JP6900660B2 - Module with shield layer - Google Patents

Description

The present invention relates to a module having a shield layer that shields unnecessary electromagnetic waves from electronic components mounted on a wiring board.

In a module in which electronic components such as semiconductor elements are mounted on the mounting surface of a wiring board, a shield layer that shields unnecessary electromagnetic waves may be provided on the electronic components in order to reduce the adverse effects of unnecessary electromagnetic waves radiated by external devices. is there. In this type of module, electronic components mounted on the mounting surface of a wiring board are covered with a sealing resin layer, and a shield layer is provided so as to cover the upper surface and side surfaces of the sealing resin layer and the side surfaces of the wiring board. is there. As such a module, for example, as shown in FIG. 11, there is a semiconductor device 100 described in Patent Document 1.

The semiconductor device 100 includes a wiring board 101, a semiconductor chip 102 mounted on one main surface of the wiring board 101, a sealing resin layer 103 for sealing the semiconductor chip 102, and a sealing resin layer 103. A conductive shield layer 104 that covers the upper surface and the side surface and the side surface of the wiring board 101 is provided. One main surface of the wiring board 101 is provided with a first wiring layer having an internal connection terminal 105 that serves as an electrical connection portion with the semiconductor chip 102, and the other main surface is electrically connected to an external device or the like. A second wiring layer having an external connection terminal 106 and a ground terminal 107 as a portion is provided, and a first solder resist layer 108 and a first solder resist layer 108 and a first solder resist layer 108 as insulating layers are provided on the first wiring layer and the second wiring layer, respectively. The solder resist layer 109 of 2 is formed.

The second solder resist layer 109 is provided with an opening 110 for exposing the external connection terminal 106, and the opening 110 for exposing the ground terminal 107 downward of the wiring board 101 and the opening 110. An open portion 111 which is continuously provided and is exposed toward the side surface of the wiring board 101 is provided. The conductive shield layer 104 is connected to the ground terminal 107 via a connecting portion 112 provided in the opening portion 111.

In the semiconductor device 100 described above, the conductive shield layer 104 is provided so as to cover the upper surface and the side surface of the sealing resin layer 103 and the side surface of the wiring board 101, so that the semiconductor chip 102 or the like of electromagnetic waves radiated from an external device is provided. And prevent unnecessary electromagnetic waves radiated from the semiconductor chip 102 and the like from leaking to the outside.

Japanese Unexamined Patent Publication No. 2015-154032 (see paragraphs 0010 to 0012, FIG. 2)

However, in the semiconductor device 100 described above, there is a risk that electromagnetic waves may enter the inside from the other main surface side of the wiring board 101, or electromagnetic waves may leak to the outside from the other main surface side.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a module capable of improving the shielding characteristics of electronic components by a shielding layer.

In order to achieve the above object, the module of the present invention is mounted on at least one of a wiring board having one main surface and the other main surface and one main surface and the other main surface of the wiring board. A surface other than the electronic component, the sealing resin layer for sealing the at least one main surface and the electronic component, the external terminal electrode, and the wiring substrate and the surface of the sealing resin layer other than the arrangement surface of the external terminal electrode. A first shield layer to be covered and a second shield layer to cover the arrangement surface of the external terminal electrode so as to isolate the external terminal electrode are provided, and the ground electrode and the dummy electrode are provided on the arrangement surface of the external terminal electrode. Is further arranged, and the second shield layer covers the arrangement region of the dummy electrode in the arrangement surface of the external terminal electrode, and provides the arrangement region of the ground electrode and the peripheral region of the arrangement region. not covered, and further comprising a connection conductor for electrically connecting the dummy electrode and the ground electrode.
According to this configuration, the surface for arranging the external terminal electrodes is covered with the first shield layer except for the surface for arranging the external terminal electrodes, and the surface for arranging the external terminal electrodes is covered with the second shield layer so as to isolate the external terminal electrodes. Therefore, the second shield layer reduces the intrusion and leakage of electromagnetic waves from the region not covered by the first shield layer while preventing the external terminal electrode from being electrically connected to the second shield layer. It is possible to improve the shielding characteristics of electronic components by the shield layer. Further, by changing the size of the dummy electrode, the contact area between the ground electrode and the second shield layer can be adjusted.

