JP6916836B2 - Method of manufacturing a laminate - Google Patents

Description

The present invention relates to, for example, a method for manufacturing a laminate as a flexible device component.

In the manufacturing process of various devices such as optical devices and electronic devices, various processes are carried out after a predetermined adhesive film is attached to the parts from the viewpoint of surface protection and impact protection of the device components. In some cases. Depending on the device component to which the protective film is attached, such a protective film may be incorporated into the product device as a device structural material while being attached to the component to supplement its strength. A technique relating to such an adhesive film having both a protective function and a reinforcing function is described in, for example, Patent Document 1 below.

JP-A-2017-132977

For device components in which various elements are formed on the circuit forming surface of a flexible substrate such as a flexible printed wiring board (FPC), the above-mentioned adhesive film (that is, in the manufacturing process) is formed at each of a plurality of locations on the same surface. Reinforcing film that also has a protective function) may be required to be attached.

Flexible device components with multiple reinforcing films on the same surface shall be manufactured by attaching each of the plurality of reinforcing films to the back surface of the flexible substrate (the surface opposite to the circuit forming surface). Is possible. However, such a fabrication method is not efficient.

Alternatively, for a flexible device component in which a plurality of reinforcing films are attached on the same surface, one reinforcing film is attached to almost the entire back surface of the flexible substrate, and then the reinforcing film is cut. Then, it can be manufactured by removing a part of the reinforcing film from the flexible substrate. However, according to such a manufacturing method involving cutting processing on a flexible substrate, adhesive residue may be conventionally generated at the cutting processing portion.

The present invention provides a method suitable for producing a laminate including an adherend and a plurality of reinforcing films to be attached to the same surface side thereof.

According to the first aspect of the present invention, there is provided a method for producing a laminate. This laminate manufacturing method includes the following sticking step , cutting step, peeling step, and adhesive strength increasing step.

In the sticking step, a reinforcing film containing the base material and the pressure-sensitive adhesive layer on the base material is stuck on the adherend on the pressure-sensitive adhesive layer side. In the reinforcing film, the base material and the pressure-sensitive adhesive layer may be directly bonded or may be bonded via another layer. The pressure-sensitive adhesive layer is irreversibly changed from a state in which the adhesive strength is relatively low (low adhesive strength state) to a state in which the adhesive strength is relatively high (high adhesive strength state) due to an external stimulus such as activation energy ray irradiation or heating. It consists of an adhesive composition that can be varied.

In the cutting step, a half-cut groove is formed from the base material side to the middle of the pressure-sensitive adhesive layer on the reinforcing film on the adherend, and a plurality of first region portions separated from each other in the reinforcing film. And at least one second region portion between the first region portion and the first region portion are formed. Further, each of the pressure-sensitive adhesive layers in the first and second regions generated through this step is in the above-mentioned low adhesive strength state.

In the peeling step, the second region portion formed as a section between the first region portions as described above is peeled from the adherend. The second region portion on the adherend is in a low adhesive force state as described above. Such a configuration is preferable for appropriately peeling the second region portion from the adherend.

In the adhesive strength increasing step, the adhesive strength of the pressure-sensitive adhesive layer in the first region portion is increased. In this step, the pressure-sensitive adhesive layer in each first region on the adherend is changed to a high adhesive strength state by an external stimulus such as irradiation of the pressure-sensitive adhesive layer in the first region with active energy rays or heating. As a result, the state of attachment to the adherend becomes strong in the first region portion derived from the above-mentioned reinforcing film. Such a configuration is suitable for leaving the first region portion as a structural material in the laminated body. The first region portion in which the pressure-sensitive adhesive layer is in a high adhesive strength state forms a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the same surface of the adherend in the laminated body to be manufactured.

According to the present laminate manufacturing method including each step as described above, a laminate including an adherend and a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the same surface thereof is manufactured. can do.

In this manufacturing method, it is not necessary to individually attach each of the plurality of films as reinforcing materials to the adherend. Such a manufacturing method contributes to the efficiency of manufacturing the laminate and the device to which the laminate is assembled.

In the above-mentioned cutting step of the present manufacturing method, as described above, the cut groove (half-cut groove) that separates each first region portion and the second region portion is an adhesive from the base material side of the reinforcing film. It is formed by half-cutting halfway through the layer. Such a configuration is suitable for suppressing so-called adhesive residue in the above-mentioned peeling step performed after the cutting step. When cutting the reinforcing film on the adherend over the entire thickness direction, depending on the cutting method and cutting conditions, the pressure-sensitive adhesive layer constituent material at or near the interface between the adherend and the reinforcing film pressure-sensitive adhesive layer. Due to the action of local temperature rise and pressing force, a part of the pressure-sensitive adhesive layer facing the interface tends to adhere to the adherend. For example, when the pressure-sensitive adhesive layer is composed of the above-mentioned first pressure-sensitive adhesive composition, local adhesion of such pressure-sensitive adhesive is caused by curing of a photocuring agent such as polyfunctional (meth) acrylate in the same composition. Occurs. In the cutting step, a configuration in which an uncut pressure-sensitive adhesive portion is left between the bottom end of the cut groove and the adherend by half-cutting as described above is used in the pressure-sensitive adhesive layer constituent material at the interface and its vicinity. Suitable for avoiding the action of local temperature rise and pressing force. Then, in the configuration in which the uncut adhesive portion is left between the bottom end of the cut groove and the adherend by the above-mentioned half-cut, the adherend uses the cohesive force of the adhesive remaining portion. It is preferable to peel off the second region portion or the pressure-sensitive adhesive layer thereof from the surface without a pressure-sensitive adhesive residue (adhesive residue).

In the above-mentioned cutting step in the present manufacturing method, preferably, in the pressure-sensitive adhesive layer of each first region portion, a modified portion facing the half-cut groove with the second region portion is formed. Such a configuration is suitable for suppressing bleed-out of the pressure-sensitive adhesive layer component on the end face of the reinforcing film portion (attached to the adherend by the pressure-sensitive adhesive layer) formed from the first region portion. ..

The adhesive strength increasing step may include heat treatment. When the adhesive strength increasing step involves heat treatment, the pressure-sensitive adhesive layer is preferably a first polymer having a glass transition temperature of less than 0 ° C. and a copolymer of an organosiloxane skeleton-containing monomer and a (meth) acrylate monomer. Contains a second polymer. Such a configuration is suitable for changing the pressure-sensitive adhesive layer in the first region derived from the reinforcing film from a low pressure-sensitive state to a high pressure-sensitive state by heating.

The adhesive strength increasing step may include an active energy ray irradiation treatment. When the adhesive force increasing step includes an active energy ray irradiation treatment, the pressure-sensitive adhesive layer preferably contains a base polymer and a polyfunctional (meth) acrylate. Such a configuration is suitable for changing the pressure-sensitive adhesive layer in the first region derived from the reinforcing film from a low pressure-sensitive state to a high pressure-sensitive state by heating.

