JP6907592B2 - Cooling system and electronic equipment system - Google Patents

Description

The invention disclosed herein relates to a cooling device and an electronic device system.

Conventionally, various cooling devices and cooling units for cooling electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2). It has also been proposed to circulate a coolant on heat-generating components such as a CPU (Central Processing Unit) in order to individually cool electronic devices arranged in layers, such as a rack-mounted server (for example). For example, see Patent Document 3). In this way, if the cooling liquid is circulated to cool the electronic devices, the air-cooling fan for cooling cannot be attached to the individual electronic devices arranged in layers, or the electronic devices arranged in layers. It is possible to cope with the increase in the number of units.

Japanese Unexamined Patent Publication No. 2014-183107 Japanese Unexamined Patent Publication No. 2013-26526 Japanese Patent Application Laid-Open No. 2008-509542

By the way, in order to cool each of a plurality of electronic devices arranged in layers, a cooling liquid is distributed from a water supply pipe to a cooling unit provided in each electronic device. However, the coolant may contain dissolved air, and if the cooling device is continuously operated, the dissolved air may become a gas and accumulate in the water supply pipe. When the cooling liquid containing the gaseous air flows into each cooling unit, the cooling efficiency in each cooling unit decreases. Since the gaseous air is stored in the upper part of the water supply pipe, it is considered that when the electronic devices are arranged in layers in the vertical direction, the cooling efficiency is lowered as the electronic devices in the upper stage are arranged. Further, even when the electronic devices are arranged in layers in the left-right direction, there is a possibility that a cooling liquid containing gaseous air may flow into the cooling unit.

On one aspect, the cooling device and electronic device system disclosed herein is an object of suppressing the supply of a coolant containing gaseous air to each cooling section.

The cooling device disclosed in the present specification includes a cooling unit provided in each of a plurality of electronic devices arranged in a layer, and a plurality of branch pipes connected to the cooling unit, and a cooling liquid is supplied to the cooling unit. A water supply pipe to be supplied, a drain pipe having a plurality of branch pipes connected to the cooling unit, and draining the coolant that has passed through the cooling unit, a water supply port of the water supply pipe, and a drain port of the drain pipe. A pump that discharges at least the coolant, a circulation pipe in which a coolant cooling unit that cools the coolant is arranged, and at least the upper end of the water supply pipe are connected to connect the plurality of cooling units. A bypass path that bypasses and is connected to the drain pipe is provided, and the plurality of cooling units are arranged in parallel in a layered manner in the vertical direction, and the water supply pipe and the drain pipe are respectively arranged in the vertical direction. The water supply pipe extends along the lower end and has a start pipe that is a start point of the bypass path, and the drain pipe has a terminal pipe that branches at the lower end and is the end point of the bypass path. The bypass path connects the start pipe and the end pipe via a connection position with the upper end of the water supply pipe.

The electronic device system disclosed in the present specification is an electronic device system including a plurality of electronic devices arranged in layers and a cooling device for cooling a cooling target portion of the electronic device, and the cooling device is the electronic device. A water supply pipe provided with each of the cooling units and a plurality of branch pipes connected to the cooling unit to supply the cooling liquid to the cooling unit, and a plurality of branch pipes connected to the cooling unit, respectively. A drain pipe for discharging the coolant that has passed through the cooling unit, a pump that connects the water supply port of the water supply pipe and the drain port of the drain pipe, and at least discharges the coolant, and the coolant. A plurality of circulation pipes in which a coolant cooling unit for cooling the water supply pipe is arranged, and a bypass path connected to at least the upper end portion of the water supply pipe and bypassing the cooling unit and connected to the drain pipe. The cooling unit is arranged in parallel in a layered manner in the vertical direction, the water supply pipe and the drainage pipe extend in the vertical direction, respectively, and the water supply pipe branches at the lower end portion to form the bypass path. The drain pipe is branched at the lower end, and the end pipe is provided as the end point of the bypass path, and the bypass path passes through a connection position with the upper end of the water supply pipe. To connect the start pipe and the end pipe.

According to the cooling device and the electronic device system disclosed in the present specification, it is possible to suppress the supply of the cooling liquid containing the gasified air to each cooling unit.

