JP6898874B2 - Endoscope imaging device and endoscope - Google Patents

Description

The present invention relates to an endoscope imaging device and an endoscope.

The endoscopic image pickup device described in Patent Document 1 includes an image pickup element, a flexible substrate on which the image pickup element is mounted, and a cable having a plurality of core wires connected to the flexible substrate. The flexible substrate includes a first substrate portion on which an image pickup element is mounted, a second substrate portion folded over the first substrate portion in a height direction perpendicular to the length direction of the cable, and a height direction. It has a fourth substrate portion folded over the second substrate portion. Electronic components are mounted on the second board portion, and a plurality of pads to which a plurality of core wires included in the cable are connected are provided on the fourth board portion.

Japanese Unexamined Patent Publication No. 2011-224348

The diameter of the insertion portion of the endoscope is required to be reduced, and the imaging device is also required to be miniaturized as the diameter of the insertion portion is reduced. In the image pickup apparatus described in Patent Document 1, the flexible substrate is folded, which enables miniaturization in the length direction. However, there is room for improvement in miniaturization in the height direction and the width direction perpendicular to the length direction.

In the image pickup apparatus described in Patent Document 1, a plurality of pads to which a plurality of core wires are connected are provided side by side at equal intervals in the width direction. In this case, as the number of core wires increases, the pad is reduced and it becomes difficult to connect the core wires. Enlarging the pad to facilitate the connection of the core wires hinders miniaturization in the width direction. In order to achieve both expansion of the pad and miniaturization in the width direction, it is conceivable to provide the pad in two rows, but it is connected to the core wire connected to the pad in the first row and the pad in the second row. The core wire overlaps, which hinders miniaturization in the height direction.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an endoscope imaging device and an endoscope which are advantageous for miniaturization.

The endoscopic image pickup device according to one aspect of the present invention is an endoscope image pickup device mounted on the tip of an insertion portion of the endoscope, and includes an image pickup element, a flexible substrate on which the image pickup element is mounted, and a flexible substrate. A plurality of core wires connected to the flexible substrate are provided, and the flexible substrate extends from the first substrate portion on which the image pickup element is mounted and the first substrate portion in the length direction of the plurality of core wires. A third substrate that is folded over the second substrate portion and has a first end on the first substrate portion side in the length direction and a second end on the opposite side. The third substrate portion includes a portion, and the third substrate portion has a plurality of pads to which the plurality of core wires are connected on a surface facing the second substrate portion, and the plurality of pads intersect with the length direction. The plurality of putt rows are divided into a plurality of putt rows extending in the direction in which the pads are formed, and the plurality of putt rows are provided at intervals in the length direction, and the second end side of the two adjacent putt rows is provided. one pad columns arranged in has at least one core arrangement region core wire connected to the pad of the other pad columns are arranged, the other pad columns, the core of one of the pad columns above It has at least one pad overlapping arrangement region and the longitudinal direction, to have at least one pad overlaps the pad and the length direction of the one pad row above.
The endoscopic imaging device of another aspect of the present invention is an endoscopic imaging device mounted on the tip of an insertion portion of an endoscope, and includes an imaging element and a flexible substrate on which the imaging element is mounted. The flexible substrate includes a plurality of core wires connected to the flexible substrate and a cable having the plurality of core wires, and the flexible substrate includes a first substrate portion on which the imaging element is mounted and the first substrate portion to the above. The second substrate portion extending in the length direction of the plurality of core wires and the second substrate portion are folded over the second substrate portion, and are opposite to the first end on the first substrate portion side in the length direction. The third substrate portion includes a third substrate portion having a second end of the above, and the third substrate portion has a plurality of pads to which the plurality of core wires are connected on a surface facing the second substrate portion. The pads are provided separately in a plurality of putt rows extending in a direction intersecting the length direction, and the plurality of putt rows are provided at intervals in the length direction and are adjacent to each other. One of the putt rows arranged on the second end side of the putt row has at least one core wire arrangement area in which the core wire connected to the putt of the other putt row is arranged, and the other putt row Has at least one pad that overlaps the core wire arrangement region of one of the pad rows in the length direction, and the plurality of core wires are in the height direction perpendicular to the facing surface of the third substrate portion. The core wire group is divided into a plurality of core wire groups having the same number as the plurality of pad rows, and the core wire group closer to the facing surface of the third substrate portion is connected to the pads of the pad row closer to the second end.

