JP6906132B2 - Component mounting method and component mounting device - Google Patents

Description

The present invention relates to a component mounting method and a component mounting device for mounting a component on a substrate positioned at a working position.

A component mounting device for mounting components such as electronic components on a board positioned at a working position is provided with a board transport path consisting of a pair of transport belts, and the board transport path supports both ends of the board from below. Transport and positioning. Positioning of the substrate by such a substrate transport path detects a state in which the end portion of the substrate to be transported in the direction along the substrate transport path reaches the inspection light projected in the direction orthogonal to the transfer direction of the substrate. At that time, the transfer operation of the substrate by the substrate transfer path is stopped (for example, Patent Document 1).

In the component mounting device described in Patent Document 1, when a substrate on which a component provided so as to protrude outward from the edge of the board is conveyed, such as a connector component, the end of the protruding portion of the component becomes inspection light. When the reached state is detected, the substrate transfer path is operated so that the substrate further moves by the amount of protrusion of the protruding portion in the direction in which the protruding portion protrudes, and then the positioning is performed to stop the transfer operation of the substrate.

Japanese Unexamined Patent Publication No. 2011-911287

However, in the prior art including Patent Document 1, the substrate transported when positioning the substrate having the protruding portion cannot follow the movement of the transport belt, and an error occurs in the positions of the substrate and the transport belt, such as "slip". Is not taken into consideration, and there is a problem that the positioned substrate may be displaced from the regular working position and the mounting quality of the parts may be deteriorated. Further, the slip amount may be different for each device or may change with the passage of time, and even in such a case, there is a problem of preventing the displacement of the substrate and maintaining the mounting quality of the parts.

Therefore, an object of the present invention is to provide a component mounting method and a component mounting device capable of accurately positioning a substrate having a protruding portion at a working position.

Component mounting method of the present invention includes a substrate transfer step of feeding transportable substrate by the substrate transport path, the ends of the direction of the substrate along the substrate transport path of the substrate conveyed by the substrate conveying path, or is attached to the substrate The end detection step of detecting the end of the protruding portion protruding outward from the end of the board of the component, the protruding amount which is the distance from the end of the board to the end of the protruding portion, and the above. In the feed amount calculation step of adding the feed correction amount corresponding to the protrusion amount to calculate the feed amount for further transporting the substrate from the end of the protrusion, and the end detection step, the end of the substrate is When it is detected, the operation of the board transport path is stopped as it is, and when the end of the protruding portion of the component mounted on the board is detected, the board moves in the direction in which the protruding portion protrudes by the feed amount. It is characterized by including a substrate positioning step of operating and then stopping the substrate transport path.

Component mounting apparatus of the present invention includes a substrate transport path for feeding transportable substrate, the ends of the direction of the substrate along the substrate transport path of the substrate transported by the substrate transport path or said loaded components on a substrate Corresponds to the amount of protrusion, which is the distance from the end of the board to the end of the protrusion, and the amount of protrusion, which detects the end of the protrusion that protrudes outward from the end of the board. A feed amount calculation unit that calculates a feed amount for further transporting the substrate from the end of the protrusion by adding the stored feed correction amount and the stored protrusion amount and the feed correction amount. When the end portion of the substrate is detected, the operation of the substrate transport path is stopped as it is, and when the end portion of the protruding portion of the component mounted on the substrate is detected, the feed is stopped. It is characterized by including a substrate positioning control unit that operates and then stops the substrate transport path so that the substrate moves in the direction in which the protruding portion protrudes by an amount.

According to the present invention, even a substrate having a protruding portion can be accurately positioned at a working position.

