JP6913709B2 - Photodetector - Google Patents

Description

The present invention relates to a photodetector including a Fabry-Perot interference filter.

As a conventional photodetector, for example, Patent Document 1 describes a device in which a light receiving element is arranged on a support substrate and a Fabry-Perot interference filter is adhered on the light receiving element via an adhesive layer. In such a photodetector, a bonding pad for electrical connection of the light receiving element is arranged on the upper surface of the light receiving element. The Fabry-Perot interference filter is arranged on the upper surface of the light receiving element at a distance from the bonding pad when viewed from the light transmission direction of the Fabry-Perot interference filter.

Japanese Unexamined Patent Publication No. 2012-173347

However, in the above-mentioned photodetector, the bonding pad needs to be arranged outside the Fabry-Perot interference filter when viewed from the light transmission direction of the Fabry-Perot interference filter, which hinders the miniaturization of the photodetector. There is a risk.

Therefore, an object of the present invention is to provide a photodetector capable of miniaturization.

The photodetector according to one embodiment of the present invention is arranged on a wiring board having a main surface, a thermistor arranged on the main surface of the wiring board, and electrically connected to the wiring board. It has a photodetector, a support member arranged around the photodetector and thermistor on the main surface of the wiring board, and a light transmission region, and is arranged on the main surface of the wiring board via the support member. The support member supports the fabric perot interference filter in the peripheral region of the light transmission region, and the support member is peripheral when viewed from the light transmission direction in the light transmission region. The fabric perot interference filter was fixed to the substrate and the substrate, forming a first opening and a second opening communicating the inside of the surrounding region and the outside of the surrounding region while being arranged so as to sandwich the region. It has a first mirror and a second mirror that faces the first mirror via a gap and is movable with respect to the first mirror, and a plurality of photodetectors and thermistors are provided on the main surface of the wiring board. Arranged in the region sandwiched between the support members, the photodetector is connected to the wire passing through the first opening, and the thermistor is connected to the wire passing through the second opening.

In the above-mentioned photodetector, the support member may be rod-shaped, and the number of support members may be two.

In the above-mentioned photodetector, the Fabry-Perot interference filter has a bonding pad, and the support member may be arranged at a position corresponding to the bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction.

In the above-mentioned photodetector, the support member may be separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction.

According to the present invention, it is possible to provide a photodetector capable of miniaturization.

It is an exploded perspective view of the photodetector which concerns on embodiment. It is sectional drawing of Fabry Perot interference filter. It is a top view which shows the manufacturing process of a photodetector. It is a top view which shows the manufacturing process of the photodetector which follows FIG. It is a top view which shows the manufacturing process of the photodetector which follows FIG. It is a side view corresponding to FIG. 5 (B). 5 (B) is a cross-sectional view taken along line VII-VII and an enlarged view of a part thereof. It is a top view which shows the manufacturing process of the photodetector which follows FIG. It is a top view which shows the modification of the light detection apparatus. It is a top view which shows the modification of the light detection apparatus.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same or corresponding parts are designated by the same reference numerals, and overlapping parts are omitted.

[First Embodiment]
[Spectroscopic sensor]
As shown in FIG. 1, the spectroscopic sensor (photodetector) 1 includes a wiring substrate 2, a photodetector 3, a plurality of spacers (support members) 4, and a Fabry-Perot interference filter 10. .. The wiring board 2 has a main surface 2A. On the main surface 2A of the wiring board 2, a mounting portion 2a on which the photodetector 3 is mounted, a plurality of electrode pads (bonding pads) 2b, and a mounting portion 2c on which a temperature compensation element such as a thermistor is mounted are mounted. It is provided. One of the electrode pads 2b is electrically connected to the mounting portion 2a by the wiring 2d. The other electrode pads 2b are electrically connected to the mounting portion 2c by the wiring 2d, and are used to electrically connect the thermistor or the like mounted on the mounting portion 2c to the outside of the spectroscopic sensor 1. The photodetector 3 is, for example, an infrared detector, which is a quantum sensor using InGaAs or the like, or a thermal sensor using a thermopile or a bolometer. When detecting each region of ultraviolet (UV), visible, and near infrared, a silicon photodiode or the like can be used as the photodetector 3.

