JP6908278B2

JP6908278B2 - Semiconductor devices and electronic devices

Info

Publication number: JP6908278B2
Application number: JP2018052728A
Authority: JP
Inventors: 靜昭増田
Original assignee: NEC Platforms Ltd
Current assignee: NEC Platforms Ltd
Priority date: 2018-03-20
Filing date: 2018-03-20
Publication date: 2021-07-21
Anticipated expiration: 2038-03-20
Also published as: JP2019165146A

Description

本発明は、半導体装置および電子機器に関する。 The present invention relates to semiconductor devices and electronic devices.

関連する技術として、ベアチップを可撓性回路基板と接続し、可撓性回路基板をベアチップの端面に沿って折り曲げてベアチップを可撓性回路基板で包んだ構造を特徴とする三次元実装型半導体装置が特許文献１で提案されている。この半導体装置では、薄型でかつベアチップと外形サイズが同等の小型化を実現できるというメリットがある。
また、その他の関連する技術として、可撓性回路基板で包み込んだ構造から支持体を突出し、突き出した支持体と高熱伝導率材料を介して、放熱部材に放熱する構造を備えた、三次元実装型半導体装置が特許文献２で提案されている。 As a related technique, a three-dimensional mountable semiconductor characterized in a structure in which a bare chip is connected to a flexible circuit board, the flexible circuit board is bent along the end face of the bare chip, and the bare chip is wrapped with the flexible circuit board. The device is proposed in Patent Document 1. This semiconductor device has an advantage that it is thin and can be miniaturized to the same external size as a bare chip.
In addition, as another related technology, a three-dimensional mounting having a structure in which a support is projected from a structure wrapped in a flexible circuit board and heat is dissipated to a heat radiating member via the protruding support and a high thermal conductivity material. A type semiconductor device is proposed in Patent Document 2.

また、その他の関連する技術として可撓性回路基板に開口部を設け、デバイスから可撓性回路基板を伝熱して支持体から放熱部材に放熱する構造を備えた３次元実装型半導体装置が特許文献３で提案されている。 In addition, as another related technology, a three-dimensional mounting type semiconductor device having a structure in which an opening is provided in a flexible circuit board, heat is transferred from the device to the flexible circuit board, and heat is dissipated from a support to a heat radiating member is patented. It is proposed in Document 3.

特開平８―３３５６６３号公報Japanese Unexamined Patent Publication No. 8-335663 国際公開第２０１１／０４３４９３号International Publication No. 2011/043493 特開２０１５−１６２４９７号公報Japanese Unexamined Patent Publication No. 2015-162497

しかしながら、特許文献１に記載の半導体装置は、ベアチップに直接、可撓性回路基板を巻きつけた構造であるため、消費電力の高い半導体ベアチップを用いた場合、熱が外部に逃げにくく温度が上昇し、チップの誤動作が生じるという課題がある。
また、特許文献２に記載の半導体装置では、ベアチップを包み込んでいる可撓性回路基板から支持体が突き出している構造であるため、突き出した支持体により、半導体装置の実装面積が広がるという課題がある。
また、特許文献３に記載の半導体装置では、可撓性回路基板のデバイスの熱が接着シート、絶縁層１、内部配線、絶縁層３、内部配線、絶縁層２の順で支持体まで熱伝導する放熱経路になるため、放熱効率が下がり、熱が逃げにくくなり温度が上昇し、チップの誤動作の原因となることがある。 However, since the semiconductor device described in Patent Document 1 has a structure in which a flexible circuit board is directly wound around a bare chip, when a semiconductor bare chip having high power consumption is used, heat does not easily escape to the outside and the temperature rises. However, there is a problem that a malfunction of the chip occurs.
Further, since the semiconductor device described in Patent Document 2 has a structure in which the support protrudes from the flexible circuit board that encloses the bare chip, there is a problem that the mounting area of the semiconductor device is expanded by the protruding support. be.
Further, in the semiconductor device described in Patent Document 3, the heat of the device of the flexible circuit board is electrically conducted to the support in the order of the adhesive sheet, the insulating layer 1, the internal wiring, the insulating layer 3, the internal wiring, and the insulating layer 2. Since it becomes a heat dissipation path, the heat dissipation efficiency is lowered, heat is hard to escape, the temperature rises, and it may cause a malfunction of the chip.

本発明は上記事情に鑑みてなされたもので、デバイスで発生した熱の放熱性を高めることを目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to improve the heat dissipation of heat generated in the device.

上記課題を解決するために、本発明は下記の構成を有する。
少なくともデバイス、該デバイスの近傍に設けられていて、該デバイスより熱伝導性が高い支持体、可撓性回路基板を有し、前記可撓性回路基板が前記デバイスおよび支持体の少なくとも一部分を包んでいる半導体装置であって、前記可撓性回路基板は、前記支持体、デバイスの少なくともいずれかが露出する開口部を有し、前記開口部に前記可撓性回路基板に含まれる内部配線が露出していることを特徴とする。 In order to solve the above problems, the present invention has the following configuration.
It has at least a device, a support provided in the vicinity of the device, a support having higher thermal conductivity than the device, and a flexible circuit board, and the flexible circuit board covers at least a part of the device and the support. The flexible circuit board has an opening in which at least one of the support and the device is exposed, and the internal wiring included in the flexible circuit board is formed in the opening. It is characterized by being exposed.

本発明によれば、デバイスで発生した熱の放熱性を高めることができる。 According to the present invention, the heat dissipation of the heat generated by the device can be enhanced.