According to the present invention, the surface for arranging the external terminal electrodes is covered with the first shield layer except for the surface for arranging the external terminal electrodes, and the surface for arranging the external terminal electrodes is covered with the second shield layer so as to isolate the external terminal electrodes. Therefore, the second shield layer reduces the intrusion and leakage of electromagnetic waves from the region not covered by the first shield layer while preventing the external terminal electrode from being electrically connected to the second shield layer. It is possible to improve the shielding characteristics of electronic components by the shield layer.

It is a bottom view of the module which concerns on 1st Embodiment of this invention. FIG. 1 is a cross-sectional view taken along the line AA of FIG. It is a bottom view before the shield of the module which concerns on 2nd Embodiment of this invention. It is a bottom view after the shield of the module which concerns on 2nd Embodiment of this invention. FIG. 4 is a cross-sectional view taken along the line BB "in FIG. It is a bottom view before the shield of the module which concerns on 3rd Embodiment of this invention. It is a bottom view after the shield of the module which concerns on 3rd Embodiment of this invention. FIG. 7 is a cross-sectional view taken along the line CC ”of FIG. It is sectional drawing of the module which concerns on 4th Embodiment of this invention. It is sectional drawing of the module which concerns on 5th Embodiment of this invention. It is sectional drawing of the conventional module.

<First Embodiment>
Module 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a bottom view of the module 1, and FIG. 2 is a cross-sectional view taken along the line AA of FIG.

As shown in FIG. 2, the module 1 according to the first embodiment is mounted on one main surface of the wiring board 2 and the wiring board 2 (corresponding to the "one main surface" on which the electronic component of the present invention is mounted) 2a. A sealing resin layer 4 for sealing the plurality of electronic components 3 and each of the electronic components 3 mounted on one main surface 2a of the wiring board 2 and the one main surface 2a, the upper surface of the sealing resin layer 4, and the surface of the sealing resin layer 4. The first shield layer 5 that covers the side surface and the side surface of the wiring board 2 and the other main surface that is the opposite surface of one main surface 2a of the wiring board 2 (corresponding to the "arrangement surface of the external terminal electrode" of the present invention). ) A part of 2b and a second shield layer 6 provided by covering the side surface of the first shield layer 5, and are mounted on, for example, a mother substrate of an electronic device in which a high frequency signal is used. Is.

The wiring board 2 is formed of, for example, low-temperature co-fired ceramics or glass epoxy resin, while a plurality of land electrodes 7 on which each electronic component 3 is mounted are formed on one main surface 2a and the other main surface 2b. Is formed with a plurality of external terminal electrodes 8 for transmitting and receiving signals to and from an external device. As shown in FIG. 1, the external terminal electrodes 8 are arranged in a matrix of 5 rows and 5 columns. A plurality of ground electrodes (not shown), a plurality of types of wiring electrodes (not shown), and a plurality of via conductors (not shown) are formed inside the wiring board 2. Here, each ground electrode is formed so as to be exposed from the side surface of the wiring board 2, for example, and is electrically connected to the first shield layer 5.

Further, each land electrode 7, each external terminal electrode 8, each ground electrode, and each wiring electrode are each made of a metal generally used as a wiring electrode such as Cu or Al. Further, each via conductor is made of a metal such as Ag or Cu. The land electrode 7 and the external terminal electrode 8 may be plated with Ni / Au.

Examples of each electronic component 3 include semiconductor elements made of semiconductors such as Si and GaAs, and chip components such as chip inductors, chip capacitors, and chip resistors.

The sealing resin layer 4 is provided so as to cover one main surface 2a of the wiring board 2 and each electronic component 3. Further, the sealing resin layer 4 can be formed of a resin generally used as a sealing resin, such as an epoxy resin.

The first shield layer 5 is provided so as to cover the upper surface and the side surface of the sealing resin layer 4 and the side surface of the wiring board 2, and unnecessary electromagnetic waves radiated from an external device are emitted from each electronic component 3 and each of the module 1. The purpose is to reduce the arrival of unnecessary electromagnetic waves to the wiring electrodes and the like, and to reduce the leakage of unnecessary electromagnetic waves radiated from each electronic component 3 of the module 1 and each wiring electrode and the like to the outside. Further, the first shield layer 5 can be formed of, for example, a conductive material such as Cu, Ag, or Al. The upper surface and side surface of the sealing resin layer 4 and the side surface of the wiring board 2 correspond to the "surface other than the arrangement surface of the external terminal electrode" of the present invention.

