JP6908196B2 - Assembly board and its manufacturing method - Google Patents

Description

The present invention relates to an assembly substrate including a plurality of element portions each having an electrical function and a method for manufacturing the same.

Patent Document 1 discloses a method of manufacturing an element having a rigid-flexible multilayer wiring board structure by forming an assembly substrate including a plurality of element portions and separating each element portion from the assembly substrate.

Specifically, in the first thermoplastic resin sheet, a release layer is formed in the region where the flexible portion is planned to be formed on the upper surface of the first thermoplastic resin sheet, and the first closed loop surrounding the region where the rigid portion is planned to be formed in the first thermoplastic resin sheet. A first notch is formed at the position of the boundary between the rigid portion formation planned region and the flexible portion formation planned region. Then, a second notch is formed from the second thermoplastic resin sheet side of the thermocompression-bonded laminate along the second closed loop that surrounds the entire rigid portion formation planned region and the flexible portion formation planned region, and the peeling layer is formed. Peel off at the boundary. As a result, the region surrounded by the first closed loop of the first thermoplastic resin sheet that is thermocompression-bonded and integrated, and the region surrounded by the second closed loop of the second thermoplastic resin sheet, Is shown to be taken out integrally.

Japanese Unexamined Patent Publication No. 2012-99604

According to the method for manufacturing an aggregate substrate described in Patent Document 1, the laminated body of the insulating resin base material in the flexible portion forming region is integrally taken out at the boundary between the flexible portion forming planned region and the rigid portion forming planned region. Therefore, the man-hours for removing the removing portion from the insulating resin base material can be reduced, and the man-hours for manufacturing the rigid-flexible multilayer wiring board can be reduced.

The rigid portion and the flexible portion of the rigid-flexible multilayer substrate are formed by the difference in the number of laminated insulating resin base materials. However, the method for manufacturing a rigid-flexible multilayer wiring board shown in Patent Document 1 is described in Patent Document 1. It has not been possible to take out an element portion having a plurality of layers of an insulating resin base material from an assembly substrate or to apply to an element having such a shape.

Therefore, an object of the present invention is to provide an assembly substrate including an element portion in which the number of layers of an insulating resin base material exists in a plurality of stages, and a method for manufacturing the same.

An assembly substrate as an example of the present disclosure includes a plurality of element portions each having an electrical function and a connecting portion having no electrical function connected to the plurality of element portions, and the element portion and the connecting portion. A collective substrate composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material in which parts are regularly arranged and a conductor pattern is formed are laminated, and the element part is a main body part. A first minority laminated portion in which the number of laminated insulating resin base materials is smaller than that of the main body portion, and a second minority portion in which the number of laminated insulating resin base materials is further smaller than that of the first minority laminated portion. The first minority laminated portion and the second minority laminated portion are connected between the main body portion and the connecting portion, and the number of laminated layers of the insulating resin base material in the connecting portion is the first. 2. It is characterized in that it is the same as the number of laminated layers of the insulating resin base material in the minority laminated portion.

Further, the method for manufacturing an aggregate substrate as an example of the present disclosure is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and each of them has an electrical function. The element portion and the connecting portion having no electrical function are provided, and the element portion and the connecting portion are regularly arranged, and the element portion is connected to the main body portion. The first minority laminated portion, which has a smaller number of laminated insulating resin base materials than the main body portion, and the second minority laminated portion, which has a smaller number of laminated insulating resin base materials than the first minority laminated portion. A method for manufacturing an aggregate substrate having a portion, wherein a first cut is formed at a position of the insulating resin base material corresponding to the periphery of the main body portion among the plurality of insulating resin base materials. Of the plurality of insulating resin base materials, a second notch is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the first minority laminated portion, and the plurality of insulating resin base materials are laminated. A body is formed, and the first minority laminated portion, the second minority laminated portion, and the removing portion of the connecting portion are peeled off from the laminated body at the first cut and the second cut position.