本発明の最少構成にかかる半導体装置の断面図である。It is sectional drawing of the semiconductor device which concerns on the minimum structure of this invention. 本発明の第１実施形態を示す半導体装置の断面図である。It is sectional drawing of the semiconductor device which shows 1st Embodiment of this invention. 第１実施形態の放熱部材を設けない状態における上面図である。It is a top view in the state which the heat radiation member of 1st Embodiment is not provided. 第１実施形態の熱伝導経路を示す断面図である。It is sectional drawing which shows the heat conduction path of 1st Embodiment. 第１実施形態の内部配線の変形例を示す上面図である。It is a top view which shows the modification of the internal wiring of 1st Embodiment. 第１実施形態の半導体装置の製造方法におけるデバイスを示す断面図である。It is sectional drawing which shows the device in the manufacturing method of the semiconductor device of 1st Embodiment. 第１実施形態の半導体装置の製造方法における支持体を示す断面図である。It is sectional drawing which shows the support in the manufacturing method of the semiconductor device of 1st Embodiment. 第１実施形態の半導体装置の製造方法における可撓性回路基板を示す断面図である。It is sectional drawing which shows the flexible circuit board in the manufacturing method of the semiconductor device of 1st Embodiment. 図８の可撓性回路基板の平面図である。It is a top view of the flexible circuit board of FIG. デバイス１、支持体２を図８の可撓性回路基板３に仮搭載をした状態の断面図である。FIG. 5 is a cross-sectional view of a state in which the device 1 and the support 2 are temporarily mounted on the flexible circuit board 3 of FIG. デバイス１、支持体２を図８の可撓性回路基板３に仮搭載をした状態の上面図である。It is a top view of the state where the device 1 and the support 2 are temporarily mounted on the flexible circuit board 3 of FIG. 図８の可撓性回路基板によってデバイス、支持体を包んだ状態の断面図である。It is sectional drawing of the state which the device and the support were wrapped by the flexible circuit board of FIG. 図１２の半導体装置にリフローのためのはんだボールを配置した断面図である。It is sectional drawing which arranged the solder ball for reflow in the semiconductor device of FIG. 本発明の第２実施形態の断面図である。It is sectional drawing of the 2nd Embodiment of this invention. 本発明の第３実施形態の断面図である。It is sectional drawing of the 3rd Embodiment of this invention. 第３実施形態の熱伝導経路を示す断面図である。It is sectional drawing which shows the heat conduction path of 3rd Embodiment. 第４実施形態の断面図である。It is sectional drawing of 4th Embodiment. 第５実施形態の断面図である。It is sectional drawing of 5th Embodiment. 第６実施形態の断面図である。It is sectional drawing of 6th Embodiment. 第7実施形態の断面図である。It is sectional drawing of 7th Embodiment.

本発明の最少構成例にかかる半導体装置について図１を参照して説明する。
符号１はデバイスであって、このデバイス１の周囲には支持体２が設けられ、これらデバイス１、支持体２は可撓性回路基板３に搭載されている。前記可撓性回路基板３は、一のシート状をなす可撓性回路基板３がデバイス１および支持体２を包んでいる半導体装置であり、包んでいる可撓性回路基板３の一部に、可撓性回路基板３の一方の面から他方の面までを貫通する開口部５が開いている。この開口部５には、前記支持体２が外気と接触することができるように露出しているとともに、さらに、可撓性回路基板３の両端から突出した内部配線３Ａが露出している。この内部配線３Ａは、例えば、銅、アルミニウム等の導電体であって、一般に高い熱伝導係数を持っている。
前記支持体２の露出部分および可撓性回路基板３の内部配線３Ａは、直接、大気に接触するか、例えば、図１に破線で示すような熱伝導体からなる放熱部材４に接触させることにより放熱効率が高められるようになっている。 The semiconductor device according to the minimum configuration example of the present invention will be described with reference to FIG.
Reference numeral 1 is a device, and a support 2 is provided around the device 1, and the device 1 and the support 2 are mounted on a flexible circuit board 3. The flexible circuit board 3 is a semiconductor device in which a flexible circuit board 3 in the form of a sheet wraps a device 1 and a support 2, and is a part of the wrapping flexible circuit board 3. , The opening 5 penetrating from one surface to the other surface of the flexible circuit board 3 is open. The support 2 is exposed in the opening 5 so that it can come into contact with the outside air, and internal wiring 3A protruding from both ends of the flexible circuit board 3 is further exposed. The internal wiring 3A is, for example, a conductor such as copper or aluminum, and generally has a high thermal conductivity coefficient.
The exposed portion of the support 2 and the internal wiring 3A of the flexible circuit board 3 are brought into direct contact with the atmosphere or, for example, a heat radiating member 4 made of a heat conductor as shown by a broken line in FIG. This makes it possible to improve the heat dissipation efficiency.

上記最少構成の半導体装置にあっては、デバイスで１発生した熱を支持体２、可撓性回路基板３の内部配線３Ａから、大気に直接、あるいは、放熱部材４を介して放熱することができ、半導体装置の温度上昇を抑えることができる。 In the semiconductor device having the minimum configuration, the heat generated by the device 1 can be dissipated from the support 2 and the internal wiring 3A of the flexible circuit board 3 directly to the atmosphere or through the heat radiating member 4. It is possible to suppress the temperature rise of the semiconductor device.

以下、本発明の実施形態を説明する。図１の例および各実施形態で共通の構成要素には同一符号を付し、重複した説明を省略する。
（第１実施形態）
本発明の第１実施形態にかかる半導体装置が搭載された電子機器について、図面を参照して詳細に説明する。図２は、本発明の第１の実施の形態を示す半導体装置の断面図、図３は放熱部材４を取り外した状態での上面図である。
図２は、可撓性回路基板３を図２が印刷された用紙に見立てた場合に、この紙面の表となる第１の面６の中央にデバイス１を配置し、これを囲むように支持体２を配置しておき、第１の面６を内側にして、紙面の上下をそれぞれ紙面の手前に曲げながらデバイス１、支持体２の上に重ねて包み込むことにより形成された第１実施形態の半導体装置を紙面と直交する方向へ切断した断面を示している。 Hereinafter, embodiments of the present invention will be described. The components common to the example of FIG. 1 and each embodiment are designated by the same reference numerals, and duplicate description will be omitted.
(First Embodiment)
An electronic device equipped with the semiconductor device according to the first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 is a cross-sectional view of a semiconductor device showing the first embodiment of the present invention, and FIG. 3 is a top view of a semiconductor device with the heat radiating member 4 removed.
In FIG. 2, when the flexible circuit board 3 is regarded as the paper on which FIG. 2 is printed, the device 1 is arranged in the center of the first surface 6 which is the front surface of the paper, and is supported so as to surround the device 1. The first embodiment formed by arranging the body 2 and wrapping the body 2 on the device 1 and the support 2 while bending the top and bottom of the paper surface toward the front of the paper surface with the first surface 6 inside. It shows a cross section of the semiconductor device of

