JP6903267B2 - Electronic component transfer device and electronic component inspection device - Google Patents

Description

The present invention relates to an electronic component transfer device and an electronic component inspection device.

Conventionally, an electronic component mounting device for mounting an electronic component such as an IC chip has been known (see, for example, Patent Document 1). The electronic component mounting device described in Patent Document 1 includes a plurality of suction nozzles that can suck electronic components and move them up and down. Then, in this electronic component mounting device, when mounting the electronic component, the position and orientation of the electronic component sucked by the suction nozzle can be optically detected.

Japanese Unexamined Patent Publication No. 2011-159964

However, in the electronic component mounting device described in Patent Document 1, for example, the pitch between adjacent suction nozzles may change excessively from a specified value, that is, a design value, depending on a usage environment, a usage state, and the like. In this case, it is preferable to detect the position of each suction nozzle, calculate the change in the pitch between the suction nozzles, and make a correction according to the calculation result. Is not disclosed at all.

The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as follows.

The electronic component transfer device of the present invention has a base that can move in the first direction and
A first grip portion provided on the base portion for gripping an electronic component, and a first grip portion.
A second grip portion provided on the base portion, which is movable in the first direction with respect to the first grip portion and grips an electronic component, and a second grip portion.
It is characterized by having a detection unit capable of detecting a position of the first grip portion in the first direction and a position of the second grip portion in the first direction.

As a result, the distance between the first grip portion and the second grip portion can be obtained, and the operation of the first grip portion and the second grip portion can be changed according to the distance. Therefore, for example, the first grip portion and the second grip portion can smoothly grip the electronic component.

In the electronic component transfer device of the present invention, the base can be moved in a second direction orthogonal to the first direction.
It is preferable that the detection unit can detect the position of the first grip portion in the second direction and the position of the second grip portion in the second direction.

As a result, the distance between the first grip portion and the second grip portion in the second direction is determined based on the position of the first grip portion in the second direction and the position of the second grip portion in the second direction. Obtainable.

In the electronic component transfer device of the present invention, the first grip portion and the second grip portion can move in the first direction and the third direction orthogonal to the second direction with respect to the base portion. Yes,
When the distance obtained based on the position of the first grip portion and the position of the second grip portion detected by the detection unit is equal to or more than a predetermined value, the first grip portion and the said It is preferable to move the second grip portion and the second grip portion individually in the third direction.

Thereby, for example, the electronic component can be accurately grasped, or the grasped electronic component can be accurately released.

In the electronic component transfer device of the present invention, the first grip portion and the second grip portion can move in the first direction and the third direction orthogonal to the second direction with respect to the base portion. Yes,
When the distance obtained based on the position of the first grip portion and the position of the second grip portion detected by the detection unit is less than a predetermined value, the first grip portion and the said It is preferable to move the second grip portion and the second grip portion in the third direction at the same time.

Thereby, for example, the electronic component can be gripped or the gripped electronic component can be released as quickly as possible.

In the electronic component transfer device of the present invention, the detection unit includes a first light emitting unit that emits light in the first direction, a first light receiving unit that receives light from the first light emitting unit, and the second light emitting unit. It is preferable to have a second light emitting unit that emits light in a direction and a second light receiving unit that receives light from the second light emitting unit.

As a result, the position of each grip portion in the first direction can be detected based on the transmission and blocking of light between the first light emitting unit and the first light receiving unit, and the second light emitting unit and the second light emitting unit and the second light emitting unit can be detected. 2 The position of each grip portion in the second direction can be detected based on the transmission and blocking of light between the light receiving portion and the light receiving portion.

In the electronic component transfer device of the present invention, the detection unit has a main body unit composed of block-shaped or plate-shaped members.
The main body has a recess and
A small concave portion or a small convex portion formed at the bottom of the concave portion and smaller than the concave portion in a plan view.
A first light emitting portion insertion portion that opens into the side wall portion of the recess and into which the first light emitting portion is inserted.
An insertion portion for a first light receiving portion, which is opened in the side wall portion of the recess so as to face the insertion portion for the first light emitting portion and into which the first light receiving portion is inserted.
A second light emitting portion insertion portion that opens in the side wall portion of the recess and into which the second light emitting portion is inserted.
It is preferable to have a second light receiving portion insertion portion which is opened in the side wall portion of the recess so as to face the second light emitting portion insertion portion and into which the second light receiving portion is inserted.

As a result, when the main body portion is obtained by machining from the base material serving as the main body portion, the following effects are obtained. Once the base metal is fixed to the machine tool, the recess, the through hole, the insertion part for the first light emitting part, and the insertion part for the first light receiving part are used while maintaining the fixed state. And the insertion part for the second light emitting part and the insertion part for the second light receiving part can be completely processed. As a result, it is possible to obtain a main body portion with high accuracy in the positional relationship of each processed portion.

In the electronic component transfer device of the present invention, it is preferable that the small recess is formed through the small recess.
This makes it possible to clearly image small recesses with an imaging device such as a camera.

The electronic component transfer device of the present invention has a supply area in which the electronic component is conveyed to an inspection area in which the electronic component is inspected, and a collection area in which the electronic component inspected in the inspection area is collected.
The detection unit is preferably provided in the supply region and the recovery region.

Thereby, in both the supply region and the recovery region where the plurality of electronic components are conveyed, for example, the position of the first grip portion in the first direction and the position of the second grip portion in the first direction are based on. Therefore, the distance between the first grip portion and the second grip portion in the first direction can be obtained.

In the electronic component transfer device of the present invention, a third grip portion provided at the base portion, which is movable in the first direction with respect to the first grip portion, and which grips the electronic component, and a third grip portion.
It has a fourth grip portion that is provided on the base portion, is movable in a first direction with respect to the first grip portion, and grips an electronic component.
It is preferable that the detection unit can detect the position of the third grip portion in the first direction and the position of the fourth grip portion in the first direction.

As a result, the distance between the third grip portion and the fourth grip portion in the first direction is determined based on the position of the third grip portion in the first direction and the position of the fourth grip portion in the first direction. Obtainable.

In the electronic component transfer device of the present invention, the base can be moved in a second direction orthogonal to the first direction.
The detection unit includes a position of the first grip portion in the second direction, a position of the second grip portion in the second direction, and a position of the third grip portion in the second direction. It is preferable that the position of the fourth grip portion in the second direction can be detected.

As a result, the position of the first grip portion in the second direction, the position of the second grip portion in the second direction, the position of the third grip portion in the second direction, and the second grip portion of the fourth grip portion. Based on the position in the direction, the distance between the first grip portion and the second grip portion in the second direction, the distance between the second grip portion and the third grip portion, and the third grip portion and the fourth grip portion. You can get the distance.

In the electronic component transfer device of the present invention, a fifth grip portion provided at the base portion and arranged in the second direction with respect to the first grip portion and a fifth grip portion.
A sixth grip portion provided on the base portion and arranged in the second direction with respect to the second grip portion, and a sixth grip portion.
A seventh grip portion provided on the base portion and arranged in the second direction with respect to the third grip portion, and a seventh grip portion.
It has an eighth grip portion provided on the base portion and arranged in the second direction with respect to the fourth grip portion.
The detection unit includes a position of the fifth grip portion in the first direction, a position in the second direction, a position of the sixth grip portion in the first direction, and a position in the second direction. , The position of the 7th grip portion in the first direction, the position in the second direction, the position of the 8th grip portion in the first direction, and the position in the second direction can be detected. It is preferable to have it.

As a result, the first grip portion to the eighth grip portion can smoothly grip the electronic component.

The electronic component inspection apparatus of the present invention has a base that can be moved in the first direction and a base.
A first grip portion provided on the base portion for gripping an electronic component, and a first grip portion.
A second grip portion provided on the base portion, which is movable in the first direction with respect to the first grip portion and grips an electronic component, and a second grip portion.
A detection unit capable of detecting the position of the first grip portion in the first direction and the position of the second grip portion in the first direction.
It is characterized by having an electronic component gripped by the first grip portion and an inspection section for inspecting the electronic component gripped by the second grip portion.

As a result, the distance between the first grip portion and the second grip portion can be obtained, and the operation of the first grip portion and the second grip portion can be changed according to the distance. Therefore, for example, the first grip portion and the second grip portion can smoothly grip the electronic component. In addition, the electronic component can be transported to the inspection unit, and thus the inspection unit can inspect the electronic component. In addition, the electronic parts after inspection can be transported from the inspection unit.

FIG. 1 is a schematic perspective view of a first embodiment of the electronic component inspection apparatus of the present invention as viewed from the front side. FIG. 2 is a schematic plan view showing an operating state of the electronic component inspection apparatus shown in FIG. FIG. 3 is a perspective view of a device transport head installed in the device supply area in FIG. FIG. 4 is a view seen from the direction of arrow A in FIG. FIG. 5 is a perspective view of an alignment jig installed in the electronic component inspection apparatus shown in FIG. FIG. 6 is a perspective view of an alignment jig installed in the electronic component inspection apparatus shown in FIG. FIG. 7 is a perspective view of a position detection unit installed in the electronic component inspection apparatus shown in FIG. FIG. 8 is a schematic partial vertical cross-sectional view showing an alignment state of the device transport head shown in FIG. FIG. 9 is a schematic partial vertical cross-sectional view showing an alignment state of the device transport head shown in FIG. FIG. 10 is a schematic partial vertical cross-sectional view showing an alignment state of the device transport head shown in FIG. FIG. 11 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 12 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 13 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 14 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 15 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 16 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 17 is a schematic horizontal cross-sectional view showing the position detection operation of the device transport head shown in FIG. 3 in order. FIG. 18 is a schematic partial vertical cross-sectional view of the state shown in FIG. FIG. 19 is a schematic partial vertical cross-sectional view of the state shown in FIG. FIG. 20 is a schematic partial vertical cross-sectional view following FIG. 17, which sequentially shows the position detection operations of the device transfer heads. FIG. 21 is a schematic partial vertical cross-sectional view following FIG. 17, which sequentially shows the position detection operations of the device transfer heads. FIG. 22 is a graph showing a light receiving state of the first light receiving unit in the position detecting unit shown in FIG. FIG. 23 is a graph showing a light receiving state of the second light receiving unit in the position detecting unit shown in FIG. FIG. 24 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the first mode in order. FIG. 25 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the first mode in order. FIG. 26 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the first mode in order. FIG. 27 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 28 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 29 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 30 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 31 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 32 is a schematic partial vertical cross-sectional view showing the operation of the device transport head shown in FIG. 3 in the second mode in order. FIG. 33 is a flowchart showing a control program until the device transfer head shown in FIG. 3 operates in either the first mode or the second mode. FIG. 34 is a schematic plan view showing a device transfer head included in the electronic component inspection apparatus (second embodiment) of the present invention. FIG. 35 is a schematic partial vertical cross-sectional view showing a position detection operation of a device transport head included in the electronic component inspection apparatus (third embodiment) of the present invention. FIG. 36 is a graph showing the relationship between the position of the device transfer head shown in FIG. 35 in the X direction and the flow rate of the gas ejected from the device transfer head. Is. FIG. 37 is a graph showing the relationship between the position of the device transfer head shown in FIG. 35 in the Y direction and the flow rate of the gas ejected from the device transfer head. FIG. 38 is a perspective view of the suction nozzle included in the electronic component inspection device (fourth embodiment) of the present invention and its periphery.

Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the preferred embodiments shown in the accompanying drawings.

<First Embodiment>
Hereinafter, the first embodiment of the electronic component transfer device and the electronic component inspection device of the present invention will be described with reference to FIGS. 1 to 33. In the following, for convenience of explanation, as shown in FIG. 1, three axes orthogonal to each other are referred to as an X-axis, a Y-axis, and a Z-axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the direction parallel to the X axis is also referred to as "X direction (first method)", the direction parallel to the Y axis is also referred to as "Y direction (second direction)", and the direction parallel to the Z axis is "". Also called "Z direction (third direction)". In addition, the direction in which the arrows in each direction point is called "positive", and the opposite direction is called "negative". Further, the term "horizontal" as used herein is not limited to a perfect horizontal position, and includes a state of being slightly inclined (for example, less than 5 °) with respect to the horizontal position as long as the transportation of electronic components is not hindered. Further, the upper side in FIGS. 1, 3 to 10, 18 to 21, and 24 to 32 may be referred to as "upper" or "upper" and the lower side may be referred to as "lower" or "lower".

The electronic component transfer device 10 of the present invention includes a base portion 75 that can move in the X direction, which is the first direction, and a base portion 75.
A first gripping portion 78A provided on the base portion 75 for gripping an electronic component, and a second gripping portion 78B provided on the base portion 75 that is movable in the X direction with respect to the first gripping portion 78A and grips the electronic component. And a position detection unit (detection unit) 3 capable of detecting the position of the first grip portion 78A in the X direction and the position of the second grip portion 78B in the X direction.

As a result, as will be described later, the distance between the first grip portion 78A and the second grip portion 78B can be obtained, and the operation of the first grip portion 78A and the second grip portion 78B is changed according to the distance. can do. Therefore, for example, the first grip portion 78A and the second grip portion 78B can smoothly grip the electronic component.

Further, the electronic component inspection device 1 of the present invention has the electronic component transfer device 10 of the present invention, and is further gripped by the electronic component gripped by the first gripping portion 78A and the second gripping portion 78B. It has an inspection unit 16 for inspecting electronic components.
As a result, the electronic component can be transported to the inspection unit 16, and thus the inspection unit 16 can inspect the electronic component. In addition, the electronic parts after inspection can be transported from the inspection unit 16.

Hereinafter, the configuration of each part will be described.
As shown in FIGS. 1 and 2, the electronic component inspection device 1 incorporating the electronic component transfer device 10 transports electronic components such as an IC device which is a BGA (Ball Grid Array) package, and electronic components are transported in the transport process. It is a device that inspects and tests the electrical characteristics of parts (hereinafter simply referred to as "inspection"). In the following, for convenience of explanation, a case where an IC device is used as the electronic component will be described as a representative, and this will be referred to as “IC device 90”. In the present embodiment, the IC device 90 has a rectangular shape (square) in a plan view.

Further, the electronic component inspection device 1 (electronic component transfer device 10) is used by mounting in advance what is called a "change kit" that is replaced for each type of IC device 90. This change kit has a mounting portion on which the IC device 90 is mounted, and the mounting portion includes, for example, a temperature adjusting unit 12 and a device supply unit 14, which will be described later.

Further, as a mounting portion on which the IC device 90 is mounted, there is also a plate-shaped tray 200 prepared by the user, in addition to the change kit as described above. This tray 200 is also mounted on the electronic component inspection device 1 (electronic component transfer device 10). The tray 200 as a mounting portion is used, for example, when the IC device 90, which is an electronic component, is loaded into the electronic component inspection device 1 (electronic component transfer device 10). As a result, a plurality of uninspected IC devices 90 can be loaded together with the tray 200 in the tray supply area A1 described later, so that the operator (user) can easily perform the loading operation. The tray 200 is also used when the IC device 90 classified according to the inspection result is placed.

The electronic component inspection device 1 includes a tray supply area A1, a device supply area (hereinafter simply referred to as “supply area”) A2, an inspection area A3, a device recovery area (hereinafter simply referred to as “recovery area”) A4, and the like. A tray removal area A5 is provided, and these areas are divided by each wall portion as described later. Then, the IC device 90 passes through each of the areas from the tray supply area A1 to the tray removal area A5 in the _{direction of the arrow α 90} , and the inspection is performed in the inspection area A3 in the middle. As described above, the electronic component inspection device 1 includes a handler which is an electronic component transfer device 10 for transporting the IC device 90 in each region, an inspection unit 16 for inspecting in the inspection region A3, and a control unit 800. It has become. In addition, the electronic component inspection device 1 includes a monitor 300, a signal lamp 400, and an operation panel 700.

In the electronic component inspection device 1, the side where the tray supply area A1 and the tray removal area A5 are arranged, that is, the lower side in FIG. 2 is the front side and the inspection area A3 is arranged, that is, in FIG. The upper side of is used as the back side.

The tray supply area A1 is a material supply unit to which the tray 200 in which a plurality of uninspected IC devices 90 are arranged is supplied. In the tray supply area A1, a large number of trays 200 can be stacked.

The supply area A2 is an area in which a plurality of IC devices 90 on the tray 200 conveyed from the tray supply area A1 are conveyed and supplied to the inspection area A3, respectively. The tray transport mechanisms 11A and 11B for horizontally transporting the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2. The tray transport mechanism 11A is a moving unit capable of moving the tray 200 together with the IC device 90 mounted on the tray 200 on the positive side in the Y direction, that is, in the _{direction of the arrow α 11A in FIG.} As a result, the IC device 90 can be stably sent to the supply region A2. Further, the tray transport mechanism 11B is a moving portion capable of moving the empty tray 200 on the negative side in the Y direction, that is, in the _{direction of the arrow α 11B in FIG.} As a result, the empty tray 200 can be moved from the supply area A2 to the tray supply area A1.

The supply area A2 is provided with a temperature control unit (soak plate (English notation: soak plate, Chinese notation (example): temperature equalizing plate)) 12, a device transfer head 13, and a tray transfer mechanism 15. ..

The temperature adjusting unit 12 is configured as a mounting unit on which a plurality of IC devices 90 are mounted, and is called a "soak plate" capable of collectively heating or cooling the mounted IC devices 90. With this soak plate, the IC device 90 before being inspected by the inspection unit 16 can be preheated or cooled to adjust the temperature to a temperature suitable for the inspection (high temperature inspection or low temperature inspection). In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to any of the temperature adjusting units 12. Since the temperature adjusting unit 12 as the mounting unit is fixed, the temperature can be stably adjusted with respect to the IC device 90 on the temperature adjusting unit 12.

The device transfer head 13 is supported so as to be movable in the X direction and the Y direction in the supply region A2, and has a portion that can be moved in the Z direction as well. As a result, the device transfer head 13 transfers the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and between the temperature adjustment unit 12 and the device supply unit 14, which will be described later. It can be responsible for transporting the IC device 90. In FIG. 2, the movement of the device transport head 13 in the X direction is indicated by the arrow α _13X , and the movement of the device transport head 13 in the Y direction is indicated by the arrow α _13Y .

The tray transport mechanism 15 is a mechanism for transporting an empty tray 200 in a state where all the IC devices 90 have been removed in the supply area A2 on the positive side in the X direction, that is, in the arrow α ₁₅ direction. Then, after this transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

The inspection area A3 is an area for inspecting the IC device 90. An inspection unit 16 and a device transfer head 17 are provided in the inspection area A3. Further, a device supply unit 14 that moves so as to straddle the supply area A2 and the inspection area A3, and a device collection unit 18 that moves so as to straddle the inspection area A3 and the collection area A4 are also provided.

The device supply unit 14 is configured as a mounting unit on which the temperature-controlled IC device 90 is mounted by the temperature adjusting unit 12, and can convey the IC device 90 to the vicinity of the inspection unit 16. Or simply called a "supply shuttle".

Further, the device supply unit 14 as the mounting unit is supported so as to be reciprocally movable between the supply area A2 and the inspection area A3 along the X direction, that is, the arrow α _{14 direction.} As a result, the device supply unit 14 can stably convey the IC device 90 from the supply area A2 to the vicinity of the inspection unit 16 in the inspection area A3, and the IC device 90 is conveyed by the device transfer head 17 in the inspection area A3. After being removed, it is possible to return to the supply area A2 again.

In the configuration shown in FIG. 2, two device supply units 14 are arranged in the Y direction, and the IC device 90 on the temperature adjustment unit 12 is conveyed to any of the device supply units 14. Further, the device supply unit 14 is configured to be able to heat or cool the IC device 90 mounted on the device supply unit 14, similarly to the temperature adjustment unit 12. As a result, the temperature-adjusted IC device 90 can be transported to the vicinity of the inspection unit 16 in the inspection area A3 while maintaining the temperature-adjusted state.

The device transfer head 17 is an operating unit in which the IC device 90 whose temperature adjustment state is maintained is gripped and the IC device 90 is conveyed within the inspection area A3. The device transfer head 17 is supported so as to be reciprocally movable in the Y direction and the Z direction within the inspection area A3, and is a part of a mechanism called an “index arm”. As a result, the device transport head 17 can transport the IC device 90 on the device supply unit 14 carried in from the supply area A2 onto the inspection unit 16 and place it on the inspection unit 16. In FIG. 2, the reciprocating movement of the device transport head 17 in the Y direction is indicated by an arrow α _17Y . Further, the device transport head 17 is supported so as to be reciprocally movable in the Y direction, but the present invention is not limited to this, and the device transfer head 17 may be supported so as to be reciprocally movable in the X direction as well.

Further, the device transfer head 17 is configured to be able to heat or cool the gripped IC device 90, similarly to the temperature adjusting unit 12. As a result, the temperature adjustment state in the IC device 90 can be continuously maintained from the device supply unit 14 to the inspection unit 16.

The inspection unit 16 is configured as a mounting unit on which an IC device 90, which is an electronic component, is mounted and the electrical characteristics of the IC device 90 are inspected. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminal portion of the IC device 90. Then, the terminal portion of the IC device 90 and the probe pin are electrically connected, that is, in contact with each other, so that the IC device 90 can be inspected. The inspection of the IC device 90 is performed based on a program stored in the inspection control unit included in the tester connected to the inspection unit 16. Similarly to the temperature adjusting unit 12, the inspection unit 16 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The device recovery unit 18 is configured as a mounting unit on which the IC device 90 that has been inspected by the inspection unit 16 can be mounted and can transport the IC device 90 to the recovery area A4, and is a "recovery shuttle plate" or. It is simply called the "recovery shuttle".

Further, the device recovery unit 18 is supported so as to be reciprocally movable between the inspection area A3 and the recovery area A4 along the X direction, that is, the arrow α _{18 direction.} Further, in the configuration shown in FIG. 2, two device recovery units 18 are arranged in the Y direction as in the device supply unit 14, and the IC device 90 on the inspection unit 16 is one of the device collection units 18. It is transported to and placed on. This transfer is performed by the device transfer head 17.

The recovery area A4 is an area in which a plurality of IC devices 90 that have been inspected in the inspection area A3 and have completed the inspection are collected. The collection area A4 is provided with a collection tray 19, a device transfer head 20, and a tray transfer mechanism 21. An empty tray 200 is also prepared in the collection area A4.

