JP6883271B2 - Inorganic filler particles - Google Patents
Inorganic filler particles Download PDFInfo
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- JP6883271B2 JP6883271B2 JP2016053561A JP2016053561A JP6883271B2 JP 6883271 B2 JP6883271 B2 JP 6883271B2 JP 2016053561 A JP2016053561 A JP 2016053561A JP 2016053561 A JP2016053561 A JP 2016053561A JP 6883271 B2 JP6883271 B2 JP 6883271B2
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- 239000002245 particle Substances 0.000 title claims description 111
- 239000011256 inorganic filler Substances 0.000 title claims description 60
- 229910003475 inorganic filler Inorganic materials 0.000 title claims description 60
- 239000011521 glass Substances 0.000 claims description 56
- 239000011342 resin composition Substances 0.000 claims description 38
- 239000010410 layer Substances 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 239000002923 metal particle Substances 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 20
- 150000001875 compounds Chemical class 0.000 description 14
- 239000007788 liquid Substances 0.000 description 11
- 230000007423 decrease Effects 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- -1 for example Substances 0.000 description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000006087 Silane Coupling Agent Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229920002554 vinyl polymer Polymers 0.000 description 5
- 125000004386 diacrylate group Chemical group 0.000 description 4
- 238000007524 flame polishing Methods 0.000 description 4
- UYERIVYDSGUOJG-UHFFFAOYSA-N morpholine;prop-2-enamide Chemical compound NC(=O)C=C.C1COCCN1 UYERIVYDSGUOJG-UHFFFAOYSA-N 0.000 description 4
- 239000000049 pigment Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 239000002419 bulk glass Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- IAXXETNIOYFMLW-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) 2-methylprop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C(=C)C)CC1C2(C)C IAXXETNIOYFMLW-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
- BOKRKKCPFKUCIZ-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;2-methyloxirane Chemical compound CC1CO1.OCC(CO)(CO)CO BOKRKKCPFKUCIZ-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- NWIIFBPIDORBCY-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O.OCC(O)CO NWIIFBPIDORBCY-UHFFFAOYSA-N 0.000 description 1
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- NHJIDZUQMHKGRE-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-yl 2-(7-oxabicyclo[4.1.0]heptan-4-yl)acetate Chemical compound C1CC2OC2CC1OC(=O)CC1CC2OC2CC1 NHJIDZUQMHKGRE-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000032900 absorption of visible light Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- DNWBGZGLCKETOT-UHFFFAOYSA-N cyclohexane;1,3-dioxane Chemical compound C1CCCCC1.C1COCOC1 DNWBGZGLCKETOT-UHFFFAOYSA-N 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FSPSELPMWGWDRY-UHFFFAOYSA-N m-Methylacetophenone Chemical compound CC(=O)C1=CC=CC(C)=C1 FSPSELPMWGWDRY-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Glass Compositions (AREA)
Description
本発明は、立体造形用樹脂組成物用として好適な無機充填材粒子に関する。 The present invention relates to inorganic filler particles suitable for a resin composition for three-dimensional modeling.
従来、樹脂材料等を積層させて立体造形物を得る方法が知られている。例えば光造形法、粉末床溶融焼結法、熱溶解積層(Fused deposition modeling:FDM)法等種々の方法が提案され実用化されている(例えば特許文献1参照)。 Conventionally, a method of laminating resin materials and the like to obtain a three-dimensional model has been known. For example, various methods such as a stereolithography method, a powder bed fusion sintering method, and a Fused deposition modeling (FDM) method have been proposed and put into practical use (see, for example, Patent Document 1).
なかでも光造形法は、細やかな造形や正確なサイズ表現に優れており、広く普及している。光造形法は以下のようにして立体造形物を作製するものである。まず液状の光硬化性樹脂を満たした槽内に造形ステージを設け、造形ステージ上の光硬化性樹脂に紫外線レーザー等の活性エネルギー線を照射して所望のパターンの硬化層を形成する。このようにして硬化層を1層形成すると造形ステージを1層分だけ下げて、硬化層上に未硬化の光硬化性樹脂を導入し、同様にして活性エネルギー線を光硬化性樹脂に照射して前記硬化層上に新たな硬化層を積み上げる。この操作を繰り返すことにより、所定の立体造形物を得る。また、粉末焼結法は、樹脂、金属、セラミックスまたはガラスの粉末を満たした槽内に造形ステージを設け、造形ステージ上の粉末に活性エネルギー線を照射し、軟化変形にて所望のパターンの硬化層を形成するものである。 Among them, the stereolithography method is excellent in delicate modeling and accurate size expression, and is widely used. The stereolithography method produces a three-dimensional model as follows. First, a modeling stage is provided in a tank filled with a liquid photocurable resin, and the photocurable resin on the modeling stage is irradiated with active energy rays such as an ultraviolet laser to form a cured layer having a desired pattern. When one cured layer is formed in this way, the modeling stage is lowered by one layer, an uncured photocurable resin is introduced onto the cured layer, and the photocurable resin is similarly irradiated with active energy rays. A new hardened layer is piled up on the hardened layer. By repeating this operation, a predetermined three-dimensional model is obtained. Further, in the powder sintering method, a modeling stage is provided in a tank filled with resin, metal, ceramics or glass powder, the powder on the modeling stage is irradiated with active energy rays, and a desired pattern is cured by softening and deformation. It forms a layer.
上記の方法により得られた立体造形物には、用途によっては高い機械的強度が求められる。特許文献1では、樹脂組成物中に無機充填材粒子を含有させることにより、得られる立体造形物の機械的強度(機械的剛性)が向上することが記載されている。 The three-dimensional model obtained by the above method is required to have high mechanical strength depending on the application. Patent Document 1 describes that the mechanical strength (mechanical rigidity) of the obtained three-dimensional model is improved by containing the inorganic filler particles in the resin composition.