Top view of the component mounting device according to the embodiment of the present invention Configuration explanatory view of the component mounting apparatus according to the embodiment of the present invention Configuration explanatory view of the board transport path provided in the component mounting apparatus according to the embodiment of the present invention (A) (b) The figure which shows the example of the substrate which has the protruding part on which the component is mounted by the component mounting apparatus of one Embodiment of this invention. The figure which shows the example of the image of the substrate mark imaged by the substrate recognition camera provided in the component mounting apparatus of one Embodiment of this invention. A block diagram showing a configuration of a control system of a component mounting device according to an embodiment of the present invention. The figure which shows the example of the relationship between the protrusion amount and the feed correction amount of the substrate which has the protrusion part carried by the board transfer path provided in the component mounting apparatus of one Embodiment of this invention. The flow chart which shows the manufacturing method of the mounting board by the component mounting apparatus of one Embodiment of this invention. (A) (b) Explanatory drawing of a substrate positioning process for a substrate having no protruding portion by the component mounting apparatus according to the embodiment of the present invention. (A) (b) (c) Explanatory drawing of a substrate positioning process for a substrate having a protruding portion by the component mounting apparatus according to the embodiment of the present invention.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, and the like described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device. In the following, the corresponding elements will be designated by the same reference numerals in all the drawings, and duplicate description will be omitted. In FIG. 1 and a part described later, the two axial directions orthogonal to each other in the horizontal plane are the X direction of the substrate transport direction (horizontal direction in FIG. 1) and the Y direction orthogonal to the substrate transport direction (vertical direction in FIG. 1). Is shown. In FIG. 2 and a part described later, the Z direction (vertical direction in FIG. 2) is shown as a height direction orthogonal to the horizontal plane. The Z direction is the vertical direction when the component mounting device is installed on a horizontal plane.

First, the overall configuration of the component mounting device 1 will be described with reference to FIGS. 1 and 2. In FIG. 1, a substrate transport path 3 is arranged in the X direction on the upper surface of the base 2. The board transport path 3 transports the board B delivered from the upstream device, and positions and holds the board B at a working position by the component mounting mechanism described below. Parts supply units 4 are arranged on both sides of the board transport path 3. A plurality of tape feeders 5 are mounted side by side on the component supply unit 4. The tape feeder 5 pitch-feeds the carrier tape holding the component to position the component at a supply position to the transfer head 8 constituting the component mounting mechanism.

A Y-axis beam 6 is horizontally arranged along the Y direction at one end of the upper surface of the base 2 in the X direction. A pair of X-axis beams 7 are slidably mounted on the Y-axis beam 6 in the Y direction. The X-axis beam 7 is driven in the Y direction by the linear drive mechanism provided in the Y-axis beam 6. A transfer head 8 is mounted on each X-axis beam 7 so as to be slidable in the X direction. The transfer head 8 includes a plurality of nozzle units 9, and is driven in the X direction by a linear drive mechanism provided by the X-axis beam 7.

By driving the Y-axis beam 6, the X-axis beam 7, and the transfer head 8, the transfer head 8 is a tape arranged in the component supply unit 4 by a suction nozzle 9a (see FIG. 2) provided in the nozzle unit 9. The component D (see FIG. 2) is vacuum-sucked out from the feeder 5 and moved above the substrate B to mount the component D at the mounting position of the substrate B. In the above configuration, the Y-axis beam 6 and the X-axis beam 7 form a head moving mechanism 10 that moves the transfer head 8 in the horizontal direction (X direction, Y direction). Further, the Y-axis beam 6, the X-axis beam 7, and the transfer head 8 form a component mounting mechanism.

In FIG. 1, a component recognition camera 11 is arranged between a substrate transport path 3 and each component supply unit 4 in the base 2. The transfer head 8 from which the component D is taken out from the component supply unit 4 moves above the component recognition camera 11, so that the component recognition camera 11 is held by the suction nozzle 9a mounted on the transfer head 8. Image D.

A substrate recognition camera 12 located on the lower surface side of the X-axis beam 7 and moving integrally with the transfer head 8 is arranged on the coupling plate 8a to which the transfer head 8 is attached in a posture in which the imaging direction is downward. It is installed. The board recognition camera 12 moves the transfer head 8 above the board B positioned at the working position of the board transfer path 3 to take an image of the board mark M or the like formed at a diagonal position on the board B. .. That is, the substrate recognition camera 12 is a camera that captures the substrate mark M formed on the substrate B positioned at the working position.