According to the second aspect of the present invention, a laminate is provided. This laminated body is obtained by the above-mentioned laminated body manufacturing method according to the first aspect of the present invention, and includes an adherend and a reinforcing film. The reinforcing film includes a base material and an adhesive layer on the base material, and is attached to the adherend on the adhesive layer side. In the reinforcing film, the base material and the pressure-sensitive adhesive layer may be directly bonded or may be bonded via another layer. Further, the reinforcing film includes a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the adherend. The pressure-sensitive adhesive layer of each reinforcing film portion has a thickness of 5 μm or more, and the adhesive strength of the pressure-sensitive adhesive layer is 5 N / 25 mm or more.

According to a third aspect of the present invention, a reinforcing film is provided. This reinforcing film is a reinforcing film used in the method for producing a laminate according to the first aspect of the present invention, and includes a base material and an adhesive layer on the base material. The pressure-sensitive adhesive layer can be changed from a low adhesive strength state to a high adhesive strength state by an external stimulus.

It is a perspective view of the laminated body which concerns on one Embodiment of this invention. It is a partially enlarged sectional view of the laminated body shown in FIG. FIG. 3A represents a part of the steps in the method for manufacturing the laminate shown in FIG. 1, FIG. 3B represents a step following the step shown in FIG. 3A, and FIG. 3C shows a step following the step shown in FIG. 3B. 3D represents the steps following the steps shown in FIG. 3C. It is a partially enlarged view in FIG. 3C.

1 and 2 show the laminated body X according to the embodiment of the present invention. FIG. 1 is a perspective view of the laminated body X. FIG. 2 is a partially enlarged cross-sectional view of the laminated body X. The laminate X includes an adherend 10 and a film 20.

The adherend 10 is a flexible adherend according to an embodiment of the present invention, has flexibility, and has a first surface 11 and a second surface 12 facing each other. Examples of the adherend 10 include a flexible optical device such as a flexible display panel, a flexible electronic device such as a flexible printed wiring board (FPC), and a flexible base material as a component thereof. When the adherend 10 is a flexible optical device, the first surface 11 side of the adherend 10 includes, for example, various circuit elements such as a pixel region including a plurality of pixels located in an array and a drive circuit. A circuit area and a wiring pattern that electrically connects them are formed. When the adherend 10 is a flexible electronic device, for example, various circuit elements and wiring patterns are formed on the first surface 11 side of the adherend 10. Such an adherend 10 can take various plan-view shapes depending on the design of the device for manufacturing purposes.

As is often shown in FIG. 2, the film 20 includes the base material 21 and the pressure-sensitive adhesive layer 22, and is attached to the second surface 12 of the adherend 10 described above on the pressure-sensitive adhesive layer 22 side. In the film 20, the base material 21 and the pressure-sensitive adhesive layer 22 may be directly bonded or may be bonded via another layer. Such a film 20 is an example of a reinforcing film in the present invention, and is for supplementing a reinforcing function in addition to a protective function for the adherend 10, and is used as a device structural material in a product device together with the adherend 10. It is an element to be incorporated.

The film 20 includes a film portion 20A (first reinforcing film portion) and a film portion 20B (second reinforcing film portion) that are separated and adjacent to each other on the adherend 10 (the film portions 20A and 20B are the base materials 21 respectively). And the pressure-sensitive adhesive layer 22). The film portion 20A and the film portion 20B are adjacent to each other with a distance in the plane direction D orthogonal to the thickness direction of the film 20.

The base material 21 of the film portion 20A has an end surface 21a (first inclined end surface) facing the film portion 20B in the surface direction D2. The end surface 21a is inclined so as to retract toward the inward side of the film portion 20A as the distance from the adherend 10 increases. That is, the end surface 21a is inclined so as to move away from the film portion 20B in the surface direction D2 as it advances in the direction from the adherend 10 toward the film 20 in the thickness direction D1 of the film 20. The inclination angle α of the end face 21a with respect to the thickness direction D1 is, for example, 1 ° or more, preferably 2 ° or more, more preferably 3 ° or more, still more preferably 5 ° or more, for example, 45 ° or less, preferably 45 ° or less. Is 30 ° or less. The pressure-sensitive adhesive layer 22 of the film portion 20A has a modified portion 22a at the edge on the film portion 20B side. The modified portion 22a is a portion of the film portion 20A where the exposed surface of the pressure-sensitive adhesive layer 22 is cured by heating or the like.

The base material 21 of the film portion 20B has an end surface 21b (second inclined end surface) facing the film portion 20A in the surface direction D2. The end surface 21b is inclined so as to retract toward the inward side of the film portion 20B as the distance from the adherend 10 increases. That is, the end surface 21b is inclined so as to move away from the film portion 20B in the surface direction D2 as it advances in the direction from the adherend 10 toward the film 20 in the thickness direction D1 of the film 20. The inclination angle α of such an end face 21b with respect to the thickness direction D1 is, for example, 1 ° or more, preferably 2 ° or more, more preferably 3 ° or more, still more preferably 5 ° or more, for example, 45 ° or less, preferably 45 ° or less. Is 30 ° or less. The pressure-sensitive adhesive layer 22 of the film portion 20B has a modified portion 22b at the edge on the film portion 20A side. The modified portion 22b is a portion of the film portion 20B where the exposed surface of the pressure-sensitive adhesive layer 22 is cured by heating or the like.

The base material 21 in the film 20 is a support for ensuring the mechanical strength of the film 20, and is a main element for exhibiting its reinforcing function and protective function in the film 20.

The base material 21 is made of a flexible plastic material. Examples of such plastic materials include (meth) acrylic resins (acrylic resins and / or methacrylic resins) such as polyester resins, polyolefin resins, and polymethacrylates, polyimide resins, polycarbonate resins, polyether sulfone resins, and polyarylate resins. Examples include melamine resin, polyamide resin, cellulose resin, and polystyrene resin. Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate. Polyolefin resins include, for example, polyethylene, polypropylene, and cycloolefin polymer (COP). When the pressure-sensitive adhesive layer 22 is made of an adhesive composition that can be brought into a high adhesive force state by irradiation with active energy rays as described later, the base material 21 preferably has transparency to the active energy rays. From the viewpoint of achieving both transparency and mechanical strength, the plastic material for forming the base material 21 is preferably a polyester resin, and more preferably polyethylene terephthalate (PET).

The thickness of the base material 21 is, for example, 4 μm or more, and from the viewpoint of reinforcing the adherend 10, it is preferably 20 μm or more, more preferably 30 μm or more, and further preferably 45 μm or more. The thickness of the base material 21 is, for example, 500 μm or less, and is preferably 300 μm or less, more preferably 200 μm or less, still more preferably 100 μm or less, from the viewpoint of flexibility and handleability of the film 20.

