JP6882155B2 - Suction nozzle and suction nozzle assembly - Google Patents

Description

The present disclosure relates to a suction nozzle and a suction nozzle assembly.

Conventionally, a suction nozzle assembly mounted on an electronic component transporter has been used to transport chip-shaped electronic components such as semiconductor elements, capacitors, and resistors. The suction nozzle assembly is a combination of a suction nozzle and a flange.

Here, the suction nozzle is provided with a suction hole for sucking the electronic component on the suction surface for sucking the electronic component (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-21542

In recent years, as the miniaturization of electronic components has progressed, it has been required to reduce the suction surface of the suction nozzle. Here, in order to make the suction surface smaller, it is necessary to make the tip portion having the suction surface thinner. However, with a thin tip, the mechanical strength is reduced and the tip is easily chipped.

The present disclosure has been devised in view of such circumstances, and an object of the present invention is to provide a suction nozzle and a suction nozzle assembly in which the tip portion is not easily chipped even if the tip portion is thin.

The suction nozzle of the present disclosure is made of ceramics and includes a tip portion having a suction surface and a main body portion connected to the tip portion. The tip portion includes the adsorption surface, extends toward the main body portion, and has a porosity of 10% or more and 90% or less, and a porosity that surrounds the porous region in the radial direction. It has a dense region of 3% or less.

Further, the suction nozzle assembly of the present disclosure includes the suction nozzle and a flange having a through hole.

The tip of the suction nozzle of the present disclosure is not easily chipped.

Further, the suction nozzle assembly of the present disclosure is highly reliable because it includes the suction nozzle.

It is a perspective view which shows an example of the suction nozzle of this disclosure. It is a vertical cross-sectional view which shows an example of the suction nozzle of this disclosure. It is sectional drawing in the line AA of FIG. It is a vertical cross-sectional view which shows the other example of the suction nozzle of this disclosure. It is a vertical cross-sectional view which shows the other example of the suction nozzle of this disclosure. It is a vertical cross-sectional view which shows an example of the suction nozzle assembly of this disclosure. It is the schematic of the electronic component mounting apparatus which mounts an electronic component by the electronic component carrier which mounted the suction nozzle assembly of the present disclosure.

The suction nozzle and the suction nozzle assembly of the present disclosure will be described in detail below with reference to the drawings.

As shown in FIGS. 1 and 2, the suction nozzle 10 of the present disclosure includes a tip portion 2 having a suction surface 1 and a main body portion 3 connected to the tip portion 2. Here, the tip portion 2 is, as shown in FIG. 2, a one-third portion on the suction surface 1 side when the suction nozzle 10 is divided into three equal parts in total length. On the other hand, the main body 3 is, as shown in FIG. 2, a two-thirds portion on the side away from the suction surface 1 when the suction nozzle 10 is divided into three equal parts. Is. In other words, the main body portion 3 is a portion of the suction nozzle 10 excluding the tip portion 2.

The suction nozzle 10 of the present disclosure is made of ceramics. Here, examples of the ceramics include zirconia ceramics, alumina ceramics, zirconia-alumina composite ceramics, and silicon carbide ceramics. Here, the zirconia ceramics are ceramics containing zirconia as a main component, and the same applies to the others. The main component is a component contained in an amount of 55% by mass or more out of 100% by mass of all the components constituting the ceramics.

The zirconia-alumina composite ceramic contains zirconia and alumina, and the total content of zirconia and alumina is 55% by mass or more. The zirconia-alumina composite ceramics may have a high content of alumina as well as a high content of zirconia.

In the suction nozzle 10 of the present disclosure, the tip portion 2 and the main body portion 3 may be made of different ceramics. To be composed of different ceramics means that, for example, the tip portion 2 is composed of zirconia ceramics and the main body 3 is composed of alumina ceramics.

Here, the material of the suction nozzle 10 can be confirmed by the following method. First, measurement is performed using an X-ray diffractometer (XRD), and the obtained 2θ (2θ is a diffraction angle) value is identified with a JCPDS card to identify the components of the tip 2 and the main body 3, respectively. To identify. Next, a quantitative analysis of the tip portion 2 and the main body portion 3 is performed using an ICP emission spectroscopic analyzer (ICP). At this time, if the component identified by XRD is zirconia and the value converted from the content of zirconium (Zr) measured by ICP to zirconia (ZrO ₂ ) is 55% by mass or more, it is zirconia ceramics. It should be noted that other ceramics can be confirmed by the same method.