Further, the method for manufacturing an aggregate substrate as an example of the present disclosure is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and each of them has an electrical function. The element portion and the connecting portion having no electrical function are provided, and the element portion and the connecting portion are regularly arranged, and the element portion is connected to the main body portion. The first minority laminated portion, which has a smaller number of laminated insulating resin base materials than the main body portion, and the second minority laminated portion, which has a smaller number of laminated insulating resin base materials than the first minority laminated portion. A method for manufacturing an aggregate substrate having a portion, wherein a first cut is formed at a position of the insulating resin base material corresponding to the periphery of the main body portion among the plurality of insulating resin base materials. Among the plurality of insulating resin base materials, a second notch is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the first minority laminated portion, and among the plurality of insulating resin base materials, among the plurality of insulating resin base materials. The adjacent first notch is removed from the insulating resin base material so as to include the connecting portion, and the second notch of the plurality of insulating resin base materials is included in the connecting portion. By removing the insulating resin base material from the insulating resin base material and laminating the plurality of insulating resin base materials, the connecting portion is formed together with the first minority laminated portion and the second minority laminated portion. ..

According to the present invention, it is easy to obtain an aggregate substrate having an element portion in which the number of layers of the insulating resin base material is present in a plurality of stages.

1 (A) and 1 (B) are plan views of the assembly substrate 101 according to the first embodiment. FIG. 2 is a vertical cross-sectional view of the XX portion in FIGS. 1 (A) and 1 (B). 3 (A) is a plan view of one of the plurality of elements extracted from the assembly substrate shown in FIGS. 1 (B) and 2, and FIG. 3 (B) is a plan view of FIG. 3 (A). It is a vertical sectional view of the XX part. FIG. 4A is a cross-sectional view of each insulating resin base material constituting the laminated body 101P before laminating, and FIG. 4B is a laminated state of the plurality of insulating resin base materials of the laminated body 101P. It is a cross-sectional view. FIG. 5 is a cross-sectional view in a manufacturing process for obtaining the assembly substrate 101 from the state shown in FIG. 4 (B). FIG. 6 is a cross-sectional view of the insulating resin base materials 11, 12, and 13 before laminating. FIG. 7A is a cross-sectional view of each insulating resin base material constituting the collective substrate 102 before laminating, and FIG. 7B is a cross-sectional view of the collective substrate 102. 8 (A) and 8 (B) are plan views of the assembly substrate 103 according to the third embodiment. FIG. 9 is a vertical cross-sectional view of the XX portion in FIGS. 8 (A) and 8 (B). 10 (A) is a plan view of one of the plurality of elements extracted from the assembly substrate shown in FIGS. 8 (A) and 8 (B), and FIG. 10 (B) is a plan view of FIG. 10 (B). It is a vertical sectional view of the XX part in A). 11 (A) and 11 (B) are plan views of the assembly substrate 104 according to the fourth embodiment. FIG. 12 is a plan view of one element portion extracted from the assembly substrate 104 shown in FIG. 11 (B).

First, some aspects of the assembly substrate and the method for manufacturing the same according to the present invention will be described.

The collective substrate of the first aspect according to the present invention includes a plurality of element portions each having an electrical function and a connecting portion having no electrical function connected to the plurality of element portions, and the element portion. A collective substrate composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material in which the connecting portions are regularly arranged and a conductor pattern is formed are laminated.
The element portion includes a main body portion, a first minority laminated portion in which the number of laminated layers of the insulating resin base material is smaller than that of the main body portion, and the insulating resin base material laminated as compared with the first minority laminated portion. It has a second minority laminate, which is even smaller in number,
The first minority laminated portion and the second minority laminated portion are connected between the main body portion and the connecting portion.
The number of layers of the insulating resin base material in the connecting portion is the same as the number of layers of the insulating resin base material in the second minority laminated portion.

According to the collective substrate having the above structure, when the insulating resin base material is partially removed from the laminated body to form the first minority laminated portion, the second minority laminated portion and the connecting portion, the first minority laminated portion and the second minority laminated portion are formed. Since the minority laminated portion and the connecting portion are the minority laminated portions that continuously expand, the removed portion for forming the continuous minority laminated portion can be easily removed from the laminated body all at once.

In the assembly substrate of the second aspect according to the present invention, the conductor pattern is formed on the surface of at least one of the first minority laminated portion, the second minority laminated portion, or the connecting portion. With this structure, it becomes easy to remove the first minority laminated portion, the second minority laminated portion, or the removing portion for forming the connecting portion.

In the assembly substrate of the third aspect according to the present invention, the first minority laminated portions or the second minority laminated portions are close to each other between adjacent element portions among the plurality of element portions. According to this structure, the continuum of the connecting portion and the first minority laminated portion or the second minority laminated portion connected to both sides thereof can be easily removed from the laminated body all at once.