The pressure-sensitive adhesive layer 22 in the film 20 is an element for attaching the film 20 to the adherend 10, and is made of a pressure-sensitive adhesive composition. The pressure-sensitive adhesive layer 22 in the present embodiment can be irreversibly changed from a state in which the adhesive strength is relatively low (low adhesive strength state) to a state in which the adhesive strength is relatively high (high adhesive strength state) by an external stimulus. It is a layer formed from an adhesive composition, and takes a high adhesive force state in the laminated body X that has undergone the manufacturing process.

As the adhesive composition for forming the adhesive layer 22, for example, an adhesive composition capable of changing from a low adhesive force state to a high adhesive force state by irradiation with active energy rays such as ultraviolet rays or electron beams (first adhesive force). Composition), and an adhesive composition (second adhesive composition) that can be changed from a low adhesive force state to a high adhesive force state by heating.

The first tacky composition comprises a base polymer, a photocuring agent, and a photopolymerization initiator.

Examples of the base polymer include acrylic polymer, natural rubber, styrene-isoprene-styrene block copolymer (SIS block copolymer), styrene-butadiene-styrene block copolymer (SBS block copolymer), and styrene-ethylene. -Butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene, polyisobutylene, butyl rubber, chloroprene rubber, silicone rubber and the like can be mentioned. From the viewpoint of controlling the adhesive force, an acrylic polymer is preferable as the base polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0 ° C. or lower, preferably −100 ° C. to −5 ° C., more preferably −80 ° C. to −10 ° C., and further preferably −40 ° C. to −10 ° C. Such a configuration is suitable for ensuring the fluidity of the base polymer in the first adhesive composition, and is therefore suitable for changing the first adhesive composition into a high adhesive force state by active energy rays. Is.

The glass transition temperature is a value described in literature, catalogs, etc., or a value calculated based on the following equations (X) (Fox equation). The same applies to the glass transition temperature of other polymers described later.

1 / Tg = W1 / Tg1 + W2 / Tg2 + ... + Wn / Tgn (X)
[In the formula (X), Tg represents the glass transition temperature (unit: K) of the polymer (A), and Tgi (i = 1, 2, ... N) is when the monomer i forms a homopolymer. It represents the glass transition temperature (unit: K), and Wi (i = 1, 2, ... n) represents the mass fraction of the monomer i in all the monomer components].
The acrylic polymer in the first adhesive composition is obtained by polymerizing a monomer component (first monomer component) containing a (meth) acrylic acid alkyl ester as a main component. "(Meta) acrylic acid" shall mean acrylic acid and / or methacrylic acid.

Examples of the (meth) acrylic acid alkyl ester include a linear or branched (meth) acrylic acid C1-20 alkyl ester. Examples of such (meth) acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and isopropyl (meth) acrylate. Butyl (meth) acrylate, Isobutyl (meth) acrylate, s-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, isopentyl (meth) acrylate, (meth) acrylic Neopentyl acid, (meth) hexyl acrylate, (meth) heptyl acrylate, 2-ethylhexyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, nonyl (meth) acrylate, (meth) Isononyl acrylate, (meth) decyl acrylate, (meth) isodecyl acrylate, (meth) undecyl acrylate, (meth) dodecyl acrylate, (meth) isotridodecyl acrylate, (meth) tetradecyl acrylate, (meth) ) Isotetradecyl acrylate, pentadecyl acrylate, cetyl (meth) acrylate, heptadecyl (meth) acrylate, octadecyl (meth) acrylate, isooctadecyl (meth) acrylate, nonadecil (meth) acrylate, And eikosyl (meth) acrylate. In forming the acrylic polymer, one kind of (meth) acrylic acid alkyl ester may be used, or two or more kinds of (meth) acrylic acid alkyl esters may be used.

From the viewpoint of adjusting the glass transition temperature of the acrylic polymer, it is preferable to use methyl methacrylate and C4-12 alkyl ester of acrylic acid in combination as the (meth) acrylic acid alkyl ester. When these are used in combination, the blending amount of methyl methacrylate is, for example, 5 parts by mass or more, for example, 20 parts by mass or less, based on 100 parts by mass of the total amount of methyl methacrylate and acrylic acid C4-12 alkyl ester. The blending amount of the acrylic acid C4-12 alkyl ester is, for example, 80 parts by mass or more, and for example, 95 parts by mass or less.

The blending ratio of the (meth) acrylic acid alkyl ester in the first monomer component is, for example, 50% by mass or more, preferably 60% by mass or more, and for example, 80% by mass or less.

The first monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the (meth) acrylic acid alkyl ester. Examples of the functional group-containing vinyl monomer include a hydroxyl group-containing vinyl monomer, a carboxyl group-containing vinyl monomer, a nitrogen-containing vinyl monomer, a cyano group-containing vinyl monomer such as (meth) acrylonitrile, and a glycidyl group-containing vinyl monomer such as glycidyl (meth) acrylate. , Sulf group-containing vinyl monomer, phosphate group-containing vinyl monomer such as 2-hydroxyethylacryloyl phosphate, aromatic vinyl monomer, vinyl ester monomer, and vinyl ether monomer such as methyl vinyl ether.

Examples of the hydroxyl group-containing vinyl monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, and 6-hydroxyhexyl (meth) acrylate. Examples thereof include 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and 4- (hydroxymethyl) cyclohexylmethyl (meth) acrylate, preferably. 2-Hydroxyethyl (meth) acrylate, more preferably 2-hydroxyethyl acrylate.

Examples of the carboxyl group-containing vinyl monomer include (meth) acrylic acid, 2-carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Be done. Further, examples of the carboxyl group-containing vinyl monomer include acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride.

Examples of the nitrogen-containing vinyl monomer include N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazin, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-acryloylmorpholine, and N. -Vinyl carboxylic acid amides and N-vinyl caprolactam can be mentioned.

Examples of the sulfo group-containing vinyl monomer include styrene sulfonic acid and allyl sulfonic acid.

Aromatic vinyl monomers include, for example, styrene, p-methylstyrene, o-methylstyrene, and α-methylstyrene.

Examples of the vinyl ester monomer include vinyl acetate and vinyl propionate.

In forming the acrylic polymer, one kind of functional group-containing vinyl monomer may be used, or two or more kinds of functional group-containing vinyl monomers may be used. From the viewpoint of introducing a crosslinked structure into the acrylic polymer, it is preferable to use a hydroxyl group-containing vinyl monomer and / or a carboxyl group-containing vinyl monomer as the functional group-containing vinyl monomer. From the viewpoint of ensuring sufficient cohesive force in the pressure-sensitive adhesive layer 22, it is preferable to use a nitrogen-containing vinyl monomer as the functional group-containing vinyl monomer, and the hydroxyl group-containing vinyl monomer and / or the carboxyl group is contained together with the nitrogen-containing vinyl monomer. It is preferable to use a vinyl monomer.

