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JP6877007B2 - Operation method of copper electrorefining - Google Patents
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JP6877007B2 - Operation method of copper electrorefining - Google Patents

Operation method of copper electrorefining Download PDF

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JP6877007B2
JP6877007B2 JP2017167187A JP2017167187A JP6877007B2 JP 6877007 B2 JP6877007 B2 JP 6877007B2 JP 2017167187 A JP2017167187 A JP 2017167187A JP 2017167187 A JP2017167187 A JP 2017167187A JP 6877007 B2 JP6877007 B2 JP 6877007B2
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anode
passivation
copper
current density
slime layer
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博昭 中野
博昭 中野
悟 大上
悟 大上
健太 渡
健太 渡
秀樹 大原
秀樹 大原
賢二 竹田
賢二 竹田
浅野 聡
聡 浅野
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Sumitomo Metal Mining Co Ltd
Kyushu University NUC
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Kyushu University NUC
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Description

本発明は、銅電解精製における不動態化の発生を予測する操業管理方法に関する。 The present invention relates to an operation management method for predicting the occurrence of passivation in copper electrorefining.

工業的な銅の電解精製では、硫酸銅を主成分とする電解液を装入した電解槽の中に、銅製錬の乾式工程で製造された粗銅で作られた陽極板(以下、アノードと称する。)と、銅もしくはステンレスやチタンなどで作られた陰極板(以下、カソードと称する。)を交互に一定間隔で対向するように配置し、通電して行われる。 In industrial electrolytic purification of copper, an anode plate made of blister copper produced in a dry process of copper smelting (hereinafter referred to as an anode) is placed in an electrolytic cell filled with an electrolytic solution containing copper sulfate as a main component. ) And a cathode plate made of copper, stainless steel, titanium, etc. (hereinafter referred to as a cathode) are alternately arranged so as to face each other at regular intervals, and are energized.

この通電により、アノード側ではアノードに含有された銅は電解液中に銅イオンとして溶出し、一方カソード上では銅イオンが電析する。この際に金や銀や鉛のようにアノードから溶出しないままアノード表面で単体や化合物の形態のアノードスライムを形成し、アノードから剥がれ落ちて槽底に沈積するもの、ニッケルなどのようにアノードから溶出するがカソードには析出しないもの、アンチモンやビスマスのように一部がアノードから溶出し、残りは槽底に沈むものなど様々な形態をとる。 By this energization, the copper contained in the anode is eluted as copper ions in the electrolytic solution on the anode side, while the copper ions are electrodeposited on the cathode. At this time, an anode slime in the form of a single substance or a compound is formed on the surface of the anode without elution from the anode like gold, silver or lead, and the thing that peels off from the anode and deposits on the bottom of the tank, such as nickel, from the anode. It takes various forms, such as those that elute but do not precipitate on the cathode, and those that partially elute from the anode and sink to the bottom of the tank, such as antimony and bismuth.

しかし、上記のアノードの表面には、時として不動態化皮膜と呼ばれる層が生成されて電流が流れ難くなる不動態化と称せられる現象が発生することがある。この不動態化が発生すると電流が流れなくなったり、電圧が上昇したりするなど通常の電解操業が困難となり、銅の生産性を大きく低下させる問題が生じる。 However, on the surface of the above-mentioned anode, a phenomenon called passivation may occur in which a layer called a passivation film is sometimes formed to make it difficult for current to flow. When this passivation occurs, normal electrolytic operation becomes difficult, such as when current does not flow or the voltage rises, and there arises a problem that the productivity of copper is greatly reduced.

上記不動態化皮膜は、アノードスライムと同じく黒っぽい色を呈するなど一見類似するが、通常のアノードスライムは電解液の通液性が良く、適宜アノードから剥がれ落ちるなど、言わば「新陳代謝」するのに対して、不動態化皮膜はアノード表面に「粘着」し、電解液も電流の流れも遮ってしまう点が異なる。 The above passivation film is seemingly similar in that it has a blackish color like the anode slime, but the normal anode slime has good electrolyte permeability and peels off from the anode as appropriate, so to speak, it "metabolizes". The difference is that the passivation film "sticks" to the surface of the anode, blocking both the electrolyte and the flow of current.

この不動態化発生の原因としては様々に考えられるが、現象の一つとして銅アノード表面に硫酸銅の結晶が析出していることが多い。
硫酸銅結晶が生成する要因としては様々な要因が考えられる。例えば、電解液温度の低下、電解槽内での電解液の対流不足によるアノード表面での拡散の不足、さらにアノードでの電流密度増加や電解液中の銅イオン濃度の過剰な増加あるいは電解液中の遊離硫酸イオン濃度の増加、さらに銅アノードに含有する不純物の増加、銅アノード表面に付着するアノードスライム層の構造緻密化等もある。
これらが複合的に絡み合いアノードから溶出した銅がイオンとして電解液中に拡散することが制限され、過飽和となって硫酸銅の結晶を析出し不動態化皮膜を形成すると推定される。
There are various possible causes for this passivation, but one of the phenomena is that copper sulfate crystals are often deposited on the surface of the copper anode.
Various factors can be considered as factors for forming copper sulfate crystals. For example, the temperature of the electrolyte drops, the diffusion on the anode surface is insufficient due to insufficient convection of the electrolyte in the electrolytic cell, the current density at the anode increases, the copper ion concentration in the electrolyte increases excessively, or in the electrolyte. There is also an increase in the concentration of free sulfate ions in the copper anode, an increase in impurities contained in the copper anode, and a densification of the structure of the anode slime layer adhering to the surface of the copper anode.
It is presumed that these are complexly entangled and the copper eluted from the anode is restricted from diffusing into the electrolytic solution as ions, resulting in supersaturation and precipitation of copper sulfate crystals to form a passivation film.