FIG. 1 is a description schematically showing a schematic configuration of an electronic device system including the cooling device of the first embodiment. FIG. 2 is an explanatory diagram schematically showing a server blade as an example of an electronic device. FIG. 3 (A) is an explanatory view showing an example in which the height position of the start pipe in the water supply pipe and the height position of the lowermost branch pipe are matched, and FIG. 3 (B) is an explanatory view of the start pipe in the water supply pipe. It is explanatory drawing which shows the example which made the height position lower than the height position of the lowermost branch pipe. FIG. 4A is an explanatory view showing an example in which the height position of the terminal pipe in the drainage pipe and the height position of the lowermost branch pipe are matched, and FIG. 4B is an explanatory view of the terminal pipe in the drainage pipe. It is explanatory drawing which shows the example which made the height position lower than the height position of the lowermost branch pipe. FIG. 5A is an explanatory view showing a first connecting member, and FIG. 5B is an explanatory view showing a modified example of the first connecting member. FIG. 6 is an explanatory view showing the flow path cross-sectional area of the bypass path and the flow path cross-sectional area in the branch pipe. FIG. 7 is an explanatory diagram showing a schematic configuration of the cooling device of the second embodiment. FIG. 8 (A) is an explanatory view showing a modified example of the positional relationship between the start pipe and the end pipe in the drain pipe of the second embodiment, and FIG. 8 (B) is the start pipe and the end of the drain pipe of the second embodiment. It is explanatory drawing which shows the modification of the branching angle of a pipe. FIG. 9 is an explanatory diagram showing a schematic configuration of the cooling device of the third embodiment. FIG. 10 is an explanatory diagram showing a schematic configuration of the cooling device of the fourth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the dimensions, ratios, etc. of each part may not be shown so as to completely match the actual ones. In addition, depending on the drawing, for convenience of explanation, components that actually exist may be omitted, or the dimensions may be exaggerated than they actually are.

(First Embodiment)
First, the electronic device system 1 provided with the cooling device 10 of the first embodiment will be described with reference to FIGS. 1 to 6. FIG. 1 is a description schematically showing a schematic configuration of an electronic device system including the cooling device of the first embodiment. FIG. 2 is an explanatory diagram schematically showing a server blade as an example of an electronic device. FIG. 3 (A) is an explanatory view showing an example in which the height position of the start pipe in the water supply pipe and the height position of the lowermost branch pipe are matched, and FIG. 3 (B) is an explanatory view of the start pipe in the water supply pipe. It is explanatory drawing which shows the example which made the height position lower than the height position of the lowermost branch pipe. FIG. 4A is an explanatory view showing an example in which the height position of the terminal pipe in the drainage pipe and the height position of the lowermost branch pipe are matched, and FIG. 4B is an explanatory view of the terminal pipe in the drainage pipe. It is explanatory drawing which shows the example which made the height position lower than the height position of the lowermost branch pipe. FIG. 5A is an explanatory view showing a first connecting member, and FIG. 5B is an explanatory view showing a modified example of the first connecting member. FIG. 6 is an explanatory view showing the flow path cross-sectional area of the bypass path and the flow path cross-sectional area in the branch pipe. In the following description, the direction indicated by the arrow in FIG. 1 and the like is the vertical direction.

Referring to FIG. 1, the electronic device system 1 of the present embodiment is a server system adopting a rack mount method. The electronic device system 1 includes a plurality of server blades 11a to 11e arranged in layers. The server blades 11a to 11e are examples of electronic devices. The server system is an example of an electronic device system. In the present embodiment, five server blades are provided, but the number of server blades is not limited to this.

Referring to FIG. 2, each of the server blades 11a to 11e includes a semiconductor package 13 mounted on the substrate 12. The semiconductor package 13 is a cooling target portion in the present embodiment. A cooling plate 14 serving as a cooling unit is mounted on each semiconductor package 13. The server blades 11a to 11e are arranged and installed in a rack in a layered manner in the vertical direction. Specifically, the server blade 11a is located at the bottom and the server blade 11e is located at the top. Therefore, the cooling plates 14 mounted on the server blades 11a to 11e are also arranged in layers in the vertical direction. Each cooling plate 14 is included in the cooling device 10. Each cooling plate 14 has a path through which the coolant can flow, and the coolant removes heat from the semiconductor package 13 to cool the semiconductor package 13. The cooling plate 14 of the present embodiment is made of copper having excellent thermal conductivity from the semiconductor package 13 to the coolant. The cooling plate 14 may be formed by using a material other than copper, for example, a material such as a copper alloy, aluminum, or an aluminum alloy. Further, the cooling plate 14 may be formed by using an inorganic material such as diamond, carbon composite (carbon composite material), or aluminum nitride. Although water is used as the cooling liquid in the present embodiment, an aqueous solution containing water as a main component may be used. The coolant is not limited to these, and other conventionally known coolants, for example, propylene glycol antifreeze may be used.

Referring to FIG. 1 again, the electronic device system 1 incorporates the cooling device 10. The cooling device 10 includes a cooling plate 14 mounted on each server blade 11a to 11e, a water supply pipe 20 for supplying a cooling liquid to each cooling plate 14, and a drain pipe for discharging the cooling liquid passing through each cooling plate 14. 30 is provided. A water supply path 201 is formed inside the water supply pipe 20. A drainage path 301 is formed inside the drainage pipe 30.

The water supply pipe 20 includes branch pipes 21a to 21e extending in the vertical direction, branching from the water supply path 201, and being connected to the cooling plate 14, respectively. The branch pipes 21a to 21e are arranged in parallel along the longitudinal direction of the water supply pipe 20, that is, the vertical direction. The branch pipes 21a to 21e are provided according to the number of cooling plates 14. The water supply pipe 20 includes a water supply port 20a that opens on the lower surface.