図２に示す本発明の第１実施形態の半導体装置は、可撓性回路基板３の第１の面６に第１の外部電極７を備え、第１の面６と表裏の関係にある第２の面８に第２の外部電極９を備えている。また第１の面６に前記デバイス１、支持体２が搭載されている。
前記半導体装置は、さらに、前記開口部５を有する前記可撓性回路基板３と、前記デバイス１の周囲を囲むように配置され、前記可撓性回路基板３の前記開口部５に露出している支持体２と、前記可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と、前記放熱部材４と、前記可撓性回路基板３の内部配線３Ａとで構成されている。前記内部配線３Ａは、例えばＣｕのような電気伝導性および熱伝導性の良好な材料により構成され、前記デバイス１と放熱部材４の間にある導熱シート１２を介して前記放熱部材４に熱伝導するとともに、前記開口部５で放熱部材４と接触することによっても熱伝導している。
ここで、前記放熱部材４は、所定形状の溝を設けることにより放熱面積を確保するヒートシンク部４ａと、このヒートシンク部４ａの下面に一体に設けられて高熱部分（図示の場合は支持体２）と接触する脚部４ｂとを有する。前記放熱部材４は一般的に用いられているヒートシンク(放熱器、放熱板)の他、導熱シート、導熱ゴム、または半導体装置を収容している筐体（一般に金属により構成され、収容された電子機器等からの熱により温度上昇し、大気と接触することにより放熱する）などを含むものとする。 The semiconductor device of the first embodiment of the present invention shown in FIG. 2 includes a first external electrode 7 on a first surface 6 of a flexible circuit board 3, and has a front-back relationship with the first surface 6. A second external electrode 9 is provided on the surface 8 of the second surface. Further, the device 1 and the support 2 are mounted on the first surface 6.
The semiconductor device is further arranged so as to surround the flexible circuit board 3 having the opening 5 and the device 1, and is exposed to the opening 5 of the flexible circuit board 3. The support 2 is, the device 1 electrically connected to the first external electrode 7 of the flexible circuit board 3, the heat radiating member 4, and the internal wiring 3A of the flexible circuit board 3. It is configured. The internal wiring 3A is made of a material having good electrical and thermal conductivity such as Cu, and is thermally conducted to the heat radiating member 4 via a heat conducting sheet 12 between the device 1 and the heat radiating member 4. At the same time, heat is conducted by contacting the heat radiating member 4 at the opening 5.
Here, the heat radiating member 4 is integrally provided with a heat sink portion 4a for securing a heat radiating area by providing a groove having a predetermined shape and a high heat portion (support 2 in the case of drawing) provided integrally with the lower surface of the heat sink portion 4a. Has a leg portion 4b that comes into contact with. The heat radiating member 4 includes a heat sink (radiator, heat radiating plate) that is generally used, a heat conductive sheet, a heat conductive rubber, or a housing (generally composed of metal and housed electrons) that houses a semiconductor device. The temperature rises due to the heat from the equipment, etc., and heat is dissipated when it comes into contact with the atmosphere).

また、図示例の可撓性回路基板３は、前記支持体２の対向する２辺に対応するそれぞれの端部寄りの所定領域で折り曲げて、前記デバイス１と支持体２とを上下から挟むことにより、包み込んだ構造になっている。より詳細には、可撓性回路基板３の所定領域で第１の面６が内側となるように折り曲げることにより、図２に示すように、デバイス１、支持体２を一枚の可撓性回路基板３が上下から挟んだ（包んだ）構造とされている。また、上面にある前記開口部５の部分で放熱部材４に接続または接触させており、さらに、前記開口部５で放熱部材４と可撓性回路基板３の内部配線３Ａとを接触させることにより、半導体装置の実装面積を広げることなく、デバイス１から発生する熱を半導体装置の外部に効率よく逃がす効果を有している。
また前記可撓性回路基板３の第２の面８にある第２の外部電極９には、前記半導体装置が搭載される実装基板１０との接続のための外部端子１１が形成されており、外部端子１１としては例えばＳｎを含んだ金属材料で構成されたいわゆる半田ボール等が好ましい。
上記では、半導体装置の形状としては半田ボールを使用しているが、表面実装型部品の形状であれば、対応できるのは言うまでもない。 Further, the flexible circuit board 3 of the illustrated example is bent at a predetermined region near each end corresponding to two opposing sides of the support 2, and the device 1 and the support 2 are sandwiched from above and below. Therefore, it has a wrapped structure. More specifically, as shown in FIG. 2, the device 1 and the support 2 are made flexible by bending the flexible circuit board 3 so that the first surface 6 is inside in a predetermined region. The circuit board 3 has a structure sandwiched (wrapped) from above and below. Further, the heat radiating member 4 is connected or brought into contact with the heat radiating member 4 at the portion of the opening 5 on the upper surface, and further, the heat radiating member 4 and the internal wiring 3A of the flexible circuit board 3 are brought into contact with each other at the opening 5. It has the effect of efficiently releasing the heat generated from the device 1 to the outside of the semiconductor device without expanding the mounting area of the semiconductor device.
Further, the second external electrode 9 on the second surface 8 of the flexible circuit board 3 is formed with an external terminal 11 for connecting to the mounting board 10 on which the semiconductor device is mounted. As the external terminal 11, for example, a so-called solder ball made of a metal material containing Sn is preferable.
In the above, a solder ball is used as the shape of the semiconductor device, but it goes without saying that the shape of the surface mount type component can be used.

また、図５は本発明の第１実施形態の半導体装置の変形例であり、この変形例の内部配線３Ｂは、図３の内部配線３Ａと形状が異なっている。すなわち内部配線は、必ずしも、四角形でなくても、本発明の構成が実現できることは云うまでもない。 Further, FIG. 5 shows a modification of the semiconductor device according to the first embodiment of the present invention, and the internal wiring 3B of this modification has a shape different from that of the internal wiring 3A of FIG. That is, it goes without saying that the configuration of the present invention can be realized even if the internal wiring is not necessarily a quadrangle.

