, the third external terminal 112c is electrically connected to the sealing conductor pattern H via the third conductor portion 114c and the third via conductor 119c, which will be described later. Therefore, the third external terminal 112c is used as a ground terminal.

The wiring pattern 113 is provided on the upper surface of the substrate 110a and is drawn out from the electrode pad 111 toward the conductor portion 114 of the nearby substrate 110a. Further, as shown in FIG. 3, the wiring pattern 113 is composed of the first wiring pattern 113a and the second wiring pattern 113b.

The conductor portion 114 is provided inside the substrate 110a, and both ends thereof are electrically connected to the wiring pattern 113 and the measurement pad 118. The conductor portion 114 is provided by filling the inside of the through hole provided in the substrate 110a with a conductor. The conductor portion 114 is composed of a first conductor portion 114a, a second conductor portion 114b, and a third conductor portion 114c. The third conductor portion 114c is provided on the first frame body 110b and is electrically connected to the sealing conductor pattern H.

The connection pad 115 is used to mount the integrated circuit element 150. Further, as shown in FIG. 4, the connection pad 115 is provided by the first connection pad 115a, the second connection pad 115b, the third connection pad 115c, the fourth connection pad 115d, the fifth connection pad 115e, and the sixth connection pad 115f. It is configured. The first connection pad 115a and the first external terminal 112a are connected by a first connection pattern 117a described later and a first via conductor 119a described later provided on the lower surface of the substrate 110a, and the second connection pad 115b and the first external terminal 112a are connected to each other. One measurement pad 118a is electrically connected. Further, the third connection pad 115c and the third external terminal 112c are connected by a second connection pattern 117b described later and a third via conductor 119c described later provided on the lower surface of the substrate 110a, and the fourth connection pad 115d And the second external terminal 112b are connected by a third connection pattern 117c described later and a second via conductor 119b described later provided on the lower surface of the substrate 110a. Further, the fifth connection pad 115e and the second measurement pad 118b are electrically connected, and the sixth connection pad 115f and the fourth external terminal 112d are connected to the fourth connection described later, which is provided on the lower surface of the substrate 110a. It is connected by a pattern 117d and a fourth via conductor 119d described later. Further, the connection pattern 117 is provided on the lower surface of the substrate 110a and is drawn out from the connection pad 115 toward the nearby external terminal 112.

The cutouts 116 are provided at the four corners of the inner peripheral edge of the second frame 110c. The notch 116 is provided so as to form an arc in contact with both sides of the corner. The notch 116 is composed of a first notch 116a and a second notch 116b. The radius of curvature R1 of the first notch portion 116a is provided so as to be larger than the radius of curvature R2 of the second notch portion 116b. The radius of curvature R1 of the first notch 116a is 150 to 225 μm, and the radius of curvature R2 of the second notch 116b is 75 to 125 μm.

The connection pattern 117 is for electrically connecting the connection pad 115 and the external terminal 112. The connection pattern 117 is composed of a first connection pattern 117a, a second connection pattern 117b, a third connection pattern 117c, and a fourth connection pattern 117d.

The measuring pad 118 is for measuring the characteristics of the crystal element 120 by bringing the contact pin or the like into contact with the measuring pad 118. The measurement pad 118 is composed of a first measurement pad 118a and a second measurement pad 118b. The measurement pad 118 is electrically connected to the electrode pad 111 provided on the upper surface of the substrate 110a via the wiring pattern 113 and the conductor portion 114 provided on the substrate 110a. The measurement pad 118 is provided at a position where it overlaps with the integrated circuit element 150 in a plan view. By doing so, the stray capacitance generated between the mounting pattern (not shown) on the mounting board of an electronic device or the like and the measurement pad 118 is reduced, so that the stray capacitance is not added to the crystal element 120. , It is possible to reduce the fluctuation of the oscillation frequency of the crystal element 120.

The via conductor 119 is for electrically connecting the connection pattern 117 and the external terminal 112. As shown in FIG. 4, the via conductors 119 are provided at the four corners of the inner peripheral edge of the second frame body 110c, and both ends thereof are electrically connected to the connection pattern 117 and the external terminal 112. The via conductor 119 is provided by filling the inside of the through hole provided in the substrate 110a with a conductor. The via conductor 119 is composed of a first via conductor 119a, a second via conductor 119b, a first via conductor 119c, and a fourth via conductor 119d. The upper end of the third via conductor 119c is electrically connected to the third conductor 114c, so that it is electrically connected to the lid 130 via the sealing conductor pattern H.