不動態化を発生させないための対策として様々な方法が提案されている。しかし、不動態化が発生し難くなる条件に電解条件を緩和する方法は、時として生産性が低下する方向と同じであることも多く、あまり好ましい方法でなく工業的には制約も多い。
例えば、電流密度を下げると不動態化は発生しづらくなるが、一方で時間当たりの銅生産量が低下するために生産性が低下する。また、銅アノード中の不純物品位を低減すると不動態化は発生しにくくなるが、一方で不純物品位を低減しようとしても原料の鉱石事情や経済性から制約がある。
このように、実際の生産現場において不動態化の影響を避けるために取り得る手段には限りがあり、不動態化の発生を完全に抑えることは容易でなかった。
Various methods have been proposed as measures to prevent passivation. However, the method of relaxing the electrolysis conditions under the condition that passivation is less likely to occur is often the same as the direction in which the productivity decreases, which is not a very preferable method and there are many industrial restrictions.
For example, when the current density is lowered, passivation is less likely to occur, but on the other hand, the productivity is lowered because the amount of copper produced per hour is lowered. Further, if the impurity grade in the copper anode is reduced, passivation is less likely to occur, but on the other hand, even if the impurity grade is reduced, there are restrictions due to the ore situation and economic efficiency of the raw material.
As described above, the measures that can be taken to avoid the influence of passivation at the actual production site are limited, and it has not been easy to completely suppress the occurrence of passivation.

一方、発生した不動態化皮膜を除去して影響を回避する対策も存在する。例えば電解槽からアノードを引き揚げたり電解槽から電解液を一時的に抜き、アノード表面に水を噴射したりブラシ掛け等で物理的に剥ぎ取ったりする方法や、一度に大きな電流を流して剥離させる方法等がある。しかし前者は大きな手間を要し、後者は剥ぎ取られた不動態化皮膜がカソードに巻き込まれ、製品の電気銅中の不純物品位を増加させるという問題がある。
そのため、不動態化の発生を予知し、不動態化皮膜が生成する前に対策を取ることが望まれてきた。
On the other hand, there are also measures to avoid the influence by removing the generated passivation film. For example, the anode can be lifted from the electrolytic cell, the electrolytic solution can be temporarily removed from the electrolytic cell, and water can be sprayed onto the surface of the anode or physically peeled off by brushing, or a large current can be applied at one time to peel off the anode. There are methods and so on. However, the former requires a great deal of labor, and the latter has a problem that the stripped passivation film is caught in the cathode and increases the impurity grade in the electrolytic copper of the product.
Therefore, it has been desired to predict the occurrence of passivation and take measures before the passivation film is formed.

工業的な銅の電解精製では、一定の電流密度、いわゆる定電流法で通電される。不動態化が発生すると、電流が流れ難くなるため、同じ電流を流そうとして大きな電圧を加えるように制御される。そこで、電解槽の電圧(槽電圧)を測定することで不動態化皮膜の発生を検知することが行われてきた。 In industrial copper electrorefining, electricity is applied by a constant current density, the so-called constant current method. When passivation occurs, it becomes difficult for current to flow, so it is controlled to apply a large voltage in an attempt to pass the same current. Therefore, it has been practiced to detect the occurrence of a passivation film by measuring the voltage of the electrolytic cell (tank voltage).

しかし、不動態化が発生した場合、槽電圧の上昇は、経過時間に対して指数関数的であり、急激に上昇する。このため槽電圧の上昇を検知しても対策が追い付かず、不動態化を発生させてしまうことが多い。
具体的には、1回の電解精製は通常、1週間から10日間前後の日数を掛けて実施されるが、電圧の上昇が確認されるのは4日目以降に多く、確認された時点から1日ないしは数時間で本格的に不動態化してしまうことから、種々の対策を実施しても効果を確認する以前に不動態化が発生する結果となっていた。
However, when passivation occurs, the rise in tank voltage is exponential with respect to elapsed time and rises sharply. Therefore, even if an increase in the tank voltage is detected, the countermeasures cannot catch up and passivation often occurs.
Specifically, one electrolytic refining is usually carried out over a period of about 1 week to 10 days, but an increase in voltage is often confirmed after the 4th day, and from the time when it is confirmed. Since the passivation occurs in earnest in one day or several hours, even if various measures are taken, the passivation occurs before the effect is confirmed.

そこで、生産現場の実電解槽ではなく、別にビーカーレベルの小型電解槽を設置し、電気化学的な手法を用いて不動態化の発生や、発生した不動態化皮膜の特性について評価する方法が試みられてきた。
例えば、特許文献1に見られるような方法は、アノード電位を浸漬電位より50mVから200mV貴な電位となる様に電圧を印加し、電流値が急激に増加する時間を測定することでステンレス表面に生成する不動態化皮膜の安定性を評価する方法である。
このような手法を用いて、銅電解精製でのアノード不動態化の発生を予測することも可能と考えられる。
Therefore, instead of the actual electrolytic cell at the production site, a small beaker-level electrolytic cell is installed separately, and the occurrence of passivation and the characteristics of the generated passivation film are evaluated using an electrochemical method. It has been tried.
For example, in the method as seen in Patent Document 1, a voltage is applied so that the anode potential is 50 mV to 200 mV noble than the immersion potential, and the time during which the current value rapidly increases is measured on the stainless steel surface. This is a method for evaluating the stability of the resulting passivation film.
Using such a method, it is possible to predict the occurrence of anode passivation in copper electrorefining.