The drainage pipe 30 includes branch pipes 31a to 31e extending in the vertical direction, branching from the drainage path 301, and being connected to the cooling plate 14, respectively. The branch pipes 31a to 31e are arranged in parallel along the longitudinal direction of the drainage pipe 30, that is, the vertical direction. The branch pipes 31a to 31e are provided according to the number of cooling plates 14. The drain pipe 30 includes a drain port 30a that opens on the lower surface.

The cooling device 10 includes a circulation pipe 40 that connects the water supply port 20a of the water supply pipe 20 and the drainage port 30a of the drainage pipe 30. A pump 41 for discharging the cooling liquid and a heat exchanger 42 for storing and cooling the cooling liquid are arranged in the circulation pipe 40. The heat exchanger 42 forms a chiller unit for cooling the cooling water together with the reserve tank. The heat exchanger 42 is arranged on the upstream side of the pump 41. As a result, the coolant cooled by the heat exchanger 42 is discharged by the pump 41. The heat exchanger 42 is a so-called radiator and is an example of a coolant cooling unit. As the coolant cooling unit, various conventionally known means can be adopted as long as the coolant can be cooled. The circulation pipe 40 is led out to the outside of the rack in which the server blades 11a to 11e are installed, and the pump 41 and the heat exchanger 42 are installed outside the rack. The coolant discharged by the pump 41 is introduced from the water supply port 20a into the water supply path 201 in the water supply pipe 20 and distributed to the branch pipes 21a to 21e. Then, the coolant is supplied to each cooling plate 14. The coolant that has taken heat from the semiconductor package 13 in each cooling plate 14 is discharged to the drainage path 301 in the drainage pipe 30. The coolant discharged to the drainage path 301 is sent to the heat exchanger 42 for cooling, and is again sent out to the water supply pipe 20 by the pump 41. In the present embodiment, the water supply pipe 20, the drain pipe 30, and the circulation pipe 40 are manufactured separately, and by connecting them, a part of the coolant circulation loop is formed. It is not necessary to distinguish between. For example, the downstream side of the pump 41 and the water supply pipe 20 may be provided integrally, or the upstream side of the heat exchanger 42 and the drain pipe 30 may be provided integrally. In short, it suffices if a loop is formed in which the coolant discharged by the pump 41 circulates.

The water supply pipe 20 includes a start end pipe 22 that branches at the lower end portion and serves as a start point of the bypass path 50, which will be described in detail later. Further, the drainage pipe 30 includes a terminal pipe 32 that branches at the lower end portion and serves as the end point of the bypass path 50. The coolant discharged by the pump 41 flows into the start pipe 22, passes through the bypass path 50, passes through the end pipe 32, and joins the drain pipe 30. Then, the coolant is sent to the heat exchanger 42.

Here, the height of the installation position of the start end pipe 22 will be described. The start end pipe 22 can be provided below the cooling plate 14 arranged at the bottom of the cooling plates 14 arranged in layers in the vertical direction. In the present embodiment, as shown in FIG. 3A, the highest position H ₂₂ of the inner peripheral wall of the starting pipe 22 and the highest inner peripheral wall of the first branch pipe 21a connected to the lowermost cooling plate 14 The position H _21a is set to the same height. The cooling liquid separated from the water supply path 201 flows into the start end pipe 22. Therefore, strictly speaking, the flow rate in the water supply path 201 decreases on the downstream side of the position where the start end pipe 22 is installed. Therefore, for example, if the position of the start end pipe 22 is set near the middle stage, it is considered that the variation in the flow rate becomes large between the vicinity of the lower stage and the middle stage and thereafter. It is considered that setting the position of the starting pipe 22 does not affect the amount of distribution to the branch pipes 21a to 21e so much as in the present embodiment. However, this idea is further advanced to the height of the starting pipe 22. The position can be set. That is, as shown in FIG. 3 (B), the highest position H _21a of the inner circumferential wall of the first branch pipe 21a connected to the highest position H ₂₂ of the inner circumferential wall of the starting tube 22 to the bottom of the cooling plate 14 Can be provided below. With such an arrangement, it is possible to level the distribution amount of the coolant to the branch pipes 21a to 21e. In the present embodiment, the branch pipe 21a is located on the most upstream side, the branch pipe 21e is located on the most downstream side, the branch pipe 21a is located at the lowest stage, and the branch pipe 21e is located at the uppermost stage. ing. Therefore, strictly speaking, it is conceivable that such an arrangement affects the distribution amount of the coolant, but this can be homogenized by adjusting the output of the pump 41 or the like.