近年、樹脂組成物からなる立体造形物の用途が多様化しており、装飾品等の美感が要求される用途にも展開されつつある。ここで、樹脂組成物中に無機充填材粒子以外に顔料等を添加して、濃色の立体造形物を得ることが考えられる。しかしながら、当該方法では、樹脂組成物の流動性が低下して成形性が低下するという問題がある。また、光造形法の場合は、顔料等が活性エネルギー線を遮断するため、樹脂組成物全体に活性エネルギー線が行き渡りにくくなり、硬化が不十分になるという問題もある。 In recent years, the uses of three-dimensional shaped objects made of resin compositions have been diversified, and they are being developed for applications that require aesthetics such as ornaments. Here, it is conceivable to add a pigment or the like in addition to the inorganic filler particles to the resin composition to obtain a dark-colored three-dimensional model. However, this method has a problem that the fluidity of the resin composition is lowered and the moldability is lowered. Further, in the case of the stereolithography method, since the pigment or the like blocks the active energy rays, there is a problem that the active energy rays are hard to spread throughout the resin composition and the curing becomes insufficient.
以上に鑑み、本発明は、濃色の立体造形物を効率良く製造することが可能な無機充填材粒子を提供することを目的とする。 In view of the above, it is an object of the present invention to provide inorganic filler particles capable of efficiently producing a dark-colored three-dimensional model.
本発明の無機充填材粒子は、ガラス粒子の表面に金属粒子が付着しており、明度(L*値)が90以下であることを特徴とする。 Inorganic filler particles of the present invention, the surface of the glass particles are deposited metal particles, Lightness (L * value) is equal to or is 90 or less.
本発明の無機充填材粒子は、ガラス粒子表面に付着した金属粒子が可視光を吸収するため、明度が低いという特徴を有する。そのため、本発明の無機充填材粒子を配合した樹脂組成物を使用することにより、所望の濃色を呈した立体造形物を製造することができる。この場合、無機充填材粒子とは別に顔料等を添加する必要がないため、樹脂組成物の流動性が不当に低下することがなく、成形性に優れるという利点がある。また、光造形法の場合は、活性エネルギー線が顔料等により遮断されにくくなるため、硬化を促進することができる。 Inorganic filler particles of the present invention, the metal particles adhering to the glass particle surface absorbs visible light, it has a feature of low light level. Therefore, by using the resin composition containing the inorganic filler particles of the present invention, it is possible to produce a three-dimensional model having a desired dark color. In this case, since it is not necessary to add a pigment or the like separately from the inorganic filler particles, there is an advantage that the fluidity of the resin composition does not unreasonably decrease and the moldability is excellent. Further, in the case of the stereolithography method, the active energy rays are less likely to be blocked by the pigment or the like, so that curing can be promoted.
本発明の無機充填材粒子において、金属粒子がFe、Cr及びNiから選択される少な
くとも1種からなることが好ましい。このようにすれば、所望の低い明度が得やすくな
る。
In the inorganic filler particles of the present invention, it is preferable that the metal particles consist of at least one selected from Fe, Cr and Ni. In this way, desired low light level is easily obtained.
本発明の無機充填材粒子は、ガラス粒子1gに対し、金属粒子が200μg以上付着していることが好ましい。このようにすれば、所望の低い明度が得やすくなる。 The inorganic filler particles of the present invention preferably have 200 μg or more of metal particles attached to 1 g of glass particles. In this way, desired low light level is easily obtained.
本発明の無機充填材粒子は、ガラス粒子の平均粒子径(D50)が1μm以上であることが好ましい。このようにすれば、樹脂組成物の流動性に優れ成形性が向上しやすくなる。また、無機充填材粒子と樹脂との界面に存在する泡(界面泡)が抜けやすくなる。 The inorganic filler particles of the present invention preferably have an average particle size (D 50 ) of glass particles of 1 μm or more. By doing so, the fluidity of the resin composition is excellent and the moldability is easily improved. In addition, bubbles (interfacial bubbles) existing at the interface between the inorganic filler particles and the resin are easily removed.
本発明の樹脂組成物は、上記の無機充填材粒子と硬化性樹脂とを含有することを特徴とする。 The resin composition of the present invention is characterized by containing the above-mentioned inorganic filler particles and a curable resin.
本発明の立体造形物は、上記の樹脂組成物の硬化物からなることを特徴とする。 The three-dimensional model of the present invention is characterized by comprising a cured product of the above resin composition.
本発明の立体造形物は、明度(L*値)が60以下であることが好ましい。 Three-dimensional object of the present invention, Lightness (L * value) is preferably 60 or less.
本発明の立体造形物の製造方法は、樹脂組成物からなる表面層に選択的に活性エネルギー光線を照射して所定のパターンを有する硬化層を形成し、前記硬化層上に新たな層を形成した後に活性エネルギー線を照射して前記硬化層と連続した所定パターンを有する新たな硬化層を形成し、所定の立体造形物が得られるまで前記硬化層の積層を繰り返すことを特徴とする立体造形物の製造方法であって、樹脂組成物として、上記の樹脂組成物を使用することを特徴とする。 In the method for producing a three-dimensional model of the present invention, a surface layer made of a resin composition is selectively irradiated with active energy rays to form a cured layer having a predetermined pattern, and a new layer is formed on the cured layer. After that, a new cured layer having a predetermined pattern continuous with the cured layer is formed by irradiating with active energy rays, and the three-dimensional modeling is characterized by repeating the lamination of the cured layer until a predetermined three-dimensional model is obtained. It is a method for producing a product, and is characterized in that the above-mentioned resin composition is used as the resin composition.
本発明の無機充填材粒子を配合した樹脂止組成物を使用することにより、濃色の立体造形物を効率良く製造することが可能となる。 By using the resin stop composition containing the inorganic filler particles of the present invention, it is possible to efficiently produce a dark-colored three-dimensional model.
本発明の無機充填材粒子は、ガラス粒子の表面に金属粒子が付着してなるものである。 The inorganic filler particles of the present invention are formed by adhering metal particles to the surface of glass particles.