One of the via conductors 119 located inside the second frame 110c provided with the first notched portion 116a is electrically connected to the output terminal in the external terminal 112. That is, the second via conductor 119b is provided inside the second frame body 110c, and is provided so as not to be exposed on the inner peripheral edge of the second frame body 110c. Further, the radius of curvature R1 is made larger than the radius of curvature R2 so that the second via conductor 119b is not exposed on the inner wall of the second frame 110c. In such a crystal device, since the second via conductor 119b electrically connected to the output terminal 112b, which is one of the external terminals 112, is provided in the second frame 110c, the second via conductor The 119b is not exposed inside the second frame 110c, and when mounted on a mounting board such as an electronic device, the bonding material attached to the second external terminal 112b, which is an output terminal, is attached to the second via conductor 119b. It can be prevented from adhering. Therefore, it is possible to suppress the application of load resistance due to the bonding material adhering to the second via conductor 119b, so that noise is superimposed on the reference signal output from the second external terminal 112b, which is the output terminal. It is possible to suppress the storage.

The sealing conductor pattern H plays a role of improving the wettability of the joining member 131 when joining the lid body 130 via the joining member 131. As shown in FIGS. 3 and 4, the sealing conductor pattern H is electrically connected to the third external terminal 112c via the third conductor portion 114c and the third via conductor 119c. The sealing conductor pattern H has a thickness of, for example, 10 to 25 μm by sequentially applying nickel plating and gold plating to the surface of a conductor pattern made of, for example, tungsten or molybdenum, in a form that surrounds the upper surface of the first frame 110b in an annular shape. Is formed in.

Here, the size of the measurement pad 118 will be described by taking as an example the case where the dimension of one side when the package 110 is viewed in a plan view is 0.8 to 2.0 mm. The length of the long side of the measuring pad 118 is 0.2 to 0.8 mm, and the length of the short side is 0.15 to 0.75 mm.

Further, as an electrical characteristic measuring instrument (not shown) used when measuring the characteristics of the crystal element 120, it is necessary to measure equivalent parameters such as inductance and capacitance in addition to the resonance frequency and crystal impedance of the crystal element 120. A network analyzer or impedance analyzer that can be used is used. The contact pin is composed of a highly conductive pin in which the surface of an alloy such as copper or silver is plated with gold, and a resectorable socket having a spring property that suppresses an impact at the time of contact. The measurement is performed by making contact while pressing against.

Here, a method of manufacturing the substrate 110a will be described. When the substrate 110a is made of alumina ceramics, first, a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent or the like to a predetermined ceramic material powder are prepared. Further, a predetermined conductor paste is applied to the surface of the ceramic green sheet or the through hole which has been punched or the like in advance by punching or the like to the ceramic green sheet by a conventionally known screen printing or the like. Further, these green sheets are laminated and press-molded, and then fired at a high temperature. Finally, a predetermined portion of the conductor pattern, specifically, an electrode pad 111, an external terminal 112, a wiring pattern 113, a conductor portion 114, a connection pad 115, a connection pattern 117, a measurement pad 118, a via conductor 119, and a sealing conductor. It is produced by subjecting the portion to be the pattern H to nickel plating, gold plating, silver palladium, or the like. Further, the conductor paste is composed of, for example, a sintered body of a metal powder such as tungsten, molybdenum, copper, silver or silver-palladium.

As shown in FIGS. 1 and 2, the crystal element 120 is bonded onto the electrode pad 111 via a conductive adhesive 140. The crystal element 120 plays a role of oscillating a reference signal of an electronic device or the like by stable mechanical vibration and a piezoelectric effect.