The second shield layer 6 is provided so as to cover a part of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5, and unnecessary electromagnetic waves radiated from an external device are emitted from the module 1. This is to reduce the arrival of unnecessary electromagnetic waves from each electronic component 3 and each wiring electrode of the module 1 and to reduce the leakage of unnecessary electromagnetic waves radiated from each electronic component 3 and each wiring electrode of the module 1 to the outside. Is.

Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6 will be described. As shown in FIGS. 1 and 2, the second shield layer 6 is a covering region that does not include an arrangement region of each external terminal electrode 8 in the other main surface 2b of the wiring board 2 and a peripheral region of the arrangement region. (On the other hand, it corresponds to a part of the main surface 2b). In other words, the second shield layer 6 does not have a region that overlaps with each of the external terminal electrodes 8 when the back surface of the module 1 is viewed from a direction perpendicular to the back surface, and is located around each of the external terminal electrodes 8. Each opening 9 is formed so that there is no overlapping periphery, and as shown in FIGS. 1 and 2, the other main surface 2b of the wiring board 2 is exposed between the second shield layer 6 and the external terminal electrode 8. doing. That is, the second shield layer 6 covers the other main surface 2b of the wiring board 2 so as to isolate the external terminal electrode 8. In this way, each external terminal electrode 8 and the second shield layer 6 are electrically insulated from each other. Further, the second shield layer 6 can be formed of, for example, a conductive material such as Cu, Ag, or Al.

The second shield layer 6 and the second shield layers 6a, 6b, 6d described later are surfaces not covered by the first shield layers 5, 5c, 5d from the side surfaces of the first shield layers 5, 5c, 5d. It is provided continuously over.

(Module manufacturing method)
Next, the manufacturing method of the module 1 will be described.

First, a plurality of land electrodes 7 are formed on one main surface 2a, a plurality of external terminal electrodes 8 are formed on the other main surface 2b, and a plurality of ground electrodes, a plurality of types of wiring electrodes, and a plurality of ground electrodes are internally formed. And a wiring board 2 on which a plurality of via conductors and the like are formed is prepared. Each land electrode 7, each external terminal electrode 8, each ground electrode, and each wiring electrode can be formed by screen printing a conductive paste containing a metal such as Ag or Cu. Further, each via conductor can be formed by a well-known method after forming a via hole using a laser or the like.

Next, a plurality of electronic components 3 are mounted on one main surface 2a of the wiring board 2 by using a well-known surface mounting technique. Next, the sealing resin layer 4 is formed on one main surface 2a of the wiring board 2 so as to cover one main surface 2a of the wiring board 2 and each electronic component 3 mounted on the one main surface 2a. For the formation of the sealing resin layer 4, for example, a coating method, a printing method, a compression molding method, a transfer molding method, or the like can be used. Further, in order to flatten the surface of the sealing resin layer 4, the surface of the sealing resin layer 4 is polished or ground.

Next, the first shield layer 5 is formed on the upper surface and the side surface of the sealing resin layer 4 and the side surface of the wiring board 2 so as to cover the upper surface and the side surface of the sealing resin layer 4 and the side surface of the wiring board 2. For the formation of the first shield layer 5, for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used.

Next, the covering region of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5 are covered so as to cover the covering region of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5. The second shield layer 6 is formed. For the formation of the second shield layer 6, for example, a sputtering method, a vapor deposition method, a paste coating method, or the like can be used. By masking the region of the wiring board 2 other than the covering region of the other main surface 2b, each opening 9 can be formed in the second shield layer 6.

Therefore, according to the first embodiment described above, in addition to the first shield layer 5 that covers the upper surface and the side surface of the sealing resin layer 4 and the side surface of the wiring board 2, the other main surface 2b of the wiring board 2 is covered. It includes a second shield layer 6 that covers the region and the sides of the first shield layer 5. As a result, it is possible to reduce electromagnetic waves that enter the inside of the module 1 from the upper surface and side surfaces of the module 1 and electromagnetic waves that leak to the outside of the module 1 from the upper surface and side surfaces of the module 1, and also enter the inside of the module 1 from the lower surface of the module 1. It is possible to reduce the electromagnetic waves generated and the electromagnetic waves leaking from the lower surface of the module 1 to the outside of the module 1. As described above, in the module 1, it is possible to improve the shielding characteristics of the electronic components by the first shield layer 5 and the second shield layer 6.

