JP6918461B2 - Vacuum drying system and vacuum drying method - Google Patents

Description

The present invention relates to a vacuum drying system and a vacuum drying method.

Conventionally, an organic light emitting diode (OLED), which is a light emitting diode utilizing light emission of organic EL (Electroluminescence), is known. An organic EL display using an organic light emitting diode has advantages such as thinness, light weight, low power consumption, and excellent response speed, viewing angle, and contrast ratio. For this reason, it has been attracting attention in recent years as a next-generation flat panel display (FPD).

The organic light emitting diode has an anode formed on the substrate, a cathode provided on the side opposite to the substrate with reference to the anode, and an organic layer provided between the anode and the cathode. The organic layer has, for example, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the anode side to the cathode side.

An inkjet coating device is used to form a hole injection layer, a hole transport layer, a light emitting layer, and the like. The coating apparatus forms a coating layer by coating a coating liquid containing an organic material and a solvent on the substrate. The coating layer is dried under reduced pressure and fired to form a hole injection layer or the like (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-779666

FIG. 1 is a diagram showing a time change of the atmospheric pressure inside the processing container of the vacuum drying device according to the conventional example. When the depressurization is started at time t0, the pressure inside the processing container drops sharply from the atmospheric pressure, and then becomes substantially constant from time t1 to time t2. Between time t1 and time t2, most of the solvent contained in the coating layer evaporates. After that, the air pressure inside the processing container gradually decreases and becomes substantially constant from time t3. By time t3, the contour of the coating layer is almost adjusted. Subsequently, the air pressure inside the processing container is kept low for a long time, and the solvent remaining in the coating layer gradually evaporates. From the time t4 when the elapsed time from the start of depressurization reaches the set time to the time t5, the pressure inside the processing container is returned to the atmospheric pressure.

Conventionally, the processing time for vacuum drying is long, and vacuum drying has been a bottleneck in the production line.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a vacuum drying system capable of improving throughput.

In order to solve the above problems, according to one aspect of the present invention,
A first vacuum drying device that evaporates the solvent from a coating layer containing an organic material and a solvent formed on a substrate in a reduced pressure atmosphere where the atmospheric pressure is lower than the atmospheric pressure.
A second vacuum drying device, which is provided separately from the first vacuum drying device, evaporates the solvent remaining in the coating layer after the solvent is evaporated by the first vacuum drying device in a reduced pressure atmosphere in which the atmospheric pressure is lower than the atmospheric pressure. Decompression drying device and
A transport unit that transports the substrate from the first decompression drying device to the second decompression drying device, and
A control device for controlling the first decompression drying device, the second decompression drying device, and the transport unit is provided.
The first decompression drying device includes a first processing container for accommodating the substrate on which the coating layer is formed, a first substrate holding portion for holding the substrate inside the first processing container, and the first treatment. It has a first decompression mechanism that decompresses the inside of the container to a pressure lower than atmospheric pressure.
The second decompression drying device holds a second processing container for accommodating the substrate conveyed from the first decompression drying device by the transport unit and a second substrate holding for holding the substrate inside the second processing container. It has a part and a second decompression mechanism that decompresses the inside of the second processing container to a pressure lower than the atmospheric pressure.
The second substrate holding portion is a cassette having a plurality of substrate mounting portions on which the substrate is mounted at intervals in the vertical direction.
The cassette is arranged inside the second processing container .
In the control device, the inside of the second processing container is decompressed to a pressure lower than the atmospheric pressure by the second decompression mechanism, and the substrate is carried in and out of the second processing container by the transport unit. A drying system is provided.

According to one aspect of the present invention, there is provided a vacuum drying system capable of improving throughput.

It is a figure which shows the time change of the atmospheric pressure inside the processing container of the vacuum drying apparatus by a conventional example. It is a top view which shows the organic EL display by one Embodiment. It is sectional drawing which shows the main part of the organic EL display by one Embodiment. It is a flowchart which shows the manufacturing method of the organic light emitting diode by one Embodiment. It is sectional drawing which shows the substrate which formed the coating layer by one Embodiment. FIG. 5 is a cross-sectional view showing a substrate in which the coating layer of FIG. 5 is dried under reduced pressure. It is a top view which shows the substrate processing system by one Embodiment. It is a top view which shows the vacuum drying system by one Embodiment. It is sectional drawing which shows the 1st decompression drying apparatus of FIG. It is sectional drawing which shows the 2nd decompression drying apparatus of FIG. It is a top view which shows the vacuum drying system by 1st modification. It is a top view which shows the vacuum drying system by 2nd modification. It is sectional drawing which shows the 2nd decompression drying apparatus of FIG.

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each drawing, the same or corresponding configurations are designated by the same or corresponding reference numerals and the description thereof will be omitted.

<Organic EL display>
FIG. 2 is a plan view showing an organic EL display according to an embodiment. In FIG. 2, the circuit of one unit circuit 11 is enlarged and shown.

The organic EL display includes a substrate 10, a plurality of unit circuits 11 arranged on the substrate 10, a scanning line drive circuit 14 provided on the substrate 10, and a data line drive circuit 15 provided on the substrate 10. .. The unit circuit 11 is provided in a region surrounded by the plurality of scanning lines 16 connected to the scanning line driving circuit 14 and the plurality of data lines 17 connected to the data line driving circuit 15. The unit circuit 11 includes a TFT layer 12 and an organic light emitting diode 13.

The TFT layer 12 has a plurality of TFTs (Thin Film Transistors). One TFT has a function as a switching element, and the other TFT has a function as a current control element for controlling the amount of current flowing through the organic light emitting diode 13. The TFT layer 12 is operated by the scanning line driving circuit 14 and the data line driving circuit 15 to supply a current to the organic light emitting diode 13. The TFT layer 12 is provided for each unit circuit 11, and the plurality of unit circuits 11 are independently controlled. The TFT layer 12 may have a general configuration and is not limited to the configuration shown in FIG.

The drive method of the organic EL display is an active matrix method in this embodiment, but may be a passive matrix method.

FIG. 3 is a cross-sectional view showing a main part of the organic EL display according to the embodiment. As the substrate 10, a transparent substrate such as a glass substrate or a resin substrate is used. A TFT layer 12 is formed on the substrate 10. A flattening layer 18 for flattening the step formed by the TFT layer 12 is formed on the TFT layer 12.

The flattening layer 18 has an insulating property. A contact plug 19 is formed in the contact hole penetrating the flattening layer 18. The contact plug 19 electrically connects the anode 21 as a pixel electrode formed on the flat surface of the flattening layer 18 and the TFT layer 12. The contact plug 19 may be made of the same material as the anode 21 and may be formed at the same time.

The organic light emitting diode 13 is formed on the flat surface of the flattening layer 18. The organic light emitting diode 13 has an anode 21 as a pixel electrode, a cathode 22 as a counter electrode provided on the opposite side of the substrate 10 with respect to the pixel electrode, and an organic layer formed between the anode 21 and the cathode 22. It has 23 and. By operating the TFT layer 12, a voltage is applied between the anode 21 and the cathode 22, and the organic layer 23 emits light.

The anode 21 is formed of, for example, ITO (Indium Tin Oxide) and transmits light from the organic layer 23. The light transmitted through the anode 21 passes through the substrate 10 and is taken out to the outside. The anode 21 is provided for each unit circuit 11.

The cathode 22 is formed of, for example, aluminum or the like, and reflects light from the organic layer 23 toward the organic layer 23. The light reflected by the cathode 22 passes through the organic layer 23, the anode 21, and the substrate 10 and is taken out to the outside. The cathode 22 is common to the plurality of unit circuits 11.