ガラス粒子の平均粒子径(D50)は1μm以上、1.5μm以上、2μm以上、特に2.5μm以上であることが好ましい。ガラス粒子の平均粒子径が小さすぎると、得られる無機充填材粒子も小さくなり、本発明の無機充填材粒子を樹脂と混合した場合、樹脂組成物の流動性が低下したり、無機充填材粒子と樹脂との界面に存在する泡(界面泡)が抜けにくくなる。一方、ガラス粒子の平均粒子径が大きすぎると、得られる無機充填材粒子も大きくなり、樹脂組成物中における無機充填材粒子の充填率が低下しやすくなるため、500μm以下、100μm以下、50μm以下、特に20μm以下であることが好ましい。 The average particle size (D 50 ) of the glass particles is preferably 1 μm or more, 1.5 μm or more, 2 μm or more, and particularly preferably 2.5 μm or more. If the average particle size of the glass particles is too small, the obtained inorganic filler particles also become small, and when the inorganic filler particles of the present invention are mixed with the resin, the fluidity of the resin composition decreases or the inorganic filler particles It becomes difficult for bubbles (interfacial bubbles) existing at the interface between the resin and the resin to come off. On the other hand, if the average particle size of the glass particles is too large, the obtained inorganic filler particles also become large, and the filling rate of the inorganic filler particles in the resin composition tends to decrease. Therefore, 500 μm or less, 100 μm or less, 50 μm or less. In particular, it is preferably 20 μm or less.
なお本発明において、平均粒子径(D50)は一次粒子のメジアン径での50%体積累積径を示し、レーザー回折式粒度分布測定装置により測定された値をいう。 In the present invention, the average particle diameter (D 50 ) indicates a 50% volume cumulative diameter of the primary particles in terms of median diameter, and refers to a value measured by a laser diffraction type particle size distribution measuring device.
ガラス粒子の比表面積は0.1〜3.5m2/g、0.5〜3.2m2/g、特に0.75〜3m2/gであることが好ましい。ガラス粒子の比表面積が小さすぎると、得られる無機充填材粒子の粒子径が大きくなるため、樹脂組成物中における無機充填材粒子の充填率が低下しやすくなる。一方、ガラス粒子の比表面積が大きすぎると、得られる無機充填材粒子の比表面積も大きくなるため、樹脂組成物の流動性が低下したり、無機充填材粒子と樹脂との界面に存在する泡が抜けにくくなる。 The specific surface area of the glass particles 0.1~3.5m 2 /g,0.5~3.2m 2 / g, it is particularly preferably 0.75~3m 2 / g. If the specific surface area of the glass particles is too small, the particle size of the obtained inorganic filler particles becomes large, so that the filling rate of the inorganic filler particles in the resin composition tends to decrease. On the other hand, if the specific surface area of the glass particles is too large, the specific surface area of the obtained inorganic filler particles also increases, so that the fluidity of the resin composition decreases or bubbles existing at the interface between the inorganic filler particles and the resin. Is hard to come off.
ガラス粒子の形状は特に限定されないが、略球状であることが好ましい。このようにすれば、無機充填材粒子の比表面積が小さくなるため、樹脂組成物の粘度上昇を抑制することができる。なお、略球形のガラス粒子は、例えばバルク状ガラスを粉砕した後、火炎研磨(ファイアポリッシュ)を行うことにより作製することができる。 The shape of the glass particles is not particularly limited, but it is preferably substantially spherical. By doing so, since the specific surface area of the inorganic filler particles becomes small, it is possible to suppress an increase in the viscosity of the resin composition. The substantially spherical glass particles can be produced, for example, by crushing bulk glass and then performing flame polishing (fire polishing).
ガラス粒子の軟化点は1000℃以下、900℃以下、特に800℃以下であることが好ましい。ガラス粒子の軟化点が高すぎると、火炎研磨による球状化が困難になる傾向がある。一方、ガラス粒子の軟化点の下限は特に限定されないが、現実的には250℃以上、特に300℃以上である。 The softening point of the glass particles is preferably 1000 ° C. or lower, 900 ° C. or lower, and particularly preferably 800 ° C. or lower. If the softening point of the glass particles is too high, it tends to be difficult to spheroidize by flame polishing. On the other hand, the lower limit of the softening point of the glass particles is not particularly limited, but in reality, it is 250 ° C. or higher, particularly 300 ° C. or higher.
ガラス粒子の結晶化開始温度は、軟化点より100℃以上、150℃以上、特に200℃以上高いことが好ましい。このようにすれば、ガラス粒子の軟化流動時に結晶が析出しにくくなるため、火炎研磨による球状化が容易になる。 The crystallization start temperature of the glass particles is preferably 100 ° C. or higher, 150 ° C. or higher, and particularly preferably 200 ° C. or higher higher than the softening point. In this way, crystals are less likely to precipitate during the softening flow of the glass particles, so that spheroidization by flame polishing becomes easy.
ガラス粒子の密度は2.4〜7g/cm3、2.5〜6g/cm3、特に2.6〜5g/cm3であることが好ましい。ガラス粒子の密度が低すぎると、軟化点が不当に高くなる傾向がある。一方、ガラス粒子の密度が大きすぎると、光造形法を適用した場合に樹脂組成物中で無機充填材粒子が沈降分離しやすくなる。 The density of the glass particles is preferably 2.4 to 7 g / cm 3 , 2.5 to 6 g / cm 3 , and particularly preferably 2.6 to 5 g / cm 3 . If the density of the glass particles is too low, the softening point tends to be unreasonably high. On the other hand, if the density of the glass particles is too high, the inorganic filler particles tend to settle and separate in the resin composition when the stereolithography method is applied.