Further, usually, the thickness of the first shield layer 5 on the side surface of the module 1 tends to be thinner than the thickness on the upper surface, and the thickness of the second shield layer 6 on the side surface of the module 1 tends to be thinner than the thickness on the lower surface. is there. However, in the module 1, since the side surface of the module 1 is covered with two layers of the first shield layer 5 and the second shield layer 6, the thickness of the shield layer on the side surface of the module 1 (first shield layer 5). And the thickness of the second shield layer 6 combined) can be increased. Therefore, the module 1 can effectively reduce the electromagnetic waves that enter the inside of the module 1 from the side surface of the module 1 and the electromagnetic waves that leak to the outside of the module 1 from the side surface of the module 1. When the shield layer (second shield layer 6) is not provided on the lower surface side of the module 1, the ratio of the thickness of the upper surface to the thickness of the side surface of the shield layer of the module 1 is approximately 4: 1, but 2 for the module 1. By providing one shield layer (first shield layer 5, second shield layer 6), the ratio of the thickness of the upper surface to the thickness of the side surface of the shield layer of the module 1 becomes approximately 2: 1. As described above, since the shield film having a sufficient thickness can be provided on the side surface of the module 1, the shielding effect on the side surface can also be improved.

<Second Embodiment>
The module according to the second embodiment of the present invention will be described with reference to FIGS. 3 to 5. 3 is a bottom view of the module 1a before shielding, FIG. 4 is a bottom view of the module 1a after shielding, and FIG. 5 is a cross-sectional view taken along the line BB of FIG.

The module 1a according to the second embodiment is different from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2, as shown in FIGS. 3 to 5, the other main surface 2b of the substrate 2. A plurality of ground electrodes 21 are formed together with the plurality of external terminal electrodes 8 so that they do not overlap with each external terminal electrode 8 and slightly touch each ground when viewed from the direction perpendicular to the back surface of the module 1a. It differs in that a second shield layer 6a is provided so as to overlap a part of the electrode 21. Each ground electrode (not shown) in the wiring board 2 is connected to the second shield layer 6a via each ground electrode 21. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof will be omitted by adding the same reference numerals.

As shown in FIGS. 3 and 5, a plurality of external terminal electrodes 8 and a plurality of ground electrodes 21 are formed on the other main surface 2b of the substrate 2. As shown in FIG. 3, the plurality of external terminal electrodes 8 are arranged on the sides of the rectangle, and five external terminal electrodes 8 are provided on each side. Further, four ground electrodes 21 are provided inside a rectangle in which a plurality of external terminal electrodes 8 are arranged. Each ground electrode 21 is made of a metal generally used as a wiring electrode such as Cu or Al, and each ground electrode 21 may be Ni / Au plated.

As shown in FIGS. 4 and 5, the second shield layer 6a is provided so as to cover a part of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5.

Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6a will be described. As shown in FIGS. 4 and 5, the second shield layer 6a does not include the arrangement region of each external terminal electrode 8 and the peripheral region of the arrangement region in the other main surface 2b of the wiring board 2. , Covers a covering region (corresponding to a part of the other main surface 2b) including a part of the arrangement region of each ground electrode 21. In other words, the second shield layer 6a does not have a region that overlaps with each of the external terminal electrodes 8 when the back surface of the module 1a is viewed from the direction perpendicular to the back surface, and is located around each of the external terminal electrodes 8. Each opening 9 is formed so that there is no overlapping periphery, and each opening 9a is formed so as to overlap with each ground electrode 21 only in a region not including the central region of the ground electrode 21, as shown in FIGS. 4 and 5. The other main surface 2b of the wiring board 2 is exposed between the second shield layer 6a and the external terminal electrode 8. In this way, each external terminal electrode 8 and the second shield layer 6a are electrically insulated, and each ground electrode 21 and the second shield layer 6a are electrically connected.

Therefore, according to the second embodiment described above, in addition to the effect of the first embodiment, the region excluding the central region of each ground electrode 21 is covered with the second shield layer 6a, so that each ground electrode 21 and the first The contact area of the second shield layer 6a can be increased, and poor contact between each ground electrode 21 and the second shield layer 6a can be reduced. Further, the area of the ground electrode in the wiring board 2 can be reduced, and the degree of freedom in designing the layout of the wiring electrodes and the like in the wiring board 2 is increased.