Further, the endoscope according to one aspect of the present invention includes the endoscope imaging device at the tip of the insertion portion.

According to the present invention, it is possible to provide an endoscope imaging device and an endoscope which are advantageous for miniaturization.

It is a block diagram of an example of an endoscope system for demonstrating the embodiment of this invention. It is a side view of the endoscope image pickup apparatus mounted on the tip part of the insertion part of the endoscope of FIG. It is a top view of the endoscope imaging apparatus of FIG. It is a schematic diagram which shows the arrangement example of the pad of the flexible substrate. It is a schematic diagram which shows the connection mode of a flexible board and a cable. It is a schematic diagram which shows how to divide the core wire of a cable. It is a schematic diagram which shows the other arrangement example of the pad of a flexible substrate. It is a schematic diagram which shows the other arrangement example of the pad of a flexible substrate. It is a schematic diagram which shows how to divide the core wire of a cable. It is a schematic diagram which shows the other arrangement example of the pad of a flexible substrate.

FIG. 1 shows an example of an endoscopic system for explaining an embodiment of the present invention.

The endoscope system 1 includes an endoscope 2, a light source unit 3, and a processor unit 4. The endoscope 2 has an insertion portion 6 to be inserted into a subject, an operation portion 7 connected to the insertion portion 6, and a universal cord 8 extending from the operation portion 7, and the insertion portion 6 has a tip portion 10 and an insertion portion 6. It is composed of a curved portion 11 connected to the tip portion 10 and a soft portion 12 connecting the curved portion 11 and the operating portion 7.

An image pickup device including an image pickup element is mounted on the tip portion 10. The curved portion 11 is configured to be bendable, and the bending operation of the curved portion 11 is operated by the operating portion 7. Further, the flexible portion 12 is configured to be relatively flexible so as to be deformable according to the shape of the insertion path in the subject.

The operation unit 7 is provided with a button for operating an image pickup using the image pickup device and a rotary knob for operating the bending operation of the bending unit 11. Further, the operation unit 7 is also provided with a treatment tool insertion port 13 into which a treatment tool such as a high-frequency snare is inserted, and the treatment tool channel 14 from the treatment tool insertion port 13 to the tip portion 10 is inside the insertion portion 6. It is provided in.

A light guide and a cable are provided inside the insertion unit 6, the operation unit 7, and the universal cord 8, and a connector 9 is provided at the end of the universal cord 8. The endoscope 2 is connected to the light source unit 3 and the processor unit 4 via the connector 9.

The illumination light generated by the light source unit 3 is guided to the tip portion 10 via the light guide, and is emitted from the tip portion 10. Further, the operating power of the image sensor, the control signal for driving the image sensor, and the image signal output from the image sensor are transmitted between the processor unit 4 and the image sensor via the cable. The processor unit 4 processes the input image signal to generate image data of the observation site in the subject, displays the generated image data on the monitor 5, and records the generated image data. A light emitting element such as an LED (light emitting diode) may be mounted on the tip portion 10, and the light emitting element may generate illumination light.

2 and 3 show the configuration of the image pickup apparatus mounted on the tip portion 10 of the insertion portion 6.

The image pickup device 20 mounted on the tip portion 10 includes an image pickup optical system 21, an image pickup element 22, a flexible substrate 23 on which the image pickup element 22 is mounted, and a plurality of core wires 25 connected to the flexible substrate 23. In the illustrated example, the plurality of core wires 25 are integrally bundled by a sheath or the like to form the cable 24, but they may be separated from each other.

The imaging optical system 21 has one or more lenses 30 and a prism 31. In a state where the image pickup apparatus 20 is mounted on the tip portion 10 of the insertion portion 6, the optical axis of the lens 30 is arranged parallel to the longitudinal axis of the insertion portion 6. The prism 31 is reflected by an incident surface 32 on which light passing through the lens 30 is incident, a reflecting surface 33 that reflects light incident on the incident surface 32 in a direction different from the incident direction with respect to the incident surface 32, and a reflecting surface 33. It has an exit surface 34 that emits light.

The incident surface 32 is arranged perpendicular to the optical axis of the lens 30, and the reflecting surface 33 is arranged so as to be inclined with respect to the optical axis. In the illustrated example, the incident surface 32 is arranged so as to be inclined at an angle of 45 °. The light incident on the incident surface 32 along the optical axis of the lens 30 is reflected by the reflecting surface 33 in the direction orthogonal to the optical axis. The emitting surface 34 is arranged along the optical axis of the lens 30 on the incident surface 32 and perpendicular to the traveling direction of the light reflected by the reflecting surface 33. In the illustrated example, the optical axis of the lens 30 is arranged. It is arranged parallel to.