デバイス１としては例えば半導体ベアチップ、パッケージ化された電子部品、受動部品（コンデンサ、抵抗、インダクタ）などを用いることができる。
支持体２の材料としては、例えば金属（鉄、アルミニウム、アルミニウムを含んだ合金、NiとFeを含んだ合金、NiとCrを含んだ合金、Crを含んだ合金、銅）、シリコン、樹脂材料（ナイロン、ＰＰ、エポキシ樹脂、カーボン、アラミド樹脂）、雲母（マイカ）などを用いることができる。 As the device 1, for example, a semiconductor bare chip, a packaged electronic component, a passive component (capacitor, resistor, inductor) or the like can be used.
Examples of the material of the support 2 include metals (iron, aluminum, alloys containing aluminum, alloys containing Ni and Fe, alloys containing Ni and Cr, alloys containing Cr, copper), silicon, and resin materials. (Nickel, PP, epoxy resin, carbon, aramid resin), mica, and the like can be used.

図４に本実施形態の半導体装置における熱の伝導経路を示す。この図４を参照して、第１実施形態の作用について説明する。
前記デバイス１で発生した熱は、第１の経路として、前記デバイス１の表面と接触している前記可撓性回路基板３に伝わり、その後、前記可撓性回路基板３と接触している前記支持体２へと伝わる。また、第２の経路として、前記デバイス１で発生した熱が、前記デバイス１の表面と接触している前記可撓性回路基板３に伝わり、前記可撓性回路基板３に埋め込まれた銅等の熱電性の良い材料からなる前記内部配線３Ａを伝わり、可撓性回路基板３の開口部５から露出する支持体２の部分（表面に可撓性回路基板３が覆われていない部分）を用いて、半導体装置の実装面積を広げることなく、効率よく体詰へ放熱することができる。 FIG. 4 shows the heat conduction path in the semiconductor device of the present embodiment. The operation of the first embodiment will be described with reference to FIG.
The heat generated in the device 1 is transferred to the flexible circuit board 3 in contact with the surface of the device 1 as a first path, and then the heat generated in the device 1 is in contact with the flexible circuit board 3. It is transmitted to the support 2. Further, as a second path, the heat generated by the device 1 is transferred to the flexible circuit board 3 in contact with the surface of the device 1, and copper or the like embedded in the flexible circuit board 3 is transmitted. The portion of the support 2 (the portion whose surface is not covered with the flexible circuit board 3) is exposed from the opening 5 of the flexible circuit board 3 through the internal wiring 3A made of the material having good thermoelectricity. By using it, it is possible to efficiently dissipate heat to the body packing without expanding the mounting area of the semiconductor device.

以上説明した第１実施形態によれば下記の効果を得ることができる。
第一の効果は可撓性回路基板の開口部に露出している支持体を放熱部材に直接接続することにより、デバイスで発生した熱の放熱性を高めることができる。
第二の効果は放熱性を高めることにより、熱問題で使用が難しい装置にも搭載可能な半導体装置を提供することができる。
第三の効果は実装面積が少なくなることにより、小型化が必要な装置にも搭載可能な半導体装置を提供することができる。
第四の効果は可撓性回路基板の開口部に露出している内部配線を放熱部材に直接接続することにより、デバイスで発生した熱の放熱性を高めることができる。 According to the first embodiment described above, the following effects can be obtained.
The first effect is that the heat radiating property of the heat generated by the device can be enhanced by directly connecting the support exposed in the opening of the flexible circuit board to the heat radiating member.
The second effect is to improve heat dissipation, so that it is possible to provide a semiconductor device that can be mounted on a device that is difficult to use due to heat problems.
The third effect is that the mounting area is reduced, so that it is possible to provide a semiconductor device that can be mounted on a device that requires miniaturization.
The fourth effect is that the heat radiating property of the heat generated by the device can be enhanced by directly connecting the internal wiring exposed in the opening of the flexible circuit board to the heat radiating member.

次に、図６〜図１３を参照して、第１実施形態の半導体装置の製造方法の一例を説明する。
本発明の半導体装置を製造するために、図６に示すようなデバイス１（外形サイズ：約１３ｍｍ×１３ｍｍ×高さ０．７ｍｍ）を１個と図７に示すような中心に穴が開いている支持体２（外形サイズ：約２３ｍｍ×１７ｍｍ×厚さ０．７ｍｍ）を１個と図８に示すような、例えば、第１絶縁層１３、第２絶縁層１４、第３絶縁層１５からなる配線層数が２層の可撓性回路基板３（外形サイズ：約１７ｍｍ×３６ｍｍ×厚さ０．１４ｍｍ）を１個と、本発明の半導体装置の外部端子として用いる半田ボールとして、直径約０．８ｍｍのＳｎＡｇＣｕはんだボールを約１００個用意した。本例では、可撓性回路基板３については２層構成で説明しているが、配線層数が１層または、３層以上の多層の可撓性回路基板３でも構成できることは言うまでもない。
また、図９は可撓性回路基板３を上面から見た図である。 Next, an example of the method for manufacturing the semiconductor device of the first embodiment will be described with reference to FIGS. 6 to 13.
In order to manufacture the semiconductor device of the present invention, one device 1 (external size: about 13 mm × 13 mm × height 0.7 mm) as shown in FIG. 6 and a hole are formed in the center as shown in FIG. One support 2 (external size: about 23 mm × 17 mm × thickness 0.7 mm) and as shown in FIG. 8, for example, from the first insulating layer 13, the second insulating layer 14, and the third insulating layer 15. A flexible circuit board 3 (external size: about 17 mm × 36 mm × thickness 0.14 mm) having two wiring layers is used as a solder ball used as an external terminal of the semiconductor device of the present invention, and has a diameter of about about 17 mm. About 100 0.8 mm SnAgCu solder balls were prepared. In this example, the flexible circuit board 3 is described as having a two-layer configuration, but it goes without saying that the flexible circuit board 3 having a single layer or three or more layers can also be configured.
Further, FIG. 9 is a view of the flexible circuit board 3 as viewed from above.