ガラス粒子としては、例えば、組成としてSiO2、Al2O3、B2O3及びP2O5から選択される少なくとも1種を含有するガラスを使用することができる。具体的には、SiO2−B2O3−R’2O(R’はアルカリ金属元素)系ガラス、SiO2−Al2O3−RO(Rはアルカリ土類金属元素)系ガラス、SiO2−Al2O3−R’2O−RO系ガラス、SiO2−Al2O3−B2O3−R’2O系ガラス、SiO2−Al2O3−B2O3−R’2O−RO系ガラス、SiO2−R’2O系ガラス、SiO2−R’2O−RO系ガラス等を使用することができる。以下、ガラス粒子における各成分の含有量の好ましい範囲について説明する。なお、以下の説明において、特に断りのない限り「%」は「質量%」を意味する。 As the glass particles, for example, glass containing at least one selected from SiO 2 , Al 2 O 3 , B 2 O 3 and P 2 O 5 as the composition can be used. Specifically, SiO 2 -B 2 O 3 -R '2 O (R' alkali metal element) based glass, SiO 2 -Al 2 O 3 -RO (R is an alkaline earth metal element) based glass, SiO 2 -Al 2 O 3 -R '2 O-RO -based glass, SiO 2 -Al 2 O 3 -B 2 O 3 -R' 2 O -based glass, SiO 2 -Al 2 O 3 -B 2 O 3 -R ' 2 O-RO-based glass, SiO 2- R' 2 O-based glass, SiO 2- R' 2 O-RO-based glass and the like can be used. Hereinafter, a preferable range of the content of each component in the glass particles will be described. In the following description, "%" means "mass%" unless otherwise specified.
耐失透性に優れた無機充填材粒子を得る観点からは、SiO2、Al2O3、B2O3及びP2O5を合量で1%以上、5%以上、特に10%以上含有させることが好ましい。ただし、これらの成分は密度を低下させる成分であるため、高密度の立体造形物を得る場合は、合量で50%以下、40%以下、特に30%以下であることが好ましい。 From the viewpoint of obtaining inorganic filler particles having excellent devitrification resistance, the total amount of SiO 2 , Al 2 O 3 , B 2 O 3 and P 2 O 5 is 1% or more, 5% or more, particularly 10% or more. It is preferable to include it. However, since these components are components that reduce the density, when a high-density three-dimensional model is obtained, the total amount is preferably 50% or less, 40% or less, and particularly preferably 30% or less.
ガラス粒子として密度の高いものを使用することにより、得られる立体造形物に重厚感を持たせることができる。ガラス粒子の密度を高める観点からは、ガラス組成として、Ba、La、Gd、Ta、Nb、W、Bi及びTe等の比較的原子量の大きい元素を含有することが好ましい。例えば、これらの酸化物の含有量を以下の通り規制することが好ましい。 By using high-density glass particles, it is possible to give a profound feeling to the obtained three-dimensional model. From the viewpoint of increasing the density of glass particles, it is preferable that the glass composition contains elements having a relatively large atomic weight such as Ba, La, Gd, Ta, Nb, W, Bi and Te. For example, it is preferable to regulate the content of these oxides as follows.
BaOの含有量は1%以上、10%以上、20%以上、特に30%以上であることが好ましい。BaOの含有量が多すぎると、失透しやすくなり、ガラス化が困難となる傾向があるため、60%以下、特に50%以下であることが好ましい。 The content of BaO is preferably 1% or more, 10% or more, 20% or more, and particularly preferably 30% or more. If the content of BaO is too large, it tends to be devitrified and vitrification tends to be difficult. Therefore, it is preferably 60% or less, particularly 50% or less.
La2O3+Gd2O3+Ta2O5+Nb2O5+WO3+Bi2O3+TeO2の含有量は1%以上、10%以上、特に20%以上であることが好ましい。ただし、これらの成分の含有量が多すぎると、原料コストが高くなる傾向があるため、80%以下、70%以下、特に60%以下が好ましい。なお、「La2O3+Gd2O3+Ta2O5+Nb2O5+WO3+Bi2O3+TeO2」は、これらの各成分の含有量の合量を意味する。 The content of La 2 O 3 + Gd 2 O 3 + Ta 2 O 5 + Nb 2 O 5 + WO 3 + Bi 2 O 3 + TeO 2 is preferably 1% or more, 10% or more, and particularly preferably 20% or more. However, if the content of these components is too large, the raw material cost tends to be high, so 80% or less, 70% or less, particularly 60% or less is preferable. In addition, "La 2 O 3 + Gd 2 O 3 + Ta 2 O 5 + Nb 2 O 5 + WO 3 + Bi 2 O 3 + TeO 2 " means the total amount of the contents of each of these components.
立体造形物の意匠性の観点から、ガラス粒子の屈折率を高めたい場合は、屈折率向上の効果が高いTiO2を含有させることが好ましい。TiO2の含有量は0.1%以上、1%以上、5%以上、10%以上、特に30%以上であることが好ましい。ただし、TiO2の含有量が多すぎると、光透過率が低下してむしろ意匠性を損なうおそれがあるため、上限は50%以下、特に45%以下であることが好ましい。 From the viewpoint of the design of the three-dimensional model, when it is desired to increase the refractive index of the glass particles, it is preferable to contain TiO 2 having a high effect of improving the refractive index. The content of TiO 2 is preferably 0.1% or more, 1% or more, 5% or more, 10% or more, and particularly preferably 30% or more. However, if the content of TiO 2 is too large, the light transmittance may decrease and the design may be impaired. Therefore, the upper limit is preferably 50% or less, particularly 45% or less.
Sb2O3及びCeO2はFe成分に起因する光透過率低下を抑制する効果がある。Sb2O3及びCeO2の含有量は、合量で0.01〜1%、特に0.1〜0.8%であることが好ましい。これらの成分の含有量が少なすぎると上記効果が得にくくなり、一方、多すぎるとむしろ光透過率が低下しやすくなったり、成形時に失透しやすくなる。なお、Sb2O3及びCeO2の各々の含有量も上記範囲内であることが好ましい。 Sb 2 O 3 and Ce O 2 have an effect of suppressing a decrease in light transmittance due to the Fe component. The total content of Sb 2 O 3 and Ce O 2 is preferably 0.01 to 1%, particularly 0.1 to 0.8%. If the content of these components is too small, it becomes difficult to obtain the above effect, while if it is too large, the light transmittance tends to decrease or the light is easily devitrified during molding. The contents of each of Sb 2 O 3 and CeO 2 are also preferably within the above range.