The image sensor 22 is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementaly Metal Oxide Semiconductor) image sensor. The image pickup device 22 is bonded to the exit surface 34 of the prism 31 via an adhesive, and is arranged parallel to the optical axis of the lens 30 like the exit surface 34. The image pickup device 22 performs photoelectric conversion of the light emitted from the exit surface 34 of the prism 31 to generate an image signal.

The flexible substrate 23 includes a first substrate portion 40 on which the image pickup element 22 is mounted, and a second substrate portion 41 extending from the first substrate portion 40 in the length direction of the cable 24 (the length direction of the insertion portion 6). , A third substrate portion 42 folded over the second substrate portion 41, and in the illustrated example, a fourth substrate portion 43 arranged between the second substrate portion 41 and the third substrate portion 42. Including further. The third board portion 42 is provided with a plurality of pads to which the core wire 25 of the cable 24 is connected, and the fourth board portion 43 is provided with a plurality of electronic components 46 such as a chip resistor, a chip capacitor, and a crystal oscillator. Is implemented.

The overlapping direction of the second substrate portion 41, the third substrate portion 42, and the fourth substrate portion 43 is the height direction (Z direction) of the image pickup apparatus 20, and the length direction (X direction) and the height direction (Z direction) of the cable 24. The direction perpendicular to the width direction (direction) is defined as the width direction (Y direction) of the image pickup apparatus 20, and the second substrate portion 41 and the fourth substrate portion 43 are bent approximately 180 ° about an axis extending in the width direction (Y direction). It is connected via the first bent portion 44. Further, the fourth substrate portion 43 and the third substrate portion 42 are connected via a second bent portion 45 that is bent by approximately 180 ° about an axis extending in the length direction (X direction).

The method of bending the flexible substrate 23 is not limited to the illustrated example. For example, the second bent portion 45 that connects the fourth substrate portion 43 and the third substrate portion 42 is provided on the side opposite to the first bent portion 44 side of the fourth substrate portion 43 and is provided in the width direction (Y direction). It may be bent in a U shape about a shaft extending in a U shape. Further, even if the prism 31 is omitted, the image sensor 22 is arranged orthogonal to the optical axis of the lens 30, and the first substrate portion 40 on which the image sensor 22 is mounted is also arranged orthogonal to the optical axis of the lens 30. Often, in this case, the first substrate portion 40 and the second substrate portion 41 are connected via a third bent portion that is bent by approximately 90 ° about an axis extending in the width direction (Y direction).

In this example in which the image sensor 22 is arranged parallel to the optical axis of the lens 30, the first substrate portion 40 on which the image sensor 22 is mounted is also parallel to the optical axis of the lens 30, that is, in the length direction (that is, in the length direction ( It is arranged along the X direction), and the first substrate portion 40 and the second substrate portion 41 extend linearly. The fourth substrate portion 43 folded over the second substrate portion 41 has a first region 43a facing the first substrate portion 40 and a second region 43b facing the second substrate portion 41.

In mounting the electronic component 26 on the fourth substrate portion 43, preferably, as shown in FIG. 2, relatively low-profile electronic components such as a chip resistor and a chip capacitor are mounted in the first region 43a, and the first region 43a is mounted. A relatively tall electronic component such as a crystal oscillator is mounted on the two regions 43b. By mounting a low-profile electronic component in the first region 43a facing the first substrate portion 40 on which the image pickup element 22 is mounted, as compared with the case where the tall electronic component is mounted in the first region 43a. The flexible substrate 23 is moved in the height direction (Z direction) by avoiding interference between the image pickup element 22 and the electronic components and narrowing the distance between the first substrate portion 40, the second substrate portion 41, and the fourth substrate portion 43. It can be folded into a small size, and the image pickup device 20 can be miniaturized in the height direction (Z direction).

In reducing the size of the image pickup device 20 in the height direction (Z direction), it is also effective to make the image pickup device 22 thinner. Then, in thinning the image sensor 22, preferably, as shown in FIG. 3, the first substrate portion 40 is formed wider than the image sensor 22. Thereby, the image pickup device 22 can be protected.