The collection tray 19 is a placement unit on which the IC device 90 inspected by the inspection unit 16 is placed, and is fixed so as not to move in the collection area A4. As a result, the inspected IC device 90 can be stably placed on the collection tray 19 even in the collection area A4 in which a relatively large number of various movable parts such as the device transfer head 20 are arranged. Become. In the configuration shown in FIG. 2, three collection trays 19 are arranged along the X direction.

In addition, three empty trays 200 are also arranged along the X direction. The empty tray 200 also serves as a mounting unit on which the IC device 90 inspected by the inspection unit 16 is placed. Then, the IC device 90 on the device collection unit 18 that has moved to the collection area A4 is transported to and placed on either the collection tray 19 or the empty tray 200. As a result, the IC device 90 is classified according to the inspection result and collected.

The device transfer head 20 is supported so as to be movable in the X direction and the Y direction in the collection area A4, and has a portion that can be moved in the Z direction as well. As a result, the device transfer head 20 can transfer the IC device 90 from the device collection unit 18 to the collection tray 19 or the empty tray 200. In FIG. 2, the movement of the device transport head 20 in the X direction is indicated by the arrow α _20X , and the movement of the device transport head 20 in the Y direction is indicated by the arrow α _20Y .

The tray transport mechanism 21 is a mechanism for transporting an empty tray 200 carried in from the tray removal area A5 in the collection area A4 in the X direction, that is, in the arrow α ₂₁ direction. Then, after this transfer, the empty tray 200 will be arranged at a position where the IC device 90 is collected, that is, it may be one of the three empty trays 200.

The tray removal area A5 is a material removing portion where the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked.

Further, tray transport mechanisms 22A and 22B for transporting the trays 200 one by one in the Y direction are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a moving portion capable of reciprocating the tray 200 in the Y direction, that is, in the arrow α _{22A direction.} As a result, the inspected IC device 90 can be transported from the collection area A4 to the tray removal area A5. Further, the tray transport mechanism 22B can move the empty tray 200 for collecting the IC device 90 to the positive side in the Y direction, that is, in the _{direction of the arrow α 22B.} As a result, the empty tray 200 can be moved from the tray removal area A5 to the collection area A4.

The control unit 800 includes, for example, a tray transfer mechanism 11A, a tray transfer mechanism 11B, a temperature adjusting unit 12, a device transfer head 13, a device supply unit 14, a tray transfer mechanism 15, an inspection unit 16, and a device transfer. It is possible to control the operation of the head 17, the device recovery unit 18, the device transfer head 20, the tray transfer mechanism 21, the tray transfer mechanism 22A, and the tray transfer mechanism 22B.

The operator can set and confirm the operating conditions and the like of the electronic component inspection device 1 via the monitor 300. The monitor 300 has a display screen 301 composed of, for example, a liquid crystal screen, and is arranged in the upper part on the front side of the electronic component inspection device 1. As shown in FIG. 1, a mouse stand 600 on which a mouse is placed is provided on the right side of the tray removal area A5 in the drawing. This mouse is used when operating the screen displayed on the monitor 300.

Further, an operation panel 700 is arranged at the lower right of FIG. 1 with respect to the monitor 300. The operation panel 700 commands the electronic component inspection device 1 to perform a desired operation separately from the monitor 300.

Further, the signal lamp 400 can notify the operating state and the like of the electronic component inspection device 1 by the combination of the colors emitted. The signal lamp 400 is arranged above the electronic component inspection device 1. The electronic component inspection device 1 has a built-in speaker 500, and the speaker 500 can also be used to notify the operating state of the electronic component inspection device 1.

In the electronic component inspection device 1, the tray supply area A1 and the supply area A2 are separated by the first partition wall 231, and the supply area A2 and the inspection area A3 are separated by the second partition wall 232. The inspection area A3 and the recovery area A4 are separated by a third partition wall 233, and the recovery area A4 and the tray removal area A5 are separated by a fourth partition wall 234. Further, the supply area A2 and the recovery area A4 are also separated by a fifth partition wall 235.

The outermost exterior of the electronic component inspection device 1 is covered with a cover, and the cover includes, for example, a front cover 241 and a side cover 242, a side cover 243, a rear cover 244, and a top cover 245.

As described above, the device transport head 13 is movably supported in the supply region A2 in the X direction and the Y direction. As shown in FIG. 3, the device transfer head 13 has a base portion 75. The base 75 is movably supported in the X direction (first direction) and in the Y direction (second direction) orthogonal to the X direction (first direction).

Such a base 75 has a first base 751, a second base 752, a third base 753, and a fourth base 754. The first base 751 is a plate-shaped portion having a spread in the XY plane and a thickness in the Z direction. The second base 752 is a plate-shaped portion extending downward (negative side in the Z direction) from the edge on the negative side in the X direction of the first base 751 and having a spread in the YZ plane and a thickness in the X direction. is there. The third base 753 is a plate-shaped portion extending downward (negative side in the Z direction) from the positive side edge in the Y direction of the first base 751 and having a spread in the XZ plane and a thickness in the Y direction. is there. The fourth base 754 is a plate-shaped portion extending from the negative side edge in the X direction of the third base 753 to the positive side in the Y direction, spreading in the YZ plane, and having a thickness in the X direction.

Further, the device transfer head 13 has a first support portion 71, a second support portion 72, a third support portion 73, and a fourth support portion 74 supported by the base portion 75. These four support portions are provided side by side in the order of the third support portion 73, the second support portion 72, the first support portion 71, and the fourth support portion 74 from the negative side in the X direction to the positive side in the X direction.

The first support portion 71, the second support portion 72, the third support portion 73, and the fourth support portion 74 each have a plate shape having an extension in the YZ plane and a thickness in the X direction. In this way, by forming each of the support portions 71 to 74 into a plate shape having a spread in the YZ plane, the first support portions 71 to 4 support portions 74 can be arranged side by side in the X direction at a narrower pitch. Therefore, the device transfer head 13 can be downsized.

Further, the first support portion 71 of these four support portions is fixed to the first base 751. The second support portion 72, the third support portion 73, and the fourth support portion 74 are each supported by the first base 751 via a linear guide (not shown), and are movable in the X direction. ..

The device transport head 13 has a moving mechanism 76 that is responsible for this movement. The moving mechanism 76 includes a two-stage pulley 761 and a two-stage pulley 762, a belt 763 and a belt 764 stretched between the two-stage pulley 761 and the two-stage pulley 762, and a motor 765 that rotates the two-stage pulley 761. Have. Of these, the two-stage pulley 761, the two-stage pulley 762, and the motor 765 are each supported by the first base 751.

The two-stage pulley 761 and the two-stage pulley 762 are rotatable about an axis extending in the Y direction on the upper surface of the first base 751. Further, the two-stage pulley 761 and the two-stage pulley 762 are provided apart from each other in the X direction.

The two-stage pulley 761 has a small diameter pulley 761a having a small outer diameter and a large diameter pulley 761b having an outer diameter almost twice that of the small diameter pulley 761a, and these are formed concentrically side by side in the Y direction. ing. Similarly, the two-stage pulley 762 has a small diameter pulley 762a having a small outer diameter and a large diameter pulley 762b having an outer diameter almost twice that of the small diameter pulley 762a, and these are arranged concentrically in the Y direction. Is formed in. The outer diameters of the small diameter pulley 761a and the small diameter pulley 762a are equal to each other, and the outer diameters of the large diameter pulley 761b and the large diameter pulley 762b are also equal to each other.

A belt 763 is stretched between the small diameter pulley 761a and the small diameter pulley 762a. The belt 763 has two regions 763a and regions 763b extending in the X direction between the small diameter pulley 761a and the small diameter pulley 762a. The second support portion 72 is connected and fixed to the region 763a via the connecting member 766, and the fourth support portion 74 is connected and fixed to the region 763b via the connecting member 767. When the two-stage pulley 761 rotates in one direction, for example, in the region 763a, the belt 763 advances toward the negative side in the X direction, and in the region 763b, the belt 763 advances toward the positive side in the X direction. 4 The support portions 74 move to the opposite sides in the X direction and by substantially the same distance.

On the other hand, a belt 764 is stretched between the large-diameter pulley 761b and the large-diameter pulley 762b. The belt 764 has two regions 764a and 764b extending in the X direction between the large diameter pulley 761b and the large diameter pulley 762b. Of these two regions 764a and 764b, the third support portion 73 is connected via the connecting member 768 to the region 764a that advances in the same direction as the region 763a of the belt 763 when the two-stage pulley 761 rotates. , Is fixed. As a result, the second support portion 72 and the third support portion 73 move to the same side in the X direction with each other. As described above, since the large-diameter pulleys 761b and 762b have twice the outer diameter of the small-diameter pulleys 761a and 762a, the moving distance of the third support portion 73 is the movement of the second support portion 72. It is almost twice the distance.

According to such a configuration, when the two-stage pulley 761 is rotated by the motor 765, the second support portion 72 and the fourth support portion 74 move to the opposite sides in the X direction by substantially the same distance, and the third support portion 73 Moves in the same direction as the second support portion 72 and twice as much as the second support portion 72. Therefore, according to the moving mechanism 76, the pitch (center-to-center distance) PX1, which is the distance between the suction nozzle 733 of the third grip portion 78C and the suction nozzle 723 of the second grip portion 78B in the X direction, and the suction nozzle 723 and the first 1 Pitch (center-to-center distance) PX2 which is the distance between the suction nozzle 713 of the grip portion 78A and the X direction, and pitch (center-to-center distance) which is the distance between the suction nozzle 713 and the suction nozzle 743 of the fourth grip portion 78D in the X direction. PX3 and PX3 can be changed at once.

Further, the base portion 75 is provided with a first gripping portion 78A for gripping the IC device 90, which is an electronic component, via a first support portion 71, and similarly, a second gripping portion 78B for gripping the IC device 90 is second. A third grip portion 78C that is provided via two support portions 72 and grips the IC device 90 is provided via a third support portion 73, and a fourth grip portion 78D that grips the IC device 90 is provided through the fourth support portion 74. It is provided through. As a result, the second grip portion 78B to the fourth grip portion 78D can each move in the X direction with respect to the first grip portion 78A.

Since the first grip portion 78A to the fourth grip portion 78D have the same configuration except that the supported portions are different, the configuration of the first grip portion 78A will be typically described.

The first grip portion 78A has a shaft 712 that is arranged parallel to the Z direction and supports the suction nozzle 713 at the lower end portion, and a drive mechanism 714 that moves the suction nozzle 713 in the Z direction via the shaft 712. There is. In the first grip portion 78A having such a configuration, the suction nozzle 713 moves together with the shaft 712 in the Z direction (third direction) orthogonal to the X direction and the Y direction with respect to the base 75 by the operation of the drive mechanism 714. It will be possible. As a result, the IC device 90 can be gripped by lowering the suction nozzle 713 and sucking the IC device 90 by the suction nozzle 713. Then, the gripped IC device 90 will be inspected by the inspection unit 16 as described above.

The configuration of the drive mechanism 714 is not particularly limited as long as the shaft 712 can be reciprocated in the Z direction with respect to the first support portion 71, but in the present embodiment, the pulley 714a and the pulley 714b, the pulley 714a, and the pulley It has a belt 714c stretched between 714b, a fixing portion 714e for connecting and fixing the belt 714c and the shaft 712, and a motor (not shown) for rotating the pulley 714a.