The blending ratio of the functional group-containing vinyl monomer in the first monomer component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and for example, 30% by mass or less, preferably 20% by mass. % Or less.

The above-mentioned acrylic polymer can be formed by polymerizing the above-mentioned first monomer component containing a (meth) acrylic acid alkyl ester as a main component. Examples of the polymerization method include solution polymerization, bulk polymerization, and emulsion polymerization, and solution polymerization is preferable.

In solution polymerization, for example, a reaction solution is prepared by blending a first monomer component and a polymerization initiator in a solvent, and then the reaction solution is heated. Then, an acrylic polymer solution containing an acrylic polymer can be obtained by undergoing a polymerization reaction of the first monomer component in the reaction solution.

The solid content concentration of the acrylic polymer solution obtained by solution polymerization is, for example, 20% by mass or more, for example, 80% by mass or less. The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, more preferably 500,000 or more, for example, 5,000,000 or less, preferably 3,000,000 or less, and more preferably 2000000 or less. The weight average molecular weight of the acrylic polymer is a value calculated by gel permeation chromatography (GPC) and converted to polystyrene.

The blending ratio of the acrylic polymer in the first adhesive composition is, for example, 50% by mass or more, preferably 80% by mass or more, and for example, 90% by mass or less. The ratio of the blending amount of the acrylic polymer to the total amount of the acrylic polymer, the photocuring agent and the photopolymerization initiator in the first adhesive composition is, for example, 70% by mass or more, and for example, 95% by mass or less.

The photocuring agent in the first adhesive composition is, for example, a polyfunctional (meth) acrylate, which is preferable from the viewpoint that the adhesive strength of the adhesive layer 22 can be sufficiently increased by irradiation with active energy rays. Examples thereof include bifunctional (meth) acrylate and trifunctional (meth) acrylate. Examples of the bifunctional (meth) acrylate include polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, bisphenol A ethylene oxide-modified di (meth) acrylate, and bisphenol A. Propylene oxide modified di (meth) acrylate, alkanediol di (meth) acrylate, tricyclodecanedimethanol di (meth) acrylate, pentaeristol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and glycerindi ( Meta) Acrylate can be mentioned. Examples of the trifunctional (meth) acrylate include ethoxylated isocyanuric acid tri (meth) acrylate, pentaerythritol tri (meth) acrylate, and trimethylolpropane tri (meth) acrylate. Examples of the photocuring agent include other acrylic photoreactive oligomers and photoreactive oligomers such as urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based. These photo-curing agents may be used alone or in combination of two or more.

The functional group equivalent of the photocuring agent is, for example, 50 g / eq or more, and for example, 500 g / eq or less. The viscosity of the photocuring agent at 25 ° C. is, for example, 5 mPa · s or more, for example 1000 mPa · s or less. The molecular weight of the photocuring agent is, for example, 200 or less, and 1000 or more, for example, from the viewpoint of compatibility in the first adhesive composition.

The compatibility of the photocuring agent with the above-mentioned acrylic polymer is preferably low. The configuration in which the compatibility of the photocuring agent with the acrylic polymer is low realizes a low adhesive strength state in which the adhesive strength of the pressure-sensitive adhesive layer 22 can be changed to a high adhesive strength state after the fact, as will be described later. It is preferable to the above.

The blending ratio of the photocuring agent in the first adhesive composition is, for example, 10% by mass or more, and for example, 50% by mass or less. The blending amount of the photocuring agent in the first adhesive composition is, for example, 10 parts by mass or more, for example, 50 parts by mass or less, preferably 30 parts by mass or less, based on 100 parts by mass of the acrylic polymer. The ratio of the blending amount of the photocuring agent to the total amount of the acrylic polymer, the photocuring agent and the photopolymerization initiator in the first adhesive composition is, for example, 5% by mass or more, and for example, 30% by mass or less. ..

The photopolymerization initiator in the first adhesive composition is for accelerating the curing reaction of the photocuring agent, and is selected according to the type of the photocuring agent and the like. Examples of the photopolymerization initiator include a photocation initiator (photoacid generator), a photoradical initiator, and a photoanion initiator (photobase generator). Examples of the photoinitiator include hydroxyketones such as 1-hydroxycyclohexylphenylketone, benzyldimethylketals, aminoketones, acylphosphine oxides, benzophenones, and trichloromethyl group-containing triazine derivatives. These photopolymerization initiators may be used alone or in combination of two or more. When a polyfunctional (meth) acrylate is used as the above-mentioned photocuring agent, a photoradical initiator is preferably used as the photopolymerization initiator, and hydroxyketones are more preferably used as the photopolymerization initiator. The light absorption region of such a photopolymerization initiator is, for example, 300 nm or more, and for example, 450 nm or less.

The blending ratio of the photopolymerization initiator in the first adhesive composition is, for example, 0.01% by mass or more, and for example, 0.5% by mass or less, preferably 0.1% by mass or less. The blending amount of the photopolymerization initiator in the first adhesive composition is, for example, 0.01 part by mass or more, and for example, 1 part by mass or less, preferably 0.5 part by mass with respect to 100 parts by mass of the acrylic polymer. It is less than a part. The ratio of the blending amount of the photopolymerization initiator to the total amount of the acrylic polymer, the photocuring agent and the photopolymerization initiator in the first adhesive composition is, for example, 0.01% by mass or more, and for example, 1% by mass. Hereinafter, it is preferably 0.5% by mass or less.

In order to prepare the first adhesive composition, an acrylic polymer (an acrylic polymer solution when the acrylic polymer is prepared by solution polymerization), a photocuring agent, and a photopolymerization initiator are blended in the above ratios. , Mix.

The first adhesive composition preferably contains a cross-linking agent from the viewpoint of introducing a cross-linked structure into the acrylic polymer. When an acrylic polymer having a cross-linking point such as a hydroxyl group or a carboxyl group and a cross-linking agent are blended in the first adhesive composition, the cross-linking point of the acrylic polymer and the cross-linking agent can react to introduce a cross-linked structure into the acrylic polymer. It can be done. Examples of the cross-linking agent for that purpose include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, carbodiimide-based cross-linking agents, and metal chelate-based cross-linking agents, and isocyanate-based cross-linking agents are preferable. Can be mentioned.