FIG. 4 shows an example of arranging a plurality of pads provided on the third substrate portion 42 of the flexible substrate 23.

A plurality of pads 50 are provided on the surface 42a of the third substrate portion 42 facing the second substrate portion 41, and the core wire 25 (see FIG. 2) of the cable 24 is connected to each of these pads 50. .. Further, the end on the first substrate 40 side in the length direction (X direction) is the first end 42b of the third substrate 42, the opposite end is the second end 42c, and the second end 42c of the facing surface 42a . A ground pad 51 to which a shield conductor 26 (see FIG. 2) exposed to the terminal portion of the cable 24 is connected is also provided on the side. The plurality of putts 50 are provided separately in a plurality of putt rows extending in a direction intersecting the length direction (X direction), and the plurality of putt rows are provided at intervals in the length direction (X direction). In the illustrated example, the first putt row 52 and the second putt row 53 are provided separately, and the first putt row 52 and the second putt row 53 are provided in the length direction (X direction). ) And parallel to each other in the width direction (Y direction), and are provided at intervals in the length direction (X direction). As described above, since the plurality of putts 50 are provided separately in the first putt row 52 and the second putt row 53, they are individually provided as compared with the case where these putts 50 are provided in one row. The pad 50 can be enlarged and the image pickup device 20 can be miniaturized in the width direction (Y direction). The first putt row 52 and the second putt row 53 do not have to be parallel to each other as long as they do not intersect with each other.

The first putt row 52 is arranged closer to the second end 42c of the third substrate portion 42 than the second putt row 53. The first putt row 52 has one or more putts 50 at each end on both sides in the extending direction of the putt row, and in the illustrated example, has two putts 50 at each end on both sides. The first putt row 52 has a core wire arrangement region 55 at the center in the putt row extending direction. The pad 50 is not provided in the core wire arrangement region 55, and hereinafter, the region excluding the core wire arrangement region 55 from the first putt row 52 is referred to as a putt forming region 56. The dimension w of the core wire arrangement region 55 in the extending direction of the pad row is larger than the distance p of the adjacent pads 50 in the pad forming region 56.

The second putt row 53 has at least one putt 50 that overlaps the core wire arrangement region 55 of the first putt row 52 in the length direction (X direction), and in the illustrated example, two putts that overlap the core wire arrangement region 55. Has 50. Further, the second putt row 53 has two putts 50 that overlap with the putt forming region 56 of the first putt row 52 in the length direction (X direction). In the following, the pad that overlaps with the core wire arrangement region 55 will be referred to as a pad 50a, and the pad that overlaps with the putt forming region 56 will be referred to as a putt 50b, and will be distinguished as necessary.

FIG. 5 shows a connection mode between the flexible substrate 23 of FIG. 4 and the cable 24, and FIG. 6 shows a method of dividing the core wire 25 of the cable 24 in the connection mode of FIG. The core wire connected to the plurality of pads 50 in the first putt row 52 is referred to as the core wire 25a, and the core wire connected to the plurality of pads 50 in the second putt row 53 is designated as the core wire 25b, and are distinguished as necessary.

The plurality of core wires 25b connected to the putt 50 of the second putt row 53 pass through the central core wire arrangement region 55 of the first putt row 52 in close contact with each other, and after passing over the first putt row 52, are in close contact with each other. It is released and connected to the putt 50 of the second putt row 53.

The plurality of putts 50 of the first putt row 52 are provided in the putt forming regions 56 at both ends of the first putt row 52, and the plurality of core wires 25a connected to these putts 50 are connected to the terminal portion of the cable 24. It is branched from a plurality of core wires 25b passing through the central core wire arrangement region 55 of the first putt row 52 with the first putt row 52, and is connected to the putt 50 of the first putt row 52.

As described above, in the folded state of the flexible substrate 23, at least the core wire 25b connected to the pad 50a of the second pad row 53 overlapping the core wire arrangement region 55 of the first pad row 52, and the first putt row 52. The overlap with the core wire 25a connected to the pad 50 is eliminated. As a result, the distance between the second substrate portion 41 and the third substrate portion 42 can be narrowed, in other words, the plurality of core wires 25 of the cable 24 can be crushed to a low height, and the flexible substrate 23 can be folded into a small size. It can be miniaturized in the height direction (Z direction).