Further, as shown in FIGS. 1 and 2, the crystal element 120 has a structure in which the excitation electrode 122 and the extraction electrode 123 are adhered to the upper surface and the lower surface of the quartz base plate 121, respectively. .. The excitation electrode 122 is formed by adhering and forming metal on the upper surface and the lower surface of the quartz base plate 121 in a predetermined pattern. The excitation electrode 122 includes a first excitation electrode 122a on the upper surface and a second excitation electrode 122b on the lower surface. The extraction electrode 123 extends from the excitation electrode 122 toward one side of the quartz plate 121. The extraction electrode 123 includes a first extraction electrode 123a on the upper surface and a second extraction electrode 123b on the lower surface. The first extraction electrode 123a is drawn out from the first excitation electrode 122a and is provided so as to extend toward one side of the quartz base plate 121. The second extraction electrode 123b is drawn out from the second excitation electrode 122b and is provided so as to extend toward one side of the quartz base plate 121. That is, the lead-out electrode 123 is provided in a shape along the long side or the short side of the quartz base plate 121. Further, in the present embodiment, one end of the crystal element 120 connected to the first electrode pad 111a and the second electrode pad 111b is a fixed end connected to the upper surface of the substrate 110a, and the other end is between the upper surface of the substrate 110a. The crystal element 120 is fixed on the substrate 110a by a cantilever support structure having a free end.

Here, the operation of the crystal element 120 will be described. In the crystal element 120, when an external alternating voltage is applied from the extraction electrode 123 to the crystal base plate 121 via the excitation electrode 122, the crystal base plate 121 is excited in a predetermined vibration mode and frequency. ing.

Here, a method of manufacturing the crystal element 120 will be described. First, the crystal element 120 is cut from an artificial crystalline lens at a predetermined cut angle to reduce the thickness of the outer circumference of the crystal base plate 121, and the central portion of the crystal base plate 121 becomes thicker than the outer peripheral portion of the crystal base plate 121. Bevel processing is performed so as to be provided. Then, the crystal element 120 is manufactured by forming the excitation electrode 122 and the extraction electrode 123 by adhering a metal film on both main surfaces of the crystal base plate 121 by a photolithography technique, a vapor deposition technique, or a sputtering technique. Will be done.

A method of joining the crystal element 120 to the substrate 110a will be described. First, the conductive adhesive 140 is applied onto the first electrode pad 111a and the second electrode pad 111b by, for example, a dispenser. The crystal element 120 is conveyed on the conductive adhesive 140 and placed on the conductive adhesive 140. Then, the conductive adhesive 140 is cured and shrunk by being heat-cured. The crystal element 120 is joined to the electrode pad 111. That is, the second lead-out electrode 123b of the crystal element 120 is joined to the second electrode pad 111b, and the first pull-out electrode 123a is joined to the first electrode pad 111a.

The conductive adhesive 140 contains a conductive powder as a conductive filler in a binder such as a silicone resin, and the conductive powder includes aluminum, molybdenum, tungsten, platinum, palladium, silver, and titanium. Any of nickel and nickel iron, or those containing a combination thereof are used. Further, as the binder, for example, a silicone resin, an epoxy resin, a polyimide resin or a bismaleimide resin is used.

As the integrated circuit element 150, for example, a rectangular flip-chip type integrated circuit element having a plurality of connection terminals is used, and a temperature sensor for detecting an ambient temperature state, a crystal, is used on the circuit forming surface (upper surface) thereof. A storage element unit for storing temperature compensation data that compensates for the temperature characteristics of the element 120, a temperature compensation circuit unit that corrects the vibration characteristics of the crystal element 120 according to a temperature change based on the temperature compensation data, and a temperature compensation circuit unit thereof. An oscillation circuit unit is provided which is connected to and generates a predetermined oscillation output. The output signal generated by the oscillation circuit unit is output to the outside of the temperature-compensated crystal oscillator via the second external terminal 112b of the package 110, and is used as a reference signal such as a clock signal.

The storage element unit is composed of PROM and EEPROM. The temperature compensation control data of the parameters that are the basis of the cubic function shown below, which is the temperature compensation function, such as the cubic component adjustment value α, the primary component adjustment value β, and the 0th component adjustment value γ, is the first external terminal. It is input and saved from the function terminal which is 112a. A register map is stored in the storage element unit. The register map shows how the control unit reads the data, outputs a signal, and performs an operation when the control data is input to each address data.

The temperature compensation circuit unit is composed of a cubic function generation circuit, a quintic function generation circuit, and the like. For example, in the case of a cubic function generation circuit, the temperature compensation control data input to the storage element unit is read out, and the voltage derived by the cubic function is generated for each temperature from the temperature compensation control data. The external ambient temperature at this time is obtained from the temperature sensor inside the integrated circuit element 150. The temperature compensation circuit unit is connected to the cathode of the variable capacitance diode, and the voltage from the temperature compensation circuit unit is applied. In this way, the frequency temperature characteristic is flattened by correcting the frequency temperature characteristic of the crystal element 120 by applying the voltage from the temperature compensation circuit unit to the variable capacitance diode.