The plurality of spacers 4 are fixed on the main surface 2A of the wiring board 2, and the Fabry-Perot interference filter 10 is fixed on the plurality of spacers 4. In this way, the plurality of spacers 4 support the Fabry-Perot interference filter 10, and the Fabry-Perot interference filter 10 is arranged on the main surface 2A of the wiring board 2. At this time, in order to suppress the influence of thermal strain on the Fabry-Perot interference filter 10, it is preferable that the plurality of spacers 4 and the Fabry-Perot interference filter 10 are fixed by an adhesive portion made of a flexible resin material. .. As the resin material constituting the adhesive portion, for example, various resin materials such as silicone-based, urethane-based, epoxy-based, acrylic-based, and hybrid can be used. Preferably, as the resin material, a material having an elastic modulus (or Young's modulus) of 0.1 GPa or less is used. Further, it is desirable that the resin material is selected from those cured at room temperature or at low temperature.

Further, as the material of the plurality of spacers 4, for example, silicon, ceramic, quartz, glass, plastic or the like can be used. In particular, in order to alleviate the difference in thermal expansion coefficient between the Fabry-Perot interference filter 10 and the portion in contact with the plurality of spacers 4, the material of the plurality of spacers 4 has a heat as compared with the material of the Fabry-Perot interference filter 10. It is preferable that the material has the same or small expansion coefficient. As an example, when the Fabry-Perot interference filter 10 is formed on a silicon substrate, it is desirable that the plurality of spacers 4 are formed of a material having a small coefficient of thermal expansion such as quartz or silicon. Instead of forming the wiring board 2 and the spacer 4 as separate bodies as described above, a portion serving as the spacer 4 may be integrally formed on the surface of the wiring board 2. The photodetector 3 faces the light transmission region 11 of the Fabry-Perot interference filter 10 between the wiring substrate 2 and the Fabry-Perot interference filter 10, and detects the light transmitted through the Fabry-Perot interference filter 10. A temperature sensor such as a thermistor may be installed on the wiring board 2.

As will be described later, in the wiring board 2, the photodetector 3, the plurality of spacers 4, and the Fabry-Perot interference filter 10, the wiring board 2 is fixed on the stem and the light transmission region 11 of the Fabry-Perot interference filter 10 is the light of the cap. It is housed in a CAN package facing the transmission window. The electrode pads 2b of the wiring board 2 and the terminals 12 and 13 of the Fabry-Perot interference filter 10 are electrically connected to each of the lead pins penetrating the stem by wire bonding. Input / output of an electric signal to the photodetector 3 is performed via a lead pin, an electrode pad 2b, and a mounting portion 2a. The voltage is applied to the Fabry-Perot interference filter 10 via the lead pin and the terminals 12 and 13.

Hereinafter, the arrangement of the spacer 4 will be described. The spacer 4 is a region surrounding the light transmission region 11 (a region that does not include the light transmission region 11 and includes the light transmission region 11 when viewed from the light transmission direction in the light transmission region 11 of the fabric perot interference filter 10. It is arranged so as to have an opening that communicates between the inside of the surrounding area) and the outside of this surrounding area. Here, in the present specification, when a certain element (for example, spacer 4) has an opening, it is not an annular shape that surrounds the region (for example, a light transmitting region 11) without a gap, but a cut at at least one place. Means to have. The relationship between the length of the element and the opening is not particularly limited. For example, if the spacer 4 is provided in a part of the circumference of a figure such as a circle or a polygon surrounding the light transmitting region 11 and the spacer 4 is not provided in all of the spacer 4, the spacer 4 has an opening. It is assumed that you are doing. In order to stably install the Fabry-Perot interference filter 10, it is preferable that the spacers 4 are arranged at least on both sides of the light transmission region 11 when viewed from the light transmission direction. As a specific example of the spacer 4 having an opening, when two spacers 4 extending linearly are arranged in parallel with each other (see FIG. 4A), a columnar spacer 4 is provided at each of the four vertices of the quadrangle. The case where the spacers 4 are arranged in a U shape (see FIG. 10A) and the like are included.