Preferably, as shown in FIG. 6, the plurality of core wires 25 of the cable 24 have the same number of first core wires as the pad row in the height direction (Z direction) perpendicular to the facing surface 42a of the third substrate portion 42. It is divided into a group 27 and a second core wire group 28. Then, the core wire of the first core wire group 27 close to the facing surface 42a is connected to the pad 50 of the first pad row 52 near the second end 42c of the third substrate portion 42, and the second core wire group 28 far from the facing surface 42a. Is connected to the putt 50 of the second putt row 53 far from the second end 42c. As a result, the bending of the core wire 25a connected to the pad 50 of the first pad row 52 can be alleviated, and damage to the core wire 25a can be suppressed.

Further, the control signal for driving the image pickup element 22 and the signal line for transmitting the image signal output from the image pickup element 22 directly affect the image quality, and preferably, the control signal and the image signal among the plurality of core wires 25 of the cable 24. Is connected to the putts 50 at both ends of the first putt row 52 and / or the putts 50a of the second putt row 53 overlapping the core wire arrangement region 55 of the first putt row 52 in the length direction (X direction). Will be done. As a result, the overlap between the signal line for transmitting the control signal and the image signal and the other core wire 25 can be eliminated, and the image quality can be improved.

The arrangement of the putts 50 in the first putt row 52 and the second putt row 53 is not limited to the above-mentioned example. In the example shown in FIG. 7, the first putt row 52 has a plurality of putts 50 at one end in the putt row extending direction, and has a core wire arrangement region 55 at the other end. The second putt row 53 has a plurality of putts 50 at the other end in the putt row extending direction, and some putts 50 have a core wire arrangement region 55 of the first putt row 52 and a length direction (X). It overlaps in the direction).

Also, the putt row is not limited to two rows. In the example shown in FIG. 8, the plurality of putts 50 are a first putt row 52 extending in parallel with an interval in the length direction (X direction), a second putt row 53, and a third putt row 54. It is divided into rows. The first putt row 52 has a plurality of putts 50 at one end in the putt row extending direction, and the second putt row 53 has a plurality of putts 50 at the center in the putt row extending direction. , The third putt row 54 has a plurality of putts 50 at the other end in the putt row extending direction. A part of the putts 50 of the second putt row 53 overlaps the core wire arrangement area 55 of the first putt row 52 in the length direction (X direction), and a part of the putts 50 of the third putt row 54 is the first putt 50. It overlaps the core wire arrangement region 55 of the 1-put row 52 and the core wire arrangement region 57 of the second putt row 53 in the length direction (X direction).

The plurality of core wires connected to the putt 50 of the third putt row 54 pass through the core wire arrangement region 55 of the first putt row 52 and the core wire arrangement region 57 of the second putt row 53 in close contact with each other, and pass through the second putt. After crossing the row 53, they are released from close contact with each other and connected to the putt 50 of the third putt row 54.

The plurality of core wires connected to the putt 50 of the second putt row 53 pass through the core wire arrangement region 55 of the first putt row 52 in close contact with each other, and are between the first putt row 52 and the second putt row 53. Then, the core wires passing through the core wire arrangement region 57 of the second putt row 53 are branched from each other and are released from close contact with each other, and are connected to the putt 50 of the second putt row 53.

The plurality of core wires connected to the plurality of pads 50 of the first putt row 52 are a plurality of core wires passing through the core wire arrangement area 55 of the first putt row 52 between the terminal portion of the cable 24 and the first putt row 52. It is branched from the core wire and connected to the pad 50 of the first pad row 52.

When a plurality of pads 50 are provided in three rows, preferably, as shown in FIG. 9, the plurality of core wires 25 of the cable 24 have a height perpendicular to the facing surface 42a of the third substrate portion 42. In the direction (Z direction), the first core wire group 27, the second core wire group 28, and the third core wire group 29 are divided into the same number as the pad row. The core wire 25 of the first core wire group 27 closest to the facing surface 42a is connected to the pad 50 of the first pad row 52 closest to the second end 42c of the third substrate portion 42, and is the farthest from the facing surface 42a. The core wire 25 of the three core wire group 29 is connected to the pad 50 of the third putt row 54 farthest from the second end 42c, and the core wire 25 of the remaining second core wire group 28 is connected to the putt 50 of the second putt row 53. To.

FIG. 10 shows another arrangement example of the plurality of pads provided on the third substrate portion 42 of the flexible substrate 23.