銅電解精製でのアノードの不動態化を予測しようとする場合、アノード表面への不動態化皮膜の生成に伴う電流値の急激な低下を測定する必要がある。しかし、このような手法を使用する場合、実際に不動態化が発生する時間まで待たなければならず、生産現場での電圧測定と大きな違いがないばかりか、電解中に銅アノード表面に生成したアノードスライム層が何らかの影響で剥離してしまった場合、銅アノードの溶解が阻害されないこととなり、実際の生産現場と齟齬が生じる恐れがある。実際の生産現場においては、アノードスライム層が剥離するか否かは定かではなく、剥離しない場合を想定して対策を取る必要がある。 When trying to predict the passivation of the anode in copper electrorefining, it is necessary to measure the sharp decrease in the current value due to the formation of the passivation film on the anode surface. However, when using such a method, it is necessary to wait until the time when the passivation actually occurs, which is not much different from the voltage measurement at the production site, and is generated on the copper anode surface during electrolysis. If the anode slime layer is peeled off for some reason, the dissolution of the copper anode will not be hindered, which may cause a discrepancy with the actual production site. At the actual production site, it is uncertain whether or not the anode slime layer will peel off, and it is necessary to take measures assuming that the anode slime layer does not peel off.

また、例えば、特許文献2に見られるような方法は、アノード電位を貴な方向に掃引し、不動態化皮膜を形成させ、ある電位まで上昇させたところから、アノード電位を卑な方向に掃引し直すことで、こちらもステンレス表面の不動態化皮膜の安定度を測定する手法を用いる。
特許文献2の方法では、銅電解精製でのアノードの不動態化を予測する場合、図1に示すようなアノード分極曲線の各値を測定し評価する。
具体的には、電位を走査して流れる電流すなわち電流密度を測定し、不動態化皮膜を形成し始めてそれ以上電流が流れなくなる電流密度(以下「臨界不動態化電流密度」とも称する)とその電流密度に対応する電位(以下「不動態化電位」とも称する)、不動態化皮膜を形成し電位を走査しても電流が流れなくなる際の電流密度(以下「不動態保持電流密度」とも称する)等の数値が高い値であるほど、不動態化皮膜が形成し難い状態であると推測できる。
Further, for example, in the method as seen in Patent Document 2, the anode potential is swept in a noble direction, a passivation film is formed, and the anode potential is swept in a low direction from a place where the anode potential is raised to a certain potential. By re-doing, this also uses the method of measuring the stability of the passivation film on the stainless steel surface.
In the method of Patent Document 2, when predicting the passivation of the anode in copper electrorefining, each value of the anode polarization curve as shown in FIG. 1 is measured and evaluated.
Specifically, the current density that flows by scanning the potential, that is, the current density is measured, and the current density (hereinafter, also referred to as "critical passivation current density") that starts to form a passivation film and no more current flows. The potential corresponding to the current density (hereinafter also referred to as "passivation potential"), the current density when the current does not flow even if the passivation film is formed and the potential is scanned (hereinafter also referred to as "passivation holding current density"). It can be inferred that the higher the value such as) is, the more difficult it is for the passivation film to be formed.

しかしながら、上記のようなアノード分極曲線の測定では、銅アノード表面にはアノードスライム層がほとんど形成されない状態から測定を開始して不動態化を発生させるため、不動態化皮膜の生成に大きな影響を及ぼすと考えられるアノードスライム層の影響を除外しての不動態化の発生予測となり、実操業の管理に適用するには精度や検出時間等に大きな課題があった。
これらのことから、アノードスライム層の影響を加味した上で、かつ短時間に銅アノード不動態化の発生について予想できる方法が望まれていた。
However, in the measurement of the anode polarization curve as described above, since the measurement is started from the state where the anode slime layer is hardly formed on the surface of the copper anode and the passivation occurs, it has a great influence on the formation of the passivation film. The occurrence of passivation was predicted by excluding the influence of the anode slime layer, which is thought to have an effect, and there were major problems in accuracy and detection time when applied to the management of actual operations.
From these facts, a method that can predict the occurrence of copper anode passivation in a short time while taking into account the influence of the anode slime layer has been desired.

特許5830910号公報Japanese Patent No. 5830910 特開平7−225217号公報Japanese Unexamined Patent Publication No. 7-225217

本発明は、銅の電解精製において、操業時における短時間の銅アノード不動態化の発生について、その不動態化の予想を行い、不動態化を防止することで、その銅電解精製の操業を,円滑に効率良く行う操業方法を提供するものである。 The present invention predicts the occurrence of short-time copper anode passivation during operation in copper electrorefining, and prevents the passivation to prevent the copper electrorefining operation. , It provides a smooth and efficient operation method.