The organic layer 23 has, for example, a hole injection layer 24, a hole transport layer 25, a light emitting layer 26, an electron transport layer 27, and an electron injection layer 28 in this order from the anode 21 side to the cathode 22 side. When a voltage is applied between the anode 21 and the cathode 22, holes are injected from the anode 21 into the hole injection layer 24, and electrons are injected from the cathode 22 into the electron injection layer 28. The holes injected into the hole injection layer 24 are transported to the light emitting layer 26 by the hole transport layer 25. Further, the electrons injected into the electron injection layer 28 are transported to the light emitting layer 26 by the electron transport layer 27. Then, holes and electrons are recombined in the light emitting layer 26, the light emitting material of the light emitting layer 26 is excited, and the light emitting layer 26 emits light.

As the light emitting layer 26, for example, a red light emitting layer, a green light emitting layer, and a blue light emitting layer are formed. The red light emitting layer is formed of a red light emitting material that emits red light, the green light emitting layer is formed of a green light emitting material that emits green light, and the blue light emitting layer is formed of a blue light emitting material that emits blue light. The red light emitting layer, the green light emitting layer, and the blue light emitting layer are formed in the opening 31 of the bank 30.

The bank 30 separates the coating liquid for the red light emitting layer, the coating liquid for the green light emitting layer, and the coating liquid for the blue light emitting layer to prevent mixing of these coating liquids. The bank 30 has an insulating property and fills a contact hole penetrating the flattening layer 18.

<Manufacturing method of organic light emitting diode>
FIG. 4 is a flowchart showing a method for manufacturing an organic light emitting diode according to an embodiment.

First, in step S101, the anode 21 as a pixel electrode is formed. For the formation of the anode 21, for example, a vapor deposition method is used. The anode 21 is formed on the flat surface of the flattening layer 18 for each unit circuit 11. A contact plug 19 may be formed together with the anode 21.

In the following step S102, the bank 30 is formed. The bank 30 is formed using, for example, a photoresist, and is patterned into a predetermined pattern by a photolithography process. The anode 21 is exposed at the opening 31 of the bank 30.

In the following step S103, the hole injection layer 24 is formed. An inkjet method or the like is used to form the hole injection layer 24. By applying the coating liquid for the hole injection layer 24 on the anode 21 by the inkjet method, the coating layer L is formed as shown in FIG. By drying and firing the coating layer L, the hole injection layer 24 is formed as shown in FIG.

In the following step S104, the hole transport layer 25 is formed. Similar to the formation of the hole injection layer 24, an inkjet method or the like is used to form the hole transport layer 25. A coating layer is formed by applying the coating liquid for the hole transport layer 25 onto the hole injection layer 24 by an inkjet method. The hole transport layer 25 is formed by drying and firing the coating layer.

In the following step S105, the light emitting layer 26 is formed. Similar to the formation of the hole injection layer 24 and the hole transport layer 25, an inkjet method or the like is used to form the light emitting layer 26. A coating layer is formed by applying the coating liquid for the light emitting layer 26 on the hole transport layer 25 by an inkjet method. The light emitting layer 26 is formed by drying and firing the coating layer.

As the light emitting layer 26, for example, a red light emitting layer, a green light emitting layer, and a blue light emitting layer are formed. The red light emitting layer, the green light emitting layer, and the blue light emitting layer are formed in the opening 31 of the bank 30. The bank 30 separates the coating liquid for the red light emitting layer, the coating liquid for the green light emitting layer, and the coating liquid for the blue light emitting layer to prevent mixing of these coating liquids.

In the following step S106, the electron transport layer 27 is formed. For the formation of the electron transport layer 27, for example, a thin film deposition method or the like is used. Since the electron transport layer 27 may be common to the plurality of unit circuits 11, it may be formed not only on the light emitting layer 26 in the opening 31 of the bank 30 but also on the bank 30.

In the following step S107, the electron injection layer 28 is formed. For the formation of the electron injection layer 28, for example, a thin-film deposition method or the like is used. The electron injection layer 28 is formed on the electron transport layer 27. The electron injection layer 28 may be common to the plurality of unit circuits 11.

In the following step S108, the cathode 22 is formed. For the formation of the cathode 22, for example, a thin-film deposition method or the like is used. The cathode 22 is formed on the electron injection layer 28. The cathode 22 may be common to a plurality of unit circuits 11.

When the driving method of the organic EL display is not the active matrix method but the passive matrix method, the cathode 22 is patterned in a predetermined pattern.

The organic light emitting diode 13 is manufactured by the above steps. Among the organic layers 23, the substrate processing system 100 is used for forming the hole injection layer 24, the hole transport layer 25, and the light emitting layer 26.

<Board processing system>
FIG. 7 is a plan view showing a substrate processing system according to an embodiment. In the drawings below, the X and Y directions are horizontal directions that are orthogonal to each other, and the Z direction is a vertical direction that is orthogonal to the X and Y directions.

The substrate processing system 100 performs each process corresponding to steps S103 to S105 in FIG. 4 to form a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The substrate processing system 100 includes a carry-in station 110, a processing station 120, a carry-out station 130, and a control device 140.

The carry-in station 110 carries in a cassette C accommodating a plurality of boards 10 from the outside, and sequentially takes out the plurality of boards 10 from the cassette C. A TFT layer 12, a flattening layer 18, an anode 21, a bank 30, and the like are formed in advance on each substrate 10.

The carry-in station 110 includes a cassette mounting table 111 on which the cassette C is mounted, a transport path 112 provided between the cassette mounting table 111 and the processing station 120, and a substrate carrier 113 provided in the transport path 112. The substrate carrier 113 transports the substrate 10 between the cassette C mounted on the cassette mounting table 111 and the processing station 120.

The processing station 120 forms a hole injection layer 24, a hole transport layer 25, and a light emitting layer 26 on the anode 21. The processing station 120 includes a hole injection layer forming block 121 forming the hole injection layer 24, a hole transport layer forming block 122 forming the hole transport layer 25, and a light emitting layer forming block 123 forming the light emitting layer 26. To be equipped.

The hole injection layer forming block 121 forms a hole injection layer 24 by applying a coating liquid for the hole injection layer 24 on the anode 21 to form a coating layer, and drying and firing the coating layer. do. The coating liquid for the hole injection layer 24 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The hole injection layer forming block 121 includes a coating device 121a, a buffer device 121b, a vacuum drying system 121c, a heat treatment device 121d, and a temperature control device 121e. The coating device 121a discharges the droplets of the coating liquid for the hole injection layer 24 toward the opening 31 of the bank 30. The buffer device 121b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying system 121c dries the coating layer coated by the coating device 121a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 121d heat-treats the coating layer dried by the vacuum drying system 121c. The temperature control device 121e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 121d to a predetermined temperature, for example, room temperature.

The inside of the coating device 121a, the buffer device 121b, the heat treatment device 121d, and the temperature control device 121e is maintained in an atmospheric atmosphere. The vacuum drying system 121c switches the internal atmosphere between an atmospheric atmosphere and a reduced pressure atmosphere.

In the hole injection layer forming block 121, the arrangement, number, and internal atmosphere of the coating device 121a, the buffer device 121b, the vacuum drying system 121c, the heat treatment device 121d, and the temperature control device 121e can be arbitrarily selected.

Further, the hole injection layer forming block 121 includes substrate transport devices CR1 to CR2 and delivery devices TR1 to TR3. The substrate transport devices CR1 and CR2 transport the substrate 10 to each adjacent device. For example, the substrate transfer device CR1 transfers the substrate 10 to the adjacent coating device 121a and buffer device 121b. The substrate transfer device CR2 transfers the substrate 10 to the adjacent heat treatment device 121d and temperature control device 121e. The delivery devices TR1 to TR3 are provided in order between the carry-in station 110 and the substrate transfer device CR1, between the substrate transfer device CR1 and the vacuum drying system 121c, and between the vacuum drying system 121c and the substrate transfer device CR2. The substrate 10 is relayed between them. The inside of the substrate transport devices CR1 to CR2 and the delivery devices TR1 to TR3 is maintained in an atmospheric atmosphere.

Between the substrate transfer device CR2 of the hole injection layer forming block 121 and the substrate transfer device CR3 of the hole transport layer forming block 122, a delivery device TR4 that relays the substrate 10 between them is provided. The inside of the delivery device TR4 is maintained in an atmospheric atmosphere.