In the third aspect of the assembly substrate according to the fourth aspect of the present invention, the adjacent element portions are oriented differently from each other, and a plurality of pairs of the adjacent element portions are regularly arranged. According to this structure, the removing portion for forming the connecting portion and the first minority laminated portion or the second minority laminated portion connected thereto is more centralized, so that the man-hours for removing the removed portion can be reduced.

The method for manufacturing an assembly substrate according to a fifth aspect of the present invention is as follows.
It is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and is connected to a plurality of element portions each having an electrical function and the plurality of element portions. The element portion and the connecting portion are regularly arranged, and the element portion is a laminate of the main body portion and the insulating resin base material as compared with the main body portion. A method for manufacturing an aggregate substrate, which comprises a first minority laminated portion having a small number and a second minority laminated portion having a smaller number of laminated insulating resin base materials than the first minority laminated portion.
Among the plurality of insulating resin base materials, a first notch is formed at a position of the insulating resin base material corresponding to the periphery of the main body portion, and among the plurality of insulating resin base materials, the first minority A second cut is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the laminated portion, a laminated body made of the plurality of insulating resin base materials is formed, and the first cut and the first cut are made from the laminated body. At the second cut position, the first minority laminated portion, the second minority laminated portion, and the removing portion of the connecting portion are peeled off.

According to the method for manufacturing the collective substrate, the first minority laminated portion, the second minority laminated portion, and the removing portion for forming the connecting portion can be collectively removed, so that the manufacturing cost can be reduced.

The method for manufacturing the assembly substrate according to the sixth aspect of the present invention is as follows.
It is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and is connected to a plurality of element portions each having an electrical function and the plurality of element portions. The element portion and the connecting portion are regularly arranged, and the element portion is a laminate of the main body portion and the insulating resin base material as compared with the main body portion. A method for manufacturing an aggregate substrate, which comprises a first minority laminated portion having a small number and a second minority laminated portion having a smaller number of laminated insulating resin base materials than the first minority laminated portion.
A first notch is formed at a position of the insulating resin base material corresponding to the periphery of the main body of the plurality of insulating resin base materials, and the first minority of the plurality of insulating resin base materials is formed. A second notch is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the laminated portion, and among the plurality of insulating resin base materials, the adjacent first notch includes the connecting portion. As described above, the insulating resin base material is removed from the insulating resin base material so as to include the connecting portion between the second cuts among the plurality of insulating resin base materials. By laminating the insulating resin base material, the connecting portion is formed together with the first minority laminated portion and the second minority laminated portion.

According to the above-mentioned manufacturing method of the collective substrate, it becomes easy to manufacture the insulating resin base material which becomes the first minority laminated portion, the second minority laminated portion and the connecting portion after lamination.

Hereinafter, a plurality of embodiments for carrying out the present invention will be shown with reference to the drawings with reference to some specific examples. The same reference numerals are given to the same parts in each figure. Although the embodiments are shown separately for convenience of explanation in consideration of the explanation of the main points or the ease of understanding, partial replacement or combination of the configurations shown in different embodiments is possible. In the second and subsequent embodiments, the description of matters common to the first embodiment will be omitted, and only the differences will be described. In particular, the same action and effect due to the same configuration will not be mentioned sequentially for each embodiment.

<< First Embodiment >>
1 (A) and 1 (B) are both plan views of the collective substrate 101 according to the first embodiment. FIG. 1 (B) is a diagram showing a punching pattern of each element portion together with respect to FIG. 1 (A). FIG. 2 is a vertical cross-sectional view of the XX portion in FIGS. 1 (A) and 1 (B). 3 (A) is a plan view of one of the plurality of elements extracted from the assembly substrate shown in FIGS. 1 (B) and 2, and FIG. 3 (B) is a plan view of FIG. 3 (A). It is a vertical sectional view of the XX part.

The collective substrate 101 of the present embodiment has a plurality of element portions PP11, PP12, PP21, PP22, PP31, PP32, each of which has an electrical function, and between the element portions PP11-PP12, between the element portions PP21-PP22, and the element portion PP31-. A connecting portion CP having no electrical function, which is connected between the PP 32s, is provided. Here, "having no electrical function" means, in other words, that the element is not taken out from the collective substrate 101. The plurality of element portions and the plurality of connecting portions CP are regularly arranged. This "regular arrangement" means that among the plurality of element portions PP11, PP12, PP21, PP22, PP31, and PP32, the plurality of element portions and the plurality of connecting portions CP are alternately arranged in a row. be able to. In this example, the portion of the collective substrate 101 other than the plurality of element portions and the connecting portion CP is the residual portion PP0.