In the spectroscopic sensor 1 of the present embodiment, two linear spacers 4A and 4B arranged in parallel with each other are used as the spacer 4. These spacers 4A and 4B have an opening A1 indicated by a chain double-dashed line between the ends of the spacers 4A and 4B on the same side. In other words, the spacers 4A and 4B and the two openings A1 and A1 form a quadrangle surrounding the light transmitting region 11. Spacers 4A and 4B are provided on the two sides of this quadrangle, spacers 4A and 4B are not provided on the other two sides, and openings A1 and A1 are formed.

Further, in the spectroscopic sensor 1, the electrode pad 2b connected to the mounting portion 2a is arranged on the main surface 2A of the wiring board 2 in the peripheral region R1 of the light transmission region 11. The entire electrode pad 2b may be arranged in the peripheral region R1, or only a part thereof may be arranged in the peripheral region R1.

In the spectroscopic sensor 1 configured as described above, when the measurement light is incident, the light having a predetermined wavelength passes through the Fabry-Perot interference filter 10 according to the voltage applied to the Fabry-Perot interference filter 10. Then, the light transmitted through the Fabry-Perot interference filter 10 is detected by the photodetector 3. In the spectroscopic sensor 1, the spectroscopic spectrum can be obtained by detecting the light transmitted through the Fabry-Perot interference filter 10 with the photodetector 3 while changing the voltage applied to the Fabry-Perot interference filter 10.

[Fabry-Perot Interference Filter]
As shown in FIG. 2, the Fabry-Perot interference filter 10 includes a substrate 14. The antireflection layer 15, the first laminated body 30, the sacrificial layer 16 and the second laminated body 40 are laminated in this order on the surface 14a on the light incident side of the substrate 14. A gap (air gap) S is formed between the first laminated body 30 and the second laminated body 40 by the frame-shaped sacrificial layer 16. In the Fabry-Perot interference filter 10, the measurement light is incident on the second laminated body 40 from the opposite side of the substrate 14, and the light having a predetermined wavelength is transmitted through the center of the Fabry-Perot interference filter 10. It penetrates the region 11. The substrate 14 is made of, for example, silicon, quartz, glass, or the like, and when the substrate 14 is made of silicon, the antireflection layer 15 and the sacrificial layer 16 are made of, for example, silicon oxide. The thickness of the sacrificial layer 16 is 200 nm to 10 μm. The thickness of the sacrificial layer 16 is preferably an integral multiple of 1/2 of the central transmission wavelength (that is, the wavelength at the center of the variable range of the wavelength transmitted by the Fabry-Perot interference filter 10).

The portion of the first laminated body 30 corresponding to the light transmitting region 11 functions as the first mirror 31. The first laminated body 30 is configured by alternately laminating a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. The optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the first mirror 31 is preferably an integral multiple of 1/4 of the center transmission wavelength (center wavelength in the variable wavelength range).

The portion of the second laminated body 40 corresponding to the light transmitting region 11 functions as a second mirror 41 facing the first mirror 31 through the gap S. Similar to the first laminated body 30, the second laminated body 40 is configured by alternately laminating a plurality of polysilicon layers and a plurality of silicon nitride layers one by one. The optical thickness of each of the polysilicon layer and the silicon nitride layer constituting the second mirror 41 is preferably an integral multiple of 1/4 of the center transmission wavelength (center wavelength in the variable wavelength range).

In the portion of the second laminated body 40 corresponding to the void S, a plurality of through holes 40b extending from the surface 40a of the second laminated body 40 to the void S are uniformly distributed. The through hole 40b is formed to such an extent that it does not substantially affect the function of the second mirror 41. The diameter of the through hole 40b is 100 nm to 5 μm, and the opening area of the through hole 40b occupies 0.01 to 10% of the area of the second mirror 41.

In the Fabry-Perot interference filter 10, the first mirror 31 and the second mirror 41 are supported by the substrate 14. The first mirror 31 is arranged on the light incident side of the substrate 14, and the second mirror 41 is arranged on the light incident side of the first mirror 31 through the gap S.

A first electrode 17 is formed on the first mirror 31 so as to surround the light transmitting region 11. The first electrode 17 is formed by doping the polysilicon layer with impurities to reduce the resistance.

A second electrode 18 is formed on the first mirror 31 so as to include a light transmitting region 11. The second electrode 18 is formed by doping the polysilicon layer with impurities to reduce the resistance. In the polysilicon layer, the size of the second electrode 18 is preferably a size including the entire light transmitting region 11, and may be substantially the same as the size of the light transmitting region 11.