Here, if the suction nozzle 10 is made of zirconia ceramics, the mechanical strength of the tip 2 can be increased even if the tip 2 including the suction surface 1 is made thin.

Further, when the zirconia ceramics contain a conductive component, static electricity can be removed even if the suction nozzle 10 is charged with static electricity, so that the electronic parts may be contaminated with dust or the like adhering to the suction nozzle 10 due to the static electricity. , It is possible to reduce the risk of disturbing the alignment of the electronic components that are lined up and causing the mounting position to shift. The resistance value of the zirconia ceramics containing a conductive component is, for example, 10 ³ Omega least 10 ¹¹ Omega below.

Here, examples of the conductive component include iron oxide, chromium oxide, titanium oxide, manganese oxide, nickel oxide and the like. When these conductive components are contained, the zirconia ceramics have a dark color tone. In general, many electronic components have a light color tone, and therefore, when the suction nozzle 10 has a dark color tone, a recognition error or malfunction is caused by the CCD camera and the image analysis device included in the electronic component mounting device described later. Can be reduced.

As shown in FIG. 2, the tip portion 2 of the suction nozzle 10 of the present disclosure includes the suction surface 1 and extends toward the main body portion 3, and has a porosity of 10% or more and 90% or less. And a dense region 5 having a porosity of 3% or less, which surrounds the porous region 4 in the radial direction.

Here, in the example shown in FIG. 2, since the suction holes 7 are connected to the porous region 4 and the porosity of the porous region 4 is large, it is possible to adsorb the electronic component on the adsorption surface 1. That is, the porous region 4 acts as a suction path. By satisfying such a configuration, at least a part of the suction hole 7 is replaced with the porous region 4 as compared with the case where the suction hole 7 is simply a hole up to the suction surface 1, so that the tip is The mechanical strength of the portion 2 is high, and the suction nozzle 10 of the present disclosure does not easily chip the tip portion 2 even if the tip portion 2 is thin.

Here, the boundary between the porous region 4 and the dense region 5 in the tip portion 2 is a photograph taken by photographing an arbitrary radial cross section of the tip portion 2 using a scanning electron microscope (SEM). It can be set visually depending on the size of the pores. Then, the porosity of the porous region 4 and the dense region 5 at the tip portion 2 may be measured by the following method. In each of the porous region 4 and the dense region 5 in the above photograph, for example, ^{for a range in which the area is about 10 μm 2} , the image analysis software “A image-kun” (registered trademark, manufactured by Asahi Kasei Engineering Co., Ltd.) By performing image analysis by applying a technique called particle analysis, the porosity of each of the porous region 4 and the dense region 5 can be calculated. Here, as the analysis conditions of the image analysis software "A image-kun", the brightness of the crystal particles is "dark", the binarization method is "manual", the small figure removal area is 0.03 μm, and the brightness of the image is shown. The threshold value as an index may be 80 or more and 120 or less.

Further, as shown in FIG. 3, the portion of the tip portion 2 of the suction nozzle 10 of the present disclosure having the porous region 4 has a cross-sectional area of the dense region 5 of A and the porous region 4 in the radial cross section. When the cross-sectional area is B, A / B may be 0.5 or more and 30 or less. If such a configuration is satisfied, the mechanical strength of the tip portion 2 is improved while maintaining the suction force, and the tip portion is less likely to be chipped. The thickness of the dense region 5 is, for example, 10 μm or more and 300 μm or less at the thinnest portion.

Here, the cross-sectional area A of the dense region 5 and the cross-sectional area B of the porous region 4 in the radial cross section are images after the dense region 5 and the porous region 4 are painted separately in the above-mentioned photograph. It may be calculated by measuring each area using analysis software.

Further, as shown in FIG. 4, the tip portion 2 of the suction nozzle 10 of the present disclosure may have a porous region 4 up to a position connected to the main body portion 3. If such a configuration is satisfied, the mechanical strength of the tip portion 2 is further improved.

Further, the main body 3 of the suction nozzle 10 of the present disclosure may have a suction surface 6 facing the suction surface 1, and the porous region 4 may extend from the suction surface 1 to the suction surface 6. If such a configuration is satisfied, the mechanical strength of the suction nozzle 10 of the present disclosure is improved by replacing all the suction holes 7 with the porous region 4.