As shown in FIG. 2, the integrated circuit element 150 is mounted on a connection pad 115 provided on the lower surface of the substrate 110a via a conductive bonding material 160 such as solder. Further, the connection terminal 151 of the integrated circuit element 150 is connected to the connection pad 115. The connection pad 115 is electrically connected to the external terminal 112 via the connection pattern 117. The third external terminal 112c serves as a ground terminal by being connected to a mounting pad connected to a ground which is a reference potential on a mounting board of an electronic device or the like. Therefore, one of the connection terminals 151 of the integrated circuit element 150 is connected to the ground which is the reference potential.

Further, the temperature sensor provided in the integrated circuit element 150 is provided so as to be located in the measurement pad 118 in a plan view. By doing so, the heat transferred from the crystal element 120 and the heat transferred from the electrode pad 111 to the measurement pad 118 via the wiring pattern 113 and the conductor portion 114 are dissipated from the measurement pad 118, and the integrated circuit element 150 It will be transmitted to the temperature sensor installed inside. Therefore, since the heat conduction path of the crystal device can be shortened, the temperature of the crystal element 120 and the temperature of the integrated circuit element 150 become close to each other, and the temperature obtained by the temperature sensor of the integrated circuit element 150 and the temperature obtained by the temperature sensor of the integrated circuit element 150. It is possible to further reduce the difference from the actual ambient temperature of the crystal element 120.

Further, as shown in FIGS. 1 and 2, the integrated circuit element 150 has a rectangular shape, and six connection terminals 151 are provided on the lower surface thereof. Three connection terminals 151 are provided along one side, and three are provided along one side facing the one side. The length of the long side of the integrated circuit element 150 is 0.5 to 1.2 mm, and the length of the short side is 0.3 to 1.0 mm. The length of the integrated circuit element 150 in the thickness direction is 0.1 to 0.3 mm.

The conductive bonding material 160 is made of, for example, silver paste or lead-free solder. Further, the conductive bonding material contains an added solvent for adjusting the viscosity so that it can be easily applied. The lead-free solder has a component ratio of 95 to 97.5% for tin, 2 to 4% for silver, and 0.5 to 1.0% for copper.

The lid 130 is made of, for example, an alloy containing at least one of iron, nickel or cobalt. Such a lid 130 is for airtightly sealing the first recess K1 in a vacuum state or the first accommodating portion K1 filled with nitrogen gas or the like. Specifically, the lid body 130 is placed on the first frame body 110b of the package 110 in a predetermined atmosphere, and the sealing conductor pattern H of the first frame body 110b and the joining member 131 of the lid body 130 are formed. By applying a predetermined current so as to be welded and performing seam welding, the first frame body 110b is joined. Further, the lid body 130 is electrically connected to the third external terminal 112c on the lower surface of the second frame body 110c via the sealing conductor pattern H, the third conductor portion 114c and the third via conductor 119c. Therefore, the lid body 130 is electrically connected to the third external terminal 112c of the second frame body 110c.

The joining member 131 is provided at a position of the lid 130 facing the sealing conductor pattern H provided on the upper surface of the first frame 110b of the package 110. The joining member 131 is provided with, for example, silver wax or gold tin. In the case of silver wax, its thickness is 10 to 20 μm. For example, the component ratio is 72 to 85% for silver and 15 to 28% for copper. In the case of gold tin, its thickness is 10 to 40 μm. For example, those having a component ratio of 78 to 82% for gold and 18 to 22% for tin are used.

The crystal device in the present embodiment includes a rectangular substrate 110a, a first frame 110b provided along the outer peripheral edge of the upper surface of the substrate 110a, and a second frame provided along the outer peripheral edge of the lower surface of the substrate 110a. The frame body 110c, the crystal element 120 mounted on the electrode pad 111 provided on the upper surface of the substrate 110a, the integrated circuit element 150 mounted on the connection pad 115 provided on the lower surface of the substrate 110a, and the lower surface of the substrate 110a. The connection pattern 117, which is electrically connected to the connection pad 115, and the first notch 116a and the second notch 116b provided at the four corners of the inner peripheral edge of the second frame 110c, and the second The external terminal 112 provided on the lower surface of the frame body 110c, the connection pattern 117 and the external terminal 112 are electrically connected, and the via conductors 119 provided at the four corners of the inner peripheral edge of the second frame body 110c and the first A lid body 130 joined to the frame body 110b is provided, and the radius of curvature R1 of the first notch 116a is provided to be larger than the radius of curvature R2 of the second notch 116b. One of the via conductors 119 located inside the second frame 110c provided with 116a is electrically connected to the output terminal in the external terminal 112.