上記の課題を解決するための、本発明の第1の発明は、銅の製錬工程で得た粗銅をアノードに用い、定電流法による電解処理に付し、前記アノードの表面にアノードスライム層を形成、付着させ、次いで、前記アノードスライム層が前記アノードの表面に付着した状態で、前記アノードを作用極とした電位掃引法による電気化学測定に付し、前記電気化学測定により得られた臨界不動態化電流密度の値(Ys)が、予め求めてある下記(1)式に示す関係式により算出された電流密度の値(y)よりも小さな(Ys)<(y)の関係にある場合には、前記アノード表面の不動態化が発生すると予測することを特徴とする銅電解精製の操業方法である。 In the first invention of the present invention for solving the above problems, blister copper obtained in a copper smelting step is used as an anode and subjected to electrolytic treatment by a constant current method, and an anode slime layer is applied to the surface of the anode. Then, with the anode slime layer attached to the surface of the anode, the anode was subjected to an electrochemical measurement by a potential sweep method using the anode as a working electrode, and the criticality obtained by the electrochemical measurement was performed. The demobilization current density value (Ys) has a relationship of (Ys) <(y) smaller than the current density value (y) calculated in advance by the relational expression shown in the following equation (1). In some cases, it is a method of operating copper electrolytic purification, which is characterized in that immobilization of the anode surface is predicted to occur.

本発明の第2の発明は、第1の発明におけるアノードの表面に形成させるアノードスライム層の厚みが、アノードを400μm以上、2000μm以下の範囲の深さとなるように定電流法で電解した際に形成するアノードスライム層の厚み、であることを特徴とする銅電解精製の操業方法である。 The second invention of the present invention is the case where the anode is electrolyzed by the constant current method so that the thickness of the anode slime layer formed on the surface of the anode in the first invention is in the range of 400 μm or more and 2000 μm or less. It is an operation method of copper electrorefining characterized in that it is the thickness of the anode slime layer to be formed.

本発明の第3の発明は、第1及び第2の発明におけるアノードの表面にアノードスライム層を形成、付着させる際のアノード電流密度が、300A/m以上、1200A/m以下の範囲であることを特徴とする銅電解精製の操業方法である。 In the third invention of the present invention, the anode current density when forming and adhering the anode slime layer on the surface of the anode in the first and second inventions is in the range of 300 A / m 2 or more and 1200 A / m 2 or less. It is an operation method of copper electrolytic refining characterized by being present.

本発明の第4の発明は、第1から第3の発明におけるアノードの表面にアノードスライム層を形成させる定電流法による電解が、3時間以上、12時間以下の範囲の時間で行われることを特徴とする銅電解精製の操業方法である。 According to the fourth aspect of the present invention, electrolysis by the constant current method for forming an anode slime layer on the surface of the anode in the first to third inventions is carried out in a time range of 3 hours or more and 12 hours or less. This is a characteristic copper electrolytic refining operation method.

Figure 0006877007
Figure 0006877007

本発明を用いることで、短時間の銅電解精製での不動態化の発生を予測でき、実操業に生かすことで工業上顕著な効果を奏するものである。 By using the present invention, it is possible to predict the occurrence of passivation in short-time copper electrorefining, and by utilizing it in actual operations, it will have a remarkable industrial effect.

不動態化を示す一般的アノード分極曲線における臨界不動態化電流密度、不動態化電位、不動態保持電流密度の値を示した図である。It is a figure which showed the value of the critical passivation current density, the passivation potential, and the passivation holding current density in the general anodic polarization curve which shows passivation. 閾値設定のために、種々の条件において、銅アノードの溶解深さと臨界不動態化電流密度の値をプロットした図である。It is a figure which plotted the value of the dissolution depth and the critical passivation current density of a copper anode under various conditions for setting a threshold value. 閾値設定にて設定された式(直線)と、実施例1と比較例1にて測定された臨界不動態化電流密度値の位置関係を比較した図である。It is a figure which compared the positional relationship of the formula (straight line) set by the threshold setting, and the critical passivation current density value measured in Example 1 and Comparative Example 1.

本発明者らは、銅の電解精製を行う際に、予め種々の電解条件で通電して、アノードの溶解深さが一定の値となるように電解し、アノード表面にアノードスライム層を形成、付着させた後に、アノード表面にアノードスライム層が付着した状態で、アノード電位を貴な方向に掃引することで、特性項目として、臨界不動態化電流密度、不動態化電位、不動態保持電流密度のいずれかを測定し、アノード表面に「不動態化が起こる場合」と、「不動態化が起こらない場合」の閾値を把握、設定しておき、不動態化が起こるか否かを判断したい操業条件において、その臨界不動態化電流密度、不動態化電位、不動態保持電流密度のいずれかの閾値と同じ特性項目を測定し、先に設定していた閾値との大小を比較することで、その操業条件にてアノードの表面が不動態化するか否かを判断することが出来ることを見出し、本発明を完成させるに至った。 When electrolytically purifying copper, the present inventors energize in advance under various electrolytic conditions to electrolyze the anode so that the dissolution depth becomes a constant value, and form an anode slime layer on the anode surface. After adhering, by sweeping the anode potential in the noble direction with the anode slime layer attached to the anode surface, the characteristic items are critical passivation current density, passivation potential, and passivation holding current density. I want to measure either of the above, grasp and set the thresholds of "when passivation occurs" and "when passivation does not occur" on the anode surface, and judge whether or not passivation occurs. By measuring the same characteristic items as the threshold of any of the critical passivation current density, passivation potential, and passivation holding current density under the operating conditions, and comparing the magnitude with the previously set threshold. , It has been found that it is possible to determine whether or not the surface of the anode is passivated under the operating conditions, and the present invention has been completed.