As shown in FIG. 2, the assembly substrate 101 is composed of a laminated body in which a plurality of insulating resin base materials including the insulating resin base materials 11, 12, and 13 are laminated.

In the plurality of element portions PP11, PP12, PP21, PP22, PP31, and PP32, the main body portion BP and the first minority laminated portion LP1 in which the number of laminated insulating resin base materials 11, 12, and 13 is smaller than that of the main body portion BP. And the second minority laminated portion LP2 having a smaller number of laminated insulating resin base materials than the first minority laminated portion LP1. That is, the second minority laminated portion LP2 is the portion of the element portion having the smallest number of laminated layers.

The first minority laminated portion LP1 is connected to the main body portion BP, and the second minority laminated portion LP2 is connected between the first minority laminated portion LP1 and the connecting portion CP. That is, the first minority laminated portion LP1 and the second minority laminated portion LP2 are connected between the main body portion BP and the connecting portion CP. The connecting portion CP is a region having the same number of layers as the second minority laminated portion LP2 that continuously connects the minority laminated portions between the element portions.

The number of laminated insulating resin base materials in the connecting portion CP is the same as the number of laminated insulating resin base materials in the second minority laminated portion LP2.

For example, an antenna conductor pattern, a coil conductor pattern, and the like are formed on the main body BP. That is, the main body BP is a functional unit as an element. For example, an external connection terminal is formed in the second minority laminated portion LP2. Further, the first minority laminated portion LP1 is formed with a line portion between the antenna conductor pattern or the coil conductor pattern and the external connection terminal.

By punching the element portion PP21 shown by the alternate long and short dash line from the assembly substrate 101 shown in FIGS. 1 (A) and 1 (B), the element portion PP21 shown in FIGS. 3 (A) and 3 (B) can be obtained. .. The forming range of the first minority laminated portion LP1 and the second minority laminated portion LP2 is formed in a range slightly protruding to the outside from the punching line indicated by the two-dot chain line. As a result, large variations in the outer shape of the element portion due to the accuracy of the punching position are suppressed.

The same applies to the other element parts. After all the element portions PP11, PP12, PP21, PP22, PP31, and PP32 are punched out from the assembly substrate 101, the connecting portion CP and the residual portion PP0 remain on the assembly substrate 101.

FIG. 4A is a cross-sectional view of each insulating resin base material constituting the laminated body 101P before laminating, and FIG. 4B is a laminated state of the plurality of insulating resin base materials of the laminated body 101P. It is a cross-sectional view. Conductor patterns EP11A, EP11B, EP11C, and EP11D are formed on the upper surface of the insulating resin base material 11. Further, conductor patterns EP12A, EP12B, and EP12C are formed on the upper surface of the insulating resin base material 12. Each insulating resin base material is a thermoplastic resin sheet such as a liquid crystal polymer. The conductor pattern is a pattern of, for example, a Cu foil attached to an insulating resin base material.

The first notch S1 is formed in the insulating resin base material 13 at a position corresponding to the periphery of the main body BP. Further, in the insulating resin base material 12, a second notch S2 is formed at a position corresponding to the periphery of the portion to be the first minority laminated portion LP1. These cuts S1 and S2 are collectively formed for each insulating resin base material by, for example, a press die.

In the laminated body 101P of the present embodiment, the conductor patterns EP11A, EP12A and the like are formed on the insulating resin base materials 11 and 12 at the predetermined positions, and the first cut S1 is formed at the predetermined positions of the insulating resin base material 13. It is manufactured by forming a second notch S2 at a predetermined position of the insulating resin base material 12, laminating these insulating resin base materials 11, 12 and 13, and heating and pressing them.

FIG. 5 is a cross-sectional view in a manufacturing process for obtaining the assembly substrate 101 from the state shown in FIG. 4 (B). FIG. 5 shows a state in which the removal portion PS is peeled off and removed from the laminated body 101P shown in FIG. 4 (B). In the example shown in FIG. 5, the removal unit PS exists between the element unit PP21 and the element unit PP22. This removing portion PS is removed by the suction chuck SC. That is, the suction chuck SC is applied to the region facing at least a part of the second minority laminated portion LP2 and the connecting portion CP to be attracted, and the removing portion PS is separated from the laminated body to remove the removing portion PS.