The hole transport layer forming block 122 is formed by applying a coating liquid for the hole transport layer 25 on the hole injection layer 24 to form a coating layer, and drying and firing the coating layer to form a hole transport layer. 25 is formed. The coating liquid for the hole transport layer 25 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The hole transport layer forming block 122 includes a coating device 122a, a buffer device 122b, a vacuum drying system 122c, a heat treatment device 122d, and a temperature control device 122e. The coating device 122a discharges droplets of the coating liquid for the hole transport layer 25 toward the opening 31 of the bank 30. The buffer device 122b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying system 122c dries the coating layer coated by the coating device 122a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 122d heat-treats the coating layer dried by the vacuum drying system 122c. The temperature control device 122e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 122d to a predetermined temperature, for example, room temperature.

The inside of the coating device 122a and the buffer device 122b is maintained in an atmospheric atmosphere. On the other hand, the heat treatment device 122d and the temperature control device 122e suppress the deterioration of the organic material of the hole transport layer 25, so that the inside is maintained in an atmosphere of low oxygen and low dew point. The vacuum drying system 122c switches the internal atmosphere between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere.

Here, the atmosphere of low oxygen means an atmosphere having an oxygen concentration lower than that of the atmosphere, for example, an atmosphere having an oxygen concentration of 10 ppm or less. The low dew point atmosphere means an atmosphere in which the dew point temperature is lower than the atmosphere, for example, an atmosphere in which the dew point temperature is −10 ° C. or lower. The atmosphere of low oxygen and low dew point is formed by an inert gas such as nitrogen gas.

In the hole transport layer forming block 122, the arrangement, number, and internal atmosphere of the coating device 122a, the buffer device 122b, the vacuum drying system 122c, the heat treatment device 122d, and the temperature control device 122e can be arbitrarily selected.

Further, the hole transport layer forming block 122 includes substrate transport devices CR3 to CR4 and delivery devices TR5 to TR6. The substrate transport devices CR3 to CR4 transport the substrate 10 to each adjacent device. The delivery devices TR5 to TR6 are provided in order between the substrate transfer device CR3 and the vacuum drying system 122c, and between the vacuum drying system 122c and the substrate transfer device CR4, and relay the substrate 10 between them.

The inside of the substrate transfer device CR3 is maintained in an atmospheric atmosphere. On the other hand, the inside of the substrate transfer device CR4 is maintained in an atmosphere of low oxygen and low dew point. This is because the inside of the heat treatment device 122d and the temperature control device 122e provided adjacent to the substrate transfer device CR4 is maintained in an atmosphere of low oxygen and low dew point.

The delivery device TR5 is configured as a load lock device that switches the atmosphere inside the delivery device between an atmosphere atmosphere and an atmosphere having low oxygen and low dew point. This is because the vacuum drying system 122c is installed next to the delivery device TR5 on the downstream side. On the other hand, the inside of the delivery device TR6 is maintained in an atmosphere of low oxygen and low dew point.

Between the substrate transfer device CR4 of the hole transport layer forming block 122 and the substrate transfer device CR5 of the light emitting layer forming block 123, a transfer device TR7 that relays the substrate 10 between them is provided. The inside of the substrate transfer device CR4 is maintained in an atmosphere of low oxygen and low dew point, and the inside of the substrate transfer device CR5 is maintained in an atmosphere of air. Therefore, the delivery device TR7 is configured as a load lock device that switches the atmosphere inside the delivery device TR7 between a low oxygen and low dew point atmosphere and an atmospheric atmosphere.

The light emitting layer forming block 123 forms the light emitting layer 26 by applying the coating liquid for the light emitting layer 26 on the hole transport layer 25 to form the coating layer, and drying and firing the formed coating layer. The coating liquid for the light emitting layer 26 contains an organic material and a solvent. The organic material may be either a polymer or a monomer. In the case of a monomer, it may be polymerized by firing to form a polymer.

The light emitting layer forming block 123 includes a coating device 123a, a buffer device 123b, a vacuum drying system 123c, a heat treatment device 123d, and a temperature control device 123e. The coating device 123a discharges the droplets of the coating liquid for the light emitting layer 26 toward the opening 31 of the bank 30. The buffer device 123b temporarily accommodates the substrate 10 waiting to be processed. The vacuum drying system 123c dries the coating layer coated by the coating device 123a under reduced pressure to remove the solvent contained in the coating layer. The heat treatment apparatus 123d heat-treats the coating layer dried by the vacuum drying system 123c. The temperature control device 123e adjusts the temperature of the substrate 10 heat-treated by the heat treatment device 123d to a predetermined temperature, for example, room temperature.

The inside of the coating device 123a and the buffer device 123b is maintained in an atmospheric atmosphere. On the other hand, the heat treatment device 123d and the temperature control device 123e suppress the deterioration of the organic material of the light emitting layer 26, so that the inside is maintained in an atmosphere of low oxygen and low dew point. The vacuum drying system 123c switches the internal atmosphere between a low oxygen and low dew point atmosphere and a reduced pressure atmosphere.

In the light emitting layer forming block 123, the arrangement, number, and internal atmosphere of the coating device 123a, the buffer device 123b, the vacuum drying system 123c, the heat treatment device 123d, and the temperature control device 123e can be arbitrarily selected.

Further, the light emitting layer forming block 123 includes substrate transport devices CR5 to CR6 and delivery devices TR8 to TR9. The substrate transport devices CR5 to CR6 transport the substrate 10 to each adjacent device. The delivery devices TR8 to TR9 are provided in order between the substrate transfer device CR5 and the vacuum drying system 123c, and between the vacuum drying system 123c and the substrate transfer device CR6, and relay the substrate 10 between them.

The inside of the substrate transfer device CR5 is maintained in an atmospheric atmosphere. On the other hand, the inside of the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point. This is because the inside of the heat treatment device 123d and the temperature control device 123e provided adjacent to the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point.

The delivery device TR8 is configured as a load lock device that switches the atmosphere inside the delivery device between an atmosphere atmosphere and an atmosphere having low oxygen and low dew point. This is because the vacuum drying system 123c is installed next to the delivery device TR8 on the downstream side. The inside of the delivery device TR9 is maintained in an atmosphere of low oxygen and low dew point.

Between the substrate transfer device CR6 of the light emitting layer forming block 123 and the carry-out station 130, a delivery device TR10 that relays the substrate 10 between them is provided. The inside of the substrate transfer device CR6 is maintained in an atmosphere of low oxygen and low dew point, and the inside of the unloading station 130 is maintained in an atmosphere of air. Therefore, the delivery device TR7 is configured as a load lock device that switches the atmosphere inside the delivery device TR7 between a low oxygen and low dew point atmosphere and an atmospheric atmosphere.

The carry-out station 130 sequentially stores a plurality of boards 10 in the cassette C, and carries out the cassette C to the outside. The unloading station 130 includes a cassette mounting table 131 on which the cassette C is mounted, a transport path 132 provided between the cassette mounting table 131 and the processing station 120, and a substrate carrier 133 provided in the transport path 132. The substrate carrier 133 transports the substrate 10 between the processing station 120 and the cassette C mounted on the cassette mounting table 131.

The control device 140 is composed of a computer including a CPU (Central Processing Unit) 141 and a storage medium 142 such as a memory, and various processes are performed by causing the CPU 141 to execute a program (also called a recipe) stored in the storage medium 142. To realize.

The program of the control device 140 is stored in the information storage medium and installed from the information storage medium. Examples of the information storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical desk (MO), a memory card, and the like. The program may be downloaded and installed from the server via the Internet.

Next, a substrate processing method using the substrate processing system 100 having the above configuration will be described. When the cassette C accommodating the plurality of substrates 10 is mounted on the cassette mounting table 111, the substrate carrier 113 sequentially takes out the substrate 10 from the cassette C on the cassette mounting table 111, and the hole injection layer forming block 121. Transport to.