以下、本発明の具体的な内容を詳細に説明する。
1.種々の電解条件における不動態化の有無確認
実際の生産現場にて実施される可能性のある種々の電解条件にて、小型の電解槽を用いて実際に電解精製を実施し、不動態化するか否かを確認する。
Hereinafter, the specific contents of the present invention will be described in detail.
1. 1. Confirmation of presence / absence of passivation under various electrolysis conditions Under various electrolysis conditions that may be carried out at the actual production site, electrorefining is actually carried out using a small electrolytic cell to passivate. Check if it is.

2.閾値の設定
種々の電解条件にて電解精製を行い、不動態化した場合と不動態化しなかった場合に場合分けし、銅アノードの溶解深さが一定の値となるよう電解し、銅アノード表面にアノードスライム層を形成、付着させた後に、アノード電位を貴な方向に掃引することで、それらの臨界不動態化電流密度、もしくは不動態化電位、もしくは不動態保持電流密度といった不動態化の発生に大きな関係のある値を測定し整理することで、不動態化する場合と不動態化しない場合の閾値を設定する。
2. Setting the threshold The electrolytic purification is performed under various electrolytic conditions, and the passivation case and the non-passivation case are classified, and the copper anode surface is electrolyzed so that the dissolution depth of the copper anode becomes a constant value. After forming and adhering an anode slime layer to the body, by sweeping the anode potential in a noble direction, the passivation current density, passivation potential, or passivation holding current density of them can be achieved. By measuring and organizing the values that are closely related to the occurrence, the thresholds for passivation and non-passivation are set.

3.対象の電解条件における不動態化発生の予想判断
電解精製を実施した場合に、不動態化が発生するか否かを予想したい条件について、銅アノードの溶解深さが一定の値となるよう電解し、銅アノード表面にアノードスライム層を形成,付着させた後に、アノード電位を貴な方向に掃引することで、臨界不動態化電流密度、不動態化電位、及び不動態保持電流密度といった不動態化の発生に大きな関係のある値を測定し、「2.閾値の設定」にて得られた閾値との大小を比較することで、実際にその条件にて電解精製を実施した場合に不動態化が発生するか否かを予想する。
実際には予想するだけでなく、不動態化の発生が予想されるような場合は、生産現場において不動態化を発生させないための対策を取る。
3. 3. Judgment of prediction of passivation occurrence under the target electrolytic conditions Electrolysis is performed so that the dissolution depth of the copper anode becomes a constant value under the conditions for which it is desired to predict whether or not passivation will occur when electrolytic purification is performed. After forming and adhering an anode slime layer on the surface of the copper anode, the anode potential is swept in the noble direction to passivate the critical passivation current density, passivation potential, and passivation holding current density. By measuring the value that has a great relationship with the occurrence of the above and comparing the magnitude with the threshold obtained in "2. Setting the threshold", passivation occurs when electrolytic purification is actually performed under that condition. Predict whether or not will occur.
In addition to actually predicting, if passivation is expected to occur, take measures to prevent passivation at the production site.

以下、本発明の実施例を示し、さらに詳細に説明する。
[閾値設定]
先ず、組成の異なる表1に示す6種類の組成を持つ銅アノード(A,B,C,D,E,F)と、表2に示す5種類の組成の電解液(α,β,γ,δ,ζ)を用意した。
Hereinafter, examples of the present invention will be shown and described in more detail.
[Threshold setting]
First, a copper anode (A, B, C, D, E, F) having six different compositions shown in Table 1 and an electrolytic solution (α, β, γ,) having five different compositions shown in Table 2 are used. δ, ζ) were prepared.

上記のA〜Fの銅アノードは、純度99.99%の電気銅を切断し、炉に入れて1150℃に加熱して熔融し、その中に表1に示す組成になるように酸素以外の各不純物をメタルの形態で添加し合金とした。また、酸素については空気を前記熔融状態の合金を撹拌しながら中に吹き込むことで表1の組成に調整した。 The copper anodes A to F described above are made by cutting electrolytic copper having a purity of 99.99%, placing it in a furnace, heating it to 1150 ° C. to melt it, and using other than oxygen so as to have the composition shown in Table 1. Each impurity was added in the form of metal to form an alloy. The composition of oxygen was adjusted to the composition shown in Table 1 by blowing air into the molten alloy while stirring the alloy.

炉内で加熱して熔融状態で空気を吹き込み後、空冷し、得た合金を電極面積が2×2cmのサイズになるようにマスキングテープを用いて電気的に絶縁した。表1に銅アノード組成を示す。
カソードは厚み約1mmの銅の薄板を切断し、電極面積が2×2cmになるようにマスキングテープでマスキングした。
After heating in a furnace and blowing air in a molten state, the alloy was air-cooled, and the obtained alloy was electrically insulated with masking tape so that the electrode area had a size of 2 × 2 cm. Table 1 shows the copper anode composition.
For the cathode, a thin copper plate having a thickness of about 1 mm was cut and masked with masking tape so that the electrode area was 2 × 2 cm.

また、電解液(α,β,γ,δ,ζ)は、硫酸銅5水和物、硫酸ニッケル6水和物、亜ヒ酸、濃度98重量%硫酸およびイオン交換水を混合し作製した。表2に電解液組成を示す。 The electrolytic solution (α, β, γ, δ, ζ) was prepared by mixing copper sulfate pentahydrate, nickel sulfate hexahydrate, arphoic acid, sulfuric acid having a concentration of 98% by weight, and ion-exchanged water. Table 2 shows the composition of the electrolytic solution.