A third electrode 19 is formed on the second mirror 41 so as to face the first electrode 17 and the second electrode 18. The third electrode 19 is formed by doping the polysilicon layer with impurities to reduce the resistance.

In the Fabry-Perot interference filter 10, the second electrode 18 is located on the opposite side of the third electrode 19 with respect to the first electrode 17 in the opposite direction D in which the first mirror 31 and the second mirror 41 face each other. There is. That is, the first electrode 17 and the second electrode 18 are not arranged on the same plane in the first mirror 31, and the second electrode 18 is farther from the third electrode 19 than the first electrode 17.

As shown in FIGS. 1 and 2, a pair of terminals 12 for applying a voltage to the Fabry-Perot interference filter 10 are provided so as to face each other with the light transmission region 11 interposed therebetween. Each terminal 12 is arranged in a through hole from the surface 40a of the second laminated body 40 to the first laminated body 30, and is electrically connected to the first electrode 17 via the wiring 21.

As shown in FIGS. 1 and 2, a pair of terminals 13 for applying a voltage to the Fabry-Perot interference filter 10 are provided so as to face each other with the light transmission region 11 interposed therebetween. The direction in which the pair of terminals 12 face each other and the direction in which the pair of terminals 13 face each other are orthogonal to each other. Each terminal 13 is electrically connected to the third electrode 19 via the wiring 22. Further, the third electrode 19 is also electrically connected to the second electrode 18 via the wiring 23.

As shown in FIG. 2, on the surface 30a of the first laminated body 30, a trench 26 extending in an annular shape so as to surround the wiring 23 extending from the terminal 13 along the facing direction D, and the inner edge of the first electrode 17 A trench 27 extending in an annular shape is provided along the above. The trench 26 electrically insulates the first electrode 17 and the wiring 23. The trench 27 electrically insulates the first electrode 17 and the region inside the first electrode 17. The region in each of the trenches 26, 27 may be an insulating material or a void.

A trench 28 extending in an annular shape so as to surround the terminal 12 is provided on the surface 40a of the second laminated body 40. The bottom surface of the trench 28 reaches the sacrificial layer 16. The trench 28 electrically insulates the terminal 12 and the third electrode 19. The region in the trench 28 may be an insulating material or a void.

The antireflection layer 51, the third laminated body 52, the intermediate layer 53, and the fourth laminated body 54 are laminated in this order on the surface 14b on the light emitting side of the substrate 14. The antireflection layer 51 and the intermediate layer 53 have the same configurations as the antireflection layer 15 and the sacrificial layer 16, respectively. The third laminated body 52 and the fourth laminated body 54 have a laminated structure symmetrical with the first laminated body 30 and the second laminated body 40 with reference to the substrate 14, respectively. The stress adjusting layer 50 is composed of the antireflection layer 51, the third laminated body 52, the intermediate layer 53, and the fourth laminated body 54. The support is formed by the substrate 14 and the stress adjusting layer 50. The substrate 14 alone may be used as a support. The stress adjusting layer 50 is arranged on the light emitting side of the substrate 14 and has a function of suppressing the warp of the substrate 14. The stress adjusting layer 50 is provided with an opening 50a so as to include the light transmitting region 11. A light-shielding layer 29 is formed on the surface 50b of the stress adjusting layer 50 on the light emitting side. The light-shielding layer 29 is made of aluminum or the like and has a function of blocking measurement light.

In the Fabry-Perot interference filter 10 configured as described above, when a voltage is applied between the first electrode 17 and the third electrode 19 via the terminals 12 and 13, an electrostatic force corresponding to the voltage is applied. It occurs between the first electrode 17 and the third electrode 19. As a result, the second mirror 41 is driven so as to be attracted to the first mirror 31 side fixed to the substrate 14, and the distance between the first mirror 31 and the second mirror 41 is adjusted. Since the wavelength of the light transmitted through the Fabric Perot interference filter 10 depends on the distance between the first mirror 31 and the second mirror 41 in the light transmission region 11, it is applied between the first electrode 17 and the third electrode 19. By adjusting the voltage, the wavelength of the transmitted light can be appropriately selected. At this time, since the second electrode 18 has the same potential as the electrically connected third electrode 19, it functions as a compensating electrode for keeping the first mirror 31 and the second mirror 41 flat in the light transmission region 11. do.