Li2O、Na2O及びK2Oの含有量は合量で5%以下、2.5%以下、特に1%以下であることが好ましい。これらの成分の含有量を上記のように規制すれば、樹脂硬化時におけるアルカリ成分の蒸発を抑制できる。また、化学耐久性の低下を抑制できる。 The total content of Li 2 O, Na 2 O and K 2 O is preferably 5% or less, 2.5% or less, and particularly preferably 1% or less. If the content of these components is regulated as described above, evaporation of the alkaline component during resin curing can be suppressed. In addition, a decrease in chemical durability can be suppressed.
また環境上の理由から、フッ素、鉛、アンチモン、ヒ素、塩素及び硫黄の含有量は合量で1%以下、0.5%以下、特に0.1%以下であることが好ましい。 Further, for environmental reasons, the total content of fluorine, lead, antimony, arsenic, chlorine and sulfur is preferably 1% or less, 0.5% or less, and particularly preferably 0.1% or less.
金属粒子としては特に限定されないが、Fe、Cr及びNiから選択される少なくとも1種が挙げられる。これらは可視光を吸収しやすいため、所望の低い明度が得やすくなる。なお、金属粒子の平均粒子径(D50)は、通常、0.01〜100μm、さらには0.1〜10μmである。 The metal particles are not particularly limited, and examples thereof include at least one selected from Fe, Cr, and Ni. Because they easily absorb visible light, the desired low light level is easily obtained. The average particle size (D 50 ) of the metal particles is usually 0.01 to 100 μm, more preferably 0.1 to 10 μm.
本発明の無機充填材粒子において、ガラス粒子1gに対し、金属粒子が200μg以上、500μg以上、750μg以上、1000μg以上、特に1500μg以上付着していることが好ましい。金属粒子の付着量が少なすぎると、可視光の吸収が不十分となり、所望の明度が得にくくなる。一方、金属粒子の付着量が多すぎると、樹脂組成物の流動性が不当に低下し、成形性に劣る傾向がある。また、光造形法の場合は、活性エネルギー線が金属粒子により遮断され、硬化しにくくなるおそれがある。従って、金属粒子の付着量はガラス粒子1gに対して5000μg以下、4000μg以下、特に3000μg以下であることが好ましい。 In the inorganic filler particles of the present invention, it is preferable that 200 μg or more, 500 μg or more, 750 μg or more, 1000 μg or more, particularly 1500 μg or more, of metal particles are attached to 1 g of glass particles. If the amount of deposition of the metal particles is too small, the absorption of visible light is insufficient, the desired light level is hardly obtained. On the other hand, if the amount of metal particles adhered is too large, the fluidity of the resin composition is unreasonably lowered, and the moldability tends to be poor. Further, in the case of the stereolithography method, the active energy rays may be blocked by the metal particles, making it difficult to cure. Therefore, the amount of metal particles attached is preferably 5000 μg or less, 4000 μg or less, and particularly 3000 μg or less with respect to 1 g of glass particles.
ガラス粒子表面への金属粒子の付着は、ガラス粒子と金属粒子を混合することにより行う。100℃以上、200℃以上、さらに300℃以上で加熱しながら両者を混合することにより、ガラス粒子表面に金属粒子を強固に付着させやすい。なお、原料となるバルク状ガラスを粉砕または分級する際に金属粒子を添加してもよい。このようにすれば、ガラスの粉砕または分級と同時に金属粒子の付着を行うことができるため、製造効率が向上する。ガラス粉末に対し、火炎研磨による球状化処理を行う際は、金属粒子の酸化による明度上昇を抑制するため、当該球状化処理を行った後に、ガラス粒子に金属粒子を付着させることが好ましい。 The metal particles are attached to the surface of the glass particles by mixing the glass particles and the metal particles. By mixing the two while heating at 100 ° C. or higher, 200 ° C. or higher, and further 300 ° C. or higher, the metal particles can be easily adhered firmly to the surface of the glass particles. In addition, metal particles may be added when the bulk glass as a raw material is crushed or classified. In this way, the metal particles can be attached at the same time as the glass is pulverized or classified, so that the production efficiency is improved. Glass powder to, when performing the spheroidizing treatment by flame polishing, in order to suppress the bright degree increase by oxidation of the metal particles, after the spheroidization treatment, it is preferable to deposit the metal particles in the glass particles.
本発明の無機充填材粒子の明度(L*値)は90以下であり、88以下、特に85以下であることが好ましい。無機充填材粒子の明度が高すぎると、所望の濃色を呈する立体造形物が得にくくなる。 Lightness of the inorganic filler particles of the present invention (L * value) is 90 or less, 88 or less, and particularly preferably 85 or less. When light of the inorganic filler particles is too high, three-dimensional object exhibiting desired dark color is hardly obtained.
本発明の無機充填材粒子は、表面がシランカップリング剤によって処理されていることが好ましい。このようにすれば、無機充填材粒子と樹脂との結合力を高めることができ、より機械的強度に優れた立体造形物を得ることが可能になる。シランカップリング剤としては、例えばアミノシラン、エポキシシラン、アクリルシラン等が好ましい。なおシランカップリング剤の種類は、用いる硬化性樹脂に応じて適宜選択すればよく、例えば光硬化性樹脂としてビニル系不飽和化合物を用いる場合にはアクリルシラン系シランカップリング剤、エポキシ系化合物を用いる場合にはエポキシシラン系シランカップリング剤を用いることが好ましい。 The surface of the inorganic filler particles of the present invention is preferably treated with a silane coupling agent. In this way, the bonding force between the inorganic filler particles and the resin can be enhanced, and it becomes possible to obtain a three-dimensional model having more excellent mechanical strength. As the silane coupling agent, for example, aminosilane, epoxysilane, acrylicsilane and the like are preferable. The type of silane coupling agent may be appropriately selected according to the curable resin to be used. For example, when a vinyl-based unsaturated compound is used as the photocurable resin, an acrylic silane-based silane coupling agent or an epoxy-based compound may be used. When used, it is preferable to use an epoxy silane-based silane coupling agent.