When the back surface of the module 1a is viewed from the direction perpendicular to the back surface, each ground electrode 21 and the second shield layer 6a are overlapped with each other by a part of the ground electrode 21, but at least one ground is used. The electrode 21 and the second shield layer 6a may be overlapped with each other at a part of the ground electrode 21, and the remaining ground electrode 21 and the second shield layer 6a may be overlapped with the entire ground electrode 21. According to this configuration, since the opening 9 is reduced, the shielding effect can be further improved.

<Third Embodiment>
The module according to the third embodiment of the present invention will be described with reference to FIGS. 6 to 8. 6 is a bottom view of the module 1b before the shield, FIG. 7 is a bottom view of the module 1b after the shield, and FIG. 8 is a cross-sectional view taken along the line CC of FIG.

As shown in FIGS. 6 to 8, the module 1b according to the third embodiment is different from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2, that the other main surface 2b of the substrate 2 is different. A plurality of ground electrodes 21 and a plurality of dummy electrodes 31 are formed together with the plurality of external terminal electrodes 8 and overlap with each external terminal electrode 8 and each ground electrode 21 when viewed from a direction perpendicular to the back surface of the module 1b. A second shield layer 6b is provided so as not to touch each other slightly and to overlap with the entire dummy electrode 31, and each ground electrode 21 is electrically connected to each dummy electrode 31 by a connecting conductor 32. In that respect, they are different. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof will be omitted by adding the same reference numerals.

As shown in FIGS. 6 and 8, a plurality of external terminal electrodes 8, a plurality of ground electrodes 21, and a plurality of dummy electrodes 31 are formed on the other main surface 2b of the substrate 2. As shown in FIG. 6, the plurality of external terminal electrodes 8 are arranged in a matrix of 5 rows and 5 columns, in which the second row and first column, the second row and second column, the second row and fourth column, and the second row and fifth column. It is provided in the corresponding area excluding the columns, the 4th row and the 1st column, the 4th row and the 2nd column, the 4th row and the 4th column, and the 4th row and the 5th column. Further, as shown in FIG. 6, the plurality of ground electrodes 21 are arranged in the second row, the second column, the second row, the fourth column, the fourth row, the second column, and the fourth row in the matrix of 5 rows and 5 columns. It is provided in the corresponding area of the fourth row. Further, as shown in FIG. 6, the plurality of dummy electrodes 31 are arranged in the second row, the first column, the second row, the fifth column, the fourth row, the first column, and the fourth row in the matrix of 5 rows and 5 columns. It is provided in the corresponding area of the fifth column. Each dummy electrode 31 is made of a metal generally used as a wiring electrode such as Cu or Al, and each dummy electrode 31 may be Ni / Au plated.

As shown in FIGS. 7 and 8, the second shield layer 6b is provided so as to cover a part of the other main surface 2b of the wiring board 2 and the side surface of the first shield layer 5.

Here, a partial region of the other main surface 2b of the wiring board 2 covered by the second shield layer 6b will be described. As shown in FIGS. 7 and 8, the second shield layer 6b does not include the arrangement region of each external terminal electrode 8 and the peripheral region of the arrangement region in the other main surface 2b of the wiring board 2. , Covers a covering region (corresponding to a part of the other main surface 2b) that does not include the placement region of the placement region of each ground electrode 21 and the peripheral region of the placement region. In other words, the second shield layer 6b does not have a region that overlaps with each external terminal electrode 8 when the back surface of the module 1b is viewed from a direction perpendicular to the back surface, and is around the outer terminal electrodes 8. Each opening 9 is formed so that there is no overlapping periphery, and each opening 9b is formed so that there is no region that overlaps with each ground electrode 21 and there is no periphery that overlaps with the periphery of each ground electrode 21. The covering region includes the entire arrangement region of each dummy electrode 31.

As shown in FIG. 8, a plurality of connecting conductors 32 for electrically connecting each ground electrode 21 to each dummy electrode 31 are provided inside the wiring board 2 of the module 1b. Each connecting conductor 32 is made of a metal such as Ag or Cu.