In the example shown in FIG. 10, the plurality of putts 50 are provided separately in two rows, a first putt row 52 and a second putt row 53 extending in parallel at intervals in the length direction (X direction). There is. The first putt row 52 has a plurality of putts 50, and these putts 50 are arranged at equal intervals in the putt row extending direction. The second putt row 53 also has a plurality of putts 50, and these putts 50 are arranged at equal intervals in the putt row extending direction. Each of the putts 50 in the second putt row 53 overlaps the region between the adjacent putts 50 in the first putt row 52 in the length direction (X direction). That is, the core wire arrangement region 55 is formed between the adjacent pads 50 in the first putt row 52.

The plurality of core wires connected to the putt 50 of the first putt row 52 and the plurality of core wires connected to the putt 50 of the second putt row 53 are both between the terminal portion of the cable 24 and the first putt row 52. The state of being in close contact with each other is solved. Then, the core wire connected to the pad 50 of the second putt row 53 passes through the core wire arrangement region 55 of the first putt row 52 and overlaps the core wire arrangement region 55 in the length direction (X direction). It is connected to the pad 50 of the pad row 53.

As described above, the endoscopic image pickup device disclosed in the present specification is an endoscope image pickup device mounted on the tip end portion of an insertion portion of the endoscope, and the image pickup element and the image pickup element are included. The flexible substrate includes a flexible substrate to be mounted and a plurality of core wires connected to the flexible substrate. The flexible substrate includes a first substrate portion on which the image pickup element is mounted and a plurality of core wires from the first substrate portion. The second substrate portion extending in the length direction of the above and the second substrate portion which is folded over the second substrate portion and is opposite to the first end on the first substrate portion side in the length direction. The third substrate portion includes a third substrate portion having an end, and the third substrate portion has a plurality of pads to which the plurality of core wires are connected on a surface facing the second substrate portion, and the plurality of pads , The plurality of putt rows extending in a direction intersecting the length direction are provided separately, and the plurality of putt rows are provided at intervals in the length direction, and two adjacent putt rows are provided. One of the putt rows arranged on the second end side of the pad row has at least one core wire arrangement area in which the core wires connected to the pads of the other putt row are arranged, and the other putt row has the above-mentioned one. It has at least one pad that overlaps with the core wire arrangement area of the pad row in the length direction.

Further, the endoscopic imaging apparatus disclosed in the present specification includes the cable having the plurality of core wires.

Further, in the endoscopic imaging apparatus disclosed in the present specification, the plurality of core wires are the same number as the plurality of pad rows in the height direction perpendicular to the facing surface of the third substrate portion. The core wire group closer to the facing surface of the third substrate portion is connected to the pad of the pad row closer to the second end.

Further, in the endoscopic imaging apparatus disclosed in the present specification, the plurality of putts are provided separately in two putt rows, a first putt row and a second putt row, and the first putt row is provided. The putt row is arranged closer to the second end side than the second putt row, has one or more putts at each end on both sides in the putt row extending direction, and is centered in the putt row extending direction. The portion has the core wire arrangement area.

Further, in the endoscopic image pickup apparatus disclosed in the present specification, the plurality of core wires transmit one or more signal lines for transmitting a control signal for driving the image pickup element and an image signal output from the image pickup element. Including, the signal line is connected to the pads arranged at both ends of the first putt row and / or the putts of the second putt row overlapping the core wire arrangement area of the first putt row in the length direction. There is.

Further, in the endoscope imaging device disclosed in the present specification, the flexible substrate includes a fourth substrate portion arranged between the second substrate portion and the third substrate portion, and the first substrate is included. The unit and the image pickup element are arranged along the length direction, and the fourth substrate portion has a first region facing the first substrate portion and a second region facing the second substrate portion. The electronic component mounted in the first region has a lower profile than the electronic component mounted in the second region.

Further, the endoscope disclosed in the present specification includes the endoscope imaging device at the tip of the insertion portion.