また、図８に示すように可撓性回路基板３の第１の面６にはあらかじめ支持体２の表面およびデバイス１の表面と接着させる箇所に対応する部分に接着層として厚さ約２５μｍの熱可塑性の接着シート１６を貼っておいた。熱可塑性樹脂には、約１５０℃で接着できる材料を用いた。
先ず初めに、可撓性回路基板３の第一の面６の第１の外部電極７上にフラックスまたはクリーム半田を塗布し、フリップチップ実装マウンター、およびチップマウンターを用いて、デバイス１、支持体２を可撓性回路基板３に仮搭載をした。図１０は以上の工程までの断面図、図１１は以上の工程までの上面図になる。 Further, as shown in FIG. 8, the first surface 6 of the flexible circuit board 3 has a thickness of about 25 μm as an adhesive layer on the surface of the support 2 and the portion corresponding to the portion to be bonded to the surface of the device 1 in advance. A thermoplastic adhesive sheet 16 was attached. As the thermoplastic resin, a material that can be adhered at about 150 ° C. was used.
First of all, flux or cream solder is applied on the first external electrode 7 of the first surface 6 of the flexible circuit board 3, and the device 1 and the support are used by using the flip chip mounting mounter and the chip mounter. 2 was temporarily mounted on the flexible circuit board 3. FIG. 10 is a cross-sectional view up to the above steps, and FIG. 11 is a top view up to the above steps.

次に、半導体装置を１８０℃に加熱したヒーターステージ上に吸着固定させ、加圧ツールを用いて可撓性回路基板３を支持体２の２辺の辺１７で折り曲げ、デバイス１と支持体２の表面に接着させ、デバイス１と支持体２の周りに可撓性回路基板３を接着させた図１２のようなパッケージを作製した。
このようにして作製したパッケージの外部電極に、半導体装置の外部端子となるはんだボールをフラックスで仮搭載した後、リフロー炉に投入してはんだ接続を行い、図１３に示すパッケージを完成させた。 Next, the semiconductor device is adsorbed and fixed on a heater stage heated to 180 ° C., and the flexible circuit board 3 is bent at the two sides 17 of the support 2 using a pressurizing tool, and the device 1 and the support 2 are bent. A package as shown in FIG. 12 was prepared by adhering to the surface of the device 1 and adhering the flexible circuit board 3 around the device 1 and the support 2.
A solder ball, which is an external terminal of the semiconductor device, was temporarily mounted on the external electrode of the package thus produced by flux, and then put into a reflow furnace for solder connection to complete the package shown in FIG.

その後、導熱シート１２を配置し、可撓性回路基板３の開口部５の部分を通して見える支持体２と放熱部材４とを接触させ、図２の第１実施形態に示すような半導体装置を完成させた。
次に、完成した半導体装置はマウンターを用いて、実装基板１０に搭載し、リフロー装置を用いて、これらの半導体装置を実装基板１０とはんだ接続させた。 After that, the heat conductive sheet 12 is arranged, and the support 2 visible through the opening 5 of the flexible circuit board 3 and the heat radiating member 4 are brought into contact with each other to complete the semiconductor device as shown in the first embodiment of FIG. I let you.
Next, the completed semiconductor device was mounted on the mounting board 10 using a mounter, and these semiconductor devices were solder-connected to the mounting board 10 using a reflow device.

以上、本発明の実施例について述べたが、本名発明は前記実施例に限定されるものではなく、本発明の技術的思想を逸脱しない範囲でさらに多くの改変を施しえるのは言うまでも無いことである。 Although the examples of the present invention have been described above, it goes without saying that the real name invention is not limited to the above-mentioned examples, and more modifications can be made without departing from the technical idea of the present invention. That is.

（第２実施形態）
図１４は、本発明の第２実施形態を示す半導体装置の断面図である。なお第１実施形態と共通の構成には同一符号を付し、説明を簡略化する。
図１４に示す本発明の第２実施形態の半導体装置は、第１の面６に第１の外部電極７を有し、第２の面８に第２の外部電極９を有し、開口部５が設けられた可撓性回路基板３と、デバイス１の周囲を囲むように配置され可撓性回路基板３の開口部５と、開口部１８に露出しているデバイス１と、可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と放熱部材４と、開口部５および開口部１８を介して放熱部材４と接触している可撓性回路基板３の内部配線３Ａとで構成されている。
前記放熱部材４は、ヒートシンク部４ａの下面に設けられた端部の脚部４ｂに加え、中央にも脚部４ｃを有している。
また可撓性回路基板３の第２の面８にある第２の外部電極９には、実装基板１０との接続のための外部端子１１が形成されている。 (Second Embodiment)
FIG. 14 is a cross-sectional view of a semiconductor device showing a second embodiment of the present invention. The same reference numerals are given to the configurations common to those of the first embodiment, and the description will be simplified.
The semiconductor device of the second embodiment of the present invention shown in FIG. 14 has a first external electrode 7 on the first surface 6 and a second external electrode 9 on the second surface 8 and has an opening. The flexible circuit board 3 provided with the 5 and the opening 5 of the flexible circuit board 3 arranged so as to surround the periphery of the device 1 and the device 1 exposed to the opening 18 are flexible. A flexible circuit board 3 in contact with a device 1 electrically connected to a first external electrode 7 of a circuit board 3, a heat radiating member 4, and a heat radiating member 4 via an opening 5 and an opening 18. It is composed of internal wiring 3A.
The heat radiating member 4 has legs 4c at the center in addition to the legs 4b at the ends provided on the lower surface of the heat sink 4a.
Further, an external terminal 11 for connecting to the mounting substrate 10 is formed on the second external electrode 9 on the second surface 8 of the flexible circuit board 3.

このように放熱部材４の中央の脚部４ｂ、４ｃを開口部５の間だけでなく、デバイス１の上部にある開口部１８の部分からデバイス１、および、内部配線３Ａに接触させることにより、デバイス１から発生する熱を半導体装置の外部に効率よく逃がすことができる。すなわち、本実施形態では、より多くの放熱ルート（熱伝導経路）を設けることによって放熱効率を高めることができる。 In this way, the central legs 4b and 4c of the heat radiating member 4 are brought into contact with the device 1 and the internal wiring 3A not only between the openings 5 but also from the opening 18 at the top of the device 1. The heat generated from the device 1 can be efficiently released to the outside of the semiconductor device. That is, in the present embodiment, the heat dissipation efficiency can be improved by providing more heat dissipation routes (heat conduction paths).