Figure 0006877007
Figure 0006877007

Figure 0006877007
Figure 0006877007

表1および表2に示す組成のアノードと電解液とを組み合わせ、電解時間等の電解条件については実際の生産現場と同様にして電気分解を行い、どの組み合わせで不動態化が発生するかを確認した。
具体的には、容量0.5リットルのガラスビーカー中にアノードとカソードを1枚つ、20mmの面間距離を保持するように電極部分を対面させて入れ、電解液の温度を60℃に維持しながら、撹拌した。
Combine the anode and electrolyte with the compositions shown in Tables 1 and 2, and perform electrolysis in the same manner as at the actual production site for electrolytic conditions such as electrolytic time, and confirm which combination causes passivation. did.
Specifically, One not a single anode and cathode in a glass beaker 0.5 liters, put the electrode portion is faced to retain the interplanar distance of 20 mm, the temperature of the electrolytic solution 60 ° C. Stirred while maintaining.

表3に示すアノードA、B、C、Dと電解液α、β、γの12通りの組み合わせで、600A/mの電流密度で12時間電解し、銅アノードを深さ方向に約1000μm溶解させ、アノードスライム層を銅アノード表面に生成させた。
その後、アノードスライムがアノード表面に付着した状態のままで、アノード電位を0.34V(vs.NHE)から1mV/secの掃引速度によって11分間、貴な方向に掃引する電気化学測定を行い、臨界不動態化電流密度を測定した。
表3に示した12通りの組み合わせで測定した臨界不動態化電流密度は、表4に示す結果が得られた。
Electrolysis is performed at a current density of 600 A / m 2 for 12 hours with 12 combinations of anodes A, B, C and D shown in Table 3 and electrolytes α, β and γ to dissolve the copper anode by about 1000 μm in the depth direction. The anode slime layer was formed on the surface of the copper anode.
After that, with the anode slime still attached to the anode surface, an electrochemical measurement was performed in which the anode potential was swept from 0.34 V (vs. NHE) at a sweep rate of 1 mV / sec for 11 minutes in a noble direction, and the criticality was measured. The passivation current density was measured.
The results shown in Table 4 were obtained for the critical passivation current densities measured with the 12 combinations shown in Table 3.

Figure 0006877007
Figure 0006877007

Figure 0006877007
Figure 0006877007

その結果、表3で「レ」が入った組み合わせにおいて、不動態化の発生が見られ、表4の臨界不動態化電流密度の結果では、斜体数字で示された組み合わせで不動態化の発生が観察された。
本実施例においては、アノードの溶解は、絶縁性テープの被覆により一定方向からのみとなっているため、不純物を含むとは言いながら大部分が銅であるアノードの比重を、純銅と同様の8.96と仮定すると、通電量に対する溶解深さは、銅が2価のイオンとして溶解することから、600A/mの電流密度で12時間通電した際は、下記のように計算され、952μmの深さになる。
600[A/m]×12[h]/26.8[A・h/mol]×63.5/2[g/mol]/(8.96×10)[g/m]=952[μm]
As a result, the occurrence of passivation was observed in the combination with "re" in Table 3, and in the result of the critical immobilization current density in Table 4, the occurrence of passivation occurred in the combination indicated by italicized numbers. Was observed.
In this embodiment, since the anode is dissolved only from a certain direction by coating with an insulating tape, the specific gravity of the anode, which is mostly copper although it contains impurities, is the same as that of pure copper8. Assuming .96, the dissolution depth with respect to the energized amount is calculated as follows when energized for 12 hours at a current density of 600 A / m 2 because copper dissolves as divalent ions, and is 952 μm. Become the depth.
600 [A / m 2] × 12 [h] /26.8 [A · h / mol] × 63.5 / 2 [g / mol] / (8.96 × 10 6) [g / m 3] = 952 [μm]

次に、同じく電解液とアノード組成の12通りの組み合わせを用い、600A/mの電流密度で6時間電解して銅アノードを深さ方向に約500μm溶解させて、アノードスライム層を銅アノード表面に生成させた。その後、アノード電位を0.34Vvs.NHEから1mV/secの掃引速度で11分間、貴な方向に掃引して、臨界不動態化電流密度を測定した。
その測定結果を表5に示す。
Next, using 12 combinations of the electrolytic solution and the anode composition, electrolysis was performed at a current density of 600 A / m 2 for 6 hours to dissolve the copper anode by about 500 μm in the depth direction, and the anode slime layer was formed on the surface of the copper anode. Was generated. After that, the anode potential was set to 0.34 Vvs. The critical immobilization current density was measured by sweeping in the noble direction for 11 minutes at a sweep rate of 1 mV / sec from NHE.
The measurement results are shown in Table 5.

Figure 0006877007
Figure 0006877007

表5で斜体数字になっている部分が、不動態化が発生した場合となる。
表4における「銅アノードの溶解深さが約1000μmの場合」と比較すると、全体的に高い電流密度値となった。
この結果からアノードスライム層の厚みが増加するのに伴い、不動態化が発生しやすくなることがわかる。
The part in italics in Table 5 is the case where passivation occurs.
Compared with “when the dissolution depth of the copper anode is about 1000 μm” in Table 4, the current density value was higher overall.
From this result, it can be seen that as the thickness of the anode slime layer increases, passivation is likely to occur.