By recognizing the imaging data acquired by the component recognition camera 11 and the substrate recognition camera 12, the transfer head 8 is held in the suction nozzle 9a and the component D is displaced and is held in the substrate transport path 3. It is possible to detect the misalignment of the substrate B. In the component mounting operation by the component mounting mechanism, the position of the transfer head 8 is corrected in consideration of these misalignments.

Next, the configuration of the substrate transport path 3 will be described with reference to FIGS. 2 and 3. The substrate transport path 3 includes a pair of transport belts 15 driven by a transport motor 14 inside a pair of plate-shaped members 13 extending in the X direction. By driving the transport motor 14, the substrate transport path 3 supports the substrate B from below with a pair of transport belts 15 and transports the substrate B in the X direction.

The pair of plate-shaped members 13 has the width direction (Y direction) of the pair of transport belts 15 in the horizontal plane direction (Y direction) orthogonal to the transport direction (X direction) of the substrate B transported by the pair of transport belts 15. The floodlight 16 and the receiver 17 are attached so as to include both ends of). The floodlight 16 projects the inspection light L, and the receiver 17 receives the inspection light L projected by the floodlight 16. In the floodlight 16 and the receiver 17, at least a part of the projected inspection light L is shielded from light by a region including the end portion Bt of the substrate, which is the head portion in the transport direction of the substrate B transported by the pair of transport belts 15. It is set to the position.

In FIG. 2, the floodlight 16 and the receiver 17 are connected to the control device 21 included in the component mounting device 1, and are controlled by the end detection processing unit 21b, which is an internal processing unit included in the control device 21. More specifically, the end detection processing unit 21b controls the floodlight 16 to project the inspection light L and receive the light receiving signal of the light receiver 17. Then, the end detection processing unit 21b detects that the end Bt of the substrate has reached the inspection light L based on the change in the amount of light received by the light receiver 17. In this way, the floodlight 16, the receiver 17, and the end detection processing unit 21b detect the end Bt of the substrate in the direction (X direction) of the substrate B conveyed by the substrate transfer path 3. The end detection unit is configured.

The end detection unit may be configured to detect the end Bt of the substrate by a floodlight 16 and a light receiver 17 arranged in the vertical direction (Z direction). That is, the end detection unit detects the edge Bt of the substrate by projecting the inspection light L in the direction (including the Y direction and the Z direction) orthogonal to the transport direction (X direction) of the substrate B by the substrate transport path 3. (See FIG. 9B). Further, the end detection unit includes a floodlight 16 and a receiver that receives the reflected light reflected by the inspection light L projected by the floodlight 16 at the edge Bt of the substrate, and the edge Bt of the substrate depends on the presence or absence of the reflected light. May be configured to detect.

Here, with reference to FIG. 4, a board B having a protruding portion, in which a protruding component S such as a connector component protrudes outward from the end Bt of the board and is mounted (hereinafter, referred to as “protruding board Ba”). Will be described. In the component mounting device 1, the protruding board Ba is also a target for mounting the component D. In FIGS. 4A and 4B, a protruding component S is mounted on the protruding substrate Ba so as to cover a part of the end portion Bt of the substrate in the X direction from above.

When this protruding substrate Ba is conveyed by the substrate transport path 3, the end portion St of the protruding portion, which is the leading portion protruding outward from the end portion Bt of the substrate of the protruding component S mounted on the protruding substrate Ba, becomes an end portion. It is detected by the detection unit (see FIG. 10B). That is, the end detection unit projects the inspection light L in the direction orthogonal to the transport direction (X direction) of the substrate B by the substrate transport path 3 to detect the end Bt of the substrate or the end St of the protruding portion. do. The end portion St of the protruding portion detected by the end portion detecting portion on the protruding substrate Ba depends on the number, position, shape, and the like of the protruding component S mounted on the substrate B. Therefore, when there are a plurality of end Sts of the protruding portion or when the shape of the protruding part S is complicated, the end St of the outermost protruding portion is not always detected, and the end of the inner protruding portion thereof is not always detected. Part St may be detected.