Hereinafter, among the suction nozzle 713 of the first grip portion 78A, the suction nozzle 723 of the second grip portion 78B, the suction nozzle 733 of the third grip portion 78C, and the suction nozzle 743 of the fourth grip portion 78D, they are arranged from the negative side in the X direction. The suction nozzle 733 is referred to as "Nozzle No. 1 (nozzle (1))", the suction nozzle 723 is referred to as "Nozzle No. 2 (nozzle (2))", and the suction nozzle 713 is referred to as "Nozzle No. 3 (nozzle (2))". The suction nozzle 743 may be referred to as a "nozzle (3))" and the suction nozzle 743 may be referred to as a "nozzle (4)".

As shown in FIG. 4, the device transfer head 13 has a camera 771 and a mirror 772 as an image pickup unit 77.

The camera 771 is a CCD (Charge-Coupled Device) camera. In this camera 771, the camera lens 773 faces the negative side in the Y direction and is fixed to the fourth base 754 of the base 75.

The mirror 772 is arranged on the negative side in the Y direction with respect to the camera 771, and has a mirror surface 774 that refracts the viewing direction of the camera 771 downward. As a result, when the device transfer head 13 moves on the XY plane, the camera 771 is located above the tray 200, the temperature adjusting unit 12, etc. in the supply area A2, and can take an image of them. Then, based on the captured image, the positions of the tray 200, the temperature adjusting unit 12, and the like are grasped and stored in the control unit 800. The mirror 772 is fixed to the third base 753 or the fourth base 754 of the base 75.

As described above, in the device transfer head 13, the pitch PX1 of the suction nozzle 733 and the suction nozzle 723, the pitch PX2 of the suction nozzle 723 and the suction nozzle 713, and the pitch PX3 of the suction nozzle 713 and the suction nozzle 743 are provided. It can be changed all at once. As a result, the pitch PX1 takes the maximum large pitch PX1 _max and the small pitch PX1 _min smaller than the large pitch PX1 _max . Similarly, the pitch PX2 takes the maximum large pitch PX2 _max and the small pitch PX2 _min smaller than the large pitch PX2 _max . The pitch PX3 takes the maximum large pitch PX3 _max and the small pitch PX3 _minutes smaller than the large pitch PX3 _max . The tray 200 is formed with recesses 201 in which a plurality of IC devices 90 are arranged in a matrix. _{Then, the small pitch PX1 min} , the small pitch PX2 _min , and the small pitch PX3 _min can be matched with the pitch PX201 in the X direction of these recesses 201, respectively. In the electronic component inspection device 1, it is preferable _{that (large pitch PX1 max} ) = (large pitch PX2 _max ) = (large pitch PX3 _max). Further, it is preferable that (small pitch PX1 _min ) = (small pitch PX2 _min ) = (small pitch PX3 _min).

By the way, since the device transfer head 13 has, for example, an assembly error, the actual large pitch PX1 _max , large pitch PX2 _max , and large pitch PX3 _max are design values that are reference values (hereinafter, this value is referred to as the "first reference value"). It may deviate (shift) from (say). In this case, it is necessary to adjust the _{large pitch PX1 max} , the large pitch PX2 _max , and the large pitch PX3 _{max, respectively.} The alignment jig 8 shown in FIG. 5 is used for this adjustment. The alignment jig 8 is installed and used on, for example, the device supply unit 14 on the positive side in the Y direction of the two device supply units 14.

As shown in FIG. 5, the alignment jig 8 has a flat plate shape. The alignment jig 8 has eight nozzle guide holes 82 formed by opening on the upper surface 81. These nozzle guide holes 82 are arranged in a matrix of four in the X direction and two in the Y direction, and are the most negative side in the X direction and the most negative side in the Y direction. "Nozzle guide hole 821", "Nozzle guide hole 822", "Nozzle guide hole 823", "Nozzle guide hole 824", "Nozzle guide hole 825", in order from 82 to the positive side in the X direction. They are referred to as "nozzle guide hole 826", "nozzle guide hole 827", and "nozzle guide hole 828". In this embodiment, for example, a nozzle guide hole 821, a nozzle guide hole 822, a nozzle guide hole 823, and a nozzle guide hole 824 are used. The pitch PX821 of the nozzle guide hole 821 and the nozzle guide hole 822 is _{equivalent to the first reference value of the large pitch PX1 max} , and the pitch PX822 of the nozzle guide hole 822 and the nozzle guide hole 823 is It is equivalent to the first reference value of the large pitch PX2 _max , and the pitch PX823 of the nozzle guide hole 823 and the nozzle guide hole 824 is equivalent to the first reference value of the _{large pitch PX3 max.}

The alignment jig 8 has two positioning guide holes 83 for positioning with the device supply unit 14. These positioning guide holes 83 are arranged as far apart as possible in the X direction. Then, by inserting each positioning guide hole 83 into a guide pin (not shown) of the device supply unit 14, the positioning jig 8 and the device supply unit 14 are positioned.

Further, the alignment jig 8 has two bolts 84 that maintain a positioning state with the device supply unit 14. These bolts 84 are arranged apart in the Y direction. Then, by screwing each bolt 84 into the device supply unit 14, the alignment jig 8 is prevented from being separated from the device supply unit 14, so that the positioning state with the device supply unit 14 can be maintained. it can.

Next, a method of adjusting the _{large pitch PX1 max} , the large pitch PX2 _max , and the large pitch PX3 _max using the alignment jig 8 will be described.

First, as shown in FIG. 8, in a state where the device transfer head 13 has a large pitch PX1 _max , a large pitch PX2 _max , and a large pitch PX3 _max , the suction nozzle 733, which is the first nozzle, is used for the nozzle of the alignment jig 8. The suction nozzle 723, which is the second nozzle, is arranged on the guide hole 821, the suction nozzle 723, which is the second nozzle, is arranged on the nozzle guide hole 822, and the suction nozzle 713, which is the third nozzle, is arranged on the nozzle guide hole 823. A suction nozzle 743 is arranged on the nozzle guide hole 824.

Then, the suction nozzle 733, the suction nozzle 723, the suction nozzle 713, and the suction nozzle 743 are lowered from the state shown in FIG. At this time, for example, the state shown in FIG. 9 or the state shown in FIG. 10 may be obtained.

In the state shown in FIG. 9, the suction nozzle 733 is inserted into the nozzle guide hole 821, the suction nozzle 723 is inserted into the nozzle guide hole 822, the suction nozzle 713 is inserted into the nozzle guide hole 823, and the suction nozzle 743 is inserted. It is inserted into the nozzle guide hole 824. In such a state shown in FIG. 9, it is considered that the large pitch PX1 _max , the large pitch PX2 _max , and the large pitch PX3 _max are in accordance with the first reference values, respectively, and the electronic component inspection device 1 can be operated as it is. it can.

On the other hand, in the state shown in FIG. 10, the suction nozzle 733 is inserted into the nozzle guide hole 821, the suction nozzle 723 is inserted into the nozzle guide hole 822, and the suction nozzle 713 is inserted into the nozzle guide hole 823. , Only the suction nozzle 743 is not inserted into the nozzle guide hole 824. This is because the large pitch PX3 _max deviates from the first reference value (pitch PX823), that is, the large pitch PX3 _max is larger than the first reference value in the state shown in FIG. In this case, the bolt (not shown) fixing the connecting member 767 (see FIG. 3) to the belt 763 of the moving mechanism 76 is loosened, and the position of the fourth support portion 74 together with the connecting member 767 is adjusted. As a result, the suction nozzle 743 can be inserted into the nozzle guide hole 824. Then, if the suction nozzle 743 is actually inserted into the nozzle guide hole 824, _{it is considered that the large pitch PX3 max} is in accordance with the first reference value, and the electronic component inspection device 1 can be operated. Further, after this adjustment, the bolt is tightened again to fix the connecting member 767 to the belt 763.

The alignment jig 8 may be installed and used on, for example, the device recovery unit on the positive side in the Y direction of the two device collection units 18. This is because the device transfer head 20 in the collection area A4 also needs to be adjusted in the same manner as the device transfer head 13.

Further, as shown in FIG. 6, four height adjusting jigs 9 may be arranged and mounted on the upper surface 81 of the alignment jig 8 by two in the X direction and two in the Y direction. it can. These height adjusting jigs 9 mounted on the alignment jig 8 are used in the inspection area A3, and when the device transfer head 17 in the inspection area A3 is lowered, the height at the lowered position is determined. Used to adjust.

Each height adjusting jig 9 has a block shape. The height adjusting jig 9 has two guide pins (not shown) protruding downward. Each guide pin is inserted into a height adjusting jig guide hole 85 formed on the upper surface 81 of the alignment jig 8. As a result, each height adjusting jig 9 is positioned on the alignment jig 8.

Further, each height adjusting jig 9 has two bolts 91 that maintain a positioning state with the alignment jig 8. Each bolt 91 can be screwed into a female screw 86 formed on the upper surface 81 of the alignment jig 8. As a result, each height adjusting jig 9 is prevented from being separated from the alignment jig 8, and thus the positioning state with the alignment jig 8 can be maintained.

In the device transfer head 13, even if the large pitch PX1 _max , the large pitch PX2 _max , and the large pitch PX3 _max are adjusted to be the first reference values as described above, they are actually affected by, for example, a temperature change in the supply region A2. The small pitch PX1 _min , the small pitch PX2 _min , and the small pitch PX3 _min may deviate (shift) from the design values (hereinafter, this value is referred to as a "second reference value") which are the reference values. Then, depending on the difference from the second reference value (the degree of deviation from the second reference value), it may be difficult for the device transfer head 13 to grip the IC device 90 from the tray 200, or the gripped IC device 90 may be difficult to grip. May be difficult to place on the temperature control unit 12. Therefore, in the electronic component inspection device 1, it is necessary to grasp the _{actual small pitch PX1 min} , small pitch PX2 _min , and small pitch PX3 _{min, respectively.} The position detection unit (detection unit) 3 shown in FIG. 7 is used for this grasp.

As shown in FIG. 2, the position detection unit 3 is arranged in the supply area A2, and the arrangement location is preferably as close to the center of the supply area A2 as possible. The position detection unit 3 is also arranged in the collection area A4. As described above, the position detection unit (detection unit) 3 is provided in the supply area A2 and the recovery area A4. This is because the same phenomenon as the device transport head 13 in the supply region A2 can occur in the device transport head 20 in the recovery region A4, and the phenomenon can be prevented by the position detection unit 3 in the recovery region A4. .. Here, the position detection unit 3 in the supply area A2 will be typically described. As described above, the electronic component inspection device 1 includes a supply area A2 in which the IC device 90 is conveyed to the inspection area A3 in which the IC device 90, which is an electronic component, is inspected, and an electronic component inspected in the inspection area A3. It has a recovery area A4 from which the IC device 90 is recovered.

The position detection unit 3 has two positioning guide holes 48 for positioning within the supply area A2. These positioning guide holes 48 are arranged as far apart as possible in the X direction. Then, in this positioning state, the position detection unit 3 is fixed via two bolts 35.