In such a crystal device, since the via conductor 119 electrically connected to the output terminal 112b, which is one of the external terminals 112, is provided in the second frame 110c, the second frame 110c Since it is not exposed to the inside and the bonding material attached to the external terminal 112, which is the output terminal 112b, does not adhere to the exposed via conductor 119 when mounted on a mounting board such as an electronic device, noise is generated. Can be suppressed from being superimposed on the reference signal.

Further, in the crystal device of the present embodiment, the first notch portion 116a is provided diagonally in the second frame 110c. In this way, the first notch portion 116a is provided so as to be located diagonally in the second frame 110c, so that the crystal device is mounted on the mounting substrate of an electronic device or the like and the bonding material is melted. Since the area of the external terminal 112 provided at a position close to the first notch 116a is the same diagonally, the amount of adhesion of the bonding material becomes equal, so that the crystal device Can be suppressed from being mounted in rotation while reducing the fact that is mounted at an angle from the mounting board.

Further, in the crystal device of the present embodiment, one of the via conductors 119 is electrically connected to the ground terminal 112c in the external terminal 112, and the via conductor 119c is electrically connected to the ground terminal 112c. Is provided so as to be exposed in the second frame body 110c. By doing so, when the crystal device is mounted on the mounting substrate of the electronic device, the via conductor 119c is connected to the ground to provide a shield function. Therefore, the integrated circuit element 150 is provided. It can provide better protection than unnecessary electrical action from the outside.

Further, the crystal device in the present embodiment has a measurement pad 118 provided on the lower surface of the substrate 110a, and the measurement pad 118 is provided at a position where it overlaps with the integrated circuit element 150 in a plan view. By doing so, the stray capacitance generated between the mounting pattern (not shown) on the mounting board of an electronic device or the like and the measurement pad 118 is reduced, so that the stray capacitance is not added to the crystal element 120. , It is possible to reduce the fluctuation of the oscillation frequency of the crystal element 120.

(First Modified Example) Hereinafter, the crystal device in the first modified example of the present embodiment will be described. Of the crystal devices in the first modification of the present embodiment, the same parts as those of the crystal device described above are designated by the same reference numerals, and the description thereof will be omitted as appropriate. In the crystal device in the first modification of the present embodiment, as shown in FIG. 5, an insulating resin 170 is provided between the exposed portion of the via conductor 119 and the integrated circuit element 150 and the connection pad 115. It differs from the present embodiment in that it is provided.

Further, as shown in FIG. 5, the insulating resin 170 is provided on the exposed surface of the via conductor 119. By doing so, the bonding material (not shown) such as solder used when mounting the crystal device on the mounting substrate of the electronic device has the insulating resin 170 on the exposed surface of the via conductor 119. By being coated, the bonding material is less likely to get wet and spread, so that it is possible to further suppress the entry into the second recess K2.

As shown in FIG. 5, the insulating resin 170 is provided between the surface of the integrated circuit element 150 where the connection terminal 151 is provided and the connection pad 115. By doing so, the insulating resin 170 can increase the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 110a. Further, even if a bonding material such as solder gets into the second recess K2 when the crystal device is mounted on the mounting pad of the mounting substrate of an electronic device or the like, the bonding material is provided by the insulating resin 170. Is prevented from adhering to the connection terminals 151 of the integrated circuit element 150, so that a short circuit between the connection terminals 151 of the integrated circuit element 150 can be reduced. Further, the insulating resin 170 is made of a resin material such as an epoxy resin or a composite resin containing an epoxy resin as a main component.

Further, the insulating resin 170 is provided so as to cover the measurement pad 118. By doing so, it is possible to prevent foreign matter from adhering to the measurement pad 118, and thus it is possible to prevent the additional resistance of the foreign matter from being applied to the crystal element 120. Therefore, it is possible to reduce fluctuations in the oscillation frequency of the crystal element 120.