Here, as shown in FIG. 5, the porous region 4 of the suction nozzle 10 of the present disclosure may have an increasing radial cross-sectional area from the suction surface 1 to the suction surface 6. Here, when the cross-sectional area of the porous region 4 increases, the cross-sectional area of the porous region 4 may be gradually increased from the suction surface 1 to the suction surface 6 or may be gradually increased. If such a configuration is satisfied, the suction nozzle 10 of the present disclosure further improves the suction force while maintaining the mechanical strength.

Further, as shown in FIG. 6, the suction nozzle assembly 20 of the present disclosure includes a suction nozzle 10 of the present disclosure and a flange 9 having a through hole 8. As described above, the suction nozzle assembly 20 of the present disclosure is highly reliable because it includes the suction nozzle 10 of the present disclosure.

Here, as shown in FIG. 6, the flange 9 is a tubular body having a through hole 8 and including at least a part of the suction nozzle 10. The through hole 8 provided in the flange 9 is connected to the suction hole 7 or the porous region 4 provided in the suction nozzle 10, so that electronic components can be sucked. Here, the material of the flange 9 is, for example, a metal such as stainless steel or an aluminum alloy.

Then, the suction nozzle 10 and the flange 9 are fixed by fitting or adhesive. Examples of the adhesive include an adhesive containing divinylbenzene, bisphenol F, polyglycidyl ether, vinylcyclohexine dioxide, dicyclopentadiene oxide, epoxy resin, urethane, silicon, acrylic and the like. Further, when an adhesive containing divinylbenzene is used, it is highly elastic and does not undergo plastic deformation even at a temperature of about 200 ° C., so that the adsorption nozzle assembly 20 can be used even in a high temperature environment.

Further, the adhesive may be a conductive adhesive having conductivity. Here, the conductivity means that the resistance value is 10 ¹¹ Ω or less. The conductive adhesive contains, for example, a single or composite of Au, Ag, Cu, Ni, Al, Fe, C, Co, Cr, Mo, Pd, Pt, Pb, Sn, and Zn. It is an adhesive that has been used.

Here, in the suction nozzle assembly 20 of the present disclosure, if the suction nozzle 10 and the flange 9 have conductivity and there is a conductive adhesive between the suction nozzle 10 and the flange 9, static electricity is eliminated. Will be easy.

Next, the electronic component mounting device 30 for mounting the electronic component 11 by the electronic component transporter 15 mounted with the suction nozzle assembly 20 of the present disclosure will be described with reference to the schematic view of FIG. 7.

The electronic component mounting device 30 shown in FIG. 7 includes an electronic component carrier 15 including a suction nozzle assembly 20, a light 12 that irradiates light toward the electronic component 11 adsorbed on the suction nozzle assembly 20, and an electronic component. It is composed of a CCD camera 13 for displaying 11 and an image analysis device 14 for processing an image taken by the CCD camera 13. By using the electronic component mounting device 30, the electronic components 11 arranged on the tray can be mounted at a predetermined position on the circuit board.

Next, an example of the method for manufacturing the suction nozzle of the present disclosure will be described. Here, a case where the suction nozzle is made of zirconia ceramics containing a conductive component will be described as an example.

First, a zirconia powder containing a stabilizer (hereinafter, simply referred to as zirconia powder) is prepared. At this time, yttrium, ceria, magnesia or the like may be used as the stabilizer, and if these stabilizers are contained in an amount of about 2 to 8 mol%, the zirconia ceramics having sufficient strength for practical use can be obtained. Then, a solvent is added to the zirconia powder, and the powder is pulverized using a ball mill, a bead mill, or the like until the average particle size becomes 0.2 to 0.5 μm, and this is used as the first slurry.

Next, a solvent is added to the conductive component powder containing iron oxide powder, chromium oxide powder and titanium oxide powder, and the powder is pulverized using a ball mill, a bead mill or the like until the average particle size becomes 0.1 to 0.5 μm. Is the second slurry. Manganese oxide powder and nickel oxide powder can also be used as the conductive component powder.