In this way, the connecting portion CP between the second minority laminated portion LP2 of the element portion PP21 adjacent to each other and the second minority laminated portion LP2 of the element portion PP22 is formed into the first minority laminated portion LP1 and the second minority laminated portion LP1. It is removed together with the removal part of LP2. As a result, the collective substrate 101 shown in FIGS. 1 (A) and 1 (B) is obtained.

After that, the element portions PP21 and the like shown in FIGS. 3 (A) and 3 (B) can be obtained by punching out each element portion from the collective substrate 101 shown in FIG. 1 (A) by punching or the like. In this example, the thickness of the first minority laminated portion LP1 is thinner than that of the main body portion BP, and the thickness of the second minority laminated portion LP2 is further thinner. Therefore, the arrangement space of the mounting destination of the element unit can be reduced. In addition, the flexibility of the element portion, particularly the end portion, is improved.

According to the present embodiment, since the first minority laminated portion LP1, the second minority laminated portion LP2, and the connecting portion CP are the minority laminated portions that continuously expand, the removing portion for forming the continuous minority laminated portion. PS can be easily removed from the laminated body 101P all at once.

When the suction chuck SC is brought into contact with the area of the second minority laminated portion LP2 to remove the removed portion in order to collectively remove the second minority laminated portion LP2 and the first minority laminated portion LP1, the second minority laminated portion LP2 is removed. If the area of the LP2 is small, it is difficult to bring the suction chuck SC into contact with the second minority laminated portion LP2. Alternatively, the suction force becomes weak and it becomes difficult to remove the removing portion. On the other hand, in the present embodiment, the removing portion of the first minority laminated portion LP1 and the second minority laminated portion LP2 and the removing portion of the connecting portion CP are both adsorbed and removed at once, and thus removed. The removal of the part PS becomes reliable and easy.

Further, according to the present embodiment, the second minority laminated portions LP2 are close to each other between adjacent element portions (in the example shown in FIG. 5 and the like, between the element portions PP21 and PP22). According to this structure, the continuum of the connecting portion CP and the second minority laminated portion LP2 connected to both sides thereof can be more easily removed collectively from the laminated body 101P.

Further, according to the present embodiment, the number of layers of the insulating resin base material of the connecting portion CP is one layer, and the number of layers of the insulating resin base material of the second minority laminated portion LP2 connected to the connecting portion CP is also one layer. Is. That is, the number of layers of both is equal. According to this structure, the layer on the bottom surface of the removal portion PS is a continuously expanding layer, so that the removal portion PS can be easily removed.

As shown in FIGS. 4A and 4B, conductor patterns EP11A, EP11B, EP11C, and EP11D are formed on the upper surface of the insulating resin base material 11. Further, conductor patterns EP12A, EP12B, and EP12C are formed on the upper surface of the insulating resin base material 12.

A part of the conductor pattern EP11A is formed in the orientation shown in FIGS. 4 (A) and 4 (B) at a position that will later become the surface of the second minority laminated portion LP2 on the left side. Further, a part of the conductor pattern EP11C is formed at a position that will later become the surface of the second minority laminated portion LP2 on the right side.

The conductor pattern EP12A is formed in the orientation shown in FIGS. 4 (A) and 4 (B) at a position that will later become the surface of the first minority laminated portion LP1 on the left side. Further, the conductor pattern EP12C is formed at a position that will later become the surface of the first minority laminated portion LP1 on the right side.

The conductor pattern EP11D is a conductor pattern formed in the connecting portion CP other than the element portions PP21, PP22, etc., and is a dummy conductor pattern having no electrical function. The presence of the conductor pattern EP11D improves the peelability of the bottom surface of the removing portion PS shown in FIG. 5, and facilitates the removal of the removing portion PS. The conductor patterns EP12A and EP12C formed on the insulating resin base material 12 may also be dummy conductor patterns having no electrical function.

The bonding force between the insulating resin base material and the Cu foil is weaker than the bonding force between the insulating resin base materials, that is, the Cu foil acts as a release layer. The peelability of the surfaces of the second minority laminated portion LP2 and the connecting portion CP is improved, and the removal portion PS for forming the first minority laminated portion LP1, the second minority laminated portion LP2 and the connecting portion CP becomes easy to remove. ..