The position detection unit 3 includes the position of the suction nozzle 713 of the first grip portion 78A, the position of the suction nozzle 723 of the second grip portion 78B, the position of the suction nozzle 733 of the third grip portion 78C, and the fourth grip portion 78D. The position of the suction nozzle 743 is detected. As shown in FIG. 7, the position detection unit 3 includes a main body unit 4, a first light emitting unit 5A, a first light receiving unit 5B, a second light emitting unit 6A, and a second light emitting unit 6B. ..

The position detection unit (detection unit) 3 has a block shape or a plate shape (plate shape in the present embodiment), and has a main body portion 4 composed of rectangular members in a plan view. The main body 4 is formed in a recess 42 formed in the central portion of the upper surface 41, a through hole (small recess) 44 formed in the bottom 421 of the recess 42 so as to penetrate to the lower surface 43, and a side wall portion 422 of the recess 42. A first light emitting portion insertion portion 45A formed by opening, and a first light receiving portion insertion portion 45B formed by opening to face the first light emitting portion insertion portion 45A in the side wall portion 423 of the recess 42. The second light emitting portion insertion portion 46A formed by opening in the side wall portion 424 of the recess 42, and the second light emitting portion insertion portion 46A formed by opening in the side wall portion 425 of the recess 42 so as to face the second light emitting portion insertion portion 46A. 2 It has an insertion portion 46B for a light receiving portion. The first light emitting portion insertion portion 45A is formed so as to penetrate along the X direction, and the first light emitting portion 5A is inserted. The first light emitting portion 5A is fixed in the first light emitting portion insertion portion 45A by the sliding set screw 31. The first light receiving portion insertion portion 45B is formed so as to penetrate along the X direction, and the first light receiving portion 5B is inserted. The first light receiving portion 5B is fixed in the first light receiving portion insertion portion 45B by a set screw 32 with a slip. The second light emitting portion insertion portion 46A is formed so as to penetrate along the Y direction, and the second light emitting portion 6A is inserted. The second light emitting portion 6A is fixed in the second light emitting portion insertion portion 46A by the sliding set screw 33. The second light receiving portion insertion portion 46B is formed so as to penetrate along the Y direction, and the second light receiving portion 6B is inserted. The second light receiving portion 6B is fixed in the insertion portion 46B for the second light receiving portion by a set screw 34 with a slip.

When the main body portion 4 has such a configuration and the base material to be the main body portion 4 is machined, the following effects are obtained.

Once the base metal is fixed to the machine tool, the recess 42, the through hole 44, the insertion portion 45A for the first light emitting portion, and the first light receiving portion are used while maintaining the fixed state. The insertion portion 45B for the light emitting portion, the insertion portion 46A for the second light emitting portion, the insertion portion 46B for the second light receiving portion, and the like can be completely processed. As a result, it is possible to obtain the main body portion 4 having a highly accurate positional relationship between the processed portions. It is preferable that the main body 4 is formed with a female screw 47 for fixing to the machine tool.

The first light emitting unit 5A, the first light receiving unit 5B, the second light emitting unit 6A, and the second light receiving unit 6B are all fiber sensors. The first light emitting unit 5A can emit the light LS5, which is a laser beam, toward the positive side in the X direction, that is, toward the first light receiving unit 5B. The first light receiving unit 5B can receive the light LS5. The second light emitting unit 6A can emit the light LS6, which is a laser beam, toward the positive side in the Y direction, that is, toward the second light receiving unit 6B. The second light receiving unit 6B can receive the light LS6.

In this way, the position detection unit (detection unit) 3 has a first light emitting unit 5A that emits light LS5 in the X direction (first direction) and a first light receiving unit 5B that receives light LS5 from the first light emitting unit 5A. A second light emitting unit 6A that emits light LS6 in the Y direction (second direction), and a second light receiving unit 6B that receives light LS6 from the second light emitting unit 6A. As a result, as will be described later, the suction nozzle 713 of the first grip portion 78A, the suction nozzle 723 of the second grip portion 78B, and the suction nozzle 733 of the third grip portion 78C, based on the transmission and blocking of the light LS5. 4 The position of the suction nozzle 743 of the grip portion 78D in the X direction can be detected. Further, based on the transmission and blocking of the light LS6, the suction nozzle 713 of the first grip portion 78A, the suction nozzle 723 of the second grip portion 78B, the suction nozzle 733 of the third grip portion 78C, and the suction nozzle 78D of the fourth grip portion 78D are attracted. The position of the nozzle 743 in the Y direction can be detected.

As shown in FIGS. 7 and 11, the first light emitting portion insertion portion 45A and the first light receiving portion insertion portion 45B each have a slit 451. By passing the light LS5 through the slit 451 the diffusion of the light LS5 is prevented, and thus the directivity of the light LS5 is improved. Further, the insertion portion 46A for the second light emitting portion and the insertion portion 46B for the second light receiving portion each have a slit 461. By passing the light LS6 through the slit 461, diffusion of the light LS6 is prevented, and thus the directivity of the light LS6 is improved.

Further, in the position detection unit 3, the through hole 44 is a portion smaller than the bottom portion 421 in a plan view, and functions as a recognition mark for being imaged by the camera 771 (see FIG. 4). The identification mark, the coordinates of the device carrying head 13 when the the imaging center of O ₄₄ and the camera 771 of the through hole 44 forming a circular in plan view matches the horizontal position of the image pickup center of the camera 771 (XY coordinates) Will be able to. The portion that functions as the recognition mark may be a small convex portion that is formed so as to protrude from the bottom portion 421 and is smaller than the bottom portion 421 in a plan view, instead of the through hole (small concave portion) 44.

As shown in FIG. 11, the center O ₄₄ of the through hole 44 is arranged at a position overlapping _{the intersection O LS where the optical LS 5 and the optical LS 6} intersect in a plan view. As a result, the XY coordinates of the center of the suction nozzle 733, which is the first nozzle arranged at this position, and the imaging center of the camera 771 can be obtained based on the horizontal position (XY coordinates) of the device transfer head 13. .. From this, the difference in the position of the device transfer head 13 between the case where the center of the suction nozzle 733 is arranged at the same horizontal position (XY coordinates) and the case where the image pickup center of the camera 771 is arranged is the suction nozzle 733. It will be obtained as the difference in the horizontal position between the center of the camera and the image pickup center of the camera 771. That is, the relative positional relationship between the center of the suction nozzle 733 attached to the base 75 of the device transfer head 13 and the imaging center of the camera 771 also attached to the base 75 can be obtained from the moving position of the device transfer head 13. Become.

In the present embodiment, the relative positional relationship is set between the horizontal position of the center of the suction nozzle 733 (XY coordinates) and the horizontal position of the imaging center of the camera 771 (XY coordinates) based on the horizontal position of the device transfer head 13. Find as the difference. Then, by setting the relative positional relationship obtained in this way as the relative position information, when the imaging center of the camera 771 is aligned with the center position of the IC device 90, the device transfer head 13 is set based on the relative position information. By moving by the difference, the center of the suction nozzle 733 can be moved to the center position of the IC device 90. In this way, the IC device 90 is preferably gripped by the suction nozzle 733.

Next, the position of the suction nozzle 713 of the first grip portion 78A, the position of the suction nozzle 723 of the second grip portion 78B, the position of the suction nozzle 733 of the third grip portion 78C, and the fourth position by the position detection unit 3. The detection of the grip portion 78D with the position of the suction nozzle 743 will be described.

As shown in FIG. 11, in the position detection unit 3, the light LS5 is emitted from the first light emitting unit 5A and is received by the first light receiving unit 5B, and the light LS6 is emitted from the second light emitting unit 6A. , The light is being received by the second light receiving unit 6B (ON). That is, in the position detection unit 3, both the optical LS5 and the optical LS6 are in a transmitted state.

Next, as shown in FIG. 12, the suction nozzle 733, which is the first nozzle of the device transfer head 13, is moved to a position overlapping _{the center O 44 of the position detection unit 3.} That is, as shown in FIG. 18, the suction nozzle 733, which is the first nozzle of the device transfer head 13, is moved above the upper surface 41 of the position detection unit 3 and directly above the through hole 44. Such a position is detected in advance based on the image captured by the camera 771, and is stored in the control unit 800. Further, as shown in FIG. 12, the light LS5 and the light LS6 are still in a transmitted state. _{The device transfer head 13 has a small pitch PX1 min} between the suction nozzle 733, which is the first nozzle, and the suction nozzle 723, which is the second nozzle, and the suction nozzles 723 and the third nozzle, which are the second nozzles. The space between the suction nozzle 713 and the suction nozzle 713 is a small pitch PX2 _min, and the space between the suction nozzle 713 which is the third nozzle and the suction nozzle 743 which is the fourth nozzle is a small pitch PX3 _min .

Next, as shown in FIG. 13, the suction nozzle 733 is moved to the negative side in the Z direction and inserted into the recess 42 of the position detection unit 3. That is, as shown in FIG. 19, the suction nozzle 733 is moved downward to a position where it does not abut on the bottom 421 of the recess 42 of the position detection unit 3. As a result, in the position detection unit 3, the light reception of the light LS5 by the first light receiving unit 5B is blocked by the suction nozzle 733, and the light reception of the light LS6 by the second light receiving unit 6B is blocked by the suction nozzle 733. (OFF). That is, both the light LS5 and the light LS6 are shaded by the suction nozzle 733.

When detecting the position, the suction nozzle 733 starts moving from such a position (position shown in FIG. 13) in the X direction and the Y direction. As a result, it is possible to prevent the suction nozzle 733 from colliding with the side wall portion 422, the side wall portion 423, the side wall portion 424, and the side wall portion 425 of the recess 42 regardless of whether the suction nozzle 733 moves in the X direction or the Y direction. When neither the light LS5 nor the light LS6 is in the light-shielded state by the suction nozzle 733, the position of the suction nozzle 733 is finely adjusted to the position where the light-shielding state is obtained.

Next, as shown in FIG. 14, the suction nozzle 733 is gradually moved to the positive side in the X direction, and is stopped at a position where the second light receiving unit 6B is in the light receiving state (ON). Then, this position (X coordinate) is stored in the control unit 800 as the "first X coordinate (see FIG. 22)" of the suction nozzle 733.

Next, as shown in FIG. 15, the suction nozzle 733 is gradually moved to the negative side in the X direction, and is stopped at a position where the second light receiving unit 6B is in the light receiving state (ON) again. Then, this position (X coordinate) is stored in the control unit 800 as the "second X coordinate (see FIG. 22)" of the suction nozzle 733.

Next, the control unit 800 detects (calculates) and stores the central position between the first X coordinate and the second X coordinate as the "center X coordinate" which is the center position in the X direction of the suction nozzle 733. (See FIG. 22).

Next, the suction nozzle 733 is returned to the movement start position again, and as shown in FIG. 16, the suction nozzle 733 is gradually moved to the positive side in the Y direction, and the first light receiving unit 5B is in the light receiving state (ON). Stop at. Then, this position (Y coordinate) is stored in the control unit 800 as the "first Y coordinate (see FIG. 23)" of the suction nozzle 733.

Next, as shown in FIG. 17, the suction nozzle 733 is gradually moved to the negative side in the Y direction, and is stopped at a position where the first light receiving unit 5B is in the light receiving state (ON) again. Then, this position (Y coordinate) is stored in the control unit 800 as the "second Y coordinate (see FIG. 23)" of the suction nozzle 733.