[Manufacturing process of spectroscopic sensor]
Next, the manufacturing process of the spectroscopic sensor according to the present embodiment will be described with reference to FIGS. 3 to 8. 3 to 5 and 8 are plan views for showing the manufacturing process, FIG. 6 is a side view corresponding to FIG. 5 (B), and FIG. 7 is a line VII-VII of FIG. 5 (B). It is a cross-sectional view and a partially enlarged view thereof. As shown in FIG. 3A, first, the stem 6 is prepared. The stem 6 is, for example, a TO-CAN stem. The stem 6 has a structure in which a conductive lead pin 6b penetrates a disk-shaped base 6a.

Next, as shown in FIG. 3B, the wiring board 2 is arranged on the base 6a of the stem 6, and the base 6a and the wiring board 2 are adhered to each other with a resin. On the wiring board 2, a mounting portion 2a for fixing the photodetector 3, a plurality of electrode pads 2b (bonding pads), and a mounting portion 2c for arranging the thermistor 7 are arranged. .. The mounting portions 2a and 2c are electrically connected to separate electrode pads 2b by wiring 2d.

Next, as shown in FIG. 4A, the photodetector 3 and the thermistor 7 are arranged on the mounting portions 2a and 2c of the wiring board 2, respectively. Further, the spacers 4A and 4B, which are two rod-shaped members, are arranged on the wiring board 2 so as to extend in parallel with each other. The spacer 4 is provided so as to have two openings A1 and A1 when viewed from the light transmission direction (direction perpendicular to the paper surface) in the light transmission region 11 of the Fabry-Perot interference filter 10. The openings A1 and A1 communicate with each other between the inside of the peripheral region R1 of the light transmitting region 11 and the outside of the peripheral region R1. The electrode pad 2b electrically connected to the mounting portion 2a on which the photodetector 3 is mounted is arranged on the main surface 2A of the wiring board 2 in the peripheral region R1 of the light transmitting region 11.

The two spacers 4A and 4B are arranged in the peripheral region of the light transmission region 11 when viewed from the light transmission direction in the light transmission region 11 of the Fabry-Perot interference filter 10. That is, the spacers 4A and 4B are arranged apart from the light transmitting region 11 when viewed from the light transmitting direction in the light transmitting region 11. The thermistor 7 may be omitted.

Next, as shown in FIG. 4 (B), the photodetector 3, the thermistor 7, the electrode pad 2b, and the lead pin 6b of the stem 6 are electrically connected by wire bonding using the wire 8. The material of the wire 8 is, for example, gold (Au).

Here, the electrode pad 2b electrically connected to the photodetector 3 is arranged in the peripheral region R1 of the light transmission region 11 on the main surface 2A of the wiring board 2. Further, the wire 8 connected to the electrode pad 2b electrically connected to the photodetector 3 is connected to the lead pin 6b of the stem 6 via the opening A1 formed between the spacers 4A and 4B. ing.

Next, as shown in FIG. 5A, the die bond resin 5 (adhesive portion) is applied to the spacer 4. Here, the die bond resin 5 has an opening that communicates the inside of the peripheral region of the light transmitting region 11 and the outside of the peripheral region when viewed from the light transmitting direction in the light transmitting region 11. It is provided. Here, the fact that the die bond resin 5 has an opening means that the die bond resin 5 does not have a continuous annular shape, and includes the same shape as illustrated above for the spacer 4. Specifically, the die-bond resin 5 is applied so as to be arranged only on both sides of the Fabry-Perot interference filter 10 when viewed from the light transmission direction in the light transmission region 11 of the Fabry-Perot interference filter 10. .. In the case of the example shown in FIG. 5A, the die bond resin 5 is applied over substantially the entire length of the upper surfaces of the spacers 4A and 4B.