Next, with reference to FIG. 5, the position of the substrate B calculated based on the captured image captured by the substrate recognition camera 12 of the substrate mark M of the substrate B conveyed by the substrate transport path 3 and positioned at the working position. The deviation amount β will be described. When the board B is positioned at the working position (see FIGS. 9B and 10C), the mounting control unit 21a (see FIG. 6) included in the control device 21 controls the head moving mechanism 10 to control the board. The transfer head 8 is moved in the horizontal direction so that the image pickup center of the substrate recognition camera 12 is positioned at the regular position Mc * of the mark. The regular position Mc * of the board mark is the position Mc at the center of the board mark M on the board B (positional deviation amount β is zero) positioned at the regular working position.

In the captured image 12a of the substrate mark M by the substrate recognition camera 12 shown in FIG. 5, the center line 12x in the X direction and the center line 12y in the Y direction are superimposed and displayed. The intersection of the center line 12x in the X direction and the center line 12y in the Y direction is the image pickup center 12c of the board recognition camera 12, and is the regular position Mc * of the board mark. In this example, the substrate B positioned at the working position is displaced in the X direction, and the position Mc at the center of the imaged substrate mark M is separated (shifted) from the regular position Mc * of the substrate mark. Is the amount of misalignment β. For convenience, the amount of misalignment β in the Y direction is set to zero.

The misalignment amount calculation unit 21c (see FIG. 6) included in the control device 21 is a regular board mark of the board B positioned at the working position based on the captured image 12a captured by the board recognition camera 12 (camera). The amount of misalignment β from the position Mc * is calculated. When a plurality of (two in this case) substrate marks M are formed on the substrate B, the misalignment amount calculation unit 21c calculates the misalignment amount β of each substrate mark M, and the misalignment amount β is calculated. β may be calculated (for example, the average value is calculated) to obtain the misalignment amount β.

Next, the configuration of the control system of the component mounting device 1 will be described with reference to FIG. The component mounting device 1 includes a control device 21, a storage unit 22, a board transport path 3, a component supply unit 4, a transfer head 8, a head moving mechanism 10, a component recognition camera 11, a board recognition camera 12, a floodlight 16, and a receiver 17. , The input unit 23, and the display unit 24 are provided.

The control device 21 is an arithmetic processing device having a CPU function, and includes a mounting control unit 21a, an end detection processing unit 21b, a misalignment amount calculation unit 21c, a feed amount calculation unit 21d, and a board positioning control unit 21e as internal processing functions. ing. The storage unit 22 is a storage device, and stores mounting data 22a, feed correction amount data 22b, misalignment amount data 22c, feed amount data 22d, and the like. The mounting data 22a includes the material, size, and weight of the board B on which the component D is mounted, the mounting position of the component D on the board B, the type (part name) of the component D to be mounted, the shape, and the mounting of the protruding component S. Information such as position, type, shape, and protrusion amount α is included.

The mounting control unit 21a controls the component supply unit 4, the transfer head 8, and the head moving mechanism 10 based on the misalignment amount β included in the mounting data 22a and the misalignment amount data 22c, and is positioned at the working position. The mounting of the component D by the suction nozzle 9a on the substrate B is controlled. In the feed correction amount data 22b, when the protruding substrate Ba is transported to the working position by the substrate transport path 3, the end detection unit detects the end St of the protruding portion and then transports the protruding substrate Ba to the working position. The feed correction amount γ that corrects the feed amount δ that drives the transport belt 15 is stored.

Here, the feed correction amount γ will be described with reference to FIG. 7. The substrate B transported to the substrate transport path 3 has the amount of driving the transport belt 15 (the transport belt 15 is) due to the vibration generated by the driven transport belt 15 and the deterioration of the transport belt 15 over time. “Slip” may occur in which the amount of travel (distance traveled) and the amount of actual movement of the substrate (distance traveled) do not match. The feed correction amount γ is a correction amount required to move the protruding substrate Ba by the protruding amount α after the end St of the protruding portion of the protruding substrate Ba is detected by the end detecting portion. That is, for the feed amount δ, the feed correction amount γ is added to the protrusion amount α (feed amount δ = protrusion amount α + feed correction amount γ).