Next, the height of the installation position of the terminal pipe 32 will be described. The end pipe 32 can be provided below the cooling plate 14 arranged at the bottom of the cooling plates 14 arranged in layers in the vertical direction. In the present embodiment, as shown in FIG. 4A, the highest position H ₃₂ of the inner peripheral wall of the terminal pipe 32 and the highest inner peripheral wall of the first branch pipe 31a connected to the lowermost cooling plate 14. The position H _31a is set to the same height. As will be described in detail later, the cooling liquid containing the gasified air is returned to the terminal pipe 32 through the bypass path 50. It is desirable that the gaseous air is discharged from the drain port 30a without being returned to the drainage path 301 in the drain pipe 30 so as not to enter the branch pipes 31a to 31e again. Therefore, it is desirable that the terminal pipe 32 is provided as downward as possible. It is considered that if the position of the terminal pipe 32 is set as in the present embodiment, it is possible to prevent the gasified air from entering the branch pipes 31a to 31e. However, this idea is further advanced to the terminal pipe. 32 height positions can be set. That is, as shown in FIG. 4 (B), the highest position H _31a of the inner circumferential wall of the first branch pipe 31a connected to the highest position H ₃₂ of the inner circumferential wall of the end tube 32 to the bottom of the cooling plate 14 Can be provided below. This makes it possible to prevent the more appropriately gasified air from entering the branch pipes 31a to 31e.

In the present embodiment, since the end pipe 32 is provided in the drain pipe 30, the end point of the bypass path 50 is the drain pipe 30, but the bypass path 50 is connected to the circulation pipe 40. May be good. Specifically, the circulation pipe 40 may be connected to the upstream side of the heat exchanger 42 that serves as the coolant cooling unit. Even if it is connected to the circulation pipe 40, it is possible to prevent the gasified air from entering the branch pipes 31a to 31e.

The cooling device 10 includes a bypass path 50. The bypass path 50 bypasses the cooling plate 14. The start point of the bypass path 50 in the present embodiment is the start end pipe 22, and the end point is the end pipe 32. The bypass path 50 is connected to the upper end portion 20b of the water supply pipe 20. The bypass path 50 is connected to the upper end portion 20b of the water supply pipe 20 in consideration of the accumulation of gaseous air in the upper end portion of the water supply pipe 20.

Here, the gas-like air that may be contained in the coolant will be described. The coolant is not filled in the cooling plate 14 or each pipe in the initial stage of the manufacturing process of the cooling device 10. The coolant is filled in the cooling device 10 at the installation stage of the electronic device system 1. When this filling operation is performed at room temperature, dissolved air may be present in the coolant. When the operation of the cooling device 10 is started in the state where the dissolved air is present in the refrigerant liquid, the temperature and pressure of the cooling liquid fluctuate, and the air dissolved in the cooling liquid at room temperature is vaporized to become bubbles. Since this air moves upward in the liquid, it is stored in the upper end of the water supply pipe 20. If the air stored in the upper end of the water supply pipe 20 is left as it is, the head (pressure) in the water supply pipe 20 decreases, and the cooling capacity decreases due to the decrease in the flow rate of the coolant supplied to the upper cooling plate 14. Can be considered. Further, even when the cooling device 10 is in operation, for example, if the heat exchanger 42 is installed in a state of being open to the atmosphere, air may be mixed in the coolant.

Therefore, in the present embodiment, the bypass path 50 is provided to draw the gasified air into the bypass path 50 so that the air does not enter the cooling plate 14. Here, the bypass path 50 is connected to the upper end portion 20b of the water supply pipe 20 in consideration of storing the air in the upper end portion 20b of the water supply pipe 20.

In this embodiment, the upper end portion 30b of the drainage pipe 30 and the bypass path 50 are also connected. This is because there is a possibility that gasified air may be stored in the drain pipe 30 as well, and this is to be recovered. However, since the cooling liquid after passing through the cooling plate 14 is discharged to the drain pipe 30, it is considered that the influence on the cooling performance of the cooling plate 14 is small. Therefore, in order to simplify the piping, the connection between the drain pipe 30 and the bypass path 50 can be omitted.

In the cooling device 10 of the present embodiment, the first connecting member 52 is used for connecting the bypass path 50 and the upper end portion 20b of the water supply pipe 20. A second connecting member 54 is used to connect the bypass path 50 and the upper end portion 30b of the drain pipe 30.

The bypass path 50 includes a first pipe 51 that connects the start pipe 22 and the first connecting member 52, a second pipe 53 that connects the first connecting member 52 and the second connecting member 54, and a second connection. A third pipe 55 that connects the member 54 and the terminal pipe 32 is included. The first pipe 51, the second pipe 53, and the third pipe 55 use a rubber material in consideration of flexibility and heat insulating properties, but the present invention is not limited to this, and conventionally known resins, metals, and the like are used. Materials may be used.

The first connecting member 52 is provided at a connection position with the upper end portion 20b of the water supply pipe 20 of the bypass path 50, and the first connecting member 52 is provided above the plurality of cooling plates 14. .. As a result, the gas-like air passes above the uppermost cooling plate 14, and the inflow of air into the cooling plate 14 is suppressed.