無機充填材粒子に対し、硬化性樹脂を混合することにより樹脂組成物を製造することができる。混合割合は、体積%で、硬化性樹脂 10〜99%、無機充填材粒子 1〜90%であることが好ましい。より好ましくは、硬化性樹脂が35〜95%、40〜90%、特に45〜85%であり、無機充填材粒子が5〜65%、10〜60%、特に15〜55%である。無機充填材粒子の含有量が少なすぎると、得られる立体造形物の機械的強度向上の効果が得にくくなる。一方、無機充填材粒子の含有量が多すぎる場合は、各無機充填材粒子おける硬化性樹脂との接触面積が小さくなり、得られる立体造形物の機械的強度がかえって低くなる傾向がある。また光造形法の場合は、樹脂組成物の粘度が高くなり過ぎて、造形ステージ上に新たな液状層を形成しにくくなる等の不具合が発生しやすくなる。 A resin composition can be produced by mixing a curable resin with the inorganic filler particles. The mixing ratio is preferably 10 to 99% of the curable resin and 1 to 90% of the inorganic filler particles in a volume%. More preferably, the curable resin is 35 to 95%, 40 to 90%, particularly 45 to 85%, and the inorganic filler particles are 5 to 65%, 10 to 60%, particularly 15 to 55%. If the content of the inorganic filler particles is too small, it becomes difficult to obtain the effect of improving the mechanical strength of the obtained three-dimensional model. On the other hand, when the content of the inorganic filler particles is too large, the contact area of each inorganic filler particle with the curable resin tends to be small, and the mechanical strength of the obtained three-dimensional model tends to be rather low. Further, in the case of the stereolithography method, the viscosity of the resin composition becomes too high, and problems such as difficulty in forming a new liquid layer on the molding stage are likely to occur.
本発明の無機充填材粒子は特に光造形法の場合にその効果を享受しやすいため、硬化性樹脂としては光硬化性樹脂(液状の光硬化性樹脂)を用いることが好ましい。 Since the inorganic filler particles of the present invention can easily enjoy the effect particularly in the case of the stereolithography method, it is preferable to use a photocurable resin (liquid photocurable resin) as the curable resin.
光硬化性樹脂としては、重合性のビニル系化合物、エポキシ系化合物等種々の樹脂を選択することができる。また単官能性化合物や多官能性化合物のモノマーやオリゴマーが用いられる。これらの単官能性化合物、多官能性化合物は、特に限定されるものではない。例えば、以下に光硬化性樹脂の代表的なものを挙げる。 As the photocurable resin, various resins such as a polymerizable vinyl compound and an epoxy compound can be selected. Further, monomers and oligomers of monofunctional compounds and polyfunctional compounds are used. These monofunctional compounds and polyfunctional compounds are not particularly limited. For example, typical photocurable resins are listed below.
重合性のビニル系化合物の単官能性化合物としては、イソボルニルアクリレート、イソボルニルメタクリレート、ジンクロペンテニルアクリレート、ボルニルアクリレート、ボルニルメタクリレート、2−ヒドロキシエチルアクリレート、2−ヒドロキシプロピルアクリレート、プロピレングリコールアクリレート、ビニルピロリドン、アクリルアミド、酢酸ビニル、スチレン等が挙げられる。また多官能性化合物としては、トリメチロールプロパントリアクリレート、EO変性トリメチロールプロパントリアクリレート、エチレングリコールジアクリレート、テトラエチレングリコールジアクリレート、ポリエチレングリコールジアクリレート、1,4−ブタンジオールジアクリレート、1,6−ヘキサンジオールジアクリレート、ネオペンチルグリコールジアクリレート、ジシクロペンテニルジアクリレート、ポリエステルジアクリレート、ジアリルフタレート等が挙げられる。これらの単官能性化合物や多官能性化合物の1種以上を単独または混合物の形で使用することができる。 Examples of the monofunctional compound of the polymerizable vinyl compound include isobornyl acrylate, isobornyl methacrylate, dincropentenyl acrylate, borneyl acrylate, bornyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and propylene glycol. Examples thereof include acrylate, vinylpyrrolidone, acrylamide, vinyl acetate and styrene. Examples of the polyfunctional compound include trimethyl propanetriacrylate, EO-modified trimethylpropantriacrylate, ethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, 1,4-butanediol diacrylate, and 1,6. -Hexanediol diacrylate, neopentyl glycol diacrylate, dicyclopentenyl diacrylate, polyester diacrylate, diallyl phthalate and the like can be mentioned. One or more of these monofunctional compounds and polyfunctional compounds can be used alone or in the form of a mixture.
ビニル系化合物の重合開始剤としては、光重合開始剤が用いられる。光重合開始剤としては、2,2−ジメトキシ−2−フェニルアセトフェノン、1−ヒドロキシシクロヘキシルフェニルケトン、アセトフェノン、ベンゾフェノン、キサントン、フルオレノン、ベンズアルデヒド、フルオレン、アントラキノン、トリフェニルアミン、カルバゾール、3−メチルアセトフェノン、ミヒラーケトン等が代表的なものとして挙げることができ、これらの開始剤を1種または2種以上組み合わせて使用することができる。必要に応じてアミン系化合物等の増感剤を併用することも可能である。これらの重合開始剤の使用量は、ビニル系化合物に対してそれぞれ0.1〜10質量%であることが好ましい。 As the polymerization initiator of the vinyl compound, a photopolymerization initiator is used. Photopolymerization initiators include 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenylketone, acetophenone, benzophenone, xantone, fluorenone, benzaldehyde, fluorene, anthraquinone, triphenylamine, carbazole, 3-methylacetophenone, Michler ketone and the like can be mentioned as typical examples, and one or a combination of two or more of these initiators can be used. If necessary, a sensitizer such as an amine compound can be used in combination. The amount of these polymerization initiators used is preferably 0.1 to 10% by mass, respectively, with respect to the vinyl compound.