FIG. 7 shows an example in which the relationship between the protrusion amount α and the feed correction amount γ is represented by an XY graph. The feed correction amount γ depends on the material, size, weight, etc. of the protruding substrate Ba, as well as the moving distance (protruding amount α). The feed correction amount γ is obtained by varying various conditions in advance in an experiment or the like, and is stored in the feed correction amount data 22b. The feed correction amount γ may be measured by the protruding board Ba when the mounting board to be produced is changed, and may be stored in the feed correction amount data 22b. As described above, the storage unit 22 has a protrusion amount α (mounting data 22a) which is a distance from the end portion Bt of the substrate to the end portion St of the protrusion portion, and a feed correction amount γ (feed correction amount) corresponding to the protrusion amount α. Data 22b) is stored.

In FIG. 6, the misalignment amount data 22c includes the misalignment amount β of the substrate B (or the protruding substrate Ba) positioned at the work position calculated by the misalignment amount calculation unit 21c from the regular work position. It is stored in association with the calculated information that identifies the substrate B. The feed amount calculation unit 21d is based on the protrusion amount α included in the stored mounting data 22a and the feed correction amount γ included in the feed correction amount data 22b, and the feed amount calculation unit 21d protrudes from the end portion St of the protrusion portion St. The feed amount δ of the transport belt 15 for moving the protrusion amount α is calculated.

The slipperiness of the protruding substrate Ba to be transported changes depending on the variation of each part included in the component mounting device 1 and the wear of the transport belt 15. Therefore, the feed correction amount γ, which is set in advance, cannot be sufficiently corrected, and the stop position of the substrate B may be displaced. Therefore, the feed amount calculation unit 21d feeds based on the protrusion amount α, the feed correction amount γ, and the position shift amount β of the protrusion substrate Ba (board B) positioned before being stored in the misalignment amount data 22c. Calculate the amount δ (feed amount δ = protrusion amount α + feed correction amount γ + displacement amount β of the previous substrate). The calculated feed amount δ is stored in the storage unit 22 as the feed amount data 22d.

The "positional deviation β of the previous substrate" used in the calculation of the feed amount δ is not limited to the positional deviation β of the immediately preceding substrate B. For example, the average value of eight boards obtained by removing the maximum value and the minimum value from the position shift amount β of the latest ten boards B may be defined as the “position shift amount β of the previous board”. As a result, the influence of sudden misalignment can be excluded.

In FIG. 6, the substrate positioning control unit 21e controls the transfer motor 14 of the substrate transfer path 3 based on the feed amount δ included in the feed amount data 22d to stop the substrate B or the protruding substrate Ba at the working position. Execute board positioning. More specifically, in the case of the board B on which the protruding component S is not mounted, the board positioning control unit 21e operates the board transport path 3 as it is when the end Bt of the board is detected by the end detection unit. Stop (see FIG. 9B).

Further, in the case of the protruding substrate Ba, the substrate positioning control unit 21e detects the end portion St of the protruding portion of the protruding component S mounted on the substrate B (see FIG. 10B) by the amount of feed δ. The substrate transport path 3 is operated and then stopped so that the substrate B moves in the direction in which the protruding portion protrudes (X direction) (see FIG. 10C). Whether or not the protruding component S is mounted on the board B (that is, whether it is the board B or the protruding board Ba) is determined based on the mounting data 22a.

In FIG. 6, the input unit 23 is an input device such as a keyboard, a touch panel, and a mouse, and is used when inputting an operation command or data. The display unit 24 is a display device such as a liquid crystal panel, and displays various information such as an operation screen for operation by the input unit 23, as well as an image captured by the substrate mark M captured by the substrate recognition camera 12 (camera). do.

Next, a method of manufacturing a mounting board (component mounting method) by the component mounting device 1 will be described with reference to FIGS. 9 and 10 along the flow of FIG. First, the board positioning control unit 21e controls the transfer motor 14 to support the board B (or the protruding board Ba) carried into the component mounting device 1 from below by the transfer belt 15 of the board transfer path 3 (FIG. FIG. 9 (a) arrow a and FIG. 10 (a) arrow b) (ST1: substrate transfer step). Next, the end detection unit is the end Bt of the substrate in the direction (X direction) of the substrate B transported by the substrate transport path 3, or the substrate of the protruding component S mounted on the substrate B. The end St of the protruding portion protruding outward from the end Bt is detected (ST2: end detection step) (see FIGS. 9 (b) and 10 (b)).