The hole injection layer forming block 121 forms a coating layer by applying a coating liquid for the hole injection layer 24 on the anode 21, and the formed coating layer is dried and fired to form the hole injection layer 24. Form. The substrate 10 on which the hole injection layer 24 is formed is delivered from the hole injection layer forming block 121 to the hole transport layer forming block 122 by the delivery device TR4.

The hole transport layer forming block 122 forms a coating layer by applying a coating liquid for the hole transport layer 25 on the hole injection layer 24, and the formed coating layer is dried and fired to transport holes. The layer 25 is formed. The substrate 10 on which the hole transport layer 25 is formed is delivered from the hole transport layer forming block 122 to the light emitting layer forming block 123 by the delivery device TR7.

The light emitting layer forming block 123 forms the light emitting layer 26 by applying the coating liquid for the light emitting layer 26 on the hole transport layer 25 to form the coating layer, and drying and firing the formed coating layer. The substrate 10 on which the light emitting layer 26 is formed is delivered from the light emitting layer forming block 123 to the carry-out station 130 by the delivery device TR10.

The board carrier 133 of the unloading station 130 stores the board 10 received from the delivery device TR10 in a predetermined cassette C on the cassette mounting table 131. As a result, a series of processing of the substrate 10 in the substrate processing system 100 is completed.

The substrate 10 is carried out from the carry-out station 130 in a state of being housed in the cassette C. An electron transport layer 27, an electron injection layer 28, a cathode 22, and the like are formed on the substrate 10 carried out to the outside.

<Decompression drying system and decompression drying method>
Next, the vacuum drying system 123c of the light emitting layer forming block 123 will be described with reference to FIGS. 8 to 10. The vacuum drying system 121c of the hole injection layer forming block 121 and the vacuum drying system 122c of the hole transport layer forming block 122 are configured in the same manner as the vacuum drying system 123c of the light emitting layer forming block 123. Omit.

FIG. 8 is a plan view showing a vacuum drying system according to an embodiment. FIG. 9 is a cross-sectional view showing the first vacuum drying apparatus of FIG. FIG. 10 is a cross-sectional view showing the second vacuum drying apparatus of FIG. As shown in FIGS. 8 to 10, the vacuum drying system 123c includes a first vacuum drying device 150, a second vacuum drying device 160, and a substrate transfer device 170.

The first decompression drying device 150 accommodates the substrate 10 on which the coating layer containing the organic material and the solvent is formed inside the first processing container 151, and the solvent is applied from the coating layer in a reduced pressure atmosphere where the atmospheric pressure is lower than the atmospheric pressure. To evaporate. Most of the solvent contained in the coating layer evaporates, and the contour of the coating layer is almost adjusted. The first decompression drying device 150 includes, for example, a first processing container 151, a first stage 152, a first decompression mechanism 155, and a first gas supply mechanism 156.

The first processing container 151 accommodates the substrate 10 on which the coating layer containing the organic material and the solvent is formed. A carry-in outlet for the substrate 10 is formed on the side wall portion of the first processing container 151, and an open / close shutter is provided at the carry-in outlet. The opening / closing shutter opens the loading / unloading port to enable loading / unloading of the substrate 10, and the opening / closing shutter closes the loading / unloading port to reduce the pressure inside the first processing container 151. Before the start of depressurization, the inside of the first treatment container 151 is made to have a low oxygen and low dew point atmosphere, for example, a nitrogen atmosphere.

The first stage 152 holds the substrate 10 inside the first processing container 151. The first stage 152 corresponds to the first substrate holding portion described in the claims. The first stage 152 is fixed inside the first processing container 151, and a plurality of lift pins that appear and disappear from the upper surface of the first stage 152 are provided. The plurality of lift pins raise and lower the substrate 10 between the position where the substrate 10 is delivered to and from the substrate transport body 172 of the substrate transport device 170 and the position where the substrate 10 is delivered to and from the first stage 152. ..

A plurality of proximity pins may be provided on the upper surface of the first stage 152. The plurality of proximity pins support the substrate 10 so as to form a slight gap between the first stage 152 and the substrate 10.

The first decompression mechanism 155 decompresses the inside of the first processing container 151 to a pressure lower than the atmospheric pressure. The first decompression mechanism 155 includes, for example, a decompression source 155a and an APC (Adaptive Pressure Control) valve 155b. As the decompression source 155a, for example, a dry pump, a mechanical booster pump, a turbo molecular pump, or the like is used. The decompression source 155a is connected to the first processing container 151 via a pipe provided in the middle of the APC valve 155b, and the inside of the first processing container 151 is depressurized. The air pressure inside the first processing container 151 is reduced to, for example, 1 Pa or less while being adjusted by the APC valve 155b. The exhaust port 151a of the first processing container 151 is formed on the lower wall portion of the first processing container 151 as shown in FIG. 9, but may be formed on the upper wall portion or the side wall portion.

The first gas supply mechanism 156 supplies a gas such as nitrogen gas to the inside of the first processing container 151 in order to return the inside of the first processing container 151 decompressed by the first decompression mechanism 155 to the original atmosphere. The first gas supply mechanism 156 includes, for example, a gas supply source 156a, a mass flow controller 156b, and an on-off valve 156c. The gas supply source 156a is connected to the first processing container 151 via a pipe provided with a mass flow controller 156b and an on-off valve 156c in the middle, and supplies gas to the inside of the first processing container 151. The supply amount can be adjusted by the mass flow controller 156b.

The second vacuum drying device 160 accommodates the substrate 10 conveyed from the first vacuum drying device 150 inside the second processing container 161 and evaporates the solvent remaining in the coating layer in a reduced pressure atmosphere. During this time, the first vacuum drying device 150 can process another substrate 10, so that the overall throughput can be improved. The second decompression drying device 160 has, for example, a second processing container 161, a second stage 162, a second decompression mechanism 165, and a second gas supply mechanism 166, similarly to the first decompression drying device 150.

The second processing container 161 houses the substrate 10 conveyed from the first vacuum drying device 150. A carry-in outlet for the substrate 10 is formed on the side wall portion of the second processing container 161, and an open / close shutter is provided at the carry-in outlet. The opening / closing shutter opens the loading / unloading port to enable loading / unloading of the substrate 10, and the opening / closing shutter closes the loading / unloading port to reduce the pressure inside the second processing container 161. Before the start of depressurization, the inside of the second treatment container 161 is made to have a low oxygen and low dew point atmosphere, for example, a nitrogen atmosphere.

The second stage 162 holds the substrate 10 inside the second processing container 161. The second stage 162 corresponds to the second substrate holding portion described in the claims. The second stage 162 is fixed inside the second processing container 161 and is provided with a plurality of lift pins that appear and disappear from the upper surface of the second stage 162. The plurality of lift pins raise and lower the substrate 10 between the position where the substrate 10 is delivered to and from the substrate transport body 172 of the substrate transport device 170 and the position where the substrate 10 is delivered to and from the second stage 162. ..

A plurality of proximity pins may be provided on the upper surface of the second stage 162. The plurality of proximity pins support the substrate 10 so as to form a slight gap between the second stage 162 and the substrate 10.

The second decompression mechanism 165 decompresses the inside of the second processing container 161 to a pressure lower than the atmospheric pressure. The second decompression mechanism 165 has, for example, a decompression source 165a and an APC valve 165b. As the decompression source 165a, for example, a dry pump, a mechanical booster pump, a turbo molecular pump, or the like is used. The decompression source 165a is connected to the second processing container 161 via a pipe provided in the middle of the APC valve 165b to reduce the pressure inside the second processing container 161. The air pressure inside the second processing container 161 is reduced to, for example, 1 Pa or less while being adjusted by the APC valve 165b. The exhaust port 161a of the second processing container 161 is formed on the lower wall portion of the second processing container 161 as shown in FIG. 10, but may be formed on the upper wall portion or the side wall portion.