The first connecting member 52 includes a first port portion 521 extending toward the start end pipe 22, a second port portion 522 extending toward the end pipe 32 side, and a third port portion 523 extending toward the upper end portion 20b of the water supply pipe 20. Be prepared. Then, inside the connecting member 52, a first flow path 52a having a first port portion 521 and a second port portion 522 as ends and a third port portion 523 branching from the first flow path 52a are provided. A second flow path 52b as an end is formed. By using such a connecting member 52, the cooling device 10 can be easily installed. Further, it is easy to determine the positional relationship between the bypass path 50 and the upper end portion 20b of the water supply pipe 20, and it is easy to maintain the positional relationship. The first pipe 51 is connected to the first port portion 521. A second pipe 53 is connected to the second port 522. The third port portion 523 is connected to the upper end portion 20b of the water supply pipe 20.

The second connecting member 54 that connects the bypass path 50 and the drain pipe 30 also uses the same member as the first connecting member 52. That is, the second connecting member 54 also includes a first port portion 541, a second port portion 542, and a third port portion 543. Further, inside the second connecting member 54, there is a first flow path 54a having a first port portion 541 and a second port portion 542 as an end portion, and a third port branching from the first flow path 54a. A second flow path 54b having a portion 543 as an end portion is formed. A second pipe 53 is connected to the first port portion 541. A third pipe 55 is connected to the second port 542. The third port portion 543 is connected to the upper end portion 30b of the drain pipe 30.

By forming the bypass path 50 and flowing the cooling liquid into the bypass path 50 in this way, the gas-like air stored in the upper end portion 20b of the water supply pipe 20 is sucked into the bypass path 50. As a result, the inflow of air into the cooling plate 14 is suppressed, and the cooling efficiency is maintained.

Here, the relationship between the flow path cross-sectional area S1 of the first flow path 52a and the flow path cross-sectional area S2 of the second flow path 52b will be described with reference to FIG. 5A. It is desirable that the flow path cross-sectional area S1 and the flow path cross-sectional area S2 are S2 ≦ S1. The reason for setting the relationship between the two in this way is to prevent the cooling liquid containing air from flowing back to the water supply path 201 in the water supply pipe 20. In this embodiment, S2 <S1. In addition, in order to prevent the cooling liquid containing air from flowing back to the water supply path 201 in the water supply pipe 20, a connecting member 62 as shown in FIG. 5B may be used instead of the connecting member 52. good. In the connecting member 52, the first flow path 52a and the second flow path 52b are orthogonal to each other, whereas in the connecting member 62, the angle at which the second flow path 62b is 90 ° or less with respect to the first flow path 62a. It is designed to have θ1. That is, in FIG. 5B, when the angle θ1 is a counterclockwise angle with respect to the direction in which the first flow path 62a extends, the angle θ1 <90 °. As a result, backflow to the second flow path 62b is less likely to occur.

Next, with reference to FIG. 6, the flow path cross-sectional area of the bypass path 50, more specifically, the flow path cross-sectional area S3 of the first pipe 51 and the flow path cross-sectional area S4 in the branch pipe 21a branched from the water supply pipe 20. The relationship between It is desirable that the flow path cross-sectional area S3 and the flow path cross-sectional area S4 are S3 ≦ S4. The reason why the relationship between the two is set in this way is that the inflow of the cooling liquid into the branch pipe 21a is prioritized over the inflow of the cooling liquid into the bypass path 50.

When the cooling device 10 as described above is operated, the gas-like air existing in the cooling device 10 moves according to the flow of the coolant and flows into the water supply pipe 20. Since the gas-like air has a lighter specific gravity than the coolant, it moves to the upper end 20b of the water supply pipe 20 and eventually becomes an air layer. The air stored in the upper end portion 20b of the water supply pipe 20 is sucked into the cooling liquid flowing in the bypass path 50 via the first connecting member 52. Then, the coolant is released to the atmosphere in the heat exchanger 42 through the drain pipe 30 and the circulation pipe 40. As a result, the supply of the cooling liquid containing the gasified air to each cooling plate 14 can be suppressed, and the decrease in the flow rate of the cooling liquid supplied to the cooling plate 14 can be suppressed. Since the air that has become gas in the cooling device 10 finally moves to the heat exchanger 42 provided outside the rack and is exhausted, the air that moves in the cooling device 10 according to the flow of the coolant is reduced. continue. As a result, the fluctuation converges on the amount of the coolant supplied to the cooling plate 14, and the cooling efficiency is maintained. Even if the gasified air is supplied to the water supply pipe 20 again or the air is newly mixed in the heat exchanger 42 or the like, the air is stored in the upper end portion 20b of the water supply pipe 20 and bypassed. It is sucked into the cooling water flowing through the path 50. Therefore, it is suppressed that the cooling liquid containing air is supplied to each cooling plate 14.

Further, the cooling device 10 of the present embodiment does not require a valve mechanism or the like, and can have a simple structure. If a complicated mechanism such as a valve is adopted, scale, algae, slime, rust, etc. may adhere to the mechanism part, or the mechanism part may break down. There is no. Further, the cooling device 10 of the present embodiment does not require special power or the like, and is highly reliable in this respect as well.