表4及び表5での各電流密度の値について、不動態化の発生有無を分類し、図2の横軸に溶解させた銅アノードの深さ、縦軸に臨界不動態化電流密度との関係をプロットした。
図2において、銅アノードを約500μm溶解させたが不動態化しなかった点と、銅アノードを約1000μm溶解させたが不動態化しなかった場合の点を結ぶと、「y=−0.47x+3100」という関係式が得られた。
For each current density value in Tables 4 and 5, the presence or absence of passivation is classified, and the horizontal axis of FIG. 2 is the depth of the dissolved copper anode, and the vertical axis is the critical passivation current density. The relationship was plotted.
In FIG. 2, connecting the point where the copper anode was dissolved by about 500 μm but not passivated and the point where the copper anode was dissolved by about 1000 μm but not passivated were connected, “y = −0.47x + 3100”. The relational expression was obtained.

即ち、不動態化が発生するか否かを判断したい条件について、アノードスライム層を銅アノード表面に形成、付着させた後に、アノード電位を貴な方向に掃引することで、臨界不動態化電流密度を測定し、臨界不動態化電流密度の値(Y)が、(y)=−0.47x+3100にアノードの溶解深さを代入した値と比較して、その大小を評価することで、実際の生産現場で銅の電解精製を実施した際に、不動態化が発生するか否かを判断することが出来る。 That is, for the condition for determining whether or not passivation occurs, the anode slime layer is formed and adhered to the surface of the copper anode, and then the anode potential is swept in the noble direction to obtain the critical passivation current density. the measured value of the critical passivation current density (Y S) is, (y) = - compared to the value obtained by substituting the dissolved depth of the anode to 0.47x + 3100, to evaluate its magnitude, the actual It is possible to determine whether or not passivation occurs when electrolytic purification of copper is carried out at the production site of.

銅アノード表面に剥離しないアノードスライム層を形成させる場合、溶解させる銅アノードの深さが、2000μmを超える深さまで深くすると、アノードスライム層が剥離しやすくなる。一方、400μm未満の深さでは、アノードスライム層が薄くしか形成しないため、アノードスライム層の影響を反映できないことになる。
すなわち、400μm以上の深さとする必要がある。
When forming an anode slime layer that does not peel off on the surface of the copper anode, if the depth of the copper anode to be dissolved is deepened to a depth of more than 2000 μm, the anode slime layer is likely to peel off. On the other hand, at a depth of less than 400 μm, the anode slime layer is formed only thinly, so that the influence of the anode slime layer cannot be reflected.
That is, the depth needs to be 400 μm or more.

また、アノード電流密度値が1200A/mを超えると、アノードスライム層が剥離しやすくなる。さらには、アノードスライム層の形成途中で不動態化が発生しまうため、アノードの電流密度は1200A/m以下とする必要がある。一方、アノードの電流密度が300A/m未満と低すぎると、アノードスライム層を形成させるのに長い時間が必要となるため、効率的ではない。 Further, when the anode current density value exceeds 1200 A / m 2 , the anode slime layer is likely to be peeled off. Furthermore, since passivation occurs during the formation of the anode slime layer, the current density of the anode needs to be 1200 A / m 2 or less. On the other hand, if the current density of the anode is too low, less than 300 A / m 2 , it is not efficient because it takes a long time to form the anode slime layer.

上記表1に示した銅アノードEおよび表2に示した電解液γを用いて、600A/mの電流密度で12時間電解して銅アノードを深さ方向に約1000μm溶解させ、アノードスライム層を銅アノード表面に形成、付着させた。
次いでアノード電位を貴な方向に掃引して臨界不動態化電流密度を測定した。臨界不動態化電流密度値は、(Y)=2930A/mだった。
Using the copper anode E shown in Table 1 and the electrolytic solution γ shown in Table 2, electrolysis was performed at a current density of 600 A / m 2 for 12 hours to dissolve the copper anode by about 1000 μm in the depth direction, and the anode slime layer was used. Was formed and adhered to the surface of the copper anode.
The anode potential was then swept in the noble direction to measure the critical passivation current density. The critical passivation current density value was (Y S) = 2930A / m 2.

上述の「閾値設定」により得た「式:(y)=−0.47x+3100」に、上記の溶解深さ1000μmを代入すると、(y)は2630A/mとなった。
この(y)値と上記の臨界不動態化電流密度(Y)=2930A/mとを比較すると、実際に得た(Y)=2930A/mの方が、式から得た(y)=2630A/mよりも大きい。
本実施例と同組成のアノードと電解液を用いて実際の生産現場で電解精製したところ、不動態化は発生せず安定して操業できた。
つまり「溶解深さ」から算出した式の(y)値よりも、実際に測定した臨界不動態化電流密度の値が大きい方が、不動態化が生じないことが確かめられた。
Substituting the above-mentioned dissolution depth of 1000 μm into the “formula: (y) = −0.47x + 3100” obtained by the above-mentioned “threshold setting”, (y) became 2630 A / m 2 .
Comparing this (y) value with the above-mentioned critical passivation current density (Y S ) = 2930 A / m 2 , the actually obtained (Y S ) = 2930 A / m 2 was obtained from the equation (Y S) = 2930 A / m 2. y) = greater than 2630 A / m 2.
When electrolytic refining was performed at an actual production site using an anode and an electrolytic solution having the same composition as in this example, passivation did not occur and stable operation was possible.
That is, it was confirmed that the passivation did not occur when the value of the critically mobilized current density actually measured was larger than the value (y) of the formula calculated from the "dissolution depth".