Next, when the end detection unit detects the end St of the protruding portion (Yes in ST3), the feed amount calculation unit 21d is the distance from the end Bt of the substrate to the end St of the protruding portion. Based on the amount α and the feed correction amount γ corresponding to the protrusion amount α, the feed amount δ for further transporting the substrate B from the end St of the protrusion portion is calculated (ST4: feed amount calculation step).

When the misalignment amount β of the substrate B previously positioned is stored in the misalignment amount data 22c, the feed amount calculation unit 21d may perform the feed amount calculation unit 21d in the feed amount calculation step (ST4). , The feed amount δ is calculated based on the protrusion amount α, the feed correction amount γ, and the misalignment amount β of the previously positioned substrate B (arrow d). Thereby, it is possible to correct the fluctuation of the stop position of the substrate B due to the wear of the transport belt 15 and the variation of the component mounting device 1.

The feed amount calculation unit 21d is used to calculate the feed amount δ, and the “positional deviation amount β of the previously positioned substrate B” is limited to the displacement amount β of one substrate B positioned immediately before. There is nothing. For example, the average value of eight boards obtained by removing the maximum value and the minimum value from the position shift amount β of the latest ten boards B may be defined as the “positional shift amount β of the previously positioned board B”. As a result, the influence of sudden misalignment can be excluded.

Further, the feed amount calculation unit 21d does not calculate the feed amount δ when the end detection unit detects the end Bt of the substrate (No in ST3). Next, when the end portion Bt of the substrate is detected (No in ST3) in the end portion detection step (ST2), the substrate positioning control unit 21e stops the operation of the substrate transport path 3 as it is and positions the substrate B. .. Further, when the end portion St of the protruding portion of the protruding component S mounted on the substrate B is detected (Yes in ST3), the substrate positioning control unit 21e protrudes by the feed amount δ. The substrate transport path 3 is operated and stopped so that the substrate B moves in the direction in which the portion protrudes (X direction), and the substrate B is positioned (ST5: substrate positioning step).

FIG. 9 shows a process in which the substrate B having no protruding portion is positioned at the working position. In FIG. 9A, the substrate B transported (arrow a) in the substrate transport step (ST1) has an end Bt of the substrate detected in the end detection step (ST2) (floodlight 16, receiver). It is detected by 17) (Fig. 9 (b)). Therefore, in the substrate positioning step (ST5), the substrate B is stopped as it is. As a result, the substrate B is positioned at the working position.

FIG. 10 shows a process in which the protruding substrate Ba is positioned at the working position. In FIG. 10A, the protruding substrate Ba transported (arrow b) in the substrate transporting step (ST1) has an end portion St of the protruding portion of the protruding substrate Ba in the end detection step (ST2). (Reflector 16 and receiver 17) are detected (FIG. 10 (b)). Therefore, in the substrate positioning step (ST5), the protruding substrate Ba moves (arrow c) by the feed amount δ and stops (FIG. 10 (c)). As a result, the protruding substrate Ba is positioned at the working position.

In FIG. 8, the substrate mark M formed on the substrate B (or the protruding substrate Ba) positioned at the working position is then imaged by the substrate recognition camera 12 (camera) (ST6: substrate mark imaging step). Next, the misalignment amount calculation unit 21c calculates the misalignment amount β from the regular position Mc * of the substrate mark based on the captured image (ST7: misalignment amount calculation step). The calculated misalignment amount β is stored in the misalignment amount data 22c. Next, the mounting control unit 21a mounts the component D on the substrate B (or the protruding substrate Ba) based on the misalignment amount β calculated in the misalignment amount calculation step (ST7) (ST8: component mounting). Process).

In the component mounting process (ST8), when the component mounting of all the planned component Ds on the board B (or the protruding board Ba) is completed, the board B (mounting board) on which the component D is mounted is carried out and the board is carried out. In the transfer step (ST1), the transfer of the substrate B (or the protruding substrate Ba) to be mounted on the component is started next.