エポキシ系化合物としては、水素添加ビスフェノールAジグリシジルエーテル、3,4−エポキシシクロヘキシルメチル−3,4−エポキシシクロヘキサンカルボキシレート、2−(3,4−エポキシシクロヘキシル−5,5−スピロ−3,4−エポキシ)シクロヘキサン−m−ジオキサン、ビス(3,4−エポキシシクロヘキシルメチル)アジペート等が挙げられる。これらのエポキシ系化合物を用いる場合には、トリフェニルスルホニウムヘキサフルオロアンチモネート等のエネルギー活性カチオン開始剤を用いることができる。 Examples of the epoxy compound include hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, and 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4). -Epoxy) Cyclohexane-m-dioxane, bis (3,4-epoxycyclohexylmethyl) adipate and the like can be mentioned. When these epoxy compounds are used, an energy active cation initiator such as triphenylsulfonium hexafluoroantimonate can be used.
さらに光硬化性樹脂には、レベリング剤、界面活性剤、有機高分子化合物、有機可塑剤等を必要に応じて添加してもよい。 Further, a leveling agent, a surfactant, an organic polymer compound, an organic plasticizer and the like may be added to the photocurable resin as needed.
次に、立体造形物の製造方法の一例を説明する。具体的には、光硬化性樹脂を含む樹脂組成物を用いた立体造形物の製造方法について説明する。なお樹脂組成物は既述の通りであり、ここでは説明を省略する。 Next, an example of a method for manufacturing a three-dimensional model will be described. Specifically, a method for producing a three-dimensional model using a resin composition containing a photocurable resin will be described. The resin composition is as described above, and description thereof will be omitted here.
まず光硬化性樹脂組成物からなる1層の液状層を準備する。例えば液状の光硬化性樹脂組成物を満たした槽内に造形用ステージを設け、ステージ上面が液面から所望の深さ(例えば0.2mm程度)となるように位置させる。このようにすることで、ステージ上に液状層を準備することができる。 First, a single liquid layer made of a photocurable resin composition is prepared. For example, a modeling stage is provided in a tank filled with a liquid photocurable resin composition, and the upper surface of the stage is positioned so as to have a desired depth (for example, about 0.2 mm) from the liquid surface. By doing so, a liquid layer can be prepared on the stage.
次に、この液状層に活性エネルギー線、例えば紫外線レーザーを照射して光硬化性樹脂を硬化させ、所定のパターンを有する硬化層を形成する。なお活性エネルギー線としては、紫外線の他に、可視光線、赤外線等のレーザー光を用いることができる。 Next, the liquid layer is irradiated with an active energy ray, for example, an ultraviolet laser to cure the photocurable resin to form a cured layer having a predetermined pattern. As the active energy ray, laser light such as visible light or infrared light can be used in addition to ultraviolet light.
続いて、形成した硬化層上に、光硬化性樹脂組成物からなる新たな液状層を準備する。例えば、前記した造形用ステージを1層分下降させることにより、硬化層上に光硬化性樹脂を導入し、新たな液状層を準備することができる。 Subsequently, a new liquid layer made of a photocurable resin composition is prepared on the formed cured layer. For example, by lowering the modeling stage by one layer, a photocurable resin can be introduced onto the cured layer, and a new liquid layer can be prepared.
その後、硬化層上に準備した新たな液状層に活性エネルギー線を照射して、前記硬化層と連続した新たな硬化層を形成する。 Then, the new liquid layer prepared on the cured layer is irradiated with active energy rays to form a new cured layer continuous with the cured layer.
以上の操作を繰り返すことによって硬化層を連続的に積層し、所定の立体造形物を得る。 By repeating the above operation, the cured layers are continuously laminated to obtain a predetermined three-dimensional model.
本発明の無機充填材粒子を配合した樹脂組成物を使用することにより、所望の濃色を呈した立体造形物を製造することができる。例えば樹脂組成物中に本発明の無機充填材粒子を30体積%配合した場合において、60以下、特に50以下の明度L*を達成することができる。 By using the resin composition containing the inorganic filler particles of the present invention, it is possible to produce a three-dimensional model having a desired dark color. For example, when the inorganic filler particles of the present invention are blended in a resin composition in an amount of 30% by volume, a brightness L * of 60 or less, particularly 50 or less can be achieved.
以下に、本発明を実施例に基づいて説明するが、本発明は以下の実施例に何ら限定されるものではない。 Hereinafter, the present invention will be described based on examples, but the present invention is not limited to the following examples.
(実施例1)
(無機充填材粒子の作製)
質量%で、SiO2 52%、B2O3 7%、Al2O3 14%、MgO 0.5%、CaO 25%、Na2O 0.6%、K2O 0.1%、TiO2 0.5%、F 0.3%のガラス組成となるように原料を調合し、1500〜1600℃で4〜8時間溶融した後、フィルム状に成形した。フィルム状ガラスを粉砕することにより、平均粒子径10μmのガラス粒子(軟化点800℃)を得た。このガラスを火炎法によりビーズ化し、ナイロン製篩により分級を行った。得られたガラス粒子に対し、Fe、Cr及びNiを含有する金属粒子を混合することにより無機充填材粒子を得た。得られた無機充填材粒子を分析したところ、ガラス粒子1gに対して1605μgの金属粒子(Fe 1500μg、Cr 100μg、Ni 5μg)が付着していた。
(Example 1)
(Preparation of inorganic filler particles)
By mass%, SiO 2 52%, B 2 O 3 7%, Al 2 O 3 14%, 0.5% MgO, CaO 25%, Na 2 O 0.6%, K 2 O 0.1%, TiO The raw materials were prepared so as to have a glass composition of 20.5% and F 0.3%, melted at 1500 to 1600 ° C. for 4 to 8 hours, and then formed into a film. By pulverizing the film-shaped glass, glass particles having an average particle diameter of 10 μm (softening point 800 ° C.) were obtained. This glass was beaded by a flame method and classified by a nylon sieve. Inorganic filler particles were obtained by mixing metal particles containing Fe, Cr and Ni with the obtained glass particles. When the obtained inorganic filler particles were analyzed, 1605 μg of metal particles (Fe 1500 μg, Cr 100 μg, Ni 5 μg) were attached to 1 g of glass particles.