Examples of the isocyanate-based cross-linking agent include aliphatic diisocyanates such as butylene diisocyanate and hexamethylene diisocyanate, alicyclic diisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate, 2,4-tolylene diisocyanate and 4, Examples thereof include aromatic diisocyanates such as 4'-diphenylmethane diisocyanate and xylylene diisocyanate. Examples of the isocyanate-based cross-linking agent include derivatives of these isocyanates (for example, isocyanurate-modified products and polyol-modified products). Further, as the isocyanate-based cross-linking agent, a commercially available product can also be used. Examples of commercially available products include coronate L (trimethylolpropane adduct of tolylene diisocyanate, manufactured by Tosoh), coronate HL (trimethylolpropane adduct of hexamethylene diisocyanate, manufactured by Tosoh), and coronate HX (hexamethylene diisocyanate). Isocyanurate (manufactured by Toso) and Takenate D110N (trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Kagaku). These cross-linking agents may be used alone or in combination of two or more.

The functional group equivalent of the cross-linking agent is, for example, 50 g / eq or more, and for example, 500 g / eq or less.

The blending ratio of the cross-linking agent in the first adhesive composition is, for example, 0.1 part by mass or more, preferably 1.0 part by mass or more, and more preferably 1.5 parts by mass or more with respect to 100 parts by mass of the acrylic polymer. It is more preferably 2.0 parts by mass or more, and for example, 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 4 parts by mass or less.

When the above-mentioned cross-linking agent is blended in the first tacky composition, a cross-linking catalyst for accelerating the cross-linking reaction may be blended in the first tacky composition.

Examples of the cross-linking catalyst include metal-based cross-linking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, ferric nasem, butyl tin oxide, and dioctyl tin dilaurate. The cross-linking catalyst may be used alone or in combination of two or more.

The blending ratio of the cross-linking catalyst in the first adhesive composition is, for example, 0.001 part by mass or more, preferably 0.01 part by mass or more, and 0.05 part by mass, for example, with respect to 100 parts by mass of the acrylic polymer. It is less than a part.

Other components may be added to the first adhesive composition, if necessary. Other components include, for example, silane coupling agents, tackifiers, plasticizers, softeners, anti-deterioration agents, fillers, colorants, UV absorbers (from the perspective of stabilization under fluorescent or natural light). ), Antioxidants, surfactants, and antistatic agents.

The above-mentioned second adhesive composition contains a veil polymer (first polymer) and an organosiloxane-containing polymer (second polymer).

Examples of the base polymer include acrylic polymer, natural rubber, styrene-isoprene-styrene block copolymer (SIS block copolymer), styrene-butadiene-styrene block copolymer (SBS block copolymer), and styrene-ethylene. -Butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene, polyisobutylene, butyl rubber, chloroprene rubber, silicone rubber and the like can be mentioned. From the viewpoint of controlling the adhesive force, an acrylic polymer is preferable as the base polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0 ° C. or lower, preferably −100 ° C. to −5 ° C., more preferably −80 ° C. to −10 ° C., and further preferably −40 ° C. to −10 ° C. Such a configuration is suitable for ensuring the fluidity of the base polymer in the second adhesive composition, and is therefore suitable for changing the second adhesive composition to a high adhesive force state by heating. ..

The acrylic polymer in the second adhesive composition is obtained by polymerizing a monomer component (second monomer component) containing a (meth) acrylic acid alkyl ester as a main component.

As the (meth) acrylic acid alkyl ester in the second monomer component, for example, the same one as the (meth) acrylic acid alkyl ester in the first monomer component described above can be used. The blending ratio of the (meth) acrylic acid alkyl ester in the second monomer component is, for example, 50% by mass or more, preferably 60% by mass or more, and for example, 80% by mass or less.

The second monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the (meth) acrylic acid alkyl ester. As the functional group-containing vinyl monomer, for example, the same as the functional group-containing vinyl monomer in the above-mentioned first monomer component can be used. The blending ratio of the functional group-containing vinyl monomer in the second monomer component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and for example, 30% by mass or less, preferably 20% by mass. % Or less.

The acrylic polymer in the second adhesive composition can be formed by polymerizing a second monomer component containing a (meth) acrylic acid alkyl ester as a main component. Examples of the polymerization method include solution polymerization, bulk polymerization, and emulsion polymerization, and solution polymerization is preferable.

The ratio of the blending amount of the acrylic polymer to the total amount of the acrylic polymer and the organosiloxane-containing polymer in the second adhesive composition is, for example, 70% by mass or more, and for example, 99% by mass or less, preferably 90% by mass or less. Is.

Examples of the organosiloxane-containing polymer include acrylic-based, urethane-based, polyether-based, polyester-based, polycarbonate-based, and polybutadiene-based polymers having an organosiloxane skeleton. From the viewpoint of controlling adhesive strength, the organosiloxane is used. An acrylic polymer having a skeleton is preferably used.

The acrylic polymer having an organosiloxane skeleton is obtained by polymerizing a monomer component (third monomer component) containing a (meth) acrylic acid alkyl ester and a monomer having an organosiloxane skeleton. As the (meth) acrylic acid alkyl ester in the third monomer component, for example, the same one as the (meth) acrylic acid alkyl ester in the first monomer component described above can be used. As the organosiloxane skeleton-containing monomer, for example, a compound represented by the following general formula (1) or a compound represented by the general formula (2) can be used. In the general formulas (1) and (2), R ₁ represents a hydrogen or a methyl group, R ₂ represents a methyl group or a monovalent organic group, and m and n are integers of 0 or more.

Commercially available products can also be used as the organosiloxane skeleton-containing monomer. Specifically, X-22-174ASX, X-22-2426, X-22-2475, and KF-22012 (above, Shin-Etsu Chemical Co., Ltd.) One-end reactive silicone manufactured by the company) can be mentioned.

The functional group equivalent of the organosiloxane skeleton-containing monomer is, for example, 700 g / mol or more, preferably 800 g / mol or more, more preferably 850 g / mol or more, still more preferably 1500 g / mol or more, and for example, less than 20000 g / mol. It is preferably less than 15,000 g / mol, more preferably less than 10000 g / mol, still more preferably less than 6000 g / mol, and particularly preferably less than 5000 g / mol.

The ratio of the blending amount of the organosiloxane skeleton-containing monomer to the total amount of the (meth) acrylic acid alkyl ester and the organosiloxane skeleton-containing monomer in the third monomer component is, for example, 10% by mass or more, preferably 15% by mass or more, more preferably. It is 20% by mass or more, and for example, 60% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, still more preferably 30% by mass or less.

The third monomer component may contain a functional group-containing vinyl monomer. As the functional group-containing vinyl monomer, for example, the same as the functional group-containing vinyl monomer in the above-mentioned first monomer component can be used.