<< Second Embodiment >>
In the second embodiment, a method for manufacturing an assembly substrate, which is different from the example shown in the first embodiment, will be described.

FIG. 6 is a cross-sectional view of the insulating resin base materials 11, 12, and 13 before laminating. Conductor patterns EP11A, EP11B, and EP11C are formed on the upper surface of the insulating resin base material 11. Further, conductor patterns EP12A, EP12B, and EP12C are formed on the upper surface of the insulating resin base material 12.

In the present embodiment, the removing portion PS1 between the adjacent first notches S1 is removed from the insulating resin base material 13 in a single state before laminating the insulating resin base materials 11, 12, and 13. Further, the removing portion PS2 between the adjacent second notches S2 is removed from the insulating resin base material 12 in the single state. That is, in the state of the insulating resin base material 13 alone, the suction chuck SC attracts the center or the vicinity of the center of the removing part PS1 and pulls the removing part PS1 away from the insulating resin base material 13 to remove the removing part PS1. Similarly, in the state of the insulating resin base material 12 alone, the suction chuck SC adsorbs the center or the vicinity of the center of the removing part PS2 and pulls the removing part PS2 away from the insulating resin base material 12 to remove the removing part PS2.

In this example, since the position of the removing portion of each insulating resin base material can be made the same, it is not necessary to move the position of the suction chuck SC for each insulating resin base material when removing each of the above removing parts, and the suction device The removal units PS1 and PS2 can be removed while the position of is fixed. That is, the removing portion PS2 of the insulating resin base material 12 includes a connecting portion (CP in FIG. 7B shown later). Since the region including the connecting portion CP may be removed, the degree of freedom of the suction position of the suction chuck SC is increased, the suction positions of the removal portions PS1 and PS2 can be made the same with respect to the outer shape of the assembly substrate, and the suction chuck SC can be used at the time of mass production. The man-hours to move can be reduced.

FIG. 7A is a cross-sectional view of each insulating resin base material constituting the collective substrate 102 before laminating, and FIG. 7B is a cross-sectional view of the collective substrate 102.

The collective substrate 102 of the present embodiment is manufactured by laminating the insulating resin base materials 13 and 12 and the insulating resin base material 11 in a state where the removal portions PS1 and PS2 are removed. That is, by stacking the insulating resin base materials 11, 12, and 13 and heat-pressing them, the connecting portion continuous with the second minority laminated portion LP2 between the second minority laminated portions LP2 of the element portions PP21 and PP22 adjacent to each other. Form CP.

After that, the element portions PP21, PP22 and the like are extracted from the assembly substrate 102 by punching or the like, as in the examples shown in FIGS. 1 (A) and 1 (B).

<< Third Embodiment >>
In the third embodiment, an example of an assembly substrate in which the number of layers of the first minority laminated portion, the second minority laminated portion, and the connecting portion CP is different from the examples shown in the first and second embodiments is shown.

8 (A) and 8 (B) are both plan views of the collective substrate 103 according to the third embodiment. FIG. 8B is a diagram showing a punching pattern of each element portion together with respect to FIG. 8A. FIG. 9 is a vertical cross-sectional view of the XX portion in FIGS. 8 (A) and 8 (B). 10 (A) is a plan view of one of the plurality of elements extracted from the assembly substrate shown in FIGS. 8 (B) and 9, and FIG. 10 (B) is a plan view of FIG. 10 (A). It is a vertical sectional view of the XX part.

The collective substrate 103 of the present embodiment has a plurality of element portions PP11, PP12, PP21, PP22, PP31, PP32, each of which has an electrical function, between the element portions PP11-PP12, between the element portions PP21-PP22, and the element portion PP31-. A connecting portion CP having no electrical function, which is connected between the PP 32s, is provided. The plurality of element portions and the plurality of connecting portions are regularly arranged. The portion other than the plurality of element portions and the connecting portion CP of the assembly substrate 103 is the residual portion PP0.

As shown in FIG. 9, the assembly substrate 103 is composed of a laminated body in which a plurality of insulating resin base materials including the insulating resin base materials 11, 12, and 13 are laminated.