(比較例1)
表1の銅アノードFおよび表2の電解液ζを用いて、600A/mの電流密度で12時間電解し、銅アノードを深さ方向に1000μm溶解させ、アノードスライム層をアノード表面に生成させた。その後、アノード電位を貴な方向に掃引することで、臨界不動態化電流密度を測定した。その際の臨界不動態化電流密度値は、(Y)=2350A/mであった。
(Comparative Example 1)
Using the copper anode F in Table 1 and the electrolyte ζ in Table 2, electrolysis was performed at a current density of 600 A / m 2 for 12 hours to dissolve the copper anode by 1000 μm in the depth direction to form an anode slime layer on the anode surface. It was. Then, the critical mobilization current density was measured by sweeping the anode potential in the noble direction. The critical passivation current density value at this time was (Y S) = 2350A / m 2.

実施例1と同様に、「閾値設定」により得られた「式(y)=−0.47x+3100」に上記の溶解深さを代入すると、(y)=2630A/mとなる。
これと上記で測定した臨界不動態化電流密度値(Y)=2350A/mを比較すると、実際に得られた(Y)=2350A/mの方が、式から得られた(y)=2630A/mよりも小さな値である。
そこで、実際に銅の電解精製を実施すると、不動態化が発生した。
Substituting the above dissolution depth into the “formula (y) = −0.47x + 3100” obtained by “threshold setting” in the same manner as in Example 1, (y) = 2630A / m 2 .
Comparing this with the critical passivation current density value (Y S ) = 2350 A / m 2 measured above, the actually obtained (Y S ) = 2350 A / m 2 was obtained from the equation (Y S) = 2350 A / m 2. y) = a value smaller than 2630 A / m 2.
Therefore, when copper was actually electrorefined, passivation occurred.

ここで、図3に「閾値設定」から得られた「式(y)=−0.47x+3100」と、実施例1および比較例1にて測定された臨界不動態化電流密度値との関係を示すと、閾値の直線よりも上方に臨界不動態化電流密度が位置する場合は、不動態化が発生せず、一方、下方に位置すると、不動態化が発生することがわかり、この式を利用することで不動態化の発生が予測できることが確かめられた。 Here, FIG. 3 shows the relationship between the “formula (y) = −0.47x + 3100” obtained from the “threshold setting” and the critical passivation current density values measured in Example 1 and Comparative Example 1. It is shown that if the critical passivation current density is located above the threshold straight line, no passivation occurs, while if it is below the threshold line, passivation occurs. It was confirmed that the occurrence of passivation can be predicted by using it.

Claims (4)

銅の製錬工程で得た粗銅をアノードに用い、定電流法による電解処理に付し、前記アノードの表面にアノードスライム層を形成、付着させ、
次いで、前記アノードスライム層が前記アノードの表面に付着した状態で、前記アノードを作用極とした電位掃引法による電気化学測定に付し、
前記電気化学測定により得られた臨界不動態化電流密度の値(Ys)が、予め求めてある下記(1)式に示す関係式より算出された電流密度の値(y)よりも小さな(Ys)<(y)の関係にある場合には、前記アノード表面の不動態化が発生すると予測することを特徴とする銅電解精製の操業方法である。
Figure 0006877007
The blister copper obtained in the copper smelting process is used as the anode and subjected to electrolytic treatment by the constant current method to form and adhere an anode slime layer to the surface of the anode.
Next, with the anode slime layer adhering to the surface of the anode, the anode is subjected to an electrochemical measurement by a potential sweep method using the anode as a working electrode.
The electrochemical values of the critical passivation current density obtained by the measurement (Ys) is obtained in advance by Aru following (1) the value of the current density calculated from the equation shown in equation (y) smaller than (Ys ) <(Y), it is an operation method of copper electrolytic purification characterized in that the passivation of the anode surface is predicted to occur.
Figure 0006877007
前記アノードの表面に形成させるアノードスライム層の厚みが、アノードを400μm以上、2000μm以下の範囲の深さとなるように定電流法で電解した際に形成するアノードスライム層の厚み、であることを特徴とする請求項1に記載の銅電解精製の操業方法。 The thickness of the anode slime layer formed on the surface of the anode is the thickness of the anode slime layer formed when the anode is electrolyzed by a constant current method so as to have a depth in the range of 400 μm or more and 2000 μm or less. The method for operating copper electrorefining according to claim 1. アノードの表面にアノードスライム層を形成、付着させる際のアノード電流密度が、300A/m以上、1200A/m以下の範囲であることを特徴とする請求項1又は2に記載の銅電解精製の操業方法。 The copper electrorefining according to claim 1 or 2, wherein the anode current density at the time of forming and adhering the anode slime layer on the surface of the anode is in the range of 300 A / m 2 or more and 1200 A / m 2 or less. Operation method. アノードの表面にアノードスライム層を形成させる定電流法による電解が、3時間以上、12時間以下の範囲の時間で行われることを特徴とする請求項1から3のいずれか1項に記載の銅電解精製の操業方法。 The copper according to any one of claims 1 to 3, wherein electrolysis by a constant current method for forming an anode slime layer on the surface of the anode is performed for a time in the range of 3 hours or more and 12 hours or less. Operation method of electrolytic refining.
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