The organosiloxane-containing polymer in the second adhesive composition contains a (meth) acrylic acid alkyl ester and an organosiloxane skeleton-containing monomer, and if necessary, polymerizes a third monomer component containing a functional group-containing vinyl monomer. Can be formed by. Examples of the polymerization method include solution polymerization, bulk polymerization, and emulsion polymerization, and solution polymerization is preferable. In solution polymerization, for example, a third monomer component and, for example, the above-mentioned polymerization initiator are mixed with a solvent to prepare a reaction solution, and then the reaction solution is heated. Then, a polymer solution containing an organosiloxane-containing polymer can be obtained by undergoing a polymerization reaction of the third monomer component in the reaction solution. In this polymerization reaction, a chain transfer agent may be used to adjust the molecular weight of the polymer to be formed.

The second adhesive composition is preferably blended with a cross-linking agent from the viewpoint of introducing a cross-linked structure into the acrylic polymer and / or the organosiloxane-containing polymer to be blended therein. As the cross-linking agent in the second adhesive composition, for example, the same cross-linking agent as described above can be used as the cross-linking agent in the first sticky composition.

Other components may be added to the second adhesive composition, if necessary. Other components include, for example, silane coupling agents, tackifiers, plasticizers, softeners, anti-deterioration agents, fillers, colorants, UV absorbers (from the perspective of stabilization under fluorescent or natural light). ), Antioxidants, surfactants, and antistatic agents.

The blending ratio of the organosiloxane-containing polymer in the second adhesive composition is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and more preferably 0.4 parts by mass with respect to 100 parts by mass of the acrylic polymer. The above is more preferably 0.5 parts by mass or more, particularly preferably 1 part by mass or more, most preferably 2 parts by mass or more, and for example, 75 parts by mass or less, preferably 50 parts by mass or less, more preferably 20 parts by mass. Parts or less, more preferably 10 parts by mass or less, particularly preferably 8 parts by mass or less, and most preferably 5 parts by mass or less.

The thickness of the pressure-sensitive adhesive layer 22 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, still more preferably 20 μm or more, and more preferably 20 μm or more, from the viewpoint of ensuring sufficient adhesiveness to the adherend 10. From the viewpoint of handleability, for example, it is 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, still more preferably 40 μm or less, and particularly preferably 30 μm or less.

In the laminated body X, as described above with reference to FIG. 2, the end surface 21a of the base material 21 of the film portion 20A on the adherend 10 facing the film portion 20B is a film portion as the distance from the adherend 10 increases. The end surface 21b of the base material 21 of the film portion 20B on the adherend 10 that is inclined so as to retract inward of 20A and faces the film portion 20A is such that the film portion 20B portion is farther from the adherend 10. It is tilted so that it retracts inward. With such a configuration, when the region between the film portions 20A and 20B in the adherend 10 is bent in the direction indicated by the arrow R in FIG. 2 and the laminated body X is folded back, a bending allowance is secured for the bending. Suitable (that is, suitable for suppressing contact between film portions 20A and 20B). In order to obtain such a technical effect, for example, the inclination angles α of the end faces 21a and 21b are appropriately set according to the distance between the film portions 20A and 20B.

If the end surface 21a is not inclined as described above and is perpendicular to the second surface 12 of the adherend 10, the virtual line in FIG. 4 depends on the distance between the adjacent film portions 20A and 20B. As shown by, the end faces 21a and 21b of the film portions 20A and 20B interfere with each other, and the laminated body X cannot take an appropriate folded form.

On the other hand, in the laminated body X according to the embodiment of the present invention, since the end faces 21a and 21b are inclined as described above, the adherend 10 is bent (arrow) in the region between the film portions 20A and 20B. A bending allowance can be secured for bending in the direction indicated by R). Therefore, even when the film portion 20A or its end surface 21a and the film portion 20B or its end surface 21b are arranged close to each other, it is easy to take an appropriate folded form.

In such a laminated body X, it is easy to take an appropriate folded form of the adherend 10 with the film 20 sticking surface inside. In addition, the laminated body X, which is easy to take an appropriate folded form in this way, is easy to design with a short distance between the film portions 20A and 20B on the adherend 10, and is therefore easy to be miniaturized and lightened.

In addition, in the laminated body X, as described above, the pressure-sensitive adhesive layer 22 in the film portion 20A has a modified portion 22a at the side edge edge of the film portion 20B, and the pressure-sensitive adhesive layer 22 in the film portion 20B is a film portion. It has a modified portion 22b at the 20A side edge. Such a configuration is suitable for suppressing the bleed-out of the pressure-sensitive adhesive layer constituent components on the end faces 21a and 21b of the pressure-sensitive adhesive layers 22 and 22 of the film portions 20A and 20B.

3A to 3D show the above-mentioned manufacturing method of the laminated body X. The present manufacturing method includes a preparation step, a pasting step, a cutting step, a peeling step, and an adhesive strength increasing step.

First, in the preparation step, as shown in FIG. 3A, the above-mentioned adherend 10 and the film 20', which are flexible adherends, are prepared. The adherend 10 has a first surface 11 and a second surface 12 as described above. The film 20'contains the above-mentioned base material 21 and the above-mentioned pressure-sensitive adhesive layer 22 in a low adhesive strength state.

The film 20'can be produced, for example, by applying an adhesive composition on the base material 21 to form a coating film, and if necessary, drying and removing a solvent from the coating film. Examples of the method of applying the adhesive composition include roll coat, kiss roll coat, gravure coat, reverse coat, roll brush, spray coat, dip roll coat, bar coat, knife coat, air knife coat, curtain coat and lip coat. , And die coat. The drying temperature for removing the solvent is, for example, 50 ° C. or higher, preferably 70 ° C. or higher, more preferably 100 ° C. or higher, and for example, 200 ° C. or lower, preferably 180 ° C. or lower, more preferably 150 ° C. or lower. .. The drying time is, for example, 5 seconds or more, preferably 10 seconds or more, and for example, 20 minutes or less, preferably 15 minutes or less, and more preferably 10 minutes or less. When the tacky composition used contains a cross-linking agent, the cross-linking reaction involving the cross-linking agent in the sticky composition is promoted at the same time as the above-mentioned drying or by the subsequent aging. The aging conditions are appropriately set depending on the type of the cross-linking agent. The aging temperature is, for example, 20 ° C. or higher, and is, for example, 160 ° C. or lower, preferably 100 ° C. or lower. The aging time is, for example, 1 minute or more, preferably 12 hours or more, more preferably 1 day or more, and for example, 7 days or less. Further, with respect to the manufactured film 20', a release film may be laminated on the side of the pressure-sensitive adhesive layer 22 opposite to the base material 21 if necessary. Examples of such a release film include a flexible plastic film such as a polyethylene film, a polypropylene film, a polyethylene terephthalate film, and a polyester film.