Next, as shown in FIG. 5B, the Fabry-Perot interference filter 10 is placed on the spacer 4. As a result, the Fabry-Perot interference filter 10 is fixed on the spacer 4 via the die-bond resin 5 (the Fabry-Perot interference filter 10 is arranged on the photodetector 3 at a distance). At this time, the Fabry-Perot interference filter 10 is arranged so that the spacer 4 is arranged at a position corresponding to the terminals 12 and 13 as the bonding pad of the Fabry-Perot interference filter 10. Further, the terminals 12 and 13 of the Fabry-Perot interference filter 10 and the lead pin 6b of the stem 6 are electrically connected by the wire 8. The material of the wire 8 is, for example, gold (Au).

A side view corresponding to FIG. 5 (B) is shown in FIG. The Fabry-Perot interference filter 10 and the spacers 4A and 4B are bonded by the die bond resin 5.

Further, a cross-sectional view taken along line VII-VII in FIG. 5 is shown in FIG. 7 (A). An enlarged view corresponding to the portion surrounded by the ellipse EB in FIG. 7 (A) is shown in FIG. 7 (B).

The spacers 4A and 4B are separated from the light transmission region 11 of the Fabry-Perot interference filter 10. Further, spacers 4A and 4B are located at positions corresponding to the terminals 12 and 13 of the Fabry-Perot interference filter 10, specifically, directly below the terminals 12 and 13. The Fabry-Perot interference filter 10 is adhered to the upper surfaces of the spacers 4A and 4B so that the upper surfaces of the spacers 4A and 4B are in contact with the light-shielding layer 29 of the Fabry-Perot interference filter 10. Further, as shown in FIG. 7B, the outer surface 4Aa of the spacer 4A is located slightly outside the outer surface 10a of the Fabry-Perot interference filter 10.

The process following FIG. 5 (B) is shown in FIG. As shown in FIG. 8, a metal cap 9 is attached on the base 6a of the stem 6 to seal the Fabry-Perot interference filter 10, the photodetector 3, and the like. The cap 9 has a substantially cylindrical shape, and has a circular transmission window 9a on its upper surface. The transmission window 9a may be a transmission window using a material such as glass, silicon, or germanium that corresponds to the applicable wavelength range of the spectroscopic sensor 1. Further, the transmission window 9a may be a window with an antireflection film or a bandpass filter that limits the applicable wavelength range. The spectroscopic sensor 1 is obtained by the manufacturing process described above with reference to FIGS. 3 to 8.

In the spectroscopic sensor 1 of the present embodiment, openings A1 and A1 that communicate the inside of the peripheral region R1 of the light transmission region 11 and the outside of the peripheral region R1 are provided in the spacers 4A and 4B. Therefore, even when the electrode pad 2b electrically connected to the photodetector 3 is arranged inside the region surrounded by the spacers 4A and 4B in the peripheral region of the light transmission region 11, this electrode pad By providing the wire 8 for electrically connecting the 2b and the other element so as to pass through the openings A1 of the spacers 4A and 4B, the electrical connection to the photodetector 3 can be secured. .. Therefore, when viewed from the light transmission direction of the Fabry-Perot interference filter 10, the electrode pad 2b electrically connected to the photodetector 3 does not need to be arranged outside the Fabry-Perot interference filter 10. Therefore, the size of the spectroscopic sensor 1 can be made substantially the same as the size of the Fabry-Perot interference filter 10, and the spectroscopic sensor 1 can be miniaturized.

Further, since the spacers 4A and 4B have the openings A1 and A1, the sealed space is not formed by the Fabry-Perot interference filter 10, the spacer 4 and the die bond resin 5. Therefore, during the thermosetting of the die-bonded resin 5 during the manufacture of the spectroscopic sensor 1, the air surrounded by the Fabry-Perot interference filter 10, the spacer 4, and the die-bonded resin 5 does not thermally expand and burst the die-bonded resin 5. As a result, it is possible to prevent the Fabry-Perot interference filter 10 from being misaligned and the optical characteristics from being deteriorated. Further, when an element having a membrane structure such as a thermopile is used as the photodetector 3, it is possible to prevent the membrane structure of the photodetector 3 from being damaged due to thermal expansion of air.