また、図１４の第２実施形態では、放熱部材４とデバイス１、支持体２、可撓性回路基板３との間には、図２に示す第１実施形態で用いられていた導熱シート１２を介在させていないが、第１実施形態と同様に導熱シート１２を介在ざせる構造にすることができるのは言うまでもない。 Further, in the second embodiment of FIG. 14, the heat conductive sheet 12 used in the first embodiment shown in FIG. 2 is between the heat radiating member 4 and the device 1, the support 2, and the flexible circuit board 3. However, it goes without saying that the structure can be configured such that the heat conductive sheet 12 is interposed as in the first embodiment.

（第３実施形態）
図１５は、本発明の第３実施形態を示す半導体装置の断面図である。図１５に示す本発明の第３実施形態の半導体装置は、第１の面６に第１の外部電極７を有し、また第２の面８に第２の外部電極９を有し、開口部５が設けられた可撓性回路基板３を有する。この半導体装置は、さらに、デバイス１の周囲を囲むように配置され可撓性回路基板３の開口部５に露出している支持体２と、可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と放熱部材４と、開口部５で放熱部材４と接触している可撓性回路基板３の内部配線３Ａとを備えた構成とされている。 (Third Embodiment)
FIG. 15 is a cross-sectional view of a semiconductor device showing a third embodiment of the present invention. The semiconductor device of the third embodiment of the present invention shown in FIG. 15 has a first external electrode 7 on the first surface 6 and a second external electrode 9 on the second surface 8 and has an opening. It has a flexible circuit board 3 provided with a portion 5. The semiconductor device further includes a support 2 which is arranged so as to surround the periphery of the device 1 and is exposed in the opening 5 of the flexible circuit board 3, and a first external electrode 7 of the flexible circuit board 3. The device 1 is electrically connected to the device 1, the heat radiating member 4, and the internal wiring 3A of the flexible circuit board 3 which is in contact with the radiating member 4 at the opening 5.

このように開口部５を実装基板１１側にして、開口部５で、内部配線３Ａと放熱部材４の脚部４ｂとを接続させ、また、支持体２と実装基板１１を放熱部材４とで接続することにより、半導体装置の高さを方向への寸法を大きくすることなくデバイス１の発熱を外部に効率よく放熱する効果を有している。 In this way, the opening 5 is set to the mounting board 11 side, the internal wiring 3A and the leg portion 4b of the heat radiating member 4 are connected by the opening 5, and the support 2 and the mounting board 11 are connected to the heat radiating member 4. By connecting, it has the effect of efficiently dissipating the heat generated by the device 1 to the outside without increasing the height of the semiconductor device in the direction.

さらに放熱部材４と内部配線３Ａとを接触させることにより、デバイス１から発生する熱を半導体装置の外部へのより多くの放熱ルート（熱伝導経路）を設けることにより放熱効率を高めることができる。 Further, by bringing the heat radiating member 4 into contact with the internal wiring 3A, the heat radiating efficiency can be improved by providing more heat radiating routes (heat conduction paths) for the heat generated from the device 1 to the outside of the semiconductor device.

図１６に本実施形態の半導体装置における熱の流路を示す。デバイス１で発生した熱は、デバイス１の表面と接触している可撓性回路基板３に伝わり、その後、可撓性回路基板３と接触している支持体２、内部配線３Ａへと伝わり、最終的に可撓性回路基板３の開口部５の支持体２の部分（表面に可撓性回路基板３が覆われていない部分）と内部配線３Ａの部分に接触している放熱部材４を通り、実装基板１０に放熱することができる。 FIG. 16 shows a heat flow path in the semiconductor device of this embodiment. The heat generated in the device 1 is transferred to the flexible circuit board 3 in contact with the surface of the device 1, and then transferred to the support 2 and the internal wiring 3A in contact with the flexible circuit board 3. Finally, the heat radiating member 4 that is in contact with the portion of the support 2 (the portion whose surface is not covered with the flexible circuit board 3) of the opening 5 of the flexible circuit board 3 and the portion of the internal wiring 3A. As you can see, heat can be dissipated to the mounting board 10.

（第４実施形態）
図１７は、本発明の第４実施形態を示す半導体装置の断面図である。
図１７に示す本発明の第１の実施形態の半導体装置では、第１の面６に第１の外部電極７があり、第２の面８に第２の外部電極９があり、開口部５が設けられた可撓性回路基板３と、デバイス１の周囲を囲むように配置され可撓性回路基板３の開口部５に露出している支持体２と、可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と放熱部材４と、開口部５で放熱部材４と接触している可撓性回路基板３の内部配線３Ａとで構成されている。 (Fourth Embodiment)
FIG. 17 is a cross-sectional view of a semiconductor device showing a fourth embodiment of the present invention.
In the semiconductor device of the first embodiment of the present invention shown in FIG. 17, the first surface 6 has the first external electrode 7, the second surface 8 has the second external electrode 9, and the opening 5 The flexible circuit board 3 provided with the above, the support 2 arranged so as to surround the periphery of the device 1 and exposed in the opening 5 of the flexible circuit board 3, and the first flexible circuit board 3. It is composed of a device 1 electrically connected to the external electrode 7 of 1 and a heat radiating member 4, and an internal wiring 3A of a flexible circuit board 3 which is in contact with the radiating member 4 at an opening 5.

このように、開口部５をデバイス１と実装基板１０側の間に設けることにより、内部配線３Ａと放熱部材４を接続させ、また、デバイス１と実装基板１０を放熱部材４とで接続することとで、半導体装置の高さを方向への寸法を大きくすることなくデバイス１で発生した熱を外部に効率よく放熱する効果を有している。
さらに放熱部材４を内部配線３Ａに接触させることにより、デバイス１から発生する熱を半導体装置の外部へより多くの放熱ルート（熱伝導経路）を設けることにより放熱効率を高めることができる。
本実施形態における放熱経路については、第３実施形態と同様であるため、詳細な説明を省略する。 By providing the opening 5 between the device 1 and the mounting board 10 side in this way, the internal wiring 3A and the heat radiating member 4 are connected, and the device 1 and the mounting board 10 are connected by the heat radiating member 4. As a result, it has the effect of efficiently dissipating the heat generated by the device 1 to the outside without increasing the height of the semiconductor device in the direction.
Further, by bringing the heat radiating member 4 into contact with the internal wiring 3A, the heat radiating efficiency can be improved by providing more heat radiating routes (heat conduction paths) to the outside of the semiconductor device for the heat generated from the device 1.
Since the heat dissipation path in this embodiment is the same as that in the third embodiment, detailed description thereof will be omitted.