In each of the plurality of element portions PP11, PP12, PP21, PP22, PP31, and PP32, the main body portion BP and the first insulating resin base materials 11, 12, and 13 are laminated with a smaller number of layers than the main body portion BP. It has a minority laminated portion LP1 and a second minority laminated portion LP2 in which the number of laminated insulating resin base materials is further smaller than that of the first minority laminated portion LP1.

The second minority laminated portion LP2 is connected to the main body portion BP, and the first minority laminated portion LP1 is connected between the second minority laminated portion LP2 and the connecting portion CP. That is, the first minority laminated portion LP1 and the second minority laminated portion LP2 are connected between the main body portion BP and the connecting portion CP.

The number of laminated insulating resin base materials in the connecting portion CP is the same as the number of laminated insulating resin base materials in the second minority laminated portion LP2.

For example, an antenna conductor pattern, a coil conductor pattern, and the like are formed on the main body BP. Further, for example, an external connection terminal is formed in the first minority laminated portion LP1. Further, the second minority laminated portion LP2 is formed with a line portion between the antenna conductor pattern or the coil conductor pattern and the external connection terminal.

By punching the element portion PP21 shown by the alternate long and short dash line from the assembly substrate shown in FIGS. 8 (A) and 8 (B), the element portion PP21 shown in FIGS. 10 (A) and 10 (B) can be obtained. The same applies to the other element parts.

As shown in this embodiment, the number of laminated insulating resin base materials may be different between the connecting portion CP and the first minority laminated portion LP1 connected thereto.

<< Fourth Embodiment >>
In the fourth embodiment, an example of an assembly substrate in which the arrangement structure of the element portion is different from the examples shown so far is shown.

11 (A) and 11 (B) are plan views of the assembly substrate 104 according to the fourth embodiment. FIG. 12 is a plan view of one element portion extracted from the assembly substrate 104 shown in FIG. 11 (B).

The collective substrate 104 includes element portions PP11A, PP11B, PP12A, PP12B, PP13A, PP13B, PP21A, PP21B, PP22A, PP22B, PP23A, PP23B, element portions PP11A-PP11B, and element portions PP12A-PP12B, respectively, which have electrical functions. It is provided with a connecting portion CP having no electrical function, which is connected to a plurality of element portions such as between the element portions PP22A and PP22B. The connecting portion CP is a region having the same number of layers as the second minority laminated portion LP2 that continuously connects the minority laminated portions between the element portions. The plurality of element portions and the plurality of connecting portions CP are regularly arranged. In this example, the portion of the collective substrate 104 other than the plurality of element portions and the connecting portion CP is the residual portion PP0.

In the collective substrate 104 of the present embodiment, two element portions having different orientations of 180 degrees form a pair, and a plurality of pairs of element portions are arranged vertically and horizontally. In this example, in two adjacent element portions (for example, element portions PP11A and PP11B), the second minority laminated portions LP2 are close to each other, and the number of laminated second minority laminated portions LP2 and the number of laminated connected portions CP are the same. Is.

By punching the element portion PP11A shown by the alternate long and short dash line from the assembly substrate 104 shown in FIG. 11B, the element portion PP11A shown in FIG. 12 can be obtained. The same applies to the other element parts.

As in the present embodiment, the orientations of the adjacent element portions may be different from each other, and a plurality of pairs of adjacent element portions may be regularly arranged. According to this structure, the removing portions for forming the connecting portion CP, the first minority laminated portion LP1 and the second minority laminated portion LP2 are more centralized, so that the number of removed portions to be removed from the assembly substrate is reduced. Therefore, the man-hours for removing the removing portion can be reduced.

In the examples shown in FIGS. 11 (A) and 11 (B), two element portions having different orientations by 180 degrees are paired, but a pair may be formed for each of three or more element portions. Even in that case, the second minority laminated portions LP2 may be close to each other in the adjacent element portions, and the connecting portion CP may be present between the second minority laminated portions LP2.

Finally, the description of the embodiments described above is exemplary in all respects and is not restrictive. Modifications and changes can be made as appropriate for those skilled in the art. The scope of the present invention is shown not by the above-described embodiment but by the scope of claims. Further, the scope of the present invention includes modifications from the embodiment within the scope of the claims and within the scope of the claims.