Further, the electrode pad 2b electrically connected to the photodetector 3 is arranged inside the region surrounded by the spacers 4A and 4B in the peripheral region R1 of the light transmission region 11. Therefore, by providing the wiring for electrically connecting the electrode pad 2b and the other element so as to pass through the openings A1 of the spacers 4A and 4B, the electrical connection to the photodetector 3 is made. Can be secured. Therefore, as compared with the case where the electrode pad 2b is arranged outside the region surrounded by the spacers 4A and 4B, the space for arranging the electrode pad 2b becomes unnecessary, and the spectroscopic sensor 1 can be miniaturized. ..

Further, the Fabry-Perot interference filter 10 has terminals 12 and 13, and the spacers 4A and 4B correspond to the terminals 12 and 13 of the Fabry-Perot interference filter 10 when viewed from the light transmission direction of the Fabry-Perot interference filter 10. It is placed in the position to do. Therefore, in the wire bonding step at the time of manufacturing the spectroscopic sensor 1, the terminals 12 and 13 of the Fabry-Perot interference filter 10 are supported by the spacers 4A and 4B provided at the positions corresponding to the terminals 12 and 13, so that the wire Bondability can be improved.

Further, the Fabry-Perot interference filter 10 has a light transmission region 11, and the spacers 4A and 4B are separated from the light transmission region 11 of the Fabry-Perot interference filter 10 when viewed from the light transmission direction of the Fabry-Perot interference filter 10. is doing. Therefore, since the spacers 4A and 4B and the light transmitting region 11 are separated from each other, even if the die bond resin 5 protrudes during the manufacture of the spectroscopic sensor 1, the die bond resin 5 is prevented from entering the light transmitting region 11. can do. Even if the die bond resin 5 is excessively applied, the excess die bond resin 5 is transmitted to the lower side of the spacers 4A and 4B, thereby preventing the die bond resin 5 from being transmitted to the light transmitting region 11. You can also do it.

Further, as shown in FIG. 7B, the outer surface of the spacer 4A is located slightly outside the outer surface of the Fabry-Perot interference filter 10, so that the resin fillet of the die bond resin 5 is formed. Since it is formed, it is surely adhered.

[Modification example]
The arrangement of the spacer 4 described with reference to FIG. 4 (B) and the arrangement of the die bond resin 5 described with reference to FIG. 5 (A) can be variously modified. For example, as shown in FIG. 9, columnar spacers 4C are arranged in the vicinity of each of the four vertices of the rectangular wiring board 2, and die bond resin 5 is formed into dots on the upper surfaces of the four spacers 4C. It may be applied.

Further, as shown in FIG. 10A, a U-shaped spacer 4D may be fixed on the wiring board 2, and the die bond resin 5 may be applied over substantially the entire length of the upper surface of the U-shaped spacer 4D. ..

Further, as shown in FIG. 10B, the L-shaped spacer 4E is fixed to two vertices located on the diagonal line of the wiring board 2 among the four vertices of the wiring board 2, and the spacer 4E The die bond resin 5 may be applied over the upper surface.

Further, in the above embodiment, as shown in FIG. 2, the light transmission region 11 has been described as being a region narrower than the opening 50a, but the present invention is not limited to such a mode. When light whose width is narrowed down in advance is introduced as incident light, the light transmission region 11 is narrower than the opening 50a as shown in FIG. However, for example, when light wider than the opening 50a is introduced as incident light, the opening 50a defines the light transmission region 11. The present invention is also applicable to such a form.

Further, for example, the photodetector is a wiring board having a main surface, a photodetector arranged on the main surface of the wiring board and electrically connected to the wiring board, and light detection on the main surface of the wiring board. The support member is provided with a support member arranged around the vessel and a fabric perot interference filter having a light transmission region and arranged on the main surface of the wiring board via the support member, and the support member is a light transmission region. The Fabric Perot interference filter is supported in the peripheral region, and the support member has an opening that communicates the inside of the peripheral region and the outside of the peripheral region when viewed from the light transmission direction in the light transmission region.

In this photodetector, the opening is provided in the support member. Therefore, even when the bonding pad electrically connected to the photodetector is arranged in the peripheral region of the light transmission region, the wiring for electrically connecting the bonding pad and other elements is provided. By providing it so as to pass through the opening of the support member, it is possible to secure an electrical connection to the photodetector. Therefore, it is not necessary to dispose the bonding pad outside the Fabry-Perot interference filter when viewed from the light transmission direction of the Fabry-Perot interference filter. Therefore, the size of the photodetector can be made substantially the same as the size of the Fabry-Perot interference filter, and the photodetector can be miniaturized.