Next, the control unit 800 detects the central position between the first Y coordinate and the second Y coordinate as the "center Y coordinate (see FIG. 23)" which is the center position of the suction nozzle 733 in the Y direction (see FIG. 23). Calculate) and memorize.

Next, as shown in FIG. 20, the suction nozzle 733 is raised to move the device transfer head 13 to the negative side in the X direction _{by a small pitch PX2 min.} As a result, the suction nozzle 723, which is the second nozzle, moves to a position overlapping _{the center O 44 of the position detection unit 3 in a plan view.} That is, the suction nozzle 723, which is the second nozzle, is above the upper surface 41 of the position detection unit 3 and moves directly above the through hole 44.

Next, as shown in FIG. 21, the suction nozzle 723 is moved to the negative side in the Z direction and inserted into the recess 42 of the position detection unit 3.

After that, the "center X coordinate" and the "center Y coordinate" of the suction nozzle 723 are obtained in the same manner as the "center X coordinate" and the "center Y coordinate" of the suction nozzle 733. Further, the "center X coordinate" and "center Y coordinate" of the suction nozzle 713, which is the third nozzle, and the "center X coordinate" and "center Y coordinate" of the suction nozzle 743, which is the fourth nozzle, can be obtained in the same manner. it can.

As described above, the base 75 is movable in the Y direction (second direction) orthogonal to the X direction (first direction), and is orthogonal to the X direction (first direction) in the Y direction (second direction). It is also possible to move in the direction of). The base portion 75 has a first grip portion 78A that grips the IC device 90, which is an electronic component, and an IC that is movable in the X direction (first direction) with respect to the first grip portion 78A and is an electronic component. A second grip portion 78B that grips the device 90, and a third grip portion 78C that is movable in the X direction (first direction) with respect to the first grip portion 78A and grips the IC device 90 that is an electronic component. A fourth grip portion 78D that is movable in the X direction (first direction) with respect to the first grip portion 78A and grips the IC device 90, which is an electronic component, is provided.

Then, as described above, the position detection unit 3 has the center X coordinate, which is the position of the suction nozzle 713 of the first grip portion 78A in the X direction (first direction), and the suction nozzle 713 of the first grip portion 78A. It is possible to detect the center Y coordinate, which is the position in the Y direction (second direction) of.

Similarly, the position detection unit 3 has the center X coordinate, which is the position of the suction nozzle 723 of the second grip portion 78B in the X direction (first direction), and the Y direction (Y direction) of the suction nozzle 723 of the second grip portion 78B. It is possible to detect the center Y coordinate, which is the position in the second direction).

Further, the position detection unit (detection unit) 3 has the center X coordinate, which is the position of the suction nozzle 733 of the third grip portion 78C in the X direction (first direction), and the suction nozzle 733 of the third grip portion 78C. It is possible to detect the center Y coordinate, which is the position in the Y direction (second direction).

Further, the position detection unit (detection unit) 3 has a position in the X direction (first direction) of the suction nozzle 743 of the fourth grip portion 78D and a Y direction (second direction) of the suction nozzle 743 of the fourth grip portion 78D. It is possible to detect the center Y coordinate, which is the position in the direction of).

Based on the detection result detected by the position detection unit 3 having such a configuration, that is, the X coordinates of the centers of the 1st to 4th nozzles, the control unit 800 actually has a small pitch PX1 _min and a small pitch PX2 _min. , Small pitch PX3 _min can be calculated respectively.

The small pitch PX1 _min is obtained by (center X coordinate of the second nozzle (suction nozzle 723))-(center X coordinate of the first nozzle (suction nozzle 733)).

The small pitch PX2 _min is obtained by (center X coordinate of the third nozzle (suction nozzle 713))-(center X coordinate of the second nozzle (suction nozzle 723)).

The small pitch PX3 _min is obtained by (center X coordinate of the 4th nozzle (suction nozzle 743))-(center X coordinate of the 3rd nozzle (suction nozzle 713)).

In the present embodiment, the device transfer head 13 is configured such that nozzles 1 to 4 are arranged in the X direction and pitch conversion is performed in the X direction, but the present invention is not limited to this. For example, the Nozzles 1 to 4 may be arranged in the Y direction, and the pitch conversion may be performed in the Y direction. In this case, in order to obtain a small pitch smaller than the large pitch at which the pitch is maximum, the Y coordinates of the centers of the 1st to 4th nozzles are used.

In the electronic component inspection apparatus 1, the operation of the 1st to 4th nozzles depends on the degree of difference between the _{actual small pitch PX1 min} , small pitch PX2 _min , small pitch PX3 _{min and the second reference value obtained above.} Can be changed, that is, switched. This operation includes a first mode and a second mode.

As described above, the suction nozzle 713 of the first grip portion 78A, the suction nozzle 723 of the second grip portion 78B, the suction nozzle 733 of the third grip portion 78C, and the suction nozzle 743 of the fourth grip portion 78D are It is movable in the Z direction (third direction) orthogonal to the X direction (first direction) and the Y direction (second direction) with respect to the base 75.

The first mode is a distance obtained based on the position of the suction nozzle 713 of the first grip portion 78A and the position of the suction nozzle 723 of the second grip portion 78B detected by the position detection unit (detection unit) 3. Small pitch PX2 _{min ), the distance (small pitch PX1 min} ) obtained based on the position of the suction nozzle 723 of the second grip portion 78B and the position of the suction nozzle 733 of the third grip portion 78C, and the first grip portion. _{When the distance (small pitch PX3 min} ) obtained based on the position of the suction nozzle 713 of the 78A and the position of the suction nozzle 743 of the fourth grip portion 78D is less than a predetermined value, the first This is an operation of moving the grip portion 78A, the second grip portion 78B, the third grip portion 78C, and the fourth grip portion 78D at the same time, that is, collectively in the Z direction (third direction).

The second mode is a distance obtained based on the position of the suction nozzle 713 of the first grip portion 78A and the position of the suction nozzle 723 of the second grip portion 78B detected by the position detection unit (detection unit) 3. Small pitch PX2 _{min ), the distance (small pitch PX1 min} ) obtained based on the position of the suction nozzle 723 of the second grip portion 78B and the position of the suction nozzle 733 of the third grip portion 78C, and the first grip portion. _{When the distance (small pitch PX3 min} ) obtained based on the position of the suction nozzle 713 of the 78A and the position of the suction nozzle 743 of the fourth grip portion 78D is equal to or more than a predetermined value, the first This is an operation of moving the grip portion 78A, the second grip portion 78B, the third grip portion 78C, and the fourth grip portion 78D individually, that is, in the Z direction (third direction) with a time difference.

As described above, in the electronic component inspection device 1, the operation of each grip portion can be changed according to the pitch (distance) of the first nozzle to the fourth nozzle. As a result, as will be described later, the IC device 90 can be smoothly gripped by the Nozzles 1 to 4.

In the following, as an example, a case where the first mode is applied when gripping the IC device 90 on the tray 200 will be described with reference to FIGS. 24 to 26.

Here, as a premise, it is assumed that the control unit 800 determines that, for example, the small pitch PX1 _{min is the maximum among the actual small pitch PX1 min} , the small pitch PX2 _min , and the small pitch PX3 _min. Then, it is assumed that the difference (absolute value) between the small pitch PX1 _min and the second reference value (= PX201) is less than the threshold value set in advance and stored in the control unit 800. Within such a range, it is said that the size of the pitch does not affect the gripping of the IC device 90 by the nozzles 1 to 4. The "threshold value" is a value that is considered to be affected by the size of the pitch on the gripping of the IC device 90 by the nozzles 1 to 4.

As shown in FIG. 24, in a state where the device transfer head 13 has a small pitch PX1 _min , a small pitch PX2 _min , and a small pitch PX3 _min , the first nozzle, the suction nozzle 733, and the second nozzle, the suction nozzle 723, 3 The suction nozzle 713, which is the No. 4 nozzle, and the suction nozzle 743, which is the No. 4 nozzle, are arranged on the IC device 90 of the tray 200, respectively.

Next, as shown in FIG. 25, the suction nozzle 733 to No. 4 which is the first nozzle and the suction nozzle 743 which is the fourth nozzle are lowered at the same time. As a result, the suction nozzle 733 to the first nozzle and the suction nozzle 743 to be the fourth nozzle each come into contact with the IC device 90, and if suction is performed in this contact state, the IC device 90 can be sucked. ..

Next, as shown in FIG. 26, the suction nozzle 733 to No. 4 which is the first nozzle and the suction nozzle 743 which is the fourth nozzle are raised at the same time. As a result, the suction nozzle 733 to the first nozzle and the suction nozzle 743 to be the fourth nozzle can each grip the IC device 90.

With such a first mode, the IC device 90 can be gripped and conveyed as quickly as possible, and thus the throughput in the electronic component inspection device 1 can be improved.

Next, as an example, a case where the second mode is applied when gripping the IC device 90 on the tray 200 will be described with reference to FIGS. 27 to 32.

Here, as a premise, it is assumed that the control unit 800 determines that, for example, the small pitch PX1 _{min is the maximum among the actual small pitch PX1 min} , the small pitch PX2 _min , and the small pitch PX3 _min. Then, it is assumed that the difference (absolute value) between the small pitch PX1 _min and the second reference value (= PX201) is equal to or greater than the threshold value. Within such a range, it is said that the gripping of the IC device 90 by the 1st to 4th nozzles is affected by the magnitude of the pitch.

As shown in FIG. 27, the suction nozzle 733, which is the first nozzle, is arranged on the IC device 90 of the tray 200 in a state where the device transfer head 13 has a small pitch PX1 _min , a small pitch PX2 _min , and a small pitch PX3 _min. ..

Next, as shown in FIG. 28, the suction nozzle 733, which is the first nozzle, is lowered. As a result, the suction nozzle 733, which is the first nozzle, comes into contact with the IC device 90, and if suction is performed in this contacted state, the IC device 90 can be sucked.

Next, as shown in FIG. 29, the suction nozzle 733, which is the first nozzle, is raised. As a result, the suction nozzle 733, which is the first nozzle, can grip the IC device 90.

Next, as shown in FIG. 30, the device transfer head 13 is moved to the negative side in the X direction by the amount of the _{small pitch PX1 min.} As a result, the suction nozzle 723, which is the second nozzle, is arranged on the IC device 90 of the tray 200.

Next, as shown in FIG. 31, the suction nozzle 723, which is the second nozzle, is lowered. As a result, the suction nozzle 723, which is the second nozzle, comes into contact with the IC device 90, and if suction is performed in this contacted state, the IC device 90 can be sucked.

Next, as shown in FIG. 32, the suction nozzle 723, which is the second nozzle, is raised. As a result, the suction nozzle 723, which is the second nozzle, can grip the IC device 90.

After that, the IC device 90 is also gripped by the suction nozzle 713, which is the third nozzle, and the suction nozzle 743, which is the fourth nozzle, in the same manner as until the suction nozzle 723, which is the second nozzle, grips the IC device 90. Can be done.

With such a second mode, even when it is difficult to grip the IC device 90 collectively with the first nozzle to the fourth nozzle, the IC device 90 can be accurately gripped one by one with a time lag. As a result, it is possible to prevent jams and errors from occurring in the electronic component inspection device 1.