As shown in FIG. 8, each external terminal electrode 8 is electrically insulated from the second shield layer 6b, and each ground electrode 21 is connected to each dummy electrode 31 electrically connected to the second shield layer 6b. It is electrically connected to the second shield layer 6b by being electrically connected via each connecting conductor 32.

Therefore, according to the third embodiment described above, in addition to the effect of the first embodiment, the contact area between each ground electrode 21 and the second shield layer 6b is adjusted by changing the size of each dummy electrode 31. can do.

<Fourth Embodiment>
The module according to the fourth embodiment of the present invention will be described with reference to FIG. Note that FIG. 9 is a cross-sectional view of the module 1c.

As shown in FIG. 9, the module 1c according to the fourth embodiment is different from the module 1b according to the third embodiment described with reference to FIGS. 6 to 8, which is one electronic component in the sealing resin layer 4a. It is different in that a trench 41 that partitions the surface and other electronic components is formed, and a first shield layer 5c is provided so as to cover the side surface of the wiring board 2 and the sealing resin layer 4c. Since other configurations are the same as those of the module 1b according to the third embodiment, the description thereof will be omitted by adding the same reference numerals.

The sealing resin layer 4c is provided so as to cover one main surface 2a of the wiring board 2 and each electronic component 3-1, 3-2, 3-3 mounted on the one main surface 2a. In the sealing resin layer 4c, a trench 41 that partitions the portion where the electronic component 3-1 exists and the portion where the electronic component 3-2, 3-3 exists in the sealing resin layer 4c is formed in the sealing resin layer. From the upper surface of 4c (corresponding to "the surface of the sealing resin layer opposite to the surface facing at least one main surface of the wiring board"), it reaches the wiring board 2 in the direction of the wiring board 2. It is formed so as not to.

The first shield layer 5c is provided so as to cover the upper surface, the side surface, the trench 41, and the side surface of the wiring board 2 of the sealing resin layer 4c.

Therefore, according to the fourth embodiment, in addition to the effect of the third embodiment, the electronic component 3-1 and the electronic component 3-2 partitioned by the trench 41 from the first shield layer 5c of the trench 41 portion. Shielding between 3 and 3 can be realized. Further, by forming the trench 41 so as not to reach the wiring board 2, it is possible to reduce damage to the wiring board 2 by the laser when forming the trench 41.

When partitioning an electronic component from another electronic component by a trench, the highest position of the electronic component is set as the first height based on the main surface on which the electronic component of the wiring board and another electronic component are mounted. When the highest position of the electronic component is set to the second height, a trench is formed on the wiring board side as compared with the lower height of the first height and the second height, and the wiring board. The sealing resin layer may be formed from a surface opposite to one main surface of the wiring board so as not to reach one main surface. In this way, shielding between the electronic component in one portion and the electronic component in the other portion partitioned by the trench can be effectively realized.

<Fifth Embodiment>
The module according to the fifth embodiment of the present invention will be described with reference to FIG. Note that FIG. 10 is a cross-sectional view of the module 1d.

As shown in FIG. 10, the module 1d according to the fifth embodiment is different from the module 1 according to the first embodiment described with reference to FIGS. 1 and 2 on one main surface of the wiring board 2d (the present invention). The electronic component 3 is mounted on 2da (corresponding to the "one main surface" on which the electronic component of the present invention is mounted), and also on the other main surface 2db (corresponding to the "other main surface" on which the electronic component of the present invention is mounted). An electronic component 3d is mounted, a sealing resin layer 51 is provided so as to cover the other main surface 2db and the electronic component 3d, and one surface of a metal pillar (corresponding to the "external terminal electrode" of the present invention) 8d is sealed. It is formed so as to be substantially on the same surface as the lower surface of the resin layer 51 (corresponding to the “arrangement surface of the external terminal electrode” of the present invention), and the upper surface and side surface of the sealing resin layer 4, the side surface of the wiring board 2d, and the sealing. The first shield layer 5d is formed so as to cover the side surface of the resin layer 51, and the second shield layer 6d covers a part of the side surface of the first shield layer 5d and the lower surface of the sealing resin layer 51. Is different in that is formed. Since other configurations are the same as those of the module 1 according to the first embodiment, the description thereof will be omitted by adding the same reference numerals.