(Second Embodiment)
Next, the second embodiment will be described with reference to FIGS. 7 to 8 (B). FIG. 7 is an explanatory diagram showing a schematic configuration of the cooling device of the second embodiment. FIG. 8 (A) is an explanatory view showing a modified example of the positional relationship between the start pipe and the end pipe in the drain pipe of the second embodiment, and FIG. 8 (B) is the start pipe and the end of the drain pipe of the second embodiment. It is explanatory drawing which shows the modification of the branching angle of a pipe. The components common to the first embodiment are designated by the same reference numbers in the drawings, and detailed description thereof will be omitted.

The cooling device 70 of the second embodiment includes a water supply pipe 120 instead of the water supply pipe 20 of the first embodiment. Unlike the water supply pipe 20, the water supply pipe 120 does not include the start end pipe 22. The point that the branch pipes 121a to 121e are provided is common to the first embodiment.

The cooling device 70 includes a drain pipe 130 instead of the drain pipe 30 of the first embodiment. The drainage pipe 130 includes branch pipes 131a to 131e and an end pipe 133 as in the first embodiment, and further includes a start end pipe 132.

The cooling device 70 includes a bypass path 150 instead of the bypass path 50 of the first embodiment. The starting point of the bypass path 150 is the starting end pipe 132 provided in the drainage pipe 130. The bypass path 150 includes a first pipe 151, a connecting member 152, and a second pipe 153. The connecting member 152 is the same member as the first connecting member 52 in the first embodiment, and is connected to the upper end portion 120b of the water supply pipe 120. As a result, the gas-like air stored in the upper end portion 120b of the water supply pipe 120 can be sucked out to the bypass path 150. In the second embodiment, the connection between the upper end of the drain pipe 130 and the bypass path 150 is not adopted.

Even with such a cooling device 70, it is possible to suppress gasified air from entering each cooling plate 14 as in the first embodiment.

Here, the height of the installation position of the terminal tube 133 will be described with reference to FIG. 8 (A). The height of the installation position of the end pipe 133 may be equal to or less than the height of the installation position of the start pipe 132. In the present embodiment, as shown in FIG. 8A, the highest position H ₁₃₃ of the inner peripheral wall of the terminal tube 133 is set to a position lower than _{the highest position H 132} of the inner peripheral wall of the starting tube 132. .. This is in consideration of the fact that the cooling liquid containing the gasified air is returned to the end pipe 133, while the start pipe 132 serves as the start point of the bypass path 150. That is, it is a measure for preventing the cooling liquid containing the gas returned to the end pipe 133 from being sucked into the start pipe 132 again. With such a positional relationship, the air returned to the terminal pipe 133 moves to the heat exchanger 42 provided outside the rack and is exhausted. As a result, the amount of gas in the coolant can be gradually reduced.

In order to prevent the cooling liquid containing air from being sucked into the start pipe 132 again, the branch angle θ2 of the start pipe 132 and the branch angle θ3 of the end pipe 133 are set as shown in FIG. 8 (B). You can also do it. That is, in FIG. 8B, when the branch angle θ2 of the start end pipe 132 is a clockwise angle with respect to the flow direction of the cooling water in the drain pipe 130, the angle θ2 <90 °. Further, in FIG. 8B, when the branch angle θ3 of the terminal pipe 133 is set to a clockwise angle with respect to the flow direction of the cooling water in the drain pipe 130, the angle θ3 <90 °. As a result, the cooling liquid containing air is less likely to be sucked into the starting pipe 132.

(Third Embodiment)
Next, the third embodiment will be described with reference to FIG. FIG. 9 is an explanatory diagram showing a schematic configuration of the cooling device of the third embodiment. The components common to the first embodiment are designated by the same reference numbers in the drawings, and detailed description thereof will be omitted.

The cooling device 80 of the third embodiment includes a water supply pipe 220 instead of the water supply pipe 20 of the first embodiment. Unlike the water supply pipe 20, the water supply pipe 220 does not include the start end pipe 22. The point that the branch pipes 221a to 221e are provided is common to the first embodiment.

The cooling device 80 of the third embodiment includes a connecting member 252 in place of the first connecting member 52 of the first embodiment. The cooling device 80 includes a bypass path 250 instead of the bypass path 50 of the first embodiment. Unlike the first connecting member 52, the connecting member 252 includes only two mouth portions. One mouth is connected to the upper end 220b of the water supply pipe 220. The other mouth is connected to the first pipe 251 forming the bypass path 250. However, unlike the first embodiment, the cooling device 80 does not include a start-end pipe. Therefore, the upper end 220b of the water supply pipe 220 becomes the starting point of the bypass path 250.

Even in such a cooling device 80, the gasified air is stored in the upper end 220b of the water supply pipe 220. In such a cooling device 80, when the cooling water is introduced into the water supply path 2201 from the water supply port 220a provided at the lower end of the water supply pipe 220, the coolant in the water supply path 2201 is pushed out to the bypass path 250.

Even with such a cooling device 80, it is possible to suppress gasified air from entering each cooling plate 14 as in the first embodiment.