As described above, in the component mounting device 1 of the present embodiment, the substrate transport path 3 for transporting the substrate B and the end portion Bt of the substrate or the end portion St of the protruding portion of the protruding substrate Ba are detected. The detection unit, the storage unit 22 that stores the feed correction amount γ corresponding to the protrusion amount α and the protrusion amount α, and the feed amount calculation unit 21d that calculates the feed amount δ based on the protrusion amount α and the feed correction amount γ. When the end Bt of the substrate is detected by the end detection unit, the operation of the substrate transport path 3 is stopped as it is, and when the end St of the protruding portion is detected, the substrate B is transported so as to move by the feed amount δ. A board positioning control unit 21e for operating and then stopping the path 3 is provided. As a result, even the substrate B having the protruding portion (protruding substrate Ba) can be accurately positioned at the working position.

The component mounting method and the component mounting device of the present invention have an effect that even a board having a protruding portion can be accurately positioned at a working position, and are useful in the field of component mounting in which components are mounted on the board. ..

1 Parts mounting device 3 Board transport path 12 Board recognition camera (camera)
16 Floodlight (end detector)
17 Receiver (end detector)
B Board Bt Board edge D component L Inspection light M Board mark Mc * Regular position of board mark St Overhanging part end α Overhang amount β Position deviation amount γ Feed correction amount δ Feed amount

Claims (5)

A substrate transfer step of feeding transportable substrate by the substrate transport path,
Detects the end of the substrate in the direction along the substrate transport path of the substrate transported by the substrate transport path, or the end of the protruding portion of the component mounted on the board that protrudes outward from the edge of the board. End detection process and
The amount of protrusion, which is the distance from the end of the substrate to the end of the protrusion, and the amount of feed correction corresponding to the amount of protrusion are added, and the amount of feed for further transporting the substrate from the end of the protrusion. The feed amount calculation process to calculate
In the end detection step, when the end of the substrate is detected, the operation of the substrate transport path is stopped as it is, and when the end of the protruding portion of the component mounted on the substrate is detected, only the feed amount is reached. A component mounting method comprising a substrate positioning step of operating and then stopping a substrate transport path so that the substrate moves in a direction in which the protruding portion protrudes. A substrate mark imaging step of imaging a substrate mark formed on the positioned substrate by a camera,
Further including a position deviation amount calculation step of calculating the position deviation amount from the regular position of the substrate mark based on the captured image.
The first aspect of the invention, wherein in the feed amount calculation step, the feed amount is calculated based on the protrusion amount, the feed correction amount, and the misalignment amount of the previously positioned substrate. Parts mounting method. A substrate transfer path for feeding transportable substrate,
Detects the end of the substrate in the direction along the substrate transport path of the substrate transported by the substrate transport path, or the end of the protruding portion of the component mounted on the board that protrudes outward from the edge of the board. End detector and
A storage unit that stores the amount of protrusion, which is the distance from the end of the substrate to the end of the protrusion, and the feed correction amount corresponding to the protrusion.
A feed amount calculation unit that adds the stored protrusion amount and the feed correction amount to calculate a feed amount for further transporting the substrate from the end of the protrusion portion.
When the end portion of the substrate is detected, the operation of the substrate transport path is stopped as it is, and when the end portion of the protruding portion of the component mounted on the substrate is detected, only the feed amount is reached. A component mounting device including a board positioning control unit that operates and then stops a board transport path so that the board moves in a direction in which the protruding portion protrudes. A camera that captures the substrate mark formed on the positioned substrate, and
Further, a position deviation amount calculation unit for calculating the position deviation amount from the regular position of the substrate mark based on the image captured by the camera is provided.
The third aspect of the present invention, wherein the feed amount calculation unit calculates the feed amount based on the protrusion amount, the feed correction amount, and the misalignment amount of the previously positioned substrate. Component mounting device. The end portion detecting unit is characterized in that it projects inspection light in a direction orthogonal to the transport direction of the substrate by the substrate transport path to detect the end portion of the substrate or the end portion of the protruding portion. Item 3. The component mounting device according to Item 3.

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