Here, in the photodetector of the present invention, at least a part of the bonding pad electrically connected to the photodetector may be arranged in the surrounding region. According to this configuration, the wiring for electrically connecting the bonding pad and other elements is provided so as to pass through the opening of the support member, thereby ensuring the electrical connection to the photodetector. Can be done. Therefore, as compared with the case where the bonding pad is arranged outside the area surrounded by the support member, a space for arranging the bonding pad becomes unnecessary, and the photodetector can be miniaturized.

Further, for example, the light detection device includes a mounting board having a main surface, a photodetector arranged on the main surface of the mounting board, and a support member provided around the photodetector on the main surface of the mounting board. The support member supports the fabric perot interference filter in the peripheral region of the light transmission region. The support member forms an opening that communicates between the inside of the peripheral region and the outside of the peripheral region when viewed from the light transmission direction in the light transmission region, and the Fabry Perot interference filter is formed by the support and the support. It has a first mirror fixed to a support and a second mirror that faces the first mirror through a gap and is movable with respect to the first mirror. The thickness of the gap in the direction in which the first mirror and the second mirror face each other is smaller than the thickness of the support of the fabric perot interference filter, which are fixed to each other by the adhesive portions formed of the resin material.

In the photodetector, the Fabry-Perot interference filter has a bonding pad, and the support member may be arranged at a position corresponding to the bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction. According to this configuration, in the wire bonding step at the time of manufacturing the photodetector, the bonding pad of the Fabry-Perot interference filter is supported by the support member provided at the position corresponding to the bonding pad, so that the wire bonding property is improved. Can be improved.

In the photodetector, the support member may be separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction. According to this configuration, since the support member and the light transmitting region are separated from each other, even if a material such as a resin used for the adhesive portion protrudes from the adhesive portion during the manufacture of the photodetector, the resin or the like can be used. It is possible to prevent the material from entering the light transmitting region.

1 ... Spectroscopic sensor (photodetector), 2 ... Wiring substrate, 2A ... Main surface, 2b ... Electrode pad (bonding pad), 3 ... Photodetector, 4, 4A-4E ... Spacer (support member), 10 ... Fabry Perot interference filter, 11 ... light transmission region, 12, 13 ... terminal (bonding pad), A1 ... opening, R1 ... peripheral region of light transmission region 11.

Claims (4)

A wiring board with a main surface and
A thermistor arranged on the main surface of the wiring board,
A photodetector disposed on the main surface of the wiring board and electrically connected to the wiring board.
A support member arranged around the photodetector and the thermistor on the main surface of the wiring board.
A Fabry-Perot interference filter having a light transmitting region and arranged on the main surface of the wiring board via the support member is provided.
The support member supports the Fabry-Perot interference filter in the peripheral region of the light transmission region.
The support member is arranged so as to sandwich the peripheral region when viewed from the light transmitting direction in the light transmitting region, and is a first opening that communicates the inside of the peripheral region with the outside of the peripheral region. Form a portion and a second opening,
The Fabry-Perot interference filter includes a substrate, a first mirror fixed to the substrate, and a second mirror that faces the first mirror via a gap and is movable with respect to the first mirror. death,
The photodetector and the thermistor are arranged in a region sandwiched between a plurality of the support members on the main surface of the wiring board.
A wire passing through the first opening is connected to the photodetector.
A wire passing through the second opening is connected to the thermistor.
When viewed from the direction of light transmission through the light transmission region, at least a part of the photodetector and at least a part of the thermistor are arranged in a region overlapping the Fabry-Perot interference filter on the main surface of the wiring board. Is a photodetector. The support member has a rod shape and has a rod shape.
The photodetector according to claim 1, wherein the number of the support members is two. The Fabry-Perot interference filter has a bonding pad and has a bonding pad.
The photodetector according to claim 1 or 2, wherein the support member is arranged at a position corresponding to a bonding pad of the Fabry-Perot interference filter when viewed from the transmission direction. The photodetector according to any one of claims 1 to 3, wherein the support member is separated from the light transmission region of the Fabry-Perot interference filter when viewed from the transmission direction.

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