A method of forming the insulating resin 170 on the substrate 110a will be described. The tips of the resin dispenser are inserted into the four corners of the inner peripheral edge of the second frame 110c to inject the insulating resin 170. Next, the insulating resin 170 is heated and cured. Therefore, the insulating resin 170 is provided so as to cover the exposed surface of the via conductor 119. By doing so, the bonding material (not shown) such as solder used when mounting the crystal device on the mounting substrate of the electronic device has the insulating resin 170 on the exposed surface of the via conductor 119. By being coated, the bonding material is less likely to get wet and spread, so that it is possible to further suppress the entry into the second recess K2.

In the crystal device in the first modification of the present embodiment, the insulating resin 170 is provided on the exposed surface of the via conductor 119. By doing so, the bonding material (not shown) such as solder used when mounting the crystal device on the mounting substrate of the electronic device has the insulating resin 170 on the exposed surface of the via conductor 119. By being coated, the bonding material is less likely to get wet and spread, so that it is possible to prevent the joint material from entering the second recess K2.

Further, in the crystal device in the first modification of the present embodiment, an insulating resin 170 is provided between the integrated circuit element 150 and the connection pad 115. By doing so, the adhesive strength between the integrated circuit element 150 and the lower surface of the substrate 110a can be increased. Further, since the adhesive resin 170 suppresses the bonding material from adhering between the connection terminals 151 of the integrated circuit element 150, it is possible to reduce the short circuit between the connection terminals 151 of the integrated circuit element 150.

It should be noted that the present invention is not limited to this embodiment, and various changes and improvements can be made without departing from the gist of the present invention. In the above embodiment, the case where the crystal element for AT is used as the crystal element has been described, but the tuning fork type bent crystal having a base and two flat plate-shaped vibrating arms extending in the same direction from the side surface of the base. An element may be used.

110 ... Package 110a ... Substrate 110b ... First frame 110c ... Second frame 111 ... Electrode pad 112 ... External terminal 113 ... Wiring pattern 114 ... Conductor 115 ・ ・ ・ Connection pad 116 ・ ・ ・ Notch part 117 ・ ・ ・ Connection pattern 118 ・ ・ ・ Measurement pad 119 ・ ・ ・ Via conductor 120 ・ ・ ・ Crystal element 121 ・ ・ ・ Crystal base plate 122 ・ ・ ・ For excitation Electrode 123 ・ ・ ・ Pull-out electrode 130 ・ ・ ・ Lid 131 ・ ・ ・ Bonding member 140 ・ ・ ・ Conductive adhesive 150 ・ ・ ・ Integrated circuit element 151 ・ ・ ・ Connection terminal 160 ・ ・ ・ Conductive bonding material 170 ・・ ・ Insulating resin H ・ ・ ・ Conductor pattern for sealing K1 ・ ・ ・ First recess K2 ・ ・ ・ Second recess

Claims (4)

With a rectangular board
A first frame provided along the outer peripheral edge of the upper surface of the substrate, and
A second frame provided along the outer peripheral edge of the lower surface of the substrate, and
A crystal element mounted on an electrode pad provided on the upper surface of the substrate, and
An integrated circuit element mounted on a connection pad provided on the lower surface of the substrate, and
A connection pattern provided on the lower surface of the substrate and electrically connected to the connection pad,
The first notch and the second notch provided at the four corners of the inner peripheral edge of the second frame,
External terminals provided on the lower surface of the second frame and
Via conductors, which are electrically connected to the connection pattern and the external terminal and are provided at the four corners of the inner peripheral edge of the second frame,
A lid body joined to the first frame body is provided so that the radius of curvature of the first notch portion is larger than the radius of curvature of the second notch portion.
One of the via conductors located inside the second frame body provided with the first notch is electrically connected to the output terminal in the external terminal .
The first notch portion is provided on the diagonal line of the second frame body.
One of the via conductors is electrically connected to the ground terminal in the external terminal.
The via conductor electrically connected to the output terminal is provided so as not to be exposed inside the second frame.
A crystal device characterized in that the via conductor electrically connected to the ground terminal is provided so as to be exposed inside a second frame. The crystal device according to claim 1.
It has a measurement pad provided on the lower surface of the substrate, and has.
A crystal device characterized in that the measurement pad is provided at a position where it overlaps with the integrated circuit element in a plan view. The crystal device according to claim 1.
A crystal device characterized in that an insulating resin is provided at an exposed portion of the via conductor. The crystal device according to claim 3.
A crystal device characterized in that the insulating resin is also provided between the integrated circuit element and the connection pad.

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