The second gas supply mechanism 166 supplies a gas such as nitrogen gas to the inside of the second processing container 161 in order to return the inside of the second processing container 161 decompressed by the second decompression mechanism 165 to the original atmosphere. The second gas supply mechanism 166 includes, for example, a gas supply source 166a, a mass flow controller 166b, and an on-off valve 166c. The gas supply source 166a is connected to the second processing container 161 via a pipe provided with a mass flow controller 166b and an on-off valve 166c in the middle, and supplies gas to the inside of the second processing container 161. The supply amount can be adjusted by the mass flow controller 166b.

As described above, the second vacuum drying device 160 accommodates the substrate 10 conveyed from the first vacuum drying device 150 inside the second processing container 161 and evaporates the solvent remaining in the coating layer in a reduced pressure atmosphere. Most of the solvent contained in the coating layer has been evaporated in advance by the first vacuum drying device 150, and a small amount of solvent evaporates from the coating layer by the second vacuum drying device 160. Therefore, the second processing container 161 may have a narrower passage through which the solvent vapor passes than the first processing container 151, and the installation area and height can be reduced. Since the height can be reduced, the second vacuum drying device 160 can be easily stacked in multiple stages.

Further, the second vacuum drying device 160 further has a heating source 167 for heating the substrate 10 held in the second stage 162, and evaporates the solvent remaining in the coating layer at a higher temperature than the first vacuum drying device 150. Let me. Evaporation can be promoted and the processing time can be shortened. Since most of the solvent contained in the coating layer has been evaporated in advance by the first vacuum drying device 150 and the contour of the coating layer is almost adjusted, the second vacuum drying device 160 is larger than the first vacuum drying device 150. Even if it is dried at a high temperature, the contour of the coating layer does not collapse.

As the heating source 167, for example, a heater is used. Although the heating source 167 is embedded inside the second stage 162 in FIG. 10, it may be provided outside the second stage 162.

The first decompression drying device 150 of the present embodiment does not have a heating source for heating the substrate 10 held in the first stage 152, but may have one. In this case, the heating source is used to reduce the in-plane temperature unevenness of the first stage 152.

The temperature of the first stage 152 may be maintained near room temperature in order to eliminate the temperature difference from the temperature of the substrate 10. The heat transfer between the first stage 152 and the substrate 10 can be suppressed, and the in-plane temperature unevenness of the first stage 152 can be reduced. Therefore, it is possible to prevent marks such as lift pins and proximity pins of the first stage 152 from being formed in the process of adjusting the contour of the coating layer.

The second vacuum drying apparatus 160 may keep the temperature of the second stage 162 higher than the temperature of the first stage 152 while the plurality of substrates 10 are sequentially dried. Here, the temperature of the second stage 162 may be kept higher than the temperature of the first stage 152, and may be constant or fluctuate.

During the replacement of the substrate 10, the second stage 162 is kept at a higher temperature than the first stage 152, and the second stage 162 is higher than the first stage 152 before the substrate 10 is mounted on the second stage 162. It's hot. Therefore, the waiting time for raising the temperature can be omitted or shortened, and the throughput can be further improved.

This effect is obtained by using both the first vacuum drying device 150 and the second vacuum drying device 160. When only one vacuum drying device is used, the temperature of the substrate is maintained near room temperature for a while from the start of decompression, and the temperature of the substrate is raised in the middle, so that the waiting time for raising the temperature is omitted or shortened. Can not.

The substrate transfer device 170 transfers the substrate 10 between the adjacent devices. For example, the substrate transfer device 170 first conveys the substrate 10 from the delivery device TR8 to the first decompression drying device 150, then from the first decompression drying device 150 to the second decompression drying device 160, and finally to the second decompression drying device 160. It is conveyed from the drying device 160 to the delivery device TR9.

The substrate transfer device 170 includes, for example, a transfer path 171 and a substrate transfer body 172 that transfers the substrate 10 between each device connected to the transfer path 171. The transport path 171 extends in the X direction from the delivery device TR8 to the delivery device TR9. A first vacuum drying device 150 and a second vacuum drying device 160 are connected to both sides in the Y direction. The substrate carrier 172 is movable in the X and Y directions, and is rotatable around the Z axis. The substrate carrier 172 may also be movable in the Z direction.

The inside of the transport path 171 is maintained in an atmosphere of low oxygen and low dew point in order to suppress deterioration of the organic material contained in the coating layer. If the organic material contained in the coating layer is not deteriorated by oxygen or moisture, the inside of the transport path 171 may be maintained in an atmospheric atmosphere. When the inside of the transport path 171 is maintained in the atmospheric atmosphere, the inside of the delivery device TR8 is also maintained in the atmospheric atmosphere.

A plurality of first decompression drying devices 150 are connected to the substrate transfer device 170. Therefore, while the first vacuum drying device 150 performs vacuum drying of the substrate 10, another first vacuum drying device 150 can perform vacuum drying and loading / unloading of another substrate 10. A plurality of first vacuum drying devices 150 may be stacked in multiple stages in the Z direction.

Further, a plurality of second decompression drying devices 160 are connected to the substrate transfer device 170. Therefore, while the first second vacuum drying device 160 performs vacuum drying of the substrate 10, another second vacuum drying device 160 can perform vacuum drying and loading / unloading of another substrate 10. A plurality of second vacuum drying devices 160 may be stacked in multiple stages in the Z direction.

Next, a vacuum drying method using the vacuum drying system 123c having the above configuration will be described. The following operations of the vacuum drying system 123c are controlled by the control device 140. Although the control device 140 is provided separately from the vacuum drying system 123c in FIG. 7, it may be provided as a part of the vacuum drying system 123c.

First, when the delivery device TR8 receives the substrate 10 from the substrate transfer device CR5 and the atmosphere inside the delivery device TR8 is switched from the atmospheric atmosphere to the atmosphere of low oxygen and low dew point, the substrate transfer body 172 is transferred from the inside of the transfer device TR8. The substrate 10 is conveyed to the inside of the first processing container 151. When the substrate 10 is placed on the first stage 152, the substrate carrier 172 exits from the inside of the first processing container 151.

Next, the first depressurizing mechanism 155 depressurizes the inside of the first processing container 151. The solvent evaporates from the coating layer in a reduced pressure atmosphere. When the elapsed time from the start of depressurization reaches a predetermined time, most of the solvent contained in the coating layer evaporates, and the contour of the coating layer is substantially adjusted, the first decompression mechanism 155 is stopped.

Subsequently, the first gas supply mechanism 156 supplies gas to the inside of the first treatment container 151, and returns the inside of the first treatment container 151 to an atmosphere of low oxygen and low dew point. This atmosphere is a normal pressure atmosphere. After that, the substrate carrier 172 transports the substrate 10 from the inside of the first processing container 151 to the inside of the second processing container 161. When the substrate 10 is placed on the second stage 162, the substrate carrier 172 exits from the inside of the second processing container 161.

Next, the second depressurizing mechanism 165 depressurizes the inside of the second processing container 161. The solvent remaining in the coating layer evaporates in a reduced pressure atmosphere. When the elapsed time from the start of depressurization reaches a predetermined time and the solvent remaining in the coating layer is removed, the second decompression mechanism 165 is stopped.

Subsequently, the second gas supply mechanism 166 supplies gas to the inside of the second treatment container 161 to return the inside of the second treatment container 161 to an atmosphere of low oxygen and low dew point. This atmosphere is a normal pressure atmosphere. After that, the substrate carrier 172 transports the substrate 10 from the inside of the second processing container 161 to the inside of the delivery device TR9.