Next, in the sticking step, as shown in FIG. 3B, the film 20'is stuck to the adherend 10. The film 20'is attached to the second surface 12 side of the adherend 10 on the pressure-sensitive adhesive layer 22 side. The adhesive strength of the pressure-sensitive adhesive layer 22 (in a low adhesive strength state) of the film 20'is, for example, 4N / 25 mm or less, preferably 1N / 25 mm or less. The adhesive strength of the film 20'with the pressure-sensitive adhesive layer 22 is measured by a peeling test in which a test piece cut out from the film 20'if necessary is attached to the surface of the polyimide film at 25 ° C. and then peeled off from the polyimide film. Value. In the peeling test, the peeling temperature is 25 ° C., the peeling angle is 180 °, and the peeling speed is 300 mm / min.

When the pressure-sensitive adhesive layer 22 of the film 20'composed of the above-mentioned first pressure-sensitive composition (including an acrylic polymer, a photo-curing agent, and a photopolymerization initiator), the photo-curing agent in the pressure-sensitive adhesive layer 22 is uncured. Since it is in a state, the pressure-sensitive adhesive layer 22 can take a low adhesive strength state. When the pressure-sensitive adhesive layer 22 of the film 20'composed of the above-mentioned second pressure-sensitive composition (containing an acrylic polymer and an organosiloxane-containing polymer), the polyorgano which is a side chain of the organosiloxane-containing polymer in the pressure-sensitive adhesive layer 22. Since the siloxane site has a relatively low polarity in the pressure-sensitive adhesive layer 22 and tends to be unevenly distributed on the surface of the pressure-sensitive adhesive layer 22 on the adherend 10 side and its vicinity, the pressure-sensitive adhesive layer 22 is in a low adhesive strength state. Can be taken.

The configuration in which the pressure-sensitive adhesive layer 22 of the film 20'used in the sticking step is in a low adhesive strength state is suitable for ensuring reworkability in this step. If a sticking failure occurs in this step (misalignment of the film 20'with respect to the adherend 10 or mixing of air bubbles between the adherend 10 and the film 20'), sticking with a substitute film 20' The film 20'is required to have a light peelability for appropriately peeling from the adherend 10 so that the attachment work can be performed. The film 20'in which the pressure-sensitive adhesive layer 22 is in a low adhesive strength state (the pressure-sensitive adhesive layer 22 can be changed to a high adhesive strength state after the fact) is related to the work of attaching the film 20'to the adherend 10. It is suitable for ensuring reworkability and ensuring a sufficient bonding state to the adherend 10 after proper attachment.

Next, in the cutting step, as shown in FIG. 3C, the film 20'on the adherend 10 is subjected to a cutting process for forming a cut groove G (in FIG. 3C, the cut groove is schematically represented by a thick line). , In the film 20', the two separated first region portions S1 and the second region portion S2 between the first region portions S1 are partitioned. The first region portion S1 is a region forming the above-mentioned film 20 (film portions 20A, 20B) in the manufactured laminate X. The second region portion S2 is a region to be removed as described later. Examples of the cutting method in this step include cutting a knife and cutting a laser. Examples of the blade for cutting the blade include a rotary blade, a Thomson blade, and a pinnacle blade. Examples of the laser for performing laser cutting include a CO ₂ laser and a YAG laser.

In the cutting step, the cut groove G that separates the first region portion S1 and the second region portion S2 is wider as the distance from the adherend 10 toward the base material 21 side, as shown in FIG. The cut groove G is a V-shaped groove having a V-shaped cross section. That is, the cut end surface Ga on the second region portion S2 side of each first region portion S1 is inclined so as to retract toward the inward side of the first region portion S1 as the distance from the adherend 10 increases. The degree of inclination of the cut end surface Ga of the cut groove G (for example, the above angle α) can be adjusted by appropriately selecting the blade angle of the cutting edge of the blade to be used in cutting the blade, and in laser cutting. It can be adjusted by appropriately adjusting the irradiation conditions such as the irradiation energy, irradiation diameter, and irradiation position of the laser used.

Further, in the cutting step of the present embodiment, the modified portions 22a and 22b facing the cut groove G between the pressure-sensitive adhesive layer 22 and the second region portion S2 are formed in the pressure-sensitive adhesive layer 22 of each first region portion S1. The modified portions 22a and 22b can be formed, for example, by locally raising the temperature of the pressure-sensitive adhesive layer 22 when forming the cut groove. As described above, the modified portions 22a and 22b are suitable for suppressing the bleed-out of the pressure-sensitive adhesive layer constituents.

In such a cutting step, the cut groove G that separates the first region portion S1 and the second region portion S2 is half-cut from the base material 21 side to the middle of the pressure-sensitive adhesive layer 22 with respect to the film 20'. Formed by. In the half-cut, the base material 21 is cut over the entire thickness direction and is cut to a position in the middle of the pressure-sensitive adhesive layer 22 in the thickness direction. The depth of cut into the pressure-sensitive adhesive layer 22 in the half-cut is, for example, 70% or more, preferably 80% or more, more preferably 90% or more, and less than 100%, for example, in the entire thickness (100%) of the pressure-sensitive adhesive layer 22. It is preferably 99% or less, more preferably 98% or less. The residual thickness of the pressure-sensitive adhesive layer 22 after such a half-cut can be appropriately set in relation to physical properties such as viscoelasticity and peeling force of the pressure-sensitive adhesive layer 22.

Such a half-cut process is suitable for reducing the influence of heat generated by a cutting process such as laser cutting on the adherend 10, and therefore, a heat history due to the cutting process is generated in the adherend 10. Suitable for suppressing. For example, when the adherend 10 is an electronic device such as a flexible display panel or a flexible printed wiring board, the above-mentioned half-cut processing is performed on various elements provided on the first surface 11 side of the adherend 10. It is suitable for avoiding / reducing the thermal influence on the wiring.

Next, in the peeling step, as shown in FIG. 3D, the second region portion S2 partitioned between the first region portions S1 is peeled from the adherend 10. The pressure-sensitive adhesive layer 22 in the second region portion S2 on the adherend 10 is in a low adhesive strength state as described above, and such a configuration appropriately peels the second region portion S2 from the adherend 10. It is preferable to the above.

Further, performing half-cutting as described above in the cutting step preceding the peeling step is suitable for suppressing so-called adhesive residue in the main peeling step. When the film 20'on the adherend 10 is cut over the entire thickness direction, it is located at or near the interface between the adherend 10 and the adhesive layer 22 of the film 20', depending on the cutting method and cutting conditions. Due to the action of local temperature rise and pressing force in the pressure-sensitive adhesive layer constituent material, a part of the pressure-sensitive adhesive layer 22 facing the interface tends to adhere to the adherend 10 (local adhesion of the pressure-sensitive adhesive). .. For example, when the pressure-sensitive adhesive layer 22 is made of the above-mentioned first pressure-sensitive adhesive composition, the photo-curing agent such as polyfunctional (meth) acrylate in the composition is cured to locally fix the pressure-sensitive adhesive. Occurs. In the cutting step, the configuration in which the uncut adhesive portion is left between the bottom end of the cut groove G and the adherend 10 by the above-mentioned half-cut is the adhesive layer at the interface and its vicinity. It is suitable for avoiding the action of local temperature rise and pressing force on the constituent material. Then, the configuration in which the uncut adhesive portion is left between the bottom end of the cut groove G and the adherend 10 by the half cut as described above utilizes the cohesive force of the adhesive remaining portion. It is preferable to peel off the second region portion S2 or the pressure-sensitive adhesive layer 22 thereof from the surface of the adherend 10 without any pressure-sensitive adhesive residue (adhesive residue).