A plurality of electronic components 3 are mounted on one main surface 2da of the wiring board 2d, and electronic components 3d are mounted on the other main surface 2db. A plurality of land electrodes 7 on which each electronic component 3 is mounted are formed on one main surface 2da of the wiring board 2d, and a plurality of land electrodes 7d on which the electronic component 3d is mounted are formed on the other main surface 2db. A plurality of electrodes 52 are formed to which the other surfaces of the plurality of metal pillars 8d are connected. The plurality of metal pillars 8d are made of a conductive material, and are doubly formed along the inner edge of the other main surface 2db of the wiring board 2d when the back surface of the module 1 is viewed from the direction perpendicular to the back surface. .. Each electrode 52 and each metal pillar 8d are for transmitting and receiving signals to and from an external device. The sealing resin layer 51 is provided so as to cover the other main surface 2db of the wiring board 2 and the electronic component 3d, and one surface of each metal pillar 8d is substantially on the same surface as the lower surface of the sealing resin layer 5. Yes, it is exposed from the sealing resin layer 51.

The first shield layer 5d is provided so as to cover the upper surface and side surfaces of the sealing resin layer 4, the side surface of the wiring board 2, and the side surface of the sealing resin layer 51.

The second shield layer 6d is provided so as to cover a part of the lower surface of the sealing resin layer 51 and the side surface of the first shield layer 5d.

Here, a part of the lower surface of the sealing resin layer 51 covered by the second shield layer 6d will be described. As shown in FIG. 10, the second shield layer 6d is a covering region (as shown in FIG. 10) that does not include a region of one surface of each metal pillar 8d on the lower surface of the sealing resin layer 51 and a peripheral region of the region of the one surface. It covers a part of the lower surface of the sealing resin layer 51). In other words, the second shield layer 6d does not have a region that overlaps with one surface of each metal pillar 8d when the back surface of the module 1d is viewed from a direction perpendicular to the back surface, and is one of the metal pillars 8d. Each opening 9d is formed so as not to overlap the periphery of the direction, and as shown in FIG. 10, the sealing resin layer 51 is exposed between the second shield layer 6d and one surface of the metal pillar 8d. doing. That is, the second shield layer 6d covers the lower surface of the sealing resin layer 51 so as to isolate one surface of the metal pillar 8d. In this way, each metal pillar 8d and the second shield layer 6d are electrically insulated from each other.

Therefore, according to the fifth embodiment described above, as in the first embodiment, in the module 1d, the first shield layer 5d and the second shield layer 6d allow the electromagnetic waves to enter the module 1d and the module 1d. Leakage to the outside can be suppressed.

The present invention is not limited to each of the above-described embodiments, and various modifications can be made other than those described above as long as the gist of the present invention is not deviated. For example, the contents of each of the above-described embodiments may be combined. In the fifth embodiment, the plurality of metal pillars 8d are doubly formed along the inner edge of the other main surface 2db of the wiring board 2d when the back surface of the module 1 is viewed from the direction perpendicular to the back surface. However, the present invention is not limited to this, and the plurality of metal pillars may be single or triple when the back surface of the module is viewed from a direction perpendicular to the back surface, and may be annular. It does not have to be.

Further, the present invention can be applied to a component mounted on a wiring board and a module having a shield layer that shields unnecessary electromagnetic waves.

1,1a, 1b, 1c, 1d module, 2,2d wiring board, 3,3d electronic component, 4,4c, 51 sealing resin layer, 5,5d first shield layer, 6,6a, 6b, 6d first 2 shield layers, 8.8d external terminal electrodes, 21 ground electrodes, 31 dummy electrodes, 32 connection conductors, 41 trenches

Claims (1)

A wiring board having one main surface and the other main surface,
Electronic components mounted on at least one of the main surface and the other main surface of the wiring board.
A sealing resin layer that seals at least one of the main surfaces and the electronic component,
With external terminal electrodes
A first shield layer that covers a surface other than the arrangement surface of the external terminal electrode of the wiring board and the sealing resin layer, and
With a second shield layer that covers the arrangement surface of the external terminal electrode so as to isolate the external terminal electrode.
With
A ground electrode and a dummy electrode are further arranged on the arrangement surface of the external terminal electrode.
The second shield layer covers the arrangement region of the dummy electrode in the arrangement surface of the external terminal electrode, and does not cover the arrangement region of the ground electrode and the peripheral region of the arrangement region.
Features and to makes the chromophore at the distal end module further comprises a connection conductor for electrically connecting the dummy electrode and the ground electrode.

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