For example, in the above-mentioned example, a single first minority laminated portion LP1 and a single second minority laminated portion LP2 are connected between the main body portion BP and the connecting portion CP. One or both of the minority laminated portion LP1 and the second minority laminated portion LP2 may be provided. Further, in addition to the first minority laminated portion LP1, a minority laminated portion having an intermediate number of laminations between the number of laminated insulating resin base materials of the second minority laminated portion LP2 and the number of laminated insulating resin base materials of the main body portion BP is provided. It may be provided between the main body BP and the connecting CP.

BP ... Main body CP ... Connecting parts EP11A, EP11B, EP11C, EP11D ... Conductor patterns EP12A, EP12B, EP12C ... Conductor pattern LP1 ... First minority laminated portion LP2 ... Second minority laminated portion PP0 ... Residual portions PP11, PP12, PP21, PP22, PP31, PP32 ... Element part PP11A, PP11B, PP12A, PP12B, PP21A, PP21B, PP22A, PP22B, PP23A, PP23B ... Element part PS, PS1, PS2 ... Removal part S1 ... First cut S2 ... Second cut SC ... Suction chucks 11, 12, 13 ... Insulating resin base materials 101-104 ... Assembly substrate 101P ... Laminated body

Claims (6)

A plurality of element portions each having an electrical function and a connecting portion having no electrical function connected to the plurality of element portions are provided, and the element portion and the connecting portion are regularly arranged to form a conductor pattern. It is an aggregate substrate composed of a laminated body in which a plurality of insulating resin base materials including the above-mentioned insulating resin base material are laminated.
The element portion includes a main body portion, a first minority laminated portion in which the number of laminated layers of the insulating resin base material is smaller than that of the main body portion, and the insulating resin base material laminated as compared with the first minority laminated portion. It has a second minority laminate, which is even smaller in number,
The first minority laminated portion and the second minority laminated portion are connected between the main body portion and the connecting portion.
The number of layers of the insulating resin base material in the connecting portion is the same as the number of layers of the insulating resin base material in the second minority laminated portion.
Assembly board. The conductor pattern was formed on the surface of at least one of the first minority laminated portion, the second minority laminated portion, and the connecting portion.
The collective substrate according to claim 1. Among the plurality of element portions, the first minority laminated portions or the second minority laminated portions are close to each other between adjacent element portions.
The collective substrate according to claim 1 or 2. The adjacent element portions have different orientations from each other, and a plurality of pairs of the adjacent element portions are regularly arranged.
The collective substrate according to claim 3. It is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and is connected to a plurality of element portions each having an electrical function and the plurality of element portions. The element portion and the connecting portion are regularly arranged, and the element portion is a laminate of the main body portion and the insulating resin base material as compared with the main body portion. A method for manufacturing an aggregate substrate, which comprises a first minority laminated portion having a small number and a second minority laminated portion having a smaller number of laminated insulating resin base materials than the first minority laminated portion.
Among the plurality of insulating resin base materials, a first notch is formed at the position of the insulating resin base material corresponding to the periphery of the main body portion.
A second notch is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the first minority laminated portion among the plurality of insulating resin base materials.
A laminate made of the plurality of insulating resin base materials is formed, and the laminate is formed.
The first minority laminated portion, the second minority laminated portion, and the removing portion of the connecting portion are peeled from the laminated body at the first cut and the second cut position.
Manufacturing method of assembly board. It is composed of a laminated body in which a plurality of insulating resin base materials including an insulating resin base material on which a conductor pattern is formed are laminated, and is connected to a plurality of element portions each having an electrical function and the plurality of element portions. The element portion and the connecting portion are regularly arranged, and the element portion is a laminate of the main body portion and the insulating resin base material as compared with the main body portion. A method for manufacturing an aggregate substrate, which comprises a first minority laminated portion having a small number and a second minority laminated portion having a smaller number of laminated insulating resin base materials than the first minority laminated portion.
Among the plurality of insulating resin base materials, a first notch is formed at the position of the insulating resin base material corresponding to the periphery of the main body portion.
A second notch is formed at the position of the insulating resin base material corresponding to the periphery of the portion to be the first minority laminated portion among the plurality of insulating resin base materials.
Of the plurality of insulating resin base materials, the adjacent first notch is removed from the insulating resin base material so as to include the connecting portion.
Of the plurality of insulating resin base materials, the space between the second cuts is removed from the insulating resin base material so as to include the connecting portion.
By laminating the plurality of insulating resin base materials, the connecting portion is formed together with the first minority laminated portion and the second minority laminated portion.
Manufacturing method of assembly board.

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