In both the first mode and the second mode, the largest of _{the small pitch PX1 min} , the small pitch PX2 _min , and the small pitch PX3 _{min was used as a comparison with the threshold value.} Not limited to this. For example, the smallest of the small pitch PX1 _min , the small pitch PX2 _min , and the small pitch PX3 _min may be used, or both the maximum and the minimum may be used.

Next, a series of operations from detecting the positions of the 1st to 4th nozzles to gripping the IC device 90 with each nozzle will be described with reference to the flowchart of FIG. 33. The timing of executing this flowchart is not particularly limited, but may be, for example, when the temperature change in the supply region A2 is equal to or greater than a predetermined value, or at regular intervals.

The first nozzle is set as the suction nozzle for which the position is to be detected (step S101).

Next, as described above, the center X coordinate of the first nozzle is detected (step S102), and the center X coordinate is stored in the control unit 800 (step S103).

Next, as described above, the center Y coordinate of the first nozzle is detected (step S104), and the center Y coordinate is stored in the control unit 800 (step S105).

Next, it is determined whether or not steps S102 to S105 have been executed for the fourth nozzle (step S106).

If it is determined in step S106 that steps S102 to S105 have been executed for the fourth nozzle, the process is initialized (step S107). On the other hand, in step S106, if it is not determined that steps S102 to S105 have been executed for the fourth nozzle, N (nozzle number) is incremented by one (step S108).

After executing step S107, the distance between the first nozzle and the second nozzle in the X direction, that is, the small pitch PX1 _min is calculated as described above (step S109).

Next, it is determined whether or not the distance between the No. 3 nozzle and the No. 4 nozzle in the X direction, that is, whether or not the execution is performed until the _{small pitch PX3 min is calculated (step S110).}

If it is determined in step S110 that the _{operation has been executed until the small pitch PX3 min} is calculated, the maximum one (maximum distance) of _{the small pitch PX1 min} , the small pitch PX2 _min , and the small pitch PX3 _{min is detected (step S111).} .. On the other hand, in step S110, _{if it is not determined that the operation is executed until the small pitch PX3 min} is calculated, N (nozzle number) is incremented by one (step S112).

After executing step S111, | maximum distance-reference distance (second reference value) | is calculated to determine whether or not the calculation result is equal to or greater than the threshold value (step S113).

If it is not determined in step S113 that the calculation result is equal to or greater than the threshold value, the first mode is selected (step S114). On the other hand, in step S113, when it is determined that the calculation result is equal to or greater than the threshold value, the second mode is selected (step S115).

In the present embodiment, the series of operations shown in the flowchart is applied when the device transfer head 13 grips the IC device 90 on the tray 200 in the supply area A2, but the present invention is not limited to this. Other application modes include, for example, the following modes.

When the device transfer head 13 opens the IC device 90 on the temperature adjusting unit 12.
When the device transfer head 13 grips the IC device 90 on the temperature adjusting unit 12.
When the device transport head 13 opens the IC device 90 on the device supply unit 14.
When the device transfer head 20 grips the IC device 90 on the vise collecting unit 18.
When the device transfer head 20 opens the IC device 90 on the tray 200 in the collection area A4.
When the device transport head 20 opens the IC device 90 on the collection tray 19.

<Second Embodiment>
Hereinafter, the second embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 34, but the differences from the above-described embodiments will be mainly described, and the same matters will be described. Is omitted.

The present embodiment is the same as the first embodiment except that the number of gripping portions for gripping the IC device is different.

As shown in FIG. 34, in the present embodiment, in addition to the first grip portion 78A to the fourth grip portion 78D, the device transfer head 13 further includes a fifth grip portion 78E, a sixth grip portion 78F, and a third grip portion 78F. It has a 7 grip portion 78G and an 8th grip portion 78H.

The fifth grip portion 78E is provided on the base portion 75 and is arranged on the positive side (second direction) in the Y direction with respect to the first grip portion 78A. The sixth grip portion 78F is provided on the base portion 75 and is arranged on the positive side (second direction) in the Y direction with respect to the second grip portion 78B. The seventh grip portion 78G is provided on the base portion 75 and is arranged on the positive side (second direction) in the Y direction with respect to the third grip portion 78C. The eighth grip portion 78H is provided on the base portion 75 and is arranged on the positive side (second direction) in the Y direction with respect to the fourth grip portion 78D.

The position detection unit (detection unit) 3 is the same as for the first grip portion 78A to the fourth grip portion 78D described in the first embodiment, in the X direction (first) of the suction nozzle 791 of the fifth grip portion 78E. The position (center X coordinate) in the Y direction (second direction) and the position (center Y coordinate) in the Y direction (second direction) can be detected.

Similarly, the position detection unit 3 has a position (center X coordinate) of the suction nozzle 792 of the sixth grip portion 78F in the X direction (first direction) and a position (center Y coordinate) in the Y direction (second direction). ) Can be detected.

Further, the position detection unit 3 has a position (center X coordinate) of the suction nozzle 793 of the seventh grip portion 78G in the X direction (first direction) and a position (center Y coordinate) in the Y direction (second direction). Can be detected.

The position detection unit 3 detects the position (center X coordinate) of the suction nozzle 794 of the eighth grip portion 78H in the X direction (first direction) and the position (center Y coordinate) in the Y direction (second direction). It is possible.

If the flowchart described in the first embodiment is applied to the device transfer head 13 having the above configuration, the first grip portion 78A to the eighth grip portion 78H can smoothly grip the IC device 90. ..

<Third Embodiment>
Hereinafter, the third embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIGS. 35 to 37, but the differences from the above-described embodiments will be mainly described, and the same matters will be described. Omits the description.

The present embodiment is the same as the first embodiment except that the method for detecting the position of the suction nozzle is different.

Here, a method of detecting the position of the suction nozzle 733, which is typically the first nozzle, will be described.

In order to detect the "center X coordinate" which is the center position of the suction nozzle 733 in the X direction, first, as shown in FIG. 35, the suction nozzle 733 is placed on the upper surface 41 which is separated from the recess 42 of the position detection unit 3. Let me. At this time, the suction nozzle 733 is located on the negative side in the X direction with respect to the recess 42.

Then, while ejecting the gas GS from the suction nozzle 733, the suction nozzle 733 is moved to the positive side in the X direction (outward path PR1), and the position beyond the recess 42 (the suction nozzle 733 shown by the alternate long and short dash line in FIG. 35). See) to stop. In the outbound PR1, the change in the flow rate of the gas GS detected (measured) by the flow meter (not shown) communicating with the adsorption nozzle 733 is shown in the graph GR1 shown by the solid line in FIG. From this graph GR1, it can be seen that the flow rate starts to increase when the suction nozzle 733 exceeds the side wall portion 422 of the recess 42 in the process of moving. The position where this flow rate starts to increase is stored as the "first X coordinate".

Next, while ejecting the gas GS from the suction nozzle 733, the suction nozzle 733 is moved to the negative side in the X direction (return path PR2) and stopped at a position beyond the recess 42. In the return route PR2, the change in the flow rate of the gas GS detected by the flow meter is shown in the graph GR2 shown by the broken line in FIG. From this graph GR2, it can be seen that the flow rate starts to increase when the suction nozzle 733 exceeds the side wall portion 423 of the recess 42 in the process of moving. The position where this flow rate starts to increase is stored as the "second X coordinate".

Then, the central position between the first X coordinate and the second X coordinate can be detected as the "center X coordinate" which is the center position in the X direction of the suction nozzle 733.

In order to detect the "center Y coordinate" which is the center position of the suction nozzle 733 in the Y direction, the suction nozzle 733 is placed on the upper surface 41 which is separated from the recess 42 of the position detection unit 3 in the same manner as when detecting the center X coordinate. To be placed in. At this time, the suction nozzle 733 is located on the negative side in the Y direction with respect to the recess 42.

Then, while ejecting the gas GS from the suction nozzle 733, the suction nozzle 733 is moved to the positive side in the Y direction (outward route) and stopped at a position beyond the recess 42. In this outbound route, the change in the flow rate of the gas GS detected by the flow meter is shown in the graph GR3 shown by the solid line in FIG. 37. From this graph GR3, it can be seen that the flow rate starts to increase when the suction nozzle 733 exceeds the side wall portion 424 of the recess 42 in the process of moving. The position where this flow rate starts to increase is stored as the "first Y coordinate". From the graph GR3, it can be seen that the flow rate starts to decrease when the suction nozzle 733 exceeds the side wall portion 425 of the recess 42.

Next, while ejecting the gas GS from the suction nozzle 733, the suction nozzle 733 is moved to the negative side in the Y direction (return path) and stopped at a position beyond the recess 42. In this return route, the change in the flow rate of the gas GS detected by the flow meter is shown in the graph GR4 shown by the broken line in FIG. 37. From this graph GR4, it can be seen that the flow rate starts to increase when the suction nozzle 733 exceeds the side wall portion 425 of the recess 42 in the process of moving. The position where this flow rate starts to increase is stored as the "second Y coordinate".

Then, the central position between the first Y coordinate and the second Y coordinate can be detected as the "center Y coordinate" which is the center position of the suction nozzle 733 in the Y direction.

<Fourth Embodiment>
Hereinafter, a fourth embodiment of the electronic component transport device and the electronic component inspection device of the present invention will be described with reference to FIG. 38, but the differences from the above-described embodiments will be mainly described, and the same matters will be described. Is omitted. Note that FIG. 38 typically illustrates one nozzle.

The present embodiment is the same as the first embodiment except that the mode for adjusting the position of the suction nozzle is different.

As shown in FIG. 38, in the present embodiment, the suction nozzle 713 is supported and fixed to the block-shaped support portion 715.

Further, at the lower end of the shaft 712, a connecting portion 712a to which the support portion 715 is connected is provided without a block shape. Then, in the present embodiment, the connecting portion 712a and the supporting portion 715 are connected via two bolts 712b. The two bolts 712b are arranged on opposite sides of each other via the shaft 712.

With such a configuration, for example, _{when adjusting the large pitch PX2 max} , the two bolts 712b can be loosened respectively. As a result, the position of the suction nozzle 713 can be finely adjusted in the X direction (or Y direction) together with the support portion 715. Then, after this adjustment, the two bolts 712b are tightened again. As a result, the position-adjusted suction nozzle 713 is fixed to the shaft 712.

Although the electronic component transfer device and the electronic component inspection device of the present invention have been described above with reference to the illustrated embodiment, the present invention is not limited to this, and each part constituting the electronic component transfer device and the electronic component inspection device is not limited thereto. Can be replaced with any configuration that can perform similar functions. Further, any component may be added.

Further, the electronic component transfer device and the electronic component inspection device of the present invention may be a combination of any two or more configurations (features) of each of the above-described embodiments.

Further, the number of gripping portions provided by the device transport head for gripping electronic components is four along the X direction in the first embodiment, but is not limited to this, and for example, two. It may be 3 or 5 or more. Further, in the second embodiment, the number of grip portions to be installed is not limited to this, and is not limited to Y, although one grip portion is installed in the Y direction corresponding to each grip portion arranged in the X direction. Two or more may be installed in the direction.