Next, the first slurry and the second slurry are mixed and then spray-dried with a spray dryer to obtain granules. Here, the mass ratio of the first slurry and the second slurry is, for example, 60:40 to 85:15. Moreover, you may add a dispersant at the time of this mixing. The amount of the dispersant added is, for example, 0.1 to 1.0 parts by mass with respect to 100 parts by mass in total of the zirconia powder and the conductive component powder.

Next, the granules, the thermoplastic resin, the wax, and the like are put into a kneader and kneaded while heating to obtain a clay. Then, the obtained clay is put into a pelletizer to obtain pellets as a raw material for injection molding (injection molding). As the thermoplastic resin to be charged into the kneader, ethylene vinyl acetate copolymer, polystyrene, acrylic resin and the like can be used. The amount of the thermoplastic resin added may be about 10 to 25 parts by mass with respect to 100 parts by mass in total of the zirconia powder and the conductive component powder. Further, the kneading conditions using the kneader may be set to a heating temperature of 100 to 170 ° C. and a kneading time of 0.5 to 3 hours.

Next, pellets and resin beads, which are pore-forming agents that are burnt or thermally decomposed in the firing step, are injected into an injection molding machine (injection molding machine) provided with a mold for obtaining a desired shape, and injection-molded to obtain a porous region. To obtain a molded product. Here, the size of the resin beads, for example, 1 μm or more and 20 μm or less. The amount of the resin beads added is 50% by mass or more and 100% by mass or less with respect to 100% by mass of the pellets.

Next, after setting the molded body to be a porous region in an injection molding machine equipped with a mold for obtaining a desired shape, pellets are put into the injection molding machine so as to include the molded body to be a porous region and injection molded. By doing so, a molded product is obtained. The molded product in the porous region is first fired to form a sintered body, then the sintered body is set in a mold, and pellets are thrown in so that the sintered body is included and injected. A molded body may be obtained by molding.

Then, the molded product is degreased and fired in an air atmosphere at a temperature of 1300 to 1500 ° C. for 1 to 3 hours. As a result, the suction nozzle of the present disclosure having a porous region and a dense region is obtained at least at the tip portion.

Further, after firing, a wet barrel or a dry barrel may be performed. Further, after obtaining the molded product, the portion to be the suction surface may be cut, or the suction surface may be formed by polishing after firing.

Further, by preparing a flange having a through hole and combining the suction nozzle and the flange, the suction nozzle assembly of the present disclosure can be obtained. When using an adhesive, for example, an adhesive containing divinylbenzene may be prepared, and the adhesive may be applied to the portion of the suction nozzle facing the inner circumference of the through hole of the flange, and then combined with the flange. Good.

1: Suction surface 2: Tip part 3: Main body part 4: Porous region 5: Dense region 6: Suction surface 7: Suction hole 8: Through hole 9: Flange 10: Suction nozzle 11: Electronic component 12: Light 13: CCD camera 14: Image analyzer 15: Electronic component carrier 20: Suction nozzle assembly 30: Electronic component mounting device

Claims (9)

Made of ceramics
A tip portion having a suction surface and a main body portion connected to the tip portion are provided.
The tip portion includes the adsorption surface, extends toward the main body portion, has a porosity of 10% or more and 90% or less, and surrounds the porous region in the radial direction, and has a porosity of 3%. A suction nozzle having the following dense regions. The portion having the porous region at the tip portion has an A / B of 0.5 or more in the radial cross section, where A is the cross-sectional area of the dense region and B is the cross-sectional area of the porous region. The suction nozzle according to claim 1, which is 30 or less. The suction nozzle according to claim 1 or 2, wherein the tip portion has the porous region up to a position connected to the main body portion. The main body has a suction surface facing the suction surface and has a suction surface.
The suction nozzle according to claim 3, wherein the porous region extends from the suction surface to the suction surface. The suction nozzle according to claim 4, wherein the porous region has a cross-sectional area in the radial direction increasing from the suction surface to the suction surface. The suction nozzle according to any one of claims 1 to 5, wherein the ceramic is a zirconia ceramic. The suction nozzle according to claim 6, wherein the zirconia ceramics contains a conductive component. A suction nozzle assembly comprising the suction nozzle according to claim 1 to 7, and a flange having a through hole. The suction nozzle assembly according to claim 8, wherein the suction nozzle and the flange are conductive, and a conductive adhesive is provided between the suction nozzle and the flange.

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