As described above, according to the present embodiment, the vacuum drying system 123c includes a first vacuum drying device 150 and a second vacuum drying device 160. The first vacuum drying apparatus 150 accommodates the substrate 10 on which the coating layer containing the organic material and the solvent is formed inside the first processing container 151, and evaporates the solvent from the coating layer in a reduced pressure atmosphere. The second vacuum drying device 160 accommodates the substrate 10 conveyed from the first vacuum drying device 150 inside the second processing container 161 and evaporates the solvent remaining in the coating layer in a reduced pressure atmosphere. The first vacuum drying device 150 evaporates most of the solvent contained in the coating layer to prepare the contour of the coating layer, and then the second vacuum drying device 160 removes the solvent remaining in the coating layer. Since the first vacuum drying device 150 can process another substrate 10 while the second vacuum drying device 160 processes the substrate 10, the throughput of the production line can be improved.

According to the present embodiment, the second vacuum drying device 160 evaporates the solvent remaining in the coating layer at a higher temperature than the first vacuum drying device 150. Evaporation can be promoted and the processing time can be shortened. Since most of the solvent contained in the coating layer has been evaporated in advance by the first vacuum drying device 150 and the contour of the coating layer is almost adjusted, the second vacuum drying device 160 is larger than the first vacuum drying device 150. Even if it is dried at a high temperature, the contour of the coating layer does not collapse. The amount of solvent evaporated from the coating layer by the second vacuum drying device 160 is small.

According to the present embodiment, the second vacuum drying apparatus 160 keeps the temperature of the second stage 162 higher than the temperature of the first stage 152 while the plurality of substrates 10 are sequentially dried. During the replacement of the substrate 10, the second stage 162 is kept at a higher temperature than the first stage 152, and the second stage 162 is higher than the first stage 152 before the substrate 10 is mounted on the second stage 162. It's hot. Therefore, the waiting time for raising the temperature can be omitted or shortened, and the throughput can be further improved.

According to the present embodiment, the vacuum drying system 123c has a substrate transport device 170 that transports the substrate 10 from the first vacuum drying device 150 to the second vacuum drying device 160. Therefore, the substrate 10 can be automatically transported from the first vacuum drying device 150 to the second vacuum drying device 160.

According to this embodiment, a plurality of first decompression drying devices 150 are connected to the substrate transfer device 170. Therefore, while the first vacuum drying device 150 performs vacuum drying of the substrate 10, another first vacuum drying device 150 can perform vacuum drying and loading / unloading of another substrate 10.

According to this embodiment, a plurality of second decompression drying devices 160 are connected to the substrate transfer device 170. Therefore, while the first second vacuum drying device 160 performs vacuum drying of the substrate 10, another second vacuum drying device 160 can perform vacuum drying and loading / unloading of another substrate 10.

<Decompression drying system according to the first modification>
The vacuum drying system of this modification includes a load lock device 180 that accommodates the substrate 10 and switches the internal air pressure in the middle of the transport path for transporting the substrate from the first vacuum drying device 150 to the second vacuum drying device 160. It differs from the vacuum drying system of the above embodiment in that it has. The differences will be mainly described below.

FIG. 11 is a plan view showing a vacuum drying system according to the first modification. This vacuum drying system is provided in the light emitting layer forming block 123, but may be provided in the hole injection layer forming block 121 or the hole transport layer forming block 122.

The vacuum drying system of this modification has a first vacuum drying device 150 and a second vacuum drying device 160, similarly to the vacuum drying system 123c of the above embodiment. The first vacuum drying device 150 evaporates most of the solvent contained in the coating layer to prepare the contour of the coating layer, and then the second vacuum drying device 160 removes the solvent remaining in the coating layer. Since the first vacuum drying device 150 can process another substrate 10 while the second vacuum drying device 160 processes the substrate 10, the throughput of the production line can be improved.

Further, the second vacuum drying device 160 can accelerate the evaporation and shorten the processing time by evaporating the solvent remaining in the coating layer at a higher temperature than the first vacuum drying device 150.

Further, the second vacuum drying apparatus 160 keeps the temperature of the second stage 162 higher than the temperature of the first stage 152 while the plurality of substrates 10 are sequentially dried, thereby omitting the waiting time for raising the temperature. Or it can be shortened and the throughput can be further improved.

By the way, unlike the vacuum drying system 123c of the above embodiment, the vacuum drying system of this modification has a load lock device 180, a first substrate transfer device 181 and a second substrate transfer device 182.

The load lock device 180 accommodates the substrate 10 and switches the internal air pressure in the middle of the transport path for transporting the substrate 10 from the first decompression drying device 150 to the second decompression drying device 160. A decompression source and a gas supply source are connected to the load lock device 180. The decompression source decompresses the inside of the load lock device 180. The gas supply source supplies gas to the inside of the load lock device 180. The inside of the load lock device 180 is switched between, for example, a normal pressure atmosphere and a reduced pressure atmosphere.

The load lock device 180 in front of the second decompression drying device 160 can make the atmosphere around the substrate 10 a decompression atmosphere, and the inside of the second decompression drying device 160 can be maintained in a decompression atmosphere. Therefore, when the substrate 10 is carried in, the waiting time for lowering the air pressure inside the second decompression drying device 160 can be omitted or shortened. Further, since the fluctuation of the atmospheric pressure inside the second decompression drying device 160 can be suppressed, the structure of the second decompression drying device 160 can be simplified.

The first substrate transfer device 181 transfers the substrate 10 between the adjacent devices. For example, the first substrate transfer device 181 first conveys the substrate 10 from the delivery device TR8 to the first decompression drying device 150, and then conveys the substrate 10 from the first decompression drying device 150 to the load lock device 180.

The first substrate transport device 181 includes, for example, a first transport path 181a and a first substrate transport body 181b that transports the substrate 10 between each device connected to the first transport path 181a. The first transport path 181a extends in the X direction from the delivery device TR8 to the load lock device 180. The first decompression drying device 150 is connected to both sides in the Y direction. The first substrate carrier 181b is movable in the X and Y directions, and is rotatable around the Z axis. The first substrate carrier 181b may be movable in the Z direction as well.

The first transport path 181a is a path through which the substrate 10 passes after the treatment by the first decompression drying device 150. Since most of the solvent contained in the coating layer is evaporated by the first vacuum drying apparatus 150, the inside of the first transport path 181a has a low oxygen and low dew point atmosphere so that the organic material contained in the coating layer does not deteriorate. Is maintained at. The first transport path 181a is also a path through which the substrate 10 passes before the processing by the first decompression drying device 150. Therefore, the inside of the first transport path 181a is maintained in a normal pressure atmosphere. If the organic material contained in the coating layer is not deteriorated by oxygen or moisture, the inside of the first transport path 181a may be maintained in an atmospheric atmosphere.

A plurality of first decompression drying devices 150 are connected to the first substrate transfer device 181. Therefore, while the first vacuum drying device 150 performs vacuum drying of the substrate 10, another first vacuum drying device 150 can perform vacuum drying and loading / unloading of another substrate 10. A plurality of first vacuum drying devices 150 may be stacked in multiple stages in the Z direction. Further, the first decompression drying device 150 and the load lock device 180 may be stacked in multiple stages in the Z direction.

The second substrate transfer device 182 transfers the substrate 10 between the adjacent devices. For example, the second substrate transfer device 182 first conveys the substrate 10 from the load lock device 180 to the second decompression drying device 160, and then conveys the substrate 10 from the second decompression drying device 160 to the delivery device TR9.

The second substrate transfer device 182 has, for example, a second transfer path 182a and a second substrate transfer body 182b that transfers the substrate 10 between each device connected to the second transfer path 182a. The second transport path 182a connects the load lock device 180 and the delivery device TR8. A second vacuum drying device 160 is connected in the middle of the process. The second substrate carrier 182b is movable in the X and Y directions, and is rotatable around the Z axis. The second substrate carrier 182b may be movable in the Z direction as well.

The second substrate transfer device 182 includes a decompression source 182c that reduces the internal pressure to a pressure lower than the atmospheric pressure. As the decompression source 182c, for example, a dry pump, a mechanical booster pump, and a turbo molecular pump are used. The decompression generation source 182c is connected to the second transport path 182a via a pipe provided with an APC valve or the like in the middle, and maintains the inside of the second transport path 182a in a decompression atmosphere. This is to maintain the inside of the second decompression drying device 160 connected to the inside of the second transport path 182a in a decompression atmosphere.