1 Endoscope system 2 Endoscope 3 Light source unit 4 Processor unit 5 Monitor 6 Insertion part 7 Operation part 8 Universal cord 9 Connector 10 Tip part 11 Curved part 12 Flexible part 13 Treatment tool insertion port 14 Treatment tool channel 20 Imaging device 21 Imaging optical system 22 Imaging element 23 Flexible substrate 24 Cable 25 Core wire 25a Core wire 25b Core wire 26 Shield conductor 27 1st core wire group 28 2nd core wire group 29 3rd core wire group 30 Lens 31 Prism 32 Incident surface 33 Reflection surface 34 Exit surface 40 No. 1 Board part 41 Second board part 42 Third board part 42a Facing surface 42b First end 42c Second end 43 Fourth board part 43a First area 43b Second area 44 First bending part 45 Second bending part 46 Electronic parts 50 putt 50a putt 50b putt 51 ground putt 52 first putt row 53 second putt row 54 third putt row 55 core wire arrangement area 56 putt formation area 57 core wire arrangement area p spacing between adjacent pads w width dimension of core wire arrangement area

Claims (7)

It is an endoscope imaging device mounted on the tip of the insertion part of the endoscope.
Image sensor and
A flexible substrate on which the image sensor is mounted and
A plurality of core wires connected to the flexible substrate and
With
The flexible substrate is
The first substrate portion on which the image sensor is mounted and
A second substrate portion extending from the first substrate portion in the length direction of the plurality of core wires, and a second substrate portion.
A third substrate portion that is folded over the second substrate portion and has a first end on the side of the first substrate portion in the length direction and a second end on the opposite side.
Including
The third substrate portion has a plurality of pads to which the plurality of core wires are connected on a surface facing the second substrate portion.
The plurality of pads are provided separately in a plurality of rows of pads extending in a direction intersecting the length direction.
The plurality of putt rows are provided at intervals in the length direction.
One of the two adjacent putt rows arranged on the second end side has at least one core wire arrangement region in which the core wire connected to the pad of the other putt row is arranged, and the other one. Pat column of, have at least one pad overlaps the length direction as the core arrangement region of the one pad row, have at least one pad overlapping in the longitudinal direction and pad of the one pad column Endoscopic imaging device. The endoscopic imaging device according to claim 1.
An endoscopic imaging device including a cable having a plurality of core wires. It is an endoscope imaging device mounted on the tip of the insertion part of the endoscope.
Image sensor and
A flexible substrate on which the image sensor is mounted and
A plurality of core wires connected to the flexible substrate and
With the cable having a plurality of core wires,
With
The flexible substrate is
The first substrate portion on which the image sensor is mounted and
A second substrate portion extending from the first substrate portion in the length direction of the plurality of core wires, and a second substrate portion.
A third substrate portion that is folded over the second substrate portion and has a first end on the side of the first substrate portion in the length direction and a second end on the opposite side.
Including
The third substrate portion has a plurality of pads to which the plurality of core wires are connected on a surface facing the second substrate portion.
The plurality of pads are provided separately in a plurality of rows of pads extending in a direction intersecting the length direction.
The plurality of putt rows are provided at intervals in the length direction.
Of the two adjacent putt rows, one putt row arranged on the second end side has at least one core wire arrangement region in which the core wire connected to the putt of the other putt row is arranged, and the other one. The pad row of the pad has at least one pad that overlaps the core wire arrangement region of the one pad row in the length direction.
The plurality of core wires are divided into a plurality of core wire groups having the same number as the plurality of pad rows in the height direction perpendicular to the facing surface of the third substrate portion.
An endoscopic imaging device in which a group of core wires closer to the facing surface of the third substrate portion is connected to a pad in a pad row closer to the second end. The endoscopic imaging device according to any one of claims 1 to 3.
The plurality of putts are provided separately in two putt rows, a first putt row and a second putt row.
The first putt row is arranged closer to the second end side than the second putt row, has one or more putts at each end on both sides in the putt row extending direction, and the putt row extends. An endoscopic imaging device having the core wire arrangement region at the center of the direction. The endoscopic imaging device according to claim 4.
The plurality of core wires include one or more signal lines for transmitting a control signal for driving the image pickup element and an image signal output from the image pickup element.
The signal line is connected to the pads arranged at both ends of the first putt row and / or the pads of the second putt row overlapping the core wire arrangement region of the first putt row in the length direction. Endoscopic imaging device. The endoscopic imaging device according to any one of claims 1 to 5.
The flexible substrate includes a fourth substrate portion arranged between the second substrate portion and the third substrate portion.
The first substrate portion and the image pickup device are arranged along the length direction.
The fourth substrate portion has a first region facing the first substrate portion and a second region facing the second substrate portion.
The electronic component mounted in the first region is an endoscopic imaging device having a lower profile than the electronic component mounted in the second region. An endoscope provided with the endoscope imaging device according to any one of claims 1 to 6 at the tip of an insertion portion.

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