（第５実施形態）
図１８は、本発明の第５実施形態を示す半導体装置の断面図である。
図１８に示す本発明の第１の実施形態の半導体装置では、第１の面６に第１の外部電極７があり、第２の面８に第２の外部電極９があり、開口部５が設けられた可撓性回路基板３と、デバイス１の周囲を囲むように配置され可撓性回路基板３の開口部５に露出している支持体２と、可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と放熱部材４と、開口部５で放熱部材４と接触している可撓性回路基板３の内部配線３Ａで構成されている。 (Fifth Embodiment)
FIG. 18 is a cross-sectional view of a semiconductor device showing a fifth embodiment of the present invention.
In the semiconductor device of the first embodiment of the present invention shown in FIG. 18, the first surface 6 has the first external electrode 7, the second surface 8 has the second external electrode 9, and the opening 5 The flexible circuit board 3 provided with the above, the support 2 arranged so as to surround the periphery of the device 1 and exposed in the opening 5 of the flexible circuit board 3, and the first flexible circuit board 3. It is composed of a device 1 electrically connected to the external electrode 7 of 1 and a heat radiating member 4, and an internal wiring 3A of a flexible circuit board 3 which is in contact with the radiating member 4 at an opening 5.

このように開口部５をデバイス１及び支持体２と実装基板１１側の間に設けることにより、内部配線３Ａと放熱部材４を接続させ、また、デバイス１及び支持体２の両方で実装基板１１と放熱部材４とへ接続することができ、半導体装置の高さを上げることなくデバイス１の発熱を外部に効率よく放熱する効果を有している。
さらに放熱部材４と内部配線３Ａに接触させることにより、デバイス１から発生する熱を半導体装置の外部へのより多くの放熱ルート（熱伝導経路）を設けることにより放熱効率を高めることができる。
本実施形態における放熱経路については、前述の各実施形態と同様であるため、詳細な説明を省略する。 By providing the opening 5 between the device 1 and the support 2 and the mounting board 11 side in this way, the internal wiring 3A and the heat radiating member 4 are connected, and the mounting board 11 is provided by both the device 1 and the support 2. And can be connected to the heat radiating member 4, and has the effect of efficiently radiating the heat generated by the device 1 to the outside without raising the height of the semiconductor device.
Further, by bringing the heat radiating member 4 into contact with the internal wiring 3A, the heat radiating efficiency can be improved by providing more heat radiating routes (heat conduction paths) to the outside of the semiconductor device for the heat generated from the device 1.
Since the heat dissipation path in this embodiment is the same as that in each of the above-described embodiments, detailed description thereof will be omitted.

（第６実施形態）
図１９は、本発明の第６実施形態を示す半導体装置の断面図である。
図１９に示す本発明の第６実施形態の半導体装置では、第１の面６に第１の外部電極７があり、第２の面８に第２の外部電極９があり、開口部５が設けられた可撓性回路基板３と、デバイス１の周囲を囲むように配置され可撓性回路基板３の開口部５に露出している支持体２と、可撓性回路基板３の第１の外部電極７と電気的に接続されたデバイス１と放熱部材４とデバイス１と放熱部材４の間にある導熱シート１２と、開口部５で放熱部材４と接触している可撓性回路基板３の内部配線３Ａとで構成されている。
このように開口部５を上面部及び下面部の両方に設け、その上面の開口部５の部分で放熱部材４と支持体２、下面の開口部５の部分で支持体２と実装基板１１側と放熱部材４とで接続することにより、半導体装置の高さ寸法を大きくすることなくデバイス１の熱を外部に効率よく放熱することができる。 (Sixth Embodiment)
FIG. 19 is a cross-sectional view of a semiconductor device showing a sixth embodiment of the present invention.
In the semiconductor device of the sixth embodiment of the present invention shown in FIG. 19, the first surface 6 has a first external electrode 7, the second surface 8 has a second external electrode 9, and the opening 5 has an opening 5. The flexible circuit board 3 provided, the support 2 arranged so as to surround the periphery of the device 1 and exposed in the opening 5 of the flexible circuit board 3, and the first flexible circuit board 3. A flexible circuit board that is in contact with the heat-dissipating member 4 through the opening 5 and the heat-conducting sheet 12 between the device 1 and the heat-dissipating member 4 electrically connected to the external electrode 7 and the device 1 and the heat-dissipating member 4. It is composed of 3 internal wirings 3A.
In this way, the openings 5 are provided on both the upper surface portion and the lower surface portion, and the heat radiating member 4 and the support 2 are provided at the upper surface opening 5 and the support 2 and the mounting substrate 11 side are provided at the lower surface opening 5. By connecting the heat-dissipating member 4 and the heat-dissipating member 4, the heat of the device 1 can be efficiently dissipated to the outside without increasing the height dimension of the semiconductor device.

さらに放熱部材４へと内部配線３Ａを接触させることにより、デバイス１から発生する熱を半導体装置の外部へのより多くの放熱ルート（熱伝導経路）を設けることにより放熱効率を高めることができる。
本実施形態における放熱経路については、各実施形態と同様であるため、詳細な説明を省略する。 Further, by bringing the internal wiring 3A into contact with the heat radiating member 4, the heat radiating efficiency can be improved by providing more heat radiating routes (heat conduction paths) for the heat generated from the device 1 to the outside of the semiconductor device.
Since the heat dissipation path in this embodiment is the same as that in each embodiment, detailed description thereof will be omitted.