(Fourth Embodiment)
Next, the fourth embodiment will be described with reference to FIG. FIG. 10 is an explanatory diagram showing a schematic configuration of the cooling device of the fourth embodiment. The components common to the first embodiment are designated by the same reference numbers in the drawings, and detailed description thereof will be omitted.

In the fourth embodiment, unlike the first embodiment and the like, the server blades 11a to 11e are arranged in layers in the left-right direction. Along with this, in the cooling device 90 of the fourth embodiment, the cooling plates 14 are also arranged in layers in the left-right direction. The water supply pipe 320 and the drainage pipe 330 also extend in the left-right direction. The water supply pipe 320 is arranged above the server blades 11a to 11e, and the drainage pipe 330 is arranged below the server blades 11a to 11e. The cooling device 90 includes a water supply pipe 320 instead of the water supply pipe 20 of the first embodiment. The water supply pipe 320 includes branch pipes 321a to 321e as in the first embodiment. Further, the cooling device 90 includes a drain pipe 330 instead of the drain pipe 30 of the first embodiment. The drainage pipe 330 includes branch pipes 331a to 331e as in the first embodiment.

The water supply pipe 320 includes a start end pipe 322 that branches at an end close to the water supply port 320a and serves as a start point of the bypass path 350. The drainage pipe 330 includes a terminal pipe 332 that branches at an end close to the drainage port 330a and serves as an end point of the bypass path 350. The bypass path 350 connects the start pipe 322 and the end pipe 332 via a connection position with the upper end of the water supply pipe 320.

The cooling device 90 includes a circulation pipe 340 that connects the water supply port 320a of the water supply pipe 320 and the drainage port 330a of the drainage pipe 330. A pump 341 for discharging the coolant and a heat exchanger 342 for cooling the coolant are arranged in the circulation pipe 340. This point is the same as that of the first embodiment.

Even in such a cooling device 90, the gasified air is stored in the upper part of the water supply path 3201 formed in the water supply pipe 320. Therefore, the cooling liquid flowing in the bypass path 350 passing above the water supply pipe 320 sucks the gasified air and discharges it to the drainage path 3301 in the drainage pipe 330.

Even with such a cooling device 90, it is possible to prevent gasified air from entering each cooling plate 14 as in the first embodiment.

Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the specific embodiments, and various modifications and variations are made within the scope of the gist of the present invention described in the claims. It can be changed.

1 Electronic equipment system 10, 70, 80, 90 Cooling device 11a to 11e Server blade 12 Substrate 13 Semiconductor package 14 Cooling plate 20, 120, 220, 320 Water supply pipe 20a, 120a, 220a, 320a Water supply port 20b, 120b, 220b, 320b Upper end 21a to 21e, 31a to 31e, 121a to 121e, 131a to 131e, 221a to 221e, 321a to 321e, 331a to 331e Branch pipe 22,132 Start pipe 30 Drain pipe 30a, 130a, 330a Drainage port 32, 133 332 Termination pipe 40,340 Circulation pipe 41, 341 Pump 42, 342 Heat exchanger 50, 150, 250, 350 Bypass path 52, 62, 152, 252 First connection member 54 Second connection member

Claims (12)