A plurality of second decompression drying devices 160 are connected to the second substrate transfer device 182. Therefore, while the first second vacuum drying device 160 performs vacuum drying of the substrate 10, another second vacuum drying device 160 can perform vacuum drying and loading / unloading of another substrate 10. A plurality of second vacuum drying devices 160 may be stacked in multiple stages in the Z direction. Further, the second decompression drying device 160 and the load lock device 180 may be stacked in multiple stages in the Z direction.

Next, a vacuum drying method using the vacuum drying system of this modified example will be described. The following operations of the vacuum drying system are controlled by the control device 140. The control device 140 may be provided separately from the vacuum drying system, or may be provided as a part of the vacuum drying system.

First, when the delivery device TR8 receives the substrate 10 from the substrate transfer device CR5 and the atmosphere inside the delivery device TR8 is switched from the atmospheric atmosphere to the atmosphere of low oxygen and low dew point, the first substrate transfer body 181b of the delivery device TR8 The substrate 10 is conveyed from the inside to the inside of the first processing container 151. When the substrate 10 is placed on the first stage 152, the first substrate carrier 181b exits from the inside of the first processing container 151.

Next, the first depressurizing mechanism 155 depressurizes the inside of the first processing container 151. The solvent evaporates from the coating layer in a reduced pressure atmosphere. When the elapsed time from the start of depressurization reaches a predetermined time, most of the solvent contained in the coating layer evaporates, and the contour of the coating layer is substantially adjusted, the first decompression mechanism 155 is stopped.

Subsequently, the first gas supply mechanism 156 supplies gas to the inside of the first treatment container 151, and returns the inside of the first treatment container 151 to an atmosphere of low oxygen and low dew point. This atmosphere is a normal pressure atmosphere. After that, the first substrate carrier 181b conveys the substrate 10 from the inside of the first processing container 151 to the inside of the load lock device 180.

Subsequently, when the first substrate carrier 181b exits from the inside of the load lock device 180, the inside of the load lock device 180 is switched from an atmosphere of low oxygen and low dew point to a decompression atmosphere. After that, the second substrate carrier 182b conveys the substrate 10 from the inside of the load lock device 180 to the inside of the second processing container 161. When the substrate 10 is placed on the second stage 162, the second substrate carrier 182b exits from the inside of the second processing container 161.

Next, the solvent remaining in the coating layer evaporates in the reduced pressure atmosphere inside the second treatment container 161. When the elapsed time reaches a predetermined time and the solvent remaining in the coating layer is removed, the second substrate carrier 182b conveys the substrate 10 from the inside of the second processing container 161 to the inside of the delivery device TR9.

When the second substrate carrier 182b exits from the inside of the delivery device TR9, the inside of the delivery device TR9 is switched from a reduced pressure atmosphere to a low oxygen and low dew point atmosphere. After that, the substrate 10 is heat-treated by the heat treatment apparatus 123d. The inside of the heat treatment apparatus 123d is maintained in an atmosphere of low oxygen and low dew point.

As described above, according to the present modification, the vacuum drying system accommodates the substrate 10 in the middle of the transport path for transporting the substrate 10 from the first vacuum drying device 150 to the second vacuum drying device 160. It has a load lock device 180 for switching the internal air pressure. The load lock device 180 in front of the second decompression drying device 160 can make the atmosphere around the substrate 10 a decompression atmosphere, and the inside of the second decompression drying device 160 can be maintained in a decompression atmosphere. Therefore, when the substrate 10 is carried in, the waiting time for lowering the air pressure inside the second decompression drying device 160 can be omitted or shortened. Further, since the fluctuation of the atmospheric pressure inside the second decompression drying device 160 can be suppressed, the structure of the second decompression drying device 160 can be simplified.

According to this modification, the vacuum drying system includes a first substrate transfer device 181 that conveys the substrate 10 from the first vacuum drying device 150 to the load lock device 180, and a substrate from the load lock device 180 to the second vacuum drying device 160. It further has a second substrate transfer device 182 that conveys 10. Therefore, the substrate 10 can be automatically transported from the first vacuum drying device 150 to the second vacuum drying device 160.

According to this modification, the second substrate transfer device 182 includes a decompression generation source 182c that reduces the internal pressure to a pressure lower than the atmospheric pressure. The decompression source 182c maintains the inside of the second transport path 182a in a decompression atmosphere. This is to maintain the inside of the second decompression drying device 160 connected to the inside of the second transport path 182a in a decompression atmosphere.

<Decompression drying system according to the second modification>
The vacuum drying system of the first modification is different from the vacuum drying system of the first modification in that the second vacuum drying device 160A has a cassette that holds a plurality of substrates at the same time. The differences will be mainly described below.

FIG. 12 is a plan view showing a vacuum drying system according to the second modification. This vacuum drying system is provided in the light emitting layer forming block 123, but may be provided in the hole injection layer forming block 121 or the hole transport layer forming block 122.

The vacuum drying system of this modification has a first vacuum drying device 150 and a second vacuum drying device 160A, similarly to the vacuum drying system of the first modification. The first vacuum drying device 150 evaporates most of the solvent contained in the coating layer to prepare the contour of the coating layer, and then the second vacuum drying device 160A removes the solvent remaining in the coating layer. Since the first vacuum drying device 150 can process another substrate 10 while the second vacuum drying device 160A processes the substrate 10, the throughput of the production line can be improved.

Further, the vacuum drying system of the present modification is the same as the vacuum drying system of the first modification, in the middle of the transport path for transporting the substrate 10 from the first vacuum drying device 150 to the second vacuum drying device 160A. It has a load lock device 180 that accommodates 10 and switches the internal air pressure. The load lock device 180 in front of the second decompression drying device 160A can make the surrounding atmosphere of the substrate 10 a decompression atmosphere, and the inside of the second decompression drying device 160A can be maintained in a decompression atmosphere. Therefore, when the substrate 10 is carried in, the waiting time for lowering the air pressure inside the second decompression drying device 160A can be omitted or shortened. Further, since the fluctuation of the atmospheric pressure inside the second decompression drying device 160A can be suppressed, the structure of the second decompression drying device 160A can be simplified.

Further, the vacuum drying system of the present modification is the same as the vacuum drying system of the first modification, the first substrate transfer device 181 for transporting the substrate 10 from the first vacuum drying device 150 to the load lock device 180, and the load. It further includes a second substrate transfer device 182A for transporting the substrate 10 from the lock device 180 to the second vacuum drying device 160A. Therefore, the substrate 10 can be automatically transported from the first vacuum drying device 150 to the second vacuum drying device 160A.

According to this modification, the second substrate transfer device 182A has a second transfer path 182Aa, a second substrate transfer body 182Ab, and a decompression generation source 182Ac. The decompression generation source 182Ac is connected to the second transport path 182Aa via a pipe provided with an APC valve or the like in the middle, and maintains the inside of the second transport path 182Aa in a decompression atmosphere. This is to maintain the inside of the second decompression drying device 160A connected to the inside of the second transport path 182Aa in a decompression atmosphere.

FIG. 13 is a cross-sectional view showing the second vacuum drying apparatus of FIG. The second vacuum drying device 160A is provided in the vacuum drying system of the present modification, but may be provided in the vacuum drying system 123c of the above embodiment or the vacuum drying system of the first modification.

The second decompression drying device 160A of this modification includes, for example, a second processing container 161A, a cassette 162A, a Z-direction drive unit 163A, and a second decompression mechanism 165A.

The second processing container 161A simultaneously accommodates a plurality of substrates 10 that are sequentially conveyed from the first vacuum drying device 150. A carry-in outlet 161Aa for the substrate 10 is formed on the side wall portion of the second processing container 161A. The inside of the second processing container 161A is maintained in a reduced pressure atmosphere.