Next, in the adhesive force increasing step, the adhesive force of the pressure-sensitive adhesive layer 22 in the first region portion S1 is increased. When the pressure-sensitive adhesive layer 22 of the film 20'composed of the above-mentioned first pressure-sensitive composition (including an acrylic polymer, a photocuring agent, and a photopolymerization initiator), the pressure-sensitive adhesive layer 22 is subjected to the step of increasing the pressure-sensitive adhesive force. Irradiate active energy rays such as ultraviolet rays and electron beams. As a result, the pressure-sensitive adhesive layer 22 reaches a high adhesive strength state through polymerization or curing of the photocuring agent in the pressure-sensitive adhesive layer 22. When the pressure-sensitive adhesive layer 22 of the film 20'composed of the above-mentioned second pressure-sensitive composition (including an acrylic polymer and an organosiloxane-containing polymer), the pressure-sensitive adhesive layer 22 is heated in the pressure- increasing step. The heating temperature is, for example, 40 ° C. or higher, preferably 50 ° C. or higher, more preferably 60 ° C. or higher, and for example, less than 150 ° C., preferably 120 ° C. or lower, more preferably 100 ° C. or lower, still more preferably 80 ° C. or lower. Is. The heating time is, for example, 1 hour or less, preferably 30 minutes or less, more preferably 10 minutes or less, still more preferably 5 minutes or less, and for example, 1 minute or more. By such heating, the compatibility between the acrylic polymer and the organosiloxane-containing polymer in the pressure-sensitive adhesive layer 22 is enhanced, and the organosiloxane-containing polymer or the polyorganosiloxane moiety (the pressure-sensitive adhesive layer 22 in a low adhesive strength state) which is a side chain thereof is enhanced. The surface of the adhesive layer 22 on the 10-side of the adherend and its vicinity tends to be unevenly distributed), and the abundance ratio of the acrylic polymer on the surface of the adhesive layer 22 on the 10-side of the adherend and its vicinity increases. As a result, the pressure-sensitive adhesive layer 22 reaches a high adhesive strength state. The adhesive strength of the pressure-sensitive adhesive layer 22 in the high adhesive strength state is, for example, 5N / 25mm or more, preferably 8N / 25mm or more, more preferably 10N / 25mm or more, and further preferably 12N / 25mm or more. Further, the adhesive strength of the pressure-sensitive adhesive layer 22 in the high adhesive strength state is, for example, twice or more, preferably four times or more, more preferably eight times or more, as compared with the adhesive strength of the pressure-sensitive adhesive layer 22 in the low adhesive strength state. , More preferably 10 times or more.

In this step, the pressure-sensitive adhesive layer 22 of each first region portion S1 on the adherend 10 is raised by an external stimulus such as activation energy ray irradiation or heating as described above for the pressure-sensitive adhesive layer 22 of the first region portion S1. Change to an adhesive state. As a result, the state of attachment to the adherend 10 is strengthened in the first region portion S1 derived from the film 20. Such a configuration is suitable for leaving the first region portion S1 as a structural material in the laminated body X. The first region portion S1 in which the pressure-sensitive adhesive layer 22 is in a high adhesive strength state forms the film portions 20A and 20B in the laminated body X.

According to the laminate manufacturing method including each step as described above, the above-mentioned laminate X can be appropriately manufactured. Therefore, according to the present manufacturing method, in the manufactured laminated body X, the same effect as described above can be enjoyed for the laminated body X. Further, in the present manufacturing method, it is not necessary to individually attach each of the plurality of film portions 20A and 20B as reinforcing materials to the adherend 10. Such a manufacturing method contributes to the efficiency of manufacturing the laminate X and the device to which the laminate X is assembled.

X Laminated body 10 Adhesive body 20 Film (reinforcing film)
20A, 20B Film part 21 Base material 21a, 21b End face 22 Adhesive layer 22a, 22b Modified part S1 First area part S2 Second area part G Cut groove

Claims (8)

A step of attaching a reinforcing film containing a base material and a pressure-sensitive adhesive layer on the base material to an adherend on the pressure-sensitive adhesive layer side.
A half-cut groove is formed from the base material side to the middle of the pressure-sensitive adhesive layer on the reinforcing film on the adherend, and in the reinforcing film, a plurality of first region portions separated from each other and the said. and at least one second region between the first region portion is partitioned and formed, and cutting process,
A step of peeling the second region portion from the adherend,
A method for producing a laminate, which comprises a step of increasing the adhesive strength of the pressure-sensitive adhesive layer in the first region portion. The method for producing a laminate according to claim 1, wherein in the cutting step, a modified portion facing the half-cut groove is formed between the pressure-sensitive adhesive layer of each first region portion and the second region portion. The method for producing a laminate according to claim 1 or 2, wherein the adhesive strength increasing step includes a heat treatment. The third aspect of claim 3, wherein the pressure-sensitive adhesive layer contains a first polymer having a glass transition temperature of less than 0 ° C. and a second polymer which is a copolymer of an organosiloxane skeleton-containing monomer and a (meth) acrylate monomer. Method for manufacturing a laminate. The method for producing a laminate according to claim 1 or 2, wherein the adhesive strength increasing step includes an active energy ray irradiation treatment. The method for producing a laminate according to claim 5, wherein the pressure-sensitive adhesive layer contains a base polymer and a polyfunctional (meth) acrylate. A laminate obtained by the method for producing a laminate according to claim 2, wherein the laminate is obtained.
The adherend and
A reinforcing film containing a base material and a pressure-sensitive adhesive layer on the base material and being attached to the adherend on the pressure-sensitive adhesive layer side is provided.
The reinforcing film includes a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the adherend.
The pressure-sensitive adhesive layer of the first reinforcing film portion has a modified portion at the side edge of the second reinforcing film portion, and the pressure-sensitive adhesive layer of the second reinforcing film portion is located at the side edge of the first reinforcing film portion. A laminate characterized by having a modified portion. A reinforcing film used in the method for producing a laminate according to claim 3 or 4.
Includes a substrate and an adhesive layer on the substrate,
The adhesive layer is a reinforcing film characterized in that it can be changed from a low adhesive force state to a high adhesive force state by heating.

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