Cooling units provided in each of a plurality of electronic devices arranged in layers,
A water supply pipe each having a plurality of branch pipes connected to the cooling unit and supplying a cooling liquid to the cooling unit,
A drainage pipe each having a plurality of branch pipes connected to the cooling unit and discharging the cooling liquid that has passed through the cooling unit.
A pump that connects the water supply port of the water supply pipe and the drainage port of the drainage pipe and discharges at least the coolant, and a circulation pipe in which a coolant cooling unit for cooling the coolant is arranged.
A bypass path that is connected to at least the upper end of the water supply pipe and bypasses the plurality of cooling parts and is connected to the drainage pipe.
With
The plurality of cooling units are arranged in parallel in a layered manner in the vertical direction, and the water supply pipe and the drainage pipe extend in the vertical direction, respectively.
The water supply pipe is provided with a start pipe that branches at the lower end and serves as a start point of the bypass path.
The drainage pipe is provided with a terminal pipe that branches at the lower end and serves as the end point of the bypass path.
The bypass path is a cooling device that connects the start pipe and the end pipe via a connection position with the upper end of the water supply pipe. The cooling device according to claim 1, wherein the starting pipe is provided below the cooling unit arranged at the bottom of the plurality of cooling units arranged in layers in the vertical direction. The cooling device according to claim 1 or 2, wherein the terminal pipe is provided below the cooling unit arranged at the bottom of the plurality of cooling units arranged in layers in the vertical direction. The cooling device according to any one of claims 1 to 3, wherein the connection position of the bypass path with the upper end portion of the water supply pipe is provided above the plurality of cooling portions. At the connection position of the bypass path with the upper end of the water supply pipe, a first port extending to the start end pipe side, a second port extending to the end pipe side, and a second port extending to the upper end side of the water supply pipe. A first flow path having three ports and having the first port and the second port as ends is provided inside, and the third port is branched from the first flow path and has the third port as an end. The cooling device according to any one of claims 1 to 3, wherein the second flow path is provided with a formed connecting member. The cooling device according to claim 5, wherein the flow path cross-sectional area of the second flow path is equal to or less than the flow path cross-sectional area of the first flow path. The cooling device according to any one of claims 1 to 3, 5 or 6, wherein the flow path cross-sectional area of the bypass path is equal to or less than the flow path cross-sectional area in the branch pipe branched from the water supply pipe. Cooling units provided in each of a plurality of electronic devices arranged in layers,
A water supply pipe each having a plurality of branch pipes connected to the cooling unit and supplying a cooling liquid to the cooling unit,
A drainage pipe each having a plurality of branch pipes connected to the cooling unit and discharging the cooling liquid that has passed through the cooling unit.
A pump that connects the water supply port of the water supply pipe and the drainage port of the drainage pipe and discharges at least the coolant, and a circulation pipe in which a coolant cooling unit for cooling the coolant is arranged.
A bypass path that is connected to at least the upper end of the water supply pipe and bypasses the plurality of cooling parts and is connected to the drainage pipe.
With
The plurality of cooling units are arranged in parallel in a layered manner in the vertical direction, and the water supply pipe and the drainage pipe extend in the vertical direction, respectively.
The drainage pipe includes a start pipe that branches at the lower end and serves as a start point of the bypass path, and a terminal pipe that branches at the lower end and serves as the end point of the bypass path.
The bypass path is a cooling device that connects the start pipe and the end pipe via a connection position with the upper end of the water supply pipe. The cooling device according to claim 8, wherein the height of the installation position of the end pipe is equal to or less than the height of the installation position of the start pipe. Cooling units provided in each of a plurality of electronic devices arranged in layers,
A water supply pipe each having a plurality of branch pipes connected to the cooling unit and supplying a cooling liquid to the cooling unit,
A drainage pipe each having a plurality of branch pipes connected to the cooling unit and discharging the cooling liquid that has passed through the cooling unit.
A pump that connects the water supply port of the water supply pipe and the drainage port of the drainage pipe and discharges at least the coolant, and a circulation pipe in which a coolant cooling unit for cooling the coolant is arranged.
A bypass path that is connected to at least the upper end of the water supply pipe and bypasses the plurality of cooling parts and is connected to the drainage pipe.
With
The plurality of cooling units are arranged in parallel in a layered manner in the left-right direction, and the water supply pipe and the drainage pipe extend in the left-right direction, respectively.
The water supply pipe is provided with a start end pipe that branches at an end close to the water supply port and serves as a start point of the bypass path.
The drainage pipe is provided with a terminal pipe that branches at an end close to the drainage port and serves as an end point of the bypass path.
The bypass path is a cooling device that connects the start pipe and the end pipe via a connection position with the upper end of the water supply pipe. Cooling units provided in each of a plurality of electronic devices arranged in layers,
A water supply pipe each having a plurality of branch pipes connected to the cooling unit and supplying a cooling liquid to the cooling unit,
A drainage pipe each having a plurality of branch pipes connected to the cooling unit and discharging the cooling liquid that has passed through the cooling unit.
A pump that connects the water supply port of the water supply pipe and the drainage port of the drainage pipe and discharges at least the coolant, and a circulation pipe in which a coolant cooling unit for cooling the coolant is arranged.
A bypass path that is connected to at least the upper end of the water supply pipe and bypasses the plurality of cooling parts and is connected to the drainage pipe.
With
The plurality of cooling units are arranged in parallel in a layered manner in the vertical direction, and the water supply pipe and the drainage pipe extend in the vertical direction, respectively.
The drainage pipe is provided with a terminal pipe that branches at the lower end and serves as the end point of the bypass path.
The bypass path is a cooling device that connects the upper end of the water supply pipe and the terminal pipe. An electronic device system including a plurality of electronic devices arranged in layers and a cooling device for cooling a cooling target portion of the electronic device.
The cooling device includes a cooling unit provided in each of the electronic devices and a cooling unit.
A water supply pipe each having a plurality of branch pipes connected to the cooling unit and supplying a cooling liquid to the cooling unit,
A drainage pipe each having a plurality of branch pipes connected to the cooling unit and discharging the cooling liquid that has passed through the cooling unit.
A pump that connects the water supply port of the water supply pipe and the drainage port of the drainage pipe and discharges at least the coolant, and a circulation pipe in which a coolant cooling unit for cooling the coolant is arranged.
A bypass path that is connected to at least the upper end of the water supply pipe and bypasses the plurality of cooling parts and is connected to the drainage pipe.
To prepare
The plurality of cooling units are arranged in parallel in a layered manner in the vertical direction, and the water supply pipe and the drainage pipe extend in the vertical direction, respectively.
The water supply pipe is provided with a start pipe that branches at the lower end and serves as a start point of the bypass path.
The drainage pipe is provided with a terminal pipe that branches at the lower end and serves as the end point of the bypass path.
The bypass path is an electronic device system that connects the start pipe and the end pipe via a connection position with the upper end of the water supply pipe.

Images