得られた無機充填材粒子について、色差計を用いて明度L*値を測定したところ85であった。 The resulting inorganic filler particles was 85 was measured Lightness L * value with a color difference meter.
(光硬化性樹脂の作製)
まずイソホロンジイソシアネート、モルホリンアクリルアミドおよびジブチル錫ジラウレートをオイルバスで加熱した。グリセリンモノメタクリレートモノアクリレートにメチルヒドロキノンを均一に混合溶解させた液を投入し、撹拌混合して反応させた。ペンタエリスリトールのプロピレンオキサイド4モル付加物(ペンタエリスリトールの4個の水酸基にプロピレンオキサイドをそれぞれ1モル付加したもの)を加え、反応させて、ウレタンアクリレートオリゴマーとモルホリンアクリルアミドを含む反応生成物を製造した。
(Preparation of photocurable resin)
First, isophorone diisocyanate, morpholine acrylamide and dibutyl tin dilaurate were heated in an oil bath. A solution prepared by uniformly mixing and dissolving methylhydroquinone in glycerin monomethacrylate monoacrylate was added, and the mixture was stirred and mixed for reaction. A reaction product containing urethane acrylate oligomer and morpholine acrylamide was produced by adding 4 mol adducts of pentaerythritol propylene oxide (1 mol adduct of propylene oxide added to each of the 4 hydroxyl groups of pentaerythritol) and reacting them.
得られたウレタンアクリレートオリゴマーとモルホリンアクリルアミドに、モルホリンアクリルアミド、ジシクロペンタニルジアクリレートを添加した。さらに、1−ヒドロキシシクロヘキシルフェニルケトン(光重合開始剤)を添加し、無色透明なアクリル系光硬化性樹脂を得た。 Morpholine acrylamide and dicyclopentanyl diacrylate were added to the obtained urethane acrylate oligomer and morpholine acrylamide. Further, 1-hydroxycyclohexylphenyl ketone (photopolymerization initiator) was added to obtain a colorless and transparent acrylic photocurable resin.
(立体造形用樹脂組成物の調製及び立体造形物の作製)
上記で得られた光硬化性樹脂70体積%に対し無機充填材粒子30体積%を添加し、3本ローラーにより混練を行い、均質に無機充填材粒子を分散させたペースト状の樹脂組成物を得た。得られた樹脂組成物をテフロン製の内寸30mm□の型枠に流し入れた。その後、500mW、波長364nmの光を照射して、樹脂組成物を硬化させた後、80℃でアニールすることにより立体造形物を得た。得られた立体造形物について、色差計を用いて明度L*値を測定したところ40であった。
(Preparation of resin composition for three-dimensional modeling and production of three-dimensional modeling)
To 70% by volume of the photocurable resin obtained above, 30% by volume of inorganic filler particles were added and kneaded with three rollers to obtain a paste-like resin composition in which the inorganic filler particles were uniformly dispersed. Obtained. The obtained resin composition was poured into a Teflon-made mold having an inner size of 30 mm □. Then, the resin composition was cured by irradiating with light having a wavelength of 500 mW and a wavelength of 364 nm, and then annealed at 80 ° C. to obtain a three-dimensional model. The brightness L * value of the obtained three-dimensional model was measured using a color difference meter and found to be 40.
(実施例2)
得られたガラス粒子に対し、Fe、Cr及びNiの含有割合が実施例1とは異なる金属粒子を混合したこと以外は実施例1と同様にして無機充填材粒子を得た。得られた無機充填材粒子を分析したところ、ガラス粒子1gに対して1917μgの金属粒子(Fe 1800μg、Cr 110μg、Ni 7μg)が付着していた。得られた無機充填材粒子の明度L*値を測定したところ84であった。また、当該無機充填材粒子を用いて実施例と同様の方法で立体造形物を作製し、明度L*値を測定したところ37であった。
(Example 2)
Inorganic filler particles were obtained in the same manner as in Example 1 except that metal particles having different contents of Fe, Cr and Ni from Example 1 were mixed with the obtained glass particles. When the obtained inorganic filler particles were analyzed, 1917 μg of metal particles (Fe 1800 μg, Cr 110 μg, Ni 7 μg) were attached to 1 g of the glass particles. The brightness L * value of the obtained inorganic filler particles was measured and found to be 84. Further, a three-dimensional model was produced using the inorganic filler particles by the same method as in the example, and the brightness L * value was measured and found to be 37.
(比較例)
実施例1で得られたガラス粒子に対し、金属粒子を混合せずにそのまま無機充填材粒子とした。当該無機充填材粒子の明度L*値を測定したところ91であった。また、当該無機充填材粒子を用いて実施例と同様の方法で立体造形物を作製し、明度L*値を測定したところ61であった。
(Comparison example)
The glass particles obtained in Example 1 were used as they were as inorganic filler particles without mixing the metal particles. The brightness L * value of the inorganic filler particles was measured and found to be 91. Further, a three-dimensional model was produced using the inorganic filler particles by the same method as in the example, and the brightness L * value was measured and found to be 61.
Claims (7)
ガラス粒子1gに対し、金属粒子が200〜5000μg付着している無機充填材粒子。 On the surface of the glass particles are deposited metal particles, Lightness (L * value) of an inorganic filler particles, characterized in that it is 90 or less,
Inorganic filler particles in which 200 to 5000 μg of metal particles are attached to 1 g of glass particles.
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