The cassette 162A simultaneously holds a plurality of substrates 10 sequentially conveyed from the first vacuum drying apparatus 150 inside the second processing container 161A. Each substrate 10 is held inside the second processing container 161A for a set time, and then carried out. The number of processed sheets per unit time can be increased as compared with the case of the single-wafer type. The cassette 162A corresponds to the second substrate holding portion described in the claims.

The cassette 162A has a plurality of substrate mounting portions 162Aa on which the substrate 10 is mounted at intervals in the Z direction, and is movable in the Z direction inside the second processing container 161A.

The Z-direction drive unit 163A moves the cassette 162A in the Z direction inside the second processing container 161A. The substrate mounting portion 162Aa of the cassette 162A is formed so as to avoid interference with the second substrate carrier 182Ab, and is formed in a comb-teeth shape, for example. The substrate 10 is delivered by moving the cassette 162A in the Z direction in a state where the second substrate carrier 182Ab has penetrated into the cassette 162A.

The second decompression mechanism 165A decompresses the inside of the second processing container 161A to a pressure lower than the atmospheric pressure. The second decompression mechanism 165A has, for example, a decompression source 165Aa and an APC valve 165Ab. As the decompression source 165Aa, for example, a dry pump, a mechanical booster pump, a turbo molecular pump, or the like is used. The decompression source 165Aa is connected to the second processing container 161A via a pipe provided in the middle of the APC valve 165Ab to reduce the pressure inside the second processing container 161A. The air pressure inside the second processing container 161A is reduced to, for example, 1 Pa or less.

The second vacuum drying device 160A evaporates the solvent remaining in the coating layer at room temperature. The structure of the second vacuum drying apparatus 160A can be simplified as compared with the case where the solvent remaining in the coating layer is evaporated at a high temperature.

The vacuum drying method using the vacuum drying system of the present modification is the same as the vacuum drying method using the vacuum drying system of the first modification, and thus the description thereof will be omitted.

As described above, the cassette 162A of the present modification simultaneously holds a plurality of substrates 10 sequentially conveyed from the first vacuum drying apparatus 150 inside the second processing container 161A. Each substrate 10 is held inside the second processing container 161A for a set time, and then carried out. The number of processed sheets per unit time can be increased as compared with the case of the single-wafer type.

This effect is particularly remarkable when the time required for drying in the second vacuum drying device 160A is long and the set time is long. As such a case, for example, a case where the second vacuum drying device 160A performs drying at room temperature can be mentioned.

Further, according to this modification, the second vacuum drying apparatus 160A evaporates the solvent remaining in the coating layer at room temperature. The structure of the second vacuum drying apparatus 160A can be simplified as compared with the case where the solvent remaining in the coating layer is evaporated at a high temperature.

Although embodiments such as a vacuum drying system have been described above, the present invention is not limited to the above embodiments, and various modifications and improvements can be made within the scope of the gist of the present invention described in the claims. Is.

For example, the organic EL display is a bottom emission method in which the light from the light emitting layer 26 is taken out from the substrate 10 side in the above embodiment, but a top emission method in which the light from the light emitting layer 26 is taken out from the side opposite to the substrate 10 may be used. ..

In the case of the top emission method, the substrate 10 does not have to be a transparent substrate and may be an opaque substrate. This is because the light from the light emitting layer 26 is taken out from the side opposite to the substrate 10.

In the case of the top emission method, the anode 21 which is a transparent electrode is used as a counter electrode, and the cathode 22 is used as a pixel electrode provided for each unit circuit 11. In this case, since the arrangement of the anode 21 and the cathode 22 is reversed, the electron injection layer 28, the electron transport layer 27, the light emitting layer 26, the hole transport layer 25, and the hole injection layer 24 are placed in this order on the cathode 22. Is formed by.

In the above embodiment, the organic layer 23 includes the hole injection layer 24, the hole transport layer 25, the light emitting layer 26, the electron transport layer 27, and the electron injection layer 28 in this order from the anode 21 side to the cathode 22 side. It has, but it is sufficient if it has at least a light emitting layer 26. The organic layer 23 is not limited to the configuration shown in FIG.

The vacuum drying system is used in the manufacture of organic EL displays, but may be used, for example, in the manufacture of liquid crystal displays.

10 Substrate 13 Organic light emitting diode 21 Anode 22 Cathode 23 Organic layer 100 Substrate processing system 123c Decompression drying system 150 First decompression drying device 151 First processing container 152 First stage 155 First decompression mechanism 160 Second decompression drying device 161 Second Processing container 162 2nd stage 165 2nd decompression mechanism 167 Heat source 170 Board transfer device 180 Load lock device 181 1st board transfer device 182 2nd board transfer device

Claims (12)

A first vacuum drying device that evaporates the solvent from a coating layer containing an organic material and a solvent formed on a substrate in a reduced pressure atmosphere where the atmospheric pressure is lower than the atmospheric pressure.
A second vacuum drying device, which is provided separately from the first vacuum drying device, evaporates the solvent remaining in the coating layer after the solvent is evaporated by the first vacuum drying device in a reduced pressure atmosphere in which the atmospheric pressure is lower than the atmospheric pressure. Decompression drying device and
A transport unit that transports the substrate from the first decompression drying device to the second decompression drying device, and
A control device for controlling the first decompression drying device, the second decompression drying device, and the transport unit is provided.
The first decompression drying device includes a first processing container for accommodating the substrate on which the coating layer is formed, a first substrate holding portion for holding the substrate inside the first processing container, and the first treatment. It has a first decompression mechanism that decompresses the inside of the container to a pressure lower than atmospheric pressure.
The second decompression drying device holds a second processing container for accommodating the substrate conveyed from the first decompression drying device by the transport unit and a second substrate holding for holding the substrate inside the second processing container. It has a part and a second decompression mechanism that decompresses the inside of the second processing container to a pressure lower than the atmospheric pressure.
The second substrate holding portion is a cassette having a plurality of substrate mounting portions on which the substrate is mounted at intervals in the vertical direction.
The cassette is arranged inside the second processing container .
In the control device, the inside of the second processing container is decompressed to a pressure lower than the atmospheric pressure by the second decompression mechanism, and the substrate is carried in and out of the second processing container by the transport unit. Drying system. The vacuum drying system according to claim 1, wherein the second vacuum drying device has a drive unit for moving the cassette in the vertical direction inside the second processing container. The vacuum drying system according to claim 1 or 2, wherein the second vacuum drying apparatus evaporates the solvent remaining in the coating layer at room temperature. The second vacuum drying apparatus further has a heating source for heating the substrate held in the second substrate holding portion, and the solvent remaining in the coating layer at a higher temperature than the first vacuum drying apparatus. The vacuum drying system according to claim 1 or 2, which evaporates. The vacuum drying system according to claim 4, wherein the second vacuum drying apparatus keeps the temperature of the second substrate holding portion higher than the temperature of the first substrate holding portion while sequentially drying a plurality of the substrates. .. The transport unit has a load lock device for accommodating the substrate and switching the internal air pressure in the middle of a transport path for transporting the substrate from the first decompression drying device to the second decompression drying device. The vacuum drying system according to any one of 1 to 5. The transport unit includes a first substrate transport device that transports the substrate from the first decompression drying device to the load lock device, and a second substrate transport device that transports the substrate from the load lock device to the second decompression drying device. The vacuum drying system according to claim 6, further comprising an apparatus. The decompression drying system according to claim 7, wherein the second substrate transport device includes a decompression source that reduces the internal pressure to a pressure lower than the atmospheric pressure. The vacuum drying system according to claim 7 or 8, which has a plurality of the first vacuum drying devices, and the plurality of the first vacuum drying devices are connected to the first substrate transport device. The vacuum drying system according to any one of claims 7 to 9, further comprising a plurality of the second vacuum drying devices, and the plurality of the second vacuum drying devices are connected to the second substrate transport device. A vacuum drying method for drying the coating layer using the vacuum drying system according to any one of claims 1 to 10. The vacuum drying method according to claim 11, wherein the coating layer is used for manufacturing an organic EL light emitting diode.

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