Further, the IC device is rectangular in a plan view in each of the above embodiments, but is not limited to this, and may be, for example, a circular or elliptical one. In this case, the electronic component transfer device or the electronic component inspection device changes the posture of the IC device in the horizontal plane, that is, a rotating stage for rotating the IC device around the vertical axis in the horizontal plane is provided in the supply region and the recovery region. It is preferable to have. Also in this case, the series of operations shown in the flowchart can be applied to, for example, the following aspects.

-When the device transfer head opens the IC device on the rotating stage in the supply area.
-When the device transfer head grips the IC device on the rotating stage in the supply area.
-When the device transfer head opens the IC device on the rotating stage in the collection area.
-When the device transfer head grips the IC device on the rotating stage in the collection area.

1 ... Electronic parts inspection device, 10 ... Electronic parts transfer device, 11A ... Tray transfer mechanism, 11B ... Tray transfer mechanism, 12 ... Temperature control unit, 13 ... Device transfer head, 14 ... Device supply unit, 15 ... Tray transfer mechanism, 16 ... Inspection unit, 17 ... Device transfer head, 18 ... Device recovery unit, 19 ... Recovery tray, 20 ... Device transfer head, 21 ... Tray transfer mechanism, 22A ... Tray transfer mechanism, 22B ... Tray transfer mechanism, 231 ... 1 partition, 232 ... 2nd partition, 233 ... 3rd partition, 234 ... 4th partition, 235 ... 5th partition, 241 ... front cover, 242 ... side cover, 243 ... side cover, 244 ... rear cover, 245 ... top cover 3, 3 ... Position detection unit (detection unit), 31 ... Slip set screw, 32 ... Slip set screw, 33 ... Slip set screw, 34 ... Slip set screw, 35 ... Bolt, 4 ... Main body Part, 41 ... Top surface, 42 ... Recession, 421 ... Bottom part, 422 ... Side wall part, 423 ... Side wall part, 424 ... Side wall part, 425 ... Side wall part, 43 ... Bottom surface, 44 ... Through hole, 45A ... For first light emitting part Insertion part, 45B ... Insertion part for first light receiving part, 451 ... Slit, 46A ... Insertion part for second light emitting part, 46B ... Insertion part for second light receiving part, 461 ... Slit, 47 ... Female screw, 48 ... Positioning guide Holes, 5A ... 1st light emitting part, 5B ... 1st light receiving part, 6A ... 2nd light emitting part, 6B ... 2nd light receiving part, 71 ... 1st support part, 712 ... shaft, 712a ... connecting part, 712b ... bolt, 713 ... Suction nozzle, 714 ... Drive mechanism, 714a ... Pulley, 714b ... Pulley, 714c ... Belt, 714e ... Fixed part, 715 ... Support part, 72 ... Second support part, 723 ... Suction nozzle, 73 ... Third support part , 733 ... Suction nozzle, 74 ... 4th support, 743 ... Suction nozzle, 75 ... Base, 751 ... 1st base, 752 ... 2nd base, 753 ... 3rd base, 754 ... 4th base, 76 ... Movement mechanism , 761 ... two-stage pulley, 761a ... small diameter pulley, 761b ... large diameter pulley, 762 ... two-stage pulley, 762a ... small diameter pulley, 762b ... large diameter pulley, 763 ... belt, 763a ... area, 763b ... area, 764 ... belt , 764a ... region, 764b ... region, 765 ... motor, 766 ... connecting member, 767 ... connecting member, 768 ... connecting member, 77 ... imaging unit, 771 ... camera, 772 ... mirror, 773 ... camera lens, 774 ... mirror surface, 78A ... 1st grip, 78B ... 2nd grip, 78C ... 3rd grip, 78D ... 4th grip, 78E ... 5th grip, 78F ... 6th grip, 78G ... 7th grip, 78H ... 8th grip, 791 ... suction nozzle, 792 ... suction nozzle, 793 ... suction nozzle, 794 ... Suction nozzle, 8 ... Alignment jig, 81 ... Top surface, 82 ... Nozzle guide hole, 821 ... Nozzle guide hole, 822 ... Nozzle guide hole, 823 ... Nozzle guide hole, 824 ... Nozzle guide hole, 825 ... Nozzle guide hole, 826 ... Nozzle guide hole, 827 ... Nozzle guide hole, 828 ... Nozzle guide hole, 83 ... Positioning guide hole, 84 ... Bolt, 85 ... Height adjustment jig guide hole, 86 ... Female screw, 9 ... Height adjustment jig, 91 ... Bolt, 90 ... IC device, 200 ... Tray, 201 ... Recess, 300 ... Monitor, 301 ... Display screen, 400 ... Signal lamp, 500 ... Speaker, 600 ... Nozzle stand, 700 ... Operation panel, 800 ... Control unit, A1 ... Tray supply area, A2 ... Device supply area (supply area), A3 ... Inspection area, A4 ... Device recovery area (collection area), A5 ... Tray removal area, GR1 ... graph, GR2 ... graph, GR3 ... graph, GR4 ... graph, GS ... gas, LS5 ... light, LS6 ... light, O _{44 ...} center, O _{LS ...} intersection, PR1 ... forward, PR2 ... backward, PX1 ... pitch, PX1 _max ... large pitch, PX1 _min ... small pitch, PX2 ... pitch, PX2 _max ... large pitch, PX2 _min ... small pitch, PX3 ... pitch, PX3 _max ... large pitch, PX3 _min ... small pitch, PX201 ... pitch, PX821 ... Pitch, PX822 ... Pitch, PX823 ... Pitch, S101-S115 ... Step, α _11A ... Arrow, α _11B ... Arrow, α _13X ... Arrow, α _13Y ... Arrow, α ₁₄ ... Arrow, α ₁₅ ... Arrow, α _17Y ... Arrow , Α ₁₈ ... arrow, α ₂₁ ... arrow, α _20X ... arrow, α _20Y ... arrow, α _22A ... arrow, α _22B ... arrow, α ₉₀ ... arrow

Claims (10)

A base that moves in the first direction,
A first grip portion provided on the base portion for gripping an electronic component, and a first grip portion.
A second grip portion provided on the base portion, which moves in the first direction with respect to the first grip portion and grips an electronic component, and a second grip portion.
A detection unit that detects a first position of the first grip portion in the first direction and a second position of the second grip portion in the first direction.
It has a tray having a plurality of recesses on which the electronic components are arranged, and
The base moves in a second direction orthogonal to the first direction,
The detection unit detects the third position of the first grip portion in the second direction and the fourth position of the second grip portion in the second direction.
The first grip portion and the second grip portion move in the first direction with respect to the base portion and in a third direction orthogonal to the second direction.
The distance between the first position of the first grip portion detected by the detection unit in the first direction and the second position of the second grip portion in the first direction, and the plurality of recesses. When the difference from the pitch in the first direction is equal to or greater than a predetermined value , the first grip portion and the second grip portion are individually moved in the third direction. Parts transfer device. The distance between the first position of the first grip portion detected by the detection unit in the first direction and the second position of the second grip portion in the first direction, and the plurality of recesses. The electron according to claim 1, wherein when the difference from the pitch in the first direction is less than a predetermined value , the first grip portion and the second grip portion move simultaneously in the third direction. Parts transfer device. The detection unit includes a first light emitting unit that emits light in the first direction, a first light receiving unit that receives light from the first light emitting unit, and a second light emitting unit that emits light in the second direction. The electronic component transfer device according to claim 1 or 2, further comprising a second light receiving unit that receives light from the second light emitting unit. The detection unit has a main body unit composed of a block-shaped or plate-shaped member.
The main body has a detection recess and
A small concave portion or a small convex portion provided at the bottom of the detection concave portion and smaller than the detection concave portion when viewed in a plan view along the third direction.
A first light emitting portion insertion portion that opens in the side wall portion of the detection recess and into which the first light emitting portion is inserted.
A first light receiving portion insertion portion, which is opened in the side wall portion of the detection recess so as to face the first light emitting portion insertion portion and into which the first light receiving portion is inserted.
A second light emitting portion insertion portion that opens in the side wall portion of the detection recess and into which the second light emitting portion is inserted.
The electronic component according to claim 3, further comprising a second light receiving portion insertion portion which is opened in the side wall portion of the detection recess so as to face the second light emitting portion insertion portion and into which the second light receiving portion is inserted. Conveyor device. The electronic component transfer device according to claim 4, wherein the small recess is provided so as to penetrate the small recess. It has a supply area where the electronic components are transported to an inspection area where the electronic components are inspected, and a collection area where the electronic components inspected in the inspection area are collected.
The electronic component transfer device according to any one of claims 1 to 5, wherein the detection unit is provided in the supply area and the collection area. A third grip portion provided on the base portion, which moves in a first direction with respect to the first grip portion and grips an electronic component, and a third grip portion.
It has a fourth grip portion provided on the base portion, which moves in a first direction with respect to the first grip portion and grips an electronic component.
Any one of claims 1 to 6, wherein the detection unit detects a fifth position of the third grip portion in the first direction and a sixth position of the fourth grip portion in the first direction. The electronic component transfer device according to the section. The base moves in a second direction orthogonal to the first direction,
The detection unit includes the third position of the first grip portion in the second direction, the fourth position of the second grip portion in the second direction, and the second position of the third grip portion. The electronic component transfer device according to claim 7, wherein the seventh position in the direction of the above and the eighth position of the fourth grip portion in the second direction are detected. A fifth grip portion provided on the base portion and arranged in the second direction with respect to the first grip portion, and a fifth grip portion.
A sixth grip portion provided on the base portion and arranged in the second direction with respect to the second grip portion, and a sixth grip portion.
A seventh grip portion provided on the base portion and arranged in the second direction with respect to the third grip portion, and a seventh grip portion.
It has an eighth grip portion provided on the base portion and arranged in the second direction with respect to the fourth grip portion.
The detection unit includes a ninth position of the fifth grip portion in the first direction, a tenth position in the second direction, an eleventh position of the sixth grip portion in the first direction, and the first position. The twelfth position in the second direction, the thirteenth position of the seventh grip portion in the first direction, the fourteenth position in the second direction, and the fifteenth position of the eighth grip portion in the first direction. The electronic component transfer device according to claim 8, wherein the position and the 16th position in the second direction are detected. A base that moves in the first direction,
A first grip portion provided on the base portion for gripping an electronic component, and a first grip portion.
A second grip portion provided on the base portion, which moves in the first direction with respect to the first grip portion and grips an electronic component, and a second grip portion.
A detection unit that detects a first position of the first grip portion in the first direction and a second position of the second grip portion in the first direction.
An inspection unit that inspects an electronic component gripped by the first grip portion and an electronic component gripped by the second grip portion.
It has a tray having a plurality of recesses on which the electronic components are arranged, and
The base moves in a second direction orthogonal to the first direction,
The detection unit detects the third position of the first grip portion in the second direction and the fourth position of the second grip portion in the second direction.
The first grip portion and the second grip portion move in the first direction with respect to the base portion and in a third direction orthogonal to the second direction.
The distance between the first position of the first grip portion detected by the detection unit in the first direction and the second position of the second grip portion in the first direction, and the plurality of recesses. When the difference from the pitch in the first direction is equal to or greater than a predetermined value , the first grip portion and the second grip portion are individually moved in the third direction. Parts inspection equipment.

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