（第７実施形態）
図２０は、本発明の第７実施形態を示す半導体装置の断面図である。
図２０に示す本発明の第７実施形態の半導体装置では、本発明の第１実施形態と第３実施形態３で説明した半導体装置を用い、同一の半導体装置または異なる種類の半導体装置を組み合わせて複数積層した３次元実装構造になっている。
本構造とすることにより、半導体装置を並列に２次元実装した場合と比較して実装面積を削減することができ、且つ放熱効率の優れた半導体装置を得ることができる。 (7th Embodiment)
FIG. 20 is a cross-sectional view of a semiconductor device showing a seventh embodiment of the present invention.
In the semiconductor device of the seventh embodiment of the present invention shown in FIG. 20, the semiconductor devices described in the first embodiment and the third embodiment of the present invention are used, and the same semiconductor device or different types of semiconductor devices are combined. It has a three-dimensional mounting structure in which a plurality of layers are stacked.
With this structure, it is possible to reduce the mounting area as compared with the case where the semiconductor devices are two-dimensionally mounted in parallel, and it is possible to obtain a semiconductor device having excellent heat dissipation efficiency.

また、図の説明は割愛するが、図２０の第７実施形態と同様に、第１、第２実施形態のいずれかを上側に、第３から第５実施形態のいずれかを下側にし、複数積層した同様の組み合わせの３次元実装構造にすることができるのは、言うまでもない。 Further, although the description of the figure is omitted, as in the seventh embodiment of FIG. 20, either the first or second embodiment is on the upper side, and any of the third to fifth embodiments is on the lower side. Needless to say, it is possible to form a three-dimensional mounting structure in which a plurality of layers are laminated in the same manner.

（第８実施形態）
また、図の説明は割愛するが、これまでに述べた本発明の半導体装置を用いて電子機器を組み立てれば、従来よりも放熱効果が高くなるため低コストで、動作温度が問題になりやすい小型の電子機器に組み込むことができる。なお、本願明細書において、電子機器とは、プリント回路基板、プリント回路基板を搭載した大規模ＬＳＩのみならず、これらを一部に備えた電子機器を包含するものとする。 (8th Embodiment)
Further, although the explanation of the figure is omitted, if an electronic device is assembled using the semiconductor device of the present invention described so far, the heat dissipation effect is higher than before, so that the cost is low and the operating temperature tends to be a problem. Can be incorporated into electronic devices. In the specification of the present application, the electronic device includes not only a printed circuit board and a large-scale LSI on which the printed circuit board is mounted, but also an electronic device including a part thereof.

以上、本発明の実施形態について図面を参照して詳述したが、本発明は上記実施形態に限定されることなく、特許請求の範囲に記載した発明の範囲内で、種々の変形が可能であり、それらも本発明の範囲内に含まれるものであることはいうまでもない。 Although the embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the invention described in the claims. Needless to say, they are also included in the scope of the present invention.

本発明は、半導体装置、ＬＳＩ、あるいはこれらを利用した多くの電子機器で使用することが考えられるが、例えば、特に小型化、高集積化の必要がある、家庭用ゲーム機、医療機器、ワークステーション、サーバー、パーソナルコンピュータ、カーナビゲーション、携帯電話、ロボットなどが好適である。 The present invention may be used in semiconductor devices, LSIs, or many electronic devices using these. For example, home-use game machines, medical devices, and workstations that require particularly small size and high integration. Stations, servers, personal computers, car navigation systems, mobile phones, robots and the like are suitable.

１デバイス
２支持体
３可撓性回路基板
３Ａ３Ｂ内部配線
４放熱部材
４ａヒートシンク部
４ｂ４ｃ脚部
５開口部
６第１の面
７第１の外部電極
８第２の面
９第２の外部電極
１０実装基板
１１外部端子（はんだボール）
１２導熱シート
１３第１絶縁層
１４第２絶縁層
１５第３絶縁層
１６接着シート 1 Device 2 Support 3 Flexible circuit board 3A 3B Internal wiring 4 Heat dissipation member 4a Heat sink 4b 4c Leg 5 Opening 6 First surface 7 First external electrode 8 Second surface 9 Second external electrode 10 Mounting board 11 External terminal (solder ball)
12 Heat-conducting sheet 13 1st insulating layer 14 2nd insulating layer 15 3rd insulating layer 16 Adhesive sheet

Claims

It has at least a device, a support provided in the vicinity of the device, a support having higher thermal conductivity than the device, and a flexible circuit board, and the flexible circuit board covers at least a part of the device and the support. It ’s a semiconductor device
The flexible circuit board has an opening in which at least one of the support and the device is exposed, and the internal wiring contained in the flexible circuit board is exposed in the opening.
The flexible circuit board is an integral substrate that covers one surface of the support and is bent in a region near the end outside the region covering the one surface to cover the other surface of the support. The opening is formed through the region covering the other surface .
The support exposed in the opening of the flexible circuit board, the internal wiring exposed in the opening of the flexible circuit board, and the heat radiating member inserted in the opening come into contact with each other.
The internal wiring is a semiconductor device characterized in that the upper surface and the lower surface are exposed in the opening.

The semiconductor device according to claim 1 , wherein at least one of the device and the support is exposed in the opening.

The semiconductor device according to claim 2, wherein at least one of the device and the support exposed in the opening is in contact with the heat radiating member.

Claims 1 to 3 characterized in that the support and the internal wiring exposed in the opening of the flexible circuit board on the mounting board side are in contact with the mounting board via a heat radiating member. The semiconductor device according to any one of the items.

Any of claims 1 to 3 , wherein the device and internal wiring exposed in the opening of the flexible circuit board on the mounting board side are in contact with the mounting board via a heat radiating member. The semiconductor device according to one item.

The invention according to any one of claims 1 to 3 , wherein the device, the support, and the internal wiring exposed in the opening of the flexible circuit board on the mounting board side are in contact with the mounting board with a heat radiating member. Semiconductor equipment.

A semiconductor device according to any one of claims 1 to 6 , wherein a plurality of the same or different types are combined and laminated.

The support is one of Fe, an alloy containing Ni and Fe, aluminum, an alloy containing aluminum, copper, an alloy containing Ni and Cr, an alloy containing Cr, silicon, a resin material, mica, and mica. The semiconductor device according to any one of claims 1 to 7 , wherein the semiconductor device is made of the above-mentioned material.

An electronic device equipped with the semiconductor device according to any one of claims 1 to 8.